Slit die and coating apparatus having the same

Abstract

A slit die (10) uniformly applies a coating liquid to a sheet (2) in a width direction. The slit die (10) has a main header (17) extending in the width direction and spreading the coating liquid in the width direction, and a slit (16) narrower in width than the main header (17) and applying the coating liquid flowing from the main header (17) to the sheet (2). The main header (17) has a non-overlapping portion (24) not overlapping the slit (16) in the width direction at each of both end portions (17a) in the width direction. The main header (17) has a first inflow portion (19) for inflow of the coating liquid provided at the non-overlapping portion (24).

Description

TECHNICAL FIELD

[0001] The present application relates to a slit die and a coating apparatus provided with the same. BACKGROUND

[0002] As a method of forming a coating film on a sheet (base material) handled by, for example, a roll-to-roll method, a coating method using a slit die is known. The slit die spreads a coating liquid along a width direction through a manifold and uniformly applies the coating liquid to a sheet (base material) along the width direction from a slit. Various inventions are disclosed regarding the slit die.

[0003] For example, the T-die (slit die) disclosed in Patent Literature 1 is provided with a plurality of supply ports of the coating liquid toward the manifold. Thereby, compared with the case where the supply port is one, a coating film having a good distribution of the discharge amount in the width direction can be formed on the base material.

[0004] PRIOR ART DOCUMENTS

[0005] PATENT LITERATURE

[0006] Patent Literature 1: Japanese Patent Application Laid-Open No. 11-128805 SUMMARY

[0007] The slit die of the present application for uniformly applying a coating liquid to a base material along a width direction is provided with: a main manifold extending along the width direction and spreading the coating liquid along the width direction; and a slit narrower in width than the main manifold and applying the coating liquid flowing from the main manifold to the base material, the main manifold having, at both ends in the width direction, a non-overlapping portion not overlapping with the slit in the width direction, and the main manifold being provided with a first inflow portion for inflow of the coating liquid at each of the non-overlapping portions. BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1 is a view schematically showing a coating apparatus provided with the slit die of the first embodiment of the present application.

[0009] Figure 2 is a front sectional view of the slit die of the first embodiment.

[0010] Figure 3 is a plan sectional view of the slit die of the first embodiment.

[0011] Figure 4 is a plan sectional view of the slit die of the second embodiment.

[0012] Figure 5 is a front sectional view of the slit die of the third embodiment.

[0013] Figure 6 is a plan sectional view of the slit die of the third embodiment.

[0014] Figure 7 is a side sectional view of the slit die of the third embodiment.

[0015] Figure 8 is a top sectional view of the slit die of the fourth embodiment.

[0016] Figure 9 is a front sectional view of the slit die of the fifth embodiment.

[0017] Figure 10 is a top sectional view of the slit die of the fifth embodiment.

[0018] Figure 11 is a side sectional view of the slit die of the fifth embodiment.

[0019] Figure 12 is a top sectional view of the slit die of the other embodiment.

[0020] Figure 13 is a top sectional view of the slit die of the comparative example.

[0021] BRIEF DESCRIPTION OF REFERENCE NUMERALS

[0022] B width direction

[0023] B1 width dimension

[0024] B2 width dimension

[0025] 1 applicator

[0026] 2 sheet (base material)

[0027] 4 pump (supply mechanism)

[0028] 10 slit die

[0029] 13 upper block (two blocks)

[0030] 14 lower block (two blocks)

[0031] 15 spacer

[0032] 15c cutout

[0033] 16 slit

[0034] 17 main manifold

[0035] 17a width direction both end portions

[0036] 17b width direction central portion

[0037] 19 first inflow portion

[0038] 20 sub-manifold

[0039] 21 connection passage

[0040] 21a first connection passage

[0041] 21b second connection passage

[0042] 22 second inflow portion

[0043] 24 non-overlapping portion DETAILED DESCRIPTION

[0044] In the slit die of the above-described Patent Document 1, in the case where the coating takes a long time, stagnation of the coating liquid can occur at both end portions in the width direction of the manifold, and thus the solid components of the coating liquid can settle. The settlement of the coating liquid is a cause of deterioration of the discharge amount distribution in the width direction, generation of stripe-shaped coating unevenness due to outflow of the settled matter to the slit, and the like, and is not preferable.

