Vacuum processing device and control method of vacuum processing device

Abstract

The present invention provides a vacuum processing device and a control method for the vacuum processing device. The inclination of the mounting table can be adjusted and the generation of particles in the processing container can be suppressed. The mounting table is arranged in the processing container and is used to mount a substrate. The supporting member penetrates the opening formed at the bottom of the processing container and supports the mounting table from below. The holding portion is located outside the processing container, and the end of the supporting member is fixed to the holding portion, so that the holding portion can move integrally with the mounting table. The holding portion is formed in a manner of covering the opening from the outside of the processing container, and the holding portion is formed with an inner ring portion constituting a movable portion of a spherical bearing along the circumference of the opening. The flange portion is arranged around the opening on the outside of the processing container, and the flange portion is formed with an outer ring portion that engages with the inner ring portion to constitute a fixed portion of the spherical bearing. The sealing portion can be extended and retracted, and is arranged on the inner side of the spherical bearing along the circumference of the opening. The sealing portion at least hermetically seals the flange portion and the holding portion.

Description

Technical Field

[0001] The present disclosure relates to a vacuum processing apparatus and a control method of the vacuum processing apparatus. Background Art

[0002] Patent document 1 discloses a structure as follows: a spherical bearing is used to make surface contact with a convex spherical hemisphere formed on the lower surface of a stage to support the stage in a manner capable of adjusting the inclination of the stage, and a piezoelectric element is arranged around the spherical bearing. When the inclination of the stage is adjusted, the piezoelectric element is extended to separate the hemisphere from the spherical bearing.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2010-34132 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] The present disclosure provides a technology capable of adjusting the inclination of a mounting table and suppressing the generation of particles in a processing container.

[0008] Solutions for solving problems

[0009] A vacuum processing device of a technical solution disclosed in the present invention comprises a processing container, a mounting table, a supporting member, a holding portion, a flange portion, and a sealing portion. The processing container is capable of maintaining a vacuum atmosphere inside. The mounting table is disposed in the processing container and is used to mount a substrate. The supporting member penetrates an opening portion formed at the bottom of the processing container and supports the mounting table from below. The holding portion is located outside the processing container, and the end of the supporting member is fixed to the holding portion, so that the holding portion can move integrally with the mounting table. The holding portion is formed in a manner of covering the opening portion from the outside of the processing container, and the holding portion is formed with an inner ring portion constituting a movable portion of a spherical bearing along the circumference of the opening portion. The flange portion is arranged around the opening portion on the outside of the processing container, and the flange portion is formed with an outer ring portion that engages with the inner ring portion to constitute a fixed portion of the spherical bearing. The sealing portion is capable of expansion and contraction, and the sealing portion is disposed on the inner side of the spherical bearing along the circumference of the opening portion, and the sealing portion at least hermetically seals the flange portion and the holding portion.

[0010] Effects of the Invention

[0011] According to the present disclosure, it is possible to adjust the inclination of the mounting table and suppress the generation of particles in the processing container. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1This is a cross-sectional view showing an example of a schematic structure of the vacuum processing apparatus according to the first embodiment.

[0013] Figure 2 It is a cross-sectional view showing an example of the structure of the support portion according to the first embodiment.

[0014] Figure 3 It is a perspective view showing an example of the structure of the support portion according to the first embodiment.

[0015] Figure 4 This is an enlarged view of the spherical bearing portion of the first embodiment.

[0016] Figure 5 It is a diagram showing an example of the structure of the flange portion according to the first embodiment.

[0017] Figure 6 This is a flowchart showing an example of the flow of the method for controlling the vacuum processing apparatus according to the first embodiment.

[0018] Figure 7 This is a diagram schematically showing an example of a schematic configuration of a vacuum processing apparatus according to a second embodiment.

[0019] Figure 8 This is a flowchart showing an example of the flow of the method for controlling the vacuum processing apparatus according to the second embodiment.

[0020] Fig. 9 This is a diagram schematically showing an example of a schematic configuration of a vacuum processing apparatus according to a third embodiment.

[0021] Fig.10 This is a flowchart showing an example of the flow of the control method of the vacuum processing apparatus according to the third embodiment.

[0022] Fig.11 This is a flowchart showing an example of the flow of the method for controlling the vacuum processing apparatus according to the fourth embodiment.

[0023] Fig.12 It is a cross-sectional view showing another example of the structure of the support portion according to another embodiment. DETAILED DESCRIPTION

[0024] Hereinafter, embodiments of the vacuum processing apparatus and the control method of the vacuum processing apparatus disclosed in the present application will be described in detail with reference to the accompanying drawings. In addition, the disclosed vacuum processing apparatus and the control method of the vacuum processing apparatus are not limited to the following embodiments.

[0025] When the pressure inside the processing container of the vacuum processing device is switched from the atmospheric state to the vacuum state, the processing container will be deformed due to the pressure difference. In addition, the processing container will also be deformed according to temperature changes. When the processing container is deformed, there is a situation where the stress generated by the deformation of the processing container is transmitted to the mounting table, causing the inclination of the mounting table to deviate from the desired inclination. Therefore, for example, in patent document 1, the inclination of the stage can be adjusted by using a spherical bearing to make surface contact with a convex spherical hemisphere formed on the lower surface of the stage. In patent document 1, a piezoelectric element is arranged around the spherical bearing, and when the inclination of the stage is adjusted, the piezoelectric element is extended to separate the hemisphere from the spherical bearing. However, in patent document 1, after the inclination of the stage is adjusted, the piezoelectric element is contracted to contact the hemisphere with the spherical bearing, so that there is a situation where particles are generated in the processing container due to the friction between the hemisphere and the spherical bearing. Therefore, a technology that can adjust the inclination of the mounting table and suppress the generation of particles in the processing container is expected.

[0026] (First embodiment)

[0027] [Structure of Vacuum Processing Apparatus 100]

[0028] First Embodiment is Explained First, a vacuum processing apparatus 100 according to the first embodiment is described. Hereinafter, the vacuum processing apparatus 100 is described as an apparatus for performing film formation. Figure 1 It is a cross-sectional view showing an example of a schematic structure of the vacuum processing apparatus 100 according to the first embodiment.

