Chip carrying structure and chip mounting method

Abstract

The present invention discloses a chip carrying structure and a chip mounting method. The chip carrying structure includes a circuit substrate, a plurality of microheaters and a microheater control chip. The circuit substrate carries a plurality of conductive materials. The plurality of microheaters are arranged on or inside the circuit substrate. The microheater control chip is electrically connected to the plurality of microheaters. Thus, when a chip is arranged on two conductive materials, a system control module controls the microheater control chip according to chip movement information of the chip, so that the microheater starts or stops heating the two conductive materials through the control of the microheater control chip.

Description

Technical Field

[0001] The invention relates to a bearing structure and an installation method, and in particular to a chip bearing structure and a chip installation method. Background Art

[0002] In the prior art, the LED chip can be transferred from one carrier to another by a nozzle or a pin, and then mounted on a circuit substrate by external heating (eg, a reflow oven). Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a chip carrying structure and a chip mounting method in view of the deficiencies in the prior art.

[0004] In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a chip carrying structure, which includes: a circuit substrate, a plurality of microheaters and a microheater control chip. The circuit substrate carries a plurality of conductive materials. A plurality of microheaters are arranged on or inside the circuit substrate. The microheater control chip is electrically connected to the plurality of microheaters. Among them, when a chip is arranged on two conductive materials, a system control module controls the microheater control chip according to a chip movement information of the chip, so that the microheater starts or stops heating the two conductive materials through the control of the microheater control chip.

[0005] In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a chip carrying structure, which includes: a circuit substrate, a plurality of micro heaters and a micro heater control chip. The circuit substrate carries a plurality of conductive materials. The plurality of micro heaters are arranged on or inside the circuit substrate. The micro heater control chip is electrically connected to the plurality of micro heaters.

[0006] In order to solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide a chip installation method, which includes: providing a chip carrying structure, the chip carrying structure includes a circuit substrate for carrying multiple conductive materials, multiple microheaters arranged on or inside the circuit substrate, and a microheater control chip electrically connected to the multiple microheaters; carrying a chip through the chip carrying structure, and the chip is arranged on two corresponding conductive materials; controlling the microheater control chip according to a chip movement information of the chip, so that the microheater starts to heat the corresponding two conductive materials through the control of the microheater control chip; and fixing the chip on the chip carrying structure by heating and cooling the corresponding two conductive materials.

[0007] One of the beneficial effects of the present invention is that the chip carrying structure provided by the present invention can enable the microheaters to start or stop heating the corresponding two conductive materials through the control of the microheater control chip through the technical solutions of "multiple microheaters are arranged on or inside the circuit substrate" and "the microheater control chip is electrically connected to the multiple microheaters".

[0008] One of the beneficial effects of the present invention is that the chip mounting method provided by the present invention can enable the microheater to start or stop heating the corresponding two conductive materials through the control of the microheater control chip by the technical scheme of "providing a chip carrier structure, the chip carrier structure including a circuit substrate for carrying multiple conductive materials, multiple microheaters arranged on or inside the circuit substrate, and a microheater control chip electrically connected to the multiple microheaters", "carrying a chip through the chip carrier structure, the chip being arranged on two corresponding conductive materials" and "controlling the microheater control chip through a system control module according to a chip movement information of the chip".

[0009] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 FIG. 1 is a flow chart of a chip mounting method according to a first embodiment of the present invention.

[0011] Figure 2 FIG. 1 is a schematic diagram of a chip supporting structure according to a first embodiment of the present invention.

[0012] Figure 3 It is a schematic diagram of a chip carrying structure according to the first embodiment of the present invention being used to carry a chip.

[0013] Figure 4 It is a schematic diagram showing that the CMOS control circuit of the chip supporting structure of the present invention is electrically connected to the micro heater.

[0014] Figure 5 It is a curve diagram of the relationship between the heating (or cooling) temperature and time of the micro heater of the present invention.

[0015] Figure 6 FIG. 4 is a flow chart of a chip transfer method according to a second embodiment of the present invention.

