Exposure apparatus and method of manufacturing article

Abstract

An exposure apparatus and a method of manufacturing an article are disclosed. The present invention provides an exposure apparatus that exposes a substrate, including: an optical system configured to emit light for exposing the substrate in a first direction; a first supply configured to supply a gas into a chamber in which the optical system is arranged; and a second supply configured to supply a gas to a light path space through which the light from the optical system passes, wherein the second supply includes a gas blower including a blow port from which a gas is blown in a second direction, and a guide member configured to guide the gas blown from the blow port to the light path space, and the guide member includes a plate member that extends on a first direction side of the blow port so as to be arranged along the second direction.

Description

Technical Field

[0001] This invention relates to an exposure apparatus and a method for manufacturing articles. Background Technology

[0002] As one of the apparatuses used in the manufacturing process (photolithography process) of liquid crystal panels, semiconductor devices, etc., there exists an exposure apparatus that projects a pattern image of a master onto a substrate using a projection optical system and exposes the substrate. In the exposure apparatus, it is known that when a resist (photosensitive material) applied to the substrate is exposed, gas (outgas) is generated from the resist. If the outgas reacts with impurities such as acids, alkalis, or organic substances in the surrounding atmosphere or in the surface film of the optical element, this causes fogging of the optical element arranged around the substrate. In particular, the optical element located at the lowermost end of the projection optical system is arranged facing the substrate, making it possible for fogging to occur due to the outgas from the resist. If the optical element fogs, the light transmittance of the optical element decreases, which can lead to insufficient exposure, uneven illumination, or flare. Japanese Patent Application Publication No. 2005-333152 discloses an arrangement in which gas blown downward from a nozzle provided in the side of the projection optical system is guided along the curved surface of a guide element using the Coanda effect to supply gas between the projection optical system and the substrate.

[0003] In the arrangement described in Japanese Patent Application Publication No. 2005-333152, the flow direction of the gas is changed by the wall-attachment effect through a guiding member, and such gas has the property of entraining surrounding gas. Therefore, the gas can flow between the optical element and the substrate of the projection optical system while entraining exhaust gas generated from the resist. Consequently, exhaust gas reaching the optical element of the projection optical system (i.e., fogging of the optical element) cannot be sufficiently avoided. Summary of the Invention

[0004] The present invention provides an exposure apparatus that is advantageous, for example, in reducing fogging of optical elements in an optical system.

[0005] According to one aspect of the present invention, an exposure apparatus for exposing a substrate is provided, comprising: an optical system configured to emit light for exposing the substrate in a first direction; a first feeder configured to supply gas into a chamber in which the optical system is disposed; and a second feeder configured to supply gas into an optical path space through which light from the optical system passes, wherein the second feeder includes a gas blower and a guide member, the gas blower including a blow-out port, gas being blown out from the blow-out port in a second direction at a flow rate higher than that of gas blown out from the first feeder, and the guide member being configured to guide the gas blown out from the blow-out port into the optical path space, and the guide member including a plate member extending on the first direction side of the blow-out port for being arranged along the second direction in which gas is blown out from the blow-out port.

[0006] Further features of the invention will become clear from the following description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0007] Figure 1 This is a diagram showing the overall arrangement of the exposure apparatus;

[0008] Figure 2A and Figure 2B Each of the figures shows an example arrangement of the second feeder according to the first embodiment;

[0009] Figure 3 This is a diagram illustrating an example arrangement of the second feeder according to the first embodiment attached to the projection optical system;

[0010] Figures 4A to 4D These are diagrams showing examples of the arrangement and shape of the air inlets inside the guide member;

[0011] Figure 5 This is a diagram illustrating a modification of the second feeder according to the first embodiment;

[0012] Figure 6A and Figure 6B Each of these figures shows another modification of the second feeder according to the first embodiment;

[0013] Figure 7A and Figure 7B These are diagrams showing yet another modification of the second feeder according to the first embodiment;

[0014] Figure 8 This is a diagram illustrating an example arrangement of the second feeder according to the second embodiment;

[0015] Figure 9This is a diagram illustrating an example arrangement of the second feeder according to the third embodiment;

[0016] Figure 10 This is a diagram illustrating an example arrangement of the second feeder according to the fourth embodiment;

[0017] Figure 11 This is a diagram illustrating an example arrangement of the second feeder according to the fifth embodiment; and

[0018] Figure 12 This is a diagram illustrating an example arrangement of the second feeder according to the sixth embodiment. Detailed Implementation

[0019] In the following, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments are not intended to limit the scope of the claimed invention. Multiple features are described in the embodiments, but this does not limit the invention to requiring all such features, and multiple such features can be appropriately combined. Furthermore, in the drawings, the same reference numerals are given the same or similar configuration, and redundant descriptions thereof are omitted.

[0020] <First Embodiment>

[0021] The first embodiment of the present invention will now be described. Figure 1 This is a diagram showing the general arrangement of the exposure apparatus 100 according to this embodiment. The exposure apparatus 100 according to this embodiment is a step-scan exposure apparatus that exposes the substrate W while simultaneously scanning the master image M and the substrate W, thereby transferring the pattern of the master image M onto the substrate. The exposure apparatus 100 is also referred to as a scanning exposure apparatus or a scanner. In this embodiment, the master image M is, for example, a quartz mask (reticle) on which circuit patterns on each of a plurality of impact regions to be transferred onto the substrate W are formed. The substrate W is a wafer coated with photoresist, and for example, a single-crystal silicon substrate can be used. Note that in this embodiment, a step-scan exposure apparatus is described exemplarily, but the present invention can also be applied to a step-repeat exposure apparatus.

[0022] The exposure apparatus 100 may include an illumination optics system 1, a movable stage 2 that holds the original image M, a projection optics system 3, a movable stage 4 that holds the substrate W, and a controller 5. The controller 5 is, for example, a computer including a CPU and memory, and is electrically connected to the various units in the apparatus, thereby comprehensively controlling the overall operation of the apparatus. In the following description, the direction parallel to the optical axis of the light emitted from the projection optics system 3 and illuminating the substrate W is assumed to be the Z-axis direction, and two directions orthogonal to each other in a plane perpendicular to the optical axis are assumed to be the X-axis direction and the Y-axis direction, respectively. Note that in the following description, the "X-axis direction" can be defined to include both the +X and -X directions. This also applies to the "Y-axis direction" and the "Z-axis direction".

