Control method of inspection device and inspection device

Abstract

The present invention provides a control method of an inspection device with improved processing capability and an inspection device. The inspection device comprises: a loading table, which is used to load a substrate having a plurality of inspection objects and is formed with a plurality of partitions; and a heating unit, which can perform temperature raising control for each of the above-mentioned partitions. The control method of the inspection device comprises the following steps: when inspecting a first inspection object among the plurality of inspection objects, the above-mentioned heating unit is used to raise the temperature of the partition corresponding to the above-mentioned first inspection object and the partition corresponding to the second inspection object of the next inspection object.

Description

Technical Field

[0001] The present invention relates to a control method of an inspection device and the inspection device. Background Art

[0002] An inspection device is known in which a wafer on which electronic devices are formed and a carrier on which electronic devices are arranged are placed on a mounting table, and a self-tester supplies current to the electronic devices through a probe or the like, thereby inspecting the electrical characteristics of the electronic devices. The temperature of the electronic devices is controlled by a temperature adjustment mechanism provided on the mounting table.

[0003] Patent document 1 discloses a detector for sequentially inspecting electrical characteristics of a plurality of chips to be inspected arranged in a matrix on a substrate by means of a tester, the detector comprising: a mounting table for mounting the substrate; contacts for sequentially contacting electrode pads of the plurality of chips to be inspected; a plurality of LED units, each of which is composed of one or more LEDs, the plurality of LED units being arranged on the side of the mounting table opposite to the mounting surface in such a manner as to independently heat a plurality of regions where the plurality of chips to be inspected are located; and a control unit for outputting a control signal in such a manner as to drive LED units in a region of the chip to be inspected and in a peripheral region of the region, at least corresponding to a region of the chip to be inspected, among the plurality of LED units when inspecting the chip to be inspected.

[0004] <Prior Art Literature>

[0005] <Patent Documents>

[0006] Patent Document 1: Japanese Patent Application Publication No. 2019-102645 Summary of the invention

[0007] <Problems to be Solved by the Invention>

[0008] However, in an inspection device (probe) that raises the temperature of the entire substrate to a target temperature, alignment is performed after the target temperature is reached and a predetermined time has passed so that displacement due to thermal expansion ends. On the other hand, in an inspection device (probe) that partially heats the substrate using an LED unit, since partial heating is performed for each electronic device to be inspected, displacement due to thermal expansion occurs each time partial heating is performed. Therefore, after partial heating and before alignment, standby is performed until displacement due to thermal expansion ends, which reduces the processing capacity of the inspection device.

[0009] In one aspect, the present invention provides a control method for an inspection device and an inspection device that improves processing capability.

[0010] <Methods used to solve the problem>

[0011] In order to solve the above-mentioned problems, according to one embodiment, a control method for an inspection device is provided, wherein the inspection device includes: a loading table, which is used to load a substrate having a plurality of inspection objects and forms a plurality of partitions; and a heating unit, which can perform temperature control on each of the above-mentioned partitions, and the control method for the inspection device has the following steps: when inspecting a first inspection object among the plurality of inspection objects, the partition corresponding to the first inspection object and the partition corresponding to the second inspection object which is the next inspection object are heated by the above-mentioned heating unit.

[0012] <Effects of the Invention>

[0013] According to one aspect, a control method for an inspection device and an inspection device that improve processing capability can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic cross-sectional view for explaining the structure of the inspection device according to the present embodiment.

[0015] Figure 2 This is an example of a schematic cross-sectional view for explaining a temperature adjustment mechanism of a wafer in the inspection apparatus according to the present embodiment.

[0016] Figure 3 This is an example of a plan view for explaining an example of LED divisions for irradiating light in the light irradiation mechanism.

[0017] Figure 4 This is an example of a sequence diagram showing the processing of the inspection device according to the present embodiment. DETAILED DESCRIPTION

[0018] Hereinafter, the mode for implementing the present invention will be described with reference to the accompanying drawings. In each of the drawings, the same components are sometimes given the same reference numerals, and repeated descriptions are omitted.

[0019] <Inspection equipment>

[0020] use Figure 1 An inspection device 10 including a platform (mounting table) 11 according to the present embodiment will be described. Figure 1 This is an example of a schematic cross-sectional view for explaining the configuration of the inspection device 10 according to the present embodiment.

