Heat sink assemblies for electrical components

Abstract

A heat sink assembly (200) includes a plate stack (202), the plate stack (202) including fin plates (230) and spacer plates (240), the bottom edges of the fin plates (230) and the spacer plates (240) forming a compliant thermal interface (104) configured to interface with an electrical component (102). The upper edges of the fin plates are located above the spacer plates, such that an airflow channel (250) is formed between the fin plates. The heat sink assembly includes a support frame (400) supporting the fin plates and the spacer plates in the plate stack. The support frame includes a resilient support member (422), the resilient support member (422) engaging a resilient element (300) to position the resilient element relative to the support frame. The resilient element engages the fin plates and the spacer plates to bias the fin plates and the spacer plates in a first biasing direction generally toward the electrical component, thereby pressing the bottom edges of the fin plates and the spacer plates against the electrical component.

Description

Technical Field

[0001] The subject matter herein generally relates to heat dissipation for electrical components. Background Art

[0002] It may be desirable to transfer thermal energy (or heat) away from specific components of a system or device. Some systems use electrical components, such as electrical connectors, to transfer data and / or power to and from different systems or devices. Some systems use electrical components, such as pluggable modules, to transmit data signals in the form of optical and / or electrical signals through communication cables. Some systems use electrical components, such as integrated circuits, to control the system. The electrical components define the source of heat generated in the system.

[0003] A common challenge faced by developers of electrical systems is thermal management. The heat energy generated by the electrical components in the system can degrade the performance of the system components or even damage them. To dissipate this heat, the system includes a thermal component that engages a heat source, absorbs heat from the heat source, and transfers the heat away. Thermal components generally include a flat thermal interface for connecting to the electrical component. However, due to the limited thermal interface area and variations in the surface, such as the surface flatness of the connecting surfaces, achieving effective thermal coupling at the interface is difficult. In addition, the thermal component may be thermally coupled to other thermal components at other thermal interfaces. The component loses efficiency at each thermal interface.

[0004] Therefore, there is a need for heat transfer assemblies that effectively transfer thermal energy away from electrical components. Summary of the Invention

[0005] According to the present invention, a heat sink assembly is provided. The heat sink assembly includes a plate stack comprising fin plates and spacer plates arranged in a stack between the fin plates. Each fin plate has a top edge and a bottom edge. Each fin plate has a first side between the top edge and the bottom edge. Each fin plate has a second side between the top edge and the bottom edge, opposite the first side. Each spacer plate has a top edge and a bottom edge. Each spacer plate has a first side between the top edge and the bottom edge. Each spacer plate has a second side between the top edge and the bottom edge, opposite the first side. The first and second sides of the spacer plates face the respective first and second sides of the fin plates. The bottom edges of the fin plates and the bottom edges of the spacer plates form a conformable thermal interface configured to interface with an electrical component. The upper edges of the fin plates are located above the upper edges of the spacer plates, such that an airflow path is formed between the fin plates above the spacer plates. The heat sink assembly includes a support frame that supports the fin plates and the spacer plates in the plate stack. The support frame includes a resilient support member extending internally within the plate stack. The heat sink assembly includes a resilient element extending internally within the plate stack. The resilient element engages the resilient support member to position the resilient element relative to the support frame. The resilient element engages the fin plates and the spacer plates to bias the fin plates and the spacer plates in a first biasing direction generally toward the electrical component, thereby pressing bottom edges of the fin plates and the spacer plates against the electrical component. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 is a front perspective view of a communication system and a heat sink assembly according to an exemplary embodiment for dissipating heat from at least one electrical component of the communication system.

[0007] Figure 2 is a perspective view of an elastic element according to an exemplary embodiment.

[0008] Figure 3 is a front view of a heat sink assembly according to an exemplary embodiment.

[0009] Figure 4 is a side view of a support frame illustrating a portion of a heat sink assembly according to an exemplary embodiment, showing a first side panel.

[0010] Figure 5 is a side view of a support frame illustrating a portion of a heat sink assembly according to an exemplary embodiment, showing a fin plate.

[0011] Figure 6 is a side view of a support frame illustrating a portion of a heat sink assembly according to an exemplary embodiment, showing a spacer plate.

[0012] Figure 7is a front perspective view of a communication system and a heat sink assembly according to an exemplary embodiment for dissipating heat from at least one electrical component of the communication system.

