air conditioner

Abstract

The application provides an air conditioner, which comprises an indoor unit, an outdoor unit, and a heat dissipation assembly; the indoor unit comprises an indoor heat exchanger and an indoor expansion valve; the outdoor unit comprises a compressor, a four-way valve, an outdoor heat exchanger, an outdoor expansion valve, and an electric control box, and the electric control box is provided with a circuit board; the indoor expansion valve and the outdoor expansion valve are sequentially arranged between the indoor heat exchanger and the outdoor heat exchanger; the compressor is connected with the indoor heat exchanger and the outdoor heat exchanger through the four-way valve to form a refrigeration circuit for circulating flow of refrigerant; the heat dissipation assembly is formed with a refrigerant flow channel, the refrigerant flow channel is connected between the indoor expansion valve and the outdoor expansion valve, and the heat dissipation assembly is used for absorbing heat released by the circuit board by using the refrigerant flowing in the refrigeration circuit. The air conditioner provided by the application can quickly dissipate heat of the circuit board, reduce condensation, improve the use reliability of the circuit board, and improve the operation reliability of the air conditioner.

Description

Technical Field

[0001] The present invention relates to the technical field of air conditioning, and in particular to an air conditioner. Background Art

[0002] Air conditioners are common household appliances in our daily lives. They come in various forms, including residential and commercial multi-split units. Air conditioners typically consist of an indoor unit and an outdoor unit, with the indoor unit installed indoors and the outdoor unit installed outdoors.

[0003] Existing outdoor units typically include a housing, along with components such as a compressor, heat exchanger, outdoor fan, and electrical control box, housed within it. With the increasing popularity of air conditioners, the upper temperature limit for their use is becoming increasingly demanding. Modern air conditioners are being used in a wider range of applications, and the upper temperature limit required is also increasing, such as 54°C high-temperature cooling. During operation, the variable-frequency drive module (VFD) needs to be cooled. Traditionally, this cooling method involves air cooling, where air passing through a heat exchanger is directed to an air-cooled radiator to dissipate heat. However, in high ambient temperatures, the air passing through the heat exchanger is already very hot, making it difficult to dissipate heat effectively from the drive module. This can lead to overheating and shutdown, or even burnout. Consequently, refrigerant cooling is now being adopted in an increasing number of air conditioners. Cooling the module using condensed liquid refrigerant or throttled gas-liquid two-phase refrigerant provides excellent heat dissipation.

[0004] However, in actual use, due to the relatively low temperature of the refrigerant, condensation can form on the circuit boards in the electrical control box as the low-temperature refrigerant absorbs heat. This can cause short circuits in the circuit boards and reduce reliability. Therefore, the present invention aims to design an air conditioning technology that meets the heat dissipation requirements of the electrical control box while improving the reliability of the air conditioner. Summary of the Invention

[0005] The present invention provides an air conditioner, which enables a circuit board to quickly dissipate heat, improves the service reliability of the circuit board, and thus improves the operating reliability of an outdoor unit of the air conditioner.

[0006] In some embodiments of the present application, the air conditioner includes:

[0007] An indoor unit, comprising an indoor heat exchanger and an indoor expansion valve;

[0008] An outdoor unit comprising a compressor, a four-way valve, an outdoor heat exchanger, an outdoor expansion valve, and an electrical control box, wherein the electrical control box is provided with a circuit board; wherein the indoor expansion valve and the outdoor expansion valve are sequentially provided between the indoor heat exchanger and the outdoor heat exchanger, and the compressor is connected to the indoor heat exchanger and the outdoor heat exchanger via the four-way valve to form a refrigeration circuit for circulating refrigerant;

[0009] a heat dissipation assembly having a refrigerant flow channel formed therein, the refrigerant flow channel being connected between the indoor expansion valve and the outdoor expansion valve, the heat dissipation assembly being configured to utilize the refrigerant flowing in the refrigeration circuit to absorb heat released by the circuit board;

[0010] Wherein, when the air conditioner is in cooling mode, the outdoor expansion valve is in a fully open state; when the air conditioner is in heating mode, the indoor expansion valve is in a fully open state.

