Optimized air cooling unit

Abstract

A cooling unit for a data center includes: a fan section, an airflow diversion section group and a cooling section group. The fan section is arranged at the front end of the unit. The airflow diversion section group includes one or more main airflow diversion channels and a rear airflow diversion channel. The airflow diversion section is configured to guide airflow from the fan section to the cooling section group. The cooling section group includes a main cooling section arranged on one side of the unit and a rear cooling section arranged at the rear end of the unit. Cooling modules can be arranged in series within each cooling section and among multiple cooling sections to manage the distribution of cooling fluid corresponding to the hot air inlet, thereby achieving more uniform temperature and better thermal management.

Description

Technical Field

[0001] Embodiments of the present invention generally relate to electronics cooling, data center thermal management, and cooling systems. More specifically, embodiments of the present invention relate to cooling units for component-intensive enclosures. Background Art

[0002] Cooling is a prominent factor in the design of computer systems and data centers. The number of high-performance electronic components (e.g., high-performance processors) packaged within servers has steadily increased, thereby increasing the amount of heat generated and dissipated during the daily operation of the servers. If the temperature in the environment in which the data center operates is allowed to increase over time, the reliability of the servers used within the data center decreases. Maintaining a proper thermal environment is critical to the proper operation of these servers in the data center as well as server performance, reliability, and life. This requires more effective and efficient cooling solutions, especially in the case of cooling these high-performance servers.

[0003] There are several problems in current cooling systems for data centers. The systems are hardware component intensive. Therefore, airflow resistance is relatively high and airflow distribution is highly non-uniform. Cooling air is supplied from an inlet at the front of the electronics rack and exhausted from the rack from an outlet at the rear of the electronics rack. Therefore, the temperature gradient from the front to the rear of the rack is high and non-uniform. Hardware components operate in different thermal environments. Hot spots may also form in certain locations in the data center. Summary of the invention

[0004] According to one aspect of the present disclosure, a cooling unit is provided, which includes: a fan part, arranged at a front end of the cooling unit; an airflow diversion part, including one or more main airflow diversion channels and a rear airflow diversion channel, the airflow diversion part is connected to the fan part and a cooling part group, and the airflow diversion part is configured to guide the airflow from the fan part to the cooling part group; and the cooling part group includes a main cooling part arranged on one side of the cooling unit and a rear cooling part arranged at the rear end of the cooling unit, wherein the one or more main airflow diversion channels are connected to the main cooling part, and wherein the rear airflow diversion channel is connected to the rear cooling part.

[0005] According to another aspect of the present disclosure, a cooling method is provided, the method comprising: starting a fan part arranged at a front end of a cooling unit; guiding an airflow from the fan part to a cooling part group through an airflow diversion part, the airflow diversion part comprising one or more main airflow diversion channels and a rear airflow diversion channel, the airflow diversion part being connected to the fan part and the cooling part group; and cooling the airflow by using the cooling part group comprising a main cooling part arranged on one side of the cooling unit and a rear cooling part arranged at the rear end of the cooling unit, wherein the one or more main airflow diversion channels are connected to the main cooling part, and wherein the rear airflow diversion channel is connected to the rear cooling part. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Embodiments of the invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings in which like references indicate similar elements.

[0007] Figure 1 is a block diagram illustrating an example of a data center facility.

[0008] Figure 2 is a block diagram illustrating an example of an electronic rack.

[0009] Figure 3 is a block diagram illustrating an example of a cold plate configuration.

[0010] Figure 4 is a diagram illustrating an example of a cooling unit according to some embodiments.

[0011] Figure 5A and Figure 5B is a diagram illustrating an example of a fan portion of a cooling unit according to some embodiments.

[0012] Figure 6 is a diagram illustrating an example of an air flow splitting portion of a cooling unit according to some embodiments.

[0013] FIG. 7A to FIG. 7B is a diagram illustrating an example of a cooling module in a cooling part of a cooling unit according to some embodiments.

[0014] FIG. 8A to FIG. 8B is a diagram illustrating an example of a cooling module in a main cooling section of a cooling unit according to some embodiments.

[0015] Figure 8C is a top view illustrating an example of a main cooling portion including a plurality of cooling modules in a cooling unit according to some embodiments.

[0016] Fig.9A is a diagram showing an example of a cooling circuit in a cooling unit according to some embodiments.

[0017] Fig. 9B is a diagram illustrating an example of a plurality of cooling modules in a plurality of cooling sections of a cooling unit according to some embodiments.

[0018] Fig.10 is a flow chart illustrating an example of a method of designing or manufacturing a cooling unit according to some embodiments.

[0019] Fig.11 is a block diagram illustrating an example of a POD-level schematic including a cooling unit according to some embodiments.

[0020] Fig.12 is a block diagram illustrating another example of a POD-level schematic including a cooling unit according to some embodiments.

[0021] Fig.13 is a flow chart illustrating an example of a cooling method according to some embodiments. DETAILED DESCRIPTION

[0022] Various embodiments and aspects of the present invention will be described with reference to the details discussed below, and the accompanying drawings will illustrate various embodiments. The following description and accompanying drawings are explanations of the present invention and do not constitute limitations of the present invention. Many specific details are described to provide a thorough understanding of various embodiments of the present invention. However, in some cases, in order to provide a concise discussion of embodiments of the present invention, known or conventional details are not described.

[0023] Reference to "one embodiment" or "an embodiment" in the specification means that a particular feature, structure or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present invention. The phrase "in one embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment.

[0024] According to some embodiments, a cooling unit (or airflow distributor unit) for thermal management and airflow management of a data center (or electronic rack) is disclosed. The cooling unit may include a fan portion, one or more airflow diversion portions, one or more main cooling portions, and a rear cooling portion. The one or more airflow diversion portions may include one or more airflow diversion channels. The one or more airflow diversion channels may be configured to guide the airflow to one or more main cooling portions and the rear cooling portion. The one or more main cooling portions and the rear cooling portion include multiple rows of coils. The outlet of one or more main cooling portions may be connected to the inlet of the rear cooling portion. The one or more main cooling portions may be connected in series. The cooling unit may be arranged near the electronic rack, or the cooling unit may be part of the electronic rack. The cooling module may be arranged in series within each cooling portion and among multiple cooling portions to manage the distribution of cooling fluid corresponding to the hot air inlet, thereby achieving more uniform temperature and better thermal management.

[0025] According to some embodiments, a cooling unit for a data center includes a fan section, an airflow diversion section group and a cooling section group. The fan section is arranged at the front end of the unit. The airflow diversion section group includes one or more main airflow diversion channels and a rear airflow diversion channel. The airflow diversion section is connected to the fan section and the cooling section group. The airflow diversion section is configured to guide the airflow from the fan section to the cooling section group. The cooling section group includes a main cooling section arranged on one side of the unit and a rear cooling section arranged at the rear end of the unit. One or more main airflow diversion channels are connected to the main cooling section, and the rear airflow diversion channel is connected to the rear cooling section.

[0026] In one embodiment, the inlet of one or more main airflow split channels is arranged at a surface parallel to the front end, wherein the outlet of one or more main airflow split channels is arranged at a surface perpendicular to the front end.