[0045] In particular, in the case where the slit width (coating width) is narrower than the manifold width, stagnation of the coating liquid occurs at the portions of both end portions in the width direction of the manifold that do not overlap with the slit, and the solid components of the coating liquid easily settle.

[0046] The present application was completed in view of the above-described circumstances, and the main object thereof is to suppress the settlement of the coating liquid at both end portions in the width direction of the manifold in a slit die in which the slit width is narrower than the manifold width.

[0047] Hereinafter, the embodiments of the present application will be described in detail based on the drawings. The description of the following preferred embodiments is merely illustrative in nature and is in no way intended to limit the present application, its application, or its uses.

[0048] (First Embodiment)

[0049] Figure 1 A coating device 1 of a first embodiment of the present application is schematically shown. The coating device 1 is used to form a coating film of a prescribed width on a substrate. In the present embodiment, a sheet 2 that is continuously transported by a roll-to-roll method is exemplified as the substrate. The sheet 2 is formed into a long strip shape and is wound around a roll 3.

[0050] The coating device 1 is provided with a slit die 10. The slit die 10 is used to uniformly apply a coating liquid to the sheet 2 in the width direction (indicated by B in the drawing). Figure 1 The width direction refers to a direction orthogonal to the length direction of the sheet 2, that is, the transport direction of the sheet 2 (indicated by A in the drawing). Figure 1

[0051] ​The nozzle 11 of the slot die 10 is opposed to the outer peripheral surface of the roller 3 at a prescribed distance. By rotating the roller 3, that is, by continuously conveying the sheet 2, while ejecting the coating liquid from the nozzle 11 of the slot die 10, a coating film of a prescribed width is formed on the sheet 2. The sheet 2 on which the coating film is formed by the coating device 1 is dried in a drying furnace (not shown). In the drying furnace, the volatile components contained in the coating film are removed.

[0052] The coating device 1 is provided with a pump 4 as a supply mechanism. The pump 4 supplies the coating liquid to the supply port 12 of the slot die 10. In the present embodiment, two supply ports 12 are provided in the slot die 10.

[0053] The nozzle 11 is provided on the side of the slot die 10 close to the sheet 2 (hereinafter referred to as "front side"). The supply port 12 is provided on the side of the slot die 10 away from the sheet 2 (hereinafter referred to as "rear side").

[0054] The structure of the slot die 10 will be described in detail. Figure 2 、 3 The slot die 10 of the present embodiment is shown in Figure 2 is a front sectional view at line II-II, Figure 3 is a plan sectional view at line III-III.

[0055] As shown in Figure 2 , the slot die 10 has an upper block 13 and a lower block 14 as two blocks. The upper block 13 and the lower block 14 are engaged with each other via a spacer 15. The thickness of the spacer 15 is, for example, 1 mm or less.

[0056] As shown in Figure 3 , the spacer 15 is interposed between the upper block 13 and the lower block 14 at all portions 15a in the width direction on the rear side and at both portions 15b in the width direction on the front side, and is not interposed at the central portion in the width direction on the front side. Thus, a slit 16 constituted by the gap between the upper block 13 and the lower block 14 is formed at the central portion in the width direction on the front side. The front end portion of the slit 16 constitutes the nozzle 11.

[0057] The thickness of the slit 16 is substantially the same as the thickness of the spacer 15. The width direction of the slit 16 is the same as the width direction of the sheet 2. The width dimension Bl of the slit 16 is the coating width of the coating liquid coated from the nozzle 11, and is substantially the same as the width dimension of the coating film formed on the sheet 2.

[0058] As shown in Figure 2 、 3 , the slot die 10 is provided with a main header 17. The main header 17 is constituted by a recess formed in the surface of the lower block 14 on the side facing the upper block 13. The main header 17 extends in the width direction at a position on the rear side from the slit 16, and is formed, for example, in a semicircular shape in cross section (see Figure 2). The main manifold 17 does not penetrate the side wall portions on both sides in the width direction of the lower block 14. As shown in Figure 3 , the main manifold 17 is not covered by the partition 15, but faces the upper block 13 side.

