Micromechanical component and method for manufacturing a micromechanical component

Abstract

The invention relates to a micromechanical component for a sensor device, having a first seismic mass (30a), wherein the first seismic mass, which is displaceable from its first rest position in a first direction (44) over a first limit path along a first axis, mechanically contacts a first stop structure, and having a second seismic mass (30b), which is displaceable from its second rest position at least along a second axis, wherein the second axis is parallel to or lies on the first axis, wherein a second stop surface (50b) of the second seismic mass, which is displaceable from its second rest position in a second direction (46) which is oriented opposite to the first direction along the second axis, mechanically contacts a first stop surface (50a) of the first seismic mass which is attached to the first stop structure. The invention also relates to a method for producing a micromechanical component for a sensor device.

Description

TECHNICAL FIELD

[0001] The present invention relates to a micromechanical component for a sensor device. The present invention also relates to a method for manufacturing a micromechanical component for a sensor device. BACKGROUND

[0002] Fig. 1 shows a schematic view of a conventional acceleration sensor, which is known as internal prior art to the applicant.

[0003] The conventional acceleration sensor schematically shown in Fig. 1 has two seismic masses 10, which are each connected to a holder 14 by two spring arrangements 12 each, such that the two seismic masses 10 can be placed in an oscillatory motion oriented along an axis 16. The two seismic masses 10 are arranged "in series" such that the axis 16 intersects each of the two seismic masses 10 in the middle. However, the spacing d between the two seismic masses 10 is chosen so large that, even in the case of an oscillatory motion of the two seismic masses along the axis 16, no mechanical contact between the two seismic masses 10 occurs.

[0004] On the seismic masses 10, actuator electrodes 18 are constructed, which are assigned stator electrodes 20 fixed on the holder 14. The influence of an acceleration having an acceleration component oriented along the axis 16 not equal to zero on the conventional acceleration sensor of Fig. 1 leads to a deviation of the two seismic masses 10 from their rest position shown in Fig. 1, whereby the respective intermediate spacing between each of the actuator electrodes 18 and at least one respectively assigned stator electrode 20 changes. In the case of the use of printed conductors 22 constructed on the holder 14, the change in the respective intermediate spacing between the actuator electrodes 18 and the assigned stator electrodes 20 can be detected for proving or measuring the acceleration component oriented along the axis 16.

[0005] In addition, the conventional acceleration sensor of Fig. 1 has for each of the two seismic masses a first stop structure 24 and a second stop structure 26 each. The first stop structure 24 is fixed on the holder 14 such that the respectively assigned seismic mass 10 mechanically contacts the assigned first stop structure 24 when it is displaced (Verstellung) along the axis 16 in a first direction from its rest position by a first limit path. Correspondingly, the second stop structure 26 is also fixed on the holder 14 such that the respectively assigned seismic mass 10 mechanically contacts the assigned second stop structure 26 when it is displaced along the axis 16 in a second direction oriented opposite to the first direction from its rest position by a second limit path. SUMMARY

[0006] The invention proposes a micromechanical component for a sensor device, having a first seismic mass which is connected to a holder of the micromechanical component by means of at least one first spring device in such a way that the first seismic mass can be displaced relative to the holder at least along a first axis from its first rest position in the event of deformation of the at least one first spring device, wherein the first seismic mass, which is displaced along the first axis in a first direction by a first limiting distance from its first rest position, mechanically contacts a first stop structure of the holder, and having a second seismic mass which is connected to the holder by means of at least one second spring device in such a way that the second seismic mass can be displaced relative to the holder at least along a second axis from its second rest position in the event of deformation of the at least one second spring device, wherein the second axis is parallel to or lies on the first axis, wherein the first seismic mass and the second seismic mass are arranged relative to one another in such a way that a second stop surface of the second seismic mass, which is displaced along the second axis in a second direction which is oriented oppositely to the first direction from its second rest position, mechanically contacts a first stop surface of the first seismic mass which is attached on the first stop structure.

[0007] The invention also relates to a manufacturing method for a micromechanical component of a sensor device, having the following steps: connecting a first seismic mass to a holder of the micromechanical component by means of at least one first spring device in such a way that the first seismic mass can be displaced relative to the holder at least along a first axis from its first rest position in the event of deformation of the at least one first spring device; connecting a second seismic mass to the holder by means of at least one second spring device in such a way that the second seismic mass can be displaced relative to the holder at least along a second axis from its second rest position in the event of deformation of the at least one second spring device, wherein the second axis is parallel to or lies on the first axis; and configuring a first stop structure of the holder in such a way that the first seismic mass, which is displaced along the first axis in a first direction by a first limiting distance from its first rest position, mechanically contacts the first stop structure of the holder; wherein the first seismic mass and the second seismic mass are arranged relative to one another in such a way that a second stop surface of the second seismic mass, which is displaced along the second axis in a second direction which is oriented oppositely to the first direction from its second rest position, mechanically contacts a first stop surface of the first seismic mass which is attached on the first stop structure.