[0027] In one embodiment, each of the one or more primary airflow splitter channels is configured to guide airflow into the primary cooling portion in a direction perpendicular to a direction from the front end to the rear end.

[0028] In one embodiment, each of the one or more main airflow split channels has at least one L-shaped side having a curved corner in cross section.

[0029] In one embodiment, each of the cooling section groups includes at least one cooling module. In one embodiment, at least one cooling module includes multiple rows of coils, and wherein the multiple rows of coils are connected in series. In one embodiment, at least one cooling module further includes a fluid inlet and a fluid outlet, wherein the fluid inlet is connected to a first row of coils in the multiple rows of coils, and wherein the first row of coils is arranged closest to an air inlet of the corresponding cooling section, so that the first row of coils arranged closest to the air inlet first receives cooling liquid. In one embodiment, the multiple rows of coils include a first row of coils and a second row of coils, wherein the first row of coils is arranged closer to the air inlet of the corresponding cooling section than the second row of coils, and wherein the first row of coils receives cooling liquid earlier than the second row of coils. In one embodiment, the outlet of the first row of coils is connected to the inlet of the second row of coils, and wherein the first row of coils is configured to direct cooling liquid to the second row of coils, the outlet of the first row of coils is connected to the inlet of the second row of coils, wherein the first row of coils is configured to direct cooling liquid to the second row of coils, wherein the inlet of the second row of coils is disposed on the same side as the inlet of the first row of coils, and wherein, for each row of the plurality of rows of coils, the inlet is disposed on a side closest to the hot aisle. In one embodiment, each row of the plurality of rows of coils includes a plurality of tubes, and wherein the cooling fluid is distributed in parallel among the plurality of tubes.

[0030] In one embodiment, the main cooling section comprises a main cooling module, wherein the after-cooling section comprises a after-cooling module, and wherein the fluid outlet of the main cooling module is connected to the fluid inlet of the after-cooling module.

[0031] In one embodiment, the main cooling section comprises a plurality of main cooling modules, wherein the post-cooling section comprises post-cooling modules, and wherein all cooling main modules and post-cooling modules are connected in series.

[0032] In one embodiment, the fluid outlet of one of the plurality of main cooling modules is connected to the fluid inlet of another of the plurality of main cooling modules or the fluid inlet of the rear cooling module. In one embodiment, the plurality of cooling modules are assembled in the plurality of cooling sections while maintaining the same connection design.

[0033] In one embodiment, each of the plurality of primary cooling modules corresponds to one of the one or more primary airflow splitting channels, and each of the one or more primary airflow splitting channels is configured to guide airflow to the corresponding primary cooling module.

[0034] In one embodiment, the unit further comprises a cooling circuit, wherein the cooling circuit is connected to one or more main cooling modules (for Figure 8CThe cooling section may be a separate cooling section, each encapsulating a cooling module, but the functions are the same), a rear cooling module in the rear cooling section, and a heat exchanger or a cooling fluid distribution unit. For example, the heat exchanger may be encapsulated in the cooling fluid distribution unit.

[0035] According to some embodiments, a cooling method is disclosed. The method includes starting a fan section arranged at the front end of a cooling unit. The method includes guiding the airflow from the fan section to the cooling section group through an airflow diversion section, wherein the airflow diversion section includes one or more main airflow diversion channels and a rear airflow diversion channel, and wherein the airflow diversion section is connected to the fan section and the cooling section group. The method also includes cooling the airflow by using a cooling section group including a main cooling section arranged on one side of the cooling unit and a rear cooling section arranged at the rear end of the cooling unit, wherein one or more main airflow diversion channels are connected to the main cooling section, and wherein the rear airflow diversion channel is connected to the rear cooling section. In one embodiment, each of the cooling section groups includes at least one cooling module, and wherein cooling the airflow by using the cooling section group includes cooling the airflow by using at least one cooling module in each of the cooling section groups. The method also includes a cooling coil and a fluid flow connection design within a cooling module part and between multiple cooling modules in a plurality of cooling modules.

[0036] Figure 1 is a block diagram illustrating an example of a data center or data center unit according to one embodiment. In this example, Figure 1 A top view of at least a portion of a data center is shown. Figure 1 According to one embodiment, a data center system 100 includes one or more rows of electronic racks, equipment or instruments 101-102 of information technology (IT) components, such as computer servers or computing nodes that provide data services to various clients via a network (e.g., the Internet). In this embodiment, each row includes an array of electronic racks such as electronic racks 110A-110N. However, more or fewer rows of electronic racks can be implemented. Typically, rows 101-102 are aligned in parallel, and their front ends face each other and their rear ends face away from each other, forming an aisle 103 between them to allow management personnel to walk therein. However, other configurations or arrangements may also be applied. For example, two rows of electronic racks may face each other back to back without forming an aisle between them, while their front ends face away from each other. The rear end of the electronic rack may be connected to a room cooling liquid manifold.

[0037] In one embodiment, each of the electronic racks (e.g., electronic racks 110A-110N) includes a housing to accommodate a plurality of IT components arranged therein in a stacked operation. The electronic rack may include a cooling liquid manifold, a plurality of server slots (e.g., standard racks or chassis configured with the same or similar form factor), and a plurality of server chassis (also referred to as server blades or server racks) that can be inserted into and removed from the server slots. Each server chassis represents a computing node having one or more processors, memory, and / or permanent storage devices (e.g., hard disks), wherein the computing node may include one or more servers operating therein. At least one processor is attached to a liquid cold plate (also referred to as a cold plate assembly) to receive cooling liquid. In addition, one or more optional cooling fans are associated with the server chassis to provide air cooling to the computing nodes contained therein. It should be noted that the cooling system 120 can be coupled to a plurality of data center systems, such as the data center system 100.

[0038] In one embodiment, the cooling system 120 includes an external liquid loop connected to a cooling tower or dry cooler outside the building / housing container. The cooling system 120 may include, but is not limited to, evaporative cooling, free air, large thermal mass simulation, and waste heat recovery designs. The cooling system 120 may include or be coupled to a cooling liquid source that provides the cooling liquid.

[0039] In one embodiment, each server chassis is modularly coupled to a cooling liquid manifold so that the server chassis can be removed from the electronics rack without affecting the operation of the remaining server chassis and cooling liquid manifold in the electronics rack. In another embodiment, each server chassis is coupled to the cooling liquid manifold by a quick release coupling assembly having a server liquid inlet connector and a server liquid outlet connector coupled to a flexible hose to distribute cooling liquid to the processor. The server liquid inlet connector receives cooling liquid from a cooling liquid manifold mounted at the rear end of the electronics rack through a rack liquid inlet connector. The server liquid outlet connector discharges warmer or hotter liquid carrying heat exchanged from the processor to the cooling liquid manifold through a rack liquid outlet connector and then returns to a coolant distribution unit (CDU) within the electronics rack.

[0040] In one embodiment, a cooling liquid manifold disposed on the rear end of each electronic rack is coupled to a liquid supply line 132 (also referred to as a room supply manifold) to receive cooling liquid from the cooling system 120. The cooling liquid is distributed through a liquid distribution loop attached to a cold plate assembly on which the processors are mounted to remove heat from the processors. The cold plate is configured similar to a heat sink with liquid distribution tubes attached or embedded therein. The resulting warmer or hotter liquid carrying heat exchanged from the processors is delivered back to the cooling system 120 via a liquid return line 131 (also referred to as a room return manifold).