[0029] In one embodiment, the vacuum processing apparatus 100 is an apparatus for performing a plasma CVD process on a substrate W as a substrate processing. Figure 1 The vacuum processing apparatus 100 shown has a processing container 1. The processing container 1 is cylindrical, and is made of, for example, a metal such as aluminum or nickel with an anodized film formed on the surface. The processing container 1 is electrically grounded. The processing container 1 is airtightly constructed, and a vacuum atmosphere can be maintained inside. A mounting table 2 is provided inside the processing container 1. The processing container 1 has an opening 1c formed at a bottom 1b as a bottom surface on the lower side. The opening 1c is formed at a position below the mounting table 2.

[0030] The mounting table 2 is formed in a flat cylindrical shape. A substrate W such as a semiconductor wafer as a processing object is mounted on the upper surface of the mounting table 2. The mounting table 2 supports the mounted substrate W to be approximately horizontal. The mounting table 2 is composed of a metal such as aluminum, nickel, or aluminum nitride (AlN) embedded with a metal mesh electrode, and also functions as a lower electrode. The mounting table 2 is supported from below by a supporting member 4. The supporting member 4 is formed in a cylindrical shape, extends vertically downward, and passes through an opening 1c of the bottom 1b of the processing container 1. The opening 1c of the bottom 1b is formed with a diameter larger than the diameter of the supporting member 4. A gap is provided between the peripheral surface of the supporting member 4 and the peripheral surface of the opening 1c.

[0031] The lower end of the support member 4 is located outside the processing container 1 and supported by the support portion 8. The support portion 8 is provided in a manner to cover the opening portion 1c from the outside of the processing container 1, and the inclination of the mounting table 2 can be adjusted by changing the inclination of the support member 4. In addition, a rotation drive mechanism 9 for rotating the support member 4 is provided in the support portion 8. The support member 4 rotates under the action of the rotation drive mechanism 9. The mounting table 2 is configured to be rotatable according to the rotation of the support member 4. The detailed structure of the support portion 8 and the rotation drive mechanism 9 will be described later.

[0032] The mounting table 2 has a built-in heater 5, and the substrate W mounted on the mounting table 2 can be heated to a predetermined temperature by the heater 5. The mounting table 2 may also have a flow path (not shown) formed inside for circulating a refrigerant, and a refrigerant whose temperature is controlled by a cooling unit provided outside the processing container 1 is circulated and supplied into the flow path. The mounting table 2 can also control the substrate W to a predetermined temperature by heating by the heater 5 and cooling by the refrigerant supplied from the cooling unit. In addition, the temperature of the mounting table 2 may be controlled by using only the refrigerant supplied from the cooling unit without installing the heater 5.

[0033] In addition, an electrode may be embedded in the mounting table 2. The mounting table 2 can use the electrostatic force generated by the DC voltage supplied to the electrode to attract the substrate W mounted on its upper surface. In addition, the mounting table 2 is provided with a lifting pin (not shown) for transferring the substrate W to a conveying mechanism (not shown) provided outside the processing container 1.

[0034] A shower head 16 formed in a substantially disk shape is provided above the mounting table 2 and on the inner side surface of the processing container 1. The shower head 16 is supported on the upper part of the mounting table 2 via an insulating member 45 such as ceramic. Thus, the processing container 1 is electrically insulated from the shower head 16. The shower head 16 is formed of a conductive metal such as aluminum or nickel.

[0035] The shower head 16 includes a top plate member 16a and a shower plate 16b. The top plate member 16a is provided to seal the inside of the processing container 1 from the upper side. The shower plate 16b is provided below the top plate member 16a to face the mounting table 2. A gas diffusion space 16c is formed in the top plate member 16a. A plurality of gas ejection holes 16d opening toward the gas diffusion space 16c are dispersedly formed in the top plate member 16a and the shower plate 16b.

[0036] The top plate member 16a is provided with a gas inlet 16e for introducing various gases into the gas diffusion space 16c. The gas inlet 16e is connected to a gas supply path 15a. The gas supply unit 15 is connected to the gas supply path 15a.

[0037] The gas supply unit 15 has gas supply lines connected to gas supply sources of various gases used for film formation. Each gas supply line is appropriately branched corresponding to the film forming process, and is provided with control devices such as valves such as on-off valves and flow controllers such as mass flow controllers for controlling the flow of gas. The gas supply unit 15 can control the flow of various gases by controlling control devices such as on-off valves and flow controllers provided in each gas supply line.

[0038] The gas supply unit 15 supplies various gases used for film formation to the gas supply path 15a. For example, the gas supply unit 15 supplies the raw material gas for film formation to the gas supply path 15a. In addition, the gas supply unit 15 supplies the purge gas and the reaction gas that reacts with the raw material gas to the gas supply path 15a. The gas supplied to the gas supply path 15a diffuses in the gas diffusion space 16c and is ejected from each gas ejection hole 16d.

[0039] The space enclosed by the lower surface of the shower plate 16b and the upper surface of the stage 2 forms a processing space for film forming. In addition, the shower plate 16b is paired with the stage 2 grounded by the support member 4 and the processing container 1, and is configured as an electrode plate for forming a capacitively coupled plasma (CCP) in the processing space. The high-frequency power supply 10 is connected to the shower head 16 by means of a matcher 11, and the high-frequency power (RF power) is supplied from the high-frequency power supply 10 to the gas supplied to the processing space by means of the shower head 16, thereby forming the above-mentioned CCP. In addition, the high-frequency power supply 10 can also be connected to the stage 2 instead of being connected to the shower head 16, and the shower head 16 is set to be grounded.

[0040] An exhaust port 71 is formed at the bottom of the processing container 1. An exhaust device 73 is connected to the exhaust port 71 via an exhaust pipe 72. The exhaust device 73 includes a vacuum pump and a pressure regulating valve, and the vacuum in the processing container 1 can be reduced to a predetermined vacuum level by operating the vacuum pump and the pressure regulating valve.

[0041] A carry-in / carry-out port 1a for carrying in and out the substrate W is provided on a side wall of the processing container 1. A gate valve G for opening and closing the carry-in / carry-out port 1a is provided at the carry-in / carry-out port 1a.

[0042] The operation of the vacuum processing apparatus 100 configured as described above is centrally controlled by the control unit 60. The control unit 60 is connected to a user interface 61 and a storage unit 62.

