laser device

Abstract

A laser device is provided. According to one embodiment, the laser device includes: a platform; a laser supply unit disposed on a top surface of the platform and providing a laser beam; a scanner that adjusts the light path so that the laser beam irradiates an irradiation line formed on the top surface of the platform; and a control unit that controls the driving of the scanner, wherein the scanner includes: a shield disposed on the light path of the laser beam emitted from the laser supply unit and performing an opening and closing operation.

Description

Technical Field

[0001] This invention relates to a laser device. Background Technology

[0002] With the development of multimedia, the importance of display devices is increasing. In response, various types of display devices, such as liquid crystal displays and organic light-emitting diode displays, are being used.

[0003] In the manufacturing process of display devices, a laser beam can be used to cut the corresponding display device into the required specifications and shapes. The laser beam can move repeatedly along the same direction as the cutting line on the target substrate, oscillating forward and backward at predetermined distances. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a laser device capable of uniformly irradiating a laser beam along each region of a cutting line on a substrate.

[0005] The technical problems of this invention are not limited to those mentioned above. Other technical problems not mentioned can be clearly understood by those skilled in the art through the following content.

[0006] A laser device according to an embodiment for solving the above-mentioned technical problems includes: a platform; a laser supply unit disposed on a top of the platform and providing a laser beam; a scanner that adjusts the light path so that the laser beam irradiates an irradiation line formed on a top of the platform; and a control unit that controls the driving of the scanner, wherein the scanner includes: a shield disposed on the light path of the laser beam emitted from the laser supply unit and performing an opening and closing operation.

[0007] The control unit can calculate the processing area irradiated by the laser beam and the non-processing area not irradiated by the laser beam.

[0008] If the target aiming point of the laser beam is located in the processing area, the control unit can control it in the following manner: if the moving speed of the target aiming point of the laser beam is above the reference speed, the shield is opened; if the moving speed of the target aiming point of the laser beam is less than the reference speed, the shield is closed.

[0009] If the target aiming point of the laser beam is located in the non-processing area, the control unit can close the shield.

[0010] The scanner may include a mirror that oscillates the laser beam, and the target aiming point of the laser beam can be moved repeatedly by using the oscillation of the laser beam in the mirror to move forward in the direction of movement and backward in the direction opposite to the direction of movement.

[0011] The forward distance of the laser beam to the target aiming point can be greater than the reverse distance.

[0012] A laser device according to another embodiment for solving the above-mentioned technical problem includes: a laser providing unit that emits a laser beam during a first time period and a second time period; a light path adjusting unit that adjusts the travel angle of the laser beam; and a shield disposed on the travel path of the laser beam, wherein the shield is opened during the first time period to allow the emitted laser beam to travel, and is closed during the second time period to block the travel of the emitted laser beam.

[0013] The first time period and the second time period can be continuous without interruption.

[0014] The laser device may further include a control unit that controls the operation of the optical path adjustment unit and the shield, wherein the control unit can calculate the processing area irradiated by the laser beam and the non-processing area not irradiated by the laser beam.

[0015] During the first time period, the target aiming point of the laser beam can be located within the processing area and can move at a speed greater than the reference speed.

[0016] Specific details of other embodiments are provided in the detailed description and accompanying drawings.

[0017] According to one embodiment of the laser device, a laser beam can be uniformly irradiated along each region of the cutting line of the target substrate.

[0018] The effects of the embodiments are not limited to those illustrated above, and more diverse effects are included in this specification. Attached Figure Description

[0019] Figure 1 This is a plan view of a display device according to one embodiment.

[0020] Figure 2 This is a schematic partial cross-sectional view of a display device according to one embodiment.

[0021] Figure 3 This is a perspective view of a laser device according to an embodiment.

[0022] Figure 4 This is a schematic diagram of a scanner according to one embodiment.

[0023] Figure 5 This is a flowchart illustrating a method for manufacturing a display device according to an embodiment.

[0024] Figure 6It is a flowchart that specifically illustrates the steps of irradiating a laser beam onto a substrate along a calculated irradiation pattern.

[0025] Figure 7 It shows the basis Figure 5 The manufacturing method of the display device is shown in the plan view of the substrate to which a laser beam is irradiated.

[0026] Figure 8 This is a diagram illustrating the driving process of the mirror according to one embodiment.

[0027] Figure 9 This is a diagram illustrating the movement of the target aiming point of a laser beam according to one embodiment.

[0028] Figure 10 It is a graph showing the position of the target aiming point of the laser beam over time when the laser beam is irradiated according to a manufacturing method of a display device according to an embodiment.

[0029] Figure 11 yes Figure 10 An enlarged view of region A.

[0030] Figure 12 It is a graph showing the movement speed of the target aiming point of the laser beam according to its position when the laser beam oscillates based on the manufacturing method of the display device according to an embodiment.

[0031] Explanation of reference numerals in the attached figures:

[0032] 1: Laser device

[0033] 10: Object substrate

[0034] 20: Platform

[0035] 30: Platform Transfer Department

[0036] 40: Laser Supply Department

[0037] 50: Scanner

[0038] 51: Mirror section

[0039] 52: Mirror drive unit

[0040] 53: Sheath

[0041] 54: Mask drive unit

[0042] 60: Scanner Transfer Department

[0043] 70: Cooling section

[0044] 80: Control Department

[0045] 90: Platform Encoder Detailed Implementation

[0046] References and Appendix Figure 1 The advantages and features of the invention, as well as the methods for achieving them, will become clear from the detailed embodiments described below. However, the invention can take many different forms and is not limited to the embodiments disclosed below. These embodiments are provided only to complete the disclosure of the invention and to fully inform those skilled in the art of the invention of its scope, which is defined only by the scope of the claims.

[0047] The reference to elements or layers being "on" other elements or layers includes situations where they are immediately above or adjacent to other elements, or where other layers or elements are sandwiched in between. Throughout this specification, the same reference numerals refer to the same constituent elements. The shapes, dimensions, ratios, angles, quantities, etc., disclosed in the drawings used to illustrate embodiments are exemplary, and therefore the invention is not limited to the matters illustrated.

[0048] Although terms such as "first" and "second" are used to describe multiple constituent elements, these constituent elements are clearly not limited to these terms. These terms are only used to distinguish one constituent element from another. Therefore, the "first constituent element" mentioned below can obviously also be a "second constituent element" within the technical concept of this invention.

[0049] The following description refers to specific embodiments.

[0050] Figure 1 This is a plan view of a display device according to one embodiment. Figure 2 This is a schematic partial cross-sectional view of a display device according to one embodiment.

