uniform temperature plate

Abstract

The present application provides a vapor chamber, which includes a substrate, a flow guide layer and a plurality of liquid channels. The flow guide layer is disposed on the substrate and has a first opening and a second opening. At least one liquid channel is formed between the substrate and the flow guide layer. The vapor chamber defines an evaporation area corresponding to a heat source and at least one condensation area. The size of the first opening corresponding to the evaporation area and the condensation area is different from the size of the second opening corresponding to a non-evaporation area and a non-condensation area.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation, and in particular to a vapor chamber. BACKGROUND

[0002] According to the modernization needs, computers and various electronic devices are developed rapidly and their performance is constantly improved. However, in this process, the heat dissipation problem caused by high-performance hardware also comes. Generally, computers and various electronic devices usually use heat dissipation elements to dissipate heat, such as using thermal paste or heat sink to attach to the electronic components to be cooled to absorb and dissipate heat. However, this kind of heat dissipation method has limited effect, so a heat dissipation element using phase change of working fluid to promote heat conduction is developed.

[0003] The heat dissipation element described above uses the phase change and flow direction of the working fluid to achieve the purpose of heat transfer, such as the flow direction of the working fluid on the capillary structure and the flow direction of the vapor flow after the working fluid becomes vapor are opposite to each other, but it is a circulating direction. However, the existing heat dissipation element still has the problem that the working fluid and the vapor flow flow in the same channel space and easily interfere with each other, especially when the shear stress of the vapor flow is greater than the surface tension of the working fluid, the working fluid at the interface will scatter, or even the working fluid entrains the vapor flow and flows back in the opposite direction, resulting in poor heat transfer efficiency.

[0004] Therefore, how to provide a vapor chamber that can solve the above problems is one of the urgent problems to be overcome in the industry at present. SUMMARY

[0005] An object of the present application is to provide a vapor chamber, which can make the working fluid flow in the liquid channel and the gas flow channel respectively without interfering with each other, so as to improve the blocking and heat transfer efficiency.

[0006] The present application provides a vapor chamber, which is defined with an evaporation area corresponding to a heat source and at least one condensation area. The vapor chamber comprises a first substrate, a flow guide layer, a plurality of liquid channels, a second substrate, and a working fluid. The flow guide layer is disposed on the first substrate and has a plurality of first openings and a plurality of second openings. The plurality of first openings are located corresponding to the evaporation area and the condensation area, and the plurality of second openings are located not corresponding to the evaporation area and the condensation area. The plurality of first openings have different sizes from the plurality of second openings. The plurality of liquid channels are formed between the first substrate and the flow guide layer. The second substrate is disposed above the flow guide layer to form an airflow channel between the flow guide layer and the second substrate. The working fluid is filled in the plurality of liquid channels. The working fluid is vaporized after absorbing heat from the heat source in the evaporation area, and the vaporized working fluid moves along the airflow channel to the condensation area through each of the first openings corresponding to the evaporation area, and is condensed and liquefied in the condensation area. The liquefied working fluid flows back to the evaporation area along the plurality of liquid channels after passing through each of the first openings corresponding to the condensation area.

[0007] In the foregoing vapor chamber, the arrangement density of the plurality of first openings is greater than the arrangement density of the plurality of second openings.

[0008] In the foregoing vapor chamber, the ratio of the aperture of the plurality of first openings to the spacing between the plurality of first openings is 1:1.

[0009] In the foregoing vapor chamber, the ratio of the aperture of the plurality of second openings to the spacing between the plurality of second openings ranges from 1:2 to 1:4.

[0010] In the foregoing vapor chamber, the size of the plurality of first openings is greater than the size of the plurality of second openings.

[0011] In the foregoing vapor chamber, the aperture of the plurality of first openings ranges from 0.01 mm to 0.3 mm, and the aperture of the plurality of second openings ranges from 0.005 mm to 0.2 mm.

[0012] In the foregoing vapor chamber, the plurality of liquid channels are a plurality of grooves recessed on the surface of the first substrate, or are a granular sintered body, a metal mesh body, or a combination thereof.

[0013] In the foregoing vapor chamber, the width of the plurality of grooves ranges from 0.03 mm to 0.3 mm, and the depth of the plurality of grooves ranges from 0.01 mm to 0.15 mm.

[0014] In the foregoing vapor chamber, the plurality of grooves are formed by wet etching.

