Pressure sensing device and method

Abstract

A pressure sensing device (1000) comprises first and second electrodes (10, 20) spaced a distance apart from each other. At least one of the electrodes comprises / is formed of an integral piece of non-metallic conductive material. The distance is responsive to the pressure / force applied to the first and / or second electrode and is variable. The device comprises a measuring module (500) connected to the first / second electrode at a plurality of sensing points (S1...). In response to the change in distance when pressure / force is applied to the first and / or second electrode, the measuring module is configured to measure the change in capacitance between the first and second electrodes individually at each sensing point and / or simultaneously at all sensing points. The measuring module is configured to determine the position, area and magnitude of the pressure applied to the first and / or second electrode from the results of the individual measurements and / or to determine the magnitude of the applied pressure from the results of the simultaneous measurements.

Description

Technical Field

[0001] The present invention relates generally to pressure sensing devices and, in particular, but not exclusively, to devices for determining the location, area and magnitude of pressure applied by a human touch, body or object on a surface of the device. The invention also relates to methods of operating and manufacturing the device. Background Art

[0002] There is an increasing demand to embed touch- and / or pressure-sensitive devices and functions into regular passive objects and surfaces. Developments in this field help human-computer interaction become seamless in everyday life. They also play an important role in gaining new knowledge in the academic field, collecting useful research data, and in driving businesses to explore new insights into consumer behavior.

[0003] The ability to continuously monitor the changing pressures applied by various parts of the human body on objects that users naturally interact with in daily life through novel sensing devices is an area of ​​growing interest. This can be used to actuate parts of a system in response to detected behavior and / or to collect data that can be subsequently analyzed to provide useful feedback to the end user. In particular, foot pressure monitoring has been applied to a variety of fields, including biomedical diagnostics, prevention of foot ulcers (e.g., in the feet of diabetics), physical rehabilitation, athletic training, injury prevention, and electronic games. By determining the distribution of static and dynamic pressure forces, one can determine and improve balance, detect excessive pressure in specific areas of the foot, analyze gait stability, detect movement patterns to understand the user's behavior and movements, and monitor posture - the static and dynamic pressure forces applied by the human body through its feet on the sole. Similarly, in the automotive industry, monitoring the pressure applied by the human body on the seat has application scenarios, for example, monitoring the user's comfort, posture, and overall behavior while driving. Seat design is fundamental to preventing problems related to poor sitting posture, and collecting data about seating behavior through pressure mapping can help manufacturers improve seat design, comfort, and driver safety. In addition, pressure mapping offers the possibility to detect different driving conditions and provide active feedback to the user.

[0004] These emerging applications pose new challenges in the design and manufacture of pressure mapping devices due to the need for flexible and durable devices that can move naturally with the user during daily activities, as well as the need for simple and cost-effective ways to obtain high-resolution measurements.

[0005] General solutions for generating accurate pressure maps of the foot, such as those described in EP3235428A1 and US5323650A, implement a flexible XY sensor array configuration including multiple dispersed force / pressure sensors. These solutions utilize multiple layers with a large number of electronic components, interconnections / traces and manufacturing steps. The individual sensors that make up the XY sensor array are usually separated between multiple sensing layers (e.g., one for X position and one for Y position) that need to be assembled and covered, and each layer of the device usually requires different conductive / non-conductive materials and properties, coatings (e.g., pressure-sensitive coatings), printed conductive tracks / traces, and manufacturing techniques / steps. Therefore, these sensor array solutions are inherently complex in device manufacturing. In addition, the logic behind the array sensing system is based on the miniaturization and multiplication of sensing points, designed to be adjusted in two separate directions that intersect to provide XY resolution. This method has design limitations, especially when increasing spatial resolution, because the conductive traces need to fit narrowly into the available space with limited error tolerances, as shown in US5323650A.

[0006] Similarly, solutions developed for seat pressure mapping have used multiple printed conductive traces that terminate at sensing points on a sensing layer to measure local pressure and force. For example, CN1882460A discloses a device that detects seat occupancy based on measuring pressure-induced resistance changes derived from a sensing layer composed of multiple layers of resistors, conductive materials, and coatings. The pressure location is determined by measuring the resistance change between pairs of sensing points on opposite sides of the sensing layer. Therefore, a considerable number of resistor materials, sensing points, and printed traces are required to achieve high-resolution pressure mapping, which in turn increases the complexity and manufacturing / material costs of the device.

[0007] In wearable device and / or seating / bedding applications where surfaces are subject to constant and repetitive movement and stress, devices incorporating complex sensor arrays, conventional printed traces and / or coatings may be susceptible to degradation due to breakage and / or delamination, which may ultimately limit commercialization in industries such as consumer electronics, wearable and health care products, and automotive interiors.

[0008] Therefore, in order to achieve mass production of such pressure mapping devices, there is a need for a greatly simplified sensing system that provides high-resolution pressure mapping with a minimum of sensor elements and can be produced with affordable materials and manufacturing processes.

[0009] Aspects and embodiments of the present invention have been devised in view of the foregoing. Summary of the invention

[0010] According to a first aspect of the present invention, a pressure sensing device is provided. The device comprises a first electrode and a second electrode. The first electrode and the second electrode may be spaced apart and / or separated from each other. The first electrode and the second electrode may be spaced apart and / or separated by a certain distance from each other. The first electrode and / or the second electrode may be formed of or include a non-metallic conductive material. The first electrode and / or the second electrode may be formed of or include an integral piece of a non-metallic conductive material. The first electrode and / or the second electrode may include or be formed of a movable and / or deformable and / or flexible non-metallic conductive material (e.g., conductive plastic, foam and / or rubber, etc.), so that the distance may change in response to a pressure or force (at one or more locations) applied to or on the first electrode and / or the second electrode. The change in distance may be uniform or non-uniform. The term "non-metallic" conductive material used herein and throughout refers to a material that is not a metal, such as gold, silver or aluminum, etc. The device may also include a measurement module. The measuring module may be connected to or connectable to the first electrode and / or the second electrode at one or more sensing points (or multiple sensing points) on the electrode. At one or more sensing points, the measuring module may be configured to measure a change in an electrical signal in response to a pressure or force applied to or on the first electrode and / or the second electrode, for example, the pressure or force changes or reduces a distance (for example, at one or more locations). The electrical signal may be a change in capacitance between the first electrode and the second electrode, or include a change in capacitance between the first electrode and the second electrode. The measuring module may be configured to measure the change in capacitance individually at each sensing point and / or at all sensing points simultaneously. The measuring module may be configured to determine the position, area and / or amount of pressure applied to the first and / or second electrode based on the results of individual measurements. The measuring module may be configured to determine the magnitude of the applied pressure based on the results of simultaneous measurements. The magnitude of the applied pressure may be a relative value or an actual pressure value.

[0011] The space between the first and second electrodes may be at least partially filled or occupied by a non-conductive, compressible and / or flexible spacer layer or material. Alternatively, the distance between the first electrode and the second electrode may be one or more gaps, or include one or more gaps. The gap may span a certain distance. The gap may be or include an air gap, a hollow space or a void. The first electrode and the second electrode may be spaced and / or separated from each other by one or more gaps. The gap may change and / or close in response to a pressure or force applied to the first and / or second electrode. The measurement module may be configured to measure a change in an electrical signal at one or more sensing points, the change in the electrical signal being in response to a pressure or force applied to the first and / or second electrode or to the first and / or second electrode, for example, the pressure or force changes, reduces or shrinks one or more gaps.

[0012] The device uses one or more non-metallic conductive electrodes to achieve pressure sensing without the need for traditional metal electrode sensors. Using non-metallic conductive materials for the first and / or second electrodes has many advantages over traditional sensing technologies that use sensors with metal electrodes. The material cost and weight are significantly lower than traditional metal electrode materials (such as gold, silver or aluminum). The non-metallic conductive material can be moldable. Therefore, the manufacturing / assembly of the sensor device is simplified and the associated manufacturing / assembly costs are reduced. In addition, due to the nature of the molding process, the first and / or second electrodes can be molded into and / or formed of almost any arbitrary size, shape or three-dimensional (3D) form. This has many practical and functional advantages:

[0013] The electrodes can be a single piece of material, providing XY resolution pressure sensing without the need for multiple discrete pressure / force sensors, greatly simplifying device construction and operation.

[0014] • The electrodes may be formed from or comprise recyclable materials.

[0015] Electrodes can be conformed to any surface and shape, regardless of the complexity of the surface / shape. This can reduce the need for flexible printed circuits, which introduce complexity in electrode placement, wiring, and increase wear and assembly costs.

[0016] The electrodes have a 3D volume and can cover a larger area, making them more sensitive to capacitance changes and producing larger signal changes than their typical smaller metal counterparts.

[0017] The electrodes may be formed of or include the same or similar materials to replace the materials of the original product. For example, a non-pressure sensitive foam sole insert may be turned into a pressure sensitive insert by replacing the non-conductive foam therein with a conductive foam so that the sensor electrode material provides the same physical and / or ergonomic function of the product material as the original material, making the electrodes easier to integrate by the manufacturer.

[0018] If a gap is present, the size of the gap can be selected to tune the pressure response. For example, for a given electrode material and size, the depth and width of the gap can be configured to set a predetermined pressure or force that is required to reduce and / or close the gap and produce a change in capacitance. This allows the pressure sensitivity and / or dynamic range of the device to be controlled by design.

[0019] Overall, the design freedom of the sensor device itself is significantly increased.

[0020] Thus, in use, pressure or force applied directly or indirectly to the first and / or second electrode causes the first and / or second electrode to deform, change / reduce the distance / gap between the first and second electrodes, resulting in a change in capacitance - the change in capacitance can be measured by the measurement module at the sensing points (individually and / or simultaneously). Based on the position of each sensing point on the first and / or second electrode, the amplitude of the signal measured at each corresponding sensing point, the position, area and / or magnitude of the applied pressure / force can be determined.

[0021] The device can be used in a variety of pressure sensing applications, including but not limited to seat and sole pressure sensing. Traditional seat and sole pressure sensing devices rely on metal electrode materials and metal-based electronics, thus requiring additional electronic components to incorporate pressure sensing functionality into traditional non-sensor objects (such as soles). Traditional sensor approaches do not utilize the inherent materials of the object / product as the sensor electrodes themselves, such as polyurethane (PU) foam, ethylene vinyl acetate (EVA), and rubber. As a result, manufacturers and technology adopters need to implement additional assembly processes that may be different from their original manufacturing processes, thereby introducing higher risks and costs.

[0022] The determined position of the applied pressure or force can be a single point or coordinate, or include a single point or coordinate. The determined area of ​​the applied pressure or force can be the spatial range and / or shape of the applied pressure distribution, or include the spatial range and / or shape of the applied pressure distribution. The area may have a position. For example, the pressure or force can be applied at a given position on a larger area or a smaller area. The position of the area can correspond to the center of the area. The magnitude of the applied pressure or force can be a value positively correlated with the amplitude of the applied pressure or force, or include a value positively correlated with the amplitude of the applied pressure or force. The magnitude of the applied pressure or force can be a qualitative value (such as a standardized value or a relative value) or a quantitative value (such as an actual pressure or force value). In the case of requiring quantitative data, the device can be calibrated using a known pressure value or force value applied, so that the measurement result of the capacitance can be converted into a numerical value of pressure or force using a predetermined relationship.