[0013] Figure 8 is a front view of a heat sink assembly according to an exemplary embodiment.

[0014] Figure 9 is a side view of a support frame illustrating a portion of a heat sink assembly according to an exemplary embodiment, showing a first side panel.

[0015] Figure 10 is a side view of a support frame illustrating a portion of a heat sink assembly according to an exemplary embodiment, showing a fin plate.

[0016] Figure 11 is a side view of a support frame illustrating a portion of a heat sink assembly according to an exemplary embodiment, showing a spacer plate.

[0017] Figure 12 is a front perspective view of a communication system and a heat sink assembly for dissipating heat from at least one electrical component of the communication system according to an exemplary embodiment.

[0018] Figure 13 is a front view of a heat sink assembly according to an exemplary embodiment.

[0019] Figure 14 is a side view of a support frame illustrating a portion of a heat sink assembly according to an exemplary embodiment, showing a first side panel.

[0020] Figure 15 is a side view of a support frame illustrating a portion of a heat sink assembly according to an exemplary embodiment, showing a fin plate.

[0021] Figure 16 is a side view of a support frame illustrating a portion of a heat sink assembly according to an exemplary embodiment, showing a spacer plate. DETAILED DESCRIPTION

[0022] Figure 1 is a front perspective view of a communication system 100 and a heat sink assembly 200 according to an exemplary embodiment for dissipating heat from at least one electrical component 102 of the communication system 100. The heat sink assembly 200 is configured to be thermally coupled to the electrical component 102 at a thermal interface 104 at a bottom of the heat sink assembly 200. In the exemplary embodiment, the heat sink assembly 200 is air cooled by transferring heat to an airflow passing over a fin plate structure of the heat sink assembly 200.

[0023] The heat sink assembly 200 may be compressed against the electrical component 102. In an exemplary embodiment, the heat sink assembly 200 may conform to the shape of the electrical component 102 at the thermal interface 104, thereby enabling efficient heat transfer across the thermal interface 104.

[0024] In an exemplary embodiment, electrical component 102 is mounted to circuit board 110. In various embodiments, electrical component 102 may be a communication connector, such as a receptacle connector, a header connector, a plug connector, or other types of communication connectors. In other various embodiments, electrical component 102 may be an electronic package, such as an integrated circuit. In other various embodiments, electrical component 102 may be a pluggable module, such as an I / O transceiver module. In alternative embodiments, other types of electrical components may be provided.

[0025] The heat sink assembly 200 includes a plate stack 202 having a plurality of independently movable plates 204, one or more elastic elements 300 engaging the plates 204, and a support frame 400 for retaining the plates 204 within the plate stack 202. The plates 204 are configured to thermally engage the electrical component 102 and dissipate heat from the electrical component 102 to cool the electrical component 102. The plates 204 are configured to dissipate heat to the external environment. Any number of elastic elements 300 may be provided, such as a pair of elastic elements 300 defining a front elastic element and a rear elastic element. In alternative embodiments, a larger or fewer elastic elements 300 may be provided. The elastic elements 300 bias the plates 204 in a first biasing direction, such as a downward biasing direction toward the electrical component 102. The plates 204 are nested within one another and stacked together in the plate stack 202, providing thermal communication between the plates 204. The individual plates 204 are movable relative to each other such that the plates 204 can be individually articulated to conform to the electrical component 102 for improved contact and / or proximity between the heat sink assembly 200 and the electrical component 102. For example, the plates 204 can be deflectable and movable within the support frame 400 when the heat sink assembly 200 is coupled to the electrical component 102.

[0026] In an exemplary embodiment, the heat sink assembly 200 is a parallelepiped (e.g., roughly box-shaped). For example, the heat sink assembly 200 includes a top 210, a bottom 212, a front 214, a rear 216, a first side 220, and a second side 222. The top 210 can be roughly planar. The bottom 212 can be roughly planar. The front 214 can be roughly planar. The rear 216 can be roughly planar. The first side 220 can be roughly planar. The second side 222 can be roughly planar. However, in alternative embodiments, the heat sink assembly 200 can have other shapes. The support frame 400 is used to hold the heat sink assembly 200 together. In an exemplary embodiment, the support frame 400 provides external support for the plate stack 202 and provides internal support for the plate stack 202. For example, as in the illustrative embodiment, the support frame 400 can extend along the first side 220 and the second side 222. The support frame 400 may additionally or alternatively extend along the front 214 and / or the rear 216. The support frame 400 may additionally or alternatively extend along the top 210 and / or the bottom 212. The support frame 400 passes through the interior of the plate stack 202, such as between the first side 220 and the second side 222, to hold the plate stack 202 together.

