Silicon rod processing equipment

Abstract

An embodiment of the present invention provides a silicon rod processing device, the silicon rod processing device comprising: a pre-processing device, the pre-processing device is used to process and form an anti-skid structure on the silicon rod to be processed, the anti-skid structure is used to constrain the cutting line; a cutting device, the cutting device is used to cut into the silicon rod to be processed from the position of the anti-skid structure to remove the edge skin, wherein the axis of the silicon rod to be processed is in a horizontal plane; a silicon rod conveying device, the silicon rod conveying device is used to carry the silicon rod to be processed and move between the positions of different devices. The silicon rod processing equipment in the embodiment of the present invention only needs one clamping to cooperate with multiple processes for processing, thereby helping to save clamping time and reduce the accumulated errors of multiple clamping. In addition, the anti-skid structure formed by the pre-processing device also helps to improve the cutting quality of the silicon rod to be processed when it is cut in a horizontal plane.

Description

Technical Field

[0001] The invention relates to the technical field of silicon rod processing, and in particular to silicon rod processing equipment. Background Art

[0002] Silicon wafers are the core components in the manufacturing process of solar cells, and the manufacturing of silicon wafers is usually inseparable from the processing of silicon rods.

[0003] In the current silicon rod processing process, different equipment is usually arranged in different places, and multiple equipments with different functional types are used to perform different processing steps to obtain silicon rods before slicing.

[0004] The existing processing method uses multiple devices in different locations for coordinated processing, so it is necessary to frequently load and unload silicon rods. On the one hand, frequent loading and unloading of silicon rods wastes time and reduces processing efficiency. On the other hand, the clamping errors of silicon rods in different processes can easily lead to reduced processing quality of silicon rods. Summary of the invention

[0005] The invention provides a silicon rod processing device, aiming to solve the problems of low efficiency and low product quality in existing silicon rod processing.

[0006] An embodiment of the present invention provides a silicon rod processing device, comprising:

[0007] A pre-processing device, the pre-processing device is used to process and form an anti-skid structure on the silicon rod to be processed, and the anti-skid structure is used to constrain and limit the cutting line;

[0008] A cutting device, wherein the cutting device is used to cut into the silicon rod to be processed from the anti-slip structure position to remove the edge skin, wherein the axis of the silicon rod to be processed is in a horizontal plane;

[0009] A silicon rod conveying device is used to carry the silicon rod to be processed and move it between positions of different devices.

[0010] Optionally, the cutting device comprises:

[0011] a first winding mechanism and a second winding mechanism, wherein the first winding mechanism is fixed to one end of the cutting line, and the second winding mechanism is fixed to the other end of the cutting line; one of the first winding mechanism and the second winding mechanism is used for winding up the line, and the other is used for unwinding the line;

[0012] A cutting mechanism, wherein the cutting wire passes through the first winding mechanism, the cutting mechanism and the second winding mechanism in sequence, and the cutting mechanism is used to drive the cutting wire to feed and cut along a direction perpendicular to the axis of the silicon rod to be processed;

[0013] A reversing mechanism is provided on the winding path of the cutting line, and is used to guide the winding direction of the cutting line.

[0014] Optionally, the cutting mechanism comprises four groups of cutting tables, and the four groups of cutting tables are arranged in a rectangular shape;

[0015] The cutting wire passes through each group of cutting tables in sequence to form a U-shaped cutting wire network.

[0016] Optionally, each group of the cutting tables includes a support, a cutting roller and a cutting roller lifting mechanism;

[0017] The cutting roller is rotatably connected to the cutting roller lifting mechanism, the axis of the cutting roller is in a horizontal plane, and the cutting line is tangent to the lower edge of the cutting roller;

[0018] The cutting roller lifting mechanism is connected to the support, and is used to drive the cutting roller to drive the cutting line to move up and down in a vertical plane along an axial direction perpendicular to the silicon rod to be processed.

[0019] Optionally, each group of the cutting tables further comprises a cutting roller translation mechanism;

[0020] The cutting roller translation mechanism is connected to the cutting roller lifting mechanism, and the cutting roller translation mechanism is used to drive the cutting roller to drive the cutting line to approach or move away from the axis of the silicon rod to be processed in a horizontal plane.

[0021] Optionally, each group of the cutting tables further includes a driving motor, and the cutting roller is connected to an output shaft of the driving motor.

[0022] Optionally, the reversing mechanism comprises:

[0023] A first reversing wheel assembly, the first reversing wheel assembly is arranged between the first winding mechanism and the cutting mechanism, and is used to convert the direction of the cutting line between the first winding mechanism and the cutting mechanism;

[0024] A second reversing wheel assembly, the second reversing wheel assembly is arranged inside the cutting mechanism and is used to change the direction of the cutting line inside the cutting mechanism;

[0025] A third reversing wheel assembly is disposed between the cutting mechanism and the second winding mechanism, and is used for converting the direction of the cutting line between the cutting mechanism and the second winding mechanism.

[0026] Optionally, the silicon rod conveying device includes a clamping assembly and a first driving mechanism;

[0027] The clamping assembly is connected to the first driving mechanism, and the first driving mechanism is used to drive the clamping assembly to carry the silicon rod to be processed to move between different positions, wherein the clamping assembly is used to clamp the silicon rod to be processed from the end face so that the axis of the silicon rod to be processed is in a horizontal plane.

[0028] Optionally, the clamping assembly includes a first clamping beam, a fixed clamping arm, a movable clamping arm and a second driving mechanism;

[0029] The first clamping beam is fixedly connected to the first driving mechanism;

[0030] The fixed clamping arm is fixedly connected to the first clamping beam, the movable clamping arm is movably connected to the first clamping beam, and the movable clamping arm is arranged opposite to the fixed clamping arm to form a clamping space for clamping the silicon rod to be processed;

[0031] The second driving mechanism is connected to the first clamping beam and is used for driving the movable clamping arm to approach or move away from the fixed clamping arm.

[0032] Optionally, the clamping assembly further comprises a first chuck, a second chuck and a third driving mechanism;

[0033] The first chuck is rotatably connected to the fixed clamp arm, and the second chuck is rotatably connected to the movable clamp arm;

[0034] The third driving mechanism is used to drive the first chuck or the second chuck to rotate at a preset angle.

[0035] Optionally, the silicon rod processing equipment further comprises:

[0036] A polishing device is used to polish the silicon rod to be processed after the edge skin is removed.

[0037] Optionally, the silicon rod processing equipment further comprises:

[0038] The edge skin clamping device is arranged on both sides of the cutting device with the axis of the silicon rod to be processed as the center line, and the edge skin clamping device is used to clamp and fix the edge skin.

[0039] Optionally, the edge skin clamping device includes a clamping bracket, a clamping mechanism and a fourth driving mechanism;

[0040] The fourth driving mechanism is connected to the clamping bracket;

[0041] The clamping mechanism is connected to the fourth driving mechanism, and the fourth driving mechanism is used to drive the clamping mechanism to carry the edge skin and move along the direction perpendicular to the axis of the silicon rod to be processed.

