Optical sensing device

Abstract

The present invention discloses an optical sensing device comprising a circuit substrate, an emitter, and a detector, each disposed on the circuit substrate. A packaging structure encapsulates the emitter and detector, separating the emitter and detector via a first recessed portion. A second recessed portion is further provided above the detector. Thus, the first and second recessed portions alter the scattering path of the light beam generated by the emitter, reducing the amount of light directly transmitted to the detector. This improves the sensing accuracy of the optical sensing device and reduces the effects of optical crosstalk.

Description

Technical Field

[0001] The present invention relates to an optical sensing device, and in particular to an optical sensing device capable of changing the light beam transmission direction of a transmitter. Background Art

[0002] A proximity sensor (PS) is a sensor that can detect the presence of nearby objects without physical direct contact. A proximity sensor typically emits electromagnetic waves, electrostatic fields, or electromagnetic radiation beams (e.g., infrared) and searches for changes in the field or return signals. The object being sensed is often referred to as the target of the proximity sensor. Different proximity sensor targets require different sensors. For example, capacitive or photoelectric sensors can be used for plastic objects, while inductive proximity sensors can be suitable for metal objects. Therefore, a sensing module that uses a proximity sensor can be called an optical sensing module.

[0003] Many optical sensing modules typically include a metal shield to provide optical isolation between the emitter and detector, minimizing unwanted optical crosstalk between the emitter and detector. However, while the metal shield can provide optical isolation between the emitter and detector, it increases the manufacturing cost of the optical sensing module. Therefore, an opening between the emitter and detector can also be used to reduce optical crosstalk in the optical sensing module.

[0004] Figure 1 A perspective view of a conventional optical sensing device is shown, such as Figure 1 As shown, the optical sensing device 1 includes a circuit board 11, an emitter 12, a detector 13, a packaging member 14, and an opening 15. The emitter 12 and the detector 13 are disposed on the circuit board 11, and the packaging member 14 is disposed on the emitter 12 and the detector 13. By forming the opening 15 between the emitter 12 and the detector 13, the scattering path of the light beam is changed.

[0005] However, although the design of the opening can effectively reduce the problem of optical crosstalk compared to the design of no opening, as the volume of the optical sensing module becomes smaller and smaller, the opening method still has a high probability of allowing the light beam scattered by the emitter 12 to directly pass to the detector 13, such as Figure 1 As shown, the optical crosstalk problem cannot be reduced to a tolerable range.

[0006] Therefore, how to reduce the optical crosstalk problem and enhance the sensing effect of optical sensing devices through structural design improvements has become one of the important issues that this industry wants to solve. Summary of the Invention

[0007] The technical problem to be solved by the present invention is to provide an optical sensing device in response to the shortcomings of the prior art, which includes a circuit substrate, an emitter, a detector and a packaging component. The surface of the circuit substrate includes multiple circuit areas independent of each other, and the emitter and the detector are respectively arranged on the multiple circuit areas. The packaging component covers the multiple circuit areas and is respectively arranged on the emitter and the detector on the multiple circuit areas, and the packaging component includes a first recessed portion and a second recessed portion. The depth of the first recessed portion is set between the corresponding emitter and the detector, and the depth of the second recessed portion is set above the corresponding detector. The depth of the second recessed portion is lower than the depth of the first recessed portion, and the scattering path of the light beam generated by the emitter in the packaging component is changed by the first recessed portion and the second recessed portion.

[0008] In order to solve the above-mentioned technical problem, another technical solution adopted by the present invention is to provide an optical sensing device, which includes a circuit substrate, an emitter, a detector and a light-blocking packaging component.

[0009] One of the beneficial effects of the present invention is that the optical sensing device provided by the present invention can reduce the direct transmission of the light beam generated by the emitter to the detector by providing a first recessed portion, a second recessed portion, and / or a third recessed portion, thereby improving the sensing accuracy of the optical sensing module and reducing the impact of optical crosstalk.

[0010] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not intended to limit the present invention.

[0011] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 A three-dimensional diagram showing a conventional optical sensing device.