[0041] Liquid supply / return lines 131-132 are referred to as data center or room liquid supply / return lines (e.g., global liquid supply / return lines) that supply cooling liquid to all electronic rack rows 101-102. Liquid supply lines 132 and liquid return lines 131 are coupled to a heat exchanger of a CDU located within each electronic rack, forming a primary loop. A secondary loop of the heat exchanger is coupled to each server chassis in the electronic rack to deliver cooling liquid to the cold plate of the processor.

[0042] In one embodiment, the data center system 100 further includes an optional air supply system 135 for generating airflow to allow airflow to flow through the air space of the server chassis of the electronic rack, thereby exchanging heat generated by the computing nodes (e.g., servers) due to the operation of the computing nodes, and discharging the heat exchanged by the airflow to the external environment or a cooling system (e.g., an air-liquid heat exchanger) to reduce the temperature of the airflow. For example, the air supply system 135 generates an airflow of cooling / cold air to circulate from the aisle 103 through the electronic racks 110A-110N, thereby taking away the exchanged heat.

[0043] like Figure 1 As shown in , cold air flows into the electronic rack through the front end of the electronic rack, while warm / hot air flows out of the electronic rack from the rear end of the electronic rack. The heat exchanged warm / hot air is exhausted from the room / building or cooled using a separate cooling system (such as an air-liquid heat exchanger). Therefore, the cooling system is a hybrid liquid-air cooling system, in which a portion of the heat generated by the processor is removed by the cooling liquid via the corresponding cold plate, and the remaining portion of the heat generated by the processor (or other electronic device or processing device) is removed by air flow cooling.

[0044] Figure 2 2 is a block diagram showing an electronic rack according to one embodiment. The electronic rack 200 may be represented as follows: Figure 1 Any of the electronic racks shown in , for example, electronic racks 110A-110N. Figure 2According to one embodiment, the electronic rack 200 includes, but is not limited to, a CDU 201, a rack management unit (RMU) 202, and one or more server chassis 203A-203E (collectively referred to as server chassis 203). The server chassis 203 can be inserted into an array of server slots (e.g., standard racks) from the front end 204 or the back end 205 of the electronic rack 200, respectively. It should be noted that although five server chassis 203A-203E are shown here, more or fewer server chassis can be maintained within the electronic rack 200. It should also be noted that the specific locations of the CDU 201, RMU 202, and / or server chassis 203 are shown for illustrative purposes only; other arrangements or configurations of the CDU 201, RMU 202, and / or server chassis 203 can also be implemented. In one embodiment, the electronic rack 200 can be open to the environment or partially contained by a rack container, as long as the cooling fans can generate airflow from the front to the back.

[0045] In addition, for at least some of the server chassis 203, fan modules (not shown) are associated with the server chassis. Each fan module includes one or more cooling fans. The fan modules can be mounted on the rear end of the server chassis 203 or on the electronics rack to generate airflow that flows out of the front end 204, travels through the air space of the server chassis 203, and is exhausted from the rear end 205 of the electronics rack 200.

[0046] In one embodiment, the CDU 201 mainly includes a heat exchanger 211, a liquid pump 212 and a pump controller (not shown) and some other components such as a liquid reservoir, a power supply, a monitoring sensor, etc. The heat exchanger 211 can be a liquid-liquid heat exchanger. The heat exchanger 211 includes a first loop having an inlet port and an outlet port, and the inlet port and the outlet port have a first pair of liquid connectors connected to the external liquid supply / return pipelines 131-132 to form a main loop. The connector connected to the external liquid supply / return pipelines 131-132 can be set or installed on the rear end 205 of the electronic rack 200. The liquid supply / return pipelines 131-132 (also called room liquid supply / return pipelines) can be connected to the cooling system 120 as described above.

[0047] In addition, the heat exchanger 211 also includes a second loop with two ports having a second pair of liquid connectors coupled to a liquid manifold 225 (also referred to as a rack manifold) to form a secondary loop, which may include a supply manifold (also referred to as a rack liquid supply line or a rack supply manifold) and a return manifold (also referred to as a rack liquid return line or a rack return manifold), the supply manifold supplies cooled liquid to the server chassis 203, and the return manifold returns warmer liquid to the CDU 201. It should be noted that the CDU 201 may be any kind of commercially available or custom CDU. Therefore, the details of the CDU 201 will not be described here.

[0048] Each server chassis 203 may include one or more IT components (e.g., a central processing unit or CPU, a graphics processing unit (GPU), an application specific integrated circuit (ASIC) memory and / or storage). Each IT component may perform data processing tasks, wherein the IT component may include software installed in the storage, loaded into the memory and executed by one or more processors to perform the data processing tasks. The server chassis 203 may include a host server (referred to as a host node) connected to one or more computing servers (also referred to as computing nodes, such as CPU servers and GPU servers). The host server (having one or more CPUs) typically interfaces with a client over a network (e.g., the Internet) to receive requests for specific services, such as storage services (e.g., cloud-based storage services, such as backup and / or recovery), running applications to perform certain operations (e.g., image processing, deep data learning algorithms or modeling, etc., as part of a software as a service or SaaS platform). In response to the request, the host server assigns the task to one or more computing nodes or computing servers (having one or more GPUs or ASICs) managed by the host server. The computing servers perform the actual tasks, which may generate heat during operation.

[0049] The electronics rack 200 also includes an optional RMU 202 configured to provide and manage power supplied to the server chassis 203 and the CDU 201. The RMU 202 can be coupled to a power supply unit (not shown) to manage the power consumption of the power supply unit. The power supply unit can include necessary circuitry (e.g., an alternating current (AC) to direct current (DC) or DC to DC power converter, a battery, a transformer or a voltage regulator, etc.) to provide power to the remaining components of the electronics rack 200.

[0050] In one embodiment, the RMU 202 includes an optimization module 221 and a rack management controller (RMC) 222. The RMC 222 may include a monitor to monitor the operating status of various components within the electronic rack 200, such as, for example, a server chassis 203, a CDU 201, and a fan module. Specifically, the monitor receives operating data from various sensors representing the operating environment of the electronic rack 200. For example, the monitor may receive operating data representing the temperature of a processor, cooling liquid, and airflow, which may be captured and collected by various temperature sensors. The monitor may also receive data representing the fan power and pump power generated by the fan module 231 and the liquid pump 212, which may be proportional to their respective speeds. These operating data are referred to as real-time operating data. It should be noted that the monitor may be implemented as a separate module within the RMU 202.

[0051] Based on the operational data, the optimization module 221 performs optimization using a predetermined optimization function or optimization model to derive a set of optimal fan speeds for the fan module 231 and an optimal pump speed for the liquid pump 212, so that the total power consumption of the liquid pump 212 and the fan module 231 is minimized, and the operational data associated with the cooling fan of the liquid pump 212 and the fan module 231 are within their respective design specifications. Once the optimal pump speed and the optimal fan speed are determined, the RMC 222 configures the liquid pump 212 and the cooling fan of the fan module 231 based on the optimal pump speed and the fan speed.