[0043] The user interface 61 includes an operation unit such as a keyboard for a process manager to input commands to manage the vacuum processing apparatus 100, and a display unit such as a display that visually displays the operating status of the vacuum processing apparatus 100. The user interface 61 accepts various operations. For example, the user interface 61 accepts a predetermined operation to instruct the start of plasma processing.

[0044] The storage unit 62 stores data such as processing conditions and processing parameters, and programs (software) for implementing various processes performed by the vacuum processing apparatus 100 under the control of the control unit 60. In addition, the programs and data may be stored in a computer storage medium (such as a hard disk, a CD, a floppy disk, a semiconductor memory, etc.) that can be read by a computer. Alternatively, the programs and data may be used online by being transmitted from other devices at any time through, for example, a dedicated line.

[0045] The control unit 60 is, for example, a computer including a processor, a memory, etc. The control unit 60 reads a program and data from the storage unit 62 based on an instruction from the user interface 61 and controls each unit of the vacuum processing apparatus 100 to execute each process of the control method described below.

[0046] [Structure of the support portion 8]

[0047] Figure 2 It is a cross-sectional view showing an example of the structure of the support portion 8 according to the first embodiment. Figure 3 1 is a perspective view showing an example of the structure of the support portion 8 of the first embodiment. An opening portion 1c is formed at the bottom 1b of the processing container 1 corresponding to the position for supporting the stage 2. A support member 4 for supporting the stage 2 from below is inserted into the opening 1c. The lower end portion 4a of the support member 4 located outside the processing container 1 is supported by the support portion 8.

[0048] The support portion 8 includes a holding portion 81 , a flange portion 82 , and a sealing portion 83 .

[0049] The holding portion 81 is formed so as to cover the opening 1c from the outside of the processing container 1. For example, the holding portion 81 is formed in a cylindrical shape having a diameter larger than the diameter of the opening 1c and a closed bottom on the lower side. The lower end portion 4a of the support member 4 located outside the processing container 1 is fixed to the holding portion 81 so that the holding portion 81 can move integrally with the mounting table 2.

[0050] Here, the support unit 8 supports the cylindrical support member 4 rotatably about the axis of the cylinder by a rotation drive mechanism 9 . The rotation drive mechanism 9 includes a rotation shaft 91 , a vacuum seal 92 , and a motor 93 .

[0051] The holding portion 81 is formed with a hole 81a having a larger diameter than the supporting member 4 at a position corresponding to the lower end portion 4a of the supporting member 4. The hole 81a is formed with a diameter slightly larger than the diameter of the supporting member 4.

[0052] The rotating shaft 91 passes through the hole 81a and is connected to the lower end portion 4a of the support member 4, and is configured to be rotatable integrally with the support member 4. A collector ring 91a is provided at the lower end portion of the rotating shaft 91. The collector ring 91a has an electrode and is electrically connected to various wirings for supplying power to components around the mounting table 2. For example, the collector ring 91a is electrically connected to wirings for supplying power to the heater 5 embedded in the mounting table 2. In addition, for example, in the case where an electrostatic chuck for electrostatically adsorbing the substrate W is provided on the mounting table 2, the collector ring 91a is electrically connected to wirings for applying a DC voltage to the electrostatic chuck.

[0053] The motor 93 is connected to the rotating shaft 91 and rotates the rotating shaft 91. When the rotating shaft 91 rotates, the mounting table 2 rotates via the supporting member 4. When the rotating shaft 91 rotates, the slip ring 91a also rotates together with the rotating shaft 91, but the electrical connection between the slip ring 91a and various wirings for supplying power to the components around the mounting table 2 is maintained.

[0054] The vacuum seal 92 is, for example, a magnetic fluid seal. The vacuum seal 92 is provided around the rotating shaft 91. The vacuum seal 92 hermetically seals the rotating shaft 91 and can maintain the rotation of the rotating shaft 91. The vacuum seal 92 is fixed to the lower surface of the holding portion 81. The contact portion between the vacuum seal 92 and the holding portion 81 is sealed by a sealing member 94 such as an O-ring.

[0055] The support member 4 is fixed to the holding portion 81 via a rotating shaft 91 and a vacuum seal 92, and moves integrally with the holding portion 81. As the support member 4 moves, the mounting table 2 moves.

[0056] The retaining portion 81 is formed with an inner ring portion 84 constituting the movable portion of the spherical bearing along the circumferential direction of the opening portion 1c. For example, the retaining portion 81 has a cylindrical portion 81b and a flat, annular annular member 81c. The annular member 81c is fixed to the open upper end of the cylindrical portion 81b. The annular member 81c is provided with a protruding spherical inner ring portion 84 along the outer circumference. The inner ring portion 84 constitutes the movable portion of the spherical bearing. The contact portion between the cylindrical portion 81b and the annular member 81c is sealed by a sealing member 81d such as an O-ring. In addition, the retaining portion 81 may also form the cylindrical portion 81b and the annular member 81c as a whole.

[0057] The flange portion 82 is arranged around the opening portion 1c on the outside of the processing container 1. For example, the flange portion 82 is formed in a disc shape and is arranged around the opening portion 1c. The flange portion 82 is fixed to the bottom 1b of the processing container 1. The contact portion between the bottom 1b of the processing container 1 and the flange portion 82 is sealed by a sealing member 82a such as an O-ring. The flange portion 82 is formed with an outer ring portion 85 that engages with the inner ring portion 84 of the retaining portion 81 and constitutes a fixed portion of the spherical bearing. For example, the flange portion 82 has an annular member 82c and a flat annular disc portion 82b. The disc portion 82b is fixed to the bottom 1b of the processing container 1. The annular member 82c is provided on the lower surface of the disc portion 82b and protrudes from the lower surface of the disc portion 82b. The annular member 82c is formed in a manner covering the outer circumference of the annular member 81c of the retaining portion 81. A concave spherical outer ring portion 85 is formed along the inner peripheral surface of the annular member 82c that faces the annular member 81c. Figure 4 This is an enlarged view of the spherical bearing part of the first embodiment. The convex spherical surface of the inner ring portion 84 is in surface contact with the concave spherical surface of the outer ring portion 85, and functions as a spherical bearing. In the spherical bearing, by rotating the inner ring portion 84 up and down relative to the outer ring portion 85, the inner ring portion 84 can be tilted relative to the outer ring portion 85 with the spherical center of the spherical bearing as a reference. For example, when the substrate W is set to a 300mm semiconductor wafer and the mounting table 2 is set to the same size as the substrate W, the diameter of the spherical bearing is formed to be about 150 to 200mm. The retaining portion 81 is supported by the spherical bearing so that the angle can be changed relative to the flange portion 82. In addition, the flange portion 82 can also form the disc portion 82b and the annular member 82c as a whole.