[0023] Where there are multiple locations / regions, areas and / or distributions of applied pressure or force, the measurement module may be configured to determine multiple locations, areas and / or magnitudes of applied pressure and map the pressure distribution. Thus, the device may be, or include, a pressure mapping device.

[0024] The measurement module can be configured to map each measurement result obtained from an individual sensing point to the distance or proximity of the applied pressure / force to the individual sensing point. The measurement module can be configured to determine the location (e.g., XY location or absolute location) of the pressure applied on the device based on the mapped distance. The measurement module can be configured to determine the area or shape of the pressure applied on the device based on the mapped distance. For example, the mapped distance can correspond to the location of the boundary of the area. The location of the area can then be determined from the boundary location. After knowing the relative position of each sensing point on the first and / or second electrode, this information can be used to establish a pressure area distribution.

[0025] The first and / or second electrodes may be formed of, or include, a non-metallic electrically conductive thermoform material, and / or may be formed by a molding process.

[0026] Materials suitable for the first and / or second electrodes may include, but are not limited to, conductive plastics, conductive rubbers, conductive polymer materials, and conductive foams, such as conductive acrylonitrile butadiene styrene (ABS) or conductive PU, conductive EVA, conductive thermoplastic elastomers (TPE), and conductive thermoplastic polyurethanes (TPU). Such materials may be formed by injection molding, hot pressing, hot lamination, or thermoforming processes. Alternatively, such materials may be formed by 3D printing, computer numerical control (CNC) machining / milling, laser or water jet cutting (e.g., water jet cutting of uniform material sheets). Such materials may be made substantially rigid or flexible and / or deformable.

[0027] The first electrode and the second electrode may include or be formed of the same material or different materials. The first and / or second electrode may have a uniform thickness or a non-uniform thickness. The thickness of the first electrode and the second electrode may be the same or different.

[0028] The sensing points may be located at or near the periphery or peripheral edge of the first and / or second electrode. The sensing points may be distributed around or near the periphery or peripheral edge of the first or second electrode. The sensing points may be uniformly or non-uniformly distributed around the periphery / peripheral edge of the first and / or second electrode.

[0029] The second electrode may be arranged above, below, over, below, above or below the first electrode. The device may be configured such that the first electrode and the second electrode are permanently separated from each other in some areas such that the first electrode and the second electrode cannot contact each other, but not in other areas.

[0030] The electrode with the sensing point (i.e., the first or second electrode) may be referred to as a sensing electrode. The other electrode (i.e., the second or first electrode, respectively) may be referred to as a reference electrode or a ground electrode. The reference electrode may be connected to the measurement module at one or more reference points or ground points on the reference electrode. The reference electrode may be electrically grounded (e.g., by being connected to a ground / reference terminal of the measurement module). The first electrode and the second electrode may together form a pressure sensing layer.

[0031] Each sensing point may be selectively connected to a measurement module via a conductive trace or track. The conductive trace / track may be or include a wire, a conductive line, or a printed / deposited conductive trace / track on a substrate (eg, a thin flexible substrate or a PCB).

[0032] The measuring module can be a sensing circuit configured to measure a change in capacitance, or includes a sensing circuit configured to measure a change in capacitance, for example, at a sensing point connected to the sensing circuit. The sensing circuit can be a capacitive sensing chip with one or more sensing or input channels, or includes a capacitive sensing chip with one or more sensing or input channels, such as a capacitive sensing microprocessor or microcontroller. The capacitive sensing chip can be configured to measure the capacitance change of the sensing electrode via each sensing point connected to the input pin of the capacitive sensing chip. The capacitance measurement can be based on the self-capacitance of the sensing electrode. Alternatively, the capacitance measurement can be a frequency-based measurement. The interval change between the first and second electrodes (for example, by a change in distance / gap) affects the capacitive coupling between the first and second electrodes, which in turn produces a change in the capacitance measurement result.

[0033] Each sensing point can be connected to the sensing circuit at the same sensing input pin of the sensing circuit. This minimizes the number of sensing channels required for the capacitive sensing chip. Such a capacitive sensing chip is low cost. Alternatively, two or more sensing points (or each sensing point) can be connected to the sensing circuit at different sensing input pins of the sensing circuit.

[0034] The measurement module may also include a switch unit connected between the sensing circuit and the sensing point. The switch unit may be configured to selectively connect each sensing point to the sensing circuit and / or disconnect each sensing point from the sensing circuit. The switch unit may include one or more switch elements, such as transistors (e.g., general-purpose, PNP and / or NPN transistors), relays and / or any other controllable switch elements known in the art. Each sensing point may be connected to or connectable to an input pin of the sensing circuit via a switch element. The switch unit thus enables the sensing circuit to obtain a measurement result or reading from each sensing point individually (i.e., scanning the sensing point), from all sensing points and / or any combination of sensing points simultaneously by selectively connecting each sensing point to / disconnecting each sensing point from a (single) input pin. For example, when obtaining a measurement result from an individual sensing point, the sensing circuit may be configured to connect the sensing point to the input pin and disconnect all other sensing points from the input pin. This can ensure that the circuit will not short-circuit when determining the position, area and / or size of the applied pressure from an individual sensing point.

[0035] The measurement module may further include a control unit connected to the switching unit to control the connection and / or disconnection of each sensing point. The control unit may be configured to provide one or more control signals to the switching elements of the switching circuit to control their operation. The control unit may be configured to control the timing and / or frequency of the switching.

[0036] The measurement module can be configured to operate in a first mode and / or a second mode. In the first mode, the switching unit can scan each sensing point (i.e., selectively connect each individual sensing point to the sensing circuit one by one) so that the sensing circuit can obtain a measurement result or reading from each individual sensing point respectively. In the first mode, only one sensing point is actively connected to the sensing circuit at a given time. For example, when a measurement result or reading is obtained from one sensing point, other (non-active) sensing points may be disconnected from the sensing circuit. The scanning or switching frequency is high enough compared to the typical movement of the body to minimize any measurement lag, for example so that the measurement / detection can be sensed in real time. For example, the scanning rate can be in the range of 100 Hz to 200 Hz. The scanning or switching rate may be slower or faster, depending on the needs of the application.

[0037] In the second mode, the switch unit can simultaneously connect each sensing point to the sensing circuit so that the sensing circuit can simultaneously obtain a measurement or reading of the capacitance from each sensing point. In this way, each sensing point contributes to the measurement or reading in the second mode.

[0038] The first mode may provide information about the location, area and / or magnitude of the applied pressure. The second mode may provide information about the (total) magnitude of the applied pressure. The measurement in the second mode may be performed before or after the measurement in the first mode. The measurement module may be configured to switch / alternate periodically and / or continuously between the first and second operating modes during operation of the device. The first mode and the second mode may be controlled by a control unit.

[0039] For a given electrode conductivity, the change in capacitance measured at the sensing point depends on the change / reduction in the distance, or one or more gaps, between the first and second electrodes due to the magnitude of the applied pressure, the distance / proximity of the applied pressure (or the location of the changed distance / gap) to the sensing point, and the area of ​​the applied pressure. Thus, for a fixed location and area of ​​the applied pressure, the measurement results provide values ​​that are positively correlated with the magnitude of the applied pressure, for a fixed magnitude and area of ​​the applied pressure, the measurement results provide values ​​that are positively correlated with the distance or proximity of the location of the applied pressure to the sensing point, and for a fixed magnitude and location of the applied pressure, the measurement results provide values ​​that are positively correlated with the area of ​​the applied pressure. In the case of an applied pressure to an area, the measurement results provide information about the relative position of the boundaries of the area with respect to the sensing point. Thus, the measurement results from individual sensing points contain information about the location, area and / or magnitude of the applied pressure. By measuring a plurality of individual sensing points distributed around and / or near the sensing electrodes, the location, area and / or magnitude of the applied pressure can be determined (first mode). This information can be used to establish a pressure area profile.

[0040] The measurements obtained from all sensing points simultaneously (in the second mode) provide a numerical value that is positively correlated with the magnitude of the applied pressure. The (second mode) measurements can be used in conjunction with the (first mode) measurements from individual sensing points to improve the reliability of determining the location, area, and / or magnitude of the applied pressure. For example, the results of the simultaneous measurements (second mode) can be used to confirm whether the applied pressure corresponds to a smaller pressure distributed over a larger area, or a larger pressure distributed over a smaller area. In other words, the results of the simultaneous measurements (second mode) can be used to infer the correct cause of the numerical values ​​obtained from the results of the individual (first mode) measurements, and / or to obtain a unique solution for the location, area, and magnitude of the applied pressure.

[0041] The need to take multiple measurements at the same integral electrode to minimize engineering complexity motivates the application of a first mode of operation (i.e., scanning mode). By scanning multiple individual sensing points (in the first mode), separate measurements are taken from each different peripheral position in a very short (negligible) time span, and the pressure area distribution is jointly established and the magnitude of the applied pressure in each area is reported without modulating the material to prevent short circuits. This can significantly save manufacturing costs compared to traditional sensing technologies that include multiple discrete sensor electrodes, where each electrode is responsible for only a small local area and a considerable number of electrode modules (i.e., sensing elements) are required to cover a large sensing surface, such as a seat.

[0042] The device may include multiple sensing electrodes sharing the same reference electrode. Each sensing electrode may be connected to a measurement module. Alternatively, the device may include multiple sensing electrodes and multiple corresponding reference electrodes. In this case, each sensing electrode may be connected to a sensing circuit (e.g., connected to the same input pin) via a switching circuit. Each reference electrode may be connected to the same reference or ground terminal on the measurement module. In either case, the measurement module may be configured to obtain a pressure area distribution from each sensing electrode. These may be combined to construct an overall pressure distribution of the device. Multiple sensing electrodes may be used to meet spatial resolution requirements and / or mechanical requirements in a product. For example, in a shoe sole application, a device having multiple sensing electrodes may improve the spatial resolution of the overall combined pressure area distribution.

[0043] The part or each part of the device in which the first and second electrodes are separated or separated by a gap may form or provide a gapped portion or region. The device may include one or more gapped portions or regions in which the first and second electrodes are separated and / or separated by a gap. The first and second electrodes may be configured to approach and / or contact each other in each gapped portion / region in response to a pressure or force applied to or exerted on each corresponding gapped portion / region, and the pressure or force applied to or exerted on each corresponding gapped portion / region changes / reduces or closes the corresponding gap.

[0044] Each of the first electrode and the second electrode may include an inner surface and an outer surface. The inner surfaces of the first electrode and the second electrode may face each other. In each or the portion / region with a gap, the inner surfaces of the first and second electrodes may be separated by the gap. The gap may extend substantially between the inner surfaces of the first and second electrodes in the portion with the gap. Each or the gap may have a certain width and height.