[0052] As an example, based on the optimal pump speed, the RMC 222 communicates with the pump controller of the CDU 201 to control the speed of the liquid pump 212, which in turn controls the liquid flow rate of the cooling liquid supplied to the liquid manifold 225 to be distributed to at least some of the server chassis 203. Similarly, based on the optimal fan speed, the RMC 222 communicates with each fan module to control the speed of each cooling fan of the fan module 231, which in turn controls the airflow rate of the fan module. It should be noted that each fan module can be individually controlled with its specific optimal fan speed, and different fan modules and / or different cooling fans within the same fan module can have different optimal fan speeds.

[0053] It should be noted that Figure 2The rack configuration shown in is shown and described for illustrative purposes only; other configurations or arrangements may also be applied. For example, the CDU 201 may be an optional unit. The cold plate of the server chassis 203 can be connected to the rack manifold, which can be directly connected to the liquid supply / return lines 131-132 without using a CDU. Although not shown, a power supply unit can be disposed within the electronic rack 200. The power supply unit can be implemented as a standard chassis that is the same as or similar to the server chassis, wherein the power chassis can be inserted into any standard rack to replace any server chassis 203. In addition, the power chassis can also include a backup battery unit (BBU) for providing battery power to the server chassis 203 when the main power source is not available. The BBU may include one or more battery packs, and each battery pack includes one or more battery cells, and the necessary charging and discharging circuits for charging and discharging the battery cells.

[0054] Figure 3 is a block diagram illustrating a processor cold plate configuration according to one embodiment. The processor / cold plate assembly 300 may be represented as Figure 2 Any processor / cold plate configuration of the server chassis 203 shown in FIG. Figure 3 , the processor 301 is inserted into a processor socket mounted on a printed circuit board (PCB) or motherboard 302 that is coupled to other electronic components or circuits of the data processing system or server. The processor 301 also includes a cold plate 303 attached thereto, which is coupled to a rack manifold, which is coupled to the liquid supply line 132 and / or the liquid return line 131. A portion of the heat generated by the processor 301 is removed by the cooling liquid through the cold plate 303. The remainder of the heat enters the air space below or above, which can be removed by the airflow generated by the cooling fan 304.

[0055] There are multiple challenges in cooling systems for data centers, where clusters or delivery points (PODs) are deployed with information technology (IT) rack equipment with storage devices in the rack equipment. IT equipment is also named JBOD (Just a Group of Disks, or Just a Group of Drives). First, thermal management or cooling design of IT equipment and / or PODs is a challenge. The system is hardware component intensive. Therefore, the airflow resistance is relatively high and the airflow distribution is highly non-uniform. The temperature gradient is high, and the cooling airflow may be uneven across the components, so the hardware components may operate in different thermal environments. In addition, hot spots may be formed at some locations where IT components reside. The second challenge is the electronic device packaging requirements. In order to reduce storage costs and improve system performance, packaging density is becoming increasingly dense. For example, there may be more than 100 drives packaged in a 4U space, and even more. Therefore, the space for implementing advanced thermal management within the rack may be limited. It may be advantageous to have a separate design with a thermal management system and IT components. Another challenge is the cost of the cooling system.

[0056] The cooling system may use air cooling or a hybrid cooling method. Currently, cooling air is supplied from an inlet at the front end of the electronic rack and / or server, and is exhausted from an outlet at the rear end of the electronic rack and / or server to the server and rack. Therefore, the temperature gradient from the front end to the rear end is high and uneven, and hot spots may be generated. It may be necessary to develop an effective cooling unit and an effective cooling method to optimize the airflow distribution to improve cooling efficiency.

[0057] A cooling unit (or airflow distributor unit) and a cooling method for data center (or electronic rack) thermal management and airflow management are disclosed herein. The cooling unit / method disclosed herein provides a solution to the temperature gradient problem in highly component-intensive clusters or POD thermal management. The cooling unit / method can be deployed in different data center cooling infrastructures.

[0058] Figure 4402a, 402b, 402c) and a rear air flow diversion channel (e.g., 402d). The fan section 401 may be arranged at the front end 410 of the cooling unit 400. The air flow diversion section 402 may be connected to the fan section 401 and the cooling section group (e.g., 403, 404). The cooling section group (e.g., 403, 404) may include one or more main cooling sections (e.g., 403) and a rear cooling section (e.g., 404). The air flow diversion section 402 may include one or more main air flow diversion channels (e.g., 402a, 402b, 402c) and a rear air flow diversion channel (e.g., 402d). The fan section 401 may be arranged at the front end 410 of the cooling unit 400. The air flow diversion section 402 may be connected to the fan section 401 and the cooling section group (e.g., 403, 404). One or more main cooling sections (eg, 403) are disposed at the sides 413 of the unit 400, and a rear cooling section (eg, 404) is disposed at the rear end 412 of the unit.

[0059] In the air flow splitting portion 402, there may be one or more main air flow splitting channels (e.g., 402a, 402b, 402c) and one rear air flow splitting channel (e.g., 402d). Figure 4 As shown in, cooling unit 400 may include three main airflow shunt parts (e.g., 402a, 402b, 402c). The cooling unit may include different numbers of main airflow shunt channels. Airflow shunt part 402 may be configured to guide airflow from fan part 401 to cooling part group (e.g., 403, 404). In one embodiment, one or more main airflow shunt channels (e.g., 402a, 402b, 402c) may be coupled to one or more main cooling parts (e.g., 403), and rear airflow shunt channel 402d may be connected to rear cooling part 404. One or more main airflow shunt channels may guide airflow to main cooling part 403, and rear airflow shunt channel (e.g., 402d) may guide airflow to rear cooling part 404. Each of one or more main airflow shunt channels (e.g., 402a, 402b, 402c) can be configured to guide airflow to one or more main cooling sections (e.g., 403) in a direction 414 perpendicular to a direction 415 from the front end 410 of the unit to the rear end 412. The airflow shunt section can distribute and separate airflow and prevent short-path recirculation or eddy currents of the airflow. The airflow shunt channel can convey airflow to cover all coils in the cooling section group and supply airflow more evenly. Therefore, the temperature gradient problem and the uneven heat distribution in a highly component-intensive cluster or POD can be solved. In this way, the cooling efficiency of the data center can be improved, and hot spots in the data center can be avoided. More importantly, the hardware device can operate in a substantially uniform thermal environment, regardless of their location.

[0060] Figure 5A is a diagram 500a showing an example of a front view of a fan portion 501a of a cooling unit according to some embodiments. Figure 5B FIG. 500b is another example of a front view of a fan portion 501b of a cooling unit according to some embodiments. Figure 5A and 5B The fan portion (eg, 501a, 501b) may include one or more fans (eg, 505, 506), one or more fan frames (eg, 507), or one or more inlets (not shown) of the airflow splitting channel. Different designs may provide different forms of redundancy for the fans.