[0059] As shown in Figure 3 , the slit 16 is narrower in width than the main manifold 17. In other words, the width dimension B1 of the slit 16 is smaller than the width dimension B2 of the main manifold 17. That is, the main manifold 17 has, at both end portions 17a in the width direction, portions 24 (hereinafter referred to as "non-overlapping portions 24") that do not overlap the slit 16 in the width direction.

[0060] The main manifold 17 has two first inflow portions 19. Specifically, the main manifold 17 is provided with the first inflow portions 19 at the non-overlapping portions 24 (both end portions 17a in the width direction), respectively. The entirety in the width direction of each first inflow portion 19 is included in each non-overlapping portion 24 of the main manifold 17. Each first inflow portion 19 is constituted by, for example, a flow inlet formed in the wall portion of the main manifold 17.

[0061] The two supply ports 12 are opened in the rear wall portion of the lower block 14. As shown in Figure 3 , each supply port 12 is arranged in the width direction from the other. The supply paths 18 extend forward from each supply port 12. Each supply path 18 is connected to each first inflow portion 19 of the main manifold 17.

[0062] The operation of the coating device 1 will be described. The coating liquid that is pressure-fed by the pump 4 is supplied to the two supply ports 12 of the slit die 10, and flows into the main manifold 17 from the first inflow portions 19 provided at the two non-overlapping portions 24 of the main manifold 17 via the two supply paths 18. The coating liquid that has flowed into the main manifold 17 spreads in the width direction to permeate the entirety of the main manifold 17 in the width direction, and flows into the slit 16.

[0063] The coating liquid that has flowed into the slit 16 from the main manifold 17 is ejected from the ejection port 11, and is uniformly applied to the sheet 2 in the width direction. Thus, a coating film of a prescribed width is formed on the sheet 2.

[0064] Here, as described above, the non-overlapping portions 24 of the main manifold 17 do not overlap the slit 16 in the width direction. Therefore, the coating liquid is less likely to flow out from the main manifold 17 to the slit 16 at the non-overlapping portions 24. That is, the coating liquid is likely to stagnate at the non-overlapping portions 24, and thus the solid components of the coating liquid are likely to settle at the non-overlapping portions 24. The settlement of the coating liquid is a cause of deterioration of the distribution of the ejection amount in the width direction, generation of streak-like coating unevenness due to the outflow of the settled matter to the slit 16, and the like, and is not preferable.

[0065] Therefore, in the present embodiment, by providing the first inflow portions 19 in the non-overlapping portions 24 of the main header 17 respectively, the flow of the coating liquid at the non-overlapping portions 24 is promoted. Thus, the coating liquid can be inhibited from stagnating at the non-overlapping portions 24 of the main header 17, and thus the solid components of the coating liquid can be inhibited from settling at the non-overlapping portions 24. Therefore, the distribution of the discharge amount in the width direction can be made good, or the generation of the striped coating unevenness can be inhibited.

[0066] In particular, in the production of battery electrodes, cases where the coating width (slit width) changes due to switching of the type are more common, and thus the slit die 10 of the present embodiment is effective.

[0067] Also, in the present embodiment, the entire width direction of each first inflow portion 19 is included in each non-overlapping portion 24 of the main header 17, and thus the stagnation of the coating liquid at the non-overlapping portions 24 can be more reliably inhibited, and thus the settlement of the solid components of the coating liquid at the non-overlapping portions 24 can be inhibited.

[0068] As described above, according to the present embodiment, in the slit die 10 in which the width of the slit 16 is narrower than the width of the main header 17, the settlement of the coating liquid at the width direction end portions 17a (non-overlapping portions 24) of the main header 17 can be inhibited.

[0069] (Second Embodiment)

[0070] Reference Signs Figure 4 The slit die 10 of the second embodiment will be described. In the following description, there are cases where the same reference signs are assigned to the same structures as those of the above-described embodiments and detailed descriptions are omitted.

