Additive manufacturing methods for components

Abstract

The present disclosure relates to a method of forming a single sintered body, which may include cutting a first portion and a second portion from a raw material sheet. The raw material may include ceramic or metal particles suspended in a binder. The first portion may be positioned in contact with the second portion, and the portions may be sintered together to form a single body.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This patent application claims priority to U.S. Provisional Patent Application No. 63 / 069,435, filed on August 24, 2020, entitled “ADDITIVE MANUFACTURING METHODS FOR COMPONENTS,” the entire disclosure of which is hereby incorporated by reference into this document. Technical Field

[0003] The embodiments described herein generally relate to electronic device components formed using additive manufacturing processes. More specifically, the examples relate to layered metal components. Background Art

[0004] Electronic devices are ubiquitous in society and can take many forms, from watches to computers. Electronic devices, including portable electronic devices such as handheld phones, tablet computers, and watches, typically include some type of housing or casing that houses the internal components.

[0005] The manufacture of such housings or enclosures may benefit from increased output, reduced material waste, and reduced machining requirements. Therefore, it may be desirable to use additive manufacturing processes to produce device housings to reduce material waste and machining costs and increase output.

[0006] In addition, such housings or enclosures may benefit from a combination of multiple materials forming the components. The combination of multiple materials in a complex design configuration may introduce complexity into conventional manufacturing processes. For example, when manufactured using conventional techniques, a device housing formed of multiple materials may require increased processing time, materials, and costs. In some examples, common manufacturing processes may not be able to produce a device housing with a desired combination of characteristics. Therefore, it may be desirable to provide a processing and manufacturing technique that allows the production of a device housing with a desired combination of different characteristics at high efficiency, low cost, and low waste. Summary of the invention

[0007] According to some aspects of the present disclosure, the unitary body may include a sintered metal defining a plurality of 3 To about 10,000cm 3 The volume between the closed cavities.

[0008] In some examples, the sintered metal includes a first layer bonded to a second layer at an interface including a striated microstructure. The first layer includes an outer portion and an inner portion, the outer portion having a higher density than the inner portion. The sintered metal includes a first region having a first density and a second region having a second density different from the first density. The unitary body may also include a residual binder, the unitary body including between about 0.001% and about 70% by weight of the residual binder. The sintered metal includes a sidewall defining a closed cavity and a bottom plate, the sidewall having an angle greater than about 20° relative to the bottom plate. The sintered metal includes at least one of aluminum, steel, or titanium.

[0009] According to some aspects, a method of forming a unitary body may include removing at least one of a first portion and a second portion from a feedstock including particles suspended in a binder; positioning the first portion in contact with the second portion; and sintering the first portion and the second portion to form the unitary body.

[0010] In some examples, the method may further include positioning a third portion in contact with the second portion, the third portion being cut from the raw material and defining a hole. In other examples, the method may include positioning a third portion including a second material in contact with the first portion, such that the first portion is disposed between the second portion and the third portion. The first portion may include an adherent between the second portion and the third portion before sintering. The single body defines a closed cavity. The first portion includes a first particle and the second portion includes a second particle, the first particle including a material different from the second particle. The method may further include positioning the component in a volume defined by the single body. The raw material includes a binder between about 0% and about 70% by weight. Removing at least one of the first and second portions from the raw material may include laser cutting at least one of the first and second portions from the raw material. Laser cutting at least one of the first and second portions from the raw material may include cutting at least one of the first and second portions in a desired shape having a dimensional tolerance of less than about 10 microns. Sintering the first and second portions to form a single body may include heating the first and second portions to a temperature of at least about 500° C. The method may further include debonding the first and second portions.

[0011] According to some aspects, the metal part may include a single sintered body having a density greater than about 95%, the single sintered body including a first layer fused to a second layer along a planar interface region including a striated microstructure. In some examples, the single sintered body includes steel. The single sintered body includes a first metal and a second metal different from the first metal. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The present disclosure will be readily understood by the following detailed description in conjunction with the accompanying drawings, wherein like reference numerals refer to like structural elements, and wherein:

[0013] Figure 1 A perspective view of an electronic device is shown.

[0014] Figure 2 Shows Figure 1 An exploded view of the electronic equipment.

[0015] Figure 3A Shows Figure 1 A perspective view of a housing component of an electronic device.

[0016] Figure 3B Shows Figure 3A A cross-sectional view of the housing components.

[0017] Figure 3C The diagram shows a schematic diagram of a system including operating components. Figure 3A A cross-sectional view of the housing components.

[0018] Figure 3D A cross-sectional view of a housing component of an electronic device is shown.

[0019] Figure 4 A perspective view of an electronic device is shown.

[0020] Figure 5 Shows Figure 4 An exploded view of the electronic equipment.

[0021] Figure 6 Shows Figure 4 A perspective view of components of an electronic device.

[0022] Fig. 7A A perspective view of a single body is shown.

[0023] Figure 7B Shows Fig. 7A A cross-sectional view of a single body.

[0024] Figure 7C Shown are components including Fig. 7A A cross-sectional view of a single body.

[0025] Fig.7D Shows Fig. 7A A cross-sectional view of a single body.

[0026] Fig. 8A A process flow diagram illustrating a method of forming a unitary body.

[0027] Figure 8B A cross-sectional view of a single body is shown.

[0028] Figure 8C A cross-sectional view of a single body is shown.

[0029] Fig.8D A cross-sectional view of a single body is shown.

[0030] Fig. 8E An exploded view of components of an electronic device is shown.

[0031] Fig. 9A The raw materials used in the process of forming a unitary body are shown.

[0032] Fig. 9B shows a stage in the process of forming a unitary body Fig. 9A Raw materials.

[0033] Fig. 9C A stage in the process of forming a unitary body is shown.

[0034] Fig.9D A perspective view of the resulting unitary body is shown.

[0035] Fig.9E Shows Fig.9D Cross-sectional view of the microstructure of a single body. DETAILED DESCRIPTION

[0036] Reference will now be made specifically to the representative embodiments shown in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to a preferred embodiment. On the contrary, it is intended to cover alternatives, modifications and equivalent forms that may be included in the spirit and scope of the embodiments defined by the appended claims.

[0037] One aspect of the present disclosure relates to a method for forming a single sintered part, such as a single sintered metal part for an electronic device. The method for forming a metal part, such as a housing component for an electronic device, may include forming a feedstock material including a polymer binder and metal particles. Multiple blocks or portions may be removed from the feedstock by laser cutting or stamping. The blocks can be removed in a desired shape, such as a shape corresponding to a cross-sectional layer of a part to be formed, with high dimensional accuracy. The blocks can be assembled in a desired arrangement.

[0038] Additive manufacturing, also known as 3D printing, can refer to a process of forming a three-dimensional part by depositing material onto a substrate or other portion of a material. Materials used in additive manufacturing processes can include metals, plastics, ceramics, and composites. Conventional techniques for 3D printing can involve selectively depositing or printing a mixture of a binder material and powder onto a substrate or platform. The green piece can then be stretched or built up layer by layer into the desired shape, after which the binder can be burned out and the powder can be sintered or fused together.

