Automatic wafer carrying system and method for conveying wafers using the system

Abstract

A wafer automatic carrying system and a method for conveying wafers using the system, the system comprising: a vacuum chamber having a plurality of wafer carrying stations; a plurality of first and second paddles, both located within the vacuum chamber and capable of synchronously rotating, wherein each second paddle forms a pair with a corresponding first paddle to jointly carry a wafer; a double set of magnetic fluids, sealed to the vacuum chamber and connected to the plurality of first and second paddles to drive one or both of them to rotate; a first drive mechanism connected to the double set of magnetic fluids to drive the plurality of first and second paddles to rotate synchronously in the same direction via the double set of magnetic fluids; and a second drive mechanism also connected to the double set of magnetic fluids to achieve relative rotation between the plurality of first and second paddles via the double set of magnetic fluids. The system can reduce the number of movement steps of the wafer during conveyance, thereby improving the conveyance accuracy and stability of the wafer and reducing its positional error.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor wafer processing, and in particular to a system and method for carrying and transferring wafers in a semiconductor processing chamber. Background Art

[0002] Wafers are the substrates used to manufacture semiconductor devices. To manufacture semiconductor devices (e.g., integrated circuits, semiconductor light-emitting devices, etc.), wafers need to be placed in a semiconductor processing chamber for heating and deposition processes (e.g., chemical vapor deposition (CVD) and plasma-enhanced chemical vapor deposition (PECVD)). During this process, multiple wafers need to be placed sequentially on different workstations (heating plates). Therefore, specialized wafer carriers are required to place the wafers one by one on the heating plate and transport them to different workstations.

[0003] In the prior art, wafer carrying devices used to carry and transport wafers generally have some shortcomings. For example, some carrying devices cause the wafer to undergo more movement processes during the transportation process, resulting in larger position errors of the wafer and even alarm conditions during the transportation process; for example, the final position of the wafer on the heating plate cannot be accurately determined, resulting in poor quality of wafer thin film deposition; in addition, it may also cause the repeatability of wafer deposition to be unreplicable.

[0004] Therefore, it is necessary to improve the wafer carrying device in the prior art. Summary of the Invention

[0005] The purpose of this application is to solve at least one of the problems in the above-mentioned prior art and provide such a wafer automatic carrying system and a method for transferring wafers using the system. The system and method can achieve at least one of the following purposes:

[0006] (1) Reduce the number of wafer movement steps during the transfer process, thereby improving the transfer accuracy of the wafer and reducing its position error;

[0007] (2) The position of the wafer on the heating plate can be determined conveniently and accurately, thereby improving the stability of automatic wafer transfer;

[0008] (3) Improve the uniformity of thin film deposition during the process.

[0009] According to an embodiment of the present application, a wafer automatic carrying system is provided, comprising: a vacuum chamber having a plurality of wafer carrying stations; a plurality of first paddles, which are located in the vacuum chamber and can rotate synchronously; a plurality of second paddles, which are also located in the vacuum chamber and can also rotate synchronously, wherein each of the plurality of second paddles respectively forms a pair of paddles with a corresponding one of the plurality of first paddles to jointly carry a wafer; a double set of magnetic fluids, which are sealedly connected to the vacuum chamber and connected to the plurality of first paddles and the plurality of second paddles to drive one or both of them to rotate; a first driving mechanism, which is connected to the double set of magnetic fluids to drive the plurality of first paddles and the plurality of second paddles to rotate synchronously in the same direction through the double set of magnetic fluids; and a second driving mechanism, which is also connected to the double set of magnetic fluids to achieve relative rotation between the plurality of first paddles and the plurality of second paddles through the double set of magnetic fluids.

[0010] In the above embodiment, the double-set magnetic fluid includes a first ring, a second ring, and a third ring that are rotatable relative to each other, the second ring is connected to the plurality of first propellers, and the third ring is connected to the plurality of second propellers.

[0011] Preferably, the second ring includes a gear, and the first driving mechanism includes a synchronous belt meshing with the gear, so that power is transmitted to the gear of the second ring by means of the synchronous belt, thereby driving the second ring to rotate.

[0012] Preferably, the first driving mechanism further comprises another gear meshing with the synchronous belt, and the other gear is driven to rotate by a motor.

[0013] In the above embodiment, the first driving mechanism further includes: a reducer located between the other gear and the motor; and a fixing plate for fixing the reducer, wherein the fixing plate is provided between the reducer and the other gear.

[0014] Preferably, the second driving mechanism is a cylinder driving system, and of course, it can also be a hydraulic or other driving system.

[0015] As an embodiment, the second driving mechanism includes a first connecting rod fixedly connected to the second collar, a second connecting rod fixedly connected to the third collar, and a cylinder component hinged between the first connecting rod and the second connecting rod.

