Surface mount magnetic component module

Abstract

A magnetic component module includes a first head, a core on the first head, and a winding including a first trace on the first head. The first head includes a disc-shaped portion supporting the core and a cylindrical portion with a hole for receiving the core.

Description

[0001] Cross-references to related applications

[0002] This application claims the benefit of U.S. Patent Application No. 62 / 871,854, filed July 9, 2019. The entire contents of that application are incorporated herein by reference. Technical Field

[0003] This invention relates to magnetic components and magnetic component modules, and more particularly, to transformers and surface-mount transformer modules. Background Technology

[0004] Transformers are used in many applications, such as changing the voltage of an input electrical circuit. A transformer has one or more primary windings and one or more secondary windings wound around a common core of magnetic material. The primary winding receives electrical energy, for example, from a power source, and couples this energy to the secondary winding through a changing magnetic field. This electrical energy manifests as an electromagnetic force passing through the secondary winding. The voltage generated in the secondary winding is related to the voltage in the primary winding by the turns ratio between the primary and secondary windings. Typical transformers use an arrangement of adjacent coils. In a toroidal transformer, the windings are wound around a toroidal core.

[0005] Demands in many fields, including telecommunications, implantable medical devices, and battery-powered wireless devices, have driven design efforts to minimize component size with lower-cost solutions that exhibit the same or better performance but operate at reduced power consumption. This reduced power consumption is often driven by other requirements to lower the supply voltage of various circuits. Therefore, there is a continued need for more efficient, smaller, and lower-cost transformers. Summary of the Invention

[0006] To overcome the above problems and meet the above needs, a preferred embodiment of the present invention provides a magnetic component module, each magnetic component module including a substrate, a head and a winding, the head being on the substrate and including a disc-shaped portion supporting a core and a cylindrical portion receiving a hole in the core, the winding including traces on the head.

[0007] According to a preferred embodiment of the present invention, the magnetic component module includes a first head, a core on the first head, and a winding including a first trace on the first head. The first head includes a disc-shaped portion supporting the core and a cylindrical portion with a hole for receiving the core.

[0008] The magnetic component module may also include a core support between the first head and the core. The first trace may be electrically connected to the substrate.

[0009] The magnetic component module may further include a second head containing a second trace. The second head may be stacked on the first head. The magnetic component module may further include a first wiring junction on the core connecting the first trace on the first head to the second trace on the first head, and a second wiring junction on the core connecting the first trace on the second head to the second trace on the second head. The magnetic component module may further include an overmolding material encapsulating the first head, the core, the second head, the first wiring junction, and the second wiring junction.

[0010] The first head may include a support for electrically connecting the winding to the substrate, and an overmolding material for encapsulating a portion of the first head. Electronic components may be mounted on the substrate between the first head and the substrate.

[0011] The magnetic component module may further include a wiring junction on the core, connecting a first trace on the first head to a second trace on the first head. The magnetic component module may also include an overmolding material encapsulating the first head, the core, and the wiring junction.

[0012] According to a preferred embodiment of the present invention, the magnetic component module includes a cup-shaped first head having an inner edge and an outer edge, a core on the first head, and a winding including a first trace on the first head and a first wiring junction extending between the inner and outer edges of the first head and connected to the first trace.

[0013] The magnetic component module may further include a core support between the first head and the core. The magnetic component module may also include a cup-shaped second head having an inner and outer edge, which includes a second trace and is stacked on the first head. The magnetic component module may further include a second wiring junction extending between the inner and outer edges of the second head and connecting to the second trace.

[0014] The first head may include a support for electrically connecting the winding to the substrate, and an overmolding material for encapsulating a portion of the first head. Electronic components may be mounted on the substrate between the first head and the substrate. The magnetic component module may also include an overmolding material encapsulating the first head, the core, and the wiring junctions.

[0015] The above and other features, elements, characteristics, steps and advantages of the invention will become more apparent from the following detailed description of preferred embodiments of the invention with reference to the accompanying drawings. Attached Figure Description

[0016] Figure 1 and Figure 2 The head with plated windings is shown.

[0017] Figure 3 The head and core are shown.

[0018] Figure 4 The head and the core with wiring joints are shown.

[0019] Figure 5 and Figure 6 The top and bottom of the head, which has a cup shape and a support, are shown.

[0020] Figure 7 It shows Figure 5 The head has a core and wiring joint.

[0021] Figure 8 The head is shown to have a cup shape and a short support.