[0039] Conventional 3D printing techniques that rely on a print head to stretch layers of material can form a wide variety of shapes and geometries, but can also be limited in certain respects. For example, relatively large unsupported spans can be difficult or impossible to produce because many of the stretched layers are unsupported until the entire structure has been stretched, causing them to collapse under their own weight. Examples of such geometries include bridge structures or hollow box structures. As used herein, the term hollow box may refer to any geometry having a cavity or defining a volume completely enclosed by material without supports within the cavity or volume.

[0040] In contrast, the additive manufacturing processes described herein can produce essentially any geometry or structure as desired, including structures having relatively large unsupported spans and / or completely enclosed cavities or volumes. These structures, which are typically difficult to print, can be easily formed by removing portions of material from a block or sheet of raw material including a binder and powder and positioning the portions adjacent to each other to form a part. This may be because each layer of material can be removed from the raw material as a single self-supporting block and then positioned at a desired location on the part, rather than being formed in a non-self-supporting manner at a desired location. While some conventional techniques (such as binder jet 3D printing) can produce relatively large unsupported spans with bridge geometries, these techniques are also generally unable to produce closed hollow box geometries.

[0041] The additive manufacturing processes described herein can also produce components and parts with highly precise shapes with resolutions in the range of several microns. While conventional 3D printing techniques can be limited in size by the size of the print head and the flow of binder and powder being deposited, the methods described herein can include high-precision techniques such as stamping or laser cutting to form parts from raw materials. The ability to form an entire layer or part from raw materials can also result in a reduction in manufacturing time because the print head does not need to traverse the entire area of ​​each layer of the part. In addition, the additive manufacturing processes described herein can produce parts and components of multiple densities or forms including multiple materials and / or a single material because different raw materials can be used to form various parts of the part as needed.

[0042] The following references Figures 1 to 9E These and other embodiments are discussed. However, those skilled in the art will readily appreciate that the detailed description given herein with respect to these figures is for illustrative purposes only and should not be construed as limiting.

[0043] Figure 1 An example of an electronic device 100 is shown. Figure 1 The electronic device shown in FIG. 1 is a watch, such as a smart watch. Figure 1The smartwatch of FIG. 1 is only one representative example of a device that can be used with the components and methods disclosed herein. The electronic device 100 can correspond to any form of wearable electronic device, portable media player, media storage device, portable digital assistant (“PDA”), tablet computer, computer, mobile communication device, GPS unit, remote control device, etc. The electronic device 100 can be referred to as an electronic device, device, or consumer device. Figure 2 and Figure 3A Further details of the electronic device 100 are provided.

[0044] Reference now Figure 2 , the electronic device 100 includes a main housing or case 102. The housing or case 102 is connected to a front cover 116 and may have a band 150 attached thereto. A plurality of input elements such as a rotatable crown 144 and / or a button 142 may be attached to the housing 102 and protrude from the housing. The housing 102 may substantially define at least a portion of the outer surface of the device 100. The cover 116 may include glass, plastic, ceramic, or any other substantially transparent material, component, or assembly. The cover 116 may cover or otherwise cover a display, camera, touch-sensitive surface such as a touch screen, or any component of the device 100. The cover 116 may define the front outer surface of the device 100. A rear cover 130 may also be attached to the housing 102, for example, opposite to the cover 116. The rear cover 130 may include ceramic, plastic, metal, or a combination thereof. In some examples, the rear cover 130 may include an electromagnetically transparent portion 132. The electromagnetically transparent portion 132 may be transparent to electromagnetic radiation of any wavelength, such as visible light, infrared light, radio waves, or a combination thereof. The housing 102, the cover 116, and the rear cover 130 together may substantially define the internal volume and the outer surface of the device 100. In some examples, the housing 102 defines at least a portion of the rear cover 130 so that the rear cover 130 and the housing 102 are integrally formed. The housing 102 may be formed of a metal material. As discussed in more detail below, the housing 102 may be formed using an additive manufacturing process such as direct metal deposition. In some examples, the housing 102 may also include a surface layer formed by a physical vapor deposition process.

[0045] Housing 102 can be a substantially continuous or unitary component and can include one or more openings 104, 106 to receive components such as components 142 and 144 of electronic device 100 and / or provide access to interior portions of electronic device 100. Additionally, other components of electronic device 100 can be formed from or can include metal or ceramic materials formed using methods and techniques as described herein.

[0046] The device 100 may also include internal components such as a haptic engine 124, a battery 122, and a system-in-package (SiP) including one or more integrated circuits 126 such as a processor, a sensor, and a memory. The SiP may also include an enclosure. All or a portion of one or more internal components may be housed within an internal volume defined by the housing 102.

[0047] Internal components, such as one or more of components 122, 124, 126, may be disposed within an interior volume at least partially defined by housing 102 and may be attached to housing 102 via interior surfaces, attachment features, threaded connectors, studs, posts, or other features formed into, defined by, or otherwise becoming part of housing 102, and / or cover 116 or rear cover 130. In some examples, attachment features may be relatively easy to form on the interior surface of housing 102, such as by machining. In some examples, attachment features may be formed in an additive manufacturing process, as described herein.

[0048] The housing 102 formed of a metal material may conform to the internal dimensional requirements defined by the internal components 122, 124, 126. For example, the structure of the housing 102 may be solely or primarily defined or limited by the internal components that the housing 102 is designed to accommodate. That is, the housing 102 may be shaped to accommodate the internal components 122, 124, 126 in a dimensionally efficient manner without being constrained by factors other than the size of the components, such as conventional manufacturing limitations.

[0049] Any number or variety of parts or components (e.g., components of electronic devices) may be formed according to the processes described herein and may include structures as described herein. The structures and materials of the parts and components, as well as the components themselves, may apply not only to the specific examples discussed herein, but also to any number or variety of examples in any combination. Various examples of components formed by the additive manufacturing processes described herein are referred to below. FIG. 3A to FIG. 3D described.

[0050] Reference now Figure 3A , shows a perspective view of a housing 102 of an electronic device 100. The housing 102 may include a metal or ceramic structure that is partially or completely formed using the additive manufacturing processes described herein. Figure 3A The illustrations may represent the shape and design of the structure immediately after being formed using the processes described herein, or may represent the final housing after additional processing (such as machining).

[0051] The housing 102 may also include features, such as a speaker port, a button hole, or a charging port hole. As shown, holes 104, 106 may be integrally formed in the housing 102. In some examples, a protruding feature 108 may also be integrally formed in the housing 102 by the processes described herein. Feature 108 may be a support structure that may be engaged with a fastener or other component when assembling the electronic device, while features 104 and 106 may be configured to receive buttons or inputs of the electronic device. As discussed in more detail below, the housing 102 may be formed or processed to define features.

