Control of power consumption in thermal energy systems

By adjusting the flow of hot fluid in the thermal energy system through a central controller, the problems of complexity and high power consumption in existing thermal energy systems are solved, thereby reducing total power consumption and improving system efficiency.

CN113883662BActive Publication Date: 2025-11-04E ON SVERIGE
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Patent Information

Application Number
CN202110708627.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2020-07-02
Filing Date
2021-06-25
Publication Date
2025-11-04
Estimated Expiration
2041-06-25

AI Technical Summary

Technical Problem

Existing thermal energy systems suffer from complexity and inefficiency in providing heating and cooling, especially when using combined heating and cooling networks, which significantly increases power consumption, and the application of district cooling networks with water as the heat carrier is limited.

Method used

A central controller is used to control the flow of hot fluids in the thermal energy system. The outlet temperatures of the heating and cooling circuits are dynamically adjusted by the flow controllers of the heating and cooling circuits to optimize the total power consumption.

Benefits of technology

By dynamically adjusting the flow of the thermal fluid, the total power consumption of the thermal energy system is reduced, and the overall efficiency and energy utilization of the system are improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

A central controller (500) for controlling power consumption in a thermal energy system (400) comprising a plurality of heat pump assemblies (100) and a plurality of chiller assemblies (200), each heat pump assembly (100) being connected to a thermal energy circuit (300) comprising a hot conduit (302) and a cold conduit (304), to the hot conduit (302) via a hot heating circuit inlet (104) and to the cold conduit (304) via a hot heating circuit outlet (106), each chiller assembly (200) being connected to the thermal energy circuit (300), to the cold conduit (304) via a hot cooling circuit inlet (204) and to the hot conduit (302) via a hot cooling circuit outlet (206).
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Description

TECHNICAL FIELD

[0001] The present invention relates to a thermal energy system for providing heating and cooling to buildings. More specifically, the present invention relates to a central controller for a thermal energy system, a thermal energy system comprising such a central controller and a method for controlling a thermal energy system. BACKGROUND

[0002] Today, it is common practice in many places in the world to provide heating and hot water to houses and buildings via an energy grid. An example of such an energy grid is a district heating grid comprising a conduit and valve system for distributing hot water to houses and buildings such that the houses can be heated via a heat device, i.e. a heat exchanger, connected to the district heating grid when needed. The hot water can further be used for preparing hot tap water.

[0003] For cooling houses and buildings, similar systems can be used. However, the general principle of these systems is reversed. Instead of providing heat by e.g. providing hot water, heat is collected within the houses and carried away from the houses. However, district cooling grids, i.e. conduit and valve grids connecting several properties for cooling purposes, using water as a heat carrier are still rare. Instead, it is common practice to use electrical energy for running air conditioning systems, which is at least from an environmental point of view disadvantageous.

[0004] The energy grid can further be formed as a combined heating and cooling grid allowing both heating and cooling from a single system by using a heat device connected to the single system.

[0005] When heat devices are added to the energy grid, especially to such a combined heating and cooling grid mentioned above, the complexity of the heat devices is significantly increased. Especially when considering how to achieve an increase in efficiency of the thermal energy system and its connected heat devices. Manufacturers of such systems are constantly striving to provide systems with increased efficiency. SUMMARY

[0006] In view of the above, it is an object of the present invention to provide a control of a thermal energy system which alleviates some of the problems of the prior art systems outlined above.

[0007] More specifically, according to a first aspect, a central controller for controlling power consumption, in particular electric power consumption, in a thermal energy system is provided. The thermal energy system comprises a plurality of heat pump assemblies, each heat pump assembly being connected to a thermal energy circuit comprising a hot conduit and a cold conduit, to the hot conduit via a hot heating circuit inlet and to the cold conduit via a hot heating circuit outlet. A hot heating circuit flow controller is provided, configured to control the flow of thermal fluid from the hot heating circuit inlet to the hot heating circuit outlet. The thermal energy system further comprises a plurality of cooling machine assemblies. Each cooling machine assembly is connected to the thermal energy circuit, to the cold conduit via a hot cooling circuit inlet and to the hot conduit via a hot cooling circuit outlet. The thermal energy system comprises a hot cooling circuit flow controller configured to control the flow of thermal fluid from the hot cooling circuit inlet to the hot cooling circuit outlet. The central controller comprises a transceiver configured to receive power consumption data relating to the plurality of heat pump assemblies and the plurality of cooling assemblies, to transmit a heating circuit control signal to the hot heating circuit flow controllers, the heating circuit control signal indicating a heating circuit outlet temperature in each hot heating circuit outlet, to transmit a cooling circuit control signal to the hot cooling circuit flow controllers, the control signal indicating a cooling circuit outlet temperature in each hot cooling circuit outlet. The central controller comprises a circuit configured to perform an outlet temperature setting function configured to periodically change the heating circuit outlet temperature and the cooling circuit outlet temperature, and an analysis function configured to determine a current total power consumption of the plurality of heat pump assemblies and the plurality of cooling machine assemblies based on the power consumption data. The outlet temperature setting function is further configured to raise or lower the heating circuit outlet temperature and the cooling circuit outlet temperature based on a change between a previously determined total power consumption and the determined current total power consumption. Thus, a thermal fluid outlet temperature in the heating circuit outlet and the cooling circuit outlet can be found that provides an improved operating condition for the entire thermal energy system, i.e. a reduced total electric power consumption. By implementing in the present disclosure the control of the respective outlet temperatures by controlling the respective flow of thermal fluid, the central controller can achieve control of the thermal energy system to reduce its total electric power consumption.

[0008] The outlet temperature setting function can be configured to set the heating circuit outlet temperature and the cooling circuit outlet temperature to a fixed value for a predetermined time. Thus, the central controller can wait for a new system equilibrium before performing an analysis of a new current total power consumption. The thermal energy system as defined herein is complex and typically has some system inertia that should preferably be taken into account before a change in outlet temperature can be reliably evaluated.

[0009] The heating circuit outlet temperature can be configured to be set between -8°C and 50°C. The cooling circuit outlet temperature can be configured to be set between -4°C and 60°C.

