A laser sputtering atom generating device
Through the integrated design of laser sputtering atom generation device, the long-distance collimation and optical path occupation problems caused by the separation of laser and target materials and the peripheral optical path occupation of ion traps are solved, and compact optical path layout and efficient atomic beam direction control are achieved, meeting the usage requirements of ultra-low temperature vacuum environments.
Patent Information
- Application Number
- CN202111454873.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-12-02
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2041-12-02
AI Technical Summary
In the existing laser sputtering atom generation device, the long-distance collimation problem caused by the relative separation of laser light from the target material and the excessive occupation of laser incident position around the ion trap affects the stability and space utilization of the ion trap.
The integrated design is adopted to integrate the laser channel, atomic emission channel, target material and fiber optic interface into one shell. The laser light is directed into the atomic emission channel with a mirror, and the optical path adjustment is performed through the fiber coupler, collimator and mirror to ensure that the laser illuminates the target material vertically. Combining the focus lens and adjustable mirror angle, a compact optical path layout is achieved.
It solves the long-distance collimation problem caused by the separation of laser and target materials, reduces the occupation of optical paths around the ion trap, avoids the pollution of stray atomic beams on the ion imprisonment device, meets the use requirements of ultra-low temperature vacuum environment, and has a compact structure, small size and easy to use.
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Figure CN113921372B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of quantum technology, and in particular to a laser sputtering atom generating device. Background Art
[0002] In trapped ion devices such as ion traps, the generation and loading of ions is an important step, including three processes: atom generation, atomic ionization, and ion capture. There are generally two methods for the generation of atoms. One is the heating method, which is to heat the material containing the target atoms so that the target atoms escape from the material to form atomic vapor, and then transport them to the ion trapping device through a directional channel. The other is the laser sputtering method, which is to use a pulsed laser to irradiate and ablate the target material containing the target atoms to excite the target atoms. Since the ion trapping device generally needs to be placed in an ultra-high vacuum chamber to isolate the influence of the outside world and ensure the stability of the trapped ions, and the atom generation device needs to be as close to the ion trapping device as possible to ensure that the ions can be captured quickly and efficiently by the ion trapping device, the atom generation device needs to be enclosed in the vacuum chamber together with the ion trapping device. In a vacuum chamber that uses ultra-low temperature technology to obtain ultra-high vacuum, the atom generation device using the heating method will generate a large heat load, destroy the ultra-low temperature environment, and make it difficult to ensure the vacuum degree. However, there are three problems with the traditional laser sputtering atomic generation device: 1. The atomic beam generated by laser sputtering is emitted irregularly in all directions, and the confinement area of the ion trapping device (such as ion trap) is very small, so most atoms will not be trapped, fly into the free space or attach to the surface of the ion trap electrode, causing contamination of the ion trap electrode and causing electrode failure. The shielding layer method is not compact enough and takes up too much space. 2. The laser source required for laser sputtering is generally set outside the vacuum chamber, enters the vacuum chamber through the laser vacuum window and irradiates the target material. The distance is long and the laser alignment is difficult. 3. In order to improve the efficiency of atomic generation and capture, it is generally necessary to make the laser irradiate the target surface as vertically as possible. Therefore, the laser source and the target material need to be set relatively on both sides of the ion trap. In scenarios where laser detection and manipulation of ions are required, this method occupies too many laser incident positions. Summary of the invention
[0003] In order to overcome the deficiencies of the prior art, the purpose of the present invention is to provide a laser sputtering atom generating device to solve the long-distance alignment problem caused by the relative separation of the laser and the target material and the problem of excessive occupation of the laser incident positions around the ion trap.
[0004] The purpose of the present invention is achieved by the following technical solutions:
[0005] A laser sputtering atom generating device includes a housing. A laser channel and an atom emission channel are provided inside the housing. A laser reflection channel is arranged between the laser channel and the atom emission channel. A target is provided at one end of the atom emission channel, and an atom emission hole is provided at the other end of the atom emission channel. Along the propagation direction of the incident laser in the laser channel, an optical fiber coupler, a collimator and a reflector are successively arranged. A fiber optic interface is provided on the housing corresponding to the position of the optical fiber coupler. The laser reflected by the reflector passes through the laser reflection channel and enters the atom emission channel and can be projected onto the target.