[0045] The device may further include one or more separation elements, the one or more separation elements configured to separate the first electrode from the second electrode, for example, to separate the first electrode from the second electrode by a certain distance. The one or more separation elements may also be configured to provide, form and / or define one or more gaps or portions / regions with gaps. The width and height of the gap may be defined by the separation element.

[0046] The first electrode or the second electrode can be supported or suspended above / above the other electrode by one or more separation elements. The separation element can provide one or more support portions or regions that extend adjacent to and / or between regions with gaps. The separation element can be configured to maintain separation between the first and second electrodes and / or between the inner surfaces of the first and second electrodes. The separation element can extend between the first and second electrodes and / or can extend from one or both of the first and second electrodes. The separation element can be formed integrally with the first and / or second electrode. Alternatively or additionally, the separation element can be separated from / from the first and / or second electrode.

[0047] The separation element may comprise or be formed of a substantially rigid / incompressible material or a substantially flexible / compressible material. In the latter case, the gap may be reduced and / or closed by pressure applied directly to the gap or the portion / region with the gap and / or by pressure applied to the support region (i.e. not directly to the gap).

[0048] In one embodiment, the or each separating element comprises or the separating element is a non-conductive separating or spacing layer. The spacing layer may be sandwiched between the first electrode and the second electrode to separate or maintain separation between the first electrode and the second electrode and / or between the inner surfaces of the first electrode and the second electrode. The first electrode and / or the second electrode may be supported by the spacing layer. The spacing layer may be a monolithic material.

[0049] The spacer layer may include one or more through holes, openings or cutouts. One or more through holes, openings or cutouts may form, define or provide a gap or a portion / region with a gap. The portion or region of the spacer layer adjacent to and / or extending between the through holes, openings or cutouts may define a support region. The spacer layer may include an array of such through holes or openings. The thickness of the spacer layer may define the size / height of the gap. The width of each / the through hole or opening may define the width of the gap or the portion / region with a gap. The first electrode and the second electrode may extend through the width of the through hole or each through hole, opening or cutout.

[0050] Each or the through hole or opening may extend through the thickness of the spacer layer. Each or the through hole or opening may include a circular, square, rectangular, polygonal or any shaped cross-section. Each through hole or opening may have the same or different shapes and / or sizes. The through hole or opening may include one or more holes, cavities and / or repeated geometric patterns / tracks. Alternatively, one or more openings may partially extend through the thickness of the spacer layer. For example, one or more openings may include or be grooves or thickness variations of the spacer layer.

[0051] The spacer layer may include conductive traces or tracks that connect each sensing point to the measurement module and / or sensing circuitry.

[0052] The spacer layer can be substantially flexible, deformable and / or compressible. The spacer layer can be formed by or include a thermoformable non-conductive material and / or can be formed by a molding process. Suitable materials for the spacer layer can include, but are not limited to, non-conductive plastics, non-conductive polymer materials, and non-conductive foams, such as non-conductive acrylonitrile butadiene styrene (ABS), polyurethane (PU), polycarbonate (PC), polyvinyl chloride (PVC), ethylene vinyl acetate (EVA), thermoplastic elastomer (TPE), thermoplastic polyurethane (TPU) and silicone rubber. These materials can be made substantially rigid or flexible and / or deformable, and can undergo injection molding, hot pressing, hot lamination or thermoforming processes. Alternatively, these materials can be formed by 3D printing, computer numerical control (CNC) machining / milling, laser or water jet cutting (e.g., water jet cutting of uniform material sheets). Alternatively, the spacer layer may include or be formed by fabric, paper or latex. The spacer layer may have elasticity and / or flexibility similar to or higher than the first and second electrodes.

[0053] In some cases, eliminating the need for a separate separation / spacer layer (made of different materials) helps to further minimize assembly cost and complexity. The spacer layer can be integrally formed with the first and / or second electrode. The moldable first and / or second electrode allows them to form a customizable 3D structure, in which natural overhangs and / or protrusions can be formed and used as integral spacers.

[0054] For example, in alternative embodiments, one or more separation elements may include or be one or more projections extending from (the inner surface of) the first and / or second electrode. One or more separation elements may include or be an array of such projections. The projections may be configured to act as spacers. The spacers may be configured to maintain the first electrode and the second electrode in a spaced-apart relationship. The spacers may be integrally formed with the first and / or second electrodes to form a monolithic structure. The spacers may have a proximal end and a distal end attached to the inner surface of a respective one of the first or second electrodes.

[0055] Gaps or gapped portions / regions may be formed, provided or defined between spacers and / or in regions adjacent to spacers. One or more gaps (gaps of each or the gapped portions) or each or the gapped portions / regions may extend generally in a region around, on either side of and / or between one or more protrusions / spacers. In other words, gaps or gapped portions may be defined on either side of and / or between one or more protrusions / spacers.

[0056] The spacer may extend away from the inner surface of the first and / or second electrode to a distance defined by the length of the first and / or second electrode. The size / height of the gap (i.e., in the thickness direction) may be at least partially determined by the length of each or the projection / spacer. The width of the gap may be determined by the geometry / design of the projection / spacer, for example, by the separation between adjacent projections / spacers.

[0057] The spacer may be formed of or include the same or different material as the first and / or second electrode. The spacer may have the same or different electrical, thermal and / or mechanical properties as the first and / or second electrode. This may be achieved by forming the spacer in the same (single) molding step as the first and / or second electrode, or by using a two-step overmolding process.

[0058] The distal end of the or each spacer may contact (the inner surface of) the other of the first and second electrodes. In this case, the spacer may support the respective one or the first and second electrodes against the other of the first and second electrodes, or the other of the first and second electrodes may be supported by the spacer (depending on the orientation of the device). One or both of the first and second electrodes may include one or more protrusions to act as a spacer.

[0059] Alternatively, the spacer may not contact the other of the first electrode and the second electrode. In one embodiment, the other of the first electrode and the second electrode may include one or more corresponding through holes, openings, or cutouts configured to accommodate a portion of the spacer such that the spacer does not contact the other of the first and second electrodes. In another embodiment, the first and second electrodes may be sized such that the spacer is located outside the periphery of the other of the first and second electrodes such that the spacer does not contact the other of the first and second electrodes.

[0060] The length of the spacer (or the distance that the spacer extends away from the inner surface of the first / second electrode) can be greater than the depth of the through hole or opening (or the thickness of the electrode including the through hole or opening). In this way, the electrode including the spacer is separated from the electrode including the through hole or opening by a gap in the thickness direction (wherein the length of the spacer in the thickness direction is the same as the direction of the hole). The spacer can be configured to fit within the through hole or opening without contacting the side of the through hole or opening. The size / height of the gap (i.e., in the thickness direction) can also be at least partially determined by the depth of the through hole or opening, or the thickness of the electrode including the through hole or opening.

[0061] The spacer can be configured to minimize the footprint of the distal end. In this way, in the case where the distal end contacts the other of the first and second electrodes, the electrical contact between the two electrodes is minimized so that the capacitance measurement result is not affected. The spacer may include a sidewall connecting the proximal end and the distal end. The sidewall may extend in a direction substantially perpendicular to the inner surface of the corresponding one of the first and second electrodes. Alternatively, the sidewall may be angled relative to the inner surface of the corresponding one of the first and second electrodes so that the spacer is substantially pointed and / or the footprint of the spacer has / has a smaller footprint or cross-sectional area than the proximal end. This can reduce the footprint of the distal end. In addition, in the case where the spacer is angled, the footprint or contact area between the distal end and the other of the first and second electrodes may increase with the applied pressure due to the compression of the spacer and / or the electrode. This can provide a capacitance change that increases / combines the change caused by the reduced gap to enhance the overall amplitude of the measured capacitance change.

[0062] The protrusion or spacer may be formed of or include the same material as the first and / or second electrode including the protrusion / spacer. The protrusion may be integrally formed with the first and / or second electrode including the protrusion, for example, in the same molding step.

[0063] Alternatively, the protrusion / spacer may be formed of or include a different material and / or have different material properties (e.g., conductivity and / or mechanical properties) than the first and / or second electrode, which includes the protrusion spacer. In this way, the protrusion / spacer may have a different stiffness than the rest of the first and / or second electrode including the protrusion. For example, the protrusion / spacer may be formed in a different molding step.

[0064] The protrusion / spacer can be substantially rigid such that upon applied pressure or force, the protrusion / spacer maintains a fixed spacing between the first and second electrodes at or near the protrusion. In another example, the protrusion / spacer can be substantially deformable and / or resilient such that the protrusion / spacer is compressible upon applied pressure or force to provide a variable spacing / gap between the first and second electrodes at or near the protrusion / spacer.

[0065] The pressure or force required to change / reduce and / or close the gap can be determined in part by the flexibility / deformability of the first, second electrodes and / or separation elements, and in part by the size (i.e., width and height) of the gap or the portion / region with the gap. Thus, the thickness of the spacer layer and the width of each or the through hole or opening can be configured to set a predetermined pressure or force required to reduce / change or close the gap (the gap of each or the corresponding portion / region with the gap). Alternatively, the length of one or more protrusions / spacers and the width of the area on either side and / or between one or more protrusions / spacers can be configured to set a predetermined pressure or force required to close the or each gap (the gap of the or each corresponding portion / region with the gap). This can be used to adjust or customize the pressure sensitivity of the device in addition to adjusting the flexibility / deformability of the first and / or second electrodes.

[0066] The first electrode and / or the second electrode may have a substantially 1×10 2 Up to 1×10 6 Resistivity in the Ohm.cm range. The result of the resistance measurement between any two points on the first electrode and / or the second electrode over a distance of about 10 cm is substantially between 1 kOhm and 1 MOhm. Having a large resistivity means that the magnitude of the measured capacitance change varies more dramatically with the distance between the location of the pressure applied to the device and the individual sensing point, thereby improving the sensitivity resolution of the device and / or position sensing of pressure.

[0067] The resistivity and / or resistance of the first electrode and / or the second electrode can be adjusted by intrinsic material properties (i.e., intrinsic resistivity). Alternatively or additionally, the resistivity and / or resistance of the first electrode and / or the second electrode can be adjusted without changing the intrinsic material properties by introducing one or more holes, voids, grooves, thickness differences and / or repeated geometric patterns / tracks into the first electrode and / or the second electrode. For example, the first electrode and / or the second electrode may include or be a complex shape and / or a repeated geometric pattern to provide a predetermined resistance between any two given points. There may be a plurality of voids and / or grooves forming a regular array. One or more holes, voids and / or grooves may define a nonlinear conduction path between two points. Alternatively or additionally, one or more voids and / or grooves may define a plurality of linear and / or nonlinear conduction paths between two points.

[0068] The first electrode and the second electrode may be interchangeable. For example, the second electrode may alternatively include one or more sensing points connectable to a measurement module and / or a sensing circuit.

