Terminal, heat dissipation method and storage medium

Abstract

The present disclosure relates to a terminal, a heat dissipation method, and a storage medium. The terminal includes: a power supply module; and an ion fan connected to the power supply module and configured to generate an ion airflow under the power provided by the power supply module. Thus, because the terminal includes an ion fan and is capable of generating an ion airflow under the power provided by the power supply module, the ion fan can dissipate heat for the terminal on the one hand, and can also carry away static ions within the terminal, thereby achieving the purpose of neutralizing static electricity. In other words, the ion fan alone can simultaneously solve the two problems of terminal heat dissipation and electrostatic protection.

Description

Technical Field

[0001] The present disclosure relates to the field of terminal technology, and in particular to a terminal, a heat dissipation method, and a storage medium. Background Art

[0002] In related technologies, as people's demands for terminals increase, for example, multiple functional interfaces in the terminal may be used simultaneously, and the single use time is relatively long. For example, the charging interface of the terminal may be charged while the terminal is in use. In this way, the high frequency and simultaneous use of multiple functions are obviously not conducive to the heat dissipation of the terminal. On the other hand, the various electronic components in the terminal, especially the electronic components on the metal surface, such as the charging interface or headphone interface of the terminal, will generate more static electricity, which is not conducive to the electrostatic protection of the terminal. In view of this situation, the heat dissipation and electrostatic protection of the terminal have become increasingly important. Therefore, how to balance heat dissipation and electrostatic protection has become a technical problem that needs to be solved urgently. Summary of the Invention

[0003] The present disclosure provides a terminal, a heat dissipation method, and a storage medium. The technical solutions are as follows:

[0004] According to a first aspect of an embodiment of the present disclosure, there is provided a terminal, including:

[0005] Power supply module;

[0006] The ion fan is connected to the power supply module and is used to form an ion airflow under the power supply provided by the power supply module.

[0007] Optionally, the terminal further includes:

[0008] The boost module is connected between the power supply module and the ion fan, and is used for boosting the supply voltage provided by the power supply module and providing the boost voltage to the ion fan.

[0009] Optionally, the terminal further includes:

[0010] The power supply module and the ion fan are connected to form a first loop; the power supply module, the boost module and the ion fan are connected to form a second loop;

[0011] When the power supply module supplies power to the ion fan through the first circuit, the ion fan operates in a first state;

[0012] When the power supply module supplies power to the ion fan through the second circuit, the ion fan operates in the second state;

[0013] An ionization rate of the ion fan in the first state is lower than an ionization rate of the ion fan in the second state.

[0014] Optionally, the terminal further includes:

[0015] A switch module is connected between the power supply module and the ion fan, and the switch module includes: a first switch device and a second switch device;

[0016] Wherein, the first switching device is located on the first loop;

[0017] The second switching device is located on the second loop;

[0018] a control module connected to the switch module, and configured to send a first control signal or a second control signal to the switch module according to a heat generation condition in the terminal;

[0019] Under the action of the first control signal, the first switch device of the switch module is turned on and the second switch device is turned off;

[0020] Under the action of the second control signal, the first switch device of the switch module is turned off and the second switch device is turned on.

[0021] Optionally, the terminal includes: a heat generating module;

[0022] The control module is configured to generate the second control signal when the heat generating module in the terminal is a preset function module;

[0023] or,

[0024] The control module is configured to generate the second control signal when the temperature of at least one of the heat generating modules in the terminal is greater than a temperature threshold.

[0025] Optionally, the ion fan is located within a preset range centered on the heat generating module, and the ion airflow formed by the ion fan can be used to dissipate heat for the heat generating module.

[0026] Optionally, the terminal further includes:

[0027] The temperature sensor is installed on the heat generating module and connected to the control module, and is used for detecting the temperature of the heat generating module and transmitting the detected temperature to the control module.

[0028] Optionally, the terminal includes:

[0029] A plurality of ion fans are connected in parallel at the rear end of the power supply module; wherein different ion fans are arranged adjacent to different heat generating modules in the terminal.