[0006] Further, a focusing lens is provided between the collimator and the reflector.
[0007] Further, the distance between the optical center of the focusing lens and the center of the light receiving surface of the reflector plus the distance between the center of the light receiving surface of the reflector and the center of the light receiving surface of the target is equal to the focal length of the focusing lens.
[0008] Further, a fixing block for fixing the reflector is provided in the laser channel.
[0009] Further, the angle of the reflector can be adjusted. The laser channel is also provided with an adjusting mechanism, and the adjusting mechanism cooperates with the fixing block to adjust the angle of the reflector.
[0010] Further, the laser channel and the atom emission channel are parallel to each other.
[0011] Further, the atom emission hole is aligned with the center position of the target.
[0012] Further, the laser reflection channel is inclined.
[0013] Further, the cross-section of the atom emission channel is a cuboid.
[0014] Further, the target is detachably installed in the atom emission channel.
[0015] Compared with the prior art, the beneficial effects of the present invention are as follows:
[0016] The present invention uses optical sputtering to generate atoms, avoiding the heat load problem brought by the atom generation device using the heating method, and can meet the usage requirements in an ultra-low temperature vacuum environment. By integrating the laser channel, atom emission channel, target, and fiber optic interface into a single housing, and using a mirror to introduce the laser in the laser channel into the atom emission channel, it has the characteristics of a compact structure, small size, and convenient use. It solves the problem of long-distance collimation caused by the need to separate the laser and the target in the previous laser sputtering atom generation device. Only by introducing the optical fiber into the vacuum chamber through a specific fiber feedthrough technology and installing it on this device can atoms be generated, without occupying the optical path space around the ion trapping device, and solving the problem of excessive occupation of the laser incident position around the ion trap. In addition, by placing the target in the atom emission channel with an atom emission hole, the direction of the excited atom beam is shielded, avoiding the contamination of the ion trapping device by the atom beam in the stray direction. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 is a schematic diagram of a laser sputtering atom generation device provided by the present invention;
[0018] Figure 2 is an exploded view of the assembly of the fiber optic coupler and the optical fiber of a laser sputtering atom generation device provided by the present invention;
[0019] In the figure: 1. Housing; 10. Atom emission channel; 11. Atom emission hole; 12. Laser channel; 13. Laser reflection channel; 2. Target; 3. Optical fiber; 31. Optical fiber protective cover; 4. Fiber optic coupler; 41. Protective member; 42. Distance control member; 5. Collimator; 6. Focusing lens; 7. Mirror; 8. Fixed block. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0020] Next, in combination with the drawings and specific embodiments, the present invention will be further described. It should be noted that, on the premise of no conflict, the following-described embodiments or technical features can be arbitrarily combined to form new embodiments.
[0021] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "horizontal", "vertical", "top", "inner", "outer", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "one", "another", etc. are used to distinguish similar elements, and these terms and other similar terms are not intended to limit the scope of the present invention.
[0022] In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations. In the respective drawings, the same or corresponding elements adopt corresponding reference numerals (for example, the element structures identified by "1XX" and "2XX" are the same and have similar functions).
[0023] As Figure 1-2 shown, a laser sputtering atom generating device provided by the present invention includes a housing 1. A laser channel 12 and an atom emission channel 10 are provided inside the housing 1. A laser reflection channel 13 is arranged between the laser channel 12 and the atom emission channel 10. A target 2 is provided at one end of the atom emission channel 10, and an atom emission hole 11 is provided at the other end of the atom emission channel 10. A fiber optic coupler 4, a collimator 5, and a mirror 7 are successively arranged in the laser channel 12 along the propagation direction of the incident laser. A fiber optic interface is provided on the housing 1 at a position corresponding to the fiber optic coupler 4. The laser reflected by the mirror 7 passes through the laser reflection channel 13 and enters the atom emission channel 10 and can be projected onto the target 2.