[0071] In the present embodiment, the cross-sectional area of the main header 17 is smaller at the width direction central portion 17b than at each non-overlapping portion 24. The cross-sectional area referred to here is the cross-sectional area of a cross section orthogonal to the width direction (the direction in which the coating liquid expands in the main header 17). Specifically, a tapered portion 17c that protrudes toward the front side as it approaches the width direction central side from the width direction outer side is provided in the longitudinal wall portion of the main header 17 at the width direction central portion 17b. By providing the tapered portion 17c, the front-rear width (the width in the front-rear direction, the width in the horizontal direction orthogonal to the width direction) of the width direction central portion 17b of the main header 17 is made smaller, and thus the cross-sectional area is reduced.

[0072] Here, the first inflow portion 19 provided in the non-overlapping portion 24 of the main header 17 is located at a position away from the width direction central portion 17b. Therefore, the coating liquid becomes slightly difficult to flow at the width direction central portion 17b due to pressure loss or the like from the first inflow portion 19 to the width direction central portion 17b. That is, there is a possibility that the settlement of the coating liquid occurs at the width direction central portion 17b.

[0073] Therefore, in this embodiment, by providing a tapered portion 17c on the longitudinal wall portion at the rear side of the main manifold 17, the cross-sectional area of ​​the central portion 17b in the width direction is reduced, thereby accelerating the flow rate of the coating liquid flowing in the width direction of the central portion 17b. As a result, sedimentation of the coating liquid can be suppressed not only at the non-overlapping portion 24 of the main manifold 17, but also at the central portion 17b in the width direction.

[0074] (Third Implementation)

[0075] Reference Figures 5-7 The sewing mold 10 of the third embodiment will be described.

[0076] In the following description, there are cases where the same reference numerals are used for structures that are the same as those in the above embodiments, and detailed descriptions are omitted.

[0077] In this embodiment, the sewing mold 10 further includes a secondary manifold 20 and a connecting passage 21. The secondary manifold 20 is formed by a recess on the surface of the lower block 14 facing the upper block 13. The secondary manifold 20 extends in the width direction at a position further rearward than the main manifold 17, and is, for example, formed in a semi-circular cross-section (see reference). Figure 5 The secondary manifold 20 does not penetrate the side walls on both sides of the lower block 14 in the width direction. (For example...) Figure 6 As shown, the secondary manifold 20 is covered by the spacer 15. Preferably, the width of the secondary manifold 20 is the same as the width of the main manifold 17.

[0078] like Figure 6 As shown, the secondary manifold 20 has only one second inlet 22. Specifically, the second inlet 22 is located at the center 20b of the secondary manifold 20 in the width direction. The second inlet 22 is, for example, formed by an inlet formed in the wall of the secondary manifold 20.

[0079] Furthermore, in this embodiment, there are differences from the embodiments described above, such as... Figure 6 As shown, only one supply port 12 is opened on the rear wall of the lower block 14 (see also...). Figure 1 (The double-dotted line). The supply port 12 is located in the center of the width direction. The supply path 18 extends forward from the supply port 12. The supply path 18 is connected to the second inflow section 22 of the auxiliary manifold 20.

[0080] The connecting passage 21 connects the secondary manifold 20 to the main manifold 17. In this embodiment, the connecting passage 21 includes two first connecting passages 21a. Here, an outlet 23 is provided at each of the two ends 20a in the width direction of the secondary manifold 20 (see reference). Figure 6 Each outflow portion 23 is, for example, formed by an outlet opened in the wall of the sub-manifold 20. Each first connection passage 21a is connected to each outflow portion 23 of the sub-manifold 20 and to each first inflow portion 19 of the main manifold 17.

[0081] like Figure 7 As shown, each first connection passage 21a is formed by a recess on the surface of the lower block 14 facing the upper block 13. The first connection passage 21a extends in the front-rear direction between the secondary manifold 20 and the main manifold 17, and is formed, for example, in a rectangular cross-section. Figure 5 As shown, each first connection passage 21a slopes downward from the side (rear side) of the secondary manifold 20 to the side (front side) of the main manifold 17.

