Thermal management device and thermal management system

Abstract

The present invention discloses a thermal management device and a thermal management system. The thermal management device includes a first connector and a heat exchange core. The thermal management device includes a first connecting channel and a second connecting channel. One of the first connecting channel and the second connecting channel has at least two orifices on the outer wall of the first connector, and the other channel includes at least one orifice, which facilitates connection with other components of the thermal management system.

Description

Technical Field

[0001] The present invention relates to the field of thermal management technology, and in particular to a thermal management device and a thermal management system. Background Art

[0002] The thermal management system for a vehicle includes an intermediate heat exchanger, which includes a high-pressure flow channel and a low-pressure flow channel. When the thermal management system also includes at least two evaporation units, the intermediate heat exchanger and the at least two evaporation units need to be connected by multiple pipelines, and the pipeline relationship of the thermal management system is relatively complex. Summary of the Invention

[0003] The purpose of the present application is to provide a thermal management device and a thermal management system, so as to facilitate simplifying the pipe connection between the thermal management device and other components in the thermal management system.

[0004] On the one hand, an embodiment of the technical solution of the present application provides a thermal management device, the thermal management device comprising a heat exchange core, a first connector and a second connector, the heat exchange core comprising a plurality of stacked plates, along the stacking direction of the plates, the plates of the heat exchange core are located between the first connector and the second connector, the first connector and the second connector are fixed to the heat exchange core; the first connector comprises a first wall portion, the heat exchange core has a first hole channel and a second hole channel, the thermal management device has at least a first connecting channel and a second connecting channel, the first connecting channel has a first opening in the first wall portion, at least a portion of the first opening is arranged opposite to the first hole channel, and the first hole channel is connected to the first connecting channel; the second connecting channel has a second opening in the first wall portion, at least a portion of the second opening is arranged opposite to the second hole channel, and the second hole channel is connected to the second connecting channel;

[0005] One of the first connecting channel and the second connecting channel includes at least two orifices formed on the outer wall of the first connecting body, and the other channel includes at least one orifice formed on the outer wall of the first connecting body.

[0006] On the other hand, an embodiment of the technical solution of the present application also provides a thermal management system, which includes the above-mentioned thermal management device, a liquid reservoir, a compressor and a condenser, and the thermal management device has a first inlet, a first outlet, a second outlet, a second inlet, a third outlet and a third inlet, the outlet of the compressor is connected to the inlet of the condenser, the inlet of the condenser is connected to the first inlet, and the first outlet is connected to the inlet of the compressor, and the thermal management system also includes a first evaporation unit and a second evaporation unit, the third outlet is connected to the third inlet through the first evaporation unit, and the second outlet is connected to the second inlet through the second evaporation unit.

[0007] By providing the above thermal management device and thermal management system, wherein the thermal management device includes a heat exchange core, a first connector and a second connector, the thermal management device includes a first connecting channel and a second connecting channel, the first connecting channel and the second connecting channel have openings connected to the channels of the heat exchange core, one of the first connecting channel and the second connecting channel includes at least two openings, and the other channel includes at least one opening, the thermal management device can be used to connect with other components of the thermal management system through the arrangement of the above first connecting channel and the second connecting channel, which relatively simplifies the pipeline connection of the thermal management system. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is the first connection diagram of the thermal management system;

[0009] Figure 2 This is the second connection schematic diagram of the thermal management system;

[0010] Figure 3 yes Figure 1 A schematic diagram of the three-dimensional structure of a first embodiment of the heat management device;

[0011] Figure 4 yes Figure 3 A schematic diagram of the three-dimensional structure of the thermal management device from another perspective;

[0012] Figure 5 yes Figure 3 An exploded diagram of the thermal management device from one perspective;

[0013] Figure 6 yes Figure 3 Exploded diagram of the thermal management device from another perspective;

[0014] Figure 7 yes Figure 3 A top view of the thermal management device;

[0015] Figure 8 yes Figure 7 Schematic cross-sectional view along DD;

[0016] Figure 9 yes Figure 7 Schematic cross-sectional view along CC;

[0017] Figure 10 Figure 7 Schematic cross-sectional view along BB;

[0018] Figure 11 yes Figure 3 A schematic structural diagram of another embodiment of the first plate;

[0019] Figure 12 yes Figure 3 A bottom-up schematic diagram of the thermal management device;

[0020] Figure 13 yes Figure 12 Schematic cross-sectional view along AA;

[0021] Figure 14 Yes Figure 12 Schematic cross-sectional view along EE;

[0022] Figure 15 is a schematic structural diagram of a second embodiment of a thermal management device;

[0023] Figure 16 yes Figure 3 Exploded diagram of the thermal management device from a third perspective. DETAILED DESCRIPTION

[0024] The thermal management system and thermal management device of the technical solution of the present invention can have multiple implementation methods, at least one of which can be applied to a vehicle thermal management system, and at least one of which can be applied to other thermal management systems such as a household thermal management system or a commercial thermal management system. The following is an illustration using a vehicle thermal management device as an example with reference to the accompanying drawings.