[0023] The illumination optics system 1 shapes light emitted from a light source LS, such as a mercury lamp, an ArF excimer laser, or a KrF excimer laser, into a light shape, for example, a strip or an arc-shaped slit, and uses this slit-shaped light to illuminate a portion of the original image M. The light passing through this portion of the original image M enters the projection optics system 3 as pattern light reflecting the pattern of that portion of the original image M. The projection optics system 3 has a predetermined projection magnification and projects the pattern image of the original image M onto a substrate (more specifically, a resist on the substrate) using the pattern light. The original image M and the substrate W are held by the original stage 2 and the substrate stage 4, respectively, and are arranged in an optically conjugate position (the object plane and the image plane of the projection optics system 3) via the projection optics system 3. The controller 5 scans the original stage 2 and the substrate stage 4 relative to each other in a predetermined scanning direction (e.g., the X direction) at a speed ratio matched to the projection magnification of the projection optics system 3. Using this arrangement, the pattern of the original image M can be transferred onto the substrate. Here, in this embodiment, each of the illumination optical system 1 and the projection optical system 3 is configured to emit light downwards (in the -Z direction or the first direction). Therefore, in the following description, "downwards" is used to refer to the direction side (in the -Z direction or the first direction side) from which light is emitted from the illumination optical system 1 and the projection optical system 3.

[0024] The exposure apparatus 100 also includes a first supply 7, which supplies gas 41 (e.g., clean air) from a first gas supply source 31 into the interior of the chamber 6 where the projection optics system 3 is arranged. For example, the first supply 7 may be configured as a circulating gas supply mechanism to generate a predetermined airflow within the chamber 6. In this case, the first gas supply source 31 includes, for example, a fan, a filter, etc., and is configured to send gas drawn from the interior of the chamber by a suction device 33 to the first supply 7. The first supply 7 then generates a predetermined airflow within the chamber 6 by blowing the gas 41 sent (supplied) from the first gas supply source 31 into the chamber. Here, the gas outlet in the first supply 7 may be provided, for example, on the inner surface (e.g., the wall) of the chamber 6, or may be provided (arranged) inside the chamber 6. The first gas supply source 31 may be a component of the exposure apparatus 100, but when applied to equipment in a factory where the exposure apparatus 100 is installed, it may not be a component of the exposure apparatus 100. Note that in Figure 1 In the example arrangement of the exposure apparatus 100 shown, the illumination optical system 1 is also provided with a first feeder 7.

[0025] In the exposure apparatus 100, it is known that when the resist (photosensitive material) applied to the substrate is exposed, gas (exhaust gas 50) is generated from the resist. If this exhaust gas 50 reacts with impurities such as acids, alkalis, or organic substances in the surrounding atmosphere or in the surface film of the optical elements, this causes fogging of the optical elements arranged around the substrate W. In particular, the optical elements (e.g., lenses, glass plates, or mirrors) located at the lowermost end of the projection optical system 3 are arranged facing the substrate W, making fogging possible due to the exhaust gas 50 from the resist. If the optical elements fog, the light transmittance of the optical elements decreases, which can lead to insufficient exposure, uneven illumination, or flare. Therefore, the exposure apparatus 100 according to this embodiment includes a second supplier 8 that supplies gas 42 to the optical path space S through which the light (pattern light) from the projection optical system 3 passes. The specific arrangement of the second supplier 8 will be described below.

[0026] [Arrangement of the second supply unit]

[0027] Figure 2A and Figure 2B These are diagrams illustrating examples of the arrangement of the second feeder 8 according to this embodiment. Besides the second feeder 8, Figure 2A and Figure 2B Each of them also shows a portion of the projection optical system 3 around the second feeder 8, the substrate W, and the substrate stage 4. Figure 2A and Figure 2BThe example shown differs in the arrangement of the gas exhauster 9, but is similar in the rest of the arrangement (such as the arrangement of the second supply 8). The gas exhauster 9 is a mechanism that exhausts the gas that has passed through the optical path space S to the outside. Figure 2A and Figure 2B As shown in each of the diagrams, at the lower part (-Z direction side or first direction side) of the projection optical system 3, the gas exhauster 9 can be arranged relative to the optical path space S on the opposite side of the second supply 8. The gas exhauster 9 can be configured to draw gas from the opening 9a provided on the substrate W side and exhaust it, as shown in the diagram. Figure 2A As shown, or it can be configured to draw gas from the opening 9b provided on the side of the second feeder 8 and discharge it, as shown. Figure 2B As shown in the image.

[0028] The second supply unit 8 includes a gas blower 10 and a guide member 20 (rectifier), and is configured to supply gas 42 to the optical path space S through which the light (patterned light) from the projection optical system 3 passes. Here, for example, the optical path space S can be defined as the space between the optical element 3a located at the lowermost end of the projection optical system 3 and facing the substrate W, and the substrate W held by the substrate stage 4. The optical element 3a can be, for example, a light-transmitting element that transmits light, such as a lens or a glass plate, or a light-reflecting element that reflects light, such as a mirror.

[0029] The gas blower 10 includes a blowout port 11 from which gas 43 (e.g., clean air or nitrogen) is blown at a velocity higher than that of gas 41 blown from the first supply unit 7. The gas blower 10 is formed as a pipe defining a gas flow path, with its upstream side (the end opposite the blowout port 11) connected to a utility. For example, such as... Figure 1 As shown, the gas blower 10 is connected to a second gas supply source 32, which is different from the first gas supply source 31 used to send gas 41 to the first supplyer 7, and is configured to blow gas sent (supplied) from the second gas supply source 32 out of the blow port 11. Here, the second gas supply source 32 may be a component of the exposure apparatus 100, but when it is applied to equipment such as in a factory where the exposure apparatus 100 is installed, it may not be a component of the exposure apparatus 100. When the second gas supply source 32 is arranged as a component of the exposure apparatus 100, the second gas supply source 32 includes, for example, a fan, a compressor, an evaporator, a high-pressure cylinder, etc., and may provide a pressure regulator.