[0082] In this embodiment, the coating liquid, pumped by pump 4, is supplied to a supply port 12 of the die 10 and flows into the sub-manifold 20 via a supply path 18 from a second inflow portion 22 located at the central portion 20b in the width direction. The coating liquid flowing into the sub-manifold 20 expands in the width direction and spreads throughout the sub-manifold 20, flowing into two first connecting passages 21a from two outflow portions 23 located at both ends 20a in the width direction. The coating liquid flowing into the two first connecting passages 21a flows from the sub-manifold 20 side towards the main manifold 17 side and flows into the main manifold 17 from two first inflow portions 19 located at two non-overlapping portions 24 of the main manifold 17. The subsequent flow of the coating liquid is the same as in the embodiment described above.

[0083] In this embodiment, by providing a secondary manifold 20 with only one second inflow section 22 upstream (rear) of the main manifold 17, the number of supply ports 12 connected to the pump 4 can be reduced to one. This simplifies the piping structure connecting the pump 4 to the die 10.

[0084] (Fourth Implementation)

[0085] Reference Figure 8 The sewing mold 10 of the fourth embodiment will be described. In the following description, there are cases where the same reference numerals are used for structures that are the same as those in the above embodiments, and detailed descriptions are omitted.

[0086] This embodiment is a combination of the second and third embodiments. A tapered portion 17c is provided in the central portion 17b of the main manifold 17 in the width direction, and it also has a secondary manifold 20 and two first connecting passages 21a.

[0087] According to this embodiment, the effects of both the second and third embodiments can be achieved simultaneously. That is, it is possible to simultaneously suppress the settling of the coating liquid at the central portion 17b in the width direction of the main manifold 17 and simplify the piping structure connecting the pump 4 and the slit mold 10.

[0088] (Fifth Implementation)

[0089] Reference Figures 9-11The sewing mold 10 of the fifth embodiment will be described. In the following description, there are cases where the same reference numerals are used for structures that are the same as those in the above embodiments, and detailed descriptions are omitted.

[0090] In this embodiment, in addition to the two first connection paths 21a, the connection path 21 also includes a second connection path 21b. The second connection path 21b is connected to the central portion 20b in the width direction of the secondary manifold 20 and to the central portion 17b in the width direction of the main manifold 17.

[0091] In this embodiment, such as Figure 10 As shown, a cutout 15c is formed at the center of the spacer 15 in the width direction, extending from directly above the secondary manifold 20 to the main manifold 17. The second connecting passage 21b is formed by the cutout 15c of the spacer 15. The second connecting passage 21b (cutout 15c) extends from directly above the center of the secondary manifold 20 in the width direction to the main manifold 17 in the front-back direction, and is, for example, formed in a rectangular cross-section (see reference). Figure 11 ).

[0092] exist Figure 11 In this diagram, d1 is the depth dimension of the first connecting path 21a, and d2 is the depth dimension of the second connecting path 21b. The depth dimension referred to here refers to the height dimension in the vertical direction. It should be noted that... Figure 11 In the illustration, to emphasize the second connecting passage 21b, the depth dimension d2 is shown as larger than its actual size. The depth dimension d2 of the second connecting passage 21b is approximately the same as the thickness dimension of the spacer 15, for example, 1 mm or less. On the other hand, the depth dimension d1 of each first connecting passage 21a is, for example, a few mm to tens of mm. That is, the depth dimension d2 of the second connecting passage 21b is much smaller than the depth dimension d1 of each first connecting passage 21a. Consequently, the cross-sectional area of ​​the second connecting passage 21b is smaller than the cross-sectional area of ​​each of the first connecting passages 21a.

[0093] In this embodiment, the coating liquid, pumped by pump 4, is supplied to a supply port 12 of the die 10 and flows into the sub-manifold 20 from a second inlet 22 via a supply path 18. The coating liquid flowing into the sub-manifold 20 expands along its width and spreads throughout the sub-manifold 20, flowing into two first connecting passages 21a and a second connecting passage 21b directly above two outlets 23 located at both ends 20a in the width direction and the central portion 20b in the width direction. The coating liquid flowing into these connecting passages 21a and 21b flows from the sub-manifold 20 side towards the main manifold 17 side, and flows into the main manifold 17 directly above two first inlet sections 19 located at two non-overlapping portions 24 in the main manifold 17 and the central portion 17b in the width direction. The subsequent flow of the coating liquid is the same as in the embodiment described above.

