Display substrate and manufacturing method thereof, and display device

Abstract

The present invention provides a display substrate and a manufacturing method thereof, and a display device. A first flat layer located between a first passivation layer and a second source-drain metal layer is arranged to have a plurality of flat portions and a plurality of hollow portions, and the orthographic projections of the hollow portions on a base substrate do not overlap with the orthographic projections of a lap electrode and a wiring on the base substrate, and flat portions are provided between the wiring and the first passivation layer, and between the lap electrode and the first passivation layer. That is, compared with the prior art, the present invention is equivalent to reducing the area of ​​the first flat layer, reducing the surface contact area between the second flat layer and the first flat layer with a high F-content, and can prevent the second flat layer from falling off, avoid the problem of short anodes and second source-drain metal layers formed subsequently, thereby improving the yield of display products.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display substrate and a manufacturing method thereof, and a display device. Background Art

[0002] In recent years, organic electroluminescent display (OLED) as a new type of flat panel display has gradually attracted more attention. Due to its active light emission, high light brightness, high resolution, wide viewing angle, fast response speed, color saturation, lightness, low energy consumption and flexibility, it is known as a dream display and has become a hot mainstream display product in the market. Summary of the invention

[0003] The embodiments of the present invention provide a display substrate and a manufacturing method thereof, and a display device, so as to improve the yield rate of display products.

[0004] Therefore, an embodiment of the present invention provides a display substrate, including:

[0005] substrate substrate;

[0006] A first source-drain metal layer, located on the substrate;

[0007] A first passivation layer is located on a side of the first source-drain metal layer away from the substrate;

[0008] A first flat layer, located on a side of the first passivation layer away from the substrate; the first flat layer has a plurality of flat portions and a plurality of hollow portions;

[0009] a second source-drain metal layer, located on a side of the first flat layer away from the base substrate; the second source-drain metal layer has a lap electrode and a wiring, the orthographic projection of the hollow portion on the base substrate does not overlap with the orthographic projection of the lap electrode and the wiring on the base substrate, and the flat portion is provided between the wiring and the first passivation layer and between the lap electrode and the first passivation layer;

[0010] The second planar layer is located on a side of the second source-drain metal layer away from the substrate.

[0011] Optionally, in the above-mentioned display substrate provided by the embodiment of the present invention, it further includes a second passivation layer located between the second source-drain metal layer and the second planar layer, and the second passivation layer has a first via hole corresponding to the bonding electrode.

[0012] Optionally, in the above-mentioned display substrate provided by an embodiment of the present invention, the second passivation layer covers the bonding electrode and the wiring, and the second passivation layer is in direct contact with the bonding electrode and the wiring;

[0013] A portion of the first passivation layer that does not overlap with the flat portion is a first portion, and the second passivation layer is in direct contact with the first portion;

[0014] The flat portion has a bottom surface contacting the first passivation layer, a top surface opposite to the bottom surface, and a side surface connecting the bottom surface and the top surface, and the second passivation layer directly contacts the side surface of the flat portion.

[0015] Optionally, in the above-mentioned display substrate provided by an embodiment of the present invention, the orthographic projections of the bridging electrodes and the wirings of the second source-drain metal layer on the base substrate are located within the orthographic projection range of the corresponding flat portion on the base substrate.

[0016] Optionally, the display substrate provided in the embodiment of the present invention further includes an anode located on the side of the second flat layer away from the base substrate, and the anode is electrically connected to the bonding electrode through a second via hole penetrating the second flat layer and the first via hole.

[0017] Optionally, in the above-mentioned display substrate provided by an embodiment of the present invention, the slope angle of the flat portion is less than 90°.

[0018] Accordingly, an embodiment of the present invention further provides a method for manufacturing a display substrate, comprising:

[0019] providing a substrate base plate;

[0020] forming a first source-drain metal layer on the base substrate;

[0021] forming a first passivation layer on a side of the first source / drain metal layer facing away from the substrate;

[0022] forming a first flat layer having a plurality of flat portions and a plurality of hollow portions on a side of the first passivation layer away from the base substrate;

[0023] A second source-drain metal layer is formed on a side of the first flat layer away from the base substrate; wherein the second source-drain metal layer has a lap electrode and a wiring, the orthographic projection of the hollow portion on the base substrate does not overlap with the orthographic projection of the lap electrode and the wiring on the base substrate, and the flat portion is provided between the wiring and the first passivation layer and between the lap electrode and the first passivation layer;

[0024] A second planarization layer is formed on a side of the second source / drain metal layer facing away from the substrate.