[0030] The guiding member 20 is a member that guides (rectifies) the gas 43 blown from the blowing port 11 into the optical path space S. The guiding member 20 includes a first plate member 21 (lower plate member) extending below the blowing port 11 (on the -Z direction side or the first direction side) and arranged along the blowing direction (-Y direction or the second direction) of the gas 43 from the blowing port 11 of the gas blower 10. The first plate member 21 includes a first end 21a closer to the optical path space S than the blowing port 11 of the gas blower 10 and a second end 21b further away from the optical path space S than the blowing port 11. That is, the blowing port 11 of the gas blower 10 is arranged between the first end 21a and the second end 21b of the first plate member 21 in the blowing direction of the gas 43. Here, the first end 21a of the first plate member 21 is arranged below the projection optical system 3, and preferably below a portion of the optical element 3a of the projection optical system 3. On the other hand, the second end 21b of the first plate member 21 is arranged at a position that may be separated from the optical path space S, and preferably is arranged outside the movable range of the substrate W (substrate stage 4). As an example, the second end 21b of the first plate member 21 may be arranged between the blowing port 11 of the gas blower 10 and the gas blowing port of the first supplier 7. With this arrangement, the amount of exhaust gas 50 generated from the substrate W that is entrained into the gas 43 blown out from the blowing port 11 can be reduced, so that cleaner gas can be supplied to the optical path space S.

[0031] In this embodiment, in addition to the first plate member 21, the guide member 20 is configured to also include a second plate member 22 (upper plate member) extending above the blow port 11 to face the first plate member 21. That is, the second plate member 22 extends relative to the blow port 11 on the opposite side of the first plate member 21 (the +Z direction side of the blow port 11) to face the first plate member 21. The guide member 20 is formed in a tubular shape, wherein portions of its inner surface (lower surface and upper surface) are defined by the first plate member 21 and the second plate member 22, respectively. In this case, a first opening 20a and a second opening 20b can be formed in the tubular guide member 20, one side of the first opening 20a being defined by a first end portion 21a of the first plate member 21, and one side of the second opening 20b being defined by a second end portion 21b of the first plate member 21 on the opposite side of the first opening 20a.

[0032] The gas blower 10 is configured such that a blow port 11 is disposed between a first opening 20a and a second opening 20b inside the tubular guide member 20, and the area of ​​the blow port 11 is smaller than the cross-sectional area (XZ cross-sectional area) of the guide member 20. As an example, the gas blower 10 may include a first tube 12 and a second tube 13. The first tube 12 includes the blow port 11 as one end and is disposed inside the guide member 20. The second tube 13 extends through the guide member 20 (the second plate member 22) and communicates with the other end of the first tube 12 (the end opposite the blow port 11). The second tube 13 may be connected to a second gas supply source 32.

[0033] like Figure 3 As shown, the gas blower 10 (first tube 12 and second tube 13) can be attached to the projection optical system 3. Figure 3 This diagram illustrates an example arrangement of the second feeder 8 (gas blower 10) attached to the projection optical system 3 according to this embodiment. This arrangement can be advantageous in terms of space constraints within the exposure apparatus 100 and reducing fluctuations in the positional relationship between the gas blower 10 and the optical element 3a. Note that, as Figure 2A and Figure 2B Each of the gas exhausters 9 shown in the diagram can also be... Figure 3 The arrangement shown is provided.

[0034] The second feeder 8, arranged as described above, blows gas 43 from the blow port 11 of the gas feeder 10 at a flow rate higher than that of the gas blown from the first feeder 7, in the direction (-Y direction) toward the first opening 20a of the guide member 20. With this arrangement, gas 41 is drawn from the second opening 20b of the guide member 20, and the gas 41 drawn from the second opening 20b can be blown out of the first opening 20a of the guide member 20 together with the gas 43 from the blow port 11 into the optical path space S. That is, a gas 42 with a flow rate greater than that of the gas 43 blown from the blow port 11 can be supplied, in an amount that is greater than the amount of gas 41 drawn from the second opening 20b of the guide member 20.

[0035] This principle will be described in detail. When gas 43 is blown out of the blowing port 11 of the gas blower 10 at a flow rate higher than that of gas 41 blown out from the first supply 7, gas 41 is drawn in around the blowing port 11 inside the guide member 20, resulting in a low pressure (negative pressure) around the blowing port 11. Therefore, depending on the blowing of gas 43 from the blowing port 11, gas 41 is drawn (inhaled) into the guide member 20. Here, since the blowing port 11 is surrounded by the guide member 20, the inlet of gas 41 is restricted to either the first opening 20a or the second opening 20b. However, since gas 43 blown out from the blowing port 11 flows in the -Y direction, the gas flow inside the guide member 20 is formed in the direction from the second opening 20b to the first opening 20a. Therefore, gas 41 is drawn in from the second opening 20b. On the other hand, due to the blowing direction of gas 43 from the blowing port 11, almost no gas is drawn in from the first opening 20a. Therefore, gas 42, with a flow rate equal to or greater than that of gas 43 supplied to the blowing port 11 of gas blower 10, can be blown from the first opening 20a of guide member 20 into optical path space S.

[0036] Here, the arrangement direction of the guide member 20 from the second opening 20b to the first opening 20a does not necessarily need to match the direction of the gas 41 blown out from the gas outlet of the first supplier 7. As described above, the suction direction of the gas 41 is determined by the blowing direction of the gas 43 from the outlet 11 and the direction of the guide member 20. However, for the suction of cleaner gas 41 excluding the exhaust 50, the blowing direction of the gas 41 from the first supplier 7 is preferably matched with the arrangement direction from the second opening 20b to the first opening 20a. In addition, excluding the exhaust 50, the second opening 20b only needs to be located away from the optical path space S, but the second opening 20b is preferably arranged near the gas outlet of the first supplier 7. With this arrangement, clean gas 41 blown out from the gas outlet of the first supplier 7 can be drawn from the second opening 20b and supplied to the optical path space S from the first opening 20a.