[0022] Figure 9 The head is shown to have a cup shape and a pick-and-place surface.

[0023] Figure 10 The first and second heads of the stack are shown.

[0024] Figure 11 yes Figure 10 Cross-sectional view of the first and second heads of the stack.

[0025] Figure 12 This is a breakdown diagram of the first and second heads.

[0026] Figure 13 A magnetic component module connected to a substrate and an overmolded part is shown.

[0027] Figure 14 A magnetic component module with a cover connected to a substrate is shown.

[0028] Figure 15 It shows Figure 14 A magnetic component module without a lid.

[0029] Figure 16 This is a block diagram illustrating an example implementation of the magnetic component module.

[0030] Figure 17 It can include Figure 16 The diagram shows a block diagram of the gate drive circuit application for one or more magnetic component modules shown.

[0031] Figure 18 It can include Figure 17 Circuit diagram for motor control application of gate drive unit. Detailed Implementation

[0032] Figures 1 to 4A magnetic component module 100 with a core 106, a winding 101, and a head 105 is shown. The winding 101 may be defined by traces 102 on the head 105 and wiring joints 103 on the core 106. Figure 1 and Figure 2 A head 105 is shown. The head 105 can be molded and may include a trace 102 and a core support 108. The trace 102 defining the winding 101 can be provided by electroplating, vapor deposition, or any other suitable process. Figure 3 The core 106 on the head 105 is shown. Figure 4 A wiring joint 103 is shown that connects the traces 102 on the head 105. For clarity, Figure 4 Only some of the wiring joints 103 are shown. The magnetic component module 100 can be a transformer with primary and secondary windings extending around a core 106. Alternatively, other magnetic components, including, for example, an inductor with a single winding or a transformer with three or more windings, can also be used. Furthermore, the winding 101 can have any suitable number of turns and can have one or more taps. Figure 2 As shown, the head 105 may include a ridge 107 or other suitable surface mount (SM) structure, which may be located on the bottom surface of the head 105 and can be used to attach the head 105 to a substrate (not shown). Figures 1 to 4 (as shown in the image). Figure 2 Three ridges 107 are shown, but any number of ridges 107 can be used. Any suitable substrate can be used, including, for example, a printed circuit board (PCB).

[0033] like Figure 1 As shown, the head 105 may include a body that may include a generally disc-shaped portion supporting the core 106 and a cylindrical portion that can be inserted into a hole in the core 106. Figure 1 Also shown is a trace 102 disposed on the head 105 and generally extending radially from the center of the head 105 to the outer periphery. As shown, the head 105 may also include a core support 108 that protrudes from the body between the traces 102 and is higher than the traces 102 such that the core 106 does not contact the traces 102. Figure 1Three core supports 108 are shown for separating the core 106 from the trace 102. Any number of core supports 108 can be used. Alternatively, if the core 106 and / or the trace 102 are insulated, core supports may not be used. The core 106 may be located on the head 105 or may be attached to the head 105 in any suitable manner. The center of the head 105 may include a platform 109 attached to the head 105. The platform 109 may be attached to the head 105 by four arms or any suitable number of arms. Alternatively, the platform 109 may be attached without any arms, such that the top surface defined by the platform 109 is a solid without holes. If the platform 109 is connected to the head 105 by arms such that there are holes on the top surface defined by the platform 109, overmolding material can flow into the interior of the head 105 through the holes. The platform 109 can be used for pick-and-place.

[0034] Figure 2 yes Figure 1 The perspective view of the lower side of the head 105 shown. Figure 2 The diagram shows that electroplating of some traces in trace 102 can extend from the top side of head 105 around the edge to the bottom side of head 105, allowing these traces 102 to be plated with pads on the substrate (not on the substrate). Figure 2 (As shown in the diagram) Electrical connection. Trace 102 can extend to the ridge 107 on the underside of the head 105.

[0035] Figure 3 A core 106 is shown located above a head 105, with the cylindrical portion of the head 105 higher than the core 106. The core 106 may be located on a core support 108, away from the trace 102, to eliminate short circuits between the core 106 and the trace 102. However, the core 106 and / or the trace 102 may be covered or partially covered by an insulating material, which eliminates the need for a core support 108.

[0036] Figure 4 A head 105 with trace 102, a core 106, and a wiring junction 103 engaged with the head 105 to connect the trace 102 on the head 105 to define a winding are shown. The wiring junction 103 can connect adjacent traces 102 on the head 105.