[0025] Optionally, in the above manufacturing method provided by an embodiment of the present invention, forming a first flat layer having a plurality of flat portions and a plurality of hollow portions on a side of the first passivation layer away from the base substrate is specifically:

[0026] Coating a first flat material film layer on a side of the first passivation layer facing away from the substrate;

[0027] Depositing a second source-drain metal material layer on a side of the first flat material film layer away from the substrate;

[0028] Etching the second source-drain metal material layer using plasma including Cl2 to form the second source-drain metal layer;

[0029] The first flat material film layer is etched by using a mixed gas of CF4 and O2, and the Cl - Replace with F - , forming the first flat layer having a plurality of the flat portions and a plurality of the hollow portions.

[0030] Optionally, in the above manufacturing method provided by the embodiment of the present invention, after forming the second source-drain metal layer and before forming the second planarization layer, it further includes:

[0031] A second passivation layer is formed; wherein the second passivation layer has a first via hole corresponding to the bonding electrode.

[0032] Correspondingly, an embodiment of the present invention further provides a display device, including a display panel, wherein the display panel includes any one of the above-mentioned display substrates provided by the embodiment of the present invention.

[0033] The beneficial effects of the embodiments of the present invention are as follows:

[0034] The embodiment of the present invention provides a display substrate and a manufacturing method thereof, and a display device. The first flat layer located between the first passivation layer and the second source-drain metal layer is configured to have a plurality of flat portions and a plurality of hollow portions, and the orthographic projection of the hollow portion on the base substrate does not overlap with the orthographic projection of the lap electrode and the wiring on the base substrate. There are flat portions between the wiring and the first passivation layer, and between the lap electrode and the first passivation layer. That is, compared with the prior art, the present invention is equivalent to reducing the area of ​​the first flat layer, reducing the area between the second flat layer and the high F - The surface contact area of ​​the first flat layer with a large content can prevent the second flat layer from falling off, avoid the problem of short anode and second source and drain metal layers formed subsequently, thereby improving the yield of display products. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A schematic diagram of the structure of a display substrate provided in the related art;

[0036] Figure 2A partial schematic diagram of a display substrate provided in the related art during manufacture;

[0037] Figure 3 It is another partial schematic diagram of manufacturing a display substrate provided in the related art;

[0038] Figure 4 A schematic structural diagram of a display substrate provided by an embodiment of the present invention;

[0039] Figure 5 A schematic structural diagram of another display substrate provided by an embodiment of the present invention;

[0040] Figure 6 A schematic flow chart of a method for manufacturing a display substrate provided by an embodiment of the present invention;

[0041] Figure 7 A schematic flow chart of another method for manufacturing a display substrate provided by an embodiment of the present invention;

[0042] Figure 8 A schematic flow chart of another method for manufacturing a display substrate provided by an embodiment of the present invention;

[0043] Figure 9A-9D A schematic structural diagram of a method for manufacturing a display substrate provided by an embodiment of the present invention after executing each step;

[0044] Fig.10 A schematic structural diagram of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] The shapes and sizes of the components in the drawings do not reflect the actual proportions, and are only intended to illustrate the contents of the present invention.

[0047] With the development of display technology, organic electroluminescent displays capable of flexible display have promoted the diversification of display and gradually become the mainstream of display technology. Figure 1 As shown, Figure 1It is a structural schematic diagram of a display substrate in the related art, and the display substrate includes a base substrate 1, a barrier layer 2, a buffer layer 3, an active layer 4, a first gate insulating layer 5, a first gate layer 6, a second gate insulating layer 7, a second gate layer 8, an interlayer dielectric layer 9, a first source-drain metal layer 10, a passivation layer 11, a first flat layer 12, a second source-drain metal layer 13, a second flat layer 14, an anode 15, a pixel defining layer 16 and a spacer layer 17, which are stacked in sequence. With people's higher requirements for display quality, high PPI products have become the development direction of flexible displays. However, high PPI products mean finer wiring and denser arrangement. The finer the wiring, the greater the resistance. Figure 1 The display substrate shown adopts a double-layer source-drain metal layer structure, which can realize two layers of signal lines connected in parallel to reduce the resistance of the signal lines.