[0037] Next, the position and shape of the blowing port 11 (first tube 12) of the gas blower 10 will be described. Figure 2A and Figure 2BIn each of the second feeders 8 shown, the outlet 11 of the gas blower 10 is arranged inside the guide member 20, separated from the first plate member 21, and provided in the second plate member 22; however, the invention is not limited thereto. The outlet 11 of the gas blower 10 can be arranged at any position inside the guide member 20 and has any shape, as long as the area of ​​the outlet 11 is smaller than the cross-sectional area (XZ cross-sectional area) of the guide member 20. For example, the outlet 11 of the gas blower 10 can be provided in the first plate member 21, or it can be arranged to be separated from both the first plate member 21 and the second plate member 22 (e.g., it can be arranged in the central portion of the guide member 20).

[0038] Figures 4A to 4D Each of these diagrams is a view of the second feeder 8 as seen from the -Y direction side, and illustrates examples of the arrangement and shape of the gas outlet 11 of the gas blower 10 within the guide member 20. The position and shape of the outlet 11 can be determined, for example, based on the velocity distribution of the gas 42 to be supplied to the optical path space S. For example, the outlet 11 can have a rectangular shape (linear shape), such as... Figure 4A As shown, it may also have a curved shape (arc shape), such as Figure 4B As shown in the diagram. Each of these arrangements is effective when the Y-direction flow velocity of the gas supplied from the second supplier 8 to the optical path space S changes according to the optical axis direction (Z-axis direction) of the light from the projection optical system 3. Figure 4A and Figure 4B In each of the arrangement examples shown, the blow-out port 11 is provided in the upper surface (second plate member 22) of the guide member 20. Therefore, the gas velocity in the optical path space S can increase as the gas gets closer to the optical element 3a of the projection optical system 3 (i.e., decrease as the gas gets closer to the substrate W). On the other hand, in order to reduce (homogenize) the difference in the -Y direction gas velocity along the optical axis in the optical path space S, it can be done as follows: Figure 4C and Figure 4D Each of them is configured / formed as shown in the diagram for the blowhole 11. Figure 4C and Figure 4D In each of the arrangement examples shown, the blow port 11 is provided not only in the upper surface (second plate member 22) of the guide member 20, but also in the side surface (X-axis direction side) or lower surface (first plate member 21) of the guide member 20.

[0039] Here, the arrangement of the second supply 8, which enables efficient extraction of gas 41 from the second opening 20b of the guide member 20, will be described. In the arrangement of the second supply 8 according to this embodiment as described above, the area of ​​the blowing port 11 is made smaller than the cross-sectional area of ​​the guide member 20 in order to increase the blowing velocity of the gas 43 from the blowing port 11. The smaller the area of ​​the blowing port 11, the more efficiently the gas can be extracted from the second opening 20b of the guide member 20 according to the expulsion of gas 43 from the blowing port 11. This is because the smaller the area of ​​the blowing port 11, the lower the pressure around the blowing port 11 can be inside the guide member 20. As an example, when the blowing port 11 is as follows... Figure 4A When the shape shown is rectangular, the smaller the opening height h1 of the blow port 11 is compared to the cross-sectional height h2 of the guide member 20, the more efficiently the gas 41 can be drawn from the second opening 20b of the guide member 20. The opening height h1 of the blow port 11 is preferably equal to or less than half of the cross-sectional height h2 of the guide member 20 (more preferably, equal to or less than 1 / 3 or 1 / 4). In terms of area, the cross-sectional area of ​​the blow port 11 is preferably equal to or less than 1 / 4 of the cross-sectional area of ​​the guide member 20 (more preferably, equal to or less than 1 / 9 or 1 / 16).

[0040] As an example, suppose the blowing port 11 of the gas blower 10 is as follows: Figure 4A The example shown is a rectangular shape with a cross-sectional height h2 of 5 mm for the guide member 20. In this case, when the ratio of the opening height h1 of the blow-out port 11 to the cross-sectional height h2 of the guide member 20 is approximately 1:7, gas 42 with a flow rate 2.5 times that of gas 43 blown out from the first opening 20a of the guide member 20 can be blown out. Note that the dimensions (e.g., height) of each of the guide member 20 and the blow-out port 11 can be arbitrarily set. For example, the dimensions of the first opening 20a and the second opening 20b of the guide member 20 can be arbitrarily set according to the distance (from a few mm to tens of mm) between the optical element 3a of the projection optical system 3 and the substrate W. For example, in order to efficiently draw gas 41 from the second opening 20b into the guide member 20, as... Figure 5 As shown, the guide member 20 can be configured such that the opening area of ​​the second opening 20b is larger than the opening area of ​​the first opening 20a. In this case, the opening height of the second opening 20b can be greater than the distance between the optical element 3a and the substrate W. As another arrangement for efficiently pumping gas 41, such as... Figure 6A As shown, the guide member 20 can be configured such that the first plate member 21 and the second plate member 22 of the guide member 20 are made with different lengths to form a large second opening 20b. Alternatively, as Figure 6BAs shown, the second opening 20b can have an inverted cone shape (i.e., a shape in which the cross-sectional area increases toward the second opening 20b) to efficiently draw in gas 41.

[0041] Alternatively, as a method to increase the flow rate of gas 43 from the blow port 11, such as Figure 7A and Figure 7B As shown in each of them, the shape of the blow port 11 or the shape of the tube portion (first tube portion 12 and second tube portion 13) of the gas blower 10 can be changed. For example, as Figure 7A and Figure 7B As shown in each of the figures, each of the first tube 12 and the second tube 13 can be formed into a curved shape, or can gradually taper toward the blowhole 11. Furthermore, as... Figure 7B As shown, when the outlet portion of the blow port 11 in the gas blower 10 is formed to have a curved shape to allow gas 43 to flow along the second plate member 22, the flow rate of gas 43 from the blow port 11 can be increased.