[0011] By arranging expansion valves on both the indoor heat exchanger and the outdoor heat exchanger and connecting a heat dissipation component between the two expansion valves, the heat dissipation component can use the refrigerant to directly absorb the heat released by the circuit board. The heat released by the circuit board is quickly absorbed and taken away by the refrigerant flowing through the heat dissipation component, and the refrigerant continuously flows through the heat dissipation component, and the heat generated by the circuit board can be effectively taken away by the circulating refrigerant to meet the heat dissipation requirements of the circuit board; and by controlling the outdoor or indoor expansion valve to be fully open, the temperature of the refrigerant entering the heat dissipation component can be higher than the outdoor ambient temperature, reducing condensation caused by the temperature being lower than the ambient temperature, thereby avoiding or reducing the occurrence of circuit board short circuit caused by condensation, thereby meeting the heat dissipation requirements of the electronic control box and improving the reliability of the air conditioner operation.

[0012] In some embodiments of the present application, the air conditioner further comprises:

[0013] a first temperature sensor, the first temperature sensor being used to detect the temperature Tsc of the refrigerant flowing through the heat dissipation component;

[0014] a second temperature sensor, the second temperature sensor being used to detect an outdoor temperature Ta;

[0015] When Ta-Tsc>ΔT1 and lasts for t1 time, the compressor is stopped; ΔT1 is a first set temperature difference value, and t1 is a first set time length.

[0016] In some embodiments of the present application, after the compressor is shut down, it is restarted after an interval of t2; wherein t2 is a second set time.

[0017] In some embodiments of the present application, if the compressor stops more than N1 times within a time period of t3, a shutdown alarm is issued; wherein t3 is a third set time period.

[0018] In some embodiments of the present application, when Ta-Tsc>ΔT2 and lasts for t4 time, the compressor is stopped; wherein ΔT2 is the second set temperature difference, t4 is the fourth set time, ΔT2>ΔT1, t1>t4.

[0019] In some embodiments of the present application, the air conditioner further includes:

[0020] a third temperature sensor, configured to detect a temperature Tfin of the circuit board;

[0021] In the case of Tfin-Ta<ΔT3, when Ta-Tsc>ΔT1 and lasts for t1 time or when Ta-Tsc>ΔT2 and lasts for t4 time, the compressor is stopped; wherein ΔT3 is the third set temperature difference value.

[0022] In some embodiments of the present application, the heat dissipation component includes:

[0023] A heat conducting plate, the heat conducting plate is used to conduct heat;

[0024] a refrigerant heat dissipation component, wherein a refrigerant flow channel for the flow of refrigerant is formed in the refrigerant heat dissipation component;

[0025] The heat conducting plate is sandwiched between the refrigerant heat dissipation component and the circuit board, and is thermally connected to the refrigerant heat dissipation component and the circuit board respectively. The heat conducting plate can be made of a material with excellent thermal conductivity such as aluminum or copper.

[0026] In some embodiments of the present application, the refrigerant heat dissipation component includes:

[0027] A heat conducting block, used for conducting heat;

[0028] a refrigerant pipe, the refrigerant pipe forming the refrigerant flow channel;

[0029] Wherein, the refrigerant pipe is arranged on the heat conduction block, and the heat conduction block is arranged on the heat conduction plate.

[0030] In some embodiments of the present application, the heat conductive block may also be made of materials with excellent thermal conductivity such as aluminum or copper.

[0031] In some embodiments of the present application, a thermally conductive gasket is further provided between the heat conducting plate and the refrigerant heat dissipation component.

[0032] In some embodiments of the present application, a slot is further provided on the heat conducting plate, and the heat dissipation assembly is mounted in the slot.

[0033] In some embodiments of the present application, two guide portions are provided on the heat conducting plate, the guide portions protrude from the heat conducting plate, and the slot is formed between the two guide portions.

[0034] In some embodiments of the present application, the two guide portions are arranged to be inclined away from each other.

