Display panels and displays

Abstract

The present invention relates to a display panel and a display screen. A plurality of light-emitting chips are provided on the display backplane of the display panel, and a light-blocking isolation layer is provided on the light-emitting surface of each light-emitting chip away from the display backplane. The light-blocking isolation layer divides the light-emitting surface of each light-emitting chip into at least two mutually isolated light-emitting areas, and one light-emitting area constitutes a pixel. That is, the light-emitting surface of each light-emitting chip is divided into multiple mutually isolated light-emitting areas by the light-blocking isolation layer, so that it has the same or higher PPI as the Micro LED chip display screen, breaking through the current Micro LED giant conversion process on high PPI products and pixel arrangement. At the same time, it can also improve the production efficiency of the display panel, the light-emitting efficiency and the consistency of high and low current colors.

Description

Technical Field

[0001] The present invention relates to the field of display, and in particular to a display panel and a display screen. Background Art

[0002] To improve the PPI (Pixels Per Inch) and display quality of displays, Micro LED (Micro Light-emitting diode) display technology has been rapidly developed and applied. Micro LED display technology, commonly known as pixel miniaturization, uses a miniaturized chip process to produce Micro LED chips with a line width of less than 50μm from epitaxial wafers. These chips are then transferred to the display backplane using mass transfer technology. However, this technology currently faces the following challenges:

[0003] Due to the reduction in the size of Micro LED chips, the light extraction efficiency of Micro LED chips is low, which in turn leads to low overall light extraction efficiency of displays made using Micro LED chips;

[0004] As the size of Micro LED chips decreases, their sensitivity to current increases, making them more susceptible to color loss. This, in turn, can cause color loss in displays made with Micro LED chips.

[0005] Limited by the ultra-small size of Micro LED chips, the manufacturing yield rate and the chip mass transfer process's spacing requirements for Micro LED chips have significantly limited the PPI of displays made with Micro LED chips, hindering the development of Micro LED display technology towards ultra-high PPI.

[0006] The smaller the size of the Micro LED chip, the more Micro LED chips need to be transferred, the reliability and difficulty of bonding the Micro LED chip to the display backplane, the accuracy of the overlap between the chip electrode and the pad, and the probability of the chip being cracked all increase greatly, greatly affecting the yield rate and production efficiency of the display.

[0007] Therefore, how to improve the pixel density, overall light output efficiency, production efficiency and yield rate of display screens is an urgent problem that needs to be solved. Summary of the Invention

[0008] In view of the above-mentioned deficiencies in the prior art, an object of the present invention is to provide a display panel and a display screen, aiming to solve the problems in the related art of how to improve the pixel density, overall light extraction efficiency, manufacturing efficiency and yield rate of the display screen.

[0009] The present invention provides a display panel, comprising:

[0010] Display back panel;

[0011] A plurality of light-emitting chips provided on the display back panel;

[0012] A light-blocking isolation layer is provided on the light-emitting surface of each light-emitting chip, dividing each light-emitting surface into at least two light-emitting areas. Each light-emitting area is isolated from each other by the light-blocking isolation layer. The light-emitting surface is the side of the light-emitting chip away from the display backplane.

[0013] The above-mentioned display panel is provided with a plurality of light-emitting chips on its display backplane, and a light-blocking isolation layer is provided on the light-emitting surface of each light-emitting chip away from the display backplane. The light-blocking isolation layer divides the light-emitting surface of each light-emitting chip into at least two mutually isolated light-emitting areas. Each light-emitting area constitutes a pixel, which is equivalent to a light-emitting chip in a display screen made of a Micro LED chip or a smaller light-emitting chip. Therefore, under the condition of the same PPI, the number of light-emitting chips required to be provided on the display backplane of the display panel of the present invention can be reduced exponentially, and the size of the light-emitting chip that can be used can be larger, which has at least the following advantages:

[0014] The size of the light-emitting chip that can be used can be larger, and the number of light-emitting chips required can be reduced, which can greatly reduce the number of chips transferred. The reliability of the bonding between the light-emitting chip and the display backplane is improved, the overlap between the chip electrode and the pad is more precise, and the probability of chip cracking can be reduced, thereby improving the yield rate and production efficiency of the display panel.

