Adsorption device and vacuum processing device

Abstract

The present invention provides a technique for preventing leakage of a cooling gas and improving the cooling efficiency of a substrate in an adsorption device that cools the substrate using the cooling gas. In the present invention, the lifting member (15) is configured such that, in a state where the substrate (10) is not supported, the connecting portion (15a) is disposed within the guiding portion (53) of the through-hole (52), and the substrate supporting portion (15b) is disposed within the accommodating portion (54) of the through-guiding hole (52). An O-ring (17) is provided between the connecting portion (15a) and the substrate supporting portion (15b) of the lifting member (15), and the accommodating portion (54) of the through-guiding hole (52) is sealed with respect to the guiding portion (53) by tightly supporting the O-ring against the supporting wall portion (55) provided in the accommodating portion (54) of the through-guiding hole (52).

Description

Technical Field

[0001] The present invention relates to an adsorption device for adsorbing and holding a substrate in a vacuum, and particularly to a technique for an adsorption device that cools a substrate using a cooling gas. Background Art

[0002] Conventionally, in order to precisely control the temperature of a substrate, adsorption devices have been widely used in sputtering devices and the like. In a device for performing film formation or the like on an insulating substrate such as glass in a vacuum, an adsorption device that adsorbs and holds the insulating substrate using a gradient force has been widely used.

[0003] In recent years, in this technical field, in order to cope with the increasing size of the adsorbed substrate, the following solution has been proposed: a cooling space is provided between the adsorption device and the substrate, and a gas is introduced into the cooling space to cool the substrate, thereby controlling its temperature.

[0004] For example, as Figure 3 shown, in an existing adsorption device 105 provided on a mounting table 104, the lower surface of a substrate 110 is cooled by introducing a cooling gas into a cooling space 151 of a main body portion 150 through a hole portion (not shown).

[0005] Moreover, a lifting member 115 for lifting the substrate 110 is provided in a through-hole guide 152 communicating with the cooling space 151.

[0006] In the prior art, after introducing the cooling gas into the cooling space 151, the substrate 110 is cooled in a state where the lower surface of a substrate support portion 115b of the lifting member 115, which is formed to have an outer diameter larger than that of a drive portion 115a, is pressed against the bottom surface 155 of a housing portion 154 of the through-hole guide 152.

[0007] However, in the prior art, there is a problem that since a minute gap is formed between the lower surface of the substrate support portion 115b of the lifting member 115 and the bottom surface 155 of the housing portion 154, the cooling gas leaks from this gap to the guide portion 153 side, making it difficult to improve the cooling efficiency.

[0008] Prior Art Documents

[0009] Patent Documents

[0010] Patent Document 1: Japanese Patent No. 4473145 Gazette. Summary of the Invention

[0011] Problems to be Solved by the Invention

[0012] The present invention is completed to solve the above problems of the prior art, and aims to provide a technique for improving the cooling efficiency of a substrate by preventing leakage of a cooling gas in an adsorption device that cools the substrate using the cooling gas.

[0013] Solution to the problem

[0014] The present invention, which is completed to solve the above problems, is an adsorption device having: a main body portion having an adsorption electrode for adsorbing and holding a substrate in a dielectric, and a cooling space for cooling the substrate with a gas is provided in a portion on the adsorption side; a lifting member that supports and lifts the substrate via a through-guide hole that communicates with and penetrates the cooling space of the main body portion, wherein the lifting member is configured to have a substrate support portion for supporting the substrate and a connecting portion that is connected to the substrate support portion and is driven by a driving mechanism, and in a state where the substrate is not supported, the substrate support portion is disposed in a housing portion that communicates with the cooling space of the through-guide hole, and the connecting portion is disposed in a guide portion that communicates with the housing portion of the through-guide hole, and a sealing member is provided between the connecting portion and the substrate support portion of the lifting member, and the sealing member is supported by being in close contact with a support wall portion provided in the housing portion of the through-guide hole, thereby sealing the guide portion of the through-guide hole with respect to the housing portion.

[0015] The present invention is an adsorption device, wherein the lifting member is configured to bring the sealing member into close contact with the support wall portion of the housing portion of the through-guide hole by its own weight.

[0016] The present invention is an adsorption device, wherein the sealing member is an O-ring.

[0017] The present invention is a vacuum processing device configured to have a vacuum chamber and any one of the above adsorption devices provided in the vacuum chamber, and perform a predetermined process on a substrate adsorbed and held by the adsorption device.