[0051] Reference Figure 1 and Figure 2 A display device (DD), as a device for displaying moving or still images, can be used not only as the display screen of portable electronic devices such as mobile phones, smartphones, tablet PCs, smartwatches, watch phones, mobile communication terminals, electronic notebooks, e-readers, PMPs, navigators, and UMPCs, but also as the display screen of various products such as televisions, laptops, monitors, billboards, and IoT products. Examples of display devices (DDs) include organic light-emitting diode (OLED) displays, liquid crystal displays, plasma displays, field emission displays, electrophoretic displays, electrowetting displays, quantum dot displays, and micro LED displays. The following description uses an OLED as an example, but is not limited to this.

[0052] The display device DD may include a display panel DP. The display panel DP may include a flexible substrate containing a flexible polymer material such as polyimide. Accordingly, the display panel DP can be bent, folded, rolled, or bent. However, it is not limited to this; the display panel DP may include a glass substrate made of a glass-like material.

[0053] The display panel DP may include a main region MR and a curved region BD connected to one side of the main region MR along a first direction DR1. The display panel DP may also include a sub-region SR connected to the curved region BD and overlapping the main region MR along the thickness direction. The curved region BD and the sub-region SR may have a shape that protrudes from the main region MR along the first direction DR1.

[0054] In a display panel DP, the portion displaying the image can be defined as the display area DA, and the portion not displaying the image can be defined as the non-display area NDA. The display area DA of the display panel DP can be located within the main area MR. The remaining portion of the display panel DP besides the display area DA can be the non-display area NDA, and the peripheral edge of the display area DA in the main area MR, the entire curved area BD, and the entire sub-area SR can be the non-display area NDA. However, this is not a limitation; the curved area BD and / or the sub-area SR can also include the display area DA.

[0055] The main region MR can have a shape that is substantially similar to the planar shape of the display device DD. The main region MR can be a flat area located on a plane. However, it is not limited to this. In the main region MR, at least one of the remaining edges, except for the edge connected to the curved region BD, can also be curved to form a curved surface or bend in the vertical direction.

[0056] The display area DA of the display panel DP can be located in the center of the main area MR. The display area DA can include multiple pixels. The display area DA can be a rectangular shape or a rectangular shape with rounded corners. However, it is not limited to this; the display area DA can be a square or other polygonal shapes, or various shapes such as circles, ellipses, etc.

[0057] In the main region MR, the non-display area NDA can be located around the display area DA. The non-display area NDA of the main region MR can be placed in the area between the outer boundary of the display area DA and the edge of the display panel DP. Signal wiring or drive circuitry used to apply signals to the display area DA can be arranged in the non-display area NDA of the main region MR.

[0058] In the curved region BD, the display panel DP can bend downwards in the thickness direction, in other words, it can bend in the opposite direction to the display surface. The curved region BD can have a constant radius of curvature, but it is not limited to this; it can also have different radii of curvature for each interval. As the display panel DP is bent in the curved region BD, the face of the display panel DP can be flipped. That is, the upward-facing side of the display panel DP can be changed by first turning outwards through the curved region BD and then downwards.

[0059] The sub-region SR can extend from the curved region BD. The sub-region SR can extend in a direction parallel to the main region MR after the curvature ends. The sub-region SR can overlap with the main region MR along the thickness direction of the display panel DP. The sub-region SR can overlap with the non-display area NDA at the edge of the main region MR, and further overlap with the display area DA of the main region MR. The width of the sub-region SR can be the same as the width of the curved region BD, but is not limited to this.

[0060] The display panel DP may include: a first short side SS1, disposed on the other side of the main region MR in the first direction DR1, and extending along the second direction DR2; a first long side LS1, disposed on one side of the main region MR in the second direction DR2, and extending along the first direction DR1; a second long side LS2, disposed on the other side of the main region MR in the second direction DR2, and extending along the first direction DR1; and a second short side SS2, disposed on one side of the main region MR in the first direction DR1, and extending along the second direction DR2.

[0061] The corners where the first short side SS1 meets the first long side LS1 and the second long side LS2 respectively can form right angles. The corners where the second short side SS2 meets the first long side LS1 and the second long side LS2 respectively can also form right angles. However, it is not limited to this; each corner can be formed as an acute angle or an obtuse angle, or it may include a curved portion.

[0062] The display panel DP may further include: a first protruding edge PS1, located on one side of the curved region BD and the sub-region SR in a second direction DR2, and extending along the first direction DR1; a second protruding edge PS2, located on the other side of the curved region BD and the sub-region SR in a second direction DR2, and extending along the first direction DR1; and a third protruding edge PS3, located on one side of the sub-region SR in a first direction DR1, and extending along the second direction DR2.

[0063] The corners where the first protruding edge PS1 meets the second short side SS2 and the corners where the second protruding edge PS2 meets the second short side SS2 can form right angles, but are not limited to this; they can include acute angles, obtuse angles, or curved sections. The corners where the first protruding edge PS1 meets the third protruding edge PS3 and the corners where the second protruding edge PS2 meets the third protruding edge PS3 can form right angles, but are not limited to this; they can include acute angles, obtuse angles, or curved sections.

[0064] A driver chip IC can be disposed on a sub-region SR of the display panel DP. The driver chip IC may include an integrated circuit that drives the display panel DP. In one embodiment, the integrated circuit may be a data driver integrated circuit that generates and provides data signals, but is not limited thereto. The driver chip IC can be attached to the display panel DP by means of an anisotropic conductive film, or by means of ultrasonic bonding.

[0065] A pad may be provided at the end of the sub-region SR of the display panel DP, and a printed circuit board (FPCB) may be attached to the pad. The FPCB may be a flexible printed circuit board or a film.

[0066] The first short side SS1, second short side SS2, first long side LS1, second long side LS2, first protruding edge PS1, second protruding edge PS2, and third protruding edge PS3 of the aforementioned display panel DP can be lines used for cutting during the formation of the display panel DP. The appearance of the display panel DP on a plan view can be defined by the first short side SS1, second short side SS2, first long side LS1, second long side LS2, first protruding edge PS1, second protruding edge PS2, and third protruding edge PS3, and can have a closed curve shape.

[0067] For example, a display panel DP can be manufactured by directly cutting from the substrate of a mother substrate unit. However, it is not limited to this; the display panel DP can also be manufactured by precisely cutting the substrate of a cell unit after cutting from the substrate of the mother substrate unit. In this case, the cutting process of forming the substrate of the cell unit from the substrate of the mother substrate unit can be performed using a laser device that is relatively less precise than the cutting process that forms the appearance of the display panel DP. In the process of forming the display panel DP from the substrate of the cell unit, the display panel DP can be formed by cutting along the edges corresponding to the first short side SS1, the second short side SS2, the first long side LS1, the second long side LS2, the first protruding edge PS1, the second protruding edge PS2, and the third protruding edge PS3 of the display panel DP. However, it is not limited to this; it is also possible to form the display panel DP by cutting only a portion of the aforementioned edges. For example, the display panel DP can be formed by cutting along the edges corresponding to the second short side SS2, the first protruding edge PS1, and the second protruding edge PS2. The following example illustrates the process of manufacturing a display panel (DP) by precisely cutting the substrate of the mother substrate unit into the substrate of the unit unit, but it is not limited to this.

