New chip handling and testing equipment and working method

Abstract

This invention relates to the field of chip handling technology, and discloses a novel chip handling testing equipment and its working method. The equipment includes a tray stacking rack, a tray imaging and height measurement component mounted on the outer side of the rack, and a feeding and suction handling component positioned on top of the tray imaging and height measurement component. A bottom correction component is installed between the tray stacking rack and the tray imaging and height measurement component, and a feeding movement component is installed on the rear end face of the tray stacking rack. In this invention, by using the tray imaging and height measurement component, the chip is picked up and photographed to determine its center position. After picking up the chip, a bottom CCD correction camera corrects the angle of the chip. Finally, a CCD image is taken again to place the chip at the designated location on the carrier. After data calculation, the picked-up chip can be accurately placed into the designated position on the carrier or tray, effectively solving the problem of inaccurate chip placement.

Description

Technical Field

[0001] This invention relates to the field of chip handling technology, specifically to novel chip handling testing equipment and its working method. Background Technology

[0002] The technological level of chip handling and testing equipment is an important indicator of the progress of integrated circuit handling and testing technology. Chip testing equipment manufacturers, which affect the entire integrated circuit production process, are also an important part of the industry chain. Chip handling and testing equipment is mainly used for automatic chip feeding, chip pick-up and handling, chip placement and testing, pick-up and handling after testing, and collection of materials, which are classified into OK (good) and NG (bad) products.

[0003] Existing chip handling and testing equipment lacks visual imaging during chip picking, and there is no visual correction position for the bottom of the chip. Furthermore, there is no visual imaging position for chip placement, leading to inaccurate chip handling and placement, and the chips are prone to overlap and tilting after placement. In addition, existing similar equipment does not measure the height of the chip, and the suction head cannot be adjusted. Moreover, the testing section of chip handling and testing equipment often uses 4 or 32 holes for simultaneous testing, resulting in low work efficiency and poor matching effect. Summary of the Invention

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this invention provides a novel chip handling and testing equipment and method, which makes chip picking and placing more accurate. It also incorporates a laser height sensor to measure chip height, reducing chip damage caused by distance errors during the descent process. By adjusting and cleaning the suction nozzle, the device can pick up two chips at a time instead of one, improving efficiency and effectively cleaning the nozzle. Furthermore, by adopting a high-speed linear magnetic drive instead of the traditional lead screw motor drive, the device speed and cycle time are significantly increased, solving the problems mentioned in the background technology.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, the present invention provides the following technical solution: a novel chip handling and testing equipment, comprising a pallet stacking and loading rack, wherein a loading pallet photographing and height measuring component is installed on the outer side of the pallet stacking and loading rack, and a feeding and conveying component is provided on the top of the loading pallet photographing and height measuring component; a bottom correction component is installed between the pallet stacking and loading rack and the loading pallet photographing and height measuring component; and a feeding moving component is installed on the rear end face of the pallet stacking and loading rack.

[0008] The internal components of the feeding tray photo height measurement component include a support plate, and a first camera is installed on the outer wall of the support plate. A first light source is connected to the bottom of the first camera. A first movable rod is installed on the inner side of the support plate, and a second movable rod is installed at the bottom of the first movable rod. A height measurement laser sensor is connected to the bottom of the support plate.

[0009] The feeding and conveying assembly includes a stand, and a first imaging cavity is provided at the bottom of the stand. A feeding nozzle is connected to the bottom side of the stand away from the first imaging cavity.

[0010] The bottom correction assembly includes a side plate inside, and a lead screw is installed inside the side plate. A second camera is connected to the top of the lead screw, and a second light source is installed on the top of the second camera. A motor is connected to the bottom of the lead screw.

[0011] A test component is provided on the top of the feeding moving component, and a discharge moving component is connected to the other side of the feeding moving component. A discharge suction and conveying component is installed on the outside of the test component, and the test component is arranged between the feeding suction and conveying component and the discharge suction and conveying component.

[0012] The feed moving assembly includes a connecting frame inside, and a feed carrier is connected to the top of the connecting frame. A first moving drag chain is connected to the outside of the feed carrier, and a double-acting sub-execution module is installed on the bottom end of the side of the feed carrier away from the first moving drag chain.