[0035] In some embodiments of the present application, a mounting hole is provided on the circuit board, and a threaded hole is provided on the heat conduction plate; the heat dissipation assembly also includes a guide cover, which is inserted into the mounting hole, and the screw passes through the guide cover and is threadedly connected to the threaded hole.

[0036] In some embodiments of the present application, a clamping claw is provided on the outer wall of the guide cover, and the guide cover is clamped in the mounting hole through the clamping claw.

[0037] In some embodiments of the present application, the guide cover is made of insulating materials such as plastic.

[0038] In some embodiments of the present application, the end of the guide cover located outside the circuit board is a bell-mouth structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 This is the schematic diagram of the refrigeration circuit of the air conditioner;

[0040] Figure 2 yes Figure 1 Assembly drawing of the central electronic control box and heat dissipation components;

[0041] Figure 3 This is an exploded view of the heat dissipation components in the air conditioner;

[0042] Figure 4 yes Figure 3 One of the structural diagrams of the middle heat conducting plate;

[0043] Figure 5 yes Figure 3 Structural diagram of the middle heat conducting plate (part 2);

[0044] Figure 6 This is an exploded view of the assembly of the electric control box and heat dissipation components in the air conditioner;

[0045] Figure 7 yes Figure 6 Schematic diagram of the structure of the middle guide cover. DETAILED DESCRIPTION

[0046] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0047] In the description of this application, it should be understood that the terms "center", "up", "down", "front", "back", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on this application.

[0048] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0049] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0050] This embodiment provides an air conditioner that uses a compressor, a condenser, an expansion valve, and an evaporator to perform a cooling and heating cycle. The cooling and heating cycle includes a series of processes involving compression, condensation, expansion, and evaporation, and supplies a refrigerant medium to the conditioned and heat-exchanged air.

[0051] The compressor compresses high-temperature, high-pressure refrigerant gas and discharges the compressed gas. The discharged refrigerant gas flows into the condenser. The condenser condenses the compressed refrigerant into a liquid phase, releasing heat into the surrounding environment through the condensation process.

[0052] The expansion valve expands the high-temperature, high-pressure liquid refrigerant condensed in the condenser into a low-pressure, gas-liquid two-phase refrigerant. The evaporator evaporates the refrigerant expanded in the expansion valve and returns the low-temperature, low-pressure refrigerant gas to the compressor. The evaporator achieves cooling by utilizing the latent heat of evaporation to exchange heat with the material being cooled. Throughout this cycle, the air conditioner regulates the temperature of the indoor space.

[0053] like Figure 1-Figure 2 As shown, the outdoor unit of the air conditioner refers to the part of the refrigeration cycle including the compressor 1, the outdoor heat exchanger 2 and the outdoor fan (not shown), the indoor unit of the air conditioner includes the indoor heat exchanger 3 and the indoor fan (not shown), and the expansion valve (such as an electronic expansion valve) can be provided in the indoor unit or the outdoor unit.

[0054] The indoor heat exchanger 3 and the outdoor heat exchanger 2 function as a condenser or an evaporator. When the indoor heat exchanger 3 functions as a condenser, the air conditioner performs a heating mode, and when the indoor heat exchanger 3 functions as an evaporator, the air conditioner performs a cooling mode.

[0055] The indoor heat exchanger 3 and the outdoor heat exchanger 2 are switched to function as a condenser or an evaporator by generally using a four-way valve 10 . For details, please refer to the settings of conventional air conditioners and will not be described in detail here.

[0056] The refrigeration working principle of the air conditioner is: the operation of compressor 1 makes the indoor heat exchanger 3 (in the indoor unit, this is the evaporator) in an ultra-low pressure state, and the liquid refrigerant in the indoor heat exchanger 3 evaporates rapidly to absorb heat. The air blown out by the indoor fan is cooled by the indoor heat exchanger 3 coil and becomes cold air blown into the room. The evaporated refrigerant is pressurized by compressor 1 and condensed into liquid under the high-pressure environment of outdoor heat exchanger 2 (in the outdoor unit, this is the condenser), releasing heat. The heat is dissipated into the atmosphere through the outdoor fan. This cycle achieves the cooling effect.

