Filter and Inverter

Abstract

This application relates to the technical field of filters, and particularly to a filter and an inverter. The filter includes an injection molded housing, a PCBA, a DC busbar, and a magnetic ring. The inlay panel of the injection molded housing divides the injection molded housing into a first chamber and a second chamber. The capacitors of the PCBA are placed downward in the first chamber, and the capacitors are adhesively fixed to the inlay panel. The DC busbar passes through the second chamber, and the DC busbar is clamped and fixed by the lower cover and the side wall of the injection molded housing; the magnetic ring is sleeved on the DC busbar, and the outer surface of the magnetic ring is bonded to the inlay panel and the injection molded housing. Therefore, the PCBA, the DC busbar, and the magnetic ring are stably and firmly fixed in the injection molded housing, improving the anti-vibration performance. At the same time, compared with the traditional glue filling and fixing method, the amount of adhesive is greatly reduced to meet the environmental protection requirements, and at the same time, the equipment cost is reduced, and the competitiveness of the product is improved.

Description

Technical Field

[0001] The present application relates to the technical field of filters, and in particular to a filter and an inverter. Background Art

[0002] With the increasing maturity of new energy vehicles and intelligent connected vehicles, the requirements for the electrical performance and EMC performance (Electro Magnetic Compatibility) of vehicles are getting higher and higher. Therefore, filters have gradually become an important part of vehicles. When a filter is applied to a vehicle, all components of the filter need to be firmly installed to adapt to the working environment of the vehicle. This performance is evaluated by the vibration resistance performance of the components. Currently, in order to achieve the vibration resistance goal of the filter, glue is filled in the injection molded housing of the filter to integrate the injection molded housing with the copper busbar, magnetic ring, circuit board, and capacitor components on the circuit board inside it. However, due to the poor thermal conductivity of the bonding glue, it is difficult for the components inside the filter to dissipate heat, reducing the service life of the filter. At the same time, the extensive use of glue cannot meet the environmental protection requirements, and the extensive use of glue also leads to an increase in cost. Summary of the Invention

[0003] The purpose of the present invention is to provide a filter and an inverter to reduce the amount of glue used while ensuring the vibration resistance performance of the filter, so as to meet the environmental protection requirements and reduce costs.

[0004] The present invention provides a filter, including an injection molded housing, a PCBA, a DC busbar, and a magnetic ring;

[0005] An inlay board is arranged inside the injection molded housing, and the injection molded housing forms a first chamber and a second chamber on both sides of the inlay board;

[0006] The PCBA is installed in the first chamber, the circuit board of the PCBA faces and is spaced from the inlay board, and the capacitors of the PCBA are welded to the circuit board and bonded to the inlay board;

[0007] The DC busbar passes through the second chamber, and the DC busbar is clamped between the side wall of the injection molded housing and the lower cover of the injection molded housing;

[0008] The magnetic ring is installed in the second chamber, the magnetic ring is sleeved on the DC busbar, and the outer surface of the magnetic ring is bonded to the inlay board and the injection molded housing.

[0009] Further, the filter further includes a high-voltage guide post;

[0010] An avoidance groove is formed in the inlay panel, and the high-voltage guide post can pass through the inlay panel through the avoidance groove, so that one end of the high-voltage guide post extends into the first chamber and is electrically connected to the circuit board, and the other end of the high-voltage guide post extends into the second chamber and is connected to the pin of the DC busbar.

[0011] Further, an installation channel is formed on the side wall of the injection-molded housing, the high-voltage guide post passes through the installation channel, and an adhesive is filled between the installation channel and the high-voltage guide post to bond the high-voltage guide post and the installation channel.

[0012] Further, an internal thread installation hole is formed at one end of the high-voltage guide post for connecting with the pin, and a fastener adapted to the internal thread installation hole is penetrated through the pin, so that the high-voltage guide post is electrically connected to the pin through the fastener; one end of the high-voltage guide post facing the circuit board is connected to the circuit board by welding.

[0013] Further, the material of the inlay panel is a metal material, so that the capacitor and the magnetic ring can conduct heat with the inlay panel; the inlay panel extends out of the injection-molded housing and forms an installation part, and the installation part is used for connecting with a connecting column in the inverter box body for grounding and heat conduction of the inlay panel.