[0027] In the exemplary embodiment, the plates 204 of the plate stack 202 include fin plates 230 and spacer plates 240 between the fin plates 230. Each fin plate 230 has a first side 232 and a second side 234 that are opposed to each other. The fin plates 230 extend between a top edge 236 and a bottom edge 238. The bottom edge 238 faces the electrical component 102 and interfaces with the thermal interface 104 of the electrical component 102. The fin plates 230 have a height between the top edge 236 and the bottom edge 238. Optionally, the various fin plates 230 may have different shapes, such as different heights and / or different widths.

[0028] Each spacer plate 240 has opposing first and second sides 242 and 244. The spacer plates 240 extend between a top edge 246 and a bottom edge 248. The bottom edge 248 faces the electrical component 102 and interfaces with the thermal interface 104 of the electrical component 102. Optionally, the bottom edge 248 of the spacer plates 240 is substantially aligned with the bottom edge 238 of the fin plates 230 to form a thermal interface. Each spacer plate 240 has a height between the top edge 246 and the bottom edge 248 that is substantially shorter than the height of the fin plates 230. For example, the fin plates 230 extend vertically above the spacer plates 240 to form airflow channels 250 between the fin plates 230. The airflow channels 250 are located above the spacer plates 240. The airflow channels 250 allow airflow between the fin plates 230, for example, along the first and second sides 232 and 234 of the fin plates 230, to dissipate heat into the surrounding airflow. The width of the spacer plates 240 controls the width of the airflow channels 250. Alternatively, the various fin plates 240 may have different shapes, such as different heights and / or different widths.

[0029] In the exemplary embodiment, the support frame 400 includes a first side panel 410 at the first side 220 of the plate stack 202 and a second side panel 412 (eg, a second side panel 412) at the second side 222 of the plate stack 202. Figure 3 ). Optionally, end panels (not shown) may extend between the side panels 410, 412 to form a rectangular frame structure for the panel stack 202. In an exemplary embodiment, the side panels 410 include mounting tabs 414 configured to mount to a support structure (not shown), such as a bracket, cage, receptacle rack, or other support structure. The mounting tabs 414 may be welded to the support structure. The mounting tabs 414 secure the support frame 400 relative to the support structure. The panels 204 may be movable relative to the support frame 400, and therefore, relative to the support structure.

[0030] The support frame 400 includes a cross member 420 extending between the first side panel 410 and the second side panel 412. The cross member 420 can be used to support the first side panel 410 relative to the second side panel 412 (e.g., to maintain a space between the side panels 410, 412). The cross member 420 is used to support the elastic element 300 relative to the support frame 400. For example, the cross member 420 can be located immediately above the elastic element 300 to maintain the position of the elastic element 300 in the plate stack 202. The elastic element 300 can press upward against the cross member 420, so that the cross member 420 forms a bearing surface for the elastic element 300 to press against. The cross member 420 can be used to maintain the relative position of the plates 204 in the plate stack 202 (e.g., can be used to maintain a front-to-back position and / or a side-to-side position and / or a top-to-bottom position). In various embodiments, the panels 204 can have a limited degree of floating movement relative to the cross members 420 (e.g., a controlled degree of front-to-back and / or side-to-side and / or top-to-bottom movement). In various embodiments, the cross members 420 are internal cross members that extend internally within the panel stack 202. For example, the cross members 420 can pass through the fin plates 230 and / or the spacer plates 240. Additionally or alternatively, the cross members 420 can include external cross members that extend around the exterior of the panel stack 202. For example, the external cross members can be walls or panels that engage the exterior surfaces of the panels 204. The external cross members can be disposed at the front 214 and / or rear 216 (e.g., forming a rectangular frame structure with the side panels 410, 412).

