Transmission line structure

Abstract

A transmission line structure includes a dielectric layer structure, a first outer ground layer, a first contact pad, a transmission line, and a conductive via. The dielectric layer structure has a top surface, and the first outer ground layer is disposed on the top surface. An edge of the first outer ground layer has a first notch. The first contact pad is disposed on the top surface and is adapted to be connected to an electrical connector. The first contact pad is partially located in the first notch, and a gap is present between an inner edge of the first notch and the first contact pad. The transmission line is disposed in the dielectric layer structure. The conductive via is disposed in the dielectric layer structure and is connected to the first contact pad and the transmission line.

Description

TECHNICAL FIELD

[0001] The present invention relates to an electronic assembly, and more particularly to a transmission line structure. BACKGROUND

[0002] In order to have a good communication effect, the antenna is mostly arranged in the frame area around the screen of the notebook computer, and the communication module is connected by mini cable. The mini cable has a small diameter (about 0.8 mm) and is easy to arrange in the limited space. However, with the trend of thin design of the notebook computer, the gap between the screen and the back plate of the case is small, and even the mini cable is not easy to pass through the gap between the screen and the back plate of the case, and needs to be arranged along the frame area around the screen. This arrangement makes the transmission path too long and greatly increases the transmission loss and the degree of signal interference. In addition, according to the wiring space of the hinge structure of the notebook computer, the number of mini cables is too large to pass through the hinge structure from the screen end to the host end due to the large total diameter. SUMMARY

[0003] The present invention provides a transmission line structure with thin design and high transmission quality.

[0004] The transmission line structure of the present invention includes a dielectric layer structure, a first external ground layer, a first contact pad, a transmission line, and a conductive via. The dielectric layer structure has a top surface, the first external ground layer is arranged on the top surface, and an edge of the first external ground layer has a first notch. The first contact pad is arranged on the top surface and is adapted to be connected to an electrical connector. The first contact pad is partially located in the first notch, and there is a gap between an inner edge of the first notch and the first contact pad. The transmission line is arranged in the dielectric layer structure. The conductive via is arranged in the dielectric layer structure and is connected to the first contact pad and the transmission line.

[0005] In an embodiment of the present invention, the above-mentioned transmission line structure has a first section, a second section, and a third section, the second section is located between the first section and the third section, the first contact pad is located in the first section and extends to the second section, the transmission line is located in the third section and extends to the second section, and the conductive via is located in the second section.

[0006] In an embodiment of the present invention, the inner edge of the first notch is arc-shaped, and a part of the outer edge of the first contact pad is arc-shaped and corresponds to the inner edge of the first notch.

[0007] In an embodiment of the present invention, the dielectric layer structure has at least one side surface adjacent to the top surface, and the transmission line structure further includes at least one conductive layer arranged on the at least one side surface and connected to the first external ground layer.

[0008] In one embodiment of the present application, the at least one conductive layer has an extension extending from the at least one side into the dielectric layer structure, the extension having a gap with the transmission line.

[0009] In one embodiment of the present application, the dielectric layer structure includes two dielectric layers stacked on each other, the transmission line and the extension being disposed between the two dielectric layers.

[0010] In one embodiment of the present application, the at least one side includes two opposite sides, the at least one conductive layer includes two conductive layers, the two conductive layers being respectively disposed on the two opposite sides and respectively connected to two opposite ends of the first outer ground layer.

[0011] In one embodiment of the present application, the transmission line structure further includes an inner ground layer, the inner ground layer being disposed in the dielectric layer structure and connected to the at least one conductive layer, an edge of the inner ground layer has a second notch, an end of the transmission line is partially located in the second notch, and a gap is formed between an inner edge of the second notch and the end of the transmission line.

[0012] In one embodiment of the present application, the inner edge of the second notch is arc-shaped, and an outer edge of the end of the transmission line is arc-shaped and corresponds to the inner edge of the second notch.

[0013] In one embodiment of the present application, the dielectric layer structure has a bottom surface opposite to the top surface, the transmission line structure further includes a second outer ground layer disposed on the bottom surface, and the at least one conductive layer is connected to the second outer ground layer.

