A computer chassis temperature control system

Abstract

An embodiment of the present invention discloses a computer chassis temperature control system, which can collect temperature and rotation speed information of multiple temperature sensors, fans and water pumps, as well as monitor for faults. After a fault occurs, it can give a fault reminder, store the information, and control the fans and water pumps to work in a fault mode, adjusting the rotation speeds of the fans and water pumps to achieve the best heat dissipation effect.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of computer chassis heat dissipation, and particularly to a computer chassis temperature control system. Background Art

[0002] At present, the common heat dissipation methods of computer chassis mainly include the following:

[0003] (1) Traditional heat dissipation method, powering the cooling fan to operate at full load;

[0004] (2) Using a simple analog circuit to adjust the current or voltage according to the change of the resistance value of the thermistor to achieve the purpose of fan speed control.

[0005] (3) Using the fan speed control function on the computer motherboard. But generally only provides the CPU fan speed control pin. Summary of the Invention

[0006] Therefore, the embodiments of the present invention provide a computer chassis temperature control device to solve the problems existing in the existing computer chassis heat dissipation methods, such as single control logic, unreasonable speed setting, poor heat dissipation effect, and inability to detect fault information.

[0007] To achieve the above object, the embodiments of the present invention provide the following technical solution: A computer chassis temperature control system, the system includes multiple temperature sensors, multiple fans, a water-cooled circulation water pump, a temperature sensor peripheral circuit, a rotation speed measurement peripheral circuit, a PWM output circuit, and a main control MCU. The multiple temperature sensors are connected to the main control MCU through the temperature sensor peripheral circuit. The rotation speed measurement peripheral circuit is connected to the main control MCU. The main control MCU is connected to the fan and the water pump through the PWM output circuit. The multiple temperature sensors are respectively used to collect the CPU inlet water temperature, CPU outlet water temperature, GPU temperature, main chip temperature, memory temperature, hard disk temperature, internal chassis temperature, and ambient temperature information of the computer chassis. The temperature sensor peripheral circuit is used to convert the thermistor value into a voltage signal and input it to the main control MCU. The multiple fans include a water-cooled radiator fan, a chassis exhaust fan, a main chip fan, a memory fan, and a hard disk fan. The rotation speed measurement peripheral circuit is used to convert the rotation speed signals of the fan and the water pump into signals that can be processed by the main control MCU through an optocoupler. The main control MCU is used to monitor the fault status of each temperature sensor and calculate the temperature value according to the obtained voltage signal, monitor the fault status of the fan and the water pump according to the obtained rotation speed information, and adjust and control the rotation speed of the fan and the water pump according to the collected temperature information, the fault status of each temperature sensor, and the fault status information of each fan and the water pump, and output a PMW control signal. The PWM output circuit is used to output the PMW signal of the main control MCU to the fan and the water pump.

[0008] Further, the system further includes a fault status indication module, which is connected to the main control MCU through a switch circuit. The fault status indication module includes an LED status indicator and a buzzer.

[0009] Further, the system further includes a CAN communication module connected to the main control MCU. The CAN communication module is used to externally connect to a CAN communication device to read and collect data.

[0010] Further, the system further includes a power supply module connected to the main control MCU.

[0011] Further, the system further includes a liquid crystal display module, which communicates with the main control MCU through the SPI protocol and is used to display temperature, rotation speed, and fault status information.

[0012] Further, the system further includes a serial communication module connected to the main control MCU, which is used to send temperature, rotation speed, and fault status data information and for software upgrade.

[0013] Further, the system further includes an EEPROM memory, which communicates with the main control MCU through the IIC protocol and is used to store and read fault information and anti-theft verification codes.

[0014] Further, the model of the main control MCU is STM32F103VCT6.

[0015] The embodiments of the present invention have the following advantages:

[0016] A computer chassis temperature control system proposed by the embodiments of the present invention can collect temperature and rotation speed information of multiple temperature sensors, fans, and water pumps, as well as perform fault monitoring. After a fault occurs, it can give a fault reminder, store the fault, and control the fans and water pumps to work in a fault mode, adjusting the rotation speed of the fans and water pumps to achieve the best heat dissipation effect. Description of the Drawings

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only exemplary, and for those of ordinary skill in the art, without creative efforts, other implementation drawings can be obtained based on the provided drawings.

