Multi-mode multi-layer silicon wafer dicing machine

Abstract

This invention discloses a multi-mode, multi-layer silicon wafer cutting machine, comprising a mounting frame, a first take-up and untake-down section, a second take-up and untake-down section, a first moving section, a second moving section, a third moving section, a first cutting section, a second cutting section, a first servo rotary table, and a second servo rotary table. The first take-up and untake-down section is located at one end of the mounting frame, and the second take-up and untake-down section is located at the other end. The first moving section is horizontally mounted on the mounting frame. Both the first and second servo rotary tables are mounted on the first moving section. The second and third moving sections are mounted on the mounting frame and vertically positioned above the first moving section. The first cutting section is mounted on the second moving section and is driven to move towards the first moving section. The second cutting section is mounted on the third moving section and is driven to move towards the first moving section. This invention provides a multi-mode, multi-layer silicon wafer cutting machine that significantly improves silicon rod cutting efficiency, offers diverse cutting modes, and facilitates disassembly and replacement.

Description

Technical Field

[0001] This invention relates to the field of multilayer silicon wafer cutting equipment, and more specifically to a multi-mode multilayer silicon wafer cutting machine. Background Technology

[0002] The production of monocrystalline silicon typically involves first producing polycrystalline or amorphous silicon, then growing rod-shaped monocrystalline silicon rods from the melt using the Czochralski method or the floating zone method. The silicon rods grow into a shape that is smooth at one end and conical at the other. When molten elemental silicon solidifies, silicon atoms arrange themselves into numerous crystal nuclei using a diamond lattice. If these nuclei grow into grains with identical crystal orientations, these grains combine in parallel to crystallize into monocrystalline silicon. Monocrystalline silicon is a relatively reactive non-metallic element and an important component of crystalline materials, placing it at the forefront of new material development. Its main applications are as a semiconductor material and in solar photovoltaic power generation and heating.

[0003] In semiconductor material applications, silicon rods need to be divided into blocks, then the silicon blocks are cut into wafers, and the relatively thin wafers are glued together before being cut into smaller pieces for use. Using existing wire mesh equipment (bottom horizontal lines and top vertical lines) for cutting has the following drawbacks:

[0004] 1. High defect rate: Because thin silicon wafers are bonded together for cutting, and there is a gap between the horizontal and vertical lines, the bottom horizontal lines are cut first. Therefore, the upper vertical lines are only cut after one or more layers of silicon wafers have been cut. However, the bonding part between the cut silicon wafer and the bottom silicon wafer is small, which can easily cause the cut side to collapse, making it impossible to cut in the other direction, resulting in a high defect rate.

[0005] 2. Limited cutting options; only silicon wafers of specified sizes can be cut.

[0006] 3. At the same time, since the existing cutting wheels are all covered with an elastic layer on one side, they are easily worn by the diamond cutting wires. Therefore, the cutting wheels need to be replaced, but the existing cutting wheels are inconvenient to replace. Summary of the Invention

[0007] To address the aforementioned problems, the present invention aims to provide a multi-mode, multi-layer silicon wafer cutting machine that greatly improves silicon rod cutting efficiency, offers diverse cutting modes, and facilitates disassembly and replacement.

[0008] According to one aspect of the present invention, a multi-mode multilayer silicon wafer cutting machine is provided, comprising a mounting frame, a first take-up and unwinding section, a second take-up and unwinding section, a first moving section, a second moving section, a third moving section, a first cutting section, a second cutting section, a first servo rotary table, and a second servo rotary table. The first take-up and unwinding section is disposed at one end of the mounting frame, and the second take-up and unwinding section is disposed at the other end of the mounting frame. The first moving section is horizontally disposed on the mounting frame. The first servo rotary table and the second servo rotary table are both mounted on the first moving section. The second moving section and the third moving section are disposed on the mounting frame and vertically disposed above the first moving section. The first cutting section is mounted on the second moving section and is driven to move towards the first moving section. The second cutting section is mounted on the third moving section and is driven to move towards the first moving section. The first moving section drives the first servo rotary table to move below the second cutting section, and the first moving section drives the second servo rotary table to move below the first cutting section. The first take-up and unwinding section is connected to the first cutting section via a cutting line, and the second take-up and unwinding section is connected to the second cutting section via a cutting line.

[0009] In some embodiments, the device includes a frame, a motor, a first cutting wheel set, a second cutting wheel set, a first transition wheel set, a second transition wheel set, and a synchronous belt drive assembly. The motor is fixedly mounted on the front of the frame. The first and second cutting wheel sets are located at the bottom of the front of the frame, and the first and second transition wheel sets are located on the front of the frame. The first transition wheel set is located above the first cutting wheel set, and the second transition wheel set is located above the second cutting wheel set. The synchronous belt drive assembly is located on the back of the frame. The synchronous belt drive assembly is connected to the output end of the motor and the first and second cutting wheel sets and drives the first and second cutting wheel sets to rotate in the same direction.

