Heat dissipation structure and electronic equipment

Abstract

The embodiment of the present application relates to the field of electronic equipment, and provides a heat dissipation structure and electronic equipment, the heat dissipation structure comprising: a heat conduction part, the heat conduction part comprising a first heat conduction layer, a connection part and a second heat conduction layer, the first heat conduction layer and the second heat conduction layer are directly opposite, and the connection part can be bent; a first heat dissipation layer, the first heat dissipation layer is located on one side of the first heat conduction layer; a second heat dissipation layer, the second heat dissipation layer is located on one side, and the second heat dissipation layer and the first heat dissipation layer are respectively located on opposite sides of the connection part. The heat dissipation structure and electronic equipment provided by the embodiment of the present application are at least conducive to solving the problem of poor heat dissipation effect.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of electronic devices, and in particular to a heat dissipation structure and electronic devices. Background Art

[0002] With the rapid development of high frequency, high speed and integrated circuit technology of electronic devices, electronic devices are becoming more and more powerful and generating more and more heat. Heat can weaken the performance of these devices and even reduce their service life. For example, long-term use of mobile phones can cause serious heating of the processor and screen, which can further affect the service life of the organic light-emitting diode (OLED) screen.

[0003] The heat dissipation of electrical devices is to control the operating temperature of electronic equipment to ensure its working temperature and safety. It mainly involves different contents in various aspects such as heat dissipation and materials. At present, the main heat dissipation methods are natural, forced, liquid, refrigeration, conduction, heat pipes and other methods. At present, most mobile phones use passive heat dissipation. The heat dissipation method of mobile phone processors is to transfer heat from the processor and screen layer by layer to the mobile phone casing through materials such as graphite, and then dissipate the heat of the mobile phone processor into the surrounding environment (air). Therefore, there is a problem of poor heat dissipation. Summary of the invention

[0004] The embodiments of the present application provide a heat dissipation structure and an electronic device, which are at least helpful in solving the problem of poor heat dissipation effect.

[0005] According to some embodiments of the present application, on one hand, the embodiments of the present application provide a heat dissipation structure, including: a heat conducting part, the heat conducting part including a first heat conducting layer, a connecting part and a second heat conducting layer, the connecting part connects the first heat conducting layer and the second heat conducting layer, and the connecting part is bendable; a first heat dissipation layer, the first heat dissipation layer is located on one side of the first heat conducting layer; a second heat dissipation layer, the second heat dissipation layer is located on one side of the second heat conducting layer, and the second heat dissipation layer and the first heat dissipation layer are respectively located on opposite sides of the connecting part.

[0006] In some embodiments, in the direction from the second heat-conducting layer to the first heat-conducting layer, the thickness of the connecting portion is greater than the thickness of the first heat-conducting layer; and the thickness of the connecting portion is greater than the thickness of the second heat-conducting layer.

[0007] In some embodiments, in a direction from the second heat-conducting layer to the first heat-conducting layer, a thickness of the first heat-conducting layer is greater than or equal to a thickness of the second heat-conducting layer.

[0008] In some embodiments, the thickness of the first heat conductive layer ranges from 10 um to 100 um.

[0009] In some embodiments, the porosity of the second heat conductive layer ranges from 25% to 45%.

[0010] In some embodiments, the second heat-conducting layer is provided with holes penetrating the second heat-conducting layer.

[0011] In some embodiments, the holes are arranged in an array on the second heat conductive layer; the maximum physical size of the holes is ≤5 mm.

[0012] In some embodiments, the present invention further includes: a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is located between the first thermal conductive layer and the first heat dissipation layer, and the second adhesive layer is located between the second thermal conductive layer and the second heat dissipation layer.

[0013] In some embodiments, the method further includes: a third heat dissipation layer, wherein the third heat dissipation layer is located on a side of the second heat conductive layer away from the second heat dissipation layer.