[0013] Figure 2A FIG. 1 is a perspective schematic diagram of an optical sensing device according to a first embodiment of the present invention.

[0014] Figure 2B FIG. 1 is a cross-sectional diagram of light beam transmission of the optical sensing device according to the first embodiment of the present invention.

[0015] Figure 3A FIG. 4 is a perspective schematic diagram of an optical sensing device according to a second embodiment of the present invention.

[0016] Figure 3BFIG. 4 is a cross-sectional diagram of light beam transmission of an optical sensing device according to a second embodiment of the present invention.

[0017] Figure 4A FIG. 4 is a perspective schematic diagram of an optical sensing device according to a third embodiment of the present invention.

[0018] Figure 4B FIG. 4 is a cross-sectional view of an optical sensing device according to a third embodiment of the present invention.

[0019] Figure 4C FIG. 4 is a cross-sectional view of an optical sensing device according to a fourth embodiment of the present invention.

[0020] Figure 5 FIG. 4 is a cross-sectional view of an optical sensing device according to a fifth embodiment of the present invention.

[0021] Figures 6A-6D Schematic diagram of experimental data of crosstalk testing of optical sensing devices with different designs.

[0022] Figure 7 FIG. 4 is a flow chart of a method for manufacturing an optical sensing device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0023] The following is an explanation of the implementation of the "optical sensing device" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

[0024] It should be understood that although the terms first, second, third, etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. In addition, the term "or" as used herein may include any one or more combinations of the associated listed items, as appropriate.

[0025] For clarity of explanation, the technology may in some cases be presented as including separate functional blocks comprising functional blocks, including devices, device components, steps or routes in a method implemented in software, or a combination of hardware and software.

[0026] Devices implementing the disclosed methods may include hardware, firmware, and / or software and may take any of a variety of forms. Typical examples of such forms include laptop computers, smartphones, small personal computers, personal digital assistants, and the like. The functionality described herein may also be implemented in peripheral devices or built-in cards. By way of further example, such functionality may also be implemented on different chips or circuit boards with different programs running on a single device.

[0027] First embodiment of the present invention

[0028] Figure 2A is a three-dimensional schematic diagram of an optical sensing device according to a first embodiment of the present invention, Figure 2B FIG1 is a schematic diagram of light beam transmission of an optical sensing device according to a first embodiment of the present invention. Figure 2A and Figure 2B As shown, the first embodiment of the present invention provides an optical sensing device 2 , which includes a circuit substrate 21 , an emitter 22 , a detector 23 , a packaging member 24 , a first recess 25 , and a second recess 26 .

[0029] The circuit substrate 21 is preferably a printed circuit board (PCB), and multiple circuit regions may be defined on the circuit substrate 21. The emitter 22 and detector 23 are disposed on the multiple circuit regions of the circuit substrate 21. Specifically, the detector 23 is disposed on the same plane as the emitter 22, and the detector 23 and emitter 22 are disposed adjacent to each other on the circuit substrate 21 at a predetermined distance. The emitter 22 may be an emitter, and the detector 23 may be a light detector. It should be noted that in an embodiment of the present invention, the emitter 22 includes vertical-cavity surface-emitting lasers (VCSELs) and a Zener diode, and the detector 23 is an integrated ambient and proximity sensor, but this is not limited to this embodiment. The detector 23 may include both a first detection unit 231 and a second detection unit 232, or may include only the first detection unit 231 or only the second detection unit 232. The first detection unit 231 can be an ambient light sensor (ALS) and the second detection unit 232 can be a proximity sensor (PS). The present invention is not limited to the type of detector 23. The first detection unit 231 is located adjacent to the first recessed portion 25, and the second detection unit 232 is located on a side away from the first recessed portion 25. They are used to sense the light beam emitted by the emitter 22 to the sensed object and then reflected by the sensed object to the second detection unit 232. The principles and application scope of the first detection unit 231 and the second detection unit 232 are well known to those skilled in the art and will not be elaborated here.