[0010] In some embodiments, the first cutting wheel assembly includes a cutting wheel, a first bearing assembly, a second bearing assembly, a spindle assembly, an elastic plate assembly, and an outer cover. The first bearing assembly and the second bearing assembly are fixed on the frame. The spindle assembly passes through the cutting wheel and positions the cutting wheel between the first bearing assembly and the second bearing assembly. The spindle assembly is fixedly connected to the first bearing assembly and the second bearing assembly. An elastic plate assembly is provided on the side of the spindle assembly near the first bearing assembly. The elastic plate assembly is positioned between the first bearing assembly and the cutting wheel and defines the position of the cutting wheel. The outer cover covers the outside of the second bearing assembly, isolating the second bearing assembly from the external space.

[0011] In some embodiments, the spindle assembly includes an outer spindle and an inner spindle. The outer spindle has a first inclined edge at one end near the first bearing assembly, and a second inclined edge is provided in the middle of the outer spindle immediately connected to the first inclined edge. The outer spindle has a through hole at its center. The first inclined edge is disposed inside the first bearing assembly, and the second inclined edge is disposed inside the cutting wheel. The inner spindle passes through and is fixedly connected to the first bearing assembly, thus fixing the outer spindle and the first bearing assembly together.

[0012] In some embodiments, the first bearing assembly includes a first bearing housing, a first bearing, a first rotating shaft, and an end seal. The first bearing housing is fixedly mounted on a frame, the first bearing is mounted inside the first bearing housing, the first rotating shaft is disposed inside the first bearing and extends out of the first bearing housing at one end, and the end seal is fitted over the outside of the first rotating shaft and mounted on the first bearing housing.

[0013] In some embodiments, the center of the first rotating shaft is provided with a threaded hole and a first mounting hole, the first inclined side fits into the first mounting hole, and one end of the inner shaft engages with the threaded hole.

[0014] In some embodiments, the second bearing assembly includes a second bearing housing, a second bearing, and a drive sleeve. The second bearing housing is fixedly connected to the frame, and the second bearing is installed in the second bearing housing. The side of the second bearing housing away from the first bearing assembly has an internal thread, and the outer cover engages with the internal thread. The side of the second bearing housing close to the first bearing assembly has an external thread, and the drive sleeve engages with the external thread. The end of the outer shaft away from the first bearing assembly is fixed in the second bearing.

[0015] In some implementations, the first bearing is a deep groove ball bearing.

[0016] In some implementations, the second bearing is a cylindrical roller bearing.

[0017] In some embodiments, the second inclined side is provided with an external thread, the elastic plate assembly engages with the external thread, the elastic plate assembly includes a threaded sleeve, a spring and a pressure plate, the pressure plate presses against the cutting wheel, the threaded sleeve is disposed on the external thread, the spring is disposed between the threaded sleeve and the pressure plate, the threaded sleeve drives the spring to contract and thus press the pressure plate against the cutting wheel.

[0018] In some implementations, the structure of the first cutting wheel set is the same as that of the second cutting wheel set.

[0019] In some embodiments, the synchronous belt drive assembly includes a driving pulley, a first driven pulley, a second driven pulley, a first belt guide pulley, a second belt guide pulley, a third belt guide pulley, a fourth belt guide pulley, a fifth belt guide pulley, and a synchronous belt. The driving pulley is fixed to the output end of the motor. The first driven pulley is connected to a first cutting wheel group, and the second driven pulley is connected to a second cutting wheel group. The first belt guide pulley is located below the driving pulley. The third belt guide pulley and the second belt guide pulley are sequentially arranged vertically above the first driven pulley. The fourth belt guide pulley and the fifth belt guide pulley are sequentially arranged vertically above the second driven pulley.

[0020] The synchronous belt passes sequentially through the driving pulley, the second belt guide pulley, the first driven pulley, the third belt guide pulley, the fourth belt guide pulley, the second driven pulley, the fifth belt guide pulley, and the first belt guide pulley before forming a drive circuit with the driving pulley.

[0021] In some embodiments, the structure of the first cutting portion is the same as that of the second cutting portion.

[0022] In some embodiments, the first servo rotary table includes a servo motor and a worktable, the output of which is connected to the worktable and drives the worktable to rotate at any angle.

[0023] In some implementations, the structure of the first servo rotary table is the same as that of the second servo rotary table.

[0024] This invention discloses a multi-mode, multi-layer silicon wafer cutting machine. By utilizing the drive of a first moving part, a first servo rotary table and a second servo rotary table can be moved below the first or second cutting section for cutting. The first and second servo rotary tables can rotate at different angles, enabling the cutting of silicon wafers with multiple angles and polygonal shapes. The first and second cutting sections can be equipped with cutting lines of the same or different spacing, achieving various cutting shapes. A motor and synchronous belt drive assembly enable the motor to drive the first and second cutting wheel sets simultaneously and in the same direction. A first and second bearing assembly drives the cutting wheel to rotate. A mandrel assembly can both fix the cutting wheel to the first and second bearings and allow for quick disengagement from the cutting wheel, facilitating wheel replacement. An elastic sheet assembly facilitates adjustment of the cutting wheel's position on the outer shaft. A drive sleeve allows for quick disengagement from the outer shaft and cutting wheel without hammering. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of the multi-mode multilayer silicon wafer cutting machine of the present invention;