[0042] The distance (in the Y-axis direction) between the blowing port 11 of the gas blower 10 and the first opening 20a of the guide member 20 is preferably greater than, for example, the opening height h2 of the first opening 20a. That is, the blowing port 11 is preferably arranged on the inner side (+Y direction side) of the guide member 20 at a distance greater than the opening height h2 of the first opening 20a. With this arrangement, the flow of gas flowing into the guide member 20 from the first opening 20a (i.e., gas backflow) can be reduced. The closer the position (in the Y-axis direction) of the blowing port 11 is to the first opening 20a of the guide member 20, the more uniform the flow velocity distribution is before the first opening 20a. However, in the optical path space S, the flow velocity is high on the optical element 3a side and lower on the substrate W side than on the optical element 3a side. In this case, the intensity of blowing away the exhaust gas 50 changes in the Z direction. Therefore, most of the exhaust gas 50 can be blown away on the substrate W side, and the exhaust gas 50 that has passed through the substrate W side can be blown away at high speed on the optical element 3a side. On the other hand, the farther the position of the blow-out port 11 (in the Y-axis direction) is from the first opening 20a of the guide member 20, the more uniform the velocity distribution of the gas 42 blown out from the first opening 20a can be in the optical axis direction. In this case, a certain amount of exhaust gas 50 can be blown away in any region in the Z direction. In either case, the exhaust gas reaching the optical element 3a can be reduced. In order to prevent the gas 42 from being entrained by the surrounding gas (to more reliably maintain the above two velocity distributions), it is more preferable that the positional relationship between the second plate member 22 and the optical element 3a in the flow path of the gas 43 and the gas 42 is represented by a flat structure as much as possible. A flat structure is a structure in which the second plate member 22 and the optical element 3a are connected in a continuous plane. If a flat structure cannot be made, a structure with a concave portion is more preferable than a structure with a convex portion.

[0043] [Gas used in the second supply unit]

[0044] Next, the gas used by the second supply 8 will be described. The gas 42 supplied from the second supply 8 to the optical path space S flows near the optical element 3a. Therefore, the gas 42 is preferably a clean gas that does not atomize the optical element 3a. Clean gas means a gas that contains fewer impurities such as acids, alkalis, and organic matter compared to the atmosphere in the part where at least exhaust 50 has been generated. More preferably, a gas obtained by removing impurities such as acids, alkalis, and organic matter from the air (referred to as clean air), a gas obtained by drying clean air (referred to as clean dry air), an inert gas such as nitrogen, etc., can be used.

[0045] In some cases, the ambient gas 41 to be drawn from the second opening 20b of the guide member 20 may be contaminated by the exhaust gas 50. However, if the gas 41 is far from the source of the exhaust gas 50, it can be treated as a cleaner gas than the exhaust gas 50. Preferably, the ambient gas 41 in the space where the substrate stage 4 is arranged straightens along the direction (-Y direction) from the second opening 20b to the first opening 20a of the guide member 20. In this case, the ambient gas 41 to be drawn from the second opening 20b is maintained in a state that is cleaner than the atmosphere in the part where the exhaust gas 50 has been generated. In this embodiment, by blowing the gas 41 from the first supply 7, a gas flow is formed inside the chamber 6 along the direction (-Y direction) from the second opening 20b to the first opening 20a of the guide member 20. Therefore, the gas to be drawn from the second opening 20b into the guide member 20 is a cleaner gas than the atmosphere in the part where the exhaust gas 50 has been generated.

[0046] [Effect of the second feeder]

[0047] Next, the effect of the second supply 8 will be described. To prevent fogging of the optical element 3a, gas 42 is preferably supplied to the optical path space S through which the light (patterned light) from the projection optical system 3 passes, to blow away the exhaust gas 50 generated from the substrate W (resist) from the optical path space S. As described above, to efficiently blow away the exhaust gas 50 from the optical path space S, it is generally desirable to supply gas extensively to the optical path space S at a high flow rate. However, in conventional gas supply mechanisms that only provide a gas blower 10, gas is supplied locally at a high flow rate in the portion from which gas is blown out of the blow port 11 of the gas blower 10. In this case, the gas is entrained by the surrounding gas near the blow port 11, and also by the exhaust gas 50. Therefore, when the gas blown out from the blow port 11 reaches the optical path space S, it may be contaminated by the exhaust gas 50. Furthermore, the gas entrained in the blow port 11 can generate a flow of exhaust gas 50 towards the optical element 3a in the optical path space S. Therefore, it may be difficult to effectively blow away the exhaust gas from the optical path space S. Increasing the flow rate or range of gas blown from the gas blower 10 results in the consumption of a larger amount of gas. This may be disadvantageous in terms of production costs for semiconductor devices, etc.

[0048] On the other hand, in the second feeder 8 according to this embodiment, a guide member 20 is provided in addition to the gas blower 10. This limits the portion that is entrained by the gas blower 10 to the second opening 20b, thereby reducing the entrainment of the exhaust gas 50. That is, the cleanliness of the gas 42 is improved. In addition, the gas 43 blown out from the blow port 11 of the gas blower 10 is mixed with the gas 41 drawn from the second opening 20b of the guide member 20, and is supplied as gas 42 from the first opening 20a to the optical path space S. That is, gas 42 with a flow rate greater than that of gas 43 blown out from the blow port 11 can be supplied to the optical path space S. Furthermore, since the velocity distribution of the gas blown out from the first opening 20a of the guide member 20 is more uniform than the velocity distribution of the gas near the blow port 11, the local high velocity distribution of the gas in the optical path space S can be mitigated. That is, the local velocity distribution in the optical path space S can be reduced, the entrainment of exhaust gas 50 can be reduced, and a wide supply of gas with high velocity can be provided to the optical path space S. In this way, compared with a conventional gas supply mechanism, the second supply unit 8 according to this embodiment can increase the effect of preventing fogging of the optical element 3a. In addition, the second supply unit 8 according to this embodiment can reduce gas consumption. Therefore, it may be advantageous in terms of the production cost of semiconductor devices, etc.

[0049] <Second Embodiment>

[0050] A second embodiment of the invention will now be described. In this embodiment, modifications to the second feeder 8 will be described. Note that this embodiment substantially follows the first embodiment, and the arrangement and processing of the exposure apparatus 100 are similar to those in the first embodiment, unless otherwise specified below.

[0051] Figure 8 This is a diagram illustrating an example arrangement of the second feeder 8 according to this embodiment. Besides the second feeder 8, Figure 8 Also shown is a portion of the projection optical system 3 surrounding the second feeder 8, the substrate W, and the substrate stage 4. Note that it is also possible to... Figure 8 The arrangement shown provides, for example Figure 2A and Figure 2B Each of the gas exhausters 9 shown in the diagram.

