Semiconductor inverter

Abstract

The present invention discloses a wafer flipping device for semiconductor processing, including a support rotating assembly. When at a first non-rotated position, the rotating assembly receives a semiconductor work product on one side, clamps and aligns the work product, rotates the semiconductor work product thereon to a rotated position, and releases the semiconductor work product from the rotated position. The semiconductor work product can be any one of a series of different shapes and sizes, and telescopic pins are selected for the corresponding shape or size.

Description

[0001] Related Applications

[0002] This application claims the benefit of priority to U.S. Provisional Patent Application No. 62 / 824,350, filed on March 27, 2019, the disclosure of which is incorporated herein by reference.

[0003] Technical Field and Background Art

[0004] In some embodiments of the present invention, the present invention relates to a semiconductor flipper.

[0005] A flipper is a device used in the semiconductor manufacturing industry that functions to flip wafers and ring frames, typically by 180 degrees, so that components can be etched or otherwise fabricated on the back side. The flipper is installed in a microenvironment within an Equipment Front End Module (EFEM). The EFEM is a feature of semiconductor automation that moves silicon wafers or quartz masks between ultra-clean storage carriers and various processing, measurement, and test systems. The EFEM contains the components necessary to unload wafers, transfer the wafers to a mother tool for processing, and return the product to its carrier after completion.

[0006] The EFEM was developed to meet the demand for higher yields and throughput, which has been further driven by the shrinking geometries in integrated circuit production. As features become smaller, previously acceptable levels of contamination have become intolerable.

[0007] Therefore, in semiconductor processing, contamination is a problem, followed by the need for higher resolution and precision, which requires precise alignment. By automating the above processes, alignment can be improved and contamination associated with operator handling of the product can be removed. In such an automated process, an operator cannot simply pick up a wafer and flip it to process the opposite side.

[0008] Therefore, the semiconductor industry promotes equipment standards to ensure the commonality of physical design, product handling strategies, communication interfaces, and operator control among different equipment manufacturers. One benefit of standardization is the development of add-on modules, such as off-the-shelf EFEMs, which can be quickly and easily connected to tools and operate as slaves under the control of a factory host or a mother tool.

[0009] During use, wafers and ring frames are stacked within the EFEM at the load port, and a robot picks up individual wafers or ring frames (referred to herein as "media" or "semiconductor work products") therefrom and transfers the media into the manufacturing process.

[0010] During the manufacturing process, the medium sometimes needs to be flipped, usually by 180 degrees, to meet the growing demand for backside wafer processing or inspection. This operation is performed by a device such as a flipper.

[0011] The robot places the medium inside the flipper. The flipper holds the medium, and the rotating part rotates 180 degrees to flip the medium. Then it releases its gripping force, allowing the medium to be freely placed. Then the robotic arm can re-enter the flipper, grasp the flipped medium, remove it from the flipper and place it into the manufacturing process. For each wafer type, the positions and pick-up points where the robot places the wafer and picks it up after flipping are the same set points, which means that for each wafer size, the robot only needs to be programmed once.

[0012] Other background technologies include: TWM429985(U): Device for holding wafers; WO2015127191: Systems and methods for double-sided substrate processing; US8529314: Method of transporting work and equipment with a work handover mechanism; EP1884982: Semiconductor wafer mounting device; US2009092469(A1): Substrate processing unit, substrate transfer method, substrate cleaning processing unit, and substrate electroplating equipment; US9378997(B2): Substrate holding mechanism, substrate transfer device, and semiconductor manufacturing equipment; KR20080072272(A): Equipment for carrying substrates; KR100888045(B1): Equipment for flipping substrates; US5160961(A): Substrate clamping device; US8863808(B2): Pair of substrate holders, substrate holders, substrate bonding equipment, and method of manufacturing devices; US6828772(B1): Rotary clamp wafer flipper; US2004145199(A1): Devices, systems, and methods for gripping and holding disc-shaped objects; and US6520315(B1): Gripper assembly.

[0013] Existing flippers may only support one type of medium. To change the medium, the EFEM must be stopped and the flipper replaced.