[0013] The feeding carrier is a 32-cavity carrier;

[0014] The front end of the discharge suction and conveying component is equipped with a discharge tray camera, and the inner side of the discharge tray camera is connected to an NG chip type A automatic stacking and receiving tray. The outer side of the discharge moving component is equipped with an NG chip type B automatic receiving tray.

[0015] A nozzle cleaning component is installed on the outside of the bottom correction component, and a nozzle height measuring component is provided on the outside of the nozzle cleaning component. An OK tray stacking receiving rack is connected to the outside of the tray stacking loading rack.

[0016] Preferably, the feeding nozzles are provided in two sets, with four feeding nozzles in each set, and the spacing between the feeding nozzles in each set can be automatically adjusted relative to the other set.

[0017] Preferably, the test component includes an internal mounting support frame, and a moving chain is installed inside the mounting support frame. The bottom end of the moving chain is connected to an upper carrier, and the bottom end of the mounting support frame is connected to a vertical moving module.

[0018] Preferably, the discharge moving assembly includes a discharge carrier inside, and the discharge carrier is connected to the top of the dual-actuator module. The outer wall of the dual-actuator module is provided with a second moving drag chain, and the second moving drag chain is connected to the discharge carrier. The discharge carrier is a 32-cavity carrier, and the discharge carrier and the feeding carrier are symmetrically arranged about the central axis of the connecting frame.

[0019] Preferably, the discharge suction and conveying assembly includes a top frame inside, and the bottom end of the top frame is connected to a second photographing cavity. A discharge suction nozzle is installed on the bottom end of the top frame away from the second photographing cavity.

[0020] Preferably, the nozzle cleaning assembly includes a cleaning tank inside, and the inner wall of the cleaning tank is connected to a lint-free cloth. The outer wall of the cleaning tank is equipped with an elastic buckle, and the bottom end of the cleaning tank is connected to a spring. The outer wall of the cleaning tank is equipped with a sensor for detection, and the bottom of the cleaning tank is equipped with a mounting base, and the top end of the mounting base is connected to the bottom end of the spring.

[0021] Preferably, two sets of the suction nozzle cleaning assembly are provided inside the device, and are respectively located at the bottom of the feed suction nozzle and the discharge suction nozzle.

[0022] Preferably, the nozzle height measuring component includes an adjustable bracket inside, and a height measuring sensor is installed at the top of the adjustable bracket.

[0023] Preferably, two sets of the nozzle height measuring components are provided inside the device, and are respectively provided on the outside of the two sets of nozzle cleaning components.

[0024] The working method of the new chip handling and testing equipment mainly includes 6 steps:

[0025] Step 1: The chip to be tested is placed on a tray, and the tray is automatically fed by a tray stacking rack.

[0026] Step 2: Take a picture of the chip to be tested in the tray through the first imaging cavity, and then pick up the chip from the tray through the feeding nozzle;

[0027] Step 3: The feeding and conveying assembly picks up the chip from the feeding nozzle and moves it to the bottom correction assembly CCD position to correct the chip angle. Then, the data processing puts the chip into the 32-cavity feeding carrier cavity. The cycle is repeated 4 times until the 32-cavity feeding carrier cavity is full.

[0028] Step 4: The feeding carrier transports the chip to be tested to the test position via the first moving drag chain, and the test suction docking component picks up the chip from the feeding carrier and places it onto the test carrier for testing.

[0029] Step 5: After the chip test is completed, the test component puts the tested chip into the cavity of the 32-cavity discharge carrier, and the discharge carrier transfers the chip to the discharge suction position through the second moving drag chain.

[0030] Step 6: The discharge nozzle picks up the chip from the discharge carrier and transports it to the corresponding NG receiving tray and OK tray stacking receiving rack through the discharge suction and transport component. NG chips are divided into NG chip A type automatic stacking receiving tray and NG chip B type automatic receiving tray. NG chips A type are received by tray stacking, NG chips B type are received by fixed trays, and OK chips are received by tray stacking.

[0031] (III) Beneficial Effects

[0032] Compared with the prior art, the present invention has the following beneficial effects:

[0033] 1. In this invention, by setting up a photographic height measurement component on the loading tray, the chip is picked up and photographed visually to give the center position of the chip. After picking up, the angle of the chip is corrected by the bottom CCD correction camera. Finally, the chip is placed in the acupoint position of the carrier by CCD visual photography. After data calculation, the picked-up chip can be accurately placed into the position set by the carrier or tray, which effectively solves the problem of inaccurate chip placement, improves the chip handling quality and testing accuracy, and avoids the problem of inaccurate picking and placement caused by position deviation.