[0015] In the foregoing vapor chamber, the plurality of grooves are long strip-shaped, arc-shaped, square-shaped, or have a directional shape.

[0016] In the aforementioned vapor chamber, the width of the portion corresponding to the condensation region is greater than the width of the portion corresponding to the evaporation region.

[0017] In the aforementioned vapor chamber, the thickness of the flow guide layer is in the range of 0.005 mm to 0.05 mm.

[0018] In the aforementioned vapor chamber, at least one film layer having a plurality of through holes is further included, which is disposed between the flow guide layer and the first substrate, wherein the size of the plurality of through holes corresponding to the positions of the plurality of first openings is greater than the size of the corresponding plurality of first openings.

[0019] In the aforementioned vapor chamber, a plurality of film layers are further included, which are stacked with each other between the flow guide layer and the first substrate, wherein each of the plurality of film layers has a plurality of through holes, and the plurality of through holes of one of the plurality of film layers are not completely aligned with the plurality of through holes of another of the plurality of film layers.

[0020] In the aforementioned vapor chamber, the plurality of through holes are cross-shaped, triangle-shaped, star-shaped, regular polygon-shaped, or irregular polygon-shaped.

[0021] In the aforementioned vapor chamber, at least one film layer is further included, which is disposed between the flow guide layer and the second substrate and contacts the flow guide layer and the second substrate, wherein the airflow passage is provided in the film layer.

[0022] Another object of the present application is to provide a vapor chamber, comprising: a substrate; a flow guide layer disposed on the substrate and having first openings and second openings; and at least one liquid passage formed between the substrate and the flow guide layer; wherein the vapor chamber defines an evaporation region corresponding to a heat source, at least one condensation region, and at least one adiabatic region between the evaporation region and the condensation region; wherein the positions of the first openings correspond to the evaporation region and the condensation region, the positions of the second openings correspond to the adiabatic region, and the size of the first openings is different from the size of the second openings.

[0023] In the aforementioned vapor chamber, the arrangement density of the first openings is greater than the arrangement density of the second openings.

[0024] In the aforementioned vapor chamber, the ratio of the aperture of the first openings to the spacing between the first openings is 1:1.

[0025] In the aforementioned vapor chamber, the ratio of the aperture of the second openings to the spacing between the second openings is in the range of 1:2 to 1:4.

[0026] In the aforementioned vapor chamber, the aperture of the first openings is greater than the aperture of the second openings.

[0027] In the aforementioned vapor chamber, the first opening has a diameter ranging from 0.01 mm to 0.3 mm, and the second opening has a diameter ranging from 0.005 mm to 0.2 mm.

[0028] In the aforementioned vapor chamber, the liquid passage is a groove recessed in the surface of the substrate, or is a sintered granular body, a metal mesh body, or a combination thereof.

[0029] In the aforementioned vapor chamber, the groove has a width ranging from 0.03 mm to 0.3 mm, and a depth ranging from 0.01 mm to 0.15 mm.

[0030] In the aforementioned vapor chamber, the groove is formed by wet etching.

[0031] In the aforementioned vapor chamber, the groove has a shape of a long strip, an arc, a square, or a shape with a directionality.

[0032] In the aforementioned vapor chamber, the shape with the directionality has a width of a portion corresponding to the condensation region that is greater than a width of a portion corresponding to the evaporation region.

[0033] In the aforementioned vapor chamber, the flow guide layer has a thickness ranging from 0.005 mm to 0.05 mm.

[0034] In the aforementioned vapor chamber, at least one film layer having through holes is further included between the flow guide layer and the substrate, wherein a diameter of a through hole corresponding to a position of the first opening is greater than a diameter of the first opening corresponding thereto.

[0035] In the aforementioned vapor chamber, a plurality of film layers are further included, which are stacked on each other between the flow guide layer and the substrate, wherein each of the plurality of film layers has a plurality of through holes, and a plurality of through holes of one of the plurality of film layers are not completely aligned with a plurality of through holes of another of the plurality of film layers.

[0036] In the aforementioned vapor chamber, the plurality of through holes are in a shape of a cross, a triangle, a star, a regular polygon, or an irregular polygon.

[0037] In the aforementioned vapor chamber, at least one film layer is further included on the flow guide layer, wherein an airflow passage is provided in the film layer. BRIEF DESCRIPTION OF DRAWINGS

[0038] FIG. 1A A schematic diagram of the use of the vapor chamber of the present application.