[0052] When the temperature and / or humidity of the gas 43 blown from the outlet of the gas blower 10 differs from the temperature and / or humidity of the gas 41 blown from the first supplier 7, fluctuations may occur in the gas surrounding the optical element 3a. Such fluctuations affect the exposure light (pattern light) used to expose the substrate W and the measurement light used to measure the position of the substrate stage 4, and may make it difficult to accurately form a pattern on the substrate. To prevent this, the second supplier 8 according to this embodiment includes an air conditioner 14 that regulates the temperature and / or humidity of the gas 43 to be blown from the outlet 11 of the gas blower 10. The air conditioner 14 is provided upstream of the gas blower 10 (outlet 11). The air conditioner 14 regulates the temperature and / or humidity of the gas supplied from the second gas supply source 32 and sends the regulated gas to the gas blower 10 (outlet 11).

[0053] As an example, such as Figure 8 As shown, the air conditioner 14 may include a temperature regulator 14a for regulating the temperature of the gas 43 to be blown out of the outlet 11 and / or a humidity regulator 14b for regulating the humidity of the gas 43. The temperature regulator 14a uses a thermometer 15a that measures the temperature of the already temperature-regulated gas and a thermometer 15b that measures the temperature inside the chamber 6 (the temperature of the gas 41 supplied from the first supply unit 7) to regulate the temperature of the gas 43 to be blown out of the outlet 11. For example, the temperature regulator 14a may regulate the temperature of the gas 43 to be blown out of the outlet 11 such that the difference between the measurement results of the thermometer 15a and the thermometer 15b falls within an allowable range. On the other hand, the humidity regulator 14b uses a hygrometer 16a that measures the humidity of the already humidity-regulated gas and a hygrometer 16b that measures the humidity inside the chamber 6 (the humidity of the gas 41 supplied from the first supply unit 7) to regulate the humidity of the gas 43 to be blown out of the outlet 11. For example, the humidity regulator 14b can adjust the humidity of the gas 43 to be blown out from the blow port 11 so that the difference between the measurement results of the hygrometer 16a and the measurement results of the hygrometer 16b falls within an allowable range.

[0054] As described above, the second supply unit 8 according to this embodiment includes an air conditioner 14 (temperature regulator 14a and humidity regulator 14b) that regulates the temperature and / or humidity of the gas 43 to be blown out from the outlet 11 of the gas blower 10. This arrangement reduces gas fluctuations around the optical element 3a and improves the accuracy of pattern formation on the substrate.

[0055] <Third Embodiment>

[0056] A third embodiment of the invention will now be described. In this embodiment, another modification of the second feeder 8 will be described. Note that this embodiment substantially follows the first embodiment, and the arrangement and processing of the exposure apparatus 100 are similar to those in the first embodiment, unless otherwise specified below. Furthermore, this embodiment may also utilize the arrangement of the second embodiment.

[0057] In the second feeder 8 according to the first embodiment, the guide member 20 is formed in a tubular shape. However, the invention is not limited thereto. For example, since the guide member 20 is arranged to control the surrounding gas 41 from being entrained into the gas 43 blown out from the blow port 11 of the gas blower 10, the guide member 20 can be formed in a curved shape (arc shape), as long as it surrounds the blow port 11. Alternatively, when the concern is preventing the exhaust gas 50 from being entrained into the gas 43 blown out from the blow port 11, the guide member 20 is not limited to a tubular shape, but it can be formed without left and right sidewalls, such as... Figure 9 As shown in the image. Figure 9 This is a diagram of the second feeder 8 as viewed from the -Y direction side. Figure 9 The guide member 20 of the second feeder 8 shown includes only a first plate member 21, which extends below the blow port 11 to be arranged along the blowing direction (-Y direction) of the gas 43 from the blow port 11. Note that, in addition to the first plate member 21, the guide member 20 may also include a second plate member 22 extending above the blow port 11. The arrangement including the second plate member 22, compared to the arrangement including only the first plate member 21, improves the controllability of the surrounding gas 41 being entrained into the gas 43 blown from the blow port 11.

[0058] <Fourth Embodiment>

[0059] A fourth embodiment of the invention will be described. In this embodiment, yet another modification of the second feeder 8 will be described. Note that this embodiment substantially follows the first embodiment, and the arrangement and processing of the exposure apparatus 100 are similar to those in the first embodiment, unless otherwise specified below. Furthermore, this embodiment may also follow the arrangement of the second embodiment.

[0060] Figure 10 This is a diagram illustrating an example arrangement of the second feeder 8 according to this embodiment. Besides the second feeder 8, Figure 10 Also shown is a portion of the projection optical system 3 surrounding the second feeder 8, the substrate W, and the substrate stage 4. Note that it is also possible to... Figure 10 The arrangement shown provides, for example Figure 2A and Figure 2B Each of the gas exhausters 9 shown in the diagram.

[0061] In the second feeder 8 according to this embodiment, a gas blower 10 (blow port 11) is provided on the substrate side of the guide member 20 (i.e., the first plate member 21), such as Figure 10 As shown in the diagram. In this case, the velocity distribution of the gas 42 blown from the second supply 8 tends to be high on the substrate side. That is, the exhaust gas 50 can be blown away immediately after it is generated from the substrate W, so that the exhaust gas 50 can be effectively blown away from the optical path space S, preventing the exhaust gas 50 from reaching the optical element 3a. In addition, in the second supply 8 according to this embodiment, although the velocity distribution of the gas 42 blown from the second supply 8 is lower on the optical element 3a side than on the substrate side, it is ensured that the velocity and flow rate are sufficient to blow away the exhaust gas. Therefore, even if the exhaust gas 50 passes through the optical element 3a side where the gas velocity is relatively low, it can prevent the exhaust gas 50 from reaching the optical element 3a.

[0062] <Fifth Embodiment>

[0063] A fifth embodiment of the invention will now be described. In this embodiment, yet another modification of the second feeder 8 will be described. Note that this embodiment substantially follows the first embodiment, and the arrangement and processing of the exposure apparatus 100 are similar to those in the first embodiment, unless otherwise specified below. Furthermore, this embodiment may also follow the arrangement of the second embodiment.

