A new type of TO-263 lead frame

Abstract

The present invention discloses a novel TO-263 lead frame, which relates to the technical field of semiconductor packaging. This lead frame can improve the creepage voltage, increase the carrier area and save copper materials. It includes: a heat dissipation area, a carrier area, and a pin area; the heat dissipation area is arranged above the carrier area, and an oval sealant groove is arranged between the heat dissipation area and the carrier area; the pin area is arranged below the carrier area, and a border is arranged below the pin area; the pin area is provided with a first pin and a second pin, and the first pin, the second pin and the carrier area are isolated from each other.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and more particularly to a novel TO-263 lead frame. Background Art

[0002] As an optimized product of the TO-263 series, the traditional H2PAK product has good internal insulation due to the separation of its pins from the carrier, and is widely used in the market. However, for the traditional H2PAK product, the lead frame is designed with three pins, and the middle pin is cut off during the stamping and forming process. Due to considerations of product reliability, delamination and other factors, the middle pin will not be cut off from the root of the plastic package, so there will be some residues of the middle pin. But when the product voltage increases, there is a problem of arcing on the middle pin, which is likely to cause product damage. In order to solve the problem of arcing on the middle pin, increase the carrier size, ensure a safe creepage distance during high-voltage output, and improve the reliability of the packaged product, it is necessary to improve the existing H2PAK packaging structure. Summary of the Invention

[0003] An embodiment of the present invention provides a novel TO-263 lead frame, which can increase the creepage voltage, enlarge the carrier area and save copper material.

[0004] An embodiment of the present invention provides a novel TO-263 lead frame, including: a heat dissipation area, a carrier area, and a pin area;

[0005] The heat dissipation area is arranged above the carrier area, and an oval sealant groove is arranged between the heat dissipation area and the carrier area;

[0006] The pin area is arranged below the carrier area, and a border is arranged below the pin area;

[0007] A first pin and a second pin are arranged on the pin area, and the carrier area is isolated from the first pin and the second pin.

[0008] Preferably, it further includes a first pin welding area and a second pin welding area;

[0009] A first corner is arranged at the upper right corner of the first pin welding area, a second corner and a third corner are respectively arranged at the upper right corner and the lower left corner of the second pin welding area, and the hypotenuses included by the first corner, the second corner and the third corner are parallel to each other;

[0010] The first pin is connected to the first pin welding area, and the second pin is connected to the second pin welding area.

[0011] Preferably, the horizontal distance and the vertical distance between the carrier area and the first pin welding area and the second pin welding area are 0.30 mm and 1.30 mm respectively;

[0012] The distance between the first pin and the second pin is 5.08 mm.

[0013] Preferably, the angles of the first corner, the second corner and the third corner are all between 40° and 50°;

[0014] The area of the second pin soldering area is 1.8 to 2.4 times that of the first pin soldering area.

[0015] Preferably, a semi-circular glue locking groove and a first pin V-groove are provided at the part where the first pin is connected to the first pin soldering area, and the semi-circular glue locking groove is located on the side of the part where the first pin is connected to the first pin soldering area and close to the second pin soldering area;

[0016] A circular glue locking groove and a second pin V-groove are provided at the part where the second pin is connected to the second pin soldering area, and the circular glue locking groove is located inside the part where the second pin is connected to the second pin soldering area.

[0017] Preferably, a fourth corner and a dovetail groove are further included between the heat dissipation area and the carrier area;

[0018] The elliptical glue locking groove is formed by stamping on the front and back sides in sequence, and the thickness of the elliptical glue locking groove is 1.3 mm;

[0019] The length of the front side of the elliptical glue locking groove is 3.8 mm and the width is 1.2 mm; the length of the back side of the elliptical glue locking groove is 3.6 mm and the width is 1 mm;

[0020] The elliptical glue locking groove after encapsulation is filled with encapsulant.

[0021] Preferably, a first V-groove is provided around the carrier area; stepped semi-stamping structures are provided on the left and right sides of the carrier area, and the stepped semi-stamping structures are located on the side of the first V-groove away from the carrier area;

[0022] The carrier area includes one base island; or the carrier area includes two base islands.