[0016] Figure 7 FIG. 4 is a schematic diagram of a chip transfer system according to a second embodiment of the present invention.

[0017] Figure 8It is a schematic diagram showing that the chip supporting structure of the chip transfer system according to the second embodiment of the present invention contacts the chip.

[0018] Fig. 9 It is a schematic diagram of a chip according to a second embodiment of the present invention being disposed on two corresponding conductive materials by being abutted by a chip abutting structure.

[0019] Fig.10 FIG. 1 is a schematic diagram of a chip transfer module leaving a chip according to a second embodiment of the present invention.

[0020] Fig.11 It is a functional block diagram of a mobile sensing chip, a system control module, a micro-heater control chip and a plurality of micro-heaters of a chip transfer system according to a second embodiment of the present invention.

[0021] Fig.12 FIG. 4 is a schematic diagram of a chip transfer system according to a third embodiment of the present invention.

[0022] Fig.13 It is a schematic diagram of a chip according to a third embodiment of the present invention being disposed on two corresponding conductive materials through adsorption and driving of a chip adsorption structure.

[0023] Fig.14 It is a schematic diagram of a chip transfer module leaving a chip according to a third embodiment of the present invention. DETAILED DESCRIPTION

[0024] The following is an explanation of the implementation methods of the "chip carrier structure and chip installation method" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0025] The present invention provides a chip carrying structure Z, which includes: a circuit substrate 1 carrying a plurality of conductive materials B, a plurality of microheaters 2 arranged on or inside the circuit substrate 1, and a microheater control chip 3 electrically connected to the plurality of microheaters 2.

[0026] The present invention provides a chip installation method, which comprises: providing a chip bearing structure Z, the chip bearing structure Z comprising a circuit substrate 1 for bearing a plurality of conductive materials B, a plurality of microheaters 2 arranged on or inside the circuit substrate 1, and a microheater control chip 3 electrically connected to the plurality of microheaters 2; carrying a chip C through the chip bearing structure Z, the chip C being arranged on two corresponding conductive materials B; controlling the microheater control chip 3 through a system control module M3 according to a chip movement information N of the chip C, so that the microheater 2 starts to heat the corresponding two conductive materials B through the control of the microheater control chip 3; and fixing the chip C on the chip bearing structure Z through heating and cooling the corresponding two conductive materials B.

[0027] The present invention provides a chip transfer system M, which includes: a substrate carrying module M1, a chip transfer module M2 and a system control module M3. The substrate carrying module M1 carries a chip carrying structure Z, and the chip carrying structure Z includes a plurality of microheaters 2 and a microheater control chip 3 electrically connected to the plurality of microheaters 2. The chip transfer module M2 includes a mobile sensing chip M20, and the system control module M3 is electrically connected between the mobile sensing chip M20 and the microheater control chip 3.

[0028] The present invention provides a chip transfer method, which comprises: using a substrate carrying module M1 to carry a chip carrying structure Z, the chip carrying structure Z comprises a circuit substrate 1 for carrying a plurality of conductive materials B, a plurality of microheaters 2 arranged on or inside the circuit substrate 1, and a microheater control chip 3 electrically connected to the plurality of microheaters 2; using a chip transfer module M2 to arrange a chip C on two corresponding conductive materials B; using a mobile sensing chip M20 of the chip transfer module M2 to provide a chip movement information N of the chip C to a system control module M3 electrically connected between the mobile sensing chip M20 and the microheater control chip 3; the system control module M3 can control the microheater control chip 3 according to the chip movement information N of the chip C, so that the microheater 2 starts or stops heating the corresponding two conductive materials B through the control of the microheater control chip 3; and, by heating and cooling the corresponding two conductive materials B, the chip C is fixed on the chip carrying structure Z.