[0025] See also Figure 3-Figure 14. The thermal management device 1000 includes a heat exchange core, a first connector and a second connector. In this embodiment, the first connector includes a first plate 1140, the second connector includes a second plate 1210, and the heat exchange core includes a plurality of stacked plates. Along the stacking direction of the plates, the plates are located between the first plate 1140 and the second plate 1210. The heat exchange core includes a first heat exchange part 1100, a connecting plate 1400 and a second heat exchange part 1200. The first heat exchange part 1100 includes a top plate, and several plates of the first heat exchange part 1100 are stacked from the first plate 1140 to the top plate. The second heat exchange part 1200 also includes a bottom plate, and several plates of the second heat exchange part 1200 are stacked from the bottom plate to the second plate 1210. The connecting plate 1400 is located between the top plate and the bottom plate, and is welded and fixed to the top plate and the bottom plate. In other embodiments, the thermal management device may not have a top plate and a bottom plate, and the connecting plate 1400 may be directly welded to the plates of the first heat exchange section 1100 and the second heat exchange section 1200. Of course, the connecting plate 1400 may also be omitted, and the heat exchange core plates may be located between the first plate 1140 and the second plate 1210 along the stacking direction of the plates, with several plates stacked from the first plate 1140 to the second plate 1210, or alternatively, several plates stacked from the second plate 1210 to the first plate 1140. It should be noted that for ease of description, the second heat exchange section 1200 is defined as being located above the first heat exchange section 1100. The first connector also includes a first interface portion 1610, a second interface portion 1620, and a third interface portion 1630. The first interface portion 1610, the second interface portion 1620, and the third interface portion 1630 are fixed to the first plate 1140, including by welding. Thermal management device 1000 further includes a first inlet 1001, a first outlet 1002, a second inlet 1008, a second outlet 1007, a third inlet 1006, and a third outlet 1005. The first inlet 1001 and the first outlet 1002 are formed in the first interface portion 1610, the second inlet 1008 and the second outlet 1007 are formed in the second interface portion 1620, and the third inlet 1006 and the third outlet 1005 are formed in the third interface portion 1630. Thermal management device 1000 further includes a coolant outlet 1004 and a coolant inlet 1003, which are formed in the second connector.

[0026] The first heat exchange section 1100 and the second heat exchange section 1200 each include a plurality of stacked plates. The plate structures of the first heat exchange section 1100 and the second heat exchange section 1200 can be identical. The structure of the first heat exchange section 1100 will be described using the first heat exchange section 1100 as an example. In the first heat exchange section 1100, adjacent plates are stacked to form a first inter-plate flow channel and a second inter-plate flow channel. Except for the two plates closest to the first plate body 1140 and the top plate, one side of the inner plate forms the first inter-plate flow channel, and the other side of the inner plate forms the second inter-plate flow channel. In this embodiment, the adjacent plates have the same structure. For ease of description, one of the two adjacent plates is defined as the first plate and the other as the second plate. For example, a first plate and one of the two adjacent second plates form a first inter-plate flow channel, while the first plate and the second plate form a second inter-plate flow channel. The first inter-plate flow channel and the second inter-plate flow channel are relatively disconnected. The fluid in the first inter-plate channel and the fluid in the second inter-plate channel can exchange heat. It should be noted that the relative disconnection between the first and second inter-plate flow channels refers to a lack of connection within the first heat exchange unit 1100. Once the thermal management device 1000 becomes part of the thermal management system, this connection may occur. The thickness of the main body of the connecting plate 1400, top plate, and bottom plate is greater than the thickness of the main body of the plates, thereby enhancing the mechanical strength of the thermal management device.

[0027] The thermal management device 1000 has refrigerant and coolant flow channels. The refrigerant flow channels include a first channel, a second channel, and a third channel. The first and second channels are formed in the first heat exchange section 1100. The first inter-plate channel of the first heat exchange section 1100 is part of the first channel, and the second inter-plate channel of the first heat exchange section 1100 is part of the second channel. The third channel is formed in the second heat exchange section 1200, and the coolant channel is also formed in the second heat exchange section 1200. Refrigerant flowing through the third channel and coolant flowing through the coolant channel can exchange heat. A first inlet 1001 is connected to the first channel. In the thermal management system, the first inlet 1001 serves as the high-pressure refrigerant inlet for the thermal management device 1000 and can be connected to the outlet of the condenser or the outlet of the liquid accumulator. A first outlet 1002 is connected to the second channel and can be connected to the inlet of the compressor or to the compressor inlet through a gas-liquid separator. The cooling liquid inlet 1003 and the cooling liquid outlet 1004 are communicated with the cooling liquid flow channel.

[0028] In this embodiment, see Figure 5 and Figure 6The first heat exchange section 1100 includes at least a first channel 1160, a second channel 1120, a third channel 1130, and a fourth channel 1150. These channels extend along the plate stacking direction of the first heat exchange section 1100. The first flow channel includes the second channel 1120, a first inter-plate channel located between the plates, and the third channel 1130. The first inter-plate channel of the first heat exchange section 1100 connects the second channel 1120 and the third channel 1130. In this embodiment, the first inlet 1001 is connected to the third channel 1130. The refrigerant enters the third channel 1130 from the first inlet 1001, and then enters the first inter-plate channel of the first heat exchange part 1100. After heat exchange with the refrigerant in the second inter-plate channel of the first heat exchange part 1100, it enters the second channel 1120. The second channel 1120 has an opening on the top plate of the first heat exchange part. The refrigerant can leave the first heat exchange part 1100 through the opening on the top plate of the first heat exchange part 1100 and enter the third flow channel located in the second heat exchange part 1200. The second heat exchange section 1200 includes at least a fifth channel 1240, a sixth channel 1230, a seventh channel 1260, and an eighth channel 1270. The third flow channel includes the fifth channel 1240, the first inter-plate flow channel of the second heat exchange section 1200, and the sixth channel 1230. The coolant flow channel includes the seventh channel 1260, the eighth channel 1270, and the second inter-plate flow channel of the second heat exchange section 1200. In this embodiment, the coolant inlet 1003 communicates with the seventh channel 1260, and the coolant outlet 1004 communicates with the eighth channel 1270. The coolant enters the seventh channel 1260 through the coolant inlet 1003, then enters the second inter-plate channel of the second heat exchange section 1200, exchanges heat with the refrigerant in the third flow channel, and then enters the eighth channel 1270 and exits the thermal management device through the coolant outlet 1004. The second flow channel includes a first channel 1160, a second inter-plate channel located between the plates, and a fourth channel 1150. The second inter-plate channel of the first heat exchange unit 1100 connects to the first channel 1160 and the fourth channel 1150. The first outlet 1002 is connected to the first channel 1160. Refrigerant in the second flow channel enters the second inter-plate channel of the first heat exchange unit 1100 through the fourth channel 1150, exchanges heat with the refrigerant in the first inter-plate channel of the first heat exchange unit 1100, and then enters the first channel 1160. The refrigerant in the first channel 1160 is discharged from the thermal management device through the first outlet 1002. In this embodiment, the first outlet 1002 and the first inlet 1001 are both formed in the first interface portion 1610.