[0068] Display panels (DPs) can have a structure in which various organic and inorganic layers are laminated on an insulating substrate. The insulating substrate can be a flexible substrate comprising a polymer material, but is not limited to this; it can be a glass substrate including glass. Display panels (DPs) can be manufactured by laminating various organic and inorganic layers after cutting the insulating substrate to form the appearance of the display panel (DP). Specifically, the substrate to be cut (… Figure 3 The “10” can be an insulating substrate. In this case, various organic layers (not shown) and inorganic layers (not shown) can be laminated on the substrate to be cut to manufacture the display panel DP. However, it is not limited to this, and the substrate to be cut can be a substrate with various organic layers and inorganic layers laminated on it. Specifically, the appearance of the display panel DP can be formed by cutting after various organic layers and inorganic layers are laminated on an insulating substrate.

[0069] Display panel (DP) cutting can be achieved using a laser device (see reference). Figure 3 To execute, use the "1"). For detailed instructions, please refer to [link / reference]. Figure 3 and Figure 4 Then it will be discussed.

[0070] The processes of attaching the driver chip IC and the printed circuit board FPCB to the display panel DP, as well as the bending process of the bending area BD of the display panel DP, can be performed after the cutting process.

[0071] The laser device will now be described. The laser device described below can be used to cut display panels (DPs) from substrates that are divided into unit units from substrates of a mother substrate.

[0072] Figure 3 This is a perspective view of a laser device according to an embodiment. Figure 4 This is a schematic diagram of a scanner according to one embodiment.

[0073] Reference Figure 3 and Figure 4 According to one embodiment, the laser device 1 can draw a laser beam LB along a virtual cutting line CL formed on the target substrate 10, and separate and cut one side and the other side based on the cutting line CL. In the cutting line CL, the lines that have been processed are shown as solid lines, and the lines to be processed are shown as dashed lines.

[0074] The laser device 1 may include: a platform 20 for placing the target substrate 10; a platform transfer unit 30 for moving the platform 20; a laser supply unit 40 for generating a laser beam LB; a scanner 50 for changing the path of the laser beam LB; a scanner transfer unit 60 for moving the scanner 50; a cooling unit 70 for cooling the target substrate 10; a control unit 80 for controlling the drive of the laser device 1; and a platform encoder 90 for providing position information of the platform 20 to the control unit 80.

[0075] Platform 20 can support the target substrate 10. Platform transfer unit 30 can move platform 20. For example, platform transfer unit 30 can move platform 20 along a first direction DR1, but it is not limited to this and can move in multiple directions. Platform transfer unit 30 can move platform 20 to move laser beam LB along the cutting line CL. However, it is not limited to this, it can also move laser supply unit 40 and scanner 50 without moving platform 20 to move laser beam LB along the cutting line CL, or it can move platform 20, laser supply unit 40 and scanner 50 simultaneously to move laser beam LB along the cutting line CL.

[0076] The laser supply unit 40 can generate and emit a laser beam LB. The laser beam LB generated by the laser supply unit 40 can be any one of, for example, a CO2 laser, a green laser, an infrared laser, or an ultraviolet laser, but is not limited to this.

[0077] The scanner 50 can be positioned along the optical path of the laser beam LB emitted from the laser supply unit 40. The laser beam LB emitted from the laser supply unit 40 can enter the interior of the scanner 50. The scanner 50 can adjust the optical path of the laser beam LB emitted from the laser supply unit 40. The laser beam LB, with its optical path adjusted by the scanner 50, can irradiate along the cutting line CL of the target substrate 10. Specifically, the scanner 50 can oscillate the laser beam LB. Therefore, the angle at which the laser beam LB is incident on the upper surface of the target substrate 10 can vary within a predetermined range. On the upper surface of the target substrate 10, the predetermined range of the laser beam LB incident can be the light irradiation zone LBD. The light irradiation zone LBD can be formed along the cutting line CL.

[0078] The scanner 50 may include: a mirror 51 that reflects the laser beam LB emitted from the laser supply unit 40; a mirror drive unit 52 that drives the mirror 51; a shield 53 that blocks the laser beam LB; and a shield drive unit 54 that drives the shield 53.

[0079] The mirror portion 51 can oscillate the laser beam LB emitted from the laser supply portion 40, thereby causing the target aiming point of the laser beam LB to move forward and backward. The mirror portion 51 may include a first mirror portion 51a that oscillates the laser beam LB along a first direction DR1 and a second mirror portion 51b that oscillates the laser beam LB along a second direction DR2. The laser beam LB can be irradiated onto the plane defined by the first direction DR1 and the second direction DR2 through the first mirror portion 51a and the second mirror portion 51b.

[0080] The mirror drive unit 52 can drive the mirror unit 51 and selectively adjust the movement of the mirror unit 51. The mirror drive unit 52 may include a first mirror drive unit 52a that drives the first mirror unit 51a and a second mirror drive unit 52b that drives the second mirror unit 51b.

[0081] A shield 53 can block the laser beam LB emitted from the laser supply unit 40. The shield 53 can be arranged in the optical path of the laser beam LB. The shield 53 can adjust the entry of the laser beam LB into the scanner 50 by opening and closing operations. For example, if the shield 53 is open, the laser beam LB can enter the scanner 50; if the shield 53 is closed, the laser beam LB cannot enter the scanner 50. For example, the shield 53 can open and close in a sliding manner, but it is not limited to this and can open and close in various ways. Figure 4 The illustration shows a shield 53 arranged on a surface of the housing 55 of the scanner 50 described later; however, it is not limited to this, and the shield 53 may also be located inside or outside the housing 55.

[0082] The opening and closing operation of the shield 53 can be controlled by the control unit 80. Specifically, whether the shield 53 is opened or closed can be determined based on the position of the target aiming point of the laser beam LB within the target substrate 10. The target aiming point of the laser beam LB can represent the location reached by the laser beam LB when the shield 53 is open. As will be described later, the position of the target aiming point of the laser beam LB when the shield 53 of the target substrate 10 is opened or closed can be determined based on the shape of the cutting line CL and the unit forward distance of the laser beam LB (refer to...). Figure 10 The number of laser beam LB scans per unit area is determined by "d1" and the number of times the laser beam scans each unit area.

