Substrate processing apparatus

Abstract

The present application has an object to make maintenance work of a substrate processing apparatus easy. The substrate processing apparatus includes a holding surface that holds a substrate, a plurality of lift pins that protrude from the holding surface, a frame member that supports the lift pins from below and is arranged so as to overlap the holding surface in plan view, and a lift pin drive section that is arranged at an outer peripheral portion of the frame member in plan view, raises and lowers the lift pins by raising and lowering the frame member, and includes a drive source, a drive force transmission mechanism that is arranged so as to extend in the circumferential direction of the frame member, and a plurality of lift mechanisms that are linked to the drive force transmission mechanism and the outer peripheral portion of the frame member and raise and lower the frame member.

Description

TECHNICAL FIELD

[0001] The technology disclosed in this specification relates to a substrate processing apparatus. As a substrate to be processed, for example, a semiconductor wafer, a glass substrate for a liquid crystal display device, a flat panel display (FPD) substrate such as an organic electroluminescence (EL) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a glass substrate for a photomask, a ceramic substrate, a substrate for a field emission display (FED), or a substrate for a solar cell is included. BACKGROUND

[0002] In the substrate processing apparatus, a plurality of lift pins for lifting a substrate upward or downward at the time of carrying-in or carrying-out of the substrate, or the like is provided.

[0003] The plurality of lift pins lifts the substrate upward by protruding upward from a plurality of through holes provided in a holding surface of the substrate and supporting the substrate, and lowers the substrate by being housed in the through holes and disposed on the holding surface (for example, refer to Patent Document 1).

[0004] [Related Art Documents]

[0005] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open (kokai) No. 2010-114175 SUMMARY

[0007] [Problems to be Solved by the Invention]

[0008] In the technology shown in Patent Document 1, the drive mechanism for lifting the lift pins is disposed directly below the frame member. Therefore, for example, in the case of performing maintenance of the drive mechanism, the worker needs to go down below the frame member to perform the work, and there is a problem that the work space is narrow and it is difficult to perform the work.

[0009] The technology disclosed in this specification is made in view of the problems as described above, and is a technology for making the maintenance work of the substrate processing apparatus easy.

[0010] [Technical Means for Solving the Problems]

[0011] A first embodiment of the technology disclosed in the present specification relates to a substrate processing apparatus including: a holding surface configured to hold a substrate on an upper surface; a plurality of lift pins protruding toward the upper surface of the holding surface via a plurality of through holes formed in the holding surface; a frame member configured to support the plurality of lift pins from below and arranged so as to overlap the holding surface in plan view; and a lift pin drive section configured to the outer periphery of the frame member in plan view and configured to lift the plurality of lift pins by lifting the frame member, and the lift pin drive section includes: a drive source; a drive force transmission mechanism arranged so as to extend in the circumferential direction of the frame member and configured to transmit a drive force of the drive source; and a plurality of lift mechanisms linked to the drive force transmission mechanism and the outer periphery of the frame member and configured to lift the frame member.

[0012] A second embodiment of the technology disclosed in the present specification relates to the first embodiment, in which the lift pin drive section does not overlap the frame member in plan view.

[0013] A third embodiment of the technology disclosed in the present specification relates to the first embodiment or the second embodiment, in which the lift pin drive section does not overlap the holding surface in plan view.

[0014] A fourth embodiment of the technology disclosed in the present specification relates to any one of the first embodiment to the third embodiment, in which the drive force transmission mechanism is arranged so as to extend in different two circumferential directions of the frame member.

[0015] [Effects of the Invention]

[0016] According to at least the first embodiment of the technology disclosed in the present specification, since the lift pin drive section can be arranged at a position sufficiently apart from the center of the substrate in plan view, work becomes easy when maintenance work of the substrate processing apparatus is performed.

[0017] In addition, the objects, features, aspects and advantages associated with the technology disclosed in the present specification become more apparent with the detailed description and the accompanying drawings shown below. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a perspective view schematically showing a substrate processing apparatus related to an embodiment.

[0019] Figure 2 is a view for explaining a lift pin, a frame member, and a lift pin drive section shown in Figure 1 Example 1, which are arranged below a holding surface of a substrate processing apparatus.

