Plate arrangement layer sequence monitoring method and plate arrangement layer sequence monitoring device

Abstract

The present application provides a layout layer sequence monitoring method and layout layer sequence monitoring device. The method includes obtaining a side cutting image of a multilayer board after the pressing and trimming process, wherein the side cutting image corresponds to the mark position of each layer of the multilayer board; performing position deviation processing on the side cutting image to obtain the layer position deviation of each layer of the multilayer board; detecting whether all two adjacent layer position deviations in each same layer sequence match; when all two adjacent layer position deviations in each same layer sequence match, sending a layer arrangement positive sequence signal to the layout monitoring system. After obtaining the layer position deviation of each layer, the displacement deviation of the mark position of each layer is determined, and then the deviation consistency detection is performed on the layer position deviation in the same layer sequence, so as to facilitate determining whether the position deviation of the mark position of each layer changes in a certain regularity, so as to facilitate determining that the layout of the current multilayer board is correct when the position deviation changes regularly, thereby improving the qualified probability of the produced multilayer board.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board layout, and in particular to a circuit board layout layer sequence monitoring method and a circuit board layout layer sequence monitoring device. Background Art

[0002] With the widespread use of printed circuit boards, the production process of printed circuit boards is browning → prepreg cutting → pre-stacking → fusion → layout → pressing → post-pressing processing. In the layout process, multiple pre-stacked boards are stacked into multi-layer boards to be pressed to facilitate subsequent pressing. The layout process is as follows: set the number of layout layers → enter the empty basin → place the first steel plate → place the pre-layout → sandwich steel plate → place the last steel plate → take out the arranged bottom basin → laminate layout. In the step of placing the pre-layout, if the pre-layout number of layers is not reached, repeat the steps of "place pre-layout → sandwich steel plate". For example, the order of placing the pre-layout is: 2-3 layers → 4-5 layers → 6-7 layers →... After arranging the inner layer sequence, arrange the prepreg and copper foil on the outermost layers of both sides.

[0003] However, due to human factors, the order is wrong, resulting in abnormal quality of the circuit board. When the order is wrong, the traditional flying probe test and fixture test cannot detect the abnormality, which affects its performance and quality, resulting in a decrease in the qualified rate of the printed circuit board. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a method and device for monitoring the order of layers of a multilayer board for improving the pass rate of the multilayer board.

[0005] The objective of the present invention is achieved through the following technical solutions:

[0006] A method for monitoring a layout sequence, the method comprising:

[0007] Acquire a side-cut image of the multilayer board after the lamination and trimming process, wherein the side-cut image corresponds to the marked positions of each layer of the multilayer board;

[0008] Performing position deviation processing on the side-cut image to obtain the delamination position deviation of each layer of the multilayer board;

[0009] Detecting whether all two adjacent stratified position deviations in each layer sequence match;

[0010] When the position deviations of all two adjacent layers in the same layer sequence match, a layer arrangement positive sequence signal is sent to the panel arrangement monitoring system.

[0011] In one of the embodiments, the side-cutting image is subjected to position deviation processing to obtain the stratified position deviation of each layer of the multilayer board, including: obtaining the panel position parameters of each layer of the multilayer board according to the side-cutting image; and calculating the difference between the panel position parameters and the preset panel position parameters to obtain the stratified position deviation.

[0012] In one of the embodiments, after obtaining the panel position parameters of each layer of the multilayer board according to the side cut image, the method further includes: performing sequence processing on each of the panel position parameters to obtain panel position parameters of each layer in the same sequence.

[0013] In one of the embodiments, obtaining the difference between the panel arrangement parameter and the preset panel arrangement parameter includes: obtaining the difference between two adjacent panel arrangement parameters in the same layer sequence.

[0014] In one of the embodiments, the panel position parameters are sorted to obtain the panel position parameters of each row in the same layer sequence, including: obtaining the board layer sequence number according to the panel position parameters; clustering the panel position parameters of each layer according to the board layer sequence number to obtain multiple panel position parameters corresponding to each layer sequence.

[0015] In one of the embodiments, obtaining the board layer sub-sequence number according to the board position parameters includes: obtaining a first sub-sequence number and a second sub-sequence number according to the board position parameters; clustering the board position parameters of each level according to the board layer sub-sequence number includes: clustering the board position parameters with the same first sub-sequence number to obtain board position parameters of each row in the same layer sequence; and arranging the board position parameters of each row in the same layer sequence in the same sequence according to the second sub-sequence number.

