Mask components

Abstract

A mask assembly includes a mask and a blocking rod. The mask includes a pattern area in which an opening is formed and extends in a first direction. The blocking rod is arranged below the mask and overlaps with a first side portion of the mask. The mask further includes a pseudo opening area and an opening area. The pseudo opening area is arranged on the first side portion of the mask in the first direction and has an opening formed therein. The opening area is arranged on a second side portion of the mask opposite to the first side portion in the first direction and corresponds to the pseudo opening area respectively. The number of openings per unit area in each of the pseudo opening area and the opening area is less than the number of openings per unit area in the pattern area.

Description

Technical Field

[0001] Various embodiments of the present disclosure generally relate to a mask assembly and more particularly to a mask assembly for depositing an organic light emitting layer. Background Art

[0002] Flat panel display devices are used as display devices replacing cathode ray tube display devices due to their light and thin characteristics. As representative examples of such flat panel display devices, there are liquid crystal display devices and organic light emitting diode display devices.

[0003] The organic light emitting diode display device may include a display area for displaying an image through a first surface of the display device and a module area in which an optical module is arranged on a second surface of the display device. Recently, an organic light emitting layer may be provided in the module area so that an image may be displayed even in the module area. In this case, since the optical module needs to be operated by using external light incident from the first surface, a transmission window may be formed in the module area so that external light may pass through the organic light emitting diode display device. External light may pass through the organic light emitting diode display device through the transmission window. For example, the display area may include pixel areas arranged at equal intervals and in which organic light emitting layers are respectively formed, and the module area may include pixel areas in which organic light emitting layers are respectively formed and transmission areas in which transmission windows are respectively formed. In other words, the number of pixel areas per unit area in the display area and the module area may be different from each other.

[0004] A fine metal mask can be used to deposit the organic light emitting layer, and a plurality of openings can be formed in the mask. The openings can correspond to pixel areas. In this case, the portion corresponding to the display area of ​​the organic light emitting diode display device is defined as the first portion of the mask, and the portion corresponding to the module area of ​​the organic light emitting diode display device is defined as the second portion of the mask. Since the number of pixel areas per unit area in the display area and the module area is different from each other, the number of openings per unit area in the first and second portions of the mask may be different from each other. When the mask is stretched and fixed to the frame, since the number of openings per unit area in the first and second portions is different from each other, deformation of the mask (e.g., bending phenomenon) may occur, and the organic light emitting layer may not be accurately formed in each of the pixel areas. Therefore, it is necessary to develop a novel mask assembly to deposit the organic light emitting layer substantially without deformation. Summary of the invention

[0005] Some embodiments provide a mask assembly for depositing an organic light emitting layer.

[0006] According to some embodiments, the mask assembly includes a mask and a blocking rod. The mask includes a pattern area in which an opening is formed and extends in a first direction. The blocking rod is arranged below the mask and overlaps with a first side portion of the mask. The blocking rod extends in the first direction. The mask further includes a pseudo opening area and an opening area. The pseudo opening area is arranged on the first side portion of the mask in the first direction and has an opening formed therein. The opening area is arranged on a second side portion of the mask opposite to the first side portion in the first direction and corresponds to the pseudo opening area respectively. The opening area has an opening formed therein. The number of the openings per unit area in each of the pseudo opening area and the opening area is less than the number of the openings per unit area in the pattern area.

[0007] In an embodiment, the number of the openings formed in each of the dummy opening regions may be equal to the number of the openings formed in each of the opening regions.

[0008] In an embodiment, a shape in which the openings formed in each of the dummy opening regions may be arranged and a shape in which the openings formed in each of the opening regions may be arranged may be identical and symmetrical to each other.

[0009] In an embodiment, the pattern region may be located between two dummy opening regions adjacent to each other in the first direction among the dummy opening regions on the first side.

[0010] In an embodiment, the deposition material may not pass through the opening formed in the pattern region overlapping the first side portion and the opening formed in the dummy opening region.

[0011] In an embodiment, the blocking bar may overlap the opening formed in the pattern region overlapping the first side portion and the opening formed in the dummy opening region.

[0012] In an embodiment, the pattern area may be located between two opening areas adjacent to each other in the first direction among the opening areas on the second side portion.

[0013] In an embodiment, the deposition material may pass through the opening formed in the pattern region overlapping the second side, the opening formed in the opening region, and the opening formed in the pattern region not overlapping the first side and the second side.

[0014] In an embodiment, the pattern area may surround at least a portion of each of the dummy opening area and the opening area.

[0015] In an embodiment, the mask assembly may further include support rods disposed below the mask. The support rods may each extend in a second direction orthogonal to the first direction and may be spaced apart from each other in the first direction.

[0016] In an embodiment, the support bars may be spaced apart from each other at a first interval, and the support bars may be disposed below the blocking bars.

[0017] In an embodiment, the deposition material may not pass through the openings formed in the pattern region overlapping the support rods and the barrier rods.

[0018] In an embodiment, one of the support bars may extend to overlap a portion between two dummy opening areas adjacent to each other in the first direction among the dummy opening areas on the first side and a portion between two opening areas facing the two dummy opening areas.

[0019] In an embodiment, the mask assembly may further include a mask frame disposed under the mask and may be fastened to both sides of each of the blocking bars and both sides of each of the supporting bars. The mask frame may have an opening exposing the pattern area of ​​the mask.

[0020] In an embodiment, the mask may further include fixing areas located in upper and lower portions of the pattern area, the fixing areas face each other in the first direction, and a portion of each of the fixing areas overlaps the mask frame.

[0021] In an embodiment, the mask may include first to nth masks (where n is an integer greater than 1), and the kth mask and the (k+1)th mask (where k is an integer greater than or equal to 1 and less than n) among the first to nth masks may be spaced apart from each other in a second direction orthogonal to the first direction.

[0022] In an embodiment, the blocking rods may include first to m-th blocking rods (where m is an integer greater than 1), and the j-th blocking rod (where j is an integer greater than or equal to 1 and less than or equal to m) among the first to m-th blocking rods may overlap with the first side of the (k+1)-th mask without overlapping with the second side of the k-th mask.

[0023] In an embodiment, the opening of the pattern area adjacent to the dummy opening area in a second direction orthogonal to the first direction may overlap with the blocking bar.

[0024] In an embodiment, no opening may be formed in the pattern region adjacent to the dummy opening region in the second direction.