[0030] The encapsulation member 24 covers the emitter 22 and detector 23. Besides protecting them from damage from external forces, it also blocks ambient light from directly reaching the detector 23. Encapsulation member 24 is made of an epoxy resin material or other suitable molding material that is optically transparent or translucent to the electromagnetic signal of a specific wavelength emitted by the emitter 22. For example, if the signal detector 23 is a single-function infrared proximity sensor, the transparent encapsulation member 24 is a compound that allows infrared light to pass through. Encapsulation member 24 can also be a resin that cuts, filters, or shields specific wavelengths, effectively blocking ambient light from directly reaching the detector 23, thereby reducing sensing performance. For example, if the emitter 22 is a vertical-cavity surface-emitting laser (VCSEL), encapsulation member 24 can be made of an infrared-blocking resin (as used in illumination sensors). Therefore, encapsulation member 24 is also referred to as an infrared-blocking encapsulation member.

[0031] Furthermore, a first recess 25 is disposed between the emitter 22 and the detector 23. Specifically, the first recess 25 has a depth D1 of approximately 0.36 mm, extending deep enough to proximate the circuit substrate 21 but not exposing the circuit substrate 21 within the first recess 25. The width W1 of the first recess 25 is approximately 0.2 mm. The purpose of providing the first recess 25 is to redirect the scattered light beam from the emitter 22 due to the provision of the first recess 25, thereby reducing the probability of the scattered light beam being directly transmitted to the detector 23 and improving the sensing sensitivity of the detector 23. Furthermore, the provision of the first recess 25 limits the direct light beam to within the surface width Wa of the packaging member 24 (0.68 mm), thereby concentrating the light beam.

[0032] The second recess 26 is positioned above the detector 23. The depth D2 of the second recess 26 is approximately 0.15 mm. The thickness of the packaging member 24 at the bottom of the second recess 26 is approximately 0.05 mm, with a thickness tolerance of ±0.025 mm. This prevents the detector 23 from being exposed at the bottom of the second recess 26. The opening of the second recess 26 extends from a location between the first recess 25 and the first detection unit 231 to a location adjacent to the second detection unit 232. The width W2 of the second recess 26 is approximately 0.56 mm, which is smaller than the width of the detector 23. Furthermore, the first and second recesses 25, 26 can be formed, for example, by etching the packaging member 24 or by cutting. The first and second recesses 25, 26 can be formed simultaneously in a single process step, or in two separate process steps, without limitation. In addition, it should be noted that in this embodiment, the width W2 of the second recess 26 is at least twice as large as the width W1 of the first recess 25, or in other words, larger than the width of the two detection units, especially when the first detection unit 231 is an ambient light sensor, and the packaging component 24 located at the bottom of the second recess 26 has a thinner thickness to facilitate the reception of ambient light. However, the width or depth of the first recess 25 and the second recess 26 may be different in different embodiments and are not limited to those shown in the figure. According to different emitters 22 or different detectors 23, the width or depth of the first recess 25 and the second recess 26 may be adjusted according to the transmission characteristics of different light beams or the sensing sensitivity of the detector 23.

[0033] Although the first recess 25 changes the probability of the scattered light beam being directly transmitted to the detector 23, some of the scattered light beam will still be refracted again and transmitted to the detector 23. Therefore, a second recess 26 is provided so that the scattered light beam transmitted to the detector 23 will be refracted again when passing through the second recess 26, thereby further reducing the probability of the scattered light beam being transmitted to the detector 23.

[0034] Second embodiment of the present invention

[0035] Figure 3A is a three-dimensional schematic diagram of an optical sensing device according to a second embodiment of the present invention. Figure 3B FIG2 is a schematic diagram of light beam transmission of an optical sensing device according to a second embodiment of the present invention. Figure 3A and Figure 3B As shown, the second embodiment of the present invention provides an optical sensing device 2 , which includes a circuit substrate 21 , an emitter 22 , a detector 23 , a packaging member 24 , a first recess 25 , a second recess 26 , and a third recess 27 .