[0016] Preferably, the cylinder component includes a cylinder barrel and a piston rod, one end of the piston rod is arranged in the cylinder barrel, and the other end is hinged to the first connecting rod; the cylinder barrel is hinged to the second connecting rod.

[0017] Preferably, the second driving mechanism further comprises a compressed air rotary joint fixed to the second connecting rod, the compressed air rotary joint comprising a plurality of air inlet ports and a plurality of air outlet ports, the plurality of air outlet ports being connected to the cylinder to supply compressed air thereto. The specific connection method may be, for example, a hose connection.

[0018] In the above embodiment, a flange is formed on the first ferrule so as to be fixed to the bottom wall of the vacuum chamber by means of a fastener installed on the flange.

[0019] In the above embodiment, preferably, there are six wafer loading stations (i.e., heating plates) in the vacuum chamber, and correspondingly, there are six first paddles and six second paddles. Of course, four, eight, ten, or other wafer loading stations may also be provided in the vacuum chamber, and in this case, the number of first paddles and second paddles may also be four, eight, ten, or other.

[0020] In the above embodiment, the plurality of first paddles are preferably integrally formed and formed as rod-shaped bodies extending radially outward from a common first center portion; the plurality of second paddles are also integrally formed and formed as rod-shaped bodies extending radially outward from a common second center portion. Of course, the plurality of first paddles (and the plurality of second paddles) do not necessarily need to be integrally formed and may be connected in other ways. For example, the first paddles may be welded together.

[0021] In the above embodiment, the first central portion and the second central portion are coaxial but located at different heights; the portions of the plurality of first paddles and the plurality of second paddles used to support the wafers are slightly arc-shaped and have the same height. That is, there is a height difference between the center position of the plurality of first paddles or the plurality of second paddles and the portion supporting the wafers (i.e., the free end thereof).

[0022] In the above embodiment, the pair of paddles (i.e., a first paddle and a corresponding second paddle) can be operated to jointly lift the wafer in a retracted state, or can be operated to jointly clamp the wafer in a retracted state. The specific method used is determined by the size of the wafer and the spacing between the first and second paddles.

[0023] According to another embodiment of the present application, a method for transferring wafers using the wafer automatic carrier system as described above is provided.

[0024] According to another embodiment of the present application, another wafer automatic carrying system is provided, which includes: a vacuum chamber having a plurality of wafer carrying stations; a plurality of first paddles, which are located in the vacuum chamber and can rotate synchronously; a plurality of second paddles, which are also located in the vacuum chamber and can also rotate synchronously, wherein each of the plurality of second paddles respectively forms a pair of paddles with a corresponding one of the plurality of first paddles to jointly carry a wafer; a double set of magnetic fluids, which are sealed with the vacuum chamber and connected to the plurality of first paddles and the plurality of second paddles to drive one or both of them to rotate; a first driving mechanism and a second driving mechanism, which are both connected to the double set of magnetic fluids to cooperate with each other to drive the plurality of first paddles and the plurality of second paddles to rotate synchronously in the same direction and relative to each other.

[0025] Similarly, in this embodiment, the pair of paddles (i.e., a first paddle and a corresponding second paddle) can be operated to jointly lift the wafer in a retracted state, or can be operated to jointly clamp the wafer in a retracted state. The specific method used is determined by the size of the wafer and the spacing between the first and second paddles.

[0026] In the above embodiment, the first drive mechanism is configured to directly drive the plurality of first paddles to rotate, and simultaneously drive the plurality of second paddles to rotate via the second drive mechanism, in which case the second drive mechanism does not provide any driving force. The second drive mechanism is configured to drive one of the plurality of first paddles and the plurality of second paddles to rotate relative to the other, in which case the first drive mechanism does not provide any driving force. In other words, the first drive mechanism provides the driving force to achieve synchronous and co-directional rotation of the first and second paddles, while the second drive mechanism provides the driving force to achieve relative rotation between the first and second paddles.

[0027] According to another embodiment of the present application, a method for transferring wafers using the above-mentioned wafer automatic carrier system is provided, comprising the following steps:

[0028] a) positioning a plurality of first paddles and a plurality of second paddles in pairs above the plurality of wafer carrying stations and in a retracted state to carry wafers;

[0029] b) transferring at least one wafer to at least one wafer carrying station in the vacuum chamber by means of a vacuum robot, and placing the wafer on a pair of first and second paddles;

[0030] c) causing the first driving mechanism to provide driving force to cause the plurality of first paddles and the plurality of second paddles to rotate synchronously in the same direction, thereby transferring the wafer to the next or next several (e.g., next two or next three) workstations;

[0031] d) repeating steps b) and c) until all the first paddles and the second paddles are loaded with wafers;

[0032] e) raising the support rod in the vacuum chamber so as to push the wafer against the support rod to a height exceeding the height of the first paddle and the second paddle and thereby separate the wafer from the first paddle and the second paddle;

[0033] f) causing the second driving mechanism to provide a driving force to drive one of the plurality of first paddles and the plurality of second paddles to rotate in a direction away from the other, thereby separating each pair of first and second paddles to an open state; and

[0034] g) lowering the supporting rods in the vacuum chamber to place each wafer on a corresponding station in the vacuum chamber, thereby realizing automatic multi-station transfer of the entire wafer.