[0025] According to some embodiments, the mask assembly includes a mask and a blocking rod. The mask includes a pattern area in which an opening is formed and extends in a first direction. The blocking rod is disposed below the mask and overlaps with a first side portion of the mask. The blocking rod extends in the first direction. The mask further includes a pseudo opening area and an opening area. The pseudo opening area is arranged in the first side portion of the mask in the first direction and has an opening formed therein. The opening area is arranged on a second side portion of the mask opposite to the first side portion in the first direction and corresponds to the pseudo opening area, respectively. The opening area has an opening formed therein. The number of the openings per unit area in each of the pseudo opening area and the opening area is less than the number of the openings per unit area in the pattern area. The size of each of the openings formed in the opening area is different from the size of each of the openings formed in the pattern area.

[0026] According to an embodiment of the present disclosure, the mask assembly may include a dummy opening region and a pattern region surrounding at least a portion of each of the dummy opening regions. In this case, the first side portion and the second side portion of the mask may be symmetrical to each other, and no bending phenomenon may occur even when the fixed region is clamped and stretched. Therefore, when the organic light emitting layer is deposited by using the mask assembly, the opening may accurately correspond to the sub-pixel region, and deposition failure of the organic light emitting layer may not occur.

[0027] According to an embodiment of the present disclosure, the mask assembly may include a mask having a blocking area. In this case, since no opening is formed in the blocking area, the blocking bar can ensure a manufacturing tolerance as large as the blocking area. Therefore, the blocking bar can easily cover the non-display area, and the organic light-emitting layer may not be deposited on the non-display area. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Various embodiments may be understood in more detail from the following description in conjunction with the accompanying drawings, in which:

[0029] Figure 1 is a plan view showing a mask assembly according to an embodiment of the present disclosure;

[0030] Figure 2 It is shown Figure 1 A plan view of a rear surface of a mask assembly;

[0031] Figure 3 Is used to describe Figure 1 A plan view of a mask frame, a support rod and a blocking rod included in a mask assembly;

[0032] Figure 4 It is shown Figure 1 A perspective view of a mask frame included in a mask assembly;

[0033] Figure 5 It is shown Figure 1 A perspective view of a mask frame, support rods and blocking rods included in a mask assembly of FIG.

[0034] Figure 6 It is shown Figure 1 a plan view of a mask included in a mask assembly;

[0035] Figure 7 It is shown Figure 1 A partial enlarged plan view of area "A";

[0036] Figure 8 It shows that the setting Figure 6 A plan view of support bars and barrier bars on a rear surface of a mask;

[0037] Fig. 9 and Fig.10 is a perspective view showing an organic light emitting diode display device;

[0038] Fig.11 It is shown Fig. 9 A plan view of a display area and a module area included in an organic light emitting diode display device;

[0039] Fig.12 It is shown Fig.11 A partial enlarged plan view of area "C";

[0040] Fig.13 is along Fig.12 A cross-sectional view taken along line II';

[0041] Fig.14 It is shown Fig.11 A partial enlarged plan view of area "D";

[0042] Fig.15 is a plan view showing a mask assembly according to an embodiment of the present disclosure;

[0043] Fig.16 It is shown Fig.15 A partial enlarged plan view of area "E";

[0044] Fig.17 is a plan view showing a mask assembly according to an embodiment of the present disclosure; and

[0045] Fig.18 is a plan view illustrating a mask assembly according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0046] Hereinafter, a mask assembly according to various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements.

[0047] Figure 1 is a plan view showing a mask assembly according to an embodiment of the present disclosure, Figure 2 It is shown Figure 1 A plan view of the rear surface of the mask assembly, Figure 3 Is used to describe Figure 1 A plan view of a mask frame, a support rod and a blocking rod included in a mask assembly of Figure 4 It is shown Figure 1 A perspective view of a mask frame included in a mask assembly, and Figure 5 It is shown Figure 1 A perspective view of a mask frame, support rods, and blocking rods included in a mask assembly of FIG.

[0048] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 , the mask assembly 100 may include a mask 400, a mask frame 500, a blocking rod 510, a supporting rod 530, etc. For example, the mask assembly 100 may correspond to an apparatus for depositing an organic light emitting material onto a plurality of cells formed in a mother substrate.

[0049] Each of the masks 400 may extend in a first direction D1 and may be spaced apart from each other in a second direction D2 orthogonal to the first direction D1. Each of the masks 400 may have a first side portion and a second side portion opposite to the first side portion. In an embodiment, a plurality of openings may be formed in each of the masks 400, and an organic light emitting material may pass through the openings. The mask 400 may include a metal material. For example, the mask 400 may be formed by using stainless steel (SUS).

[0050] The barrier bars 510 may be disposed under the mask 400. The barrier bars 510 may prevent the mask 400 from sagging and may block the organic light emitting material from passing through the mask 400. The barrier bars 510 may be spaced apart from each other in the second direction D2, and each of the barrier bars 510 may extend in the first direction D1. In an embodiment, each of the barrier bars 510 may overlap a first side portion of each of the masks 400. Figure 1 In the embodiment, the blocking rod 510 may be exposed through the separation space between the masks 400. The blocking rod 510 may include a metal material. For example, the blocking rod 510 may be formed by using SUS.

[0051] The support rods 530 may be disposed under the mask 400. The support rods 530 may prevent the mask 400 from sagging and may block the organic light emitting material from passing through the mask 400. The support rods 530 may be spaced apart from each other in the first direction D1, and each of the support rods 530 may extend in the second direction D2. In an embodiment, the support rods 530 may be spaced apart from each other at a first interval. For example, a deposition source configured to discharge the organic light emitting material may be located in a fourth direction D4 perpendicular to the first direction D1 and the second direction D2 from the mask 400, and as shown in FIG. Figure 2 As shown, the organic light emitting material can pass through the opening in the exposed portion of the mask 400, wherein the portion is defined by the mask frame 500, the blocking rod 510 and the support rod 530. In other words, the organic light emitting material cannot pass through the portion where the mask frame 500, the blocking rod 510 and the support rod 530 are located. In addition, the exposed portions of the mask 400 defined by the mask frame 500, the blocking rod 510 and the support rod 530 can correspond to the units respectively. In addition, the support rod 530 can be arranged below the blocking rod 510. In some embodiments, the blocking rod 510 can be arranged below the support rod 530. The support rod 530 may include a metal material. For example, the support rod 530 may be formed by using SUS.