[0018] Figure 1 It is a schematic structural diagram of a computer chassis temperature control system provided by Embodiment 1 of the present invention;

[0019] Figure 2 Schematic diagram of the arrangement of the CPU and GPU (graphics card) cooling fans, water pump, and temperature sensors in a computer chassis temperature control system provided in Embodiment 1 of the present invention;

[0020] Figure 3 Logic flowchart of the cooling fan control in a computer chassis temperature control system provided in Embodiment 1 of the present invention;

[0021] Figure 4 Schematic diagram of the voltage diagnosis process of the temperature sensor in a computer chassis temperature control system provided in Embodiment 1 of the present invention;

[0022] Figure 5 Schematic diagram of the rationality diagnosis process of the temperature sensor in a computer chassis temperature control system provided in Embodiment 1 of the present invention;

[0023] Figure 6 Schematic diagram of the fan speed request process for the temperature sensor failure mode in a computer chassis temperature control system provided in Embodiment 1 of the present invention;

[0024] Figure 7 Schematic diagram of the fan speed request process for the fan failure mode in a computer chassis temperature control system provided in Embodiment 1 of the present invention;

[0025] Figure 8 Schematic diagram of the temperature correction process for the fan speed request in the fan failure mode of a computer chassis temperature control system provided in Embodiment 1 of the present invention;

[0026] Figure 9 Schematic diagram of the fan signal diagnosis process in a computer chassis temperature control system provided in Embodiment 1 of the present invention;

[0027] Figure 10 Schematic diagram of the rationality diagnosis process of the fan speed in a computer chassis temperature control system provided in Embodiment 1 of the present invention;

[0028] Figure 11 Schematic diagram of the unreasonable dynamic response diagnosis process of the fan in a computer chassis temperature control system provided in Embodiment 1 of the present invention. Detailed implementation manners

[0029] The following specific embodiments illustrate the implementation manners of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0030] Embodiment 1

[0031] As Figure 1 shown, this embodiment proposes a computer chassis temperature control system, which includes multiple temperature sensors, multiple fans, a water-cooling circulation water pump, a temperature sensor peripheral circuit, a rotation speed measurement peripheral circuit, a PWM output circuit, and a main control MCU. The multiple temperature sensors are connected to the main control MCU through the temperature sensor peripheral circuit, the rotation speed measurement peripheral circuit is connected to the main control MCU, and the main control MCU is connected to the fans and the water pump through the PWM output circuit.

[0032] The multiple temperature sensors are respectively used to collect the CPU water inlet temperature, CPU water outlet temperature, GPU temperature, main chip temperature, memory temperature, hard disk temperature, internal chassis temperature, and ambient temperature information of the computer chassis. The temperature sensor peripheral circuit is used to convert the thermistor value into a voltage signal and input it to the main control MCU. In this embodiment, NTC thermistor type temperature sensors are used for the collection of the CPU water inlet temperature, CPU water outlet temperature, GPU temperature, main chip temperature, memory temperature, hard disk temperature, internal chassis temperature, and ambient temperature information. In this embodiment, a DS18B20 digital temperature sensor is also set to collect the system circuit board temperature information, and is also used to encrypt the software by combining the unique serial number of the DS18B20 and the MCU serial number.

[0033] The multiple fans include a water-cooling radiator fan, a chassis exhaust fan, a main chip fan, a memory fan, and a hard disk fan. The rotation speed measurement peripheral circuit is used to convert the rotation speed signals of the fans and the water pump into signals that can be processed by the main control MCU through an optocoupler.

[0034] The main control MCU is used to monitor the fault status of each temperature sensor and calculate the temperature value according to the obtained voltage signal, monitor the fault status of the fans and the water pump according to the obtained rotation speed information, and adjust and control the rotation speed of the fans and the water pump according to the collected temperature information, the fault status of each temperature sensor, and the fault status information of each fan and the water pump, and output a PMW control signal. The PWM output circuit is used to output the PMW signal of the main control MCU to the fans and the water pump. In this embodiment, the model of the main control MCU is STM32F103VCT6.

[0035] In this embodiment, the rotation speed requests (%) of the corresponding fans and the water pump are calculated according to the temperatures of each sensor, the fault status of the temperature sensors, and the fault status of the fans and the water pump, and finally a PMW signal is output. According to the control functions, it mainly includes the rotation speed control of 3 water-cooling radiator fans, the rotation speed control of 2 chassis exhaust fans, the rotation speed control of 1 main chip fan, the rotation speed control of 1 memory fan, the rotation speed control of 1 hard disk fan, and the rotation speed control of 1 water pump.

