A circuit board with heat conduction through embedded ceramics and a manufacturing method thereof

Abstract

The present invention discloses a circuit board for heat conduction by inlaying ceramics and a manufacturing method thereof. The circuit board comprises a first insulating substrate and a second insulating substrate which are distributed up and down. The first insulating substrate and the second insulating substrate are bonded together by an insulating adhesive layer. A vertical channel which passes through the first insulating substrate, the second insulating substrate and the insulating adhesive layer is provided in the circuit board. A ceramic body which is convenient for heat conduction is installed in the vertical channel. The lower end of the ceramic body is provided with an insulating heat-conducting layer, and the upper end is flush with the upper surface of the first insulating substrate to form a first plane. The lower surface of the insulating heat-conducting layer is flush with the lower surface of the second insulating substrate to form a second plane. A first metal layer for connecting a heating element thereto is laid on the first plane, and a second metal layer which is convenient for heat dissipation is laid on the second plane.

Description

Technical Field

[0001] The invention relates to a circuit board that conducts heat through embedded ceramics and a manufacturing method thereof. Background Art

[0002] At present, circuit boards, as carriers of electronic components, must have a large number of components installed on them. These electronic components often generate heat when working. If the heat is allowed to accumulate on the circuit board, it will have a great impact on the life of the circuit board. Therefore, metal is embedded on the circuit board as a thermal conductive medium to quickly release the heat to the environment. However, due to the conductive properties of the metal itself, the voltage resistance of the circuit board will be reduced after the metal is embedded.

[0003] Therefore, how to overcome the above-mentioned defects has become an important issue to be solved urgently by those skilled in the art. Summary of the invention

[0004] The present invention overcomes the shortcomings of the above-mentioned technology and provides a circuit board that conducts heat through embedded ceramics and a manufacturing method thereof.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] A circuit board that conducts heat by embedding ceramics, comprising a first insulating substrate 1 and a second insulating substrate 2 distributed up and down, the first insulating substrate 1 and the second insulating substrate 2 being bonded by an insulating adhesive layer 3, a vertical channel 4 penetrating the first insulating substrate 1, the second insulating substrate 2 and the insulating adhesive layer 3 is provided in the circuit board, a ceramic body 5 for facilitating heat conduction is installed in the vertical channel 4, an insulating heat-conducting layer 6 is provided at the lower end of the ceramic body 5, and a first plane 7 is formed at the upper end flush with the upper surface of the first insulating substrate 1, the lower surface of the insulating heat-conducting layer 6 is flush with the lower surface of the second insulating substrate 2 to form a second plane 8, a first metal layer 9 for connecting heat-generating components thereto is laid on the first plane 7, and a second metal layer 10 for facilitating heat dissipation is laid on the second plane.

[0007] Preferably, the first insulating substrate 1 is provided with a first through hole 11, the second insulating substrate 2 is provided with a second through hole 21 corresponding to the position of the first through hole 11, and the insulating adhesive layer 3 extends to the inner wall surfaces of the first through hole 11 and the second through hole 21 to form a vertical channel 4.

[0008] Preferably, a step 41 is provided at one end of the vertical channel 4 close to the second insulating substrate 2 to facilitate positioning of the ceramic body 5 , and the insulating heat-conducting layer 6 is located in the section of the vertical channel 4 where the step 41 is located.

[0009] Preferably, a circuit is etched on the first metal layer 9 .

[0010] Preferably, the insulating adhesive layer 3 is a prepreg, and the insulating thermal conductive layer 6 is a prepreg or a thermal conductive adhesive.

[0011] A method for manufacturing a circuit board that conducts heat by embedding ceramics, comprising the following steps:

[0012] Step 1: provide a first insulating substrate 1 and a second insulating substrate 2, punch a first through hole 11 perpendicular to the board surface on the first insulating substrate 1, and punch a second through hole 21 perpendicular to the board surface on the second insulating substrate 2;

[0013] Step 2: The first insulating substrate 1 is placed on the top and the second insulating substrate 2 is placed on the bottom. After aligning the first through hole 11 and the second through hole 21, the first insulating substrate 1 and the second insulating substrate 2 are bonded together through the insulating adhesive layer 3 so that the insulating adhesive layer 3 fills the first through hole 11 and the second through hole 21.