[0037] Figures 5 to 7 A magnetic component module 200 with a core 206, a winding 201, and a head 205 is shown. The winding 201 may be defined by traces 202 on the head 205 and wiring joints 203 on the core 206. Figure 5 and Figure 6A cup-shaped head 205 with a central hole is shown. The head 205 can be molded and may include a trace 202 and a core support 208. The trace 202 defining the winding 201 can be provided by electroplating, vapor deposition, or any other suitable process. Figure 7 The core 206 on the head 205 and the wiring junction 203 connecting the trace 202 on the head 205 are shown. The magnetic component module 200 can be a transformer having a primary winding and a secondary winding extending around the core 206. Alternatively, other magnetic components, including, for example, an inductor with a single winding or a transformer with three or more windings, can also be used. Furthermore, the winding 201 can have any suitable number of turns and can have one or more taps. Figure 6 As shown, the head 205 may include a support 207 or other suitable surface mount (SM) structure, which may be located on the bottom surface of the head 205 for attaching the head 205 to a substrate (not shown). Figures 5 to 7 (as shown in the image). Figure 8 It is shown that a short support 217 can be used instead of support 207. Support 207 allows head 205 to be attached to the substrate, wherein electronic components are located between head 205 and the substrate, such as... Figure 14 and Figure 15 As shown, the short support 217 allows the head 205 to attach to the substrate without any components between the head 205 and the substrate, such as... Figure 13 As shown in the image. Figure 6 Four supports 207 are shown, but any number of supports 207 can be used. Any suitable substrate can be used, including, for example, a printed circuit board (PCB).

[0038] like Figure 5 As shown, the head 205 may include a cup-shaped body with inner and outer edges. Figure 5 As shown, the inner edge may be higher than the outer edge. Alternatively, the inner and outer edges may have the same height or substantially the same height within manufacturing tolerances. The head 205 may include a body that may include a generally disc-shaped portion from which the inner and outer edges extend and support the core 206, and a cylindrical portion that may include a hole defining the inner edge and insert into the core 206. The head 205 may include a hole 211 if the head 205 is, for example, as shown... Figure 14 When used together with the cover 215 shown, the hole 211 can allow the encapsulated winding 201 to be encapsulated. Figure 5 Also shown is a trace 202 disposed on the head 205 and generally extending radially from the center of the head 205 to the outer edge. As shown, the head 205 may also include a core support 208 that protrudes from the body between the traces 202 and is higher than the traces 202 such that the core 206 does not contact the traces 202. Figure 5Four core supports 208 are shown for separating the core 206 from the trace 202. Any number of core supports 208 can be used. Alternatively, if the core 206 and / or the trace 202 are insulated, core supports may not be used. The core 206 may be located within the head 205 or may be attached to the head 205 in any suitable manner. Figure 9 As shown, the center of head 205 may include a platform 209 attached to head 205. Platform 209 may be attached to head 205 via four arms or any suitable number of arms. Alternatively, platform 209 may be attached without any arms, such that the top surface defined by platform 209 is a solid without holes. If platform 209 is connected to head 205 via arms such that holes exist on the top surface defined by platform 209, overmolding material can flow into the interior of head 205 through the holes. Platform 209 can be used for pick-and-place operations.

[0039] Figure 6 yes Figure 5 The perspective view of the lower side of the head 205 shown. Figure 6 This illustrates that electroplating of some traces in trace 202 can extend from the top side of head 205 around the edge to the bottom side of head 205, allowing these traces 202 to interface with pads on the substrate (not on...). Figure 6 (As shown in the diagram) Electrical connection. Trace 202 may extend to support 207 on the underside of head 205. Support 207 may have any suitable height and may be high enough, for example, to allow electronic components to be located below head 205 when head 205 is attached to substrate. As an alternative to extending trace 202 to the underside of head 205, wiring joints (not shown) may directly connect the winding to pads on the substrate.

[0040] Figure 7 A core 206 is shown located above the head 205. The core 206 may be located on a core support 208, away from the trace 202, to eliminate short circuits between the core 206 and the trace 202. However, the core 206 and / or the trace 202 may be covered or partially covered by an insulating material, which may eliminate the need for the core support 208.

[0041] Figure 7 A head 205 with traces 202, a core 206, and a wiring joint 203 engaged with the head 205 to connect the traces 202 on the head 205 to define a winding are shown. The wiring joint 203 can connect adjacent traces 202 on the head 205. The wiring joint 203 extends between the inner and outer edges of the head 205.