[0014] Further, the filter further includes a grounding guide post; one end of the grounding guide post is connected to the circuit board by welding, and the other end of the grounding guide post is connected to the inlay panel by welding or riveting, so that the circuit board is electrically connected to the inlay panel through the grounding guide post.

[0015] Further, a glue injection cavity is formed in the second chamber of the injection-molded housing; both ends of the glue injection cavity are open ends, and one end of the glue injection cavity abuts against the inlay panel, and the other end of the glue injection cavity abuts against the DC busbar; the glue injection cavity is used for filling a heat-conducting glue, so that the DC busbar can transfer heat to the inlay panel through the heat-conducting glue.

[0016] Further, partition plates are arranged on both sides of the magnetic ring in the length direction of the magnetic ring, and both ends of the magnetic ring are bonded to the corresponding partition plates respectively.

[0017] Further, a notch is formed in the side wall of the injection-molded housing to enable the DC busbar to pass through the injection-molded housing; a convex part is formed on the lower cover of the injection-molded housing, and the convex part can extend into the notch and tightly abut against the DC busbar.

[0018] The present invention also provides an inverter, including the filter described in any one of the above.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0020] The filter provided by the present invention includes an injection molded housing, a PCBA, a DC busbar, and a magnetic ring. An inlay board is arranged inside the injection molded housing, so that the inlay board divides the internal space of the injection molded housing into a first chamber above the inlay board and a second chamber below the inlay board. The first chamber above the inlay board is used to install the PCBA. The PCBA includes a circuit board and capacitors soldered to the circuit board. The capacitors of the PCBA are placed downward in the first chamber, and an adhesive is coated on the lower end surface of the capacitor facing the inlay board, so that the capacitor is bonded to the inlay board, thereby stably fixing the PCBA in the injection molded housing. The DC busbar passes through the second chamber, and both ends in the length direction of the DC busbar extend out of the injection molded housing from the side walls on both sides of the second chamber; a lower cover for closing the second chamber is arranged at the lower end of the injection molded housing. The lower cover is connected to the side wall of the injection molded housing and clamps and fixes the DC busbar between the side wall of the injection molded housing and the lower cover, thereby fixing the DC busbar. The magnetic ring is also installed in the second chamber, and the magnetic ring is sleeved on the DC busbar. An adhesive is coated between the outer surface of the magnetic ring and the inlay board, the side wall of the injection molded housing, and the lower cover of the injection molded housing to bond and fix the magnetic ring in the second chamber, so that the magnetic ring is stably and firmly installed in the injection molded housing, and the magnetic ring will not slide back and forth or shake up and down in the injection molded housing.

[0021] Therefore, by arranging an inlay board in the injection molded housing of the filter, the circuit board and capacitors of the PCBA are soldered and connected, and a small amount of adhesive is coated between the capacitor and the inlay board for fixation; the DC busbar is clamped and fixed between the side wall of the injection molded housing and the lower cover, and the magnetic ring sleeved on the DC busbar is bonded and fixed to the inlay board and the injection molded housing through a small amount of adhesive, thereby ensuring the stability of the installation of the injection molded housing of the filter and its internal components, improving the anti-vibration performance. At the same time, compared with the traditional glue filling and fixing method, the amount of adhesive used is greatly reduced to meet the environmental protection requirements, and the equipment cost is also reduced, improving the competitiveness of the product.

[0022] The present invention also provides an inverter, including the filter described above, so the inverter also has the beneficial effects of the filter. Description of the Drawings

[0023] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required to be used in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0024] Figure 1Schematic diagram of the decomposition structure of the filter provided by the embodiment of the present invention;

[0025] Figure 2 Schematic diagram of the structure of the filter provided by the embodiment of the present invention from the first perspective (the injection molded housing is hidden);

[0026] Figure 3 Schematic diagram of the structure of the filter provided by the embodiment of the present invention from the second perspective (the injection molded housing is hidden);

[0027] Figure 4 Schematic diagram of the structure of the injection molded housing of the filter provided by the embodiment of the present invention from the first perspective;

[0028] Figure 5 Schematic diagram of the structure of the injection molded housing of the filter provided by the embodiment of the present invention from the second perspective.