[0083] The cover 53 can be driven by the cover drive unit 54. As described above, the cover 53 can be opened and closed in a sliding manner, and the cover drive unit 54 can drive the cover 53 to slide. The cover drive unit 54 can be controlled by the control unit 80. Specifically, the cover drive unit 54 can receive a control signal from the control unit 80 to open and close the cover 53. The opening and closing operation of the cover 53 via the control unit 80 will be described later.

[0084] The scanner 50 may also include a housing 55 for housing the mirror section 51 and the mirror drive section 52. The housing 55 may form the shape of the scanner 50 and provide space for housing the mirror section 51 and the mirror drive section 52. The housing 55 may include: a light inlet 551, which opens toward the laser supply section 40 to allow the laser beam LB emitted from the laser supply section 40 to enter its interior; and a light irradiation port 552, which opens to irradiate the laser beam LB toward the target substrate 10 through the mirror section 51.

[0085] The laser supply unit 40 and the scanner 50 can be moved along the second direction DR2 by means of the scanner transfer unit 60. The scanner transfer unit 60 can be formed as a gantry structure. The scanner transfer unit 60 may include: a horizontal support unit 61 extending in a horizontal direction; a vertical support unit 62 connected to the horizontal support unit 61 and extending along a third direction DR3, which is a vertical direction; and a horizontal moving unit 63 disposed on the horizontal support unit 61, which moves the laser supply unit 40 and the scanner 50 along the second direction DR2. The horizontal support unit 61 may have a shape that extends along the second direction DR2. The vertical support unit 62 may be arranged on one side and the other side of the platform 20 in the second direction DR2. The laser supply unit 40 and the scanner 50 may be arranged inside the horizontal moving unit 63. The scanner transfer unit 60 can be connected to a control unit 80, and the movement of the scanner transfer unit 60 can be controlled by the control unit 80.

[0086] The cooling section 70 can cool the target substrate 10 irradiated by the laser beam LB. Specifically, the cooling section 70 can cool the tail of the light irradiation zone LBD based on the moving direction of the light irradiation zone LBD. When the laser beam LB irradiates the target substrate 10, the light irradiation zone LBD irradiated by the laser beam LB can be instantly heated. At this time, compressive stress due to heat can be generated in the target substrate 10 within the light irradiation zone LBD. The cooling section 70 can instantly cool the tail edge of the light irradiation zone LBD based on the moving direction of the light irradiation zone LBD. At this time, tensile stress can be generated in the cooled area. Thus, if thermal shock (compressive stress and tensile stress) caused by a rapid temperature change is applied to the target substrate 10, fine cracks can be generated, thereby allowing the target substrate 10 to be cut along the cutting line CL. The degree of cooling of the target substrate 10 by the cooling section 70 can be adjusted according to the material of the target substrate 10 and the type of laser beam LB, etc.

[0087] The control unit 80 can control the overall operation of the laser device 1. Specifically, the control unit 80 can control the platform transfer unit 30, the laser supply unit 40, the scanner 50, the scanner transfer unit 60, and the cooling unit 70. The control unit 80 can use information such as the shape of the cutting line CL, the thickness and material of the target substrate 10, and the position of the platform 20 to control the cutting process of the target substrate 10.

[0088] Furthermore, the control unit 80 can adjust the opening and closing operation of the mask 53 under the control of the mask drive unit 54. Specifically, when the target aiming point of the laser beam LB is located in the non-processing area ( Figure 10 In the case of "NPA" (non-NPA), the control unit 80 can control the shutter 53 to close. Furthermore, when the target aiming point of the laser beam LB is located in the processing area ( Figure 10 In the case of “PA”, if the moving speed of the target aiming point of the laser beam LB is above the reference speed, the shutter 53 can be controlled to open; if the moving speed of the target aiming point of the laser beam LB is less than the reference speed, the shutter 53 can be controlled to close. The reference speed is set in order to uniformly irradiate the laser beam LB along the interval of the cutting line CL. It can be less than or equal to the moving speed when the laser beam LB irradiates the target substrate 10.

[0089] The laser-irradiated cutting process may include a first time period in which the mask 53 is open and a second time period in which the mask 53 is closed. The control unit 80 can control the mask drive unit 54 to open the mask 53 during the first time period and to close the mask 53 during the second time period. During the first time period, the target aiming point of the laser beam LB may be located in the processing area, and the moving speed of the target aiming point of the laser beam LB may be greater than a reference speed. During the second time period, the target aiming point of the laser beam LB may be located in a non-processing area, or it may be located in the processing area, and the moving speed may be less than the reference speed.

[0090] More detailed information regarding the control of the cover plate 53 via the control unit 80 will be described later.

[0091] The platform encoder 90 can provide the position information of the platform 20 to the control unit 80. Specifically, the platform encoder 90 can sense the position of the platform 20 and convert it into an electrical signal to be provided to the control unit 80.

[0092] In the cutting process of the substrate 10 using the laser beam LB, the laser beam LB can be oscillated by the mirror 51, while the scanner 50 can be moved by the scanner transfer unit 60, and the platform 20 can be moved by the platform transfer unit 30. Through the above operation, the laser beam LB can repeatedly move forward along the moving direction of the light irradiation zone LBD and backward in the opposite direction to the moving direction of the light irradiation zone LBD. The forward distance of the laser beam LB can be greater than the backward distance. Therefore, the light irradiation zone LBD can repeatedly move forward and backward with the laser beam LB. For example, in the cutting process, when the light irradiation zone LBD moves towards the first direction DR1, the movement of the laser beam LB towards the first direction DR1 can be forward, and the movement of the laser beam LB towards the other side of the first direction DR1 can be backward.

[0093] The laser beam LB can provide energy to the cutting line CL of the target substrate 10 by traveling forward and backward along the cutting line CL. Specifically, the point that instantaneously irradiates the laser beam LB can travel forward and backward along the cutting line CL and provide energy to the cutting line CL of the target substrate 10. The irradiated points in each unit area within the cutting line CL can be uniform overall, but are not limited to this. The target substrate 10 can be cut along the cutting line CL by the energy provided by the laser beam LB.

[0094] The following describes a method for manufacturing a display device using the laser device 1 described above. The method for manufacturing the display device DD, described later, is a method for forming a display panel DP by cutting a target substrate 10 with a laser beam LB.