[0018] Advantageous effects of the invention

[0019] In the adsorption device of the present invention, a sealing member is provided between the connecting portion and the substrate support portion of the lifting member, and the guide portion of the through-guide hole is sealed with respect to the housing portion by supporting the sealing member in close contact with the support wall portion provided in the through-guide hole. Therefore, in an adsorption device that cools a substrate using a cooling gas, it is possible to prevent the cooling gas introduced into the cooling space from leaking to the guide portion side of the through-guide hole, and thereby improve the cooling efficiency of the substrate.

[0020] In addition, in the present invention, by providing a sealing member on the lifting member side, the inner diameter of the through-guiding hole can be made as small as possible. As a result, it is possible to reliably prevent the cooling gas from leaking to the guiding portion side of the through-guiding hole without sacrificing the effective area of the adsorption portion.

[0021] As described above, the adsorption device according to the present invention can provide a vacuum processing device with high cooling efficiency of the substrate.

[0022] In the present invention, when the lifting member is configured to bring the sealing member into close contact with the support wall portion of the housing portion of the main body portion by its own weight, since there is no need for a structure (such as a spring) for pressing the sealing member against the support wall portion of the housing portion, it is possible to provide an adsorption device and a vacuum processing device with a simple structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 (a) of is a schematic structural diagram of a sputtering device as an embodiment of the vacuum processing device according to the present invention; (b) is a schematic structural diagram of an embodiment of the adsorption device used in the same sputtering device, and is a diagram for explaining the through-guiding hole; (c) is a schematic structural diagram of an embodiment of the adsorption device used in the same sputtering device, and is a diagram for explaining the state in which the lifting member is disposed in the through-guiding hole.

[0024] Figure 2 (a) of is a cross-sectional view showing the main part of the lifting member of the present embodiment; (b) is a cross-sectional view showing the main part of the lifting member disposed in the through-guiding hole; (c) is a cross-sectional view of the main part of the adsorption device of the present embodiment, and is a diagram showing the state in which the lifting member is disposed in the through-guiding hole of the main body portion; (d) is a cross-sectional view of the main part of the adsorption device of the present embodiment, and is a diagram showing the state in which the substrate is supported by the lifting member.

[0025] Figure 3 is a schematic structural diagram showing an example of a conventional adsorption device. DETAILED DESCRIPTION OF THE INVENTION

[0026] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0027] Figure 1 (a) of is a schematic structural diagram of a sputtering device as an embodiment of the vacuum processing device according to the present invention. Figure 1 (b) of is a schematic structural diagram of an embodiment of the adsorption device used in the same sputtering device, and is a diagram for explaining the through-guiding hole; Figure 1 (c) of is a schematic structural diagram of an embodiment of the adsorption device used in the same sputtering device, and is a diagram for explaining the state in which the lifting member is disposed in the through-guiding hole.

[0028] Figure 2 (a) shows a cross-sectional view of the main part of the lifting member of this embodiment; Figure 2 (b) shows a cross-sectional view of the main part of the lifting member disposed in the through guide hole; Figure 2 (c) is a cross-sectional view of the main part of the adsorption device of this embodiment, showing a state in which the lifting member is disposed in the through guide hole of the main body portion; Figure 2 (d) is a cross-sectional view of the main part of the adsorption device of this embodiment, showing a state in which the substrate is supported by the lifting member.

[0029] As Figure 1 As shown in (a), the sputtering device 1 of this embodiment has a vacuum chamber 2 connected to a vacuum exhaust system (not shown).

[0030] The inside of the vacuum chamber 2 is configured to introduce a sputtering gas, and a target 3 is disposed, for example, in the upper part thereof.

[0031] The target 3 is connected to a sputtering power supply (not shown) and is applied with a negative bias voltage. In addition, the positive electrode side of the sputtering power supply is grounded together with the vacuum chamber 2.

[0032] An adsorption device 5 for adsorbing and holding a substrate (adsorption target) 10 is provided on a mounting table 4 in the vacuum chamber 2.

[0033] The adsorption device 5 is configured such that a plurality of adsorption electrodes 11 are provided in a main body portion 50 made of various dielectrics such as ceramics, and power is supplied to these adsorption electrodes 11 from an adsorption power supply (not shown).

[0034] As Figure 1 As shown in (b), a cooling space 51 for cooling the substrate 10 is provided in a part of the adsorption side of the main body portion 50 of the adsorption device 5.

[0035] Moreover, a gas introduction hole (not shown) communicating with the cooling space 51 and introducing a cooling gas into the space is provided in the main body portion 50 of the adsorption device 5.