[0008] Advantages of the invention

[0009] The application proposes the advantageous possibility of preventing at least the first seismic mass of a micromechanical component, which is respectively equipped with two seismic masses, from undesirably adhering or sticking (English: stiction) to a first stop structure of a holder of the micromechanical component, which is at least one assigned to the first seismic mass. The application thus contributes to increasing the mechanical robustness or the overload resistance (Überlastfestigkeit) of such micromechanical components. The micromechanical components realized by means of the application can thus also be subjected to load characteristics with increased robustness requirements without (significantly) impairing the measurement accuracy or the measurement reliability of a sensor device using the respective micromechanical component. For example, a sensor device equipped with a micromechanical component according to the application can advantageously be used as an inertial sensor in a stylus for a tablet computer or a smartphone, although in such use the micromechanical component according to the application occasionally is subjected to hard impacts.

[0010] Furthermore, the micromechanical component according to the application can also be configured relatively small, while the miniaturization of the micromechanical component according to the application does not (significantly) impair its robustness with respect to impact loads. By means of the miniaturization of the micromechanical component according to the application, manufacturing costs can be saved, wherein the relatively good mechanical robustness / overload resistance of the miniaturized micromechanical component also leads to savings in repair or replacement costs.

[0011] In an advantageous embodiment of the micromechanical component, the first seismic mass, which is displaced from its first rest position by a second limit distance in the second direction along the first axis, mechanically contacts the second stop structure of the holder, wherein the first seismic mass and the second seismic mass are arranged relative to one another such that the fourth stop surface of the second seismic mass, which is displaced from its second rest position in the first direction along the second axis, mechanically contacts the third stop surface of the first seismic mass adhering to the second stop structure. As becomes clear on the basis of the following description, by means of the mechanical contact of the fourth stop surface with the third stop surface, an impulse can be transmitted from the second seismic mass to the first seismic mass adhering to the second stop structure such that a detachment of the first seismic mass from the second stop structure is achieved.

[0012] Preferably, the first oscillating mass and the second oscillating mass are arranged relative to one another such that a first spacing of the first stop face of the first oscillating mass in its first rest position to the second stop face of the second oscillating mass in its second rest position is greater than the first limit travel and less than or equal to twice the first limit travel, and / or a second spacing of the third stop face of the first oscillating mass in its first rest position to the fourth stop face of the second oscillating mass in its second rest position is greater than the second limit travel and less than or equal to twice the second limit travel. By virtue of this size relationship between the first spacing and the first limit travel or the second spacing and the second limit travel, it can be reliably ensured that mechanical contact of the first stop face with the second stop face or of the third stop face with the fourth stop face always occurs when the first oscillating mass undesirably adheres / sticks to the first stop structure or to the second stop structure.

[0013] In a further advantageous embodiment of the micromechanical component, the first stop face is configured on a first stop structure of the first oscillating mass, the second stop face is configured on a second stop structure of the second oscillating mass, the third stop face is configured on a third stop structure of the first oscillating mass, and / or the fourth stop face is configured on a fourth stop structure of the second oscillating mass. As becomes clear from the following figures, the first stop structure, the second stop structure, the third stop structure and / or the fourth stop structure can be configured with relatively great design freedom.

[0014] For example, the first stop structure of the first oscillating mass, the second stop structure of the second oscillating mass, the third stop structure of the first oscillating mass and / or the fourth stop structure of the second oscillating mass can each be configured as a spring-loaded stop structure. In this case, mechanical contact leads to a slight deflection of the respective stop structure and thus to an additional restoring force. At the same time, by virtue of the flexibility of the respective stop structure, the stop face configured thereon is less damaged. Alternatively, however, the first stop structure of the first oscillating mass, the second stop structure of the second oscillating mass, the third stop structure of the first oscillating mass and / or the fourth stop structure of the second oscillating mass can each also be configured as a fixed stop structure.

[0015] In a particularly advantageous embodiment of the micromechanical component, the first stop structure of the first seismic mass at least partially projects into a first lateral recess of the second seismic mass, which first lateral recess is open towards the first axis, the second stop structure of the second seismic mass at least partially projects into a second lateral recess of the first seismic mass, which second lateral recess is open towards the second axis, the third stop structure of the first seismic mass at least partially projects into a third lateral recess of the second seismic mass, which third lateral recess is open towards the first axis, and / or the fourth stop structure of the second seismic mass at least partially projects into a fourth lateral recess of the first seismic mass, which fourth lateral recess is open towards the second axis. Thus, a large degree of design freedom is achieved in optimizing the position of the stop structures.