[0057] The air conditioner's heating principle works as follows: The gaseous refrigerant is pressurized by compressor 1, becoming a high-temperature, high-pressure gas. It then enters indoor heat exchanger 3 (the condenser), where it condenses and liquefies, releasing heat and becoming a liquid. This heats the indoor air, thereby raising the indoor temperature. The liquid refrigerant is then decompressed by the expansion valve and enters outdoor heat exchanger 2 (the evaporator). It evaporates, absorbs heat, and becomes a gas, absorbing heat from the outdoor air (making the outdoor air even cooler). It then re-enters compressor 1 to begin the next cycle.

[0058] Among them, for the outdoor unit, since it needs to be installed outdoors, a circuit board 41 is configured in the electric control box 4 of the outdoor unit and is powered on. In order to meet the heat dissipation and cooling of the circuit board 41 while avoiding or reducing condensation on the circuit board 41, the following design is adopted.

[0059] An indoor expansion valve 31 and an outdoor expansion valve 21 are sequentially provided between the indoor heat exchanger 3 and the outdoor heat exchanger 2 .

[0060] The air conditioner further includes a heat dissipation assembly 5. A refrigerant flow channel is formed in the heat dissipation assembly 5 and is connected between the indoor expansion valve 31 and the outdoor expansion valve 21. The heat dissipation assembly 5 is configured to absorb heat released by the circuit board using the refrigerant flowing in the refrigeration circuit.

[0061] When the air conditioner is in cooling mode, the outdoor expansion valve 21 is in a fully open state; when the air conditioner is in heating mode, the indoor expansion valve 31 is in a fully open state.

[0062] Specifically, the heat dissipation component 5 uses the refrigerant flowing in the refrigeration circuit to dissipate heat from the circuit board 41. The heat released by the circuit board 41 will be directly absorbed by the heat dissipation component 5, and the circulating refrigerant will quickly remove the heat, thereby meeting the requirement of rapid heat dissipation of the circuit board 41.

[0063] At the same time, in order to avoid or reduce condensation on the circuit board surface during the heat dissipation process, the indoor expansion valve 31 and the outdoor expansion valve 21 are used to control the throttling method. The following describes the different operating modes of the air conditioner.

[0064] During refrigeration operation, the exhaust gas from the compressor 1 passes through the four-way valve 10 and enters the outdoor heat exchanger 2, where it condenses and releases heat. Since the condensation process releases heat to the outdoor environment, the temperature of the condensed liquid refrigerant is higher than the ambient temperature. The condensed liquid refrigerant enters the refrigerant flow channel through the outdoor expansion valve 21. The outdoor expansion valve 21 is fully open and does not throttle, so the temperature of the refrigerant entering the refrigerant flow channel is higher than the ambient temperature. At this time, there will be no condensation on the surface of the circuit board 41. The refrigerant then enters the indoor side, and after throttling through the indoor expansion valve 31, it enters the indoor heat exchanger 3 to evaporate and absorb heat, thereby producing a refrigeration effect. The evaporated refrigerant returns to the outdoor side and enters the compressor 1 to complete a refrigeration cycle.

[0065] During heating operation, the exhaust from compressor 1 passes through four-way valve 10 and enters indoor heat exchanger 3, where it condenses and releases heat, producing a heating effect. The refrigerant condenses and releases heat to the indoor environment. The temperature of the condensed liquid refrigerant is higher than the indoor ambient temperature. During heating operation, the indoor temperature is generally higher than the outdoor temperature, and the refrigerant temperature is also much higher than the outdoor ambient temperature. At this time, the indoor expansion valve 31 is fully open and does not throttle. Therefore, after the refrigerant returns to the outdoor side through indoor expansion valve 31 and enters the heat dissipation component 5, the refrigerant temperature remains higher than the ambient temperature, preventing condensation. The refrigerant then enters the outdoor expansion valve 21 for throttling. After throttling, it enters the outdoor heat exchanger 2 for evaporation, and then returns to compressor 1 to complete the heating cycle.