[0052] Figure 3B A cross-sectional view of a housing component 202 is shown, which may be substantially similar to Figure 3A The housing 102 shown includes Figure 3A Some or all of the features of the housing 102 shown. The housing 202 can be formed by an additive manufacturing process as described herein, and as can be seen, can have a hollow box geometry, including a cavity or volume 216 defined by at least an outer wall 212 and an inner wall 214. In some examples, the outer wall 212 can also at least partially define the outer surface of the housing 202 and the associated electronic device, while the inner wall 214 can at least partially define the interior volume of the electronic device. In some examples, one or more features 218 can be formed within the cavity 216 as desired. These features 218 can be attachment features or support features for other components, can provide thermal management to the device, or can have any function or geometry as desired.

[0053] Additionally, in some examples, the geometry of the housing 202 defining the cavity 216 including the feature 218 therein may not be achievable by conventional manufacturing processes. In some examples, and as further described herein, the cavity 216 may be formed by forming a green part according to the processes described herein that includes a portion of a binder material that does not include any powder at the location of the cavity 216. When the green part is subsequently subjected to debinding and / or sintering, as described herein, substantially no binder or other material remains in the cavity, while the powder is sintered or fused to form the sidewalls 212, 214.

[0054] Figure 3C Shows Figure 3B, which includes an operating component 220 disposed in a cavity 216 and attached to a feature 218. The operating component 220 may be attached to the feature 218 by any technique, such as adhesive, clamp, and / or mechanical interlock, as desired. The operating component 220 may include any type or combination of computing components, digital components, or mechanical components as desired. For example, the operating component 220 may include one or more sensors or inductive charging components. By providing space for positioning the component 220 within the housing 202 itself, the geometry of the housing 202 defining the cavity 216 may allow the device to include additional components or functions without occupying space within the internal volume of the device itself. Therefore, this configuration may allow the device to be reduced in size and / or increase the level of performance or functionality. In addition, in the example of the inductive charging component 220, the position of the component 220 near the outer surface defined by the outer wall 212 may also allow for improved performance.

[0055] In some examples, the housing 202 may define a hole or opening in communication with the cavity 216 to allow the operative component 220 to be inserted or positioned at a desired location. In some examples, such as when the component 220 includes a structural component or a mechanical component, the housing 202 or a portion thereof may be formed around the component 220 by the processes described herein. More details regarding the structure of the component formed according to the processes described herein are relative to Figure 3D Have a discussion.

[0056] Figure 3D A cross-sectional view of a housing 302 is shown, which may be substantially similar to Figure 3A The housing 102 shown includes Figure 3A The housing 302 may include some or all of the features of the housing 102 shown. The housing 302 may include a single body or part, but as shown, the housing 302 may include a plurality of different materials, such as a plurality of different metals and / or ceramics. For example, the housing 302 may include one or more outer portions 312 fused or bonded to one or more inner portions 316, 317. In some examples, the outer portion 312 may include a first metal, such as steel, and the inner portions 316, 317 may include a different second metal, such as aluminum.

[0057] The ability to select different materials to form various portions of a component such as housing 302 may allow for advantageous combinations of properties of several materials. For example, a configuration in which outer portion 312 comprises steel and inner portions 316, 317 comprise aluminum may allow housing 302 to have an outer surface material that is relatively hard and durable while having an inner surface that is relatively lightweight and easily machined.

[0058] In some examples, both the outer portion 312 and the inner portions 316, 317 can be formed as a single body according to the processes described herein. However, in some examples, one or more of the outer portion 312 and / or the inner portions 316, 317 can be preformed by another process, and the other of these portions can be formed and fused to the preformed portion according to the processes described herein.

[0059] However, housing 302 is not limited to having a two-part construction, and the different parts including different materials can have any geometry or arrangement as desired. For example, housing 302 can include feature 313, which can be formed according to the processes described herein and fused or bonded to portion 316, which can be preformed or formed simultaneously with feature 313. Feature 313 can include a different material than portion 316 to which it is fused. In some examples, the feature can be an attachment feature or a support feature for a component positioned in the interior volume defined by housing 302.

[0060] Additionally or alternatively, the outer portion 312 may include a protrusion 314 that may extend into or through the inner portions 316, 317. The protrusion 314 may be a support feature, an attachment feature, or any other feature as desired. For example, the protrusion 314 may allow controlled thermal communication between the outer portion 312 and the interior volume of the housing 302. Figure 3D 3. A particular configuration is shown in FIG. 3, but it should be understood that a component such as housing 302 may include any number of parts formed from any number of materials in any shape, size, and configuration.

[0061] In addition, in some examples, the various parts of the shell 302 may include the same material, but may have different densities. For example, the outer portion 312 may include a material having a first density, such as a metal or ceramic material, while the inner portions 316, 317 may include the same material having a different second density. In some examples, the outer portion 312 may have substantially any density described herein, such as a density of at least about 99%. In some examples, the inner portions 316, 317 may also have substantially any density described herein, such as a density of less than about 80%. In some examples, the inner portions 316, 317 may be considered foam. In addition, in some examples, the density of any portion of the shell 302 may vary in one or more dimensions of the portion. That is, any portion of the shell 302 may have a variable density at one or more regions, a stepped density between two or more regions, and / or a density gradient between two or more regions. In some examples, and as further described herein, the density of a component or part formed according to the methods described herein may be controlled by controlling the binder loading percentage of the raw material used to form the portion of the component or part.

[0062] As used herein, the terms exterior, outside, interior, inside, front, back, top, and bottom are used for reference purposes only. An exterior portion or exterior portion of a component may form a portion of an exterior surface of a component, but may not necessarily form the entire exterior of the exterior surface of the component. Similarly, an interior portion or interior portion of a component may form or define an interior portion or interior portion of a component, but may also form or define a portion of an exterior surface or exterior surface of a component. In some orientations of a component, a top portion of a component may be located above a bottom portion of the component, but may also be in line with, below, or in other spatial relationships with the bottom portion depending on the orientation of the component.

[0063] Any number or variety of parts or components (e.g., components of electronic devices) may be formed according to the processes described herein and may include structures as described herein. The structures and materials of the parts and components, as well as the components themselves, may apply not only to the specific examples discussed herein, but also to any number or variety of examples in any combination. Various examples of components formed by the additive manufacturing processes described herein are referred to below. Figures 4 to 6 Give a description.

[0064] Figure 4 An exemplary electronic device 400 is shown that may have a housing or other component that includes structures formed according to the processes described herein. Figure 4The electronic device 100 shown in the figure is a display or monitor used, for example, with a computer. However, this is merely a representative example of a device that can be used in conjunction with the concepts disclosed herein. For example, the electronic device 400 can correspond to a portable media player, a media storage device, a portable digital assistant ("PDA"), a tablet computer, a computer, a mobile communication device, a GPS unit, a remote control device, etc. The electronic device 400 can be referred to as an electronic device or a consumer device. Figure 5 More details of the electronic device 400 are illustrated in FIG.