[0029] [First embodiment]

[0030] See also Figures 1 to 5 As shown, the first embodiment of the present invention provides a chip mounting method, which includes: first, Figure 1 and Figure 2As shown, a chip carrier structure Z is provided, the chip carrier structure Z includes a circuit substrate 1 for carrying a plurality of conductive materials B, a plurality of micro-heaters 2 disposed on or inside the circuit substrate 1, and a micro-heater control chip 3 electrically connected to the plurality of micro-heaters 2 (step S100); then, Figure 1 and Figure 3 As shown, a chip C is carried by a chip carrying structure Z, and the chip C is arranged on two corresponding conductive materials B (step S102); then, Figure 1 and Figure 3 As shown, a system control module M3 controls the microheater control chip 3 according to a chip movement information N of the chip C (that is, the information that the chip C has been moved), so that the microheater 2 starts to heat the corresponding two conductive materials B under the control of the microheater control chip 3 (step S104); next, Figure 1 and Figure 3 As shown, the chip C is fixed on the chip supporting structure Z by heating and cooling the two corresponding conductive materials B (step S106 ).

[0031] For example, if Figure 2 As shown, the circuit substrate 1 includes a plurality of conductive contacts 100 that respectively carry a plurality of conductive materials B, and each microheater 2 is adjacent to two corresponding conductive contacts 100. That is, each microheater 2 corresponds to at least two conductive contacts 100, so that the two conductive materials B respectively disposed on the two conductive contacts 100 can be heated by the corresponding microheater 2. In addition, the conductive material B can be a solder ball, solder paste or any other conductive material. In addition, the chip C can be a light-emitting diode chip or an IC chip. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0032] For example, with Figure 3 and Figure 4As shown, the microheater control chip 3 includes a plurality of CMOS (Complementary Metal-Oxide-Semiconductor) control circuits 30 electrically connected to the plurality of microheaters 2, and the CMOS control circuit 30 has a source S, a drain D, and a gate G. In addition, each microheater 2 can be turned on (that is, current starts to pass through the microheater 2) by the control of the corresponding CMOS control circuit 30 to heat the corresponding two conductive materials B, or each microheater 2 can be turned off (that is, current stops passing through the microheater 2) by the control of the corresponding CMOS control circuit 30 to cool the corresponding two conductive materials B. In other words, the microheater control chip 3 can determine whether to allow current to pass through the corresponding microheater 2 through the switch control of each CMOS control circuit 30. When the CMOS control circuit 30 is turned on, current can be transmitted to the corresponding microheater 2 through the CMOS control circuit 30, so that the corresponding microheater 2 can be turned on to heat the corresponding two conductive materials B. When the CMOS control circuit 30 is turned off, the current cannot be transmitted to the corresponding micro-heater 2 through the CMOS control circuit 30, so that the corresponding micro-heater 2 is turned off and the corresponding two conductive materials B are cooled. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0033] For example, if Figure 3As shown, the system control module M3 can control the microheater control chip 3 to turn on or off the microheater 2 according to the chip movement information N of the chip C (or, to control the microheater control chip 3 to turn on or off multiple microheaters 2 separately). That is to say, when the system control module M3 controls the microheater control chip 3 to turn on the microheater 2 according to the chip movement information N of the chip C (the chip movement information N is a signal generated after the chip C moves), the microheater 2 will heat the corresponding two conductive materials B. When the system control module M3 controls the microheater control chip 3 to turn off the microheater 2 according to the chip movement information N of the chip C (the chip movement information N is a signal generated after the chip C moves), the microheater 2 will stop heating the corresponding two conductive materials B to cool the corresponding conductive materials B. It is worth noting that each microheater 2 has a specific resistance (or specific impedance), and the microheater control chip 3 can adjust a working current or a working voltage (or working current and working voltage) received by the corresponding microheater 2 according to the specific resistance, so that the heating temperature (or heating effect) provided by multiple microheaters 2 to multiple conductive materials B is the same. Alternatively, different microheaters 2 can be controlled by the microheater control chip 3 to provide a specific heating temperature (or heating effect). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0034] For example, with Figure 3 and Figure 5 As shown, the implementation methods of the micro-heater 2 for heating or cooling include at least the following situations:

[0035] 1. When the chip C is placed on the two corresponding conductive materials B, the corresponding microheater 2 can start heating the two corresponding conductive materials B through the control of the microheater control chip 3. That is to say, the microheater 2 starts heating from the initial heating temperature T0 when the chip C is placed on the two corresponding conductive materials B, so the corresponding two conductive materials B are heated from the initial heating temperature T0 (for example, 0°C). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0036] Second, when the chip C is set on the corresponding two conductive materials B, the corresponding microheater 2 has been controlled by the microheater control chip 3 to preheat the corresponding two conductive materials B to a preheating temperature T1. That is, the microheater 2 is preheated to a preheating temperature T1 when the chip C is set on the corresponding two conductive materials B. Therefore, after the chip C is set on the corresponding two conductive materials B, the corresponding two conductive materials B can be heated from a preheating temperature T1 (for example, room temperature to 250°C) to a maximum heating temperature T2 (for example, 200 to 400°C, so that the two conductive materials B are in a completely or nearly molten state), thereby effectively reducing the time required for the two conductive materials B to be heated to a molten state (it can save the time t1 from the initial heating temperature T0 to a preheating temperature T1), or effectively reducing the time for the chip C to be bonded to the corresponding two conductive materials B. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0037] 3. When the chip C is set on the corresponding two conductive materials B, the corresponding microheater 2 has been controlled by the microheater control chip 3 to preheat the corresponding two conductive materials B to a maximum heating temperature T2 (for example, 200-400°C, so that the two conductive materials B are in a completely or nearly molten state). In other words, the microheater 2 is preheated to a maximum heating temperature T2 when the chip C is set on the corresponding two conductive materials B. Therefore, when the chip C is set on the corresponding two conductive materials B, the two conductive materials B are already in a completely or nearly completely molten state, thereby effectively reducing the time required for the two conductive materials B to be heated to a molten state (saving the time t2 from the initial heating temperature T0 to a maximum heating temperature T2), or effectively reducing the time for the chip C to be bonded to the corresponding two conductive materials B. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0038] Fourth, when the chip C is set on the corresponding two conductive materials B, the corresponding micro-heater 2 has been controlled by the micro-heater control chip 3 to preheat the corresponding two conductive materials B to a maximum heating temperature T2 and then cool down to a predetermined cooling temperature T3 (for example, 200-250°C). That is to say, the micro-heater 2 has been cooled from a maximum heating temperature T2 to a predetermined cooling temperature T3 when the chip C is set on the corresponding two conductive materials B. Therefore, when the chip C is set on the corresponding two conductive materials B, the two conductive materials B will be in a semi-molten state that is still suitable for bonding the chip C, thereby effectively reducing the time required for the two conductive materials B to be cooled (it can save the time t3 from the initial heating temperature T0 to the maximum heating temperature T2 and then cooling to a predetermined cooling temperature T3), or effectively reducing the time for the chip C to be bonded to the corresponding two conductive materials B. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0039] It is worth noting that with Figures 2 to 4 As shown, the first embodiment of the present invention provides a chip carrier structure Z, which includes: a circuit substrate 1, a plurality of microheaters 2 and a microheater control chip 3. The circuit substrate 1 carries a plurality of conductive materials B, the plurality of microheaters 2 are arranged on or inside the circuit substrate 1, and the microheater control chip 3 is electrically connected to the plurality of microheaters 2. Figure 3 and Figure 4 As shown, when a chip C is set on two conductive materials B, a system control module M3 can control the microheater control chip 3 according to a chip movement information N of the chip C, so that the microheater 2 can start or stop heating the two conductive materials B through the control of the microheater control chip 3 (such as a CMOS control circuit 30).