[0016] In one of the embodiments, the method of obtaining the difference between the panel arrangement position parameters and the preset panel position parameters to obtain the layer position offset includes: obtaining the panel arrangement positioning coordinates corresponding to the board layer serial number according to the panel arrangement position parameters; and obtaining the difference between the panel arrangement positioning coordinates and the preset board position positioning coordinates to obtain the layer position offset corresponding to each board layer serial number.

[0017] In one of the embodiments, the detecting whether all two adjacent layer position offsets in the same layer sequence match includes: in the same layer sequence, detecting whether the difference between all two adjacent layer position offsets is equal to a preset position deviation value; when all two adjacent layer position offsets in the same layer sequence match, sending a layer arrangement positive sequence signal to the plate arrangement monitoring system includes: when all two adjacent layer position offsets in the same layer sequence are equal to the preset position deviation value, sending a layer arrangement positive sequence signal to the plate arrangement monitoring system.

[0018] In one of the embodiments, in the same layer sequence, it is detected whether the difference between the position deviations of all two adjacent layers is equal to the preset position deviation value, and then it also includes: when the position deviations of two adjacent layers in the same layer sequence are not equal to the preset position deviation value, a layer arrangement out of sequence signal is sent to the panel arrangement monitoring system.

[0019] A device for monitoring the layer sequence of a multilayer board, comprising: an image collector and a layer sequence monitoring main board; the image collector is used to obtain a side-cut image of a multilayer board after pressing and trimming processing; the input end of the layer sequence monitoring main board is connected to the output end of the image collector, and the layer sequence monitoring main board is used to perform a position deviation processing on the side-cut image to obtain the layer position deviation of each layer of the multilayer board; detect whether all two adjacent layer position deviations in each layer sequence match; when all two adjacent layer position deviations in each layer sequence match, send a positive layer sequence signal to the board layout monitoring system.

[0020] Compared with the prior art, the present invention has at least the following advantages:

[0021] The side-cut image is a position image formed by the marking of each layer. After obtaining the stratified position deviation of each level, the displacement deviation of the marking of each level is determined. Then, the stratified position deviation in the same level sequence is detected for deviation consistency, which is convenient for determining whether the position deviation of the marking of each level changes in a certain regularity. This makes it easier to determine that the current layout of the multi-layer board is correct when the regularly changing position deviation occurs, thereby improving the accuracy of the layout detection of the multi-layer board, thereby increasing the qualified probability of the produced multi-layer board. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 Flow chart of a method for monitoring the layout layer sequence in one embodiment. DETAILED DESCRIPTION

[0024] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0025] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0027] The present invention relates to a method for monitoring the layout layer sequence. In one embodiment, the layout layer sequence monitoring method includes obtaining a side cutting image of a multilayer board after the pressing and trimming process, wherein the side cutting image corresponds to the mark position of each layer of the multilayer board; performing position deviation processing on the side cutting image to obtain the layer position deviation of each layer of the multilayer board; detecting whether all two adjacent layer position deviations in each layer sequence match; when all two adjacent layer position deviations in each layer sequence match, sending a layer positive sequence signal to the layout monitoring system. The side cutting image is a position image formed by the mark position of each layer. After the layer position deviation of each layer is obtained, the displacement deviation of the mark position of each layer is determined, and then the layer position deviation in the same layer sequence is detected for deviation consistency, so as to facilitate determining whether the position deviation of the mark position of each layer changes in a certain regularity, so as to facilitate determining that the layout of the current multilayer board is correct when the position deviation changes regularly, thereby improving the accuracy of the layout detection of the multilayer board, thereby improving the qualified probability of the produced multilayer board.

[0028] See also Figure 1 , which is a flow chart of a method for monitoring the layout layer sequence of an embodiment of the present invention. The layout layer sequence monitoring method includes part or all of the following steps.

[0029] S100: Acquire a side-cut image of the multilayer board after the lamination and trimming process, wherein the side-cut image corresponds to the marked position of each layer of the multilayer board.

[0030] In this embodiment, the side cut image is obtained after the multilayer board is arranged and pressed, that is, after the pressing step is completed, the multilayer board is cut and the mark positions of each layer are exposed, so as to obtain the side image with the mark positions of each layer. The side cut image shows the mark positions of each layer. In the normal arrangement process, that is, the arrangement is correct, the mark positions of each layer will be arranged in a predetermined manner. At this time, the mark positions on the side cut image show a regular distribution. In this way, it is convenient to determine whether the arrangement of the multilayer board is correct according to the arrangement of each mark position. In another embodiment, the mark position of each layer is a copper foil with a width of 2 cm set at the edge of each layer.