[0029] See also Figure 6 、 Figure 13 and Figure 14The thermal management device has a first connecting channel 1010, a second connecting channel 1020, a third connecting channel 1030 and a fourth connecting channel 1040, the first channel 1160 is connected to the first connecting channel 1010, the second channel 1120 is connected to the second connecting channel 1020, the third channel 1130 is connected to the third connecting channel 1030, and the fourth channel 1150 is connected to the fourth connecting channel 1040. Specifically, the first plate body 1140 includes a first wall portion 1141 and a second wall portion 1142, the first connecting channel 1010 has a first opening 1015 in the first wall portion 1141, the first channel has a channel opening in the bottom plate, the first opening 1015 is at least partially arranged opposite to the channel opening of the first channel 1160, or at least part of the channel opening of the first channel faces the first opening 1015, and the first channel 1160 is connected to the first connecting channel 1010; the first connecting channel 1010 forms a first opening on the outer wall portion of the first interface portion 1610, and the first connecting channel 1010 forms a second opening on the outer wall portion of the third interface portion 1630. In this embodiment, the first opening is the first outlet 1002, and the second opening is the third inlet 1006. In one specific embodiment, the first connecting channel 1010 includes a first groove 1011, a first hole 1012, and a second hole 1013 formed in the first plate 1140, as well as a first channel 1601 formed in the first interface portion 1610 and a fifth channel 1605 formed in the third interface portion 1630. Specifically, the first groove 1011 forms a first opening 1015 in the first wall portion 1141, and the first opening 1015 is disposed opposite or partially opposite to the first channel 1160, thereby connecting the first connecting channel 1010 to the first channel 1160. The first wall portion 1141 is welded to the bottom plate of the first heat exchange portion 1100, and the periphery of the first opening 1015 is welded and sealed to the bottom plate of the first heat exchange portion 1100 to prevent fluid leakage. For details, please refer to the following. Figure 6 and 16The first wall portion includes a first connecting wall 11411, which is distributed around the first port 1015 and is sealed between the first connecting wall 11411 and the bottom plate. The bottom plate of the heat exchange core includes a first wall 1101, which faces the first port. It can be seen that the wall forming the first connecting channel includes the first wall 1101. The first hole portion 1012 and the second hole portion 1013 have openings formed in the bottom wall forming the first groove 1011. The first hole portion 1012 and the second hole portion 1013 each have an opening in the second wall portion 1142. The opening formed by the connecting wall of the first interface portion 1610 of the first channel 1601 is arranged opposite to at least a portion of the first hole portion 1012. The first channel 1601 is connected to the first hole portion 1012. The first channel 1601 forms a first opening on the outer wall of the first interface portion 1610, which is also the first port 1002. The connecting wall of the first interface portion 1610 is welded and fixed to the first plate 1140. The opening of the fifth channel 1605 formed on the connecting wall of the third interface portion 1630 is arranged opposite to at least a portion of the second hole portion 1013. The fifth channel 1605 is connected to the second hole portion 1013. The fifth channel 1605 forms a second opening, namely the third inlet 1006, on the outer wall of the third interface portion 1630. The connecting wall of the third interface portion 1630 is welded and fixed to the first plate 1140. When the thermal management device is used, the first connecting channel 1010 forms two openings on the first connecting body for connecting to other components of the thermal management system, increasing the number of interfaces of the thermal management device, relatively reducing the number of connecting pipes and tees of the thermal management system, and also reducing the number of leakage points of the thermal management system.