[0023] Preferably, a connecting rib, a middle rib, and a pin area are further included;

[0024] The heat dissipation area, the carrier area, the middle rib, the pin area and the frame form a lead frame unit;

[0025] Between the heat dissipation area and the middle rib included in the lead frame unit, a connecting rib is provided on each side of the carrier area, and adjacent two lead frame units are connected through the connecting rib; or

[0026] Two adjacent ones of the lead frame units form a set of lead frames, and a connecting rib is respectively arranged on two non-adjacent sides of two carrier regions located within a set of the lead frames.

[0027] Preferably, it further includes a runner waist hole and a non-runner waist hole, and the aperture of the non-runner waist hole is greater than or equal to the aperture of the runner waist hole;

[0028] The runner waist hole and the non-runner waist hole are arranged on the connecting rib between the middle rib and the frame in a way of being spaced at intervals in turn.

[0029] Preferably, the heat dissipation region includes a top heat dissipation region and a back heat dissipation region;

[0030] The top heat dissipation region is arranged above the carrier region;

[0031] The back heat dissipation region is arranged directly below the carrier region.

[0032] The embodiment of the present invention provides a novel TO-263 lead frame, including: a heat dissipation region, a carrier region, and a pin region; the heat dissipation region is arranged above the carrier region, and an oval sealant groove is arranged between the heat dissipation region and the carrier region; the pin region is arranged below the carrier region, and a frame is arranged below the carrier region; the pin region is provided with a first pin and a second pin. For the lead frame provided in this embodiment, two pins with a spacing are arranged in the pin region, and both pins are separated from the carrier region, increasing the creepage distance between the heat dissipation region and the pins, being able to ensure the creepage distance for safe high-voltage output, and effectively improving the electrical performance of the packaged product; furthermore, an oval sealant groove is arranged between the heat dissipation region and the carrier region, and the center line of the oval sealant groove is moved to the encapsulation line position. While ensuring good bonding between the plastic package and the frame and improving the pulling strength of the packaged product, the distance in the Y direction of the carrier can be made larger, a larger specification chip can be bonded, the size range of the packaged chips is wider, and different user requirements can be met. For the lead frame provided in this embodiment, the connecting rib between two adjacent carrier regions is optimized from one for each unit to one for every two units; the non-runner waist hole under the middle rib has the hole pitch increased as much as possible while ensuring the stability of the frame structure, reducing the use of copper material, and effectively saving the material cost. Description of the Drawings

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained according to these drawings without creative efforts.

[0034] Figure 1Schematic diagram of the novel TO-263 lead frame structure provided by the embodiments of the present invention;

[0035] Figure 2 Left view structure schematic diagram of the novel TO-263 lead frame provided by the embodiments of the present invention;

[0036] Figure 3 Cross-sectional view of the oval glue-locking groove provided by the embodiments of the present invention;

[0037] Figure 4 Another lead frame structure schematic diagram provided by the embodiments of the present invention;

[0038] Figure 5 Schematic diagram of the nickel-plated pin structure provided by the embodiments of the present invention;

[0039] Figure 6 Schematic diagram of the fully nickel-plated structure of the pin welding area and the carrier area provided by the embodiments of the present invention;

[0040] Wherein, 1. Top heat dissipation area, 2. First carrier area, 3. Pin area, 4. Oval glue-locking groove, 5. First V-groove, 6. Connecting rib, 7. First pin welding area, 8. First pin V-groove, 9. Semi-circular glue-locking groove, 10. Second pin welding area, 11. Second pin V-groove, 12. Circular glue-locking groove, 13. Middle rib, 14. First pin, 15. Second pin, 16. Frame, 17. Runner waist hole, 18. Non-runner waist hole, 19. Back heat dissipation area, 20. Dovetail groove, 21. Stepped semi-stamping structure, 22. Fourth corner, 23. Through hole, 24. Semi-through hole, 25. Second carrier area. Detailed implementation manners

[0041] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0042] Figure 1 Exemplarily shows the schematic diagram of the novel TO-263 lead frame structure provided by the embodiments of the invention, Figure 2 Left view structure schematic diagram of the novel TO-263 lead frame provided by the embodiments of the present invention; Figure 3 Cross-sectional view of the oval glue-locking groove provided by the embodiments of the present invention. The following will be described in conjunction with Figures 1 to 4 , the novel TO-263 lead frame provided by the embodiments of the present invention will be introduced.