[0035] In step b), the first and second paddles in the retracted state can jointly lift the wafer or clamp the wafer. The specific method is determined by the size of the wafer and the distance between the first and second paddles.

[0036] Preferably, in the above method, the dual-set magnetic fluid comprises a first ring, a second ring, and a third ring that are rotatable relative to each other, the second ring being connected to the plurality of first propellers, and the third ring being connected to the plurality of second propellers; the second ring comprising a gear, and the first drive mechanism comprising a synchronous belt meshing with the gear, another gear meshing with the synchronous belt, a motor driving the other gear, and a speed reducer located between the other gear and the motor. In step c), power is generated by the motor and sequentially transmitted to the speed reducer, the other gear, the synchronous belt, and the gear, thereby rotating the second ring.

[0037] Preferably, the second driving mechanism includes a first connecting rod fixedly connected to the second ring, a second connecting rod fixedly connected to the third ring, and a cylinder component hinged between the first connecting rod and the second connecting rod; in step c), the cylinder component does not generate power, but only transmits power from the second ring to the third ring; in step f), the cylinder component generates power to drive the third ring to rotate in a direction away from the second ring, and the second ring remains stationary, thereby generating relative rotation between the multiple first paddles and the multiple second paddles and reaching an open state.

[0038] The wafer carrying system and method provided in this application can bring about the following superior technical effects:

[0039] (1) Since two sets of magnetic fluid rings are used to connect the first paddle and the second paddle respectively, and the two sets of drive systems cooperate to drive the first paddle and the second paddle to rotate synchronously in the same direction and relative to each other, the movement steps of the wafer during the transfer process are reduced, and the transfer position accuracy of the wafer and the stability of the automatic transfer are improved;

[0040] (2) Using a pair of first and second paddles to clamp or lift the wafer, thereby improving the accuracy of the wafer position in the chamber;

[0041] (3) Since the position accuracy and transfer crystallinity of the wafer are improved, the uniformity of thin film deposition during the process can be improved and the product qualification rate can be increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 is a cross-sectional schematic diagram of a wafer automatic carrying system provided according to an embodiment of the present application;

[0043] Figure 2A yes Figure 1 FIG. 1 is a top view of a wafer automatic loading system, showing the various workstations in the vacuum chamber of the system and the distribution of the first and second paddles. At this time, the first and second paddles are in a retracted state and can be used to load wafers.

[0044] Figure 2B and Figure 2A Similar, also for Figure 1 The schematic diagram of the wafer automatic carrier system shown in the top view is Figure 2A The difference is that at this time, the first and second oars are in the open state;

[0045] Figure 3 yes Figure 1 The bottom view of the wafer robot carrier system is shown without the vacuum chamber, showing the structure at the bottom of the vacuum chamber;

[0046] Figure 4 It is along Figure 3 sectional enlarged view at AA in FIG (for clarity, the figure is rotated to the same Figure 1 Similar orientation), especially showing the connection relationship between the double sets of magnetic fluid and the first and second propellers;

[0047] Figure 5A yes Figure 1 The bottom portion of the wafer automatic carrier system is shown as a three-dimensional schematic diagram, showing the specific structure and connection relationship of the double sets of magnetic fluid and the first and second drive mechanisms, at this time, the cylinder of the second drive mechanism is in the original state; and

[0048] Figure 5B and Figure 5ASimilarly, it also shows a three-dimensional schematic diagram of the bottom part of the wafer automatic carrying system. Figure 5A The difference is that at this time, the cylinder of the second driving mechanism is in an extended state. DETAILED DESCRIPTION

[0049] The embodiments of the present application are described in detail below with reference to the accompanying drawings. It is easier to understand various aspects of the present application by reading the description of the following specific embodiments with reference to the accompanying drawings. It should be noted that these embodiments are merely exemplary and are only used to explain and illustrate the technical solutions of the present application, and are not limitations on the present application. Those skilled in the art can make various modifications and transformations based on these embodiments, and all technical solutions obtained by equivalent transformations fall within the scope of protection of the present application. The names of the various components used in this specification are for illustrative purposes only and do not have a limiting effect. Different manufacturers may use different names to refer to components with the same functions.