[0015] The size of the light-emitting chip that can be used can be larger, so the light-emitting efficiency of the light-emitting chip used is higher, which can improve the overall light-emitting efficiency of the display panel;

[0016] The size of the light-emitting chip that can be used can be larger, and the sensitivity to current is lower, thereby reducing the probability of display color loss, thereby better avoiding the occurrence of color loss in the display panel and improving the display quality of the display panel;

[0017] The PPI of the display panel is no longer limited by the chip mass transfer process, but mainly depends on the process of forming a light-blocking isolation layer. It breaks through the current limitations of the mass transfer process of Micro LED chips or smaller-sized light-emitting chips on high-PPI products and pixel arrangement, which is more conducive to improving the PPI of the display panel.

[0018] Based on the same inventive concept, the present invention further provides a display screen frame, a driving module, and the above-mentioned display panel, wherein the display panel is fixed in the display screen frame; and the driving module is connected to the display panel.

[0019] Since the display panel used in the above-mentioned display screen has advantages such as higher yield rate, production efficiency, overall light output efficiency, better display quality, and easier to improve PPI, the display screen produced also includes but is not limited to the above advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Schematic diagram of the structure of a display panel based on a Micro LED chip in the related art;

[0021] Figure 2 A schematic diagram of the structure of a display panel provided in an embodiment of the present invention without a light-blocking isolation layer;

[0022] Figure 3 Schematic diagram of the structure of the display panel provided by the embodiment of the present invention Figure 1 ;

[0023] Figure 4 For Figure 2 A schematic diagram of a structure in which a light shielding layer is provided on a display panel shown;

[0024] Figure 5 Schematic diagram of the structure of the display panel provided by the embodiment of the present invention Figure 2 ;

[0025] Figure 6 Schematic diagram of the structure of the display panel provided by the embodiment of the present invention Figure 3 ;

[0026] Figure 7 Schematic diagram of the structure of the display panel provided by the embodiment of the present invention Figure 4 ;

[0027] Figure 8 Schematic diagram of the structure of the display panel provided by the embodiment of the present invention Figure 5 ;

[0028] Figure 9 Schematic diagram of the structure of the display panel provided by the embodiment of the present invention Figure 6 ;

[0029] Figure 10 Schematic diagram of the structure of the display panel provided by the embodiment of the present invention Figure 7 ;

[0030] Figure 11 A schematic diagram of a photomask structure provided by an embodiment of the present invention;

[0031] Figure 12 A schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present invention;

[0032] Description of reference numerals:

[0033] 1-display backplane, 11-Micro LED chip, 2-light-emitting chip, 21-light-emitting area, 3-light-blocking isolation layer, 4-light-shielding layer, 5-light mask, 51-through hole. DETAILED DESCRIPTION

[0034] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0036] Among related technologies, Micro LED display technology has been rapidly developed and applied. Micro LED display technology is commonly known as pixel miniaturization display technology. After the epitaxial wafers produced by the epitaxial process are processed through the miniaturization chip process to produce Micro LED chips with a line width of less than 50μm, the Micro LED chips are transferred to the display backplane through mass transfer technology. One of the structures is shown in Figure 1 The display screen shown in the figure includes a display backplane 1 and MicroLED chips 11 arrayed on the display backplane. The display screen currently has the following problems:

[0037] Micro LED chips 11 are fabricated using a metal-organic chemical vapor deposition (MOCVD) process to produce the functional film layers required for epitaxial luminescence. This process is particularly sensitive to process conditions, such as fluctuations in the particle size, gas composition, and concentration ratio. As chip size decreases, the number of point, line, and surface lattice defects per unit area increases exponentially. Furthermore, in the later laser etching process, sidewall effects are more pronounced for smaller chips. In summary, as chip size decreases, its luminous efficiency decreases significantly, leading to low overall light output efficiency for displays made using Micro LED chips 11.