[0039] FIG. 1B A schematic diagram of the exploded view of the vapor chamber of the present application.

[0040] FIG. 2 A schematic diagram of the cross-sectional view of the vapor chamber of the present application.

[0041] FIG. 3 A schematic view of a surface of a flow guide layer in a vapor chamber according to the present invention.

[0042] FIG. 4 A schematic view of a first opening of a flow guide layer in a vapor chamber according to the present invention.

[0043] FIG. 5 A schematic view of a second opening of a flow guide layer in a vapor chamber according to the present invention.

[0044] FIG. 6A to FIG. 6B A schematic view of a partial top view of different embodiments of a liquid channel in a vapor chamber according to the present invention.

[0045] FIG. 7 A schematic view of a cross section of another embodiment of a vapor chamber according to the present invention.

[0046] FIG. 8A A schematic view of an exploded view of an embodiment of a plurality of membrane layers in a vapor chamber according to the present invention.

[0047] FIG. 8B and FIG. 8C A schematic view of a through hole corresponding to a plurality of membrane layers in a vapor chamber according to the present invention before and after stacking.

[0048] FIG. 9A A schematic view of a cross section of yet another embodiment of a vapor chamber according to the present invention.

[0049] FIG. 9B A schematic view of a top view of a membrane layer in FIG. 9A

[0050] The reference signs are as follows:

[0051] 1: vapor chamber

[0052] 11: first substrate

[0053] 111: evaporation zone

[0054] 112: condensation zone

[0055] 113: thermal insulation zone

[0056] 114: liquid channel

[0057] 115, 115A, 115B: column

[0058] 12: flow guide layer

[0059] 121: first opening

[0060] 122: second opening

[0061] 13: second substrate

[0062] 131, 181: air flow channel ​

[0063] 132: support column

[0064] 133: inner surface

[0065] 14: working fluid

[0066] 141: liquefied working fluid

[0067] 142: vaporized working fluid

[0068] 15, 16, 17, 18: thin film layer

[0069] 151, 152, 161, 171, 161', 171': through hole

[0070] 1611, 1612, 1613, 1614, 1711, 1712, 1713, 1714: end portion

[0071] 2: heat source

[0072] D1, D2: pore diameter

[0073] P1, P2: pitch DETAILED DESCRIPTION

[0074] The present application is described in detail by specific embodiments, and other advantages and effects of the present application can be easily understood by those skilled in the art from the contents disclosed in the present specification, and the present application can be implemented or applied by other different embodiments.

[0075] Please refer to FIG. 1A , FIG. 1B , FIG. 2 and FIG. 3 , the uniform temperature plate 1 of the present application includes a first substrate 11, a flow guide layer 12 and a second substrate 13, and the uniform temperature plate 1 of the present application can contact at least one heat source 2, and the uniform temperature plate 1 can define an evaporation area 111 corresponding to the heat source 2 and at least one condensation area 112, and a heat insulation area 113 except the evaporation area 111 and the condensation area 112. The following is described by one heat source 2, one evaporation area 111, one condensation area 112 and one heat insulation area 113, but the present application is not limited thereto. It is to be noted that, FIG. 2 the column 115 and the support column 132 in FIG. 1B are omitted, and the purpose is to clearly show the flow direction of the working fluid 14.

[0076] A plurality of liquid channels 114 can be formed between the first substrate 11 and the flow guide layer 12 to fill the working fluid 14. In one embodiment, the liquid channels 114 can be formed by a sintered particle body, a metal mesh body, a groove, or a combination thereof. The sintered particle body refers to a structure or organization formed by sintering metal powder to have a plurality of capillary pores or interconnected pores. The metal mesh body refers to a woven mesh formed by weaving metal to have a plurality of mesh purposes. In addition, as shown in FIG. 1, the groove refers to a plurality of columns 115 etched on the surface of the first substrate 11 by wet etching. The gaps between the columns 115 can constitute a plurality of interconnected grooves to allow the working fluid 14 to fill therein. FIG. 1B

[0077] In one embodiment, the width of the groove (i.e., the interval between the columns 115) ranges from 0.03 mm to 0.3 mm, and the depth of the groove (i.e., the height of the columns 115 or the depth of the recess from the surface of the first substrate 11) ranges from 0.01 mm to 0.15 mm. However, the present application is not limited thereto, and the present application is also not limited to the number of grooves (i.e., the number of columns).