[0014] The transmission line structure of the present application includes a dielectric layer structure, a first outer ground layer, a second outer ground layer, a first contact pad, a second contact pad, a transmission line, and a conductive via. The dielectric layer structure has a top surface and a bottom surface opposite to each other. The first outer ground layer is disposed on the top surface. An edge of the first outer ground layer has a first notch. The second outer ground layer is disposed on the bottom surface and has an opening. The first contact pad is disposed on the top surface and adapted to be connected to an electrical connector, the first contact pad is partially located in the first notch, and a gap is formed between an inner edge of the first notch and the first contact pad. The second contact pad is disposed on the bottom surface and located in the opening, and a gap is formed between an inner edge of the opening and the second contact pad. The transmission line is disposed in the dielectric layer structure. The conductive via is disposed in the dielectric layer structure and connected to the first contact pad, the transmission line, and the second contact pad.

[0015] In one embodiment of the present application, the transmission line structure has a first section, a second section, and a third section, the second section being located between the first section and the third section, the first contact pad being located in the first section and extending to the second section, the transmission line being located in the third section and extending to the second section, and the conductive via and the second contact pad being located in the second section.

[0016] In one embodiment of the present application, the inner edge of the first recess is arc-shaped, and the outer edge of the portion of the first contact pad is arc-shaped and corresponds to the inner edge of the first recess.

[0017] In one embodiment of the present application, the inner edge of the opening is arc-shaped, and the outer edge of the second contact pad is arc-shaped and corresponds to the inner edge of the opening.

[0018] In one embodiment of the present application, the dielectric layer structure has at least one side surface adjacent to the top surface and the bottom surface, and the transmission line structure further includes at least one conductive layer disposed on the at least one side surface and connected to the first outer ground layer and the second outer ground layer.

[0019] In one embodiment of the present application, the at least one conductive layer has an extension portion extending from the at least one side surface into the dielectric layer structure, and a gap is formed between the extension portion and the transmission line.

[0020] In one embodiment of the present application, the dielectric layer structure includes two dielectric layers stacked on each other, and the transmission line and the extension portion are disposed between the two dielectric layers.

[0021] In one embodiment of the present application, the at least one side surface includes two opposite side surfaces, and the at least one conductive layer includes two conductive layers respectively disposed on the two side surfaces, and respectively connected to opposite ends of the first outer ground layer and respectively connected to opposite ends of the second outer ground layer.

[0022] In one embodiment of the present application, the transmission line structure further includes an inner ground layer disposed in the dielectric layer structure and connected to the at least one conductive layer, one edge of the inner ground layer has a second recess, one end of the transmission line is partially located in the second recess, and a gap is formed between an inner edge of the second recess and the end of the transmission line.

[0023] In one embodiment of the present application, the inner edge of the second recess is arc-shaped, and the outer edge of the end of the transmission line is arc-shaped and corresponds to the inner edge of the second recess.

[0024] Based on the above, in the transmission line structure of the present application, the first contact pad used to connect the electrical contact is disposed on the top surface of the dielectric layer structure and connected to the transmission line inside the dielectric layer structure through the conductive via. Compared with the coaxial arrangement of a general coaxial cable (such as a mini cable), the first contact pad and the corresponding electrical contact are disposed on the top surface of the dielectric layer structure as described above, so that the transmission line structure is not axially symmetric but flat in structure, which is beneficial to the thinness of the transmission line structure. On the other hand, the first outer ground layer and the second outer ground layer disposed on the top surface and the bottom surface of the dielectric layer structure, respectively, can play a role of isolating the transmission line inside the dielectric layer structure from signal interference. Moreover, the first outer ground layer disposed on the top surface of the dielectric layer structure has a first notch corresponding to the first contact pad on the edge thereof, and there is a gap between the first contact pad and the first notch. Similarly, the second outer ground layer disposed on the bottom surface of the dielectric layer structure has an opening corresponding to the second contact pad, and there is a gap between the second contact pad and the opening. Accordingly, the equivalent capacitance values between the first contact pad and the first outer ground layer and between the second contact pad and the second outer ground layer can be changed by adjusting the size of the gap, so as to optimize the impedance matching between the contact structure (the section where the first contact pad and the electrical contact are located) and the sandwiched strip line structure (the section where the transmission line is located), and reduce the degree of transmission loss caused by the asymmetric arrangement of the contact structure and the sandwiched strip line structure. In addition, the equivalent inductance value of the conductive via can be changed by adjusting the outer diameter of the conductive via, so as to optimize the impedance matching between the contact section and the sandwiched strip line section, and further reduce the degree of transmission loss. Thus, the transmission line structure of the present application can have the characteristics of thinness and high transmission quality.