[0094] As described above, since the first inflow portion 19, which is located in the non-overlapping portion 24 of the main manifold 17, is situated away from the central portion 17b in the width direction, the coating liquid becomes slightly difficult to flow in the central portion 17b in the width direction, thus making it prone to settling. Therefore, in this embodiment, by connecting the second connecting passage 21b to the central portion 17b in the width direction of the main manifold 17, the flow of the coating liquid at the central portion 17b in the width direction is promoted. As a result, settling of the coating liquid can be suppressed not only in the non-overlapping portion 24 of the main manifold 17, but also in the central portion 17b in the width direction.

[0095] Furthermore, by making the cross-sectional area of ​​the second connecting passage 21b smaller than the cross-sectional area of ​​each of the first connecting passages 21a, the flow rate of the coating liquid flowing in the second connecting passage 21b can be made less than the flow rate of the coating liquid flowing in each of the first connecting passages 21a. That is, most of the coating liquid can flow from each of the first connecting passages 21a to each of the non-overlapping portions 24 of the main manifold 17, and a very small portion of the coating liquid can flow from the second connecting passage 21b to the central portion 17b in the width direction of the main manifold 17. As a result, most of the coating liquid can help suppress the sedimentation of the coating liquid at the non-overlapping portions 24 of the main manifold 17, and a very small portion of the coating liquid can help suppress the sedimentation of the coating liquid at the central portion 17b in the width direction.

[0096] Furthermore, since the second connection passage 21b is formed by using the cut 15c formed in the thinner spacer 15, it is possible to easily manufacture the second connection passage 21b with a smaller cross-sectional area.

[0097] (Other implementation methods)

[0098] The present invention has been described above through preferred embodiments, but such description is not a limitation and various changes can be made.

[0099] In the above embodiment, each first inflow portion 19 is entirely included in the non-overlapping portion 24 of the main manifold 17 in the width direction (see reference). Figure 3 (etc.), but if Figure 12 As shown, for example, it is acceptable for a portion of the inner side of each first inflow section 19 in the width direction to be slightly included in the portion (overlapping portion) of the main manifold 17 that overlaps with the slit 16 in the width direction. That is, it is acceptable for at least a portion of each first inflow section 19 to be included in the non-overlapping portion 24 of the main manifold 17 in the width direction, and as... Figure 12 As shown, it is also acceptable for each first inflow portion 19 to be arranged in the width direction in such a way that it spans the non-overlapping portion 24 and the overlapping portion.

[0100] In the above embodiment, the main manifold 17, the secondary manifold 20, and the first connecting passage 21a are formed by a recess on the surface of the lower block 14 facing the side of the upper block 13, but are not limited thereto. For example, the main manifold 17, the secondary manifold 20, and the first connecting passage 21a may also be formed by a cavity formed in the lower block 14, or for example, they may be formed in the upper block 13.

[0101] In the above embodiment, the die 10 and the coating apparatus 1 are used to apply a coating liquid to the sheet 2 that is continuously transported using a roll-to-roll method, but are not limited thereto. For example, the die 10 and the coating apparatus 1 can also be used to apply a coating liquid to a glass substrate placed on a worktable.

[0102] In the second and fourth embodiments, the front and rear widths of the central portion 17b in the width direction are reduced in order to reduce the cross-sectional area of ​​the central portion 17b in the width direction of the main manifold 17, but this is not a limitation. For example, the cross-sectional area of ​​the central portion 17b in the width direction can also be reduced by making the depth (height in the vertical direction) of the central portion 17b in the width direction of the main manifold 17 shallower than the depth of the non-overlapping portion 24.