[0066] Since the temperature of the circuit board 41 is higher than the refrigerant in the heat dissipation component 5 during operation (the temperature of the variable frequency drive module used to control the operation of the compressor 1 on the circuit board will exceed 100 degrees), the circulating refrigerant in the heat dissipation component 5 can promptly and effectively remove the heat generated by the circuit board 41.

[0067] By adopting the above control method, while meeting the heat dissipation requirements of the circuit board 41, condensation caused by the low temperature of the heat dissipation component 5 can be avoided, thereby avoiding short circuit of the circuit board 41 caused by condensation, thereby improving the reliability of use.

[0068] In other embodiments of the present application, in order to more reliably achieve heat dissipation of the circuit board 41, the air conditioner further includes: a first temperature sensor 501 and a second temperature sensor 502. The first temperature sensor 501 is used to detect the temperature Tsc of the refrigerant flowing through the heat dissipation component 5; the second temperature sensor 502 is used to detect the outdoor temperature Ta.

[0069] During the actual operation of the air conditioner, the operation of the compressor 1 can be controlled based on the temperature information detected by the first temperature sensor 501 and the second temperature sensor 502. Specifically, when Ta-Tsc>△T1 and lasts for t1 time, the operation of the compressor is stopped; △T1 is the first set temperature difference value, and t1 is the first set time.

[0070] Under normal circumstances, Tsc>Ta does not cause condensation. However, under certain abnormal conditions, Tsc<Ta may cause condensation. Because Ta is only the dry-bulb temperature of the ambient temperature and has a certain difference from the external dew point temperature Tw, and the lower the humidity, the greater the difference, so it is impossible to directly determine whether condensation has occurred by Tsc<Ta.

[0071] At this point, a temperature threshold ΔT1 and a time threshold T1 are set. When Ta - Tsc > ΔT1 and persists for t1, condensation may form on the heat sink 5. In this case, the compressor 1 will be shut down for protection. Because Ta is normally less than Tsc, if Ta exceeds Tsc and the difference is greater than a certain threshold ΔT1 and persists for a certain period of time t1, some abnormality must have occurred. Shutting down the compressor at this time can effectively protect the reliability of the unit.

[0072] Compressor 1 automatically restarts after t2 minutes after shutdown, where t2 is the second set duration. After compressor 1 restarts and stabilizes, the relationship between Ta and Tsc is reassessed. If Ta - Tsc > ΔT1 and persists for t1, condensation may still be present in heat dissipation assembly 5, and a further shutdown protection is initiated. This restart after shutdown is intended to prevent erroneous shutdowns and to provide a buffer period for the unit to recover from condensation under certain operating conditions.

[0073] For example, when heating is performed when the indoor temperature is very low, the temperature of the refrigerant after condensation in the indoor environment is low in the initial stage, resulting in Ta-Tsc>△T1 and lasting for t1 time, which will cause condensation and the unit to shut down. However, as the indoor temperature rises during the operation of the unit, the temperature of the condensed refrigerant rises after restarting, and condensation will not occur. The shutdown condition can be exited again, and the unit can operate normally.

[0074] If compressor 1 stops more than N1 times within a time period t3, a shutdown alarm is issued. T3 is the third set time period. If the above shutdown occurs a certain number of times within t3, it indicates that the condensation cannot be repaired automatically and some abnormality has occurred in the unit, requiring a shutdown alarm and waiting for maintenance personnel to arrive.

[0075] In another embodiment, when the Tsc temperature is particularly low and the temperature difference with Ta increases, condensation becomes more severe and the duration can be reduced, thus reaching the shutdown protection condition. Specifically, a second threshold ΔT2 and duration t2 are set. In this case, in addition to the shutdown condition when Ta - Tsc > ΔT1 and lasts for t1, the unit will also shut down for protection when Ta - Tsc > ΔT2 and lasts for t2. In this case, ΔT2 > ΔT1 and t2 < t1. ΔT2 is the second set temperature difference, and t4 is the fourth set duration, with ΔT2 > ΔT1 and t1 > t4.