[0061] like Figure 5A As shown in , the size of one or more fans (e.g., 505) can be designed to match the airflow diversion channel (e.g., two channels). For example, there can be two fans in a row, and the size of the two fans can match the width of the unit. In actual design, the detailed selection and design process can consider the width of the unit, the number of channels, and / or the size of the fan and fan frame to achieve an optimized design. In one embodiment, a dedicated fan can be selected for each airflow diversion channel. In one embodiment, a fan can be selected for two or more airflow diversion channels. When a fan is selected for one or more channels, the size of the fan can be based on the size of one or more channels.

[0062] like Figure 5B As shown in , one or more fans (e.g., 506) can be selected based on the entire unit. In one embodiment, centralized fans can be selected for the entire unit or a portion of the unit. Since larger fans (e.g., 506) can be selected for centralized cooling supply, the size of the fans can be more flexible, however, a fan frame may be required to direct the air flow. In one embodiment, the fan module 506 and frame 507 are separate units and are hot-swappable, which makes it easy to repair and replace the fans when needed.

[0063] Figure 6602 is a diagram showing an example of a top view of a cross-section 611 of an airflow splitting portion 602 of a cooling unit 600 for a data center according to some embodiments. The airflow splitting portion 602 may include one or more main airflow splitting channels (e.g., 602a, 602b, 602c) and a rear airflow splitting channel (e.g., 602d). The airflow splitting portion 602 may be configured to guide airflow from the fan portion 601 to a cooling portion group (e.g., 603, 604). In one embodiment, one or more main airflow splitting channels (e.g., 602a, 602b, 602c) may be connected to one or more main cooling portions (e.g., 603), and the rear airflow splitting channel 602d may be connected to the rear cooling portion 604. One or more main airflow splitting channels (e.g., 602a, 602b, 602c) may guide airflow to the main cooling portion 603, and the rear airflow splitting channel (e.g., 602d) may guide airflow to the rear cooling portion 604.

[0064] like Figure 6 As shown in , each of the one or more main airflow split channels (e.g., 602a, 602b, 602c) may be configured to guide the airflow from the fan portion 601 at the front end 610 of the cooling unit 600 to the one or more main cooling portions (e.g., 603) at the side 613 of the cooling unit 600. Each of the one or more main airflow split channels (e.g., 602a, 602b, 602c) may have at least one L-shaped side in a cross section 611. The inlet (e.g., 608a, 608b, 608c) of the one or more main airflow split channels (e.g., 602a, 602b, 602c) may be disposed at a surface 620 parallel to the front end 610. The outlet (e.g., 609a, 609b, 609c) of the one or more main airflow split channels (e.g., 602a, 602b, 602c) may be disposed at a surface 622 perpendicular to the front end 610. Thus, each of the one or more main airflow split channels (e.g., 602a, 602b, 602c) may be configured to direct airflow to one or more main cooling sections (e.g., 603) in a direction 614 perpendicular to a direction 615 from the front end 610 to the rear end 612. Thus, the temperature gradient from the front end 610 to the rear end 612 may be low. In addition, the cooling air may be divided and distributed to cover all heat generating components within the servers and racks. In this way, the cooling efficiency of the data center may be improved, hot spots within the data center may be avoided, and air injection path recirculation may be prevented.

[0065] In one embodiment, each of the one or more main airflow split channels (e.g., 602a, 602b, 602c) may have a side with an L-shaped side and a curved corner (e.g., 630a, 630b, 630c) at the cross section 611. The curved corner (e.g., 630a, 630b, 630c) enables smooth airflow streamlines and prevents airflow vortexes.

[0066] FIG. 7A to FIG. 7B are diagrams 700a, 700b showing examples of a cooling module 701 in a cooling portion 703 of a cooling unit according to some embodiments. Fig. 7A A three-dimensional view of cooling module 701 is shown. Figure 7B A side view of the first row 711 of cooling modules 701 is shown. FIG. 7A to FIG. 7B , the cooling unit may include a cooling section group, such as a main cooling section 703 and a rear cooling section (not shown). Each of the cooling section groups (e.g., 703) may include at least one cooling module (e.g., 701). In one embodiment, the main cooling section 703 may include one or more main cooling modules. The rear cooling section may include one rear cooling module.

[0067] At least one cooling module (e.g., 701) may include multiple rows of coils 715. Fig. 7A As shown in FIG. 7 , there are three rows of coils (e.g., 711, 712, 713) in module 701. The number of rows of coils can be 1, 2, 3, 4, 5, 10, or any other number. Multiple rows of coils can be connected in series. Therefore, cooling fluid or coolant can be supplied to multiple rows of coils (e.g., 711, 712, 713) in series. The supply side should be the side that the hot air flow approaches first. Each row in the multiple rows of coils can include multiple parallel tubes. For example, referring to FIG. Figure 7B The first row of coils 711 includes a plurality of parallel tubes 711a-711e. The number of the plurality of tubes may be 1, 2, 3, 4, 5, 10 or any other number.

[0068] The fluid inlet 705 of the module can receive cooling fluid from an external cooling source. The cooling fluid can be distributed in parallel in the plurality of cooling tubes 711a-711e in the first row of coils 711 (e.g., 711 can be first approached by hot air 714), and then flow to the outlet of the first row of coils 711. The first row of coils 711 can guide the cooling fluid to the second row of coils 712 (e.g., hot air 714 can be secondly approached by 712 after 711). After the cooling fluid passes through the plurality of cooling tubes in the second row in parallel, it flows to the third row of coils 713 in the same manner. Finally, the cooling fluid leaves the entire cooling module 701 through the fluid outlet 706 of the module.

[0069] FIG. 8A to FIG. 8B are diagrams 800a, 800b showing examples of cooling modules 815 in a main cooling section 803 of a cooling unit according to some embodiments. Fig. 8A is a three-dimensional view of module 815. Figure 8B 815. In one embodiment, the main cooling section 803 can be located on one side of the cooling unit. The hot air inlet 809a, 809b, 809c of the main cooling section 803 can be set at the side surface 822. The hot air 814 from the fan section 801 can be guided into the main cooling section 803 from the hot air inlet 809a, 809b, 809c. The air can be cooled in the cooling section and then discharged from the side 817 and 819. The main cooling section 803 may include a main cooling module 815. The main cooling module 815 may include multiple rows of coils 811, 812, 813, such as the first row of coils 811, the second row of coils 812, and the third row of coils 813. The first row of coils 811 closest to the hot air inlet 809a, 809b, 809c can first receive the cooling liquid. The fluid inlet 805 of the module can be connected to the first row of coils 811 closest to the hot air inlet. The cooling fluid may first flow to the first row of coils 811. Next, the cooling fluid may flow to the second row of coils 812, which is the second closest row of coils to the hot air inlet. Then, the cooling fluid may flow to the third row of coils 813, which is the third closest row of coils to the hot air inlet. The second row 812 may be connected to the first row 811 and the third row 813. If there are only three rows of coils, the outlet 806 of the third row of coils 813 may be connected to the inlet 835 of the rear cooling module 816 in the rear cooling section 804. When the cooling section (e.g., 803) includes multiple rows of coils (e.g., 811, 812, 813), the first row of coils (e.g., 811) closest to the air inlet (e.g., 809a-809c) may first receive the cooling fluid. Multiple rows of coils may be connected in series. When the first row of coils is disposed closer to the air inlet of the corresponding cooling section than the second row of coils, the first row of coils receives the cooling liquid earlier than the second row of coils.

