Light emitting device with fiber side facet to laser shaping

Abstract

The application discloses a light-emitting device for laser shaping of a fiber side surface, which comprises a laser chip and a light-emitting area, wherein the parallel direction of the light-emitting area to the junction plane is a slow axis, the vertical direction of the light-emitting area to the junction plane is a fast axis, the light-emitting angle of the fast axis is greater than that of the slow axis, and the light-emitting device further comprises a first optical fiber, which is arranged on the side of the laser chip provided with the light-emitting area, the plane where the fast axis of the light-emitting area is located is perpendicular to the axial direction of the first optical fiber, the light-emitting area emits laser light towards the side surface of the first optical fiber, and the laser light passes through the first optical fiber from the side surface; and the light-emitting device further comprises a positioning device for positioning the position of the first optical fiber, wherein the positioning device is used for positioning the first optical fiber, thereby improving the assembly precision, shortening the assembly time, saving manpower, and utilizing the heat dissipation of the laser chip base and the circuit board base, the heat dissipation of the constituent components of the light-emitting device for laser shaping of a fiber side surface, saving the heat dissipation components or devices, reducing the volume, and reducing the cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of lighting technology, in particular, to a light emitting device for laser shaping by means of fiber side shaping of laser emitted by laser chip. BACKGROUND

[0002] With the development of laser lighting technology, the demand and application of laser device are more and more widely. The laser emitted by the laser chip is parallel to the slow axis direction of the long direction of the light emitting area in the horizontal direction, and is perpendicular to the fast axis direction of the long direction of the light emitting area in the vertical direction. The light emitting angle of the laser emitted by the laser chip in the fast axis direction is different from that in the slow axis direction, and the light emitting angle in the fast axis direction is usually larger than that in the slow axis direction. The difference between the fast axis and the slow axis light emitting angle leads to the divergence of the long strip-shaped light beam emitted by the laser chip, which makes the application rate of the laser chip not high, especially when the laser device is used as a light source in the lighting field, the angle distribution of the fast axis and the slow axis must be adjusted.

[0003] The existing laser device adjusts the above-mentioned angle distribution by using the technology which is generally complex in structure, large in size, low in yield and difficult to popularize and apply. For example, patent publication No. CN104991347A discloses a laser shaping illuminator based on micro-lens array, which includes a collimation system, a micro-lens array group and a beam expanding system. The patent needs to cooperate with the collimation system, the micro-lens array group and the beam expanding system. The structure of the patent is complex, the calibration is difficult in the assembly process, and the volume is large, which makes it difficult to popularize and apply. SUMMARY

[0004] The purpose of the present application is to overcome the shortcomings of the above-mentioned traditional technology, and to invent a light emitting device for laser shaping by means of fiber side shaping of laser emitted by laser chip.

[0005] In order to solve the above-mentioned problems, the technical scheme adopted by the present application is: a light emitting device for laser shaping by means of fiber side shaping of laser emitted by laser chip, which comprises a laser chip, the laser chip comprising a light emitting area, the light emitting area being parallel to the slow axis direction of the horizontal plane and being perpendicular to the fast axis direction of the vertical plane, the light emitting angle of the fast axis being larger than that of the slow axis, characterized in that: it further comprises a first optical fiber, the first optical fiber being arranged on one side of the laser chip provided with the light emitting area, the plane where the fast axis of the light emitting area is located being perpendicular to the axial direction of the first optical fiber, the side of the light emitting area facing the first optical fiber emitting laser, and the laser passing through the first optical fiber from the side; and a positioning device for positioning the position of the first optical fiber.

[0006] As a kind of improvement of the above technical solution: still include laser chip base and circuit board base, the laser chip base includes a laser chip base plane, circuit board base includes a circuit board base plane, the laser chip base towards the end of first optical fiber includes laser chip base locating surface;The laser chip is fixedly arranged on the laser chip base plane, the laser chip base is fixedly arranged on the circuit board base plane, locating device is fixedly arranged on the laser chip base plane with laser chip base locating surface as reference, first optical fiber is fixedly arranged on the circuit board base plane with locating device as reference.