[0042] Figures 10 to 12A magnetic component module 300 is shown, having a stacked first head 304 and a second head 305, and a core 306 located on the first head 304 and the second head 305. The core 306 may be located on a core support 308, away from the trace 302, to eliminate short circuits between the core 306 and the trace 302. However, the core 306 and / or the trace 302 may be covered or partially covered by an insulating material, which eliminates the need for the core support 308. Figure 11 yes Figure 10 The cross-sectional view of the first head 304 and the second head 305 shown is shown. Figure 12 This is an exploded view of the first head 304 and the second head 305, showing that the first head 304 can be arranged to fit inside the second head 205. Figure 12 In this configuration, when the first head 304 is inserted into the second head 305, the core 306 is located in the second head 305. Alternatively, the first head 304 can be inserted into the second head 305 before the core 306 is inserted into the second head 305. The winding 301 can be defined by traces 302 on the first head 304 and the second head 305, and by wiring joints 303 on the core 306. The first head 304 and the second head 305 can be connected via wiring joint jumpers 311. Although Figures 10 to 12 Only the first head 304 and the second head 305 are shown, but additional heads may be stacked on top of the first head 304 and the second head 305. Each additional head generates an additional winding 301. The center of the second head 305 may include a platform (not shown) for pick-and-place placement. The first head 304 may include, for example, Figure 10 The short support 317 shown allows the first head 304 to be attached to the substrate without any components between the first head 304 and the substrate, such as... Figure 13 As shown in the image. Alternative locations, such as... Figure 14 and Figure 15 As shown, the first head 304 may include a support that allows the first head 304 to be attached to a substrate, wherein electronic components are located between the first head 304 and the substrate. The first head 304 and the second head 305 may include a bond and / or polarization structure that, when the first head 304 is inserted into the second head 305, orients the first head 304 and the second head 305 relative to each other and fixes the relationship between the first head 304 and the second head 305 so that the first head 304 and the second head 305 do not rotate relative to each other.

[0043] Figure 13A magnetic component module 200 with a head 205 connected to a substrate 220 is shown. A short support 217 of the head 205 can be soldered to the substrate 220 to create an electrical and mechanical connection between the magnetic component module 200 and the substrate 220. Circuit components and / or connectors 222 can be located on the bottom surface of the substrate. Figure 13 It is also shown that the head and wiring junction can be overmolded using overmolding material 230. Overmolding material 230 can include any suitable overmolding material. For clarity, overmolding material 230 is... Figure 13 The material is shown as transparent, but the overmolding material 230 does not need to be transparent. Although Figure 13 A substrate 220 without inner layers is shown, but a multilayer substrate may also be used. The substrate 220 may include a support 221 that can be attached to a main substrate (not shown).

[0044] Figure 14 and Figure 15 A magnetic assembly module 200 is shown, having a head 205 connected to a substrate 220 via a support 207 on the head 205. Instead of the support 207, the head 205 can be attached to the substrate 220 using any suitable structure, including, for example, a lead frame. The lead frame can be made of any suitable conductive material. Figure 14 As shown, the magnetic component module 200 may include a cover 215 covering the head 205. The cover 215 may include structures to prevent the cover 215 from contacting the wiring junction 203, such as a support, a stop, a lug, etc. Figure 14 The diagram shows that a cover 215 can cover a portion of the core 206, wiring junction 203, and head 205. A support 207 for the head 205 can be mounted on a substrate 220, with a space between the bottom of the head 205 and the top surface of the substrate 220. The space between the head 205 and the substrate 220 can be used to mount circuit components and other electronic components 222 and to increase the surface area of ​​the magnetic component module 200 to facilitate cooling. The support 207 for the head 205 can be used to save space and increase circuit density. Although... Figure 14 and Figure 15 A substrate 220 without inner layers is shown, but a multilayer substrate may also be used. The substrate 220 may include a support 221 that can be attached to a main substrate (not shown).

[0045] Figure 16 This is a block diagram illustrating an example implementation of the Magnetic Components module (TXM). Figure 16 In the diagram, the magnetic component module TXM is implemented as an isolation converter, with the isolation boundary indicated by the dashed line through the transformer TX. Figure 16 The primary side on the left and connected to the primary winding PR is located at Figure 16The right side is isolated from the secondary side connected to the secondary winding SEC. For example, Figure 16 The illustrated electronic module TXM may include a switching stage SS, a control stage CS, a transformer TX, a rectifier stage RS, and an output filter LC. The transformer TX may include a core and windings defined by the aforementioned wiring junctions and traces. Circuitry and components other than the transformer TX may include other electronic components attached to the substrate or PCB on which the transformer TX is mounted, as previously described.