[0070] Reference FIG. 8A to FIG. 8B , the outlet 807 of the first row of coils 811 can be connected to the inlet 808 of the second row of coils 812. The first row of coils 811 is configured to direct the cooling liquid to the second row of coils 812. The inlet 808 of the second row of coils can be disposed on the same side as the inlet 805 of the first row of coils. For each of the multiple rows of coils, the inlet (e.g., 805, 808, 810) can be disposed on the side closest to the hot aisle 830.

[0071] The aftercooling module 816 may include multiple rows of coils (e.g., 831, 832, 833). The multiple rows of coils may be connected similarly as described above. When the first row of coils is arranged closer to the air inlet (not shown) of the hot air 834 than the second row of coils, the first row of coils may receive cooling liquid earlier than the second row of coils.

[0072] Figure 8C 800c is a diagram showing an example of a main cooling section (e.g., 803c) including a plurality of cooling modules (e.g., 841, 842, 843) in a cooling unit according to some embodiments. The cooling unit may include a main cooling section (e.g., 803c), a rear cooling section (e.g., 804), a fan section (e.g., 801), and an airflow diversion section (e.g., 802). In one embodiment, the main cooling section (e.g., 803c) may include a plurality of main cooling modules (e.g., 841, 842, 843), and the rear cooling section (e.g., 804) may include a rear cooling module (e.g., 816). All main cooling modules (e.g., 841, 842, 843) and rear cooling modules (e.g., 816) may be connected in series. The airflow diversion section 802 may include one or more main airflow diversion channels (e.g., 802a, 802b, 802c) and a rear airflow diversion channel (e.g., 802d). In one embodiment, 841, 842 and 843 can be in separate cooling sections. Fig. 9B ).

[0073] For example, a fluid outlet (e.g., 851) of one of the plurality of main cooling modules (e.g., 841) can be connected to a fluid inlet (e.g., 852) of another of the plurality of main cooling modules (e.g., 842). For another example, a fluid outlet (e.g., 846) of one of the plurality of main cooling modules (e.g., 843) can be connected to a fluid inlet (e.g., 835) of a rear cooling module (e.g., 804).

[0074] like Figure 8C As shown in , each of the plurality of primary cooling modules (e.g., 841, 842, 843) may correspond to one of the one or more primary airflow split channels (e.g., 802a, 802b, 802c), and each of the one or more primary airflow split channels (e.g., 802a, 802b, 802c) may be configured to guide the airflow 814 to the corresponding primary cooling module (e.g., 841, 842, 843). Comparing 841, 842, and 843, 841 first receives the cooling fluid because its position is closest to the hot aisle, followed by 842, and then 843.

[0075] Fig.9A900a is a diagram showing an example of a cooling circuit 910a in a cooling unit 901a according to some embodiments. The cooling unit 901a may include a main cooling section 903a and a rear cooling section 904a. The main cooling section may include one or more cooling modules. The rear cooling section may include a cooling module. In one embodiment, the main cooling section may include a cooling module, and the fluid outlet of the cooling module in the main cooling section may be connected to the fluid inlet of the cooling module of the rear cooling section.

[0076] like Fig.9A As shown in , the main cooling section 903a includes a main cooling module 913a, and the rear cooling section 904a includes a rear cooling module 914a. The fluid outlet 923a of the main cooling module 913a is connected to the fluid inlet 924a of the rear cooling module 904a. The cooling circuit 910a can be used in the unit to complete the fluid system. In one embodiment, the circuit 910a can be connected to a heat exchanger 915a. The heat exchanger 915a may be included in the unit or from an external cooling unit. The circuit 910a can be connected to an external cooling unit in a variety of ways. This can be understood as the cooling coils in the cooling modules 913a and 914a are connected in series in terms of the fluid circuit. Therefore, the fluid temperature in the cooling coils in the cooling modules 913a and 914a increases.

[0077] Fig. 9B 900b is a diagram showing an example of multiple cooling modules (e.g., 951, 952, 953, 914b) of a cooling unit 901b according to some embodiments. The cooling unit 901b may include a main cooling section 903b and a rear cooling section 904b. The main cooling section 903b may include multiple cooling modules 951, 952, 953. The rear cooling section 904b may include a cooling module 914b. All cooling modules 951, 952, 953, and 914b may be connected in series. Direct fluid connection is used between cooling modules 951, 952, 953, and 914b.

[0078] In one embodiment, the main cooling section 903b includes a plurality of cooling modules (e.g., 951, 952, 953), and the fluid outlet of one of the plurality of cooling modules may be connected to the fluid inlet of another of the plurality of cooling modules or the cooling module of the rear cooling section. As shown in FIG. 9, the fluid outlet 941 of the main cooling module 951 is connected to the fluid inlet 942 of the main cooling module 952. The fluid outlet 943 of the main cooling module 953 is connected to the fluid inlet 924b of the rear cooling module 914b. This can be understood as the coils in the modules 951, 952, 953 and 914b are connected in series, so that the fluid temperature in the modules 951, 952, 953 and 914b increases. In another embodiment, 951, 952, 953 may be integrated into one module. In another embodiment, 951, 952, 953 may be separate cooling sections arranged and assembled together.

[0079] In one embodiment, each of the plurality of primary cooling modules corresponds to one of the one or more primary airflow diversion channels. Each of the one or more primary airflow diversion channels is configured to direct airflow to the corresponding primary cooling module. Figure 6 and Fig. 9B Each of the one or more main airflow split channels (eg, 602a, 602b, 602c) may direct the airflow to a corresponding main cooling module (eg, 951, 952, 953).

[0080] Multiple cooling modules (e.g., 951, 952, 953, 914b) can be pre-assembled using hard tubing for assembly using flexible hoses with blind-mate connectors or hand-mate connectors. Fig. 9B As shown, cooling loop 910b may be formed by connecting to an open loop source.

[0081] The cooling loop 910b can be used for the supply of cooling fluid and the return connection between one or more primary cooling modules, post-cooling modules and a heat exchanger or external cooling unit. The external cooling unit can be a liquid-to-liquid heat exchanger or a direct connection to the POD cooling source. The operating cooling fluid can be a single-phase or two-phase liquid.

[0082] Fig.10 1000 is a flow chart showing an example of a method for designing or manufacturing a cooling unit according to some embodiments. The cooling unit may include a fan portion, an air flow splitter portion, and a cooling portion group. The cooling portion group may include one or more main cooling portions and a rear cooling portion. The air flow splitter portion may include one or more main air flow splitter channels and a rear air flow splitter channel.

[0083] At 1001, a fan section may be provided at the front end of the cooling unit. The fan section may include one or more fans. The fan section including one or more fans is used to move air flow. The size of the one or more fans may be designed to match the airflow diversion channel. For example, there may be two fans in a row, wherein the size of the two fans may match the width of the unit. In actual design, the detailed selection and design process may consider the width of the unit, the number of channels, and / or the size of the fan and fan frame to achieve an optimized design. In one embodiment, a dedicated fan may be selected for each airflow diversion channel. In one embodiment, a fan may be selected for two or more airflow diversion channels. When a fan is selected for one or more channels, the size of the fan may be based on the size of the one or more channels. One or more fans may be selected based on the entire unit. In one embodiment, a centralized fan may be selected for the entire unit.