[0052] For example, the mask 400 may include the first to nth masks (where n is an integer greater than 1), and the kth mask and the (k+1)th mask (where k is an integer greater than or equal to 1 and less than n) of the first to nth masks may be spaced apart from each other in the second direction D2. In addition, the blocking rod 510 may include the first to mth blocking rods (where m is an integer greater than 1), and the jth blocking rod (where j is an integer greater than or equal to 1 and less than or equal to m) of the first to mth blocking rods may overlap with the first side of the (k+1)th mask, but not overlap with the second side of the kth mask. In addition, the support rod 530 may include the first to pth support rods (where p is an integer greater than 1), and the hth and (h+1)th support rods (where h is an integer greater than or equal to 1 and less than p) of the first to pth support rods may be spaced apart from each other in the first direction D1. The hth support rod may intersect with the first to mth blocking rods.

[0053] The mask frame 500 may be disposed below the mask 400. The mask frame 500 may overlap a portion of an upper portion and a portion of a lower portion of each of the masks 400, and the mask 400 and the mask frame 500 may be fixed to each other at the overlapping portion. Figure 4As shown, the mask frame 500 may have a plurality of first grooves 501 and a plurality of second grooves 502. Both sides of each of the blocking rods 510 and the supporting rods 530 may be fastened to the first grooves 501 and the second grooves 502, respectively (i.e., fastened to the mask frame 500). For example, both sides of each of the blocking rods 510 may be fastened to the first grooves 501, and both sides of each of the supporting rods 530 may be fastened to the second grooves 502. The mask frame 500 may include a metal material. For example, the mask frame 500 may be formed by using SUS.

[0054] Therefore, the mask assembly 100 including the blocking bars 510 , the supporting bars 530 , the mask frame 500 to which the blocking bars 510 and the supporting bars 530 are fastened, and the mask 400 disposed on the mask frame 500 may be provided.

[0055] Figure 6 It is shown Figure 1 A plan view of a mask included in the mask assembly, and Figure 7 It is shown Figure 1 For ease of description, Figure 6 It has been shown in Figure 1 A mask 400 among masks 400 .

[0056] Reference Figure 6 and Figure 7 , the mask 400 may include a pattern region 10, a dummy opening region 30, an opening region 20, and a fixed region 40. In an embodiment, a plurality of openings 401 may be formed in the pattern region 10, the dummy opening region 30, and the opening region 20, and no opening 401 may be formed in the fixed region 40. When an organic light emitting layer is deposited onto a mother substrate on which a unit is located by using the mask assembly 100, the opening 401 may correspond to a sub-pixel region of each of the units.

[0057] The pattern region 10 may be located between the fixed regions 40. That is, one end of the pattern region 10 is attached to the fixed region 40, and the other end of the pattern region 10 is attached to the fixed region 40. The openings 401 formed in the pattern region 10 may be arranged at equal intervals. A deposition material (e.g., an organic light emitting material) may pass through the openings 401 formed in the pattern region 10.

[0058] The dummy opening region 30 may be located within the pattern region 10. For example, the pattern region 10 may surround at least a portion of each of the dummy opening regions 30. In other words, the pattern region 10 may be located between two dummy opening regions 30 adjacent to each other in the first direction D1 among the dummy opening regions 30 on the first side. The dummy opening region 30 may be arranged on the first side of the mask 400 (or the first side of the pattern region 10) in the first direction D1. The opening 401 may be formed in a portion of each of the dummy opening regions 30. The deposition material may pass through the opening 401 formed in the dummy opening region 30.

[0059] The opening region 20 may be located within the pattern region 10. For example, the pattern region 10 may surround at least a portion of each of the opening regions 20. In other words, the pattern region 10 may be located between two opening regions 20 adjacent to each other in the first direction D1 among the opening regions 20 on the second side. The opening region 20 may be arranged on the second side of the mask 400 (or the second side of the pattern region 10) opposite to the first side in the first direction D1. In addition, the pseudo opening region 30 and the opening region 20 may correspond to each other. In other words, the pseudo opening region 30 and the opening region 20 may be symmetrical to each other along the first direction D1. The opening 401 may be formed in a portion of each of the opening regions 20. The deposition material may pass through the opening 401 formed in the opening region 20.

[0060] In an embodiment, Figure 7 As shown in , the number of openings 401 formed in each of the dummy opening regions 30 may be equal to the number of openings 401 formed in each of the opening regions 20. In addition, the shape in which the openings 401 formed in each of the dummy opening regions 30 are arranged and the shape in which the openings 401 formed in each of the opening regions 20 are arranged may be identical and symmetrical to each other. In addition, the number of openings 401 per unit area in each of the dummy opening regions 30 and the opening regions 20 may be less than the number of openings 401 per unit area in the pattern region 10.

[0061] The fixed regions 40 may be located in the upper and lower portions of the mask 400. The fixed regions 40 may face each other in the first direction D1. A portion of each of the fixed regions 40 may be aligned with Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5, and the fixing region 40 of the mask 400 may be fixed to the mask frame 500 at the overlapping portion. For example, in the process of fixing the mask 400 to the mask frame 500, each of the fixing regions 40 may be clamped, the fixing region 40 located in the upper portion of the mask 400 may be stretched in the first direction D1, and the fixing region 40 located in the lower portion of the mask 400 may be stretched in the direction opposite to the first direction D1. When the fixing region 40 is stretched, the overlapping portion may be welded and fixed by using a laser. In other embodiments, a groove may be formed in each of the fixing regions 40 to facilitate clamping, and the fixing region 40 of the mask 400 protruding from the mask frame 500 may be removed after welding. In addition, a dummy opening may be formed in a portion of the overlapping portion of the fixing region 40.

[0062] The conventional mask does not have the pseudo opening area 30 and the pattern area 10 surrounding at least a portion of each of the pseudo opening areas 30. In other words, the conventional mask has only the opening area 20, the pattern area 10 and the fixed area 40. When the conventional mask having only the fixed area 40, the pattern area 10 and the opening area 20 is clamped to be stretched in the first direction D1 and the direction opposite to the first direction D1, a bending phenomenon in which the left side of the conventional mask (e.g., the opposite side of the opening area 20) is bent in the third direction D3 opposite to the second direction D2 may occur. For example, the conventional mask may have a "C" shape. In this case, the opening 401 may not accurately correspond to the sub-pixel area, and the deposition failure of the organic light-emitting layer may occur. Since the number of openings 401 per unit area in the pattern area 10 is different from the number of openings 401 per unit area in each of the opening areas 20, the bending phenomenon as described above may occur.