[0058] The sealing portion 83 is retractable. The sealing portion 83 is provided on the inner side of the spherical bearing along the circumferential direction of the opening portion 1c, and at least the flange portion 82 and the retaining portion 81 are sealed airtightly. For example, a bellows 83a is provided as the sealing portion 83. The bellows 83a is arranged around the support member 4 along the circumferential direction of the opening portion 1c. The upper end side of the bellows 83a is fixed to the flange portion 82, and the lower end side of the bellows 83a is fixed to the retaining portion 81. The contact portion of the upper end side of the bellows 83a with the flange portion 82 is sealed by a sealing member 83b such as an O-ring. The contact portion of the lower end side of the bellows 83a with the retaining portion 81 is sealed by a sealing member 83c such as an O-ring. The bellows 83a is retractable. Therefore, even when the angle of the holding portion 81 is changed relative to the flange portion 82 by the spherical bearing, the bellows 83a can maintain the airtightness between the flange portion 82 and the holding portion 81 by expansion and contraction. In addition, in the present embodiment, the case where the flange portion 82 and the holding portion 81 are airtightly sealed by the bellows 83a is described. However, the upper end of the bellows 83a may be connected to the side of the opening 1c, and the opening 1c and the holding portion 81 may be airtightly sealed by the bellows 83a.

[0059] The holding portion 81 is supported by the flange portion 82 using a spherical bearing composed of an outer ring portion 85 and an inner ring portion 84. The supporting portion 8 can tilt the holding portion 81 relative to the flange portion 82 by tilting with the spherical center of the spherical bearing as a reference while bearing the thrust load generated during vacuum using the spherical bearing. The mounting table 2 and the supporting member 4 are fixed to the holding portion 81 and thus move together with the holding portion 81. Therefore, the inclination of the mounting table 2 and the supporting member 4 can be changed by changing the inclination of the holding portion 81.

[0060] The support portion 8 has an actuator 86 for changing the inclination of the holding portion 81 relative to the flange portion 82. The actuator 86 is fixed directly or indirectly to the flange portion 82. For example, an annular base 87 is provided around the holding portion 81. The base 87 is supported by a plurality of pillars 87a extending from the flange portion 82. Figure 5 This is a diagram showing an example of the structure of the flange portion 82 according to the first embodiment. Figure 5 , a state in which the lower surface of the flange portion 82 is set to the upper side is shown. In the present embodiment, four pillars 87a are provided at equal intervals in the circumferential direction of the flange portion 82 to support the base 87. The base 87 is fixed to the flange portion 82 by means of the pillars 87a. An actuator 86 is provided on the base 87. At least three actuators 86 are arranged at intervals in the circumferential direction of the opening portion 1c. For example, three actuators 86 are arranged at equal intervals in the circumferential direction of the opening portion 1c. The actuator 86 is indirectly fixed to the flange portion 82 by means of the base 87. In addition, four or more actuators 86 may be arranged.

[0061] The actuator 86 has a retractable rod 86a. The rod 86a is directly or indirectly connected to the holding portion 81 (annular member 81c) so as to come into contact with the holding portion 81. Figure 5 , rods 86a of the actuators 86 are shown arranged at equal intervals. For example, the actuator 86 is provided with a servo motor and a ball screw inside. In the actuator 86, the ball screw rotates by the rotation of the rotating shaft of the servo motor, and the rod 86a is extended and retracted along with the rotation of the ball screw. A thrust pad 86b is provided on the contact surface at the top of the rod 86a. The thrust pad 86b may not be provided, but since the surface pressure is very high, it is preferred to provide the thrust pad 86b. The thrust pad 86b is preferably a high pressure-resistant component formed by quenching. The thrust pad 86b is connected to the retaining portion 81.

[0062] The actuator 86 extends the rod 86a to push up the contact portion between the holding portion 81 and the thrust pad 86b from the bottom, thereby changing the inclination of the holding portion 81 relative to the flange portion 82. The support portion 8 can tilt the mounting table 2 by pushing the holding portion 81 by three actuators 86 evenly arranged on the circumference. The inclination of the mounting table 2 is adjusted according to the pushing amount of the three actuators 86.

[0063] In addition, by detecting the inclination of the support member 4, the holding portion 81, and the rotation drive mechanism 9 (for example, the rotation shaft 91) using various detection components, the inclination of the mounting table 2 adjusted by the plurality of actuators 86 can be determined. Examples of the detection components include a linear encoder, a gyro sensor, a three-axis acceleration sensor, and a laser tracker.

[0064] The actuator 86 extends and retracts the rod 86a under the control of the control unit 60. The control unit 60 can control the inclination of the mounting table 2 by controlling the extension and retraction of the rods 86a of the three actuators 86.

[0065] In addition, as described above, in the vacuum processing apparatus 100, when the pressure inside the processing container 1 is switched from the atmospheric state to the vacuum state, the processing container 1 is deformed due to the pressure difference. In addition, the heat of the substrate processing performed in the processing container 1 is transferred and the temperature changes, and the processing container 1 is also deformed due to the temperature change. When the processing container 1 is deformed, there is a case where the stress generated by the deformation of the processing container 1 is transmitted to the mounting table 2, causing the inclination of the mounting table 2 to change.

[0066] Therefore, the vacuum processing apparatus 100 of the embodiment can adjust the inclination of the stage 2 by using the support portion 8 of the above-mentioned structure. Therefore, even if the inclination of the stage 2 changes due to the deformation of the processing container 1, the vacuum processing apparatus 100 can adjust the inclination of the stage 2 to the original inclination. As a result, the vacuum processing apparatus 100 can improve the deviation of the inclination of the stage 2 caused by the deformation of the processing container 1, and as a result, the in-plane uniformity of the substrate processing such as the film forming processing can be improved. For example, the support portion 8 of the present embodiment can change the inclination of the stage 2 by about ±5° to 10° at most. In fact, as long as the support portion 8 can adjust the angle of the stage 2 by about ±0.x°, the inclination of the stage 2 caused by the deformation of the processing container 1 can be corrected.