[0036] Since the arrangement positions of the circuit substrate 21, the emitter 22, the detector 23, the packaging component 24, the first recess 25, and the second recess 26 of the second embodiment are the same as those of the first embodiment, the arrangement positions of the circuit substrate 21, the emitter 22, the detector 23, the packaging component 24, the first recess 25, and the second recess 26 and the connection relationship between other components can be referred to the description of the first embodiment above, which will not be repeated here.

[0037] Similarly, in the second embodiment, the first recess 25 is disposed between the emitter 22 and the detector 23. Specifically, the depth D1 of the first recess 25 extends downward to an area adjacent to the circuit substrate 21, but does not expose the circuit substrate 21 in the first recess 25. The depth D1 is generally approximately 0.36 mm, and the width W1 of the first recess 25 is approximately 0.2 mm. The third recess 27 is disposed above the first recess 25, and the width W3 of the third recess 27 is approximately 0.4 mm, which is approximately twice the width W1 of the first recess 25. The depth D3 of the third recess 27 is approximately 0.1-0.2 mm.

[0038] Furthermore, the first recessed portion 25 and the third recessed portion 27 are stacked to form a stepped recessed portion. In a preferred embodiment of the present invention, the left and right sides of the stepped recessed portion are symmetrical. However, in different embodiments, the left and right sides of the recessed portion may also be asymmetrical, and this is not limited here. The purpose of providing the first recessed portion 25 and the third recessed portion 27 is to change the transmission path of the scattered light beam from the emitter 22 due to the provision of the first recessed portion 25 and the third recessed portion 27, thereby preventing the scattered light beam from being directly transmitted to the detector 23 and causing misjudgment by the detector 23. In addition, due to the provision of the third recessed portion 27, the light beam can be limited to be directly incident within the range of the surface width Wb of the packaging component 24 of 0.58 mm, thereby achieving the purpose of concentrating the light beam.

[0039] Furthermore, the first and third recesses 25, 27 can be formed, for example, by etching the packaging member 24, or by cutting. The first and third recesses 25, 27 can be formed simultaneously in a single process step, or in two separate process steps, without limitation. The second recess 26 is disposed above the detector 23. Its bottom portion, at a depth D2, does not expose the detector 23. The depth D2 of the second recess 26 is approximately the same as the depth of the third recess 27. The width W2 of the second recess 26 is approximately 0.56 mm, which is smaller than the width of the detector 23. The depth D2 of the second recess 26 is approximately 0.15 mm. The thickness of the packaging member 24 at the bottom of the second recess 26 is approximately 0.05 mm, with a thickness tolerance within ±0.025 mm. In addition, it should be noted that the width or depth of the first recess 25, the second recess 26 and the third recess 27 may be different in different embodiments and is not limited to that shown in the figure. According to different emitters 22 or different detectors 23, the width or depth of the first recess 25, the second recess 26 and the third recess 27 may be adjusted according to the transmission characteristics of different light beams or the sensing sensitivity of the detector 23.

[0040] See also Figure 2B and Figure 3B The first recessed portion 25 includes a first side 251 and a second side 252, the second recessed portion 26 includes a third side 261 and a fourth side 262, and the third recessed portion 27 includes a fifth side 271 and a sixth side 272. Figure 2B and Figure 3B As shown, the transmission path of the light beam 30 will change when it is transmitted in different media. When the light beam 30 is emitted from the emitter 22, it will be transmitted in the packaging component 24. Some light beams 30 will be direct, and some light beams 30 will be scattered. When the light beam 30 is scattered to the first recessed portion 25, part of the scattered light beam 30 will be refracted or reflected due to the change of the medium (solid to gas or gas to solid). Part of the scattered light beam will be refracted into the atmosphere at the first side 251 of the first recessed portion 25 or the fifth side 271 of the third recessed portion 27, and part of the scattered light beam 30 will be refracted to the second side 252 of the first recessed portion 25 or the sixth side 272 of the third recessed portion 27, and transmitted again in the packaging component 24. Then, the scattered light beam 30 is reflected back to the packaging member 24 by the surface 241 of the packaging member 24. When the reflected light beam 30 passes through the third side 261 of the second recessed portion 26, it is refracted again. Part of the light beam is transmitted to the bottom 263 of the second recessed portion 26. The light beam 30 is refracted again at the bottom 263 of the second recessed portion 26, thereby reducing the probability of the light beam 30 being directly transmitted to the proximity sensor 232. Figure 2B and Figure 3B As shown, it can be seen that the light beam 30 changes its transmission path due to the setting of the first recess 25, the second recess 26 and / or the third recess 27, which greatly reduces the probability of the light beam 30 being directly transmitted to the proximity sensor 232, thereby reducing the occurrence of crosstalk and improving the sensing efficiency of the detector 23.