[0031] S200: performing position deviation processing on the side-cut image to obtain the delamination position deviation of each layer of the multilayer board.

[0032] In this embodiment, the side cut image is processed by offsetting, which is to collect the mark positions on the side cut image, so as to determine the unique marking parameters of the mark positions on each level, that is, the layer offset. The layer offset is used to determine the arrangement order between the levels. For example, in the longitudinal direction of the multilayer board, the layer offsets are distributed in a certain regular pattern, so as to distinguish each level of the multilayer board, and then to determine whether the arrangement of the multilayer board is correct according to the layer offset.

[0033] S300: Detect whether the bit offsets of all two adjacent layers in the same layer sequence match.

[0034] In this embodiment, in the same hierarchical sequence, the stratified position offset is the displacement deviation of the mark position on any level, and the levels of the same hierarchical sequence are divided into the same category, so as to facilitate the classification of mark positions with similar hierarchical attributes. Detecting all two adjacent stratified position offsets in each same hierarchical sequence is to compare the stratified position offsets of the mark positions of the two adjacent levels in each same hierarchical sequence, that is, to compare the stratified position offsets of the mark positions of the two adjacent levels in each same hierarchical sequence, so as to facilitate determining whether the mark positions of all two adjacent levels in the same hierarchical sequence are arranged in a predetermined manner, so as to facilitate the subsequent determination of whether the levels of the same hierarchical sequence are correctly sorted.

[0035] S400: When the position offsets of all two adjacent layers in the same layer sequence match, a layer arrangement positive sequence signal is sent to the panel arrangement monitoring system.

[0036] In this embodiment, in the same hierarchical sequence, all two adjacent layer position offsets match, indicating that the layers in the same hierarchical sequence are arranged in a corresponding predetermined manner. Only when all the layers in all the hierarchical sequences meet the above conditions, that is, all the layers in all the hierarchical sequences are arranged in a corresponding specified manner, can it be determined that the layers of the multilayer board are arranged in a certain pattern, and this pattern corresponds to the layout method of the multilayer board, so that when all two adjacent layer position offsets in the same hierarchical sequence match, it is determined that the multilayer board has been correctly arranged. At this time, the multilayer board is a product with correct layout, which effectively reduces the probability of a multilayer board with incorrect layout acting as a qualified product.

[0037] In the above embodiments, the side-cut image is a position image formed by the marking of each layer. After obtaining the stratified position deviation of each level, the displacement deviation of the marking of each level is determined. Then, the stratified position deviation in the same level sequence is subjected to deviation consistency detection, so as to facilitate determination of whether the position deviation of the marking of each level changes in a certain regularity. This facilitates determination that the current layout of the multi-layer board is correct when the position deviation changes regularly, thereby improving the accuracy of the layout detection of the multi-layer board, and thus improving the qualified probability of the produced multi-layer board.

[0038] In one of the embodiments, the offset processing of the side-cut image to obtain the delamination offset of each layer of the multilayer board includes: obtaining the panel position parameters of each layer of the multilayer board according to the side-cut image; and obtaining the difference between the panel position parameters and the preset panel position parameters to obtain the delamination offset. In this embodiment, the panel position parameters include the position parameters of the markers on each layer in the image, and the preset panel position parameters can be the position parameters of the specified positions on the side-cut image, or the position parameters of the fixed markers on the multilayer board corresponding to each marker, that is, the preset panel position parameters are used as the position parameters of the reference markers on each layer, so as to facilitate the determination of the positions of the markers on each layer on the side-cut image, thereby facilitating the determination of the relative position relationship between the markers, and further facilitating the determination of whether each layer is at the correct layer of the multilayer board. Among them, the layered position deviation is the degree of position deviation between each mark position and the fixed mark position, which is used to show the size of the displacement deviation of each mark position on the side-cut image, so as to facilitate determining whether the deviation rule of the mark positions at each level follows the predetermined rule, that is, to determine whether the deviation size and direction of the mark positions at each level are the predetermined deviation size and direction.