[0067] In the vacuum processing apparatus 100 of the embodiment, the spherical bearing for adjusting the inclination of the mounting table 2 is disposed on the atmosphere side and is isolated from the inside of the processing container 1 by the bellows 83a. Thus, in the vacuum processing apparatus 100, when the inclination of the mounting table 2 is adjusted, even if particles are generated by friction of the spherical bearing, the particles can be blocked, and generation of particles in the processing container 1 can be suppressed.

[0068] In this manner, the vacuum processing apparatus 100 according to the present embodiment can adjust the inclination of the mounting table 2 and suppress the generation of particles in the processing container 1 .

[0069] [Specific example of the flow of the control method of the vacuum processing device]

[0070] Next, a specific example of the flow of the method for controlling the vacuum processing apparatus 100 will be described. Figure 6 This is a flowchart showing an example of the flow of the control method of the vacuum processing apparatus 100 according to the first embodiment.

[0071] The control unit 60 obtains the inclination of the mounting table 2 (step S101). The inclination of the mounting table 2 can also be obtained by using various detection components to detect the inclination of the support member 4, the holding portion 81, and the rotation drive mechanism 9. In addition, the inclination of the mounting table 2 can also be obtained by inputting the measurement result of the inclination of the mounting table 2 from the user interface 61.

[0072] The control unit 60 calculates a correction amount for setting the stage 2 to a desired inclination from the acquired inclination of the stage 2 (step S102). For example, the control unit 60 calculates the direction and angle of inclination of the stage 2 required to set the stage 2 to a desired inclination as the correction amount.

[0073] The control unit 60 controls the extension and contraction of each actuator 86 to adjust the inclination by the calculated correction amount (step S103), and the process ends. The inclination of the mounting table 2 is corrected as each actuator 86 is extended and contracted.

[0074] [Effect]

[0075] As described above, the vacuum processing apparatus 100 of the first embodiment includes a processing container 1, a mounting table 2, a support member 4, a holding portion 81, a flange portion 82, and a sealing portion 83 (bellows 83a). The processing container 1 can maintain a vacuum atmosphere inside. The mounting table 2 is provided in the processing container 1 and mounts a substrate W. The support member 4 penetrates the opening portion 1c formed in the bottom 1b of the processing container 1 and supports the mounting table 2 from below. The holding portion 81 is located outside the processing container 1, and the lower end portion 4a of the support member 4 is fixed to the holding portion 81, so that the holding portion 81 can move integrally with the mounting table 2. The holding portion 81 is formed in a manner covering the opening portion 1c from the outside of the processing container 1. The holding portion 81 is formed with an inner ring portion 84 constituting a movable portion of a spherical bearing along the circumferential direction of the opening portion 1c. The flange portion 82 is arranged around the opening portion 1c outside the processing container 1. The flange portion 82 is formed with an outer ring portion 85 that engages with the inner ring portion 84 and constitutes a fixing portion of the spherical bearing. The sealing portion 83 is retractable and is provided on the inner side of the spherical bearing along the circumferential direction of the opening portion 1c, and hermetically seals at least between the flange portion 82 and the holding portion 81. Thus, the vacuum processing apparatus 100 can adjust the inclination of the mounting table 2 and suppress the generation of particles in the processing container 1.

[0076] In addition, the vacuum processing apparatus 100 of the first embodiment further includes an actuator 86 and a control unit 60. The actuator 86 is fixed to the flange portion 82, and a retractable rod 86a is provided on the actuator 86 so as to contact the holding portion 81. The control unit 60 controls the extension and retraction of the rod 86a of the actuator 86 to adjust the inclination of the holding portion 81 and the mounting table 2. Thus, the vacuum processing apparatus 100 can adjust the inclination of the mounting table 2 by retracting and retracting the rod 86a of the actuator 86 under the control of the control unit 60.

[0077] In addition, at least three actuators 86 are arranged at intervals in the circumferential direction of the opening 1 c . Thus, the vacuum processing apparatus 100 can adjust the inclination of the mounting table 2 in any direction.

[0078] (Second embodiment)

[0079] [Structure of Vacuum Processing Apparatus 100]

[0080] Next, a second embodiment will be described. Since the vacuum processing apparatus 100 of the second embodiment has substantially the same configuration as the vacuum processing apparatus 100 of the first embodiment, different portions will be mainly described. Figure 7 FIG. 1 is a diagram schematically showing an example of a schematic structure of a vacuum processing apparatus 100 according to the second embodiment. Figure 7 , the structure of the vacuum processing apparatus 100 is simplified, and only the parts related to the description are shown. The same reference numerals are given to the same parts as those of the vacuum processing apparatus 100 of the first embodiment, and the description thereof is omitted.

[0081] The vacuum processing apparatus 100 is provided with a film thickness sensor 95 around the shower head 16. The film thickness sensor 95 is configured to be able to detect the film thickness of the substrate W located within a predetermined detection range in a non-contact manner.

[0082] The mounting table 2 is supported by a support member 4. The lower end of the support member 4 is located outside the processing container 1 and is supported by a support portion 8. The support portion 8 can adjust the inclination of the mounting table 2 by changing the inclination of the support member 4. In addition, the support portion 8 supports the cylindrical support member 4 by a rotation drive mechanism 9 so that it can rotate about the axis of the cylinder as a rotation axis.

[0083] The control unit 60 controls the actuator 86 to tilt the stage 2 so that the substrate W placed on the stage 2 is located within the detection range of the film thickness sensor 95. In addition, the control unit 60 controls the rotation drive mechanism 9 to rotate the support member 4 and the stage 2. The control unit 60 uses the film thickness sensor 95 to measure the film thickness of the film on the substrate W. In addition, when it is not necessary to measure the film thickness in the circumferential direction of the substrate W, the stage 2 may not be rotated. For example, when measuring the film thickness at multiple locations in the radial direction of the substrate W, the control unit 60 may also change the inclination of the stage 2 to move the detection range of the film thickness sensor 95 in the radial direction of the substrate W, thereby measuring the film thickness using the film thickness sensor 95.

[0084] Figure 8 This is a flowchart showing an example of the flow of the control method of the vacuum processing apparatus 100 according to the second embodiment.