[0014] According to some embodiments of the present application, on the other hand, the embodiments of the present application further provide an electronic device, including: a screen, a back cover and a processor; a heat dissipation structure like any of the above items, wherein the second heat-conducting layer is attached to the back cover, the first heat dissipation layer is located on a side of the first heat-conducting layer away from the second heat-conducting layer, and the first heat dissipation layer is located between the screen of the electronic device and the first heat-conducting layer, the second heat dissipation layer is located on a side of the second heat-conducting layer facing the first heat-conducting layer, and the second heat dissipation layer is located between the processor and the second heat-conducting layer.

[0015] The technical solution provided by the embodiments of the present application has at least the following advantages:

[0016] The connecting part connects the first heat-conducting layer and the second heat-conducting layer, which can ensure that the heat generated by the processor and the screen is directly transferred to the back shell of the electronic device through the inside of the heat-conducting part, thereby avoiding the poor heat dissipation effect caused by the heat generated by the processor and the screen being transferred from the screen to the back shell of the electronic device layer by layer, which is beneficial to heat conduction and cooling of the screen and processor.

[0017] In addition, the heat conducting part is an integrated structure. On the one hand, when the heat generated by the processor and the screen is transferred to the back shell of the mobile phone through the inside of the heat conducting part, the heat conducting part is an integrated structure, which effectively avoids the poor heat dissipation effect caused by the difference in thermal diffusion coefficients of different heat conducting media; on the other hand, the heat conducting part is an integrated structure, which can ensure that there is no tiny gap between the first heat conducting layer and the connecting part and between the second heat conducting layer and the connecting part, thereby increasing the contact area, effectively avoiding the heat transfer resistance between the first heat conducting layer and the connecting part and between the second heat conducting layer and the connecting part, which is conducive to improving the problem of poor heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplifications do not constitute limitations on the embodiments. Unless otherwise stated, the pictures in the drawings do not constitute proportional limitations.

[0019] Figure 1 A schematic diagram of the structure of an electronic device provided by an embodiment of the present application when the rear shell is opened;

[0020] Figure 2 A schematic diagram of an exploded structure of a heat dissipation structure provided in one embodiment of the present application;

[0021] Figure 3 A schematic structural diagram of a heat dissipation structure provided by an embodiment of the present application when a heat conducting portion is bent. DETAILED DESCRIPTION

[0022] As can be seen from the background technology, existing electronic devices have the problem of poor heat dissipation effect.

[0023] The present application provides a heat dissipation structure and an electronic device, which uses a heat-conducting part in combination with a first heat dissipation layer and a second heat dissipation layer to conduct heat, thereby increasing the thermal conductivity of a screen and a processor; the second heat-conducting layer adopts an open hole design and is connected to the back shell of the electronic device, which can efficiently conduct the heat of the screen and the processor to the back shell of the electronic device for heat dissipation.

[0024] The following will describe the various embodiments of the present application in detail with reference to the accompanying drawings. However, it will be appreciated by those skilled in the art that in the various embodiments of the present application, many technical details are provided in order to enable the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solution claimed in the present application can be implemented.

[0025] refer to Figures 1 to 3 , Figure 1 A schematic diagram of the structure of an electronic device provided by an embodiment of the present application when the rear shell is opened; Figure 2 A schematic diagram of an exploded structure of a heat dissipation structure provided in one embodiment of the present application; Figure 3 A schematic structural diagram of a heat dissipation structure provided in an embodiment of the present application when the heat conducting portion is bent, the heat dissipation structure includes: a heat conducting portion 110, the heat conducting portion 110 includes a first heat conducting layer 111, a connecting portion 112 and a second heat conducting layer 113, the connecting portion 112 connects the first heat conducting layer 111 and the second heat conducting layer 113, and the connecting portion 112 is bendable; the heat conducting portion 110 also includes a first heat dissipation layer 12 and a second heat dissipation layer 13, the first heat dissipation layer 12 is located on one side of the first heat conducting layer 111, the second heat dissipation layer 13 is located on one side of the second heat conducting layer 113, and the second heat dissipation layer 13 and the first heat dissipation layer 12 are respectively located on opposite sides of the connecting portion 112.