[0042] Optionally, the clamping mechanism includes a second clamping beam, a fixed clamping block, a movable clamping block and a fifth driving mechanism;

[0043] The second clamping beam is fixedly connected to the fifth driving mechanism;

[0044] The fixed clamping block is fixedly connected to the second clamping beam, the movable clamping block is movably connected to the second clamping beam, and the movable clamping block is arranged opposite to the fixed clamping block to form a clamping space for clamping the edge skin;

[0045] The fifth driving mechanism is connected to the second clamping beam and is used for driving the movable clamping block to approach or move away from the fixed clamping block.

[0046] Optionally, the silicon rod processing equipment further comprises:

[0047] The edge skin collecting and conveying device is arranged below the edge skin clamping device and is used for collecting and outputting the edge skin.

[0048] Optionally, the edge skin collection and delivery device is a conveyor belt device.

[0049] Optionally, the silicon rod processing equipment further comprises a feeding device, wherein the feeding device is used to feed the silicon rods to be processed into the silicon rod processing equipment, and to feed the processed silicon rods out of the silicon rod processing equipment.

[0050] In an embodiment of the present invention, a pre-processing device, a cutting device and a silicon rod conveying device are integrated in the silicon rod processing equipment. The silicon rod conveying device can carry the silicon rod to be processed and move between other positions such as the position of the pre-processing device and the position of the cutting device. The pre-processing device can complete the process of anti-slip structure processing, and the cutting device can complete the process of cutting and removing the edge skin. Therefore, only one clamping is required to cooperate with multiple processes for processing, which helps to save clamping time and reduce the accumulated errors of multiple clamping. In addition, the anti-slip structure formed by the pre-processing device also helps to improve the cutting quality of the silicon rod to be processed when cutting in a horizontal plane. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0052] Figure 1 An isometric schematic diagram of a silicon rod processing device according to an embodiment of the present invention is shown;

[0053] Figure 2The embodiment of the present invention is shown Figure 1 Schematic diagram along the X1 direction;

[0054] Figure 3 The embodiment of the present invention is shown Figure 1 Schematic diagram along the Y1 direction;

[0055] Figure 4 The embodiment of the present invention is shown Figure 1 Schematic diagram along the Z1 direction;

[0056] Figure 5 A schematic diagram showing an anti-slip structure on a silicon rod to be processed in an embodiment of the present invention is shown;

[0057] Figure 6 An isometric schematic diagram of a pre-processing device according to an embodiment of the present invention is shown;

[0058] Figure 7 A schematic diagram showing a process of cutting a square stick into a rectangular shape in an embodiment of the present invention;

[0059] Figure 8 A schematic diagram of a cutting device according to an embodiment of the present invention is shown;

[0060] Fig. 9 A schematic isometric view of a cutting mechanism according to an embodiment of the present invention is shown;

[0061] Fig.10 The embodiment of the present invention is shown Fig. 9 Schematic diagram along the X2 direction;

[0062] Fig.11 The embodiment of the present invention is shown Fig. 9 Schematic diagram along the Y2 direction;

[0063] Fig.12 The embodiment of the present invention is shown Fig. 9 Schematic diagram along the Z2 direction;

[0064] Fig.13 The embodiment of the present invention is shown Figure 8 A schematic side view of the cutting device;

[0065] Fig.14 The embodiment of the present invention is shown Figure 8 A schematic diagram of the cutting device;

[0066] Fig.15 The embodiment of the present invention is shown Figure 8 Schematic diagram of the cutting device in the direction of B;

[0067] Fig.16 An axonometric schematic diagram of a silicon rod conveying device according to an embodiment of the present invention is shown;

[0068] Fig.17 The embodiment of the present invention is shown Fig.16 Schematic diagram along the X3 direction;

[0069] Fig.18 The embodiment of the present invention is shown Fig.16 Schematic diagram along the Y3 direction;

[0070] Fig.19 The embodiment of the present invention is shown Fig.16 Schematic diagram along the Z3 direction;

[0071] Fig. 20 An isometric schematic diagram of a skin edge clamping device according to an embodiment of the present invention is shown;

[0072] Fig.21 The embodiment of the present invention is shown Fig. 20 Schematic diagram along the X4 direction;

[0073] Fig. 22 The embodiment of the present invention is shown Fig. 20 Schematic diagram along the Y4 direction;

[0074] Fig.23 The embodiment of the present invention is shown Fig. 20 Schematic diagram along the Z4 direction;

[0075] Fig.24 An axonometric schematic diagram of a side skin collection and delivery device in an embodiment of the present invention is shown;

[0076] Fig.25 A schematic isometric view of a material feeding device according to an embodiment of the present invention is shown.

[0077] Description of the accompanying drawings:

[0078] Pre-processing device-10, cutting device-11, silicon rod conveying device-12, polishing device-13, edge skin clamping device-14, edge skin collecting device-15, feeding device-16, silicon rod to be processed-20, cutting line-30, first winding mechanism-111, second winding mechanism-112, cutting mechanism-113, reversing mechanism-114, clamping assembly-121, clamping bracket-141, clamping mechanism-142, fourth driving mechanism-143, anti-slip structure-201, cutting table-1131, first clamping beam-1211, fixed clamping arm-1212, movable clamping arm-1213, second driving mechanism-1214, first chuck -1215, second chuck -1216, second clamping beam -1421, fixed clamp block -1422, movable clamp block -1423, support -11311, cutting roller -11312, first reversing wheel -A0, second reversing wheel -A1, third reversing wheel -A2, fourth reversing wheel -A3, fifth reversing wheel -A4, sixth reversing wheel -A5, seventh reversing wheel -A6, eighth reversing wheel -A7, ninth reversing wheel -A8, tenth reversing wheel -A9, eleventh reversing wheel -A10, twelfth reversing wheel -A11, thirteenth reversing wheel -A12, fourteenth reversing wheel -A13, fifteenth reversing wheel -A14, sixteenth reversing wheel -A15. DETAILED DESCRIPTION

[0079] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0080] Reference Figures 1 to 6 , showing a schematic structural diagram of a silicon rod processing device provided by the present invention, the silicon rod processing device comprising:

[0081] A pre-processing device 10, wherein the pre-processing device 10 is used to process and form an anti-slip structure 201 on the silicon rod 20 to be processed, wherein the anti-slip structure 201 is used to constrain and limit the cutting line 30;

[0082] A cutting device 11, wherein the cutting device 11 is used to cut into the silicon rod 20 to be processed from the anti-slip structure 201 to remove the edge skin 21, wherein the axis of the silicon rod 20 to be processed is in a horizontal plane;

[0083] The silicon rod conveying device 12 is used to carry the silicon rod 20 to be processed and move between positions of different devices.