[0007] As a kind of improvement of the above technical solution: the radius of first optical fiber is R, the distance from the light-emitting area to the circuit board base plane is K, the positioning tolerance of the distance from the light-emitting area of laser chip to the optical fiber axis is M, the radius R of first optical fiber is in the range of 6.6M

[0008] Since the above technical solution is used, compared with the prior art, the positioning device is used to position the first optical fiber, which improves the assembly precision, shortens the assembly time and saves manpower.Secondly, the light-emitting device for laser shaping of optical fiber side surface utilizes the heat dissipation of laser chip base and circuit board base, and utilizes the heat dissipation of the components of light-emitting device for laser shaping of optical fiber side surface, thereby saving the heat dissipation components or devices, reducing the volume and reducing the cost.

[0009] The application will be further described below in conjunction with the drawings and specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 is the front view of the light-emitting device for laser shaping of optical fiber side surface.

[0011] Figure 2 is the top view of Figure 1 .

[0012] Figure 3 is the partial structure schematic view of Figure 1 .

[0013] Figure 4 is the front view of another embodiment of the light-emitting device for laser shaping of optical fiber side surface.

[0014] Figure 5 is the top view of Figure 4 .

[0015] Figure 6 is the partial structure schematic view of Figure 4 .

[0016] Figure 7 is the front view of another embodiment of the light-emitting device for laser shaping of optical fiber side surface.

[0017] Figure 8 This is a front view of another embodiment of a light-emitting device that uses optical fiber side-to-laser shaping.

[0018] Figure 9 yes Figure 8 Right view of the positioning block and the first optical fiber. Detailed Implementation

[0019] Example 1:

[0020] like Figures 1-3 As shown, the light-emitting device with optical fiber side-facing laser shaping includes a laser chip 101. The laser chip 101 includes a light-emitting area that emits laser light 121. Since the laser light 121 emitted by the light-emitting area has a slow axis direction parallel to the elongated direction of the laser chip 101 and a fast axis direction perpendicular to the elongated direction of the laser chip 101, the emission angle of the laser light 121 emitted by the laser chip 101 in the fast axis direction differs from that in the slow axis direction; typically, the emission angle in the fast axis direction is greater than that in the slow axis direction. This difference in emission angles in the fast and slow axis directions results in the laser light 121 emitted by the laser chip 101 being a divergent, elongated beam. For these reasons, when the laser chip 101 is used as a light source in lighting or display applications, the angular distribution of the laser chip 101 in the fast or slow axis direction needs to be adjusted.

[0021] In this design, the first optical fiber 102 is positioned on the side of the laser chip 101 where the light-emitting area is located. The light-emitting area faces the side of the first optical fiber 102, and the plane containing the fast axis of the light-emitting area is perpendicular to the axial direction of the first optical fiber 102. The laser 121 emitted from the light-emitting area enters from one side of the first optical fiber 102 and exits from the other side. This technical solution utilizes the first optical fiber 102 to adjust the emission angles in the fast and slow axis directions. Figure 3 As shown, in the cross-sectional direction of the first optical fiber 102, the two curved surfaces of the first optical fiber 102 in the vertical direction act as a lens, bending the laser 121 emitted from the light-emitting region along the fast axis and reducing the emission angle of the laser 121. The first optical fiber 102 remains unchanged in the horizontal direction, meaning that the emission angle of the laser 121 along the slow axis does not change. The laser 121 emitted from the light-emitting region is the first laser 121a before it enters the first optical fiber 102, and the second laser 121b after exiting the first optical fiber 102. The first laser 121a is equivalent to passing through a convex lens.

[0022] In this embodiment, the first optical fiber 102 does not change the emission angle of the laser 121 emitted by the light-emitting region in the slow axis direction; the first optical fiber 102 collimates the laser 121 emitted by the light-emitting region in the fast axis direction. The above technical solution compresses the angle in the fast axis direction only, while the angle in the slow axis direction remains unchanged.