[0064] Figure 11 This is a diagram illustrating an example arrangement of the second feeder 8 according to this embodiment. Besides the second feeder 8, Figure 11 Also shown is a portion of the projection optical system 3 surrounding the second feeder 8, the substrate W, and the substrate stage 4. Note that it is also possible to... Figure 11 The arrangement shown provides, for example Figure 2A and Figure 2B Each of the gas exhausters 9 shown in the diagram.

[0065] In the second supply device 8 according to this embodiment, the gas blower 10 includes a plurality of blowing ports 11. Figure 11In the example shown, the gas blower 10 includes a first blow-out port 11a provided on the optical element 3a side (i.e., the second plate member 22) of the guide member 20, and a second blow-out port 11b provided on the substrate W side (i.e., the first plate member 21) of the guide member 20. The gas supply source blown from the first blow-out port 11a and the gas supply source blown from the second blow-out port 11b may be included in a common system or may be included in different systems. In the arrangement of the second supplyer 8 according to this embodiment, the flow velocity distribution of the gas 42 blown from the second supplyer 8 is high on both the optical element 3a side and the substrate W side, making the overall flow velocity tend to be uniform. Therefore, the exhaust gas 50 can be effectively blown away from the optical path space S. In addition, since the overall flow velocity can be increased in the height direction, even if the exhaust gas 50 is generated from a wide range across the substrate W and the exhaust gas 50 leaks in the lateral direction (X-axis direction) of the second supplyer 8, the exhaust gas 50 can be effectively prevented from reaching the optical element 3a. Figure 11 An example is shown in which a plurality of gas blowers 10 extending through the first plate member 21 are provided, but a plurality of gas blowers 10 extending through the second plate member 22 may be provided.

[0066] <Sixth Embodiment>

[0067] A sixth embodiment of the invention will be described. In this embodiment, yet another modification of the second feeder 8 will be described. Note that this embodiment substantially follows the first embodiment, and the arrangement and processing of the exposure apparatus 100 are similar to those in the first embodiment, unless otherwise specified below. Furthermore, this embodiment may adopt the arrangement of the second embodiment.

[0068] Figure 12 This is a diagram illustrating an example arrangement of the second feeder 8 according to this embodiment. Besides the second feeder 8, Figure 12 Also shown is a portion of the projection optical system 3 surrounding the second feeder 8, the substrate W, and the substrate stage 4. Note that it is also possible to... Figure 12 The arrangement shown provides, for example Figure 2A and Figure 2B Each of the gas exhausters 9 shown in the diagram.

[0069] In the second feeder 8 according to this embodiment, the guide member 20 has a shape that bends midway. At least one blowing port 11 can be arranged inside the guide member 20. Figure 12In the arrangement shown, the blow port 11 is provided on the optical element 3a side of the guide member 20 (i.e., the second plate member 22). However, the invention is not limited to this, and the blow port 11 may be provided on the substrate W side of the guide member 20 (i.e., the first plate member 21), or the blow port 11 may be provided on both the optical element 3a side and the substrate W side. The arrangement of the second feeder 8 according to this embodiment is advantageous in situations where the second feeder 8 cannot be arranged due to space constraints around the projection optical system 3 (optical element 3a).

[0070] <Seventh Embodiment>

[0071] A seventh embodiment of the present invention will be described. In this embodiment, an example arrangement of the second feeder 8 will be described. Note that this embodiment substantially follows the first embodiment, and the arrangement and processing of the exposure apparatus 100 are similar to those in the first embodiment, unless otherwise specified below. Furthermore, this embodiment may also utilize the arrangements of each of the second to sixth embodiments described above.

[0072] In each of the above embodiments, an example has been described in which the second supply 8 is arranged to supply gas 42 to the optical path space S through which light (patterned light) from the projection optical system 3 passes. However, the invention is not limited thereto, and the second supply 8 may also be arranged to supply gas 42 to the optical path space through which light (slit-shaped light) from the illumination optical system 1 passes. For example, the second supply 8 may be arranged to supply gas 42 to the space between the illumination optical system 1 and the original plate M (original plate stage 2) through which light from the illumination optical system 1 passes. Alternatively, the second supply 8 may be arranged to supply gas 42 to the space between the original plate M (original plate stage 2) and the projection optical system 3 through which light transmitted through the original plate M passes. With this arrangement, exhaust gas can be prevented from reaching the optical elements of the illumination optical system 1 or the original plate M and from fogging the optical elements or the original plate M.

[0073] Here, factors causing fogging of the optical elements of the illumination optical system 1 will be described. Generally, not all components of the master stage 2 are made of cleaned metal. For example, there are resin components, adhesives, and grease, and even metal components may include areas that are not adequately cleaned. In this case, exhaust gas may be generated from the resin components, adhesives, grease, and areas that are not adequately cleaned. If the exhaust gas reaches the optical elements of the illumination optical system 1, it causes fogging of the optical elements. Similarly, if exhaust gas generated from the components of the master stage 2 reaches the master image M, it causes fogging of the master image M. In addition, there are cases where the illumination optical system 1 and / or the projection optical system 3 use components that generate exhaust gas, just like the master stage 2. In the same case, if the exhaust gas reaches the optical elements of the illumination optical system 1 or the master image M, it causes fogging of the optical elements or the master image M. In the cases described above, by arranging the second supply 8 described in each of the first to fourth embodiments to supply gas 42 to the optical path space of the light from the illumination optical system 1, exhaust gas can be prevented from reaching the optical elements of the illumination optical system 1 and / or the master image M. That is, it can reduce (suppress) the fogging of the optical elements of the illumination optical system 1 and / or the original M.

[0074] <Example of a method for manufacturing an article>

[0075] The method for manufacturing articles according to embodiments of the present invention is suitable for manufacturing articles, such as microdevices or elements having microstructures, like semiconductor devices. The method for manufacturing articles according to this embodiment includes the steps of forming a latent image pattern onto a photosensitive material applied to a substrate using the aforementioned exposure apparatus (the substrate exposure step), and developing (processing) the substrate on which the latent image pattern has been formed in the formation step. Furthermore, this manufacturing method includes other well-known steps (e.g., oxidation, deposition, vapor deposition, doping, planarization, etching, resist removal, dicing, bonding, encapsulation, etc.). Compared to conventional methods, the method for manufacturing articles according to this embodiment is advantageous in at least one aspect of article performance, quality, productivity, and production cost.