[0014] Existing flipping devices use multiple bulky pneumatic pipes to drive the moving parts on the rotating assembly. Each pipe requires its own rotary joint.

[0015] The wire harness for powering the moving parts on the rotating assembly contains a large number of wires, all of which require a transition device from the flipper body to the rotating assembly.

[0016] The diversity of components, pipes, and wires increases the likelihood of failures, but the flipper only needs to rotate half a turn, so no more complex solutions are required.

[0017] Existing flippers use only a single size of media, which is placed by a robot at a position clearly defined by the geometry of the flipper. Once media of multiple sizes and shapes need to be accommodated, registration of the media on the flipper is required, regardless of whether their dimensions achieve the high positioning accuracy required in the semiconductor industry. That is, it is difficult to accurately position the media within the rotating assembly. In addition, each additional component increases the complexity of the piping and wiring. Summary of the Invention

[0018] This embodiment attempts to overcome the above limitations by providing a flipper with a gripper and multiple sets of alignment pins to accommodate semiconductor work products of different sizes and shapes. Each set of positioning pins can be aligned with the plunger for media of a determined size or shape. The gripper is designed to ensure that only a suitable set of positioning pins is used for each size or shape of media. Therefore, the flipper can accommodate a range of media of different sizes, thicknesses, and shapes, and the combination of the gripper with the plunger and appropriate positioning pins can provide precise alignment in all cases.

[0019] Another advantage is that since the media may already be aligned and provided, the accuracy and complexity required of the robotic arm are reduced. The flipper of this embodiment can control and drive as many components as needed without significantly increasing the connection complexity.

[0020] In some embodiments, a single air / vacuum supply and / or slip ring (both extending through the axis of rotation of the flipper) can be used to supply power and pneumatic power to the flipper in order to place and operate valves and sensors on the rotating components. This not only reduces the number of failure points but also eliminates one of the major limitations on the number of onboard components.

[0021] In other embodiments, multiple lines can be connected to the flipper through a cable, which is well known in robotic arms and similar technologies.

[0022] The reduction in the mechanical and electrical complexity of the flipper may extend the mean time between failures.

[0023] According to an object of some embodiments of the present invention, there is provided a wafer flipping method for semiconductor processing of semiconductor work products of multiple predetermined sizes, the method comprising:

[0024] When at a first non-rotated position, receiving a semiconductor work product having a first predetermined size in a rotating assembly, the rotating assembly having a plurality of retractable pins, each of the retractable pins corresponding to a respective predetermined size;

[0025] Clamping the semiconductor work product in the assembly at the first rotated position;

[0026] Select a retractable pin from a plurality of aligned retractable pins corresponding to the first predetermined size;

[0027] Use the selected retractable pin to align the semiconductor work product in the component;

[0028] Rotate the component with the semiconductor work product to a second rotational position;

[0029] Release the semiconductor work product from the second rotational position.

[0030] The method further includes clamping the semiconductor work product between a first clamping frame and a second clamping frame.

[0031] The method further includes receiving pneumatic power from a support into the rotating assembly and supplying the pneumatic power to a gripper.

[0032] The method further includes providing a pneumatic circuit using a rotary joint having respective feed connectors and return connectors.

[0033] The method further includes providing power from a support to the component using a slip ring.

[0034] The method further includes using a plunger pin to push the semiconductor work product against a plurality of corresponding extended positioning pins among the plurality of retractable pins to align the work product.

[0035] The method further includes operating the positioning pins through a plurality of solenoids.

[0036] In one embodiment, the solenoids are powered by at least one electronic controller mounted outside the rotating assembly through a slip ring.

[0037] In one embodiment, the second position is rotated up to 180 degrees from the first position.

[0038] In one embodiment, the semiconductor work product is a wafer or a ring.

[0039] The method further includes operating a release actuator to release the semiconductor work product from the gripper at the second rotational position, thereby releasing the semiconductor work product at the second rotational position with a predetermined alignment.