[0063] According to an embodiment of the present disclosure, the mask assembly 100 may include a dummy opening region 30 and a pattern region 10 surrounding at least a portion of each of the dummy opening regions 30. In this case, the first side portion and the second side portion of the mask 400 may be symmetrical to each other, and a bending phenomenon may not occur even when the fixing region 40 is clamped and stretched. Therefore, when an organic light emitting layer is deposited by using the mask assembly 100, the opening 401 may accurately correspond to the sub-pixel region, and deposition failure of the organic light emitting layer may not occur.

[0064] Although the four openings 401 have been described as being formed in Figure 7 In each of the opening region 20 and the dummy opening region 30, but the configuration of the present disclosure is not limited thereto. For example, Figure 7 The arrangement of the openings 401 of each of the opening region 20 and the dummy opening region 30 may be based on Fig.11The sub-pixel region 61 and the transmission region 71 in the second display region 70 (see Fig.14 )'s arrangement.

[0065] In addition, although Figure 7 The openings 401 have been shown to have the same shape, but the configuration of the present disclosure is not limited thereto. For example, the shape of each of the openings 401 located in the pattern area 10 may be different from the shape of each of the openings 401 located in each of the pseudo-opening area 30 and the opening area 20. In other words, since the shape of each of the openings 401 located in the pattern area 10 is different from the shape of each of the openings 401 located in each of the opening area 20 and the pseudo-opening area 30, the shape of the organic light-emitting layer corresponding to the pattern area 10 may be different from the shape of the organic light-emitting layer corresponding to each of the pseudo-opening area 30 and the opening area 20. In addition, the size of each of the openings 401 located in the pattern area 10 may be different from the size of each of the openings 401 located in the pseudo-opening area 30 and the opening area 20.

[0066] Figure 8 It shows that the setting Figure 6 A plan view of the support bars and the blocking bars on the rear surface of the mask. For ease of description, Figure 8 One mask 400 , one of the blocking bars 510 , and the supporting bars 530 have been shown.

[0067] Reference Figure 7 and Figure 8 , the blocking rod 510 may be disposed under the mask 400 to overlap with the first side portion. The blocking rod 510 may extend in the first direction D1. In an embodiment, the blocking rod 510 may overlap with the opening 401 formed in the pattern region 10 overlapping with the first side portion and the opening 401 formed in the dummy opening region 30. Therefore, the deposition material may not pass through the opening 401 formed in the pattern region 10 overlapping with the first side portion and the opening 401 formed in the dummy opening region 30. In addition, the pattern region 10 may surround at least a portion of each of the dummy opening regions 30, and the blocking rod 510 may overlap with a portion of the pattern region 10 surrounding at least a portion of each of the dummy opening regions 30. In other words, the blocking rod 510 may be disposed to overlap with the opening 401 of the pattern region 10 adjacent to the dummy opening region 30 in the second direction D2. Therefore, the deposition material may not pass through the opening 401 formed in a portion of the pattern region 10 surrounding at least a portion of each of the dummy opening regions 30.

[0068] The support rods 530 may be disposed below the blocking rods 510. The support rods 530 may extend in the second direction D2 (or the third direction D3) and may be spaced apart from each other in the first direction D1. For example, one of the support rods 530 may extend to overlap with a portion between two pseudo opening regions 30 adjacent to each other in the first direction D1 in the pseudo opening region 30 on the first side and a portion between two opening regions 20 facing the two pseudo opening regions 30. In an embodiment, the deposition material may not pass through the opening 401 formed in the pattern region 10 overlapping the support rods 530.

[0069] In an embodiment, the deposition material may pass through the opening 401 formed in the region "B" where the mask 400 is exposed, wherein the region "B" is defined by the fixing region 40 (or the mask frame 500), the blocking rods 510, and the supporting rods 530. In other words, the deposition material may pass through the opening 401 formed in the pattern region 10 overlapping the second side, the opening 401 formed in the opening region 20, and the opening 401 formed in the pattern region 10 not overlapping the first side and the second side.

[0070] For example, in the process of depositing the organic light-emitting layer by using the mask assembly 100, a plurality of units may be arranged on the mother substrate in a lattice shape, and the mother substrate may be located in a direction opposite to the fourth direction D4 from the top surface of the mask 400. In other words, the unit may face the mask 400. When the organic light-emitting layer is deposited on the unit by using the mask assembly 100, there may be a portion where the organic light-emitting layer does not need to be deposited. For example, in the portion where the pad electrode is set (which is located in the lower part of each of the units), the portion where the wiring is set (which is located in the outermost periphery of the lower part of each of the units) and the space between adjacent units, the organic light-emitting layer may not need to be deposited. In this case, the first side portion of the mask 400 may correspond to the portion where the pad electrode of each of the units is set, and the blocking rod 510 may overlap with the first side portion. In addition, the portion where the wiring is set and the space between the adjacent units may overlap with the support rod 530 and the fixed area 40 (or mask frame 500) of the mask 400. Therefore, since the barrier rods 510 , the support rods 530 , and the fixing region 40 of the mask 400 are disposed in a portion where the organic light emitting layer does not need to be deposited, it is possible to block the deposition material from passing through.

[0071] Fig. 9 and Fig.10 is a perspective view showing an organic light emitting diode display device, and Fig.11 It is shown Fig. 9 A plan view of a display area and a module area included in an organic light emitting diode display device.

[0072] Reference Fig. 9 , Fig.10 and Fig.11 , the organic light emitting diode display device 700 may include a first optical module 410, a second optical module 420, etc. The organic light emitting diode display device 700 may have a first surface S1 for displaying an image and a second surface S2 opposite to the first surface S1. The first optical module 410 and the second optical module 420 may be disposed on one side of the second surface S2 of the organic light emitting diode display device 700, and the first optical module 410 and the second optical module 420 may be adjacent to each other.

[0073] like Fig.11 As shown, the organic light emitting diode display device 700 may be divided into a first display area 60, a second display area 70 (or module area), and a non-display area 80. The second display area 70 may be located on one side of the organic light emitting diode display device 700, and the first display area 60 may surround at least a portion of the second display area 70. In other words, the area of ​​the first display area 60 may be greater than the area of ​​the second display area 70. In an embodiment, the first optical module 410 and the second optical module 420 may overlap with the second display area 70. In addition, the non-display area 80 may be located on the opposite side of the organic light emitting diode display device 700 and may face the second display area 70.