[0039] Furthermore, after obtaining the layout position parameters of each level of the multilayer board according to the side cut image, it also includes: sorting the layout position parameters to obtain the layout position parameters of each level in the same level sequence. In this embodiment, the layout position parameters include the position parameters of the mark positions of each level, which are used to reflect the specific position of the mark positions of each level on the corresponding level, and are also used to reflect the relative position relationship between the mark positions. Before processing the layout position parameters, it is necessary to classify the mark positions with the same level sequence attributes to avoid comparing the layout position parameters in different level sequences. Here, sorting the layout position parameters is to classify the mark positions that originally have a predetermined arrangement distribution, so as to facilitate the separate comparison of the mark positions with different arrangement distribution rules, ensure the correctness of the layout of the multilayer board, effectively improve the identification of the multilayer board with incorrect layout, and also improve the efficiency of the layout comparison of the multilayer board. In another embodiment, each layer of the multilayer board may have only one layer sequence or multiple layer sequences, that is, each of the panel arrangement parameters is sequenced to obtain a parameter set of N layer sequences, wherein the parameter set is a set formed by multiple panel arrangement parameters with the same layer sequence, N is an integer greater than 0, and each layer sequence corresponds to a layer arrangement distribution rule.

[0040] Furthermore, the said processing of sorting the said arrangement of panel position parameters to obtain the arrangement of panel position parameters of the same layer sequence includes: obtaining the board layer sequence number according to the said arrangement of panel position parameters; clustering the arrangement of panel position parameters of each layer according to the said board layer sequence number to obtain a plurality of arrangement of panel position parameters corresponding to each layer sequence. In this embodiment, the said arrangement of panel position parameters includes not only the position parameters of the marking position, but also the board layer sequence number of the layer corresponding to the marking position. The board layer sequence number is a parameter used to distinguish the various layers. The various layers are classified according to the board layer sequence number, so as to facilitate the classification of the marking positions on each layer. For example, the layers with an odd number of layers are clustered into one category, and the layers with an even number of layers are clustered into another category. In this way, after obtaining the said board layer sequence number, the marking positions can be divided according to the classification of the board layer sequence number, so as to facilitate the determination of the marking positions of the same category as the same layer sequence. The board layer sequence number may be based on the actual number of layers distributed at each level in the side cut image, so as to facilitate classification of the board layer sequence numbers of a specified level, thereby facilitating obtaining the panel position parameters of the same layer sequence attributes.

[0041] Furthermore, the obtaining of board layer sub-sequence numbers according to the board position parameters includes: obtaining a first sub-sequence number and a second sub-sequence number according to the board position parameters; clustering the board position parameters of each layer according to the board layer sub-sequence numbers includes: clustering the board position parameters with the same first sub-sequence number to obtain board position parameters of each row in the same layer sequence; and arranging the board position parameters of each row in the same layer sequence in the same sequence according to the second sub-sequence number. In this embodiment, the board layer sub-sequence number includes the first sub-sequence number and the second sub-sequence number. The first sub-sequence number serves as the major category layer number of the board layer sub-sequence number. The first sub-sequence number is used to classify the layers with the same layer sequence attributes into the same category. The first sub-sequence number has the function of clustering the panel arrangement parameters, that is, determining the categories of different panel arrangement parameters according to the first sub-sequence number. For example, the first sub-sequence number is divided according to the odd and even number of layers. When the number of layers of each layer is odd, the first sub-sequence number of each layer is 0, and when the number of layers of each layer is even, the first sub-sequence number of each layer is 1. The second sub-sequence number is the sorting of the parameters of each row of plate positions in the same layer sequence. The second sub-sequence number is based on the sorting of the first sub-sequence number, that is, when the first sub-sequence number is the same, the parameters of each row of plate positions are re-sorted in a predetermined order according to the second sub-sequence number, so as to arrange the mark positions of each level in the same layer sequence, so that each mark position in the same layer sequence presents a corresponding arrangement distribution, thereby facilitating the determination of the arrangement rules of each mark position in the same layer sequence, and further facilitating the determination of whether the arrangement of the level corresponding to the current layer sequence is correct according to the arrangement rules of each mark position in the same layer sequence.