[0010] In a second aspect, a thermal energy system is provided. The thermal energy system comprises:

[0011] a thermal energy loop comprising a hot conduit configured to allow a flow of thermal fluid therethrough at a first temperature and a cold conduit configured to allow a flow of thermal fluid therethrough at a second temperature, the second temperature being lower than the first temperature;

[0012] a plurality of heat pump assemblies, each heat pump assembly being connected to:

[0013] a thermal heating loop comprising a thermal heating loop inlet connected to the hot conduit and a thermal heating loop outlet connected to the cold conduit, the thermal heating loop being configured to transfer thermal fluid from the thermal heating loop inlet to the thermal heating loop outlet, the thermal heating loop further comprising a thermal heating loop flow controller configured to control the flow of thermal fluid from the thermal heating loop inlet to the thermal loop outlet.

[0014] each heat pump assembly comprises:

[0015] a heat pump; and

[0016] a thermal pump loop comprising a thermal pump loop inlet connected to the thermal heating loop at a first heat pump connection point, a thermal pump loop outlet connected to the thermal heating loop at a second heat pump connection point, and a thermal pump control pump configured to control the flow of thermal fluid from the thermal pump loop inlet through the heat pump at a heat extraction side of the heat pump to the thermal pump loop outlet.

[0017] the thermal pump loop partially overlaps the thermal heating loop, the overlap being between the first heat pump connection point and the second heat pump connection point.

[0018] the thermal energy system further comprises a plurality of chiller assemblies, each chiller assembly being connected to:

[0019] a thermal cooling loop comprising a thermal cooling loop inlet connected to the cold conduit and a thermal cooling loop outlet connected to the hot conduit, the thermal cooling loop being configured to transfer thermal fluid from the thermal cooling loop inlet to the thermal cooling loop outlet, the thermal cooling loop further comprising a thermal cooling loop flow controller configured to control the flow of thermal fluid from the thermal cooling loop inlet to the thermal cooling loop outlet.

[0020] each chiller assembly comprises:

[0021] a chiller; and

[0022] a chiller circuit comprising a chiller inlet connected to the hot cooling circuit at a first chiller connection point, a chiller circuit outlet connected to the hot cooling circuit at a second chiller connection point, and a chiller control pump configured to control a flow of hot fluid from the chiller inlet through the chiller at a heat generating side of the chiller to the chiller circuit outlet.

[0023] The chiller circuit partially overlaps with the hot cooling circuit, the overlap being between the first chiller connection point and the second chiller connection point.

[0024] The thermal energy system further comprises a central controller configured to control the thermal energy system according to the first aspect.

[0025] Thus, a thermal energy system is provided which can be controlled to achieve a total power consumption reduction, wherein the flow of hot fluid in the hot heating circuit and in the hot cooling circuit is controlled such that a desired respective outlet temperature is achieved which provides said total power consumption reduction.

[0026] According to a third aspect, a method for controlling a power consumption of a thermal energy system is provided. The thermal energy system comprises a hot conduit configured to allow a flow of hot fluid of a first temperature therethrough, and a cold conduit configured to allow a flow of hot fluid of a second temperature therethrough, the second temperature being lower than the first temperature;

[0027] a plurality of heat pump assemblies, each heat pump assembly being connected to:

[0028] a hot heating circuit comprising a hot heating circuit inlet connected to the hot conduit and a hot heating circuit outlet connected to the cold conduit, the hot heating circuit being configured to transfer hot fluid from the hot heating circuit inlet to the hot heating circuit outlet, the hot heating circuit further comprising a hot heating circuit flow controller configured to control a flow of hot fluid from the hot heating circuit inlet to the hot circuit outlet;

[0029] each heat pump assembly comprises:

[0030] a heat pump; and

[0031] a hot heating circuit comprising a hot heating circuit inlet connected to the hot conduit and a hot heating circuit outlet connected to the cold conduit, the hot heating circuit being configured to transfer hot fluid from the hot heating circuit inlet to the hot heating circuit outlet, the hot heating circuit further comprising a hot heating circuit flow controller configured to control a flow of hot fluid from the hot heating circuit inlet to the hot circuit outlet;

[0032] The heat pump circuit partially overlaps the thermal heating circuit, the overlap being between the first heat pump connection point and the second heat pump connection point.

[0033] The thermal energy system further comprises a plurality of chiller components, each chiller component being connected to:

[0034] a thermal cooling circuit comprising a thermal cooling circuit inlet connected to the cold conduit and a thermal cooling circuit outlet connected to the hot conduit, the thermal cooling circuit being configured to transfer thermal fluid from the thermal cooling circuit inlet to the thermal cooling circuit outlet, the thermal cooling circuit further comprising a thermal cooling circuit flow controller configured to control the flow of thermal fluid from the thermal cooling circuit inlet to the thermal cooling circuit outlet.

[0035] Each chiller component further comprises:

[0036] a chiller; and

[0037] a chiller circuit comprising a chiller inlet connected to the thermal cooling circuit at a first chiller connection point, a chiller circuit outlet connected to the thermal cooling circuit at a second chiller connection point, and a chiller control pump configured to control the flow of thermal fluid from the chiller inlet through the chiller at a heat generating side of the chiller to the chiller circuit outlet.

[0038] The chiller circuit partially overlaps the thermal cooling circuit, the overlap being between the first chiller connection point and the second chiller connection point. The thermal energy system further comprises a central controller according to the first aspect. The method comprises:

[0039] varying the heating circuit outlet temperature and the cooling circuit outlet temperature;

[0040] determining a change between a current total power consumption and a previously determined total power consumption based on power consumption data relating to the plurality of heat pump components and the plurality of cooling components; and

[0041] increasing or decreasing the heating circuit outlet temperature and the cooling circuit outlet temperature based on the change. The respective outlet temperatures are thus varied until the total power consumption of the thermal energy system is reduced. Thus, the thermal energy system can meet the thermal load imposed on the system while achieving an overall efficiency increase.

[0042] In one embodiment, if it is determined that the change in total power consumption is reduced relative to the previously determined total power consumption, the heating circuit outlet temperature is further decreased if the previous change in heating outlet temperature was a decrease, and the heating circuit outlet temperature is further increased if the previous change in heating circuit outlet temperature was an increase. If it is determined that the change in total power consumption is increased relative to the previously determined total power consumption, the heating circuit outlet temperature is increased if the previous change in heating outlet temperature was a decrease, and the heating circuit outlet temperature is decreased if the previous change in heating circuit outlet temperature was an increase.