[0030] The second communication channel 1020 has a second opening 1025 on the first wall portion 1141. The second channel has a channel opening on the bottom plate. The second opening 1025 is at least partially opposite the channel opening of the second channel 1120, or in other words, at least a portion of the channel opening of the second channel faces the second opening 1025. The second channel 1120 is connected to the second communication channel 1020. The second communication channel 1020 has a third hole portion 1022 and a fourth hole portion 1023. The third hole portion 1022 and the fourth hole portion 1023 each have a hole opening formed on the second wall portion 1142. The second communication channel 1020 also has a second channel 1602 and a sixth channel 1606. The second channel 1602 is formed in the second interface portion 1620. The second channel 1602 forms a third opening in the second interface portion 1620, which is also the second outlet 1007. The sixth channel 1606 is formed in the third interface portion 1630, and the sixth channel 1606 forms a fourth opening, i.e., the third outlet 1005, in the third interface portion 1630. In one specific embodiment, the second connecting channel 1020 includes a second groove 1021, a third hole portion 1022, and a fourth hole portion 1023 formed in the first plate 1140, as well as the second channel 1602 formed in the second interface portion 1620 and the sixth channel 1606 formed in the third interface portion 1630. The second groove 1021 forms a second opening 1025 in the first wall portion 1141, and the second opening 1025 is disposed opposite or partially opposite to the second channel 1120, thereby connecting the second connecting channel 1020 to the second channel 1120. The third hole portion 1022 and the fourth hole portion 1023 are formed with hole openings on the bottom wall forming the second groove 1021. The third hole portion 1022 and the fourth hole portion 1023 are formed with hole openings on the second wall portion. The channel opening formed by the connecting wall of the second interface portion 1620 of the second channel 1602 is arranged opposite to at least a portion of the third hole portion 1022. The second channel 1602 is connected to the third hole portion, wherein the connecting wall of the second interface portion 1620 is welded and fixed to the first plate. For details, please refer to Figure 6 and 16 The first wall portion 1141 includes a second connecting wall 11412, which is distributed around the second port 1025 and is sealed between the second connecting wall 11412 and the bottom plate. The bottom plate of the heat exchange core includes a second wall 1102, which faces the second port 1025. It can be seen that the wall forming the second connecting channel includes the second wall 1102. The sixth channel 1606 is arranged opposite to at least a portion of the fourth hole portion 1023 at the channel opening formed by the connecting wall of the third interface portion 1630. The sixth channel 1606 is connected to the fourth hole portion, wherein the connecting wall of the third interface portion 1630 is welded and fixed to the first plate 1140. Please refer to Figure 11In other embodiments, the first plate body 1140 includes a first sub-portion 1041 and a second sub-portion 1042, which are welded and fixed, a first hole portion 1012 and a second hole portion 1013 are formed in the first sub-portion 1041, and the second sub-portion 1042 has a first through hole 1011', the first through hole 1011' forms a side wall of the first groove 1011, and the first sub-portion 1041 relative to the wall adjacent to the second sub-portion 1042 forms the bottom wall of the first groove 1011. Of course, the first hole portion 1012 and the second hole portion 1013 have hole openings on the bottom wall of the first groove 1011, and at least part of the hole opening of the first hole portion 1012 and at least part of the hole opening of the second hole portion 1013 are arranged opposite to the first through hole 1011'. It can be known that the bottom wall forming the first groove 1011 is located in the first sub-portion. Similarly, the third hole portion 1022 and the fourth hole portion 1023 are formed in the first sub-portion 1041, the second sub-portion 1042 has a second through hole 1021', the second through hole 1021' forms the side wall of the second groove 1021, and the first sub-portion 1041 relative to the wall adjacent to the second sub-portion 1042 forms the bottom wall of the first groove 1011. Of course, the third hole portion 1022 and the fourth hole portion 1023 have hole openings on the bottom wall of the first groove 1011, and at least part of the hole opening of the third hole portion and at least part of the hole opening of the fourth hole portion are arranged opposite to the second through hole 1021'. It can be seen that the bottom wall forming the second groove is located in the first sub-portion 1041.

[0031] In other embodiments, one of the first communication channel 1010 and the second communication channel 1020 has at least two openings connected to an external device, and the other has one opening connected to an external device.

[0032] The third communication channel 1030 and the fourth communication channel 1040 both have openings in the first wall portion and the second wall portion. The opening in the first wall portion of the third communication channel 1030 is disposed opposite or partially opposite to the third hole 1130, thereby communicating with the third communication channel 1030. The opening in the first wall portion of the fourth communication channel 1040 is disposed opposite or partially opposite to the fourth hole 1150, thereby communicating with the fourth hole 1150. The third communication channel 1030 forms a first inlet 1001 in the first interface portion 1610, and the fourth communication channel 1040 forms a second inlet 1008 in the second interface portion 1620.

[0033] As can be seen from the above, the thermal management device includes an interface portion, which includes a first interface portion 1610, a second interface portion 1620, and a third interface portion 1630. The interface portion includes a connecting wall, which is welded to the first plate body. The interface portion has a channel, and the channel of the interface portion has an opening in its connecting wall. The opening formed in the channel of the interface portion's connecting wall faces the corresponding opening of the first plate body, thereby achieving communication between the channel of the interface portion and the corresponding opening of the first plate body. The interface portion and the first plate body can also be a one-piece structure, such as formed from a profile. The channel of the interface portion also has an opening in the outer wall of the interface portion for communicating with other components within the thermal management system. Of course, the interface portion can include at least one of the first interface portion 1610, the second interface portion 1620, and the third interface portion 1630. For example, if the thermal management device does not have a first interface portion, then the first inlet and the first outlet are formed on the first plate body 1140. These interface parts can be set separately, such as the first interface part 1610, the second interface part 1620 and the third interface part 1630 are three independent parts, which are respectively welded and fixed to the first plate body; two of the first interface part, the second interface part and the third interface part are an integral structure, and the other is welded and fixed to the first plate body. The first interface part 1610, the second interface part 1620 and the third interface part 1630 can also be set as an integral part and will not be described in detail. The shape of the interface part can be block-shaped or tubular. It can be seen that the first inlet 1001 and the first outlet 1002 are both located in the first interface part 1610. In order to facilitate installation with other devices of the thermal management system, the first inlet 1001 and the first outlet 1002 can be set on the same side wall. In this way, the interfaces of other components of the thermal management system are easy to integrate into one, which is also convenient for assembly.

[0034] The thermal management device includes a first throttling unit 1700, which includes a first valve core. The second interface portion 1620 includes a first cavity, with at least a portion of the first throttling unit 1700 located in the first cavity. The thermal management device includes a first valve port, which is part of the second channel 1602. The second channel 1602 includes a first subchannel and a second subchannel. The first subchannel has an opening on the inner wall of the first interface portion, which communicates with the third hole portion; the second subchannel forms a second outlet on the outer wall of the second interface portion. The first valve core can adjust the opening of the first valve port, and the first subchannel can communicate with the second subchannel through the first valve port. The first throttling unit 1700 is fixed to the second interface portion 1620, further enhancing the integration of the thermal management device.