[0069] According to a second aspect of the present invention, a method for manufacturing a pressure sensing device of the first aspect is provided. The method includes forming a first electrode and a second electrode. The first electrode and / or the second electrode may be formed by an integral piece of a non-metallic conductive material or include an integral piece of a non-metallic conductive material. The first electrode and / or the second electrode include or are formed by a movable and / or deformable and / or flexible non-metallic conductive material. The method may also include arranging the first electrode and the second electrode in a spaced-apart configuration so that the first electrode and the second electrode are separated by a certain distance. The method also includes providing a measurement module. The method may also include connecting the measurement module to one of the first or second electrodes at one or more sensing points or multiple sensing points on the electrode. One or more sensing points may be distributed (uniformly or unevenly) around the periphery or peripheral edge of the first or second electrode. The method also includes connecting the measurement module to the other of the first or second electrodes at one or more reference points or grounding points on the other of the first or second electrodes.

[0070] The method may also include spacing the first electrode from the second electrode in the stacked arrangement, or vice versa. For example, the method may further include arranging the second electrode above, below, above, below, above or below the first electrode so that the second electrode is spaced a distance from the first electrode, and optionally so that there are one or more gapped portions / regions in which the first and second electrodes are separated by a gap. The first electrode and the second electrode may be substantially planarly aligned.

[0071] The electrode with the sensing point (ie, the first or second electrode) may be referred to as the sensing electrode. The other electrode (ie, the second or first electrode, respectively) may be referred to as the reference electrode or ground electrode.

[0072] The method may also include forming a plurality of sensing electrodes and arranging the plurality of sensing electrodes above, below, over, below, above or below the same reference electrode. The method may also include connecting a measurement module to each sensing electrode at a sensing point on the respective sensing electrode.

[0073] The method may further include forming a plurality of sensing electrodes and a plurality of corresponding reference electrodes, and arranging each sensing electrode relative to the corresponding reference electrode, for example, above, below, over, below, above, or below the corresponding reference electrode (e.g., so that they are aligned in a plane). The method may further include connecting a measurement module to each sensing electrode at a sensing point on the corresponding sensing electrode, and optionally, connecting a measurement module to each reference electrode at one or more reference or ground points on each reference electrode.

[0074] Forming the first and / or second electrode may include a thermoforming and / or molding process.One mold may be used to mold multiple sub-portions of either electrode.

[0075] The method may further include forming one or more separation elements configured to separate the first and second electrodes. The one or more separation elements may further be configured to provide or form a gap. Forming the one or more separation elements may include a thermoforming and / or molding process.

[0076] Forming one or more separation elements may include forming a non-conductive separation or spacing layer. The spacing layer may be substantially flexible or rigid. The method may also include arranging the spacing layer between the first electrode and the second electrode to separate the first electrode and the second electrode.

[0077] Forming the first and second electrodes and / or separation / spacer layers may include injection molding, hot pressing, hot lamination and / or thermoforming processes. These manufacturing processes are relatively inexpensive. Alternatively, forming the first and second electrodes and / or separation layers may include 3D printing, computer numerical control (CNC) machining / milling, laser or water jet cutting (e.g., water jet cutting of a uniform sheet of material). The method of forming each electrode may include forming the first and / or second electrodes together to attach to a non-conductive surface and / or object (e.g., overmolding the first and / or second electrodes to one side of a fabric sheet). In this arrangement, a mold is required to mold multiple sub-portions of any electrode.

[0078] Forming the separation / spacer layer may also include forming one or more through holes, openings or cutouts in the spacer layer to provide a gap for each or the respective gapped portion. Forming the spacer layer may also include forming an array of through holes in the spacer layer.

[0079] In another embodiment, forming the first and / or second electrode includes forming one or more protrusions extending from (the surface of) the first and / or second electrode. Forming one or more protrusions includes forming an array of such protrusions. The protrusions may be configured to serve as spacers. The spacer may be configured to maintain the first electrode and the second electrode in a spaced relationship. The spacer may be formed integrally with the first and / or second electrode to form a monolithic structure (e.g., formed in the same molding step). Forming the spacer may include forming a spacer having sidewalls extending in a direction substantially perpendicular to the surface of a corresponding one of the first and second electrodes. Alternatively, forming the spacer may include forming a spacer having sidewalls that are substantially angled relative to the surface of a corresponding one of the first and second electrodes, such that the spacer is generally pointed and / or the distal end of the spacer has a smaller footprint or cross-sectional area than the proximal end.

[0080] Forming the first and second electrodes may also include forming one or more through holes, openings or cutouts in one of the first and second electrodes, the one or more through holes, openings or cutouts configured to accommodate the protrusion / spacer or a portion of each protrusion / spacer so that the spacer does not contact the other of the first and second electrodes when the first and second electrodes are arranged in a spaced-apart configuration.

[0081] Optionally or preferably, forming the first and second electrodes comprises forming said array of through holes, openings or cutouts in one of the first and second electrodes to accommodate a corresponding array of said protrusions / spacers in the other of the first and second electrodes.

[0082] According to a third aspect of the invention, there is provided a method of operating the pressure sensing device of the first aspect. The method may include measuring a change in capacitance between a first electrode and a second electrode, when pressure or force is applied to the first and / or second electrodes, individually at each sensing point or optionally at all sensing points simultaneously, the change in capacitance being responsive to a change in the distance (or optionally, one or more gaps) between the first and / or second electrodes. The method may also include determining the area, location and / or magnitude of the pressure applied to the first and / or second electrodes.

[0083] The step of determining the area, location and / or magnitude of the pressure applied to the first and / or second electrode may further include mapping each measurement obtained from an individual sensing point to a distance or proximity of the applied pressure / force from the individual sensing point. The step also includes determining the area and / or location of the pressure applied to the first and / or second electrode based on the mapped distance. Determining the area may include determining the shape of the applied pressure. The method may also include determining a pressure area distribution based on the determined area, location and / or magnitude of the applied pressure.

[0084] The change in capacitance may be measured at the measurement module. Measuring the change in capacitance at each sensing point individually may include scanning each sensing point in sequence. Scanning may include selectively connecting / disconnecting each sensing point to the measurement module such that only one sensing point or any combination of sensing points is connected to the measurement module at any given time. This may ensure that the circuit is not shorted when determining the location, area, and / or magnitude of applied pressure from individual sensing points.

[0085] For example, while a measurement or reading is being taken from one sensing point, the other (inactive) sensing points may be disconnected from the sensing circuit. The scanning frequency is high enough to minimize any measurement lag compared to typical movements of the body, e.g., so that the measurement / detection may be sensed in real time. For example, the scanning rate may be in the range of 100 Hz to 200 Hz. The scanning rate may be slower or faster depending on the application.

[0086] By scanning multiple individual sensing points, a separate measurement / reading is obtained from each different location in a short (negligible) time span, which together establishes the pressure area distribution and gives a notice of the amount of pressure applied in the area, without the need for modulating materials to prevent short circuits. This can significantly save manufacturing costs compared to conventional sensing technologies that include multiple dispersed sensor electrodes, where each electrode is responsible for only a small local area and a relatively large number of electrode modules (i.e., sensing elements) are required to cover a large sensing surface, such as a seat.

[0087] Simultaneously measuring the change in capacitance at each sensing point includes connecting each sensing point to a measurement module.

[0088] The measurement variation involves using a single input pin of a capacitive sensing chip for the measurement module.

[0089] According to a fourth aspect of the present invention, there is provided a shoe sole comprising one or more pressure sensing devices according to the first aspect.

[0090] According to a fifth aspect of the present invention, there is provided a seat for a car or an aircraft, the seat comprising one or more pressure determining devices according to the first aspect.

[0091] According to a sixth aspect of the invention, there is provided a consumer product comprising one or more pressure sensing devices according to the first aspect. The consumer product may comprise or be a phone housing, a laptop, or a surface of a wall, table or object, wherein the one or more pressure sensing devices are configured to provide one or more touch pads. The consumer product may be connectable to a computing device to provide a user interface to control one or more functions of the computing device based on the determined location, area and / or magnitude of pressure applied to the one or more sensing devices.

[0092] Aspects and / or embodiments of the invention may include any one or more of the features described or defined herein. Features described in the context of separate aspects and / or embodiments of the invention may be used together, may be removed or replaced, and / or may be interchangeable. Similarly, where features are described in the context of a single embodiment for the sake of brevity, these features may also be provided separately or in any suitable sub-combination. Features described in conjunction with an apparatus have corresponding features defined with respect to a method, and vice versa, and these embodiments are specifically contemplated. BRIEF DESCRIPTION OF THE DRAWINGS

[0093] In order that the present invention can be better understood, embodiments will now be discussed by way of example only with reference to the accompanying drawings, in which:

[0094] Figure 1 a and Figure 1 b shows a pressure sensing device according to the invention in a top schematic plan view, and a switching unit of the device in the top schematic plan view is shown in a bottom schematic plan view;

[0095] Figure 2a and Figure 2b The embodiment according to the present invention is shown Figure 1 Schematic cross section of a sensing layer of a device;

[0096] Figure 3 It shows that according to the present invention Figure 1 Schematic cross section of a sensing layer of a device;

[0097] Figure 4 a to Figure 4 c shows another embodiment of the present invention. Figure 1 Schematic cross section of a sensing layer of a device;

[0098] Figure 5 a to Figure 5 c respectively show the Figure 3 A top view, a side view and an exploded view of the sensing layer;

[0099] Figure 6 a and Figure 6 b shows the structure of the shoe with the components of FIG. 2 and FIG. 3 integrated into the sole, respectively. Figure 5 An exploded view and a side view of an embodiment of a pressure mapping device of a sensing layer;

[0100] Figure 6 c shows the Figure 6 a and Figure 6 b An exemplary pressure diagram of the device;

[0101] Figure 7 a and Figure 7 b shows an exploded view and a side view of another embodiment of a pressure mapping device, respectively, wherein Figure 3 and Figure 5 The sensing layer is integrated into the sole;

[0102] Figure 7 c shows the Figure 7 a and Figure 7 b Example pressure diagram of the device;

[0103] Figure 8 a to Figure 8 c respectively show the Figure 4 b: cross-section, exploded view, and top and side views of the sensing layer;

[0104] Figure 8 d shows the Figure 8 a to Figure 8 c Example pressure map of the sensing layer;

[0105] Fig. 9 a to Fig. 9 c respectively show the embodiment according to another embodiment Figure 4 b top view, side view and exploded view of the sensing layer;

[0106] Fig.10 a to Fig.10 c shows Figure 1 Different measurement configurations of the device;

[0107] Fig.11 Techniques for determining pressure areas and locations are shown;

[0108] Fig.12 a to Fig.12 f shows example measurement results for different distributions of applied pressures;

[0109] Fig.13 a to Fig.13 g shows Figure 3 Different configurations of electrodes of the sensing layer to control electrode resistance;

[0110] Fig.14 a to Fig.14 c shows the sensing layer that can be adapted to a surface of arbitrary shape;

[0111] Fig.14 d to Fig.14 e shows a sensing layer formed in an arbitrary shape;

[0112] Fig.15 It shows that multiple Figure 1 a system of devices;

[0113] Fig.16 a shows a plurality of pressure sensing devices integrated into the seat;

[0114] Fig.16 b schematically shows the Fig.16 Different pressure diagrams obtained for the seat of a;

[0115] Fig.17 The invention shows a device integrated into the housing of a smartphone or tablet computer. Figure 1 Devices;

[0116] Fig.18 A touch panel integrated into a computing device is shown. Figure 1 Devices;

[0117] Fig.19 shows the surface integrated into the wall Figure 1 devices; and

[0118] Fig. 20 Shown is the integration into the table surface Figure 1 device.