[0084] Specifically, if Figure 1, a three-dimensional isometric schematic diagram of a silicon rod processing device provided by an embodiment of the present invention is shown. The silicon rod processing device includes a pre-processing device 10, a cutting device 11 and a silicon rod conveying device 12. Figures 2 to 4 They were given Figure 1 Views of silicon rod processing equipment along different directions.

[0085] The pre-processing device 10 is used to process and form an anti-skid structure 201 on the silicon rod 20 to be processed, and the anti-skid structure 201 is used to constrain and limit the cutting line 30. Figure 5 As shown in FIG. 1 , a schematic diagram of an anti-skid structure 201 on a silicon rod 20 to be processed is shown. The anti-skid structure 201 can limit the cutting line 30 to prevent the cutting line 30 from slipping and swinging. It can be understood that the anti-skid structure 201 is a groove or platform formed after removing material from the surface of the silicon rod 20 to be processed. In practical applications, it can be used Figure 6 The illustrated laser processing device is used as the pre-processing device 10 to process the anti-skid structure 201 using laser, or a mechanical cutting tool with a grinding wheel as a cutting tool can be used to cut the anti-skid structure 201 on the surface of the silicon rod 20 to be processed. Therefore, the processing principle and device type of the pre-processing device 10 in the embodiment of the present invention are not further limited. In addition, the cutting wire 30 used can be a diamond wire saw, which is also called a diamond wire, which refers to a method of fixing diamond abrasives on a metal wire by an electroplating process or a resin bonding method.

[0086] After the silicon rod 20 to be processed is processed by the pre-processing device 10, the edge skin 21 is cut off by the cutting device 11. Specifically, the cutting wire 30 wound in the cutting device 11 cuts into the position of the anti-slip structure 201 to cut off the edge skin 21 of the silicon rod 20 to be processed. When four pieces of edge skin are cut off from the four sides of the silicon rod 20 to be processed, a square rod with a rectangular cross-sectional shape can be obtained. The process of cutting the rectangular square rod is as follows: Figure 7 It is understood that the more the number of edge skins cut, the more the cross-sectional shape of the obtained silicon rod tends to be polygonal. For example, a silicon rod with a pentagonal or hexagonal cross-sectional shape can also be obtained by cutting.

[0087] It can be understood that the pre-processing device 10 and the cutting device 11 are two device modules with different functions in the silicon rod processing equipment. The relative positions of the pre-processing device 10 and the cutting device 11 in the equipment only need to satisfy the sequence of the processing steps. At the same time, they can also be arranged in accordance with the principle of minimizing the time consumption when transferring silicon rods between different devices. Therefore, the layout positions and relative positional relationship of the pre-processing device 10 and the cutting device 11 are not limited.

[0088] In order to facilitate the transmission of the silicon rod 20 to be processed between the workstations corresponding to the pre-processing device 10 and the cutting device 11, the silicon rod processing equipment of the embodiment of the present invention further provides a silicon rod conveying device 12, which is used to carry the silicon rod 20 to be processed and move between the positions of different devices. For example, the silicon rod 20 to be processed can be carried by the silicon rod conveying device 12 to move to the workstation of the pre-processing device 10 first, and after the anti-slip structure 201 is processed, the silicon rod conveying device 12 carries the silicon rod 20 to be processed and continues to move to the workstation of the cutting device 11 to cut and remove the edge skin 21. It should be noted that when the silicon rod 20 to be processed is transmitted and moved between the positions of different devices, it can always maintain the clamping state with the silicon rod conveying device 12, that is, the silicon rod 20 to be processed only needs to be clamped once, and the processed silicon rod is unloaded from the silicon rod conveying device 12 after each processing process such as pre-processing to form the anti-slip structure 201 and cutting to remove the edge skin 21 is completed.

[0089] In an embodiment of the present invention, a pre-processing device, a cutting device and a silicon rod conveying device are integrated in the silicon rod processing equipment. The silicon rod conveying device can carry the silicon rod to be processed and move between other positions such as the position of the pre-processing device and the position of the cutting device. The pre-processing device can complete the process of anti-slip structure processing, and the cutting device can complete the process of cutting and removing the edge skin. Therefore, only one clamping is required to cooperate with multiple processes for processing, which helps to save clamping time and reduce the accumulated errors of multiple clamping. In addition, the anti-slip structure formed by the pre-processing device also helps to improve the cutting quality of the silicon rod to be processed when cutting in a horizontal plane.

[0090] Optionally, refer to Figure 8 , the cutting device 11 comprises:

[0091] a first winding mechanism 111 and a second winding mechanism 112, wherein the first winding mechanism 111 is fixed to one end of the cutting line 30, and the second winding mechanism 112 is fixed to the other end of the cutting line 30; one of the first winding mechanism 111 and the second winding mechanism 112 is used for winding up the line, and the other is used for unwinding the line;

[0092] A cutting mechanism 113, wherein the cutting wire 30 passes through the first winding mechanism 111, the cutting mechanism 113 and the second winding mechanism 112 in sequence, and the cutting mechanism 113 is used to drive the cutting wire 30 to feed and cut along an axial direction perpendicular to the silicon rod 20 to be processed;

[0093] The reversing mechanism 114 is disposed on the winding path of the cutting line 30 , and is used to guide the winding direction of the cutting line 30 .

[0094] Specifically, if Figure 8As shown in the figure, the cutting device 11 of the embodiment of the present invention includes two winding mechanisms, namely a first winding mechanism 111 and a second winding mechanism 112. One of the two winding mechanisms is used for winding and the other is used for releasing. For example, one end of a cutting line can be wound and fixed on the reel of the first winding mechanism 111 by a clamp, and the other end of the cutting line can be wound and fixed on the reel of the second winding mechanism 112 by a clamp. The two reels can be driven to rotate independently by two motors respectively, and when the first winding mechanism 111 releases the cutting line, the second winding mechanism 112 can be wound and tightened. It can be understood that in the actual cutting process, the winding and releasing functions of the first winding mechanism 111 and the second winding mechanism 112 are switched with each other, that is, under the control of the control program, the first winding mechanism 111 and the second winding mechanism 112 can alternately wind and release, thereby realizing the reciprocating motion of the cutting line and the reciprocating motion cutting action.

[0095] The first winding mechanism 111 and the second winding mechanism 112 are respectively used to realize the retraction and release of the cutting wire 30. After the cutting wire 30 is wound out from one of the winding mechanisms, it needs to pass through the cutting mechanism 113 and then wind back to the other winding mechanism. The cutting wire 30 can be driven by the cutting mechanism 113 to feed and cut along the axis direction perpendicular to the silicon rod 20 to be processed. That is to say, when the cutting wire 30 passes through the cutting mechanism 113, the cutting mechanism 113 can provide it with a force along the feeding direction. At this time, in addition to the reciprocating retraction and release movement under the action of the first winding mechanism 111 and the second winding mechanism 112, the cutting wire 30 can also feed and move along the axis direction perpendicular to the silicon rod 20 to be processed, gradually approaching the silicon rod 20 to be processed, and then cutting in from the anti-slip structure position until the cutting is completed. It should be noted that during the cutting process, the cutting wire 30 itself is parallel to the axis of the silicon rod 20 to be processed, and the feeding movement direction of the cutting wire 30 can be in the vertical plane and perpendicular to the axis of the silicon rod 20 to be processed.