[0025] In order to make the above features and advantages of the present application more obvious and easy to understand, the following specific examples are described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 is a schematic view of a transmission line structure according to an embodiment of the present application.

[0027] Figure 2 is a schematic view of a transmission line structure according to an embodiment of the present application. Figure 1 is an enlarged view of region A of the transmission line structure of

[0028] Figure 3 is an enlarged view of region B of the transmission line structure of Figure 1

[0029] Figure 4 is an exploded view of the transmission line structure of Figure 2

[0030] Figure 5 is a schematic view of a transmission line structure according to an embodiment of the present application. Figure 2

[0031] ​​​Figure 6 Drawing Figure 1 The transmission line structure is applied to a notebook computer.

[0032] Figure 7 The transmission line structure is applied to a notebook computer. Figure 2 The transmission line structure is applied to a notebook computer.

[0033] Figure 8 The transmission line structure is applied to a notebook computer. Figure 3 The transmission line structure is applied to a notebook computer.

[0034] Symbol explanation

[0035] 50: electrical connector, 62: display, 62a: bezel, 62b: screen, 64: host, 66: antenna, 100: transmission line structure, 110: dielectric layer structure, 110a: top surface, 110b: bottom surface, 110c: side surface, 110d: front end, 112, 114: dielectric layer, 113: adhesive layer, 120: first outer ground layer, 120a: first notch, 125, 180: conductive layer, 130: second outer ground layer, 130a: opening, 140: first contact pad, 150: second contact pad, 160: transmission line, 162: end, 170: conductive via, 182: extension, 190: inner ground layer, 190a: second notch, d1, d2: outer diameter, G: gap, H1, H2, H3: thickness, L: length, S1: first section, S2: second section, S3: third section, W1, W2, W3: width. DETAILED DESCRIPTION

[0036] Figure 1 The transmission line structure is applied to a notebook computer. Figure 2 The transmission line structure is applied to a notebook computer. Figure 1 The transmission line structure is applied to a notebook computer. Figure 3 The transmission line structure is applied to a notebook computer. Figure 1 The transmission line structure is applied to a notebook computer. Figure 4 The transmission line structure is applied to a notebook computer. Figure 2 The transmission line structure is applied to a notebook computer. Figures 1 to 4 The transmission line structure is applied to a notebook computer.

[0037] The transmission line structure is applied to a notebook computer. Figure 4 The transmission line structure is applied to a notebook computer. Figure 4). The first outer ground layer 120 and the second outer ground layer 130 are disposed on the top surface 110a and the bottom surface 110b of the dielectric layer structure 110, respectively. The first outer ground layer 120 has a first notch 120a. The first contact pad 140 is disposed on the top surface 110a of the dielectric layer structure 110 and partially located within the first notch 120a of the first outer ground layer 120, with a gap between the inner edge of the first notch 120a and the first contact pad 140. The second outer ground layer 130 has an opening 130a. The second contact pad 150 is disposed on the bottom surface 110b of the dielectric layer structure 110 and located within the opening 130a of the second outer ground layer 130, with a gap between the inner edge of the opening 130a and the second contact pad 150. The transmission line 160 is disposed within the dielectric layer structure 110. The conductive via 170 is disposed within the dielectric layer structure 110 and connected to the first contact pad 140, the transmission line 160 and the second contact pad 150.

[0038] Figure 5 is Figure 2 For the sake of clarity, Figure 5 only partial conductive structures within the transmission line structure 100, i.e. the first contact pad 140, the second contact pad 150, the conductive via 170 and the transmission line 160 are shown. As Figure 5 indicated, according to the above configuration, the transmission line structure 100 of the present embodiment can be divided into a first section S1 (a contact architecture), a second section S2 (a modal conversion coupling structure) and a third section S3 (a sandwiched stripline structure), with the second section S2 located between the first section S1 and the third section S3.