[0026] Figure 2 This is a schematic diagram of the structure of the first cutting section of the multi-mode multilayer silicon wafer cutting machine of the present invention;

[0027] Figure 3 This is a schematic diagram of the structure of the first cutting wheel group of the multi-mode multilayer silicon wafer cutting machine of the present invention;

[0028] Figure 4 This is a schematic diagram of the mandrel assembly of the multi-mode multilayer silicon wafer cutting machine of the present invention;

[0029] Figure 5 This is a schematic diagram of the structure of the first bearing assembly of the multi-mode multilayer silicon wafer cutting machine of the present invention;

[0030] Figure 6 This is a schematic diagram of the structure of the second bearing assembly of the multi-mode multilayer silicon wafer cutting machine of the present invention;

[0031] Figure 7 This is a schematic diagram of the elastic sheet assembly of the multi-mode multilayer silicon wafer cutting machine of the present invention;

[0032] Figure 8This is a schematic diagram of the synchronous belt drive assembly of the multi-mode multilayer silicon wafer cutting machine of the present invention;

[0033] Figure 9 This is a schematic diagram of the structure of the first servo rotary table of the multi-mode multilayer silicon wafer cutting machine of the present invention;

[0034] Figure 10 This is a schematic diagram of an embodiment of the first servo rotary table and the second servo rotary table of the multi-mode multilayer silicon wafer cutting machine of the present invention.

[0035] Figure 11 This is a top view of the multi-mode multilayer silicon wafer cutting machine of the present invention, showing the shape it can cut from a multilayer silicon wafer.

[0036] Figure 12 This is a schematic diagram of the structure of the multi-layer silicon wafer cutting machine of the present invention after multi-mode multi-layer silicon wafer cutting is completed. Detailed Implementation

[0037] The present invention will now be described in detail with reference to the embodiments shown in the accompanying drawings. However, it should be noted that these embodiments are not intended to limit the present invention. Equivalent transformations or substitutions in function, method, or structure made by those skilled in the art based on these embodiments are all within the scope of protection of the present invention.

[0038] In the description of this invention, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to mechanical or electrical connections, or internal connections between two components. They can be direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the terms according to the specific circumstances.

[0039] like Figure 1As shown, the multi-mode multilayer silicon wafer cutting machine of the present invention includes a mounting frame 1, a first take-up and untake-down section 2, a second take-up and untake-down section 3, a first moving section 4, a second moving section 5, a third moving section 6, a first cutting section 7, a second cutting section 8, a first servo rotary table 9, and a second servo rotary table 10. The first take-up and untake-down section 2 is located at one end of the mounting frame 1, and the second take-up and untake-down section 3 is located at the other end. The first moving section 4 is horizontally arranged on the mounting frame 1. The first servo rotary table 9 and the second servo rotary table 10 are both mounted on the first moving section 4. The second moving section 5 and the third moving section 6 are located on... The mounting bracket 1 is vertically positioned above the first moving part 4. The second moving part 5 mounts the first cutting part 7 and drives it to move towards the first moving part 4. The third moving part 6 mounts the second cutting part 8 and drives it to move towards the first moving part 4. The first moving part 4 drives the first servo rotary table 9 to move below the second cutting part 8 and the second servo rotary table 10 to move below the first cutting part 7. The first take-up and untake-down part 2 is connected to the first cutting part 7 via a cutting line, and the second take-up and untake-down part 3 is connected to the second cutting part 8 via a cutting line. By using the drive of the first moving part 4, the first servo rotary table 9 and the second servo rotary table 10 can be moved below the first cutting part 7 or the second cutting part 8 for cutting. The first servo rotary table 9 and the second servo rotary table 10 can rotate at different angles, thereby realizing the cutting of silicon wafers with multiple angles and polygons. The first cutting part 7 and the second cutting part 8 can be used to mount cutting lines with the same or different line spacing, thereby realizing various cutting shapes.

[0040] The first take-up and unwinding section 2 and the second take-up and unwinding section 3 are existing mature technologies that are widely used in silicon rod cutting equipment. Of course, the first take-up and unwinding section 2 and the second take-up and unwinding section 3 have the same structure.

[0041] The first moving part 4, the second moving part 5, and the third moving part 6 can all adopt a transmission method of motor, lead screw, lead screw nut seat, linear guide and slider, which can respond quickly and move in a precise position, making it suitable for the cutting and processing of smaller silicon wafers.

[0042] like Figure 2As shown, the first cutting section 7 includes a frame 71, a motor 72, a first cutting wheel set 73, a second cutting wheel set 74, a first transition wheel set 75, a second transition wheel set 76, and a synchronous belt drive assembly 77. The motor 72 is fixedly mounted on the front of the frame 71. The first cutting wheel set 73 and the second cutting wheel set 74 are located at the bottom of the front of the frame 71, and the first transition wheel set 75 and the second transition wheel set 76 are located on the front. The first transition wheel set 75 is located above the first cutting wheel set 73, and the second transition wheel set 76 is located above the second cutting wheel set 74. The synchronous belt drive assembly 7709 is located on the back of the frame 71. The synchronous belt drive assembly 77 connects the output end of the motor 72 to the first cutting wheel set 73 and the second cutting wheel set 74 and drives the first cutting wheel set 73 and the second cutting wheel set 74 to rotate in the same direction. The motor 72 and the synchronous belt drive assembly 77 are used to drive the first cutting wheel group 73 and the second cutting wheel group 74 simultaneously and in the same direction. The first cutting wheel group 73 and the second cutting wheel group 74 form multiple cutting wire groups in a single direction, thereby cutting the multilayer silicon wafer. The first transition wheel group 75 and the second transition wheel group 76 realize the wire threading and take-up mechanism of diamond cutting wire.