[0021] The inspection device 10 is a device for inspecting the electrical characteristics of each of a plurality of electronic devices (inspected objects, chips) formed on a wafer (substrate) W. It should be noted that the substrate having the inspected object is not limited to the wafer W, but also includes a bracket, a glass substrate, a chip monomer, etc. configured with electronic devices. The inspection device 10 includes a storage chamber 12 for accommodating a platform 11 on which the wafer W is mounted, a loader 13 arranged adjacent to the storage chamber 12, and a tester 14 arranged in a manner covering the storage chamber 12.

[0022] The storage chamber 12 has a shell shape with a hollow interior. A stage 11 for placing the wafer W and a probe card 15 arranged opposite to the stage 11 are accommodated inside the storage chamber 12. The probe card 15 has electrode pads arranged corresponding to the electrodes of each electronic device of the wafer W and a plurality of needle-shaped probes (contact terminals) 16 arranged corresponding to the solder bumps.

[0023] The platform 11 has a fixing mechanism (not shown) for fixing the wafer W to the platform 11. Thus, the relative position of the wafer W with respect to the platform 11 is prevented from being deviated. In addition, a moving mechanism (not shown) for moving the platform 11 in the horizontal direction and the vertical direction is provided in the storage chamber 12. Thus, the relative position of the probe card 15 and the wafer W is adjusted so that the electrode pads and solder bumps provided corresponding to the electrodes of each electronic device contact the probes 16 of the probe card 15.

[0024] The loader 13 is used to take out the wafer W equipped with electronic devices from the transport container, namely FOUP (not shown) and place it on the platform 11 inside the storage chamber 12, and remove the wafer W after inspection from the platform 11 and store it in the FOUP.

[0025] The probe card 15 is connected to the tester 14 via the interface 17. When each probe 16 contacts the electrode pads and solder bumps corresponding to the electrodes of each electronic device on the wafer W, each probe 16 supplies power to the electronic device from the tester 14 via the interface 17, or transmits the signal from the electronic device to the tester 14 via the interface 17.

[0026] The tester 14 has a test board (not shown) for reproducing a part of the circuit configuration of the main board on which the electronic device is mounted, and the test board is connected to a test computer 18 that determines the quality of the electronic device based on the signal from the electronic device. By replacing the test board in the tester 14, the circuit configuration of various main boards can be reproduced.

[0027] The control unit 19 is used to control the movement of the platform 11. The control unit 19 controls the moving mechanism (not shown) of the platform 11, thereby moving the platform 11 in the horizontal direction and the vertical direction. In addition, the control unit 19 is connected to the platform 11 through the wiring 20. The control unit 19 controls the movement of the light irradiation mechanism 40 described later through the wiring 20.

[0028] The heat medium supply device 21 is connected to the heat medium flow path 33 of the platform 11 through the forward pipe 22 and the return pipe 23, so that the heat medium can circulate between the heat medium supply device 21 and the heat medium flow path 33 of the platform 11. The control unit 19 controls the heat medium supply device 21 to control the temperature, flow rate, etc. of the heat medium supplied from the heat medium supply device 21 to the heat medium flow path 33.

[0029] It should be noted that, although the control unit 19 and the heat medium supply device 21 are illustrated as being provided in the loader 13 , they are not limited thereto and may be provided in other locations.

[0030] In the inspection apparatus 10, when inspecting the electrical characteristics of an electronic device, the test computer 18 sends data to a test board connected to the electronic device via each probe 16, and determines whether the sent data is correctly processed by the test board based on the electrical signal from the test board.

[0031] Next, refer to Figure 2 A temperature adjustment mechanism for wafer W in inspection apparatus 10 according to the present embodiment will be described. Figure 2 FIG. 1 is an example of a cross-sectional schematic diagram for explaining a temperature adjustment mechanism of a wafer W in the inspection device 10 of the present embodiment. Figure 2 In the figure, the white arrows show the flow of the heat medium. Figure 2 In FIG. 1 , an example of light irradiated from the light irradiation mechanism 40 is shown by a solid arrow.

[0032] The stage 11 includes a placement section 30 and a light irradiation mechanism 40. In addition, the placement section 30 includes a plate member 31 and a light-transmitting member 32.

[0033] The plate member 31 is a member on which the wafer W is placed, and is formed in a substantially disk shape.