[0014] Step 3: punching holes in the insulating adhesive layer 3 at the positions of the first through hole 11 and the second through hole 21 to form a vertical channel 4;

[0015] Step 4: providing a ceramic body 5, and embedding the ceramic body 5 in the vertical channel 4, so that the upper end of the ceramic body 5 is flush with the upper surface of the first insulating substrate 1 to form a first plane 7, and the lower end of the ceramic body 5 is provided with an insulating heat-conducting layer 6, so that the lower surface of the insulating heat-conducting layer 6 is flush with the lower surface of the second insulating substrate 2 to form a second plane 8;

[0016] Step 5: Lay a first metal layer 9 on the first plane 7 for connecting the heat generating components thereon, and lay a second metal layer 10 on the second plane 8 for heat dissipation.

[0017] Preferably, a circuit is etched on the first metal layer 9 .

[0018] Preferably, the vertical channel 4 is provided with a large inner diameter section and a small inner diameter section distributed up and down, the aperture of the large inner diameter section close to the first insulating substrate 1 is smaller than the first through hole 11, and the aperture of the small inner diameter section close to the second insulating substrate 2 is smaller than the large inner diameter section, and the vertical channel 4 forms a step 41 at the junction of the large and small inner diameter sections, and the insulating thermal conductive layer 6 fills the small inner diameter section.

[0019] Preferably, the insulating adhesive layer 3 is a prepreg, and the insulating thermal conductive layer 6 is a prepreg or a thermal conductive adhesive.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] A ceramic body is embedded in the circuit board of this case, and the upper end of the ceramic body is directly in contact with the first metal layer. When in use, the heat-generating components are connected to the first metal layer, and an insulating heat-conductive layer is provided at the lower end of the ceramic body, which is directly in contact with the second metal layer. Therefore, the heat generated by the heat-generating components when working can be transferred from the first metal layer to the second metal layer through the ceramic body and then dissipated, thereby avoiding the working environment temperature of the components being too high. Due to the non-conductive property of ceramics, the upper end of the ceramic body can be directly in contact with the first metal layer, and the voltage resistance performance of the circuit board can also be guaranteed without adding an additional insulating layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a cross-sectional schematic diagram of a circuit board in this case that is heat-conducting by embedding ceramics.

[0023] Figure 2 It is a schematic diagram of the first insulating substrate and the second insulating substrate in this case.

[0024] Figure 3 It is a schematic cross-sectional view of the combination of the first insulating substrate, the second insulating substrate and the insulating adhesive layer in this case.

[0025] Figure 4 It is a schematic diagram of the vertical channel cross section of this case. DETAILED DESCRIPTION

[0026] The features of the present invention and other related features are further described in detail below through embodiments to facilitate understanding by those skilled in the art:

[0027] like Figures 1 to 4 As shown, a circuit board for heat conduction by inlaid ceramics comprises a first insulating substrate 1 and a second insulating substrate 2 which are distributed up and down, the first insulating substrate 1 and the second insulating substrate 2 being bonded by an insulating adhesive layer 3, a vertical channel 4 penetrating the first insulating substrate 1, the second insulating substrate 2 and the insulating adhesive layer 3 is provided in the circuit board, a ceramic body 5 for heat conduction is installed in the vertical channel 4, an insulating heat-conducting layer 6 is provided at the lower end of the ceramic body 5, and a first plane 7 is formed at the upper end flush with the upper surface of the first insulating substrate 1, the lower surface of the insulating heat-conducting layer 6 is flush with the lower surface of the second insulating substrate 2 to form a second plane 8, a first metal layer 9 for connecting heat-generating components thereto is laid on the first plane 7, and a second metal layer 10 for heat dissipation is laid on the second plane.

