Display module and display device

Abstract

The application provides a display module and a display device, and belongs to the technical field of display. The display module comprises a display panel, a printed circuit board located at the back side of the display panel, and a heat insulation layer located between the printed circuit board and the display panel. The orthographic projection of the printed circuit board on the display panel is located in the orthographic projection of the heat insulation layer on the display panel. The technical scheme of the application can improve the display uniformity of a display picture.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display module and a display device. BACKGROUND

[0002] OLED (Organic Light-Emitting Diode, OLED for short) display device has been listed as the next generation display technology with great development prospects due to its advantages of thinness, lightness, wide viewing angle, active light-emitting, continuous adjustable light-emitting color, low cost, fast response speed, small energy consumption, low driving voltage, wide working temperature range, simple production process, high light-emitting efficiency and flexible display.

[0003] OLED display device is sensitive to heat, and long time high temperature will reduce the service life of organic light-emitting material. In order to realize the narrow frame of the display module, the PCB (Printed Circuit Board) usually needs to be bent to the side of the display screen. Since the electronic components in the PCB will generate heat, the heat will be transferred to the display screen, causing the service life of the light-emitting material in the adjacent area to be shortened, and forming Mura display defect. SUMMARY

[0004] The technical problem to be solved by the present application is to provide a display module and a display device, which can improve the display uniformity of the display picture.

[0005] To solve the above technical problems, the technical solutions of the embodiments of the present application are as follows:

[0006] In one aspect, a display module is provided, comprising:

[0007] a display panel;

[0008] a printed circuit board located at the display back side of the display panel;

[0009] a heat insulation layer located between the printed circuit board and the display panel, and the orthographic projection of the printed circuit board on the display panel is located in the orthographic projection of the heat insulation layer on the display panel.

[0010] In some embodiments, the display panel comprises:

[0011] a display substrate;

[0012] a heat-conducting glue located on the side of the display substrate facing the printed circuit board;

[0013] a heat-conducting plate located on the side of the heat-conducting glue facing the printed circuit board, and the heat-conducting plate is fixed on the display substrate through the heat-conducting glue.

[0014] In some embodiments, the heat-conductive adhesive is a light-shielding heat-conductive adhesive.

[0015] In some embodiments, the heat insulation layer is fixed on the heat-conductive plate through the adhesive layer.

[0016] In some embodiments, the display module further comprises:

[0017] a heat-conductive layer between the heat insulation layer and the printed circuit board, the heat-conductive layer being connected with the heat-conductive plate, and a projection of the heat insulation layer on the display panel being within a projection of the heat-conductive layer on the display panel.

[0018] In some embodiments, the heat-conductive plate comprises a first region, a second region and a third region which are independent of each other, a projection of the printed circuit board on the display panel coincides with a projection of the first region on the display panel, the second region is in contact with the heat-conductive layer, and the third region does not cover the heat-conductive layer, wherein the third region has a greater heat radiation capacity than the first region.

[0019] In some embodiments, the display module further comprises:

[0020] an electromagnetic shielding film on a side of the printed circuit board away from the display panel.

[0021] In some embodiments, the display module further comprises:

[0022] a heat-conductive spacer on a side of the electromagnetic shielding film away from the OELD display module.

[0023] In some embodiments, the material of the heat-conductive spacer comprises heat-conductive silicone grease or heat-dissipating resin.

[0024] In some embodiments, the display module specifically comprises:

[0025] a display substrate;

[0026] a polarizer on a display side of the display substrate;

[0027] a touch layer on a side of the polarizer away from the display substrate;

[0028] a cover plate on a side of the touch layer away from the display substrate;

[0029] a back film on a display back side of the display substrate;

[0030] a heat-conductive adhesive on a side of the back film away from the display substrate;

[0031] a heat insulation layer on a side of the heat-conductive adhesive away from the display substrate;

[0032] A printed circuit board located on the side of the heat insulation layer away from the display substrate;

[0033] An electromagnetic shielding film located on the side of the printed circuit board away from the display substrate;

[0034] A display screen flip-chip film, one end of which is bonded to the display substrate, and the other end is bent to the display back side of the display substrate and bonded to the printed circuit board;

[0035] The driving chip is located on the side of the display screen's flip-chip film facing the display substrate.