[0048] The material of the source-drain metal layer is generally a titanium / aluminum / titanium stacked structure. Since the lower layer of the second source-drain metal layer 13 is the first flat layer 12, and the flat layer material is an organic material, there is water vapor in the first flat layer 12. Compared with the first source-drain metal layer 10, the second source-drain metal layer 13 is prone to Al corrosion. Specifically, Cl2 plasma etching is usually used to form the source-drain metal layer, such as Figure 2 As shown in A in FIG. 1 , A is a structural diagram of forming a second source-drain metal layer 13 (Ti / Al / Ti) on the first flat layer 12 (PLN) by an etching process. After the second source-drain metal layer 13 is formed, Cl remains on the surface of the first flat layer 12, the outer wall of the second source-drain metal layer 13, and the surface of the photoresist PR. - ;like Figure 2 As shown in B, the residual Cl - It reacts with H2O in the environment to form HCl; Figure 2 As shown in C, H2O and HCl react with Al in the second source-drain metal layer 13, resulting in aluminum corrosion. High PPI products are more susceptible to extremely severe Al corrosion in the second source-drain metal layer 13 due to their finer and denser wiring. Figure 3 As shown in the related art, the high PPI product solves the Al corrosion problem of the second source-drain metal layer 13 by adding CF4 in the post-processing process. - The remaining Cl - Replaced, because more F is used - To replace Cl - , which will increase the CF bonds between Ti and the surface of the first flat layer 12. The CF bonds have very strong polarity, which reduces the surface energy of Ti and the first flat layer 12, making it difficult for the second flat layer 14 to be coated normally (fall off), causing the anode 15 and the second source-drain metal layer 13 to be short, seriously affecting the product yield.

[0049] In view of this, an embodiment of the present invention provides a display substrate, such as Figure 4 As shown, including:

[0050] Base substrate 20;

[0051] A first source-drain metal layer 21 is located on the base substrate 20;

[0052] A first passivation layer 22 is located on a side of the first source / drain metal layer 21 away from the substrate 20;

[0053] The first flat layer 23 is located on the side of the first passivation layer 22 away from the base substrate 20; the first flat layer 23 has a plurality of flat portions 231 and a plurality of hollow portions 232;

[0054] The second source-drain metal layer 24 is located on the side of the first flat layer 23 away from the base substrate 20; the second source-drain metal layer 24 has a lap electrode 241 and a wiring 242, the orthographic projection of the hollow portion 232 on the base substrate 20 does not overlap with the orthographic projection of the lap electrode 241 and the wiring 242 on the base substrate 20, and there is a flat portion 231 between the wiring 242 and the first passivation layer 22 and between the lap electrode 241 and the first passivation layer 22;

[0055] The second planar layer 25 is located on a side of the second source / drain metal layer 24 facing away from the base substrate 20 .

[0056] The display substrate provided by the embodiment of the present invention is characterized in that the first flat layer 23 located between the first passivation layer 22 and the second source-drain metal layer 24 is provided with a plurality of flat portions 231 and a plurality of hollow portions 232, and the orthographic projection of the hollow portion 232 on the base substrate 20 does not overlap with the orthographic projection of the bonding electrode 241 and the wiring 242 on the base substrate 20, and there is a flat portion 231 between the wiring 242 and the first passivation layer 22 and between the bonding electrode 241 and the first passivation layer 22, that is, compared with the prior art, the present invention is equivalent to reducing the area of ​​the first flat layer 23, reducing the second flat layer 25 and the high F - The surface contact area of ​​the first planar layer 23 with a high content can prevent the second planar layer 25 from falling off, avoid the problem of the subsequently formed anode and the second source-drain metal layer 24 being short, thereby improving the yield of display products.