[0043] like Figure 3 As shown, the first cutting wheel assembly 73 includes a cutting wheel 731, a first bearing assembly 732, a second bearing assembly 733, a spindle assembly 734, an elastic plate assembly 735, and an outer cover 736. The first bearing assembly 732 and the second bearing assembly 733 are fixed on the frame 71. The spindle assembly 734 passes through the cutting wheel 731 and positions the cutting wheel 731 between the first bearing assembly 732 and the second bearing assembly 733. The spindle assembly 734 is fixedly connected to the first bearing assembly 732 and the second bearing assembly 733. An elastic plate assembly is provided on the side of the spindle assembly 734 near the first bearing assembly 732. The elastic plate assembly is positioned between the first bearing assembly 732 and the cutting wheel 731 and defines the position of the cutting wheel 731. The outer cover 736 covers the outside of the second bearing assembly 733 and isolates the second bearing assembly 733 from the external space. The cutting wheel 731 is driven to rotate by the first bearing assembly 732 and the second bearing assembly 733; the spindle assembly 734 can both fix the cutting wheel 731 to the first bearing 7322 and the second bearing 7332 and can also quickly detach the cutting wheel 731, making it easy to replace the cutting wheel 731; the elastic plate assembly 735 makes it easy to adjust the position of the cutting wheel 731 on the outer shaft 7341; the drive sleeve 7333 can quickly detach the outer shaft 7341 from the cutting wheel 731 without knocking.

[0044] like Figure 4As shown, the spindle assembly 734 includes an outer spindle 7341 and an inner spindle 7342. The outer spindle 7341 has a first inclined edge 7343 at one end near the first bearing assembly 732. A second inclined edge 7344 is located in the middle of the outer spindle 7341, closely connected to the first inclined edge 7343. A through hole is located at the center of the outer spindle 7341. The first inclined edge 7343 is disposed within the first bearing assembly 732, and the second inclined edge 7344 is disposed within the cutting wheel 731. The inner spindle passes through and is fixedly connected to the first bearing assembly 732, thus fixing the outer spindle 7341 to the first bearing assembly 732 as a single unit. The outer spindle 7341 connects the first bearing 7322, the second bearing 7332, and the cutting wheel 731. The inner spindle is fixedly connected to the first rotating shaft 7323, thereby tightening the outer spindle 7341 and the first rotating shaft 7323.

[0045] Simultaneously, the first inclined side 7343 is installed inside the first rotating shaft 7323, and the second inclined side 7344 is connected to the cutting wheel 731. Specifically, the first inclined side 7343 has an angle of 9°-11° with the central axis of the outer shaft 7341, with an optimal angle of 10°, and the second inclined side 7344 has an angle of 3°-5° with the central axis of the outer shaft 7341, with an optimal angle of 4°. The fit between the cone and the conical hole facilitates ensuring that the first rotating shaft 7323, the outer shaft 7341, and the cutting wheel 731 are coaxial during installation, and also makes installation faster. The end of the outer shaft 7341 is fixed inside the second bearing 7332, so that the first rotating shaft 7323, the outer shaft 7341, the inner shaft, and the cutting wheel 731 form a whole and rotate within the first bearing 7322 and the second bearing 7332.

[0046] The inner shaft is an extended bolt, with one end confined in the through hole and the other end connected to the threaded hole 7325 of the first rotating shaft 7323. The connection between the inner shaft and the threaded hole 7325 facilitates the integration of the outer shaft 7341 and the first rotating shaft 7323.

[0047] like Figure 5 As shown, the first bearing assembly 732 includes a first bearing housing 7321, a first bearing 7322, a first rotating shaft 7323, and an end seal 7324. The first bearing housing 7321 is fixedly mounted on the frame 71. The first bearing 7322 is mounted inside the first bearing housing 7321. The first rotating shaft 7323 is disposed inside the first bearing 7322 and extends out of the first bearing housing 7321 at one end. The end seal 7324 is fitted over the outside of the first rotating shaft 7323 and mounted on the first bearing housing 7321. The first bearing assembly 7322 is fixed to the frame 71 by the first bearing housing 7321. The end of the first rotating shaft 7323 away from the second bearing assembly 733 is connected to a first driven wheel 7702 to drive the first rotating shaft 7323 to rotate.

[0048] The first rotating shaft 7323 has a threaded hole 7325 and a first mounting hole 7326 at its center. The first inclined edge 7343 fits into the first mounting hole 7326, and one end of the inner shaft 7342 engages with the threaded hole 7325. The first mounting hole 7326 is coaxial with the first inclined edge 7343 to ensure that the first rotating shaft 7323 is coaxial with the outer shaft 7341, and will not vibrate during rotation.