[0034] 2. In this invention, by setting a height sensor inside the device, the distance between the chip and the nozzle can be accurately calculated under the action of the laser height sensor measuring the height of the chip. This allows for effective control of the distance at which the nozzle descends to pick up the chip, effectively solving the problem of the nozzle damaging the chip, ensuring the working quality of the nozzle, improving the safety of the chip, reducing the scrap rate of the product, and avoiding the problem of chip damage caused by distance error during the picking and descent process.

[0035] 3. In this invention, by setting up a feeding nozzle and a discharging nozzle, and with the adjustable distance between the nozzles, the ability to pick up chips one by one can be changed to picking up two chips at a time. Furthermore, by using an automatic X and Y direction adjustment mechanism for the nozzles, the center distance between the two sets of nozzles can be effectively adjusted, allowing the two nozzles to descend and pick up two chips at once, effectively improving the overall working efficiency of the equipment. Moreover, the structure is simple and easy to use.

[0036] 4. In this invention, by setting up a dual-actuator module, a high-speed linear magnetic drive method is adopted to replace the traditional lead screw motor drive, which greatly improves the efficiency of chip handling. Furthermore, by setting up a nozzle cleaning component, the nozzle cleaning function of the equipment is increased, which can effectively clean the chip nozzle, avoid nozzle contamination of the chip, ensure the quality of chip handling by the equipment, and help extend the service life of the equipment. Attached Figure Description

[0037] Figure 1 This is a front structural diagram of the novel chip handling and testing equipment of the present invention;

[0038] Figure 2 This is a top view of the novel chip handling and testing equipment of the present invention;

[0039] Figure 3 This is a three-dimensional structural diagram of the pallet stacking and loading rack in this invention;

[0040] Figure 4 This is a three-dimensional structural diagram of the pallet photographing and height measuring component in this invention;

[0041] Figure 5 This is a front structural diagram of the feeding and conveying assembly in this invention;

[0042] Figure 6 This is a side view of the feeding and conveying assembly in this invention.

[0043] Figure 7 This is a three-dimensional structural diagram of the bottom correction component in this invention;

[0044] Figure 8 This is a three-dimensional structural diagram of the feeding moving component and the discharging moving component in this invention;

[0045] Figure 9 This is a schematic diagram of the front structure of the test component in this invention;

[0046] Figure 10 This is a side view of the test component in this invention.

[0047] Figure 11 This is a three-dimensional structural diagram of the test component in this invention;

[0048] Figure 12 This is a top view schematic diagram of the feeding and conveying assembly and the discharging and conveying assembly in this invention;

[0049] Figure 13 This is a schematic diagram of the side mounting structure of the material discharge suction and conveying assembly in this invention;

[0050] Figure 14This is a front structural diagram of the material discharge suction and conveying assembly in this invention;

[0051] Figure 15 This is a side view of the material discharge suction and conveying assembly in this invention.

[0052] Figure 16 This is a three-dimensional structural diagram of the suction nozzle cleaning assembly in this invention;

[0053] Figure 17 This is a three-dimensional structural diagram of the suction nozzle height measuring component in this invention;

[0054] Figure 18 This is a three-dimensional structural diagram of the OK pallet stacking and receiving rack in this invention.

[0055] In the diagram: 1. Pallet stacking and loading rack; 2. Pallet loading camera and height measurement assembly; 201. Support plate; 202. First camera; 203. First light source; 204. First movable rod; 205. Second movable rod; 206. Height measurement laser sensor; 3. Feeding and conveying assembly; 301. Stand; 302. First camera chamber; 303. Feeding nozzle; 4. Bottom correction assembly; 401. Side plate; 402. Lead screw; 403. Second camera; 404. Second light source; 405. Motor; 5. Feeding moving assembly; 501. Connecting frame; 502. Feeding carrier; 503. First moving cable chain; 504. Double-actuated actuator module; 6. Testing assembly; 601. Mounting support frame; 602. Moving... 603. Upper carrier; 604. Up and down moving module; 7. Discharge moving assembly; 701. Discharge carrier; 702. Second moving drag chain; 8. Discharge suction and handling assembly; 801. Top frame; 802. Second photographing chamber; 803. Discharge nozzle; 9. Discharge tray photographing; 10. NG chip A-type automatic stacking and receiving tray; 11. NG chip B-type automatic receiving tray; 12. Nozzle cleaning assembly; 1201. Cleaning tank; 1202. Dust-free cloth; 1203. Elastic buckle; 1204. Spring; 1205. Sensor detection; 1206. Mounting base; 13. Nozzle height measuring assembly; 1301. Adjustable bracket; 1302. Height sensor; 14. OK tray stacking and receiving rack. Detailed Implementation