[0016] Furthermore, the implementation of a corresponding manufacturing method for the micromechanical component of the sensor device also achieves the aforementioned advantages, wherein the manufacturing method can be extended in accordance with the aforementioned embodiments of the micromechanical component. BRIEF DESCRIPTION OF DRAWINGS

[0017] Further features and advantages of the present application will become apparent from the following detailed description, taken in combination with the pertaining drawings, wherein:

[0018] Fig. 1 shows a schematic diagram of a conventional acceleration sensor;

[0019] Figure 2a and Figure 2b Fig. 2 shows a schematic diagram of a first embodiment of a micromechanical component;

[0020] Figure 3a and Figure 3b Fig. 3 shows a schematic diagram of a second embodiment of a micromechanical component;

[0021] Figure 4 Fig. 4 shows a schematic diagram of a third embodiment of a micromechanical component; and

[0022] Figure 5 Fig. 5 shows a flow diagram for illustrating an embodiment of a manufacturing method for a micromechanical component. DETAILED DESCRIPTION

[0023] Figure 2a and Figure 2b Fig. 2 shows a schematic diagram of a first embodiment of a micromechanical component.

[0024] In Figure 2aThe micromechanical component shown only schematically has a first seismic mass 30a which is connected to a holder 34 of the micromechanical component by means of at least one first spring device 32a in such a way that the first seismic mass 30a can be displaced relative to the holder 34 at least along a first axis 36a from its first rest position in the event of a deformation of the at least one first spring device 32a. Furthermore, the micromechanical component has a second seismic mass 30b which is connected to the holder 34 by means of at least one second spring device 32b in such a way that the second seismic mass 30b can be displaced relative to the holder 34 at least along a second axis 36b from its second rest position in the event of a deformation of the at least one second spring device 32b. Exemplarily, in the micromechanical component shown in Figure 2a and Figure 2b the second axis 36b lies on the first axis 36a. The two seismic masses 30a and 30b are thus arranged "in succession" along the first / second axes 36a and 36b. Alternatively, the second axis 36b can also be parallel to the first axis 36a.

[0025] In the example shown in Figure 2a and Figure 2b the holder 34 is shown only schematically. For example, two support columns 38 for each seismic mass 30a and 30b and a plurality of stator electrodes 40 for each seismic mass 30a and 30b are shown. The support columns 38 and the stator electrodes 40 are respectively configured as fixed / non-displaceable components of the holder 34. Each of the seismic masses 30a and 30b is connected to the two support columns 38 which belong to it by means of one first / second spring device 32a or 32b respectively. Furthermore, each seismic mass 30a and 30b is respectively configured with an actuator electrode 42a or 42b which can jointly act with the stator electrodes 40 which belong to it in the manner described below. However, it is expressly pointed out here that the configuration of the holder 34 with the support columns 38 and / or the stator electrodes 40 is to be interpreted only exemplarily.

[0026] The first seismic mass 30a can be displaced along the first axis 36a not only in a first direction 44 but also in a second direction 46 which is oriented oppositely to the first direction 44 from its first rest position shown in Figure 2a The second seismic mass 30b can also be displaced along the second axis 36b not only in a third direction 48 but also in a fourth direction 50 which is oriented oppositely to the third direction 48 from its second rest position shown in Figure 2aThe second resting position shown is displaced along the second axis 36b not only in the first direction 44 but also in the second direction 46. The retainer 34 also includes a first stop structure 48a for at least the first vibrating mass 30a, which is arranged relative to the first vibrating mass 30a such that the first vibrating mass 30a, having traveled a first limit distance s1 along the first axis 36a from its first resting position in the first direction 44, mechanically contacts the first stop structure 48a. The displacement movement of the first vibrating mass 30a from its first resting position along the first axis 36a in the first direction 44 is thus (generally) limited to the first limit distance s1 by means of the first stop structure 48a. As an advantageous supplement, the retainer 34 also additionally has a second stop structure 48b for the second vibrating mass 30b, which is arranged relative to the second vibrating mass 30b such that the second vibrating mass 30b, having traveled a first limit distance s1 along the second axis 36b from its second resting position in the second direction 46, mechanically contacts the second stop structure 48b. In this respect, the displacement movement of the second vibrating mass 30b from its second rest position along the second axis 36b in the second direction 46 can also be (usually) limited to the first limit distance s1 by means of the second stop structure 48b. The first stop structure 48a and / or the second stop structure 48b are preferably arranged or constructed on the retainer 14 such that the first stop structure 48a and / or the second stop structure 48b can only be displaced by means of the damaged retainer 14.