[0103] In the third to fifth embodiments, the two first connection passages 21a are composed of completely independent passages, but are not limited to this. For example, the two first connection passages 21a may also be a structure in which the main passage is a branch that is connected to the central portion 20b in the width direction of the secondary manifold 20 and extends towards the main manifold 17.

[0104] In the fifth embodiment, the second connection passage 21b is formed by a cutout 15c formed in the spacer 15, but it is not limited to this. For example, the second connection passage 21b may also be formed by a recess formed on the surface of the lower block 14 facing the side of the upper block 13.

[0105] In the fifth embodiment, the cross-sectional area of ​​the second connecting passage 21b is adjusted to be smaller than the cross-sectional area of ​​each of the first connecting passages 21a by making the depth dimension d2 of the second connecting passage 21b much smaller than the depth dimension d1 of each of the first connecting passages 21a, but this is not a limitation. For example, the width of the second connecting passage 21b can also be reduced ( Figure 11 The width in the left and right directions of the first connecting passage 21a is increased, or the width of each first connecting passage 21a is widened, while the cross-sectional area of ​​the second connecting passage 21b is adjusted to be smaller than the cross-sectional area of ​​each of the first connecting passages 21a.

[0106] [Example]

[0107] (Example 1)

[0108] 1. A coating apparatus for manufacturing battery plates is used. 2. Copper foil (thickness: 10 μm) is used as the sheet material. 3. The slurry used as the coating liquid comprises 96% by mass graphite powder, 2% by mass carboxymethyl cellulose (CMC), and 2% by mass styrene-butadiene rubber (SBR) as solid components, and pure water is mixed into the solid components as a solvent.

[0109] Using the sewing mold 10 of the first embodiment (see reference) Figure 2 , 3 The width B2 of the main manifold 17 is set to 600mm, and the cross-sectional area of ​​the main manifold 17 is set to 6.3cm². 2 The width B1 of the slit 16 was set to 500mm, the flow rate of the coating liquid was set to 10ml / sec, and the coating was carried out for 48 hours to produce the battery plate.

[0110] (Example 2)

[0111] Using the sewing mold 10 of the second embodiment (see reference) Figure 4 (This is to ensure that the cross-sectional area at the center of the main manifold 17 in the width direction is 3.5 cm².) 2 Furthermore, the cross-sectional area at a position 50mm outward from the center of the main manifold 17 in the width direction is 6.3cm². 2 The cone shape (cone portion 17c) is provided. Other conditions are the same as in Example 1.

[0112] (Example 3)

[0113] Using the sewing mold 10 of the third embodiment (see reference) Figures 5-7 The width of the secondary manifold 20 is set to 600 mm, and the cross-sectional area of ​​each first connecting passage 21a is set to 2.1 cm². 2 Other conditions are the same as in Example 1.

[0114] (Example 4)

[0115] Using the sewing mold 10 of the fourth embodiment (see reference) Figure 8 The dimensions and other conditions are the same as in Examples 2 and 3.

[0116] (Example 5)

[0117] Using the sewing mold 10 of the fifth embodiment (see reference) Figures 9-11 The cross-sectional area of ​​the second connecting path 21b is set to 1.0 cm². 2 Other conditions are the same as in Example 3.

[0118] (Comparative Example)

[0119] Sewing mold 110 using existing technology (refer to) Figure 13 ).like Figure 13As shown, in the main manifold 17 of the slit mold 110, only one inlet 119 for supplying the coating liquid is provided at the central portion 17b in the width direction. A supply port 12 is provided on the rear wall of the slit mold 110. The inlet 119 and the supply port 12 are interconnected through a supply path 18. Other conditions are the same as in Embodiment 1.

[0120] (evaluate)

[0121] The ejection amount distribution in the width direction of the battery plates obtained by Examples 1-5 and the Comparative Example was measured and evaluated as follows. Battery plates with a diameter of 30 mm were punched at 10 points at 50 mm intervals along the width direction, and the weight of each plate was measured. Using the measured values ​​at the 10 points, the difference between the maximum and minimum values ​​was divided by the average value, which was taken as the ejection amount distribution in the width direction. The calculated results are shown in Table 1.