[0020] Figure 3 is a view showing in detail Figure 2A perspective view of the structure of the lift pin, the frame member, and the lift pin drive section exemplified.

[0021] Figure 4 A diagram showing an example of the structure of the drive force transmission mechanism and the lift mechanism of the lift pin drive section.

[0022] Figure 5 A cross-sectional view showing an example of the lift action of the lift pin.

[0023] Figure 6 A cross-sectional view showing an example of the lift action of the lift pin.

[0024] Figure 7 A diagram showing an example of the structure of the drive force transmission mechanism and the lift mechanism.

[0025] [Explanation of symbols]

[0026] 1: substrate processing apparatus

[0027] 2: slit nozzle

[0028] 3: substrate

[0029] 4: stage

[0030] 5: coating processing section

[0031] 6: lift pin

[0032] 7: frame member

[0033] 8: lift pin drive section

[0034] 8A: drive source

[0035] 8B, 8OB: drive force transmission mechanism

[0036] 8C, 8OC: lift mechanism

[0037] 21: discharge port

[0038] 31: upper surface

[0039] 41: holding surface

[0040] 51: nozzle support

[0041] 52: guide rail

[0042] 53: slit nozzle moving section

[0043] 54: linear motor

[0044] 55: linear encoder

[0045] 70: control section

[0046] 82: shaft

[0047] 82A: pinion

[0048] 82B: linkage jig

[0049] 84: linkage portion

[0050] 86: rack

[0051] 88: sliding hole

[0052] 88A, 88B: end portion

[0053] 90: through hole

[0054] 100: nozzle adjustment region DETAILED DESCRIPTION

[0055] Hereinafter, embodiments will be described with reference to the accompanying drawings. In the following embodiments, detailed features and the like are also shown for the purpose of explanation of the technology, but these are examples, and not all of these are features necessary for the embodiments to be implemented.

[0056] Further, the drawings are schematically shown, and for the purpose of explanation, omission or simplification of structures in the drawings is appropriate. In addition, the mutual relationship of the size and the position of the structures and the like shown in different drawings is not necessarily accurately recorded, and can be appropriately changed. In addition, in the drawings other than the sectional view, hatching is sometimes also indicated in order to easily understand the contents of the embodiments.

[0057] In addition, in the explanation shown below, the same symbols are attached to the same constituent elements to be shown, and the names and the functions thereof are also the same. Therefore, in order to avoid repetition, detailed explanation thereof is sometimes omitted.

[0058] In addition, in the explanation described below, in the case where it is described that "including", "containing", or "having" a certain constituent element or the like, unless otherwise specified, it is not an exclusive expression that excludes the existence of other constituent elements.

[0059] In addition, in the explanation described below, even in the case where a term indicating a specific position or direction such as "upper", "lower", "left", "right", "side", "bottom", "top", or "back" is used, these terms are used for the purpose of easily understanding the contents of the embodiments, and are not related to the position or direction at the time of actual implementation.

[0060] <EMBODIMENT>

[0061] Hereinafter, a substrate processing apparatus related to the present embodiment will be described.

[0062] <STRUCTURE OF SUBSTRATE PROCESSING APPARATUS>

[0063] Figure 1 is a perspective view schematically showing a substrate processing apparatus 1 related to the present embodiment.

[0064] The substrate processing apparatus 1 is a slit coater that applies a coating liquid to an upper surface 31 of a substrate 3 using a slit nozzle 2. In the substrate processing apparatus 1, as the coating liquid thereof, various coating liquids such as a photoresist liquid as an etching-resistant film, a photoresist liquid for a color filter, a polyimide precursor (polyamic acid), a paste containing silicon, a nano metal ink, or a paste of a conductive material can be used. Further, the "upper surface 31 of the substrate 3" refers to a main surface of the substrate 3 on which side the coating liquid is applied among both main surfaces of the substrate 3.

[0065] The substrate processing apparatus 1 includes a stage 4 that can adsorptively hold the substrate 3 in a horizontal posture, a coating processing section 5 that performs a coating process on the substrate 3 held by the stage 4 using the slit nozzle 2, and a control section 70 that controls the operation of each structure of the substrate processing apparatus 1.