[0023] In actual operation, in order to facilitate operation, a first optical fiber 102 with a large enough radius is usually selected, and the distance between the first optical fiber 102 and the laser chip 101 is usually large. In the technical solution, in order to form a circular ideal light spot of the second laser 121b, the radius of the first optical fiber 102 and the distance between the first optical fiber 102 and the laser chip 101 need to be strictly controlled. The radius of the first optical fiber 102 and the distance between the first optical fiber 102 and the laser chip 101 are related to whether the second laser 121b emitted by the first optical fiber 102 is collimated or focused, and affect the ratio of the angle of the second laser 121b in the fast axis direction to the angle of the second laser 121b in the slow axis direction. In the technical solution, ideally, the first laser 121a passes through the first optical fiber 102 to form the second laser 121b and then collimates, and it is necessary to ensure that the ratio of the angle of the second laser 121b in the fast axis direction to the angle of the second laser 121b in the slow axis direction is approximately equal to 1.

[0024] In the technical solution, the first optical fiber 102 is taken as an example of a quartz optical fiber, and the refractive index of the quartz optical fiber is 1.46. In the embodiment, the radius of the first optical fiber 102 is R, and the distance between the light emitting area and the circuit board base plane 104a is K. When the distance K between the light emitting area and the circuit board base plane 104a is equal to R, the first optical fiber 102 is directly fixed on the circuit board base plane 104a, and the first optical fiber 102 is naturally positioned in the vertical direction, that is, the optical axis of the laser 121 emitted by the light emitting area of the laser chip 101 passes through the axis of the first optical fiber 102. In fact, the light emitting area of the laser chip 101 is allowed to have a deviation in the height direction from the axis of the first optical fiber 102, and a slight eccentricity does not affect the divergence angle of the second laser 121b, but only affects the emission direction of the second laser 121b. For example, the center of the first optical fiber 102 is high, and the light emitting area is low, so the emission direction of the second laser 121b will be upwardly biased. Therefore, the embodiment is a preferred embodiment, and the radius of the first optical fiber 102 is equal to the distance between the light emitting area and the circuit board plane 104a.

[0025] In summary, the radius of the first optical fiber 102 is related to the material of the first optical fiber 102 and the distance between the light emitting area and the circuit board base plane 104a. In the embodiment, the first optical fiber 102 is a quartz optical fiber, and the radius of the first optical fiber 102 is less than 1.5 times the distance between the light emitting area and the circuit board plane 104a, which satisfies the above limitation condition.

[0026] The distance between the first optical fiber 102 and the plane where the light emitting region of the laser chip 101 is located is L. This distance is related to the cross-sectional radius of the first optical fiber 102 and the refractive index of the material selected for the first optical fiber 102. The larger the radius of the first optical fiber 102, the smaller the bending ability of the laser 121, and the larger the value of L. The larger the refractive index of the material of the first optical fiber 102, the stronger the bending ability of the laser 121, and the smaller the value of L. L actually corresponds to the focal length of the first optical fiber 102 as a lens. When the light emitting region is at the focal point, the second laser 121b emitted by the first optical fiber 102 is collimated; when the light emitting region deviates from the focal point, the second laser 121b emitted by the first optical fiber 102 is convergent; and when the light emitting region deviates from the focal point, the second laser 121b emitted by the first optical fiber 102 is divergent.

[0027] In summary, the distance L between the first optical fiber 102 and the plane where the light emitting region of the laser chip 101 is located determines the spot size of the laser 121 after passing through the first optical fiber 102. The distance L between the first optical fiber 102 and the light emitting region is a sensitive factor that affects the spot size of the second laser 121b. If the spot of the second laser 121b emitted by the first optical fiber 102 is too small, the energy of the second laser 121b is concentrated, the energy per unit area is high, and the use process is prone to burn out components or cause safety accidents; if the spot of the second laser 121b is too large, the light intensity is insufficient and cannot meet the demand.