[0035] See also Figure 5 and Figure 6Along the stacking direction of the plates, the connecting plate body 1400 is located between the first heat exchange part 1100 and the second heat exchange part 1200. Specifically, the first heat exchange part 1100 includes a first connecting wall 1110, and the second heat exchange part 1200 includes a second connecting wall 1220. In this embodiment, the first connecting wall 1110 is formed on the top plate of the first heat exchange part 1100, and the second connecting wall 1220 is formed on the bottom plate of the second heat exchange part 1200. The lower wall of the connecting plate body 1400 is welded and fixed to the first connecting wall 1110, and the upper wall of the connecting plate body 1400 is welded and fixed to the second connecting wall 1220. The first connecting wall 1110 and the second connecting wall 1220 are arranged opposite each other. The relative arrangement mentioned herein includes indirect relative arrangement and direct relative arrangement. Indirect relative arrangement means that there is another object between the first connecting wall 1110 and the second connecting wall 1220, such as the connecting plate 1400. The connecting plate 1400 may not be provided between the first connecting wall 1110 and the second connecting wall 1220, that is, the first connecting wall 1110 and the second connecting wall 1220 are directly opposite each other, and the first connecting wall 1110 and the second connecting wall 1220 are welded to each other. The thermal management device includes a first through hole 1410 and a second through hole 1420. In this embodiment, the first through hole 1410 and the second through hole 1420 are formed in the connecting plate 1400. The first through hole 1410 and the second through hole 1420 extend through the connecting plate 1400 and have openings on the upper wall and the lower wall of the connecting plate 1400, respectively. The second through hole 1420 connects the sixth channel 1230 and the first channel 1160, that is, the second through hole 1420 connects the third flow channel and the second flow channel. The refrigerant in the third flow channel and the coolant in the coolant flow channel enter the first channel 1160 of the first heat exchange part through the second through hole 1420 after heat exchange in the second heat exchange part 1200. Since the first channel 1160 is the outflow channel of the second flow channel, the refrigerant entering the first channel 1160 from the second heat exchange part is discharged from the thermal management device 1000 through the first outlet 1002. It can be known that in this embodiment, the refrigerant flowing out of the second heat exchange part 1200 does not participate in heat exchange in the first heat exchange part 1100, but enters the compressor through the first channel 1160.

[0036] See also Figure 8The thermal management device includes a second throttling unit 1300 and a tube 1500. The second throttling unit 1300 includes a valve port 1350 and a valve body 1310. The valve body 1310 is fixed to the first plate 1210. The valve port 1350 has a second valve port 1351. At least part of the tube 1500 is located in the fifth channel 1240. The first end of the tube 1500 is relatively fixed to the valve port 1350 of the second throttling unit 1300. The cavity of the tube 1500 is communicated with the second valve port 1351. The second end of the tube 1500 cooperates with the first through hole 1410. If the second end is located in the first channel, Through hole 1410, and sealed at the connection with the wall of the first through hole 1410, so that the second channel 1120 is connected with the cavity of the tube body 1500, and the refrigerant in the second channel 1120 enters the second valve port 1351 through the cavity of the tube body 1500; the second heat exchange part 1200 includes a first partition, and the first partition and one of the plates of the second heat exchange part are an integral structure, along the axial direction of the fifth channel 1240, the first partition forms the bottom wall of the fifth channel 1240, and the first partition has an opening for accommodating the tube body 1500, forming a sealing arrangement between the wall of the first partition opening and the wall of the tube body 1500.

[0037] See also Figure 1 、 Figure 5 as well as Figure 6 , combined with Figure 1The thermal management system shown in the figure describes the operation of thermal management device 1000. The thermal management system includes a compressor 100, a condenser 200, and thermal management device 1000. The outlet of compressor 100 is connected to the first inlet 1001 of the thermal management device through condenser 200, and the first outlet 1002 of the thermal management device is connected to the inlet of compressor 100. The thermal management system also includes a first evaporation unit, a second evaporation unit, a first heat exchanger 400, and a pump 300. The coolant inlet 1003 of thermal management device 1000 is connected to the coolant outlet 1004 through the first heat exchanger 400 and pump 300. Specifically, the coolant flow path of thermal management device 1000, first heat exchanger 400, and pump 300 form a coolant system or part of a coolant system. The coolant in the coolant system flows within the coolant system driven by pump 300. The third outlet 1005 of the thermal management device 1000 communicates with the third inlet 1006 via the first evaporation unit. The first evaporation unit includes a first throttling device 500 and a second heat exchanger 600. The second outlet 1007 of the thermal management device 1000 communicates with the second inlet 1008 via the second evaporation unit. The second evaporation unit includes a third heat exchanger 800. During operation, high-temperature, high-pressure refrigerant releases heat in the condenser 200. Relatively low-temperature, high-pressure refrigerant enters the refrigerant flow path of the thermal management device 1000, i.e., the first flow path of the first heat exchange unit 1100, through the first inlet 1001. Refrigerant in the second channel enters the cavity of the tube body 1500 through the second channel. After throttling and reducing pressure through the first valve port 1351, the refrigerant enters the fifth channel 1240, i.e., the third flow path. There, the refrigerant absorbs heat from the coolant, lowering the coolant temperature, before entering the sixth channel 1230. The refrigerant in the sixth channel 1230 enters the second flow channel, specifically the first channel 1160, through the second through hole 1420 of the connecting plate body 1400. The first channel 1160 is the outlet channel of the second flow channel. Therefore, the refrigerant in the second heat exchange part 1200 does not participate in or participates in a small amount of heat exchange in the first heat exchange part 1100, and then enters the first connecting channel 1010, and then is discharged from the first outlet 1002 and enters the inlet of the compressor. The second hole 1120 also has an opening toward the first plate. The refrigerant in the second hole 1120 also enters the second connecting channel 1020. The refrigerant in the second connecting channel 1020 exits the thermal management device through the second outlet 1007 and the third outlet 1005. The third outlet 1005 is connected to the third inlet 1006 via the first throttling device 500 and the second heat exchanger 600. It can be seen that the second heat exchanger 600 is an evaporator. The refrigerant discharged from the second heat exchanger 600 enters the first connecting channel 1010 through the third inlet 1006 and then enters the inlet of the compressor through the first outlet 1002. It can be seen that the refrigerant discharged from the second heat exchanger 600 enters the first connecting channel 1010, exits the thermal management device through the first outlet 1002, and enters the inlet of the compressor 100.The refrigerant throttled by first throttling unit 1700 flows out through second outlet 1007, passes through third heat exchanger 800, and enters second inlet 1008. As can be seen, third heat exchanger 800 is an evaporator. Since second inlet 1008 is connected to fourth channel 1150, the refrigerant then enters first channel 1160 and flows out of first outlet 1002 through the first connecting channel. Before entering the compressor inlet, the refrigerant from the three evaporation units converges in first connecting channel 1010. In other words, first connecting channel 1010 functions as a flow collector, while second connecting channel 1020 functions as a flow distributor. Refrigerant in second connecting channel 1020 flows out of second outlet 1007 and third outlet 1005, respectively. (See .) Figure 2 The thermal management system further includes a second throttling device 700 . In this case, the thermal management device does not include the first throttling unit 1700 . In this case, the second evaporation unit includes the second throttling device 700 and the third heat exchanger 800 .