[0026] In some embodiments, the heat dissipation structure is applied to electronic equipment, referring to Figure 1 The connecting portion 112 is bent so that the first heat-conducting layer 111 is opposite to the second heat-conducting layer 113, the second heat-conducting layer 113 is used to fit with the back shell 23 of the electronic device, the first heat dissipation layer 12 is located on the side of the first heat-conducting layer 111 away from the second heat-conducting layer 113, and the first heat dissipation layer 12 is located between the screen 21 of the electronic device and the first heat-conducting layer 111, the second heat dissipation layer 13 is located on the side of the second heat-conducting layer 113 facing the first heat-conducting layer 111, and the second heat dissipation layer 13 is located between the processor 22 of the electronic device and the second heat-conducting layer 113.

[0027] In some embodiments, the connecting portion 112 connects the first heat-conducting layer 111 and the second heat-conducting layer 113, which can ensure that the heat generated by the processor 22 and the screen 21 is directly transferred to the back shell 23 of the electronic device through the inside of the heat-conducting portion 11, thereby avoiding the poor heat dissipation effect caused by the heat generated by the processor 22 and the screen 21 being transferred from the screen 21 to the back shell 23 of the electronic device layer by layer, which is beneficial to heat conduction and cooling of the screen 21 and the processor 22.

[0028] In some embodiments, the heat conducting part 110 is an integrally formed structure; the material of the heat conducting part 110 includes at least one of copper, silver or aluminum. On the one hand, when the heat generated by the processor 22 and the screen 21 is transferred to the rear shell 23 through the inside of the heat conducting part 110, the heat conducting part 110 is an integrally formed structure, which effectively avoids the poor heat dissipation effect caused by the difference in thermal diffusion coefficients of different heat conducting media; on the other hand, the heat conducting part 110 is an integrally formed structure, which can ensure that there is no small gap between the first heat conducting layer 111 and the connecting part 112 and between the second heat conducting layer 113 and the connecting part 112, thereby increasing the contact area, effectively avoiding the generation of heat transfer resistance between the first heat conducting layer and the connecting part and between the second heat conducting layer and the connecting part, which is conducive to improving the problem of poor heat dissipation effect.

[0029] In some embodiments, the first thermally conductive layer 111 is a continuous film layer over the entire surface, which is equivalent to maximizing the effective contact area between the first thermally conductive layer 111 and the processor 22 of the electronic device, so that there is less gap between the first thermally conductive layer 111 and the processor 22 of the electronic device, which is beneficial to reducing the heat transfer resistance between the first thermally conductive layer 111 and the processor 22 of the electronic device, thereby improving the heat transfer efficiency of the first thermally conductive layer 111, which is beneficial to improving the problem of poor heat dissipation effect; in the direction where the second thermally conductive layer 113 points to the first thermally conductive layer 111, the thickness of the first thermally conductive layer 111 ranges from 10um to 100um, specifically 20um, 40um, 50um, 80um or 100um; the material of the first thermally conductive layer 111 includes copper, silver or aluminum.

[0030] In some embodiments, the second heat-conducting layer 113 is in contact with the rear shell 23 of the electronic device, that is, one side of the second heat-conducting layer 113 is in contact with the last layer of heat transfer, so the second heat-conducting layer 113 also has the function of assisting heat dissipation. The second heat-conducting layer 113 may be provided with a hole 114 that penetrates the second heat-conducting layer 113. The hole 114 is provided on the second heat-conducting layer 113. Compared with the second heat-conducting layer 113 without the hole 114, the surface area of ​​the second heat-conducting layer 113 is increased, that is, the area of ​​the inner wall of the hole 114 is increased. The increase in surface area is conducive to the discharge of heat. In addition, heat can be transferred by the gas in the hole 114. The heat conduction effect of air is not as good as that of the second heat-conducting layer 113, that is, the heat transfer resistance between air and the second heat-conducting layer 113 is large. When the heat flow passes through the interface, the heat transfer resistance will greatly reduce the heat transfer efficiency, causing the temperature along the heat flow direction to drop sharply, which is conducive to improving the heat dissipation effect.