[0036] This invention also provides a display device, including a display module and a housing as described above. The housing covers the display module for protection, and a thermally conductive pad is provided between the housing and the display module to maintain the distance between them.

[0037] The embodiments of the present invention have the following beneficial effects:

[0038] In the above solution, a heat insulation layer is provided between the printed circuit board and the display panel. The heat insulation layer can block the heat generated by the printed circuit board from being transferred to the display panel, reduce the temperature of the area of ​​the display panel close to the printed circuit board, prevent heat accumulation in the area, and thus prevent the lifespan of the light-emitting material in the area from being shortened under long-term high temperature, thereby ensuring the uniformity of the display image quality. Attached Figure Description

[0039] Figure 1 This is a schematic diagram of the structure of the display module for related technologies;

[0040] Figure 2 and Figure 3 This is a schematic diagram of the structure of the display module according to an embodiment of the present invention;

[0041] Figure 4 This is a planar schematic diagram of the heat-conducting plate according to an embodiment of the present invention;

[0042] Figure 5 This is a heat distribution diagram according to an embodiment of the present invention.

[0043] Figure Labels

[0044] 1. Cover plate

[0045] 2. Adhesive layer

[0046] 3. Touch layer

[0047] 4. Adhesive layer

[0048] 5. Polarizing film

[0049] 6 Display substrate

[0050] 7 back membrane

[0051] 8 heat-conducting glue

[0052] 9 heat-conducting plate

[0053] 10 adhesive layer

[0054] 11 printed circuit board

[0055] 12 electromagnetic shielding film

[0056] 13 COF support structure

[0057] 14 thermal insulation layer

[0058] 15 heat-conducting layer

[0059] 16 heat-conducting spacer

[0060] 17 housing

[0061] 201 touch layer FPC

[0062] 601 display screen COF

[0063] 602 drive chip

[0064] 100 display panel DETAILED DESCRIPTION

[0065] To make the technical problems, technical solutions and advantages to be solved by the embodiments of the present application more clear, the following will be described in detail in conjunction with the drawings and specific embodiments.

[0066] As Figure 1As shown, the existing display module includes a display panel 100 and a heat-conducting plate 9 arranged in layers, the heat-conducting plate 9 is generally made of metal, which can be an aluminum plate, a copper plate or an aluminum alloy, etc., and its main function is to disperse the heat generated by the display panel and provide structural support. The heat-conducting plate 9 is combined with the display panel 100 by a heat-conducting adhesive 8. A printed circuit board 11 is arranged on the side of the heat-conducting plate 9 away from the display panel 100, the printed circuit board 11 is fixed on the heat-conducting plate 9 by an adhesive layer 10, and an electromagnetic shielding film 12 is arranged on the side of the printed circuit board 11 away from the display panel 100. The display module further includes a display screen COF (Chip On Flex, Chip On Flex) 601, one end of the display screen COF 601 is bound to the display substrate 6, and the other end is bent to the display back side of the display panel and bound to the printed circuit board 11. The display screen COF 601 is provided with a driving chip 602, and a COF supporting structure 13 is arranged between the display screen COF 601 and the heat-conducting plate 9. The display panel includes a cover plate 1, a cementing layer 2, a touch layer 3, a cementing layer 4, a polarizer 5, a display substrate 6 and a back film 7 arranged in layers, and the display module further includes a touch layer FPC (Flexible Printed Circuit, Flexible Printed Circuit) 201 connected to the touch layer 3.