[0038] As can be seen, the provision of second through-hole 1420 allows refrigerant from the second heat exchange section 1200 to enter the first heat exchange section 1100 for heat exchange. Specifically, the second heat exchange section includes a sixth channel 1230. The connecting plate body has a second through-hole 1420, which extends through the upper and lower walls of the connecting plate body. The opening of the sixth channel 1230 is at least partially opposite the opening of the second through-hole 1420 on its upper wall. The opening of the fourth channel 1150 is at least partially opposite the opening of the second through-hole 1420 on its lower wall. The sixth channel 1230 can communicate with the fourth channel 1150 through the second through-hole 1420. Refrigerant from the sixth channel 1230 enters the fourth channel 1150 through the second through-hole 1420, and then undergoes heat exchange in the first heat exchange section 1100. As can be seen, the refrigerant flowing from the second heat exchange section 1200 into the first heat exchange section 1100 also participates in the heat exchange.

[0039] See also Figure 15. The thermal management device may also not be provided with the second heat exchange part 1200, and the first channel 1160 has a channel opening on the top plate of the first heat exchange part and the second channel 1120 has a channel opening on the top plate of the first heat exchange part 1100 to communicate with other components of the thermal management system. In this embodiment, the thermal management device is not provided with an interface part, and the first outlet, the first inlet, the second outlet, the second inlet, the third outlet, and the third inlet are formed on the second wall part of the first plate body 1140, and the second wall part is the outer wall part of the first connector. In addition, the first plate body 1140 may also include a convex portion, and the convex portion of the first plate body 1140 is relatively more protruding than other parts of the first plate body. The convex portion of the first plate body 1140 may be block-shaped or tubular, and the first outlet, the first inlet, the second outlet, the second inlet, the third outlet, and the third inlet may also be formed on the convex portion of the first plate body. When the thermal management device does not include an interface portion, the opening of the first hole portion is the first outlet, the opening of the second hole portion is the third inlet, the opening of the third hole portion is the second outlet, and the opening of the fourth hole portion is the third outlet. Given the concept of the present invention, it is easy to imagine that one of the first connecting channel 1020 and the second connecting channel 1020 is provided in the first connector and the other is provided in the second connector, which will not be described in detail. The first channel 1160 may not have a channel opening in the second plate body 1210, and the second channel 1120 may not have a channel opening in the second plate body 1210.

[0040] It should be noted that the above embodiments are only used to illustrate the present invention and are not intended to limit the technical solutions described in the present invention. Although this specification has described the present invention in detail with reference to the above embodiments, it should be understood by those skilled in the art that the present invention can still be modified or replaced by equivalents, and all technical solutions and improvements thereof that do not depart from the spirit and scope of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A thermal management device, comprising a heat exchange core, a first connector, and a second connector, the heat exchange core comprising a plurality of stacked plates, wherein the plates of the heat exchange core are located between the first connector and the second connector along a stacking direction of the plates, and the first connector and the second connector are fixed to the heat exchange core; the first connector comprises a first wall portion, the heat exchange core has a first hole and a second hole, the thermal management device comprises at least a first connecting channel and a second connecting channel, the first connecting channel has a first opening in the first wall portion, at least a portion of the first opening is arranged opposite to the first hole, and the first hole is connected to the first connecting channel; the second connecting channel has a second opening in the first wall portion, at least a portion of the second opening is arranged opposite to the second hole, and the second hole is connected to the second connecting channel; One of the first connecting channel and the second connecting channel includes at least two orifices, and the at least two orifices are formed on the outer wall of the first connecting body, and the other channel includes at least one orifice, and the at least one orifice is formed on the outer wall of the first connecting body, and the orifice is an interface for external connection.

2. The thermal management device according to claim 1, characterized in that The first connecting channel includes a first opening and a second opening, the first opening and the second opening being formed on the outer wall of the first connector; the heat exchange core includes a bottom plate, the first channel has a channel opening on the bottom plate, at least part of the channel opening of the first channel faces the first opening, the first wall portion includes a first connecting wall, the first connecting wall is distributed around the first opening, and the first connecting wall and the bottom plate are sealed; the bottom plate includes a first wall, the first wall facing the first opening; And / or, the second connecting channel includes a third orifice and a fourth orifice, and the third orifice and the fourth orifice are formed on the outer wall portion of the first connector; the second channel has a channel opening on the bottom plate, and at least part of the channel opening of the first channel faces the second opening, the first wall portion includes a second connecting wall, and the second connecting wall is distributed on the peripheral side of the second opening, and a seal is arranged between the second connecting wall and the bottom plate; the bottom plate includes a second wall, and the second wall faces the second opening.