[0030] According to a second aspect of an embodiment of the present disclosure, a heat dissipation method is provided, which is applied to the terminal described above, including:

[0031] determining heat generation conditions within the terminal;

[0032] generating a first control signal or a second control signal according to a heat generation condition in the terminal;

[0033] The first control signal is used to control a first loop formed by connecting the power supply module and the ion fan, so that the ion fan operates in a first state;

[0034] The second control signal is used to control the conduction of a second loop formed by connecting the power supply module, the boost module and the ion fan, so that the ion fan operates in the second state;

[0035] The ionization rate of the ion fan in the first state is lower than the ionization rate of the ion fan in the second state.

[0036] Optionally, the method further includes at least one of the following:

[0037] When the heat generating module in the terminal is a preset function module, generating the second control signal;

[0038] When the temperature of at least one of the heat generating modules in the terminal is greater than a temperature threshold, the second control signal is generated.

[0039] According to a third aspect of an embodiment of the present disclosure, a terminal is provided, including:

[0040] processor;

[0041] a memory for storing processor-executable instructions;

[0042] The processor is configured to implement the steps of any of the above-described methods when executed.

[0043] According to a fourth aspect of an embodiment of the present disclosure, a non-transitory computer-readable storage medium is provided, on which a computer program is stored, and the program is used by a processor to execute the steps of any of the above-described methods.

[0044] The technical solutions provided by the embodiments of the present disclosure may have the following beneficial effects:

[0045] The terminal of the disclosed embodiment includes: a power supply module and an ion fan, wherein the ion fan is connected to the power supply module and is used to form an ion airflow under the power provided by the power supply module. In this way, since there is an ion fan in the terminal and it can generate an ion airflow under the power supply of the power supply module, on the one hand, the generated ion airflow can take away the heat generated inside the terminal and dissipate heat for the terminal; on the other hand, the generated ion airflow can neutralize the static electricity generated on the electronic components in the terminal and play a role in electrostatic protection. In this way, the ion airflow generated by the ion fan under the power supply of the power supply module can take into account both heat dissipation and electrostatic protection, thereby achieving the purpose of effectively protecting the electronic components in the terminal.

[0046] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0048] Figure 1 is a schematic structural diagram of a terminal according to an exemplary embodiment;

[0049] Figure 2 is another structural diagram of a terminal according to an exemplary embodiment;

[0050] Figure 3 is another structural diagram of a terminal according to an exemplary embodiment;

[0051] Figure 4 is another structural diagram of a terminal according to an exemplary embodiment;

[0052] Figure 5 is a schematic diagram showing a specific structure of a terminal according to an exemplary embodiment;

[0053] Figure 6 is a flow chart showing a heat dissipation method according to an exemplary embodiment;

[0054] Figure 7 is a block diagram of a heat dissipation device according to an exemplary embodiment;

[0055] Figure 8 It is a block diagram of a terminal according to an exemplary embodiment. DETAILED DESCRIPTION

[0056] Exemplary embodiments will be described in detail herein, examples of which are illustrated in the accompanying drawings. In the following description, when referring to the drawings, like numbers in different figures represent like or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present invention, as detailed in the appended claims.

[0057] Figure 1 is a schematic diagram showing the structure of a terminal according to an exemplary embodiment. Figure 1 As shown, the terminal 1 includes:

[0058] Power supply module 10;

[0059] The ion fan 12 is connected to the power supply module 10 and is used to form an ion airflow under the power provided by the power supply module 10.

[0060] Here, the terminal can be a fixed terminal, such as a desktop computer, an all-in-one computer, or a smart TV. The terminal can also be a mobile terminal, such as a mobile phone, a tablet computer, a laptop computer, or a wearable device. The wearable device can also be a smart watch or a smart bracelet. In fact, any electronic device that can cause internal components to generate heat or static electricity during operation is a terminal as described in this embodiment.

[0061] It should be noted that the ion airflow generated by the ion fan 12 carries positive and negative charges, so that the static electricity on the surface of the object is neutralized, thereby achieving the purpose of eliminating static electricity.

[0062] In some embodiments, the ion fan 12 comprises an ion ionizer. The ion fan operates by ionizing air under voltage to form ions, which then form an ion flow. Once the ion flow reaches a surface, primarily the surface of electronic components within the terminal, it can simultaneously cool the electronic components and neutralize static electricity on the surface.

[0063] Here, the power supply module may include a power management chip, or may include a power management chip and a peripheral circuit, which is not limited here. In fact, the power supply voltage provided by the power supply module can enable the ion fan to form an ion airflow.