[0038] Under the same brightness requirement, the higher the current per unit area (current density), the more wavelength shifts occur in red, green, and blue. This can easily cause discoloration in the displayed colors, significantly affecting the visual experience. Micro LED chips 11 are small in size and highly sensitive to current, especially red Micro LED chips. This makes displays made with Micro LED chips 11 prone to discoloration.

[0039] Limited by the ultra-small size of the Micro LED chips 11, the manufacturing yield rate and the spacing requirements between the Micro LED chips 11 during the chip mass transfer process have significantly limited the PPI of displays made with the Micro LED chips 11, hindering the development of Micro LED display technology towards ultra-high PPI.

[0040] The smaller the size of the Micro LED chip 11, the more Micro LED chips 11 need to be transferred, the reliability and difficulty of bonding the Micro LED chip 11 on the display backplane, the accuracy of the overlap between the chip electrode and the pad, the probability of the chip being cracked, etc. are all greatly increased, which greatly affects the yield and production efficiency of the display screen.

[0041] Based on this, the present invention hopes to provide a solution that can solve the above technical problems, and its details will be described in subsequent embodiments.

[0042] This embodiment provides a display panel, which can be used for, but not limited to, manufacturing various display screens, including:

[0043] Display backplane; the display backplane in this embodiment may be, but is not limited to, a glass backplane or a printed circuit board;

[0044] A plurality of light-emitting chips are provided on the display backplane. In this embodiment, the number of light-emitting chips provided on the display backplane can be flexibly set according to specific application requirements, and the specific distribution of the light-emitting chips on the display backplane can also be flexibly set according to requirements;

[0045] A light-blocking isolation layer is provided on the light-emitting surface of each light-emitting chip, dividing each light-emitting surface into at least two light-emitting areas. Each light-emitting area is isolated from each other by the light-blocking isolation layer. In this embodiment, the light-emitting surface of the light-emitting chip is the side of the light-emitting chip away from the display backplane, which can also be referred to as the positive light-emitting surface of the light-emitting chip. That is, in this embodiment, a light-blocking isolation layer is provided on the light-emitting surface of each light-emitting chip. The light-blocking isolation layer can divide the light-emitting surface of each light-emitting chip into multiple mutually isolated light-emitting areas. In this embodiment, the isolation of the light-emitting areas refers to physical isolation and optical isolation through the light-blocking layer, thereby minimizing light crosstalk between the light-emitting areas and ensuring the display effect.

[0046] In the above-mentioned display panel, a light-emitting area on the light-emitting surface of each light-emitting chip constitutes a pixel, which is equivalent to a light-emitting chip in a display screen made of a Micro LED chip or a smaller light-emitting chip. In this embodiment, each light-emitting chip on the display panel has at least two light-emitting areas on its light-emitting surface, which corresponds to two pixels. Under the condition of the same PPI, the number of light-emitting chips required to be arranged on the display backplane of the display panel in this embodiment can be reduced exponentially, which can greatly reduce the number of chips to be transferred. In addition, the reliability of the bonding between the light-emitting chip and the display backplane is improved, the overlap between the chip electrode and the pad is more precise, and the probability of chip cracking can be reduced, thereby improving the yield rate and manufacturing efficiency of the display panel.

[0047] Because the light-emitting chips that can be used can be larger in size, the light-emitting chips used have higher light extraction efficiency, thereby improving the overall light extraction efficiency of the display panel. Furthermore, the light-emitting chips are less sensitive to current, especially red light-emitting chips, thereby reducing the probability of display color loss, thereby better preventing color loss in the resulting display panel and improving the display quality of the display panel.

[0048] Furthermore, the display panel's PPI is no longer limited by the chip mass transfer process, but primarily depends on the process for forming the light-blocking isolation layer, further improving the display panel's PPI. In other words, the actual PPI of the display panel in this embodiment is determined by the process capabilities of manufacturing the light-blocking isolation layer, and is unaffected by the Micro LED chip manufacturing process and mass transfer process. For example, when using a yellow light process to manufacture the light-blocking isolation layer, the theoretical PPI is more than three times that of existing Micro LED displays.