[0036] The main structures of each module are not very different. Taking the temperature control of the CPU and GPU (graphics card) as an example for illustration. The CPU and GPU (graphics card) adopt a circulating water cooling method, and the layout of the fan, water pump and related temperature sensors is as Figure 2 shown. The circulating coolant between different components is realized through the water cooling circulating pump. The control logic flow of the cooling fan is as Figure 3 shown. Specifically:

[0037] The voltage analog signals representing the temperatures of the CPU inlet water temperature sensor, CPU outlet water temperature sensor and GPU temperature sensor of the thermistor type are converted into voltage digital signals through AD conversion, and then voltage diagnosis (judging whether there are faults such as short circuits and poor contacts) is carried out. The voltage value is calculated and converted into temperature, and temperature rationality diagnosis is carried out. Based on the above diagnosis results, according to the temperatures obtained by the three sensors, the maximum value of the temperatures of the CPU inlet water, CPU outlet water and GPU outlet water is taken, and a look-up table is made with the ambient temperature to obtain the initial value of the fan speed (%), and the temperature difference between the GPU outlet water and the CPU inlet water is looked up in the table to obtain the fan speed correction coefficient, and the final fan speed (%) is obtained according to the initial value of the fan speed (%) and the fan speed correction coefficient (multiple temperature-speed look-up tables (one-dimensional table or two-dimensional table) are pre-configured in the system software, and the corresponding fan speed demand value can be obtained by looking up the temperature according to one temperature (one-dimensional table) or two temperature values (two-dimensional table). Linear interpolation calculation is used to make the temperature value queryable in the table, and the specific values in the table can be set according to the actual situation);

[0038] Then, according to the change amount of the water pump speed, it is decided whether to limit the change rate of the fan speed request, and the target temperature of the coolant is calculated from the ambient temperature. If the closed-loop condition is met, PID closed-loop control can be performed on the fan speed, and the fan speed is obtained based on the above conditions. Combining the fan speed requests in the temperature sensor fault failure mode and the fan fault failure mode, then the slope smoothing process of the fan speed (%) change is carried out, and combined with the fan speed range limit, the fan speed is obtained. The main control MCU converts the fan speed request into a PMW output signal.

[0039] The voltage diagnosis of the temperature sensor is as Figure 4 shown, mainly including voltage range diagnosis and poor contact diagnosis: judging whether the voltage value exceeds the upper and lower limits. If it exceeds, the fault state timing is carried out. If the timing exceeds the limit value, a voltage range fault is reported; high-pass filtering is carried out on the voltage value, and it is calculated whether the voltage change gradient exceeds the limit value. If it exceeds, the fault state timing is carried out. If the timing exceeds the limit value, a poor contact fault is reported.

[0040] The temperature rationality diagnosis of the temperature sensor is as Figure 5As shown, it mainly includes out-of-range temperature faults and unreasonable temperature rise faults: determine whether the temperature value exceeds the upper and lower limits. If it does, start fault status timing. If the timing exceeds the limit value, report a temperature range fault; record the temperature at startup and the highest temperature during the process, and use a timer to time. When the temperature of other temperature sensors changes significantly and the timer reaches the defined time, calculate the difference between the highest temperature during the process of the temperature sensor and the temperature at startup. If the difference does not exceed the limit value, report an unreasonable temperature rise fault.

[0041] The fan speed request for the temperature sensor failure mode is defined as: the fan speed requests set when faults occur in the CPU inlet temperature, CPU outlet temperature, GPU outlet temperature, internal chassis temperature, and ambient temperature. The control logic is as Figure 6 shown. Specifically: According to the CPU inlet temperature, CPU outlet temperature, GPU outlet temperature, internal chassis temperature, and ambient temperature, count the number of faulty sensors. If there are no faults, output the minimum fan speed request. If there are faults, output the fan speed request according to the set parameters. Then, according to whether each sensor is faulty, if the GPU outlet temperature sensor is not faulty, output the fan speed request by looking up the table according to the GPU outlet temperature. If the CPU outlet temperature sensor is not faulty, output the fan speed request by looking up the table according to the CPU outlet temperature. If the CPU inlet temperature sensor is not faulty, output the fan speed request by looking up the table according to the CPU inlet temperature. If the internal chassis temperature sensor is not faulty, output the fan speed request by looking up the table according to the internal chassis temperature. If the ambient temperature sensor is not faulty, output the fan speed request by looking up the table according to the ambient temperature.