[0028] As described above, a ceramic body 5 is embedded in the circuit board of the present case, and the upper end of the ceramic body 5 is directly in contact with the first metal layer 9. When in use, the heat-generating components are connected to the first metal layer 9, and the lower end of the ceramic body 5 is provided with an insulating heat-conducting layer 6, which is directly in contact with the second metal layer 10. Therefore, the heat generated by the heat-generating components during operation can be transferred from the first metal layer 9 to the second metal layer 10 through the ceramic body 5 and then dissipated, thereby avoiding excessively high working environment temperature of the components. Due to the non-conductive property of ceramics, the upper end of the ceramic body 5 can be directly in contact with the first metal layer 9, and the voltage resistance performance of the circuit board can also be guaranteed without adding an additional insulating layer.

[0029] like Figures 1 to 4 As shown, preferably, the first insulating substrate 1 is provided with a first through hole 11, the second insulating substrate 2 is provided with a second through hole 21 corresponding to the position of the first through hole 11, and the insulating adhesive layer 3 extends to the inner wall surfaces of the first through hole 11 and the second through hole 21 to form a vertical channel 4.

[0030] like Figure 1 , Figure 4 As shown, preferably, a step 41 is provided at one end of the vertical channel 4 close to the second insulating substrate 2 to facilitate positioning of the ceramic body 5 , and the insulating heat-conducting layer 6 is located in the section of the vertical channel 4 where the step 41 is located.

[0031] like Figure 1 As shown, preferably, the first metal layer 9 is etched with a circuit.

[0032] like Figure 1 to Figure 2 As shown, preferably, the insulating adhesive layer 3 is a prepreg, and the insulating thermal conductive layer 6 is a prepreg or a thermal conductive adhesive.

[0033] like Figures 1 to 4 As shown, a method for manufacturing a circuit board by embedding ceramic heat conduction comprises the following steps:

[0034] Step 1: provide a first insulating substrate 1 and a second insulating substrate 2, punch a first through hole 11 perpendicular to the board surface on the first insulating substrate 1, and punch a second through hole 21 perpendicular to the board surface on the second insulating substrate 2;

[0035] Step 2: The first insulating substrate 1 is placed on the top and the second insulating substrate 2 is placed on the bottom. After aligning the first through hole 11 and the second through hole 21, the first insulating substrate 1 and the second insulating substrate 2 are bonded together through the insulating adhesive layer 3 so that the insulating adhesive layer 3 fills the first through hole 11 and the second through hole 21.

[0036] Step 3: punching holes in the insulating adhesive layer 3 at the positions of the first through hole 11 and the second through hole 21 to form a vertical channel 4;

[0037] Step 4: providing a ceramic body 5, and embedding the ceramic body 5 in the vertical channel 4, so that the upper end of the ceramic body 5 is flush with the upper surface of the first insulating substrate 1 to form a first plane 7, and the lower end of the ceramic body 5 is provided with an insulating heat-conducting layer 6, so that the lower surface of the insulating heat-conducting layer 6 is flush with the lower surface of the second insulating substrate 2 to form a second plane 8;

[0038] Step 5: Lay a first metal layer 9 on the first plane 7 for connecting the heat generating components thereon, and lay a second metal layer 10 on the second plane 8 for heat dissipation.

[0039] like Figure 1 As shown, preferably, a circuit is etched on the first metal layer 9 .

[0040] like Figure 1 , Figure 3 , Figure 4 As shown, the vertical channel 4 is provided with a large inner diameter section and a small inner diameter section distributed up and down, the aperture of the large inner diameter section close to the first insulating substrate 1 is smaller than the first through hole 11, and the aperture of the small inner diameter section close to the second insulating substrate 2 is smaller than the large inner diameter section, and the vertical channel 4 forms a step 41 at the junction of the large and small inner diameter sections, and the insulating thermal conductive layer 6 fills the small inner diameter section.

[0041] like Figure 1 to Figure 2 As shown, preferably, the insulating adhesive layer 3 is a prepreg, and the insulating thermal conductive layer 6 is a prepreg or a thermal conductive adhesive.

[0042] As mentioned above, this case protects a circuit board that conducts heat through embedded ceramics and its manufacturing method. All technical solutions that are the same or similar to this case should be shown to fall within the scope of protection of this case.