[0049] The first bearing, 7322, is a deep groove ball bearing. Deep groove ball bearings have low frictional resistance, high speed, and can be used in machine parts that bear radial loads or combined radial and axial loads, as well as machine parts that bear axial loads.

[0050] like Figure 6 As shown, the second bearing assembly 733 includes a second bearing housing 7331, a second bearing 7332, and a drive sleeve 7333. The second bearing housing 7331 is fixedly connected to the frame 71. The second bearing 7332 is installed inside the second bearing housing 7331. The side of the second bearing housing 7331 away from the first bearing assembly 732 has an internal thread, and the outer cover 736 engages with the internal thread. The side of the second bearing housing 7331 near the first bearing assembly 732 has an external thread, and the drive sleeve 7333 engages with the external thread. The end of the outer shaft 7341 away from the first bearing assembly 732 is fixed inside the second bearing 7332. The second bearing assembly 733 is fixed to the frame 71 by the second bearing housing 7331, and the drive sleeve 7333 rotates the extrusion cutting wheel 731 to disengage from the outer shaft 7341, enabling rapid replacement.

[0051] The second bearing 7332 is a cylindrical roller bearing. The cylindrical rollers and raceways are in line contact. It has a high load capacity and primarily bears radial loads. The rolling elements have low friction with the raceway flanges, making it suitable for high-speed rotation. The cylindrical roller bearing has a separable inner and outer ring structure. This allows for quick and convenient replacement of the cutting wheel 731 when the cutting wheel 731 needs to be replaced. The drive sleeve 7333 can quickly detach from the cutting wheel 731 and outer shaft 7341, allowing the inner ring and outer shaft 7341 to be directly removed.

[0052] like Figure 7 As shown, the second inclined side 7344 is provided with an external thread. The elastic plate assembly 735 engages with the external thread. The elastic plate assembly 735 includes a threaded sleeve 7351, a spring piece 7352, and a pressure plate 7353. The pressure plate 7353 presses against the cutting wheel 731. The threaded sleeve 7351 is disposed on the external thread, and the spring piece 7352 is disposed between the threaded sleeve 7351 and the pressure plate 7353. The threaded sleeve 7351 drives the spring piece 7352 to contract, thereby pressing the pressure plate 7353 against the cutting wheel 731. The position of the cutting wheel 731 is adjusted and controlled by moving the threaded sleeve 7351 on the external thread.

[0053] The cutting wheel 731 is covered with an elastic material, and the elastic material has multiple grooves for holding diamond cutting wires. This results in multiple cutting wires running in the same direction, with the spacing between each pair of cutting wires determining the distance between the silicon wafers to be cut. In the prior art, the installation and removal of the cutting wheel 731 is very inconvenient; therefore, it is only replaced when the cutting wheel 731 is severely worn and must be replaced. Generally, cutting wheels 731 with different wire spacings are not replaced.

[0054] When replacing the cutting wheel 7351, the following steps are performed: First, use a wrench to pry the threaded sleeve 7351 until it disengages from the outer shaft 7341. Then, loosen the outer cover 736 to expose the end of the inner shaft, and rotate the end of the inner shaft to disengage it from the first rotating shaft 7323. Next, use a wrench to pry the drive sleeve 7333 to drive the cutting wheel 731, causing the cutting wheel 731 to disengage from the outer shaft 7341. Finally, remove the inner ring of the second bearing 7332 and the outer shaft 7341, and remove the cutting wheel 731. When a new cutting wheel 731 with a new line gauge needs to be installed, simply reverse the above steps.

[0055] The structure of the first cutting wheel set 73 is the same as that of the second cutting wheel set 74, in order to facilitate standardized production.

[0056] The first transition wheel set 75 and the second transition wheel set 76 have the same structure, and are similar to the structure of the first cutting wheel set 73. The difference is that the first rotating shaft 7323 is located in the first bearing 7322 but does not extend out of the first bearing seat 7321. The end seal 7324 seals the first rotating shaft 7323 in the first bearing seat 7321. This structure makes it easier to replace the transition wheels.

[0057] like Figure 8 As shown, the synchronous belt drive assembly 77 includes a drive pulley 7701, a first driven pulley 7702, a second driven pulley 7703, a first belt guide pulley 7704, a second belt guide pulley 7705, a third belt guide pulley 7706, a fourth belt guide pulley 7707, a fifth belt guide pulley 7708, and a synchronous belt 7709. The drive pulley 7701 is fixed to the output end of the motor 72. The first driven pulley 7702 is connected to the first cutting wheel group 73, and the second driven pulley 7703 is connected to the second cutting wheel group 74. The first belt guide pulley 7704 is located below the drive pulley 7701. The third belt guide pulley 7706 and the second belt guide pulley 7705 are sequentially arranged vertically above the first driven pulley 7702. The fourth belt guide pulley 7707 and the fifth belt guide pulley 7708 are sequentially arranged vertically above the second driven pulley 7703.