[0027] Figure 2b Show Figure 2a A magnified partial view. (As shown in...) Figure 2b As can be seen, the first vibrating mass 30a and the second vibrating mass 30b are arranged relative to each other such that the first stop surface 50a of the first vibrating mass 30a and the second stop surface 50b of the second vibrating mass 30b can mechanically contact each other. Specifically, the vibrating masses 30a and 30b are arranged and oriented relative to each other such that the second stop surface 50b of the second vibrating mass 30b, which has shifted from its second rest position along the second axis 36b in the second direction 46, mechanically contacts the first stop surface 50a of the first vibrating mass 30a attached to its first stop structure 48a. By means of the mechanical contact between the first stop surface 50a and the second stop surface 50b, impulse transmission from the second vibrating mass 30b to the first vibrating mass 30a can be achieved such that the first vibrating mass 30a attached to its first stop structure 48a is again detached / loosened from the first stop structure 48a. Therefore, undesirable adhesion or bonding of the first vibrating mass 30a to its first stop structure 48a can be quickly eliminated again. Therefore, in Figure 2bThe advantageous arrangement of the seismic masses 30a and 30b relative to each other improves the mechanical robustness or overload resistance of the micromechanical component, as is schematically illustrated in Fig. 1.

[0028] Furthermore, due to the advantageous arrangement of the seismic masses 30a and 30b relative to each other, the first stop surface 50a of the first seismic mass 30a, which is displaced in the first direction 44 along the first axis 36a from its first rest position, mechanically contacts the second stop surface 50b of the second seismic mass 30b, which is attached to its second stop structure 48b, such that an impulse transfer from the first seismic mass 30a to the second seismic mass 30b takes place. Thus, an undesired attachment or sticking of the second seismic mass 30b on its second stop structure 48b can also be quickly eliminated again. This contributes to an additional improvement of the mechanical robustness or overload resistance of the micromechanical component. Even in the event of a mechanical load, i.e. a non-static acceleration, when one of the seismic masses 30a or 30b comes into mechanical contact with the first / second stop structure 48a or 48b assigned thereto, the sticking state of the respective seismic mass 30a or 30b on the first / second stop structure 48a or 48b assigned thereto is quickly cancelled again, whereby the micromechanical component is converted again into its full functional capability state. Since it is extremely unlikely that both seismic masses 30a and 30b are attached to their assigned first / second stop structure 48a and 48b at the same time when a dynamic load occurs, in the sticking state of a seismic mass 30a or 30b, the other seismic mass 30a or 30b is always still able to achieve the detachment / release of the attached seismic mass 30a or 30b.

[0029] For example, the advantageous arrangement of the first seismic mass 30a relative to the second seismic mass 30b is achieved when the first distance d1 of the first stop surface 50a of the first seismic mass 30a, which is located in its first rest position, to the second stop surface 50b of the second seismic mass 30b, which is located in its second rest position, is greater than the first limit path s1 and less than or equal to twice the first limit path s1. This guarantees a favorable displaceability of both seismic masses 30a and 30b during the operation of the micromechanical component, wherein mechanical contact of the seismic masses 30a and 30b on their stop surfaces 50a and 50b usually only occurs when one of the two seismic masses 30a and 30b is attached to the stop structure 48a or 48b assigned thereto.

[0030] In Figure 2a and Figure 2bIn the micromechanical component according to the application, the first stop surface 50a is configured on a first stop structure 52a of the first oscillation mass 30a and the second stop surface 50b is configured on a second stop structure 52b of the second oscillation mass 30b. The stop structures 52a and 52b can in particular be configured as nub stoppers or nub stop structures. Furthermore, the first oscillation mass 30a and the second oscillation mass 30b can also be configured with a plurality of first / second stop surfaces 50a and 50b or with a plurality of first / second stop structures 52a and 52b.

[0031] As an optional extension, Figure 2a and Figure 2b The micromechanical component according to the application also has a third stop structure 48c which is arranged / configured on the holder 34 such that the first oscillation mass 30a which is displaced by a second limit distance s2 in the second direction 46 from its first rest position along the first axis 36a mechanically contacts the third stop structure 48c of the holder 34. Correspondingly, a fourth stop structure 48d is arranged / configured on the holder 34 such that the second oscillation mass 30b which is displaced by a second limit distance s2 in the first direction 44 from its second rest position along the second axis 36b mechanically contacts the fourth stop structure 48c. The displacement movement of the first oscillation mass 30a in the second direction 46 along the first axis 36a from its first rest position and / or the displacement movement of the second oscillation mass 30b in the first direction 44 along the second axis 36b from its second rest position is thus (generally) limited to the second limit distance s2 by means of the third / fourth stop structure 48c and 48d. The second limit distance s2 can be equal to or different from the first limit distance s1. The third stop structure 48c and / or the fourth stop structure 48d is preferably arranged or configured on the holder 14 such that the third stop structure 48c and / or the fourth stop structure 48d can only be displaced by damaging the holder 14. Exemplarily only, the third stop structure 48c and / or the fourth stop structure 48d is arranged / configured on the holder 14 such that the third stop structure 48c and / or the fourth stop structure 48d is arranged / configured on the holder 14 such that the third stop structure 48c and / or the fourth stop structure 48d can only be displaced by damaging the holder 14. Figure 2a and Figure 2b In the micromechanical component according to the application, the stop structures 48a to 48d are configured on the support column.