[0057] In specific implementation, although Figure 4 By etching away a portion of the first flat layer 23, the second flat layer 25 and the high F - However, the sidewalls of the flat portion 231 and the sidewalls of the second source / drain metal layer 24 still have F - , and because the high PPI product routing 242 is densely arranged, there will still be a lot of F -, resulting in the problem of the second flat layer 25 falling off, therefore, in the above-mentioned display substrate provided by the embodiment of the present invention, as Figure 5 As shown, the second passivation layer 26 is also included between the second source-drain metal layer 24 and the second planar layer 25, and the second passivation layer 26 has a first via hole V1 corresponding to the bonding electrode 241. In this way, the second passivation layer 26 can completely prevent the second planar layer 25 from contacting the surface of the second source-drain metal layer 24 and the first planar layer 23, thereby avoiding the problem that the second planar layer 25 is difficult to coat.

[0058] In a specific implementation, in the above-mentioned display substrate provided in an embodiment of the present invention, as Figure 5 As shown, the second passivation layer 26 covers the bonding electrode 241 and the wiring 242, and the second passivation layer 26 is in direct contact with the bonding electrode 241 and the wiring 242; thus, the second passivation layer 26 can completely prevent the second source-drain metal layer 24 from contacting the surface of the first flat layer 23, thereby avoiding the problem that the second flat layer 25 is difficult to coat;

[0059] The portion of the first passivation layer 22 that does not overlap with the flat portion 231 is the first portion 221 , and the second passivation layer 26 is in direct contact with the first portion 221 ;

[0060] The flat portion 231 has a bottom surface 2311 arranged in contact with the first passivation layer 22, a top surface 2312 arranged opposite to the bottom surface 2311, and a side surface 2313 connecting the bottom surface 2311 and the top surface 2312. The second passivation layer 26 is in direct contact with the side surface 2313 of the flat portion 231; in this way, the second passivation layer 26 can completely avoid the side surface 2313 of the flat portion 231 from contacting the surface of the first flat layer 23, thereby avoiding the problem that the second flat layer 25 is difficult to coat.

[0061] In a specific implementation, in the above-mentioned display substrate provided in an embodiment of the present invention, as Figure 5 As shown, the orthographic projections of the bonding electrode 241 and the wiring 242 of the second source-drain metal layer 24 on the base substrate 20 are located within the orthographic projection range of the corresponding flat portion 231 on the base substrate 1 .

[0062] The present invention changes the contact surface of the second flat layer 25, thereby avoiding the problem of the second flat layer 25 falling off when the high PPI product solves the Al corrosion problem of the second source and drain metal layer 24. In addition, the present invention only needs to add a second passivation layer 26 process without increasing the mask cost. It is perfectly compatible with the existing backplane structure and greatly improves the yield of high PPI products.

[0063] In a specific implementation, in the above-mentioned display substrate provided in an embodiment of the present invention, as Figure 5As shown, it also includes an anode 27 located on the side of the second flat layer 25 away from the base substrate 20 , and the anode 27 is electrically connected to the bonding electrode 241 through a second via hole V2 and a first via hole V1 penetrating the second flat layer 25 .

[0064] like Figure 4 As shown, Figure 4 For the case where the second passivation layer 26 is not provided, the anode 27 is directly electrically connected to the bonding electrode 241 through the second via hole V2 penetrating the second flat layer 25. Figure 5 The scheme shown.

[0065] In a specific implementation, in the above-mentioned display substrate provided in an embodiment of the present invention, as Figure 4 and Figure 5 As shown, the slope angle of the flat portion 231 is less than 90°. This can make the sidewall of the flat portion 231 smooth, preventing the subsequent film layer from being broken due to the height difference of the flat portion 231.

[0066] It should be noted that Figure 4 and Figure 5 The side wall of the flat portion 231 is steeper, and the orthographic projection area of ​​the flat portion 231 on the substrate 1 is equal to the orthographic projection area of ​​the trace 242 on the substrate 1. In actual production, the side of the flat portion 231 is relatively flat, that is, the orthographic projection area of ​​the flat portion 231 on the substrate 1 is slightly larger than the orthographic projection area of ​​the trace 242 on the substrate 1, close to a positive trapezoid, so that the film layer formed above the flat portion 231 will not be broken, so Figure 4 and Figure 5 It is only a schematic illustration and does not represent the actual shape of the film layer.