[0065] Reference now Figure 5 , the electronic device 400 may include a housing 102 and a cover 403 attached to the housing 402. A plurality of internal components such as a display assembly 410, computing components, and other components may be disposed between the housing 402 and the cover 403. The housing 402 may substantially define at least a portion of an exterior surface of the device 400. The cover 403 may include glass, plastic, or any other substantially transparent material, component, or assembly. The cover 403 may cover or otherwise cover the display assembly 410, a camera, a touch-sensitive surface such as a touch screen, and other components of the device 400. The cover 403 may define a front exterior surface of the device 400. The housing 402 and the cover 403 together may substantially define an exterior surface of the device 400.

[0066] Device 400 may also include internal components, such as processors, memory, circuit boards, batteries, light emitting diodes (LEDs), fans, sensors, and other computing components. Such components may be disposed within an internal volume defined at least in part by housing 101 and may be attached to housing 402 via interior surfaces formed into, defined by, or otherwise part of housing 402 and / or cover 403, attachment features, threaded connectors, studs, columns, and the like.

[0067] The housing 402 may be formed according to the additive manufacturing process described herein, and thus may include unique or complex geometries. For example, the housing 402 may include an area with a three-dimensional structure to allow for enhanced cooling performance, noise reduction, and / or aesthetics. A three-dimensional structure, such as a three-dimensional structure formed in an area of ​​the housing 402, may include a body having a first surface and a second surface, the first surface forming a portion of the exterior of the electronic device 400, and the second surface defining at least a portion of the interior volume of the housing 402. In addition, other components of the electronic device 400, such as internal structural components, may be formed by an area formed according to the process described herein, or may include an area formed according to the process described herein. In some examples, the housing 402 or other components may include a body in which one or more cavities extend from a first surface of the body into the body and one or more cavities extend from a second surface of the body into the body. One or more cavities extending from the second surface of the body into the body may intersect or interfere with one or more cavities extending from the first surface of the body into the body to form a three-dimensional pattern of holes or channels in the body.

[0068] The body of a structure (e.g., a continuous structure formed according to the process described herein) may include one or more structures formed in one or more surfaces of the body, defined by one or more surfaces of the body, or extending from one or more surfaces of the body into the body. For example, the body may have a generally cubic shape, a generally spherical shape, a generally cylindrical shape, a generally annular shape, etc. In some examples, the body may have the general shape of any polyhedron. In some other examples where the three-dimensional pattern extends through one or more regions of the body, the regions may be separated by one or more portions of the body that do not include the three-dimensional pattern. The one or more portions separating the regions of the body that include the three-dimensional pattern may be substantially continuous. However, in some examples, one or more portions may include structures or features formed in or on one or more portions. As used herein, the term "three-dimensional pattern" may refer to a positive surface of a three-dimensional structure, or a negative space at least partially surrounded or defined by a surface or body. In addition, the term "enclosed" as used herein refers to a volume that is completely enclosed or entirely enclosed by the surface of the body, and does not include any passage between the volume and the surrounding environment outside the body. The three-dimensional pattern may include one or more irregular shapes, regular shapes, repeating shapes, or a combination thereof.

[0069] Figure 6A perspective view of a housing 402 including a three-dimensional structure and formed according to the additive manufacturing process described herein is shown. The housing 402 may include a unitary body. The housing 402 may include at least a first surface 404 and a second surface 406. In some examples, the first surface 404 and the second surface 406 may be opposing surfaces of the housing 402. For example, the first surface 404 may be parallel to and opposite to the second surface 406. However, in some examples, the first surface 404 and the second surface 406 may not be substantially parallel or opposite, and may be adjacent to each other or disposed at any angle relative to each other.

[0070] One or more first cavities 408 or recesses may extend from the first surface 404 into the housing 402, and one or more second cavities 414 or recesses may extend from the second surface 406 into the housing 402. The first cavity 408 and / or the second cavity 414 may have substantially the same size and shape as one another, but in some examples, the size and shape of the first cavity 408 and / or the second cavity 414 may be different from one another. The first cavity 408 and / or the second cavity 414 may have a substantially spherical or hemispherical shape, such that the negative space of the cavity 408, 414 may have the shape of a portion or region of a sphere. However, in some other examples, the first cavity 408 and / or the second cavity 414 may have any shape. It can be seen that the first cavity 408 and / or the second cavity 414 may be arranged in a pattern, such as a regular or repeating pattern of the first cavity 408 and / or the second cavity 414. In some examples, the pattern may include a close-packed pattern of a first cavity 408 and / or a second cavity 414 that is substantially spherical, such as a hexagonal close-packed pattern of cavities 408, 414 that are substantially spherical. As used herein, a hexagonal close-packed pattern is intended to be understood as a structure that substantially corresponds to a layer of spheres or sphere portions that are stacked so that the spheres or sphere portions in alternating layers are superimposed on each other and aligned in the gaps of the preceding layer. The traditional packing coefficient of a hexagonal close-packed system is typically 0.74, but can be higher in the system of the present disclosure due to the generation of overlapping or interference patterns. In addition, it can be seen that the area of ​​the housing 402 where the first cavity 408 and the second cavity 414 extend into the body can be separated by a portion 412 of the body that does not include a three-dimensional pattern.

[0071] Any number or variety of parts or components (e.g., components of electronic devices) may be formed according to the processes described herein and may include structures as described herein. The structures and materials of the parts and components, as well as the components themselves, may apply not only to the specific examples discussed herein, but also to any number or variety of examples in any combination. Various examples of components formed by the additive manufacturing processes described herein are referred to below. 7A to 7D Give a description.

[0072] Fig. 7A A perspective view of a unitary body 502 comprising a sintered metal and / or ceramic material and formed according to the additive manufacturing process described herein is shown. Although the body 502 is shown as having a particular geometry, it should be understood that the unitary body 502 can have substantially any desired geometry. The body 502 can define an outer surface 504 and can include one or more features 506 that can extend from the body 502. In some examples, the features 506 can be formed simultaneously with the body 502 according to the process described herein. However, in some examples, the body 502 can be formed before the features 506, and the features can be formed according to the process described herein and joined to the preformed body 502.

[0073] The body 502 may also define a cavity 510 or volume having a substantially hollow box-shaped geometry. That is, the body 502 may define a cavity 510 that may be completely or substantially completely enclosed by the body 502. The cavity 510 may be substantially uninterrupted by any features that provide support to those portions of the body 502 that define the cavity 510. In some examples, the cavity 510 may be at least partially defined by a top plate or other portion of the body 502 that spans a distance and is not supported by other portions of the body 502 other than those portions that define the cavity 510. In some examples, the angle of the sidewalls defining the cavity 510 relative to the floor, top plate, or other portion of the body 502 that defines the cavity may be greater than about 15°, 20°, 30°, 40°, 45°, 50°, 60°, 70°, 80°, or greater than about 90° or more. In some examples, the cavity may define a distance between about 1 cm and about 2 cm. 3 To about 10,000cm 3 Between, about 10cm 3 To about 5,000cm 3 Between, or between about 50cm 3 and about 1000cm 3 The closed volume between.