[0050] See also Figure 1 , which shows a cross-sectional schematic diagram of a wafer automatic carrying system provided according to an embodiment of the present application. Figure 2A , which is Figure 1 The schematic diagram of the wafer automatic carrying system shown in FIG. Figure 1 and 2A As shown in , the wafer automatic carrying system includes: a vacuum chamber 1, multiple first paddles 2, multiple second paddles 3, two sets of magnetic fluids 4, a first driving mechanism 5, and a second driving mechanism 6.

[0051] The vacuum chamber 1 is also called a reaction chamber, which has multiple wafer carrying stations (i.e., heating plates) 11. Multiple first paddles 2 are located in the vacuum chamber 1 and can rotate synchronously; multiple second paddles 3 are also located in the vacuum chamber 1 and can also rotate synchronously. Figure 2A As shown in FIG, each of the plurality of second paddles 3 forms a pair of paddles with a corresponding one of the plurality of first paddles 2, forming a structure similar to a "hand-holding" structure to jointly carry a wafer. Specifically, the paired first paddle 2 and second paddle 3 can be operated to Figure 2A The method used is determined by the size of the wafer and the spacing between the first paddle 2 and the second paddle 3.

[0052] In the examples given in this application, Figure 2A As shown in FIG, there are a total of six carrying stations 11 in the vacuum chamber 1, and accordingly, there are a total of six pairs of first paddles 2 and second paddles 3. Of course, the number of stations in the vacuum chamber 1 can also be other numbers, such as four, eight, ten, etc., which can be designed according to needs.

[0053] like Figure 1 As shown in , the double set of magnetic fluid 4 is located at the bottom of the vacuum chamber 1 and is sealed therewith, and is connected to the multiple first paddles 2 and the multiple second paddles 3 to drive one or both of them to rotate, as detailed below.

[0054] like Figure 1 As shown in , the first driving mechanism 5 is connected to the double set of magnetic fluids 4 to drive the multiple first paddles 2 and the multiple second paddles 3 to rotate synchronously in the same direction through the double set of magnetic fluids 4; the second driving mechanism 6 is also connected to the double set of magnetic fluids 4 to achieve relative rotation between the multiple first paddles 2 and the multiple second paddles 3 through the double set of magnetic fluids 4. That is, the first driving mechanism 5 is used to drive the synchronous and same-direction rotation of the multiple first paddles 2 and the multiple second paddles 3 to transfer the wafers thereon to the next (or next N, N is an integer greater than 1) workstations, and the second driving mechanism 6 is used to drive the relative rotation between the first paddle 2 and the second paddle 3 (that is, one rotates relative to the other) so that the distance between the two is increased and becomes open (see Figure 2B , at which point the wafer can slowly drop onto the heating plate (supported by the support rods above the heating plate), and then return to the contracted state ( Figure 2A ) to carry the next wafer.

[0055] By utilizing two intersecting, paired paddles to clamp and support the wafer, wafer positioning is achieved with greater precision, thereby improving its positional accuracy. The use of dual sets of magnetic fluid significantly facilitates synchronous, co-directional, and relative rotation of the first and second paddles, while also facilitating a sealed connection between the dual sets of magnetic fluid and the bottom of the vacuum chamber 1.

[0056] See also Figure 3 , which is Figure 1 The bottom view of the wafer automatic carrier system shown in FIG2 is a schematic diagram after the vacuum chamber is omitted, which shows the structure at the bottom of the vacuum chamber; see also FIG2 for details. Figure 4 , which is along Figure 3 The enlarged cross-sectional view at AA in the figure particularly shows the connection relationship between the double sets of magnetic fluid and the first and second propellers.

[0057] like Figure 4 As shown in , in the above embodiment of the present application, the double-set magnetic fluid 4 includes a first ring 41, a second ring 42 and a third ring 43 that are rotatable relative to each other. The first ring 41 is located at the outermost portion to be fixedly connected to the vacuum chamber 1. The second ring 42 is an intermediate ring, located between the first ring 41 and the third ring 43, and is connected to the plurality of first paddles 2 so that they rotate. The third ring 43 is located at the innermost portion and is connected to the plurality of second paddles 3 so that they rotate. The specific connection method can be a fixed connection, a key connection, or the like.

[0058] See also Figure 5A , which is a three-dimensional schematic diagram of the bottom of the above-mentioned wafer automatic carrying system (for the sake of clarity, the vacuum chamber, the first paddle and the second paddle are not shown), which shows the structure of the double sets of magnetic fluid 4 and the first and second drive mechanisms 5 and 6 and the connection relationship between them. At this time, the cylinder of the second drive mechanism is in its original state.

[0059] like Figure 5A As shown in FIG, the second ring 42 includes a gear 421, and the first drive mechanism 5 includes a timing belt 51 meshing with the gear 421. The timing belt transmits power to the gear 421, thereby driving the second ring 42 to rotate. The timing belt 51 is a timing belt, and providing rotational power to the wafer through the timing belt helps improve rotation accuracy and transmission efficiency.