[0031] In the illustrated embodiment, cross member 420 includes a resilient support element 422 and a panel support element 424. Resilient support element 422 supports resilient element 300, and panel support element 424 supports panels 204 relative to each other and relative to support frame 400. In the illustrated embodiment, panel support element 424 is a cylindrical pin. However, in alternative embodiments, other types of support elements may be used. In the illustrated embodiment, resilient support element 422 is a cylindrical pin and may be referred to hereinafter as resilient support pin 422. Resilient support element 422 and / or panel support element 424 may be structures other than pins, such as rails, pegs, tabs, or other structures. Any number of resilient support pins 422 may be provided, such as a pair of resilient support pins 422 defining a front resilient support pin proximate front end 214 and a rear resilient support pin proximate rear end 216. The ends of resilient support element 422 may be secured to side panels 410, 412. For example, the ends of the resilient support pins 422 can be brazed, welded, flattened, riveted, screwed, or otherwise coupled to the side panels 410, 412. Any number of panel support elements 424 can be provided, such as a pair of panel support elements 424 defining a front panel support pin proximate the front end 214 and a rear panel support pin proximate the rear end 216. In various embodiments, the panel support elements 424 can be cylindrical pins. The ends of the panel support elements 424 can be fixed to the side panels 410, 412. For example, the ends of the panel support elements 424 can be brazed, welded, flattened, riveted, screwed, or otherwise coupled to the side panels 410, 412.

[0032] Figure 2 3 is a perspective view of a spring element 300 according to an exemplary embodiment. The spring element 300 includes a top 310, a bottom 312, a front 314, a back 316, a first side 320, and a second side 322. The spring element 300 includes mounting tabs 324, 326 on the first side 320 and the second side 322, respectively, for mounting the spring element 300 to a support frame 400 (e.g., FIG. Figure 1 (As shown). In the exemplary embodiment, the elastic element 300 is a stamped structure, which is stamped from a metal sheet into a resilient shape. In various embodiments, the elastic element 300 may be a cup-shaped leaf spring; however, in alternative embodiments, the elastic element 300 may have other shapes. The elastic element 300 is made of a thin metal material, making it flexible.

[0033] The spring element 300 includes a center body 330 extending between a first side 320 and a second side 322. Front wings 332 extend forward from the center body 330 at a downward angle to a front edge 334 at the front 314 of the spring element 300. Rear wings 336 extend rearward from the center body 330 at a downward angle to a rear edge 338 at the rear 316 of the spring element 300. The center body 330 is disposed at the top 310 of the spring element 300. The front edge 334 and the rear edge 338 are disposed at the bottom 312 of the spring element 300 to engage the plate 204 (e.g., the heat sink assembly 200) of the spring element 300. Figure 1 ), thereby pressing the plate 204 in a downward biasing direction.

[0034] In an exemplary embodiment, front wing 332 is divided into a plurality of front spring fingers 342. Front spring fingers 342 are separated by gaps 344 formed by cutting front wing 332 inward from front edge 334, for example, during a stamping process. Front spring fingers 342 are independently movable relative to one another, for example, to provide independent spring pressure to corresponding panels 204. In an exemplary embodiment, rear wing 336 is divided into a plurality of rear spring fingers 346. Rear spring fingers 346 are separated by gaps 348 formed by cutting front wing 336 inward from rear edge 338, for example, during a stamping process. Rear spring fingers 346 are independently movable relative to one another, for example, to provide independent spring pressure to corresponding panels 204.

[0035] Figure 3 FIG2 is a front view of a heat sink assembly 200 according to an exemplary embodiment. The heat sink assembly 200 includes a plate 204 arranged in a plate stack 202. A support frame 400 is configured to hold the plate 204 in the plate stack 202. The elastic element 300 is supported by the support frame 400 and acts on the plate 204 to press the plate 204 in a downward biasing direction.

[0036] The fin plates 230 are positioned between the spacer plates 240. The bottom edges 238 of the fin plates 230 and the bottom edges 248 of the spacer plates 240 define the bottom 212 of the heat sink assembly 200, which defines a thermal interface with the electrical component 102 (e.g., Figure 121). The fin plates 230 and the spacer plates 240 are both configured to be directly thermally coupled to the electrical component 102 at the bottom 212. The fin plates 230 are taller than the spacer plates 240 and extend above the top edge 246 of the spacer plates 240. The airflow channel 250 is located between the fin plates 230 and above the spacer plates 240. The spacer plates 240 maintain the relative position of the fin plates 230 to define the airflow channel 250 therebetween. After installation, the side panels 410, 412 hold the fin plates 230 and the spacer plates 240 in the plate stack 202, and the cross members 420 maintain the relative position of the side panels 410, 412. In the exemplary embodiment, the elastic support pins 422 span the top of the elastic element 330 and extend above the spacer plates 240.