[0032] Figure 3a and Figure 3b A schematic representation of a second embodiment of a micromechanical component is shown.

[0033] As an extension of the aforementioned embodiments, in Figure 3a and Figure 3bIn the micromechanical component, the third stop surface 50c of the first seismic mass 30a and the fourth stop surface 50d of the second seismic mass 30b can also be in mechanical contact with each other. In particular, the first seismic mass 30a and the second seismic mass 30b are arranged relative to each other and the third stop surface 50c of the first seismic mass 30a and the fourth stop surface 50d of the second seismic mass 30b are configured in such a way that, from its second rest position, the fourth stop surface 50d of the second seismic mass 30b, which is displaced in the first direction 44 along the second axis 36b, mechanically contacts the third stop surface 50c of the first seismic mass 30a, which is attached to the third stop structure 48c. By means of the mechanical contact of the fourth stop surface 50d of the second seismic mass 30b with the third stop surface 50c of the first seismic mass 30a, it is possible to transfer the momentum from the second seismic mass 30b to the first seismic mass 30a, which is attached to the third stop structure 48c, in such a way that detachment of the first seismic mass 30a from the third stop structure 48c is achieved. Advantageously, in addition, the third stop surface of the first seismic mass 30a, which is displaced in the second direction 46 along the first axis 36a from its first rest position, can mechanically touch the fourth stop surface 50d of the second seismic mass 30b, which is attached to its fourth stop structure 48d, in such a way that, by means of the transfer of momentum from the first seismic mass 30a to the second seismic mass 30b, it is also possible to quickly eliminate the undesired attachment or sticking of the second seismic mass 30b to its fourth stop structure 48d again. The configuration of the third stop surface 50c of the first seismic mass 30a and the fourth stop surface 50d of the second seismic mass 30b thus achieves an additional improvement in the mechanical robustness or overload resistance of the micromechanical component.

[0034] Preferably, the second distance d2 of the third stop surface 50c of the first seismic mass 30a, which is located in its first rest position, to the fourth stop surface 50d of the second seismic mass 30b, which is located in its second rest position, is greater than the second limit distance s2 and less than or equal to twice the second limit distance S2. This also ensures advantageous displaceability of the two seismic masses 30a and 30b during operation of the micromechanical component, so that mechanical contact of the seismic masses 30a and 30b on their stop surfaces 50c and 50d generally only occurs when one of the two seismic masses 30a and 30b is attached to the stop structure 48c or 48d assigned to it.

[0035] Preferably, the third stop surface 50c is configured on a third stop structure 52c of the first seismic mass 30a and the fourth stop surface 50d is configured on a fourth stop structure 52d of the second seismic mass 30b. In this case, the third stop structure 52c and the fourth stop structure 52d can be shaped such that the third stop structure 52d of the first seismic mass 30a at least partially extends into a lateral recess 54c of the second seismic mass 30b, which opens towards the first axis 36a, and that the fourth stop structure 52d of the second seismic mass 30b at least partially extends into a lateral recess 54d of the first seismic mass 30a, which opens towards the second axis 36b. As can be seen in Figure 3b , the orientation of the third stop surface 50c of the first seismic mass 30a towards the fourth stop surface 50d of the second seismic mass 30b can be oriented opposite to the orientation of the first stop surface 50a of the first seismic mass 30a towards the second stop surface 50b of the second seismic mass 30b. This can also be interpreted as an "interlocking configuration" of the third stop structure 52c and the fourth stop structure 52d. Thus, a movement of the first seismic mass 30a away from the second seismic mass 30b can also enable a disengagement of the second seismic mass 30b from the fourth stop structure 48d, and a movement of the second seismic mass 30b away from the first seismic mass 30a can enable a disengagement of the first seismic mass 30a from the third stop structure 48c.

[0036] The stop structures 52c and 52d can also be configured as a bump stop or a bump stop structure. Furthermore, the first seismic mass 30a and the second seismic mass 30b can also be configured with multiple third / fourth stop surfaces 50c and 50d or with multiple third / fourth stop structures 52c and 52d.