[0074] The first display area 60 may include a plurality of sub-pixel areas (eg, corresponding to Fig.12 The second display area 70 may include a plurality of sub-pixel areas and a transmission area (eg, corresponding to a sub-pixel area 61). Fig.14 The organic light emitting diode display device 700 may include a sub-pixel area 61 and a transmission area 71). For example, external light may pass through the transmission area through the organic light emitting diode display device 700. In an embodiment, the organic light emitting diode display device 700 may display images at mutually different resolutions in the first display area 60 and the second display area 70. For example, an image may be displayed at a first resolution in the first display area 60, and an image may be displayed at a second resolution lower than the first resolution in the second display area 70. In other words, the number of sub-pixel areas per unit area in the first display area 60 may be greater than the number of sub-pixel areas per unit area in the second display area 70. A pad electrode electrically connected to an external device configured to generate an image signal and wiring connected to the pad electrode and extending to the first display area 60 and the second display area 70 may be provided in the non-display area 80. In other words, an image may not be displayed in the non-display area 80.

[0075] The first optical module 410 may include a camera module for capturing (or recognizing) an image of an object located above the first surface S1 of the organic light emitting diode display device 700 .

[0076] The second optical module 420 may include a facial recognition sensor module for detecting a user's face, a pupil recognition sensor module for detecting a user's pupils, an acceleration sensor module and a geomagnetic sensor module for determining movement of the organic light emitting diode display device 700, a proximity sensor module and an infrared sensor module for detecting proximity relative to the front side of the organic light emitting diode display device 700, an illuminance sensor module for measuring brightness when left in a pocket or a bag, and the like.

[0077] Fig.12 It is shown Fig.11 A partial enlarged plan view of area "C", Fig.13 is along Fig.12 A cross-sectional view taken along line II' of Fig.14 It is shown Fig.11 A partial enlarged plan view of area "D".

[0078] Reference Fig.12 , Fig.13 and Fig.14 , the organic light emitting diode display device 700 may include a lower substrate 110, a semiconductor element 250, a planarization layer 270, a pixel defining layer 310, a lower electrode 290, an organic light emitting layer 330, an upper electrode 340, and an upper substrate 450. In this case, the semiconductor element 250 may include an active layer 130, a gate insulating layer 150, a gate electrode 170, an interlayer insulating layer 190, a source electrode 210, and a drain electrode 230.

[0079] The first display area 60 may include a plurality of sub-pixel areas 61. For example, the sub-pixel areas 61 may be arranged in the first direction D1 and the second direction D2 in the first display area 60. In other words, the sub-pixel areas 61 may be arranged throughout the first display area 60.

[0080] The second display area 70 may include a plurality of sub-pixel areas 61 and a transmission area 71. For example, the sub-pixel area 61 may be partially arranged in the second display area 70, and the transmission area 71 may surround the sub-pixel area 61. In an embodiment, the organic light emitting layer 330 may be respectively disposed in the sub-pixel area 61 of the first display area 60, and the organic light emitting layer 330 may be respectively disposed in the sub-pixel area 61 of the second display area 70. In addition, when the sub-pixel area 61 is disposed in the second display area 70, the organic light emitting layer 330 may be disposed in the sub-pixel area 61 of the second display area 70. Fig.12 Compared with the sub-pixel region 61 in the first display region 60, due to the transmission region 71, Fig.14 The second display region 70 may include a relatively small number of sub-pixel regions 61 per unit area. In other words, the second resolution of the second display region 70 may be lower than the first resolution of the first display region 60.

[0081] As described above, since the sub-pixel region 61 is provided so that an image can be displayed even in the module region (e.g., the second display region 70), the organic light emitting layer 330 may be formed in the sub-pixel region 61. In this case, since the first optical module 410 and the second optical module 420 need to operate by using external light incident from the first surface S1 of the organic light emitting diode display device 700, a transmission window (e.g., a transmission region 71) may be formed in the second display region 70 so that the external light can pass through the organic light emitting diode display device 700. For example, the first display region 60 may include the sub-pixel regions 61 arranged at equal intervals and in which the organic light emitting layers 330 are respectively formed, and the second display region 70 may include the sub-pixel regions 61 in which the organic light emitting layers 330 are respectively formed and the transmission region 71 in which the transmission window is formed. In other words, the number of sub-pixel regions 61 per unit area in the first display region 60 and the second display region 70 may be different from each other.

[0082] In the process of manufacturing the organic light emitting diode display device 700 , the organic light emitting layer 330 may be deposited by using the mask assembly 100 . Figure 8 The region “B” of the mother substrate may correspond to the first display region 60 and the second display region 70, and the portion overlapped with the barrier bar 510 adjacent to the region “B” may correspond to the non-display region 80. In other words, one of the units provided on the mother substrate may correspond to the organic light emitting diode display device 700. Therefore, the organic light emitting layer 330 may be formed in the sub-pixel regions 61 located in the first display region 60 and the second display region 70, respectively, by using the mask assembly 100, and the organic light emitting layer 330 may not be formed in the non-display region 80.

[0083] Refer again Fig.13 , a lower substrate 110 including a transparent or opaque material may be provided. The lower substrate 110 may include a quartz substrate, a synthetic quartz substrate, a calcium fluoride substrate, a fluorine-doped quartz (F-doped quartz) substrate, a soda-lime glass substrate, an alkali-free glass substrate, and the like.

[0084] A buffer layer (not shown) may be provided on the lower substrate 110. The buffer layer may be provided on the entire lower substrate 110. The buffer layer may prevent metal atoms or impurities from diffusing from the lower substrate 110 into the semiconductor element 250, and may control the heat transfer rate during the crystallization process for forming the active layer 130 to obtain a substantially uniform active layer 130. In addition, when the surface of the lower substrate 110 is uneven, the buffer layer may be used to improve the flatness of the surface of the lower substrate 110. Depending on the type of the lower substrate 110, at least two buffer layers may be provided on the lower substrate 110, or no buffer layer may be provided. For example, the buffer layer may include an organic material or an inorganic material.