[0039] Specifically, the first contact pad 140 is located in the first section S1 and adapted to be connected to an electrical contact 50, thereby constituting the above-mentioned contact architecture. The electrical contact 50 is, for example, an I-PEX connector or other types of connectors, which are not limited by the present disclosure. The conductive via 170 and the second contact pad 150 are located in the second section S2. The first contact pad 140 extends from the first section S1 to the second section S2 to be connected to the conductive via 170. The transmission line 160 is located in the third section S3 and cooperates with the dielectric layer structure 110 to constitute the above-mentioned sandwiched stripline structure, and the transmission line 160 extends to the second section S2 to be connected to the conductive via 170.

[0040] The first contact pad 140 is disposed on the top surface 110a of the dielectric layer structure 110 and is connected to the transmission line 160 inside the dielectric layer structure 110 through the conductive via 170. Compared with the coaxial configuration of a general coaxial cable (e.g., a mini cable), the first contact pad 140 and the corresponding electrical connector 50 are disposed on the top surface 110a of the dielectric layer structure 110, as described above, so that the transmission line structure 100 is not axially symmetric but is a flat structure, which is beneficial to the thinning of the transmission line structure 100. Specifically, the maximum outer diameter of a general mini cable is about 0.81 mm, and the maximum outer diameter of the transmission line 160 of the embodiment can be reduced to less than or equal to 0.4 mm. On the other hand, the first outer ground layer 120 and the second outer ground layer 130 disposed on the top surface 110a and the bottom surface 110b of the dielectric layer structure 110, respectively, can play a shielding role of isolating the transmission line 160 inside the dielectric layer structure 110 from signal interference.

[0041] Also, as described above, the first outer ground layer 120 disposed on the top surface 110a of the dielectric layer structure 110 has a first notch 120a corresponding to the first contact pad 140 at the edge thereof, and there is a gap between the first contact pad 140 and the first notch 120a. Similarly, the second outer ground layer 130 disposed on the bottom surface 110b of the dielectric layer structure 110 has an opening 130a corresponding to the second contact pad 150, and there is a gap between the second contact pad 150 and the opening 130a. Accordingly, the equivalent capacitance values between the first contact pad 140 and the first outer ground layer 120 and between the second contact pad 150 and the second outer ground layer 130 can be changed by adjusting the size of the gap, so as to optimize the impedance matching between the first section S1 and the third section S3 and reduce the degree of transmission loss of the first section S1 and the third section S3 due to the asymmetric configuration of each other. In addition, the equivalent inductance value of the conductive via 170 can be changed by adjusting the outer diameter of the conductive via 170, so as to optimize the impedance matching between the first contact pad 140 and the transmission line 160 and further reduce the degree of transmission loss. This is the mode conversion and coupling effect provided by the above-mentioned mode conversion coupling structure, so as to achieve the impedance conversion and transmission mode matching between the quasi-TEM mode of the above-mentioned connector structure and the TEM mode of the above-mentioned sandwiched strip line structure.

[0042] As Figure 2 and Figure 4As shown, the inner edge of the first notch 120a of the first outer ground layer 120 is, for example, circular arc-shaped, and the outer edge of the first contact pad 140 is also, for example, circular arc-shaped and corresponds to the circular arc-shaped inner edge of the first notch 120a, and the gap between the first contact pad 140 and the inner edge of the first notch 120a is, for example, uniform and equidistant. Similarly, the inner edge of the opening 130a of the second outer ground layer 130 is, for example, circular arc-shaped, and the outer edge of the second contact pad 150 is also, for example, circular arc-shaped and corresponds to the circular arc-shaped inner edge of the opening 130a, and the gap between the second contact pad 150 and the inner edge of the opening 130a is, for example, uniform and equidistant. However, the present application is not limited thereto, and in other embodiments, the inner edge of the first notch 120a and the corresponding outer edge of the first contact pad 140 can be square or other non-circular arc-shaped shapes, and the gap between the first contact pad 140 and the inner edge of the first notch 120a can be non-equidistant, which can improve the flexibility of impedance matching as needed. Similarly, the inner edge of the opening 130a and the corresponding outer edge of the second contact pad 150 can be square or other non-circular arc-shaped shapes, and the gap between the second contact pad 150 and the inner edge of the opening 130a can be non-equidistant, which can improve the flexibility of impedance matching as needed.