[0043] In one embodiment, the method includes if it is determined that the change in total power consumption is reduced relative to the previously determined total power consumption, the cooling circuit outlet temperature is further decreased if the previous change in cooling outlet temperature was a decrease, and the cooling circuit outlet temperature is further increased if the previous change in cooling circuit outlet temperature was an increase. If it is determined that the change in total power consumption is increased relative to the previously determined total power consumption, the cooling circuit outlet temperature is increased if the previous change in cooling outlet temperature was a decrease, and the cooling circuit outlet temperature is decreased if the previous change in cooling circuit outlet temperature was an increase.

[0044] The heating circuit outlet temperature of each heat pump assembly and the cooling circuit outlet temperature of each cooling machine assembly can be further controlled independently of each other.

[0045] In one embodiment, the heating circuit outlet temperature and the cooling circuit outlet temperature are controlled by varying the flow rate of the thermal fluid provided by the heating circuit flow controller and the thermal cooling circuit flow rate controller, respectively.

[0046] In one embodiment, the method is performed on the thermal heating circuit prior to performing the method on the thermal cooling circuit, or vice versa. Thus, it can be easier to determine the change in total power consumption of the thermal energy system for each change in outlet temperature in the heating circuit or in the cooling circuit.

[0047] Generally, all terms used in the claims are to be interpreted according to their ordinary meaning in the technical field, unless explicitly defined otherwise herein. All references to a / an / the [element, device, component, means, step, etc.] are to be interpreted openly as referring to at least one instance of said element, device, component, means, step, etc., unless explicitly stated otherwise. The steps of any methods disclosed herein do not have to be performed in the exact order disclosed unless explicitly stated. BRIEF DESCRIPTION OF DRAWINGS

[0048] The above and further objects, features and advantages of the present application will be better understood from the following illustrative and non-limiting detailed description of preferred embodiments of the present application, taken in conjunction with the accompanying drawings, in which like reference numerals refer to like elements in which:

[0049] Figure 1 A schematic diagram of a thermal energy system according to an embodiment is disclosed.

[0050] Figure 2 A schematic diagram of a thermal energy system according to an embodiment is disclosed.

[0051] Figure 3 A schematic sketch of a central controller for controlling a thermal energy system according to an embodiment is disclosed.

[0052] Figure 4 A flow chart of a method for controlling a thermal energy system comprising a central controller according to an embodiment is disclosed.

[0053] Figure 5 A flow chart of a method for controlling a thermal energy system comprising a central controller according to an embodiment is disclosed. DETAILED DESCRIPTION

[0054] The present application now will be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the application are shown. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and fully convey the scope of the application to those skilled in the art.

[0055] Figure 1A heat energy system 400 for distributing heat from a heat energy circuit 300 to one or more thermal loads 600, such as heating / cooling of a building and / or hot tap water, is schematically illustrated. The building can be any type of building, such as a residential building, a commercial or office building, an apartment building, a detached house or an industrial building, suitable for being connected to the heat energy circuit 300. The heat energy circuit 300 can be a district heating network or a district cooling network known in the art. The district heating network (or district cooling network) can comprise a supply conduit providing a heating (or cooling) medium from a heat plant (not shown) and a return conduit transporting the cooled heating medium (or heated cooling medium) to the heat plant. The heating (or cooling) medium can be any fluid, such as water, suitable for being heated (or cooled) at the heat plant and transported through the supply conduit and the return conduit. The heating (or cooling) medium will hereinafter be referred to as "heat fluid". The heat plant can be a geothermal power plant, an electric power plant for heating (or cooling) a fluid, a wind or solar power plant, or can be driven by combustion of a fuel, such as gas or oil. The heat plant is configured to heat (or cool) the heat fluid and pump it through the heat energy circuit 300. For a district heating network, the supply conduit is considered a hot conduit 302 and the return conduit is considered a cold conduit 304. For a district cooling network, the supply conduit is considered a cold conduit 304 and the return conduit is considered a hot conduit 302.

[0056] As an alternative to a district heating or district cooling network, the heat energy circuit 300 can be a combined district heating and cooling network as previously disclosed in, for example, WO 2017 / 076868 filed by E.ON Sverige AB. In this case, the hot conduit 302 and the cold conduit 304 should not be considered a supply conduit and a return conduit, but rather as a hot conduit and a cold conduit 304 as disclosed in WO 2017 / 076868.

[0057] The heat energy circuit 300 thus comprises a hot conduit 302 and a cold conduit 304 for distributing heat energy to / from the heat energy system 400 connected thereto.

[0058] The heat energy system 400 is configured to extract / store heat from / into the heat fluid of the heat energy circuit 300 by a plurality of heat pump assemblies 100 and a plurality of chiller assemblies 200. Each heat pump assembly 100 and / or each chiller assembly 200 can serve one building or a plurality of buildings. A particular building can comprise one heat pump assembly 100 / one chiller assembly 200. A particular building can comprise more than one heat pump assembly 100 and more than one chiller 200, respectively.

[0059] Each heat load 600 can be formed in various ways, such as via water-to-water heating, water-to-air heating, etc. Furthermore, in the heat pump assembly 100, the heat load 600 can be formed not only by space heating but also by, for example, by providing tap hot water. The cooler 200 can be configured to meet the heat load 600 formed by comfort cooling to provide cooling for office equipment such as server rooms and / or for cooling water, to name just a few examples.

[0060] Each of the heat loads 600 can be dynamically changed, which naturally affects the heat pump assembly 100 and the cooling unit assembly 200. For example, the heat output from the heat pump assembly 100 or the cooling unit assembly 200 required to maintain a particular preferred indoor temperature in the building 600 can change rapidly with weather variations. Regardless of the individual conditions of the heat pump assembly 100 and the cooling unit assembly 200, it is desirable for the thermal system 400 as a whole to operate as efficiently as possible. That is, for a given operating condition, the total power consumption of the thermal system should be kept as low as possible.

[0061] Figure 1 The heat pump assembly 100 and the cooler assembly 200 shown are respectively connected to the heating circuit 102 and the cooling circuit 202 included in the thermal system 400. The heating circuit 102 is connected to the thermal circuit 300 via a heating circuit inlet 104 connected to a heat pipe 302 and a heating outlet 106 connected to a cold pipe 304. The heating circuit inlet 104 draws hot fluid from the heat pipe 302, and the heating circuit outlet 106 returns the hot fluid to the cold pipe 304, which extracts heat from the hot fluid, thus returning a lower-temperature hot fluid. The cooling circuit 202 is connected to the thermal circuit 300 via a cooling circuit inlet 204 connected to the cold pipe 304 and a cooling outlet 206 connected to the heat pipe 304. The cooling circuit inlet 204 draws hot fluid from the cold pipe 304, and the cooling circuit outlet 206 returns the hot fluid to the heat pipe 304, where the hot fluid stores heat, thus returning a higher-temperature hot fluid.