[0058] The synchronous belt 7709 passes sequentially through the driving pulley 7701, the second belt guide pulley 7705, the first driven pulley 7702, the third belt guide pulley 7706, the fourth belt guide pulley 7707, the second driven pulley 7703, the fifth belt guide pulley 7708, and the first belt guide pulley 7704 before forming a drive circuit with the driving pulley 7701. This configuration allows the motor 72 to drive the driving pulley 7701 to rotate, which in turn drives the first driven pulley 7702 and the second driven pulley 7703 to rotate in the same direction via the synchronous belt 7709.

[0059] The structure of the first cutting section 7 is the same as that of the second cutting section 8. The identical structure of the first cutting section 7 and the second cutting section 8 facilitates standardized production and ensures more reliable quality.

[0060] like Figure 9 As shown, the first servo rotary table 9 includes a servo motor 91 and a worktable 92. The output end of the servo motor 91 is connected to the worktable 92 and drives the worktable 92 to rotate at any angle. The servo motor 91 is mounted on a slider, and its output end is connected to the worktable 92. The servo motor 91 is used to control the rotation angle of the worktable 92 to perform different cutting modes.

[0061] The structure of the first servo rotary table 9 is the same as that of the second servo rotary table 10. The identical structure of the first servo rotary table 9 and the second servo rotary table 10 facilitates standardized production and ensures more reliable quality.

[0062] like Figure 10 As shown, driven by the first moving part 4, the first servo rotary table 9 moves below the second cutting part 8 to perform cutting, while the second servo rotary table 10 is in a waiting-for-processing position; similarly, the first moving part 4 can drive the second servo rotary table 10 to move below the first cutting part 7 to perform cutting, while the first servo rotary table 9 is in a waiting-for-processing position. With this arrangement, when the cutting line spacing of the first cutting part 7 and the second cutting part 8 is different, since the first servo rotary table 9 and the second servo rotary table 10 can rotate, numerous cutting methods can be derived.

[0063] like Figure 11 As shown, the present invention has multiple embodiments.

[0064] Implementation Method 1:

[0065] As shown in Figure A, the line spacing of the cutting lines on the first cutting section 7 and the second cutting section 8 is the same. The first servo rotary table 9 is located below the first cutting section 7, and the second servo rotary table 10 is located below the second cutting section 8. The first cutting section 7 and the second cutting section 8 perform cutting. After cutting is completed, the first servo rotary table 9 and the second servo rotary table 10 rotate 90° simultaneously. The first cutting section 7 and the second cutting section 8 perform cutting, which is used for cutting square silicon wafers.

[0066] Implementation Method Two:

[0067] As shown in Figure B, the line spacing of the cutting lines on the first cutting section 7 and the second cutting section 8 is different. The first servo rotary table 9 is located below the first cutting section 7, and the second servo rotary table 10 is located below the second cutting section 8. The first cutting section 7 and the second cutting section 8 cut in sequence. Then, the first moving part 4 drives the first servo rotary table 9 to move below the second cutting section 8 to cut, while the second servo rotary table 10 is in the waiting position. After the processing is completed, the first moving part 4 can drive the second servo rotary table 10 to move below the first cutting section 7 to cut, while the first servo rotary table 9 is in the waiting position to cut, and the rectangular silicon wafer is cut.

[0068] Implementation Method 3:

[0069] As shown in Figure C, the line spacing of the cutting lines on the first cutting section 7 and the second cutting section 8 is the same. The first servo rotary table 9 is located below the first cutting section 7, and the second servo rotary table 10 is located below the second cutting section 8. The first cutting section 7 and the second cutting section 8 perform cutting. After cutting is completed, the first servo rotary table 9 and the second servo rotary table 10 rotate 45° simultaneously. The first cutting section 7 and the second cutting section 8 perform cutting, which is used for cutting diamond-shaped silicon wafers.

[0070] Implementation Method Four:

[0071] As shown in Figure D, the line spacing of the cutting lines on the first cutting section 7 and the second cutting section 8 is different. The first servo rotary table 9 is located below the first cutting section 7, and the second servo rotary table 10 is located below the second cutting section 8 and is in a 45° rotation state. The first cutting section 7 and the second cutting section 8 cut in sequence. Then, the first moving part 4 drives the first servo rotary table 9 to move below the second cutting section 8. After the first servo rotary table 9 rotates 45°, the second cutting section 8 cuts, while the second servo rotary table 10 is in a waiting position. After processing is completed, the first moving part 4 can drive the second servo rotary table 10 to move below the first cutting section 7 and rotate in the opposite direction by 45°. The first cutting section 7 cuts, while the first servo rotary table 9 is in a waiting position, to cut the parallelogram silicon wafer.

[0072] Implementation Method 5:

[0073] As shown in Figure E, the line spacing of the cutting lines on the first cutting section 7 and the second cutting section 8 is the same. The first servo rotary table 9 is located below the first cutting section 7, and the second servo rotary table 10 is located below the second cutting section 8. The first cutting section 7 and the second cutting section 8 perform cutting. After cutting, the first servo rotary table 9 and the second servo rotary table 10 rotate 60° simultaneously. The first cutting section 7 and the second cutting section 8 perform cutting. After cutting, the first servo rotary table 9 and the second servo rotary table 10 rotate 60° simultaneously, which is used for cutting regular hexagonal silicon wafers.