[0031] In some embodiments, the porosity of the second thermal conductive layer 113 is in the range of 25% to 45%, specifically 25%, 30%, 35%, 40% or 45%. Opening holes in the second thermal conductive layer 113 can further ensure the thermal conductivity and heat dissipation effects. The porosity of the second thermal conductive layer 113 is less than 50%, which can ensure that the contact area between the second thermal conductive layer 113 and the second heat dissipation layer 13 and the back shell 23 is large, that is, the effective area of ​​heat transfer or heat exchange is large, which is conducive to improving the heat dissipation effect.

[0032] In some embodiments, the holes 114 are arranged in an array on the second heat-conducting layer 113, which is equivalent to the holes 114 being evenly distributed on the second heat-conducting layer 113, ensuring that each part of the second heat-conducting layer 113 is evenly conducting heat and dissipating heat, which is beneficial to improving the heat conduction effect and the heat dissipation effect; the maximum physical size of the hole 114 is ≤5mm, and can be 1mm, 2mm, 3mm or 5mm. The smaller the maximum physical size of the hole 114, the larger the contact area between the second heat-conducting layer 113 and the second heat dissipation layer 13 and the back shell 23, that is, the effective area of ​​heat transfer or heat exchange is larger, which is beneficial to improving the heat dissipation effect. The shape of the hole 114 can be diamond, circular, rectangular, elliptical or annular. The present application does not specifically limit the shape of the hole 114, and it is only necessary to satisfy that the maximum physical size of the hole 114 is ≤5mm.

[0033] In other embodiments, the second heat-conducting layer has a functional area and an edge area. The edge area is located around the second heat-conducting layer and surrounds the functional area. The holes are arranged in an array on the functional area to further ensure the thermal conductivity and heat dissipation effects.

[0034] In some other embodiments, the holes are diffusely arranged on the second heat-conducting layer, and the closer to the edge of the second heat-conducting layer, the greater the distance between adjacent holes, which is equivalent to multiple holes being diffusely arranged with the center of the second heat-conducting layer as the center toward the outer side of the second heat-conducting layer.

[0035] Specifically, in some embodiments, the second heat-conducting layer 113 may be laser grooved to form the hole 114. In other embodiments, a mold may be used to form the second heat-conducting layer with holes. The embodiments of the present application do not specifically limit the method and process for forming the second heat-conducting layer and the holes.

[0036] In some embodiments, the material of the second heat-conducting layer 113 may be the same as that of the first heat-conducting layer 111, which can avoid the poor heat dissipation effect caused by the difference in thermal diffusion coefficients of different heat-conducting media. In other embodiments, the material of the second heat-conducting layer may be different from that of the first heat-conducting layer.

[0037] In some embodiments, in the direction in which the second heat conductive layer 113 points to the first heat conductive layer 111, the thickness of the first heat conductive layer 111 is equal to the thickness of the second heat conductive layer 113. In other embodiments, the thickness of the first heat conductive layer is greater than the thickness of the second heat conductive layer.

[0038] In some embodiments, the connection portion 112 is a continuous film layer on the entire surface, which is equivalent to maximizing the effective contact area between the connection portion 112 and the processor 22 of the electronic device, so that there is less gap between the connection portion 112 and the processor 22 of the electronic device, which is beneficial to reducing the heat transfer resistance between the connection portion 112 and the processor 22 of the electronic device, thereby improving the heat transfer efficiency of the connection portion 112, which is beneficial to improving the problem of poor heat dissipation effect. In addition, the connection portion 112 serves as a medium for heat transfer or heat exchange between the first heat conductive layer 111 and the second heat conductive layer 113. The connection portion 112 is a continuous film layer on the entire surface, that is, the effective area of ​​heat transfer or heat exchange is increased, which is beneficial to improving the heat dissipation effect.