[0067] When the display module is working, the driving chip 602 and the printed circuit board 11 will generate a large amount of heat, which has the risk of being conducted to the display panel 100, and will be gathered in a large amount in the area of the display panel 100 close to the printed circuit board 11, affecting the heat dissipation speed of the display module in this area, causing the service life of the light-emitting material in this area to be shortened, and forming Mura (bright spot) defects. The heat distribution diagram of the display module is shown in FIG. I, the heat of the high-temperature area (A) is distributed in a semicircle, the heat gradient of the display module is large, and the heat uniformity is poor. The temperature in area B is lower than that in area A, and the temperature in area C is lower than that in area B. Figure 5

[0068] The embodiment of the present application provides a display module and a display device, which can improve the quality uniformity of a display picture.

[0069] The embodiment of the present application provides a display module, which includes:

[0070] a display panel;

[0071] a printed circuit board located on the display back side of the display panel;

[0072] a heat insulation layer located between the printed circuit board and the display panel, and the orthographic projection of the printed circuit board on the display panel is located in the orthographic projection of the heat insulation layer on the display panel.

[0073] ​The display panel can be a liquid crystal display panel, an OLED display panel, or a QLED display panel.

[0074] In this embodiment, a heat insulation layer is arranged between the printed circuit board and the display panel. The heat insulation layer can block the heat generated by the printed circuit board from being transmitted to the display panel, reduce the temperature of the area of the display panel close to the printed circuit board, avoid the accumulation of heat in the area, and further avoid the service life of the light-emitting material in the area from being shortened under long-term high temperature, so as to ensure the uniformity of the quality of the display picture.

[0075] In some embodiments, the display panel comprises:

[0076] a display substrate;

[0077] a heat-conducting adhesive on the side of the display substrate facing the printed circuit board;

[0078] a heat-conducting plate on the side of the heat-conducting adhesive facing the printed circuit board, the heat-conducting plate being fixed on the display substrate through the heat-conducting adhesive.

[0079] In some embodiments, the heat insulation layer is fixed on the heat-conducting plate through an adhesive layer.

[0080] As Figure 2As shown, the display module of the embodiment includes a display panel 100 and a heat-conducting plate 9 arranged in a stack, the heat-conducting plate 9 is generally made of metal, which can be an aluminum plate, a copper plate or an aluminum alloy, etc. The main function of the heat-conducting plate 9 is to disperse the heat generated by the display panel and provide structural support at the same time. The heat-conducting plate 9 is combined with the display panel 100 through a heat-conducting adhesive 8, and the color of the heat-conducting adhesive 8 can be white or black. A printed circuit board 11 is arranged on the side of the heat-conducting plate 9 away from the display panel 100, and the printed circuit board 11 is fixed on the heat-conducting plate 9 through an adhesive layer 10, which can be a pressure-sensitive adhesive. An electromagnetic shielding film 12 is arranged on the side of the printed circuit board 11 away from the display panel 100, which can shield the electromagnetic influence from the outside and ensure the display quality. The display module further includes a display screen COF 601, one end of which is bound to the display substrate 6. In order to realize a narrow frame, the other end of the display screen COF 601 is bent to the display back side of the display substrate and is bound to the printed circuit board 11. A driving chip 602 is arranged on the display screen COF 601, and a COF support structure 13 is arranged between the display screen COF 601 and the heat-conducting plate 9 to support the display screen COF 601. The display panel includes a cover plate 1, a cementing layer 2, a touch layer 3, a cementing layer 4, a polarizer 5, a display substrate 6 and a back film 7 arranged in a stack. In the embodiment, a heat insulation layer 14 is arranged between the adhesive layer 10 and the printed circuit board 11, which can be made of ABS engineering plastic or other materials with low structural strength and heat conductivity, which can block the heat of the driving chip 602 and the printed circuit board 11, reduce the temperature of the corresponding area of the display module, and reduce the risk of local high temperature to the display substrate. The heat distribution diagram of the display module of the structure is shown in FIG. II, and the area of the high-temperature zone (A) is larger, indicating that the local high temperature can be improved. Figure 5

[0081] The cover plate 1, the cementing layer 2, the touch layer 3, the cementing layer 4, the polarizer 5, the display substrate 6 and the back film 7 can be adjusted in order or increased or decreased according to the needs of the display module.