[0037] Further features of the micromechanical component according to Figure 3a and Figure 3b and advantages thereof are described with reference to Figure 2a and 2b .

[0038] Figure 4 A schematic view showing a third embodiment of a micromechanical component.

[0039] In Figure 4In the micromechanical component shown schematically in Fig. 2, the second axis 36b extends parallel to the first axis 36a. The seismic masses 30a and 30b are thus arranged "side by side". Furthermore, the first stop structure 52a of the first seismic mass 30a also at least partially extends into the lateral recess 54a of the second seismic mass 30b, which recess opens towards the first axis 36a, and the second stop structure 52b of the second seismic mass 30b at least partially extends into the lateral recess 54b of the first seismic mass 30a, which recess opens towards the second axis 36b. Thus, in the micromechanical component shown in Fig. 2, the stop structures 52a and 52b are configured as "engaging stop structures". Figure 4 In the micromechanical component shown in Fig. 3, not only the stop structures 52a and 52b are configured as "engaging stop structures", but also the stop structures 52c and 52d are configured as "engaging stop structures".

[0040] With regard to further features of the micromechanical component shown in Fig. 3 and advantages thereof, reference is made to the description of the micromechanical component shown in Fig. 2. Figure 4 Figure 2a Figure 2b Figure 3a Figure 3b

[0041] In all of the above-described micromechanical components, the stop faces 50a to 50d or the stop structures 52a to 52d contribute to an improved robustness of the respective micromechanical component with respect to the situation that the seismic mass 30a or 30b of the micromechanical component undesirably sticks to an adjacent stop structure 48a to 48d. In the above-described micromechanical components, the stop structures 52a to 52d are configured such that these stop structures do not significantly influence the static behavior (offset sensitivity) of the respective micromechanical component or of a sensor device using the respective micromechanical component, nor do they significantly influence the dynamic behavior (frequency, damping) of the respective micromechanical component or of a sensor device using the respective micromechanical component. Furthermore, the above-described micromechanical components have a good compactness, so that the additional space requirement due to the stop structures 52a to 52d is negligible. In Figs. 2 to Figure 4 In Figs. 2 to Figure 4 , the stop structures 52a to 52d are shown as fixed / non-flexible stop structures 52a to 52d. Alternatively, the first stop structure 52a of the first seismic mass 30a, the second stop structure 52b of the second seismic mass 30b, the third stop structure 52c of the first seismic mass 30a and / or the fourth stop structure 52d of the second seismic mass 30b can be configured as resilient stop structures, respectively. It is also pointed out that the configuration as a bump stop of the stop structures 52a to 52d shown in Figs. 2 to

[0042] ​​​​​The above-described micromechanical components have only two seismic masses 30a and 30b. However, it is pointed out that such micromechanical components can also be constructed with at least three such seismic masses, wherein the above-described stop faces 50a to 50d or stop structures 52a to 52d can be constructed on at least three seismic masses thereof.

[0043] Each of the above-described micromechanical components can be used as (at least part of) a sensor device. In particular, such micromechanical components can be used as (at least part of) an inertial sensor for proving or measuring at least one acceleration component oriented along an axis 36a and 36b thereof. A non-zero acceleration component oriented along the axis 36a and 36b causes at least the seismic masses 30a and 30b to deviate from their rest position, whereby the respective intermediate spacing between each of the actuator electrodes 42a and 42b and at least one respectively assigned stator electrode 40 changes. In case of using printed conductors (not depicted) constructed on the holder 34, the change of the respective intermediate spacing can be detected by intercepting the voltage change or by taking the capacitance change, for example by an external evaluation circuit. In particular, here a differential signal can be evaluated, since under a suitable arrangement of the actuator electrodes 42a and 42b and the stator electrodes 40, a deviation of at least the seismic masses 30a and 30b from their rest position along the axis 36a and 36b triggers a positive and negative change of the respective intermediate spacing. As an extension with at least three seismic masses, the micromechanical component can also be used for a two-dimensional acceleration sensor.

[0044] Figure 5 A flow chart for illustrating an embodiment of a manufacturing method for a micromechanical component is shown.