[0037] Figure 4 FIG. 4 is a side view of a portion of a heat sink assembly 200 illustrating a support frame 400 showing a first side panel 410 according to an exemplary embodiment. Figure 5 FIG. 4 is a side view of a portion of a heat sink assembly 200 illustrating a support frame 400 showing a fin plate 230 according to an exemplary embodiment. Figure 6 FIG. 4 is a side view of a portion of a heat sink assembly 200 illustrating a support frame 400 showing a spacer plate 240 according to an exemplary embodiment. Figures 4 to 6 The support frame 400 is shown relative to the plate 204 and the elastic element 300 .

[0038] The support frame 400 is used to support the plate 204 and to support the elastic element 300 relative to the plate 204. The plate support pin 424 passes through the side panel 410 ( Figure 4 )、Fin plate 230( Figure 5 ) and spacer plate 240 ( Figure 6 ) extends. The side panel 410 includes an opening 416 for receiving the plate support pin 424. The fin plate 230 includes a fin plate slot 260 ( Figure 5 ), and the spacer plate 240 includes a spacer plate slot 262 ( Figure 6 ). The plate support member 424 extends internally through the fin plate 230 in the fin plate slot 260, and the plate support member 424 extends internally through the spacer plate 240 in the spacer plate slot 262. In the exemplary embodiment, the fin plate slot 260 is elongated (e.g., in a vertical direction), and the spacer plate slot 262 is elongated (e.g., in a vertical direction). The fin plate 230 and the spacer plate 240 can move relative to the plate support member 424. The fin plate slot 260 and the spacer plate slot 262 provide a gap relative to the plate support member 424 to allow the fin plate 230 and the spacer plate 240 to move relative to the plate support member 424. For example, the fin plate 230 and the spacer plate 240 can move upward relative to the plate support member 424.

[0039] The fin plate 230 includes an elastic opening 264 ( Figure 5 In the illustrated embodiment, the elastic opening 264 is triangular in shape, having a flat bottom 266 and a vertex 268 at the top of the elastic opening 264. The vertex 268 may be located approximately in the center between the front and rear portions of the elastic opening 264. The elastic support pin 422 is received at the vertex 268 in the elastic opening 264 and positioned in the elastic opening 264 by the wall of the fin plate 230, which forms the elastic opening 264 extending from the vertex 268. The central body 330 is aligned with the vertex 268. The elastic support pin 422 is aligned with the central body 330 and supports the elastic element 300. The elastic element 300 presses against the elastic support pin 422. The front wings 332 and the rear wings 336 extend from the center body 330 so that the front edge 334 and the rear edge 338 engage the bottom 266 of the resilient opening 264, pressing against the fin plate 230 and engaging the top edge 246 of the spacer plate 240 ( Figure 6 The spring element 300 biases the fin plate 230 and the spacer plate 240 in a downward biasing direction to engage the electrical component 102 (eg, Figure 1 shown).

[0040] Figure 7 is a front perspective view of a communication system 100 and a heat sink assembly 200 according to an exemplary embodiment for dissipating heat from at least one electrical component 102 of the communication system 100. The support frame 400 includes Figure 1 The plate 204 of the heat sink assembly 200 can be designed into different shapes to interface with features of the support frame 400 .

[0041] The support frame 400 holds the panels 204 in the panel stack 202. The support frame 400 supports the spring elements 300. The spring elements 300 bias the panels 204 in a first biasing direction, such as a downward biasing direction. The individual panels 204 can move relative to each other and relative to the support frame 400 so that the panels 204 can be individually articulated to conform to the electrical components 102 (e.g., Figure 1 ), for improving contact and / or proximity between the heat sink assembly 200 and the electrical component 102 .