[0043] As Figure 1As shown, the lead frame mainly includes a heat dissipation area, a carrier area, and a pin area 3. Specifically, the heat dissipation area includes a top heat dissipation area 1 and a back heat dissipation area 19. Among them, the top heat dissipation area 1 is arranged above the carrier area. In order to ensure good bonding between the plastic package and the frame, on the one hand, the pulling strength of the packaged product can be improved, and on the other hand, the distance in the Y direction of the carrier can be made larger, that is, a larger-sized chip can be bonded. Preferably, an oval sealant groove 4 is arranged between the top heat dissipation area 1 and the carrier area, and the center line of the oval sealant groove 4 is moved to the encapsulation line position.

[0044] In the embodiment of the present invention, a part of the oval sealant groove 4 is located in the top heat dissipation area 1, and the other part is located in the carrier area. After encapsulation, the plastic encapsulant completely fills the oval sealant groove 4. In actual application, the front and back of the oval sealant groove 4 are formed by stamping once each. The first stamping is from the left to form a through hole 23 with a diameter of 1 mm to ensure that the excess copper material is removed. The second stamping is from the right to form a semi-through hole 24 with a diameter of 1.2 mm to ensure the shape after stamping and prevent corner collapse during one-time stamping. After two stampings, the thickness of the oval sealant groove 4 is 1.3 mm, the front length is 3.8 mm, and the front width is 1.2 mm; the back width of the oval sealant groove 4 is 3.6 mm, and the back width is 1 mm.

[0045] Furthermore, in order to ensure good bonding between the plastic encapsulant and the frame, increase the bonding force, and prevent moisture from entering due to product delamination, preferably, in addition to the oval sealant groove 4, a fourth corner 22 and a dovetail groove 20 are also arranged between the top heat dissipation area 1 and the carrier area. Among them, the dovetail groove 20 is located on both sides of the oval sealant groove 4, and the fourth corner 22 is located on both sides of the dovetail groove 20.

[0046] Furthermore, the carrier area is arranged directly above the back heat dissipation area 19, the pin area 3 is arranged below it, and a border 16 is arranged below the pin area 3.

[0047] In actual application, the pin area 3 includes a first pin 14 and a second pin 15 from left to right. In order to ensure the creepage distance for high-voltage output safety and effectively improve the electrical performance of the packaged product, preferably, there is a spacing between the first pin 14 and the second pin 15, that is, the first pin 14 and the second pin 15 are isolated from each other; in actual application, the first pin 14 is the G pole, and the second pin 15 is the S pole; furthermore, there is also a spacing between the first pin 14, the second pin 15 and the carrier area respectively, that is, the first pin 14, the second pin 15 and the carrier area are also isolated from each other.

[0048] The first pin 14 is connected to the first pin soldering area 7, and the second pin 15 is connected to the second pin soldering area 10. Among them, the first pin soldering area 7 and the second pin soldering area 10 are arranged side by side below the carrier area, and the horizontal distance between the carrier area and the first pin soldering area 7 and the second pin soldering area 10 is 0.3 mm, and the vertical distance is 1.3 mm. Further, the distance between the first pin 14 and the second pin 15 is 5.08 mm.