[0042] Furthermore, the said obtaining the difference between the said panel arrangement position parameter and the preset panel position parameter to obtain the said layer position deviation includes: obtaining the panel arrangement positioning coordinates corresponding to the board layer serial number according to the said panel arrangement position parameter; obtaining the difference between the said panel arrangement positioning coordinates and the said preset panel position positioning coordinates to obtain the layer position deviation corresponding to each board layer serial number. In this embodiment, the said panel arrangement position parameter also includes the panel arrangement positioning coordinates, and the said panel arrangement positioning coordinates correspond to the said board layer serial number, that is, the said panel arrangement positioning coordinates correspond to the said standard position, that is, the said panel arrangement positioning coordinates correspond to the position of the said standard position one by one, for example, the said panel arrangement positioning coordinates are the endpoint coordinates on the same side of each standard position, that is, the said panel arrangement positioning coordinates are the coordinates of the specific position of each standard position. The said preset panel position positioning coordinates include the coordinates of the fixed position on the said side cut image, that is, the said preset panel position positioning coordinates are used as the reference coordinates of each said panel arrangement positioning coordinates, that is, the said preset panel position positioning coordinates are used as the reference coordinates of each said panel arrangement positioning coordinates. The difference between the panel arrangement positioning coordinates and the preset panel position positioning coordinates is to obtain the distance between the panel arrangement positioning coordinates and the coordinates of the fixed position, so as to facilitate the determination of the spacing between the mark position on each level and the fixed position, thereby facilitating the determination of the distance that the mark position on each level deviates from the fixed position, and further facilitating the determination of the relative position relationship between the mark positions on each level. The obtained layered position deviation is the deviation distance of each mark position, which is used to display the degree of deviation of each mark position, so that the arrangement pattern between each mark position can be displayed, which is convenient for determining whether the arrangement of each level is correct.

[0043] In one of the embodiments, the step of obtaining the difference between the panel position parameter and the preset panel position parameter includes: obtaining the difference between two adjacent panel position parameters in the same layer sequence. In this embodiment, the preset panel position parameter is an adjacent panel position parameter in the same layer sequence, that is, when calculating the layer position offset of the current layer, one of the panel position parameters is used as the panel position parameter of the current layer, and the other panel position parameter is the panel position parameter of the previous or next layer, that is, the layer position offset is obtained based on the panel position parameters between two adjacent layers in the same layer sequence, eliminating the step of setting the preset panel position parameter, making the step of calculating the layer position offset simpler.

[0044] In one of the embodiments, the detection of whether all two adjacent layer position deviations in the same layer sequence match includes: in the same layer sequence, detecting whether the difference between all two adjacent layer position deviations is equal to the preset position deviation value; when all two adjacent layer position deviations in the same layer sequence match, sending a layer arrangement positive sequence signal to the plate arrangement monitoring system includes: when all two adjacent layer position deviations in the same layer sequence are equal to the preset position deviation value, sending a layer arrangement positive sequence signal to the plate arrangement monitoring system. In this embodiment, the difference between two adjacent layer position deviations is the degree of consistency of the change in displacement deviation of two adjacent levels in the same layer sequence, that is, the difference between two adjacent layer position deviations is used to show the unidirectional degree of change in displacement deviation of two adjacent levels in the same layer sequence, that is, the difference between two adjacent layer position deviations is used to show the gradual degree of displacement deviation of two adjacent levels in the same layer sequence. The preset position deviation value is a specified change amount of the position deviation of each layer in the same layer sequence, which is used to determine the increase or decrease degree of the position deviation of each layer in the same layer sequence, that is, each layer sequence has a corresponding preset position deviation value, which is convenient for determining the degree of change of the position deviation of each layer in different layers. All two adjacent layer position deviations in the same layer sequence are equal to the preset position deviation value, indicating that the layer position deviation of each level in the same layer sequence changes in a unidirectional manner. For example, when the preset position deviation value is greater than 0, the change of the layer position deviation of each level in the same layer sequence increases; for example, when the preset position deviation value is less than 0, the change of the layer position deviation of each level in the same layer sequence decreases. In this way, after determining that the change of the layer position deviation of each level in the same layer sequence changes in a unidirectional manner, the layout mode of each level of the multilayer board is arranged in a certain regular pattern, and the positive layer arrangement signal is sent to the layout monitoring system, indicating that the layout of the multilayer board is correct at this time.

[0045] Furthermore, in the same layer sequence, it is detected whether the difference between all two adjacent layer position deviations is equal to the preset position deviation value, and then it also includes: when there are two adjacent layer position deviations in the same layer sequence that are not equal to the preset position deviation value, a layer arrangement misorder signal is sent to the plate arrangement monitoring system. In this embodiment, the difference between the two adjacent layer position deviations is the degree of consistency of the change in displacement deviation of two adjacent levels in the same layer sequence, that is, the difference between the two adjacent layer position deviations is used to show the unidirectional degree of change in displacement deviation of two adjacent levels in the same layer sequence, that is, the difference between the two adjacent layer position deviations is used to show the gradual degree of displacement deviation of two adjacent levels in the same layer sequence. The preset position deviation value is the specified change amount of each layer position deviation in the same layer sequence, which is used to determine the increase or decrease degree of each layer position deviation in the same layer sequence, that is, each layer sequence has a corresponding preset position deviation value, which is convenient for determining the degree of change of each layer position deviation in different layers. In the same layer sequence, there are two adjacent stratification position deviations that are not equal to the preset position deviation value, indicating that the stratification position deviations of a part of the layers in the same layer sequence remain unchanged. For example, when the preset position deviation value is equal to 0, the stratification position deviations of a part of the layers in the same layer sequence remain the same, that is, there are a part of the layers that have not undergone changes in the stratification position deviations. In this way, after determining that the stratification position deviations of a part of the layers in the same layer sequence have not changed, the arrangement of the layers of the multilayer board is irregular, that is, different from the predetermined arrangement, and a stratification misorder signal is sent to the arrangement monitoring system, indicating that the arrangement of the multilayer board is wrong at this time, so that it is easy to screen out the multilayer board with wrong arrangement.