[0076] <Other Embodiments>

[0077] Embodiments of the present invention can also be implemented by a computer of a system or apparatus that reads and executes computer-executable instructions (e.g., one or more programs) recorded on a storage medium (which may also be more fully referred to as a 'non-transitory computer-readable storage medium') to perform one or more functions of the above embodiments and / or includes one or more circuits (e.g., application-specific integrated circuits (ASICs)) for performing one or more functions of the above embodiments, and by a method performed by a computer of the system or apparatus by, for example, reading and executing computer-executable instructions from the storage medium to perform one or more functions of the above embodiments and / or controlling one or more circuits to perform one or more functions of the above embodiments. The computer may include one or more processors (e.g., a central processing unit (CPU), a microprocessor unit (MPU)) and may include separate computers or networks of separate processors to read and execute computer-executable instructions. The computer-executable instructions may be provided to the computer, for example, from a network or storage medium. The storage medium may include, for example, a hard disk, random access memory (RAM), read-only memory (ROM), storage devices for distributed computing systems, optical discs (such as CDs, DVDs, or Blu-ray discs). TM One or more of the following: flash memory devices, memory cards, etc.

[0078] The embodiments of the present invention can also be implemented by providing software (programs) that perform the functions of the above embodiments to a system or device via a network or various storage media, and the computer or central processing unit (CPU) or microprocessor unit (MPU) of the system or device reads out and executes the program.

[0079] While the invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be given the broadest interpretation in order to cover all such modifications and equivalent structures and functions.

Claims

1. An exposure apparatus for exposing a substrate, comprising: An optical system, which is arranged in a cavity and configured to emit light for exposing a substrate; A guiding member configured to guide gas into the optical path space through which light from the optical system passes, and having a first end and a second end opposite to the first end; A blowout port is disposed between the first end and the second end and is configured to blow out a first gas. The guiding member is configured to supply a gas comprising a first gas blown out from the blowing port and a second gas drawn from the second end into the optical path space from the first end, and The second end is positioned inside the cavity further away from the optical path space than the first end, and the gas in the cavity is drawn from the second end as the second gas.

2. The apparatus of claim 1, wherein the blowing port is disposed inside the guide member.

3. The apparatus of claim 1, wherein the guiding member comprises a plate member disposed between the blow port and the substrate to be separated from the blow port.

4. The apparatus of claim 1, wherein the flow rate of the first gas blown out from the blowing port is higher than the flow rate of the second gas drawn from the second end.

5. The apparatus of claim 1, wherein the guiding member is configured to supply a gas, in which the first gas and the second gas are mixed between the first end and the second end, from the first end to the optical path space.

6. The apparatus according to claim 1, further comprising: A first supply device is configured to supply gas into the chamber; as well as A second feeder, configured to supply the first gas for blowing out from the nozzle, is also provided. The gas supplied to the chamber by the first feeder is drawn from the second end as the second gas.

7. The apparatus of claim 6, wherein the second feeder includes a temperature regulator configured to regulate the temperature of the first gas to be blown out from the blow port.

8. The apparatus of claim 6, wherein the second feeder includes a humidity regulator configured to regulate the humidity of the first gas to be blown out from the blow port.

9. The apparatus of claim 3, wherein the plate member is arranged relative to the blow-out port on a first direction side and extends along a second direction, the first direction being the direction in which light is emitted from the optical system and the second direction being the direction in which the first gas is blown out from the blow-out port.

10. The apparatus of claim 3, further comprising a stage configured to hold the substrate, wherein the stage is movable beneath the plate member.

11. The apparatus according to claim 6, wherein The first supply device supplies gas from the first gas supply source into the chamber, and The second supplier supplies gas from a second gas supply source to the optical path space, and the second gas supply source is different from the first gas supply source.

12. The apparatus according to claim 1, wherein The first end of the guiding member is positioned relative to the optical system on the side in the first direction from which light is emitted from the optical system.

13. The apparatus according to claim 1, wherein The optical system includes optical elements configured to transmit or reflect light, and The first end of the guiding member is positioned relative to a portion of the optical element on the side in which light is emitted from the optical system.

14. The apparatus according to claim 3, wherein The blow-out port is arranged to be separated from the plate member of the guide member.

15. The apparatus according to claim 3, wherein The guide member includes a second plate member, which is arranged on the opposite side of the plate member relative to the blow port so as to face the plate member, and The blow port is provided in the second plate member.

16. The apparatus according to claim 3, wherein The blowing port is provided in the plate member of the guide member.

17. The apparatus according to claim 1, wherein The guide member is formed in a tubular shape, and The area of ​​the blowing port is smaller than the cross-sectional area of ​​the guide member.

18. The apparatus according to claim 1, wherein The guide member is formed in a tubular shape; and The first end is closer to the optical path space than the blowing port, and the second end is farther away from the optical path space than the blowing port.

19. The apparatus of claim 1, further comprising a gas blower including a first tube and a second tube, the first tube including the blow port as one end and disposed inside the guide member, and the second tube extending through the guide member and communicating with the other end of the first tube.

20. The apparatus of claim 19, wherein The gas blower includes multiple blow ports.

21. The apparatus of claim 1, further comprising a gas exhaustor configured to exhaust gas from the optical path space.

22. The apparatus according to claim 1, wherein The optical system is a projection optical system that projects a patterned image onto the substrate, and The optical path space is the space between the projection optical system and the substrate through which light from the projection optical system passes.

23. The apparatus according to claim 1, wherein The optical system is the original illumination optical system, and The optical path space is at least one of the following: the space between the lighting optical system and the original through which light from the lighting optical system passes, and the space through which light transmitted through the original passes.

24. The apparatus of claim 22, further comprising a substrate stage configured to hold the substrate. The first end is disposed between the projection optical system and the substrate stage.

25. The apparatus of claim 23, further comprising a master stage configured to hold a master plate for exposing the substrate. The first end is positioned between the illumination optics system and the original plate stage.

26. A method of manufacturing an article, the method comprising: The substrate is exposed using the exposure apparatus defined in any one of claims 1 to 25; as well as The substrate exposed in the exposure is then developed. The article is manufactured from a developed substrate.

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