[0040] According to a second object of an embodiment of the present invention, there is provided a wafer flipping device for semiconductor processing of a plurality of semiconductor work products of different predetermined sizes, the device including a support rotating assembly, the rotating assembly including:

[0041] A gripper for receiving the semiconductor work product;

[0042] An upper frame member and a lower frame member for clamping the semiconductor work product within the frame when the semiconductor work product is oriented in a first direction;

[0043] A plurality of retractable pins for bringing the semiconductor work product into a predetermined alignment within the frame, the plurality of retractable pins being selected for different ones of the plurality of predetermined sizes so as to align all of the plurality of predetermined sizes;

[0044] A rotary actuator for rotating the rotary assembly between the first direction and a second direction rotated from the first direction; and

[0045] A release actuator for releasing the frame member to release the semiconductor work product to a predetermined alignment when in the second direction.

[0046] In multiple embodiments, the rotary assembly further includes a rotary joint for receiving pneumatic power from a support member for supply to each of the plurality of frame members.

[0047] In multiple embodiments, the rotary joint is disposed on a rotary axis of the rotary assembly.

[0048] In multiple embodiments, the rotary assembly further includes a slip ring for supplying power from the support member to the assembly.

[0049] In multiple embodiments, the plurality of positioning pins of the plurality of retractable pins are for aligning a semiconductor work product corresponding to one of a plurality of different sizes or shapes, each size or shape having its own predetermined alignment.

[0050] In multiple embodiments, the positioning pins are operated by at least one electronic controller mounted external to the rotary assembly. Additionally or alternatively, the plurality of frame members are operated by at least one electronic controller mounted external to the rotary assembly.

[0051] In multiple embodiments, the at least one electronic controller is connected to supply power to the positioning pins or the frame members.

[0052] In multiple embodiments, the positioning pins or the frame members are powered by a slip ring.

[0053] In multiple embodiments, the plurality of retractable pins are arranged in pairs, and at least one of each pair of the positioning pins includes an alignment pin.

[0054] In multiple embodiments, the device further includes a pneumatic distribution system for distributing pneumatic fluid from a rotary valve to the respective plurality of gripper frame members.

[0055] In multiple embodiments, the second direction is a 180-degree rotation from the first direction.

[0056] In multiple embodiments, the semiconductor working product is a wafer or a ring.

[0057] According to a third object of an embodiment of the present invention, there is provided a wafer flipping device for semiconductor processing, including:

[0058] A support member, the support member including a power source and a pneumatic source;

[0059] A rotating assembly;

[0060] A slip ring connecting the power source to the rotating assembly; and

[0061] A rotary joint configured to mount the rotating assembly on the support member and provide a feed and a return feed to connect the pneumatic source to the rotating assembly.

[0062] Unless otherwise defined, all technical and / or scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Although methods and materials similar or equivalent to those described herein can be used in the practice or testing of embodiments of the present invention, the methods and / or materials described below are exemplary. In case of conflict, the claims and their defined scope shall prevail. Additionally, these materials, methods, and examples are illustrative only and not intended for essential limitation. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] Some embodiments of the present invention are described herein by way of example only with reference to the accompanying drawings. Now, with specific reference to the drawings, it is emphasized that the details shown are for the purpose of illustrative discussion of embodiments of the present invention. In this regard, it will be apparent to those skilled in the art how embodiments of the present invention can be practiced using the drawings.

[0064] In the drawings:

[0065] Figure 1 is a perspective schematic view of a semiconductor flipping device according to an embodiment of the present invention.

[0066] Figure 2 is Figure 1 a simplified flow schematic diagram of the operation of the flipping device.

[0067] Figure 3 is to Figure 1 a three-dimensional schematic view of a rotary joint connecting the rotating assembly of to the support member.

[0068] Figure 4 is Figure 3 A cross-sectional schematic view of a swivel joint.

[0069] Figure 5 is in Figure 1 A view of the retractable and extendable positioning pins used in the embodiment of

[0070] Figure 6 is Figure 1 A plan schematic view of the rotating assembly of

[0071] Figure 7 is Figure 1 A detailed schematic view of a pair of retractable pins in

[0072] Figure 8 is Figure 1 A detailed schematic view of the back plate of Detailed implementation mode

[0073] In some embodiments of the present invention, it relates to a semiconductor flipper, and more specifically but not restrictively, to a flipper used with an EFEM.