[0074] Implementation Method Six:

[0075] The line spacing of the cutting lines on the first cutting section 7 and the second cutting section 8 is different. The first servo rotary table 9 is located below the first cutting section 7, and the second servo rotary table 10 is located below the second cutting section 8. The first cutting section 7 and the second cutting section 8 perform cutting. After cutting is completed, the first servo rotary table 9 and the second servo rotary table 10 rotate 90° simultaneously. The first cutting section 7 and the second cutting section 8 perform cutting, which is used to cut square silicon wafers of different sizes.

[0076] Implementation Method Six:

[0077] The line spacing of the cutting lines on the first cutting section 7 and the second cutting section 8 is different. The line spacing of the cutting lines on the first cutting section 7 and the second cutting section 8 is the same. The first servo rotary table 9 is located below the first cutting section 7, and the second servo rotary table 10 is located below the second cutting section 8. The first cutting section 7 and the second cutting section 8 perform cutting. After cutting is completed, the first servo rotary table 9 and the second servo rotary table 10 rotate 45° at the same time. The first cutting section 7 and the second cutting section 8 perform cutting, which is used to cut diamond-shaped silicon wafers of different sizes.

[0078] Implementation Method Eight:

[0079] The line spacing of the cutting lines on the first cutting section 7 and the second cutting section 8 is different. The first servo rotary table 9 is located below the first cutting section 7, and the second servo rotary table 10 is located below the second cutting section 8. The first cutting section 7 and the second cutting section 8 perform cutting. After cutting is completed, the first servo rotary table 9 and the second servo rotary table 10 rotate 60° simultaneously. The first cutting section 7 and the second cutting section 8 perform cutting. After cutting is completed, the first servo rotary table 9 and the second servo rotary table 10 rotate 60° simultaneously. This is used to cut regular hexagonal silicon wafers of different sizes.

[0080] By varying the rotation angles of the first servo rotary table 9 and the second servo rotary table 10, and by having the same or different spacing between the cutting lines on the first cutting section 7 and the second cutting section 8, theoretically countless silicon wafer cutting methods can be derived, resulting in higher processing efficiency.

[0081] like Figure 11 As shown in the diagram, the structure of a multilayer silicon wafer after cutting is as follows: before cutting, multiple layers of silicon wafers are overlapped and connected by adhesive. Since the thinner silicon wafers are glued together for cutting, and there is a gap between the horizontal and vertical lines, the bottom horizontal lines are cut first. Therefore, the upper vertical lines are only cut after one or more layers of silicon wafers have been cut. However, the part of the silicon wafer that is cut and the silicon wafer below it is small, which can easily cause the cut side to collapse, making it impossible to cut in the other direction, resulting in a high defect rate.

[0082] Therefore, during the cutting process, assuming the line spacing of the cutting lines on the first cutting section 7 and the second cutting section 8 is the same, and square silicon wafers of the same size need to be cut, the distance is explained as follows: First, the first cutting section 7 and the second cutting section 8 move downwards to cut 90% of the thickness of a single layer of silicon wafer; the first cutting section 7 and the second cutting section 8 move upwards; then the first servo rotary table 9 and the second servo rotary table 10 simultaneously rotate 90° clockwise; the first cutting section 7 and the second cutting section 8 move downwards to cut the first layer of silicon wafer until 90% of the thickness of the second layer of silicon wafer is cut; the first cutting section 7 and the second cutting section 8 move upwards; then the first servo rotary table 9 and the second servo rotary table 10 simultaneously rotate 90° counterclockwise; the first cutting section 7 and the second cutting section 8 move downwards to cut the second layer of silicon wafer until 90% of the thickness of the third layer of silicon wafer is cut; this process is repeated until all wafers are cut. This effectively avoids the aforementioned defects. Moreover, since the servo motor 91 drives the worktable 92, the rotation angle is precise and the response is fast, resulting in a high yield and high processing efficiency.

[0083] The above descriptions are merely some embodiments of the present invention. It should be noted that those skilled in the art can make other modifications and improvements without departing from the inventive concept of the present invention, and these all fall within the protection scope of the present invention.

