Multilayer capacitor and board having the multilayer capacitor mounted thereon

Abstract

A multilayer capacitor and a board on which the multilayer capacitor is mounted are provided, the multilayer capacitor comprising: a capacitor body including a dielectric layer and a first inner electrode and a second inner electrode, the capacitor body having a first surface, a second surface, a third surface, a fourth surface, a fifth surface, and a sixth surface, the first inner electrode being exposed through the third surface, the fifth surface, and the sixth surface, and the second inner electrode being exposed through the fourth surface, the fifth surface, and the sixth surface; a first side portion and a second side portion, respectively disposed on the fifth surface and the sixth surface of the capacitor body; and a first outer electrode and a second outer electrode, respectively disposed on the third surface and the fourth surface of the capacitor body to be connected to the first inner electrode and the second inner electrode, respectively. The first side portion and the second side portion include a needle-shaped second phase containing glass, manganese (Mn), and phosphorus (P), the glass including aluminum (Al) and silicon (Si).

Description

[0001] This application is a divisional application of an invention patent application with an application date of April 20, 2020, application number 202010311525.2, and invention name “Multilayer capacitor and a board with a multilayer capacitor mounted thereon”. Technical Field

[0002] The present disclosure relates to a multilayer capacitor and a board on which the multilayer capacitor is mounted. Background Art

[0003] Multilayer capacitors are widely used as information technology (IT) components for computers, personal digital assistants (PDAs), mobile phones, etc. due to their advantages such as small size, high capacitance, and easy installation. In addition, multilayer capacitors are widely used as electrical components due to their characteristics such as high reliability and high strength.

[0004] With the recent trend of miniaturization and multifunctionalization of electronic devices, multilayer capacitors are also required to have small size and high capacitance. To this end, multilayer capacitors having a structure in which inner electrodes are exposed in the width direction of the capacitor body to significantly increase the area of ​​the inner electrodes in the width direction have been manufactured.

[0005] In the multilayer capacitor having such a structure, a capacitor body is manufactured and side portions are respectively attached to both surfaces of the capacitor body in a width direction in a pre-sintering process so that the side portions cover exposed portions of the inner electrodes.

[0006] However, a multilayer capacitor having such a structure as described above (attaching the side portions after the internal electrodes are exposed in the width direction of the capacitor body) may suffer from deterioration in moisture-proof reliability and deterioration in toughness due to shrinkage after sintering. Summary of the invention

[0007] An aspect of the present disclosure is to provide a multilayer capacitor capable of increasing capacitance and improving moisture-proof reliability and toughness, and a board having the multilayer capacitor mounted thereon.

[0008] According to one aspect of the present disclosure, a multilayer capacitor includes: a capacitor body including a dielectric layer and a first inner electrode and a second inner electrode, the capacitor body having a first surface and a second surface facing each other, a third surface and a fourth surface connected to the first surface and the second surface and facing each other, and a fifth surface and a sixth surface connected to the first surface and the second surface and the third surface and the fourth surface and facing each other, the first inner electrode is exposed through the third surface, the fifth surface and the sixth surface, and the second inner electrode is exposed through the fourth surface, the fifth surface and the sixth surface; a first side portion and a second side portion, respectively disposed on the fifth surface and the sixth surface of the capacitor body; and a first outer electrode and a second outer electrode, respectively disposed on the third surface and the fourth surface of the capacitor body to be connected to the first inner electrode and the second inner electrode, respectively. The first side portion and the second side portion include a needle-shaped second phase containing glass, manganese (Mn) and phosphorus (P), the glass including aluminum (Al) and silicon (Si).

[0009] Long axes of the needle-shaped second phase of the first and second side portions may have a length of 1 μm to 10 μm.

[0010] The dielectric layer may have an average thickness of 0.4 μm or less.

[0011] Each of the first and second internal electrodes may have an average thickness of 0.41 μm or less.

[0012] The number of the stacked first internal electrodes and the second internal electrodes may be 400 or more.

[0013] Each of the first side portion and the second side portion may have an average thickness of 10 μm to 20 μm.

[0014] The capacitor body may include an active region in which the first and second internal electrodes overlap each other, and upper and lower cover regions disposed on upper and lower surfaces of the active region, respectively.