[0029] Reference numerals:

[0030] 1 - Injection molded housing, 11 - Inlaid panel, 12 - First chamber, 13 - Second chamber, 14 - Avoidance groove, 15 - Installation channel, 16 - Installation part, 17 - Glue injection chamber, 18 - Partition board, 19 - Notch, 110 - Lower cover, 111 - Protrusion part, 2 - PCBA, 21 - Circuit board, 22 - Capacitor, 3 - DC bus bar, 31 - Positive copper bar, 32 - Negative copper bar, 33 - Pin, 4 - Magnetic ring, 5 - High - voltage guide post, 51 - Fastener, 6 - Grounding guide post. Detailed implementation manners

[0031] Next, the technical solutions of the present invention will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments.

[0032] Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents the selected embodiments of the present invention.

[0033] All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0034] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. These terms are only used for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and should not be construed as indicating or implying relative importance.

[0035] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "mounted", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] Next, refer to Figures 1 to 5 to describe the filter and inverter according to some embodiments of the present application.

[0037] The present application provides a filter, as Figure 1 shown. The filter includes an injection molded housing 1, a PCBA 2 (Printed Circuit Board Assembly), a DC busbar 3, and a magnetic ring 4.

[0038] An inlay panel 11 is provided inside the injection molded housing 1. Combining Figure 4 and Figure 5 shown, the inlay panel 11 is horizontally disposed in the middle of the injection molded housing 1, so that the inlay panel 11 divides the internal space of the injection molded housing 1 into two upper and lower chambers, namely a first chamber 12 above the inlay panel 11 and a second chamber 13 below the inlay panel 11.

[0039] Among them, the first chamber 12 above the inlay panel 11 is used to mount the PCBA 2. The PCBA 2 includes a circuit board 21 and a capacitor 22 soldered to the circuit board 21. By soldering the circuit board 21 and the capacitor 22 mounted thereon, the connection between the two is more stable and the anti-vibration performance is also better. Combining Figure 2As shown, when installing the PCBA 2 in the first chamber 12, the PCBA 2 is placed in the first chamber 12 with the capacitor 22 facing downwards, that is, the circuit board 21 and the inlay board 11 are arranged at an interval facing each other. The capacitor 22 is located on the lower surface of the circuit board 21 facing the inlay board 11, and the capacitor 22 is placed on the inlay board 11; an adhesive is coated on the lower end surface of the capacitor 22 facing the inlay board 11, so that the capacitor 22 is bonded to the inlay board 11, thereby stably fixing the PCBA 2 in the injection molded housing 1.

[0040] As Figure 3 shown, the DC busbar 3 passes through the second chamber 13, and both ends of the DC busbar 3 in the length direction extend out of the injection molded housing 1 from the side walls on both sides of the second chamber 13, so that the filter can be electrically connected to external devices through the DC busbar 3. A lower cover 110 for closing the second chamber 13 is provided at the lower end of the injection molded housing 1. The lower cover 110 is connected to the side wall of the injection molded housing 1 and clamps and fixes the DC busbar 3 between the side wall of the injection molded housing 1 and the lower cover 110, thereby fixing the DC busbar 3.

[0041] Preferably, as Figure 1 、 Figure 3 and Figure 4 shown, the injection molded housing 1 is provided with notches 19 on the side walls on opposite sides of the second chamber 13. When the DC busbar 3 is placed in the second chamber 13, both ends of the DC busbar 3 can extend out of the injection molded housing 1 from the side walls on both sides of the second chamber 13 respectively. The lower cover 110 of the injection molded housing 1 can be bonded or connected to the lower end of the injection molded housing 1 by friction welding to close the second chamber 13, and protrusions 111 are provided at positions of the lower cover 110 of the injection molded housing 1 opposite to the notches 19 on both sides of the side wall of the injection molded housing 1. The protrusions 111 can be inserted into the corresponding notches 19 and tightly abut against the DC busbar 3 in the notches 19, thereby realizing the clamping and fixing of the DC busbar 3.