[0096] In addition, it can be understood that since the cutting wire 30 is soft and bendable and easily deformed, it is necessary to guide its winding direction through the reversing mechanism 114 so that it runs along the designed direction. For example, the reversing mechanism 114 is arranged between the first winding mechanism 111 and the cutting mechanism 113 to guide the cutting wire 30 into the cutting mechanism 113; the reversing mechanism 114 is arranged between the cutting mechanism 113 and the second winding mechanism 112 to guide the cutting wire 30 to wind back to the second winding mechanism 112. The reversing mechanism 114 can simplify the complexity of the cutting device 11 and reduce the number of cutting wires used, so that the silicon rod 20 to be processed can be cut using one cutting wire.

[0097] Optionally, refer to Figure 8 The cutting mechanism 113 includes four groups of cutting tables 1131, and the four groups of cutting tables 1131 are arranged in a rectangular shape;

[0098] The cutting wire 30 passes through each group of the cutting tables 1131 in sequence to form a U-shaped cutting wire network.

[0099] Specifically, if Figure 8 As shown in the figure, in the embodiment of the present invention, four groups of cutting tables 1131 are used to form a cutting mechanism 113. The four groups of cutting tables 1131 are arranged in a rectangular shape. After the cutting wire 30 is wound out from a winding mechanism, it passes through each group of cutting tables 1131 in turn under the guidance of the reversing mechanism 114, enters the cutting mechanism 113 from the first cutting table 1131, and is wound out of the cutting mechanism 113 from the fourth cutting table 1131. After that, it is wound back to another winding mechanism under the guidance of the reversing mechanism 114.

[0100] Combination Figure 8 It is easy to understand that the cutting wire 30 forms a U-shaped cutting wire net in the cutting mechanism 113, and the two parallel sections in the cutting wire net are the parts that will contact the silicon rod 20 to be processed during the cutting feed movement. When the cutting mechanism 113 moves with the cutting wire 30, the side skins on the opposite sides of the silicon rod 20 to be processed can be cut off at the same time.

[0101] Optionally, refer to Figures 9 to 12 Each group of the cutting tables 1131 includes a support 11311, a cutting roller 11312 and a cutting roller lifting mechanism;

[0102] The cutting roller 11312 is rotatably connected to the cutting roller lifting mechanism, the axis of the cutting roller 11312 is in a horizontal plane, and the cutting line 30 is tangent to the lower edge of the cutting roller 11312;

[0103] The cutting roller lifting mechanism is connected to the support 11311, and is used to drive the cutting roller 11312 to drive the cutting line 30 to move up and down in a vertical plane along an axial direction perpendicular to the silicon rod 20 to be processed.

[0104] Specifically, the structure of each group of cutting tables 1131 can be the same, such as Figures 9 to 12As shown, each group of cutting tables 1131 includes a support 11311, a cutting roller 11312 and a cutting roller lifting mechanism. The support 11311 can be a metal frame or a metal box structure, which is used to connect and support the cutting roller 11312 and the cutting roller lifting mechanism. The cutting roller lifting mechanism is connected and installed on the support 11311 and is rotatably connected to the cutting roller 11312. The cutting roller 11312 is a roller with a wire groove. Combined with the figure, when the axis of the cutting roller 11312 is in a horizontal plane, the cutting line 30 is tangent to the lower edge of the cutting roller 11312 and is embedded in the wire groove. It is easy to understand that when the cutting roller lifting mechanism can drive the cutting roller 11312 to move up and down relative to the support 11311, the lower edge of the cutting roller 11312 can be pressed down to drive the cutting line 30 to do a feeding movement, and the cutting roller 11312 can also rotate relative to the cutting roller lifting mechanism and the support 11311.

[0105] For example, a hydraulic cylinder, a screw mechanism, a gear rack mechanism, etc. can be used as a cutting roller lifting mechanism, and the linear motion parts in the cutting roller lifting mechanism are rotatably connected to the cutting roller 11312, thereby driving the cutting roller 11312 to rise and fall and translate in the vertical plane to achieve the feeding of the cutting line 30. At the same time, the self-rotation of the cutting roller 11312 can also ensure that the cutting line 30 can be freely retracted and released to avoid excessive wear.

[0106] Optionally, each group of the cutting tables 1131 further includes a cutting roller translation mechanism;

[0107] The cutting roller translation mechanism is connected to the cutting roller lifting mechanism, and the cutting roller translation mechanism is used to drive the cutting roller 11312 to drive the cutting line 30 to approach or move away from the axis of the silicon rod 20 to be processed in a horizontal plane.

[0108] Specifically, in the actual processing process, the size specifications of the silicon rods 20 to be processed faced by the equipment may not be exactly the same. For example, some silicon rods 20 to be processed are thicker and some are thinner. In order to improve the scope of application of the equipment. Each set of cutting tables 1131 also includes a cutting roller translation mechanism, and the cutting roller translation mechanism can be connected to the aforementioned cutting roller lifting mechanism, and the two can be linked. Specifically, the cutting roller lifting mechanism can drive the cutting roller translation mechanism to move up and down in the vertical plane, and at the same time, the cutting roller translation mechanism can also telescope and translate in the horizontal plane. In this cutting table 11312, the cutting roller 11312 can be connected and installed on the cutting roller translation mechanism, and rotate relative to the cutting roller translation mechanism. It is easy to understand that when the cutting roller translation mechanism telescopes and translates, the cutting roller 11312 can be driven to drive the cutting line 30 to move close to or away from the axis of the silicon rod 20 to be processed in the horizontal plane.

[0109] When the cutting line 30 is away from the axis of the silicon rod 20 to be processed in the horizontal plane, a larger cutting space can be formed, and vice versa, a smaller cutting space can be formed. Therefore, the application of the cutting roller translation mechanism can make the cutting table 11312 more flexibly applicable to silicon rods 20 to be processed of different thicknesses. For example, according to design requirements, the cutting table 11312 can cover silicon rods 20 to be processed with a diameter range of 200mm to 330mm. At the same time, since the cutting line 30 can translate in the horizontal plane, the cutting margin can also be adjusted. For example, according to the processing requirements of the silicon rod, the edge skin can be cut and removed from any position between 156mm and 230mm from the edge of the silicon rod, that is, the thickness of the edge skin can be between 156mm and 230mm. It should be noted that the above-mentioned cutting roller translation mechanism that drives the cutting roller 11312 and the cutting line 30 to translate is similar to the cutting roller lifting mechanism, and any one of the linear motion mechanisms such as hydraulic cylinders, screw mechanisms, gear rack mechanisms, etc. can also be used, and the linear motion components in the cutting roller translation mechanism can be rotatably connected to the cutting roller 11312. Whether it is the movement of the cutting roller translation mechanism or the cutting roller lifting mechanism, it can be achieved by setting parameters in the control program.