[0095] Figure 5This is a flowchart illustrating a method for manufacturing a display device according to an embodiment. Figure 6 It is a flowchart that specifically illustrates the steps of irradiating a laser beam onto a substrate along a calculated irradiation pattern. Figure 7 It shows the basis Figure 5 The manufacturing method of the display device is shown in the plan view of the substrate to which a laser beam is irradiated. Figure 8 This is a diagram illustrating the driving process of the mirror according to one embodiment. Figure 9 This is a diagram illustrating the movement of the target aiming point of a laser beam according to one embodiment. Figure 10 It is a graph showing the position of the target aiming point of the laser beam over time when the laser beam is irradiated according to a manufacturing method of a display device according to an embodiment. Figure 11 yes Figure 10 An enlarged view of region A. Figure 12 It is a graph showing the movement speed of the target aiming point of the laser beam according to its position when the laser beam oscillates based on the manufacturing method of the display device according to an embodiment.

[0096] Reference Figures 5 to 12 A method for manufacturing a display device according to one embodiment may include the following steps: preparing a laser device (S10); providing a control unit with the shape of a cutting line, the unit forward distance of the laser beam, and the number of scans of the laser beam LB per unit area (S20); providing the control unit with position information of the platform collected from the platform encoder (S30); calculating a laser beam irradiation pattern by the control unit (S40); and irradiating the target substrate with a laser beam according to the calculated irradiation pattern (S50).

[0097] In the step of preparing the laser device (S10), the laser device is referenced Figure 3 and Figure 4 The laser device described above (refer to...) Figure 3 (1). Therefore, additional explanation for this is omitted in this step.

[0098] After performing the step of preparing the laser device (S10), the step of providing the control unit 80 with the shape of the cutting line, the unit traverse distance of the laser beam, and the number of scans of the laser beam in each unit area (S20) can be performed.

[0099] As described above, the cutting line CL can be a line cut by the object substrate 10 under laser beam LB. The shape of the cutting line CL can be similar to that of the reference. Figure 1 The display panels DP described above have the same shape.

[0100] The target aiming point of the laser beam LB can be determined by a scanner (see reference). Figure 3 The “50”) and the platform (refer to Figure 3The laser beam LB can be positioned roughly along the cutting line CL during the operation of "20". The target aiming point of the laser beam LB can also be formed in a region beyond the cutting line CL. However, for the region where the target aiming point of the laser beam LB is beyond the cutting line CL, the shield 53 is closed and can be protected from being irradiated by the laser beam LB.

[0101] For example, the target aiming point of the laser beam LB can travel from the first aiming start point SP1a on the target substrate 10 through the first cutting start point SP1b and the first cutting end point EP1b to the first aiming end point EP1a. The area between the first cutting start point SP1b and the first cutting end point EP1b serves as the processing area PA for irradiation by the laser beam LB, and can be located within the cutting line CL. The area between the first aiming start point SP1a and the first cutting start point SP1b, and the area between the first cutting end point EP1b and the first aiming end point EP1a serve as the non-processing area NPA on the target substrate 10, where the laser beam LB is blocked by the shield 53 and will not irradiate it, and can be located outside the cutting line CL. The non-processing area NPA can be an area used to ensure that the number of laser beam LB scans per unit area is uniform between the first cutting start point SP1b and the first cutting end point EP1b. A detailed description of the processing area PA and the non-processing area NPA will be given later.

[0102] As described above, the target aiming point of the laser beam LB can be moved repeatedly in both forward and reverse directions. When the target aiming point of the laser beam LB travels from the first aiming start point SP1a to the first aiming end point EP1a, the laser beam LB can be continuously emitted from the laser supply unit 40.

[0103] The edge formed by the first cutting start point SP1b and the first cutting end point EP1b can be the first short side of the display panel DP (refer to...). Figure 1 (SS1). The first cutting start point SP1b and the first cutting end point EP1b can be located between the first aiming start point SP1a and the first aiming end point EP1a.

[0104] The laser beam LB can irradiate from the first cutting start point SP1b to the first cutting end point EP1b on the target substrate 10. For the regions between the first aiming start point SP1a and the first cutting start point SP1b, and between the first cutting end point EP1b and the first aiming end point EP1a, when the target aiming point of the laser beam LB passes through these regions, the shield 53 is closed, preventing irradiation by the laser beam LB. However, in this case, the laser beam LB can also be continuously emitted from the laser supply unit 40. However, it is not limited to this; for the regions between the first aiming start point SP1a and the first cutting start point SP1b, and between the first cutting end point EP1b and the first aiming end point EP1a, since these regions are located outside the cutting line CL, when the target aiming point of the laser beam LB passes through these regions, the shield 53 is opened, allowing irradiation by the laser beam LB.

[0105] Furthermore, the target aiming point of the laser beam LB can travel from the second starting point SP2a on the target substrate 10, through the second cutting starting point SP2b and the second cutting ending point EP2b, to the second ending point EP2a. The region between the second starting point SP2a and the second cutting starting point SP2b can be located outside the closed curve-shaped cutting line CL, and the region between the second cutting ending point EP2b and the second ending point EP2a can be located inside the closed curve-shaped cutting line CL. As described above, the target aiming point of the laser beam LB can repeatedly travel forward and backward. When the target aiming point of the laser beam LB travels from the second starting point SP2a to the second ending point EP2a, the laser beam LB can be continuously emitted from the laser supply unit 40.

[0106] The edge formed by the second cutting start point SP2b and the second cutting end point EP2b can be the second short side of the display panel DP (refer to...). Figure 1 (SS2). The second cutting start point SP2b and the second cutting end point EP2b can be located between the second starting point SP2a and the second ending point EP2a.

[0107] The area between the second cutting start point SP2b and the second cutting end point EP2b is designated as the processing area PA. When the target aiming point of the laser beam LB passes through this area, the shield 53 is opened, allowing the laser beam LB to irradiate the area. The area between the second starting point SP2a and the second cutting start point SP2b, and the area between the second cutting end point EP2b and the second cutting end point EP2a, are designated as the non-processing area NPA. When the target aiming point of the laser beam LB passes through this area, the shield 53 is closed, preventing irradiation by the laser beam LB. However, in this case, the laser beam LB can be continuously emitted from the laser supply unit 40. However, this is not a limitation. For the area between the second starting point SP2a and the second cutting start point SP2b, since it is located outside the cutting line CL, the shield 53 is opened when the target aiming point of the laser beam LB passes through this area, allowing the area to also be irradiated by the laser beam LB. In this case, similarly, since the area between the second cut end point EP2b and the second cut end point EP2a is located inside the cut line CL, the shield 53 may have to be closed when the target aiming point of the laser beam LB passes through this area.