[0015] Each of the upper cover region and the lower cover region may have a thickness of 20 μm or less.

[0016] Each of the first and second external electrodes may have an average thickness of 10 μm or less.

[0017] The first outer electrode may include a first connection portion disposed on the third surface of the capacitor body to be connected to the first inner electrode and a first band portion extending from the first connection portion to a portion of the first surface of the capacitor body, and the second outer electrode may include a second connection portion disposed on the fourth surface of the capacitor body to be connected to the second inner electrode and a second band portion extending from the second connection portion to a portion of the first surface of the capacitor body.

[0018] According to another aspect of the present disclosure, a board on which a multilayer capacitor is mounted includes: a substrate including a first electrode pad and a second electrode pad on one surface of the substrate; and a multilayer capacitor, which is mounted so that the first external electrode and the second external electrode are respectively connected to the first electrode pad and the second electrode pad.

[0019] According to another aspect of the present disclosure, a multilayer capacitor includes: a capacitor body including a dielectric layer and a first inner electrode and a second inner electrode, the capacitor body having a first surface and a second surface opposite to each other, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other, and a fifth surface and a sixth surface connected to the first surface and the second surface and the third surface and the fourth surface and opposite to each other, the first inner electrode is exposed through the third surface, the fifth surface and the sixth surface, and the second inner electrode is exposed through the fourth surface, the fifth surface and the sixth surface; a first side portion and a second side portion, respectively disposed on the fifth surface and the sixth surface of the capacitor body; and a first outer electrode and a second outer electrode, respectively disposed on the third surface and the fourth surface of the capacitor body to be connected to the first inner electrode and the second inner electrode, respectively. Each of the first side portion and the second side portion includes one needle-shaped second phase and another needle-shaped second phase physically cross-linked. Each of the one needle-shaped second phase and the other needle-shaped second phase includes manganese (Mn), phosphorus (P) and glass containing aluminum (Al) and silicon (Si).

[0020] A major axis of each of the one acicular second phase and the other acicular second phase may have a length of 1 μm to 10 μm. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0022] Figure 1 is a perspective view showing a multilayer capacitor according to an embodiment of the present disclosure;

[0023] Figure 2 is along Figure 1 A cross-sectional view taken along line II' in FIG.

[0024] Figure 3A and Figure 3B They are shown respectively Figure 1 A plan view of a stacked structure of a first inner electrode and a second inner electrode of a multilayer capacitor;

[0025] Figure 4 is along Figure 1 A cross-sectional view taken along line II-II';

[0026] Figure 5 is along Figure 1 A cross-sectional view taken along line III-III' in FIG.

[0027] Figure 6 It is installed with Figure 1 Schematic cross-sectional view of a plate of a multilayer capacitor is shown in FIG. DETAILED DESCRIPTION

[0028] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings.

[0029] This disclosure may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

[0030] Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0031] Thus, the shapes and dimensions of elements in the drawings may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements.

[0032] Furthermore, throughout the drawings, the same reference numerals are used for elements having similar functions and activities.

[0033] In the specification, unless explicitly stated otherwise, when a part “includes” a certain component, it is understood that it may further include other components, rather than excluding other components.

[0034] In order to clearly describe example embodiments, X, Y, and Z indicated in the drawings are defined to represent a length direction, a width direction, and a thickness direction of the multilayer capacitor, respectively.

[0035] In addition, the Z direction may be used in the same meaning as the stacking direction along which dielectric layers are stacked.

[0036] Figure 1 is a perspective view showing a multilayer capacitor according to an embodiment of the present disclosure, Figure 2 is along Figure 1 A cross-sectional view taken along line II' in FIG. Figure 3A and Figure 3B They are shown respectively Figure 1 A plan view of a stacked structure of a first inner electrode and a second inner electrode of a multilayer capacitor, Figure 4 is along Figure 1 A cross-sectional view taken along line II-II' in FIG. Figure 5 is along Figure 1 A cross-sectional view taken along line III-III'.

[0037] In the following, reference will be made to Figures 1 to 5 A multilayer capacitor according to this embodiment is described.

[0038] Reference Figures 1 to 5 , the multilayer capacitor 100 includes a capacitor body 110 , first and second side portions 141 and 142 , and first and second external electrodes 131 and 132 .