[0067] In a specific implementation, in the above-mentioned display substrate provided in an embodiment of the present invention, as Figure 4 and Figure 5 As shown, it also includes: a barrier layer 28, a buffer layer 29, an active layer 30, a first gate insulating layer 31, a first gate layer 32, a second gate insulating layer 33, a second gate layer 34, an interlayer dielectric layer 35, a pixel defining layer 36 located on the side of the anode 27 away from the base substrate 20, and a spacer layer 37 on the side of the pixel defining layer 36 away from the base substrate 20. The functions of these film layers are the same as those in the prior art and are not described in detail here.

[0068] In specific implementation, Figure 4 and Figure 5As shown, the routing 242 can be a VDD power line pattern or a data line pattern, etc. Since other patterns of the driving circuit are arranged below the routing 242, such as scan lines, source and drain electrodes of thin film transistors (TFTs), etc., the film layer is uneven. The first passivation layer generally adopts a deposition process, and the first passivation layer 22 will be as uneven as the film layer below it. Therefore, in order to make the patterns of the second source and drain metal layer 24 such as the overlapping electrode 241 and the routing 242 on a flat film surface, it is necessary to set a first flat layer 23 between the second source and drain metal layer 24 and the first passivation layer 22 to improve the excellent electrical environment.

[0069] Based on the same inventive concept, the embodiment of the present invention also provides a method for manufacturing a display substrate, such as Figure 6 As shown, including:

[0070] S601, providing a substrate;

[0071] S602, forming a first source-drain metal layer on the substrate;

[0072] S603, forming a first passivation layer on a side of the first source / drain metal layer facing away from the substrate;

[0073] S604, forming a first flat layer having a plurality of flat portions and a plurality of hollow portions on a side of the first passivation layer away from the substrate;

[0074] S605, forming a second source-drain metal layer on a side of the first flat layer away from the base substrate; wherein the second source-drain metal layer has a lapped electrode and a wiring, an orthographic projection of a hollow portion on the base substrate does not overlap with an orthographic projection of the lapped electrode and the wiring on the base substrate, and a flat portion is provided between the wiring and the first passivation layer and between the lapped electrode and the first passivation layer;

[0075] S606 , forming a second planarization layer on a side of the second source / drain metal layer facing away from the substrate.

[0076] The manufacturing method of the above-mentioned display substrate provided by an embodiment of the present invention is to set the first flat layer located between the first passivation layer and the second source-drain metal layer to have multiple flat parts and multiple hollow parts, and the orthographic projection of the hollow part on the base substrate does not overlap with the orthographic projection of the overlapping electrode and the wiring on the base substrate, and there are flat parts between the wiring and the first passivation layer and between the overlapping electrode and the first passivation layer. That is, compared with the prior art, the present invention is equivalent to reducing the area of ​​the first flat layer and reducing the surface contact area between the second flat layer and the first flat layer with a high F-content, which can prevent the second flat layer from falling off and avoid the problem of short anodes and second source-drain metal layers formed subsequently, thereby improving the yield of display products.

[0077] In a specific implementation, in the above manufacturing method provided by an embodiment of the present invention, a first flat layer having a plurality of flat portions and a plurality of hollow portions is formed on a side of the first passivation layer away from the substrate, such as Figure 7 As shown, specifically:

[0078] S701, coating a first flat material film layer on a side of the first passivation layer facing away from the substrate;

[0079] S702, depositing a second source-drain metal material layer on a side of the first flat material film layer away from the substrate;

[0080] S703, etching the second source-drain metal material layer using plasma including Cl2 to form a second source-drain metal layer;

[0081] S704, using a mixed gas of CF4 and O2 to etch the first flat material film layer, and at the same time, removing the Cl - Replace with F - , forming a first flat layer having a plurality of flat portions and a plurality of hollow portions.

[0082] In the specific implementation, in the above-mentioned manufacturing method provided in the embodiment of the present invention, if Figure 8 As shown, after forming the second source-drain metal layer and before forming the second planar layer, the method further includes:

[0083] S605 ′, forming a second passivation layer; wherein the second passivation layer has a first via hole corresponding to the bonding electrode.

[0084] In specific implementation, the above manufacturing method provided in the embodiment of the present invention also includes: forming an anode on the side of the second flat layer away from the base substrate; wherein the anode is electrically connected to the bonding electrode through the second via hole and the first via hole penetrating the second flat layer.