[0049] In this embodiment, the plurality of light-emitting chips disposed on the display backplane may be, but are not limited to, LED chips having a chip size greater than or equal to 50 microns. For example, they may be, but are not limited to, Mini LED chips having a chip size between 50 and 200 microns. Conventional LED chips or large-sized LED chips larger than 200 microns may also be used. Furthermore, the LED chips in this embodiment may be, but are not limited to, flip-chip LED chips, face-mount LED chips, or vertical LED chips. Of course, in some examples, the plurality of light-emitting chips disposed on the display backplane may also be Micro LED chips, thereby dividing the light-emitting surface of the Micro LED chip into multiple smaller light-emitting areas, thereby achieving a display panel with a higher PPI.

[0050] In one example of this embodiment, to further enhance the display quality of the display panel, the display panel may further include a light-shielding layer disposed on the display backplane and located between the light-emitting chips, thereby preventing light from crossing between the light-emitting chips and further enhancing the display quality. Of course, in some examples, the light-shielding layer may be omitted because the light-emitting areas are already isolated from each other by the light-blocking isolation layer.

[0051] For ease of understanding, the display panel provided in this embodiment is described below with reference to the accompanying drawings.

[0052] See also Figure 2 The display panel shown includes a display back panel 1 and a plurality of light-emitting chips 2 arranged on the display back panel 1 . Figure 2 The display panel shown is currently equipped with a light-blocking isolation layer. Figure 3 As shown, a light-blocking isolation layer 3 is provided on the light-emitting surface of each light-emitting chip 2, and the light-blocking isolation layer 3 divides the light-emitting surface of each light-emitting chip 2 into a plurality of mutually isolated light-emitting areas 21. It should be understood that in this embodiment, the light-blocking isolation layers 3 provided on the light-emitting surface of each light-emitting chip 2 can be separated from each other, for example, see Figure 3 As shown, they can also be connected together according to needs, and can be integrally formed or not. In this embodiment, the number of light emitting areas 21 on the light emitting surface of each light emitting chip 2 can be the same, different, or partially the same. Figure 3 In the example shown, the number of light emitting regions 21 on the light emitting surface of each light emitting chip 2 is the same, which is six.

[0053] exist Figure 3 In the display panel area shown, there are 54 light-emitting areas, that is, 54 pixels. Traditional display panels made of Micro LED chips require 54 Micro LED chips, but Figure 3 The display panel shown in the figure actually requires only nine light-emitting chips. The light-emitting surface of each light-emitting chip is divided into six light-emitting areas by a light-blocking isolation layer 3, thereby forming nine pixels. This shows that compared to display panels made with existing Micro LED chips, the number of required light-emitting chips can be reduced exponentially. Furthermore, using light-emitting chips larger than Micro LED chips offers better light extraction efficiency and lower current sensitivity, thus reducing the probability of color fading. This, in turn, better prevents color fading in the resulting display panel, thereby improving the display quality of the display panel.

[0054] In one application example of this example, see Figure 4As shown, the display panel further includes a light shielding layer 4 disposed on the display backplane 1 and located between the light emitting chips 2. The light shielding layer 4 can be located below the light blocking isolation layer 3 or can be disposed flush with the light blocking isolation layer 3. In some application examples, the material of the light shielding layer 4 can be the same as that of the light blocking isolation layer 3. In this case, the two can be integrally formed or not integrally formed. In other application examples, the materials of the light shielding layer 4 and the light blocking isolation layer 3 can also be different. Figure 5 As shown, it is Figure 4 On the basis of the display panel shown, a light-blocking isolation layer 3 is provided on the light-emitting surface of each light-emitting chip 2 .

[0055] In one example of this embodiment, a plurality of light emitting chips may be arranged on the display back panel to be distributed in a first array, for example, see Figure 2 The light emitting chips 2 are shown to be distributed in an array on the display back panel 1. Of course, in some application scenarios, the specific distribution of the light emitting chips 2 on the display back panel 1 can be flexibly adjusted according to specific application requirements, which will not be repeated here.