[0122] In addition, the sedimentation of the solid components of the coating liquid at the main manifold 17 of the slit mold 10 (110) of Examples 1-5 and the Comparative Example was evaluated. Specifically, the slit mold 10 (110) after coating was completed was disassembled, and the presence or absence of sedimentation of the solid components of the coating liquid at the main manifold 17 was observed. In the case of sedimentation, specifically, in the case where solid matter remained even after the slurry was removed, the sedimented (residual) solid components (solid matter) were carefully collected and their weight was measured. The measurement results are shown in Table 1.

[0123] As shown in Table 1, in Examples 1 to 5, the settling of the solid components of the coating liquid at the main manifold 17 was suppressed compared to the comparative example. This is because the slit mold 10 of the present invention suppressed the retention of the coating liquid at both ends 17a (non-overlapping portions 24) of the main manifold 17 in the width direction.

[0124] When comparing Examples 1 and 2, slight sedimentation occurred at the central portion 17b in the width direction of the main manifold 17 in Example 1, but no sedimentation occurred in Example 2. This is because, in Example 2, the cross-sectional area at the center in the width direction of the main manifold 17 was reduced, thereby suppressing sedimentation of the coating liquid at the central portion 17b in the width direction. However, in Example 2, the spray volume distribution in the width direction was slightly worse than in Example 1. That is, it can be said that the suppression of sedimentation and the improvement of the spray volume distribution are a trade-off.

[0125] When comparing Examples 3 and 4, similarly to the comparison of Examples 1 and 2, the suppression of sedimentation and the improvement of ejection volume distribution are in a trade-off relationship.

[0126] In Example 5, by connecting a second connecting passage 21b to the central portion 17b in the width direction of the main manifold 17, both the suppression of sedimentation and the improvement of the ejection volume distribution are achieved.

[0127] [Table 1]

[0128]

[0129] According to the present invention, in a slit mold where the slit width is narrower than the manifold width, the settling of the coating liquid at both ends of the manifold in the width direction can be suppressed.

[0130] Industrial applicability

[0131] This invention can be applied to slit molds and coating devices equipped with such slit molds, and is therefore extremely useful and has high industrial applicability.

Claims

1. A sewing mold, wherein, The slit mold is used to uniformly apply the coating liquid to the substrate along the width direction. The sewing mold has the following features: A main manifold extending along the width direction and spreading the coating liquid along the width direction; and A slit, narrower than the main manifold, is used to coat the substrate with the coating liquid flowing from the main manifold. The main manifold has non-overlapping portions at both ends in the width direction, which do not overlap with the slit in that width direction. The main manifold is provided with a first inlet section for the coating liquid to flow into each of the non-overlapping portions. The sewing mold also has the following features: A secondary manifold, extending along the width direction, and spreading the coating liquid along the width direction; and A connecting passage connects the secondary manifold to the main manifold, allowing the coating liquid to flow from the secondary manifold to the main manifold. The connection path includes a first connection path that connects to each of the first inflow sections. Most of the coating liquid flowing in the connection passage flows in the first connection passage.

2. The sewing mold according to claim 1, wherein, The cross-sectional area of ​​the main manifold is smaller in the central portion in the width direction than in the non-overlapping portion.

3. The sewing mold according to claim 1 or 2, wherein, The secondary manifold is provided with only one second inlet for the coating liquid to flow into.

4. The sewing mold according to claim 1 or 2, wherein, The connection path also includes a second connection path that connects to the central portion of the main manifold in the width direction. The cross-sectional area of ​​the second connection path is smaller than the cross-sectional area of ​​each of the first connection paths.

5. The sewing mold according to claim 4, wherein, The slit is formed by the gap between two blocks joined together by a spacer. The second connection path is formed by a cut in the spacer.

6. The sewing mold according to claim 1 or 2, wherein, The entire width direction of each of the first inflow portions is included in each of the non-overlapping portions.

7. The sewing mold according to claim 1 or 2, wherein, The connection path includes only the first connection path.

8. A coating apparatus, wherein, The coating apparatus includes: The sewing mold according to any one of claims 1 to 7; and A supply mechanism that supplies the coating liquid to the slit mold.

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