[0078] In another embodiment, the vapor chamber 1 of the present application can have grooves with different widths and depths according to requirements. For example, a plurality of grooves with a smaller width (e.g., 0.05 to 0.1 mm) can be provided, and a groove with a larger width (e.g., 0.1 to 0.5 mm) can be specifically provided. The groove with the larger width can accommodate more working fluid 14, and the grooves with the smaller width can provide stronger capillary force to increase the transmission efficiency. As shown in FIG. 2, the width between the columns 115A (or the columns 115B) is smaller, and the width between the columns 115A and the columns 115B is larger. FIG. 6A

[0079] In another embodiment, the width and the depth of the groove can be different according to the total thickness of the first substrate 11. For example, when the total thickness of the first substrate 11 is 0.05 to 0.1 mm, the width of the groove can range from 0.05 mm to 0.2 mm, and the depth of the groove can range from 0.03 mm to 0.08 mm. When the total thickness of the first substrate 11 is 0.12 to 0.2 mm, the width of the groove can range from 0.08 mm to 0.3 mm, and the depth of the groove can range from 0.05 mm to 0.15 mm. When the total thickness of the first substrate 11 is 0.02 to 0.05 mm, the width of the groove can range from 0.03 mm to 0.1 mm, and the depth of the groove can range from 0.01 mm to 0.04 mm. However, the present application is not limited to the above-mentioned total thickness of the first substrate 11 and the width and the depth of the groove.

[0080] ​​In another embodiment, the liquid channel 114 can be implemented in various different ways. For example... FIG. 6B As shown, the liquid channel 114 can also have a directional shape, such as a trapezoid, where the width of the portion of the liquid channel 114 corresponding to the condensation zone 112 (the width between columns 115A and 115B) is greater than the width of the portion corresponding to the evaporation zone 111 (the width between columns 115A and 115B). This allows the working fluid 14 in the condensation zone 112 to flow more easily to the evaporation zone 111. Alternatively, the liquid channel 114 can also be elongated, arc-shaped, or square, etc., simply by different arrangements of the columns 115, but the present invention is not limited thereto.

[0081] A flow guiding layer 12 is disposed on a first substrate 11 and a liquid channel 114, and has a plurality of first openings 121 and a plurality of second openings 122, both of which penetrate both surfaces of the flow guiding layer 12. In one embodiment, the first openings 121 and second openings 122 can be formed using processes such as etching, laser engraving, or punching to create a mesh structure in the flow guiding layer 12, but this invention is not limited thereto. Furthermore, the positions of the first openings 121 correspond to the evaporation zone 111 and the condensation zone 112, while the positions of the second openings 122 correspond to the insulation zone 113; that is, the second openings 122 are not located in either the evaporation zone 111 or the condensation zone 112. Additionally, the size (aperture) of the first openings 121 is different from the size (aperture) of the second openings 122.

[0082] In one embodiment, the size (diameter) of the first opening 121 is larger than the size (diameter) of the second opening 122. For example, the diameter of the first opening 121 can range from 0.01 mm to 0.3 mm, while the diameter of the second opening 122 can range from 0.005 mm to 0.2 mm, allowing the first opening 121 to be permeable to air and water, while the second opening 122 is permeable to air but not to water. However, this invention is not limited thereto. Additionally, the thickness of the flow guiding layer 12 can range from 0.005 mm to 0.05 mm, preferably less than 0.025 mm, but this invention is not limited thereto.

[0083] In one embodiment, the density of the first opening 121 on the first substrate 11 may be greater than the density of the second opening 122 on the first substrate 11. For example, the density of the first opening 121 corresponding to the evaporation zone 111 may be greater than the density of the second opening 122 corresponding to the insulation zone 113. Furthermore, the density of the first opening 121 corresponding to both the evaporation zone 111 and the condensation zone 112 may be greater than the density of the second opening 122 corresponding to the insulation zone 113 simultaneously, or the density of the first opening 121 corresponding to only one of the evaporation zone 111 and the condensation zone 112 may be greater than the density of the second opening 122 corresponding to the insulation zone 113; the present invention is not limited thereto.

[0084] Referring to FIG. 4 , the arrangement density of the first openings 121 can be determined by the diameter of the first openings 121 and the distance between the first openings 121, for example, the ratio of the diameter D1 of the first openings 121 to the distance P1 between the first openings 121 is 1:1, but the present application is not limited thereto.