[0039] After stacking a plurality of dielectric layers 111 in the Z direction, the capacitor body 110 is in a sintered state, and adjacent dielectric layers 111 may be integrated with each other so that a boundary therebetween is not easily visible without a scanning electron microscope (SEM).

[0040] The capacitor body 110 may include a plurality of dielectric layers 111 and first and second internal electrodes 121 and 122 having opposite polarities to each other and alternately disposed in the Z direction with the respective dielectric layers 111 interposed therebetween.

[0041] The capacitor body 110 may include: an effective area, which is a part that helps to form the capacitance of the capacitor, in which the first internal electrode 121 and the second internal electrode 122 are alternately arranged and the corresponding dielectric layer 111 is interposed between the first internal electrode 121 and the second internal electrode 122; an upper covering area 112 and a lower covering area 113, which are edge portions arranged on the upper surface and the lower surface of the active area in the Z direction.

[0042] In this case, each of the upper cover region 112 and the lower cover region 113 may have a thickness of 20 μm or less.

[0043] The shape of the capacitor body 110 is not limited, but may be a substantially hexahedron. The capacitor body 110 may have a first surface 1 and a second surface 2 facing each other in the Z direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in the X direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2 and the third surface 3 and the fourth surface 4 and facing each other in the Y direction. In this embodiment, the first surface 1 may be a mounting surface of the multilayer capacitor 100.

[0044] The dielectric layer 111 may include ceramic powder particles, for example, BaTiO 3 -based ceramic powder particles.

[0045] BaTiO3 (BT)-based ceramic powder can be prepared by partially using calcium (Ca), zirconium (Zr), etc. in BaTiO3 (Ba 1-x Ca x )TiO3、Ba(Ti 1-y Ca y )O3、(Ba 1-x Ca x )(Ti 1-y Zr y )O3 or Ba(Ti 1-y Zr y )O3, but the present disclosure is not limited to this.

[0046] Ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. may be further added to the dielectric layer 111 together with the ceramic powder particles.

[0047] The ceramic additive may include, for example, transition metal oxides or transition metal carbides, rare earth elements, magnesium (Mg), aluminum (Al), and the like.

[0048] The first and second internal electrodes 121 and 122 are electrodes to which opposite polarities are applied and may be disposed on corresponding dielectric layers 111 to be alternately stacked in the Z direction and may be alternately disposed in the capacitor body in the Z direction with a single dielectric layer 111 therebetween.

[0049] In this case, the first and second internal electrodes 121 and 122 may be electrically insulated from each other by the dielectric layer 111 disposed therebetween.

[0050] The first internal electrode 121 is exposed through the third surface 3 , the fifth surface 5 , and the sixth surface 6 of the capacitor body 110 .

[0051] In this case, the first internal electrode 121 may also be exposed through a corner connecting the third surface 3 and the fifth surface 5 of the capacitor body 110 and a corner connecting the third surface 3 and the sixth surface 6 of the capacitor body 110 .

[0052] The second internal electrode 122 is exposed through the fourth surface 4 , the fifth surface 5 , and the sixth surface 6 of the capacitor body 110 .

[0053] In this case, the second inner electrode 122 may also be exposed through a corner connecting the fourth surface 4 and the fifth surface 5 of the capacitor body 110 and a corner connecting the fourth surface 4 and the sixth surface 6 of the capacitor body 110 .

[0054] In this case, the ends of the first and second internal electrodes 121 and 122 alternately exposed through the third and fourth surfaces 3 and 4 of the capacitor body 110 can be connected to the first and second external electrodes 131 and 132 disposed on both ends in the X direction of the capacitor body 110 to be electrically connected to the first and second external electrodes 131 and 132, respectively.

[0055] According to the above configuration, when a predetermined voltage is applied to the first and second external electrodes 131 and 132 , charges are accumulated between the first and second internal electrodes 121 and 122 .

[0056] In this case, the capacitance of the multilayer capacitor 100 is proportional to an overlapping area in which the first and second internal electrodes 121 and 122 in the active region overlap each other in the Z direction.

[0057] As in this embodiment, when the first and second internal electrodes 121 and 122 are constructed, not only the basic areas of the first and second internal electrodes 121 and 122 increase, but also the vertical overlapping areas thereof increase. Therefore, the capacitance of the multilayer capacitor 100 can be increased.