[0034] The light-transmitting member 32 transmits the light irradiated from the light irradiation mechanism 40. In addition, a groove is formed on the upper surface of the light-transmitting member 32, and the plate member 31 and the light-transmitting member 32 are bonded or joined to form a heat medium flow path 33. The heat medium passes through the front pipe 22 (see Figure 1 ) Self-heating medium supply device 21 (refer to Figure 1) is supplied to the heat medium flow path 33. The heat medium flowing in the heat medium flow path 33 is returned through the return pipe 23 (refer to Figure 1 ) returns to the heat medium supply device 21. It should be noted that a groove may be formed on the lower surface side of the plate member 31, and the plate member 31 and the light-transmitting member 32 may be bonded or joined to form the heat medium flow path 33. As the heat medium, for example, water or Galden (registered trademark), which is a colorless and light-transmitting liquid, is used.

[0035] In addition, a plurality of temperature sensors 34 are provided in the plate member 31. The temperature detected by the temperature sensor 34 is sent to the control unit 19.

[0036] The light irradiation mechanism 40 includes a plurality of LEDs 41 for irradiating light. When viewed from above, the LEDs 41 are divided into respective predetermined areas (see below). Figure 3 ). The control unit 19 can control the lighting and the light amount of each divided LED 41 when lighting. It should be noted that although the light irradiation mechanism 40 is described as a device using the LED 41 as a light source, the type of light source is not limited to this.

[0037] The light emitted from the light irradiation mechanism 40 passes through the translucent component 32 and the heat medium flowing in the heat medium flow path 33, and irradiates the back side of the plate component 31, so that the temperature of the plate component 31 increases. In addition, the heat is transferred from the plate component 31 to the wafer W, so that the temperature of the electronic device formed on the wafer W increases. It should be noted that the plate component 31 may also be formed of a translucent component that transmits light. In this case, the light irradiated from the light irradiation mechanism 40 passes through the translucent component 32 and directly irradiates the back side of the wafer W, so that the temperature of the electronic device formed on the wafer W increases.

[0038] In addition, the stage 11 (plate member 31) is formed into a plurality of partitions corresponding to the partitions for irradiating the light of the irradiation mechanism 40. The light irradiation mechanism 40 can control the partition of the stage 11 (plate member 31) whose temperature is increased by the light irradiation mechanism 40 by controlling the partition in which the LED 41 is turned on. Thus, the temperature increase of the wafer W placed on the stage 11 can be controlled for each partition.

[0039] The probe 16 contacts the electrode of the electronic device. Figure 1 )A voltage is applied to the electrode of the electronic device through the probe 16, thereby enabling current to flow to the internal circuit of the electronic device.

[0040] Wafer W has an electronic device (chip) to be inspected. Figure 2 In the embodiment, electronic devices 201 to 203 are formed on a wafer W.

[0041] Here, for the light irradiation mechanism 40, use Figure 3 Provide explanation. Figure 3 FIG. 4 is an example of a top view for explaining an example of LED partitions for irradiating light in the light irradiation mechanism 40. Figure 3 In FIG. 1 , the positions of the electronic devices 201 to 203 to be inspected when viewed from above are indicated by two-dot chain lines.

[0042] like Figure 3 As shown, the light irradiation mechanism 40 has an LED array 400 divided into respective predetermined areas. Each LED array 400 is provided with a plurality of LEDs 41 (see Figure 2 ) The control unit 19 can control the lighting of the LED 41 and the light intensity when lighting for each LED array 400 .

[0043] The range of the LED array 400 that lights up when the electronic device 201 is heated is shown by a dotted line as an irradiation area 401. The irradiation area 401 is composed of, for example, the LED array 400 corresponding to the center position of the electronic device 201 and the LED arrays 400 around it. In addition, the range of the LED array 400 that lights up when the electronic device 202 is heated up is shown by a dotted line as an irradiation area 402. The irradiation area 402 is composed of, for example, the LED array 400 corresponding to the center position of the electronic device 202 and the LED arrays 400 around it. In addition, the range of the LED array 400 that lights up when the electronic device 203 is heated up is shown by a dotted line as an irradiation area 403. The irradiation area 403 is composed of, for example, the LED array 400 corresponding to the center position of the electronic device 203 and the LED arrays 400 around it. It should be noted that the LED array 400 of a part of the irradiation areas 401 to 403 may overlap with the LED array 400 of a part of another irradiation area 401 to 403. In addition, the irradiation areas corresponding to the respective electronic devices may be different from each other. It should be noted that if Figure 3 As shown in the example of FIG. 1 , a part of the irradiation area may overlap between one electronic device and another electronic device. In addition, the irradiation area may not overlap between one electronic device and another electronic device. In addition, the irradiation area may be the same between one electronic device and another electronic device.