[0074] Figure 7B Shows Fig. 7A 502. As can be seen, cavity 510 can be completely or substantially enclosed by body 502. Body 502 can be formed by sintering multiple portions or layers of raw material material having a desired geometry, as described herein. Figure 7B The cross-section shown may correspond to the shape of a single such layer or portion. In some examples, cavity 510 may thus be defined by several portions or layers of body 502, one or more of which may define a hole or orifice. Alignment of several of these holes or orifices defined by the layers of body 502 may result in the formation of cavity 510, as described herein.

[0075] Although cavity 510 may be substantially empty or hollow, i.e., cavity 510 may not include any material of body 502, in some examples, cavity 510 may contain a component 520 disposed therein, such as Figure 7C . In some examples, component 520 may include thermal components, mechanical components, and / or operational components. In some examples, component 520 may include any type or combination of computing components, digital components, or mechanical components as desired. For example, component 520 may include one or more sensors or inductive charging components. In some examples, housing 502 may define a hole or opening in communication with cavity 510 to allow operational component 520 to be inserted or positioned at a desired location. However, in some examples, body 502 or portions thereof may be formed around component 520 by the processes described herein. Thus, in some examples, component 520 may not be directly connected to other operational components of the electronic device, but may include features that enable component 520 to wirelessly receive data and / or power from one or more sources outside cavity 510. Relative Fig.7D Further details of other configurations of unitary bodies formed according to the processes described herein are shown.

[0076] Fig.7D A cross-sectional view of a unitary body 602 is shown, which can be substantially similar to the unitary bodies described herein and include the unitary bodies described herein such as Fig. 7A As with body 502, single body 602 including sintered metal and / or ceramic material can define cavity 610. Additionally, in some examples, body 602 can include multiple different materials and / or materials having multiple different densities.

[0077] For example, body 602 can include one or more outer portions 604 fused or bonded to one or more inner portions 605. In some examples, outer portions 604 can include a first material, while inner portions 605 can include a different second material and / or a first material having a different second density and / or grain structure.

[0078] In some examples, both the outer portion 604 and the inner portion 605 can be formed as a single body 602 according to the processes described herein. However, in some examples, one or more of the outer portion 605 and / or the inner portion 604 can be preformed by another process, and the other of these portions can be formed and fused to the preformed portion according to the processes described herein. For example, the inner portion 605 can be preformed and include any material as desired, while the outer portion 604 can include a sintered metal and / or ceramic material that can be formed and fused to the inner portion 605 according to the processes described herein. However, the body 602 is not limited to having a two-part construction, and the different portions including different materials can have any number, geometry, or arrangement as desired.

[0079] Any number or type of parts or components (e.g., components of electronic devices) may be formed according to the processes described herein and may include structures as described herein. The structures and materials of the parts and components, as well as the components themselves, may be applied not only to the specific examples discussed herein, but also to any number or type of examples in any combination. Various examples of the additive manufacturing processes described herein are referred to below. FIG. 8A to FIG. 9E Give a description.

[0080] Fig. 8A A process flow diagram of a method 700 of forming a unitary body is shown, which unitary body may be substantially similar to the unitary bodies described herein and include some or all of the features of the unitary bodies described herein. At block 702, one or more portions or blocks may be removed from a feedstock including particles of ceramic and / or metallic material and a binder. At block 704, the blocks may be positioned to contact each other in a desired arrangement or geometry. At block 706, the blocks may be sintered to remove substantially all of the binder therefrom, and the particles of the blocks may be fused or joined into a unitary body including one or more sintered materials.

[0081] In some examples, the feedstock can include a polymer binder having a sinterable powder or sinterable particles disposed or suspended therein. In some examples, the polymer binder can include one or more polymer materials.

[0082] In some examples, the sinterable particles may include any metal and / or ceramic material as required. In some examples, the sinterable particles may have an average main size or diameter between about 1 micron and about 200 microns, between about 5 microns and about 150 microns, between about 10 microns and about 100 microns, between about 20 microns and about 50 microns, or between about 20 microns and about 40 microns. In some examples, the particles may have a relatively uniform size distribution. That is, the particles may all have substantially similar main sizes, for example, within about 5%, 10% or 15% of the average main size of the particles. However, in some examples, the raw material may include a variety of powder sizes as required. For example, the raw material may include a first powder having a first average main size or a range of main sizes, and a second powder having a different second average main size or a range of main sizes.

[0083] In some examples where the particles include metals, the metals may include one or more of steel, aluminum, copper, titanium, and / or alloys thereof in any combination as desired. In some examples where the particles include ceramics, the ceramics may include sapphire, zirconium oxide, or titanium dioxide in any combination as desired.

[0084] The raw material may have substantially any shape as desired, and may include a sheet in some examples. Thus, in some examples, one or more pieces may be removed from a raw material sheet at frame 702. In some examples, a variety of raw materials may be used, such that a first piece may be removed from a first raw material and a second piece may be removed from a different second raw material, the second raw material comprising, for example, a binder different from the first raw material and / or different particles. In some examples, removing one or more pieces from the raw material at frame 702 may be achieved by any technique as desired. In some examples, removing a piece from the raw material may be achieved by, for example, cutting a piece from the raw material with a blade, a tool, a laser, a water jet, or any other technique. In some examples, removing a piece from the raw material at frame 702 may include laser cutting one or more pieces from the raw material. In some examples, removing a piece from the raw material at frame 702 may include stamping one or more pieces using a stamping tool having a desired shape.

[0085] In some examples, the piece can be removed from the feedstock at box 702 in a desired shape and with a dimensional tolerance of less than about 1 millimeter (mm), less than about 750 microns, less than about 500 microns, less than about 250 microns, less than about 200 microns, less than about 100 microns, less than about 50 microns, less than about 25 microns, less than about 10 microns, or less than about 5 microns, or less.

[0086] At frame 704, these blocks can then be positioned relative to each other in a desired configuration or arrangement to form, for example, a green body corresponding to the desired shape or geometry of the final part. In some examples, the blocks are positioned directly adjacent to or in direct contact with each other. In some examples, the blocks can be positioned to directly contact other blocks or parts that they will fuse or engage. For example, one or more blocks removed from the raw material can be positioned to contact the preformed parts that they will fuse to as described herein. In some examples, adhesives or other materials can be used to keep the blocks in a desired configuration. In some examples, direct contact between the adhesives of the blocks can be sufficient to keep the blocks in the desired arrangement as a green body. In some examples, pressure can be applied to the blocks to enhance or maintain the desired arrangement as a green body.

[0087] Once the blocks have been positioned relative to each other in a desired arrangement, the blocks may be sintered at block 706 to form a single body, such as described herein. At block 706, sintering may include heating the blocks to one or more desired temperatures and for one or more desired durations. In some examples, the sintering process of block 706 may include a debonding step. That is, the blocks may be heated to volatilize and remove a portion or all of the binder comprising each block. In some examples, the debonding step may be performed separately from the sintering process. However, in some examples, debonding may occur during the sintering process at block 706.

[0088] In some examples, the sintering process may include heating the green body to a temperature of at least about 100°C, at least about 150°C, or at least about 200°C or higher for a desired duration. In some examples, the sintering process may include heating the green body to a temperature of at least about 300°C, at least about 350°C, at least about 400°C, at least about 450°C, at least about 500°C, or at least about 550°C or higher for a desired duration. In some examples, the sintering process may include heating the green body to a temperature of at least about 700°C, at least about 750°C, at least about 800°C, at least about 950°C, or at least about 1000°C or higher for a desired duration.