[0062] exist Figure 1 In the illustrated embodiment, the heating circuit 102 and the cooling circuit 202 are also connected to each other, so that the hot fluid can circulate from the cooling circuit outlet 206 to the heating circuit inlet 104 and from the heating circuit outlet 106 to the cooling circuit inlet 204. That is, the hot fluid can circulate directly between the heating circuit 102 and the cooling circuit 202.

[0063] The thermal energy system 400 can be connected to the thermal energy circuit 300 by a hot connection conduit 402 connecting the hot conduit 302 with the heating circuit inlet 104 and the cooling circuit outlet 206, and by a cold connection conduit 404 connecting the cold conduit 304 with the cooling circuit inlet 204 and the heating circuit outlet 106. Further, the hot connection conduit 402 and the cold connection conduit 404 can be provided with a hot fluid inlet control valve 406 and a hot fluid outlet control valve 408, respectively. The control valves 406, 408 are configured to control the flow rate and / or pressure of the hot fluid flowing into / out of the thermal energy circuit 300.

[0064] To establish and further control the flow of hot fluid through the hot heating circuit 102 to the plurality of heat pump assemblies 100, a hot heating circuit flow controller 108 is provided. The hot heating circuit flow controller 108 preferably comprises a hot heating circuit circulation pump 108a, and can further comprise a first hot heating circuit control valve 108b and an optional second hot heating circuit control valve 108c.

[0065] In Figure 1 Further shown in Figure 1 Only two heat pump assemblies 100 are shown in

[0066] Each heat pump 110 can comprise a heat extraction side 110a and a heat release side 110b. The heat extraction side 110a is connected to a respective heat pump circuit 112. The heat pump circuit 112 in turn is connected to the hot heating circuit 102 via a heat pump circuit inlet 114 at a first connection point 118 and via a heat pump circuit outlet 116 at a second connection point 120. Each heat pump circuit 112 partially overlaps with the hot heating circuit 102, such that the overlap is between the first connection point 118 and the second connection point 120.

[0067] Each heat pump circuit 112 further comprises a heat pump control pump 122 configured to control the flow rate of hot fluid from the heat pump circuit inlet 114 through the heat pump 110 heat extraction side 110a. It will be appreciated that while Figure 1 While only one heat pump assembly 100 is shown in

[0068] To establish and control the flow of thermal fluid through the thermal cooling circuit 202, a thermal cooling circuit flow controller 208 is provided. The thermal cooling circuit flow controller 208 preferably comprises a thermal cooling circuit circulation pump 208a, and it can further comprise a first thermal cooling circuit control valve 208b and optionally a second thermal cooling circuit control valve 208c.

[0069] In Figure 1 Further shown in Figure 1 Three chiller assemblies 200 are shown in

[0070] Each chiller 210 can comprise a heat extraction side 210a and a heat release side 210b. The heat release side 210b is connected to a respective chiller circuit 212. Each chiller circuit 212 in turn is connected to the thermal cooling circuit 202 at a first connection point 218 via a chiller circuit inlet 214 and at a second connection point 220 via a chiller circuit outlet 216. Each chiller circuit 212 partially overlaps with the thermal cooling circuit 202, such that the overlap is between the first connection point 218 and the second connection point 220.

[0071] The chiller circuit 212 further comprises a chiller control pump 222 configured to control the flow rate of thermal fluid from the chiller circuit inlet 214 through the chiller 210 heat release side 210a. It will be appreciated that while Figure 1 While only one chiller assembly 200 is shown in

[0072] A heat pump assembly controller 124 and a chiller assembly controller 224 can be provided to control the heat pump assembly 100 and the chiller assembly 200, respectively. For example, the respective controllers 124, 224 can be configured to control the respective control pumps 122, 222 on each heat pump circuit 112 and each chiller circuit 212. The respective controllers 124, 224 can further be connected to each heat pump 110 and each chiller 210 for controlling them and for monitoring their performance, such as their power consumption and / or heat load 600. In one embodiment, the heat pump assembly controller 124 and / or the chiller assembly controller 224 can be formed as part of or function of the central controller 500 and / or can be separate units connected to the central controller. Still further, the heat pump assembly controller 124 and / or the chiller assembly controller 224 can be connected to the hot heating circuit flow controller 108 and the hot cooling circuit flow controller 208, respectively.

[0073] In one embodiment, as shown in FIG. 1, a heating circuit outlet temperature sensor 126 and a cooling circuit outlet temperature sensor 226 are provided on the hot heating circuit outlet 106 and the hot cooling circuit outlet 206, respectively. The respective temperature sensors 126, 226 are configured to detect the temperature of the thermal fluid in the conduits 106, 206 to which they are attached. The heating circuit outlet temperature sensor 126 is connected to the heat pump assembly controller 124, and the cooling circuit outlet temperature sensor 226 is connected to the chiller assembly controller 224. Figure 1

[0074] Generally, it is desirable to achieve the highest possible coefficient of performance (COP) for each heat pump 110 and each chiller 210. That is, the relationship between the heat extracted / accumulated and the energy, power consumed by the heat pump 110 / chiller 210 should be as high as possible. However, the efficiency of the overall thermal energy system 400 is not determined solely by the COP of each heat pump 110 and / or each chiller 210. Rather, the power required by all other energy-consuming devices of the thermal energy system 400 must also be considered. For example, the heat pump control pumps 122, the chiller control pumps 222, the hot heating circuit controller 108, and the hot cooling circuit controller 208 require power in order to achieve the required flow rates, thereby affecting the overall efficiency / COP of the thermal energy system 400. Still further, each heat pump assembly 100 and each chiller assembly 200 connected to the thermal energy system 400 affect each other, and thus it is desirable to find a way to improve the overall efficiency of the entire thermal energy system 400.