[0040] [Second embodiment]

[0041] See also Figures 6 to 11 As shown, the second embodiment of the present invention provides a chip transfer method, which includes: first, Figure 6 , Figure 7 and Fig.11 As shown, a substrate carrying module M1 is used to carry a chip carrying structure Z, and the chip carrying structure Z includes a circuit substrate 1 for carrying a plurality of conductive materials B, a plurality of micro heaters 2 disposed on or inside the circuit substrate 1, and a micro heater control chip 3 electrically connected to the plurality of micro heaters 2 (step S200); then, Figures 6 to 9 As shown, a chip C is placed on two corresponding conductive materials B through a chip transfer module M2 (step S202); then, Figure 6 , Fig. 9 and Fig.11 As shown, a chip movement information N of chip C (i.e., information that chip C has been moved) is provided to a system control module M3 electrically connected between the movement sensing chip M20 and the micro-heater control chip 3 through a movement sensing chip M20 of the chip transfer module M2 (step S204); next, in conjunction with Figure 6 , Figure 8 , Fig. 9 and Fig.11 As shown, the system control module M3 controls the microheater control chip 3 according to the chip movement information N of the chip C, so that the microheater 2 starts or stops heating the corresponding two conductive materials B through the control of the microheater control chip 3 (step S206); then, Figure 6 and Fig. 9 As shown, the chip C is fixed on the chip supporting structure Z by heating and cooling the two corresponding conductive materials B (that is, the micro heater 2 stops heating the two corresponding conductive materials B) (step S208); finally, Figure 6 and Fig.10 As shown, the chip transfer module M2 is separated from the chip C (step S210). For example, the chip transfer module M2 includes a chip temporary supporting structure M21 (such as a blue film or any film with an adhesive layer) for temporarily supporting the chip C and a chip abutting structure M22 (such as a contact-type traditional ejector pin or an ultrasonic ejector pin) for abutting the chip C, and the mobile sensing chip M20 is disposed on the chip abutting structure M22. In addition, in step S202, the chip C can be disposed on the corresponding two conductive materials B by the downward abutment of the chip abutting structure M22. Furthermore, in step S210, the chip abutting structure M22 of the chip transfer module M2 will separate from the chip C, and the chip temporary supporting structure M21 of the chip transfer module M2 will also be separated from the chip C. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0042] For example, if Figure 7 As shown, the circuit substrate 1 includes a plurality of conductive contacts 100 that respectively carry a plurality of conductive materials B, and each microheater 2 is adjacent to two corresponding conductive contacts 100. In other words, each microheater 2 corresponds to at least two conductive contacts 100, so that two conductive materials B respectively disposed on the two conductive contacts 100 can be heated by the corresponding microheater 2. In addition, the conductive material B can be a solder ball, solder paste or any other conductive substance. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0043] For example, with Figure 4 , Figure 7 and Fig.11 As shown, the microheater control chip 3 includes a plurality of CMOS (Complementary Metal-Oxide-Semiconductor) control circuits 30 electrically connected to the plurality of microheaters 2, and the CMOS control circuit 30 has a source S, a drain D, and a gate G. In addition, each microheater 2 can be turned on (that is, current starts to pass through the microheater 2) by the control of the corresponding CMOS control circuit 30 to heat the corresponding two conductive materials B, or each microheater 2 can be turned off (that is, current stops passing through the microheater 2) by the control of the corresponding CMOS control circuit 30 to cool the corresponding two conductive materials B. In other words, the microheater control chip 3 can determine whether to allow current to pass through the corresponding microheater 2 through the switch control of each CMOS control circuit 30. When the CMOS control circuit 30 is turned on, current can be transmitted to the corresponding microheater 2 through the CMOS control circuit 30, so that the corresponding microheater 2 can be turned on to heat the corresponding two conductive materials B. When the CMOS control circuit 30 is turned off, the current cannot be transmitted to the corresponding micro-heater 2 through the CMOS control circuit 30, so that the corresponding micro-heater 2 is turned off and the corresponding two conductive materials B are cooled. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0044] For example, with Figures 7 to 11As shown, the system control module M3 can control the microheater control chip 3 to turn on or off the microheater 2 (or control the microheater control chip 3 to turn on or off multiple microheaters 2 separately) according to the chip movement information N of the chip C (or the module movement information of the chip transfer module M2). In other words, when the system control module M3 controls the microheater control chip 3 to turn on the microheater 2 according to the chip movement information N of the chip C (the chip movement information N is a signal generated after the chip C moves), the microheater 2 will heat the corresponding two conductive materials B. When the system control module M3 controls the microheater control chip 3 to turn off the microheater 2 according to the chip movement information N of the chip C (the chip movement information N is a signal generated after the chip C moves), the microheater 2 will stop heating the corresponding two conductive materials B to cool the corresponding conductive materials B. It is worth noting that each microheater 2 has a specific resistance (or specific impedance), and the microheater control chip 3 can adjust a working current or a working voltage (or working current and working voltage) received by the corresponding microheater 2 according to the specific resistance, so that the heating temperature (or heating effect) provided by multiple microheaters 2 to multiple conductive materials B is the same. Alternatively, different microheaters 2 can be controlled by the microheater control chip 3 to provide a specific heating temperature (or heating effect). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0045] For example, with Figure 5 , Fig. 9 and Fig.11 As shown, the implementation methods of the micro-heater 2 for heating or cooling include at least the following situations:

[0046] 1. When the chip C is placed on the corresponding two conductive materials B from the chip temporary supporting structure M21 through the chip supporting structure M22, the corresponding micro-heater 2 can be controlled by the micro-heater control chip 3 to start heating the corresponding two conductive materials B. In other words, the micro-heater 2 starts heating from the initial heating temperature T0 when the chip C is placed on the corresponding two conductive materials B, so the corresponding two conductive materials B are heated from the initial heating temperature T0 (for example, 0°C). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0047] Second, when the chip C is placed on the corresponding two conductive materials B from the chip temporary supporting structure M21 through the chip abutment structure M22, the corresponding microheater 2 has been controlled by the microheater control chip 3 to preheat the corresponding two conductive materials B to a preheating temperature T1. That is, the microheater 2 is preheated to a preheating temperature T1 just when the chip C is placed on the corresponding two conductive materials B. Therefore, after the chip C is placed on the corresponding two conductive materials B, the corresponding two conductive materials B can be heated from a preheating temperature T1 (for example, room temperature to 250°C) to a maximum heating temperature T2 (for example, 200 to 400°C, so that the two conductive materials B are in a completely or nearly molten state), thereby effectively reducing the time required for the two conductive materials B to be heated to a molten state (can save the time t1 for heating from the initial heating temperature T0 to a preheating temperature T1), or effectively reducing the time for the chip C to be bonded to the corresponding two conductive materials B. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0048] 3. When the chip C is placed on the corresponding two conductive materials B from the chip temporary supporting structure M21 through the chip abutment structure M22, the corresponding microheater 2 has been controlled by the microheater control chip 3 to preheat the corresponding two conductive materials B to a maximum heating temperature T2 (for example, 200-400°C, so that the two conductive materials B are in a completely or nearly molten state). In other words, the microheater 2 is preheated to a maximum heating temperature T2 just when the chip C is placed on the corresponding two conductive materials B. Therefore, when the chip C is placed on the corresponding two conductive materials B, the two conductive materials B are already in a completely or nearly completely molten state, thereby effectively reducing the time required for the two conductive materials B to be heated to a molten state (saving the time t2 from the initial heating temperature T0 to a maximum heating temperature T2), or effectively reducing the time for the chip C to be bonded to the corresponding two conductive materials B. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0049] Fourth, when the chip C is placed on the corresponding two conductive materials B from the chip temporary supporting structure M21 through the chip supporting structure M22, the corresponding micro-heater 2 has been controlled by the micro-heater control chip 3 to preheat the corresponding two conductive materials B to a maximum heating temperature T2 and then cool down to a predetermined cooling temperature T3 (for example, 200-250°C). In other words, the micro-heater 2 has been cooled from a maximum heating temperature T2 to a predetermined cooling temperature T3 when the chip C is placed on the corresponding two conductive materials B. Therefore, when the chip C is placed on the corresponding two conductive materials B, the two conductive materials B will be in a semi-molten state that is still suitable for bonding the chip C, thereby effectively reducing the time required for the two conductive materials B to be cooled (it can save the time t3 from the initial heating temperature T0 to the maximum heating temperature T2 and then to the predetermined cooling temperature T3), or effectively reducing the time for the chip C to be bonded to the corresponding two conductive materials B. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0050] It is worth noting that Figure 7 As shown, the second embodiment of the present invention provides a chip transfer system M, which includes: a substrate carrying module M1, a chip transfer module M2 and a system control module M3. More specifically, the substrate carrying module M1 carries a chip carrying structure Z, and the chip carrying structure Z includes a circuit substrate 1 for carrying a plurality of conductive materials B, a plurality of micro-heaters 2 disposed on or inside the circuit substrate 1, and a micro-heater control chip 3 electrically connected to the plurality of micro-heaters 2. The chip transfer module M2 is disposed above the substrate carrying module M1 (such as Figure 7 as shown) or below ( Figure 7 ), so as to place a chip C on the corresponding two conductive materials B, and the chip transfer module M2 includes a motion sensing chip M20. The system control module M3 is electrically connected between the motion sensing chip M20 and the micro-heater control chip 3. Thus, when the motion sensing chip M20 of the chip transfer module M2 provides a chip movement information N of the chip C to the system control module M3, the system control module M3 can control the micro-heater control chip 3 according to the chip movement information N of the chip C, so that the micro-heater 2 starts or stops heating the corresponding two conductive materials B under the control of the micro-heater control chip 3.