[0085] The following embodiments of the present invention provide Figure 5 The manufacturing method of the display substrate shown is described as follows:

[0086] (1) A barrier layer 28, a buffer layer 29, an active layer 30, a first gate insulating layer 31, a first gate layer 32, a second gate insulating layer 33, a second gate layer 34, an interlayer dielectric layer 35, a first source-drain metal layer 21 and a first passivation layer 22 are sequentially formed on a base substrate 20, a first flat material film layer 23' is coated on a side of the first passivation layer 22 away from the base substrate 20, and a third via hole V3 is formed in the first flat material film layer 23' at a drain position corresponding to the first source-drain metal layer 21 by patterning the first flat material film layer 23', as shown in FIG. Fig. 9A shown.

[0087] (2) depositing a second source-drain metal material layer on the side of the first flat material film layer 23' away from the substrate 20, and etching the second source-drain metal material layer using a plasma including Cl2 to form a second source-drain metal layer 24 having a lap electrode 241 and a wiring 242, such as Fig. 9B shown.

[0088] (3) The first flat material film layer 23' is etched using a mixed gas of CF4 and O2, and the Cl - Replace with F - , forming a first flat layer 23 having a plurality of flat portions 231 and a plurality of hollow portions 232; wherein the orthographic projection of the hollow portion 232 on the base substrate 20 does not overlap with the orthographic projection of the bonding electrode 241 and the wiring 242 on the base substrate 20, and there is a flat portion 231 between the wiring 242 and the first passivation layer 22 and between the bonding electrode 241 and the first passivation layer 22, such as Fig. 9C shown.

[0089] (4) forming a second passivation layer 26 on the side of the second source / drain metal layer 24 away from the base substrate 20, and patterning the second passivation layer 26 to form a first via hole V1 corresponding to the bonding electrode 241 in the second passivation layer 26, as shown in FIG. Fig.9D shown.

[0090] (5) forming a second flat layer 25 on a side of the second passivation layer 26 away from the base substrate 20, and patterning the second flat layer 25 to form a second via hole V2 corresponding to the first via hole V1 in the second flat layer 25; then, forming an anode 27, a pixel defining layer 36, and a spacer layer 37 in sequence on a side of the second flat layer 25 away from the base substrate 20, and the anode 27 is electrically connected to the bonding electrode 241 through the second via hole V2 and the first via hole V1 penetrating the second flat layer 25, as shown in FIG. Figure 5 shown.

[0091] Through the above steps (1) to (5), the Figure 5 The display substrate is shown.

[0092] It should be noted that in the above-mentioned method for manufacturing a display substrate provided in an embodiment of the present invention, the patterning process may include only a photolithography process, or may include a photolithography process and an etching step, and may also include other processes such as printing and inkjetting for forming a predetermined pattern; the photolithography process refers to a process for forming a pattern using a photoresist, a mask, an exposure machine, etc., including film formation, exposure, and development processes. In specific implementation, the corresponding patterning process may be selected according to the structure formed in the present invention.

[0093] Based on the same inventive concept, an embodiment of the present invention further provides a display panel, including the display substrate in the above embodiment. Since the principle of solving the problem by the display panel is similar to that of the above display substrate, the implementation of the display panel can refer to the implementation of the above display substrate, and the repeated parts will not be repeated.

[0094] Based on the same inventive concept, an embodiment of the present invention further provides a display device, including the display panel in the above embodiment. Since the principle of solving the problem by the display device is similar to that of the above display panel, the implementation of the display device can refer to the implementation of the above display panel, and the repeated parts will not be repeated.

[0095] In a specific implementation, the display device provided in the embodiment of the present invention may be a full-screen display device, or may be a flexible display device, etc., which is not limited here.

[0096] In a specific implementation, the display device provided by the embodiment of the present invention may be as follows: Fig.10 The full-screen mobile phone shown. Of course, the display device provided in the embodiment of the present invention can also be any product or component with a display function, such as a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, etc. Other essential components of the display device should be understood by ordinary technicians in the field, and will not be repeated here, nor should they be used as limitations on the present invention.