[0084] At 1002, an airflow diversion section including one or more main airflow diversion channels and a rear airflow diversion channel is arranged in a cooling unit. The airflow diversion section can be configured to distribute and separate airflow. The airflow diversion section can be configured to guide the airflow from the fan section to the cooling section group. In one embodiment, one or more main airflow diversion channels can be connected to one or more main cooling sections, and the rear airflow diversion channel can be connected to the rear cooling section. One or more main airflow diversion channels can guide the airflow to the main cooling section, and the rear airflow diversion channel can guide the airflow to the rear cooling section. In one embodiment, each of the one or more main airflow diversion channels can have at least one side with an L-shaped side and a curved corner at the cross section. The curved corner can smooth the airflow streamline and prevent airflow vortex. The airflow diversion section is configured to prevent short-path recirculation of the airflow, convey the airflow to cover all cooling modules in the cooling section, and supply the airflow more evenly to the components in the data center.

[0085] In one embodiment, each of the one or more primary airflow splitter channels can be configured to direct airflow from the fan section to the one or more primary cooling sections in a direction perpendicular to the direction from the front end to the rear end of the cooling unit. Thus, the temperature gradient can be low or substantially uniform. In this way, the cooling efficiency of the data center can be improved, and hot spots within the data center can be avoided.

[0086] At 1003, a cooling section group including a main cooling section and a rear cooling section is provided. The main cooling section is provided at one side of the cooling unit, and the rear cooling section is provided at the rear end of the cooling unit. Each of the cooling section groups may include at least one cooling module. In one embodiment, the main cooling section may include one or more cooling modules. The rear cooling section may include a cooling module. At least one cooling module may include multiple rows of coils. The multiple rows of coils may be connected in series. Therefore, cooling fluid or coolant may be supplied to the multiple rows of coils in series. The supply side may first approach the hot air.

[0087] In one embodiment, at least one cooling module further comprises a fluid inlet and a fluid outlet, wherein the fluid inlet is disposed proximate to the fan section, and wherein the fluid outlet is disposed proximate to the aftercooling section or another cooling module.

[0088] In one embodiment, the main cooling section may include one cooling module, and the fluid outlet of the cooling module in the main cooling section may be connected to the fluid inlet of the cooling module in the rear cooling section.

[0089] In one embodiment, the main cooling section includes a plurality of cooling modules, and a fluid outlet of one of the plurality of cooling modules may be connected to a fluid inlet of another of the plurality of main cooling modules or a rear cooling module of the rear cooling section.

[0090] In one embodiment, each of the plurality of primary cooling modules corresponds to one of the one or more primary airflow splitting channels, and each of the one or more primary airflow splitting channels is configured to guide airflow to a corresponding primary cooling module.

[0091] At 1004, a cooling circuit is arranged in the cooling unit. The cooling circuit can be connected to one or more main cooling modules in the main cooling section, the after-cooling modules in the after-cooling section, and the heat exchanger. The cooling circuit can be used for the supply of cooling fluid and the return connection between one or more main cooling modules, after-cooling modules and the heat exchanger or external cooling unit. The external cooling unit can be a liquid-to-liquid heat exchanger or a direct connection to the POD cooling source. The working cooling fluid can be a single-phase or two-phase liquid.

[0092] Fig.11 is a block diagram 1100 illustrating an example of a POD-level schematic including a cooling unit according to some embodiments. Fig.12 1200 is a block diagram illustrating another example of a POD level schematic including a cooling unit according to some embodiments. Fig.11 and Fig.12 , such as combined Figures 4 to 10 The described cooling units (eg, 1101 , 1201 ) may be deployed in PODs (eg, 1110 , 1210 ) in a data center. Fig.11 An environment that houses a hot aisle (eg, 1105) is shown. Fig.12 An environment that houses a cold aisle (eg, 1205) is shown.

[0093] In one embodiment, the cooling units (e.g., 1101, 1201) can be respectively Fig.11 In an environment that accommodates hot aisles as shown in Fig.12 The environment shown in the cold aisle containment is deployed adjacent to the electronic racks (e.g., 1102, 1202). Any type of containment environment can be used. Airflow (e.g., 1103, 1203) can be supplied to the IT components in the electronic racks (e.g., 1102, 1202) in a direction perpendicular to the direction from the front end to the rear end of the rack. The cooling unit provides thermal management with low temperature gradient and high cooling efficiency for component-intensive data centers.

[0094] In one embodiment, the cooling unit may be integrated with the electronics rack and be part of the electronics rack. The electronics rack may be equipped with one cooling unit on one side or two cooling units on both sides. The containment solution may be implemented and designed in different ways, for example modular containment may be applied to a single rack, several racks and a row of racks. The cooling circuit may be integrated into the cooling unit in different ways and at different locations.

[0095] Fig.13 Flowchart showing an example of a cooling method according to some embodiments (e.g., cooling components in an electronic rack in a data center by using a cooling unit). The cooling unit may include a fan portion, an airflow diversion portion, and a cooling portion group. The cooling portion group may include one or more main cooling portions and a rear cooling portion. The airflow diversion portion may include one or more main airflow diversion channels and a rear airflow diversion channel. By this method, the temperature gradient from the front end to the rear end of the electronic rack may be low or substantially uniform. In this way, the cooling efficiency of the data center may be improved, and hot spots within the data center may be avoided.

[0096] At 1301, a fan section disposed at the front end of the cooling unit may be activated. The fan section may include one or more fans. The fan section including one or more fans is used to move air flow. The size of the one or more fans may be designed to match the air flow diversion channel. In one embodiment, a dedicated fan may be selected for each air flow diversion channel. In one embodiment, a centralized fan may be selected for the entire unit.

[0097] At 1302, airflow can be directed from the fan section to the cooling section group by an airflow splitter section. The airflow splitter section may include one or more main airflow splitter channels and a rear airflow splitter channel. The airflow splitter section may be coupled to the fan section and the cooling section group. The airflow splitter section may be configured to direct airflow from the fan section to the cooling section group. In one embodiment, one or more main airflow splitter channels may be coupled to one or more main cooling sections, and a rear airflow splitter channel may be connected to a rear cooling section. One or more main airflow splitter channels may direct airflow to the main cooling section, and a rear airflow splitter channel may direct airflow to the rear cooling section.

[0098] In one embodiment, directing the airflow from the fan section to the cooling section group includes directing the airflow in a direction perpendicular to a direction from the front end to the rear end to enter the main cooling section.

[0099] At 1303, the airflow is cooled by using a cooling section group including a main cooling section disposed at one side of the cooling unit and a rear cooling section disposed at the rear end of the cooling unit, wherein one or more main airflow split channels are coupled to the main cooling section, and wherein the rear airflow split channels are coupled to the rear cooling section. The airflow is cooled by the cooling modules in the cooling section of the cooling unit and then discharged to the opposite side of the hot air inlet of the cooling section. The cooled air exhausted by the rear cooling section is delivered to the cold channel, and the cooled air exhausted by the cooling section is directly delivered to the racks adjacent thereto, such as the left or right side of the rack.

