Conductive structure and method of making the same

Abstract

The application provides a conductive structure and a preparation method thereof. The preparation method comprises the following steps: preparing a frame, wherein the frame comprises a static frame and a moving plate; preparing the moving plate, wherein the moving plate can move relative to the static frame; preparing a conductive connecting piece by using a MEMS process; and assembling the conductive connecting piece, wherein the conductive connecting piece comprises end portions coupled with the static frame and the moving plate respectively and a wire connected between the end portions. The static frame and the moving plate are prepared by using a traditional process, and the conductive connecting piece is prepared by using a MEMS process, so that the advantages of different processes are effectively utilized, the manufacturing difficulty and cost of the conductive structure are reduced, and the conductive structure is easy to be miniaturized and integrated.

Description

TECHNICAL FIELD

[0001] The present application relates to a conductive structure used by a camera, in particular to a conductive connector prepared by MEMS technology and a method for assembling the conductive structure. BACKGROUND

[0002] The conductive structure is widely used in electronic products, which usually includes a static component and a moving component, wherein the moving component can move relative to the static component to improve the use experience of the product, and the conductive connector is used between the moving component and the static component to realize electrical connection.

[0003] In the prior art, the conductive structure is manufactured by a traditional method, which is cost-effective, but when the wire size of the conductive connector is small, interference is easy to occur, the reliability is poor, and the more stringent tolerance requirements cannot be met.

[0004] Therefore, it is necessary to provide a new conductive structure and a preparation method thereof. SUMMARY

[0005] Based on the above problems, the present application provides a conductive structure and a preparation method thereof, and specifically, the scheme of the present application is as follows:

[0006] A preparation method of a conductive structure includes the following steps: preparing a frame, the frame includes a static frame and a moving plate, the moving plate can move relative to the static frame; preparing a conductive connector by using a MEMS process; assembling the conductive connector, the conductive connector includes end portions respectively coupled with the static frame and the moving plate, and a wire connected between the end portions.

[0007] Further, the step of preparing the conductive connector by using the MEMS process includes: selecting a substrate; preparing the conductive connector on the substrate; removing the substrate and transferring the conductive connector.

[0008] Further, the step of preparing the conductive connector on the substrate includes: depositing a sacrificial layer on the substrate; depositing an insulating medium layer on the sacrificial layer; depositing a seed layer on the insulating medium layer; coating a first photoresist layer on the seed layer and patterning the first photoresist layer to expose part of the seed layer; sputtering a metal layer; removing the first photoresist layer and the seed layer; coating a second photoresist layer; patterning the second photoresist layer to expose part of the insulating medium layer; etching the insulating medium layer with the second photoresist layer as a mask; removing the second photoresist layer.

[0009] Further, it further includes the step of attaching the conductive connector to a transfer tape.

[0010] Further, the attaching the conductive connecting piece to the transfer tape comprises the step of peeling off the substrate and the sacrificial layer.

[0011] Further, the patterning the first photoresist layer comprises forming a forming area of the conductive connecting piece end and a forming area of the conductive wire.

[0012] Further, the method further comprises the step of forming a pad at the end.

[0013] Further, the substrate comprises glass or silicon.

[0014] Further, the metal comprises copper, aluminum or gold.

[0015] Further, the insulating medium layer comprises polyimide, dry film or liquid crystal polymer.

[0016] Further, the assembling the conductive connecting piece comprises connecting the conductive connecting piece to the frame by means of adhesion or welding.

[0017] Further, the application further discloses a conductive structure formed by the preparation method.

[0018] Advantages of the application:

[0019] The application utilizes the conventional process to prepare the static frame and the moving plate of the conductive structure, utilizes the MEMS process to prepare the conductive connecting piece, and assembles to complete the preparation of the conductive structure, and the MEMS process for manufacturing the conductive wire and the conventional process for manufacturing the frame are combined, which has cost benefits, can manufacture smaller conductive wires on the frame, can match higher tolerance requirements, reduces the manufacturing difficulty and cost of the conductive structure, and is easy to miniaturize and integrate. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a top view structural schematic diagram of the conductive structure of one embodiment of the application;

[0021] Figure 2 is a structural schematic diagram of the combination of the static frame and the moving plate of the conductive structure of one embodiment of the application;

[0022] Figure 3 is a structural schematic diagram of the conductive connecting piece of the conductive structure of one embodiment of the application;

[0023] Figure 4 is a preparation process flow schematic diagram of the conductive structure of one embodiment of the application;

[0024] Figures 5-17 is a preparation process cross-sectional schematic diagram of the conductive connecting piece of one embodiment of the application. DETAILED DESCRIPTION

[0025] In order to make the above objectives, features and advantages of the present application more obvious and easy to understand, the present application will be described in detail below with specific embodiments, so that the above and other objectives, features and advantages of the present application will be more clear.