[0110] Optionally, each group of the cutting tables 1131 further includes a driving motor, and the cutting rollers 11312 are connected to an output shaft of the driving motor.

[0111] Specifically, in one embodiment, the cutting roller 11312 can also be coaxially assembled and connected with the output shaft of the driving motor. The driving motor can drive the cutting roller 11312 to rotate under the control of the controller in the device. Under the action of the friction between the wire groove of the cutting roller 11312 and the cutting wire 30, the force for the reciprocating retraction and extension movement can be supplemented to the cutting wire 30, thereby reducing defects such as slipping and hysteresis during the retraction and extension movement of the cutting wire 30, which helps to improve the cutting quality of silicon rods.

[0112] Optionally, refer to Figure 8 as well as Figures 13 to 15 , the reversing mechanism 114 comprises:

[0113] A first reversing wheel assembly, which is disposed between the first winding mechanism 111 and the cutting mechanism and is used to convert the direction of the cutting line 30 between the first winding mechanism 111 and the cutting mechanism 113;

[0114] A second reversing wheel assembly, the second reversing wheel assembly is disposed inside the cutting mechanism 113 and is used to change the direction of the cutting line 30 inside the cutting mechanism 113;

[0115] The third reversing wheel assembly is disposed between the cutting mechanism 113 and the second winding mechanism 112 , and is used to convert the direction of the cutting line 30 between the cutting mechanism 113 and the second winding mechanism 112 .

[0116] Specifically, if Figure 8 As shown, in one embodiment, the above-mentioned reversing mechanism 114 may include a plurality of reversing wheels, each of which has a structure similar to that of a pulley and has a wire groove. The plurality of reversing wheels may be arranged in groups at different positions to change the routing direction of the cutting line 30 so that the cutting line 30 passes through different mechanisms. According to different installation positions and directions, the plurality of reversing wheels may be divided into a first reversing wheel assembly disposed between the first winding mechanism 111 and the cutting mechanism 113, a second reversing wheel assembly disposed inside the cutting mechanism 113, and a third reversing wheel assembly disposed between the cutting mechanism 113 and the second winding mechanism 112.

[0117] Combination Figure 8 As shown in the figure, the first reversing wheel assembly may include a second reversing wheel A1, a third reversing wheel A2, a fourth reversing wheel A3, a fifth reversing wheel A4 and a sixth reversing wheel A5. The first reversing wheel A0, the second reversing wheel A1, the third reversing wheel A2 and the fourth reversing wheel A3 are arranged in a first plane M, that is, the axes of the first reversing wheel A0, the second reversing wheel A1, the third reversing wheel A2 and the fourth reversing wheel A3 are parallel to each other and perpendicular to the first plane M.

[0118] Combination Fig.13 As shown in the figure, after the cutting line 30 is wound out from the first winding mechanism 111, it first passes through the upper edge of the first reversing wheel A0 and changes direction by 90 degrees, then goes downward around the lower edge of the second reversing wheel A1 and changes direction by 180 degrees, and then goes upward around the upper edges of the third reversing wheel A2 and the fourth reversing wheel A3, gradually approaching the cutting mechanism 113.

[0119] like Figure 8 and Fig.15 As shown in the figure, in order to convert the cutting line 30 to the second plane N perpendicular to the first plane M, the fifth reversing wheel A4 and the sixth reversing wheel A5 are arranged in the second plane N, and the wheel edges of the fourth reversing wheel A3 and the fifth reversing wheel A4 coincide, that is, the axes of the fifth reversing wheel A4 and the sixth reversing wheel A5 are parallel to each other and perpendicular to the second plane N. After the cutting line 30 is wound out from the fourth reversing wheel A3, it can be wound into the cutting mechanism 113 under the guidance of the lower edge of the fifth reversing wheel A4 and the upper edge of the sixth reversing wheel A5, and arranged in a direction parallel to the axis of the silicon rod 20 to be processed, so as to cut one side of the silicon rod 20 to be processed.

[0120] Combination Figure 8As shown in the diagram, the third reversing wheel assembly may include an eleventh reversing wheel A10, a twelfth reversing wheel A11, a thirteenth reversing wheel A12, a fourteenth reversing wheel A13, a fifteenth reversing wheel A14 and a sixteenth reversing wheel A15. The eleventh reversing wheel A10 and the twelfth reversing wheel A11 are arranged in the second plane N, the thirteenth reversing wheel A12, the fourteenth reversing wheel A13, the fifteenth reversing wheel A14 and the sixteenth reversing wheel A15 are arranged in the third plane J, wherein the third plane J is parallel to the first plane M, the axes of the twelfth reversing wheel A11 and the thirteenth reversing wheel A12 are perpendicular to each other, and the rims of the twelfth reversing wheel A11 and the thirteenth reversing wheel A12 overlap. These six reversing wheels are used to guide the cutting line 30 to be wound back to the second winding mechanism 112 after it is wound out. The eleventh deflecting wheel A10 and the twelfth deflecting wheel A11 are arranged in the second plane N, and the arrangement positions of the thirteenth deflecting wheel A12, the fourteenth deflecting wheel A13, the fifteenth deflecting wheel A14 and the sixteenth deflecting wheel A15 are similar to those of the aforementioned first deflecting wheel A0, the second deflecting wheel A1, the third deflecting wheel A2, the fourth deflecting wheel A3, the fifth deflecting wheel A4 and the sixth deflecting wheel A5, and are not repeated here.

[0121] Combination Figure 8 and Fig.14 As shown in the figure, the second reversing wheel assembly may include a seventh reversing wheel A6, an eighth reversing wheel A7, a ninth reversing wheel A8 and a tenth reversing wheel A9. In order to cut both sides of the silicon rod 20 to be processed using a single cutting line 30, a seventh reversing wheel A6, an eighth reversing wheel A7, a ninth reversing wheel A8 and a tenth reversing wheel A9 are further arranged in a fourth plane K which is parallel to the second plane N. The seventh reversing wheel A6 is coaxially arranged with the sixth reversing wheel A5, and the tenth reversing wheel A9 is coaxially arranged with the eleventh reversing wheel A10. Figure 8 and Fig.14 It can be seen that, under the guidance of the four reversing wheels, the cutting wire 30 is again arranged in a direction parallel to the axis of the silicon rod 20 to be processed, so as to cut the other side of the silicon rod 20 to be processed.

[0122] It should be noted that the number and position of the above-mentioned reversing wheels are adaptive designs made based on other parts of the silicon rod processing equipment in the embodiment of the present invention, which can optimize the positional relationship between different structures and reduce space waste. In practical applications, the number of reversing wheels can be increased or decreased, and the arrangement position can be adjusted, and the embodiment of the present invention does not further limit this.