Claims

1. A circuit board that conducts heat by embedding ceramics, characterized in that The circuit board comprises a first insulating substrate (1) and a second insulating substrate (2) which are arranged in an upper and lower manner, wherein the first insulating substrate (1) and the second insulating substrate (2) are bonded together by an insulating adhesive layer (3), wherein a vertical channel (4) is provided in the circuit board and passes through the first insulating substrate (1), the second insulating substrate (2) and the insulating adhesive layer (3), wherein a ceramic body (5) for facilitating heat conduction is installed in the vertical channel (4), wherein an insulating heat-conducting layer (6) is provided at the lower end of the ceramic body (5), and a first plane (7) is formed at the upper end thereof and flush with the upper surface of the first insulating substrate (1), wherein the lower surface of the insulating heat-conducting layer (6) is flush with the lower surface of the second insulating substrate (2) to form a second plane (8), wherein a first metal layer (9) for connecting a heat-generating component thereto is laid on the first plane (7), and a second metal layer (10) for facilitating heat dissipation is laid on the second plane; The first insulating substrate (1) is provided with a first through hole (11), the second insulating substrate (2) is provided with a second through hole (21) corresponding to the position of the first through hole (11), and the insulating adhesive layer (3) extends to the first through hole (11) and the inner wall surface of the second through hole (21) to form a vertical channel (4); The vertical channel (4) is provided with a step (41) at one end close to the second insulating substrate (2) to facilitate the positioning of the ceramic body (5), and the insulating heat-conducting layer (6) is located in the section of the vertical channel (4) where the step (41) is located.

2. A circuit board for heat conduction by embedding ceramics according to claim 1, characterized in that The first metal layer (9) is etched with a circuit.

3. A circuit board for heat conduction by embedding ceramics according to any one of claims 1 to 2, characterized in that The insulating adhesive layer (3) is a prepreg, and the insulating heat-conducting layer (6) is a prepreg or a heat-conducting adhesive.

4. A method for manufacturing a circuit board by embedding ceramic heat conduction, characterized in that The following steps are involved: Step 1: providing a first insulating substrate (1) and a second insulating substrate (2), punching a first through hole (11) perpendicular to the board surface direction on the first insulating substrate (1), and punching a second through hole (21) perpendicular to the board surface direction on the second insulating substrate (2); Step 2: The first insulating substrate (1) is placed on top and the second insulating substrate (2) is placed on the bottom. After aligning the first through hole (11) and the second through hole (21), the first insulating substrate (1) and the second insulating substrate (2) are bonded together via an insulating adhesive layer (3), so that the insulating adhesive layer (3) completely fills the first through hole (11) and the second through hole (21); Step three: punching holes in the insulating adhesive layer (3) at the positions of the first through hole (11) and the second through hole (21) to form a vertical channel (4); Step 4: providing a ceramic body (5), embedding the ceramic body (5) in the vertical channel (4), making the upper end of the ceramic body (5) flush with the upper surface of the first insulating substrate (1) to form a first plane (7), and providing an insulating heat-conducting layer (6) at the lower end of the ceramic body (5), making the lower surface of the insulating heat-conducting layer (6) flush with the lower surface of the second insulating substrate (2) to form a second plane (8); The vertical channel (4) is provided with a large inner diameter section and a small inner diameter section distributed up and down, the aperture of the large inner diameter section close to the first insulating substrate (1) is smaller than the first through hole (11), and the aperture of the small inner diameter section close to the second insulating substrate (2) is smaller than the large inner diameter section, and the vertical channel (4) forms a step (41) at the junction of the large and small inner diameter sections, and the insulating heat-conducting layer (6) fills the small inner diameter section; Step 5: Laying a first metal layer (9) on the first plane (7) for connecting the heat generating components thereto, and laying a second metal layer (10) on the second plane (8) for heat dissipation.

5. The method for manufacturing a circuit board by embedding ceramic heat conduction according to claim 4, characterized in that A circuit is etched on the first metal layer (9).

6. A method for manufacturing a circuit board by embedding ceramic heat conduction according to any one of claims 4-5, characterized in that The insulating adhesive layer (3) is a prepreg, and the insulating heat-conducting layer (6) is a prepreg or a heat-conducting adhesive.

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