[0074] A wafer flipping device for semiconductor processing, comprising a support rotating assembly, which, when in a first non-rotated position, receives a semiconductor work product on one side, clamps, places and aligns the work product, and rotates with the semiconductor work product thereon to a rotated position, and releases the semiconductor work product from the rotated position with a predetermined alignment. For work products of different sizes and shapes, the way of predetermined alignment may be different. The rotation is usually more than 180 degrees, so the term "flip" is used.

[0075] Modern semiconductor factories need to be able to place components on both sides of a semiconductor wafer. Therefore, the wafer needs to be flipped at some point.

[0076] The flipping devices in the prior art are rotating plates of a given size, which can accommodate wafers of a single size placed on the plate by a robotic arm. Each device is specific to a ring frame or a wafer and has a given size. The robotic arm positions the wafer and then uses pneumatic grippers to clamp the wafer on the plate. Each gripper is controlled separately by a different air tube.

[0077] In contrast, the flipper of this embodiment can accommodate media of ring and wafer types and can accommodate different sizes. In the prior art, the machine must be stopped and the flipping plate replaced to change the size or type of the media.

[0078] The medium is clamped by a holder, which consists of a lower clamping frame and an upper clamping frame. Usually, multiple pairs of alignment pads consist of placement pads, and at least one positioning pin for each pair can be used for edge engagement of the medium to define the precise position of the medium. The holder and the alignment pads are located on the flipper itself and can be powered by a pneumatic source through a pneumatic circuit. The pneumatic source is transmitted to the rotating assembly through a rotary joint, exhausted through a return flow, and power can be provided through a slip ring. Vacuum can be used. The clamping electro-pneumatic circuit and mechanical features are located on the rotating assembly itself. The holder frames move towards and away from each other simultaneously, usually in response to a clamping or unclamping instruction.

[0079] The flipper includes a plunger for pushing the semiconductor work product from one edge, and the placement pad can include multiple positioning pins for accurately aligning the semiconductor work product with the flipper by engaging with the opposite edge. The plunger pushes the medium towards the positioning pins. Prior art flippers do not provide alignment, and the robot receiving the flipped wafer must account for wafer misalignment. Robots in the prior art may thus be responsible for realigning the wafer, making the robot more complex and expensive.

[0080] Before explaining in detail at least one embodiment of the present invention, it should be understood that the application of the present invention is not necessarily limited to the construction and setting details of the components and / or methods shown in the following description and / or drawings and / or embodiments. The present invention is capable of having other embodiments or of being carried out or implemented in various ways.

[0081] Now referring to the drawings, Figure 1 A wafer flipping device 10 for semiconductor processing is shown. The wafer flipping device includes a support 12 and a rotating assembly 14. The rotating assembly includes an assembly 16, which is designed to receive and clamp a semiconductor product for flipping.

[0082] The rotating assembly 16 is designed to receive a semiconductor work product or medium 18 on the frame surface before rotation, and its operation is schematically shown in Figure 2 In it. The assembly 20 receives the work product, usually from a robotic arm, and the plunger pushes the edge of the work product towards the positioning pins to ensure that the work product is aligned with a defined position on the assembly. Then, the holder 22 clamps the work product in the aligned position. Then, when the work product is firmly clamped, the assembly rotates 24 so that the work product is now facing the opposite direction of the bottom surface of the assembly. Then the work product can be released 26, usually released to the robotic arm again and returned to the semiconductor production process in a reverse form.

[0083] More specifically, the operation of the flipper is as follows:

[0084] 1. A prerequisite for startup is that the flipper is at 0°. The holder is open and no work product is detected in the flipper.

[0085] 2. The host configures the wafer size through digital I / O or a serial communication interface.

[0086] 3. The flipper raises a selected set of pin valves according to the size or shape of the work product, thereby appropriately extending the appropriate set of positioning pins as needed. The positioning pins are located on the placement pads.

[0087] 4. The robotic arm places the work product on the flipper.

[0088] 5. Positioning - Then, the plunger pushes the work product towards the raised positioning pins.

[0089] 6. The plunger can retract. In different situations, the plunger may retract after the flipping procedure.