[0046] like Figure 16 As shown, the switching stage SS receives an input voltage Vin and outputs a voltage SSout to at least one primary winding PRI of the transformer TX. The switching stage may include switches or transistors that control the power flow. The control stage CS includes an input control signal CSin. The control stage CS can control the switching of the switches in the switching stage SS and can monitor the transformer TX via the auxiliary winding AUX. The vertical dashed line through the transformer TX represents the current isolation between the primary winding PRI and the auxiliary winding AUX and the secondary winding SEC. The secondary winding of the transformer TX may be connected to a rectifier stage RS, which in turn is connected to an output filter LC that outputs a DC voltage between +Vout and -Vout. The rectifier stage may include diodes and / or synchronous rectifiers that rectify the voltage at the secondary winding SEC. The output filter LC may include an arrangement of inductors and capacitors to filter out unwanted frequencies.

[0047] Figure 17 It can include Figure 16 The diagram shows a block diagram of the gate drive circuit application for one or more magnetic component modules (TXM). The vertical and horizontal dashed lines represent current isolation. Figure 17 The magnetic component module TXM shown may include, for example, a +12Vdc input and -5Vdc and +18Vdc outputs, which can be used to drive, for example, metal-oxide-semiconductor field-effect transistors (MOSFETs) or insulated-gate bipolar transistors (IGBTs). The outputs of the magnetic component module TXM can be connected to the gate driver IXDD614YI. The controller CONT can send and receive control signals represented by those shown in the dashed boxes, including, for example, power-off, pulse-width modulation (PWM) enable, low-side and high-side PWM, overcurrent detection, etc. Control signals can be sent and received between the controller CONT and the isolation circuit ISO, and between the controller CONT and the magnetic component module TXM. The isolation circuit ISO can receive and send feedback signals, such as VDS measurement. The isolation circuit may include transformers, capacitors, optocouplers, digital isolators, etc. The output of the gate drive circuit can be connected to the gate of a switch located in the inverter unit circuit, as a means for, etc. Figure 18This is part of an inverter used in a motor control application.

[0048] Figure 18 A circuit for a motor control application is shown, which may include a power supply PS, such as an inverter INV, operating at a fixed frequency of 50Hz or 60Hz, and a motor MTR operating at the desired frequency. As shown, the inverter INV may include a power converter PC, a smoothing circuit S, and an inverter unit circuit IU controlled by PWM control. Figure 18 It is shown that the controller CONT can be included to control Figure 17 The gate drive unit (GDU) controls the gate of the switch within the inverter unit circuit (IU). Feedback (FB) can be provided from the motor MTR to the controller CONT to stabilize the control of the gate drive unit (GDU).

[0049] The package including the magnetic component module can be of any size. For example, the package can be approximately 12.7 mm × approximately 10.4 mm × approximately 4.36 mm. Packages with these dimensions can provide higher isolation. Magnetic component modules can be used in many different applications, including, for example, industrial, medical, and automotive applications. For example, as described above, the magnetic component module can be included in a gate driver. For example, the magnetic component module can provide 1W to 2W of power with an efficiency exceeding 80%, and can provide a breakdown voltage of 3kV or 5kV depending on the footprint of the magnetic component module. For example, the magnetic component module can include enhanced isolation required by UL and can operate in temperatures between approximately -40°C and approximately 105°C or between approximately -40°C and approximately 125°C. For example, depending on the application, the magnetic component module can have a moisture sensitivity rating (MSL) of 1 or 2. Magnetic component modules can be used in battery management systems or programmable logic controllers, as well as for data acquisition and communication compliant with RS484 / 232.