[0075] ​Accordingly, the central controller 500 provided is configured to control the thermal energy system 400, more specifically, the thermal heating loop flow controller 108 and the thermal cooling loop flow controller 208, in response to the total power consumption of the thermal energy system 400. The central controller 500 is configured to change the temperature of the thermal fluid in the thermal heating loop outlet 106 and the thermal cooling loop outlet 206, respectively, as can be measured by the temperature sensors 126, 226. The change in temperature in the respective outlets 106, 206 is achieved by controlling the respective heating loop flow controller 108 / cooling loop flow controller 208, which changes the flow rate of the thermal fluid in the heating loop 102 and the cooling loop 202, respectively. The change in flow rate of the thermal fluid in the heating loop 102 and the cooling loop 202 has an effect on the heat pump assembly 100 and the chiller assembly 200 connected thereto. These will adapt to the new flow rate and then a change in power consumption of the thermal energy system 400 can be determined by the central controller 500. The aim of the central controller 500 controlling the thermal energy system 400 is to reduce its total power consumption.

[0076] As mentioned, the operating conditions of the thermal energy system 400 are dynamic. That is, the thermal load 600 is constantly changing, which means that a certain flow rate in the thermal heating loop 102 and the thermal cooling loop 202 does not always make the thermal energy system 400 have the same efficiency, nor does it always make the thermal fluid have the same respective outlet temperature. Accordingly, the central controller 500 iterates the control of the thermal energy system 400 periodically / continuously to maintain the thermal fluid temperature in the heating loop outlet 106 and the cooling loop outlet 206, respectively, such that the power consumption of the thermal energy system 400 is optimized / reduced for any operating condition / thermal load 600.

[0077] As Figure 1 shown, the central controller 500 can be connected to the heating loop controller 108 and the cooling loop controller 208 directly or via the heat pump assembly controller 124 and the assembly controller 224, respectively. The central controller 500 can also be connected to each heat pump 110 and each chiller 210 directly or via the heat pump assembly controller 124 and the assembly controller 224, respectively. The central controller 500 can also be connected to the heating loop outlet temperature sensor 126 and the cooling loop outlet temperature sensor 226 directly or via the heat pump assembly controller 124 and the assembly controller 224, respectively. The central controller 500 can be connected to each component of the thermal energy system 400 directly or indirectly as needed. Accordingly, the central controller 500 can collect power consumption data indicative of the total power consumption of the thermal energy system 400.

[0078] Figure 2 Another embodiment of the thermal energy system 400 is shown, in which the thermal heating loop 108 and the thermal cooling loop 208 are not directly connected to each other. Figure 2The illustrated embodiment is otherwise the same as Figure 1 The hot heating circuit inlet 104 is connected to the hot conduit 302 of the thermal energy circuit 300 and the hot heating circuit outlet 106 is connected to the cold circuit 302. The hot cooling circuit inlet 204 is connected to the cold conduit 304 and the hot cooling circuit outlet 106 is connected to the hot conduit 302.

[0079] Still further, the heating circuit inlet 104 and the cooling circuit inlet 204 can be provided with a hot fluid inlet control valve 406. The heating circuit outlet 106 and the cooling circuit outlet 206 can be provided with a hot fluid outlet control valve 408. The control valves 406, 408 are configured to control the flow and / or pressure of the hot fluid flowing into / out of the thermal energy circuit 300.

[0080] In Figure 2 In the illustrated embodiment, the hot heating circuit 102 and the hot cooling circuit 202 can be controlled completely independently of each other, as they are only connected to each other via the thermal energy circuit 300.

[0081] Figure 3 is a schematic illustration of the illustrated central controller 500. The central controller 500 is configured to perform the overall control of the functions and operations of the thermal energy system 400 and thus comprises a circuitry 510 which can be associated with a memory 508. The circuitry 510 can comprise a control circuitry 502 and an associated processor 504 such as a central processing unit (CPU), a microcontroller or a microprocessor. The processor 504 is configured to execute program code stored in the memory 508 in order to perform the functions and operations of the central controller 500.

[0082] The memory 508 can be one or more of a buffer, a flash memory, a hard drive, a removable media, a volatile memory, a non-volatile memory, a random access memory (RAM), or other suitable device. In a typical arrangement, the memory 508 can include a non-volatile memory for long term data storage and a volatile memory used as system memory for the central controller 500. The memory 508 can exchange data with the control circuitry 502 over a data bus. There can also be accompanying control lines and an address bus between the memory 508 and the control circuitry 502.

[0083] Circuitry 510 can also include a transceiver 506 connected to control circuitry 502 configured to allow remote control of units of the thermal energy system 400 and to allow communication between the units. The units of the assembly can be control pumps 122, 222, valves, heat pumps 110, chillers 210, flow controllers 108, 208, temperature sensors 126, 226, etc. The communication path over which the communication takes place can be wired or wireless. The communication can include data transfer, etc. The data transfer can include, but is not limited to, downloading and / or uploading data and receiving or sending messages. The data can be processed by the processor 504. The processing can include storing the data in a memory (e.g., memory 508 of circuitry 510), performing operations or functions, etc. The communication can be separate for each unit of the respective assembly.

[0084] The functions and operations of the central controller 500 can be embodied in the form of executable logic routines (e.g., lines of code, software programs, etc.) that are stored on a non-transitory computer readable medium (e.g., memory 508) of circuitry 510 and executed by control circuitry 502 (e.g., using processor 504). In addition, the functions and operations of the central controller 500 can be standalone software applications or form part of software applications that perform additional tasks related to the central controller 500. The described functions and operations can be considered methods that the corresponding apparatus is configured to perform. Also, while the described functions and operations can be implemented in software, this functionality can also be performed via special-purpose hardware or firmware, or some combination of hardware, firmware, and / or software. Heat pump controllers 124 and chiller controllers 224 can be formed in a similar manner as the central controller 500. In one embodiment, the heat pump controllers 124 and chiller controllers 224 are integral with the central controller 500 and thus included as a physical unit or as a function in the central controller 500, which can then be directly connected to the components of each heat pump assembly 100 and the components of each chiller assembly 200.

[0085] The central controller 500 is configured for controlling power consumption in a thermal energy system 400 that includes a plurality of heat pump assemblies 100, each heat pump assembly 100 connected to a thermal energy circuit 300 that includes a hot conduit 302 and a cold conduit 304, connected to the hot conduit 302 via a hot heating circuit inlet 104, and connected to the cold conduit 304 via a hot heating circuit outlet 106. The heat pump assembly also includes a hot heating circuit flow controller 108 configured to control the flow of thermal fluid from the hot heating circuit inlet 104 to the hot heating circuit outlet 106.