[0082] In some embodiments, the heat-conducting adhesive 8 can be a light-shielding heat-conducting adhesive, such as a black heat-conducting adhesive, which can reduce the reflection of ambient light by the display panel and improve the optical effect of the display panel

[0083] In some embodiments, the display module further includes:

[0084] A heat-conducting layer is arranged between the heat insulation layer and the printed circuit board, the heat-conducting layer is connected with the heat-conducting plate, and the orthographic projection of the heat insulation layer on the display panel is located in the orthographic projection of the heat-conducting layer on the display panel.

[0085] As Figure 3 ​As shown, the embodiment adds a heat-conducting layer 15 near the side of the heat insulation layer 14 close to the printed circuit board 11. The heat-conducting layer 15 can be a copper foil, graphite, metal mesh or similar composite material with good heat conductivity. The heat-conducting layer 15 is covered with an adhesive layer on both sides. To better increase the heat dissipation of the heat-conducting layer, the adhesive layer can be made of a high-conductivity adhesive. The heat-conducting layer 15 covers the entire heat insulation layer 14 and is connected to the heat-conducting plate 9. To enhance the heat dissipation of the entire module, the heat-conducting layer 15 does not cover the entire heat-conducting plate 9. Its main function is to disperse the heat generated by the printed circuit board 11 and the driving chip 602 to the heat-conducting plate 9, reducing the accumulation of heat in the printed circuit board 11 area, and improving the temperature uniformity of the display module.

[0086] In the embodiment, the thickness of the heat insulation layer 14 can be 1-4 mm. The heat insulation layer 14 has high thermal resistance, which can reduce the heat conduction from the printed circuit board 11 to the display module. The heat of the display module is mainly evenly heated by the heat-conducting plate attached to the back, and the heat is conducted from the hot end to the cold end, with a much higher heat conduction efficiency than the heat insulation layer 14. The heat-conducting layer 15 attached to the outer surface of the heat insulation layer 14 mainly realizes the rapid and even heating of the heat generated by the electronic elements on the printed circuit board 11 and the driving chip 602, and conducts the heat to the driving chip end away from the display module. The "heat insulation layer + heat-conducting layer" structure of the embodiment can isolate the heat of the display module from the printed circuit board 11 and the driving chip 602, reduce the local high temperature of the display module, and reduce the temperature gradient on the surface of the display module, thereby improving the display uniformity.

[0087] The temperature distribution of the display module of the embodiment is shown in Figure 5 As can be seen, the temperature distribution gradient of the display module is significantly reduced, the local high temperature is significantly improved, the maximum temperature of the display module is reduced, and the uniformity of the temperature distribution is significantly improved, which is beneficial to improving the display life and display effect of the display module. The structural design of the heat dissipation structure layer can reduce the local high temperature of the display module, reduce the reverse conduction of the heat of the printed circuit board, enhance the heat distribution uniformity of the display module, improve the heat dissipation of the display module without significantly increasing the cost, and improve the service life of the display panel.

[0088] In some embodiments, as shown in Figure 3 and Figure 4As shown, the heat-conducting plate includes a first region 9a, a second region 9b and a third region 9c which are independent of each other, the orthographic projection of the printed circuit board on the display panel coincides with the orthographic projection of the first region 9a on the display panel, the second region 9b is in contact with the heat-conducting layer, and the third region 9c is not covered by the heat-conducting layer, wherein the heat radiation capacity of the third region is greater than that of the first region. In order to improve the heat radiation capacity of the third region, the third region can be blackened so that the surface of the third region is black.