[0041] Third embodiment of the present invention

[0042] Figure 4A is a three-dimensional schematic diagram of an optical sensing device according to a third embodiment of the present invention. Figure 4B is a cross-sectional view of an optical sensing device according to a third embodiment of the present invention. Figure 4A and Figure 4B As shown, in a third embodiment of the present invention, an optical sensing device 4 includes a circuit substrate 41 , an emitter 42 , a detector 43 , a packaging member 44 , a first recess 45 , a second recess 46 and a third recess 47 .

[0043] Since the components and connections of the optical sensing device 4 in the third embodiment of the present invention are substantially the same as those of the optical sensing device 2 in the first embodiment, and the optical sensing device 4 also includes a first detection unit 431 and a second detection unit 432, the arrangement and connections of the circuit substrate 41, emitter 42, detector 43, packaging member 44, first recess 45, and third recess 47 of the optical sensing device 4 are not further described herein.

[0044] The width W1 of the first recess 45 is approximately 0.2 mm. The third recess 47 is disposed above the first recess 45, and the width W3 of the third recess 47 is at least twice the width W1 of the first recess 45. The circuit substrate 41 is preferably not exposed at the bottom of the first recess 45, so the depth D1 of the first recess 45 must be less than the thickness of the packaging member 44. Furthermore, the first and third recesses 45, 47 may be stacked to form a stepped recess. In a preferred embodiment of the present invention, the stepped recess has symmetrical left and right sides. However, in different embodiments, the left and right sides may also be asymmetrical, and this is not limiting. Furthermore, the provision of the third recess 47 can limit the direct light beam to within the surface width Wb of the packaging member 44 of 0.58 mm, thereby concentrating the light beam. The second recessed portion 46 is disposed above the detector 43. The depth D2 of the second recessed portion 46 is approximately 0.15 mm. The upper surface of the detector 43 is covered by the packaging member 44 having a thickness of approximately 0.025 to 0.075 mm and is not exposed below the depth D2 of the second recessed portion 46. The opening W2' of the second recessed portion 46 extends from a position on one side of the first detection unit 431 to an edge of the packaging member 44. The third embodiment illustrates that the second recessed portion 46 of the present invention can have different implementations in different embodiments. As long as the scattered light beam from the emitter 42 can be directly transmitted to the second sensor 432 of the detector 43, it can be an implementation of the second recessed portion 46 of the present invention, and this is not limited here.

[0045] Fourth embodiment of the present invention

[0046] However, in the fourth embodiment, for example, Figure 4C As shown, in the fourth embodiment of the present invention, the optical sensing device 4 also includes: a circuit substrate 41 , an emitter 42 , a detector 43 , a packaging component 44 , a first recess 45 and a second recess 46 ′.

[0047] Likewise, due to Figure 4CThe components and connections of the optical sensing device 4 are substantially the same as those of the optical sensing device 2 of the first embodiment. Therefore, the description of the components and connections of the optical sensing device 4 will not be repeated here. In the optical sensing device 4 of the fourth embodiment, compared to the second recess 46 of the third embodiment, the second recess 46' of the fourth embodiment extends from a side edge of the packaging member 44 to above the opening of the first recess 45. In other words, the second recess 46' of the fourth embodiment communicates with the first recess 45 to form an L-shaped notch. The optical sensing device 4 may further include a third recessed portion 47, which is disposed above the first recessed portion 45. One side of the first recessed portion 45 and the third recessed portion 47 are stacked to form a stepped recessed portion. The other side of the third recessed portion 47 is connected to the second recessed portion 46'. Through the first recessed portion 45, the second recessed portion 46' and / or the third recessed portion 47 of the fourth embodiment, the light transmission path of the light beam emitted by the emitter 42 can also be changed, thereby reducing the probability of the light beam being directly transmitted to the detector 43.