[0085] Referring to FIG. 5 , the arrangement density of the second openings 122 can be determined by the diameter of the second openings 122 and the distance between the second openings 122, for example, the ratio of the diameter D2 of the second openings 122 to the distance P2 between the second openings 122 ranges from 1:2 to 1:4, but the present application is not limited thereto.

[0086] The second substrate 13 is arranged on the flow guide layer 12, and since the inner surface 133 of the second substrate 13 is formed with a plurality of support columns 132 recessed from the inner surface 133, an airflow passage 131 can be formed between the flow guide layer 12 and each support column 132 of the second substrate 13. In an embodiment, as shown in FIG. 1B and FIG. 2 , the second substrate 13 can be placed on the first substrate 11 and abut the flow guide layer 12 with the support columns 132, so that a portion of the second substrate 13 seals a portion of the first substrate 11, so that the working fluid 14 can be completely sealed in the liquid passage 114, and the support columns 132 have the function of strengthening the support of the airflow passage 131.

[0087] In an embodiment, the materials of the first substrate 11 and the second substrate 13 can be high-thermal-conductivity metals such as copper, silver, aluminum, steel, titanium or alloys thereof, stainless steel, etc., and the material of the flow guide layer 12 can be a high-temperature-resistant material such as pure copper, copper alloy, graphite, etc., but the present application is not limited thereto. If the materials of the first substrate 11, the second substrate 13 and the flow guide layer 12 are all copper, they can also be fused into one body by sintering.

[0088] In use, the uniform temperature plate 1 of the present application, as shown in FIG. 2 , the working fluid 14 is vaporized after absorbing the heat of the heat source 2 in the evaporation area 111, and the vaporized working fluid 142 reaches the airflow passage 131 through the first openings 121 corresponding to the evaporation area 111, and moves along the airflow passage 131 to the condensation area 112. Then, the vaporized working fluid 142 can be condensed (wait to cool down) in the condensation area 112 and liquefied on the surface of the flow guide layer 12, and the liquefied working fluid 141 can be sucked into the first openings 121 of the flow guide layer in the condensation area 112 by the action of surface tension and then reach the liquid passage 114, and then flow back to the evaporation area 111 along the liquid passage 114 and can be heated and vaporized again to complete a whole heat dissipation cycle.

[0089] In one embodiment, the number of condensation zones 112 can be set according to the usage condition, and the number of evaporation zones 111 can be set according to the number of heat sources 2, as long as the liquid passages 114 and the air flow passages 131 are connected between the condensation zones 112 and the evaporation zones 111. The present application is not limited thereto.

[0090] Please refer to FIG. 7 , the heat spreader 1 of the present application can further include at least one film layer 15 disposed between the flow guide layer 12 and the first substrate 11, and having a plurality of through holes 151, 152. The size of the through hole 151 corresponding to the position of the first opening 121 is greater than the size of the corresponding first opening 121, and the size of the through hole 152 corresponding to the position of the second opening 122 can be approximately equal to the size of the corresponding second opening 122. In this way, the working fluid 14 in the evaporation zone 111 can first pass through the larger through hole 151 and then enter the relatively smaller first opening 121, which is conducive to capillary phenomenon (i.e. the through hole 151 as an extension of the liquid passage 114 in the evaporation zone 111). Similarly, the working fluid 14 in the condensation zone 112 that has been vaporized, after condensation and liquefaction, first passes through the smaller first opening 121 and then enters the relatively larger through hole 151, and finally reaches the liquid passage 114, which will be conducive to condensation phenomenon (i.e. the through hole 151 as an extension of the liquid passage 114 in the condensation zone 112). In this embodiment, the film layer 15 can be one or more layers, and the material can be pure copper, copper alloy, graphite, etc. high-temperature resistant material, and the material and thickness of the film layer 15 can be the same as or different from the flow guide layer 12, but the present application is not limited thereto. In the case of multiple layers, the size of the through hole in the film layer adjacent to the first substrate 11 will be greater than the size of the through hole in the film layer away from the first substrate 11, so that the through holes in each layer of the film layer present a pyramid structure to enhance capillary phenomenon and condensation phenomenon, and can also have a supporting effect. The through holes 151, 152 are formed using etching, laser engraving, punching, etc. but the present application is not limited thereto.