[0086] The thermal energy system 400 further comprises a plurality of chiller assemblies 200, each chiller assembly 200 connected to the thermal energy circuit 300, to the cold conduit 304 via the hot chiller circuit inlet 204, and to the hot conduit 302 via the hot chiller circuit outlet 206, and comprising a hot chiller circuit flow controller 208 configured to control the flow of thermal fluid from the hot chiller circuit inlet 204 to the hot chiller circuit outlet 206.

[0087] The central controller transceiver 506 is configured to receive power consumption data relating to the plurality of heat pump assemblies 100 and the plurality of chiller assemblies 200. The power consumption data can be formed by signals from each of the heat pump assemblies 100 and the chiller assemblies 200 and / or from each of the heat pump assembly controllers 124 and the chiller assembly controllers 224 or components thereof. The power consumption data can further be signals indicative of the power consumption of each heat pump 110, each chiller 210, each heat pump control pump 122, each chiller control pump 222, each heating circuit flow controller 108, and each cooling circuit flow controller 208. The power consumption data can include the total power consumption of the thermal energy system 400.

[0088] The central controller 500 is configured to transmit a heating circuit control signal to the hot heating circuit flow controller 108, the heating circuit control signal being indicative of a heating circuit outlet temperature in the hot heating circuit outlet 106. The central controller 500 is further configured to transmit a cooling circuit control signal to the hot cooling circuit flow controller 208, the control signal being indicative of a cooling circuit outlet temperature in the hot cooling circuit outlet 206.

[0089] The central controller circuit 510 is configured to execute an outlet temperature setting function configured to periodically change the heating circuit outlet temperature and the cooling circuit outlet temperature. By controlling the hot heating circuit flow controller 108 and the hot cooling circuit flow controller 208, the respective thermal fluid outlet temperatures are changed, thereby changing the flow rate of the thermal fluid in the hot heating circuit 102 and the hot cooling circuit 202, respectively. A decrease in the flow rate of the thermal fluid in the hot heating circuit 102 will result in a decrease in the temperature of the thermal fluid in the heating circuit outlet 106, and vice versa. A decrease in the flow rate of the thermal fluid in the hot cooling circuit 202 will result in an increase in the temperature of the thermal fluid in the cooling circuit outlet 206, and vice versa. The central controller 500 can receive feedback from the respective outlet temperature sensors 126, 226 for achieving the desired temperature of the thermal fluid in the hot heating circuit outlet 106 and the hot cooling circuit outlet 206, respectively.

[0090] The central controller 500 further comprises an analysis function implemented and executed by the circuit 502, which is configured to determine a current total power consumption of the plurality of heat pump assemblies 100 and the plurality of chiller assemblies 200 based on the power consumption data. The outlet temperature setting function is further configured to raise or lower the heating circuit outlet temperature and the cooling circuit outlet temperature based on a change between the previously determined total power consumption and the determined current total power consumption.

[0091] In one embodiment, the temperature setting function is configured to set the heating circuit outlet temperature and the cooling circuit outlet temperature to a fixed value for a predetermined time. Thus, the thermal energy system 400 will have time to stabilize, where each heat pump assembly 100 and each chiller assembly 200 find a new equilibrium or balance, where each heat pump control pump 122, each chiller control pump 222, each heat pump 110 and each chiller 210 respectively adapt to a new flow rate of the thermal fluid in the thermal heating circuit 102 and the thermal cooling circuit 202.

[0092] When the thermal energy system 400 has adapted to the new conditions, the new total power consumption can be determined more accurately. The time during which each temperature is set can be determined by a set time, such as 30 to 120 seconds. The time can also be determined by when the total power consumption stabilizes after a change in temperature of the thermal fluid in either the thermal heating circuit outlet 106 or the thermal cooling circuit outlet 206. As mentioned, the temperature in the thermal heating circuit outlet 106 can be measured by the heating circuit outlet temperature sensor 126, and as mentioned, the temperature in the thermal cooling circuit outlet 206 can be measured by the cooling circuit outlet temperature sensor 226.

[0093] In one embodiment, the heating circuit outlet temperature is configured to be set between -8°C and 50°C, and the cooling circuit outlet temperature is configured to be set between -4°C and 60°C.

[0094] Reference is made to Figure 4 wherein a schematic flow chart of a method 1000 for controlling the power consumption of the thermal energy system 400 is shown. The method comprises changing 1002 the heating circuit outlet temperature and the cooling circuit outlet temperature. Typically, the method 1000 is initiated by changing 1002 the temperature of the thermal fluid in the thermal heating circuit outlet 106 and / or the thermal cooling circuit outlet 206, or determining 1004 the current power consumption of the thermal energy system 400, after which the outlet temperature is changed 1002. Thereafter, a change between the current total power consumption of the thermal energy system 400 and a previously determined total power consumption can be determined 1004. In one embodiment, the method 1000 comprises waiting 1006 for a new thermal energy system 400 balance before determining 1004 the current total power consumption, as described above.

[0095] The time required before the current total power consumption is determined 1004 can be defined by a set predetermined time, preferably between 30 and 120 seconds. It can also be determined by when the total power consumption of the thermal energy system 400 has stabilized after a new outlet temperature has been set, whereby the current total power consumption can be determined 1004 as the stabilized total power consumption. The stabilized power consumption can be defined as the degree of change in power consumption per time unit has reached a sufficiently low power consumption after the outlet temperature has been changed.

[0096] Based on the determined change in power consumption of the thermal energy system 400, the temperature in the heating circuit outlet 106 and / or the cooling circuit outlet 206 is then increased 1002a or decreased 1002b.

[0097] The method 1000 can further comprise: if the determined 1004 change in total power consumption is reduced relative to the previously determined total power consumption, further decreasing 1002b the heating circuit outlet temperature in case the previous change 1002 in heating outlet temperature was a decrease. In case the previous change in heating circuit outlet temperature was an increase, which resulted in a decrease in total power consumption of the thermal energy system 400, the heating circuit outlet temperature can also be further increased 1002a.

[0098] If the determined 1004 change in total power consumption is increased relative to the previously determined total power consumption, the heating circuit outlet temperature can be increased 1002a in case the previous change 1002 in heating circuit outlet temperature was a decrease, and the heating circuit outlet temperature can be decreased 1002b in case the previous change 1002 in heating circuit outlet temperature was an increase.