[0085] The control unit 60 controls the actuator 86 to tilt the stage 2 so that the substrate W placed on the stage 2 is located within the detection range of the film thickness sensor 95 (step S201). For example, the control unit 60 controls the plurality of actuators 86 to tilt the stage 2 until the substrate W placed on the stage 2 is located within the detection range of the film thickness sensor 95.

[0086] The control unit 60 controls the rotation drive mechanism 9 to rotate the support member 4 and the mounting table 2 (step S202 ). The control unit 60 measures the film thickness of the film on the substrate W using the film thickness sensor 95 (step S203 ).

[0087] In this way, in the vacuum processing apparatus 100, the substrate W placed on the mounting table 2 can be moved into the detection range of the film thickness sensor 95. Thus, in the vacuum processing apparatus 100, even when the film thickness sensor 95 can only be arranged around the nozzle 16 facing the mounting table 2, the film thickness detection can be performed in real time during the substrate processing.

[0088] [Effect]

[0089] As described above, the vacuum processing apparatus 100 of the second embodiment further includes the nozzle head 16 (upper electrode) and the film thickness sensor 95. The nozzle head 16 is arranged opposite to the mounting table 2 in the processing container 1. The film thickness sensor 95 is arranged around the nozzle head 16 and can detect the film thickness of the substrate W located within a predetermined detection range in a non-contact manner. In the control method of the vacuum processing apparatus 100 of the second embodiment, the actuator 86 is controlled to tilt the mounting table 2 so that the substrate W mounted on the mounting table 2 is located within the detection range of the film thickness sensor 95. Thus, in the vacuum processing apparatus 100, even when the film thickness sensor 95 is arranged around the nozzle head 16 opposite to the mounting table 2, the film thickness detection can be performed in real time during the process of performing substrate processing.

[0090] (Third embodiment)

[0091] [Structure of Vacuum Processing Apparatus 100]

[0092] Next, a third embodiment will be described. Since the vacuum processing apparatus 100 of the third embodiment has substantially the same configuration as the vacuum processing apparatus 100 of the first embodiment, different portions will be mainly described. Fig. 9 FIG. 1 is a diagram schematically showing an example of a schematic structure of a vacuum processing apparatus 100 according to a third embodiment. Fig. 9 , the structure of the vacuum processing apparatus 100 is simplified, and only the parts related to the description are shown. The same reference numerals are given to the same parts as those of the vacuum processing apparatus 100 of the first embodiment, and the description thereof is omitted.

[0093] In the vacuum processing apparatus 100, a distance measurement substrate SW capable of measuring the distance (hereinafter appropriately referred to as "gap") between the stage 2 and the nozzle head 16 is arranged on the stage 2. The distance measurement substrate SW has a wireless communication function of transmitting the gaps measured at a plurality of positions within the mounting surface of the stage 2 as measurement results to the control unit 60. The control unit 60 measures the gap between the nozzle head 16 and the stage 2 using the distance measurement substrate SW. The control unit 60 controls the actuator 86 based on the measurement result of the measured gap so that the stage 2 and the nozzle head 16 are parallel.

[0094] Fig.10This is a flowchart showing an example of the flow of the control method of the vacuum processing apparatus 100 according to the third embodiment.

[0095] The control unit 60 places the distance measurement substrate SW on the mounting table 2 (step S301 ).

[0096] The control unit 60 instructs the distance measurement board SW to measure the gap (step S302). The distance measurement board SW transmits the gaps measured at a plurality of positions in the circumferential direction of the mounting table 2 as measurement results to the control unit 60. In addition, a gap measurement instruction may be transmitted from a component other than the control unit 60.

[0097] The control unit 60 controls the actuator 86 to make the stage 2 parallel to the nozzle 16 based on the measurement result of the distance measurement substrate SW (step S303). For example, the control unit 60 controls the actuator 86 to make the distances (that is, gaps) at multiple positions on the mounting surface of the stage 2 within a predetermined range.

[0098] Thus, in vacuum processing apparatus 100, gaps can be equalized at multiple locations on the mounting surface of mounting table 2 without opening processing container 1. As a result, vacuum processing apparatus 100 can improve the in-plane uniformity of substrate processing on substrate W while maintaining the vacuum state of processing container 1.

[0099] [Effect]

[0100] As described above, the vacuum processing apparatus 100 of the third embodiment further includes a nozzle 16 (upper electrode). The nozzle 16 is arranged opposite to the mounting table 2 in the processing container 1. In the control method of the vacuum processing apparatus 100 of the third embodiment, a distance measurement substrate SW capable of measuring the distance between the mounting table 2 and the nozzle 16 at a plurality of positions in the mounting surface of the mounting table 2 is arranged on the mounting table 2. Moreover, in the control method of the vacuum processing apparatus 100, the actuator 86 is controlled based on the measurement result of the distance measurement substrate SW so that the mounting table 2 and the nozzle 16 are parallel. Thus, the vacuum processing apparatus 100 can improve the in-plane uniformity of the substrate processing performed on the substrate W while maintaining the vacuum state of the processing container 1.

[0101] (Fourth embodiment)

[0102] [Structure of Vacuum Processing Apparatus 100]

[0103] Next, a fourth embodiment will be described. Since the vacuum processing apparatus 100 of the fourth embodiment has substantially the same configuration as the vacuum processing apparatus 100 of the first embodiment, different portions will be mainly described.

[0104] In the vacuum processing apparatus 100, for each substrate processing performed in the processing container 1, the measurement data indicating the state of the substrate W and the inclination of the mounting table 2 are stored in the storage unit 62. The state of the substrate W subjected to the substrate processing can be measured by installing a sensor in the processing container 1, or the substrate W sent out from the vacuum processing apparatus 100 can be measured by using other devices after the substrate processing. The control unit 60 obtains the measurement data indicating the inclination of the mounting table 2 corresponding to the state of the substrate W satisfying the prescribed conditions, which is obtained by measuring for each substrate processing performed in the processing container 1. For example, the control unit 60 reads and obtains the measurement data from the storage unit 62 of the control unit 60. The substrate processing is sequentially performed in the processing container 1, and when the timing of switching each substrate processing comes, the control unit 60 controls the actuator 86 based on the measurement data so that the mounting table 2 becomes an angle corresponding to the substrate processing.

[0105] Fig.11 This is a flowchart showing an example of the flow of the control method of the vacuum processing apparatus 100 according to the fourth embodiment.