3. The thermal management device according to claim 1 or 2, characterized in that: The first connecting body includes a first plate body, the second connecting body includes a second plate body, the first wall portion is located on the first plate body, the first plate body includes a second wall portion, and the first wall portion is closer to the plate than the second wall portion; The first connecting channel includes a first hole portion and a second hole portion, and the second connecting channel includes a third hole portion and a fourth hole portion. The first hole portion, the second hole portion, the third hole portion and the fourth hole portion are formed on the first plate body, and the first hole portion, the second hole portion, the third hole portion and the fourth hole portion all have hole portion openings formed on the second wall portion.

4. The thermal management device according to claim 3, characterized in that The first plate body has a first groove and a second groove, the first groove forms the first opening in the first wall portion, the second groove forms the second opening in the first wall portion, the first hole portion and the second hole portion have hole portion openings in the wall forming the first groove, and the third hole portion and the fourth hole portion have hole portion openings in the wall forming the second groove.

5. The thermal management device according to claim 4, characterized in that: The first plate body includes a first sub-section and a second sub-section, the first sub-section and the second sub-section are welded and fixed, the first hole section, the second hole section, the third hole section and the fourth hole section are formed in the first sub-section, the second sub-section has a first through hole and a second through hole, at least part of the hole opening of the first hole section and at least part of the hole opening of the second hole section face the first through hole, at least part of the hole opening of the third hole section and at least part of the hole opening of the fourth hole section face the second through hole, the wall forming the first groove is located in the first sub-section, and the wall forming the second groove is located in the first sub-section.

6. The thermal management device according to any one of claims 1-2, 4-5, characterized in that: The thermal management device includes a refrigerant flow channel, the refrigerant flow channel includes a first flow channel and a second flow channel, the first flow channel includes a first inter-plate flow channel, a third hole channel and the second hole channel, and the second flow channel includes a second inter-plate flow channel, a fourth hole channel and the first hole channel; The thermal management device has a third communication channel and a fourth communication channel. The third communication channel is connected to the third hole channel, and the fourth communication channel is connected to the fourth hole channel. The third communication channel and the fourth communication channel respectively have channel openings on the second wall portion of the first connector.

7. The thermal management device according to claim 6, characterized in that: The first connector includes at least one of a first interface portion, a second interface portion, and a third interface portion, wherein at least one of the first interface portion, the second interface portion, and the third interface portion is integrally formed with the first plate body or is fixed to the second wall portion of the first plate body; the first connecting channel includes a first channel and a fifth channel, the second connecting channel includes a second channel and a sixth channel, the third connecting channel includes a third channel, and the fourth connecting channel includes a fourth channel; The first channel and the third channel are formed in the first interface portion, and the first channel is connected to the first hole portion; the second channel and the fourth channel are formed in the second interface portion, and the second channel is connected to the third hole portion; the fifth channel and the sixth channel are formed in the third interface portion, the fifth channel is connected to the second hole portion, and the sixth channel is connected to the fourth hole portion.

8. The thermal management device according to claim 7, characterized in that: The thermal management device includes a first interface portion, a second interface portion, and a third interface portion, wherein the first interface portion, the second interface portion, and the third interface portion are separately provided, or two of the first interface portion, the second interface portion, and the third interface portion are integrally structured and are separately provided from the other; The first channel has a first outlet on the outer wall of the first interface part, the third channel has a first entrance on the outer wall of the first interface part, and the first entrance and the first outlet are located on the same side wall of the first interface part; the second channel has a second outlet on the outer wall of the second interface part, the fourth channel has a second entrance on the outer wall of the second interface part, and the second entrance and the second outlet are located on the same side wall of the second interface part; the fifth channel has a third entrance on the outer wall of the third interface part, and the sixth channel has a third outlet on the outer wall of the third interface part; the third entrance and the third outlet are located on the same side wall of the first interface part.

9. The thermal management device according to claim 8, characterized in that: The thermal management device includes a first throttling unit, which includes a first valve core; the second interface part has a first cavity, and at least part of the first throttling unit is located in the first cavity; the thermal management device has a first valve port, which is part of the second channel, and the first valve core can adjust the opening of the first valve port; the second channel includes a first sub-channel and a second sub-channel, the first sub-channel is connected to the third hole portion, and the first sub-channel has an opening on the inner wall of the first interface part; the second sub-channel forms the second outlet on the outer wall of the second interface part; the first valve core can adjust the opening of the first valve port, and the first sub-channel can be connected to the second sub-channel through the first valve port.

10. The thermal management device according to claim 3, characterized in that: The thermal management device includes a refrigerant flow channel, the refrigerant flow channel includes a first flow channel and a second flow channel, the first flow channel includes a first inter-plate flow channel, a third hole channel and the second hole channel, and the second flow channel includes a second inter-plate flow channel, a fourth hole channel and the first hole channel; The thermal management device has a third communication channel and a fourth communication channel. The third communication channel is connected to the third hole channel, and the fourth communication channel is connected to the fourth hole channel. The third communication channel and the fourth communication channel respectively have channel openings on the second wall portion of the first connector.

11. The thermal management device according to claim 10, characterized in that: The first connector includes at least one of a first interface portion, a second interface portion, and a third interface portion, wherein at least one of the first interface portion, the second interface portion, and the third interface portion is integrally formed with the first plate body or is fixed to the second wall portion of the first plate body; the first connecting channel includes a first channel and a fifth channel, the second connecting channel includes a second channel and a sixth channel, the third connecting channel includes a third channel, and the fourth connecting channel includes a fourth channel; The first channel and the third channel are formed in the first interface portion, and the first channel is connected to the first hole portion; the second channel and the fourth channel are formed in the second interface portion, and the second channel is connected to the third hole portion; the fifth channel and the sixth channel are formed in the third interface portion, the fifth channel is connected to the second hole portion, and the sixth channel is connected to the fourth hole portion.