[0046] It can be understood that the side-cut image is a distribution image of the edge level markings formed after cutting the edge of the multilayer board. Although the markings are set at the edge of each level, during the cutting process, when the cutting accuracy is not high, it is easy for the cutting line on the multilayer board to deviate from the predetermined trajectory, for example, there is a certain angle between the final cutting trajectory and the predetermined trajectory. Moreover, since the side-cut image is collected from the side of the multilayer board, it is easy to cause part of the graphics formed by the marking to be cut into non-standard lengths, that is, when the cutting deviates from the marking, the marking is cut obliquely, which is easy to cause the calculation error of the layer position deviation corresponding to the marking, and then it is easy to cause a misjudgment of whether the layout of the multilayer board is correct.

[0047] In order to reduce misjudgment of the layout of the multilayer board, the side cut image of the multilayer board after the lamination and trimming process is obtained, and then the following is further included:

[0048] Acquire a positive plate image of the multilayer board after edge trimming processing;

[0049] Acquire side edge parameters and trimming parameters according to the positive plate image;

[0050] Performing a leveling process on the side edge parameters and the trimming edge parameters to obtain a first side leveling degree and a second side leveling degree;

[0051] Detecting whether the flatness of the first side matches the flatness of the second side;

[0052] When the first side flatness matches the second side flatness, step S200 is performed.

[0053] In this embodiment, the multilayer board is a square board, and the positive board image is an image of the front panel of the multilayer board, that is, the positive board image is a panel image of the multilayer board viewed from above or from above. After the multilayer board is cut, a cutting line will be left on the multilayer board, that is, a new side edge will be formed on the side of the multilayer board, which is convenient for obtaining the shape of the multilayer board after cutting. The positive board image contains the shape structure formed by each side edge of the multilayer board, wherein the side edge parameters and trimming parameters are obtained according to the positive board image, the trimming parameters correspond to the new side edge formed after the multilayer board is cut, and the side edge parameters correspond to the side edge of the multilayer board that is set opposite to the new side edge. The trimming parameters and the side edge parameters are used to display the position parameters of the cut side edge and the side edge opposite to it, which is convenient for reflecting the position of the above two sides on the multilayer board.

[0054] The side edge parameters are subjected to leveling processing, which is to detect the levelness of the new side edge of the multilayer board after cutting and the side edge set opposite to it, that is, to obtain the levelness between the corresponding side edge and the specified axis in the predetermined coordinate system according to the side edge parameters, that is, to obtain the deflection between the corresponding side edge and the specified axis in the predetermined coordinate system according to the side edge parameters. The leveling processing of the trimming parameters is the same as the above. For example, the side edge parameters and the trimming parameters are subjected to leveling processing, which is to obtain the levelness between the side edge corresponding to the side edge parameters and the Y-axis in the coordinate system of the positive plate image, and to obtain the levelness between the new side edge corresponding to the trimming parameters and the Y-axis in the coordinate system of the positive plate image, so as to obtain the levelness of the first side and the second side. The first side levelness is the levelness between the side edge corresponding to the side edge parameters and the Y-axis in the coordinate system of the positive plate image, and the second side levelness is the levelness between the new side edge corresponding to the trimming parameters and the Y-axis in the coordinate system of the positive plate image. In this way, after obtaining the first side flatness and the second side flatness, the cutting deviation of the new side after cutting can be judged by comparing the similarity between the first side flatness and the second side flatness. The first side flatness matches the second side flatness, indicating that the new side after cutting is parallel to the side opposite to it, that is, the cutting track on the multilayer board is the correct cutting track, that is, the side cutting image is the correct cutting image of the marked position on each layer.