[0106] The control unit 60 obtains measurement data indicating the inclination of the stage 2 corresponding to the state of the substrate W satisfying the specified conditions, which is measured for each substrate processing performed in the processing container 1 (step S401). For example, the control unit 60 reads and obtains the measurement data from the storage unit 62 of the control unit 60. The state of the substrate W refers to, for example, a numerical value indicating the film quality of a film formed on the substrate W using the substrate processing. In addition, when the measurement data is stored in other devices, the control unit 60 may also obtain the measurement data from other devices via a network. In addition, the control unit 60 may also generate and obtain measurement data using machine learning based on the inclination of the stage 2 corresponding to the state of the substrate W in each substrate processing.

[0107] The control unit 60 performs substrate processing in the processing container 1 (step S402 ).

[0108] The control unit 60 determines whether the timing of switching the substrate processing being executed has arrived (step S403). If the timing of switching has not arrived (step S403: No), the control unit 60 continues the substrate processing being executed.

[0109] In addition, when the time for switching has arrived (step S403: Yes), the control unit 60 determines whether the execution of all substrate processing has been completed (step S404). When the execution of all substrate processing has not been completed (step S404: No), the control unit 60 controls the plurality of actuators 86 based on the measurement data acquired in step S401 (step S405). That is, the control unit 60 refers to the measurement data to obtain the inclination of the mounting table 2 corresponding to the next substrate processing as the switching target. Then, the control unit 60 controls the plurality of actuators 86, and the control unit 60 controls the actuators 86 so that the inclination of the mounting table 2 becomes the obtained inclination. After controlling the actuators 86, the control unit 60 returns the processing to step S402, and performs the next substrate processing as the switching target in the processing container 1.

[0110] In addition, when the execution of all substrate processes is completed (step S404: Yes), the control unit 60 ends the process.

[0111] In this way, the vacuum processing apparatus 100 can dynamically adjust the position and inclination of the mounting table 2 for each substrate process. As a result, the vacuum processing apparatus 100 can obtain the best processing result for each substrate process while continuously performing substrate processes in sequence.

[0112] [Effect]

[0113] As described above, in the control method of the vacuum processing apparatus 100 of the fourth embodiment, the measurement data indicating the inclination of the mounting table 2 corresponding to the state of the substrate W satisfying the predetermined condition, which is measured for each substrate process performed in the processing container 1, is acquired. In the control method of the vacuum processing apparatus 100, the substrate processes are sequentially performed in the processing container 1. In the control method of the vacuum processing apparatus 100, the actuator 86 is controlled based on the measurement data each time the timing of switching the substrate process arrives. Thus, the vacuum processing apparatus 100 can obtain the best processing result for each substrate process while continuously and sequentially performing the substrate processes.

[0114] The above embodiments are described, but it should be understood that the embodiments disclosed this time are illustrative in all aspects and are not restrictive. The above embodiments may be omitted, replaced, or modified in various forms without departing from the scope of the claims and their gist.

[0115] For example, in the above-mentioned embodiment, the vacuum processing device 100 is described as an example of a device that performs plasma CVD processing as a substrate processing. However, the disclosed technology is not limited to this. The disclosed technology can also be applied to any device that performs other substrate processing such as plasma etching. That is, the disclosed technology can be adopted in any plasma processing device. For example, the vacuum processing device 100 can also be any type of plasma processing device such as a capacitively coupled plasma (CCP: Capacitively Coupled Plasma) type, an inductively coupled plasma (ICP: Inductively-coupled plasma) type, or a plasma processing device that uses surface waves such as microwaves to excite gas.

[0116] In addition, in the above-mentioned embodiment, the case where the entire circumference of the inner ring portion 84 constituting the movable part of the spherical bearing and the outer ring portion 85 constituting the fixed part of the spherical bearing is set to a spherical shape is described as an example. However, the disclosed technology is not limited to this. It is also possible to set a part of the circumference of the inner ring portion 84 and the outer ring portion 85 to a spherical shape. For example, three or more parts can be set to a spherical shape at intervals on the circumference of the inner ring portion 84 and the outer ring portion 85. For example, the inner ring portion 84 and the outer ring portion 85 can be set to a spherical shape near the part where the thrust pad 86b abuts. For example, the inner ring portion 84 and the outer ring portion 85 can be set to a spherical shape in a predetermined range including the part where the thrust pad 86b abuts.

[0117] In addition, in the above-mentioned embodiment, the case where the inner ring portion 84 and the outer ring portion 85 are formed into a spherical shape with the same curvature radius to form a spherical bearing in surface contact is described as an example. However, the disclosed technology is not limited to this. The spherical bearing formed by the inner ring portion 84 and the outer ring portion 85 can also be configured as a self-aligning bearing or a ball bearing.

[0118] In addition, in the above-mentioned embodiment, the case where the exhaust port 71 connected to the exhaust device 73 is provided at the end side of the bottom of the processing container 1 is described as an example. However, the disclosed technology is not limited to this. The exhaust part for exhausting the inside of the processing container 1 may also be provided at the holding part 81. In addition, a plurality of gas outlets for outputting a predetermined gas may be provided at intervals along the circumferential direction on the side surface of the opening 1c. Fig.12 FIG. 2 is a cross-sectional view showing another example of the structure of the support portion according to another embodiment. Figure 2The same parts of the support portion 8 of the first embodiment shown are marked with the same figure marks and the description is omitted. An exhaust port 74 is formed on the side of the holding portion 81. An exhaust device 73 is connected to the exhaust port 74 via an exhaust pipe 75. In addition, the exhaust port 74 can also be formed on the bottom surface of the holding portion 81. The exhaust device 73 depressurizes the inside of the processing container 1 to a specified vacuum level via the exhaust port 74 and the holding portion 81. A gas output port 98 is formed on the side of the opening portion 1c. A plurality of gas output ports 98 are provided on the side of the opening portion 1c at equal intervals. The gas output port 98 is connected to the gas supply portion 15 via a pipe not shown in the figure. The gas supply portion 15 supplies a specified gas to the gas output port 98. For example, the gas supply portion 15 supplies N 2 The purge gas such as gas is used to discharge particles generated in the bellows 83a and other parts of the support part 8. Thus, the vacuum processing apparatus 100 can discharge particles generated in the support part 8 from the exhaust port 74, thereby suppressing the generation of particles in the processing container 1.