[0042] The fan speed request for the fan failure mode is defined as: the fan speed requests set when faults occur in the water-cooled radiator fan 1, water-cooled radiator fan 2, and water-cooled radiator fan 3, as Figure 7 shown. The control logic is: first perform fan diagnosis, count the number of faulty fans. If there are no faults, output the minimum fan speed request; if there are faults (1, 2, or all 3 are faulty), then perform temperature correction to obtain the correction coefficient and output the fan speed request according to the set parameters. Multiply the basic fan speed value by the correction coefficient to output the fan speed request.

[0043] The above-mentioned temperature correction is defined as: for different CPU inlet, outlet, GPU outlet, internal chassis, and ambient temperatures, correct the fan speed request according to the correction coefficient, as Figure 8As shown, the control logic is as follows: Based on the CPU inlet temperature, outlet temperature, GPU outlet temperature, internal chassis temperature, and ambient temperature, count the number of faulty sensors. If all sensors are faulty, output a correction factor of 1.0. If not all sensors are faulty, according to whether each sensor is faulty, if the GPU outlet temperature sensor is not faulty, look up the table based on the GPU outlet temperature to output the correction factor; if the CPU outlet temperature sensor is not faulty, look up the table based on the CPU outlet temperature to output the correction factor; if the CPU inlet temperature sensor is not faulty, look up the table based on the CPU inlet temperature to output the correction factor; if the internal chassis temperature sensor is not faulty, look up the table based on the internal chassis temperature to output the correction factor; if the ambient temperature sensor is not faulty, look up the table based on the ambient temperature to output the correction factor (a temperature - correction factor look - up table is pre - configured in the system software, and the corresponding correction factor value can be obtained by looking up the table according to the temperature).

[0044] The above - mentioned fan diagnosis mainly includes signal diagnosis and rationality diagnosis. The signal diagnosis logic is as follows: As Figure 9 shown, first wait for task allocation. After getting the allocated task, determine whether the current speed request meets the minimum diagnosis requirement. If it meets, count the number of pulse signals obtained within the defined time. If the number of pulse signals is less than the set value, report a fan signal fault. The rationality diagnosis in fan diagnosis includes two diagnosis methods: unreasonable actual speed signal and unreasonable dynamic response. The diagnosis logic of the unreasonable actual speed signal is as follows: As Figure 10 shown, first wait for task allocation. After getting the allocated task, determine whether the current speed request meets the minimum diagnosis requirement. If it meets, calculate the theoretical speed according to the speed request through the fan characteristics. If the difference between the theoretical speed and the actual speed is higher than the limit value, trigger the fault status timing. When the timing reaches the set time, report an unreasonable actual speed fault. The diagnosis logic of the unreasonable dynamic response is as follows: As Figure 11 shown, first wait for task allocation. After getting the allocated task, determine whether the change rate of the speed request exceeds the limit value. If it exceeds, record the actual speed and theoretical speed at this moment. Then determine whether the change rate of the speed request is lower than the limit value. If it is lower, record the actual speed and theoretical speed at this moment. According to the actual speed and theoretical speed recorded twice, calculate the ratio of the actual speed change gradient to the theoretical speed change gradient. If the gradient ratio is lower than the set value, report a slow dynamic response fault.

[0045] Furthermore, the system also includes a fault status indication module. The fault status indication module is connected to the main control MCU through a switch circuit. The fault status indication module includes an LED status indicator and a buzzer.

[0046] Further, the system further includes a CAN communication module connected to the main control MCU. The CAN communication module is used to externally connect to a CAN communication device to read and collect data. The CAN communication uses a TJA1050 chip and peripheral circuits, and a 120-ohm terminal resistor.

[0047] Further, the system further includes a power supply module connected to the main control MCU. The power supply circuit uses an RT7272, an AMS1117, and peripheral circuits to convert the 12V input voltage into 5V and 3.3V voltages.

[0048] Further, the system further includes a liquid crystal display module. The liquid crystal display module communicates with the main control MCU through the SPI protocol and is used to display temperature, rotational speed, and fault status information. The display device currently uses a 1.3-inch 7-pin OLED display module.

[0049] Further, the system further includes a serial communication module connected to the main control MCU. The serial communication uses a CH340G chip, peripheral drive circuits, and a MicroUSB interface. It can send information such as temperature, rotational speed, fault information, software version number, chip ID, etc. according to instructions, and the software can be upgraded through a USB data cable.