[0089] In some examples, the green body may be heated to a first temperature and maintained for a first duration, and then heated to one or more different temperatures and maintained for one or more durations as desired. Thus, in some examples, the sintering process of frame 706 may include heating the green body to any combination of temperatures described herein and for any combination of durations. In some examples, heating the green body to a first temperature may remove a first portion of the binder, while heating the green body to a higher second temperature may remove a second portion of the binder. In some examples, the first and second portions of the binder may include different polymers or components of the binder, such as components with different volatilization temperatures. In some examples, even after the sintering process of frame 706, at least a portion of the binder may remain in the final sintered part. In some examples, the final sintered part may have a residual binder between about 0% by weight and about 70% by weight; or a residual binder between about 0.001% by weight and about 70% by weight.

[0090] The sintering process of frame 706 may cause the metal and / or ceramic particles of the green body to sinter or fuse, thereby joining or fusing to each other to form a single body as described herein. In some examples, the sintering process of frame 706 may further increase the density of the material of the consolidation particles and densify the single body to a desired degree. For example, a sintered single body as described herein may have a density of at least about 30%, at least about 40%, at least about 50%, at least about 60%, at least about 70%, at least about 80%, at least about 90%, at least about 95%, at least about 96%, at least about 97%, at least about 98%, at least about 99%, or at least about 99.5% or more. In some examples, the sintered single body may be substantially 100% dense. In addition, as described herein, one or more portions of a single body may have different densities as desired.

[0091] As used herein, the term density may refer to the percentage of the volume of the sintered component that is occupied by the material of the green particles or powder. That is, the percentage of the volume of the unitary body that is not occupied by pores and / or open spaces between the sintered particles. Thus, the density of a unitary body may also be equal to 100% minus the porosity percentage of the unitary body. For example, a unitary body with a density of 99% will also have a porosity of 1%.

[0092] In some examples, one or more stages of the sintering process of block 706 may be performed in one or more different atmospheres as desired. In some examples, sintering in different atmospheres may affect different metals and / or ceramic materials of the green body in different ways. For example, sintering in an atmosphere containing oxygen may produce different materials, such as different metal alloys, thereby achieving different colors in a single sintered body. In some examples, one or more stages of the sintering process may be performed in an atmosphere containing oxygen, nitrogen, hydrogen, an inert gas such as argon, any gas as desired, or a combination thereof. In some examples, one or more stages of the sintering process may be performed under reduced pressure (such as in a vacuum).

[0093] Figure 8B A cross-sectional view of a unitary body 710 comprising sintered metal and / or ceramic material and formed according to the additive manufacturing process described herein is shown. Specifically, Figure 8B A unitary body 710 is shown including a first layer 712, which is a metal injection molded (MIM) layer. The MIM layer may include particles suspended in a binder. In some embodiments, the second layer 714 may also be a MIM layer. In other embodiments, the second layer 714 may include a metal sheet layer or other material layer. In some examples, when joined together via sintering, as described above with reference to Fig. 8A As described above, MIM layers such as first layer 712 can be used as brazing layers. MIM layers can fuse together the layers of a sintered single body. In some examples, the layers can form a cohesive material. Figure 8B An example is shown where the microstructure of the first layer 712 is different from the microstructure of the second layer 714. In some examples, the microstructure of the first layer 712 and the second layer 714 may include different grain sizes due to different material histories and / or compositions of the layers and possible impurities within the powder or binder of the MIM layer. For example, the first layer 712 may include a MIM 316L layer and the second layer 714 may include an annealed 316Li sheet. After sintering, as described above, the first layer and the second layer may include different grain structures, even though the single body may be macroscopically and functionally uniform. In some examples, the composition of the MIM layer may include a higher carbon content than the metal sheet. In some examples, different MIM layers may include different material compositions.

[0094] Figure 8CA cross-sectional view of a unitary body 720 comprising sintered metal and / or ceramic material and formed according to the additive manufacturing process described herein is shown. In some examples, the unitary body 720 may include multiple material layers, such as layer 722. In one example, layer 722 may be a MIM layer. In some examples, when layer 722 is a MIM layer, the unitary body may include a slot 724. The slot 724 may include a diameter of about 50 microns. In some examples, the slot 724 may include an ejection pinhole formed by a manufacturing process. In some examples, layer 726 may include a MIM layer. The MIM layer 726 may include an interface 728 between layers that does not include the slot 724. In some examples, layer 726 may be a material that is not a MIM layer, such as a metal sheet, a sintered metal, and / or a ceramic material. After sintering, layer 726 may be uniform and viscous, so that no obvious structure or slot is included at the interface 728.

[0095] Fig.8D A cross-sectional view of a unitary body 730 is shown. In some examples, the unitary body 70 may have a first layer 732 intersecting a second layer 734. The first layer 732 and the second layer 734 may include a first density and a second density, respectively. In some examples, the first density may be different from the second density. Similar to the above reference Figure 3D As described, the outer layer or outer portion may include a material having a first density, such as a metal or ceramic material, and the inner portion may include the same material having a different second density. In some examples, the second layer 734 may have substantially any density described herein, such as a density of at least about 99%. In some examples, the first layer 732 may also have substantially any density described herein, such as a density less than about 80%. In some examples, the first layer 732 may be considered to be foam and / or metal foam. In addition, in some examples, the density of any layer of the single body 730 may vary in one or more dimensions of the body. That is, any layer of the single body 730 may have a variable density at one or more regions, a stepped density between two or more regions, and / or a density gradient between two or more regions. In one example, the first layer 732 may include a porous MIM layer.

[0096] In some examples, the first layer 732 as a porous MIM layer may be sintered to another material such as a second layer 734. In some examples, the second layer 734 may include a MIM layer, a metal sheet, or other materials. In some embodiments, the interface between the first layer 732 and the second layer 734 may be a gradient of density and / or porosity. In other embodiments, the interface between the first layer 732 and the second layer 734 may be abrupt. For example, the density of the first layer 732 at the interface may be about 60%, and the density of the second layer 734 at the interface may be about 99%. In some examples, the porous MIM layer and / or the single body 730 may include a stainless steel structure, copper, titanium, aluminum, and / or other suitable metals.

[0097] In some examples, the density of the porous MIM layer can be controlled by the grain size of the powder before the sintering process. In other examples, the temperature of the sintering can be adjusted to control the density and / or porosity of the MIM layer and / or the single body 730. In some examples, the density of the porous MIM layer can be controlled to improve the polymer / resin bonding in the selective area. In other examples, the density of the porous MIM layer can be controlled to reduce the weight of the single body 730 in a specific desired area. According to one example, the density of the single porous MIM layer can be selectively adjusted to have selectively dense areas (such as those areas that may be impacted during a drop event, or areas that may be placed under load during use) and selectively less dense in other areas of the MIM layer to reduce the overall weight and / or enhance polymer bonding.