[0119] It should be noted that the drawings are schematic and may not be drawn to scale. For clarity and convenience in the drawings, the relative sizes and proportions of parts of these drawings may have been shown exaggerated or reduced. The same reference numerals are generally used to refer to corresponding or similar features in modified and / or different embodiments. DETAILED DESCRIPTION

[0120] Figure 1a (top panel) shows a schematic diagram of a pressure sensing device 1000 according to an embodiment of the present invention. The device 1000 includes a pressure sensing layer 100 connected to a measurement module 500 at a plurality of sensing points S1, S2 located at or near the periphery of the sensing layer 100. The sensing layer 100 is configured to provide a change in an electrical signal (capacitance) in response to a pressure or force applied on or to (either side of) the sensing layer 100, as will be discussed in more detail below with reference to FIG. 2. The measurement module 500 is configured to measure the electrical signal and determine the location, area, and magnitude of the pressure applied on the sensing layer 100 based on the measured electrical signal.

[0121] The measurement module 500 includes a sensing circuit 300 configured to measure the capacitance change caused by pressure at the sensing points S1, S2. In an embodiment, the sensing circuit 300 is a capacitance sensing chip having one or more sensing / input channels or pins 320, such as a capacitance sensing microprocessor or microcontroller. The sensing circuit 300 is connected to the switch unit 200 (an example of which is shown in FIG. 2 ). Figure 1 The switch unit 200 is configured to selectively connect the sensing points S1, S2 to the sensing circuit 300 and disconnect the sensing points S1, S2 from the sensing circuit 300. The switch circuit 200 includes a plurality of switch elements SW1, SW2, such as transistors (e.g., general PNP and / or NPN transistors), relays, and / or any other controllable switch elements known in the art. Figure 1 In the embodiment shown in FIG. 1 , each sensing point S1, S2 is connected to the same input pin 320 of the sensing circuit 300 via the switching elements SW1, SW2. The switching unit 200 thus enables the sensing circuit 300 to obtain measurements or readings from each sensing point S1, S2 individually, from all sensing points S1, S2 simultaneously, and / or from any combination of sensing points S1, S2 using only a single input pin 320 by selectively connecting / disconnecting each sensing point S1, S2. Alternatively, each sensing point S1, S2 may be connected to a different input pin 320 of the sensing circuit 300, such as Figure 1 b. Fig.10 and Fig.11 The measurement configuration is described in more detail.

[0122] Each sensing point S1, S2 is connected to the measuring module 500 via a conductive trace 40. For example, the conductive trace 40 may include or be a flexible (not shown) substrate or printed circuit board (or a separate spacer layer, see Figure 7 a and Figure 7 b) conductors, conductive wires or conductive tracks. Figure 1 a and Figure 1 Only the connection to the input pin 320 is shown in FIG. 1 , but there may be additional connections (not shown) required for the measurement between the sensing layer 100 and the sensing circuit 300. For example, one or more portions of the sensing layer 100 may be connected to a ground or reference pin of the sensing circuit 300 via the conductive trace 40 (see below).

[0123] The measurement module 500 also includes a control unit 400, which is connected to the switch unit 200 to control the switch elements SW1, SW2, thereby controlling the connection between the sensing points S1, S2 and the sensing circuit 300. The control unit 400 may include or be a microcontroller or microprocessor chip. The control unit 400 includes a plurality of input / output (I / O) channels 410 connected to the corresponding control inputs / terminals of the switch elements SW1, SW2, and the switch elements SW1, SW2 provide output signals, which are configured to control the timing and frequency of switching of each switch element SW1, SW2. The timing and frequency of switching can be controlled by a software program running on the control unit 400 or another computing device in communication with the control unit 400. In the case of transistors, in Figure 1 a and Figure 1 An example configuration of the controllable switch elements SW1, SW2 is shown in the bottom plane of b. It should be understood that the above switching operation can be achieved in other ways and / or using other active or passive switch components.

[0124] The control unit 400 is further configured to receive measurement data from the sensing circuit 300 (e.g., via the I / O channel 410) for determining the location, area, and magnitude of the applied pressure. Calculations of the location, area, and magnitude of the applied pressure may be performed on-chip using appropriate software running on the control unit 400. The control unit 400 may be configured to store, process, and / or analyze data. Alternatively or additionally, the control unit 400 may communicate with a remote computing device running software that is configured to receive, process, store, and / or analyze measurement data from the control unit 400 (not shown). For example, the computing device may be configured to visualize data obtained from the device 1000. The computing device may include a user interface configured to visualize data and control the device 1000. Reference will be made below to Fig.12 The determination of the location, area and magnitude of pressure is discussed in more detail.

[0125] The sensing layer 100 is configured to provide pressure-induced capacitance changes that can be measured by the sensing circuit 300 at the sensing points S1, S2 by deformation of the sensing layer 100. Alternatively, this allows the sensing circuit 300 to include or be a commercially available capacitive sensing microprocessor (CSM) or microcontroller. Such CSMs are typically cheaper and require fewer sensing input pins 320 than pressure sensing microprocessors or force sensors. Figure 1 In the embodiment of a, using a smaller number of input pins allows for the use of a less expensive alternative CSM (eg, having a smaller number of channels) rather than a multi-channel CSM having a greater number of pins (eg, 8 channels versus 16 channels).

[0126] Figure 2a A cross-sectional view of a pressure sensing layer 100 having generality is shown to illustrate the general form and operating principle of the device 1000. The sensing layer 100 comprises a first electrode 10 and a second electrode 20 spaced apart from the first electrode 10 in a thickness direction Z, such that the electrodes 10, 20 are separated from each other by a distance d. In other words, the two electrodes 10, 20 are arranged in a stacked configuration, one above the other. Although the second electrode 20 is shown as being arranged above the first electrode 10, the order of the two electrodes 10, 20 may be swapped. For example, the second electrode 20 may alternatively be arranged below / under the first electrode 10.

[0127] The first electrode 10 and / or the second electrode 20 are formed of or include a movable and / or deformable and / or flexible material. One or each of the first electrode 10 and the second electrode 20 may be movable relative to each other, or the first electrode 10 and / or the second electrode 20 may deform and / or bend in response to pressure or force applied to or on either electrode 10, 20 (i.e., from either or both sides of the sensing layer 100) to reduce / change the distance d between the electrodes 10, 20 in one or more locations (uniformly or non-uniformly). This Figure 2a It is shown in Figure 2aThe second electrode 20 is shown in a substantially undeformed / unbent position (i) in the absence of pressure / force, and in a substantially deformed / bent position (ii) in the presence of pressure or force applied to the second electrode 20 from the second electrode 20 side of the sensing layer 100, which reduces the distance d, as indicated by the arrow. Thus, at least the electrode to which the applied pressure or force is applied is substantially deformable and / or flexible, or capable of bending, in order to enable the device 1000 to operate. The other electrode may be substantially rigid or deformable / flexible, depending on the application requirements. For example, if the entire sensing layer 100 needs to be flexible, both electrodes 10, 20 may be deformable / flexible.

[0128] The capacitance of the first electrode 10 is affected by the proximity of or distance to the second electrode 20, and vice versa. Thus, a change / reduction in the distance d in response to a pressure or force applied on or to the sensing layer 100 results in a change in the capacitance between the first electrode 10 and the second electrode 20, which can be measured by the sensing circuit 300 at the sensing points S1, S2. This is the basis for the operating principle of the device 1000, which will be described in more detail below. Furthermore, the operation of the device 1000 does not rely on any capacitive coupling of the electrodes 10, 20 with an object or subject providing the pressure / force.

[0129] The sensing points S1, S2 may be located on the first electrode 10 or the second electrode 20. The electrode with the sensing points S1, S2 is a sensing electrode. The other electrode is a reference electrode (not shown) connected to a ground or reference pin of the sensing circuit 300 at one or more reference points.

[0130] The distance d between the electrodes 10, 20 or the space between the electrodes 10, 20 may be substantially hollow, such that the electrodes 10, 20 are separated from each other by a gap (e.g., an air gap or a void). Alternatively, the space between the electrodes 10, 20 may be at least partially filled or occupied by a non-conductive spacer layer or spacer material that is substantially compressible and elastic to allow the distance d between the electrodes 10, 20 to change under an applied pressure / force (not shown). For example, the spacer layer / material may be formed of or include the following materials: ABS, EVA, PU, ​​rubber, or foam.

[0131] Figure 2bAn example of a sensing layer 100 is shown, in which the electrodes 10, 20 are separated from each other by a gap. In this embodiment, the sensing layer 100 includes one or more gapped portions 110, in which the first electrode 10 and the second electrode 20 are separated by the gap. Outside the gapped portions 110 are one or more support portions 120, in which the first electrode 10 and the second electrode 20 are separated by one or more separation elements (not shown). The separation elements are configured to maintain the separation between the first electrode 10 and the second electrode 20 and to provide or form the gap. Thus, the separation elements support the overall structure of the sensing layer 100. The separation elements can be separate from the first electrode 10 and / or the second electrode 20 or integrated with the first electrode 10 and / or the second electrode 20, such as Figure 3 , Figures 4 to 7 shown and described below.

[0132] The first electrode 10 and the second electrode 20 are formed of or include an integral piece of a non-metallic conductive material, such as a conductive plastic or polymer (e.g., conductive acrylonitrile butadiene styrene (ABS), conductive ethylene vinyl acetate (EVA), or conductive polymethane (PU). Such materials are thermoformable and can therefore be formed using known molding processes such as injection molding, hot pressing, or any other thermoforming process. This significantly increases the design freedom for the electrode shape and the device 1000 itself.

[0133] In one embodiment, the sensing electrode (ie, the first electrode 10 or the second electrode 20) may have a substantially 1×10 2 Up to 1×10 6 The resistivity of the sensing electrode is in the range of 1 kOhm.cm. This means that the result of the resistance measurement between any two points on the sensing electrode at a distance of about 10 cm is substantially between 1 kOhm and 1 MOhm. The reference electrode (i.e., the other of the first electrode 10 or the second electrode 20) can have the same or different resistivity as the sensing electrode. For example, the reference electrode can have a much lower resistivity than the sensing electrode.

[0134] Figure 3 One embodiment of a sensing layer 101 is shown in which the separation element comprises or is a non-conductive separation or spacing layer 30 located between the first electrode 10 and the second electrode 20. The spacing layer 30 comprises one or more openings 32 that form / provide a gap, and thus form a gapped portion 110 and a support portion 120. The width W of the gap or gapped portion 110 is defined by the size and shape of the openings 32. Thus, the spacing layer 30 separates the first electrode 10 and the second electrode 20 and also electrically isolates the first electrode 10 and the second electrode 20 in the support portion 120.