[0056] In one example of this embodiment, at least two light-emitting areas on the light-emitting surface of each light-emitting chip are also distributed in a second array on their respective corresponding light-emitting surfaces; of course, the distribution of each light-emitting area on the light-emitting surface is not limited to the array distribution, and can also be flexibly set according to needs, which will not be described in detail here. In this example, the light-emitting surface of a light-emitting chip is divided into 2*N light-emitting areas by a light-blocking isolation layer, where N is an integer greater than or equal to 1. For example, the value of N can be set to 1, 2, 3, 4, 5, 6, 7, etc. according to application requirements, and the light-emitting surface of a corresponding light-emitting chip is divided into 2, 4, 6, 8, 10, 12 or 14 light-emitting areas, etc. by a light-blocking isolation layer. For example:

[0057] See also Figure 6 As shown, Figure 6 The display panel shown is Figure 5 Compared with the display panel shown, the main difference between the two is that Figure 5 The light-blocking isolation layers 3 provided on the light-emitting surfaces of the light-emitting chips 2 are separated from each other. Figure 6 The light-blocking isolation layers 3 arranged on the light-emitting surfaces of the light-emitting chips 2 are connected together.

[0058] See also Figure 7 As shown, Figure 7 The display panel shown is Figure 6 Compared with the display panel shown in FIG. 1 , the main difference between the two is that the number of the light emitting areas 21 on the light emitting surface of each light emitting chip 2 is four.

[0059] See also Figure 8 As shown, Figure 8 The display panel shown is Figure 6Compared with the display panel shown in FIG. 1 , the main difference between the two is that the number of the light emitting areas 21 on the light emitting surface of each light emitting chip 2 is ten.

[0060] Of course, in some application scenarios, the light-emitting surface of a light-emitting chip can also be divided into an odd number of light-emitting areas, such as 3, 5, or 7, by the light-blocking isolation layer, which will not be repeated here.

[0061] In some examples of this embodiment, the light-emitting chips 2 disposed on the display backplane 1 can have the same color, for example, they can all be blue. In other examples, the light-emitting chips 2 disposed on the display backplane 1 can also emit multiple colors. For example, in one example, they can include but are not limited to a red light-emitting chip that emits red light, a green light-emitting chip that emits green light, and a blue light-emitting chip that emits blue light. In still other examples, in addition to the red light-emitting chip, the green light-emitting chip, and the blue light-emitting chip, a white light-emitting chip can also be included. For ease of understanding, the following description uses two configuration examples.

[0062] In one example, a plurality of light emitting chips are distributed in a first array on a display backplane, and adjacent light emitting chips emit light of different colors in the row direction and / or column direction of the first array; for example, see Figure 2 and Figure 4 As shown, the three adjacent light-emitting chips in the first row from top to bottom are a red light-emitting chip, a green light-emitting chip, and a blue light-emitting chip from left to right; the three adjacent light-emitting chips in the second row are a green light-emitting chip, a blue light-emitting chip, and a red light-emitting chip from left to right; and the three adjacent light-emitting chips in the third row are a blue light-emitting chip, a red light-emitting chip, and a green light-emitting chip from left to right, so that the colors of light emitted by adjacent light-emitting chips in the row and column directions of the first array are different. Figure 1 In the display panel shown, since the Micro LED chip uses mass transfer technology, the mass transfer yield and efficiency of the simplest RGB Real pixel arrangement do not yet meet the mass production standards and requirements, resulting in poor visual quality of current Micro LED products, color fringing easily appearing on the edges, and unsatisfactory white balance and color seams at the splicing position in the splicing display. At the same time, there are also major visual effects problems for flexible curved surfaces and special-shaped products. In this example, by arranging light-emitting chip pixels of different colors in the same column in the first array of A Zi, the light-emitting areas of the same column in the second array are different colors, which can solve the display color fringing phenomenon caused by the traditional Micro LED Real arrangement. In this example, Figure 3The light-emitting areas in the same column are shown as a display unit, which ensures the same PPI as traditional Micro LED displays of the same area. Secondly, in this solution, the same color light-emitting areas (i.e., pixels of the same color) share a TFT switch, which can greatly improve the yield of the display backplane TFT process.