[0044] <Control of inspection device>

[0045] Next, for the control of the inspection device 10 of this embodiment, use Figure 4 Provide explanation. Figure 41 is an example of a timing chart showing the processing of the inspection device 10 of this embodiment. Here, the case where the wafer W has electronic devices 201 to 203 and the inspection device 10 inspects the electronic device 201, the electronic device 202, and the electronic device 203 in this order is described as an example. Figure 4 In FIG. 1 , the horizontal axis represents time. In addition, for each electronic device 201 to 203 , the temperature is represented by a solid line, and the displacement due to thermal expansion is represented by a dotted line. In addition, for the irradiation areas 401 to 403 , the intervals in which the LED array 400 is lit are represented by arrows.

[0046] exist Figure 4 In the example shown, the control unit 19 executes a preparation process S101 for inspecting the electronic device 201, an inspection process S104 for inspecting the electronic device 201, a preparation process S105 for inspecting the electronic device 202, an inspection process S108 for inspecting the electronic device 202, a preparation process S109 for inspecting the electronic device 203, and an inspection process S112 for inspecting the electronic device 203.

[0047] In the preparation process S101, the wafer W is transported from the loader 13 to the storage chamber 12, and the wafer W is placed on the platform 11. The fixing mechanism (not shown) of the platform 11 fixes the placed wafer W on the platform 11. The heat medium of a specified temperature flows in the heat medium flow path 33, and the wafer W placed on the platform 11 is heated to a specified first temperature as a whole. It should be noted that the first temperature is a temperature (for example, 70°C) lower than the specified second temperature (target temperature, for example, 80°C) during the inspection of electronic devices. If the temperature of the wafer W detected by the temperature sensor 34 stabilizes at the first temperature after a specified time, the control unit 19 determines that the displacement of the wafer W due to thermal expansion is stable (end). And, if the control unit 19 determines that the displacement of the wafer W due to thermal expansion is stable (end), the alignment of the wafer W is performed (wafer alignment). Here, for example, the position deviation of the wafer W in the horizontal direction (X and Y directions), the position deviation of the wafer W in the vertical direction (Z direction), and the rotation direction (θ) of the wafer W with the vertical direction as the rotation axis are analyzed. Z direction) to align the position deviation.

[0048] Furthermore, in the preparation step S101, the control unit 19 controls the light irradiation mechanism 40 to light the LED array 400 in the irradiation area 401 for heating the electronic device 201, thereby starting to heat the electronic device 201. In addition, the control unit 19 can control the light amount of the LED array 400 in the irradiation area 401 so that the temperature of the electronic device 201 reaches the target temperature based on the detection value of the temperature sensor 34. Figure 4As shown by the solid line, the temperature of the electronic device 201 rises to the target temperature and then remains at the target temperature.

[0049] In addition, by heating the electronic device 201, Figure 4 As shown by the dotted line, the electronic device 201 is displaced due to thermal expansion. The displacement of the electronic device 201 due to thermal expansion stabilizes (ends) as time passes. Here, the time from the start of temperature rise to the stabilization of the displacement due to thermal expansion shown by the dotted line is longer than the time from the start of temperature rise to the stabilization of the temperature shown by the solid line.

[0050] If the temperature of the electronic device 201 detected by the temperature sensor 34 stabilizes at the target temperature and a prescribed time has passed, the control unit 19 determines that the displacement of the electronic device 201 due to thermal expansion is stable (ended). It should be noted that the prescribed time is obtained in advance through experiments, simulations, etc., and is stored in the control unit 19. Furthermore, if the control unit 19 determines that the displacement of the electronic device 201 due to thermal expansion is stable (ended), alignment (chip alignment) S102 of the electronic device 201 to be inspected is performed. Here, for example, the position deviation of the electronic device 201 to be inspected in the horizontal direction (X, Y directions), the position deviation of the electronic device 201 to be inspected in the vertical direction (Z direction), and the rotation direction (θ ) of the electronic device 201 to be inspected with the vertical direction as the rotation axis are determined. Z direction) to align the position deviation.

[0051] The control unit 19 controls the moving mechanism (not shown) of the stage 11 to bring the electrode of the electronic device 201 to be inspected into contact with the probe 16 (S103). Here, alignment is performed based on the thermal expansion of the electronic device 201 to be inspected, so that the electrode of the electronic device 201 and the probe 16 can be reliably aligned. In addition, the contact pressure between the electrode of the electronic device 201 and the probe 16 can be set to a preferred pressure.