[0066] The control section 70 controls a control object by executing a program stored in an internal or external storage medium (a volatile or non-volatile memory such as a hard disk drive (HDD), a random access memory (RAM), a read only memory (ROM), or a flash memory, etc.) and includes, for example, a central processing unit (CPU), a microprocessor, or a microcomputer, etc.

[0067] Figure 1 The stage 4 exemplified in the present embodiment is composed of a stone material such as granite having a substantially rectangular parallelepiped shape. The stage 4 includes a holding surface 41 that is processed into a substantially horizontal flat surface and holds the substrate 3 in a region on the -Y side in the upper surface (+Z side surface) thereof. The holding surface 41 can be a region overlapping the substrate 3 when viewed from above or a region slightly wider than the region overlapping the substrate 3 when viewed from above. A plurality of vacuum adsorption ports (not shown) are dispersedly formed in the holding surface 41. The substrate 3 is adsorptively held at a predetermined position in a substantially horizontal state at the time of the coating process by using these vacuum adsorption ports. Further, the holding form of the substrate 3 is not limited thereto and, for example, the stage 4 can be configured in a manner that mechanically holds the substrate 3.

[0068] In addition, the stage 4 includes a nozzle adjustment region 100 in a region on the +Y side from the region occupied by the holding surface 41. In the nozzle adjustment region 100, a nozzle cleaning device (not shown) that performs a cleaning process on the slit nozzle 2 before the coating process is disposed.

[0069] In the substrate processing apparatus 1, a moving mechanism, described later, is provided in the coating processing section 5 to move the slit nozzle 2 along the Y-axis direction. Using the moving mechanism, the slit nozzle 2 can be moved back and forth between above the holding surface 41 and above the nozzle adjustment area 100.

[0070] Furthermore, during the period when the slit nozzle 2 moves above the nozzle adjustment area 100, that is, during the period when the slit nozzle 2 is not above the area occupied by the holding surface 41 in the platform 4, the substrate 3 that has been coated is removed from the platform 4 and the substrate 3 that will be coated next is placed in. On the other hand, during the period when the slit nozzle 2 moves above the holding surface 41, the coating liquid is applied from the slit nozzle 2 to the upper surface 31 of the substrate 3 on the holding surface 41.

[0071] The moving mechanism of the coating treatment unit 5 mainly includes: a nozzle support 51 with a bridging structure, which traverses the upper part of the platform 4 along the X-axis and supports the slit nozzle 2; and a slit nozzle moving part 53, which moves the nozzle support 51 and the slit nozzle 2 supported by the nozzle support 51 horizontally along a pair of guide rails 52 extending along the Y-axis.

[0072] like Figure 1 As illustrated, the nozzle support 51 is a bridging structure that supports the left and right ends of the platform 4 along the X-axis and spans the holding surface 41. The slit nozzle moving part 53 causes the nozzle support 51, which is the bridging structure, and the slit nozzle 2 held by the nozzle support 51 to move relative to the substrate 3 held on the platform 4 along the Y-axis.

[0073] Specifically, the slit nozzle moving part 53 includes: a guide rail 52 that guides the movement of the slit nozzle 2 along the Y-axis on the ±X side, a linear motor 54 that serves as a drive source, and a linear encoder 55 for detecting the position of the outlet of the slit nozzle 2.

[0074] like Figure 1 As illustrated, the two guide rails 52 extend along the Y-axis at both ends of the platform 4 in the X-axis direction.

[0075] Here, a plurality of lifting pins (not shown) are provided on the holding surface 41. The plurality of lifting pins are used to support the substrate 3 when it is moved in and placed on the holding surface 41, and when the substrate 3 held on the holding surface 41 is moved out. Each lifting pin protrudes from a through hole (not shown) formed in the holding surface 41 toward the upper surface of the holding surface 41 and supports the substrate 3 from below.

[0076] In the structure as above, the slit nozzle 2 is capable of moving substantially horizontally in the Y-axis direction with respect to the holding surface 41 in the upper space of the holding surface 41 for holding the substrate 3. Then, the substrate processing apparatus 1 forms a coating layer on the upper surface 31 of the substrate 3 held by the holding surface 41 by discharging the coating liquid from the discharge port 21 of the slit nozzle 2 while relatively moving the slit nozzle 2 as described above.