[0123] Optionally, refer to Figures 16 to 19 , the silicon rod conveying device 12 includes a clamping assembly 121 and a first driving mechanism;

[0124] The clamping assembly 121 is connected to the first driving mechanism, and the first driving mechanism is used to drive the clamping assembly 121 to carry the silicon rod 20 to be processed to move between different positions, wherein the clamping assembly 121 is used to clamp the silicon rod 20 to be processed from the end face so that the axis of the silicon rod 20 to be processed is in a horizontal plane.

[0125] Specifically, if Figures 16 to 19 As shown, the silicon rod conveying device 12 mentioned above may include a clamping assembly 121 and a first driving mechanism. The stationary part of the first driving mechanism may be mounted and fixed on the frame of the silicon rod processing equipment, and the moving part of the first driving mechanism may be connected and fixed to the clamping assembly 121. When the first driving mechanism is actuated, the clamping assembly 121 may be driven to move between different positions of the silicon rod processing equipment. The first driving mechanism may also adopt any one of the linear motion mechanisms such as a hydraulic cylinder, a screw mechanism, a gear rack mechanism, etc. Since the clamping assembly 121 is used to clamp the silicon rod 20 to be processed, the silicon rod 20 to be processed can be moved between different positions under the clamping action of the clamping assembly 121, thereby completing different processing procedures. For example, when the clamping assembly 121 carries the silicon rod 20 to be processed and is in the position of the pre-processing device 10, the anti-slip structure 201 can be processed, and when the clamping assembly 121 carries the silicon rod 20 to be processed and is in the position of the cutting device 11, the edge skin 21 can be cut off. Combined with Fig.16 As shown in the figure, the clamping assembly 121 is used to clamp the end face of the silicon rod 20 to be processed so that the axis of the silicon rod 20 to be processed is in a horizontal plane, so that a hanging clamping method can be adopted to realize horizontal processing of the silicon rod 20 to be processed, which can reduce the structural complexity of the traditional V-shaped block for placing the silicon rod 20 to be processed, and the movement of the silicon rod 20 to be processed is more convenient.

[0126] Optionally, refer to Figures 16 to 19 , the clamping assembly 121 includes a first clamping beam 1211, a fixed clamping arm 1212, a movable clamping arm 1213 and a second driving mechanism 1214;

[0127] The first clamping beam 1211 is fixedly connected to the first driving mechanism;

[0128] The fixed clamp arm 1212 is fixedly connected to the first clamping beam 1211, the movable clamp arm 1213 is movably connected to the first clamping beam 1211, and the movable clamp arm 1213 is arranged opposite to the fixed clamp arm 1212 to form a clamping space for clamping the silicon rod 20 to be processed;

[0129] The second driving mechanism 1214 is connected to the first clamping beam 1211 and is used for driving the movable clamping arm 1213 to move closer to or away from the fixed clamping arm 1211 .

[0130] Specifically, if Figures 16 to 19 As shown, the clamping assembly 121 may include a first clamping beam 1211, a fixed clamping arm 1212, a movable clamping arm 1213 and a second driving mechanism 1214. The first clamping beam 1211 may be a bar-shaped metal component, which as the main structure of the clamping assembly 121 may be fixedly connected to the moving part of the first driving mechanism. When the first driving mechanism is activated, the first clamping beam 1211 may be driven to move relative to the frame of the device, that is, the movement of the clamping assembly 121 is realized.

[0131] In the clamping assembly 121, a fixed clamping arm 1212 and a movable clamping arm 1213 are extended and connected along a direction perpendicular to the axis of the first clamping beam 1211. The fixed clamping arm 1212 is fixedly connected to the first clamping beam 1211 by bolts or welding, and the movable clamping arm 1213 can be slidably connected to the first clamping beam 1211 by means of a slide rail, and the movement power of the movable clamping arm 1213 is provided by the second driving mechanism 1214. The movable clamping arm 1213 is fixedly connected to the moving part of the second driving mechanism 1214. When the second driving mechanism 1214 drives the movable clamping arm 1213 away from the fixed clamping arm 1212, the clamping space between the two becomes larger, which can accommodate and clamp the silicon rod 20 to be processed. When the second driving mechanism 1214 drives the movable clamping arm 1213 to approach the fixed clamping arm 1212, the clamping space between the two becomes smaller, which can clamp the silicon rod 20 to be processed.

[0132] Optionally, refer to Fig.16 , the clamping assembly 121 further includes a first chuck 1215, a second chuck 1216 and a third driving mechanism;

[0133] The first chuck 1215 is rotatably connected to the fixed clamp arm 1212, and the second chuck 1216 is rotatably connected to the movable clamp arm 1213;

[0134] The third driving mechanism is used to drive the first chuck 1215 or the second chuck 1216 to rotate at a preset angle.

[0135] Specifically, if Fig.16As shown, the clamping assembly 121 may further include a first chuck 1215, a second chuck 1216 and a third driving mechanism. The first chuck 1215 is rotatably connected to the fixed clamp arm 1212, and the second chuck 1216 is rotatably connected to the movable clamp arm 1213. When the fixed clamp arm 1212 and the movable clamp arm 1213 clamp the silicon rod 20 to be processed from the end face by the first chuck 1215 and the second chuck 1216, the silicon rod 20 to be processed can rotate around its own axis. In order to control the rotation angle of the silicon rod 20 to be processed, the third driving mechanism can be used to drive the rotation of the first chuck 1215 or the second chuck 1216. For example, the first chuck 1215 or the second chuck 1216 can be driven to rotate according to a preset angle by a gear transmission mechanism or a synchronous belt transmission mechanism. In practical applications, the preset angle can be set to 90 degrees, so that when the silicon rod 20 to be processed is rotated, a secondary cutting can be performed to cut the silicon rod 20 to be processed into a square rod with a square cross section.

[0136] Optionally, refer to Figure 1 , the silicon rod processing equipment also includes:

[0137] The polishing device 13 is used to polish the silicon rod 20 to be processed after the edge skin is removed.

[0138] Specifically, if Figure 1 As shown, in one embodiment, the silicon rod processing equipment of the embodiment of the present invention further includes a polishing device 13. When the aforementioned silicon rod conveying device 12 carries the silicon rod 20 to be processed and moves to the position of the polishing device 13, the polishing device 13 can polish and grind the silicon rod 20 to be processed after removing the edge skin, so as to further improve the surface quality of the silicon rod and meet higher processing requirements. The polishing device 13 can be a device with a diamond grinding head, which uses the diamond grinding head to reciprocate on the surface of the silicon rod to reduce the surface roughness and make the quality more refined. At the same time, there is no need to repeatedly clamp the silicon rod between the cutting process and the polishing process, which can reduce the cumulative error caused by the secondary clamping.

[0139] Optionally, refer to Figure 1 , the silicon rod processing equipment also includes:

[0140] The edge skin clamping device 14 is arranged on both sides of the cutting device 11 with the axis of the silicon rod 20 to be processed as the center line. The edge skin clamping device 14 is used to clamp and fix the edge skin 21.