[0076] In a certain embodiment, the air conditioner further includes: a third temperature sensor 503, the third temperature sensor 503 is used to detect the temperature Tfin of the circuit board; wherein, when Tfin-Ta<△T3, when Ta-Tsc>△T1 and continues for t1 time or when Ta-Tsc>△T2 and continues for t4 time, the operation of the compressor is stopped; wherein △T3 is a third set temperature difference value.

[0077] Specifically, when comparing Tsc with Ta, even if condensation conditions are reached, only the heat sink 5 will produce condensation; the circuit board 41 may not have condensed yet and will not be damaged. Tfin represents the temperature of the circuit board 41. Without heat dissipation, the circuit board 41 may exceed 100°C. Even after heat dissipation, it will far exceed the ambient temperature Ta. Therefore, a third threshold ΔT3 can be set. When the above shutdown conditions are met, the shutdown protection must also meet Tfin - Ta Δ < T3. This minimizes false alarms.

[0078] Among them, △T1, △T2, △T3, t1, t2, t3 and t4 are obtained through experiments based on different models and are not limited here.

[0079] In some embodiments of the present application, in order to allow the heat released by the circuit board 41 to be directly and efficiently absorbed by the heat dissipation component 5, as shown in FIG. Figure 3-Figure 5 The heat dissipation assembly 5 shown includes a heat conducting plate 51 and a refrigerant heat dissipation component 52 .

[0080] The heat conducting plate 51 is used to conduct heat and can be made of a material with good thermal conductivity, such as aluminum or copper.

[0081] The refrigerant heat dissipation component 52 is formed with a refrigerant flow channel for the refrigerant to flow; the refrigerant in the refrigeration circuit flows into the refrigerant flow channel and absorbs heat to remove the heat.

[0082] The heat conducting plate 51 is sandwiched between the refrigerant heat sink 52 and the circuit board 41, and is thermally conductively connected to both the refrigerant heat sink 52 and the circuit board 41. Heat generated by the circuit board 41 is directly absorbed by the heat conducting plate 51, which then transfers the heat to the refrigerant heat sink 52 using its excellent thermal conductivity. Because the refrigerant flowing through the refrigerant heat sink 52 absorbs the heat transferred from the heat conducting plate 51, the refrigerant directly absorbs heat from the circuit board 41, achieving rapid heat dissipation.

[0083] In other embodiments of the present application, the refrigerant heat dissipation component 52 includes: a heat conductive block 521 and a refrigerant pipe 522 .

[0084] Similarly, the heat conducting block 521 can also be made of a material with excellent thermal conductivity, such as aluminum or copper, and is used to conduct heat. The refrigerant pipe 522 is used to transport the refrigerant. The refrigerant pipe 522 is mounted on the heat conducting block 521, which is mounted on the heat conducting plate 51.

[0085] Heat transfer plate 51 absorbs heat generated by circuit board 41 and transfers it to refrigerant pipe 522. The refrigerant flowing through refrigerant pipe 522 absorbs the heat and quickly removes it. Refrigerant pipe 522 is connected between outdoor heat exchanger 2 and indoor heat exchanger 3, utilizing the refrigerant flowing between these two locations to absorb heat.

[0086] In order to increase the heat conduction area, the refrigerant tube 522 can be clamped between the heat conduction block 521 and the heat conduction plate 51. On the one hand, one side of the refrigerant tube 522 is in direct contact with the heat conduction plate 51 to absorb heat. On the other hand, the heat conduction block 521 absorbs the heat conducted by the heat conduction plate 51 and is absorbed by the heat conduction on the other side of the refrigerant tube 522, thereby improving the heat conduction efficiency.

[0087] In addition, in order to increase the heat conduction area of ​​the refrigerant tube 522, a heat conduction block 521 can be used to wrap the refrigerant tube 522, that is, a groove is formed in the heat conduction block 521, and the refrigerant tube 522 passes through the groove, so that the tube wall of the refrigerant tube 522 is evenly in good contact with the heat conduction block 521. In this way, the heat conduction area of ​​the refrigerant tube 522 can also be effectively increased to improve the heat dissipation efficiency.