[0042] As Figures 1 to 3 shown, the magnetic ring 4 is also installed in the second chamber 13, and the magnetic ring 4 is sleeved on the DC busbar 3, so that the inner ring surface of the magnetic ring 4 is in contact with the DC busbar 3. At the same time, the outer surface of the magnetic ring 4 can be in contact with the inlay board 11 and the injection molded housing 1, that is, the upper surface of the outer surface of the magnetic ring 4 facing the inlay board 11 is attached to the inlay board 11, the lower surface of the outer surface of the magnetic ring 4 is attached to the lower cover 110 of the injection molded housing 1, and the outer surfaces on both sides of the magnetic ring 4 can be abutted and attached to the side wall of the injection molded housing 1. An adhesive is coated between the outer surface of the magnetic ring 4 and the inlay board 11, the side wall of the injection molded housing 1 and the lower cover 110 of the injection molded housing 1 to bond and fix the magnetic ring 4 in the second chamber 13, thereby stably and firmly installing the magnetic ring 4 in the injection molded housing 1, and the magnetic ring 4 will not slide back and forth or shake up and down in the injection molded housing 1.

[0043] Therefore, by arranging an inlaid board 11 inside the injection-molded housing 1 of the filter, the circuit board 21 and the capacitor 22 of the PCBA 2 are welded and connected, and a small amount of adhesive is applied between the capacitor 22 and the inlaid board 11 for fixation; the DC busbar 3 is clamped and fixed between the side wall of the injection-molded housing 1 and the lower cover 110, and the magnetic ring 4 sleeved on the DC busbar 3 is adhesively fixed to the inlaid board 11 and the injection-molded housing 1 through a small amount of adhesive, thereby ensuring the stability of the installation of the injection-molded housing 1 of the filter and its internal components, improving the anti-vibration performance. At the same time, compared with the traditional glue-filling fixation method, the amount of adhesive used is greatly reduced to meet the environmental protection requirements, and the equipment cost is also reduced, improving the competitiveness of the product.

[0044] In this embodiment, preferably, as Figure 3 and Figure 5 shown, a partition board 18 is further formed in the second chamber 13 of the injection-molded housing 1. Specifically, partition boards 18 are respectively arranged on both sides in the length direction of the magnetic ring 4, so as to partition a predetermined space in the second chamber 13 for installing the magnetic ring 4. The magnetic ring 4 can be placed between the two partition boards 18, and both ends in the length direction of the magnetic ring 4 can be adhesively fixed to the two partition boards 18 through adhesive, thereby further improving the stability of the installation of the magnetic ring 4 and the anti-vibration performance of the filter.

[0045] In this embodiment, preferably, the number of magnetic rings 4 is at least one; Figure 1 and Figure 3 show a form in which two magnetic rings 4 are installed on the DC busbar 3. The two magnetic rings 4 are arranged at intervals relative to each other on the DC busbar 3, and inlaid boards 11 are arranged at both ends in the length direction of each magnetic ring 4.

[0046] In an embodiment of the present application, preferably, as Figure 1 and Figure 4 shown, the corners of the inlaid board 11 protrude out of the injection-molded housing 1, and the part of the inlaid board 11 protruding out of the injection-molded housing 1 forms a mounting portion 16; during the use of the filter, it can be installed in the inverter box body, and a connecting column is arranged in the inverter. The filter is connected to the connecting column through the mounting portion 16 to install the filter in the inverter. The material of the inlaid board 11 is a metal material. The inlaid board 11 can be grounded through connection with the connecting column in the inverter box body, or the heat on the inlaid board 11 can be transferred to the heat dissipation system of the inverter through the connecting column for heat dissipation.

[0047] In terms of heat dissipation, when the filter is working, one of the main heat sources of the filter is the capacitor 22, as Figure 2As shown, by directly placing the capacitor 22 on the inlay board 11, heat conduction can occur between the capacitor 22 and the inlay board 11, so that the heat generated when the capacitor 22 operates can be quickly conducted out through the inlay board 11, thereby achieving good heat dissipation.