[0108] In the laser beam LB irradiation process, the laser beam LB can be oscillated by the mirror 51, thereby allowing the target aiming point of the laser beam LB to repeatedly move forward and backward. The target aiming point of the laser beam LB can oscillate with a predetermined oscillation width WS. When the target aiming point of the laser beam LB moves forward and backward, it can be accompanied by a uniform motion UM moving at a constant speed and an acceleration / deceleration motion AM with varying speed.

[0109] When the target aiming point of the laser beam LB moves at a constant speed UM, the shield 53 can be opened to allow the laser beam LB to irradiate the target substrate 10. When the target aiming point of the laser beam LB undergoes acceleration or deceleration AM, the shield 53 can be closed to prevent the laser beam LB from irradiating the target substrate 10. However, in this case, the laser beam LB can also be continuously emitted from the laser supply unit 40.

[0110] The cutting process can be performed by moving the platform 20 and / or the scanner 50 while the laser beam LB oscillates. For example, the target aiming point of the laser beam LB can be repeatedly moved forward along the first direction DR1 and backward along the second direction DR2. At the same time, the platform 20 can move along the second direction DR2 and / or the scanner 50 can move along the first direction DR1.

[0111] When the laser beam LB swings once, the unit forward distance W1 of the laser beam LB's target aiming point can be the same as the sum of the swing width WS of the laser beam LB's target aiming point and the distance moved by the platform 20 or scanner 50 during one swing of the laser beam LB. When the laser beam LB swings once, the unit backward distance W2 of the laser beam LB's target aiming point can be the same as the sum of the swing width WS of the laser beam LB's target aiming point and the distance moved by the platform 20 or scanner 50 during one swing of the laser beam LB. The unit backward distance W2 of the laser beam LB's target aiming point can be less than the unit forward distance W1 of the laser beam LB's target aiming point.

[0112] While the laser beam LB oscillates, the platform 20 and / or scanner 50 can move, so that the target aiming point of the laser beam LB can move a unit distance W3 in the forward direction each time it moves forward and backward. The unit distance W3 of the target aiming point of the laser beam LB can be the same as the value of the difference between the unit forward distance W1 and the unit backward distance W2 of the target aiming point of the laser beam LB.

[0113] The unit forward distance d1 of the laser beam LB can represent the distance the laser beam LB travels forward in each uniform motion UM. The unit backward distance d2 of the laser beam LB can represent the distance the laser beam LB travels backward in each uniform motion UM. The unit forward distance d1 of the laser beam LB can be greater than the unit backward distance d2. In the unit uniform motion UM of the laser beam LB, the unit forward distance d1 and the unit backward distance d2 of the laser beam LB can be constant, but are not limited to this.

[0114] The number of laser beam LB scans (n) per unit area can represent the number of times the laser beam LB scans at any point within the cutting line CL. The number of laser beam LB scans (n) per unit area can have a uniform value across the entire cutting line CL. That is, in the laser beam LB irradiation process, uniform energy can be applied to the entire cutting line CL.

[0115] The unit forward distance d1 of the laser beam LB and the number of laser beam LB scans (n) per unit area can be set differently depending on the target substrate 10. For example, they can be set differently depending on the shape, thickness, and material of the target substrate 10, but are not limited to this.

[0116] If the unit forward distance d1 of the laser beam LB and the number of laser beam LB scans (n) per unit area are determined, the unit forward distance d3 of the laser beam LB can be determined by the following Equation 1.

[0117] [Formula 1]

[0118]

[0119] The unit travel distance d3 of the laser beam LB can represent the distance that the laser beam LB travels on the target substrate 10 each time it oscillates past the mirror 51. The unit travel distance d3 of the laser beam LB can be the same as the difference between the unit forward distance d1 and the unit backward distance d2 of the laser beam LB. Therefore, if the unit forward distance d1 of the laser beam LB and the number of laser beam LB scans (n) per unit area are determined, the unit backward distance d2 and the unit travel distance d3 of the laser beam LB can be determined together.

[0120] After performing the step (S20) of providing the control unit with the shape of the cutting line, the unit forward distance of the laser beam, and the number of laser beam scans per unit area, the step (S30) of providing the control unit with the platform position information collected from the platform encoder can be performed. (See above for reference...) Figure 3 and Figure 4 The platform encoder 90 can provide the position of the platform 20. The position of the object substrate 10 within the platform 20 can be kept approximately constant. Therefore, by providing the position information of the platform 20, the control unit 80 can be provided with the specific position of the object substrate 10 arranged on the platform 20.

[0121] The step of providing the platform's position information collected from the platform encoder to the control unit (S30) can also be performed before the step of providing the control unit with the shape of the cutting line, the unit forward distance of the laser beam, and the number of laser beam scans per unit area (S20). That is, the execution order of the step of providing the platform's position information collected from the platform encoder to the control unit (S30) and the step of providing the control unit with the shape of the cutting line, the unit forward distance of the laser beam, and the number of laser beam scans per unit area (S20) is not limited.

[0122] After performing the step of providing the platform position information collected from the platform encoder to the control unit (S30), the step of calculating the laser beam illumination pattern by the control unit can be performed (S40). The laser beam illumination pattern can be calculated using information such as the shape of the cutting line CL received in the previous step, the unit forward distance d1 of the laser beam LB, the number of laser beam LB scans (n) per unit area, and the position of the platform 20 collected from the platform encoder 90. For example, the calculated laser beam illumination pattern may include the unit movement distance d3 of the laser beam LB calculated by Equation 1 above, the first aiming start point SP1a and the first aiming end point EP1a determined by the position information of the platform 20 received from the platform encoder 90, whether the mask 53 is operated according to its position, and the laser beam switching point, etc. That is, if the irradiation pattern of the laser beam LB is calculated, the cutting line CL of the laser beam LB irradiating the target substrate 10, the first aiming start point SP1a, the first aiming end point EP1a, the laser beam switching point, the unit forward distance d1 of the laser beam LB, the unit moving distance d3 of the laser beam LB, and the moving speed of the target aiming point of the laser beam LB can be determined.

[0123] After performing the step of calculating the irradiation pattern of the laser beam by the control unit (S40), the step of irradiating the target substrate with the laser beam according to the calculated irradiation pattern can be performed (S50). The laser beam LB can irradiate along the cutting line CL in a manner that the number of laser beam LB scans (n) per unit area is constant. Furthermore, when the target aiming point of the laser beam LB moves along the cutting line CL, the unit forward distance d1, the unit backward distance d2, and the unit moving distance d3 of the laser beam LB can be kept constant.