[0089] In this embodiment, the surface of the heat-conducting plate which is not covered by the heat-conducting layer is blackened, and the blackening method can be anodic oxidation, electroplating or paint spraying, which enhances the surface heat radiation of the heat-conducting plate. When the heat-conducting plate is made of metal, the surface heat radiation of the metal material is poor, so, as shown in FIG. 1C, the region 9c (i.e. the third region) of the heat-conducting plate 15 which is not covered by the heat-conducting layer 9 is blackened to increase the strong heat radiation capacity of the heat-conducting plate 15, thereby achieving rapid and uniform heating of the display module and reducing the overall temperature of the display module. The blackening process makes the heat-conducting plate non-conductive, which affects the transmission of static electricity accumulated on the printed circuit board to the heat-conducting plate. In addition, in order to ensure that the heat-conducting layer can transmit heat to the heat-conducting plate, the region 9b (i.e. the second region) of the heat-conducting plate 9 which is in contact with the heat-conducting layer 15 is not blackened. The region 9a (i.e. the first region) of the heat-conducting plate 9 which is opposite to the printed circuit board can be blackened or not. Figure 4

[0090] As shown in FIG. 1C, the display module further includes: Figure 3

[0091] A heat-conducting spacer 16 is located on the side of the electromagnetic shielding film 12 which is away from the OELD display module, and the heat-conducting spacer 16 is in contact with the shell 17 of the display module.

[0092] In this embodiment, a heat-conducting spacer 16 can also be arranged on the back of the display module, the material of the heat-conducting spacer 16 includes heat-conducting silicone grease or heat-dissipating resin, the heat-conducting spacer 16 is in contact with the shell 17 of the display device, and the heat-conducting spacer 16 can transmit the heat generated by the display module to the shell of the display module. The shell of the display module is in contact with the external environment, and has strong heat dissipation capacity, which is beneficial to further heat dissipation of the display module.

[0093] The display device provided in the embodiment of the present application includes the display module and the shell as described above. Figure 3 ​​As shown, the shell 17 covers the display module, for protecting the display module, and the shell 17 and the display module are spaced apart by the heat-conducting spacer 16, for maintaining the spacing between the shell and the display module. The heat-conducting spacer 16 is in contact with the shell 17 of the display device, and the heat generated by the display module can be transmitted to the shell of the display module through the heat-conducting spacer 16. The shell of the display module is in contact with the external environment, and has strong heat dissipation capacity, which is conducive to further heat dissipation of the display module.

[0094] In this embodiment, the display device can be a liquid crystal display device, an OLED display device, or a QLED display device.

[0095] The display device in this embodiment includes, but is not limited to, a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, and a power supply, and the like. Those skilled in the art can understand that the structure of the display device described above does not constitute a limitation on the display device, and the display device can include more or fewer components described above, or combine certain components, or different component arrangements. In the embodiments of the present application, the display device includes, but is not limited to, a display, a mobile phone, a tablet computer, a television, a wearable electronic device, a navigation display device, and the like.

[0096] The display device can be a television, a display, a digital photo frame, a mobile phone, a tablet computer, or any product or component with display function. The display device further includes a flexible printed circuit board, a printed circuit board, and a back plate.

[0097] In consumer electronics, the OLED size is small, the brightness is low, and the heat generated by the display module is not high. However, the vehicle-mounted display module requires high brightness and large size, and the overall heat of the display module will be much higher. Therefore, the technical solution of this embodiment can be applied to the vehicle-mounted display module, isolate high-temperature heat sources, improve the uniformity of display module heat dissipation, improve the picture quality uniformity of the display module, and prolong the service life. Of course, the technical solution of this embodiment is not limited to be used in the vehicle-mounted display module, but can also be applied to other types of display scenarios.

[0098] It should be explained that each embodiment in the present specification is described in a progressive manner, and the same or similar parts between each embodiment can be referred to each other, and each embodiment focuses on the difference from other embodiments. Especially, for the embodiment, since it is basically similar to the product embodiment, it is described more simply, and the related part can be referred to the part of the product embodiment.