[0058] For example, when the area of ​​the overlapping region of the first internal electrode 121 and the second internal electrode 122 is significantly increased, the capacitance of the capacitor may be significantly increased even with the same size.

[0059] In addition, since the steps caused by the lamination of the internal electrodes can be reduced to improve the accelerated lifetime of the insulation resistance, the multilayer capacitor 100 having improved capacitance characteristics and improved reliability can be provided.

[0060] In this case, materials of the first and second internal electrodes 121 and 122 are not limited, and the first and second internal electrodes 121 and 122 may be formed using a conductive paste including a noble metal material or at least one of nickel (Ni) and copper (Cu).

[0061] The conductive paste may be printed by screen printing, gravure printing, or the like, but the printing method of the conductive paste is not limited thereto.

[0062] An average thickness of the first and second internal electrodes 121 and 122 may be determined according to their purposes, and may be, for example, 0.41 μm or less.

[0063] In addition, the total number of the stacked first and second internal electrodes 121 and 122 may be 400 or more.

[0064] Therefore, the multilayer capacitor 100 according to example embodiments may be used as a component requiring a large size and high capacitance, such as an IT component.

[0065] The first side portion 141 is disposed on the fifth surface 5 of the capacitor body 110 , and the second side portion 142 is disposed on the sixth surface 6 of the capacitor body 110 .

[0066] The first and second side portions 141 and 142 contact ends of portions of the first and second internal electrodes 121 and 122 exposed through the fifth and sixth surfaces 5 and 6 of the capacitor body to cover the ends.

[0067] The first and second side portions 141 and 142 serve to protect the capacitor body 110 and the first and second internal electrodes 121 and 122 from external impacts and the like, and to ensure insulation performance and moisture-proof reliability near the capacitor body 110 .

[0068] The first side portion 141 and the second side portion 142 include a needle-shaped second phase (e.g., a needle-shaped mullite second phase) containing glass, manganese (Mn) and phosphorus (P), and the glass includes aluminum (Al) and silicon (Si). For example, the needle-shaped mullite second phase includes manganese (Mn), phosphorus (P), and glass containing aluminum (Al) and silicon (Si). In one example, the first side portion 141 and the second side portion 142 can be made of a material different from that of the dielectric layer 111.

[0069] Such a mullite second phase of this embodiment may be physically cross-linked to an adjacent mullite second phase to be physically connected to the adjacent mullite second phase.

[0070] Therefore, the first side portion 141 and the second side portion 142 may have better resistance against external physical impact, and may block a moisture penetration path into the capacitor body 110 .

[0071] In addition, the second phase of the present disclosure may improve the grain density of the first side portion 141 and the second side portion 142 according to the chemical low temperature sintering effect.

[0072] Therefore, the first side portion 141 and the second side portion 142 may have better resistance against external physical impact, and a water infiltration path of the capacitor body 110 may be blocked.

[0073] The mullite second phase of this embodiment can improve the moisture resistance reliability and hardness of the capacitor body 110 to be relatively higher than those of other second phases (eg, phosphate second phase).

[0074] The average thickness of the first side portion 141 and the second side portion 142 in the Y direction may be 10 μm to 20 μm. In one example, the average thickness of each of the first side portion 141 and the second side portion 142 in the Y direction may be 10 μm to 20 μm.

[0075] When the average thickness of the first side portion 141 and the second side portion 142 in the Y direction is low, the ratio of the capacitor body 110 in the multilayer capacitor having the same standard can be increased. Therefore, the capacitance of the multilayer capacitor 100 can also be increased.

[0076] Generally, when the average thickness of the side portion is low, the moisture-proof reliability and toughness of the side portion may deteriorate. However, the multilayer capacitor 100 according to this embodiment may include the first side portion 141 and the second side portion 142 containing the second phase, thereby preventing the reliability and toughness of the multilayer capacitor 100 from deteriorating even when the average thickness of the first side portion 141 and the second side portion 142 is low.

[0077] The acicular mullite second phase included in the first and second side portions 141 and 142 may have a acicular shape having a major axis and a minor axis.