[0064] In some embodiments, the terminal further comprises: a backlight module;

[0065] The power supply module may include: a power supply component connected to the backlight module and supplying power to the backlight module.

[0066] Here, the backlight module needs to meet the terminal's brightness requirements, so it requires a higher voltage than other electronic components within the terminal. It is understood that the power supply component that powers the backlight module outputs a first-level power supply. Here, the voltage provided by the first-level power supply enables the ion fan to generate ion airflow. For example, the output voltage provided for the backlight module is 12V or 24V, while the output voltage for other electronic components, such as the sound card chip, is 3.3V or 5V.

[0067] Thus, in this embodiment, the power supply module can directly reuse the existing power supply components within the terminal, such as the power supply component that powers the backlight module. There is no need to change the original voltage output of the power supply within the terminal in order to provide a higher voltage for the ion fan. Instead, the power supply components within the terminal that can provide a higher voltage for the ion fan, such as the power supply component of the backlight module, can be directly reused, thereby saving power consumption of the terminal power supply. In addition, there is no need to add a new power supply to provide a higher voltage for the ion fan, nor is there a need to add a boost module to boost the voltage output of the power supply. Therefore, the changes to the circuit inside the terminal are relatively small, the implementation is simple, and the modification cost is lower.

[0068] Of course, in other embodiments, the power supply module can be a power supply that is re-built into the terminal and is dedicated to powering the ion fan. In this way, power supply-related operations or controls can be performed specifically for the ion fan, which is more specialized and less likely to affect or occupy the power resources of other electronic components in the terminal.

[0069] In this embodiment, the ion fan within the terminal generates an ion airflow powered by the power module. This airflow can dissipate heat generated by the terminal's internal electronic components during operation, providing cooling for the terminal. Furthermore, it neutralizes static electricity generated by the terminal's electronic components, providing electrostatic protection. Thus, this embodiment requires only one ion fan powered by the power module to achieve both heat dissipation and electrostatic protection within the terminal.

[0070] Furthermore, it should be noted that in related technologies, heat dissipation is typically addressed by adding a heat dissipation film and introducing silicone, and then addressing static electricity by adding an electrostatic protection tube and an overvoltage protection device. This requires modification of every electronic component in the terminal that requires heat dissipation or anti-static treatment, which is clearly inconvenient to operate and is costly. Therefore, compared to the prior art, which requires adding a heat dissipation film and introducing silicone to address heat dissipation, and adding an electrostatic protection tube and an overvoltage protection device to address static electricity, the terminal provided in this embodiment can simultaneously address both heat dissipation and static electricity protection with a single ion fan, making implementation simpler and more convenient, and reducing modification costs.

[0071] As an alternative embodiment, see Figure 2 , Figure 2 is another structural diagram of a terminal according to an exemplary embodiment. Figure 2 As shown, the terminal 1 further includes:

[0072] The boost module 14 is connected between the power supply module 10 and the ion fan 12 , and is used for boosting the supply voltage provided by the power supply module and providing the boost voltage to the ion fan 12 .

[0073] Here, the boost module 14 refers to a conversion circuit capable of increasing the output voltage to be higher than the input voltage, that is, the input voltage input to the boost module 14 becomes higher after being output by the boost module 14. In some embodiments, the boost module 14 may include a Boost circuit.

[0074] It is understandable that the power supply module here can be a second-level power supply, while the power supply provided by the power supply module and the boost module can be a first-level power supply. Here, the first level output by the first-level power supply is higher than the second level output by the second-level power supply. In some embodiments, the power supply module can be a power supply chip in the terminal that is directly connected to the terminal battery.

[0075] It can be seen that the higher the supply voltage of the ion fan, the higher the ion velocity in the generated ion airflow, and thus the higher the heat dissipation efficiency and the static elimination efficiency on the surface of electronic components. In this way, the boost module 14 of this embodiment can improve the heat dissipation efficiency and static elimination efficiency of the ion fan.

[0076] Based on this, as another optional embodiment, please refer to Figure 3 , Figure 3 is another structural diagram of a terminal according to an exemplary embodiment. Figure 3 As shown, the terminal 1 further includes:

[0077] The power supply module 10 and the ion fan 12 are connected to form a first loop; the boost module 14 and the ion fan are connected to form a second loop;

[0078] The power supply module 10 supplies power to the ion fan 12 through the first circuit, and the ion fan 12 operates in a first state;

[0079] The power supply module 10 supplies power to the ion fan 12 through the second circuit, and the ion fan 12 operates in the second state;

[0080] The ionization rate of the ion fan 12 in the first state is lower than the ionization rate of the ion fan 12 in the second state.