[0056] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0057] Please see Figures 1-18A novel chip handling and testing equipment includes a pallet stacking and loading rack 1, a pallet imaging and height measurement assembly 2, a support plate 201, a first camera 202, a first light source 203, a first movable rod 204, a second movable rod 205, a height measurement laser sensor 206, a feeding and conveying assembly 3, a stand 301, a first imaging cavity 302, a feeding nozzle 303, a bottom correction assembly 4, a side plate 401, a lead screw 402, a second camera 403, a second light source 404, a motor 405, a feeding moving assembly 5, a connecting frame 501, and a feeding carrier. 502, First moving cable chain 503, Double-actuated actuator module 504, Test component 6, Mounting support frame 601, Moving chain 602, Upper carrier 603, Up and down moving module 604, Discharge moving component 7, Discharge carrier 701, Second moving cable chain 702, Discharge suction and handling component 8, Top frame 801, Second photographing chamber 802, Discharge suction nozzle 803, Discharge tray photographing 9, NG chip A-type automatic stacking and receiving tray 10, NG chip B-type automatic receiving tray 11, Suction nozzle cleaning component 12, Cleaning tank 1201 The components include: a cleanroom cloth 1202, an elastic buckle 1203, a spring 1204, a sensor detection 1205, a mounting base 1206, a suction nozzle height measuring component 13, an adjustable bracket 1301, a height sensor 1302, and an OK pallet stacking and receiving rack 14. A pallet stacking and receiving rack 14 is mounted on the outside of the pallet stacking and receiving rack 1, and a pallet photographing and height measuring component 2 is installed on top of the pallet photographing and height measuring component 2. A bottom correction component 4 is installed between the pallet stacking and receiving rack 1 and the pallet stacking and receiving rack 14. The rear end is equipped with a feeding moving component 5. The surface of the tray stacking rack 1 has a feeding position and a receiving position. The feeding position and the receiving position are stacked trays. The outer side of the feeding position is a working position. The working position is used for the nozzle to pick up or place chips on the tray. Through the stacking of the trays, the trays are automatically separated. The trays with chips are then transported to the designated chip picking position. After the chips in the trays are picked up, the empty trays are transported to the recycling position. The empty trays are automatically stacked, realizing the automation and precision of chip feeding.

[0058] The internal components of the loading tray photo-taking and height measurement assembly 2 include a support plate 201, and a first camera 202 is installed on the outer wall of the support plate 201. A first light source 203 is connected to the bottom of the first camera 202. A first movable rod 204 is installed on the inner side of the support plate 201, and a second movable rod 205 is installed at the bottom of the first movable rod 204. A height measurement laser sensor 206 is connected to the bottom of the support plate 201. The loading tray photo-taking and height measurement assembly 2 can automatically take pictures of the chips to be tested in the tray and pick up the center position of the chips, so that the suction nozzle can pick up the center of the chips later. By setting the height measurement laser sensor 206, the height measurement laser sensor 206 can measure the height of the chips, and through data acquisition and calculation, the distance data of each chip can be accurately recorded.

[0059] The feeding and conveying assembly 3 includes a stand 301 inside, and a first imaging cavity 302 is provided at the bottom of the stand 301. A feeding nozzle 303 is connected to the bottom side of the stand 301 away from the first imaging cavity 302. The first imaging cavity 302 can take pictures of the placement carrier cavity, and then process the placement position data after taking pictures so that the chip picked up by the nozzle can be accurately placed into the carrier cavity. The first imaging cavity 302 also takes pictures of the placed chip to detect whether the chip is placed in the wrong position, and detects and judges the overlap and warping that occur after placement.

[0060] The bottom correction component 4 includes a side plate 401, and a lead screw 402 is installed inside the side plate 401. A second camera 403 is connected to the top of the lead screw 402, and a second light source 404 is installed on the top of the second camera 403. A motor 405 is connected to the bottom of the lead screw 402. The bottom correction component 4 takes a picture of the bottom surface of the chip through the second camera 403. After processing the data after taking the picture, the chip deflection angle is automatically corrected by the nozzle rotation axis to achieve chip correction.