[0039] In other embodiments, the connection portion is provided with a second hole penetrating the connection portion, and the second holes are arranged in a regular array on the connection portion; the size and shape of the second hole can be the same as the size and shape of the hole located in the second heat-conducting layer. In still other embodiments, the connection portion includes an equally divided first part and a second part, the first part of the connection portion is connected to the first heat-conducting layer, the second part of the connection portion is connected to the second heat-conducting layer, the first part is a continuous film layer on the entire surface, and the second part of the connection portion is provided with a third hole penetrating the connection portion, and the third holes are arranged in a regular array on the second part of the connection portion; the size and shape of the third hole can be the same as the size and shape of the hole located in the second heat-conducting layer.

[0040] In some embodiments, the connecting portion 112 serves as a bending portion to connect the first thermal conductive layer 111 and the second thermal conductive layer 113. In the direction in which the second thermal conductive layer 113 points to the first thermal conductive layer 111, the thickness of the connecting portion 112 is greater than the thickness of the first thermal conductive layer 111. The thickness of the connecting portion 112 is greater than the thickness of the second thermal conductive layer 113, which is equivalent to thickening the connecting portion 112. This not only ensures that the connecting portion 112 can withstand multiple bendings without breaking, but also increases the area of ​​the connecting portion 112, that is, the effective area of ​​heat transfer or heat exchange increases, which is beneficial to improving the heat dissipation effect.

[0041] In other embodiments, in the direction in which the second heat-conducting layer points to the first heat-conducting layer, the thickness of the connecting portion is equal to the thickness of the first heat-conducting layer; the thickness of the connecting portion is equal to the thickness of the second heat-conducting layer, that is, only one process step is required for the heat-conducting portion, that is, the second heat-conducting layer is grooved to form a through hole, thereby simplifying the overall process flow.

[0042] In some embodiments, the first heat dissipation layer 12 is used to reduce the poor heat transfer caused by the loose direct contact between the first heat conductive layer 111 and the screen 21 of the electronic device, establish an effective heat conduction channel between the first heat conductive layer 111 and the screen 21 of the electronic device, reduce the heat transfer resistance, and improve the heat dissipation performance. The material of the first heat dissipation layer 12 can be thermally conductive foam; the thickness of the first heat dissipation layer 12 ranges from 0.1mm to 0.5mm, specifically 0.1mm, 0.2mm, 0.3mm, 0.4mm or 0.5mm. In other embodiments, the material of the first heat dissipation layer can be thermally conductive silicone, thermally conductive pads, thermally conductive gels or other thermally conductive interface materials with high specific heat capacity and low thermal resistance.

[0043] In addition, in some embodiments, a thermally conductive filler with good thermal conductivity is added into the first heat dissipation layer 12, which may specifically be carbon nanotubes, graphite, nano-aluminum nitride, micron aluminum powder or boron nitride, which is beneficial to further improve the poor heat dissipation performance.

[0044] In some embodiments, the proportion of the thermally conductive filler dispersed in the first heat dissipation layer 12 can be 10%, 15%, 20% or 30%. The present application does not limit the specific proportion of the thermally conductive filler. It is only necessary that the filling amount of the thermally conductive filler reaches a certain critical value to ensure that a network or chain-like shape is formed in the system, that is, a thermally conductive network chain.

[0045] In some embodiments, the size of the thermally conductive filler may be nanometer-scale or micrometer-scale; the thermally conductive filler may be in the shape of particles, flakes, spheres, fibers, etc.; the present application does not limit the specific size and shape of the thermally conductive filler.

[0046] In some embodiments, the second heat dissipation layer 13 is used to reduce the poor heat transfer caused by the loose direct contact between the second heat conductive layer 113 and the processor 22 of the electronic device, establish an effective heat conduction channel between the second heat conductive layer 113 and the processor 22 of the electronic device, reduce the heat transfer resistance, and improve the heat dissipation performance. The material of the second heat dissipation layer 13 can be the same as that of the first heat dissipation layer 12, which can avoid the poor heat dissipation effect caused by the difference in thermal diffusion coefficients of different heat-conducting media; the thickness of the second heat dissipation layer 13 can be the same as that of the first heat dissipation layer 12. In other embodiments, the material of the second heat dissipation layer 13 can be different from that of the first heat dissipation layer 12; the thickness of the second heat dissipation layer 13 can be different from that of the first heat dissipation layer 12.