[0090] 7. The gripper closes.

[0091] 8. The flipper rotates.

[0092] 9. Finally, the gripper opens to release the rotated and aligned work product, where the alignment can be specific to the particular size and shape of the work product.

[0093] Now referring to Figure 1 , the rotating assembly 16 has a gripper composed of a lower frame member 30 and an upper frame member 31, whose task is to clamp the semiconductor work product 18 when placing the semiconductor work product 18 on the assembly. The work product 18 can reach different radii around the center of the assembly, and the assembly is designed to accommodate work products of different sizes and shapes, including several different sizes of wafers and several different sizes of rings. The gripper can be pneumatic. The gripper is provided with an upper gripper frame member 31 and a lower gripper frame member 30. Retractable pins 38 are located at different radii to firmly position work products of different sizes, so that any work product in the predetermined size list can be accurately aligned.

[0094] As Figure 7 shown, the retractable pins 38 are set in pairs at 90. Each pair includes an upper retractable pin 90 and a lower retractable pin 91. The upper retractable pin 90 may include an upper placement pad 92. The lower retractable pin 91 includes a placement pad 94 and a positioning pin 96. The positioning pin 96 can form a retractable structure and provide precise alignment for the semiconductor work product.

[0095] At least some types of media may require at least two pairs of placement pads, and in one embodiment, one of the two groups is retractable. When the corresponding media type is absent, the retractable group is retracted. The placement pads 98 are located on the surface of the pins, against the work product, and move up and down at the actuating part 100. In addition to the placement pads 98 with positioning pins, there are other placement pads 102, which provide as Figure 8A common back pad 104 shared by all the medium types shown. The back pad is located on the back plate of a rotating assembly fixed against a support. The plunger 50 has a pin that provides horizontal alignment of the semiconductor work product and pushes the work product against the locating pin 96.

[0096] Now referring to Figure 3 , in some embodiments, a rotary joint 40 connects the assembly to the support by a flange 46. An extension 44 is on one side of the support and provides a location for the main rotary actuator and the slip ring. An extension 48 extends into the rotating assembly, having a connecting piece connected to the support structure 46, and a connecting piece 48 connected to the rotating structure. Thus, the rotating assembly can be axially fixed on the support. The rotary joint allows the assembly to rotate about the central axis of the joint and further receives pneumatic power from a pneumatic circuit in the support to be supplied to the rotating assembly 14 and respectively supplied to the frame members 30, 31, the grippers, and the plungers on the rotating assembly 14 that contact the product. In this embodiment, the pneumatic power is centrally supplied from a single rotary joint at the axis of rotation at the connection between the rotating assembly and the support. In other embodiments, the pneumatic power can be provided through a hose outside the rotating shaft.

[0097] Now referring to Figure 4 , is Figure 3 a simplified schematic longitudinal cross - section of the rotary joint 40. The central tube 50 rotates along the axis of rotation and thus rotates without changing its position. The central tube 50 contains cables from the slip ring. Tubes 51 and 53 located on both sides of the central tube 50 respectively convey forward and return air. The assembly rotates using the rotary joint, and the inner hollow part of the tubes continues to provide pneumatic power along the axis of rotation when the assembly rotates.

[0098] The rotating assembly may also require power for load systems, such as a rotation control system, an alignment control system, and actuators. A single slip - ring connection around the joint can be used to supply power to the assembly system from the support. For example, a wire slip ring 24 can be used. Alternatively, since the rotation angle usually does not exceed 180 degrees, the wires can be directly connected without a slip ring. Individual wires can be directly connected, or the wires can be connected together in a tube. In addition, pneumatic tubes can be connected, with or without channels.

[0099] Now referring to Figure 5 , which is Figure 1Details are shown of an upper and lower pair of retractable pins 38 for positioning the work product 18. The retractable pins include pneumatic pistons, placement pads, and alignment pins 33. The retractable pins 38 can be raised or lowered to and / or extended to the alignment pins 33 depending on whether they are at the radius specified for the current work product. There are multiple retractable pins at different positions to provide alignment for different media sizes and shapes, so for example, an inner retractable pin 32 and an outer retractable pin 34 are at two close but different radii. The retractable pad 34 extends upward for alignment as it is at the correct radius for the current media 18

[0100] A programmable logic controller (PLC) can be mounted on the static part of the flipper. Control and status signals pass to / from the PLC via slip rings. Pneumatic pistons are used to operate the retractable pins, grippers, and plungers.