[0028] The cross-sectional diameter of the first optical fiber can be very small in theory, as long as it is greater than the width of the light emitting region in the fast axis direction, which is only about 1 micron. However, through experiments, we found that the cross-sectional diameter of the first optical fiber 102 cannot be too small, and there is a lower limit to the size. The first optical fiber 102 uses a quartz optical fiber, and through repeated experiments, we have reached the following conclusion: the diameter 2R of the first optical fiber 102 is 4.4 times the distance L between the first optical fiber 102 and the plane where the light emitting region is located, i.e. R = 2.2L. Since the diameter 2R of the first optical fiber 102 affects the distance L between the first optical fiber 102 and the plane where the light emitting region is located, the diameter 2R of the first optical fiber 102 cannot be too small, otherwise the distance L between the first optical fiber 102 and the plane where the light emitting region is located will be difficult to control, and the assembly will be difficult. Assuming that the positioning tolerance of the distance between the light emitting region of the laser chip 101 and the axis of the first optical fiber 102 is M, it is verified through repeated experiments that the distance L between the first optical fiber 102 and the plane where the light emitting region is located is not less than 3 times the positioning tolerance M, i.e. L > 3M, and since R = 2.2L, R > 6.6M. The upper limit of the radius R of the first optical fiber 102 using a quartz optical fiber is 1.5 times the distance K between the light emitting region and the plane 104a of the circuit board base. In this way, the first optical fiber 102 has a radius R range. The radius R of the first optical fiber 102 has a range of 6.6M < R < 1.5K.

[0029] The above range of values is the range of values of the radius R of the first optical fiber 102 when the first optical fiber 102 is made of quartz optical fiber. If the first optical fiber 102 is made of other materials, the range of values of the radius R of the first optical fiber 102 changes with the refractive index.

[0030] As can be seen from the above, both the radius R of the first optical fiber 102 and the distance L from the first optical fiber 102 to the plane of the light-emitting region of the laser chip 101 need to be strictly accurate. As the accuracy increases, the difficulty in the production process increases. For example, Figure 1 and 3 As shown in FIGS. 1 and 2, in order to meet the accuracy requirements, reduce the production cost, and improve the production and assembly efficiency, a laser chip base 103 for positioning and fixing the laser chip 101 and a positioning device for positioning the first optical fiber 102 are added in the technical solution. The positioning device serves as a reference for fixing the first optical fiber 102, and controls the distance L between the first optical fiber 102 and the laser chip 101. The positioning device improves the accuracy, reduces the assembly difficulty, reduces the production cost, and avoids the first optical fiber 102 or the laser chip 101 from being fixed insecurely during use, which cannot achieve the expected purpose.

[0031] In the embodiment, the positioning device is a positioning block 105. One side of the positioning block 105 close to the laser chip base 103 is set as a reference to the laser chip base positioning surface 103a, and is arranged close to the laser chip base positioning surface 103a. The positioning block 105 is fixedly arranged on the circuit board base plane 104a. The distance L from the first optical fiber 102 to the plane of the light-emitting region is determined according to the material of the selected first optical fiber 102 and the radius R of the first optical fiber 102, and the position of the optical fiber positioning groove 106 on the positioning block 105 is selected. The depth of the optical fiber positioning groove 106 is selected according to the radius R of the first optical fiber 102 and the distance K from the light-emitting region to the circuit board base plane 104a. When the position and the depth of the optical fiber positioning groove 106 are determined, the first optical fiber 102 is fixedly arranged in the optical fiber positioning groove 106 by using the adhesive in the embodiment, so as to avoid the movement of the first optical fiber 106 and affect the emission effect of the second laser 121b.

[0032] In a preferred embodiment, the optical axis of the laser 121 emitted by the light-emitting region passes through the axis of the first optical fiber 102. When the optical axis of the laser 121 emitted by the light-emitting region is perpendicular to the axis of the first optical fiber 102, the laser 121 will not be refracted in the first optical fiber 102, and the loss of the laser 121 passing through the first optical fiber 102 is minimal.

[0033] The positioning device has the advantages that the position of the fiber positioning groove 106 on the positioning block 105 is uniquely determined according to the material, radius, etc. of the first optical fiber 102, without the need for repeated calibration or measurement during assembly, and the assembly speed is greatly improved. The positioning block 105 serves to improve the installation position accuracy of the first optical fiber 102, shorten the installation time, and meet the requirements of mass production.