[0100] In one embodiment, each of the cooling section groups includes at least one cooling module, and wherein cooling the airflow includes cooling the airflow by using the at least one cooling module in each of the cooling section groups.

[0101] In one embodiment, at least one cooling module includes a plurality of rows of coils, and wherein cooling the airflow by using the at least one cooling module includes cooling the airflow by using the plurality of rows of coils in series.

[0102] In one embodiment, the main cooling section comprises a plurality of main cooling modules, wherein the after-cooling section comprises after-cooling modules, and wherein cooling the airflow by using the cooling section group comprises cooling the airflow by using all the main cooling modules and after-cooling modules in series.

[0103] In one embodiment, cooling the airflow by using the primary cooling module and the after-cooling module in series includes connecting a fluid outlet of one of the plurality of primary cooling modules to a fluid inlet of another primary cooling module or a fluid inlet of the after-cooling module of the plurality of primary cooling modules.

[0104] In one embodiment, each of a plurality of main cooling modules corresponds to one of one or more main airflow diversion channels, and wherein directing the airflow from the fan section to the cooling section group includes directing the airflow from each of the one or more main airflow diversion channels to the corresponding main cooling module.

[0105] At 1304, a cooling circuit is started in the cooling unit. The cooling circuit may be connected to one or more main cooling modules in the main cooling section, a post cooling module in the post cooling section, and a heat exchanger. The cooling circuit may be used for supply of cooling fluid and a return connection between one or more main cooling modules, a post cooling module, and a heat exchanger or an external cooling unit.

[0106] In the foregoing description, embodiments of the present invention have been described with reference to specific exemplary embodiments of the present invention. Obviously, various modifications may be made to the embodiments of the present invention without departing from the broader spirit and scope of the present invention as set forth in the appended claims. Therefore, the description and drawings are to be regarded as illustrative rather than restrictive.

Claims

1. Cooling unit, including: A fan part is arranged at the front end of the cooling unit; an air flow splitting portion, comprising one or more main air flow splitting channels and a rear air flow splitting channel, the air flow splitting portion being coupled to the fan portion and the cooling portion group, the air flow splitting portion being configured to guide air flow from the fan portion to the cooling portion group; as well as The cooling part group includes a main cooling part arranged on one side of the cooling unit and a rear cooling part arranged at the rear end of the cooling unit, wherein the one or more main airflow diversion channels are connected to the main cooling part, and wherein the rear airflow diversion channel is connected to the rear cooling part, so that the main cooling part cools the air in the one or more main airflow diversion channels, and the rear cooling part cools the air in the rear airflow diversion channel.

2. The cooling unit according to claim 1, wherein: The inlet of the one or more main airflow diversion channels is arranged at a surface parallel to the front end, wherein the outlet of the one or more main airflow diversion channels is arranged at a surface perpendicular to the front end.

3. The cooling unit according to claim 1, wherein: Each of the one or more primary airflow splitter channels is configured to direct airflow into the primary cooling portion in a direction perpendicular to a direction from the front end to the rear end.

4. The cooling unit according to claim 1, wherein: Each of the one or more main airflow split channels has at least one L-shaped side with a curved corner in cross section.

5. The cooling unit according to claim 1, wherein: Each cooling section in the cooling section group includes at least one cooling module.

6. The cooling unit according to claim 5, wherein: The at least one cooling module comprises a plurality of rows of coils, and wherein the plurality of rows of coils are connected in series.

7. The cooling unit according to claim 6, wherein: The at least one cooling module further comprises a fluid inlet and a fluid outlet, wherein the fluid inlet is connected to a first row of coils among the plurality of rows of coils, and wherein the first row of coils is arranged closest to an air inlet of a corresponding cooling section such that the first row of coils arranged closest to the air inlet receives cooling liquid first.

8. The cooling unit according to claim 6, wherein: The plurality of rows of coils include a first row of coils and a second row of coils, wherein the first row of coils is disposed closer to an air inlet of a corresponding cooling section than the second row of coils, and wherein the first row of coils receives cooling liquid earlier than the second row of coils.

9. The cooling unit according to claim 8, wherein: The outlet of the first row of coils is connected to the inlet of the second row of coils, wherein the first row of coils is configured to direct the cooling liquid to the second row of coils, wherein the inlet of the second row of coils is disposed on the same side as the inlet of the first row of coils, and wherein, for each of the plurality of rows of coils, the inlet is disposed on a side closest to the hot aisle.

10. The cooling unit according to claim 6, wherein: Each of the plurality of rows of coiled tubes includes a plurality of tubes, and wherein a cooling fluid is distributed in parallel among the plurality of tubes.

11. The cooling unit according to claim 1, wherein: The main cooling section comprises a main cooling module, wherein the after-cooling section comprises a after-cooling module, and wherein a fluid outlet of the main cooling module is connected to a fluid inlet of the after-cooling module.

12. The cooling unit according to claim 1, wherein: The main cooling section includes a plurality of main cooling modules, wherein the post-cooling section includes a post-cooling module, and wherein all of the main cooling modules and the post-cooling modules are connected in series.

13. The cooling unit according to claim 12, wherein: A fluid outlet of one of the plurality of main cooling modules is connected to a fluid inlet of another of the plurality of main cooling modules or a fluid inlet of the rear cooling module.

14. The cooling unit according to claim 12, wherein: Each of the plurality of primary cooling modules corresponds to one of the one or more primary airflow splitting channels, and wherein each of the one or more primary airflow splitting channels is configured to guide airflow to a corresponding primary cooling module.

15. Cooling method, including: Starting a fan portion disposed at a front end of the cooling unit; directing an airflow from the fan section to a cooling section group through an airflow splitting section, the airflow splitting section comprising one or more main airflow splitting channels and a rear airflow splitting channel, the airflow splitting section being coupled to the fan section and the cooling section group; as well as The airflow is cooled by using the cooling portion group including a main cooling portion arranged on one side of the cooling unit and a rear cooling portion arranged at the rear end of the cooling unit, wherein the one or more main airflow diversion channels are connected to the main cooling portion, and wherein the rear airflow diversion channel is connected to the rear cooling portion.

16. The method according to claim 15, wherein: Directing airflow from the fan section to the set of cooling sections includes directing airflow into the main cooling section in a direction perpendicular to a direction from the front end to the rear end.

17. The method according to claim 15, wherein: Each of the cooling section groups includes at least one cooling module, and wherein cooling the airflow by using the cooling section groups includes cooling the airflow by using the at least one cooling module in each of the cooling section groups.

18. The method according to claim 17, wherein: The at least one cooling module includes a plurality of rows of coils, and wherein cooling the airflow by using the at least one cooling module includes cooling the airflow by using the plurality of rows of coils in series.

19. The method according to claim 15, wherein: The main cooling section includes a plurality of main cooling modules, wherein the after-cooling section includes after-cooling modules, and wherein cooling the airflow by using the cooling section group includes cooling the airflow by using the main cooling modules and the after-cooling modules in series.

20. The method according to claim 19, wherein: Each of the multiple main cooling modules corresponds to one of the one or more main airflow diversion channels, and wherein directing the airflow from the fan section to the cooling section group includes directing the airflow from each of the one or more main airflow diversion channels to the corresponding main cooling module.

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