[0091] Please refer to FIG. 8A , FIG. 8B and FIG. 8C , which are different embodiments of the heat spreader 1 shown in FIG. 7 , and FIG. 8A only draw the differences from FIG. 7 , i.e. only draw the film layers 16, 17 and the flow guide layer 12. In other words, in this embodiment, the film layer 16, 17 replaces the film layer 15 in FIG. 7 , and the rest of the structure is the same as FIG. 7And not draw and repeat, wherein the film layer 16, 17 is not limited to 2 layers, but also can be 3 layers or more, the material can be pure copper, copper alloy, graphite and other high temperature resistant materials, and the material and thickness of the film layer 16, 17 can be the same or different from the flow guide layer 12, but the present application is not limited to this. In this embodiment, the film layer 16, 17 is stacked between the flow guide layer 12 and the first substrate 12, and the film layer 16, 17 has a plurality of through holes 161, 171, the plurality of through holes 161 penetrates the upper and lower surfaces of the film layer 16, the plurality of through holes 171 penetrates the upper and lower surfaces of the film layer 17, and the through hole 161 is not completely aligned or partially overlaps the through hole 171 and the first opening 121 and the second opening 122 of the flow guide layer 12. In detail, as shown in FIG. 8B and FIG. 8C The through hole 161 has end portions 1611, 1612, 1613, 1614, and the through hole 171 has end portions 1711, 1712, 1713, 1714, and the aforementioned so-called through hole 161 is not completely aligned or partially overlaps the through hole 171, which means that the through hole 161 does not completely coincide with the through hole 171, as shown in FIG. 8C The through hole 161 only partially communicates with the end portion 1714 of the through hole 171, and the through hole 161 only partially communicates with the end portion 1713 of the through hole 171, which makes the path of the liquid channel 114 to the flow guide layer 12 longer, which is beneficial for storing more working fluid 14. In addition, the through hole 171 can also communicate with the end portion of other through holes 161', and the through hole 161 can also communicate with other through holes 171', in other words, the through holes 161, 171 can simultaneously communicate with multiple other through holes to increase the path of the liquid channel 114 to the flow guide layer 12. In addition, the through hole 161 is also not completely aligned or partially overlaps the first opening 121 and the second opening 122 of the flow guide layer 12, for example, the size of the through hole 161 can be larger than the size of the first opening 121 or the second opening 122, or a single through hole 161 can correspond to multiple first openings 121 or multiple second openings 122 at the same time (for example, the end portions 1611, 1612, 1613, 1614 of the through hole 161 correspond to different first openings 121 or second openings 122, etc.), but the present application is not limited to this.

[0092] In the above embodiment, the through holes 161, 171 are formed by etching, laser engraving, punching and other processes, the aperture of the through holes 161, 171 is larger than the first opening 121, and the aperture of the through holes 161, 171 is the same or the aperture of the through hole 171 is larger than the aperture of the through hole 161, but the present application is not limited to this.

[0093] In the above embodiment, the through holes 161, 171 are taken as an example in the form of a cross, but the present application is not limited to this, the through holes 161, 171 can also be triangular, star-shaped, regular polygonal or irregular polygonal.

[0094] Please refer to FIG. 9A and FIG. 9B which are another embodiment of the present application. Compared with the embodiment shown in FIG. 2 , the embodiment of FIG. 9A is substantially the same as the embodiment of FIG. 2 , except that a film layer 18 is further arranged between the flow guide layer 12 and the second substrate 13, and the inner surface 133 of the second substrate 13 is no longer provided with the support column 132. Since the support column 132 is no longer arranged, the film layer 18 contacts the flow guide layer 12 and the second substrate 13, and has the airflow passage 181 arranged therein. In this way, the film layer 18 can have the function of supporting the airflow passage 181, wherein the airflow passage 181 can be formed by the granular sintered body, the metal mesh body, the groove, or a combination thereof. In the embodiment, the width of the airflow passage 181 shown in FIG. 9B can be 2 mm, and the number can be multiple (not limited to three in FIG. 9B ), but the present application is not limited thereto.

[0095] In an embodiment, the film layer 18 can be a single layer or multiple layers, but the present application is not limited thereto. In the embodiment of the multiple-layer film layer 18, the airflow passage 181 can be formed by the through holes in the multiple-layer film layer 18 that are in communication with each other. In addition, the heat spreader 1 of the present application can simultaneously use the embodiments of FIG. 7 , FIG. 8A and FIG. 9A , that is, the heat spreader 1 simultaneously has any combination of the film layers 15, 16, 17, and 18, but the present application is not limited thereto. Furthermore, the flow guide layer 12 and the film layers 15, 16, 17, and 18 of the present application are sheet-shaped materials (thin sheets), but the present application is not limited thereto.