[0078] In each of the first side portion 141 and the second side portion 142 , a major axis of the second phase may have a length of 1 μm to 10 μm.

[0079] When conventional first and second side portions 141 and 142 do not include a needle-shaped mullite second phase and the major axis of the second phase of each of conventional first and second side portions 141 and 142 has a short length of 10 μm or less, moisture-proof reliability and hardness of first and second side portions 141 and 142 and capacitor body 110 may be deteriorated.

[0080] However, as in this embodiment, when the first side portion 141 and the second side portion 142 include a needle-shaped mullite second phase containing glass (including Al and Si), Mn and P, even if the major axis of the second phase of each of the first side portion 141 and the second side portion 142 has a length of 10 μm or less, the moisture-proof reliability and hardness of the first side portion 141 and the second side portion 142 can be prevented from deteriorating.

[0081] The phosphate-based glass according to the prior art forms a needle-like second phase after sintering. The second phase having the mullite component according to this embodiment may have a needle-like shape and may have a major axis having a larger size and a greater thickness than the major axis of the phosphate-based second phase containing only the ordinary P component. Therefore, the moisture resistance and hardness of the first side portion 141 and the second side portion 142 may be further improved.

[0082] The first and second external electrodes 131 and 132 may be provided with voltages of opposite polarities to each other and may be disposed on both ends of the capacitor body 110 in the X direction. The first and second external electrodes 131 and 132 may be connected to portions of the first and second internal electrodes 121 and 122 exposed through the third and fourth surfaces 3 and 4 of the capacitor body 110, respectively, to be electrically connected to the first and second internal electrodes 121 and 122.

[0083] In this case, the first and second external electrodes 131 and 132 may have an average thickness of 10 μm or less. In one example, each of the first and second external electrodes 131 and 132 may have an average thickness of 10 μm or less.

[0084] Therefore, the multilayer capacitor 100 can be miniaturized and the manufacturing cost of the multilayer capacitor 100 can be reduced.

[0085] When the thickness of each of the first external electrode 131 and the second external electrode 132 is low, the moisture-proof reliability and hardness of the capacitor body 110 may generally deteriorate. However, in this embodiment, the first side portion 141 and the second side portion 142 include a needle-shaped second phase containing glass (including Al and Si), Mn and P, thereby preventing the moisture-proof reliability and hardness from deteriorating even if each of the first external electrode 131 and the second external electrode 132 has a thickness of 10 μm or less. As a result, miniaturization and reduced manufacturing costs of the multilayer capacitor 100 can be expected.

[0086] The first external electrode 131 may include a first connection portion 131 a and a first band portion 131 b .

[0087] The first connection portion 131 a is disposed on the third surface 3 of the capacitor body 110 and contacts the end of the first internal electrode 121 exposed outward through the third surface 3 of the capacitor body 110 to physically and electrically connect the first internal electrode 121 and the first external electrode 131 to each other.

[0088] The first band portion 131 b is a portion extending from the first connection portion 131 a to a portion of the first surface 1 of the capacitor body 110 .

[0089] If necessary, in order to improve adhesive strength or the like, the first tape portion 131 b may further extend to the second surface 2 , the fifth surface 5 , and the sixth surface 6 of the capacitor body 110 to cover one end portion of the side portions 141 and 142 .

[0090] The second external electrode 132 may include a second connection portion 132 a and a second band portion 132 b .

[0091] The second connection portion 132a is disposed on the fourth surface 4 of the capacitor body 110 and contacts the end of the second internal electrode 122 exposed outward through the fourth surface 4 of the capacitor body 110 to physically and electrically connect the second internal electrode 122 and the second external electrode 132 to each other.

[0092] Each of the first and second external electrodes 131 and 132 may include a plating layer for at least a portion of structural reliability, ease of board mounting, durability to the outside, heat resistance, and equivalent series resistance (ESR).

[0093] For example, the plating layer may be formed by sputtering or electrodeposition, but the method of forming the plating layer is not limited thereto.

[0094] The plating layer may include a maximum amount of nickel, but is not limited thereto. The plating layer may be implemented using copper (Cu), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), lead (Pb) alone, or an alloy including at least one of them.