[0047] In some embodiments, the thermally conductive filler added to the second heat dissipation layer 13 may be the same as the thermally conductive filler added to the first heat dissipation layer 12, so as to avoid the poor heat dissipation effect caused by the difference in thermal diffusion coefficients of different heat-conducting media. In other embodiments, the thermally conductive filler added to the second heat dissipation layer 13 may be different from the thermally conductive filler added to the first heat dissipation layer 12.

[0048] In some embodiments, the heat dissipation structure further includes a third heat dissipation layer, which is located on a side of the second heat conductive layer 113 away from the second heat dissipation layer 13, and the third heat dissipation layer is located between the rear shell 23 and the second heat conductive layer 113. The third heat dissipation layer is used to reduce the poor heat transfer caused by the loose direct contact between the second heat conductive layer 113 and the rear shell 23 of the electronic device, establish an effective heat conduction channel between the second heat conductive layer 113 and the rear shell 23 of the electronic device, reduce the heat transfer resistance, and improve the heat dissipation performance.

[0049] In some embodiments, the third heat dissipation layer is a thermally conductive coating, so that the second thermally conductive layer 113 is located inside the third heat dissipation layer, that is, the third heat dissipation layer wraps the second thermally conductive layer 113, which is equivalent to increasing the effective area of ​​heat exchange, which is beneficial to improving the heat dissipation effect.

[0050] In other embodiments, the third heat dissipation layer is a graphite film, which can smoothly adhere to any flat and curved surface, thereby reducing the fine gap between the second heat-conducting layer 113 and the back shell 23 of the electronic device, reducing the heat transfer resistance, and improving the heat dissipation performance. In some other embodiments, the material of the third heat dissipation layer can be the same as that of the first heat dissipation layer; the thermal conductive filler added to the third heat dissipation layer can be the same as that added to the first heat dissipation layer; the thickness of the third heat dissipation layer can be the same as that of the first heat dissipation layer, which can avoid the poor heat dissipation effect caused by the difference in thermal diffusion coefficients of different heat-conducting media. In some other embodiments, the material of the third heat dissipation layer can be different from that of the first heat dissipation layer; the thickness of the third heat dissipation layer can be different from that of the first heat dissipation layer; the thermal conductive filler added to the third heat dissipation layer can be different from that added to the first heat dissipation layer.

[0051] In some embodiments, the heat dissipation structure further includes: a first adhesive layer and a second adhesive layer, the first adhesive layer is located between the first thermal conductive layer 111 and the first heat dissipation layer 12 , and the second adhesive layer is located between the second thermal conductive layer 113 and the second heat dissipation layer 13 .

[0052] In some embodiments, a thermally conductive filler with good thermal conductivity is added to the first adhesive layer to further improve the problem of poor heat dissipation. Thermally conductive fillers with good thermal conductivity include metal fillers, oxide fillers, nitride fillers, carbide fillers or inorganic non-metal fillers. The metal filler can be silver, copper, aluminum, magnesium, nickel, etc.; the oxide filler can be aluminum oxide or magnesium oxide; the nitride filler can be aluminum nitride, boron nitride, silicon nitride, etc.; the carbide filler can be silicon carbide and boron carbide; the inorganic non-metal filler can be carbon nanotubes, graphite or carbon black.

[0053] In some embodiments, the thermally conductive filler added to the second adhesive layer may be the same as the thermally conductive filler added to the first adhesive layer, so as to avoid the poor heat dissipation effect caused by the difference in thermal diffusion coefficients of different thermally conductive media. In other embodiments, the thermally conductive filler added to the second adhesive layer may be different from the thermally conductive filler added to the first adhesive layer.

[0054] In some embodiments, the heat dissipation structure further includes a third adhesive layer and a fourth adhesive layer, the third adhesive layer is located between the first heat dissipation layer 12 and the screen 21 of the electronic device, and the fourth adhesive layer is located between the second heat conductive layer 113 and the rear shell 23 of the electronic device.