[0135] The spacer layer 30 may include or be formed of a non-conductive plastic or polymer material (e.g., ABS, EVA, or PU) or any other thermoformable non-conductive material. In this manner, the spacer layer 30 may also be formed using a molding process. Alternatively, the spacer layer 30 may include or be formed of a fabric or fiber material (such as paper). In the case where the spacer layer 30 includes or is formed of a thermoformable non-conductive material and is produced by a molding process, the opening 32 may be formed by the same molding process. Alternatively, the opening 32 may be formed by selectively cutting or removing material from a uniform sheet forming the spacer layer 30.

[0136] Depending on the application requirements, the spacer layer 30 can be substantially rigid or deformable / flexible. For example, if the entire sensing layer 100 needs to be flexible, both the first electrode 10 and the second electrode 20 and the spacer layer 30 may include or be formed of a deformable / flexible material. In the case where the spacer layer 30 is flexible / deformable, the spacer layer can be compressed under the applied pressure, thereby changing the gap between the first electrode 10 and the second electrode 20. In this case, the sensing layer 101 can respond to the pressure applied to the support portion 120 and the gap portion 110 or to the pressure applied to both.

[0137] Although the sensing layer 101 is shown as a three-layer structure, it is understood that the sensing layer 101 may include additional conductive / non-conductive layers without changing the operating principle of the device 1000. For example, the spacer layer 30 itself may be formed as a multi-layer structure.

[0138] Figure 4 a to Figure 4 c shows an alternative embodiment of the sensing layer 102, wherein the first and second electrodes 10, 20 are separated from each other and a gap is formed without the use of a separate spacer layer 30. In this embodiment, the separation element includes or extends from the inner surface 20i of the second electrode 20 to act as a spacer. One or more protrusions 24 (although it is understood that either or both of the electrodes 10, 20 may include such protrusions). The spacers 24 of the sensing layer 102 are integrally formed with the first and / or second electrodes 10, 20 to form a monolithic structure (e.g., formed during the same molding process). In this embodiment, the width W of the gap or gapped portion 110 is defined by the area between adjacent spacers 24 and / or the area surrounding the spacers 24.

[0139] exist Figure 4 In the embodiment of a, the spacer 24 is located outside the periphery of the first electrode 10 and extends to the (non-conductive) support surface S, so that the spacer 24 does not contact the first electrode 10. Figure 4In the embodiment of FIG. 1 and FIG. 2 , the spacer 24 extends through one or more openings 12 in the first electrode 10 to the supporting surface S, such that the spacer 24 does not contact the first electrode 10 (i.e., the spacer 24 fits within the opening 12 such that the spacer 24 does not contact the sides of the opening 12). In both examples, the spacer 24 extends in the thickness direction of the sensing layer 102 (i.e., the Z direction) to a length greater than the thickness of the first electrode 10. This ensures that when the first electrode 10 is placed against the surface S, the spacer 24 abuts against the surface S, supporting the second electrode 20 in a spaced relationship from the first electrode 10 and forming / providing a gap, as shown. In addition, because the spacer 24 does not contact the first electrode 10, the first and second electrodes are electrically isolated.

[0140] In the case where the electrode including the spacer 24 is deformable, the spacer 24 can be compressed under the applied pressure, thereby changing the gap between the first electrode 10 and the second electrode 20. In this case, the sensing layer 102 can respond to the pressure applied to the support portion 120 and the gap portion 110 or to both.

[0141] exist Figure 4 In an alternative configuration shown in FIG. 3 , the spacer 24 supporting the electrode 20 can rest directly on the surface 10i of the first electrode 10. Due to the relatively high resistivity of the electrodes 10, 20, a substantial short circuit of the electrodes is avoided and the capacitance measurement result is not impaired. In this case, the spacer 24 can be configured to minimize the contact area between the distal end of the spacer 24 and the first electrode 10. For example, the spacer 24 can be generally convex or pointed, such as Figure 4 c. In this way, when pressure is applied to the sensing layer 102, the contact area between the spacer 24 and the first electrode 10 can be increased due to the deformable nature of the first electrode 10 and / or second electrode 20 material, thereby producing a change in the measured capacitance in addition to the change in capacitance produced by the change in the gap alone. The sensing layer 102 can therefore respond to pressure applied to the support portion 120 and the portion with the gap 110 or to both.

[0142] Since the spacer 24 is integrally formed with the first and / or second electrode 10, 20, the manufacturing and assembly of the sensing layer 102 can be simplified compared to the sensing layer 101 that requires a separate spacer layer 30. The spacer 24 may include or be formed of the same material as the first and / or second electrode 10, 20, and thus have the same electrical and / or mechanical properties as the first and / or second electrode 10, 20. Alternatively, the spacer 24 may include or be formed of a different material than the first and / or second electrode 10, 20 and / or have different electrical and / or mechanical properties than the first and / or second electrode 10, 20, for example by using a two-step overmolding process (e.g., by Figure 4 b and 4c). In this way, the spacer 24 can be formed of or include a non-conductive material, for example, to ensure that the electrodes 10, 20 remain electrically isolated even when the spacer 24 rests directly on the inner surface 10i of the first electrode 10, as in Figure 4 As seen in c.

[0143] Due to the absence of the spacer layer 30, the sensing layer 102 can be suitable for scaling down to smaller sizes because the size and geometry of the integral spacer 24 and / or opening 12 can be more accurately controlled during the molding process. For example, feature sizes as low as 0.1 mm with a tolerance of 0.01 mm can be achieved using injection molding, thereby allowing smaller pressure sensing devices, such as devices with specific shapes / contours and XYZ dimensions as small as 0.5 mm to 1 mm, to be produced and easily integrated with smaller products / objects. In contrast, it is difficult to fit off-the-shelf electronic pressure sensors or load cells into smaller products / objects.

[0144] The device 1000 responds to the applied pressure to reduce the gap, and the applied pressure to close the gap. The pressure sensitivity of the sensing layer 100, 101, 102 is determined by the ease with which the electrode to which the pressure is applied is deformed and bent to reduce and ultimately close the gap. This is determined by the rigidity / flexibility of the first and / or second electrodes 10, 20 and the geometry of the gap or the portion 110 with the gap (i.e., the height and width W of the gap). For example, the larger the width W of the gap, the easier it is to deform and bend the first and / or second electrodes 10, 20. In addition, the smaller the height of the gap, the smaller the pressure / force required to close the gap. As described above, the geometry of the gap or the portion 110 with the gap is primarily determined by the separation element, i.e., the size / shape of the thickness spacer layer 30 and the opening 32 (for the sensing layer 101) or the length and arrangement of the spacer 24 (for the sensing layer 102). Furthermore, it should be understood that the flexibility / rigidity of the electrodes 10, 20 of the sensing layers 100, 101, 102 is itself determined by the (intrinsic) mechanical properties of the electrode material and the electrode geometry (e.g., the thickness of the first and / or second electrodes 10, 20). Due to the use of moldable materials, the geometry of the electrodes 10, 20 and the gap can be easily adjusted by design to customize the flexibility of the device 1000 and thus the pressure sensitivity to meet the needs of a specific application. For example, the inner surface 10i, 20i of any of the electrodes 10, 20 may include one or more grooves, ridges and / or undulations 20r to enhance flexibility, such as Figure 4 As shown in a.

[0145] In addition, for a given applied pressure profile (responsivity), the magnitude of the signal measured by the sensing circuit 300 is related to the total deformed area. This is related to the size of the individual gapped portions 110, but also to the fill factor of the sensing layer 100, 101, 102, i.e., the ratio of the total area of ​​the sensing layer 100, 101, 102 occupied by the gapped portions 110 to the total area of ​​the sensing layer 100, 101, 102. The fill factor can be controlled independently of the size of the individual gapped portions 110, for example, by the number and density of the openings 32 or spacers 24. In this way, multiple design variables can adjust the device sensitivity over time, depending on the application needs.

[0146] Figure 5 a to Figure 5 c shows an embodiment of the sensing layer 101, in which the spacer layer 30 includes an array of openings 32. Each opening 32 forms and / or provides a separate gapped portion 110. In this way, the pressure or force applied to the sensing layer 100 will change the gap in one or more gapped portions 110, and the change in the gap can be detected by the sensing circuit 300 (not shown) as a change in capacitance. In this example, the sensing layer 101 includes four sensing points S1, S2, S3, S4 on the second electrode 20. The first electrode 10 is grounded. Alternatively, the sensing points S1, S2, S3, S4 can be located on the first electrode 10, and the second electrode 20 can be grounded. The plurality of openings 32 can be substantially the same size and shape, as shown, or can be different sizes and shapes (not shown). In addition, the openings 32 can form a regular array, as shown (e.g., a repeating geometric pattern), or can form an irregular pattern (not shown). One or more openings 32 can form an elongated straight line or curve or a wavy pattern (not shown).

[0147] Figure 6 a and Figure 6 b shows an embodiment of a device 1000 having a sensing layer 101 configured as a pressure sensing sole. The sole device 1000 includes a plurality of first electrodes 10a to 10f, a single integral spacer layer 30, and a single integral second electrode 20. Each first electrode 10a to 10f is a sensing electrode, and the sensing electrode includes a plurality of sensing points S1 to S12 distributed around the periphery of the sensing electrode for connecting to a measurement module 500 via a trace 40. The second electrode 20 is a reference electrode for connecting to a ground / reference pin of the measurement module 500. In this way, a single integral reference electrode is used as a reference electrode for each individual sensing electrode, thereby simplifying assembly and manufacturing. In this example, the first electrodes 10a to 10f forming the sensing electrodes are located below the reference electrode. This allows the sensing electrodes to be cut to the (usually flat) sole, while the reference electrode can be formed / molded into the 3D shape of a typical sole, such as Figure 6b. This arrangement also allows the ground reference to shield the sensing electrode from any parasitic external capacitance (e.g., originating from the user's foot). The upper side of the second electrode 20 may be coated or covered with a non-conductive material to provide (electrical and physical) protection and / or water resistance, for example, the covering / coating may be a waterproof fabric.

[0148] The first electrodes 10a to 10f are arranged according to typical pressure zones of the foot. Separating / dividing the sensing electrodes in this manner can provide improved spatial resolution of pressure sensing. The spacer layer 30 includes a plurality of openings 32 also arranged in zones, each zone corresponding to one of the first electrodes 10a to 10f. Similarly, in this example, a single integral spacer layer 30 is used as the spacer layer 30 for each first electrode 10a to 10f, thereby simplifying assembly and manufacturing. Alternatively, it will be appreciated that the (second) reference electrode and / or the spacer layer 30 can be separated / divided into a plurality of separate spacer layers 30 to match the separate sensing electrodes.

[0149] Conductive traces 40 are formed in or on a flexible substrate (e.g., a flexible PCB) that extends around the perimeter of the sensing layer 101, which in this case corresponds to the perimeter of the sole. Arranging the traces 40 in this manner can increase the robustness of the sole device 1000 by reducing the pressure or force directly exerted by the foot on the traces 40 and the associated wear and tear.