[0042] The support frame 400 includes a first side panel 410 and a second side panel 412 (eg, Figure 8). The support frame 400 includes a cross member 420 extending between the side panels 410, 412. The cross member 420 supports the first side panel 410 relative to the second side panel 412 (e.g., to maintain the space between the side panels 410, 412). In the exemplary embodiment, the cross member 420 is an external cross member located outside the panel stack 202. For example, the cross member 420 includes a front end panel 426 at the front 214 and a rear end panel 428 at the rear 216. The end panels 426, 428 extend between the side panels 410, 412 and hold the side panels 410, 412 relative to each other. The end panels 426, 428 form panel support elements for the ends of the panels 204. The end panels 426, 428, together with the side panels 410, 412, form a rectangular outer frame of the panel stack 202. The support frame 400 includes a cross member that extends across the plate stack 202 between the end panels 426, 428. For example, the cross member extends from the front to the rear.

[0043] In an exemplary embodiment, the support frame 400 includes a resilient support rail 430 that extends through the airflow channel 250 along the top of the resilient element 300. The resilient support rail 430 can extend parallel to the plates 204. The resilient support rail 430 defines a resilient support element for the resilient element 300. The resilient support rail 430 is supported by end panels 426, 428 at the front end 214 of the plate stack 202 and at the rear end 216 of the plate stack 202. The resilient support rail 430 is used to support the resilient element 300 relative to the support frame 400. The resilient element 300 presses upward against the resilient support rail 430, such that the resilient support rail 430 forms a bearing surface for the resilient element 300 to press against.

[0044] Figure 8 4 is a front view of a heat sink assembly 200 according to an exemplary embodiment. The heat sink assembly 200 includes plates 204 arranged in a plate stack 202. A support frame 400 is configured to hold the plates 204 in the plate stack 202. The elastic element 300 is supported by the support frame 400 and acts on the plates 204 to press the plates 204 in a downward biasing direction. For example, a resilient support rail 430 spans the top of the resilient element 300 to hold the resilient element 300 in position relative to the plates 204. In an exemplary embodiment, the resilient support rail 430 includes a positioning tab 431 that engages the plates 204 to position the resilient support rail 430 relative to the plates 204. For example, the positioning tab 431 can extend in two directions to engage adjacent plates 204.

[0045] Figure 9FIG. 4 is a side view of a portion of a heat sink assembly 200 illustrating a support frame 400 showing a first side panel 410 according to an exemplary embodiment. Figure 10 FIG. 4 is a side view of a portion of a heat sink assembly 200 illustrating a support frame 400 showing a fin plate 230 according to an exemplary embodiment. Figure 11 FIG. 4 is a side view of a portion of a heat sink assembly 200 illustrating a support frame 400 showing a spacer plate 240 according to an exemplary embodiment. Figures 9 to 11 The support frame 400 is shown relative to the plate 204 and the elastic element 300 .

[0046] The support frame 400 is used to support the plate 204 and to support the elastic element 300 relative to the plate 204. The end panels 426 are coupled to the side panels 410 ( Figure 9 ). The elastic support rail 430 is along the fin plate 230 ( Figure 10 ) and spacer plate 240 ( Figure 11 ) extends. The resilient support rail 430 is coupled to the end panel 426, for example, welded to the end panel 426. The resilient opening 264 ( Figure 10 ) receives the elastic element 300. In the illustrated embodiment, the elastic opening 264 is rectangular in shape with a flat bottom and a flat top. The elastic support rail 430 has a bottom edge 432 that engages the center body 330. The bottom edge 432 can be located below the top of the elastic opening 264 to support the elastic element 300. The front wings 332 and the rear wings 336 extend from the center body 330 so that the front edge 334 and the rear edge 338 engage the bottom of the elastic opening 264, thereby pressing against the fin plate 230 and engaging the top edge 246 ( Figure 11 The spring element 300 biases the fin plate 230 and the spacer plate 240 in a downward biasing direction to engage the electrical component 102 (eg, Figure 1 shown).

[0047] Figure 12 is a front perspective view of a communication system 100 and a heat sink assembly 200 according to an exemplary embodiment for dissipating heat from at least one electrical component 102 of the communication system 100. The support frame 400 includes Figure 1 The embodiments shown in Figure 7 The plate 204 of the heat sink assembly 200 can be designed into different shapes to interface with features of the support frame 400 .