[0060] Furthermore, the first driving mechanism 5 further includes: another gear 52, which is engaged with the synchronous belt 51 and driven to rotate by the motor 53; a reducer 54, which is located between the another gear 52 and the motor 53; and a fixing plate 55, which is provided between the reducer 54 and the another gear 52 and is used to fix the reducer 54. Figure 5A As shown in FIG, the power (rotational motion) generated by the motor 53 is transmitted to another gear 52 via the reducer 54. The other gear 52 further drives the synchronous belt 51 to move, and the synchronous belt 51 drives the gear 421 (i.e., the second collar 42) to rotate. As previously described, the second collar 42 is connected to the plurality of first paddles 2, and therefore, the first paddles 2 rotate along with the second collar 42.

[0061] Furthermore, a connection structure is provided between the second and third rings 42, 43, so that when the second ring 42 rotates, the third ring 43 is also driven to rotate synchronously. The connection structure between the second and third rings 42, 43 can be any structure that can achieve a rigid connection between the two rings, thereby transmitting torque therebetween.

[0062] In the embodiment provided herein, the second drive mechanism 6 serves as the aforementioned connecting structure. In other words, the second drive mechanism 6 functions both as a drive mechanism for achieving relative motion between the first and second paddles 2 and 3, and as a connecting structure for achieving synchronized motion between the first and second paddles 2 and 3. This unique structural design simplifies the overall structure of the conveyor, saving costs and demonstrating its ingenuity.

[0063] In the embodiment of the present application, the second driving mechanism 6 is a cylinder driving system. Figure 5A 、 5BThe second driving mechanism 6 includes: a first connecting rod 61 fixedly connected to the second collar 42, a second connecting rod 62 fixedly connected to the third collar 43, and a cylinder component 63 hingedly connected between the first connecting rod 61 and the second connecting rod 62. The cylinder component 63 includes a cylinder barrel 631 and a piston rod 632. Figure 5A 、 5B As shown in , one end of the piston rod 632 is arranged in the cylinder 631 , and the other end is hinged to the first connecting rod 61 ; the cylinder 631 is hinged to the second connecting rod 62 .

[0064] Therefore, when the second ring 42 rotates, it drives the first connecting rod 61 to rotate together. The first connecting rod 61 further drives the cylinder component 63 (which is now equivalent to a connecting rod) and the second connecting rod 62, thereby driving the third ring 43 to rotate. In other words, the third ring 43 rotates synchronously with the second ring 42. Therefore, the third ring 43 and the second ring 42 respectively drive the first paddle 2 and the second paddle 3 to rotate synchronously. This rotation can transfer the wafer to the next (or next two, three, etc.) station.

[0065] In the above embodiment, if Figure 5B As shown in the figure, the second driving mechanism 6 further includes a compressed air rotary joint 64, which is fixed to the second connecting rod 62. As shown in the figure, the compressed air rotary joint 64 includes a plurality of air inlet ports and a plurality of air outlet ports, and the plurality of air outlet ports can be connected to the cylinder 631 through a hose (not shown) to provide compressed gas thereto.

[0066] When compressed gas is not injected into the cylinder 631, Figure 5A As shown, the cylinder component 63 is in its original state (i.e., the piston rod 632 is in a contracted state); when compressed gas is injected into the cylinder 631, the compressed gas pushes the piston in the cylinder 631 to move outward, that is, the piston rod 632 moves Figure 5A 、 5B Move to the right until you reach Figure 5B During this process, the second ring 42 is fixed, and thus the first paddle 2 is also fixed, while the piston rod 632 drives the third ring 43 to rotate through the first connecting rod 61, and the third ring 43 drives the second paddle 3 to rotate in the direction away from the second paddle 2, thereby increasing the distance between each pair of first paddle 2 and second paddle 3 and reaching the open state (as shown in FIG. Figure 2B As shown), the wafer can now fall from between the first paddle 2 and the second paddle 3.

[0067] It can be seen that in the above embodiment given in the present application, the first drive mechanism 5 and the second drive mechanism 6 are respectively connected to the second ring 42 and the third ring 43 of the double set of magnetic fluid 4, so as to cooperate with each other to drive the multiple first paddles 2 and the multiple second paddles 3 to rotate synchronously in the same direction and relative to each other. Specifically, the first drive mechanism 5 is configured to directly drive the multiple first paddles 2 to rotate, and at the same time drive the multiple second paddles 3 to rotate via the second drive mechanism 6, at which time the second drive mechanism 6 does not provide a driving force; the second drive mechanism 6 is configured to drive one of the multiple first paddles 2 and the multiple second paddles 3 (for example, the multiple second paddles 3) to rotate relative to the other (for example, the multiple first paddles 2), at which time the first drive mechanism 5 does not provide a driving force.