[0077] Further, the region of a prescribed width from the end portion of each edge of the substrate 3 (a frame-like region) becomes a non-coating region which is not a coating target of the coating liquid.

[0078] In addition, during the handover of the substrate 3 between the substrate processing apparatus 1 and the external conveyance mechanism (i.e., during the in-out conveyance of the substrate 3), and the like during which the coating process is not performed on the platform 4, the slit nozzle 2 retreats to the nozzle adjustment region 100 which is a region deviated to the +Y side from the holding surface 41 of the substrate 3 (corresponding to the state exemplified in Figure 1 The slit nozzle 2 is subjected to the cleaning process by the nozzle cleaning device.

[0079] Further, as the substrate processing performed by the substrate processing apparatus 1, in addition to the coating process described above, for example, a high-temperature process or the like can be assumed. In this case, the lift pins for supporting the substrate 3 protrude from the through holes formed in the upper surface of the hot plate. In addition, even in the case where a plurality of such hot plates are stacked, the lift pins are included in each of the hot plates.

[0080] Figure 2 is a view for describing the lift pins 6, the frame member 7, and the lift pin driving section 8 provided below the holding surface 41 of the substrate processing apparatus 1 exemplified in Figure 1

[0081] As exemplified in Figure 2 Below the holding surface 41 of the platform 4, a plurality of lift pins 6 which pass through a plurality of through holes (not illustrated here) provided in the holding surface 41 and each of the lift pins 6 are formed.

[0082] The plurality of lift pins 6 are supported by the common frame member 7 and are lifted together with the frame member 7. Figure 2 The frame member 7 in is disposed within the region in which the holding surface 41 is disposed when viewed from above, but the frame member 7 can also be disposed so as to protrude from the region in which the holding surface 41 is disposed.

[0083] The frame member 7 is connected to the lift pin driving section 8 at at least a portion (a peripheral portion) of the outer periphery thereof. The lift pin driving section 8 is connected to the platform 4 directly or indirectly.

[0084] ​The lift pin driving section 8 includes a driving source 8A as a rotary driving motor or the like, a driving force transmission mechanism 8B connected to the driving source 8A and transmitting the driving force from the driving source 8A to the circumference of the frame member 7, and a plurality of lift mechanisms 8C lifted in accordance with the driving force transmitted by the driving force transmission mechanism 8B. The lift pin driving section 8 transmits the rotary drive or horizontal drive caused by the driving source 8A through the driving force transmission mechanism 8B and further converts it into lift drive. Further, the driving source 8A can also include a plurality of driving sources.

[0085] As shown in Figure 2 , the lift pin driving section 8 is arranged along at least a portion of the outer periphery (outer peripheral portion) of the frame member 7 in a manner of surrounding the frame member 7 in plan view.

[0086] Further, in Figure 2 , the lift pin driving section 8 is arranged at a position not overlapping the frame member 7 in plan view, but the lift pin driving section 8 can also overlap the outer peripheral portion of the frame member 7 on at least a portion. In addition, in Figure 2 , at least a portion of the lift pin driving section 8 (driving force transmission mechanism 8B and lift mechanism 8C) is arranged at a position overlapping the holding surface 41 in plan view, but the entire lift pin driving section 8 can also be arranged at a position not overlapping the holding surface 41 in plan view.

[0087] Figure 3 is a perspective view that shows the structure of the lift pin 6, frame member 7, and lift pin driving section 8 exemplified in Figure 2 .

[0088] As exemplified in Figure 3 , a plurality of lift pins 6 are vertically supported at each edge of the frame member 7 formed in a lattice shape. The position at which each lift pin 6 is supported corresponds to the position of the through hole formed in the holding surface 41, and the lift pin 6 is inserted into the through hole in conjunction with the lift drive of the frame member 7, and further each lift pin 6 protrudes from the upper surface of the holding surface 41. Further, the position in the height direction (Z-axis direction) of each lift pin 6 can be adjusted.