[0101] In Figure 7 , the retractable pin 91 is an integral structure consisting of a pneumatic piston and a positioning pad, where the positioning pad consists of a placement pad and an alignment pin.

[0102] To prepare the flipper for a particular media type, the processor provides commands to the corresponding electric valves to extend the pneumatic pistons associated with the placement pads and pins for the given media type, with the remaining pistons inactive. Accordingly, the corresponding pneumatic pistons raise the corresponding placement pads.

[0103] The alignment pins are part of the alignment mechanism. Alignment occurs when the media is placed on the placement pad. Alignment begins when the plunger pin 50 pushes the media until it reaches and is stopped by the extended alignment pin 96.

[0104] Thus, the alignment pins are components that form part of the alignment procedure and allow alignment to occur.

[0105] Once the work product is received in the assembly, it is then aligned by pushing against the exposed alignment pins with the plunger and clamped by the gripper. The assembly then rotates, typically one hundred and eighty degrees from the initial position. The rotation can be performed by a rotation actuator typically mounted in the support. After rotation, the work product can be released from the gripper into the robotic arm for replacement in the semiconductor manufacturing facility. The gripper includes actuators for operating the pneumatic devices as well as clamping and releasing the work product. Since the work product is already aligned, the robotic arm does not need to have alignment capabilities and can therefore use a cheaper robotic arm.

[0106] Semiconductor processed products can be wafers or double-sided processed ring frames.

[0107] More specifically, the flipper device according to this embodiment can be used in the semiconductor manufacturing industry to flip silicon wafers and ring frames, also known as film frames for post-cutting.

[0108] A silicon wafer and a ring frame can be stacked inside a box placed in a load port from where a robot picks up individual wafers or ring frames, hereinafter referred to as semiconductor work products, and transfers them into the manufacturing process.

[0109] During the manufacturing process, the work product sometimes needs to be flipped, usually by 180 degrees, to meet the growing demand for backside wafer processes or inspections, and the present embodiment provides a device for this purpose.

[0110] The robot places the medium inside the flipper which holds the medium and the rotating assembly rotates to flip the semiconductor work product by 180 degrees. Then the flipper releases its grip, leaving the work product in a free state, and then the robotic arm can re-enter the flipper, grab the flipped work product, remove it from the flipper and place it into the manufacturing process. The placement pads with associated locating pins ensure that each wafer type has its own positioning on the flipper. Thus, the position and pick-up point where the robot places and picks up the wafer after flipping are the same set points, meaning the robot only needs to be programmed once for each wafer size.

[0111] The following are four features of the flipper of the present embodiment.

[0112] 1. The flipper can accommodate multiple work product types, including wafers and ring configurations.

[0113] 2. The flipper can accommodate different work product sizes.

[0114] 3. Multiple retractable pads are located on the rotating gripper and are powered directly by the rotating gripper.

[0115] 4. Locating pins and plungers accurately position the work product inside the flipper, with a specific alignment and a set of retractable pins and a gripper for each different size and shape.

[0116] Therefore, the flipper of the present embodiment does not need to be reassembled, replaced or processed in any way to accommodate different work product shapes and sizes.

[0117] In contrast, in the prior art, the flipper typically only supports one type of medium. To change the medium, the EFEM must be stopped and the flipper replaced. The flipper of the present embodiment can handle multiple shapes and sizes while avoiding the need to stop the EFEM to replace the flipper.

[0118] An exemplary wafer according to the present embodiment can be designed to support four different sizes of media:

[0119] 1. 200 mm diameter (wafer type)

[0120] 2. 300 mm diameter (wafer type)

[0121] 3. Annular frame applicable to 200 - millimeter wafer type

[0122] 4. Annular frame applicable to 300 - millimeter wafer type

[0123] The flipper of this embodiment can have only a pair of pneumatic tubes, namely a single feed tube and a single return tube, and a slip ring with multiple wires (e.g., 24 wires) can be used to operate all the valves placed on the rotating assembly. All the control mechanisms and circuits can be directly installed on the rotating assembly, thus minimizing the possibility of failure.