[0055] In some embodiments, the thermally conductive filler added to the third adhesive layer may be the same as the thermally conductive filler added to the first adhesive layer. In other embodiments, the thermally conductive filler added to the third adhesive layer may be different from the thermally conductive filler added to the first adhesive layer.

[0056] In some embodiments, the thermally conductive filler added to the fourth adhesive layer may be the same as the thermally conductive filler added to the first adhesive layer. In other embodiments, the thermally conductive filler added to the fourth adhesive layer may be different from the thermally conductive filler added to the first adhesive layer.

[0057] In the technical solution provided in the embodiment of the present application, the connecting portion 112 connects the first heat-conducting layer 111 and the second heat-conducting layer 113, which can ensure that the heat generated by the processor 22 and the screen 21 is directly transferred to the back shell 23 of the electronic device through the heat-conducting portion 11, thereby avoiding the poor heat dissipation effect caused by the heat generated by the processor 22 and the screen 21 being transferred from the screen 21 to the back shell 23 of the electronic device layer by layer, which is beneficial to heat conduction and cooling of the screen 21 and the processor 22.

[0058] In addition, the heat conducting part 11 is an integrally formed structure. On the one hand, when the heat generated by the processor 22 and the screen 21 is transferred to the mobile phone rear shell 23 through the inside of the heat conducting part 11, the heat conducting part 11 is an integrally formed structure, which effectively avoids the poor heat dissipation effect caused by the difference in thermal diffusion coefficients of different heat conducting media; on the other hand, the heat conducting part 11 is an integrally formed structure, which can ensure that there is no tiny gap between the first heat conducting layer 111 and the connecting part 112 and between the second heat conducting layer 113 and the connecting part 112, thereby increasing the contact area, effectively avoiding the generation of heat transfer resistance between the first heat conducting layer 111 and the connecting part 112 and between the second heat conducting layer 113 and the connecting part 112, which is conducive to improving the problem of poor heat dissipation effect.

[0059] Correspondingly, an embodiment of the present application also provides an electronic device, including: a screen 21, a back shell 23 and a processor 22; in the heat dissipation structure provided in the above embodiment, the second heat-conducting layer 113 is attached to the back shell 23 of the electronic device, the first heat dissipation layer 12 is located on the side of the first heat-conducting layer 111 away from the second heat-conducting layer 113, and the first heat dissipation layer 12 is located between the screen 21 of the electronic device and the first heat-conducting layer 111, the second heat dissipation layer 13 is located on the side of the second heat-conducting layer 113 facing the first heat-conducting layer 111, and the second heat dissipation layer 13 is located between the processor 22 of the electronic device and the second heat-conducting layer 113.

[0060] The electronic devices of the present application include but are not limited to mobile phones, computers, laptops, tablet computers, televisions or smart bracelets.

[0061] In some embodiments, the screen 21 is an OLED display screen, and the material of the rear shell 23 is tempered glass. In other embodiments, the screen may be a light emitting diode (LED) display screen, and the material of the rear shell may be a metal alloy or plastic.

[0062] In some embodiments, the first heat-conducting layer 111 is opposite to the second heat-conducting layer 113. The screen 21 is located on the side of the first heat-dissipating layer 12 away from the first heat-conducting layer 111; the second heat-conducting layer 113 is attached to the rear shell 23, and the connecting portion 112 is attached to the rear shell 23; the processor 22 is located between the first heat-conducting layer 111 and the second heat-dissipating layer 13.

[0063] The following combination Figure 1 , which provides a more detailed explanation of the assembly process of electronic equipment and the heat dissipation principle.

[0064] refer to Figure 1 One side of the first heat dissipation layer 12 contacts the screen 21 through the third adhesive layer, and the other side of the second heat dissipation layer 13 contacts the first thermal conductive layer 111 through the first adhesive layer; one side of the second thermal conductive layer 113 contacts the second heat dissipation layer 13 through the second adhesive layer, and the other side of the second thermal conductive layer 113 contacts the rear shell 23 through the fourth adhesive layer. Therefore, the rear shell 23 of the electronic device is opened by flipping along the side of the electronic device, and in the process of opening the rear shell 23, the second thermal conductive layer 113 and the second heat dissipation layer 13 are flipped together at the same time.