[0098] Fig. 8E An exploded view of a component 740 of an electronic device is shown. In some examples, the electronic device may include a boss 742 and a boss bonding layer 744. The boss 742 may be sintered to the boss bonding layer 744 and the core layer 746. In some examples, the core layer 746 may be further sintered to a shell bonding layer 748 and a decorative shell layer 750. The core layer 746 and the decorative shell layer 750 may be metal sheets. In some examples, the shell bonding layer 748 may be a first material. In some examples, the first material may include a MIM layer or a material including particles suspended in a binder. In some examples, the first material may be positioned between the second layer and the third layer and contact the second layer and the third layer, respectively. Fig. 8EIn the embodiment of the present invention, the second layer may include a core layer 746, and the third layer may include a decorative shell layer 750. In some examples, the third layer may include a second material. The second material may include a metal sheet, a ceramic material, or another suitable material. In some examples, the third layer may be positioned in contact with the first layer so that the first layer is disposed between the second layer and the third layer. In such a configuration, in some examples, the first layer may serve as an adhesion layer between the second layer and the third layer before sintering. In other words, in the manufacture of the component 740, the shell bonding layer 748 may serve as an adhesive between the core layer 746 and the decorative shell layer 750. The first layer, the second layer, and the third layer may be sintered together to form a single body. In one example, the boss column 742, the boss column bonding layer 744, the core layer 746, the shell bonding layer 748, and the decorative shell 750 may be sintered together to form a sintered assembly 752. In other words, the first layer, the second layer, and the third layer may be sintered together to form a single body and / or component 740 of an electronic device.

[0099] Further details of the process for forming a sintered unitary body as described herein are provided with respect to 9A to 9E Shown.

[0100] Fig. 9A A process for forming a unitary body, such as feedstock 801 in process 700, is shown. In some examples, feedstock 801 can be formed by mixing or combining a binder with a powder or granules including a metal and / or ceramic material as described herein. In some examples, feedstock 801 can be formed into substantially any shape as desired, such as a block, a sheet, or a shape having a curved geometry. In some examples, the material can be pressed into a desired shape to form feedstock 801. In some examples, the material can be extruded into a desired shape to form feedstock 801. In some examples, a variety of different feedstocks 801 can be formed, such as feedstocks 801 having different materials, particle sizes, and / or binder loading percentages.

[0101] Fig. 9B Shown after being pressed into sheet shape Fig. 9A In some examples, the raw material sheet 801 can have any thickness as desired. In some examples, the raw material 801 can have a thickness of less than about 10 microns, less than about 5 microns, less than about 2 microns, less than about 1 micron, less than about 500 microns, less than about 250 microns, or less than about 200 microns or less. In some examples, the thickness of the raw material 801 can be at least about 4 times, 5 times, 6 times, or 10 times or more the average major dimension of the particles comprising the raw material.

[0102] like Fig. 9BAs shown, multiple portions or pieces 812, 814, 816, 818 may be removed from a single portion of feedstock 801 as described herein. However, in some examples, one or more of pieces 812, 814, 816, 818 may be removed from a different feedstock (such as a feedstock including a different material, particle size, and / or binder loading percentage).

[0103] Fig. 9C Blocks 812, 814, 816, 818 are shown after being removed from stock material 801. Blocks 812, 814, 816, 818 may be removed by any process described herein, such as laser cutting and / or embossing processes. It can be seen that one or more of blocks 812, 814, 816, 818 may define holes, orifices, recesses, or other shapes that, when assembled into a desired configuration, may define at least a portion of an unsupported span or cavity 820 as described herein.

[0104] The blocks 812, 814, 816, 818 may be positioned relative to each other as indicated by any desired process or technique (e.g., an automated or robotically controlled process). As described herein, one or more of the blocks 812, 814, 816, 818 may include a different material than one or more of the other blocks 812, 814, 816, 818. In some examples, the blocks 812, 814, 816, 818 may be a bottom block 812, one or more intermediate blocks 814, 816, and a top block 818. Further, in some examples, one or more of the blocks 812, 814, 816, 818 may include a preformed material, such as a portion of a metal or ceramic that does not include the feedstock 801. For example, the bottom block 812 and / or the top block 818 may include a sheet of metal material that may be fused to particles of the other blocks 814, 816 during a sintering process as described herein.

[0105] Fig.9D shows that after being subjected to the sintering process described herein, Fig. 9C 802 is a perspective view of a unitary body 802 formed from assembled blocks 812, 814, 816, 818 of raw materials shown in . The body 802 can be substantially similar to the unitary bodies described herein and can include some or all of the features of the unitary bodies described herein. In some examples, the body 802 can define an outer surface 832 and can include one or more features 834 that can extend from the body 802. The body 802 can also define a cavity 820 or volume having a substantially hollow box-shaped geometry. Although the cavity 820 can be substantially empty or hollow, that is, the cavity 820 can not include any material of the body 802, in some examples, the cavity 820 can accommodate a component 840 disposed therein.

[0106] In some examples, the body 802 can be smaller in one or more dimensions compared to the green body formed from the blocks 812, 814, 816, 818. This can be a result of the sintering process. In some examples, the body 802 can shrink in one or more dimensions by about 20 microns to about 30 microns or less compared to the size of the green body.

[0107] Fig.9E Shows Fig.9D 802. It can be seen that even though the unitary body 802 can be substantially dense, and the layers or blocks forming the green body can be fused or joined together, in some examples, interfaces between the blocks of the green body can still be visualized or distinguished in the formed body 802. For example, block 812 can be fused to block 814 along interface 813 with block 814. Similarly, block 814 can be fused to adjacent block 816 along interface 815. In some examples, these interfaces 813, 815 can be defined by differences in density, material, and / or grain structure between adjacent layers, even though the layers can be completely fused together, thereby producing a striated microstructure.

[0108] In some examples, each layer or block of the green body, such as block 816, can produce a density and / or grain structure gradient in the unitary body 802 corresponding to the shape of the block 816. For example, the block 816 can produce relatively denser regions 816-1 and 816-3 corresponding to the outer regions (such as the top and bottom) of the block 816. The block 816 can also produce a relatively less dense region 816-2 corresponding to the inner region of the block 816. In some examples, the absolute density difference between the regions 816-1, 816-3 and the region 816-2 can be at least about 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 1%, 2%, or even at least about 5%.

[0109] Any features or aspects of the components, devices, and methods discussed herein may be combined or included in any combination of variations. For example, any method of forming a sintered single body of an electronic device may be used in combination to form any component as described herein. The steps, stages, or frames of any method described herein may be performed in any desired order and may be performed simultaneously if necessary. In addition, a component of a device may be formed by a sintered single body as described herein, which may include one or more features formed therein. Any method may be used to form such one or more features. Although certain methods and components are described with respect to a housing, casing, or frame of an electronic device, the methods and components described herein may also be or form any number of additional components of an electronic device, including internal components, external components, casings, surfaces, or portions of surfaces.