[0052] Next, in the inspection process S104, the tester 14 inspects the electronic device 201 to be inspected connected via the probe 16. At this time, the control unit 19 can control the light amount of the LED array 400 in the irradiation area 401 so that the temperature of the electronic device 201 reaches the target temperature based on the detection value of the temperature sensor 34. When the inspection of the electronic device 201 is completed, the LED array 400 in the irradiation area 401 is turned off.

[0053] In the inspection process S104, the control unit 19 controls the light irradiation mechanism 40 to light the LED array 400 in the irradiation area 402 for heating the electronic device 202 to be inspected next, thereby starting to heat the electronic device 202. In addition, the control unit 19 controls the light amount of the LED array 400 in the irradiation area 402 so that the temperature of the electronic device 202 reaches the target temperature based on the detection value of the temperature sensor 34. Figure 4 As shown by the solid line, the temperature of the electronic device 202 rises to the target temperature and is then maintained at the target temperature.

[0054] In addition, by heating the electronic device 202, such as Figure 4 As shown by the dotted line, the electronic device 202 is displaced due to thermal expansion. The displacement of the electronic device 202 due to thermal expansion stabilizes (ends) as time passes.

[0055] In the preparation step S105, preparations are made for inspecting the electronic device 202. When a predetermined time has passed since the temperature of the electronic device 201 detected by the temperature sensor 34 has stabilized at the target temperature, the control unit 19 determines that the displacement of the electronic device 202 due to thermal expansion has stabilized (end). Furthermore, when the control unit 19 determines that the displacement of the electronic device 202 due to thermal expansion has stabilized (end), alignment (chip alignment) of the electronic device 202 to be inspected next is performed S106.

[0056] Here, during the inspection of the electronic device 201, the temperature of the electronic device 202 to be inspected next is raised in advance. Thus, in the preparation step S105, the electronic device 202 can be aligned S106 in a state where the displacement of the electronic device 202 due to thermal expansion is stabilized (finished). Thus, the contact accuracy between the electronic device 202 and the probe 16 can be improved.

[0057] In addition, during the inspection of the electronic device 201, by preheating the temperature of the electronic device 202 to be inspected next, the waiting time from the completion of the inspection step S104 of the electronic device 201 to the start of the alignment S106 of the electronic device 202 can be shortened. Thus, the processing capacity of the inspection apparatus 10 can be improved.

[0058] It should be noted that in Figure 4In the figure, although the timing of starting to heat up the electronic device 202 is set to after the start of the inspection process S104, it is not limited to this. The timing of starting to heat up the electronic device 202 may be simultaneous with the start of the inspection process S104. In addition, the timing of starting to heat up the electronic device 202 may be earlier than the start of the inspection process S104. For example, when the inspection time of each electronic device 201 to 203 is shorter than the time from the start of heating to the stabilization of the displacement due to thermal expansion of each electronic device 201 to 203, the heating of the electronic device 202 may be started before the start of the inspection process S104 of the electronic device 201.

[0059] The control unit 19 controls the moving mechanism (not shown) of the stage 11 to bring the electrode of the electronic device 202 to be inspected into contact with the probe 16 (S107). Here, since alignment is performed based on the thermal expansion of the electronic device 202 to be inspected, the electrode of the electronic device 202 and the probe 16 can be reliably aligned. In addition, the contact pressure between the electrode of the electronic device 202 and the probe 16 can be set to a preferred pressure.

[0060] Next, in the inspection process S108, the tester 14 inspects the electronic device 202 to be inspected connected via the probe 16. At this time, the control unit 19 can control the light amount of the LED array 400 in the irradiation area 402 so that the temperature of the electronic device 202 reaches the target temperature based on the detection value of the temperature sensor 34. When the inspection of the electronic device 202 is completed, the LED array 400 in the irradiation area 402 is turned off.

[0061] Thereafter, the preparation process S109, chip alignment S110, contact S111, and inspection process S112 for the electronic device 203 are the same as the preparation process S105, chip alignment S106, contact S107, and inspection process S108 for the electronic device 202, so repeated descriptions are omitted.