[0068] like Figure 5A 、 5B As shown in , a flange 411 is formed on the first ferrule 41 so as to be fixed to the bottom wall of the vacuum chamber 1 by means of fasteners (such as screws, bolts, etc.) installed on the flange 411 .

[0069] Back to Figure 2A 、 2B , 3. In the embodiment of the present application, the multiple first paddles 2 are integrally formed and formed into a rod-shaped body extending radially outward from a common first center portion 21; the multiple second paddles 3 are integrally formed and formed into a rod-shaped body extending radially outward from a common second center portion 31. The first center portion 21 and the second center portion 31 are coaxial, but are located at different heights. That is, the multiple first paddles 2 and the multiple second paddles 3 all constitute a radial structure, the center portions of the two coincide, and the free ends extending outward, that is, the parts of the first paddle 2 and the second paddle 3 used to carry the wafer are slightly arc-shaped and have the same height. This is in Figure 1 It can be clearly seen that it is used to accurately carry the wafer.

[0070] The present application also provides a method for transporting wafers using the above-mentioned wafer automatic carrying system. The method comprises the following steps:

[0071] a) multiple first paddles 2 and multiple second paddles 3 are positioned in pairs above the multiple wafer carrying stations 11 and are in a retracted state (e.g. Figure 2A As shown), for carrying wafers;

[0072] b) transferring at least one wafer to at least one wafer carrying station 11 in the vacuum chamber 1 by means of a vacuum robot, and placing the wafer on the pair of first paddles 2 and second paddles 3;

[0073] c) causing the first driving mechanism 5 to provide driving force to cause the plurality of first paddles 2 and the plurality of second paddles 3 to rotate synchronously in the same direction, thereby transferring the wafer to the next one or several next workstations;

[0074] d) Repeat steps b) and c) until all first paddles 2 and second paddles 3 are loaded with wafers;

[0075] e) raising the support rod in the vacuum chamber 1 so as to push the wafer against the first paddle 2 and the second paddle 3 to a height higher than the first paddle 2 and the second paddle 3 and separate the wafer from the wafer;

[0076] f) causing the second driving mechanism 6 to provide a driving force to drive one of the plurality of first paddles 2 and the plurality of second paddles 3 to rotate in a direction away from the other, thereby separating each pair of first paddles 2 and second paddles 3 to an open state (such as Figure 2B shown); and

[0077] g) lowering the support rods in the vacuum chamber 1 to place each wafer on a corresponding station in the vacuum chamber 1, thereby realizing automatic multi-station transfer of the entire wafer.

[0078] As described above, the dual-set magnetic fluid 4 includes a first ring 41, a second ring 42, and a third ring 43 that are rotatable relative to each other. The second ring 42 is connected to the plurality of first paddles 2, and the third ring 43 is connected to the plurality of second paddles 3. The second ring 42 includes a gear 421, and the first drive mechanism 5 includes a synchronous belt 51 meshed with the gear 421, another gear 52 meshed with the synchronous belt 51, a motor 53 driving the other gear 52, and a reducer 54 located between the other gear 52 and the motor 53.

[0079] In step c), the motor 53 generates power and transmits the power to the reducer 54, the other gear 52, the synchronous belt 51 and the gear 421 in sequence, thereby rotating the second ring 42 and further driving the first paddle 2 to rotate.

[0080] As described above, the second driving mechanism 6 includes a first connecting rod 61 fixedly connected to the second collar 42, a second connecting rod 62 fixedly connected to the third collar 43, and a cylinder component 63 hingedly connected between the first connecting rod 61 and the second connecting rod 62. In step c), the cylinder component 63 does not generate power, but only transmits power from the second collar 42 to the third collar 43, thereby driving the second paddle 3 to rotate synchronously with the first paddle 2 in the same direction; and in step f), the cylinder component 63 generates power to drive the third collar 43 to rotate in a direction away from the second collar 42, while the second collar 42 remains stationary, thereby generating relative rotation between the plurality of first paddles 2 and the plurality of second paddles 3 and reaching the open state.

[0081] In the above embodiment, the paired first paddle 2 and second paddle 3 in the retracted state can jointly lift the wafer or jointly clamp the wafer. The specific method to be used is determined by the size of the wafer and the distance between the first paddle 2 and the second paddle 3.

[0082] According to the wafer carrying system and method provided by the present application, since two sets of different ferrules of magnetic fluid are used to connect the first paddle and the second paddle respectively, and the first paddle and the second paddle are driven by two sets of drive systems to realize synchronous rotation and relative rotation of the two, respectively, the movement steps of the wafer in the transmission process are reduced, and the accuracy of its transmission position and the stability of automatic transmission are improved. At the same time, since the paired first paddle and second paddle are used to clamp and support the wafer, the accuracy of the wafer position in the cavity is improved. In addition, since the position accuracy and transmission crystallinity of the wafer are improved, the uniformity of thin film deposition in the process can be improved, and the product qualification rate can be improved.