[0088] In some embodiments of the present application, the refrigerant pipe 522 may be connected in series to the refrigeration circuit of the air conditioner. In this way, after the compressor 1 is started, refrigerant flows through the refrigerant pipe 522, thereby maximizing heat dissipation performance.

[0089] In some embodiments of the present application, a thermal pad 53 is further provided between the heat conducting plate 51 and the refrigerant heat dissipation component 52. Specifically, the thermal pad 53 can conduct heat between the heat conducting plate 51 and the refrigerant heat dissipation component 52 to improve the heat transfer efficiency between the two.

[0090] In order to facilitate the connection between the heat conducting plate 51 and the heat dissipation assembly 5, a card slot 511 is further provided on the heat conducting plate 51, and the heat dissipation assembly 5 is carded in the card slot 511. Specifically, the card-mounting method is adopted so that the heat conducting plate 51 and the heat dissipation assembly 5 can be quickly assembled together.

[0091] The heat conducting plate 51 is provided with two guides 512 that protrude from the plate 51 and form a slot 511 between the two guides 512. The heat conducting block 521 of the refrigerant heat dissipation component 52 is guided by the guides 512 on both sides and is locked in the slot 511, completing the assembly of the heat conducting plate 51 and the refrigerant heat dissipation component 52.

[0092] A positioning pin 513 may be provided between the two slots 511 on the heat conducting plate 51. Correspondingly, a positioning hole 5211 is provided on the heat conducting block 521. The positioning pin 513 is inserted into the positioning hole 5211 for positioning, facilitating quick and accurate assembly by the operator. Furthermore, two guide portions 512 are arranged at an angle with respect to each other, so that the heat conducting block 521 is guided and installed via the two inclined guide portions 512.

[0093] In some embodiments of the present application, regarding the installation position of the heat dissipation component 5, as shown in FIG. Figure 2 As shown, the heat dissipation component 5 can be directly mounted on the front area of ​​the circuit board 1 .

[0094] Or, as Figure 6 and Figure 7As shown, the heat sink assembly 5 is mounted on the back of the circuit board 41. The circuit board 41 is provided with a mounting hole 411, and the heat conducting plate 51 is provided with a threaded hole (not labeled). The heat sink assembly 5 also includes a guide cover 55, which is inserted into the mounting hole 411. The screw 54 passes through the guide cover 55 and is threaded into the threaded hole.

[0095] Specifically, during the actual assembly process, because the heat dissipation component 5 needs to be fixed by screws 54 from the front side of the circuit board 41, in order to prevent the fixing tool from accidentally damaging the electrical components on the circuit board 41 around the screw when fixing the screw 54, a guide cover 55 for the screw 54 is designed on the circuit board 41. The guide cover 55 is used to guide the screw 54 through the mounting hole 411 on the circuit board 41, and then the screw 54 is connected to the heat conducting plate 51 below, so that the heat conducting plate 51 is fixed to the bottom of the circuit board 41.

[0096] In some embodiments, the outer wall of the guide cover 55 is provided with a claw 551, which engages the guide cover 55 in the mounting hole 411. Specifically, the claw 551 engages the guide cover 55 in the mounting hole 411, facilitating quick assembly by the operator. The guide cover 55 is secured with the claw 551, making it easy to install and unlikely to fall off, thereby effectively protecting the circuit board 41.

[0097] In one embodiment of the present application, the installation position of the heat dissipation assembly 5 is arranged at the bottom of the electrical control box 4. When the screw 54 is fixed, the screw 54 is placed in the guide cover 55, and the screw 54 falls into the screw hole of the heat conduction plate 51 along the guide cover 55. The screwdriver is used to tighten the screw 54 along the guide cover 55.

[0098] In one embodiment, the guide cover 55 is made of an insulating material such as plastic to prevent interference with the circuits of the circuit board 41. In another embodiment, the end of the guide cover 55 located outside the circuit board 41 is formed into a bell-mouth structure 552. The bell-mouth structure automatically guides the inserted screws 54 and also reserves space for the heads of the screws 54.