[0034] The side of the laser chip base 103 away from the circuit board base 104 is a laser chip base plane 103b, the laser chip 101 is attached to the laser chip base plane 103b, and the end of the laser chip base 103 facing the first optical fiber 102 includes a laser chip base positioning surface 103a. The surface of the circuit board base 104 is provided with a circuit board base plane 104a, and the laser chip base 103 is fixedly arranged on the circuit board base plane 104a. One side of the positioning device is tightly attached to the laser chip base positioning surface 103a, the bottom of the positioning device is fixedly arranged on the circuit board base plane 104a, and the other side of the positioning device is tightly attached to the first optical fiber 102, which is also fixedly arranged on the circuit board base plane 104a.

[0035] The laser chip 101 is attached to the laser chip base plane 103b, and the laser chip base 103 is attached to the circuit board base plane 104a. The laser chip 101 and the circuit board base 104 are electrically connected through pads and / or gold wires, and the circuit board base 104 supplies power to the laser chip 101 through the pads and / or gold wires. The laser chip 101 generates heat during operation, and the laser chip 101 needs to be cooled. The heat generated by the laser chip 101 during operation is transferred to the laser chip base 103, and the laser chip base 103 dissipates part of the heat. The laser chip base 103 and the circuit board base plane 104a are attached together, and the other part of the heat is transferred to the circuit board base 104, which dissipates the heat.

[0036] The shape of the laser chip 101 is a rectangular parallelepiped, the light emitting area is arranged on one end face in the length direction of the laser chip 101, the light emitting area of the laser chip 101 is a long strip, the long side of the laser chip 101 is parallel to a plane on the laser chip base 103 and a plane of the circuit board base 104, and the heat dissipation surface of the laser chip 101 is tightly attached to the plane of the laser chip base 103. The above design has the advantage that the heat of the laser chip 101 is transferred to the circuit board base 104 in the shortest distance, and the heat dissipation effect is better.

[0037] The above design can not only fix and position the laser chip 101, but also transfer and dissipate the heat generated by the laser chip 101 during operation through the components fixed thereto, saving the heat dissipation device, reducing the cost, size, and manufacturing cost of the product, and improving the installation efficiency.

[0038] The circuit board base 104 is preferably made of materials with good thermal conductivity, such as copper substrate, aluminum substrate, or aluminum nitride substrate, and the laser chip base 103 is preferably made of materials with good thermal conductivity, such as aluminum nitride, aluminum oxide, or silicon carbide.

[0039] The disadvantage of the positioning device in this embodiment is that the shape and position requirements of the fiber positioning groove 106 are high during the processing. Once an error occurs during processing, the detection and calibration are complicated and the repair of the fiber positioning groove 106 is difficult.

[0040] Example 2:

[0041] like Figures 4-6 As shown, the light-emitting device for laser shaping on the side of the optical fiber differs from Embodiment 1 in that the positioning device is different. The positioning device used in this embodiment includes an isolation component, which is an isolation post 205. To facilitate material selection and avoid the influence of the isolation post 205 on the refraction or reflection of the laser passing through the first optical fiber 202, a circular cross-section isolation post 205 is used in this embodiment. A preferred isolation post 205 is a second optical fiber. Using a second optical fiber has the following advantages: first, high diameter accuracy; second, it is a common product on the market, readily available, and inexpensive; and third, easy cutting and processing.

[0042] In this embodiment, the second optical fiber is fixedly mounted on the circuit board base plane 204a with the laser chip base positioning surface 203a as a reference. The side of the second optical fiber closest to the laser chip base positioning surface 203a is tightly fitted to the laser chip base positioning surface 203a. The second optical fiber serves as the positioning reference for the first optical fiber 202. The side of the second optical fiber furthest from the laser chip base positioning surface 203a is tightly fitted to the first optical fiber 202. The first optical fiber 202 is fixedly mounted on the circuit board base plane 204a.

[0043] In this embodiment, the distance K from the light-emitting area to the circuit board base plane 204a is controlled by controlling the height of the laser chip base 203. The radius R of the first optical fiber 202 is determined by the material of the first optical fiber 202. The radius R of the first optical fiber 202 determines the distance L from the first optical fiber 202 to the plane where the light-emitting area is located. The distance L from the first optical fiber 202 to the plane where the light-emitting area is located is achieved by using second optical fibers of different radii.