[0061] A test component 6 is provided on the top of the feeding moving component 5, and a discharge moving component 7 is connected to the other side of the feeding moving component 5. A discharge suction and conveying component 8 is installed on the outside of the test component 6, and the test component 6 is set between the feeding suction and conveying component 3 and the discharge suction and conveying component 8. A second photographing cavity 802 is provided inside the discharge suction and conveying component 8, which can take pictures of the position of the chip on the NG B type tray, and can also take pictures of the position of the 32-position discharge carrier 701. Then, the placement position data after taking pictures is processed so that the chip after being sucked by the discharge nozzle 803 is accurately placed into the NG tray position.

[0062] The feeding moving assembly 5 includes a connecting frame 501 inside, and a feeding carrier 502 is connected to the top of the connecting frame 501. A first moving drag chain 503 is connected to the outside of the feeding carrier 502, and a double-acting sub-execution module 504 is installed on the bottom of the side of the feeding carrier 502 away from the first moving drag chain 503. The double-acting sub-execution module 504 adopts a high-speed linear magnetic drive, which greatly improves the working speed of the equipment and the cycle time, thereby improving work efficiency.

[0063] The feeding carrier 502 is a 32-cavity carrier. The feeding carrier 502 can hold 32 chips to be tested and can also transfer 32 chips to be tested to the test position. During the movement, 32 chips or fewer chips are picked up by vacuum suction. Each vacuum suction channel of the 32-cavity feeding carrier 502 is independently controlled and does not affect each other.

[0064] The front end of the discharge suction and conveying component 8 is equipped with a discharge tray camera 9, and the inner side of the discharge tray camera 9 is connected to an NG chip A-type automatic stacking and receiving tray 10. The outer side of the discharge moving component 7 is equipped with an NG chip B-type automatic receiving tray 11. The discharge tray camera 9 can automatically take pictures of the chip placement position in the receiving tray and pick up the placement position, so as to ensure that the chip picked up by the nozzle can be accurately placed into the receiving tray.

[0065] A nozzle cleaning component 12 is installed on the outside of the bottom correction component 4, and a nozzle height measuring component 13 is provided on the outside of the nozzle cleaning component 12. An OK tray stacking and receiving rack 14 is connected to the outside of the tray stacking and receiving rack 14. The OK tray stacking and receiving rack 14 can collect the tested OK chips. By stacking empty trays, the trays are automatically separated, and the empty trays are transported to the designated chip receiving and placing position. After the OK chips in the tray are full, the tray with chips is transported to the recycling position, and the tray with chips is automatically stacked and collected.

[0066] Please see Figures 5-6 The feeding nozzle 303 is set in two sets, with four feeding nozzles in each set. The spacing between the feeding nozzles 303 in each set can be automatically adjusted relative to the other set. The feeding nozzles 303 can easily pick up the chips. The spacing between each nozzle of the picking component can be automatically adjusted. By setting four nozzles as a set, and with the automatic adjustment of the distance between each set relative to the other set, the nozzle can pick up two chips at a time, repeating four times, and picking up eight chips in one cycle.

[0067] Please see Figures 9-11 The test component 6 includes a mounting support frame 601, and a moving chain 602 is installed inside the mounting support frame 601. The bottom end of the moving chain 602 is connected to an upper carrier 603, and the bottom end of the mounting support frame 601 is connected to a vertical moving module 604. The pick-up docking component of the test component 6 is mainly used to pick up the chip from the 32-hole feeding carrier 502, and then put the picked-up chip into the test upper carrier 603.

[0068] Please see Figure 8The discharge moving component 7 includes a discharge carrier 701 inside, which is connected to the top of the dual-actuator module 504. The outer wall of the dual-actuator module 504 is provided with a second moving drag chain 702, which is connected to the discharge carrier 701. The discharge carrier 701 is a 32-cavity carrier, and the discharge carrier 701 and the feeding carrier 502 are symmetrically arranged about the central axis of the connecting frame 501. The discharge carrier 701 is responsible for placing the tested chips, and can hold 32 tested chips. It can also transfer the 32 tested chips to the discharge position. During the movement, the 32 chips or fewer chips are sucked up by vacuum suction. Each vacuum suction of the 32-cavity discharge carrier 701 is independently controlled and does not affect each other.