[0049] In the embodiment of the present invention, in order to ensure the structural strength of the product after encapsulation and prevent the product from being torn apart, preferably, a first corner is provided at the upper right corner of the first pin soldering area 7, and a second corner and a third corner are respectively provided at the upper right corner and the lower left corner of the second pin soldering area 10, and the hypotenuses included in the first corner, the second corner and the third corner are parallel to each other. Further, the angles of the three corners are between 40° and 50°, and the area of the second pin soldering area 10 is larger than the area of the first pin soldering area 7. In practical applications, the area of the second pin soldering area 10 is 1.8 to 2.4 times the area of the first pin soldering area 7.

[0050] Further, in order to ensure the good waterproof performance and structural strength of the carrier area and prevent water vapor from entering the carrier area and the carrier area from being torn apart under the force in the X direction, preferably, a semi-circular sealant groove 9 and a first pin V-groove 8 are provided at the connection part between the first pin 14 and the first pin soldering area 7. Among them, the semi-circular sealant groove 9 is located at the connection part between the first pin 14 and the first pin soldering area 7 and on the side close to the second pin soldering area 10, and because its shape is semi-circular, it is called the semi-circular sealant groove 9; a circular sealant groove 12 and a second pin V-groove 11 are provided at the connection part between the second pin 15 and the second pin soldering area 10. Among them, the circular sealant groove 12 is located inside the connection part between the second pin 15 and the second pin soldering area 10, and because its shape is circular, it is called the circular sealant groove 12.

[0051] In the embodiment of the present invention, in order to improve the bonding force between the plastic package and the carrier and improve the problem of carrier delamination, preferably, a first V-groove 5 is provided around the carrier area; further, a stepped semi-stamping structure 21 is provided on the left and right sides of the carrier area, and the semi-stamping structure is located on the side of the first V-groove 5 away from the carrier area. It should be noted that in the embodiment of the present invention, the left and right sides of the carrier area refer to the two sides of the carrier area that are not adjacent to the top heat dissipation area 1 and the pin area 3.

[0052] In practical applications, the carrier area can be set as the first carrier area 2 including only one base island, or can be set as the second carrier area 25 including two base islands; further, on one base island, one chip can be set, or two chips can be set; based on this, it can be determined that at least one chip can be set in the carrier area, and at most four chips can be set. It should be noted that the shapes of the two base islands included in the second carrier area 25 can be the same or different.

[0053] It should be noted that the lead frame included in the embodiment of the present invention includes, from top to bottom, a top heat dissipation area 1, a carrier area, a middle rib 13, a pin area 3, and a frame 16, forming a lead frame unit. In practical applications, the lead frame further includes a connecting rib 6.

[0054] The connecting rib 6 has two existing ways in the lead frame unit. One way: when a connecting rib 6 is respectively arranged on both sides of the carrier area included in the lead frame unit, then a connecting rib 6 is shared between two adjacent lead frame units, that is, a total of three connecting ribs 6 are included in two adjacent lead frame units; another way: when two adjacent lead frame units form a group of lead frames, a connecting rib 6 is respectively arranged on two non-adjacent side edges included in the two carrier areas located in the lead frame, that is, only two connecting ribs 6 are included in a group of lead frames. Through the above settings, on the premise of ensuring product performance, the use of copper material can be reduced, and the material cost can be saved.

[0055] Further, in order to save raw materials, on the premise of ensuring the stability of the frame, flow channel waist holes 17 and non-flow channel waist holes 18 with different apertures can be provided under the middle rib 13. Among them, the flow channel waist holes 17 and the non-flow channel waist holes 18 are arranged on the connecting rib 6 between the middle rib 13 and the frame 16 in a sequentially spaced manner, and two flow channel waist holes 17 or two non-flow channel waist holes 18 with the same aperture are arranged on one connecting rib 6. In the embodiment of the present invention, the aperture of the non-flow channel waist hole 18 is greater than or equal to the aperture of the flow channel waist hole 17. Preferably, the aperture of the non-flow channel waist hole 18 is 2 to 3 times the aperture of the flow channel waist hole 17.