[0141] Specifically, in one embodiment, in the process of cutting the silicon rod 20 to be processed to remove the edge skin 21, in order to prevent the edge skin 21 from falling and breaking, Figure 1As shown, the edge skin clamping device 14 can also be set on both sides of the cutting device 11 with the axis of the silicon rod 20 to be processed as the center line. When the cutting device 11 cuts the silicon rod 20 to be processed, the edge skin 21 cut off from both sides of the silicon rod can be clamped by the edge skin clamping device 14 to prevent it from falling and breaking naturally. The edge skin clamping device 14 can be a general manipulator or a device customized according to the shape and size of the silicon rod.

[0142] Optionally, refer to Figure 20 to Figure 23 The edge skin clamping device 14 includes a clamping bracket 141, a clamping mechanism 142 and a fourth driving mechanism 143;

[0143] The fourth driving mechanism 143 is connected to the clamping bracket 141;

[0144] The clamping mechanism 142 is connected to the fourth driving mechanism 143 , and the fourth driving mechanism 143 is used to drive the clamping mechanism 142 to carry the edge skin 21 to move along the axis direction perpendicular to the silicon rod 20 to be processed.

[0145] Specifically, in one embodiment, Figure 20 to Figure 23 As shown, the edge skin clamping device 14 provided in the embodiment of the present invention may include a clamping bracket 141, a clamping mechanism 142 and a fourth driving mechanism 143. The clamping bracket 141 may be a frame structure made by connecting metal profiles, and the clamping bracket 141 may be fixedly connected to the frame of the silicon rod processing equipment to install and support the clamping mechanism 142 and the fourth driving mechanism 143. The stationary part of the fourth driving mechanism 143 is connected and fixed to the clamping bracket 141, and the moving part of the fourth driving mechanism 143 is connected and fixed to the clamping mechanism 142. The clamping mechanism 142 may be slidably connected to the clamping bracket 141 through a slide rail. During the cutting process, the clamping mechanism 142 may keep the edge skin 21 clamped. When the cutting is completed, the fourth driving mechanism 143 is actuated to drive the clamping mechanism 142 to move downward in a vertical plane along the axis direction perpendicular to the silicon rod 20 to be processed, so as to remove the edge skin 21 and prevent it from falling and breaking naturally from a high place.

[0146] Optionally, refer to Figure 20 to Figure 23 , the clamping mechanism 142 includes a second clamping beam 1421, a fixed clamping block 1422, a movable clamping block 1423 and a fifth driving mechanism;

[0147] The second clamping beam 1421 is fixedly connected to the fifth driving mechanism;

[0148] The fixed clamp block 1422 is fixedly connected to the second clamping beam 1421, the movable clamp block 1423 is movably connected to the second clamping beam 1421, and the movable clamp block 1423 and the fixed clamp block 1422 are arranged opposite to each other to form a clamping space for clamping the edge skin 21;

[0149] The fifth driving mechanism is connected to the second clamping beam 1421 and is used for driving the movable clamping block 1423 to move closer to or away from the fixed clamping block 1422 .

[0150] Specifically, in one embodiment, Figure 20 to Figure 23 As shown, the clamping mechanism 142 may include a second clamping beam 1421, a fixed clamping block 1422, a movable clamping block 1423 and a fifth driving mechanism. The second clamping beam 1421 may be a crossbeam made of a metal frame or a metal box, and is used to install the fixed clamping block 1422 and the movable clamping block 1423 connected to the clamping edge skin 21. At the same time, the second clamping beam 1421 may also be slidably connected to the clamping bracket 141 through a slide rail, and the moving part of the fourth driving mechanism 143 may be fixedly connected to the second clamping beam 1421. The axis of the second clamping beam 1421 is in a horizontal plane, the fixed clamping block 1422 and the movable clamping block 1423 may be arranged on the same straight line in the horizontal direction, the fixed clamping block 1422 is fixedly connected to one end of the second clamping beam 1421, and the two are relatively stationary, and the movable clamping block 142 is slidably connected to the second clamping beam 1421, and the two can slide relatively. The fifth driving mechanism is installed in the clamping mechanism 142 to provide a driving force for the movable clamping block 142 to move closer to or away from the fixed clamping block 1422. It should be noted that the fifth driving mechanism is a mechanism that can achieve linear motion, similar to the aforementioned first driving mechanism, for example, it can be any mechanism of linear motion mechanisms such as a hydraulic cylinder, a screw mechanism, a gear rack mechanism, etc.

[0151] Optionally, refer to Figure 4 and Fig.24 , the silicon rod processing equipment also includes:

[0152] The edge skin collecting and delivering device 15 is arranged below the edge skin clamping device 14 and is used for collecting and delivering the edge skin 21 .

[0153] Specifically, in one embodiment, in order to improve the degree of automation of the silicon rod processing equipment and reduce the human involvement process, such as Figure 4 As shown, a side skin collecting and conveying device 15 is also provided below the side skin clamping device 14. When the side skin clamping device 14 unloads the cut and separated side skin 21 onto the side skin collecting and conveying device 15, the control system controls the side skin collecting and conveying device 15 to operate, and the side skin 21 can be collected and conveyed to the waste material recycling station for recycling of the side skin 21. This process can be automatically realized by relying on the side skin collecting and conveying device 15, which reduces human intervention, improves recycling efficiency and reduces the risk of injury during operation. Fig.24 A conveyor belt device structure of the edge skin collecting and conveying device 15 is also given as an example.

[0154] Optionally, refer to Figure 1 as well as Fig.25 The silicon rod processing equipment further includes a feeding device 16, and the feeding device 16 is used to feed the silicon rods 20 to be processed into the silicon rod processing equipment, and to output the processed silicon rods from the silicon rod processing equipment.

[0155] Specifically, if Figure 1 As shown, in one embodiment, in order to improve the degree of automation of loading and unloading of the silicon rod processing equipment, compared with the traditional solution, in which a robotic arm or a crane or other devices for loading and unloading are independently arranged outside the equipment, an installation position of a feeding device 16 is reserved in the silicon rod processing equipment in the embodiment of the present invention, and the feeding device 16 is directly integrated into the silicon rod processing equipment. Fig.25 A schematic diagram of a feeding device 16 is given as an example. The feeding device 16 is installed in the silicon rod processing equipment. The feeding device 16 can be used to feed the silicon rods 20 to be processed into the silicon rod processing equipment for transfer and transmission by the silicon rod conveying device 12 to complete the loading. At the same time, the processed silicon rods can also be output from the silicon rod processing equipment to complete the unloading.

[0156] like Figure 1 As shown in the diagram, when the silicon rod 20 to be processed is loaded onto the feeding device 16 from the direction indicated by the I side, as the feeding device 16 translates, the silicon rod 20 to be processed is moved to the bottom of the silicon rod conveying device 12. The silicon rod conveying device 12 carries the silicon rod 20 to be processed to different positions to complete the processing, and then re-transmits the processed silicon rod to the position of the feeding device 16. The feeding device 16 carries the processed silicon rod and outputs the silicon rod from the silicon rod processing equipment from the direction indicated by the II side.