[0026] As shown in Figures 1-3 , the conductive structure 100 comprises a static frame 1, a moving plate 2, a conductive connecting piece 3 and an elastic support 30. The moving plate 2 is embedded in the static frame 1 and can move relative to the static frame 1. The conductive connecting piece 3 is coupled to the static frame 1 and the moving plate 2 respectively to realize the transmission of electrical signals between the static frame 1 and the moving plate 2. The elastic support 30 can provide sufficient support and restoring force when the moving plate 2 moves. In other alternative embodiments, the moving plate 2 and the static frame 1 can also use other arrangements to adapt to the needs of different products, and accordingly, the moving mode of the moving plate 2 relative to the static frame 1 includes displacement, rotation, etc.

[0027] As shown in Figure 3 , the conductive connecting piece 3 comprises an end portion 301 for coupling with the static frame 1 or the moving plate 2, and a wire 302 connected between the two end portions 301. The surface of the end portion 301 further comprises a plurality of pads 303. The wire 302 has a certain hardness and elasticity, and can support itself between the static frame 1 and the moving plate 2, and the plurality of wires are ensured not to interfere with each other.

[0028] The static frame 1 and the moving plate 2 can be prepared by using existing mature technology, and the present embodiment will not be described in detail.

[0029] As shown in Figure 4 , one embodiment of the present application proposes a preparation method of a conductive structure 100, comprising:

[0030] S1, preparing a frame, the frame comprising a static frame 1 and a moving plate 2; the frame is of metal material, which can be stainless steel, copper, etc.

[0031] The moving plate 2 can move relative to the static frame 1;

[0032] S2, preparing a conductive connecting piece by using a MEMS process;

[0033] S3, assembling the conductive connecting piece;

[0034] The conductive connecting piece 3 comprises an end portion 301 coupled to the static frame 1 and the moving plate 2 respectively, and a wire 302 connected between the end portions.

[0035] The conductive connecting piece is mainly prepared by MEMS process; and the preparation of the conductive structure 100 is realized by assembling the conductive connecting piece 3, the static frame 1 and the moving plate 2.

[0036] As shown in Figures 5-17 , the preparation process of the conductive connecting piece is as follows:

[0037] The substrate 4 is selected, which is, for example, silicon or glass commonly used in the semiconductor field.

[0038] The conductive connecting piece 3 is prepared on the substrate, which comprises an end portion 301 and a spring 302 connected to the end portion, wherein the end portion has at least an insulating layer and a metal layer above the insulating layer.

[0039] The metal layer has a conductive function, and can be selected from gold, aluminum, copper or other shape memory alloys.

[0040] As shown in Figure 5 , a sacrificial layer 5 is deposited on the substrate 4, which can be an oxide or a polymer, and is mainly used for temporary bonding and subsequent removal of the substrate 4.

[0041] As shown in Figure 6 , an insulating medium layer 6 is deposited on the sacrificial layer 5; the insulating medium layer 6 is, for example, polyimide, dry film or liquid crystal polymer, but the present application is not limited thereto, and other applicable insulating medium materials can also be used.

[0042] As shown in Figure 7 , a seed layer 7 is deposited on the insulating medium layer 6; the seed layer serves as the basis for subsequent deposition of the metal layer, and can be selected from copper, and in other alternative embodiments, can also be aluminum or gold.

[0043] As shown in Figure 8 , a first photoresist layer 8 is coated on the seed layer 7, and the first photoresist layer 8 is patterned to form a first deposition portion 9 exposing part of the seed layer, as shown in Figure 9 . In this step, the first deposition portion 9 serves as a forming area for forming the conductive connecting piece.

[0044] As shown in Figure 10 , a metal layer is sputtered; the metal layer fills the first deposition portion 9 to form a conductive portion 10, and the surface of the metal layer and the first photoresist layer can be planarized by grinding or CMP process. From the cross section, the first deposition portion 9 is rectangular, but is not limited to this shape, and can be other applicable shapes.

[0045] As shown in Figures 11-12 , the first photoresist layer 8 and the seed layer 7 are removed.

[0046] As shown in Figures 13-14As shown, a second photoresist layer 11 is coated; similar to the formation of the first photoresist, the second photoresist layer can be formed by spin coating; the second photoresist layer is patterned, specifically, the second photoresist layer above and around the conductive portion 10 is retained, and the insulating dielectric layer 6 located between the conductive portions 10 is exposed to form an etched portion 12; the exposed insulating dielectric layer is etched to the point where it ends at the sacrificial layer 5 to form an insulating portion 14.