[0124] In the prior art, the flipper does not control the positioning of semiconductor work products within the rotating assembly. They depend on the position where the robot places the medium.

[0125] Now refer to Figure 6 , which is a view above the rotating assembly 14. The flipper of this embodiment can accurately position the work product within the rotating assembly to ensure safe rotation, thus minimizing the risk of breakage of mispositioned work products during rotation.

[0126] In addition, the wafer position alignment feature of this embodiment allows the use of a vacuum end - effector and eliminates the need for an edge - gripping end - effector.

[0127] According to this embodiment, once the work product is placed within the flipper 10, it can be accurately positioned in place by means of the positioning plunger 50 to push the work product into place. At the same time, as described above, the placement pad with positioning pins serves as a stopper for the work product pushed by the pusher. When the work product reaches the currently selected positioning pin, the plunger stops but still maintains pressure on the work product, accurately positioning it in place.

[0128] Each wafer size can be placed on the common back pad 56 and can have dedicated retractable pins, usually two pairs of dedicated retractable pins, one pair on the right and one pair on the left. The flipper selects two pairs of pins (upper - left / right and lower - left / right), and lifts according to the work product size and shape information provided by the host to provide alignment. In the embodiment, sensors on the flipper can detect the medium size and / or type. All other pads of other sizes and shapes can be retracted as needed, and it should be noted that the pads of the largest size never need to be retracted because they do not cause an obstruction.

[0129] It should be noted that the flipper can be simply used for wafer alignment without actual flipping. The robot can take out the misaligned work product from the box, place it in the flipper for alignment, and then provide the aligned wafer to the manufacturing process.

[0130] It is expected that many related EFEM devices and wafer production technologies will be developed during the patent term of this application, and the scope of the corresponding terms will preferably include all such new technologies.

[0131] As used herein, the terms "comprises", "comprising", "includes", "including", "having" and their inflections mean "including but not limited to".

[0132] As used herein, the term "consisting of" means "including and limited to"

[0133] As used herein, the singular forms "a", "an" and "the" include plural references unless the context clearly dictates otherwise.

[0134] It should be understood that certain features of the present invention, which are, for clarity, described in the context of separate embodiments, may also be provided in combination in a single embodiment. Conversely, various features that are, for brevity, described in the context of a single embodiment in the present invention may also be provided separately, or in any suitable sub-combination, or in any other described embodiment applicable to the present invention. The specific features described in the context of various embodiments are not to be considered essential features of those embodiments unless those embodiments do not function without those components.

[0135] Although the present invention is described in connection with its specific embodiments, it will be apparent to those skilled in the art that many alternatives, modifications and variations are possible. Accordingly, it is intended to embrace all such alternatives, modifications and variations that fall within the spirit and broad scope of the appended claims.

[0136] All publications, patents and patent applications mentioned in this specification are hereby incorporated by reference in their entirety into this specification. To the extent as if each individual publication, patent or patent application was specifically and individually indicated to be incorporated by reference herein. Additionally, any reference cited or pointed out should not be construed as an admission that such references are prior art to the present invention. The title section in this application is used herein to make the specification easy to understand and should not be construed as a necessary limitation. Additionally, any priority document of this application is hereby incorporated by reference into this application.

Claims

1. A wafer flipping method for semiconductor processing of multiple semiconductor work products of a plurality of predetermined sizes, characterized in that: the method includes: when at a first non-rotated position, receiving a semiconductor work product having a first predetermined size in a rotating assembly, the rotating assembly having a plurality of retractable pins, each of the retractable pins corresponding to a respective predetermined size; clamping the semiconductor work product in the assembly at a first rotated position; selecting retractable pins from a plurality of aligned retractable pins corresponding to the first predetermined size; aligning the semiconductor work product in the assembly using the selected retractable pins; rotating the assembly with the semiconductor work product to a second rotated position; releasing the semiconductor work product from the second rotated position.