[0085] The active layer 130 may be disposed in the sub-pixel region 61 on the lower substrate 110 and may include a metal oxide semiconductor, an inorganic semiconductor (eg, amorphous silicon or polysilicon), an organic semiconductor, etc. The semiconductor element 250 may have a source region, a drain region, and a channel region between the source region and the drain region.

[0086] The gate insulating layer 150 may be disposed on the active layer 130. The gate insulating layer 150 may cover the active layer 130 in the sub-pixel region 61 on the lower substrate 110, and may be disposed over the entire sub-pixel region 61 on the lower substrate 110. The gate insulating layer 150 may fully cover the active layer 130 on the lower substrate 110, and may have a substantially flat top surface without generating steps around the active layer 130. In some embodiments, the gate insulating layer 150 may be disposed along the contour of the active layer 130 having a uniform thickness to cover the active layer 130 on the lower substrate 110. The gate insulating layer 150 may include a silicon compound, a metal oxide, or the like. For example, the gate insulating layer 150 may include silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), Silicon Oxycarbide (SiO x C y ), Silicon Carbonitride (SiC x N y ), aluminum oxide (AlO x ), aluminum nitride (AlNx), tantalum oxide (TaO x ), hafnium oxide (HfO x )、ZrO x ), titanium oxide (TiO x ) etc. In other embodiments, the gate insulating layer 150 may have a multilayer structure including a plurality of insulating layers. The insulating layers may include materials different from each other and may have thicknesses different from each other.

[0087] The gate electrode 170 may be disposed in the sub-pixel region 61 on the gate insulating layer 150. In other words, the gate electrode 170 may be disposed on a portion of the gate insulating layer 150 under which the channel region of the active layer 130 is located. The gate electrode 170 may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, or the like. The gate electrode 170 may include gold (Au), silver (Ag), aluminum (Al), platinum (Pt), nickel (Ni), titanium (Ti), palladium (Pd), magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr), tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), scandium (Sc), neodymium (Nd), iridium (Ir), an aluminum alloy, aluminum nitride (AlN), or the like.x ), silver-containing alloys, tungsten nitride (WN x ), copper-containing alloys, molybdenum-containing alloys, titanium nitride (TiN x ), chromium nitride (CrN x ), Tantalum Nitride (TaN x ), strontium ruthenium oxide (SrRu x O y ), zinc oxide (ZnO x )、Indium Tin Oxide (ITO), Tin Oxide (SnO x ), indium oxide (InO x ), gallium oxide (GaO x ), indium zinc oxide (IZO), etc. These may be used alone or in combination with each other. In other embodiments, the gate electrode 170 may have a multilayer structure including a plurality of metal layers. The metal layers may include materials different from each other and may have thicknesses different from each other.

[0088] The interlayer insulating layer 190 may be disposed on the gate electrode 170. The interlayer insulating layer 190 may cover the gate electrode 170 in the sub-pixel region 61 on the gate insulating layer 150, and may be disposed over the entire gate insulating layer 150. The interlayer insulating layer 190 may fully cover the gate electrode 170 on the gate insulating layer 150, and may have a substantially flat top surface without generating steps around the gate electrode 170. In some embodiments, the interlayer insulating layer 190 may be disposed with a uniform thickness along the contour of the gate electrode 170 to cover the gate electrode 170 on the gate insulating layer 150. The interlayer insulating layer 190 may include a silicon compound, a metal oxide, or the like.

[0089] The source electrode 210 and the drain electrode 230 may be disposed in the sub-pixel region 61 on the interlayer insulating layer 190. The source electrode 210 may be connected to the source region of the active layer 130 through a first contact hole formed by removing a first portion of the gate insulating layer 150 and the interlayer insulating layer 190, and the drain electrode 230 may be connected to the drain region of the active layer 130 through a second contact hole formed by removing a second portion of the gate insulating layer 150 and the interlayer insulating layer 190. Each of the source electrode 210 and the drain electrode 230 may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in combination with each other. In other embodiments, each of the source electrode 210 and the drain electrode 230 may have a multilayer structure including a plurality of metal layers. The metal layers may include materials different from each other and may have thicknesses different from each other.

[0090] Thus, the semiconductor element 250 including the active layer 130 , the gate insulating layer 150 , the gate electrode 170 , the interlayer insulating layer 190 , the source electrode 210 , and the drain electrode 230 may be provided.

[0091] The planarization layer 270 may be disposed in the sub-pixel region 61 on the interlayer insulating layer 190, the source electrode 210, and the drain electrode 230. For example, the planarization layer 270 may have a thickness sufficient to cover the source electrode 210 and the drain electrode 230 on the interlayer insulating layer 190. In this case, the planarization layer 270 may have a substantially flat top surface. In order to achieve such a flat top surface of the planarization layer 270, a planarization process may be additionally performed on the planarization layer 270. The top surface of the drain electrode 230 may be partially exposed through a contact hole formed by removing a portion of the planarization layer 270. The planarization layer 270 may include an organic material or an inorganic material. In an embodiment, the planarization layer 270 may include an organic material. For example, the planarization layer 270 may include a photoresist, a polypropylene-based resin, a polyimide-based resin, a polyamide-based resin, a siloxane-based resin, a propylene-based resin, an epoxy-based resin, and the like.

[0092] The lower electrode 290 may be disposed in the sub-pixel region 61 on the planarization layer 270. The lower electrode 290 may pass through the contact hole of the planarization layer 270 to be connected to the drain electrode 230. In addition, the lower electrode 290 may be electrically connected to the semiconductor element 250. The lower electrode 290 may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in combination with each other. In other embodiments, the lower electrode 290 may have a multilayer structure including a plurality of metal layers. The metal layers may include materials different from each other and may have thicknesses different from each other.

[0093] The pixel defining layer 310 may be disposed on a portion of the lower electrode 290 and the planarization layer 270. The pixel defining layer 310 may cover both sides of the lower electrode 290 and may expose a portion of the top surface of the lower electrode 290. The pixel defining layer 310 may be formed of an organic material or an inorganic material. In an embodiment, the pixel defining layer 310 may include an organic material.

[0094] The organic light emitting layer 330 may be disposed in the sub-pixel region 61 on the lower electrode 290 exposed by the pixel defining layer 310. The organic light emitting layer 330 may be formed by using at least one of the light emitting materials for emitting light of different colors (i.e., red light, green light, blue light, etc.) according to the sub-pixel. Alternatively, the organic light emitting layer 330 may be formed by stacking a plurality of light emitting materials for generating light of different colors (such as red light, green light, and blue light) to emit white light as a whole. In an embodiment, the organic light emitting layer 330 may be formed by using Figure 1The organic light emitting layer 330 is formed by using the mask assembly 100 .