[0048] Another main heat source of the filter is the DC busbar 3. In order to effectively dissipate the heat of the DC busbar 3, in an embodiment of the present application, preferably, as Figure 5 shown, a glue injection cavity 17 is provided on the side wall of the injection molded housing 1 of the second chamber 13. Both ends of the glue injection cavity 17 are open, and one end of the glue injection cavity 17 abuts against the inlay board 11, and the other end of the glue injection cavity 17 can abut against the DC busbar 3 installed in the second chamber 13. The glue injection cavity 17 is filled with thermal conductive glue, so that a heat path is formed between the DC busbar 3 and the inlay board 11, and the heat generated by the DC busbar 3 can be quickly transferred to the inlay board 11 through the thermal conductive glue, and then the filter can be quickly dissipated through the heat exchange between the inlay board 11 and the inverter system.

[0049] Preferably, as Figure 5 shown, the number of the glue injection cavities 17 is multiple, and the multiple glue injection cavities 17 are arranged at intervals on the side wall of the injection molded housing 1.

[0050] Therefore, by setting the inlay board 11, the capacitor 22 is directly installed close to the inlay board 11 so that the two can conduct heat, and the DC busbar 3 can conduct heat with the inlay board 11 through the thermal conductive glue, which not only makes the installation of the internal structure of the filter more compact, but also has a good heat dissipation path.

[0051] In an embodiment of the present application, preferably, as Figure 1 and Figure 2 shown, when the circuit board 21 of the PCBA2 is installed, it needs to be grounded. A grounding post 6 is provided between the circuit board 21 and the inlay board 11. One end of the grounding post 6 is welded or riveted to the inlay board 11, and the other end of the grounding post 6 is welded to the circuit board 21, so that the circuit board 21 of the PCBA2 is grounded to the inlay board 11 through the grounding post 6; and the circuit board 21 and the inlay board 11 can also be fixedly connected through the grounding post 6, so that the PCBA2 is more stably installed in the injection molded housing 1, improving the anti-vibration performance of the filter.

[0052] In an embodiment of the present application, preferably, as Figure 2 shown, a high-voltage post 5 for electrically connecting the circuit board 21 and the DC busbar 3 is also provided in the filter; the DC busbar 3 includes a positive copper busbar 31 and a negative copper busbar 32, and not less than two pins 33 are respectively provided on the positive copper busbar 31 and the negative copper busbar 32, and each pin 33 is connected to the circuit board 21 through a high-voltage post 5; asFigure 2 and Figure 3 As shown in Figure 3 , three pins 33 are provided on the positive copper bar 31 of the DC bus bar 3, enabling the circuit board 21 to be electrically connected to the positive copper bar 31 through three high-voltage guide posts 5; three pins 33 are also provided on the negative copper bar 32 of the DC bus bar 3, enabling the circuit board 21 to be electrically connected to the negative copper bar 32 through another three high-voltage guide posts 5.

[0053] Preferably, in order to enable one end of the high-voltage guide post 5 to be located in the first chamber 12 for electrical connection to the circuit board 21 and the other end to be located in the second chamber 13 for electrical connection to the DC bus bar 3, avoidance grooves 14 are respectively formed on the mosaic plate 11 at positions directly opposite to each high-voltage guide post, as Figure 2 shown, so that the high-voltage guide post 5 can pass through the mosaic plate 11, and the through-diameter of the avoidance groove 14 is greater than that of the high-voltage guide post 5 to prevent the high-voltage guide post 5 from contacting the metal mosaic plate 11.

[0054] In this embodiment, preferably, as Figure 4 shown, an installation channel 15 is further formed on the side wall of the injection-molded housing 1 in the first chamber 12 at a position directly opposite to the high-voltage guide post. The high-voltage guide post 5 can extend into the installation channel 15, and the end of the high-voltage guide post 5 for connection to the circuit board 21 extends out of the installation channel 15 to connect to the circuit board 21; the installation channel 15 is filled with an adhesive to bond the high-voltage guide post 5 in the installation channel 15, enabling the high-voltage guide post 5 to be stably fixed on the injection-molded housing 1. Furthermore, the circuit board 21 of the PCBA 2 and the DC bus bar 3 are stably fixedly connected together and electrically connected through the high-voltage guide post 5, improving the vibration resistance of the filter.