[0062] As described above, according to the inspection device 10 of this embodiment, the light irradiation mechanism 40 heats the electronic device 202 to be inspected next in advance during the inspection of one electronic device 201. As a result, the waiting time from the end of the inspection of the electronic device 201 to the start of the alignment of the electronic device 202 can be shortened, thereby improving the processing capacity of the inspection device 10.

[0063] In other words, the electronic device 202 can be aligned after the displacement due to thermal expansion of the electronic device 202 is stabilized (completed). As a result, the alignment accuracy of the electronic device 202 is improved, and the contact accuracy between the electronic device 202 and the probe 16 is improved.

[0064] In addition, it is preferred that the electronic device under inspection and the electronic device to be inspected next are adjacent to each other. Thus, by heating the electronic device under inspection to the target temperature, the temperature of the adjacent electronic device to be inspected next can also be raised. Thus, the processing capacity of the inspection device 10 can be improved.

[0065] As mentioned above, the inspection device 10 has been described, but the present invention is not limited to the above-mentioned embodiment and the like, and various modifications and improvements can be made within the scope of the gist of the present invention described in the claims.

[0066] As a heating unit capable of heating each divided area of ​​the stage 11, the device having the light irradiation mechanism 40 has been described, but the present invention is not limited thereto. As a heating unit capable of heating each divided area of ​​the stage 11, a heater or the like may also be used.

Claims

1. A control method for an inspection device, the inspection device comprising: a mounting table for mounting a substrate having a plurality of objects to be inspected and having a plurality of partitions; and A heating unit capable of performing temperature control for each of the above-mentioned partitions, The control method of the inspection device has the following steps: The heating unit heats the entire substrate placed on the mounting table to a first temperature; The heating unit starts heating a first subarea corresponding to a first inspection object among the plurality of inspection objects as an inspection object; After starting to increase the temperature of the first sub-area, controlling the temperature increase of the first sub-area by the heating unit so that the temperature of the first inspection object becomes a second temperature as a target temperature, and starting to inspect the first inspection object; and Before the inspection of the first inspection object is completed, the heating unit starts to increase the temperature of the second sub-area corresponding to the second inspection object to be inspected next.

2. The control method of the inspection device according to claim 1, wherein: It also has the following processes: After the inspection of the first inspection object is completed, the heating unit controls the temperature of the second subarea to be raised so that the temperature of the second inspection object reaches the target temperature, and the inspection of the second inspection object is started. The second inspection object is arranged on the substrate next to the first inspection object.

3. The control method of the inspection device according to claim 1 or 2, wherein: The inspection device includes a temperature sensor for detecting the temperature of the object to be inspected. When the temperature of the subarea corresponding to the inspection object is increased, the heating unit is controlled based on the temperature of the inspection object detected by the temperature sensor so that the temperature of the inspection object reaches the target temperature.

4. The control method of the inspection device according to claim 3, wherein: It also has the following processes: If a threshold time has passed after the temperature of the inspection object has stabilized at the target temperature, it is determined that the displacement of the inspection object due to thermal expansion has stabilized.

5. The control method of the inspection device according to claim 4, wherein: It also has the following processes: If it is determined that the displacement of the inspection object due to thermal expansion is stable, alignment of the inspection object is performed.

6. The control method of the inspection device according to claim 5, wherein: The inspection device includes a probe for contacting the inspection object, and The control method of the inspection device further comprises the following steps: After the alignment of the inspection object, the inspection object is brought into contact with the probe.

7. The control method of the inspection device according to any one of claims 1, 2, 4 to 6, wherein: The heating unit is a light irradiation mechanism that irradiates light to heat the mounting table.

8. The control method of the inspection device according to claim 7, wherein: The light irradiation mechanism includes an LED as a light source.

9. An inspection device, comprising: A mounting table for mounting a substrate having a plurality of objects to be inspected and having a plurality of partitions; A heating unit capable of performing temperature increase control on each of the above-mentioned partitions; and A control unit, which is used to control the heating unit, The control unit is controlled in the following manner: The heating unit heats the entire substrate placed on the mounting table to a first temperature; The heating unit starts heating a first subarea corresponding to a first inspection object among the plurality of inspection objects as an inspection object; After starting to increase the temperature of the first sub-area, controlling the temperature increase of the first sub-area by the heating unit so that the temperature of the first inspection object becomes a second temperature as a target temperature, and starting to inspect the first inspection object; and Before the inspection of the first inspection object is completed, the heating unit starts to increase the temperature of a second sub-area corresponding to a second inspection object that is a next inspection target among the plurality of inspection objects.

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