[0083] The technical content and technical features of this application have been described in the above-mentioned relevant embodiments. However, the above-mentioned embodiments are merely examples for implementing this application. Those skilled in the art may still make various substitutions and modifications based on the teachings and disclosures of this application without departing from the spirit of this application. Therefore, the embodiments disclosed in this application do not limit the scope of this application. On the contrary, modifications and equivalents contained in the spirit and scope of the claims are included within the scope of this application.

Claims

1. A wafer automatic carrying system, comprising: A vacuum chamber (1) having a plurality of wafer carrying stations (11); A plurality of first paddles (2) located in the vacuum chamber (1) and capable of synchronous rotation; a plurality of second paddles (3), which are also located in the vacuum chamber (1) and are also capable of synchronous rotation, wherein each of the plurality of second paddles (3) forms a pair of paddles with a corresponding one of the plurality of first paddles (2) to jointly carry a wafer; A double set of magnetic fluid (4), which is sealed and connected to the vacuum chamber (1) and connected to the plurality of first paddles (2) and the plurality of second paddles (3) to drive one or both of them to rotate; a first driving mechanism (5) connected to the double-set magnetic fluid (4) to drive the plurality of first propellers (2) and the plurality of second propellers (3) to rotate synchronously in the same direction through the double-set magnetic fluid (4); and A second driving mechanism (6) is also connected to the double-set magnetic fluid (4) to achieve relative rotation between the plurality of first propellers (2) and the plurality of second propellers (3) through the double-set magnetic fluid (4).

2. The wafer automatic loading system according to claim 1, wherein: The double-set magnetic fluid (4) includes a first ring (41), a second ring (42) and a third ring (43) that can rotate relative to each other, the second ring (42) is connected to the plurality of first propellers (2), and the third ring (43) is connected to the plurality of second propellers (3).

3. The wafer automatic carrying system according to claim 2, wherein: The second collar (42) includes a gear (421), and the first driving mechanism (5) includes a synchronous belt (51) meshing with the gear (421).

4. The wafer automatic carrying system according to claim 3, wherein: The first driving mechanism (5) further comprises another gear (52) meshing with the synchronous belt (51), and the other gear (52) is driven to rotate by a motor (53).

5. The wafer automatic carrying system according to claim 4, wherein: The first driving mechanism (5) further includes a speed reducer (54) located between the other gear (52) and the motor (53).

6. The wafer automatic carrier system according to claim 5, wherein: The first driving mechanism (5) further includes a fixing plate (55) for fixing the reducer (54), and the fixing plate (55) is arranged between the reducer (54) and the other gear (52).

7. The wafer automatic carrier system according to claim 2, wherein: The second driving mechanism (6) is a cylinder driving system.

8. The wafer automatic carrying system according to claim 7, wherein: The second driving mechanism (6) comprises a first connecting rod (61) fixedly connected to the second collar (42), a second connecting rod (62) fixedly connected to the third collar (43), and a cylinder component (63) hingedly connected between the first connecting rod (61) and the second connecting rod (62).

9. The wafer automatic carrying system according to claim 8, wherein: The cylinder component (63) includes a cylinder barrel (631) and a piston rod (632), one end of the piston rod (632) is arranged in the cylinder barrel (631), and the other end is hinged to the first connecting rod (61); the cylinder barrel (631) is hinged to the second connecting rod (62).

10. The wafer automatic carrying system according to claim 9, wherein: The second driving mechanism (6) further comprises a compressed air rotary joint (64) fixed to the second connecting rod (62), wherein the compressed air rotary joint (64) comprises a plurality of air inlet ports and a plurality of air outlet ports, wherein the plurality of air outlet ports are connected to the cylinder (631) to provide compressed air thereto.

11. The wafer automatic carrying system according to claim 2, wherein: A flange (411) is formed on the first ferrule (41) so as to be fixed to the bottom wall of the vacuum chamber (1) by means of a fastener mounted on the flange (411).

12. The wafer automatic carrying system according to claim 1, wherein there are six wafer carrying stations (11) in the vacuum chamber (1), and correspondingly there are six first paddles (2) and six second paddles (3).

13. The wafer automatic carrying system according to claim 1, wherein the plurality of first paddles (2) are integrally formed and formed as rod-shaped bodies extending radially outward from a common first center portion (21); the plurality of second paddles (3) are integrally formed and formed as rod-shaped bodies extending radially outward from a common second center portion (31).

14. The automatic wafer carrying system according to claim 13, wherein the first center portion (21) and the second center portion (31) are coaxial but located at different heights; the portions of the multiple first paddles (2) and the multiple second paddles (3) used to carry wafers are slightly arc-shaped and have the same height.