[0045] In method step St1, the first seismic mass is connected to the holder of the micromechanical component by means of at least one first spring device in such a way that the first seismic mass can be displaced relative to the holder at least along a first axis from its first rest position in the event of a deformation of the at least one first spring device. Correspondingly, as method step St2, the second seismic mass is connected to the holder by means of at least one second spring device in such a way that the second seismic mass can be displaced relative to the holder at least along a second axis from its second rest position in the event of a deformation of the at least one second spring device, wherein the second axis is parallel to the first axis or lies on the first axis. In a further method step St3, the first stop structure of the holder is configured in such a way that the first seismic mass, which is displaced by a first limit distance along the first axis in the first direction from its first rest position, mechanically contacts the first stop structure of the holder. However, when carrying out the method steps St1 and St2, the first seismic mass and the second seismic mass are arranged relative to one another in such a way that the second stop surface of the second seismic mass, which is displaced in a second direction oriented opposite the first direction along the second axis from its second rest position, mechanically contacts the first stop surface of the first seismic mass attached to the first stop structure. An undesired attachment or sticking of the first seismic mass on the first stop structure can thus be quickly eliminated.

[0046] As an optional method step St4, the second stop structure of the holder can additionally be configured in such a way that the first seismic mass, which is displaced by a second limit distance along the first axis in the second direction from its first rest position, mechanically contacts the second stop structure of the holder, wherein, when carrying out the method steps St1 and St2, the first seismic mass and the second seismic mass are arranged relative to one another in such a way that the fourth stop surface of the second seismic mass, which is displaced in the first direction along the second axis from its second rest position, mechanically contacts the third stop surface of the first seismic mass attached to the second stop structure. An undesired sticking or attachment of the first seismic mass on the second stop structure can thus also be cancelled again by means of the impulse transfer from the second mass to the first mass.

[0047] The method steps St1 to St3 or the method steps St1 to St4 can be carried out in any order, partially in time overlap or simultaneously. Preferably, the first stop surface is configured on a first stop structure of the first seismic mass, the second stop surface is configured on a second stop structure of the second seismic mass, the third stop surface is configured on a third stop structure of the first seismic mass, and / or the fourth stop surface is configured on a fourth stop structure of the second seismic mass. Since the at least one stop structure can be realized as a design measure which can be easily implemented, its configuration can be easily carried out and can be realized without (significant) additional costs.

[0048] Other features of the micromechanical components described above can also be realized when implementing the manufacturing method described herein. However, these features are not described again herein. With regard to the availability of the products of the manufacturing method described herein, reference is made to the micromechanical components described above.

Claims

1. Micromechanical component for a sensor device, having: a first seismic mass (30a) which is connected to a holder (34) of the micromechanical component by means of at least one first spring arrangement (32a) in such a way that the first seismic mass (30a) can be displaced relative to the holder (34) at least along a first axis (36a) in a first direction (44) or in a second direction (46) which is oriented opposite the first direction (44) from its first rest position with deformation of the at least one first spring arrangement (32a); and a second seismic mass (30b) which is connected to the holder (34) by means of at least one second spring arrangement (32b) in such a way that the second seismic mass (30b) can be displaced relative to the holder (34) at least along a second axis (36b) in the first direction (44) or in the second direction (46) from its second rest position with deformation of the at least one second spring arrangement (32b); and the second axis (36b) is parallel to the first axis (36a) or lies on the first axis (36a); characterized in that the first seismic mass (30a) mechanically contacts a first stop structure (48a) of the holder (34) when it is displaced along the first axis (36) in the first direction (44) by a first limiting path (si) from its first rest position, wherein the first seismic mass (30a) and the second seismic mass (30b) are arranged relative to one another in such a way that, with the first seismic mass (30a) attached to the first stop structure (48a), the second seismic mass (30b) is displaced along the second axis (36b) in the second direction (46) and its second stop face (50b) mechanically contacts a first stop face (50a) of the first seismic mass (30a), wherein the first stop face (50a) and the second stop face (50b) lie opposite one another in the first direction (44) and the second direction (46) and can mechanically contact one another. the first seismic mass (30a) mechanically contacts a second stop structure (48c) of the holder (34) when it is displaced along the first axis (36a) in the second direction (46) by a second limiting path (s2) from its first rest position, wherein the first seismic mass (30a) and the second seismic mass (30b) are arranged relative to one another in such a way that a fourth stop face (50d) of the second seismic mass (30b) which is displaced along the second axis (36b) in the first direction (44) from its second rest position mechanically contacts a third stop face (50c) of the first seismic mass (30a) which is attached to the second stop structure (48c). a second seismic mass (30b) which is connected to the holder (34) by means of at least one second spring device (32b) in such a way that the second seismic mass (30b) can be displaced relative to the holder (34) at least along a second axis (36b) in the first direction (44) or in the second direction (46) in the event of a deformation of the at least one second spring device (32b) from its second rest position, wherein ​ ​ ​ 2. The micromechanical structure according to claim 1, wherein ​ 3. The micromechanical structure according to claim 2, wherein The first stop face (50a) is configured on a first stop structure (52a) of the first seismic mass (30a), the second stop face (50b) is configured on a second stop structure (52b) of the second seismic mass (30b), the third stop face (50c) is configured on a third stop structure (52c) of the first seismic mass (30a), and / or the fourth stop face (50d) is configured on a fourth stop structure (52d) of the second seismic mass (30b).