[0043] Please refer to Figures 2 to 4 , the dielectric layer structure 110 of the present embodiment has two side surfaces 110c (indicated in Figure 4 ) adjacent to the top surface 110a and the bottom surface 110b, and the dielectric layer structure 110 includes two dielectric layers 112, 114 that are stacked with each other, and the two dielectric layers 112, 114 can be bonded with each other by an adhesive layer 113 (indicated in Figure 4 ), and each side surface 110c is formed by the side surfaces of the two dielectric layers 112, 114. The dielectric constant (Dk) of the two dielectric layers 112, 114 can be 2.5, and the loss tangent (Df) of the two dielectric layers 112, 114 can be 0.003. The transmission line structure 100 further includes two conductive layers 180, which are respectively arranged on the two side surfaces 110c, and are respectively connected to the opposite ends of the first outer ground layer 120 and are respectively connected to the opposite ends of the second outer ground layer 130, so as to jointly play a shielding role of isolating the transmission line 160 in the dielectric layer structure 110 from signal interference with the first outer ground layer 120 and the second outer ground layer 130. The two conductive layers 180 can be connected as shown in Figure 2 to the front end 110d of the dielectric layer structure 110, and are connected with the conductive layer 125 (shown in Figure 2 ) on the top surface 110a (indicated in Figure 4 ) of the dielectric layer structure 110. Figure 5The electrical connection 50 is shown to connect the transmission line 160 through the first contact pad 140, and also to connect the first external ground layer 120 and the second external ground layer 130 through the conductive layer 125 and the conductive layer 180. Each conductive layer 180 is, for example, plated on the corresponding side surface 110c by a laser-induced metallization process. Compared to the prior art in which a plurality of conductive vias arranged in sequence on both sides of the transmission line are used as a shielding structure, the present embodiment uses a continuous and complete conductive layer 180 as a shielding structure as described above, which can have a better shielding effect.

[0044] Further, each conductive layer 180 of the present embodiment has an extension 182 extending from the corresponding side surface 110c into the dielectric layer structure 110 between the two dielectric layers 112, 114, which can enhance the adhesion of each conductive layer 180 to the dielectric layer structure 110. Moreover, a gap is provided between each extension 182 and the transmission line 160, and by adjusting the size of the gap, the equivalent distance between each conductive layer 180 and the transmission line 160 can be optimized, achieving the effect of reducing transmission loss.

[0045] In addition, the transmission line structure 100 of the present embodiment can further include an inner ground layer 190 as shown in Figure 2 and Figure 4 The inner ground layer 190 is disposed within the dielectric layer structure 110 between the two dielectric layers 112, 114 and is connected to the two conductive layers 180, so as to be connected to the first external ground layer 120 and the second external ground layer 130 through the two conductive layers 180. The edge of the inner ground layer 190 has a second notch 190a, one end 162 of the transmission line 160 is partially located within the second notch 190a, and a gap is provided between the inner edge of the second notch 190a and the end 162 of the transmission line 160. In this way, by adjusting the size of the gap, the equivalent capacitance between the end 162 of the transmission line 160 and the inner ground layer 190 can be changed, so as to optimize the impedance matching between the first section S1 and the third section S3, and reduce the degree of transmission loss caused by the asymmetric configuration of the first section S1 and the third section S3.

[0046] As shown in Figure 2 and Figure 4As shown, the inner edge of the second notch 190a of the inner ground layer 190 is, for example, circular arc-shaped, and the outer edge of the end 162 of the transmission line 160 is also, for example, circular arc-shaped and corresponds to the circular arc-shaped inner edge of the second notch 190a, and the gap between the end 162 of the transmission line 160 and the inner edge of the second notch 190a is, for example, uniform and equidistant. However, the present application is not limited thereto, and in other embodiments, the inner edge of the second notch 190a and the corresponding outer edge of the end 162 of the transmission line 160 can be square or other non-circular arc-shaped shapes, and the gap between the end 162 of the transmission line 160 and the inner edge of the second notch 190a can be non-equidistant, which can improve the flexibility of impedance matching as needed.