[0036] In the present invention, for example, noble gases such as argon (Ar) gas, nitrogen (N2) gas, and helium (He) gas can be used as the cooling gas.

[0037] The cooling space 51 is provided by forming a recess in a part of the adsorption side of the main body portion 50, and is configured to face the lower surface of the substrate 10 adsorbed on the adsorption device 5.

[0038] A plurality of through guide holes 52 communicating with the cooling space 51 and penetrating the main body portion 50 until the mounting table 4 are provided in the main body portion 50 of the adsorption device 5.

[0039] Inside these through-guide holes 52, there are respectively provided lifting members 15 for supporting and lifting the substrate 10 via the through-guide holes 52 to place the substrate 10 on the adsorption device 5 or to remove the substrate 10 from the adsorption device 5.

[0040] The through-guide hole 52 has a guide portion 53 formed to extend in the vertical direction, and a receiving portion 54 communicating with the cooling space 51 is provided at the upper end portion of the through-guide hole 52.

[0041] Moreover, between the guide portion 53 and the receiving portion 54 of the through-guide hole 52, there is provided a conical support wall portion 55 (refer to Figure 2 (b)) of

[0042] The lifting member 15 of the present embodiment is made of a metal material such as stainless steel, and has: a connecting portion 15a formed to extend in the vertical direction and connected to the drive shaft 16 (refer to Figure 1 (a)); a cylindrical substrate support portion 15b provided at the upper end portion of the connecting portion 15a and supporting the substrate 10.

[0043] The lifting member 15 is configured such that in a state where the substrate 10 is not supported, the substrate support portion 15b is disposed in the receiving portion 54 of the through-guide hole 52, and the connecting portion 15a is disposed in the guide portion 53 of the through-hole 52.

[0044] The lifting member 15 of the present embodiment is integrally formed. For example, as shown in Figure 2 (a), the dimensions are set such that the outer diameter of the connecting portion 15a is smaller than the outer diameter of the substrate support portion 15b.

[0045] Here, a conical seal positioning portion 15d formed to decrease in outer diameter toward the connecting portion 15a is provided at a portion of the substrate support portion 15b on the connecting portion 15a side, and a cylindrical groove portion 15e having a diameter smaller than that of the connecting portion 15a is provided at a portion of the seal positioning portion 15d on the connecting portion 15a side.

[0046] Moreover, an O-ring 17 (sealing member) is provided between the connecting portion 15a and the substrate support portion 15b of the lifting member 15 to seal the receiving portion 54 of the through-guide hole 52 with respect to the guide portion 53.

[0047] The O-ring 17 of the present embodiment is formed to have an inner diameter slightly smaller than the outer diameter of the groove portion 15e of the lifting member 15 and an outer diameter smaller than the outer diameter of the substrate support portion 15b.

[0048] Moreover, in the case where the O-ring 17 is installed on the lifting member 15, the O-ring 17 is in close contact with the above-mentioned sealing positioning portion 15d and the groove portion 15e, and contacts the upper surface 15f of the connecting portion 15a. In this way, the shapes and sizes of the sealing positioning portion 15d, the groove portion 15e, and the upper surface 15f of the connecting portion 15a are set, and the size of the O-ring 17 is set.

[0049] Furthermore, as Figure 2 shown in (b) of, in the case where the lifting member 15 is disposed in the through-hole guiding hole 52, the size of the O-ring 17 and the shapes and sizes of the supporting wall portions 55 of the through-hole guiding hole 52 are set in such a way that the O-ring 17 is in close contact with the supporting wall portions 55 of the through-hole guiding hole 52.

[0050] In addition, in the lifting member 15 of the present embodiment, a flat protection member 15c made of an elastic member such as resin or rubber is mounted on the upper surface of the substrate support portion 15b.

[0051] As Figure 2 shown in (d) of, the protection member 15c is used to achieve the following functions: when the substrate 10 is supported by the lifting member 15, it does not damage the back surface of the substrate 10 and does not cause problems such as ESD (peeling charge).

[0052] In the adsorption device 5 of the above-described present embodiment, an O-ring 17 is provided as a sealing member between the connecting portion 15a and the substrate support portion 15b of the lifting member 15. The O-ring is supported in close contact with the supporting wall portion 55 provided in the through-hole guiding hole 52 to seal the accommodating portion 54 of the through-hole guiding hole 52 with respect to the guiding portion 53. Therefore, when cooling the substrate 10 using the cooling gas, it is possible to prevent the cooling gas introduced into the cooling space 51 from leaking to the guiding portion 53 side of the through-hole guiding hole 52, thereby improving the cooling efficiency of the substrate 10.