[0044] In this embodiment, a second optical fiber is used as a positioning device for fixing the first optical fiber 202 onto the circuit board base plane 204a. This positioning device not only functions as the positioning device in Embodiment 1, but also eliminates the need for optical fiber positioning slots. Simply calculate the diameter of the second optical fiber as required, then directly fix the first optical fiber 202 onto the circuit board base plane 204a, and then fix it as needed. This significantly reduces production costs.

[0045] In the embodiment, the second optical fiber is used as the positioning device, the cross section of the second optical fiber is circular, and the contact of the second optical fiber with the laser chip base positioning surface 203a, the circuit board base plane 204a and the first optical fiber 202 is a straight line. The contact surface is too small, and the fixation is not firm.

[0046] Embodiment 3

[0047] As shown in the drawing, the optical fiber side surface is opposite to the light emitting device for laser shaping. The embodiment is different from embodiment 2 in that: Figure 7

[0048] The angle α between the laser chip base plane 303b and the circuit board base plane 304a is 45°.

[0049] The laser chip 301 is attached to the laser chip base plane 303b, and the angle between the optical axis of the laser 321 emitted by the light emitting area and the laser chip base plane 303b is also 45°. The first laser 321a is incident from the side of the first optical fiber 302, and the second laser 321b is emitted after passing through the center of the first optical fiber 302.

[0050] In the embodiment, the positioning device includes an isolation component, which is an isolation column 305. In the embodiment, the isolation column 305 is rectangular in cross section. In a preferred embodiment, the isolation column 305 is made of the same material as the first optical fiber 302.

[0051] One side of the isolation column 305 is attached to the first optical fiber 302, and the other side is tightly attached to the laser chip base positioning surface 303a. The side of the isolation column 305 close to the circuit board base plane 304a is fixedly arranged on the circuit board base plane 404a.

[0052] In the embodiment, the angle α between the laser chip base plane 303b and the circuit board base plane 304a is 45°. At this time, the angle between the emission angle of the second laser 321b and the horizontal direction is 45°. The second laser 321b emitted at this angle can be used for reflective wavelength conversion devices and other requirements.

[0053] The cross-sectional area of the isolation column 305 is rectangular, the contact surface of the isolation column 305 and the circuit board base plane 304a is a plane, the isolation column 305 is more stable on the circuit board base plane 304a, and the fixation is convenient. The contact surface between the isolation column 305 and the laser chip base positioning surface 203a is also a plane. The attachment operation between the planes is simple, which reduces the difficulty of the assembly process, reduces the error and improves the precision.

[0054] Embodiment 4

[0055] As​Figure 8 and 9 As shown, the light-emitting device with the side of the optical fiber facing the laser shaping device differs from Embodiment 1 in that:

[0056] In this embodiment, the angle α between the laser chip base plane 403b and the circuit board base plane 404a is -45°. The laser chip 401 is attached to the laser chip base plane 403b, and the angle between the optical axis of the laser 421 emitted from the light-emitting area and the circuit board base plane 404a is also -45°. The first laser 421a enters from the side of the first optical fiber 402, passes through the center of the first optical fiber 402, and then exits from the other side of the first optical fiber 402 to form the second laser 421b.

[0057] In this embodiment, the angle α between the laser chip base plane 403b and the circuit board base plane 404a is -45°. Therefore, the angle between the emission angle of the second laser 421b and the circuit board base plane 404a is -45°. The emission angle of the second laser 421b in this embodiment differs from that in Embodiment 1. In this embodiment, the second laser 421b, which was parallel to the circuit board base plane 404a, is emitted in a direction away from the circuit board base plane 404a. This embodiment changes the emission mode of the second laser 421, greatly expanding its application range.

[0058] In this embodiment, such as Figure 8 As shown, the positioning block 405 is in close contact with the positioning surface 403a of the laser chip base. Since the laser 421 emitted by the laser chip 401 needs to be tilted to irradiate the first optical fiber 402, the positioning block 405 is provided with an optical fiber positioning groove 406, which fixes the first optical fiber 402. In this embodiment, the positioning block 405 also needs to ensure that the first laser 421a emitted by the light-emitting area enters from the side of the first optical fiber 402, passes through the center of the first optical fiber 402, and then forms a second laser 421b from the other side of the first optical fiber 402.