[0056] In the embodiments of the present invention, two pins are provided in the pin area 3, and the distance between the two pins is large; the pins are separated from the carrier area; the creepage distance between the back heat sink and the pins is increased to ensure the creepage distance for high-voltage output safety, effectively improving the electrical performance of the packaged product. Furthermore, moving the center line of the oval sealant hole to the encapsulation line position can ensure good bonding between the plastic package and the frame, improve the pulling strength of the packaged product, and at the same time make the distance in the Y direction of the carrier larger, enabling bonding of larger-sized chips and a wider range of processed chip sizes to meet the needs of different users. Further, the connecting ribs 6 in the vertical direction on the middle rib 13 are optimized from one per unit to one per two units; non-flow-channel waist holes 18 with different apertures are provided below the middle rib 13. While ensuring the stability of the frame structure, the aperture is increased as much as possible to reduce the use of copper material and effectively save material costs; the lead frame provided by the embodiments of the present invention can share the packaging equipment with TO-263US-7L. After replacing the parts, the two products can be interchanged, effectively reducing the capital investment in packaging equipment.

[0057] To more clearly introduce the lead frame provided by the embodiments of the present invention, the following Figures 1 to 6 will take Embodiment 1, Embodiment 2, and Embodiment 3 as examples to introduce the lead frame.

[0058] Embodiment 1

[0059] As Figure 1 shown, the lead frame mainly includes a top heat sink area 1, a carrier area, and a pin area 3, which are connected in parallel through the top heat sink area 1, the middle rib 13, and the border 16 to form a lead frame unit; the carrier area is arranged on the front of the back heat sink area 19, and the pin area 3 is arranged below the carrier area; at the connection part between the top heat sink area 1 and the carrier area, an enlarged oval sealant groove 4, a fourth corner 22, and a dovetail groove 20 are provided, aiming to ensure good bonding between the plastic encapsulant and the frame, increase the bonding force, and prevent product delamination and water vapor from entering.

[0060] In practical applications, the oval sealant groove 4 is formed by two stamping processes. The first time, a through hole 23 with a diameter of 1.00 mm is stamped from the left to ensure the removal of excess copper material. The second time, a semi-through hole 24 with a diameter of 1.20 mm is stamped from the right to ensure the shape after stamping and prevent corner collapse during a single stamping.

[0061] Within a lead frame unit, the carrier area can be set as the first carrier area 2 as Figure 1 shown, which only includes one base island, or it can also be set as Figure 1The second carrier area 25 shown includes two base islands on the left and right. The sizes of the two base islands on the left and right can be adjusted according to the size of the chip, that is, the two base islands can be of the same size or different sizes. Further, in order to ensure good waterproof performance and structural strength of the carrier area, prevent moisture from entering the carrier area and prevent cracking due to tensile force in the X direction, preferably, V-grooves are provided around the carrier area, and stepped semi-stamping structures 21 are provided on the left and right sides of the carrier area. The stepped semi-stamping structures 21 are located on the side of the V-grooves away from the carrier area.

[0062] It should be noted that in actual applications, one chip or two chips can be provided on the base island. When two chips are provided, the shapes of the two chips can be the same or different. In the embodiments of the present invention, the specific shape of the chip provided on the base island is not set.

[0063] As Figure 1 shown, the pin area 3 is provided with two pins, which are the first pin 14 and the second pin 15 from left to right. The first pin 14 and the second pin 15 are isolated from each other. Specifically, the distance between the first pin 14 and the second pin 15 is 5.08 mm; further, the first pin 14, the second pin 15 and the carrier area are also isolated from each other.

[0064] In actual applications, the first pin 14 is connected to the first pin welding area 7, and the second pin 15 is connected to the second pin welding area 10. Among them, the first pin welding area 7 and the second pin welding area 10 are arranged in parallel directly below the carrier area. In order to ensure the creepage distance for high-voltage output safety and effectively improve the electrical performance of the packaged product, preferably, the horizontal distance between the carrier area and the welding areas of the first pin 14 and the second pin 15 is 0.30 mm, and the pin area 3 is higher than the carrier area, and the vertical distance is 1.30 mm.