[0096] The thinning design of the flow guide layer 12 in the heat spreader 1 of the various embodiments of the present application can reduce the thickness of the heat spreader 1 to less than 0.25 mm, preferably less than 0.2 mm, but the present application is not limited thereto.

[0097] The different sizes of the openings in the flow guide layer of the heat spreader of the present application are designed to have larger and denser first openings in the evaporation and condensation zones to allow the working fluid to vaporize and condense and to pass through the first openings, and to have smaller and sparser second openings in the non-evaporation and non-condensation zones to prevent the vaporized or condensed working fluid from passing through the second openings. This effectively allows the working fluid to flow in the liquid channel and the gas flow channel without interfering with each other, and improves the barrier and heat transfer efficiency, so that the non-evaporation and non-condensation zones are closer to the theoretical adiabatic zone. In addition, since the flow guide layer is directly arranged on the liquid channel, the size of the groove can be smaller to provide stronger capillary force, and excessive working fluid can not be removed during the vacuum pumping stage, improving the practicability.

[0098] The above embodiments are only illustrative of the technical principles, characteristics and effects of the present application, and are not intended to limit the implementation scope of the present application. Those skilled in the art can modify and change the above embodiments without departing from the spirit and scope of the present application. Any equivalent modifications and changes made by using the teachings of the present application are still covered by the scope of the claims of the present application. The protection scope of the present application should be as listed in the claims.

Claims

1. A vapor chamber, comprising an evaporation zone corresponding to a heat source and at least one condensation zone, characterized in that, The vapor chamber includes: First substrate; A flow guiding layer is disposed on the first substrate and has a plurality of first openings and a plurality of second openings, wherein the positions of the plurality of first openings correspond to the evaporation zone and the condensation zone, and the positions of the plurality of second openings do not correspond to the evaporation zone and the condensation zone. Multiple liquid channels are formed between the first substrate and the flow guiding layer; A second substrate is disposed above the flow guiding layer to form an airflow channel between the flow guiding layer and the second substrate; and The working fluid is filled in the plurality of liquid channels. The working fluid absorbs heat from the heat source in the evaporation zone and then vaporizes. The vaporized working fluid moves to the condensation zone through each of the first openings corresponding to the evaporation zone along the airflow channel. In the condensation zone, the working fluid is condensed and liquefied. The liquefied working fluid flows back to the evaporation zone through each of the first openings corresponding to the condensation zone along the plurality of liquid channels. Wherein, the density of the plurality of first openings is greater than the density of the plurality of second openings, or the size of the first opening is greater than the size of the second opening.

2. The temperature distribution plate as described in claim 1, characterized in that, When the density of the plurality of first openings is greater than the density of the plurality of second openings, the ratio of the aperture of the plurality of first openings to the spacing between the plurality of first openings is 1:

1.

3. The temperature distribution plate as described in claim 1, characterized in that, When the density of the plurality of first openings is greater than the density of the plurality of second openings, the ratio of the aperture of the plurality of second openings to the spacing between the plurality of second openings is in the range of 1:2 to 1:

4.

4. The temperature distribution plate as described in claim 1, characterized in that, When the size of the first opening is larger than the size of the second opening, the diameter of the first opening ranges from 0.01 mm to 0.3 mm, and the diameter of the second opening ranges from 0.005 mm to 0.2 mm.

5. The temperature distribution plate as described in claim 1, characterized in that, The multiple liquid channels are multiple grooves recessed on the surface of the first substrate, or are sintered particles, metal mesh, or a combination thereof.

6. The temperature distribution plate as described in claim 5, characterized in that, The width of the plurality of grooves ranges from 0.03 mm to 0.3 mm, and the depth of the plurality of grooves ranges from 0.01 mm to 0.15 mm.

7. The temperature distribution plate as described in claim 5, characterized in that, These multiple trenches were formed by wet etching.

8. The temperature distribution plate as described in claim 5, characterized in that, The multiple grooves are elongated, arc-shaped, square, or trapezoidal, with the width of the portion corresponding to the condensation zone being greater than the width of the portion corresponding to the evaporation zone.

9. The temperature distribution plate as described in claim 1, characterized in that, The thickness of the flow guide layer ranges from 0.005 mm to 0.05 mm.