[0124] The step of irradiating the target substrate with a laser beam according to the calculated irradiation pattern (S50) may include the following steps: irradiating the scanner with a laser beam, and operating at least one of the scanner and the platform to move the target aiming point of the laser beam according to the calculated laser beam irradiation pattern (S51); determining whether the laser beam irradiates the processing area (S52); if the laser beam irradiates the processing area, determining whether the moving speed of the laser beam is above the reference speed (S53); and if the laser beam does not irradiate the processing area, determining whether the laser beam irradiates a region that exceeds the unit reverse distance of the laser beam from the first cutting end point (S54).

[0125] The laser supply unit 40 can irradiate a laser beam LB onto the scanner 50. The target aiming point of the laser beam LB can be moved at a constant speed UM within the light irradiation zone LBD by the scanner 50. At the same time, the laser beam LB moving at a constant speed UM within the light irradiation zone LBD can move at least one of the scanner 50 and the platform 20, causing the target aiming point of the laser beam LB to move along the cutting line CL. That is, the target aiming point of the light irradiation zone LBD can move along the cutting line CL. While moving the target aiming point of the laser beam LB, the shutter 53 can be operated through several real-time judgment processes. If the shutter 53 is opened, the laser beam LB can enter the scanner 50 from the laser supply unit 40; if the shutter 53 is closed, it can prevent the laser beam LB from entering the scanner 50 from the laser supply unit 40.

[0126] The following describes several determination steps performed to determine whether the shield 53 is open or closed during the movement of the target aiming point of the laser beam LB in step (S50) of irradiating the target substrate according to the calculated irradiation pattern. First, a step (S52) can be performed to determine whether the target aiming point of the laser beam is formed within the processing area. The processing area PA can represent the area where the target substrate 10 is cut by the laser beam LB. The processing area PA can represent the area between the first cutting start point SP1b and the first cutting end point EP1b formed along the cutting line CL. The non-processing area NPA can represent the area outside the processing area PA.

[0127] The laser beam LB can begin irradiating the scanner 50 from the laser supply unit 40 before the target aiming point reaches the first cutting start point SP1b. That is, the laser beam LB can begin to be emitted towards the scanner 50 from the non-processing area NPA before the target aiming point is located at the first cutting start point SP1b. The laser beam LB can be oscillated by the oscillation of the mirror unit 51. The mirror unit 51 can change from a stationary state to a state of uniform oscillation by accelerating the oscillation speed. If the mirror unit 51 oscillates at a uniform speed, the target aiming point of the laser beam LB can repeatedly move forward and backward with a predetermined oscillation width WS. The acceleration of the mirror unit 51 can be performed by moving at least one of the platform 20 and the scanner 50, but it is not limited to this and can also be performed when the platform 20 and the scanner 50 are stationary. The location where the mirror unit 51 begins to move at a uniform speed UM can be the first aiming start point SP1a. If the target aiming point of the laser beam LB reaches the first aiming start point SP1a, the laser beam LB can be emitted from the laser supply unit 40. However, it is not limited to this; the laser beam LB can also be emitted before the target aiming point of the laser beam LB reaches the first aiming start point SP1a. By ensuring the area between the first aiming start point SP1a and the first cutting start point SP1b, the number of scans by the laser beam LB can be the same for each unit area in the processing area PA between the first cutting start point SP1b and the first cutting end point EP1b.

[0128] Furthermore, even after the target aiming point has passed the first cutting end point EP1b, the laser beam LB can still be emitted towards the scanner 50 until the target aiming point of the laser beam LB is located at the first aiming end point EP1a. That is, the laser beam LB can continue to be emitted even when the target aiming point is located in the non-processing area NPA between the first cutting end point EP1b and the first aiming end point EP1a. The distance between the first cutting end point EP1b and the first aiming end point EP1a can be the same as the unit retrograde distance d2 of the laser beam LB, but it is not limited to this.

[0129] When a first virtual line IL1 parallel to the time axis is drawn at any point within the processing area PA, the number of intersections between the first virtual line IL1 and the graph can be constant. Therefore, the number of laser beam scans (n) per unit area can be uniform at any point within the processing area PA. For example, in Figure 10 In the diagram, the number of intersections between the first virtual line IL1 drawn at any location within the processing area PA and the chart can be 5 (n=5), and the number of intersections between the second virtual line IL2 and the chart can be less than 3.

[0130] exist Figure 10In the diagram, the target aiming point of the laser beam LB is illustrated with a dashed line when the shield 53 is closed, and with a solid line when the shield 53 is open. When the target aiming point of the laser beam LB is located in the non-processing area NPA, the shield 53 can be closed to block the laser beam LB from irradiating the target substrate 10. Furthermore, it can be determined whether the target aiming point of the laser beam LB is formed in a region exceeding a unit retrograde distance d2 from the first cutting end point EP1b. If the target aiming point of the laser beam LB is formed in a region exceeding a unit retrograde distance d2 from the first cutting end point EP1b, the laser processing can be terminated. The location exceeding a unit retrograde distance d2 from the first cutting end point EP1b can be the first aiming end point EP1a where the laser processing ends.

[0131] The shield 53 can prevent the target substrate 10 from being processed in areas other than the processing area PA. That is, the shield 53 can be closed when the target aiming point of the laser beam LB is located between the first aiming start point SP1a and the first cutting start point SP1b, and when the target aiming point of the laser beam LB is located between the first cutting end point EP1b and the first aiming end point EP1a.

[0132] When the target aiming point of the laser beam LB is located within the processing area PA, a step (S53) can be performed to determine whether the moving speed of the target aiming point of the laser beam is greater than or equal to a reference speed. If the moving speed of the target aiming point of the laser beam LB is greater than or equal to the reference speed, the shield 53 can be opened to allow the laser beam LB to irradiate the target substrate 10. If the moving speed of the target aiming point of the laser beam LB is less than the reference speed, the shield 53 can be closed to prevent the laser beam LB from irradiating the target substrate 10. The reference speed can be less than or equal to the speed of the laser beam LB when it is moving at a constant speed UM. Through this step (S53), when the target aiming point of the laser beam LB is accelerating or decelerating at AM, the shield 53 can be closed to prevent the laser beam LB from irradiating the target substrate 10. Therefore, the laser beam LB can move at a uniform speed along the cutting line CL on the target substrate 10 and irradiate it.

[0133] The following explains the repeated forward and reverse movements of the laser beam LB as the target aiming point moves. The laser beam LB can move forward from the first aiming conversion point TP1 to the second aiming conversion point TP2, and then change direction at the second aiming conversion point TP2 to move backward towards the third aiming conversion point TP3.