12. The thermal management device according to claim 11, characterized in that: The thermal management device includes a first interface portion, a second interface portion, and a third interface portion, wherein the first interface portion, the second interface portion, and the third interface portion are separately provided, or two of the first interface portion, the second interface portion, and the third interface portion are integrally structured and are separately provided from the other; The first channel has a first outlet on the outer wall of the first interface part, the third channel has a first entrance on the outer wall of the first interface part, and the first entrance and the first outlet are located on the same side wall of the first interface part; the second channel has a second outlet on the outer wall of the second interface part, the fourth channel has a second entrance on the outer wall of the second interface part, and the second entrance and the second outlet are located on the same side wall of the second interface part; the fifth channel has a third entrance on the outer wall of the third interface part, and the sixth channel has a third outlet on the outer wall of the third interface part; the third entrance and the third outlet are located on the same side wall of the first interface part.

13. The thermal management device according to claim 12, characterized in that: The thermal management device includes a first throttling unit, which includes a first valve core; the second interface part has a first cavity, and at least part of the first throttling unit is located in the first cavity; the thermal management device has a first valve port, which is part of the second channel, and the first valve core can adjust the opening of the first valve port; the second channel includes a first sub-channel and a second sub-channel, the first sub-channel is connected to the third hole portion, and the first sub-channel has an opening on the inner wall of the first interface part; the second sub-channel forms the second outlet on the outer wall of the second interface part; the first valve core can adjust the opening of the first valve port, and the first sub-channel can be connected to the second sub-channel through the first valve port.

14. The thermal management device according to any one of claims 7 to 13, characterized in that: The heat exchange core includes a first heat exchange portion and a second heat exchange portion, the first plate is fixed to the first heat exchange portion, and the second heat exchange portion is fixed to the second plate; the thermal management device has a coolant flow channel, the coolant flow channel is formed in the second heat exchange portion, the refrigerant flow channel includes a third flow channel, the third flow channel is formed in the second heat exchange portion, and the refrigerant in the third flow channel and the coolant in the coolant flow channel can exchange heat in the second heat exchange portion; the second heat exchange portion includes a fifth channel and a sixth channel, the fifth channel and the sixth channel are part of the third channel; The thermal management device includes a second throttling unit and a tube body, the second throttling unit includes a first valve mouth portion, at least part of the tube body is located in the fifth channel, the first end portion of the tube body is relatively fixed to the first valve mouth portion, the cavity of the tube body is connected to the first valve mouth and the second channel, and the sixth channel is connected to the first channel or the fourth channel.

15. The thermal management device according to claim 14, characterized in that: The thermal management device further includes a connecting plate body, the connecting plate body having a first through hole and a second through hole, the first through hole and the second through hole passing through the upper wall and the lower wall of the connecting plate body, the channel opening of the sixth channel is at least partially arranged opposite to the opening formed by the second through hole in the upper wall of the connecting plate body, the channel opening of the first channel is at least partially arranged opposite to the opening formed by the second through hole in the lower wall of the connecting plate, or at least part of the channel opening of the fourth channel is arranged opposite to the opening formed by the second through hole in the lower wall of the connecting plate body; At least a portion of the opening of the fifth channel is arranged opposite to the opening of the first through hole formed on the upper wall of the connecting plate body, and the second channel can be connected to the fifth channel through the second through hole.

16. A thermal management system, comprising a thermal management device as described in any one of claims 1-2, 4-5, and 7-13, a compressor, and a condenser, the thermal management device having a first inlet, a first outlet, a second outlet, a second inlet, a third outlet, and a third inlet, the outlet of the compressor being connected to the inlet of the condenser, the inlet of the condenser being connected to the first inlet, and the first outlet being connected to the inlet of the compressor, the thermal management system further comprising a first evaporation unit and a second evaporation unit, the third outlet being connected to the third inlet through the first evaporation unit, and the second outlet being connected to the second inlet through the second evaporation unit.

17. A thermal management system, comprising the thermal management device as claimed in claim 3, a compressor and a condenser, the thermal management device having a first inlet, a first outlet, a second outlet, a second inlet, a third outlet and a third inlet, the outlet of the compressor being connected to the inlet of the condenser, the inlet of the condenser being connected to the first inlet, the first outlet being connected to the inlet of the compressor, the thermal management system further comprising a first evaporation unit and a second evaporation unit, the third outlet being connected to the third inlet via the first evaporation unit, and the second outlet being connected to the second inlet via the second evaporation unit.

18. A thermal management system, comprising the thermal management device as claimed in claim 6, a compressor and a condenser, the thermal management device having a first inlet, a first outlet, a second outlet, a second inlet, a third outlet and a third inlet, the outlet of the compressor being connected to the inlet of the condenser, the inlet of the condenser being connected to the first inlet, the first outlet being connected to the inlet of the compressor, the thermal management system further comprising a first evaporation unit and a second evaporation unit, the third outlet being connected to the third inlet via the first evaporation unit, and the second outlet being connected to the second inlet via the second evaporation unit.

19. A thermal management system, comprising the thermal management device as claimed in claim 14, a compressor and a condenser, the thermal management device having a first inlet, a first outlet, a second outlet, a second inlet, a third outlet and a third inlet, the outlet of the compressor being connected to the inlet of the condenser, the inlet of the condenser being connected to the first inlet, the first outlet being connected to the inlet of the compressor, the thermal management system further comprising a first evaporation unit and a second evaporation unit, the third outlet being connected to the third inlet via the first evaporation unit, and the second outlet being connected to the second inlet via the second evaporation unit.

Images