[0099] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first", "second", and the like, as used in the present disclosure, do not imply any order, quantity, or importance, but are used to distinguish different components. The terms "include", "comprise", and the like, mean to encompass the elements listed after such terms and their equivalents, and do not exclude other elements. The terms "connected", "coupled", and the like, do not limit to physical or mechanical connections or couplings, and can include electrical connections or couplings, whether direct or indirect. The terms "upper", "lower", "left", "right", and the like, are used only to indicate relative positions, and can change according to the position of the described object.

[0100] It can be understood that when an element such as a layer, a film, a region, or a substrate is referred to as being "on" or "under" another element, it can be "directly" on or under the other element, or one or more intervening elements can also be present.

[0101] In the description of the above-described embodiments, specific features, structures, materials, or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0102] The above description is merely illustrative of the disclosure and does not limit the scope of the disclosure. Any modifications made within the spirit and principles of the disclosure shall be considered within the scope of the disclosure. Therefore, the scope of the disclosure should be determined by the scope of the claims.

Claims

1. A display module, characterized by The display module comprises: a display panel; a printed circuit board located on the display back side of the display panel; a heat insulation layer located between the printed circuit board and the display panel, the orthographic projection of the printed circuit board on the display panel is located within the orthographic projection of the heat insulation layer on the display panel; the display panel comprises: a display substrate; a heat conductive adhesive located on the side of the display substrate facing the printed circuit board; a heat conductive plate located on the side of the heat conductive adhesive facing the printed circuit board, the heat conductive plate is fixed on the display substrate through the heat conductive adhesive; the display module further comprises: a heat conductive layer located between the heat insulation layer and the printed circuit board, the heat conductive layer is connected with the heat conductive plate, the orthographic projection of the heat insulation layer on the display panel is located within the orthographic projection of the heat conductive layer on the display panel; the heat conductive plate comprises a first region, a second region and a third region which are independent of each other, the orthographic projection of the printed circuit board on the display panel coincides with the orthographic projection of the first region on the display panel, wherein the heat conductive layer in the first region covers the side of the heat insulation layer and the adhesive layer; the second region is in contact with the heat conductive layer, and the third region does not cover the heat conductive layer, wherein the heat radiation capacity of the third region is greater than that of the first region; wherein the third region of the heat conductive plate which does not cover the heat conductive layer is blackened, and the second region is not blackened; the display module further comprises: an electromagnetic shielding film located on the side of the printed circuit board away from the display panel; the display module further comprises: a heat conductive spacer located on the side of the electromagnetic shielding film away from the display panel, the heat conductive spacer is in contact with the shell of the display module.

2. The display module of claim 1, wherein, The heat conductive adhesive is a light-shielding heat conductive adhesive.

3. The display module of claim 1, wherein, The heat insulation layer is fixed on the heat conductive plate through an adhesive layer.

4. The display module of claim 1, wherein, The material of the heat conductive spacer comprises heat conductive silicone grease or heat dissipation resin.

5. The display module of any of claims 1-4, wherein, The display module specifically comprises: a display substrate; a polarizing sheet located on the display side of the display substrate; a touch layer located on the side of the polarizing sheet away from the display substrate; a cover plate located on the side of the touch layer away from the display substrate; a back film located on the display back side of the display substrate; a heat conductive adhesive located on the side of the back film away from the display substrate; a heat insulation layer located on the side of the heat conductive adhesive away from the display substrate; a printed circuit board located on the side of the heat insulation layer away from the display substrate; an electromagnetic shielding film located on the side of the printed circuit board away from the display substrate; a display screen COF, one end of the display screen COF is bound and connected with the display substrate, and the other end is bent to the display back side of the display substrate and is bound and connected with the printed circuit board; a drive chip located on the side of the display screen COF facing the display substrate.

6. A display device, characterized by comprising: The display module comprises a display module and a shell, the shell covers the display module for protection, and a heat conductive spacer is arranged between the shell and the display module to maintain the distance between the shell and the display module.

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