[0051] [Third embodiment]

[0052] See also Figure 12 to Figure 14 As shown, the third embodiment of the present invention provides a chip transfer system M and a chip transfer method. Fig.12 and Figure 7 Comparison Fig.13 and Fig. 9 Comparison Fig.14 and Fig.10 The biggest difference between the third embodiment and the second embodiment of the present invention is that in the chip transfer system M of the third embodiment, the chip transfer module M2 includes a chip adsorption structure M23 for adsorbing the chip C, and the mobile sensing chip M20 is disposed on the chip adsorption structure M23. Fig.12 and Fig.13 As shown, in the chip transfer method of the third embodiment, the chip C can be adsorbed and driven by the chip adsorption structure M23 to be disposed on the corresponding two conductive materials B. Furthermore, as Fig.14 As shown, in the chip transfer method of the third embodiment, the chip adsorption structure M23 of the chip transfer module M2 will leave the chip C. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0053] [Beneficial Effects of Embodiments]

[0054] One of the beneficial effects of the present invention is that the chip supporting structure Z provided by the present invention can enable the microheaters 2 to start or stop heating the corresponding two conductive materials B through the control of the microheater control chip 3 through the technical solutions of "multiple microheaters 2 are arranged on or inside the circuit substrate 1" and "the microheater control chip 3 is electrically connected to the multiple microheaters 2".

[0055] One of the beneficial effects of the present invention is that the chip mounting method provided by the present invention can enable the microheater 2 to start or stop heating the corresponding two conductive materials B through the control of the microheater control chip 3 by means of the technical scheme of "providing a chip supporting structure Z, the chip supporting structure Z including a circuit substrate 1 for supporting multiple conductive materials B, multiple microheaters 2 arranged on or inside the circuit substrate 1, and a microheater control chip 3 electrically connected to the multiple microheaters 2", "carrying a chip C through the chip supporting structure Z, the chip C being arranged on two corresponding conductive materials B", and "controlling the microheater control chip 3 through a system control module M3 according to a chip movement information N of the chip C".

[0056] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the protection scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the claims of the present invention.