[0069] Please see Figures 12-15 The internal part of the material feeding and conveying assembly 8 includes a top frame 801, and the bottom end of the top frame 801 is connected to the second imaging cavity 802. A material feeding nozzle 803 is installed on the bottom end of the top frame 801 away from the second imaging cavity 802. The material feeding nozzle 803 can pick up the chips at one time, pick up eight chips at a time, and then place the chips after the nozzle into NG A and NG B trays. The spacing between each nozzle of the feeding component can be automatically adjusted, and four nozzles are grouped together. Each group can automatically adjust the distance relative to another group.

[0070] Please see Figure 16 The nozzle cleaning assembly 12 includes a cleaning tank 1201 inside, with a lint-free cloth 1202 connected to the inner wall of the cleaning tank 1201. An elastic buckle 1203 is installed on the outer wall of the cleaning tank 1201, and a spring 1204 is connected to the bottom of the cleaning tank 1201. A sensor detection 1205 is installed on the outer wall of the cleaning tank 1201, and a mounting base 1206 is installed at the bottom of the cleaning tank 1201. The top of the mounting base 1206 is connected to the bottom of the spring 1204. The lint-free cloth 1202 has a good cleaning effect on the nozzle, and the elastic buckle 1203 allows for quick replacement of the cleaning tank 1201, ensuring the working efficiency of the nozzle cleaning assembly 12.

[0071] Please see Figure 2 Two sets of nozzle cleaning components 12 are installed inside the equipment, and are respectively installed at the bottom of the feed nozzle 303 and the discharge nozzle 803. By setting two sets of nozzle cleaning components 12, the nozzle cleaning components 12 can automatically clean the eight sets of feed nozzles 303 and the eight sets of discharge nozzles 803, solving the problem of contaminating the chip surface during the nozzle suction process.

[0072] Please see Figure 17The nozzle height measuring component 13 includes an adjustable bracket 1301 inside, and a height measuring sensor 1302 is installed on the top of the adjustable bracket 1301. The nozzle height measuring component 13 can achieve stable height measurement after the nozzle is replaced, ensuring the working quality of the nozzle.

[0073] Please see Figure 2 There are two sets of suction nozzle height measuring components 13 inside the equipment, and they are respectively set on the outside of the two sets of suction nozzle cleaning components 12. By setting the suction nozzle height measuring components 13 on the outside of the eight sets of feeding suction nozzles 303 and the eight sets of discharging suction nozzles 803, the height of each set of suction nozzles can be quickly measured after replacement, ensuring the stability of the equipment operation.

[0074] The working method of the new chip handling and testing equipment mainly includes 6 steps:

[0075] Step 1: Place the chip to be tested on the tray, and the tray is automatically fed by the tray stacker 1;

[0076] Step 2: Take a picture of the chip to be tested in the tray through the first imaging chamber 302, and then pick up the chip from the tray through the feeding nozzle 303;

[0077] Step 3: The feeding and conveying assembly 3 transports the chip after being sucked up by the feeding nozzle 303 to the bottom correction assembly 4CCD position to correct the chip angle. Then, the data processing puts the chip into the 32-cavity feeding carrier 502. The cycle is repeated 4 times until the 32-cavity feeding carrier 502 is full.

[0078] Step 4: The feeding carrier 502 transports the chip to be tested to the test position via the first moving drag chain 503, and the test suction docking component picks up the chip on the feeding carrier 502 and places it on the test carrier 603 for testing.

[0079] Step 5: After the chip test is completed, the test component 6 puts the tested chip into the cavity of the 32-cavity discharge carrier 701. The discharge carrier 701 transfers the chip to the discharge pick-up position through the second moving drag chain 702.

[0080] Step 6: The discharge nozzle 803 picks up the chip from the discharge carrier 701 and transports it to the corresponding NG receiving tray and OK tray stacking receiving rack 14 through the discharge suction and transport assembly 8. The NG chips are divided into NG chip A type automatic stacking receiving tray 10 and NG chip B type automatic receiving tray 11. NG chips A type is received by tray stacking, NG chips B type is received by fixed trays, and OK chips are received by tray stacking.