2. The wafer flipping method according to claim 1, characterized in that: the method further includes clamping the semiconductor work product between a first clamping frame and a second clamping frame.

3. The wafer flipping method according to claim 2, characterized in that: the method further includes receiving pneumatic power from a support member into the rotating assembly and supplying the pneumatic power to at least one of the first clamping frame and the second clamping frame.

4. The wafer flipping method according to claim 3, characterized in that: the method further includes providing a pneumatic circuit using a rotary joint having respective feed connectors and return connectors.

5. The wafer flipping method according to claim 1, characterized in that: the method further includes supplying power from a support member to the assembly using a slip ring.

6. The wafer flipping method according to claim 1, characterized in that: the method further includes using a plunger pin to push the semiconductor work product against a plurality of corresponding extended positioning pins among the plurality of retractable pins to align the work product.

7. The wafer flipping method according to claim 6, characterized in that: the method further includes operating the positioning pins through a plurality of solenoids.

8. The wafer flipping method according to claim 7, characterized in that: the solenoids are powered by at least one electronic controller mounted outside the rotating assembly through a slip ring.

9. The wafer flipping method according to claim 1, characterized in that: the second rotated position is rotated up to 180 degrees from the first rotated position.

10. The wafer flipping method according to claim 1, characterized in that: the semiconductor work product is a wafer or a ring.

11. The wafer flipping method according to claim 2, characterized in that: the method further includes operating a release actuator for releasing the semiconductor work product from the first clamping frame and the second clamping frame at the second rotated position, so as to release the semiconductor work product at the second rotated position with a predetermined alignment.

12. A wafer flipping device for semiconductor processing of multiple semiconductor work products of different predetermined sizes, characterized in that: the device includes a support rotating assembly, the rotating assembly including: A gripper for receiving the semiconductor work product; An upper frame member and a lower frame member for gripping the semiconductor work product within the frame when the semiconductor work product is oriented in a first direction; A plurality of retractable pins for bringing the semiconductor work product into a predetermined alignment within the frame, the plurality of retractable pins being selected for different ones of the plurality of predetermined sizes so as to align all the predetermined sizes; A rotary actuator for rotating the rotary assembly between the first direction and a second direction rotated from the first direction; and A release actuator for releasing the frame member to release the semiconductor work product to a predetermined alignment when in the second direction.

13. The wafer flipping device according to claim 12, characterized in that: The rotary assembly further includes a rotary joint for receiving pneumatic power from a support member for supply to each of the plurality of frame members.

14. The wafer flipping device according to claim 13, characterized in that: The rotary joint is disposed on a rotary shaft of the rotary assembly.

15. The wafer flipping device according to claim 12, characterized in that: The rotary assembly further includes a slip ring for supplying power to the assembly from a support member.

16. The wafer flipping device according to any one of claims 12 to 14, characterized in that: The plurality of positioning pins of the plurality of retractable pins are for aligning a semiconductor work product corresponding to one of a plurality of different sizes or shapes, each size or shape having its own predetermined alignment.

17. The wafer flipping device according to claim 16, characterized in that: The positioning pins are operated by at least one electronic controller mounted outside the rotary assembly, and / or wherein the frame members are operated by at least one electronic controller mounted outside the rotary assembly.

18. The wafer flipping device according to claim 17, characterized in that: The at least one electronic controller is connected to supply power to the positioning pins or the frame members.

19. The wafer flipping device according to claim 18, characterized in that: The positioning pins or the frame members are powered by a slip ring.

20. The wafer flipping device according to claim 12, characterized in that: The plurality of retractable pins are arranged in pairs, and at least one of each pair of retractable pins includes an alignment pin.

21. The wafer flipping device according to claim 12, characterized in that: The device further includes a pneumatic distribution system for distributing pneumatic fluid from a rotary valve to the respective plurality of gripper frame members.

22. The wafer flipping device according to claim 12, characterized in that: The second direction is 180 degrees rotated from the first direction.

23. The wafer flipping device according to claim 12, characterized in that: The semiconductor work product is a wafer or a ring.

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