10. The temperature distribution plate as described in claim 1, characterized in that, The heat spreader also includes at least one thin film layer with multiple through holes, which is disposed between the flow guiding layer and the first substrate, wherein the size of the multiple through holes corresponding to the positions of the multiple first openings is larger than the size of the corresponding multiple first openings.

11. The temperature distribution plate as described in claim 1, characterized in that, The heat spreader also includes multiple thin film layers stacked between the flow guide layer and the first substrate, wherein each of the multiple thin film layers has multiple through holes, and the multiple through holes of one of the multiple thin film layers are not completely aligned with the multiple through holes of another of the multiple thin film layers.

12. The temperature distribution plate as described in claim 11, characterized in that, These multiple through holes are either cross-shaped or regular polygonal.

13. The temperature distribution plate as described in claim 1, characterized in that, The heat spreader also includes at least one thin film layer disposed between the flow guide layer and the second substrate and in contact with the flow guide layer and the second substrate, wherein the thin film layer is provided with the airflow channel.

14. A heat spreader, characterized in that, The vapor chamber includes: substrate; A flow guiding layer is disposed on the substrate and has a plurality of first openings and a plurality of second openings; At least one liquid channel is formed between the substrate and the flow guiding layer; and The working fluid fills the liquid channel; The vapor chamber is defined as having an evaporation zone corresponding to a heat source, at least one condensation zone, and at least one insulation zone between the evaporation zone and the condensation zone. The first opening is located in the evaporation zone and the condensation zone, and the second opening is located in the insulation zone. Wherein, the density of the plurality of first openings is greater than the density of the plurality of second openings, or the diameter of the first opening is greater than the diameter of the second opening; The working fluid absorbs heat from the heat source in the evaporation zone and then vaporizes. The vaporized working fluid moves to the condensation zone through the first opening corresponding to the evaporation zone, where it condenses and liquefies. The liquefied working fluid then flows back to the evaporation zone through the first opening corresponding to the condensation zone and along the liquid channel.

15. The temperature distribution plate as described in claim 14, characterized in that, When the density of the plurality of first openings is greater than the density of the plurality of second openings, the ratio of the diameter of the first opening to the spacing between the first openings is 1:

1.

16. The temperature distribution plate as described in claim 14, characterized in that, When the density of the plurality of first openings is greater than the density of the plurality of second openings, the ratio of the diameter of the second opening to the distance between the second openings is in the range of 1:2 to 1:

4.

17. The temperature distribution plate as described in claim 14, characterized in that, When the size of the first opening is larger than the size of the second opening, the diameter of the first opening ranges from 0.01 mm to 0.3 mm, and the diameter of the second opening ranges from 0.005 mm to 0.2 mm.

18. The temperature distribution plate as described in claim 14, characterized in that, The liquid channel is a groove recessed into the surface of the substrate, or a sintered particulate body, a metal mesh, or a combination thereof.

19. The temperature distribution plate as described in claim 18, characterized in that, The width of the trench ranges from 0.03 mm to 0.3 mm, and the depth of the trench ranges from 0.01 mm to 0.15 mm.

20. The temperature distribution plate as described in claim 18, characterized in that, The trench was formed by wet etching.

21. The temperature distribution plate as described in claim 18, characterized in that, The groove can be elongated, arc-shaped, square, or trapezoidal, with the width of the portion corresponding to the condensation zone being greater than the width of the portion corresponding to the evaporation zone.

22. The temperature distribution plate as described in claim 14, characterized in that, The thickness of the flow guide layer ranges from 0.005 mm to 0.05 mm.

23. The temperature distribution plate as described in claim 14, characterized in that, The heat spreader also includes at least one thin film layer with through holes, which is disposed between the flow guiding layer and the substrate, wherein the diameter of the through hole corresponding to the position of the first opening is larger than the diameter of the corresponding first opening.

24. The temperature distribution plate as described in claim 14, characterized in that, The heat spreader also includes multiple thin film layers stacked between the flow guide layer and the substrate, wherein each of the multiple thin film layers has multiple through holes, and the multiple through holes of one of the multiple thin film layers are not completely aligned with the multiple through holes of another of the multiple thin film layers.

25. The temperature distribution plate as described in claim 24, characterized in that, These multiple through holes are either cross-shaped or regular polygonal.

26. The temperature distribution plate as described in claim 14, characterized in that, The heat spreader also includes at least one thin film layer disposed on the flow guide layer, wherein the thin film layer has an airflow channel.

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