[0099] Furthermore, if the determined 1004 change in total power consumption is reduced relative to the previously determined total power consumption, the cooling circuit outlet temperature can be further decreased 1002b in case the previous change 1002 in heating outlet temperature was a decrease. In case the previous change in cooling circuit outlet temperature was an increase, the cooling circuit outlet temperature can be further increased 1002a.

[0100] If the determined 1004 change in total power consumption is increased relative to the previously determined total power consumption, the cooling circuit outlet temperature can be increased 1002a in case the previous change 1002 in cooling outlet temperature was a decrease. Finally, in case the previous change 1002 in cooling circuit outlet temperature was an increase, the heating circuit outlet temperature can be decreased 1002a.

[0101] The above described method 1000 can be performed independently for the heating circuit 102 and the cooling circuit 202. Figure 4The method shown, i.e. controlling the temperature of the hot fluid in the heating circuit outlet 106 and the cooling circuit outlet 206 simultaneously and / or independently of each other to achieve a reduction in the total power consumption of the thermal energy system 400.

[0102] As mentioned, the heating circuit outlet temperature and the cooling circuit outlet temperature are controlled by changing the flow rate of the hot fluid provided by the heating circuit flow controller 108 and the thermal cooling circuit flow rate controller 208, respectively. The heating circuit outlet temperature sensor 126 and the cooling circuit outlet temperature sensor 226 can provide temperature information to the central controller 500, respectively, to allow feedback control of the thermal heating circuit flow controller 108 and the thermal cooling circuit flow controller 208 to achieve the desired outlet temperature. The method 1000 can further comprise determining 1004 to alternatively address and change the temperature in the thermal cooling circuit outlet 206 when the outlet temperature is achieved, and neither an increase nor a decrease in the temperature of the hot fluid in the thermal heating circuit outlet 106 is large enough to reduce the total power consumption of the thermal energy system 400. The method 1000 is then executed, changing the temperature of the hot fluid in the thermal cooling circuit outlet 206 until the outlet temperature is achieved, and the method 1000 can then be repeated if neither an increase nor a decrease in the temperature of the hot fluid in the thermal cooling circuit outlet 206 is large enough to reduce the total power consumption of the thermal energy system 400.

[0103] In Figure 5 A further embodiment of the method 1000 for controlling the power consumption of the thermal energy system 400 is shown in Figure 5 The method shown shows how the method 1000 can first be executed on the thermal heating circuit 102 to find the temperature of the hot fluid in the thermal heating circuit outlet 106, which provides the desired reduced total power consumption for the thermal heating circuit 102 and all the heat pump components 100. The method 1000 is then repeated on the thermal cooling circuit 202, whereby the temperature of the hot fluid in the thermal cooling circuit outlet 206 is achieved, which achieves the desired reduced total power consumption for the thermal cooling circuit 102 and all the cooling machine components 200.

[0104] The method 1000 can then be executed again for the thermal heating circuit 102, etc.

[0105] It should be understood that the present application is not limited to the embodiments shown. Several modifications and changes can therefore be envisaged within the scope of the present application, which is therefore only limited by the claims appended hereto.

Claims

1. A central controller for controlling power consumption in a thermal energy system, the thermal energy system comprising: Multiple heat pump components, each heat pump component connected to a thermal energy loop including a heat pipe and a cold pipe, connected to the heat pipe via a heat heating loop inlet and connected to the cold pipe via a heat heating loop outlet, the thermal energy system further including a heat heating loop flow controller configured to control the flow of hot fluid from the heat heating loop inlet to the heat heating loop outlet; The system also includes multiple cooling unit components, each connected to the thermal energy loop via a hot cooling loop inlet to the cold conduit and a hot cooling loop outlet to the hot conduit. The thermal energy system further includes a hot cooling loop flow controller configured to control the flow of hot fluid from the hot cooling loop inlet to the hot cooling loop outlet. The central controller includes: The transceiver is configured as follows: Receive power consumption data related to the plurality of heat pump components and the plurality of cooler components. The heating loop control signal is transmitted to the heating loop flow controller, which indicates the heating loop outlet temperature at each heating loop outlet. The cooling loop control signal is transmitted to these hot cooling loop flow controllers, which indicate the cooling loop outlet temperature at each hot cooling loop outlet; and The circuit is configured to perform: The outlet temperature setting function is configured to change the outlet temperature of the heating circuit and the outlet temperature of the cooling circuit. The analysis function is configured to determine the current total power consumption of the plurality of heat pump components and the plurality of cooler components based on the power consumption data. The outlet temperature setting function is further configured to raise or lower the outlet temperature of the heating circuit and the outlet temperature of the cooling circuit based on the change between the previously determined total power consumption and the determined current total power consumption.

2. The central controller according to claim 1, wherein, The outlet temperature setting function is configured to set the outlet temperature of the heating circuit and the outlet temperature of the cooling circuit to a fixed value within a predetermined time.

3. The central controller according to claim 1, wherein, The outlet temperature of the heating circuit is configured to be between -8°C and 50°C, and the outlet temperature of the cooling circuit is configured to be between -4°C and 60°C.