[0081] Working principle: During use, the chip to be tested is placed on a tray, which is automatically fed by the tray stacker 1. The first imaging chamber 302 takes a picture of the chip in the tray. Then, the chip is picked up from the tray by the feeding nozzle 303 of the feeding and conveying assembly 3. The feeding and conveying assembly 3 then transports the chip picked up by the feeding nozzle 303 to the bottom correction assembly 4. The second camera 403 in the bottom correction assembly 4 corrects the chip angle by CCD position. Then, the data is processed and the chip is placed into the 32-cavity feeding carrier 502 of the feeding moving assembly 5. The process is repeated four times until the 32-cavity feeding carrier 502 is full. Once full, the feeding carrier 502 uses a first moving chain 503 to transport the chip to the testing position. The bottom docking part of the testing component 6 picks up the chip from the feeding carrier 502 and places it onto the testing carrier 603 for testing. After testing, the testing component 6 places the tested chip into the 32-cavity discharge carrier 701 in the discharge moving component 7, and the discharge carrier 701 uses a second moving chain 702 to transfer the chip to the discharge position. The chip is picked up by the discharge nozzle 803 inside the discharge pick-up and transport assembly 8, and then transported by the discharge pick-up and transport assembly 8 to the corresponding NG chip type A automatic stacking and receiving tray 10, NG chip type B automatic receiving tray 11, and OK tray stacking and receiving rack 14. The NG chip type A automatic stacking and receiving tray 10 is used to receive chips with test results of type A. The trays are stacked and empty, automatically separated, and then the empty trays are transported to the designated chip receiving and placing positions. After the trays are full of chips, the chips are then placed on the trays. The system automatically stacks and collects the chips from the trays at the recycling location. The NG chip B-class automatic collection tray 11 is used to collect chips with B-class test results. It consists of two fixed tray positions for collection. The OK tray stacking and collection rack 14 is used to collect OK chips after testing. By stacking and emptying the trays, the system automatically separates the trays and then transports the empty trays to the designated chip collection location. After the trays are full of OK chips, the trays with chips are transported to the recycling location, and the system automatically stacks and collects the chips. This completes the working principle of the equipment.

[0082] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A novel chip handling and testing equipment, comprising a pallet stacking rack (1), characterized in that: The pallet stacking rack (1) is equipped with a pallet photo measuring component (2) on its outer side, and a feeding suction and conveying component (3) is provided on the top of the pallet photo measuring component (2). A bottom correction component (4) is installed between the pallet stacking rack (1) and the pallet photo measuring component (2), and a feeding moving component (5) is installed on the rear end face of the pallet stacking rack (1). The internal structure of the feeding tray photo height measuring component (2) includes a support plate (201), and a first camera (202) is installed on the outer wall of the support plate (201). A first light source (203) is connected to the bottom of the first camera (202). A first movable rod (204) is installed on the inner side of the support plate (201), and a second movable rod (205) is installed at the bottom of the first movable rod (204). A height measuring laser sensor (206) is connected to the bottom of the support plate (201). The feed suction and conveying assembly (3) includes a stand (301) inside, and a first photographing cavity (302) is provided at the bottom of the stand (301). A feed suction nozzle (303) is connected to the bottom side of the stand (301) away from the first photographing cavity (302). The bottom correction component (4) includes a side plate (401) inside, and a lead screw (402) is installed inside the side plate (401). A second camera (403) is connected to the top of the lead screw (402), and a second light source (404) is installed on the top of the second camera (403). A motor (405) is connected to the bottom of the lead screw (402). The top of the feeding moving component (5) is provided with a test component (6), and the other side of the feeding moving component (5) is connected to a discharge moving component (7). The outside of the test component (6) is equipped with a discharge suction and conveying component (8), and the test component (6) is arranged between the feeding suction and conveying component (3) and the discharge suction and conveying component (8). The feed moving assembly (5) includes a connecting frame (501) inside, and a feed carrier (502) is connected to the top of the connecting frame (501). A first moving drag chain (503) is connected to the outside of the feed carrier (502), and a double-acting sub-execution module (504) is installed on the bottom of the side of the feed carrier (502) away from the first moving drag chain (503). The feeding carrier (502) is a 32-cavity carrier; The front end of the discharge suction and conveying component (8) is equipped with a discharge tray photograph (9), and the inner side of the discharge tray photograph (9) is connected to an NG chip A-type automatic stacking and receiving tray (10). The outer side of the discharge moving component (7) is equipped with an NG chip B-type automatic receiving tray (11). The bottom correction component (4) is equipped with a nozzle cleaning component (12) on its outer side, and a nozzle height measuring component (13) is provided on the outer side of the nozzle cleaning component (12). The outer side of the tray stacking rack (1) is connected to an OK tray stacking receiving rack (14). The test component (6) includes an installation support frame (601) inside, and a moving chain (602) is installed inside the installation support frame (601). The bottom end of the moving chain (602) is connected to an upper carrier (603), and the bottom end of the installation support frame (601) is connected to an up-down moving module (604). The discharge moving assembly (7) includes a discharge carrier (701) inside, and the discharge carrier (701) is connected to the top of the double-acting sub-module (504). The outer wall of the double-acting sub-module (504) is provided with a second moving drag chain (702), and the second moving drag chain (702) is connected to the discharge carrier (701). The discharge carrier (701) is a 32-cavity carrier, and the discharge carrier (701) and the feeding carrier (502) are symmetrically arranged about the central axis of the connecting frame (501). The nozzle cleaning assembly (12) includes a cleaning tank (1201) inside, and a lint-free cloth (1202) is connected to the inner wall of the cleaning tank (1201). An elastic buckle (1203) is installed on the outer wall of the cleaning tank (1201), and a spring (1204) is connected to the bottom end of the cleaning tank (1201). A sensor detection (1205) is installed on the outer wall of the cleaning tank (1201), and a mounting base (1206) is installed at the bottom of the cleaning tank (1201). The top end of the mounting base (1206) is connected to the bottom end of the spring (1204).