[0048] Fifth embodiment of the present invention

[0049] in addition, Figure 5 is a cross-sectional view of an optical sensing device according to a fifth embodiment of the present invention. Figure 5 As shown, in a fifth embodiment of the present invention, an optical sensing device 5 includes a circuit substrate 51 , an emitter 52 , a detector 53 , a light-blocking packaging component 54 and a recess 55 .

[0050] Similarly, since the components and their connections of the optical sensing device 5 in the fifth embodiment of the present invention are substantially the same as those of the optical sensing device 4 in the third embodiment, and the detector 53 of the optical sensing device 5 also includes a first detection unit 531 and a second detection unit 532, the arrangement and connection of the circuit substrate 51, emitter 52, detector 53, and light-blocking packaging component 54 of the optical sensing device 5 are not further described herein.

[0051] The depth D of the recess 55 is approximately 0.15 mm, and the width W of the recess 55 is at least twice the width of the two detection units 531 and 532. The thickness Td of the light-blocking encapsulation member 54 at the bottom of the recess 55 is approximately 0.05 mm, with a thickness tolerance of ±0.025 mm, ensuring that the detector 53 is not exposed at the bottom of the recess 55. The opening of the recess 55 extends from one side of the first sensing unit 531, through the top of the first sensing unit 531, to one side of the second sensing unit 532, or from one side of the first sensing unit 531 to one edge of the light-blocking encapsulation member 54. Compared to the third embodiment, the optical sensing device 5 of the fifth embodiment includes only one recess 55. The thinner light-blocking encapsulation member 54 above the detector 53 reduces the direct transmission of the light beam emitted by the emitter 52 to the detector 53. Furthermore, the use of a light-blocking encapsulation material as the light-blocking encapsulation member 54 effectively blocks side light.

[0052] For example, a light-blocking infrared light-blocking adhesive is selected as the light-blocking encapsulating member 54 to fully cover the emitter 52 and the detector 53. Specifically, the light-blocking infrared light-blocking adhesive has a characteristic: within a selected wavelength range, for example, at a thickness of 0.3 mm, its transmittance drops to below 60% at wavelengths between 700 and 900 nm. As the thickness increases, the percentage of light filtered out in this wavelength range increases, preferably to less than 20%. Therefore, the light-blocking encapsulating member 54 between the emitter 52 and the detector 53 has a spacing Tgap that is at least twice the original thickness of the light-blocking encapsulating member 54. This allows at least 80% of the infrared light to be filtered out, effectively shielding side light and preventing the light beam from being directly transmitted to the detector 53 without affecting the light output of the emitter 52 or the light reception of the detector 53. The thickness Te of the light-blocking encapsulating member 54 corresponding to the light-emitting surface of the emitter 52 must allow at least 60% of the light to pass through. Therefore, for the light-blocking infrared light-blocking material, the thickness Te is preferably less than 0.3 mm. That is to say, the distance Tgap between the light-blocking packaging component 54 between the emitter 52 and the detector 53 is at least twice greater than the thickness Te of the light-emitting surface of the light-blocking packaging component 54 corresponding to the emitter 52; the thickness Te of the light-emitting surface of the light-blocking packaging component 54 corresponding to the emitter 52 is greater than the thickness Td of the light-incident surface of the light-blocking packaging component 54 corresponding to the detector 53, that is, the distance Tgap is greater than 2 times the thickness Te and greater than the thickness Td.