[0048] The support frame 400 holds the plates 204 in the plate stack 202. In an exemplary embodiment, the support frame 400 includes upper spacer plates 440 between the fin plates 230. The upper spacer plates 440 are used to support the elastic elements 300. The upper spacer plates 440 are internal support elements located within the plate stack 202. The elastic elements 300 bias the plates 204 in a first biasing direction, such as a downward biasing direction. The individual plates 204 can move relative to each other and relative to the support frame 400 so that the plates 204 can be individually articulated to conform to the electrical components 102 (e.g., Figure 1 ), for improving contact and / or proximity between the heat sink assembly 200 and the electrical component 102 .

[0049] The support frame 400 includes a first side panel 410 and a second side panel 412 (eg, Figure 13 ). The support frame 400 includes a cross member 420 extending between a first side panel 410 and a second side panel 412. The cross member 420 supports the first side panel 410 relative to the second side panel 412 (e.g., to maintain a space between the side panels 410, 412). In the exemplary embodiment, the cross member 420 includes a plate support element 424 and an upper plate support element 425. The upper plate support element 425 is a plate support pin similar to the plate support element 424. The lower plate support element 424 supports the fin plate 230 and the spacer plate 240. The upper plate support element 425 supports the fin plate 230 and the upper spacer plate 440.

[0050] Figure 13 2 is a front view of a heat sink assembly 200 according to an exemplary embodiment. The heat sink assembly 200 includes plates 204 arranged in a plate stack 202. A support frame 400 is configured to hold the plates 204 in the plate stack 202. The support frame 400 includes an upper spacer plate 440 positioned in the airflow channel 250 between the fin plates 230. The upper spacer plate 440 is positioned above the spacer plates 240. The elastic element 300 is supported by the upper spacer plate 440 of the support frame 400 and acts on the plates 204 to press the plates 204 in a downward biasing direction. For example, the upper spacer plate 440 spans the top of the elastic element 300 to hold the elastic element 300 in place relative to the plates 204.

[0051] Figure 14 FIG. 4 is a side view of a portion of a heat sink assembly 200 illustrating a support frame 400 showing a first side panel 410 according to an exemplary embodiment. Figure 15 FIG. 4 is a side view of a portion of a heat sink assembly 200 illustrating a support frame 400 showing a fin plate 230 according to an exemplary embodiment. Figure 16FIG. 4 is a side view of a portion of a heat sink assembly 200 illustrating a support frame 400 showing a spacer plate 240 according to an exemplary embodiment. Figures 14 to 16 The support frame 400 is shown relative to the plate 204 and the elastic element 300 .

[0052] The support frame 400 is used to support the plate 204 and to support the elastic element 300 relative to the plate 204. The plate support elements 424, 425 pass through the side panels 410 ( Figure 14 ) extends. The plate support member 424 supports the fin plate 230 ( Figure 15 ) and spacer plate 240 ( Figure 16 ), and the upper plate support member 425 supports the fin plate 230 ( Figure 15 ) and upper spacer plate 440 ( Figure 16 In an exemplary embodiment, the fin plate 230 includes a fin plate slot 260 ( Figure 15 ) and upper fin plate slot 261. The spacer plate 240 includes a spacer plate slot 262 ( Figure 16 ). Upper spacer plate 440 includes upper spacer plate aperture 263. Plate support element 424 extends internally through fin plate 230 in fin plate slot 260, and plate support element 424 extends internally through spacer plate 240 in spacer plate slot 262. Upper plate support element 425 extends internally through fin plate 230 in upper fin plate slot 260, and upper plate support element 425 extends internally through upper spacer plate 440 in upper spacer plate aperture 263. Fin plate 230 and spacer plate 240 are movable relative to plate support element 424 and upper spacer plate 440.

[0053] The upper spacer plate 440 supports the elastic element 300. The upper spacer plate 440 is held in place in the plate stack 202 by the upper plate support member 425. The upper spacer plate 440 includes a bottom edge 442 that forms a support surface for the elastic element 300. When the heat sink assembly 200 is coupled to the electrical component 102, the fin plate 230 can move in an upward direction relative to the upper spacer plate 440. When the heat sink assembly 200 is coupled to the electrical component 102, the spacer plate 240 can move in an upward direction toward the upper spacer plate 440.