[0065] Further, in order to ensure the structural strength of the encapsulated product and prevent the product from being torn apart, preferably, a first corner is provided at the upper right corner of the first pin welding area 7, and a second corner and a third corner are respectively provided at the upper right corner and the lower left corner of the second pin welding area 10. The hypotenuses of the three corners are parallel, and the angles of the three corners are 40° to 50°; the area of the second pin welding area 10 is 1.8 to 2.4 times that of the first pin welding area 7. Further, in order to ensure good waterproof performance and structural strength of the carrier area and prevent moisture from entering the carrier area and the carrier area from being torn apart under X-direction force, preferably, a semi-circular sealant groove 9 and a first pin V-groove 8 are provided at the part where the first pin 14 is connected to the first pin welding area 7; since the semi-circular sealant groove 9 is located at the part where the first pin 14 is connected to the first pin welding area 7 and is close to the second pin welding area 10 and its shape is semi-circular, it is called the semi-circular sealant groove 9; a circular sealant groove 12 and a second pin V-groove 11 are provided at the part where the second pin 15 is connected to the second pin welding area 10; since the circular sealant groove 12 is located inside the part where the second pin 15 is connected to the second pin welding area 10 and its shape is circular, it is called the circular sealant groove 12.

[0066] As Figure 1 shown, in this embodiment, when a connecting rib 6 is provided on each side of the carrier area included in the lead frame unit, then a connecting rib 6 is shared between two adjacent lead frame units, that is, a total of three connecting ribs 6 are included in two adjacent lead frame units.

[0067] In this embodiment, the runner waist holes 17 and the non-runner waist holes 18 are arranged on the connecting rib 6 between the middle rib 13 and the frame 16 at intervals in turn, and two runner waist holes 17 or two non-runner waist holes 18 with the same hole diameter are provided on one connecting rib 6. It should be noted that Figure 1 the runner waist holes 17 and the non-runner waist holes 18 shown have the same hole diameter.

[0068] Embodiment 2

[0069] As Figure 4 shown, this lead frame is an improvement on the lead frame provided in Embodiment 1. While ensuring the stability of the frame structure, two adjacent lead frame units are set as a group of lead frames. The connecting rib between the two carrier areas in this group of lead frames is removed, and the hole diameter of the non-runner waist hole 18 between the two frames is increased. In the embodiment of the present invention, the connecting rib 6 in the middle of the carrier area is optimized from one per unit to one per two units, saving raw materials.

[0070] Furthermore, in order to save raw materials, on the premise of ensuring the stability of the frame, flow channel waist holes 17 and non-flow channel waist holes 18 with different apertures can be provided under the middle rib 13. In this embodiment, the aperture of the non-flow channel waist hole 18 is 2 to 3 times that of the flow channel waist hole 17.

[0071] Embodiment 3:

[0072] Based on Embodiments 1 and 2, different electroplating process surface treatments can be performed on the pin welding area and the carrier area of this lead frame to improve the welding strength between the bonding wire and the pin welding area. As Figure 5 shown in the schematic diagram of nickel plating on the pin welding area, or as Figure 6 shown in the schematic diagram of full nickel plating on the pin welding area and the carrier area.

[0073] In summary, the embodiments of the present invention provide a new type of TO-263 lead frame, including: a heat dissipation area, a carrier area, and a pin area; the heat dissipation area is arranged above the carrier area, and an oval sealant groove is arranged between the heat dissipation area and the carrier area; the pin area is arranged below the carrier area, and a border is arranged below the carrier area; the pin area is provided with a first pin and a second pin, and a spacing is left between the first pin and the second pin. In the lead frame provided in this embodiment, two pins with a spacing are arranged in the pin area, and both pins are separated from the carrier area, increasing the creepage distance between the heat dissipation area and the pins, ensuring a safe creepage distance for high-voltage output, and effectively improving the electrical performance of the packaged product; furthermore, an oval sealant groove is arranged between the heat dissipation area and the carrier area, which can make the distance in the Y direction of the carrier larger while ensuring good bonding between the plastic package and the frame and improving the pulling strength of the packaged product, enabling bonding of larger-sized chips, with a wider processing chip size range, and meeting the needs of different users.