15. The wafer robot system of claim 1, wherein the pair of paddles are operable to jointly lift the wafer in a retracted state.

16. The wafer robot system of claim 1, wherein the pair of paddles are operable to jointly grip a wafer in a retracted state.

17. A wafer automatic carrying system, comprising: A vacuum chamber (1) having a plurality of wafer carrying stations (11); A plurality of first paddles (2) located in the vacuum chamber (1) and capable of synchronous rotation; a plurality of second paddles (3), which are also located in the vacuum chamber (1) and are also capable of synchronous rotation, wherein each of the plurality of second paddles (3) forms a pair of paddles with a corresponding one of the plurality of first paddles (2) to jointly carry a wafer; A double set of magnetic fluid (4), which is sealed and connected to the vacuum chamber (1) and connected to the plurality of first paddles (2) and the plurality of second paddles (3) to drive one or both of them to rotate; The first driving mechanism (5) and the second driving mechanism (6) are both connected to the double sets of magnetic fluid (4) to cooperate with each other to drive the multiple first propellers (2) and the multiple second propellers (3) to rotate synchronously in the same direction and relative to each other.

18. The wafer automatic carrier system according to claim 17, wherein: The first driving mechanism (5) is configured to directly drive the plurality of first paddles (2) to rotate, and simultaneously drive the plurality of second paddles (3) to rotate via the second driving mechanism (6), wherein the second driving mechanism (6) does not provide driving force; The second driving mechanism (6) is configured to drive one of the plurality of first paddles (2) and the plurality of second paddles (3) to rotate relative to the other, while the first driving mechanism (5) does not provide driving force.

19. The wafer robot system of claim 17, wherein the pair of paddles are operable to jointly lift the wafer in a retracted state.

20. The wafer robot system of claim 17, wherein the pair of paddles are operable to jointly grip a wafer in a retracted state.

21. A method for transferring wafers using the wafer automatic carrier system according to any one of claims 1 to 20, comprising the following steps: a) positioning the plurality of first paddles (2) and the plurality of second paddles (3) in pairs above the plurality of wafer carrying stations (11) and placing them in a retracted state to carry wafers; b) transferring at least one wafer to at least one wafer carrying station (11) in the vacuum chamber (1) by means of a vacuum robot, and placing the wafer on a pair of first paddles (2) and second paddles (3); c) causing the first driving mechanism (5) to provide driving force to cause the plurality of first paddles (2) and the plurality of second paddles (3) to rotate synchronously in the same direction, thereby transferring the wafer to the next one or several next workstations; d) repeating steps b) and c) until all the first paddles (2) and second paddles (3) are loaded with wafers; e) raising the support rod in the vacuum chamber (1), thereby pushing the wafer against the first paddle (2) and the second paddle (3) to a height exceeding the first paddle (2) and the second paddle (3) and separating from them; f) causing the second driving mechanism (6) to provide a driving force to drive one of the plurality of first paddles (2) and the plurality of second paddles (3) to rotate in a direction away from the other, thereby separating each pair of paddles (2, 3) to an open state; and g) lowering the support rods in the vacuum chamber (1) to place each wafer on a corresponding workstation in the vacuum chamber (1).

22. The method of claim 21, wherein: The double-set magnetic fluid (4) comprises a first ring (41), a second ring (42) and a third ring (43) that are rotatable relative to each other, the second ring (42) is connected to the plurality of first propellers (2), and the third ring (43) is connected to the plurality of second propellers (3); The second ferrule (42) includes a gear (421), the first driving mechanism (5) includes a synchronous belt (51) meshed with the gear (421), another gear (52) meshed with the synchronous belt (51), a motor (53) driving the other gear (52), and a speed reducer (54) located between the other gear (52) and the motor (53); In step c), the motor (53) generates power and transmits the power to the reducer (54), the other gear (52), the synchronous belt (51) and the gear (421) in sequence, thereby rotating the second ring (42).

23. The method of claim 22, wherein: The second driving mechanism (6) comprises a first connecting rod (61) fixedly connected to the second collar (42), a second connecting rod (62) fixedly connected to the third collar (43), and a cylinder component (63) hingedly connected between the first connecting rod (61) and the second connecting rod (62); In step c), the cylinder component (63) does not generate power, but only transmits power from the second ring (42) to the third ring (43); In step f), the cylinder component (63) generates power to drive the third ring (43) to rotate in a direction away from the second ring (42), and the second ring (42) remains stationary, thereby generating relative rotation between the multiple first paddles (2) and the multiple second paddles (3) and reaching an open state.

24. The method according to claim 21, wherein in step b), the paired first paddle (2) and second paddle (3) in the retracted state jointly lift the wafer.

25. The method according to claim 21, wherein in step b), the paired first paddle (2) and second paddle (3) in a retracted state jointly clamp the wafer.

Images