[0050] If the magnetic component module includes a transformer, the primary winding may include at least 20 turns and the secondary winding may include 12 turns. For example, the coupling coefficient of the transformer may be 0.99. For example, the primary winding may have a DC resistance (DCR) of approximately 17.8 Ω / turn, and the secondary winding may have a DCR of approximately 16.9 Ω / turn. The maximum current may be 600 mA (overcurrent protection), but a typical current is 300 mA, for example, to ensure that the magnetic component module is not damaged under such overcurrent conditions. For example, the core may have an inner diameter of approximately 5.4 mm, an outer diameter of approximately 8.8 mm, and a height of approximately 1.97 mm. For example, the spacer may have an inner diameter of approximately 5.1 mm, an outer diameter of approximately 8.8 mm, and a height of approximately 0.2 mm. For example, the transformer may have a size of approximately 12.7 mm × approximately 10.4 mm × approximately 2.5 mm. The core can be made of any suitable material, including, for example, Mn-Zn, Ni-Zn, FeNi, etc. The spacers can be made of any suitable material, including, for example, epoxy resin adhesive. The wiring joints can be made of any suitable material, including, for example, aluminum or copper. The leads can be made of any suitable material, including, for example, Cu with a Ni-Sn coating. The overmolding material can be made of any suitable material, including, for example, epoxy resin.

[0051] It should be understood that the above description is merely illustrative of the invention. Various alternatives and modifications can be devised by those skilled in the art without departing from the scope of the invention. Therefore, the invention is intended to encompass all such alternatives, modifications, and variations falling within the scope of the appended claims.

Claims

1. A magnetic component module, comprising: a first header, the first header being a molded header; a core, on the first header; and windings, including a first trace on the first header and additional traces; wherein the first header includes: a disc-shaped portion extending only along a bottom surface of the core and supporting the core; stands extending from the disc-shaped portion; and a cylindrical portion of a hole receiving the core, the first trace extends along the disc-shaped portion adjacent to a bottom surface of the core and along the cylindrical portion adjacent to an inner surface of the core, and the additional traces extend from a top side of the first header to a bottom side of a corresponding stand of the stands such that, when the first header is connected to a substrate, the additional traces are electrically connected to pads on the substrate.

2. The magnetic component module of claim 1, further comprising a core stand between the first header and the core.

3. The magnetic component module of claim 1, wherein the first trace is electrically connected to the substrate.

4. The magnetic component module of claim 1, further comprising a second header including a first trace.

5. The magnetic component module of claim 4, wherein the second header is stacked on the first header.

6. The magnetic component module of claim 5, further comprising: a second trace on the first header; a second trace on the second header; a first routing junction on the core and connecting the first trace on the first header with the second trace on the first header; and a second routing junction on the core and connecting the first trace on the second header with the second trace on the second header.

7. The magnetic component module of claim 6, further comprising an overmold encapsulating the first header, the core, the second header, the first routing junction, and the second routing junction.

8. The magnetic component module of any of claims 1-7, further comprising an overmold encapsulating a portion of the first header. electronic components are mounted between the first header and the substrate and on the substrate.

10. The magnetic component module of any of claims 1-5, further comprising:

9. The magnetic assembly module of claim 8, wherein, a second trace on the first header; and a routing junction on the core and connecting the first trace on the first header with the second trace on the first header.

11. The magnetic component module of claim 10, further comprising an overmold encapsulating the first header, the core, and the routing junction. the stands include surface mount structures or ridges.

13. A magnetic component module, comprising: a first header, the first header being a molded header having a cup shape with an inner rim and an outer rim and including stands extending from the first header; 12. The magnetic assembly module of any one of claims 1 to 7, wherein, a core, on the first header; and windings, including a first trace on the first header and additional traces; ​ ​ ​ a winding including a first trace on the first header and an additional trace and a first routing junction extending between the inner and outer edges of the first header and connected to the first trace; wherein the first trace extends along the first header adjacent to the inner, bottom, and outer surfaces of the core, and the additional trace extends from a top side of the first header to a bottom side of a corresponding one of the standoffs such that, when the first header is connected to a substrate, the additional trace is electrically connected to a pad on the substrate.

14. The magnetic component module of claim 13, further comprising a core standoff between the first header and the core.

15. The magnetic component module of claim 13, further comprising a second header having a cup shape with an inner edge and an outer edge, the second header including a second trace and stacked on the first header.

16. The magnetic component module of claim 15, further comprising a second routing junction extending between the inner and outer edges of the second header and connected to the second trace.

17. The magnetic component module of any of claims 13-16, further comprising an overmold material encapsulating a portion of the first header.

18. The magnetic assembly module of claim 17, wherein, electronic components are mounted between the first header and the substrate and on the substrate.

19. The magnetic component module of claim 16, further comprising an overmold material encapsulating the first header, the core, the first routing junction, and the second routing junction.

20. The magnetic assembly module of any of claims 13-16, wherein, the standoffs include surface mount structures or ridges.

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