[0055] Furthermore, when the deviation angle of the cutting track on the multilayer board is small, the position and shape of the mark positions on each layer basically meet the requirements for the detection of the side cutting image, that is, after cutting, all the mark positions are cut, and no other metal is cut. At this time, the multilayer board only needs to be cut again after the layout inspection is qualified to be produced as a normal product. In order to avoid waste of products, the detection of whether the first side flatness matches the second side flatness also includes the following steps:

[0056] When the first side flatness does not match the second side flatness, performing angle processing on the first side flatness and the second side flatness to obtain an angle deviation;

[0057] Detecting whether the corner offset is less than or equal to a preset offset;

[0058] When the corner offset is less than or equal to the preset offset, obtaining calibration numbers of each level according to the side cut image;

[0059] Detecting whether the calibration number is equal to a preset calibration number;

[0060] When the calibration number is equal to the preset calibration number, step S200 is executed.

[0061] In this embodiment, the first side flatness does not match the second side flatness, indicating that the new side of the multilayer board after cutting is not parallel to the side corresponding to the side parameter, that is, indicating that the cutting track of the multilayer board is deviated. In order to avoid the waste of multilayer boards, that is, to reduce production costs, the first side flatness and the second side flatness are deflected, that is, the side corresponding to the side parameter and the new side are deflected at an angle, wherein the side corresponding to the side parameter is parallel to the predetermined cutting track, and the obtained side angle deviation is the angle of the new side corresponding to the cutting parameter deviating from the predetermined side after cutting, which is convenient for determining the deviation angle of the new side formed after cutting of the multilayer board. The preset deviation is the controllable angle of the side deflection after cutting, that is, the preset deviation is the error range of the deflection angle of the cutting side. The corner deviation is less than or equal to the preset deviation, indicating that the deflection angle of the cut side is within the controllable range, that is, the deflection angle of the cut side is small, and does not affect the cutting of the alignment positioning, nor does it affect the arrangement detection of the alignment positioning of the formed side cut image. At this time, it is also necessary to perform small-angle cutting detection on the marking positions on each level, and obtain the calibration number of each level according to the side cut image, that is, in the case of small-angle cutting, there are corresponding marking positions on each level in the side cut image, and the number of marking positions on each level is a specified number, for example, the preset calibration number is 1. In this way, the calibration number is equal to the preset calibration number, indicating that the number of marking positions on each level is a specified number, and there is no excessive or insufficient situation, that is, it indicates that the marking positions on each level can be used to detect the order of the board arrangement, and does not affect the accuracy of the final correctness of the board arrangement. Moreover, it can also avoid the waste of such multi-layer boards with small-angle cutting.

[0062] In one of the embodiments, the present application also provides a layout layer sequence monitoring device, which is implemented by the layout layer sequence monitoring method described in any of the above embodiments. In one of the embodiments, the layout layer sequence monitoring device has a functional module corresponding to each step of the layout layer sequence monitoring method. The layout layer sequence monitoring device can implement the layout layer sequence monitoring method described in any of the above embodiments when working, and the layout layer sequence monitoring device includes an image collector and a layer sequence monitoring mainboard; the image collector is used to obtain the side cutting image of the multilayer board after the pressing and trimming process; the input end of the layer sequence monitoring mainboard is connected to the output end of the image collector, and the layer sequence monitoring mainboard is used to perform position deviation processing on the side cutting image to obtain the layer position deviation of each layer of the multilayer board; detect whether all two adjacent layer position deviations in each same layer sequence match; when all two adjacent layer position deviations in each same layer sequence match, send a layer positive sequence signal to the layout monitoring system. In this embodiment, the side-cut image is a position image formed by the marking positions of each layer. After obtaining the stratified position deviation of each level, the displacement deviation of the marking position of each level is determined. Then, the stratified position deviation in the same level sequence is subjected to deviation consistency detection, so as to facilitate determination of whether the position deviation of the marking position of each level changes in a certain regularity. This facilitates determination that the current layout of the multi-layer board is correct when the position deviation changes regularly, thereby improving the accuracy of the layout detection of the multi-layer board, and thus improving the qualified probability of the produced multi-layer board.

[0063] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for monitoring the layout sequence, characterized in that: include: Acquire a side-cut image of the multilayer board after the lamination and trimming process, wherein the side-cut image corresponds to the marked positions of each layer of the multilayer board; Obtaining a positive plate image of the multilayer board after edge trimming processing; Acquire side parameters and trimming parameters according to the positive plate image, Performing a leveling process on the side edge parameters and the trimming edge parameters to obtain a first side leveling degree and a second side leveling degree; Detecting whether the flatness of the first side matches the flatness of the second side; When the first side flatness matches the second side flatness, performing position deviation processing on the side cut image to obtain the delamination position deviation of each layer of the multilayer board; Detecting whether all two adjacent stratified position deviations in each layer sequence match; When the position deviations of all two adjacent layers in the same layer sequence match, a layer arrangement positive sequence signal is sent to the panel arrangement monitoring system.