[0081] It should be noted that in some scenarios, such as when the ion fan is cooling electronic components that generate a lot of heat or are prone to static electricity, such as the terminal's CPU (central processing unit) or the terminal's charging port, if heat is needed for such electronic components, the ion fan near such electronic components can be pre-connected to the second circuit, and the power supply module is powered by the second circuit to better provide heat dissipation and static electricity removal.

[0082] In other scenarios, such as when the ion fan is cooling electronic components with low heat generation or low static electricity, for example, the terminal's Bluetooth chip and other low-frequency chips. In this case, if you want to cool such electronic components, you can pre-connect the ion fan near such electronic components to the first circuit, and the power supply module will power the ion fan from the first circuit. In this way, the ion fan can be directly powered to output an ion airflow sufficient to dissipate heat and eliminate static electricity for such electronic components without the need for a boost module, thus saving terminal energy consumption.

[0083] In this way, since this embodiment provides two circuits for the power supply module and the ion fan, one of the two circuits can be selected to provide the ion fan with the voltage required for operation. For example, the second circuit is selected when a higher ionization rate is required, and the first circuit is selected when a higher ionization rate is not required. In this way, a suitable ion fan access solution can be given according to different situations to ensure heat dissipation and static electricity removal effects without wasting the terminal's energy consumption.

[0084] Based on this, as another optional embodiment, please refer to Figure 3 ,like Figure 3 As shown, the terminal 1 further includes:

[0085] The switch module 16 is connected between the power supply module 10 and the ion fan 12 . The switch module 16 includes a first switch device 161 and a second switch device 162 .

[0086] Wherein, the first switch device 161 is located on the first loop;

[0087] The second switch device 162 is located on the second loop;

[0088] a control module connected to the switch module 16 and configured to send a first control signal or a second control signal to the switch module 16 according to a heat generation state in the terminal;

[0089] Under the action of the first control signal, the first switch device 161 of the switch module 16 is turned on and the second switch device 162 is turned off;

[0090] Under the action of the second control signal, the first switch device 162 of the switch module 16 is turned off and the second switch device 162 is turned on.

[0091] Here, the switch module 16 includes a first switch device 161 and a second switch device 162. The first switch device 161 and the second switch device 162 can be various switch devices. For example, the first switch device 161 and the second switch device 162 can be single-pole single-throw switches, relays, or metal oxide semiconductor field effect transistors, etc., without limitation.

[0092] Here, when the first switch device 161 is off and the second switch device 162 is on, the second circuit is on and the first circuit is off. In other words, the circuit connected to the boost module is on, while the circuit not connected to the boost module is off. At this time, the boost module boosts the power provided by the power supply module before providing it to the ion fan. In this way, under the action of the second control signal, the power supply voltage of the ion fan is actually increased, thereby improving the heat dissipation efficiency and static removal efficiency of the ion fan.

[0093] When the first switch 161 is on and the second switch 162 is off, the first circuit is on and the second circuit is off. That is, the circuit not connected to the boost module is on, while the circuit connected to the boost module is off. At this point, the ion fan operates on the power provided by the power supply module, without boosting the voltage provided by the power supply module. Thus, under the action of the first control signal, the boost module is not required, and the ion fan can be powered directly by the power supply module.

[0094] Therefore, in combination with the above-mentioned scenario, that is, when the heat dissipation target of the ion fan is an electronic component that generates a high amount of heat or is prone to a large amount of static electricity, the first circuit can be disconnected by automatically turning on the second circuit under the action of the second control signal, that is, by introducing a boost module to improve the heat dissipation efficiency and static electricity removal efficiency of the ion fan, so as to better dissipate heat and remove static electricity for this type of electronic component that generates a high amount of heat or is prone to a large amount of static electricity. When the heat dissipation target of the ion fan is an electronic component that generates a low amount of heat or has a low amount of static electricity, the first circuit can be automatically turned on and the second circuit can be disconnected under the action of the first control signal, that is, without the need to introduce a boost module, heat can be dissipated for this type of electronic component that generates a low amount of heat or has a low amount of static electricity, thereby saving power consumption of the terminal.