[0047] According to the above configuration of the present embodiment, the voltage standing wave ratio (VSWR) of the transmission line structure 100 in the operating frequency band range of 1 GHz-6 GHz can be less than 1.3. Moreover, the transmission loss at an operating frequency of 1 GHz and a transmission length of 1 meter can be less than or equal to 3.1 dB / m, and the transmission loss at an operating frequency of 6 GHz and a transmission length of 1 meter can be less than or equal to 8.0 dB / m.

[0048] Figure 6 The transmission line structure Figure 1 is applied to a notebook computer. As shown, Figure 6 the antenna 66 at the frame 62a of the display 62 of the notebook computer can be connected to the signal processing module in the host 64 through the transmission line structure 100 of the above embodiment. Since the transmission line structure 100 is a flat structure as described above and has a smaller thickness, it can be directly connected to the host 64 as shown, Figure 6 over the back of the screen 62b of the display 62. Such a configuration has a shorter wiring distance and can reduce transmission loss and signal interference. Moreover, since the transmission line structure 100 has a smaller thickness, even if the number of transmission line structures 100 is multiple, it can reach the host 64 through the pivot structure between the host 64 and the display 62. Thus, the design of the multi-input multi-output (MIMO) antenna system can be met.

[0049] The following illustrates the specific size design of the transmission line structure 100 of the present embodiment. Figure 7 is Figure 2 a cross-sectional view of the transmission line structure along the I-I line. Figure 8 is Figure 3 a cross-sectional view of the transmission line structure along the II-II line. Please refer to Figure 7 and Figure 8In this embodiment, the total width W1 of the transmission line structure 100 can be 3.02 mm, and the total thickness H1 of the transmission line structure 100 can be 0.4 mm. The thicknesses H2 and H3 of each dielectric layer 112 and 114 can be 0.18 mm. The outer diameter d1 of the conductive via 170 can be 0.2 mm. The width W2 of the extension 182 of the conductive layer 180 can be 0.4 mm. The width W3 of the transmission line 160 can be 0.27 mm. The outer diameters of the first pad 140, the end 162 of the transmission line 160, and the second pad 150 are, for example, the same ( Figure 7 The outer diameter (d2) can be 0.4~0.6 mm. The gaps between the inner edge of the first notch 120a and the first pad 140, the gaps between the inner edge of the opening 130a and the second pad 150, and the gaps between the inner edge of the second notch 190a and the end 162 of the transmission line 160 are, for example, the same. Figure 7 The gap (G) is indicated as 0.1 mm. Furthermore, the total length L of the transmission line structure 100 (indicated by...) Figure 1 The dimensions can be 100 mm. In other embodiments, the above dimensions may be changed as needed, and the present invention does not limit their actual values.

[0050] In summary, in the transmission line structure of the present application, the first contact pad for connecting the electrical contact is disposed on the top surface of the dielectric layer structure and connected to the transmission line inside the dielectric layer structure through the conductive via. Compared with the coaxial configuration of the general coaxial cable (such as the mini cable), the first contact pad and the corresponding electrical contact are disposed on the top surface of the dielectric layer structure as described above, so that the transmission line structure is not axisymmetric in structure but becomes a flat structure, which is beneficial to the thinness of the transmission line structure. On the other hand, the first outer ground layer and the second outer ground layer disposed on the top surface and the bottom surface of the dielectric layer structure, respectively, can play a role of isolating the transmission line inside the dielectric layer structure from signal interference. Moreover, the first outer ground layer disposed on the top surface of the dielectric layer structure has a first notch corresponding to the first contact pad on the edge thereof, and there is a gap between the first contact pad and the first notch. Similarly, the second outer ground layer disposed on the bottom surface of the dielectric layer structure has an opening corresponding to the second contact pad, and there is a gap between the second contact pad and the opening. Accordingly, the equivalent capacitance value between the first contact pad and the first outer ground layer and the equivalent capacitance value between the second contact pad and the second outer ground layer can be changed by adjusting the size of the gap, so as to optimize the impedance matching between the contact structure (the section where the first contact pad and the contact are located) and the sandwiched strip line structure (the section where the transmission line is located), and reduce the degree of transmission loss caused by the asymmetric configuration of the contact structure and the sandwiched strip line structure. In addition, the equivalent inductance value of the conductive via can be changed by adjusting the outer diameter size of the conductive via, so as to optimize the impedance matching between the contact section and the sandwiched strip line section, and further reduce the degree of transmission loss. Therefore, the transmission line structure of the present application can have the characteristics of thinness and high transmission quality.