2. The method for monitoring the layout sequence of panels according to claim 1, characterized in that: The step of performing position deviation processing on the side cut image to obtain the delamination position deviation of each layer of the multilayer board includes: Acquire the panel arrangement parameters of each layer of the multilayer board according to the side cutting image; The difference between the panel arrangement parameter and the preset panel position parameter is calculated to obtain the layer position deviation.

3. The method for monitoring the layout sequence of panels according to claim 2, characterized in that: After obtaining the panel arrangement parameters of each layer of the multilayer board according to the side cutting image, the method further includes: The parameters of each row of panel positions are processed in sequence to obtain the parameters of each row of panel positions in the same sequence.

4. The method for monitoring the layout sequence of panels according to claim 3, characterized in that: The step of obtaining the difference between the panel arrangement parameter and the preset panel arrangement parameter comprises: In the same layer sequence, the difference between the parameters of two adjacent panel positions is obtained.

5. The method for monitoring the layout sequence of panels according to claim 3, characterized in that: The step of performing sequence processing on the panel position parameters to obtain the panel position parameters of the same layer sequence includes: Obtaining the board layer serial number according to the board position parameter; The panel arrangement parameters of each layer are clustered according to the panel layer sequence numbers to obtain a plurality of panel arrangement parameters corresponding to each layer sequence.

6. The method for monitoring the layout sequence of panels according to claim 5, characterized in that: The obtaining of the board layer sequence number according to the board arrangement parameters includes: Obtain a first sub-sequence number and a second sub-sequence number according to the panel arrangement parameters; The clustering of the panel arrangement parameters of each layer according to the panel layer serial number includes: Clustering the row position parameters of the same first sub-sequence number to obtain the row position parameters of the same layer sequence; The panel position parameters of each row in the same layer sequence are arranged in the same sequence according to the second sub-sequence number.

7. The method for monitoring the layout sequence of panels according to claim 5, characterized in that: The step of obtaining the difference between the panel arrangement parameter and the preset panel position parameter to obtain the layer position deviation comprises: According to the panel arrangement position parameters, the panel arrangement positioning coordinates corresponding to the panel layer serial number are obtained; The panel arrangement positioning coordinates are subtracted from the preset panel position positioning coordinates to obtain the layer position offset corresponding to each panel layer number.

8. The method for monitoring the layout sequence of panels according to claim 1, characterized in that: The step of detecting whether all two adjacent layer position offsets in the same layer sequence match each other includes: In the same layer sequence, detecting whether the difference between the position deviations of all two adjacent layers is equal to the preset position deviation value; When the position deviations of all two adjacent layers in the same layer sequence match, a positive layer arrangement sequence signal is sent to the panel arrangement monitoring system, including: When the position deviations of all two adjacent layers in the same layer sequence are equal to the preset position deviation value, a layer arrangement positive sequence signal is sent to the panel arrangement monitoring system.

9. The method for monitoring the layout sequence of panels according to claim 8, characterized in that: In the same layer sequence, detecting whether the difference between the position deviations of all two adjacent layers is equal to the preset position deviation value, and then further comprising: When the position deviations of two adjacent layers in the same layer sequence are not equal to the preset position deviation values, a layer arrangement out of sequence signal is sent to the panel arrangement monitoring system.

10. A device for monitoring the order of plate arrangement, characterized in that: include: An image collector, the image collector is used to obtain a side image of the multilayer board after the pressing and trimming process, and to obtain a front image of the multilayer board after the closing and trimming process; A layer sequence monitoring main board, the input end of the layer sequence monitoring main board is connected to the output end of the image collector, the layer sequence monitoring main board is used to obtain side parameters and trimming parameters according to the positive plate image, perform leveling processing on the side parameters and the trimming parameters to obtain the first side flatness and the second side flatness; detect whether the first side flatness matches the second side flatness; when the first side flatness matches the second side flatness, perform position deviation processing on the side trimming image to obtain the layer position deviation of each layer of the multilayer board; detect whether all two adjacent layer position deviations in each same layer sequence match; when all two adjacent layer position deviations in each same layer sequence match, send a layer arrangement positive sequence signal to the panel arrangement monitoring system.

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