[0157] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0158] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation modes, which are merely illustrative rather than restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. A silicon rod processing device, characterized in that: The silicon rod processing equipment comprises: A pre-processing device, the pre-processing device is used to process and form an anti-skid structure on the silicon rod to be processed, the anti-skid structure is used to constrain and limit the cutting line; the anti-skid structure is a groove or a platform formed after removing material from the surface of the silicon rod to be processed; A cutting device, wherein the cutting device is used to cut into the silicon rod to be processed from the anti-slip structure position to remove the edge skin, wherein the axis of the silicon rod to be processed is in a horizontal plane; A silicon rod conveying device, wherein the silicon rod conveying device is used to carry the silicon rod to be processed and move between positions of different devices; The cutting device comprises a first winding mechanism, a second winding mechanism, a cutting mechanism, and a reversing mechanism; The reversing mechanism comprises: a first reversing wheel assembly, which is arranged between the first winding mechanism and the cutting mechanism and is used to convert the direction of the cutting line between the first winding mechanism and the cutting mechanism; A second reversing wheel assembly, the second reversing wheel assembly is arranged inside the cutting mechanism and is used to change the direction of the cutting line inside the cutting mechanism; A third reversing wheel assembly is disposed between the cutting mechanism and the second winding mechanism, and is used for converting the direction of the cutting line between the cutting mechanism and the second winding mechanism.

2. The silicon rod processing equipment according to claim 1, characterized in that: The first winding mechanism is fixed to one end of the cutting line, and the second winding mechanism is fixed to the other end of the cutting line; one of the first winding mechanism and the second winding mechanism is used for winding the line, and the other is used for releasing the line; The cutting wire passes through the first winding mechanism, the cutting mechanism and the second winding mechanism in sequence, and the cutting mechanism is used to drive the cutting wire to feed and cut along a direction perpendicular to the axis of the silicon rod to be processed; The reversing mechanism is arranged on the winding path of the cutting line, and the reversing mechanism is used to guide the winding direction of the cutting line.

3. The silicon rod processing equipment according to claim 2, characterized in that: The cutting mechanism comprises four groups of cutting tables, and the four groups of cutting tables are arranged in a rectangular shape; The cutting wire passes through each group of cutting tables in sequence to form a U-shaped cutting wire network.

4. The silicon rod processing equipment according to claim 3, characterized in that: Each group of the cutting tables comprises a support, a cutting roller and a cutting roller lifting mechanism; The cutting roller is rotatably connected to the cutting roller lifting mechanism, the axis of the cutting roller is in a horizontal plane, and the cutting line is tangent to the lower edge of the cutting roller; The cutting roller lifting mechanism is connected to the support, and is used to drive the cutting roller to drive the cutting line to move up and down in a vertical plane along an axial direction perpendicular to the silicon rod to be processed.

5. The silicon rod processing equipment according to claim 4, characterized in that: Each group of the cutting tables also includes a cutting roller translation mechanism; The cutting roller translation mechanism is connected to the cutting roller lifting mechanism, and the cutting roller translation mechanism is used to drive the cutting roller to drive the cutting line to approach or move away from the axis of the silicon rod to be processed in a horizontal plane.

6. The silicon rod processing equipment according to claim 4, characterized in that: Each group of the cutting tables further comprises a driving motor, and the cutting roller is connected to an output shaft of the driving motor.

7. The silicon rod processing equipment according to any one of claims 1 to 6, characterized in that: The silicon rod conveying device comprises a clamping assembly and a first driving mechanism; The clamping assembly is connected to the first driving mechanism, and the first driving mechanism is used to drive the clamping assembly to carry the silicon rod to be processed to move between different positions, wherein the clamping assembly is used to clamp the silicon rod to be processed from the end face so that the axis of the silicon rod to be processed is in a horizontal plane.

8. The silicon rod processing equipment according to claim 7, characterized in that: The clamping assembly includes a first clamping beam, a fixed clamping arm, a movable clamping arm and a second driving mechanism; The first clamping beam is fixedly connected to the first driving mechanism; The fixed clamping arm is fixedly connected to the first clamping beam, the movable clamping arm is movably connected to the first clamping beam, and the movable clamping arm is arranged opposite to the fixed clamping arm to form a clamping space for clamping the silicon rod to be processed; The second driving mechanism is connected to the first clamping beam and is used for driving the movable clamping arm to approach or move away from the fixed clamping arm.

9. The silicon rod processing equipment according to claim 8, characterized in that: The clamping assembly also includes a first chuck, a second chuck and a third driving mechanism; The first chuck is rotatably connected to the fixed clamp arm, and the second chuck is rotatably connected to the movable clamp arm; The third driving mechanism is used to drive the first chuck or the second chuck to rotate at a preset angle.

10. The silicon rod processing equipment according to any one of claims 1 to 6, characterized in that: The silicon rod processing equipment also includes: A polishing device is used to polish the silicon rod to be processed after the edge skin is removed.

11. The silicon rod processing equipment according to any one of claims 1 to 6, characterized in that: The silicon rod processing equipment also includes: The edge skin clamping device is arranged on both sides of the cutting device with the axis of the silicon rod to be processed as the center line, and the edge skin clamping device is used to clamp and fix the edge skin.

12. The silicon rod processing equipment according to claim 11, characterized in that: The edge skin clamping device comprises a clamping bracket, a clamping mechanism and a fourth driving mechanism; The fourth driving mechanism is connected to the clamping bracket; The clamping mechanism is connected to the fourth driving mechanism, and the fourth driving mechanism is used to drive the clamping mechanism to carry the edge skin and move along the direction perpendicular to the axis of the silicon rod to be processed.

13. The silicon rod processing equipment according to claim 12, characterized in that: The clamping mechanism comprises a second clamping beam, a fixed clamping block, a movable clamping block and a fifth driving mechanism; The second clamping beam is fixedly connected to the fifth driving mechanism; The fixed clamping block is fixedly connected to the second clamping beam, the movable clamping block is movably connected to the second clamping beam, and the movable clamping block is arranged opposite to the fixed clamping block to form a clamping space for clamping the edge skin; The fifth driving mechanism is connected to the second clamping beam and is used for driving the movable clamping block to approach or move away from the fixed clamping block.

14. The silicon rod processing equipment according to claim 11, characterized in that: The silicon rod processing equipment also includes: The edge skin collecting and conveying device is arranged below the edge skin clamping device and is used for collecting and outputting the edge skin.

15. The silicon rod processing equipment according to claim 14, characterized in that: The edge skin collecting and conveying device is a conveyor belt device.

16. The silicon rod processing equipment according to any one of claims 1 to 6, characterized in that: The silicon rod processing equipment further comprises a feeding device, which is used to feed the silicon rods to be processed into the silicon rod processing equipment and to feed the processed silicon rods out of the silicon rod processing equipment.

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