2. The novel chip handling and testing equipment according to claim 1, characterized in that: The feed nozzles (303) are provided in two sets, and each set has 4 feed nozzles (303). The spacing between each set of feed nozzles (303) can be automatically adjusted relative to the other set.

3. The novel chip handling and testing equipment according to claim 1, characterized in that: The discharge suction and conveying assembly (8) includes a top frame (801) inside, and the bottom end of the top frame (801) is connected to a second photographing cavity (802). A discharge suction nozzle (803) is installed on the bottom end of the top frame (801) away from the second photographing cavity (802).

4. The novel chip handling and testing equipment according to claim 1, characterized in that: The nozzle cleaning assembly (12) is provided in two sets inside the equipment, and is respectively provided at the bottom of the feed nozzle (303) and the discharge nozzle (803).

5. The novel chip handling and testing equipment according to claim 1, characterized in that: The nozzle height measuring component (13) includes an adjustable bracket (1301) inside, and a height measuring sensor (1302) is installed on the top of the adjustable bracket (1301).

6. The novel chip handling and testing equipment according to claim 5, characterized in that: The nozzle height measuring component (13) is provided in two sets inside the device and is provided on the outside of the two sets of nozzle cleaning components (12).

7. The operating method of the novel chip handling and testing equipment according to any one of claims 1-6, characterized in that: It mainly includes 6 steps: Step 1: The chip to be tested is placed in a tray, and the tray is automatically fed by the tray stacker (1); Step 2: Take a picture of the chip to be tested in the tray through the first imaging cavity (302), and then pick up the chip in the tray through the feeding nozzle (303); Step 3: The feeding suction and conveying assembly (3) transports the chip after being sucked up by the feeding nozzle (303) to the bottom correction assembly (4) CCD position to correct the chip angle, and then the data processing puts the chip into the 32-hole feeding carrier (502) acupoint. The cycle is repeated 4 times until the 32-hole feeding carrier (502) acupoints are filled. Step 4: The feeding carrier (502) transports the chip to be tested to the test position through the first moving drag chain (503), and the test suction docking component picks up the chip on the feeding carrier (502) and puts it into the test carrier (603) for testing; Step 5: After the chip test is completed, the test component (6) puts the tested chip into the cavity of the 32-cavity discharge carrier (701), and the discharge carrier (701) transfers the chip to the discharge suction position through the second moving drag chain (702). Step 6: The discharge nozzle (803) picks up the chip on the discharge carrier (701) and transports the chip to the corresponding NG receiving tray and OK tray stacking receiving rack (14) through the discharge suction and transport assembly (8). NG is divided into NG chip A type automatic stacking receiving tray (10) and NG chip B type automatic receiving tray (11). NG A type is received by tray stacking, NG B type is received by fixed tray, and OK good product is received by tray stacking.

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