[0095] According to this embodiment, the first side portion 141 and the second side portion 142 include a needle-shaped mullite second phase containing glass (including Al and Si), Mn and P. As a result, the strength of the first side portion 141 and the second side portion 142 may be improved by 30% or more compared to the side portion not including the second phase.

[0096] In addition, crack resistance of the first side portion 141 and the second side portion 142 may be enhanced to improve moisture-proof reliability of the multilayer capacitor 100 .

[0097] In this embodiment, the dielectric layer 111 may have an average thickness of 0.4 μm or less. Since the thickness of the dielectric layer 111 corresponds to the distance between the first and second internal electrodes 121 and 122, the capacitance of the multilayer capacitor 100 may be improved when the thickness of the dielectric layer 111 is low.

[0098] The first and second internal electrodes 121 and 122 may have an average thickness of 0.41 μm or less. For example, each of the first and second internal electrodes 121 and 122 may have an average thickness of 0.41 μm or less.

[0099] Since the multilayer capacitor 100 of this embodiment has a structure in which the first internal electrode 121 and the second internal electrode 122 are exposed through the fifth surface 5 and the sixth surface 6 of the capacitor body 110, the step of the capacitor body 110 can be reduced at the ends of the first internal electrode 121 and the second internal electrode 122 in the Y direction.

[0100] Therefore, even when the thickness of the dielectric layer 111 and the first and second internal electrodes 121 and 122 are reduced to achieve multilayer thinning as described above, there is no significant problem in the reliability of the multilayer capacitor 100. Therefore, reliability can be ensured while increasing the capacitance of the capacitor 100.

[0101] In addition, when the average thickness of the first and second internal electrodes 121 and 122 is reduced as described above, shrinkage after sintering can be reduced. Therefore, the diameter of the pores in the end of the capacitor body 110 can be further reduced, thereby further improving the reliability of the multilayer capacitor 100.

[0102] Reference Figure 6 According to this embodiment, a board on which a multilayer capacitor is mounted may include: a substrate 210, including a first electrode pad 221 and a second electrode pad 222 on one surface thereof; and a multilayer capacitor 100, which is mounted so that a first external electrode 131 and a second external electrode 132 are respectively connected to the first electrode pad 221 and the second electrode pad 222 on the upper surface of the substrate 210.

[0103] In this embodiment, it is shown and described that the multilayer capacitor 100 is mounted on the substrate 210 by the solders 231 and 232 , but a conductive paste may be used instead of the solder as needed.

[0104] As described above, the inner electrode may be exposed in the width direction of the capacitor body to increase the capacitance of the multilayer capacitor, and the side may include a needle-shaped mullite second phase containing glass (including Al and Si), Mn and P to improve the moisture-proof reliability and toughness of the multilayer capacitor based on the physical cross-linking effect and chemical low-temperature sintering effect of the second phase on the side.

[0105] While embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A multilayer capacitor comprising: a capacitor body including a dielectric layer and a first inner electrode and a second inner electrode, the capacitor body having a first surface and a second surface opposite to each other, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other, a fifth surface and a sixth surface connected to the third surface and the fourth surface and opposite to each other, the first inner electrode being exposed through the third surface, the fifth surface and the sixth surface, and the second inner electrode being exposed through the fourth surface, the fifth surface and the sixth surface; A first side portion and a second side portion are respectively disposed on the fifth surface and the sixth surface of the capacitor body; as well as a first outer electrode and a second outer electrode, respectively disposed on the third surface and the fourth surface of the capacitor body to be connected to the first inner electrode and the second inner electrode, respectively; wherein the first side portion and the second side portion include a needle-shaped second phase including glass, the glass including aluminum and silicon, Wherein, each of the first internal electrode and the second internal electrode has an average thickness of 0.41 μm or less.

2. The multilayer capacitor according to claim 1, wherein The needle-shaped second phase in the first side portion and the second side portion further includes manganese and phosphorus, and the material of the first side portion and the second side portion is different from the material of the dielectric layer.

3. The multilayer capacitor according to claim 1, wherein The major axes of the needle-shaped second phase of the first side portion and the second side portion have a length of 1 μm to 10 μm.

4. The multilayer capacitor according to claim 1, wherein The dielectric layer has an average thickness of 0.4 μm or less.

5. The multilayer capacitor according to claim 1, wherein The number of the first internal electrodes and the second internal electrodes is 400 or more.