[0050] Further, the system further includes an EEPROM memory. The EEPROM memory communicates with the main control MCU through the IIC protocol and is used to store and read fault information and anti-theft verification codes. The EEPROM memory is an electrically erasable programmable memory, a storage chip whose data is not lost after power-off, and uses an AT24C02 chip.

[0051] Although the present invention has been described in detail above with general descriptions and specific embodiments, on the basis of the present invention, some modifications or improvements can be made, which are obvious to those skilled in the art. Therefore, these modifications or improvements made without departing from the spirit of the present invention all fall within the scope of protection required by the present invention.

Claims

1. A computer chassis temperature control system, characterized in that, The system includes multiple temperature sensors, multiple fans, a water-cooling circulation water pump, a temperature sensor peripheral circuit, a rotation speed measurement peripheral circuit, a PWM output circuit, and a main control MCU. The multiple temperature sensors are connected to the main control MCU through the temperature sensor peripheral circuit. The rotation speed measurement peripheral circuit is connected to the main control MCU. The main control MCU is connected to the fans and the water pump through the PWM output circuit. The multiple temperature sensors are respectively used to collect the CPU inlet water temperature, CPU outlet water temperature, GPU temperature, main chip temperature, memory temperature, hard disk temperature, internal case temperature, and ambient temperature information of the computer case. The temperature sensor peripheral circuit is used to convert the thermistor value into a voltage signal and input it to the main control MCU. The multiple fans include a water-cooling radiator fan, a case exhaust fan, a main chip fan, a memory fan, and a hard disk fan. The rotation speed measurement peripheral circuit is used to convert the rotation speed signals of the fans and the water pump into signals that can be processed by the main control MCU through an optocoupler. The main control MCU is used to monitor the fault status of each temperature sensor and calculate the temperature value according to the obtained voltage signal, monitor the fault status of the fans and the water pump according to the obtained rotation speed information, and adjust and control the rotation speed of the fans and the water pump according to the collected temperature information, the fault status of each temperature sensor, and the fault status information of each fan and the water pump, and output a PMW control signal. The PWM output circuit is used to output the PMW signal of the main control MCU to the fans and the water pump; The adjustment and control of the rotation speed of the fans and the water pump specifically include: performing fan diagnosis, counting the number of faulty fans. If there are no faults, output the minimum rotation speed request value. If there are faults, perform temperature correction to obtain a correction coefficient, and output a rotation speed request according to the set parameters. Multiply the basic rotation speed value by the correction coefficient to output the rotation speed request; The temperature correction includes: according to the CPU inlet water temperature, outlet water temperature, GPU outlet water temperature, internal case temperature, and ambient temperature, counting the number of faulty sensors. If all are faulty, output a correction coefficient of 1.

0. If not all are faulty, according to whether each sensor is faulty, if the GPU outlet water temperature sensor is not faulty, look up the table according to the GPU outlet water temperature to output the correction coefficient. If the CPU outlet water temperature sensor is not faulty, look up the table according to the CPU outlet water temperature to output the correction coefficient. If the CPU inlet water temperature sensor is not faulty, look up the table according to the CPU inlet water temperature to output the correction coefficient. If the internal case temperature sensor is not faulty, look up the table according to the internal case temperature to output the correction coefficient. If the ambient temperature sensor is not faulty, look up the table according to the ambient temperature to output the correction coefficient.

2. The temperature control system for a computer chassis according to claim 1, wherein, The system further includes a fault status indication module. The fault status indication module is connected to the main control MCU through a switch circuit. The fault status indication module includes an LED status indicator and a buzzer.

3. The temperature control system for a computer chassis according to claim 1, wherein The system further includes a CAN communication module connected to the main control MCU. The CAN communication module is used to externally connect a CAN communication device to read and collect data.

4. The temperature control system for a computer chassis according to claim 1, wherein The system further includes a power supply module connected to the main control MCU.

5. The temperature control system for a computer chassis according to claim 1, wherein The system further includes a liquid crystal display module, which communicates with the main control MCU through the SPI protocol and is used to display temperature, rotation speed, and fault status information.

6. The temperature control system of a computer chassis according to claim 1, wherein The system further includes a serial communication module connected to the main control MCU, which is used to send temperature, rotation speed, and fault status data information and for software upgrade.

7. The temperature control system for a computer chassis according to claim 1, characterized in that, The system further includes an EEPROM memory, which communicates with the main control MCU through the IIC protocol and is used to store and read fault information and anti-theft verification codes.

8. A computer chassis temperature control system according to claim 1, characterized in that, The model of the main control MCU is STM32F103VCT6.

Images