[0063] For another example, see Figure 9 As shown, a plurality of light emitting chips 2 are distributed in a first array on the display back panel, and the light emitted is all blue light, see Figure 10 As shown, it is isolated and divided into multiple light-emitting areas 21 by the light-blocking isolation layer 3. In this example, a light conversion layer can be provided corresponding to each light-emitting area 21 to convert the light emitted from the light-emitting area 21 into light of a desired color, such as red light or green light.

[0064] It should be understood that, in this embodiment, the shape of each light emitting area 21 can be flexibly set, for example, in addition to Figure 3 In addition to the rectangular area shown in , it can also be set to a regular shape such as a circular area, an elliptical area, a diamond area, etc. according to needs, or it can be set to an irregular shape according to needs, which will not be repeated here. And the shapes of each light-emitting area 21 can be the same or different, or partly the same and partly different. For ease of understanding, the following explanation is given by taking each light-emitting area 21 as an example of a rectangular area. In this embodiment, the ratio of the length (i.e., the size in the column direction of the second array) and the width (i.e., the size in the row direction of the second array) of the rectangular area is 1:1 to 3:1. For example, the ratio value can be set to 1:1, 1:2 or 1:3 according to needs, and the specific value can be flexibly set according to application requirements.

[0065] See also Figure 3 As shown, in this embodiment, the light emitting areas 21 on the light emitting surface of a light emitting chip 2 are distributed in a second array on the light emitting surface. In the row direction of the second array, the ratio of the lateral spacing between adjacent light emitting areas 21 to the width of the light emitting area is 1:3 to 1:2, and / or, in the column direction of the second array, the ratio of the longitudinal spacing between adjacent light emitting areas 21 to the length of the light emitting area is 1:2 to 4:5. In some examples of this embodiment, the ratio of the spacing between adjacent light emitting chips to the width of the light emitting area is 1:2 to 1:1. The specific value can be flexibly set according to the requirements of the application scenario, thereby improving the display effect.

[0066] As can be seen, the display panel provided in this embodiment uses Mini LED chips or large LED chips instead of Micro LED chips. The light-emitting chip is divided into multiple isolated light-emitting areas by a light-blocking isolation layer. This allows it to have the same or higher PPI as the Micro LED chip display, while also improving production efficiency, as well as the light extraction efficiency of the display panel and the consistency of high and low current colors. For ease of understanding, the following is an exemplary description of the display panel production process.

[0067] See also Figure 12 As shown, an exemplary production process includes but is not limited to:

[0068] S1201: Setting a light-emitting chip on the display back panel.

[0069] For example, see Figure 2 As shown, Mini LED chips or large LED chips are fabricated on the display backplane TFTs via mass transfer or other chip transfer methods, combined with solder paste bonding or other bonding methods. In this example, the number of light-emitting chips requiring mass transfer is reduced to one-third of that when using Micro LED chips, and the area of the light-emitting chips used is significantly increased compared to Micro LED chips, which can greatly improve the yield rate, increase the light extraction efficiency of the light-emitting chips, and improve the color stability of different currents.

[0070] S1202: Disposing a light-blocking isolation layer on the light-emitting surface of each light-emitting chip to divide each light-emitting surface into at least two light-emitting areas, wherein each light-emitting area is isolated from each other by the light-blocking isolation layer.

[0071] For example, a light-blocking isolation layer such as BM (Black Matrix) can be produced through a patterning process, such as a yellow light process, or the required light-blocking isolation layer can be prepared by printing black ink; a template process can also be used, in which a layer of light-blocking adhesive is attached to the entire surface through a vacuum hot pressing process, and then a plasma process is used to remove the light-blocking adhesive covering the required pixels (i.e., the position where the light-emitting area needs to be set), thereby obtaining a light-blocking isolation layer.