[0099] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any other manner. Any person skilled in the art may utilize the above-disclosed technical content to modify or modify the present invention into equivalent embodiments. However, any simple modifications, equivalent variations, and modifications to the above embodiments that do not depart from the technical content of the present invention and are based on the technical essence of the present invention remain within the scope of protection of the present invention.

Claims

1. An air conditioner, characterized in that: include: An indoor unit, comprising an indoor heat exchanger and an indoor expansion valve; An outdoor unit comprising a compressor, a four-way valve, an outdoor heat exchanger, an outdoor expansion valve, and an electrical control box, wherein the electrical control box is provided with a circuit board; wherein the indoor expansion valve and the outdoor expansion valve are sequentially provided between the indoor heat exchanger and the outdoor heat exchanger, and the compressor is connected to the indoor heat exchanger and the outdoor heat exchanger via the four-way valve to form a refrigeration circuit for circulating refrigerant; a heat dissipation assembly having a refrigerant flow channel formed therein, the refrigerant flow channel being connected between the indoor expansion valve and the outdoor expansion valve, the heat dissipation assembly being configured to utilize the refrigerant flowing in the refrigeration circuit to absorb heat released by the circuit board; Wherein, when the air conditioner is in cooling mode, the outdoor expansion valve is in a fully open state; when the air conditioner is in heating mode, the indoor expansion valve is in a fully open state; The air conditioner further comprises: a first temperature sensor, the first temperature sensor being used to detect the temperature Tsc of the refrigerant flowing through the heat dissipation component; a second temperature sensor, the second temperature sensor being used to detect an outdoor temperature Ta; a third temperature sensor, configured to detect a temperature Tfin of the circuit board; When Ta-Tsc>ΔT1 and lasts for t1 time, the compressor is stopped; ΔT1 is the first set temperature difference value, and t1 is the first set time length; When Ta-Tsc>ΔT2 and lasts for t4, the compressor is stopped; wherein ΔT2 is the second set temperature difference, t4 is the fourth set time, ΔT2>ΔT1, t1>t4; When Tfin-Ta<ΔT3, when Ta-Tsc>ΔT1 and lasts for t1 time or when Ta-Tsc>ΔT2 and lasts for t4 time, the compressor is stopped; wherein ΔT3 is the third set temperature difference value.

2. The air conditioner according to claim 1, characterized in that After the compressor is shut down, it is restarted after an interval of t2; wherein t2 is a second set time.

3. The air conditioner according to claim 2, characterized in that If the compressor stops more than N1 times within the time period t3, a shutdown alarm will be issued; wherein t3 is the third set time period.

4. The air conditioner according to any one of claims 1 to 3, characterized in that: The heat dissipation component includes: A heat conducting plate, the heat conducting plate is used to conduct heat; a refrigerant heat dissipation component, wherein the refrigerant flow channel for the refrigerant to flow is formed in the refrigerant heat dissipation component; The heat conducting plate is sandwiched between the refrigerant heat dissipation component and the circuit board, and the heat conducting plate is thermally connected to the refrigerant heat dissipation component and the circuit board respectively.

5. The air conditioner according to claim 4, characterized in that The refrigerant heat dissipation component includes: A heat conducting block, used for conducting heat; a refrigerant pipe, the refrigerant pipe forming the refrigerant flow channel; Wherein, the refrigerant pipe is arranged on the heat conduction block, and the heat conduction block is arranged on the heat conduction plate.

6. The air conditioner according to claim 4, characterized in that The heat conducting plate is further provided with a slot, and the heat dissipation component is mounted in the slot.

7. The air conditioner according to claim 4, characterized in that The circuit board is provided with a mounting hole, and the heat conducting plate is provided with a threaded hole; the heat dissipation assembly further comprises a guide cover, the guide cover is inserted into the mounting hole, and a screw passes through the guide cover and is threadedly connected in the threaded hole.

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