4. A thermal energy system, comprising: A thermal circuit including a heat pipe and a cold pipe, the heat pipe being configured to allow a hot fluid at a first temperature to flow through it, and the cold pipe being configured to allow a hot fluid at a second temperature to flow through it, the second temperature being lower than the first temperature; Multiple heat pump components, each heat pump component connected to a heat heating circuit, the heat heating circuit including a heat heating circuit inlet connected to the heat pipe and a heat heating circuit outlet connected to the cold pipe, the heat heating circuit being configured to transfer hot fluid from the heat heating circuit inlet to the heat heating circuit outlet, the heat heating circuit further including a heat heating circuit flow controller, the heat heating circuit flow controller being configured to control the flow of hot fluid from the heat heating circuit inlet to the heat heating circuit outlet; Each heat pump assembly includes: Heat pumps; and A heat pump circuit includes a heat pump circuit inlet, a heat pump circuit outlet, and a heat pump control pump. The heat pump circuit inlet is connected to the heat heating circuit at a first heat pump connection point, and the heat pump circuit outlet is connected to the heat heating circuit at a second heat pump connection point. The heat pump control pump is configured to control the flow of hot fluid from the heat pump circuit inlet through the heat pump on the heat extraction side of the heat pump to the heat pump circuit outlet. The heat pump circuit partially overlaps with the heating circuit, and the overlap is between the first heat pump connection point and the second heat pump connection point. Multiple cooling unit components, each cooling unit component connected to a thermal cooling circuit, the thermal cooling circuit including a thermal cooling circuit inlet connected to the cold conduit and a thermal cooling circuit outlet connected to the heat conduit, the thermal cooling circuit being configured to transfer hot fluid from the thermal cooling circuit inlet to the thermal cooling circuit outlet, the thermal cooling circuit further including a thermal cooling circuit flow controller, the thermal cooling circuit flow controller being configured to control the flow of hot fluid from the thermal cooling circuit inlet to the thermal cooling circuit outlet; Each cooling unit includes: Cooler; and A cooling circuit includes a cooling circuit inlet, a cooling circuit outlet, and a cooling circuit control pump. The cooling circuit inlet is connected to the hot cooling circuit at a first cooling circuit connection point, and the cooling circuit outlet is connected to the hot cooling circuit at a second cooling circuit connection point. The cooling circuit control pump is configured to control the flow of hot fluid from the cooling circuit inlet through the cooling circuit on the heating side of the cooling circuit to the cooling circuit outlet. The cooling circuit and the hot cooling circuit partially overlap, with the overlap occurring between the first cooling circuit connection point and the second cooling circuit connection point. The thermal energy system further includes a central controller according to claim 1, the central controller being configured to control the thermal energy system.

5. A method for controlling power consumption of a thermal energy system, the thermal energy system comprising a heat pipe and a cold pipe, the heat pipe being configured to allow a hot fluid at a first temperature to flow through it, and the cold pipe being configured to allow a hot fluid at a second temperature to flow through it, the second temperature being lower than the first temperature; Multiple heat pump components, each heat pump component connected to: A thermal heating circuit includes a thermal heating circuit inlet connected to a heat pipe and a thermal heating circuit outlet connected to a cold pipe. The thermal heating circuit is configured to transfer hot fluid from the thermal heating circuit inlet to the thermal heating circuit outlet. The thermal heating circuit further includes a thermal heating circuit flow controller configured to control the flow of hot fluid from the thermal heating circuit inlet to the thermal heating circuit outlet. Each heat pump assembly includes: Heat pump; as well as A heat pump circuit includes a heat pump circuit inlet, a heat pump circuit outlet, and a heat pump control pump. The heat pump circuit inlet is connected to the heat heating circuit at a first heat pump connection point, and the heat pump circuit outlet is connected to the heat heating circuit at a second heat pump connection point. The heat pump control pump is configured to control the flow of hot fluid from the heat pump circuit inlet through the heat pump on the heat extraction side of the heat pump to the heat pump circuit outlet. The heat pump circuit partially overlaps with the heating circuit, and the overlap is between the first heat pump connection point and the second heat pump connection point. Multiple cooling units, each cooling unit connected to: A thermal cooling circuit includes a thermal cooling circuit inlet connected to a cold conduit and a thermal cooling circuit outlet connected to a heat conduit, the thermal cooling circuit being configured to transfer hot fluid from the thermal cooling circuit inlet to the thermal cooling circuit outlet, the thermal cooling circuit further including a thermal cooling circuit flow controller, the thermal cooling circuit flow controller being configured to control the flow of hot fluid from the thermal cooling circuit inlet to the thermal cooling circuit outlet. Each cooling unit includes: Cooler; and A cooling circuit includes a cooling circuit inlet, a cooling circuit outlet, and a cooling circuit control pump. The cooling circuit inlet is connected to the hot cooling circuit at a first cooling circuit connection point, and the cooling circuit outlet is connected to the hot cooling circuit at a second cooling circuit connection point. The cooling circuit control pump is configured to control the flow of hot fluid from the cooling circuit inlet through the cooling circuit on the heating side of the cooling circuit to the cooling circuit outlet. The cooling circuit and the hot cooling circuit partially overlap, with the overlap occurring between the first cooling unit connection point and the second cooling unit connection point. The thermal energy system further includes... The central controller according to claim 1, the method comprising: Change the outlet temperature of the heating circuit and the outlet temperature of the cooling circuit; The change between the current total power consumption and the previously determined total power consumption is determined based on power consumption data related to the plurality of heat pump components and the plurality of cooling unit components; and Based on this change, the outlet temperature of the heating circuit and the outlet temperature of the cooling circuit can be increased or decreased.

6. The method according to claim 5, wherein, If it is determined that the change in total power consumption is reduced relative to the previously determined total power consumption, then the heating circuit outlet temperature is further reduced if the previous change in the heating circuit outlet temperature was a decrease, and wherein the heating circuit outlet temperature is further increased if the previous change in the heating circuit outlet temperature was an increase; and wherein if it is determined that the change in total power consumption is increased relative to the previously determined total power consumption, then the heating circuit outlet temperature is increased if the previous change in the heating circuit outlet temperature was a decrease, and wherein the heating circuit outlet temperature is decreased if the previous change in the heating circuit outlet temperature was an increase.

7. The method according to claim 5, wherein, If it is determined that the change in total power consumption is reduced relative to the previously determined total power consumption, then the cooling circuit outlet temperature is further reduced if the previous change in the cooling circuit outlet temperature was a decrease, and wherein the cooling circuit outlet temperature is further increased if the previous change in the cooling circuit outlet temperature was an increase; and wherein if it is determined that the change in total power consumption is increased relative to the previously determined total power consumption, then the cooling circuit outlet temperature is increased if the previous change in the cooling circuit outlet temperature was a decrease, and wherein the heating circuit outlet temperature is decreased if the previous change in the cooling circuit outlet temperature was an increase.

8. The method according to claim 5, wherein, The outlet temperature of the heating circuit for each heat pump assembly and the outlet temperature of the cooling circuit for each cooler assembly are controlled independently of each other.

9. The method according to claim 5, wherein, The outlet temperatures of the heating circuit and the cooling circuit are controlled by changing the flow rates of the hot fluids supplied by the flow controller of the heating circuit and the flow rate controller of the cooling circuit, respectively.

10. The method according to claim 5, wherein, The method is performed on the heating circuit before the cooling circuit, or vice versa.

Citation Information

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