[0074] Although the preferred embodiments of the present invention have been described, those skilled in the art can make additional changes and modifications to these embodiments once they know the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present invention.

[0075] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these changes and modifications.

Claims

1. A novel TO-263 lead frame, characterized in that, it includes: a heat dissipation area, a carrier area, and a pin area; The heat dissipation area is arranged above the carrier area, and an oval sealant groove is arranged between the heat dissipation area and the carrier area; The pin area is arranged below the carrier area, and a border is arranged below the pin area; A first pin and a second pin are arranged on the pin area, and the carrier area is isolated from the first pin and the second pin; The pin area further includes a first pin soldering area and a second pin soldering area; A first corner is arranged at the upper right corner of the first pin soldering area, a second corner and a third corner are respectively arranged at the upper right corner and the lower left corner of the second pin soldering area, and the hypotenuses included by the first corner, the second corner and the third corner are parallel to each other; The first pin is connected to the first pin soldering area, and the second pin is connected to the second pin soldering area; The angles of the first corner, the second corner and the third corner are all between 40° and 50°; The area of the second pin soldering area is 1.8 to 2.4 times the area of the first pin soldering area; A fourth corner and a dovetail groove are further included between the heat dissipation area and the carrier area; The oval sealant groove is formed by stamping on the front and back in sequence, and the thickness of the oval sealant groove is 1.3 mm; The front of the oval sealant groove is 3.8 mm long and 1.2 mm wide; the back of the oval sealant groove is 3.6 mm long and 1 mm wide; The oval sealant groove is filled with encapsulant after encapsulation; A part of the oval sealant groove is located in the top heat dissipation area, another part is located in the carrier area, the dovetail groove is located on both sides of the oval sealant groove, and the fourth corner is located on both sides of the dovetail groove.

2. The lead frame according to claim 1, characterized in that, The horizontal distance between the carrier area and the first pin soldering area and the second pin soldering area is 0.30 mm, and the vertical distance is 1.30 mm; The distance between the first pin and the second pin is 5.08 mm.

3. The lead frame according to claim 1, characterized in that, A semi-circular sealant groove and a first pin V-groove are arranged at the connection part of the first pin and the first pin soldering area, and the semi-circular sealant groove is located on the side of the connection part of the first pin and the first pin soldering area and close to the second pin soldering area; A circular sealant groove and a second pin V-groove are arranged at the connection part of the second pin and the second pin soldering area, and the circular sealant groove is located inside the connection part of the second pin and the second pin soldering area.

4. The lead frame according to claim 1, characterized in that, First V-grooves are arranged around the carrier area; stepped semi-stamping structures are arranged on the left and right sides of the carrier area, and the stepped semi-stamping structures are located on the side of the first V-groove far from the carrier area; The carrier area includes one base island; or the carrier area includes two base islands.

5. The lead frame according to claim 1, characterized in that, It further includes connecting ribs and middle ribs; The heat dissipation area, the carrier area, the middle ribs, the pin area and the border form a lead frame unit; The lead frame unit includes a connection rib disposed on each of two sides of the carrier region, and a connection rib is shared between two adjacent lead frame units; or two adjacent lead frame units form a set of lead frames, and a connection rib is disposed on each of two non-adjacent sides of two carrier regions located within the set of lead frames.

6. The lead frame according to claim 5, wherein, it further includes a flow channel waist hole and a non-flow channel waist hole, and the aperture of the non-flow channel waist hole is greater than or equal to the aperture of the flow channel waist hole; the flow channel waist hole and the non-flow channel waist hole are arranged at intervals in sequence on the connection rib between the middle rib and the border.

7. The lead frame according to claim 1, wherein, the heat dissipation region includes a top heat dissipation region and a back heat dissipation region; the top heat dissipation region is disposed above the carrier region; the back heat dissipation region is disposed directly below the carrier region.

Images