[0065] The first heat dissipation layer 12 transfers the heat generated by the screen 21 to the first heat-conducting layer 111. Part of the heat generated by the processor 22 is absorbed by the first heat-conducting layer 111, and the other part is transferred by the second heat dissipation layer 13 to the second heat-conducting layer 113. The first heat-conducting layer 111 transfers the absorbed heat to the second heat-conducting layer 113 through the connecting portion 112, and finally the second heat-conducting layer 113 transfers the heat to the rear housing 23 for heat dissipation.

[0066] In the above technical solution, the heat generated by the screen 21 and the heat generated by the processor 22 are transmitted through the inside of the heat conducting part 11. The heat conducting part 11 has a small thermal resistance, which is beneficial to quickly conduct the heat generated by the screen 21 and the heat generated by the processor 22, and is beneficial to improving the thermal conductivity and heat dissipation effects, thereby helping to increase the service life of the screen 21 and the processor 22, so it is highly practical.

[0067] Those skilled in the art can understand that the above-mentioned embodiments are specific examples for implementing the present application, and in practical applications, various changes can be made to them in form and detail without departing from the spirit and scope of the present application. Any person skilled in the art can make their own changes and modifications without departing from the spirit and scope of the present application, so the scope of protection of the present application shall be based on the scope defined in the claims.

Claims

1. An electronic device, characterized in that: include: Screen, back cover and processor; The heat dissipation structure comprises: a heat conducting portion, the heat conducting portion comprises a first heat conducting layer, a connecting portion and a second heat conducting layer, the connecting portion connects the first heat conducting layer and the second heat conducting layer, and the connecting portion is bendable; the second heat conducting layer is attached to the rear shell; a first heat dissipation layer, the first heat dissipation layer being located on one side of the first heat conductive layer; the first heat dissipation layer being located on a side of the first heat conductive layer away from the second heat conductive layer, and the first heat dissipation layer being located between the screen and the first heat conductive layer; A second heat dissipation layer, the second heat dissipation layer is located on a side of the second heat-conducting layer facing the first heat-conducting layer, the second heat dissipation layer is located between the processor and the second heat-conducting layer, and the second heat dissipation layer and the first heat dissipation layer are respectively located on opposite sides of the connecting portion; wherein the second heat dissipation layer is also located between the connecting portion and the processor of the electronic device.

2. The electronic device according to claim 1, characterized in that: In a direction from the second heat-conducting layer to the first heat-conducting layer, the thickness of the connecting portion is greater than the thickness of the first heat-conducting layer; and the thickness of the connecting portion is greater than the thickness of the second heat-conducting layer.

3. The electronic device according to claim 1, characterized in that: In a direction in which the second heat-conducting layer points toward the first heat-conducting layer, a thickness of the first heat-conducting layer is greater than or equal to a thickness of the second heat-conducting layer.

4. The electronic device according to claim 1 or 3, characterized in that: The thickness of the first heat-conducting layer is in the range of 10um to 100um.

5. The electronic device according to claim 1, characterized in that: The second heat-conducting layer is provided with a hole penetrating through the second heat-conducting layer.

6. The electronic device according to claim 5, characterized in that: The porosity of the second heat-conducting layer is in the range of 25% to 45%.

7. The electronic device according to claim 5, characterized in that: The holes are arranged in an array on the second heat-conducting layer; the maximum physical size of the holes is ≤5mm.

8. The electronic device according to claim 1, characterized in that: Also includes: A first adhesive layer and a second adhesive layer, wherein the first adhesive layer is located between the first heat-conducting layer and the first heat-dissipating layer, and the second adhesive layer is located between the second heat-conducting layer and the second heat-dissipating layer.

9. The electronic device according to claim 1, characterized in that: Also includes: A third heat dissipation layer is located on a side of the second heat conducting layer away from the second heat dissipation layer.

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