[0055] In this embodiment, preferably, as Figure 3 and Figure 5 shown, the lower end of the high-voltage guide post 5 is connected to the pin 33 of the DC bus bar 3 through a fastener 51. An internal-thread installation hole is formed at the lower end of the high-voltage guide post 5, an installation hole is formed on the pin 33, and a fastening screw adapted to the fastener 51, i.e., the internal-thread installation hole, is provided in the installation hole. Thus, the high-voltage guide post 5 can be firmly connected to the pin 33 of the DC bus bar 3 through the fastening screw, achieving both mechanical connection and electrical connection between the two. The connection between the other end of the high-voltage guide post 5 and the circuit board 21 is a welding connection, ensuring the stability of the connection and improving the vibration resistance of the filter.

[0056] This application also provides an inverter, including the filter of any of the above embodiments.

[0057] In this embodiment, the inverter includes a filter. Therefore, the inverter has all the beneficial effects of the filter, which will not be elaborated here one by one.

[0058] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A filter, characterized in that, It includes an injection molded housing, a PCBA, a DC bus bar, and a magnetic ring; An inlay board is arranged inside the injection molded housing, and the injection molded housing forms a first chamber and a second chamber on both sides of the inlay board; The PCBA is installed in the first chamber, the circuit board of the PCBA faces the inlay board and is spaced apart, the capacitors of the PCBA are welded to the circuit board and the capacitors are bonded to the inlay board; The DC bus bar passes through the second chamber, and the DC bus bar is clamped between the side wall of the injection molded housing and the lower cover of the injection molded housing; The magnetic ring is installed in the second chamber, the magnetic ring is sleeved on the DC bus bar, and the outer surface of the magnetic ring is bonded to the inlay board and the injection molded housing; The filter further includes a high-voltage guide post; An avoidance groove is formed on the inlay board, and the high-voltage guide post can pass through the inlay board through the avoidance groove, so that one end of the high-voltage guide post extends into the first chamber and is electrically connected to the circuit board, and the other end of the high-voltage guide post extends into the second chamber and is connected to the pin of the DC bus bar; An installation channel is formed on the side wall of the injection molded housing, the high-voltage guide post passes through the installation channel, and an adhesive is filled between the installation channel and the high-voltage guide post to bond the high-voltage guide post and the installation channel; An internal thread installation hole is formed at one end of the high-voltage guide post for connecting with the pin, and a fastener adapted to the internal thread installation hole is passed through the pin, so that the high-voltage guide post is electrically connected to the pin through the fastener; One end of the high-voltage guide post facing the circuit board is welded to the circuit board.

2. The filter according to claim 1, characterized in that, The material of the inlay board is a metal material, so that the capacitors and the magnetic ring can conduct heat with the inlay board; Part of the inlay board extends out of the injection molded housing and forms an installation part, and the installation part is used for connecting with a connecting column in the inverter box body for grounding and heat conduction of the inlay board.

3. The filter according to claim 2, wherein It also includes a grounding guide post; One end of the grounding guide post is welded to the circuit board, and the other end of the grounding guide post is welded or riveted to the inlay board, so that the circuit board is electrically connected to the inlay board through the grounding guide post.

4. The filter according to claim 2, wherein The injection molded housing forms a glue injection cavity in the second chamber; Both ends of the glue injection cavity are open ends, and one end of the glue injection cavity abuts against the inlay board, and the other end of the glue injection cavity abuts against the DC bus bar; The glue injection cavity is used for filling a heat-conducting glue, so that the DC bus bar can transfer heat to the inlay board through the heat-conducting glue.

5. The filter according to claim 1, characterized in that, Partition plates are arranged on both sides of the magnetic ring in the length direction of the magnetic ring, and both ends of the magnetic ring are respectively bonded to the corresponding partition plates.

6. The filter according to claim 1, wherein A notch is formed on the side wall of the injection molded housing to enable the DC bus bar to pass through the injection molded housing; A convex part is formed on the lower cover of the injection molded housing, and the convex part can extend into the notch and tightly abut against the DC bus bar.

7. An inverter, characterized in that, It includes the filter according to any one of claims 1-6.

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