[0095] Specifically, in this embodiment, whether to send the first control signal or the second control signal to the switch module can be determined according to the heat generation condition in the terminal.

[0096] Thus, in this embodiment, by introducing the switch module and the control module, the power supply module can automatically control which circuit supplies power to the ion fan based on the terminal's internal heat generation status. This allows for intelligent switching of the appropriate circuit based on the terminal's current heat generation status, thus increasing the terminal's intelligence.

[0097] Specifically, see Figure 4 , Figure 4 is another structural diagram of a terminal according to an exemplary embodiment. Figure 4 As shown, the terminal 1 includes: a heat generating module 18;

[0098] The control module is configured to generate the second control signal when the heat generating module 18 in the terminal 1 is a preset function module;

[0099] or,

[0100] The control module is configured to generate the second control signal when the temperature of the heat generating module 18 in the terminal 1 is greater than a temperature threshold.

[0101] Here, the heat-generating module refers to the electronic components inside the terminal that can generate heat during the use of the terminal, for example, the various chips in the terminal, such as the CPU, charging management chip, or power management chip in the terminal. Another example is the various interfaces installed in the terminal, such as the charging interface, headphone interface, or earpiece.

[0102] Here, the preset functional module is a pre-set related module that generates a large amount of heat or releases a large amount of static electricity, for example, a CPU or a charging port in a terminal.

[0103] Here, the temperature threshold is a preset temperature value that may require a higher ionization rate to provide heat dissipation.

[0104] In this way, both situations require the addition of a boost module to help the ion fan output a larger ion airflow, thereby providing better heat dissipation and static elimination effects for heat generating modules that are preset function modules or whose temperature is greater than the temperature threshold.

[0105] In some embodiments, the heat generating module may be a heat generating module that is closer to the ion fan. Specifically, the ion fan is located within a preset range centered on the heat generating module, and the ion airflow generated by the ion fan can be used to dissipate heat for the heat generating module.

[0106] In this way, it is only necessary to determine whether the heat generating module within the preset range of the ion fan is a preset functional module, thereby effectively dissipating heat and eliminating static electricity for the heat generating module within the preset range at the same time.

[0107] As an optional embodiment, the terminal further includes:

[0108] The temperature sensor is installed on the heat generating module and connected to the control module, and is used for detecting the temperature of the heat generating module and transmitting the detected temperature to the control module.

[0109] In this embodiment, the temperature sensor is mounted directly on the heat generating module, accurately detecting the external temperature of the module and thus accurately determining whether the module requires timely heat dissipation. Thus, this embodiment only requires one temperature sensor mounted on the module to accurately determine whether the module's current temperature has reached a threshold, enabling timely and efficient heat dissipation and static elimination.

[0110] It should be noted that since there are multiple heat generating modules inside the terminal, in order to facilitate heat dissipation for each heat generating module, in some embodiments, an ion fan is configured within a preset range of the heat generating module. These ion fans can be connected in series to the rear end of the power supply module or in parallel to the rear end of the power supply module.

[0111] As for the method of being connected in series to the rear end of the power supply module, since all the ion fans are connected in series on the same loop, different heat dissipation solutions cannot be provided for different heat generating modules.

[0112] Based on this, as an optional embodiment, the terminal includes:

[0113] A plurality of ion fans are connected in parallel at the rear end of the power supply module; wherein different ion fans are arranged adjacent to different heat generating modules in the terminal.

[0114] In this way, this embodiment equips different heat-generating modules with exclusive ion fans through multiple ion fans connected in parallel behind the power supply module, so that different ion fan heat dissipation or static elimination solutions can be provided for different heat-generating modules. For example, different control signals are given to carry out targeted control according to the heat generation conditions of the heat-generating modules, which is beneficial to taking into account the efficiency of heat dissipation and static elimination of different heat-generating modules and terminal energy consumption.

[0115] Furthermore, the present disclosure also provides a specific embodiment to further understand the terminal provided by the embodiment of the present disclosure.

[0116] Smartphone charging power is increasing, and at the same time, smartphone applications are becoming increasingly diverse. It's common for users to use their smartphones while charging. For example, when a user plays a game while using their smartphone, heat dissipation and ESD protection in the smartphone's charging port become increasingly important. Therefore, heat dissipation and ESD protection are two major challenges that smartphones must address, and finding a way to efficiently and simultaneously address these issues is crucial.