[0134] When the target aiming point of the laser beam LB moves forward, the first laser beam switching point UP1 and the second laser beam switching point UP2 can be located between the first aiming switching point TP1 and the second aiming switching point TP2. The first laser beam switching point UP1 and the second laser beam switching point UP2 can be the boundary points of one side and the other side of the first uniform speed interval UM1 where the target aiming point of the laser beam LB moves forward at a uniform speed. In the first uniform speed interval UM1 between the first laser beam switching point UP1 and the second laser beam switching point UP2, the shield 53 can be opened to allow the laser beam LB to irradiate the target substrate 10. The first uniform speed interval UM1 can be the interval in which the target aiming point of the laser beam LB moves at a uniform speed above the reference speed.

[0135] A first acceleration / deceleration interval AM1 can be formed between the first aiming conversion point TP1 and the first laser beam conversion point UP1. During the first acceleration / deceleration interval AM1, the shield 53 can be closed to prevent the laser beam LB from irradiating the target substrate 10. The first acceleration / deceleration interval AM1 can be the interval in which the moving speed of the target aiming point of the laser beam LB increases.

[0136] A second acceleration / deceleration interval AM2 can be formed between the second laser beam switching point UP2 and the second aiming switching point TP2. In the second acceleration / deceleration interval AM2, the shield 53 can be closed to prevent the laser beam LB from irradiating the target substrate 10. The second acceleration / deceleration interval AM2 can be the interval in which the moving speed of the target aiming point of the laser beam LB decreases.

[0137] The third laser beam switching point UP3 and the fourth laser beam switching point UP4 can be located between the second aiming switching point TP2 and the third aiming switching point TP3. The third laser beam switching point UP3 and the fourth laser beam switching point UP4 can be the boundary of one side and the other side of the second uniform speed interval UM2 where the target aiming point of the laser beam LB moves at a uniform speed in reverse. Within the second uniform speed interval UM2 between the third laser beam switching point UP3 and the fourth laser beam switching point UP4, the shield 53 can be opened to allow the laser beam LB to irradiate the target substrate 10. The second uniform speed interval UM2 can be the interval where the target aiming point of the laser beam LB moves at a uniform speed greater than a reference speed.

[0138] The third laser beam switching point UP3 can be located at the same location as the second laser beam switching point UP2, but is not limited to this. The fourth laser beam switching point UP4 can be located to one side of the first laser beam switching point UP1 in the forward direction of the laser beam LB. The distance between the first laser beam switching point UP1 and the fourth laser beam switching point UP4 can be the same as the unit movement distance d3 of the laser beam LB.

[0139] A third acceleration / deceleration interval AM3 can be formed between the second aiming conversion point TP2 and the third laser beam conversion point UP3. In the third acceleration / deceleration interval AM3, the shield 53 can be closed to prevent the laser beam LB from irradiating the target substrate 10. The third acceleration / deceleration interval AM3 can be the interval in which the moving speed of the target aiming point of the laser beam LB decreases and the absolute value of the moving speed increases.

[0140] A fourth acceleration / deceleration interval AM4 can be formed between the fourth laser beam switching point UP4 and the third aiming switching point TP3. In the fourth acceleration / deceleration interval AM4, the shield 53 can be closed to prevent the laser beam LB from irradiating the target substrate 10. The fourth acceleration / deceleration interval AM4 can be the interval in which the movement speed of the target aiming point of the laser beam LB increases and the absolute value of the movement speed increases.

[0141] Based on the manufacturing method of the laser device 1 and the display device DD according to an embodiment, uniform energy can be provided along the cutting line CL by region. Specifically, the laser beam LB can irradiate along the cutting line CL by reciprocating motion. When the target aiming point of the laser beam LB is located in the non-processing area NPA, the shield 53 can be closed. Furthermore, when the laser beam LB reciprocates, the shield 53 can be closed in the acceleration / deceleration intervals AM1, AM2, AM3, and AM4 of the target aiming point of the laser beam LB, and the shield 53 can be opened only in the uniform speed intervals UM1 and UM2, allowing the laser beam LB to move at a uniform speed and irradiate the target substrate 10. Therefore, the number of laser beam LB scans (n) per unit area within the cutting line CL can be uniform, thereby providing uniform energy along the cutting line CL by region.

[0142] Furthermore, regarding the control of the laser beam LB by opening and closing the laser supply unit 40 itself, it may be difficult to achieve real-time and timely control of the laser beam LB due to the time required to drive the laser supply unit 40. However, based on the manufacturing method of the laser device 1 and the display device DD according to an embodiment, the laser beam LB is controlled by opening and closing the shield 53 while the laser supply unit 40 is continuously emitting the laser beam LB, thereby enabling real-time and timely control of whether the laser beam LB is irradiated.

[0143] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, it will be understood by those skilled in the art that the invention can be implemented in other specific forms without altering its technical concept or essential features. Therefore, the embodiments described above should be understood as exemplary in all respects, and not limiting.

Claims

1. A laser device comprising: a stage; a laser providing section arranged on an upper portion of the stage and providing a laser beam; a scanner adjusting an optical path so that the laser beam is irradiated to an irradiation line formed on an upper portion of the stage; and a control section controlling driving of the scanner, wherein the scanner includes: a shutter arranged on the optical path of the laser beam emitted from the laser providing section and performing opening and closing operations, the control section calculates a processing region irradiated by the laser beam and a non-processing region not irradiated by the laser beam, when a position of a target aiming point of the laser beam is located in the processing region, the control section controls in such a manner that: if a moving speed of the target aiming point of the laser beam is equal to or greater than a reference speed, the shutter is opened, and if the moving speed of the target aiming point of the laser beam is less than the reference speed, the shutter is closed.

2. The laser device according to claim 1, wherein if the position of the target aiming point of the laser beam is located in the non-processing region, the control section closes the shutter.

3. The laser device according to claim 1, wherein the scanner includes a mirror section that oscillates the laser beam, the target aiming point of the laser beam is moved by repeatedly performing forward movement in a moving direction and reverse movement in a direction opposite to the moving direction by oscillation of the laser beam using the mirror section.

4. The laser device according to claim 3, wherein a distance of the target aiming point of the laser beam performing the forward movement is greater than a distance of performing the reverse movement.

5. A laser device comprising: a laser providing section emitting a laser beam during a first time period and a second time period; an optical path adjusting section adjusting a traveling angle of the laser beam; a shutter arranged on a traveling path of the laser beam; and a control section controlling operations of the optical path adjusting section and the shutter, wherein the shutter is opened during the first time period to allow the emitted laser beam to travel, and is closed during the second time period to block the emitted laser beam from traveling, the control section calculates a processing region irradiated by the laser beam and a non-processing region not irradiated by the laser beam, during the first time period, a target aiming point of the laser beam is located in the processing region and moves at a speed equal to or greater than a reference speed.

6. The laser device according to claim 5, wherein the first time period and the second time period are continuously consecutive without interruption. ​ ​

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