[0053] In addition, in the present embodiment, by providing the O-ring 17 on the lifting member 15 side, the inner diameter of the through-hole guiding hole 52 can be made as small as possible. Thus, it is possible to reliably prevent the cooling gas from leaking to the guiding portion 53 side of the through-hole guiding hole 52 without sacrificing the effective area of the adsorption portion.

[0054] In this way, according to the adsorption device 5 of the present embodiment, it is possible to provide the compact vacuum processing device 1 with high cooling efficiency of the substrate.

[0055] In addition, in the present embodiment, the lifting member 15 is configured such that the O-ring 17 is brought into close contact with the support wall portion 55 of the housing portion 54 that penetrates the guide hole 52 by its own weight. Therefore, a structure for pressing the O-ring 17 against the support wall portion 55 of the housing portion 54 is not required, and as a result, a simple-structured adsorption device and a vacuum processing device can be provided.

[0056] In addition, the present invention is not limited to the above-described embodiment, and various modifications can be made.

[0057] For example, in the above-described embodiment, the conical seal positioning portion 15d is provided on the lifting member 15, and the conical support wall portion 55 is provided in the through guide hole 52. However, the present invention is not limited thereto. For example, the seal positioning portion 15d of the lifting member 15 and the support wall portion 55 of the through guide hole 52 can be provided to be orthogonal to the longitudinal direction of the lifting member 15 and the through guide hole 52.

[0058] Furthermore, the present invention can be applied not only to sputtering devices but also to various vacuum processing devices such as evaporation devices and etching devices.

[0059] Description of Reference Numerals

[0060] 1: Sputtering device (vacuum processing device);

[0061] 2: Vacuum chamber;

[0062] 3: Target;

[0063] 4: Mounting table;

[0064] 5: Adsorption device;

[0065] 10: Substrate;

[0066] 11: Adsorption electrode;

[0067] 15: Lifting member;

[0068] 15a: Connecting portion;

[0069] 15b: Substrate support portion;

[0070] 15c: Protection member;

[0071] 15d: Seal positioning portion;

[0072] 15e: Groove portion;

[0073] 15f: Upper surface;

[0074] 16: Driving mechanism;

[0075] 17: O-ring (sealing member);

[0076] 50: Main body part;

[0077] 51: Cooling space;

[0078] 52: Through - guiding hole;

[0079] 53. Guiding part;

[0080] 54: Accommodating part;

[0081] 55: Supporting wall part.

Claims

1. An adsorption device, comprising: A main body portion having an adsorption electrode for adsorbing and holding a substrate in a dielectric, and a cooling space for cooling the substrate with gas is provided in a portion on the adsorption side; and A lifting member that supports and lifts the substrate through a through-guiding hole, the through-guiding hole communicating with the cooling space of the main body portion and passing through the main body portion, wherein, The lifting member is configured to have a substrate support portion that supports the substrate and a connection portion that is connected to the substrate support portion and is driven by a drive mechanism. In a state where the substrate is not supported, the substrate support portion is disposed in a housing portion that communicates with the cooling space of the through guide hole, and the connection portion is disposed in a guide portion that communicates with the housing portion of the through guide hole. A sealing member is provided between the connection portion and the substrate support portion of the lifting member. By closely supporting the sealing member with a support wall portion provided in the housing portion of the through guide hole, the guide portion of the through guide hole is sealed with respect to the housing portion. A sealing positioning portion is provided in a portion of the substrate support portion on the connection portion side. A cylindrical groove portion having a diameter smaller than that of the connection portion is provided in a portion of the sealing positioning portion on the connection portion side. The sealing member is disposed in the groove portion, and is formed to have an inner diameter slightly smaller than the outer diameter of the groove portion of the lifting member and an outer diameter smaller than the outer diameter of the substrate support portion.

2. The adsorption device according to claim 1, wherein, The lifting member is configured to cause the sealing member to be closely attached to the support wall portion of the housing portion of the through guide hole by its own weight.

3. The adsorption device according to any one of claims 1 or 2, wherein, The sealing member is an O-ring.

4. A vacuum processing device, comprising: A vacuum chamber; and The adsorption device according to claim 1 provided in the vacuum chamber, The vacuum processing device is configured to perform a predetermined process on the substrate adsorbed and held by the adsorption device.

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