[0047] like Figure 15 As shown, the second photoresist layer 11 is removed.

[0048] like Figures 16-17 As shown, the substrate 4 and the sacrificial layer 5 are removed. Specifically, for example, transfer tape 13 can be used to adhere the conductive portion 10, and the sacrificial layer can be etched away or peeled off to remove the sacrificial layer and the substrate, thereby transferring the obtained conductive connector 3, including the conductive portion 10 and the insulating portion 14, onto the transfer tape 13. From the cross-sectional view, the cross-sectional area of ​​the insulating portion 14 is larger than that of the conductive portion 10, and the insulating portion 14 extends to both sides of the conductive portion 10, which can prevent interference between adjacent conductive portions 10. Optionally, from the cross-section of the wire 302, the insulating portion 14 is arranged symmetrically about the conductive portion 10, resulting in a uniform mass distribution and better wire stability.

[0049] The conductive connector 3 is assembled with the static frame 1 and the movable plate 2 to obtain the conductive structure 100. The assembly method can be adhesive bonding or welding.

[0050] Optionally, the method further includes the step of forming a pad 303 at the end 301. The pad is used for electrical connection to enable signal transmission.

[0051] This invention utilizes traditional processes to prepare a static frame and moving plate for the conductive structure, and uses MEMS processes to prepare conductive connectors. After assembly, the conductive structure is completed. The combination of MEMS processes for manufacturing wires and conventional processes for manufacturing frames is cost-effective and allows for the manufacture of smaller wires on the frame, which can meet higher tolerance requirements. It reduces the difficulty and cost of manufacturing the conductive structure and facilitates miniaturization and integration.

[0052] Furthermore, the conductive structure disclosed in this invention has a wide range of applications and is generally suitable for signal transmission between movable and fixed components. As an example, it is applicable to lens modules. Specifically, the lens is fixed to a movable plate, the photosensitive device is connected to a static frame, and the conductive connector realizes the electrical connection between the movable plate and the static frame. This allows the lens's coordinate signals, jitter frequency, etc., to be transmitted to the signal receiving unit. Conversely, it can also transmit the drive signals used for image stabilization to the drive unit that drives the lens, thereby realizing the image stabilization function of the lens module.

[0053] The above merely describes the embodiments of the present application, and it should be pointed out that, for those skilled in the art, improvements can be made without departing from the inventive concept, and these all belong to the protection scope of the present application.

Claims

1. A method for preparing a conductive structure, characterized in that, Includes the following steps: A frame is fabricated, the frame comprising a static frame and a movable plate, the movable plate being movable relative to the static frame; Fabricating a conductive connector using MEMS technology includes: selecting a substrate, fabricating the conductive connector on the substrate, removing the substrate, and transferring the conductive connector; fabricating the conductive connector on the substrate includes: depositing a sacrificial layer on the substrate, depositing an insulating dielectric layer on the sacrificial layer, depositing a seed layer on the insulating dielectric layer, coating a first photoresist layer on the seed layer and patterning the first photoresist layer to expose a portion of the seed layer, sputtering a metal layer, removing the first photoresist layer and the seed layer, coating a second photoresist layer, patterning the second photoresist layer to expose a portion of the insulating dielectric layer, etching the insulating dielectric layer using the second photoresist layer as a mask to form an insulating portion, and removing the second photoresist layer; the patterning of the first photoresist layer includes forming an end region and a wire formation region. Assemble the conductive connector, which includes an end coupled to the static frame and the movable plate respectively, and a wire connecting the ends.

2. The method for preparing the conductive structure according to claim 1, characterized in that, It also includes the step of attaching the conductive connector to the transfer tape.

3. The method for preparing the conductive structure according to claim 2, characterized in that, The step of attaching the conductive connector to the transfer tape includes the step of peeling off the substrate and the sacrificial layer.

4. The method for preparing the conductive structure according to claim 1, characterized in that, It also includes the step of forming a pad at the end.

5. The method for preparing the conductive structure according to claim 1, characterized in that, The substrate may be glass or silicon; the metal may be copper, aluminum or gold.

6. The method for preparing the conductive structure according to claim 1, characterized in that, The insulating dielectric layer includes polyimide, dry film, or liquid crystal polymer.

7. The method for preparing the conductive structure according to claim 1, characterized in that, The step of assembling the conductive connector includes connecting the conductive connector to the frame by means of adhesive bonding or welding.

8. A conductive structure, characterized in that, It is formed by the method for preparing the conductive structure according to any one of claims 1 to 7.

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