[0053] Figures 6A-6D Schematic diagram of experimental data of crosstalk testing of optical sensing devices with different designs. Figure 6A The experimental data shown is that the optical sensing device includes only one first recessed portion without the second recessed portion and the third recessed portion. The light intensity 60A transmitted to the proximity sensor is approximately 1.2240E-6Watts / cm2. Figure 6B The experimental data shown is that the optical sensing device includes the first recess and the second recess, but does not have the third recess. The light intensity 60B transmitted to the proximity sensor is approximately 1.0707E-6Watts / cm2. Figure 6A and Figure 6B It can be seen that the light intensity 60B transmitted to the proximity sensor of the optical sensing device decreases by approximately 15% due to the addition of the second recessed portion. Figure 6C The experimental data results show that the optical sensing device of the second embodiment of the present invention includes a first recessed portion, a second recessed portion, and a third recessed portion. The light intensity 60C transmitted to the proximity sensor is approximately 3.672E-7Watts / cm2. Compared with the traditional sensor packaging structure with only the first recessed portion, its light intensity is reduced by approximately 70%. Figure 6D The experimental data results show that the optical sensing device of the third embodiment of the present invention also includes the first recess, the second recess, and the third recess. The light intensity 60D transmitted to the proximity sensor is approximately 3.59E-7 Watts / cm2. Its light intensity is roughly similar to that of the second embodiment. Compared with the traditional sensor packaging structure with only the first recess, its light intensity is also reduced by approximately 70%.

[0054] Experimental results indicate that by providing the first, second, and third recesses within the optical sensing device, the crosstalk of the second detection unit can be reduced by at least 100 counts, down from the 400 to 500 counts typically associated with conventional light fluctuations. Excessive crosstalk can lead to sensing failure in the optical sensing device, causing it to believe it is constantly approaching the sensing object, potentially preventing the mobile device's screen from turning off.

[0055] Figure 7 FIG. 1 is a flow chart of the manufacturing method of the optical sensing device of the present invention. Figure 7 As shown, and with reference to the component numbers of the optical sensing device of the first embodiment of the present invention, in step S701, an emitter 22 and a detector 23 are arranged on a circuit substrate 21. A gap is provided between the emitter 22 and the detector 23. Therefore, in subsequent manufacturing processes, an opening can be formed in the gap between the emitter 22 and the detector 23. In step S702, a packaging material is filled on the emitter 22, the detector 23, and the circuit substrate 21. The packaging material 24 is then filled and baked. In addition to protecting the emitter 22 and the detector 23, the packaging material 24 can also block some ambient light, allowing only light beams of specific wavelengths (such as infrared light, etc.) to pass to the detector 23. How to fill the packaging material 24 and how to bake the packaging material 24 are well known to those skilled in the art and will not be described in detail here.

[0056] In step S703, a first recess 25 is formed between the emitter 22 and the detector 23. The first recess 25 can be formed by laser etching or, in various embodiments, by cutting. Depending on the size of the detector 23, different processes can be used to form the first recess 25, and this is not a limitation. Next, in step S704, a second recess 26 is formed above the detector 23. The second recess 26 can be formed in the same manner as the first recess 25, and can be formed simultaneously with the first recess 25 in the same process step, or after the first recess 25 is formed, and this is not a limitation. The optical sensing device 2 of the present invention can be manufactured through the above-described manufacturing process. The above description merely illustrates the method for forming the optical sensing device 2 of the present invention and does not limit the optical sensing device 2 of the present invention to being formed only by the above-described process steps. For example, in different embodiments, the first recessed portion 25 or the second recessed portion 26 can also be formed by a mold with a height difference, without the need for laser etching or cutting to form the first recessed portion 25 or the second recessed portion 26.

[0057] In addition, in the manufacturing method of the optical sensing device of different embodiments, step S704 may be further included. In step S704, a second recessed portion 26 is formed above the detector 23. Figure 2A and Figure 2B As shown, the first recessed portion 25 and the second recessed portion 26 can be formed, for example, by etching the packaging component 24, or the first recessed portion 25 and the second recessed portion 26 can be formed by cutting, and the first recessed portion 25 and the second recessed portion 26 can be formed simultaneously in a single process step, or the first recessed portion 25 and the second recessed portion 26 can be formed in two different process steps, which is not limited here.