[0117] Related technologies address heat dissipation by adding heat dissipation films and silicone rubber to electronic components in smartphones that require heat dissipation. They also address ESD protection by adding ESD protection tubes and overvoltage protection devices. However, these approaches are incomprehensible and fail to address both heat dissipation and ESD protection simultaneously with a single device.

[0118] Based on this, this embodiment proposes a terminal, see Figure 5 , Figure 5 FIG. 1 is a schematic diagram showing a specific structure of a terminal according to an exemplary embodiment. Figure 5 As shown, the smartphone 20 may include:

[0119] PM (power management chip) 100;

[0120] A Boost circuit 140 connected to the PM; and

[0121] The ion fan 120 is connected to the Boost circuit 140 , and is used to boost the voltage provided by the PM and provide the voltage to the ion fan 120 .

[0122] The smartphone 20 here can be understood as the terminal described in the above embodiment; the PM100 here can be understood as the power supply module described in the above embodiment; and the Boost circuit 140 here can be understood as the boost module described in the above embodiment.

[0123] The working principle of the ion fan: Under the action of low current and high voltage generated by the high-voltage generator, the ion ionizer forms a stable high-voltage electric field, ionizes the air to form ions, which are carried out by the airflow to the surface of the object, and can simultaneously reduce the temperature and neutralize static electricity.

[0124] Here, the PM provides power output to the Boost circuit, and the Bosst circuit is responsible for generating high voltage and low current to supply the ion fan. The ion fan generates a high voltage electric field within a small area, ionizing the air to form ions to form an ion airflow, thereby achieving the purpose of dissipating heat for the heat generating module 180 and neutralizing static electricity.

[0125] Here, the heat generating module 180 may include: a CPU of the smartphone 20 , and may also include: a charging interface of the smartphone 20 .

[0126] It should be added that different heat generation modules correspond to different ion fans, and multiple ion fans are connected in parallel at the rear end of the PM and the Boost circuit.

[0127] In this embodiment, compared with the prior art which requires solving the heat dissipation problem by adding a heat dissipation film and introducing silicone, and solving the static electricity problem by adding an electrostatic protection tube and an overvoltage protection device, the terminal provided in this embodiment can solve the heat dissipation and electrostatic protection problems of the terminal at the same time only by an ion fan, which is simpler and more convenient to implement, and the modification cost is also lower.

[0128] Figure 6 FIG. 1 is a flow chart showing a heat dissipation method according to an exemplary embodiment. Figure 6 As shown, the method is applied to the terminal described above, including:

[0129] Step 601: Determine the heat generation status in the terminal;

[0130] Step 602: Generate a first control signal or a second control signal according to a heat generation state in the terminal;

[0131] The first control signal is used to control a first loop formed by connecting the power supply module and the ion fan, so that the ion fan operates in a first state;

[0132] The second control signal is used to control the conduction of a second loop formed by connecting the power supply module, the boost module and the ion fan, so that the ion fan operates in the second state;

[0133] The ionization rate of the ion fan in the first state is lower than the ionization rate of the ion fan in the second state.

[0134] In this embodiment, the power supply module can automatically control which circuit to use to power the ion fan according to the internal heat generation state of the terminal. This can achieve intelligent switching of the appropriate circuit based on the current heat generation state of the terminal, thereby increasing the intelligence of the terminal.

[0135] As an optional embodiment, the method further includes at least one of the following:

[0136] When the heat generating module in the terminal is a preset function module, generating the second control signal;

[0137] When the temperature of at least one of the heat generating modules in the terminal is greater than a temperature threshold, the second control signal is generated.

[0138] In this embodiment, both situations require the addition of a boost module to help the ion fan output a larger ion airflow, thereby providing better heat dissipation and static elimination effects for the heat generating module that is a preset functional module and the heat generating module whose temperature is greater than the temperature threshold.

[0139] The specific manner of the method in the above embodiment has been described in detail in the embodiment of the camera module and will not be elaborated here.