[0097] A display substrate and a manufacturing method thereof, as well as a display device provided by an embodiment of the present invention, are configured such that a first flat layer located between a first passivation layer and a second source-drain metal layer is provided with a plurality of flat portions and a plurality of hollow portions, and the orthographic projections of the hollow portions on a base substrate do not overlap with the orthographic projections of a lap electrode and a wiring on the base substrate, and flat portions are provided between the wiring and the first passivation layer, and between the lap electrode and the first passivation layer. That is, compared with the prior art, the present invention is equivalent to reducing the area of ​​the first flat layer, reducing the surface contact area between the second flat layer and the first flat layer with a high F-content, and can prevent the second flat layer from falling off, and avoid the problem of short anodes and second source-drain metal layers formed subsequently, thereby improving the yield of display products.

[0098] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A display substrate, characterized in that: include: substrate substrate; A first source-drain metal layer, located on the substrate; A first passivation layer is located on a side of the first source-drain metal layer away from the substrate; A first flat layer, located on a side of the first passivation layer away from the base substrate; the first flat layer has a plurality of flat portions and a plurality of hollow portions; a second source-drain metal layer, located on a side of the first flat layer away from the base substrate; the second source-drain metal layer has a lap electrode and a wiring, the orthographic projection of the hollow portion on the base substrate does not overlap with the orthographic projection of the lap electrode and the wiring on the base substrate, and the flat portion is provided between the wiring and the first passivation layer and between the lap electrode and the first passivation layer; A second planar layer is located on a side of the second source-drain metal layer away from the substrate; The display substrate further includes a second passivation layer located between the second source-drain metal layer and the second planar layer, the second passivation layer having a first via hole corresponding to the bonding electrode; The second passivation layer covers the bonding electrode and the wiring, and the second passivation layer is in direct contact with the bonding electrode and the wiring; A portion of the first passivation layer that does not overlap with the flat portion is a first portion, and the second passivation layer is in direct contact with the first portion; The flat portion has a bottom surface contacting the first passivation layer, a top surface opposite to the bottom surface, and a side surface connecting the bottom surface and the top surface, and the second passivation layer directly contacts the side surface of the flat portion.

2. The display substrate according to claim 1, wherein: The orthographic projections of the bridging electrodes and the wirings of the second source-drain metal layer on the base substrate are located within the orthographic projection range of the corresponding flat portion on the base substrate.

3. The display substrate according to claim 1, wherein: It also includes an anode located on a side of the second flat layer away from the base substrate, and the anode is electrically connected to the bonding electrode through a second via hole penetrating the second flat layer and the first via hole.

4. The display substrate according to any one of claims 1 to 3, characterized in that: The slope angle of the flat portion is less than 90°.

5. A method for manufacturing a display substrate according to any one of claims 1 to 4, characterized in that: include: providing a substrate base plate; forming a first source-drain metal layer on the base substrate; forming a first passivation layer on a side of the first source / drain metal layer facing away from the substrate; forming a first flat layer having a plurality of flat portions and a plurality of hollow portions on a side of the first passivation layer away from the base substrate; A second source-drain metal layer is formed on a side of the first flat layer away from the base substrate; wherein the second source-drain metal layer has a lap electrode and a wiring, the orthographic projection of the hollow portion on the base substrate does not overlap with the orthographic projection of the lap electrode and the wiring on the base substrate, and the flat portion is provided between the wiring and the first passivation layer and between the lap electrode and the first passivation layer; A second passivation layer is formed on a side of the second source-drain metal layer away from the base substrate; wherein the second passivation layer has a first via hole corresponding to the lapped electrode; A second planarization layer is formed on a side of the second passivation layer facing away from the substrate.

6. The method according to claim 5, characterized in that: The first flat layer having a plurality of flat portions and a plurality of hollow portions is formed on a side of the first passivation layer away from the base substrate, specifically: Coating a first flat material film layer on a side of the first passivation layer facing away from the substrate; Depositing a second source-drain metal material layer on a side of the first flat material film layer away from the substrate; Etching the second source-drain metal material layer using plasma including Cl2 to form the second source-drain metal layer; The first flat material film layer is etched by using a mixed gas of CF4 and O2, and the Cl - Replace with F - , forming the first flat layer having a plurality of the flat portions and a plurality of the hollow portions.

7. A display device, characterized in that: A display panel is included, wherein the display panel includes the display substrate according to any one of claims 1 to 4.

Images