[0110] To the extent applicable to the present technology, the collection and use of data obtained from various sources can be used to improve the delivery of inspirational content or any other content that may be of interest to users. The present disclosure contemplates that in some instances, such collected data may include personal information data that uniquely identifies or can be used to contact or locate a specific person. Such personal information data may include demographic data, location-based data, phone numbers, email addresses, ID, home address, data or records related to the user's health or fitness level (e.g., vital sign measurements, medication information, exercise information), date of birth, or any other identifying or personal information.

[0111] The present disclosure recognizes that the use of such personal information data in the present invention technology can be used to benefit users. For example, the personal information data can be used to deliver targeted content that users are more interested in. Therefore, the use of such personal information data enables users to have planned control over the content delivered. In addition, the present disclosure also anticipates other uses of personal information data that benefit users. For example, health and fitness data can be used to provide insights into the user's overall health status, or can be used as positive feedback for individuals who use technology to pursue health goals.

[0112] This disclosure envisions that entities responsible for collecting, analyzing, disclosing, transmitting, storing or otherwise using such personal information data will comply with established privacy policies and / or privacy practices. Specifically, such entities should implement and adhere to privacy policies and practices that are recognized as meeting or exceeding industry or government requirements for maintaining the privacy and security of personal information data. Such policies should be easily accessible to users and should be updated as the collection and / or use of data changes. Personal information from users should be collected for legitimate and reasonable purposes of the entity and not shared or sold outside of these legitimate uses. In addition, such collection / sharing should be performed after receiving informed consent from the user. In addition, such entities should consider taking any necessary steps to defend and secure access to such personal information data and ensure that others who have access to personal information data comply with their privacy policies and processes. In addition, such entities may subject themselves to third-party assessments to demonstrate their compliance with widely accepted privacy policies and practices. In addition, policies and practices should be adjusted to specific types of personal information data collected and / or accessed, and to applicable laws and standards including specific considerations of jurisdiction. For example, in the United States, the collection or access of certain health data may be governed by federal and / or state laws, such as the Health Insurance Portability and Accountability Act (HIPAA), while health data in other countries may be subject to other regulations and policies and should be handled accordingly. Therefore, different privacy practices should be maintained in each country for different types of personal data.

[0113] Regardless of the foregoing, the present disclosure also contemplates an example in which a user selectively blocks the use or access of personal information data. That is, the present disclosure contemplates that hardware elements and / or software elements may be provided to prevent or block access to such personal information data. For example, with respect to an advertising delivery service, the technology of the present invention may be configured to allow a user to choose to "opt in" or "opt out" at any time during or after registration for the service to participate in the collection of personal information data. In another example, a user may choose not to provide emotion-related data for a target content delivery service. In another example, a user may choose to limit the length of time that emotion-related data is retained, or to completely prohibit the development of basic emotional conditions. In addition to providing "opt-in" and "opt-out" options, the present disclosure contemplates providing notifications related to access or use of personal information. For example, a user may be notified that their personal information data will be accessed when downloading an application, and then reminded again just before the personal information data is accessed by the application.

[0114] In addition, it is an object of the present disclosure that personal information data should be managed and processed to minimize the risk of unintentional or unauthorized access or use. Risks can be minimized by limiting data collection and deleting data once it is no longer needed. In addition, and when applicable, including in certain health-related applications, data de-identification can be used to protect the privacy of users. De-identification can be facilitated by removing specific identifiers (e.g., date of birth, etc.), controlling the amount or specificity of stored data (e.g., collecting location data at the city level rather than at the address level), controlling how data is stored (e.g., aggregating data on users), and / or other methods when appropriate.

[0115] Thus, while the present disclosure broadly covers the use of personal information data to implement one or more of the various disclosed examples, the present disclosure also contemplates that various examples may also be implemented without access to such personal information data. That is, various examples of the present technology will not fail to function properly due to the lack of all or a portion of such personal information data. For example, content may be selected and delivered to a user by inferring preferences based on non-personal information data or an absolute minimum amount of personal information, such as content requested by a device associated with the user, other non-personal information available to a content delivery service, or publicly available information.

[0116] For the purpose of illustration, the foregoing description uses specific nomenclature to provide a thorough understanding of the examples. However, it will be apparent to those skilled in the art that the examples can be practiced without specific details. Therefore, for the purpose of illustration and description, the foregoing description of the specific examples described herein is presented. These descriptions are not intended to be exhaustive or to limit these examples to the precise form disclosed. It will be apparent to those of ordinary skill in the art that, in view of the above teachings, many modifications and variations are feasible.

Claims

1. A single body, comprising a sintered metal, wherein the sintered metal is limited to a thickness between 1 cm 3 and 10,000cm 3 A closed cavity between which: The sintered metal includes a plurality of layers defining the closed cavity, at least two layers of the plurality of layers each defining a hole; The plurality of layers includes an outer portion and an inner portion, the outer portion including a first material, the inner portion including a second material different from the first material, the outer portion including an outer portion and an inner portion, the outer portion having a higher density than the inner portion; and The alignment of the apertures defined by the at least two layers defines the enclosed cavity.

2. A single body according to claim 1, wherein: The plurality of layers includes a first layer bonded to a second layer at an interface, the interface including a striated microstructure.

3. The unitary body of claim 1 further comprising between 0.001% and 70% by weight of a binder.

4. A unitary body according to claim 1, wherein: The sintered metal defines side walls and a floor, the side walls and the floor at least partially defining the enclosed cavity, the side walls having an angle greater than 20° relative to the floor.

5. The unitary body according to claim 1, wherein: The sintered metal includes at least one of aluminum, steel, or titanium.

6. The unitary body of claim 1, wherein the outer portion is fused to the inner portion along a planar interface region, the planar interface region comprising a striated microstructure.

7. A method of forming a unitary body according to any one of claims 1 to 6, the unitary body comprising sintered metal, the method comprising: positioning a first layer comprising a first material in contact with a second layer comprising a second material, the second material being different from the first material, the first layer comprising an exterior portion of the unitary body and the second layer comprising an interior portion of the unitary body, the first material comprising particles suspended in a binder; and Sintering to form the single body, the single body defines a space between 1cm 3 and 10,000cm 3 The first layer comprises an outer portion and an inner portion, the outer portion having a higher density than the inner portion.

8. The method of claim 7, further comprising positioning a third layer comprising the first material in contact with the second layer, the third layer defining an aperture.

9. The method according to claim 7, further comprising: positioning a third layer comprising the second material in contact with the first layer such that the first layer is disposed between the second layer and the third layer; Wherein, before sintering, the first layer comprises an adhesion layer between the second layer and the third layer.

10. The method of claim 7, further comprising positioning a component within a volume defined by the unitary body.

11. The method according to claim 7, wherein: The first material includes between 0.001% and 70% by weight of binder.

12. The method of claim 7, further comprising removing the first layer from the stock material by laser cutting.

13. The method according to claim 7, wherein: Sintering the first layer and the second layer to form the unitary body includes heating the first layer and the second layer to a temperature of at least 500°C.

14. The method of claim 7, further comprising debonding the first layer.

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