[0095] The upper electrode 340 may be disposed in the sub-pixel region 61 on the pixel defining layer 310 and the light emitting layer 330. The upper electrode 340 may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. These may be used alone or in combination with each other. In other embodiments, the upper electrode 340 may have a multilayer structure including a plurality of metal layers. The metal layers may include materials different from each other and may have thicknesses different from each other.

[0096] The upper substrate 450 may be disposed on the upper electrode 340. The upper substrate 450 may include substantially the same material as the lower substrate 110. For example, the upper substrate 450 may include a quartz substrate, a synthetic quartz substrate, a calcium fluoride substrate, a fluorine-doped quartz substrate, a soda-lime glass substrate, an alkali-free glass substrate, or the like.

[0097] Therefore, it is possible to provide Fig.13 An organic light emitting diode display device 700 is shown in FIG.

[0098] Fig.15 is a plan view showing a mask assembly according to an embodiment of the present disclosure, and Fig.16 It is shown Fig.15 In addition to the blocking area 90, Fig.15 and Fig.16 The mask assembly 1000 shown in FIG. 1 may have the same Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 The configuration of the mask assembly 100 described above is substantially the same or similar. Fig.15 and Fig.16 In the Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 Redundant description of components where the components described are substantially the same or similar.

[0099] Reference Fig.11 , Fig.15 and Fig.16, the mask 400 may include a pattern region 10, a dummy opening region 30, an opening region 20, a blocking region 90, and a fixed region 40. In an embodiment, a plurality of openings 401 may be formed in the pattern region 10, the dummy opening region 30, and the opening region 20, and no opening 401 may be formed in the fixed region 40 and the blocking region 90. When an organic light emitting layer is deposited onto a mother substrate on which a unit is located by using the mask assembly 1000, the opening 401 may correspond to a sub-pixel region of each of the units.

[0100] The barrier rod 510 may overlap with the first side portion of the mask 400 so that the organic light emitting layer 330 may not be formed on the first side portion of the mask 400. Fig.11 In the non-display area 80, the barrier bar 510 may be overlapped with the opening 401 of the pattern area 10 adjacent to the dummy opening area 30 in the second direction D2, depending on the area of ​​the non-display area 80. In this case, the barrier bar 510 may not be precisely overlapped with the opening 401 of the pattern area 10 adjacent to the dummy opening area 30 in the second direction D2.

[0101] For example, in the process of manufacturing the mask assembly 1000, when the mask 400 is welded to the mask frame 500 after the blocking bar 510 is fastened to the mask frame 500, a manufacturing tolerance may be generated, and the mask 400 may include the blocking area 90 to ensure a margin caused by the manufacturing tolerance. In other words, since the opening 401 is not formed in the blocking area 90, the blocking bar 510 can ensure a manufacturing tolerance as large as the blocking area 90.

[0102] According to an embodiment of the present disclosure, the mask assembly 1000 may include a mask 400 having a blocking region 90. In this case, since the opening 401 is not formed in the blocking region 90, the blocking bar 510 may ensure a manufacturing tolerance as large as the blocking region 90. Therefore, the blocking bar 510 may easily cover the non-display region 80, and the organic light emitting layer 330 may not be deposited on the non-display region 80.

[0103] Fig.17 1 is a plan view showing a mask assembly according to an embodiment of the present disclosure. In addition to the second opening 402 formed in the dummy opening region 30 and the opening region 20, Fig.17 The mask assembly 1200 shown in FIG. 1 may have the same Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 The mask assembly 100 described herein is of substantially the same or similar construction. Fig.17 In the Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 Redundant description of components that are substantially the same or similar. For example, Fig.17 It can correspond to the following Figure 1 A partial enlarged plan view of area "A".

[0104] Reference Figures 1 to 6 , Figure 8 and Fig.17 , the mask 400 may include a pattern area 10, a dummy opening area 30, an opening area 20, and a fixed area 40. In an embodiment, a first opening 401 may be formed in the pattern area 10, a second opening 402 may be formed in the dummy opening area 30 and the opening area 20, and the first opening 401 may not be formed in the fixed area 40. When an organic light-emitting layer is deposited onto a mother substrate on which a unit is located by using the mask assembly 1200, the first opening 401 and the second opening 402 may correspond to a sub-pixel area of ​​each of the units. In other words, the deposited material (e.g., an organic light-emitting material) may pass through the first opening 401 and the second opening 402.

[0105] In an embodiment, the size of each of the first openings 401 may be different from the size of each of the second openings 402. For example, the size of each of the second openings 402 may be larger than the size of each of the first openings 401. The opening area 20 may correspond to Fig.11 The second display area 70 shown in FIG. 1 and the second display area 70 may include Fig.14 In this case, the second opening 402 may correspond to the sub-pixel region 61. In addition, Fig.10 The first optical module 410 and the second optical module 420 shown in FIG. 4 may be disposed in the second display area 70. Meanwhile, the pattern area 10 may correspond to Fig.11 The first display area 60 may include Fig.12 The sub-pixel area 61 is shown in FIG.

[0106] The second display area 70 may include a relatively small number of sub-pixel areas 61 when compared to the first display area 60, and in order to adjust the brightness of the second display area 70 to a level similar to the brightness of the first display area 60 located at the periphery of the second display area 70, it is necessary to increase the current density in the second display area 70, thereby possibly shortening the life of the pixels in the second display area 70. In an embodiment, since the size of each of the second openings 402 is larger than the size of each of the first openings 401, the sub-pixel area 61 located in the second display area 70 may have a relatively large size. When the sub-pixel area 61 located in the second display area 70 has a relatively large size, the current density of the pixels disposed in the second display area 70 may be reduced, thereby not shortening the life of the pixels disposed in the second display area 70.

[0107] Fig.18 1 is a plan view showing a mask assembly according to an embodiment of the present disclosure. In addition to the second opening 403 formed in the dummy opening region 30 and the opening region 20, Fig.18 The mask assembly 1300 shown in FIG. 1 may have the same Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 The mask assembly 100 described herein is of substantially the same or similar construction. Fig.18 In the Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 Redundant description of components that are substantially the same or similar. For example, Fig.18 It can correspond to the following Figure 1 A partial enlarged plan view of area "A".