[0089] The driving force transmission mechanism 8B includes a plurality of shafts 82 that rotate in conjunction with the drive of the driving source 8A, and a linkage portion 84 that links the shafts 82 to each other at the corner portion of the frame member 7. Here, the linkage portion 84 can also not be included. Even in the case where the linkage portion 84 is not included, as long as the shaft 82 linked to the driving source 8A extends along the circumference of the frame member 7 and can transmit the driving force thereof along the circumference, it is acceptable.

[0090] Further, Figure 3The driving force transmission mechanism 8B in the frame member 7 is configured to extend along three sides of the frame member 7 via the linkage portion 84, but by being configured to extend along multiple sides (including two sides) of the frame member 7 via the driving force transmission mechanism 8B, the lift pins 6, and further the substrate 3, can be uniformly and stably lifted via the lift mechanisms 8C on the multiple sides.

[0091] The multiple lift mechanisms 8C are configured to be separated from each other along the circumference of the frame member 7. Each of the lift mechanisms 8C is linked to the outer circumferential portion of the frame member 7 and the driving force transmission mechanism 8B, and lifts the frame member 7.

[0092] <Structure of the lift pin driving portion>

[0093] Figure 4 is a view showing an example of the structure of the driving force transmission mechanism 8B and the lift mechanism 8C of the lift pin driving portion 8.

[0094] The driving force transmission mechanism 8B includes multiple shafts 82 that rotate in linkage with the driving of the driving source 8A, and a linkage portion 84 that links the shafts 82 to each other at the corner portion of the frame member 7.

[0095] As shown in Figure 4 , a pinion 82A is provided at the portion of the shaft 82 that faces the lift mechanism 8C. In addition, a linkage jig 82B for linkage with the other shaft 82 is provided at the end portion of the shaft 82. The linkage jig 82B is inserted into the inside of the linkage portion 84, and comes into contact with the linkage jig 82B of the other shaft 82 in the inside of the linkage portion 84, thereby linking the rotation of the shafts to each other.

[0096] On the other hand, each of the lift mechanisms 8C includes a rack 86 that engages with the pinion 82A provided at the shaft 82. The rack 86 is linked to the frame member 7, and the driving force of the driving source 8A is transmitted to the lift mechanism 8C via the engagement of the pinion 82A of the shaft 82 and the rack 86 of the lift mechanism 8C.

[0097] The frame member 7 linked to the lift mechanism 8C, and further the lift pin 6 supported from below by the frame member 7, are lifted in linkage with the lifting drive of the lift mechanism 8C caused by the driving of the driving source 8A.

[0098] <About the lifting operation of the lift pin>

[0099] Figure 5 and Figure 6 is a cross-sectional view showing an example of the lifting operation of the lift pin 6. First, as shown in Figure 5 , in a state in which the lift pin 6 does not protrude upward from the holding surface 41 of the platform 4 (in Figure 5 , the lift pin 6 is inserted into the through hole 90, and the lift pin 6 does not protrude upward from the holding surface 41), the frame member 7 linked to the lift mechanism 8C is disposed at a lower position.

[0100] On the other hand, when the frame member 7 is raised by the drive of the drive source 8A, the frame member 7 is arranged at the upper position, and in conjunction therewith, each lift pin 6 supported from below by the frame member 7 protrudes toward the upper side of the holding surface 41 via the through hole 90. Then, the substrate 3 supported by the lower surface of the lift pin 6 is lifted apart from the holding surface 41. In the state where the substrate 3 is supported by the lift pin 6, the substrate 3 is carried in or carried out, or the like is performed.

[0101] Further, in Figure 5 , a case where the lift pin 6 does not protrude from the holding surface 41 and the substrate 3 is in contact with (or is adsorbed to) the holding surface 41 is shown, but the lift pin can also be in a state where it slightly protrudes from the holding surface 41 as a proximity pin or the like.

[0102] <Variations on the structure of the lift pin drive section>

[0103] Figure 7 is a view showing an example of the structure of the drive force transmission mechanism 80B and the lift mechanism 80C.