[0024] In this embodiment, the function of the housing 1 is to serve as the enclosure structure and fixed structure of the entire device. The function of the atomic emission channel 10 is to place the target 2, provide shielding for the atomic beam, and a channel for the directional emission of atoms. The function of the laser channel 12 is to fix the fiber optic coupler 4, collimator 5, mirror 7, and focusing lens 6, and provide a path for the laser to enter. The target 2 is arranged at one end of the atomic emission channel 10, and its function is to provide a source of target atoms. The atomic emission hole 11 is used to emit the atomic beam in the target direction. The function of the mirror 7 is to reflect the incident laser at a specific angle through the laser reflection channel 13 onto the target 2. The sputtering pulsed laser is introduced into the laser channel 12 through the optical fiber 3. Specifically, the optical fiber 3 is connected to the fiber optic coupler 4 through a fiber optic interface. First, the device is arranged near the ion trapping device. The atomic emission hole 11 is as close as possible to the trapping region of the ion trapping device and is aligned with the trapping region. The sputtering pulsed laser enters through the optical fiber 3, passes through the collimator 5, is reflected by the mirror 7, passes through the laser reflection channel 13, enters the atomic emission channel 10, and irradiates the target 2. The atoms on the surface of the target 2 are sputtered out as target atoms under the irradiation of the laser and are emitted in all directions. Since the atomic emission channel 10 filters the atomic beam in the stray directions, the atomic beam in the direction of the atomic emission hole 11 can be emitted from the atomic emission hole 11. Since the atomic emission hole 11 is aligned with the trapping region of the ion trapping device and the distance is close enough, the flying atomic beam can smoothly enter the trapping region.
[0025] The present invention uses the optical sputtering method to generate atoms, avoiding the heat load problem brought by the heating method atomic generation device, and can meet the use requirements in an ultra-low temperature vacuum environment. By integrating the laser channel 12, atomic emission channel 10, target 2, and fiber optic interface in a housing 1, and at the same time using the mirror 7 to introduce the laser in the laser channel 12 into the atomic emission channel 10, it has the characteristics of a compact structure, small volume, and convenient use, solving the problem of long-distance collimation caused by the need to separate the laser and the target 2 in the previous laser sputtering atomic generation device. Only by introducing the optical fiber 3 into the vacuum chamber through a specific fiber feedthrough technology and installing it on this device can atoms be generated, without occupying the optical path space around the ion trapping device, solving the problem of excessive occupation of the laser incident position around the ion trap. In addition, by placing the target 2 in the atomic emission channel 10 with the atomic emission hole 11, the direction of the excited atomic beam is shielded, avoiding the contamination of the ion trapping device by the atomic beam in the stray directions.
[0026] It should be noted that the assembly schematic diagram of the fiber optic coupler 4 and the optical fiber 3 of the present invention is as Figure 2 shown. The fiber optic coupler 4 includes a protection member 41 and a distance control member 42. The optical fiber 3 is sleeved with an optical fiber protection cover 31.
[0027] As a preferred embodiment, a focusing lens 6 is provided between the collimator 5 and the mirror 7. Between the collimator 5 and the mirror 7, the focusing lens 6 is arranged. After the laser passes through the collimator 5, it is focused by the focusing lens 6 to form a Gaussian beam, so that the laser can irradiate the target 2 with a specified spot diameter.
[0028] Specifically, the distance between the optical center of the focusing lens 6 and the center of the light receiving surface of the mirror 7 plus the distance between the center of the light receiving surface of the mirror 7 and the center of the light receiving surface of the target 2 is equal to the focal length of the focusing lens 6. This makes the focusing effect reach the best.
[0029] As a preferred embodiment, a fixing block 8 for fixing the mirror 7 is provided in the laser channel 12, which facilitates the installation of the mirror 7.