[0059] Figure 9 As shown, a light-transmitting groove 407 is provided on one side of the positioning surface 103a of the laser chip base, which is closely attached to the positioning block 405. The light-transmitting groove 407 extends into the positioning block 405, and one end of the light-transmitting groove 407 extending into the positioning block 405 is connected to the optical fiber positioning groove 406.

[0060] In this embodiment, the second laser 421b needs to pass through the center of the first optical fiber 402, the light transmission groove 407 needs to be large enough, and the end of the laser chip 401 with the light-emitting area extends into the light transmission groove 407. The center extension line of the light-emitting area passes through the center of the first optical fiber 402.

[0061] The above detailed description of the specific embodiments of the present application is provided for the purpose of fully and completely disclosing the best mode of the present application, and should not be used to limit the scope of the patent. Any equivalent modifications and variations of the present application that are made in light of the above teachings are also within the scope of the present application.

Claims

1. A light-emitting device for laser shaping of the side of an optical fiber, comprising a laser chip, the laser chip including a light-emitting region, the direction parallel to the junction plane of the light-emitting region being the slow axis, and the direction perpendicular to the junction plane being the fast axis, the light-emitting angle of the fast axis being greater than the light-emitting angle of the slow axis, characterized in that: It also includes a first optical fiber, which is disposed on the side of the laser chip where the light-emitting area is disposed. The plane where the fast axis of the light-emitting area is located is perpendicular to the axial direction of the first optical fiber. The light-emitting area emits laser light toward the side of the first optical fiber, and the laser light passes through the first optical fiber from the side. It also includes a positioning device for positioning the position of the first optical fiber. It also includes a laser chip base and a circuit board base. The laser chip base includes a laser chip base plane, and the circuit board base includes a circuit board base plane. The end of the laser chip base facing the first optical fiber includes a laser chip base positioning surface. The laser chip is fixedly mounted on the laser chip base plane, and the laser chip base is fixedly mounted on the circuit board base plane. The positioning device is fixedly mounted on the laser chip base plane with the laser chip base positioning surface as a reference, and the first optical fiber is fixedly mounted on the circuit board base plane with the positioning device as a reference. The radius of the first optical fiber is R, the distance from the light-emitting area to the plane of the circuit board base is K, the positioning tolerance of the distance from the light-emitting area of ​​the laser chip to the axis of the first optical fiber is M, and the value range of the radius R of the first optical fiber is 6.6M < R < 1.5K.

2. The light-emitting device for laser shaping of the optical fiber side as described in claim 1, characterized in that: The positioning device is a positioning block, and the positioning block is provided with an optical fiber positioning groove. The first optical fiber is fixedly installed in the optical fiber positioning groove. The positioning block is fixedly installed close to the positioning surface of the laser chip base.

3. The light-emitting device for laser shaping of the optical fiber side as described in claim 2, characterized in that: It also includes a light-transmitting slot, which is intersected with the fiber positioning slot. The light-transmitting slot is the channel for the laser emitted from the light-emitting area and allows the laser passing through the first fiber to exit.

4. The light-emitting device for laser shaping of the optical fiber side as described in claim 1, characterized in that: The positioning device includes an isolation component, which is cylindrical. The side of the isolation component closest to the positioning surface of the laser chip base is tightly fitted to the positioning surface of the laser chip base. The isolation component is fixedly mounted on the plane of the circuit board base.

5. The light-emitting device for laser shaping of the optical fiber side as described in claim 4, characterized in that: The first optical fiber is tightly bonded to the side of the isolation component away from the positioning surface of the laser chip base.

6. The light-emitting device for laser shaping of the optical fiber side as described in claim 4, characterized in that: The cross-section of the isolation component is circular or rectangular.

7. The light-emitting device for laser shaping of the fiber side as described in any one of claims 4-6, characterized in that: The isolation component is a second optical fiber.

8. A light source, characterized in that: The light-emitting device for laser-shaped optical fiber sidewalls as described in any one of claims 1-7 is provided with a fluorescent sheet, wherein the light-emitting device for laser-shaped optical fiber sidewalls excites the fluorescent sheet to emit excitation light.

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