[0140] Figure 7 FIG. 1 is a block diagram of a heat dissipation device according to an exemplary embodiment. Figure 7 , the device is applied to the terminal described above; the device includes: a determination module 71 and a generation module 72;

[0141] The determining module 71 is configured to determine the heat generation status in the terminal;

[0142] The generating module 72 is configured to generate a first control signal or a second control signal according to the heat generation condition in the terminal;

[0143] The first control signal is used to control a first loop formed by connecting the power supply module and the ion fan, so that the ion fan operates in a first state;

[0144] The second control signal is used to control the conduction of a second loop formed by connecting the power supply module, the boost module and the ion fan, so that the ion fan operates in the second state;

[0145] The ionization rate of the ion fan in the first state is lower than the ionization rate of the ion fan in the second state.

[0146] In some optional embodiments, the device further comprises at least one of the following:

[0147] a first generating module configured to generate the second control signal when the heat generating module in the terminal is a preset function module;

[0148] The second generating module is configured to generate the second control signal when the temperature of at least one of the heat generating modules in the terminal is greater than a temperature threshold.

[0149] Regarding the device in the above embodiment, the specific manner in which each module performs operations has been described in detail in the embodiments of the vibration control device and the vibration control method, and will not be elaborated here.

[0150] Figure 8FIG8 is a block diagram of a terminal 800 according to an exemplary embodiment. For example, the terminal 800 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0151] Reference Figure 8 The terminal 800 may include one or more of the following components: a processing component 802 , a memory 804 , a power component 806 , a multimedia component 808 , an audio component 810 , an input / output (I / O) interface 812 , a sensor component 814 , and a communication component 816 .

[0152] The processing component 802 generally controls the overall operation of the terminal 800, such as operations associated with display, phone calls, data communications, camera operation, and recording operations. The processing component 802 may include one or more processors 820 to execute instructions to perform all or part of the steps of the above-described method. In addition, the processing component 802 may include one or more modules to facilitate interaction between the processing component 802 and other components. For example, the processing component 802 may include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.

[0153] The memory 804 is configured to store various types of data to support operations on the terminal 800. Examples of such data include instructions for any application or method operating on the terminal 800, contact data, phone book data, messages, pictures, videos, etc. The memory 804 can be implemented by any type of volatile or non-volatile storage device, or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk, or optical disk.

[0154] Power component 806 provides power to various components of terminal 800. Power component 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to terminal 800.

[0155] The multimedia component 808 includes a screen that provides an output interface between the terminal 800 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen can be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor can not only sense the boundaries of the touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front camera and / or a rear camera. When the terminal 800 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera can receive external multimedia data. Each front camera and rear camera can be a fixed optical lens system or have a focal length and optical zoom capability.

[0156] The audio component 810 is configured to output and / or input audio signals. For example, the audio component 810 includes a microphone (MIC), which is configured to receive external audio signals when the terminal 800 is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signal can be further stored in the memory 804 or transmitted via the communication component 816. In some embodiments, the audio component 810 also includes a speaker for outputting audio signals.

[0157] I / O interface 812 provides an interface between processing component 802 and peripheral interface modules, such as a keyboard, click wheel, buttons, etc. These buttons may include but are not limited to: a home button, volume buttons, a start button, and a lock button.

[0158] The sensor assembly 814 includes one or more sensors for providing various aspects of the terminal 800's status assessment. For example, the sensor assembly 814 can detect the open / closed state of the terminal 800, the relative positioning of components, such as the display and keypad of the terminal 800. The sensor assembly 814 can also detect changes in the position of the terminal 800 or a component of the terminal 800, the presence or absence of user contact with the terminal 800, the orientation or acceleration / deceleration of the terminal 800, and temperature changes of the terminal 800. The sensor assembly 814 can include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 814 can also include an optical sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 can also include an accelerometer, a gyroscope, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0159] The communication component 816 is configured to facilitate wired or wireless communication between the terminal 800 and other devices in the system. The terminal 800 can access a wireless network based on a communication standard, such as WiFi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 616 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0160] In an exemplary embodiment, the terminal 800 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the above methods.

[0161] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 804 including instructions, and the instructions can be executed by the processor 820 of the terminal 800 to perform the above method. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, etc.

[0162] A non-transitory computer-readable storage medium, when instructions in the storage medium are executed by a processor of a terminal, enables the terminal to execute the vibration control method described in the above embodiments.

[0163] Other embodiments of the present invention will readily occur to those skilled in the art after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the invention being indicated by the following claims.