Claims

1. A transmission line structure, comprising: a dielectric layer structure having a top surface and a bottom surface opposite to each other; a first outer ground layer disposed on the top surface, wherein an edge of the first outer ground layer has a first notch; a second outer ground layer disposed on the bottom surface and having an opening; a first contact pad disposed on the top surface and adapted to be connected to an electrical connector, wherein the first contact pad is partially located in the first notch, and a gap is formed between an inner edge of the first notch and the first contact pad; a second contact pad disposed on the bottom surface and located in the opening, wherein a gap is formed between an inner edge of the opening and the second contact pad; a transmission line disposed in the dielectric layer structure; and a conductive via disposed in the dielectric layer structure and connected to the first contact pad, the transmission line and the second contact pad, wherein the transmission line structure has a first section, a second section and a third section, the second section is located between the first section and the third section, the first contact pad is located in the first section and extends to the second section, the transmission line is located in the third section and extends to the second section, the conductive via is located in the second section, the first contact pad is located in the first section to form a connector architecture, the conductive via and the second contact pad are located in the second section, the first contact pad extends from the first section to the second section to be connected to the conductive via, the transmission line is located in the third section to form a sandwich strip line structure with the dielectric layer structure, and the transmission line extends to the second section to be connected to the conductive via, the gap is adjusted to change the equivalent capacitance between the first contact pad and the first outer ground layer and the equivalent capacitance between the second contact pad and the second outer ground layer to optimize the impedance matching between the first section and the third section, to reduce the transmission loss caused by the asymmetric configuration of the first section and the third section, and the outer diameter of the conductive via is adjusted to change the equivalent inductance of the conductive via to optimize the impedance matching between the first contact pad and the transmission line, to further reduce the transmission loss, the antennas at the frame of the display of the notebook computer are connected to the signal processing module in the notebook computer host through the transmission line structure, the transmission line structure is a flat structure, so it directly passes through the back of the display screen to be connected to the notebook computer host, and since the number of the transmission line structures is multiple, it can reach the notebook computer host through the pivot structure between the notebook computer host and the display, thereby meeting the design of the multiple-input multiple-output antenna system, the dielectric layer structure has at least one side surface adjacent to the top surface and the bottom surface, and the transmission line structure further comprises at least one conductive layer disposed on the at least one side surface and connected to the first outer ground layer and the second outer ground layer. ​ ​ ​ ​ ​ ​ ​ ​ 2. The transmission line structure of claim 1, wherein: The inner edge of the first notch is arcuate, and a portion of the outer edge of the first pad is arcuate and corresponds to the inner edge of the first notch.

3. The transmission line structure of claim 1, wherein: The inner edge of the opening is arcuate, and the outer edge of the second pad is arcuate and corresponds to the inner edge of the opening.

4. The transmission line structure of claim 1, wherein: The at least one conductive layer has an extension portion extending from the at least one side surface into the dielectric layer structure, and a gap is defined between the extension portion and the transmission line.

5. The transmission line structure of claim 4, wherein: The dielectric layer structure includes two dielectric layers stacked on each other, and the transmission line and the extension portion are disposed between the two dielectric layers.

6. The transmission line structure of claim 1, wherein: The at least one side surface includes two opposite side surfaces, and the at least one conductive layer includes two conductive layers respectively disposed on the two side surfaces, and respectively connected to opposite ends of the first outer ground layer and to opposite ends of the second outer ground layer.

7. The transmission line structure of claim 1, wherein: Further comprising an inner ground layer disposed in the dielectric layer structure and connected to the at least one conductive layer, and an edge of the inner ground layer has a second notch, and an end of the transmission line is partially located in the second notch, and a gap is defined between an inner edge of the second notch and the end of the transmission line.

8. The transmission line structure of claim 7, wherein: The inner edge of the second notch is arcuate, and an outer edge of the end of the transmission line is arcuate and corresponds to the inner edge of the second notch.

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