[0104] As exemplified in Figure 7 , the drive force transmission mechanism 80B is a plurality of plate members that move horizontally along the circumferential direction of the frame member 7 in linkage with the drive of a drive source such as a linear motor.

[0105] As exemplified in Figure 7 , a sliding hole 88 is formed at a position of the drive force transmission mechanism 80B that faces the lift mechanism 80C. The sliding hole 88 includes an end portion 88A on the upper side in the vertical direction of the drive force transmission mechanism 80B and an end portion 88B on the lower side in the vertical direction, and the end portion 88A and the end portion 88B are connected smoothly while being inclined.

[0106] On the other hand, each lift mechanism 80C is a protrusion that is embedded into the sliding hole 88 formed in the drive force transmission mechanism 80B. The protrusion is formed at the outer circumferential portion of the frame member 7.

[0107] Furthermore, when the drive force transmission mechanism 80B moves horizontally in linkage with the drive force of the drive source, the protrusion embedded into the sliding hole 88 moves smoothly from the end portion 88A (or the end portion 88B) to the end portion 88B (or the end portion 88A) of the sliding hole 88 in the state of being embedded into the sliding hole 88 and is raised and lowered.

[0108] Thus, the frame member 7 linked with the lift mechanism 80C, and further the lift pin 6 supported from below by the frame member 7, are raised and lowered in linkage with the raising and lowering drive of the lift mechanism 80C caused by the drive of the drive source.

[0109] Further, the structure of the drive force transmission mechanism and the lifting mechanism can assume various structures other than the above. For example, it can also be configured as a combination of a mechanism that converts the rotational drive of the rotational drive motor into lifting drive using a crank arm or a ball screw or the like. In addition, a belt, a chain, or a wire or the like can be stretched along the circumference of the frame member 7, whereby the drive force of the rotational drive motor is transmitted. Alternatively, a plurality of gears can be linked along the circumference of the frame member 7, whereby the drive force of the rotational drive motor is transmitted.

[0110] <Effects of the Embodiments>

[0111] Next, examples of effects produced by the above-described embodiments are shown. Further, in the following description, the effects are described based on the specific structures exemplified in the above-described embodiments, but can be replaced with other specific structures exemplified in the present specification within a range where the same effects are produced.

[0112] According to the above-described embodiments, the substrate processing apparatus includes a holding surface 41, a plurality of lifting pins 6, a frame member 7, and a lifting pin drive section 8. The holding surface 41 holds the substrate 3 on the upper surface. The plurality of lifting pins 6 protrude toward the upper surface of the holding surface 41 through a plurality of through holes 90 formed in the holding surface 41. The frame member 7 supports the plurality of lifting pins 6 from below and is disposed so as to overlap the holding surface 41 in plan view. The lifting pin drive section 8 is disposed at the outer peripheral portion of the frame member 7 in plan view. In addition, the lifting pin drive section 8 lifts the plurality of lifting pins 6 by lifting the frame member 7. Here, the lifting pin drive section 8 includes a drive source 8A, a drive force transmission mechanism 8B (or a drive force transmission mechanism 80B), and a plurality of lifting mechanisms 8C (or lifting mechanisms 80C). The drive force transmission mechanism 8B is disposed so as to extend along the circumference of the frame member 7 and transmits the drive force of the drive source 8A. The plurality of lifting mechanisms 8C are linked to the outer peripheral portion of the frame member 7 and the drive force transmission mechanism 8B and lift the frame member 7.

[0113] According to this structure, since the lifting pin drive section 8 can be disposed at a position sufficiently apart from the center of the substrate 3 in plan view, it is not necessary to intrude into the lower side of the substrate 3 when performing maintenance work of the drive source 8A or the lifting mechanism 8C or the like. Therefore, the maintenance work becomes easy. In addition, since the drive force transmission mechanism 8B formed so as to extend along the circumference of the frame member 7 transmits the drive force of the drive source 8A to the plurality of lifting mechanisms 8C, the frame member 7 as a whole can be lifted uniformly and stably via the plurality of lifting mechanisms 8C. In addition, since the plurality of lifting mechanisms 8C can be disposed sufficiently apart at the outer peripheral portion of the frame member 7, the plurality of lifting pins 6 supported by the frame member 7 can be lifted uniformly and stably.