[0058] Alternatively, in another embodiment of the present invention, step S705 may be included to form a third recessed portion 27 on the first recessed portion 25. The second and third recessed portions 26, 27 may be formed in the same manner as the first recessed portion 25. The second and third recessed portions 26, 27 may be formed simultaneously with the first recessed portion 25 in the same process step, or they may be formed after the first recessed portion 25 is formed. The above manufacturing process can be used to manufacture the optical sensing device 2 of the present invention. The above is merely an illustration of the method for forming the optical sensing device 2 of the present invention and does not limit the optical sensing device 2 of the present invention to being formed using only the above process steps.

[0059] The beneficial effect of the present invention is that the optical sensing device provided by the present invention can reduce the direct transmission of the light beam generated by the emitter to the detector by providing the first recessed portion, the second recessed portion and the third recessed portion, thereby improving the sensing accuracy of the optical sensing device and reducing the impact of optical crosstalk.

[0060] The contents disclosed above are only preferred feasible embodiments of the present invention and do not limit the scope of protection of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the description and drawings of the present invention are included in the scope of protection of the claims of the present invention.

Claims

1. An optical sensing device, characterized in that: The optical sensing device comprises: a circuit substrate, the surface of which includes a plurality of circuit areas independent of each other; An emitter and a detector are respectively disposed on the plurality of circuit areas; and A packaging component covers the plurality of circuit areas and the emitters and detectors thereon, and the packaging component includes: a first recessed portion, disposed between the emitter and the detector; a second recessed portion, disposed corresponding to the detector; and The depth of the second recessed portion is lower than that of the first recessed portion, and the first recessed portion and the second recessed portion change the scattering path of the light beam generated by the emitter in the packaging component; The depth of the first recessed portion is deep enough to be adjacent to the circuit substrate, but the circuit substrate is not exposed in the first recessed portion; The detector is configured to receive light through the second recess.

2. The optical sensing device according to claim 1, wherein: The thickness of the packaging component located in the second recessed portion is not less than 0.05 mm.

3. The optical sensing device according to claim 1, wherein: The optical sensing device further includes a third recessed portion disposed above the first recessed portion, and a width of the third recessed portion is greater than a width of the first recessed portion.

4. The optical sensing device according to claim 3, wherein: The depth of the third recessed portion is equal to the depth of the second recessed portion.

5. The optical sensing device according to any one of claims 1 to 4, wherein: The detector includes a first detection unit and a second detection unit, and an opening of the second recessed portion extends from a position between the first recessed portion and the first detection unit to a position adjacent to the second detection unit.

6. The optical sensing device according to claim 5, wherein: The opening of the second recessed portion does not extend above the second detection unit.

7. The optical sensing device according to claim 5, wherein: An opening of the second recessed portion spans the first detection unit and the second detection unit and extends to an edge of the packaging component.

8. The optical sensing device according to claim 5, wherein: The first detection unit is an ambient light sensor, and the second detection unit is a proximity sensor.

9. The optical sensing device according to claim 5, wherein: The width of the second recessed portion is at least greater than the widths of the first detection unit and the second detection unit.

10. An optical sensing device, characterized in that: The optical sensing device comprises: a circuit substrate, the surface of which includes a plurality of circuit areas independent of each other; An emitter and a detector are respectively disposed on the plurality of circuit areas; and A light-blocking packaging component covers the plurality of circuit regions of the circuit substrate and the emitter and the detector thereon, and the light-blocking packaging component includes a recessed portion disposed above the detector and having a depth; The recessed portion changes the scattering path of the light beam generated by the emitter in the light-blocking packaging component; Wherein, the light-blocking packaging component is a light-proof infrared light-blocking adhesive material.

11. The optical sensing device according to claim 10, wherein: The detector includes a first detection unit and a second detection unit, the first detection unit is adjacent to the emitter, and the recess spans the first detection unit and the second detection unit, and or extends to an edge of the light-blocking packaging component.

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