6. The multilayer capacitor according to claim 1, wherein Each of the first side portion and the second side portion has an average thickness of 10 μm to 20 μm.

7. The multilayer capacitor according to claim 1, wherein The capacitor body includes an active region in which the first and second internal electrodes overlap each other, and an upper cover region and a lower cover region respectively disposed on an upper surface and a lower surface of the active region.

8. The multilayer capacitor according to claim 7, wherein Each of the upper cover region and the lower cover region has a thickness of 20 μm or less.

9. The multilayer capacitor according to claim 1, wherein Each of the first external electrode and the second external electrode has an average thickness of 10 μm or less.

10. The multilayer capacitor according to claim 1, wherein The first outer electrode includes a first connection portion provided on the third surface of the capacitor body to be connected to the first inner electrode and a first band portion extending from the first connection portion to a portion of the first surface of the capacitor body, and the second outer electrode includes a second connection portion provided on the fourth surface of the capacitor body to be connected to the second inner electrode and a second band portion extending from the second connection portion to a portion of the first surface of the capacitor body.

11. A multilayer capacitor comprising: a capacitor body including a dielectric layer and a first inner electrode and a second inner electrode, the capacitor body having a first surface and a second surface opposite to each other, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other, and a fifth surface and a sixth surface connected to the third surface and the fourth surface and opposite to each other, the first inner electrode being exposed through the third surface, the fifth surface and the sixth surface, and the second inner electrode being exposed through the fourth surface, the fifth surface and the sixth surface; A first side portion and a second side portion are respectively disposed on the fifth surface and the sixth surface of the capacitor body; as well as a first outer electrode and a second outer electrode, respectively disposed on the third surface and the fourth surface of the capacitor body to be connected to the first inner electrode and the second inner electrode, respectively; wherein the first side and the second side include a needle-shaped second phase comprising glass, the glass comprising aluminum and silicon, and Wherein, the dielectric layer has an average thickness of 0.4 μm or less.

12. The multilayer capacitor according to claim 11, wherein The needle-shaped second phase in the first side portion and the second side portion further includes manganese and phosphorus, and the material of the first side portion and the second side portion is different from the material of the dielectric layer.

13. The multilayer capacitor according to claim 11, wherein The major axes of the needle-shaped second phase of the first side portion and the second side portion have a length of 1 μm to 10 μm.

14. The multilayer capacitor according to claim 11, wherein The number of the first internal electrodes and the second internal electrodes is 400 or more.

15. The multilayer capacitor according to claim 11, wherein Each of the first side portion and the second side portion has an average thickness of 10 μm to 20 μm.

16. The multilayer capacitor according to claim 11, wherein The capacitor body includes an active region in which the first and second internal electrodes overlap each other, and an upper cover region and a lower cover region respectively disposed on an upper surface and a lower surface of the active region.

17. The multilayer capacitor according to claim 16, wherein Each of the upper cover region and the lower cover region has a thickness of 20 μm or less.

18. The multilayer capacitor according to claim 11, wherein Each of the first external electrode and the second external electrode has an average thickness of 10 μm or less.

19. The multilayer capacitor according to claim 11, wherein The first outer electrode includes a first connection portion provided on the third surface of the capacitor body to be connected to the first inner electrode and a first band portion extending from the first connection portion to a portion of the first surface of the capacitor body, and the second outer electrode includes a second connection portion provided on the fourth surface of the capacitor body to be connected to the second inner electrode and a second band portion extending from the second connection portion to a portion of the first surface of the capacitor body.

20. A multilayer capacitor comprising: a capacitor body including a dielectric layer and a first inner electrode and a second inner electrode, the capacitor body having a first surface and a second surface opposite to each other, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other, a fifth surface and a sixth surface connected to the third surface and the fourth surface and opposite to each other, the first inner electrode being exposed through the third surface, the fifth surface and the sixth surface, and the second inner electrode being exposed through the fourth surface, the fifth surface and the sixth surface; A first side portion and a second side portion are respectively disposed on the fifth surface and the sixth surface of the capacitor body; as well as a first outer electrode and a second outer electrode, respectively disposed on the third surface and the fourth surface of the capacitor body to be connected to the first inner electrode and the second inner electrode, respectively; The first side portion and the second side portion include a needle-shaped mullite second phase containing glass, wherein the glass contains aluminum and silicon.