Claims

1. A heat sink assembly (200), comprising: A plate stack (202), the plate stack (202) comprising fin plates (230) and spacer plates (240) arranged in a stack between the fin plates, each of the fin plates having a top edge (236) and a bottom edge (238), each of the fin plates having a first side (232) between the top edge and the bottom edge, each of the fin plates having a second side (234) between the top edge and the bottom edge opposite the first side, each of the spacer plates having a top edge (246) and a bottom edge (248), each of the spacer plates having a a first side (242) between a top edge and the bottom edge, each of the spacer plates having a second side (244) between the top edge and the bottom edge opposite the first side, the first and second sides of the spacer plates facing the corresponding first and second sides of the fin plates, the bottom edges of the fin plates and the bottom edges of the spacer plates forming a compliant thermal interface (104) configured to interface with an electrical component (102), the upper edges of the fin plates being located above the upper edges of the spacer plates such that an airflow channel (250) is formed between the fin plates above the spacer plates; a support frame (400) supporting the fin plates and the spacer plates in the plate stack, the support frame including a resilient support member (422) extending internally in the plate stack; as well as A resilient element (300) extending within the interior of the plate stack, the resilient element engaging the resilient support member to position the resilient element relative to the support frame, the resilient element engaging the fin plates and the spacer plates to bias the fin plates and the spacer plates in a first biasing direction generally toward the electrical component, thereby pressing the bottom edges of the fin plates and the spacer plates against the electrical component.

2. The heat sink assembly (200) according to claim 1, wherein: The fin plate (230) is movable relative to the spacer plate (240), and the spacer plate is movable relative to the fin plate.

3. The heat sink assembly (200) according to claim 1, wherein The support frame (400) includes a first side panel (410) at a first side (220) of the plate stack (202) and a second side panel (412) at a second side (222) of the plate stack, the elastic element (300) extending between the first side panel and the second side panel.

4. The heat sink assembly (200) according to claim 3, wherein: The resilient support member (422) extends across each of the fin plates (230) and each of the spacer plates (240) between the first side panel (410) and the second side panel (412).

5. The heat sink assembly (200) according to claim 1, wherein The elastic element (300) extends perpendicularly to the fin plate (230) and the spacer plate (240), and the elastic support member (422) extends along the elastic element perpendicularly to the fin plate and the spacer plate to engage the elastic element.

6. The heat sink assembly (200) according to claim 1, wherein The elastic element (300) extends perpendicular to the fin plate (230) and the spacer plate (240), and the elastic support member (422) extends across the elastic element parallel to the fin plate and the spacer plate to engage the elastic element.

7. The heat sink assembly (200) according to claim 1, wherein The elastic element (300) includes a central body (330), a front wing (332) extending forward from the central body at a downward angle, and a rear wing (336) extending rearward from the central body at a downward angle, the elastic support member (422) engaging the central body, and distal ends of the front wing and the rear wing engaging the fin plate (230) and the spacer plate (240) to press the fin plate and the spacer plate in a first biasing direction.

8. The heat sink assembly (200) according to claim 1, wherein The elastic element (300) is a front elastic element, and the elastic support member (422) is a front elastic support member located near the front (214) of the plate stack (202), the heat sink assembly also includes a rear elastic element (300) and a rear elastic support member (422) located near the rear (216) of the plate stack, the rear elastic element engages the rear elastic support member to position the rear elastic element relative to the support frame (400), the rear elastic element engages the fin plate (230) and the spacer plate (240) so as to bias the fin plate and the spacer plate in a first biasing direction generally toward the electrical component (102), thereby pressing the bottom edges of the fin plate and the spacer plate against the electrical component.

9. The heat sink assembly (200) according to claim 1, wherein The elastic support member (422) includes an elastic support pin extending through the fin plate (230) along the top of the elastic element (300).

10. The heat sink assembly (200) according to claim 1, wherein The resilient support member (422) includes one or more resilient support rails (430) extending across the top of the resilient element (300) through corresponding airflow channels (250).

11. The heat sink assembly (200) according to claim 10, wherein: The resilient support rails (430) are supported by end panels at the front end of the plate stack (202) and at the rear end of the plate stack.

12. The heat sink assembly (200) according to claim 10, wherein: The resilient support track (430) includes a locating tab that engages a plate arranged in the stack to position the resilient support track relative to the plates arranged in the plate stack.

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