4. The micromechanical structure according to claim 2 or 3, wherein The first stop structure (52a) of the first seismic mass (30a), the second stop structure (52b) of the second seismic mass (30b), the third stop structure (52c) of the first seismic mass (30a), and / or the fourth stop structure (52d) of the second seismic mass (30b) are respectively configured as a spring-loaded stop structure.

5. The micromechanical structure according to claim 4, wherein The first stop structure (52a) of the first seismic mass (30a) at least partially projects into a first lateral recess (54a) of the second seismic mass (30b), which first lateral recess is open towards the first axis (36a), the second stop structure (52b) of the second seismic mass (30b) at least partially projects into a second lateral recess (54b) of the first seismic mass (30a), which second lateral recess is open towards the second axis (36b), the third stop structure (52c) of the first seismic mass (30a) at least partially projects into a third lateral recess (54c) of the second seismic mass (30b), which third lateral recess is open towards the first axis (36a), and / or the fourth stop structure (52d) of the second seismic mass (30b) at least partially projects into a fourth lateral recess (54d) of the first seismic mass (30a), which fourth lateral recess is open towards the second axis (36b).

6. The micromechanical structure according to claim 4, wherein 7. A manufacturing method for a micromechanical component of a sensor device, the manufacturing method having the following steps: ​ The first seismic mass (30a) is connected to the holder (34) of the micromechanical component by means of at least one first spring device (32a) in such a way that the first seismic mass (30a) can be displaced (St1) relative to the holder (34) at least along a first axis (36) in a first direction (44) or in a second direction (46) which is oriented opposite the first direction (44) from its first rest position with deformation of the at least one first spring device (32a); The second oscillation mass (30b) is connected to the holder (34) by means of at least one second spring device (32b) in such a way that the second oscillation mass (30b) can be displaced relative to the holder (34) at least along a second axis (36b) in the first direction (44) or in the second direction (46) from its second rest position with deformation of the at least one second spring device (32b), wherein The second axis (36b) is parallel to the first axis (36a) or lies on the first axis (36a) (St2); and The first stop structure (48a) of the holder (34) is configured in such a way that the first seismic mass (30a) which is displaced by a first limiting path (s1) along the first axis (36a) in the first direction (44) from its first rest position mechanically contacts the first stop structure (48a) of the holder (34) (St3); characterized in that The first seismic mass (30a) and the second seismic mass (30b) are arranged relative to one another in such a way that, with the first seismic mass (30a) attached to the first stop structure (48a), the second seismic mass (30b) is displaced along the second axis (36b) in the second direction (46) and its second stop face (50b) mechanically contacts the first stop face (50a) of the first seismic mass (30a), wherein the first stop face (50a) and the second stop face (50b) lie opposite one another in the first direction (44) and the second direction (46) and can mechanically contact one another.

8. The manufacturing method according to claim 7, wherein Additionally, the second stop structure (48c) of the holder (34) is configured in such a way that the first seismic mass (30a) which is displaced by a second limiting path (s2) along the first axis (36a) in the second direction (46) from its first rest position mechanically contacts the second stop structure (48c) of the holder (34), wherein the first seismic mass (30a) and the second seismic mass (30b) are arranged relative to one another in such a way that a fourth stop face (50d) of the second seismic mass (30b) which is displaced along the second axis (36b) in the first direction (44) from its second rest position mechanically contacts a third stop face (50c) of the first seismic mass (30a) which is attached to the second stop structure (48c).

9. The manufacturing method according to claim 8, wherein, The first stop face (50a) is configured on a first stop structure (52a) of the first seismic mass (30a), the second stop face (50b) is configured on a second stop structure (52b) of the second seismic mass (30b), the third stop face (50c) is configured on a third stop structure (52c) of the first seismic mass (30a), and / or the fourth stop face (50d) is configured on a fourth stop structure (52d) of the second seismic mass (30b).

10. The production method according to claim 8 or 9, wherein The first and second oscillating masses (30a, 30b) are arranged relative to each other such that a first spacing (dl) of a first stop face (50a) of the first oscillating mass (30a) in its first rest position to a second stop face (50b) of the second oscillating mass (30b) in its second rest position is greater than the first limit travel (sl) and less than or equal to twice the first limit travel (sl), and / or a second spacing (d2) of a third stop face (50c) of the first oscillating mass (30a) in its first rest position to a fourth stop face (50d) of the second oscillating mass (30b) in its second rest position is greater than the second limit travel (s2) and less than or equal to twice the second limit travel (s2).

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