21. The multilayer capacitor according to claim 20, wherein The acicular mullite second phase in the first side portion and the second side portion further includes manganese and phosphorus.

22. The multilayer capacitor according to claim 20, wherein The major axes of the acicular mullite second phase of the first side portion and the second side portion have a length of 1 μm to 10 μm.

23. The multilayer capacitor according to claim 20, wherein: The dielectric layer has an average thickness of 0.4 μm or less.

24. The multilayer capacitor of claim 20, wherein: Each of the first internal electrode and the second internal electrode has an average thickness of 0.41 μm or less.

25. The multilayer capacitor of claim 20, wherein: The number of the first internal electrodes and the second internal electrodes is 400 or more.

26. The multilayer capacitor of claim 20, wherein: Each of the first side portion and the second side portion has an average thickness of 10 μm to 20 μm.

27. The multilayer capacitor of claim 20, wherein: The capacitor body includes an active region in which the first and second internal electrodes overlap each other, and an upper cover region and a lower cover region respectively disposed on an upper surface and a lower surface of the active region.

28. The multilayer capacitor of claim 27, wherein: Each of the upper cover region and the lower cover region has a thickness of 20 μm or less.

29. The multilayer capacitor of claim 20, wherein: Each of the first external electrode and the second external electrode has an average thickness of 10 μm or less.

30. The multilayer capacitor of claim 20, wherein: The first outer electrode includes a first connection portion provided on the third surface of the capacitor body to be connected to the first inner electrode and a first band portion extending from the first connection portion to a portion of the first surface of the capacitor body, and the second outer electrode includes a second connection portion provided on the fourth surface of the capacitor body to be connected to the second inner electrode and a second band portion extending from the second connection portion to a portion of the first surface of the capacitor body.

31. A multilayer capacitor comprising: a capacitor body including a dielectric layer and a first inner electrode and a second inner electrode, the capacitor body having a first surface and a second surface opposite to each other, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other, and a fifth surface and a sixth surface connected to the third surface and the fourth surface and opposite to each other, the first inner electrode being exposed through the third surface, the fifth surface and the sixth surface, and the second inner electrode being exposed through the fourth surface, the fifth surface and the sixth surface; A first side portion and a second side portion are respectively disposed on the fifth surface and the sixth surface of the capacitor body; as well as a first outer electrode and a second outer electrode, respectively disposed on the third surface and the fourth surface of the capacitor body to be connected to the first inner electrode and the second inner electrode, respectively; wherein the first side portion and the second side portion include a needle-shaped second phase including glass, the glass including aluminum and silicon, Wherein, each of the first side portion and the second side portion has an average thickness of 10 μm to 20 μm.

32. The multilayer capacitor of claim 31 , wherein: The needle-shaped second phase in the first side portion and the second side portion further includes manganese and phosphorus, and the material of the first side portion and the second side portion is different from the material of the dielectric layer.

33. The multilayer capacitor of claim 31 , wherein: The major axes of the needle-shaped second phase of the first side portion and the second side portion have a length of 1 μm to 10 μm.

34. The multilayer capacitor of claim 31, wherein: The number of the first internal electrodes and the second internal electrodes is 400 or more.

35. The multilayer capacitor of claim 31 , wherein: The capacitor body includes an active region in which the first and second internal electrodes overlap each other, and an upper cover region and a lower cover region respectively disposed on an upper surface and a lower surface of the active region.

36. The multilayer capacitor of claim 35, wherein: Each of the upper cover region and the lower cover region has a thickness of 20 μm or less.

37. The multilayer capacitor of claim 31, wherein: Each of the first external electrode and the second external electrode has an average thickness of 10 μm or less.

38. The multilayer capacitor of claim 31 , wherein: The first outer electrode includes a first connection portion provided on the third surface of the capacitor body to be connected to the first inner electrode and a first band portion extending from the first connection portion to a portion of the first surface of the capacitor body, and the second outer electrode includes a second connection portion provided on the fourth surface of the capacitor body to be connected to the second inner electrode and a second band portion extending from the second connection portion to a portion of the first surface of the capacitor body.

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