[0164] It should be understood that the present invention is not limited to the exact construction described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. A terminal, characterized in that: include: Power supply module; at least one ion fan, located in the terminal and connected to the power supply module, for forming an ion airflow under power provided by the power supply module; A functional interface, wherein at least one ion fan is provided at the functional interface and performs heat dissipation and static neutralization for the functional interface by blowing the ion airflow toward the functional interface; The terminal further includes: a control module, configured to control the power supply module to supply power to the ion fan through a first circuit when the ion fan is directed to a first type of device, so that the ion fan operates in a first state; and to control the power supply module to supply power to the ion fan through a second circuit when the ion fan is directed to a second type of device, so that the ion fan operates in a second state; The ionization rate of the ion fan in the first state is lower than the ionization rate of the ion fan in the second state; the amount of static electricity accumulated when the first type of device is working is less than the amount of static electricity accumulated when the second type of device is working; the second type of device includes a charging interface in the functional interface; The terminal further includes: a boost module connected between the power supply module and the ion fan, and configured to boost the supply voltage provided by the power supply module and then provide the boost voltage to the ion fan; The power supply module and the ion fan are connected to form the first loop; The power supply module, the boost module and the ion fan are connected to form the second loop.

2. The terminal according to claim 1, wherein The terminal further includes: A switch module is connected between the power supply module and the ion fan, and the switch module includes: a first switch device and a second switch device; Wherein, the first switching device is located on the first loop; The second switching device is located on the second loop; The control module is connected to the switch module and is used to send a first control signal or a second control signal to the switch module according to the heat generation status in the terminal; Under the action of the first control signal, the first switch device of the switch module is turned on and the second switch device is turned off; Under the action of the second control signal, the first switch device of the switch module is turned off and the second switch device is turned on.

3. The terminal according to claim 2, characterized in that The terminal includes: a heat generating module including the first type of device and the second type of device; The control module is configured to generate the second control signal when the heat generating module in the terminal is a preset function module; the preset function module includes a charging interface in the second type of device; or, The control module is configured to generate the second control signal when the temperature of at least one of the heat generating modules in the terminal is greater than a temperature threshold. The terminal according to claim 3, wherein: The ion fan is located within a preset range centered on the heat generating module, and the ion airflow formed by the ion fan can be used to dissipate heat for the heat generating module. The terminal according to claim 3 , wherein: The terminal further includes: The temperature sensor is installed on the heat generating module and connected to the control module, and is used for detecting the temperature of the heat generating module and transmitting the detected temperature to the control module. The terminal according to claim 1 , wherein: The ion fan includes a plurality of; A plurality of the ion fans are connected in parallel at the rear end of the power supply module; wherein different ion fans are arranged adjacent to different heat generation modules in the terminal.

7. A heat dissipation method, characterized in that: The terminal according to any one of claims 2 to 6 comprises: determining heat generation conditions within the terminal; generating a first control signal or a second control signal according to a heat generation condition in the terminal; The first control signal is used to control a first loop formed by connecting the power supply module and the ion fan, so that the ion fan operates in a first state; The second control signal is used to control the conduction of a second loop formed by connecting the power supply module, the boost module and the ion fan, so that the ion fan operates in the second state; Wherein, the ionization rate of the ion fan in the first state is lower than the ionization rate of the ion fan in the second state; Wherein, at least one of the ion fans is located at the functional interface of the terminal, and performs heat dissipation and static neutralization for the functional interface by blowing the ion airflow toward the functional interface; The method further comprises: When the ion fan acts on a first type of device, the first circuit is controlled to be turned on and the second circuit is turned off; and when the ion fan acts on a second type of device, the first circuit is controlled to be turned off and the second circuit is controlled to be turned on; Among them, the amount of static electricity accumulated when the first type of device is working is less than the amount of static electricity pressurized when the first type of device is working; the second type of device includes the charging interface in the functional interface.

8. The method according to claim 7, characterized in that The method further comprises at least one of the following: When the heat generating module in the terminal is a preset function module, the second control signal is generated; the preset function module includes a charging interface in the second type of device; When the temperature of at least one of the heat generating modules in the terminal is greater than a temperature threshold, the second control signal is generated.

9. A terminal, characterized in that: include: processor; memory for storing processor-executable instructions; The processor is configured to implement the method of claim 7 or 8 when executed.

10. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that: The program is executed by a processor to implement the method according to claim 7 or 8.

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