[0030] As a preferred embodiment, the angle of the mirror 7 can be adjusted. The laser channel 12 is also provided with an adjusting mechanism, and the adjusting mechanism cooperates with the fixing block 8 to adjust the angle of the mirror 7. The adjusting mechanism of this embodiment can drive the fixing block 8 to rotate, and then adjust the angle of the mirror 7, so as to automatically adjust the reflection angle of the mirror 7, so that the incident laser can be reflected to the target 2 at a specific angle through the laser reflection channel 13, and the operation is simple. Among them, the adjusting mechanism can be a driving mechanism such as a motor or a lead screw.
[0031] As a preferred embodiment, the laser channel 12 and the atomic emission channel 10 are parallel to each other. This can keep the incident laser and the emitted atoms parallel to each other, which is convenient for the installation of this atomic generating device. At the same time, the overall device structure is compact, with the characteristic of a small volume, effectively solving the problem that too much space is occupied by the laser incident position around the ion trap.
[0032] As a preferred embodiment, the atomic emission hole 11 is aligned with the center position of the target 2. This ensures that the atomic emission is parallel to the incident laser, effectively solving the problem that too much space is occupied by the laser incident position around the ion trap.
[0033] Specifically, the laser reflection channel 13 is inclined. Through the mutual cooperation of the mirror 7 and the laser reflection channel 13, it is ensured that the incident laser can hit the target 2, and at the same time, the purpose of a compact structure is achieved.
[0034] As a preferred embodiment, the cross-section of the atomic emission channel 10 is a cuboid. This ensures the purpose of a compact structure and effectively solves the problem that too much space is occupied by the laser incident position around the ion trap.
[0035] As a preferred embodiment, the target 2 is detachably installed in the atomic emission channel 10. This facilitates the replacement of the target 2.
[0036] The above embodiments are only preferred embodiments of the present invention, and cannot be used to limit the scope of protection of the present invention. Any non-substantive changes and substitutions made by those skilled in the art based on the present invention fall within the scope of protection required by the present invention.
Claims
1. A laser sputtering atom generating device, characterized in that, It includes a housing (1), a laser channel (12) and an atomic emission channel (10) are provided inside the housing (1), a laser reflection channel (13) is arranged between the laser channel (12) and the atomic emission channel (10), a target (2) is provided at one end of the atomic emission channel (10), and an atomic emission hole (11) is provided at the other end of the atomic emission channel (10); a fiber optic coupler (4), a collimator (5) and a reflector (7) are sequentially arranged in the laser channel (12) along the propagation direction of the incident laser, a fiber optic interface is provided on the housing (1) at a position corresponding to the fiber optic coupler (4), the laser reflected by the reflector (7) passes through the laser reflection channel (13) and enters the atomic emission channel (10) and can be projected onto the target (2), wherein the laser channel (12) and the atomic emission channel (10) are parallel to each other, and the laser reflection channel (13) is inclined.
2. The laser sputtering atomic generation device according to claim 1, wherein A focusing lens (6) is provided between the collimator (5) and the reflector (7).
3. The laser sputtering atom generating device according to claim 2, characterized in that, The distance between the optical center of the focusing lens (6) and the center of the light receiving surface of the reflector (7) plus the distance between the center of the light receiving surface of the reflector (7) and the center of the light receiving surface of the target (2) is equal to the focal length of the focusing lens (6).
4. The laser sputtering atom generating device according to claim 1, characterized in that, A fixing block (8) for fixing the reflector (7) is provided in the laser channel (12).
5. The laser sputtering atom generating device according to claim 4, wherein The angle of the reflector (7) can be adjusted, and the laser channel (12) is also provided with an adjusting mechanism, and the adjusting mechanism cooperates with the fixing block (8) to adjust the angle of the reflector (7).
6. The laser sputtering atom generating device according to claim 1, wherein The atomic emission hole (11) is aligned with the center position of the target (2).
7. The laser sputtering atom generating device according to claim 1, wherein The cross section of the atomic emission channel (10) is a cuboid.
8. The laser sputtering atom generating device according to claim 1, characterized in that, The target (2) is detachably installed in the atomic emission channel (10).
Citation Information
Patent Citations
Laser sputtering atom generation device
CN216288306U