[0072] For example, in one application example, a layer of light-blocking adhesive can be attached to the entire surface through a vacuum hot pressing process. Figure 11 The light mask 5 shown is covered on the light-blocking plastic layer, and the light mask 5 is formed with through holes 51 of corresponding shapes and sizes at positions corresponding to the light-emitting areas 21 to be formed. Then, the light-blocking plastic in each through hole 51 is removed, so that the corresponding area on the light-emitting surface of the light-emitting chip 2 is exposed to form the light-emitting area 21, thereby obtaining Figure 6The display panel shown. Of course, in some examples, after removing the light-blocking adhesive in each through hole 51, a light-transmitting adhesive can be filled in the through hole 51 as needed to better protect the light-emitting chip 2. Light-mixing particles can also be added to the light-transmitting adhesive as needed to enhance the light-emitting effect. In this embodiment, the light mask 5 can be reused or not, and the material of the light mask 5 can be flexibly selected, for example, quartz, Invar alloy, or silicon.

[0073] It can be seen that the display panel produced by the display panel manufacturing method provided in this embodiment uses LED chips with a chip size greater than or equal to 50 microns to achieve extremely small Micro LED display, and the patterned production defines the arrangement of light-emitting pixels. The arrangement of pixels (that is, the arrangement of light-emitting areas) can be set more flexibly, for example, including but not limited to Diamond, Real RGB, Pentile, Delta, and other SPR arrangements, with better versatility and adaptability.

[0074] This embodiment also provides a display screen, which can be a flexible display screen or a rigid display screen, and it can be a display screen of a regular shape, such as a rectangle, a circle, an ellipse, etc., or a special-shaped display screen. The display screen includes a display screen frame, a driving module, and a display panel as shown in the above examples. The display panel is fixed in the display screen frame, and the driving module is connected to the display panel to control the display panel. It should be understood that the display screen in this embodiment can be applied to various electronic devices, such as monitors, computers, mobile phones, smart watches, vehicle-mounted equipment, billboards, etc. The display screen uses LED chips with a chip size greater than or equal to 50 microns to realize an extremely small Micro LED display. Compared with the display screen made of Micro LED chips, it has lower cost, better yield, higher light output efficiency and better display effect.

[0075] It should be understood that the application of the present invention is not limited to the above examples. For those skilled in the art, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A display panel, characterized in that: include: Display back panel; A plurality of light-emitting chips provided on the display back panel; A light-blocking isolation layer is provided on the light-emitting surface of each light-emitting chip, and the light-blocking isolation layer divides each light-emitting surface into at least two light-emitting areas. Each light-emitting area is isolated from each other into a predefined shape and predefined size by the light-blocking isolation layer. The light-emitting surface is the side of the light-emitting chip away from the display backplane.

2. The display panel according to claim 1, wherein The light-emitting chip is an LED chip with a chip size greater than or equal to 50 microns.

3. The display panel according to claim 1, wherein in, The display panel further includes a light shielding layer disposed on the display backplane and located between the light emitting chips.

4. The display panel according to any one of claims 1 to 3, wherein: The plurality of light-emitting chips are distributed in a first array on the display back panel, and the at least two light-emitting areas on each light-emitting surface are distributed in a second array on the corresponding light-emitting surface.

5. The display panel according to claim 4, wherein: In the row direction and / or column direction of the first array, adjacent light-emitting chips emit light of different colors; the light-emitting chips include a red light-emitting chip that emits red light, a green light-emitting chip that emits green light, and a blue light-emitting chip that emits blue light.

6. The display panel according to claim 4, wherein: One of the light-emitting surfaces is divided into 2*N light-emitting areas by the light-blocking isolation layer, where N is an integer greater than or equal to 1.

7. The display panel according to claim 4, wherein: The light exit area is a rectangular area, and the ratio of the length to the width of the rectangular area is 1:1 to 3:

1.

8. The display panel according to claim 7, wherein: In the row direction of the second array, a ratio of a lateral spacing between adjacent light exit areas to a width of the light exit area is 1:3 to 1:2; And / or, in the column direction of the second array, a ratio of a longitudinal spacing between adjacent light exit areas to a length of the light exit area is 1:2 to 4:

5.

9. The display panel according to claim 7, wherein: The ratio of the spacing between adjacent light-emitting chips to the width of the light-emitting area is 1:2 to 1:

1.

10. A display screen, characterized in that: The device comprises a display screen frame, a driving module, and a display panel according to any one of claims 1 to 9, wherein the display panel is fixed in the display screen frame; The driving module is connected to the display panel.

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