Claims

1. A chip carrying structure, characterized in that: The chip carrying structure comprises: a circuit substrate, the circuit substrate being used to carry a plurality of conductive materials; a plurality of micro heaters, wherein the plurality of micro heaters are arranged on or inside the circuit substrate; and a micro-heater control chip, wherein the micro-heater control chip is electrically connected to the plurality of micro-heaters; Wherein, when a chip is disposed on the two conductive materials, a system control module controls the microheater control chip according to chip movement information of the chip, so that the microheater starts or stops heating the two conductive materials under the control of the microheater control chip; Wherein, the circuit substrate comprises a plurality of conductive contacts respectively carrying a plurality of the conductive materials, and each of the micro-heaters is adjacent to two corresponding conductive contacts; Wherein, the microheater control chip comprises a plurality of CMOS control circuits electrically connected to the plurality of microheaters respectively, and each of the microheaters is turned on by the control of the corresponding CMOS control circuit to heat the corresponding two conductive materials or is turned off by the control of the corresponding CMOS control circuit to cool the corresponding two conductive materials; Wherein, the system control module controls the micro-heater control chip to turn on or off the micro-heater according to the chip movement information of the chip; Wherein, when the system control module controls the microheater control chip to turn on the microheater according to the chip movement information of the chip, the microheater heats the corresponding two conductive materials; When the system control module controls the microheater control chip to turn off the microheater according to the chip movement information of the chip, the microheater stops heating the corresponding two conductive materials to cool the corresponding conductive materials.

2. The chip carrying structure according to claim 1, characterized in that: When the chip is transferred to the two conductive materials, the corresponding microheaters start to heat the corresponding two conductive materials through the control of the microheater control chip; wherein each microheater has a resistance value, and the microheater control chip adjusts a working current or a working voltage received by the corresponding microheater according to the resistance value so that the heating temperatures provided by the multiple microheaters are the same.

3. The chip carrying structure according to claim 1, characterized in that: When the chip is transferred to the two conductive materials, the corresponding microheaters have been controlled by the microheater control chip to preheat the corresponding two conductive materials to a maximum heating temperature and then cool them to a predetermined cooling temperature; wherein each microheater has a resistance value, and the microheater control chip adjusts a working current or a working voltage received by the corresponding microheater according to the resistance value so that the heating temperatures provided by the multiple microheaters are the same.

4. A chip mounting method, characterized in that: The chip mounting method comprises: A chip carrier structure is provided, the chip carrier structure comprising a circuit substrate for carrying a plurality of conductive materials, a plurality of microheaters arranged on or inside the circuit substrate, and a microheater control chip electrically connected to the plurality of microheaters; The chip carrying structure is used to carry a chip, wherein the chip is arranged on the two corresponding conductive materials; Controlling the microheater control chip according to chip movement information of the chip, so that the microheater starts to heat the corresponding two conductive materials under the control of the microheater control chip; and Fixing the chip on the chip supporting structure by heating and cooling the two corresponding conductive materials; Wherein, the circuit substrate comprises a plurality of conductive contacts respectively carrying a plurality of the conductive materials, and each of the micro-heaters is adjacent to two corresponding conductive contacts; Wherein, the microheater control chip comprises a plurality of CMOS control circuits electrically connected to the plurality of microheaters respectively, and each of the microheaters is turned on by the control of the corresponding CMOS control circuit to heat the corresponding two conductive materials or is turned off by the control of the corresponding CMOS control circuit to cool the corresponding two conductive materials; Wherein, a system control module controls the micro-heater control chip to turn on or off the micro-heater according to the chip movement information of the chip; Wherein, when the system control module controls the microheater control chip to turn on the microheater according to the chip movement information of the chip, the microheater heats the corresponding two conductive materials; When the system control module controls the microheater control chip to turn off the microheater according to the chip movement information of the chip, the microheater stops heating the corresponding two conductive materials to cool the corresponding conductive materials.

5. The chip mounting method according to claim 4, characterized in that: When the chip is transferred to the two conductive materials, the corresponding microheaters start to heat the corresponding two conductive materials through the control of the microheater control chip; wherein each microheater has a resistance value, and the microheater control chip adjusts a working current or a working voltage received by the corresponding microheater according to the resistance value so that the heating temperatures provided by the multiple microheaters are the same.

6. The chip mounting method according to claim 4, characterized in that: When the chip is transferred to the two conductive materials, the corresponding microheaters have been controlled by the microheater control chip to preheat the corresponding two conductive materials to a maximum heating temperature and then cool them to a predetermined cooling temperature; wherein each microheater has a resistance value, and the microheater control chip adjusts a working current or a working voltage received by the corresponding microheater according to the resistance value so that the heating temperatures provided by the multiple microheaters are the same.

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