[0150] Each opening 32 provides a gapped portion 110 that contributes to the capacitance change measured at the sensing point in response to the applied pressure or force. By scanning each sensing point S1 to S12 on each sensing layer 10a to 10f, multiple force application locations / areas can be determined and a pressure area map can be established. Figure 6 c shows the Figure 6 a and Figure 6 b is an exemplary pressure area graph obtained by the sole device 1000. Each circle represents an XY position on the graph, and the radius of each circle represents the magnitude of the pressure or force determined at that position.

[0151] Figure 7 a and Figure 7 FIG. 1B shows an alternative embodiment of a sole device 1000 having a sensing layer 101, wherein the first electrode 10 is a single integral sensing electrode and the trace 40 is integrated into the spacer layer 30. The trace 40 can be printed onto a non-conductive material as described above. Alternatively, the trace 40 can be formed using a conductive line integrated into / on a non-conductive material (e.g., a fabric). Integrating the trace 40 into / on the spacer layer 30 can simplify the manufacture and assembly of the device 1000. Figure 7c shows that when the user wears it, Figure 7 a and Figure 7 b is a corresponding exemplary pressure area diagram obtained by the sole device 1000.

[0152] although Figure 6 and Figure 7 The sensing layer 101 is shown as including a plurality of interspaced portions 110 , but it is understood that the device 1000 may be formed with one or more sensing layers 100 that do not have any interspaced portions 110 .

[0153] Figure 8 a to Figure 8 c shows an embodiment of a sensing layer 102 comprising three spacers 14 extending from the inner surface 10i of the first electrode 10, and three corresponding openings 22 formed in the second electrode 20. In this example, the spacers 14 and the openings 22 are arranged in a linear array. The first electrode 10 is a sensing electrode having sensing points S1, S2 at each end of the array, and the second electrode 20 is a reference electrode for grounding. Additional sensing points may be provided around the periphery of the sensing electrode. In this example, the width of the sensing layer 102 is approximately 5 mm. In use, the lower electrode (in this case the second electrode 20) may be fixed to the surface S, for example, by an adhesive. Figure 8 d shows that when pressure is applied in two locations, Figure 8 a to Figure 8 c. Example pressure region diagram obtained by the sensing layer 102. Figure 6 and Figure 7 Likewise, each circle represents an XY location on the graph, and the radius of each circle represents the magnitude of the pressure or force determined at that location.

[0154] Fig. 9 a to Fig. 9 c shows an alternative embodiment of the sensing layer 102, which includes a larger spacer 14 and an array of openings 22. In this example, the second electrode 20 is a sensing electrode having a plurality of sensing points S1 to S4 distributed around the periphery of the second electrode, and the first electrode 20 is a reference electrode for grounding (although either of the first electrode 10 and the second electrode 20 may be used as a sensing electrode).

[0155] The measurement module 500 is configured to operate in a first mode and a second mode. In the first mode, the switch unit 300 scans each sensing point S1, S2 one by one, so that the sensing circuit 300 can obtain a measurement result or reading from each individual sensing point S1, S2 respectively. In the second mode, the switch unit 300 connects all sensing points S1, S2 to the sensing circuit 300, so that the sensing circuit 300 can obtain a single measurement result or reading of capacitance from all sensing points S1, S2 at the same time. In this way, each sensing point S1, S2 contributes to the measurement or reading in the second mode. In the first mode, only one sensing point S1, S2 is actively connected to the sensing circuit 300 at a given time. For example, when a measurement or reading is taken from one sensing point S1, S2, the other (inactive) sensing points S1, S2 can be disconnected from the sensing circuit. Compared with the typical movement of the body, the scanning frequency can be high enough to minimize any measurement lag, for example, so that the measurement / detection can be perceived in real time. For example, the scanning rate can be in the range of 100 Hz to 200 Hz. The scanning or switching rate can be slower or faster, depending on the needs of the application. The measurement module 500 is configured to periodically and / or continuously switch / alternate between the first operating mode and the second operating mode during operation of the device 1000. Each cycle provides a reading cycle or measurement cycle C1 including N+1 readings, where N is the number of detection points S1, S2. In an embodiment, the switch unit 300 is controlled by the control unit 400, so the first mode and the second mode are controlled by the control unit 400.

[0156] Fig.10 a to Fig.10 c shows an example measurement cycle for a sensing layer 100, 101, 102 having two sensing points S1 and S2, wherein each sensing point S1, S2 is connected to a switching unit 200 providing a single output to an input pin 320 of a sensing circuit 300. Each switching element SW1, SW2 is controllable (via a control unit 400, not shown) to switch between a closed state in which the respective sensing point S1, S2 is connected to the input pin 320, and an open state in which the respective sensing point S1, S2 is disconnected from the input pin 320. Reading cycle C1 includes three readings, two in a first operating mode and one in a second operating mode. To generate a first reading in the first operating mode, switch SW1 is closed and switch SW2 is open, thereby capturing a reading from sensing point S1 at the input pin 320 (see Fig.10 a) To generate a second reading in the first operating mode, switch SW1 is opened and switch SW2 is closed, thereby capturing a reading from sensing point S2 at input pin 320 (see Fig.10b) To generate a reading in the second operating mode, the two switches SW1, SW2 are closed, thereby capturing the readings from the two sensing points S1, S2 at the input pin 320 (see Fig.10 c).

[0157] As described in more detail below, readings from individual sensing points S1, S2 in a first mode and from all sensing points S1, S2 simultaneously in a second mode are used to determine the location, area and magnitude of the applied pressure. The measurement cycle C1 is repeated (continuously or periodically) to monitor changes in pressure and interactions with the sensing layers 100, 101, 102 in near real time.

[0158] The capacitance measurement or reading from each sensing point S1, S2 is positively correlated to the magnitude of the applied pressure. Due to the relatively high resistivity of the electrode material, the capacitance measurement or reading resulting from a given applied pressure decays with the distance (x) from the sensing point S1, S2. Therefore, the reading from each individual sensing point S1, S2 is related to the distance / proximity from / to the magnitude / location of the applied pressure at the sensing point S1, S2, and also the magnitude of the applied pressure. Since the geometry of the sensing layer 100, 101, 102 and the location / position of the sensing points S1, S2 on the sensing layer 100, 101, 102 are known, the location and area of ​​the applied pressure on the sensing layer 100, 101, 102 can be determined by calculating the distance of the force application location from each sensing point S1, S2, and then calculating the location and magnitude based on those distances.

[0159] The readings from the individual sensing points S1, S2 can be mapped to the distance x based on the known dependence of the readings on the distance x. For example, the relationship can be expressed by an exponential function f(x)=e -nx , where e represents a constant and n is an adjustable parameter representing the decay rate, which relationship can be determined / derived experimentally. Based on the value of the capacitance reading recorded at each sensing point S1, S2, a radius x having a value of 1 , x 2 The circle drawn from each sensing point S1, S2 outlines the perimeter of the area A of applied pressure. Therefore, this method can be used to reconstruct the location and area A (shaded area) of applied pressure, as shown in Fig.10 As shown. It follows that the greater the number of sensing points (circles), the greater the accuracy and spatial resolution of the pressure area mapping. However, it is understood that the sensing layers 100, 101, 102 may include any number N of sensing points S1, S2, ... S depending on the application requirements. NOne or two sensing points S1, S2 provide one-dimensional (eg, X or Y) position sensing / area sensing, while three or more sensing points S1, S2 may provide two-dimensional (eg, XY) position sensing / area sensing.

[0160] The readings obtained in the first operating mode are used to determine the location, area and / or magnitude of the applied pressure. Fig.11 A rectangular area A is shown in FIG, but it will be appreciated that the method may be used to determine any area A having any arbitrary shape. The readings obtained in the second operating mode provide information about the total pressure applied to the entire sensing layer 100, 101, 102, which may be used in conjunction with the first mode measurements to improve the accuracy / reliability of the determined location, area, and / or magnitude of the applied pressure. For example, since the readings obtained in the first mode depend on both the magnitude of the applied pressure and the distance x, the second mode readings may be used to confirm whether the readings obtained in the first mode correspond to a smaller pressure distributed over a larger area, or vice versa. Thus, the combination of the two modes provides a more reliable pressure area map.

[0161] The pressure region map or information obtained from the device 1000 can be qualitative (e.g., normalized or relative values) or quantitative (e.g., when actual pressure values ​​are required). In the case where quantitative data is required, the capacitance measurement can be converted to a pressure value using a predetermined relationship. For example, a known pressure value is applied to calibrate the device.

[0162] Fig.12 a to Fig.12 f shows an exemplary reading cycle C1, C2 (see right hand side of the figure) obtained from the sensing layer 100, 101, 102, wherein two sensing points S1, S2 are subject to a pressure or force distribution A (see left hand side of the figure) indicated by the shaded area. As mentioned above, each cycle C1, C2 includes three readings (i.e., N+1). Fig.12 a and Fig.12 b indicates different readings obtained by applying lower and higher pressures / forces to the same size area A and location on the sensing layers 100, 101, 102, respectively. Fig.11 c to Fig.11 d indicates how the readings vary with different locations and different sized areas of applied pressure / force. In particular, Fig.11 d and Fig.11 e shows the different readings, ie the pressure distribution, obtained for areas of different sizes in the same central location. As described above, this information is used to build an accurate pressure area map of the interaction with the sensing layer 100, 101, 102.

[0163] As mentioned above, the ability to resolve the spatial location and area of ​​applied pressure relies on the relatively high resistivity of the electrode materials. Fig.13 a to Fig.13 As shown in Figure 1, the resistivity and / or resistance of the first electrode 10 and / or the second electrode 20 can be adjusted by introducing one or more holes, voids, cutouts, grooves, thickness differences and / or repeated geometric patterns / tracks into the electrode geometry without changing the intrinsic material properties. This provides a predetermined resistance between any two given points. The holes, voids, cutouts and / or grooves can form a regular or irregular array. The one or more holes, voids and / or grooves can define a nonlinear conduction path between any two points. Alternatively or additionally, the one or more voids and / or grooves can define multiple linear and / or nonlinear conduction paths between two points.

[0164] As described above, the first electrode 10 and the second electrode 20 can be produced using a variety of different inexpensive materials and manufacturing techniques. The first electrode 10 and the second electrode 20 and any spacing layer 30 can be formed / molded separately and then assembled together at a later time. The materials and material properties can be selected to match the properties required for the application, such as soles, automotive interiors, and wearables. In addition, due to the nature of the molding process, the first electrode 10 and the second electrode 20 can be formed or molded into almost any arbitrary size, shape, or three-dimensional (3D) form, for example, see Fig.13 and Fig.14 d. For example, although Figures 2 to Fig. 9 The sensing layers 100, 101, 102 and electrodes 10, 20 are shown in a generally planar configuration, but the sensing layers 100, 101, 102 and electrodes 10, 20 may be formed / molded to conform to the exterior / interior surface S of any object having any shape, regardless of complexity, such as Fig.14 a to Fig.14 c. The sensing layer 100 can be formed / molded into a desired shape, such as Fig.14 a. Fig.14 b. Fig.14 d and Fig.14 Alternatively, in the case where the first electrode 10 and the second electrode 20 and any spacer layer 30 are flexible, the sensing layers 100, 101, 102 can be deformed to conform to the surface profile S. In some applications, the sensing layer 100, 101, 102 can be deformed to conform to the surface profile S. Fig.14 c and Fig.14 e to provide easier mechanical connection of the sensing points S1 to S4 to the measurement module 500, for example, the sensing points S1 to S4 can be located at closer positions than in a generally planar configuration.