Claims

1. A vacuum processing device, wherein: The vacuum treatment device has: a processing container capable of maintaining a vacuum atmosphere inside; A loading platform, which is disposed in the processing container and is used to load the substrate; a supporting member that penetrates an opening formed at the bottom of the processing container and supports the mounting table from below; a holding portion located outside the processing container, the end of the supporting member being fixed to the holding portion so that the holding portion can move integrally with the mounting table, the holding portion being formed in a manner to cover the opening portion from the outside of the processing container, and the holding portion being formed with an inner ring portion constituting a movable portion of a spherical bearing along the circumference of the opening portion; a flange portion disposed outside the processing container and around the opening portion, the flange portion having an outer ring portion engaged with the inner ring portion to constitute a fixing portion of the spherical bearing; and a sealing portion which is retractable and arranged on the inner side of the spherical bearing along the circumferential direction of the opening portion, and which seals at least between the flange portion and the holding portion in an airtight manner, The support member can be tilted with the center of the spherical surface of the spherical bearing as a reference.

2. The vacuum processing device according to claim 1, wherein: The vacuum treatment device also has: an actuator fixed to the flange portion, wherein a retractable rod is provided on the actuator so as to contact the holding portion; and A control unit controls the extension and contraction of the rod of the actuator to adjust the inclination of the holding unit and the mounting table.

3. The vacuum processing device according to claim 2, wherein: At least three of the actuators are arranged at intervals in the circumferential direction of the opening.

4. The vacuum processing device according to any one of claims 1 to 3, wherein: The vacuum treatment device also has: an exhaust unit provided in the holding unit, the exhaust unit exhausting the inside of the processing container via the opening and the holding unit; and A plurality of gas outlets are provided at intervals in the circumferential direction on the side surface of the opening, and the gas outlets outlet a predetermined gas.

5. A method for controlling a vacuum processing device, The vacuum treatment device has: a processing container capable of maintaining a vacuum atmosphere inside; A loading platform, which is disposed in the processing container and is used to load the substrate; a supporting member that penetrates an opening formed at the bottom of the processing container and supports the mounting table from below; a holding portion located outside the processing container, the end of the supporting member being fixed to the holding portion so that the holding portion can move integrally with the mounting table, the holding portion being formed in a manner to cover the opening portion from the outside of the processing container, and the holding portion being formed with an inner ring portion constituting a movable portion of a spherical bearing along the circumference of the opening portion; A flange portion disposed outside the processing container and around the opening portion, the flange portion having an outer ring portion engaged with the inner ring portion to constitute a fixing portion of the spherical bearing; a sealing portion which is expandable and contractible, the sealing portion being provided on the inner side of the spherical bearing along the circumferential direction of the opening portion, the sealing portion sealing at least between the flange portion and the holding portion in an airtight manner, and An actuator is fixed to the flange portion, and a retractable rod is provided on the actuator in a manner of contacting the holding portion, wherein: The vacuum processing device also has: an upper electrode disposed in the processing container so as to face the mounting table; as well as a film thickness sensor disposed around the upper electrode, the film thickness sensor being capable of detecting the film thickness of the substrate within a predetermined detection range in a non-contact manner, The control method of the vacuum processing device comprises the following steps: The actuator is controlled so that the mounting table is tilted so that the substrate mounted on the mounting table is located within a detection range of the film thickness sensor.

6. A method for controlling a vacuum processing device, The vacuum treatment device has: a processing container capable of maintaining a vacuum atmosphere inside; A loading platform, which is disposed in the processing container and is used to load the substrate; a supporting member that penetrates an opening formed at the bottom of the processing container and supports the mounting table from below; a holding portion located outside the processing container, the end of the supporting member being fixed to the holding portion so that the holding portion can move integrally with the mounting table, the holding portion being formed in a manner to cover the opening portion from the outside of the processing container, and the holding portion being formed with an inner ring portion constituting a movable portion of a spherical bearing along the circumference of the opening portion; a flange portion disposed outside the processing container and around the opening portion, the flange portion being formed with an outer ring portion engaging with the inner ring portion to constitute a fixing portion of the spherical bearing; a sealing portion which is expandable and contractible, the sealing portion being provided on the inner side of the spherical bearing along the circumferential direction of the opening portion, the sealing portion sealing at least between the flange portion and the holding portion in an airtight manner, and an actuator fixed to the flange portion, wherein a retractable rod is provided on the actuator so as to contact the holding portion, The support member can be tilted with the spherical center of the spherical bearing as a reference. The vacuum processing device also has: an upper electrode disposed in the processing container so as to face the mounting table, The control method of the vacuum processing device comprises the following steps: A distance measuring substrate capable of measuring the distance between the mounting table and the upper electrode at a plurality of positions within a mounting surface of the mounting table is arranged on the mounting table; as well as The actuator is controlled based on the measurement result of the distance measurement substrate so that the stage is parallel to the upper electrode.

7. A method for controlling a vacuum processing device, The vacuum treatment device has: a processing container capable of maintaining a vacuum atmosphere inside; A loading platform, which is disposed in the processing container and is used to load the substrate; a supporting member that penetrates an opening formed at the bottom of the processing container and supports the mounting table from below; a holding portion located outside the processing container, the end of the supporting member being fixed to the holding portion so that the holding portion can move integrally with the mounting table, the holding portion being formed in a manner to cover the opening portion from the outside of the processing container, and the holding portion being formed with an inner ring portion constituting a movable portion of a spherical bearing along the circumference of the opening portion; a flange portion disposed outside the processing container and around the opening portion, the flange portion being formed with an outer ring portion engaging with the inner ring portion to constitute a fixing portion of the spherical bearing; a sealing portion which is expandable and contractible, the sealing portion being provided on the inner side of the spherical bearing along the circumferential direction of the opening portion, the sealing portion sealing at least between the flange portion and the holding portion in an airtight manner, and an actuator fixed to the flange portion, wherein a retractable rod is provided on the actuator so as to contact the holding portion, The support member can be tilted with the spherical center of the spherical bearing as a reference. The control method of the vacuum processing device comprises the following steps: acquiring measurement data indicating the inclination of the mounting table corresponding to the state of the substrate satisfying a predetermined condition, measured for each substrate process performed in the processing container; sequentially performing substrate processing in the processing container; and The actuator is controlled based on the measurement data every time the timing of switching the substrate processing comes.

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