[0108] Reference Figures 1 to 6 , Figure 8 and Fig.18, the mask 400 may include a pattern region 10, a dummy opening region 30, an opening region 20, and a fixed region 40. In an embodiment, a first opening 401 may be formed in the pattern region 10, a second opening 403 may be formed in the dummy opening region 30 and the opening region 20, and the first opening 401 may not be formed in the fixed region 40. When an organic light-emitting layer is deposited onto a mother substrate on which a unit is located by using the mask assembly 1300, the first opening 401 and the second opening 403 may correspond to a sub-pixel region of each of the units. In other words, the deposited material (e.g., an organic light-emitting material) may pass through the first opening 401 and the second opening 403.

[0109] In an embodiment, the size of each of the first openings 401 may be different from the size of each of the second openings 403. For example, the size of each of the second openings 403 may be smaller than the size of each of the first openings 401. The opening area 20 may correspond to Fig.11 The second display area 70 shown in FIG. 1 and the second display area 70 may include Fig.14 In this case, the second opening 403 may correspond to the sub-pixel region 61. In addition, Fig.10 The first optical module 410 and the second optical module 420 shown in FIG. 4 may be disposed in the second display area 70. Meanwhile, the pattern area 10 may correspond to Fig.11 The first display area 60 may include Fig.12 The sub-pixel area 61 is shown in FIG.

[0110] In an embodiment, the second display area 70 may include a relatively small number of sub-pixel areas 61 and sub-pixel areas 61 having relatively small sizes when compared to the first display area 60. Therefore, the size of the transmission area 71 of the second display area 70 may be relatively increased, and the external light passing through the transmission area 71 may be relatively increased. In this case, the image quality of the first optical module 410 (e.g., camera module) and the sensing quality of the second optical module 420 (e.g., facial recognition sensor module, pupil recognition sensor module, acceleration sensor module, geomagnetic sensor module, proximity sensor module, infrared sensor module, and illumination sensor module) may be improved.

[0111] The present disclosure can be applied to various mask assemblies including masks. For example, the present disclosure can be applied to several mask assemblies, such as a metal mask assembly for depositing an organic light-emitting layer, a metal mask assembly for depositing a thin film, and the like.

[0112] The foregoing is an illustration of the embodiments and should not be construed as limiting the embodiments. Although some embodiments have been described, it will be readily appreciated by those skilled in the art that many modifications may be made in the embodiments without substantially departing from the novel teachings and advantages of the present disclosure. Therefore, all such modifications are intended to be included within the scope of the present disclosure as defined in the claims. Therefore, it should be understood that the foregoing is an illustration of various embodiments and should not be construed as being limited to the specific embodiments disclosed, and modifications to the disclosed embodiments and other embodiments are intended to be included within the scope of the appended claims.

Claims

1. A mask assembly, comprising: A mask including a pattern region formed with openings, the mask extending in a first direction; and a blocking rod disposed below the mask, overlapping with a first side portion of the mask, and extending in the first direction, The mask further comprises: a dummy opening region arranged on the first side of the mask in the first direction, the dummy opening region having an opening formed therein; as well as an opening region arranged on a second side of the mask opposite to the first side in the first direction, the opening regions respectively corresponding to the dummy opening regions, the opening regions having openings formed therein, and a deposition material being able to pass through the openings formed in the opening regions, and The number of the openings per unit area in each of the dummy opening region and the opening region is smaller than the number of the openings per unit area in the pattern region. 2 . The mask assembly according to claim 1 , wherein the number of the openings formed in each of the dummy opening regions is equal to the number of the openings formed in each of the opening regions. 3 . The mask assembly according to claim 1 , wherein a shape in which the openings formed in each of the dummy opening regions are arranged and a shape in which the openings formed in each of the opening regions are arranged are identical to and symmetrical to each other. 4 . The mask assembly according to claim 1 , wherein the pattern region is located between two of the dummy opening regions on the first side that are adjacent to each other in the first direction. 5 . The mask assembly of claim 4 , wherein a deposition material does not pass through the opening formed in the pattern region overlapping the first side portion and the opening formed in the dummy opening region. 6 . The mask assembly of claim 4 , wherein the barrier bar overlaps the opening formed in the pattern region overlapping the first side portion and the opening formed in the dummy opening region.

7. The mask assembly according to claim 1, wherein the pattern area is located between two opening areas adjacent to each other in the first direction among the opening areas on the second side portion, The deposited material further passes through the opening formed in the pattern region overlapping the second side portion and the opening formed in the pattern region not overlapping the first side portion and the second side portion. 8 . The mask assembly according to claim 1 , wherein the pattern region surrounds at least a portion of each of the dummy opening region and the opening region. 9 . The mask assembly of claim 1 , further comprising support rods disposed under the mask, each of the support rods extending in a second direction orthogonal to the first direction and spaced apart from each other in the first direction.

10. The mask assembly according to claim 9, wherein the support bars are spaced apart from each other at a first interval, and The supporting rod is arranged below the blocking rod.

11. The mask assembly according to claim 9, wherein a deposition material does not pass through the opening formed in the pattern area overlapping the support rods and the barrier rods, and One of the support bars extends to overlap a portion between two dummy opening areas adjacent to each other in the first direction and a portion between two opening areas facing the two dummy opening areas in the dummy opening areas on the first side.

12. The mask assembly according to claim 9, further comprising a mask frame disposed under the mask, fastened to both sides of the blocking rod and both sides of each of the supporting rods, and having an opening exposing the pattern area of ​​the mask, wherein the mask further comprises fixing areas located in the upper and lower parts of the pattern area, The fixing areas face each other in the first direction, and A portion of each of the fixing regions overlaps the mask frame.

13. The mask assembly according to claim 1, wherein the mask comprises first to nth masks, wherein n is an integer greater than 1, and The kth mask and the k+1th mask of the first to nth masks are spaced apart from each other in a second direction perpendicular to the first direction, wherein k is an integer greater than or equal to 1 and less than n, and wherein the blocking rods include first to mth blocking rods, wherein m is an integer greater than 1, and The jth barrier bar among the first to mth barrier bars overlaps with the first side of the k+1th mask but does not overlap with the second side of the kth mask, where j is an integer greater than or equal to 1 and less than or equal to m. 14 . The mask assembly of claim 1 , wherein the opening of the pattern area adjacent to the dummy opening area in a second direction orthogonal to the first direction overlaps the blocking bar.

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