[0165] In addition, it can be understood that Figure 2 Figure 3 and Figure 4 The Z direction shown in FIG. 1 is not necessarily a vertical axis, and thus the sensing layers 100 , 101 , 102 may be arranged to lie in any direction.

[0166] Fig.15 A general system 2000 is shown that includes multiple individual sensing layers 100, the readings of which can be combined to form a single pressure area map, for example, by a computer program or software running on the control unit 400 or a remote computing device.

[0167] Fig.16 a shows an embodiment of a system 2000 of multiple sensing layers 100 integrated into a seat. Figure 6 As with the sole device 1000 of the embodiment of the present invention, each sensing layer 100 provides information about the location, area, and magnitude of applied pressure or force from a specific area in the system 2000. The information from each sensing layer 100 can be combined by software to create a global pressure map of the complex sensor system 2000, effectively making the multiple sensing layers 100 equivalent to a single large sensing layer 100 or pressure mapping area. For example, in Fig.16 In the seat system 2000 of a, multiple sensing layers 100 can be used to obtain weight distribution, and different seating behaviors can be derived based on the weight distribution, such as Fig.16 Each different sensing layer 100 of the system 2000 can be connected to the same sensing input 320 of the sensing circuit 300, for example, via one or more switching units 200. Alternatively, each different sensing layer 100 can be connected to a different sensing input 320.

[0168] In addition to applications in foot and seat pressure mapping, device 1000 may be integrated into many everyday objects that a user interacts with. Fig.17 An embodiment of a sensing layer 100 molded and integrated into a phone housing that can be used to extend the trackpad functionality of a modern touch screen phone is shown.

[0169] Fig.18 An embodiment of the sensing layer 100 is shown for use as a laptop computer trackpad. The sensing layer 100 can be used to replace conventional touch / pressure sensor array based trackpads with integral non-metallic electrodes that can be produced inexpensively and require fewer sensing input pins and sensing points to provide precise position information.

[0170] Fig.19 and Fig. 20 Other embodiments of the sensing layer 100 are shown integrated into common surfaces (eg, walls and table surfaces) to provide a touch screen and / or interactive pad.

[0171] Embodiments of the present invention provide a sensing layer 100, 101, 102 that generates a single capacitance reading from a single sensing point S1, S2 that indicates the interaction of a body / object with the sensing layer 100, 101, 102, which can be recorded via a single input pin 320 of the sensing circuit 300. Adding two or more sensing points S2, S2 and switches between the sensing points can advantageously provide supplemental information about the force application area and allow a more accurate position or pressure / force distribution to be constructed. This is because the readings from each sensing point S1, S2 are different based on the relative proximity / position of each applied pressure / force or local interaction with the sensing layer 100, 101, 102 to each sensing point S1, S2.

[0172] By reading this disclosure, other variations and modifications will be apparent to those skilled in the art. Such variations and modifications may involve equivalent and other features known in the art, and may replace or be used in addition to the features described herein.

[0173] Although the attached claims refer to specific combinations of features, it should be understood that the scope of the disclosure of the present invention also includes any novel feature or any novel combination of features disclosed herein, whether explicitly or implicitly, or any generalization thereof, whether or not it relates to the same invention as currently claimed in any claim, and whether or not it alleviates any or all of the same technical problems as the present invention.

[0174] Features that are described in the context of separate embodiments may also be provided in combination in a single embodiment. Conversely, various features that are, for brevity, described in the context of a single embodiment may also be provided separately or in any suitable subcombination.

[0175] For the sake of completeness, the present application states that the term "comprising" does not exclude other elements or steps, the term "a" or "an" does not exclude a plurality, and any reference signs in the claims should not be construed as limiting the scope of the claims.

Claims

1. A pressure sensing device, include: a first electrode and a second electrode, the first electrode and the second electrode being spaced a distance from each other, at least one of the first electrode or the second electrode being formed from or comprising an integral piece of a non-metallic electrically conductive material, and wherein the distance is capable of changing in response to pressure or force applied to the first electrode and / or the second electrode; and a measuring module connected to the first electrode or the second electrode at a plurality of sensing points on the first electrode or the second electrode, wherein the measuring module is configured to: measuring a change in capacitance between the first electrode and the second electrode individually at each sensing point in response to a change in distance when pressure or force is applied to the first electrode and / or the second electrode; mapping each measurement obtained from an individual sensing point to a distance of the individual sensing point; and The position, area and magnitude of the pressure exerted on the first electrode and / or the second electrode are determined from the results of the individual measurements and the mapped distances.

2. The device according to claim 1, in, The first electrode and / or the second electrode are movable and / or deformable so as to change the distance, and / or the first electrode and / or the second electrode are formed of or include a non-metallic thermoformable conductive material, and / or the first electrode and / or the second electrode are formed by a molding process.

3. The device according to claim 1 or 2, in, The sensing points are distributed around the periphery of the first electrode or the second electrode. 4 . The apparatus of claim 1 , wherein the measurement module comprises a sensing circuit configured to measure a change in capacitance at the sensing point.

5. The device of claim 4, wherein the sensing circuit is or includes a capacitive sensing microprocessor.

6. An apparatus according to claim 4 or claim 5, wherein each sensing point is connected to the sensing circuit at the same sensing input pin of the sensing circuit, or at different sensing input pins of the sensing circuit.

7. An apparatus according to claim 4 or 5, wherein the measurement module further comprises a switch unit connected between the sensing circuit and the sensing points, wherein the switch unit is configured to selectively connect and disconnect each sensing point to the sensing circuit, so that a single sensing point is connected to the sensing circuit when individual measurements are performed, and all sensing points are connected to the sensing circuit when simultaneous measurements are performed.

8. The device of claim 1, further comprising one or more separation elements configured to separate the first electrode and the second electrode.

9. A device according to claim 8, wherein the distance between the first electrode and the second electrode is or includes one or more gaps, and the gap can be changed in response to pressure or force applied to the first electrode and / or the second electrode.

10. The apparatus of claim 9, wherein the one or more separation elements are configured to provide the one or more gaps.

11. The device according to any one of claims 8 to 10, wherein the one or more separating elements are or include a non-conductive spacer layer located between the first electrode and the second electrode.

12. The device of claim 9, wherein the one or more separation elements are or include a non-conductive spacer layer located between the first electrode and the second electrode, and wherein the spacer layer includes one or more openings to provide the one or more gaps.

13. The device of claim 12, wherein the spacer layer comprises an array of openings.

14. The device according to claim 12 or claim 13, in, The spacer layer is formed of or includes a non-conductive material.

15. The device according to claim 14, wherein the spacer layer is flexible and / or compressible, and / or is formed by a molding process.

16. A device according to claim 9, wherein the first electrode and / or the second electrode includes the one or more separation elements, and the one or more separation elements are one or more integral protrusions to serve as spacers, or include one or more integral protrusions to serve as spacers, and the spacer is configured to separate the first electrode and the second electrode and provide the one or more gaps.

17. A device according to claim 16, wherein the first electrode and / or the second electrode comprises one or more openings, and the one or more openings are configured to accommodate a portion of one or more protrusions of the other of the first electrode and / or the second electrode so that the first electrode and the second electrode do not contact each other.

18. A device according to claim 16, wherein one or more protrusions of the first electrode and / or the second electrode contact the other of the first electrode and / or the second electrode, and wherein the one or more protrusions are configured to provide a variable contact area with the other of the first electrode and / or the second electrode in response to pressure or force applied to the first electrode and / or the second electrode.

19. The device of claim 18, wherein the one or more protrusions are convex and / or pointed.

20. The device according to claim 18 or claim 19, in, Each of the one or more gaps extends around, on either side of, and / or in an area between the one or more protrusions.

21. An apparatus according to claim 20, wherein the size of the gap is determined at least in part by the length of the or each protrusion.

22. A pressure sensing method for operating a device according to any one of claims 1 to 15, include: measuring at the sensing circuit a change in capacitance between the first electrode and the second electrode individually at each sensing point and simultaneously at all sensing points in response to a change in distance between the first electrode and the second electrode when pressure or force is applied to the first electrode and / or the second electrode; mapping each measurement obtained from an individual sensing point to the distance of that individual sensing point, and The position, area and magnitude of the applied pressure on the first electrode and / or the second electrode are determined from the results of the individual measurements and the mapped distances and / or the magnitude of the applied pressure is determined from the results of the simultaneous measurements.

23. The method according to claim 22, in, The measurement steps include: Each sensing point is selectively connected / disconnected to / from the sensing circuit such that when individual measurements are taken, a single sensing point is connected to the sensing circuit and when simultaneous measurements are taken, all sensing points are connected to the sensing circuit.

24. A method of manufacturing a pressure sensing device according to any one of claims 1 to 15, include: forming a first electrode and a second electrode, wherein the first electrode and / or the second electrode is formed of or includes a unitary piece of a non-metallic conductive material; arranging the first electrode and the second electrode in a spaced-apart configuration such that the first electrode and the second electrode are separated by a distance; as well as A measurement module is connected to the first electrode or the second electrode at a plurality of sensing points on the electrode.

25. The method of claim 24, wherein forming the first electrode and the second electrode comprises a thermoforming and / or molding process.

26. The method of claim 25, wherein the first electrode and / or the second electrode is movable and / or deformable.

27. The method of claim 26, further comprising forming one or more separation elements configured to separate the first electrode from the second electrode.

28. The method of claim 27, wherein forming the one or more discrete elements comprises a thermoforming and / or molding process.

29. The method according to claim 28, in: Forming the one or more discrete elements includes forming a non-conductive spacer layer.

30. The method of claim 29, wherein the spacer layer is flexible; and The method also includes disposing the spacer layer between the first electrode and the second electrode.

31. A method according to claim 29, wherein the step of arranging includes arranging the first electrode and the second electrode in a spaced-apart configuration such that the first electrode and the second electrode are separated by one or more gaps, and wherein forming the spacer layer includes forming one or more openings in the spacer layer to provide the one or more gaps.

32. The method of claim 31, wherein forming the spacer layer comprises forming an array of openings in the spacer layer.

33. The method of claim 28, wherein the step of arranging comprises arranging the first electrode and the second electrode in a spaced-apart configuration such that the first electrode and the second electrode are separated by one or more gaps, and wherein the one or more separation elements are formed include: One or more protrusions are integrally formed with the first electrode and / or the second electrode to serve as spacers, the spacers being configured to separate the first electrode from the second electrode and provide the one or more gaps.

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