Claims

1. A multi-mode, multi-layer silicon wafer cutting machine, characterized in that, The device includes a mounting frame, a first take-up and untake-up section, a second take-up and untake-up section, a first moving section, a second moving section, a third moving section, a first cutting section, a second cutting section, a first servo rotary table, and a second servo rotary table. The first take-up and untake-up section is located at one end of the mounting frame, and the second take-up and untake-up section is located at the other end. The first moving section is horizontally mounted on the mounting frame. Both the first servo rotary table and the second servo rotary table are mounted on the first moving section. The second and third moving sections are mounted on the mounting frame and vertically positioned above the first moving section. The first cutting section is mounted on the second moving section and drives it to move towards the first moving section. The second cutting section is mounted on the third moving section and drives it to move towards the first moving section. The first moving section drives the first servo rotary table to move below the second cutting section. The first take-up and untake-up section is connected to the first cutting section via a cutting line, and the second take-up and untake-up section is connected to the second cutting section via a cutting line. The first cutting section includes a frame, a motor, a first cutting wheel set, a second cutting wheel set, a first transition wheel set, a second transition wheel set, and a synchronous belt drive assembly. The motor is fixedly mounted on the front of the frame. The first and second cutting wheel sets are located at the bottom of the front of the frame, and the first and second transition wheel sets are located on the front of the frame. The first transition wheel set is located above the first cutting wheel set, and the second transition wheel set is located above the second cutting wheel set. The synchronous belt drive assembly is located on the back of the frame. The synchronous belt drive assembly connects the output end of the motor to the first and second cutting wheel sets and drives the first and second cutting wheel sets to rotate in the same direction. The first cutting wheel assembly includes: a cutting wheel, a first bearing assembly, a second bearing assembly, a spindle assembly, an elastic plate assembly, and an outer cover. The first bearing assembly and the second bearing assembly are fixed on the frame. The spindle assembly passes through the cutting wheel and positions the cutting wheel between the first bearing assembly and the second bearing assembly. The spindle assembly is fixedly connected to the first bearing assembly and the second bearing assembly. An elastic plate assembly is provided on the side of the spindle assembly near the first bearing assembly. The elastic plate assembly is positioned between the first bearing assembly and the cutting wheel and defines the position of the cutting wheel. The outer cover covers the outside of the second bearing assembly and isolates the second bearing assembly from the external space. The mandrel assembly includes an outer shaft and an inner shaft. The outer shaft has a first inclined edge at one end near the first bearing assembly. The outer shaft has a second inclined edge in the middle, which is immediately connected to the first inclined edge. The outer shaft has a through hole at its center. The first inclined edge is disposed inside the first bearing assembly. The second inclined edge is disposed inside the cutting wheel. The inner shaft passes through and is fixedly connected to the first bearing assembly, thus fixing the outer shaft and the first bearing assembly together. The first bearing assembly includes a first bearing housing, a first bearing, a first rotating shaft, and an end seal. The first bearing housing is fixedly mounted on the frame. The first bearing is mounted inside the first bearing housing. The first rotating shaft is disposed inside the first bearing and extends out of the first bearing housing at one end. The end seal is sleeved on the outside of the first rotating shaft and mounted on the first bearing housing. The first bearing is a deep groove ball bearing. The structure of the first cutting wheel set is the same as that of the second cutting wheel set; The structure of the first cutting part is the same as that of the second cutting part.

2. The multi-mode multilayer silicon wafer cutting machine according to claim 1, characterized in that, The first rotating shaft has a threaded hole and a first mounting hole at its center, the first inclined side fits into the first mounting hole, and one end of the inner shaft engages with the threaded hole.

3. The multi-mode, multi-layer silicon wafer cutting machine according to claim 1, characterized in that, The second bearing assembly includes a second bearing housing, a second bearing, and a drive sleeve. The second bearing housing is fixedly connected to the frame. The second bearing is installed inside the second bearing housing. The side of the second bearing housing away from the first bearing assembly has an internal thread, and the outer cover engages with the internal thread. The side of the second bearing housing near the first bearing assembly has an external thread, and the drive sleeve engages with the external thread. The end of the outer shaft away from the first bearing assembly is fixed inside the second bearing. The second bearing is a cylindrical roller bearing.

4. The multi-mode, multi-layer silicon wafer cutting machine according to claim 1, characterized in that, The second inclined side is provided with an external thread, and the elastic plate assembly engages with the external thread. The elastic plate assembly includes a threaded sleeve, a spring plate, and a pressure plate. The pressure plate presses against the cutting wheel. The threaded sleeve is disposed on the external thread, and the spring plate is disposed between the threaded sleeve and the pressure plate. The threaded sleeve drives the spring plate to contract, thereby pressing the pressure plate against the cutting wheel.

5. The multi-mode, multi-layer silicon wafer cutting machine according to claim 1, characterized in that, The synchronous belt drive assembly includes a driving pulley, a first driven pulley, a second driven pulley, a first belt guide pulley, a second belt guide pulley, a third belt guide pulley, a fourth belt guide pulley, a fifth belt guide pulley, and a synchronous belt. The driving pulley is fixed to the output end of the motor. The first driven pulley is connected to a first cutting wheel group, and the second driven pulley is connected to a second cutting wheel group. The first belt guide pulley is located below the driving pulley. The third belt guide pulley and the second belt guide pulley are sequentially arranged vertically above the first driven pulley. The fourth belt guide pulley and the fifth belt guide pulley are sequentially arranged vertically above the second driven pulley. The synchronous belt passes sequentially through the driving pulley, the second belt guide pulley, the first driven pulley, the third belt guide pulley, the fourth belt guide pulley, the second driven pulley, the fifth belt guide pulley, and the first belt guide pulley before forming a drive circuit with the driving pulley.

6. The multi-mode, multi-layer silicon wafer cutting machine according to claim 1, characterized in that, The first servo rotary table includes a servo motor and a worktable. The output end of the servo motor is connected to the worktable and drives the worktable to rotate at any angle.

7. The multi-mode multilayer silicon wafer cutting machine according to claim 1, characterized in that, The structure of the first servo rotary table is the same as that of the second servo rotary table.

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