[0114] Further, even if the other structures exemplified in the present specification are appropriately added to the above-described structure, that is, even if the other structures in the present specification that are not mentioned in the above-described structure are appropriately added, the same effects can be obtained.

[0115] Further, according to the above-described embodiment, the lift pin driving section 8 does not overlap the frame member 7 in plan view. According to this structure, by arranging the lift pin driving section 8 to be offset to the outer peripheral portion side of the frame member 7 in plan view, heat generated in the lift pin driving section 8 (particularly, the driving source 8A) is less likely to be trapped under the frame member 7. Particularly, in the case where a high-temperature process or a cooling process is performed on the holding surface 41, if the lift pin driving section 8 is arranged under the holding surface 41, the lift pin driving section 8 is likely to be affected by a sharp temperature change and to develop a failure. Therefore, this structure is effective. Further, by arranging the lift pin driving section 8 at a position that does not overlap the frame member 7, the lift pin driving section 8 can be arranged at the same height as the frame member 7, and thus the height of the structure of the substrate processing apparatus 1 can be reduced. Therefore, the safety of maintenance work is improved, and further, the safety can be improved when the substrate processing apparatus 1 is transported.

[0116] Further, according to the above-described embodiment, the lift pin driving section 8 does not overlap the holding surface 41 in plan view. According to this structure, by exposing the lift pin driving section 8 to the outside of the holding surface 41 in plan view, heat generated in the lift pin driving section 8 (particularly, the driving source 8A) can be effectively released. Further, by arranging the lift pin driving section 8 at a position that does not overlap the holding surface 41, the lift pin driving section 8 can be arranged at the same height as the holding surface 41. Therefore, the height of the structure of the substrate processing apparatus 1 can be reduced.

[0117] Further, according to the above-described embodiment, the driving force transmission mechanism 8B (or the driving force transmission mechanism 80B) is arranged so as to extend along different two circumferential directions of the frame member 7. According to this structure, the driving force from the driving source 8A is transmitted along multiple sides of the frame member 7 through the driving force transmission mechanism 8B. Therefore, the lift pins 6, and further the substrate 3, can be uniformly and stably lifted and lowered via the lift mechanisms 8C on the multiple sides.

[0118] <Modifications of the above-described embodiments>

[0119] In the above-described embodiments, the material, the material, the size, the shape, the relative arrangement, or the implementation conditions of each constituent element are sometimes described, but these are one example in all aspects and are not limiting.

[0120] Therefore, numerous modifications and equivalents can be assumed within the technical scope of the present application disclosed in this specification. For example, cases where at least one constituent element is transformed, added, or omitted are included.

[0121] In addition, in the above-described embodiments, in cases where a material name or the like is described without being particularly specified, other additives, such as an alloy or the like, are included in the material, unless there is a contradiction.

Claims

1. A substrate processing apparatus comprising: at least one hot plate; a plurality of lift pins each protruding from a plurality of through holes formed in an upper surface of the hot plate and supporting a substrate; a frame member supporting the plurality of lift pins from below, disposed so as to overlap the hot plate in plan view below the hot plate, and having a rectangular outer periphery; and a lift pin drive portion disposed in an outer peripheral portion of the frame member in plan view and configured to raise and lower the plurality of lift pins by raising and lowering the frame member, and the lift pin drive portion includes: a rotary drive motor disposed outside the frame member; at least one shaft disposed so as to extend along a circumferential direction of the frame member and rotate in linkage with driving of the rotary drive motor; and a lift mechanism configured to cause a plurality of pinions provided to the shaft to engage with a plurality of racks provided to an outer peripheral portion of the frame member, respectively, and raise and lower the frame member by rotation of the shaft by driving of the rotary drive motor.

2. The substrate processing apparatus according to claim 1, wherein the lift pin drive portion does not overlap the frame member in plan view.

3. The substrate processing apparatus according to claim 1 or 2, wherein the lift pin drive portion does not overlap the hot plate in plan view.

4. The substrate processing apparatus according to claim 1 or 2, wherein the at least one shaft is disposed so as to extend along different two circumferential directions of the frame member. ​

Images