Substrate processing apparatus, substrate processing method, and storage medium storing a program

Abstract

The present invention relates to a substrate processing apparatus, a substrate processing method, and a storage medium storing a program, with the objective of improving the detection accuracy of a substrate flying off a polishing head. The substrate processing apparatus includes: a polishing table (350) to which a polishing pad (352) for polishing a substrate is attached; a polishing head (302) for holding the substrate and pressing it against the polishing pad (352); a retaining ring member configured to surround the polishing head (302); a retaining ring member pressurization chamber configured adjacent to the retaining ring member; an arm (360) for holding the polishing head (302) and rotating it; and a slip-out detector (910) for detecting the ejection of the substrate from the polishing head (302) based on the rotational torque of the arm (360) or based on the flow rate of fluid supplied to the retaining ring member pressurization chamber.

Description

Technical Field

[0001] This application relates to a substrate processing apparatus, a substrate processing method, and a storage medium storing a program for executing the substrate processing method on a computer, which then uses the substrate processing apparatus. Priority is claimed based on Japanese Patent Application No. 2020-111535, filed June 29, 2020. The entire contents of this application, including the description, scope of protection, drawings, and abstract of Japanese Patent Application No. 2020-111535, are incorporated herein by reference in their entirety. Background Technology

[0002] One type of substrate processing equipment used in semiconductor manufacturing processes includes a CMP (Chemical Mechanical Polishing) apparatus. CMP apparatuses can be broadly classified into "face-up type" (where the surface of the substrate being polished faces upwards) and "face-down type" (where the surface of the substrate being polished faces downwards) based on the direction in which the polished surface of the substrate faces.

[0003] A face-down chemical mechanical polishing apparatus comprises a polishing head that holds a substrate and a polishing table to which a polishing pad is attached. The substrate is polished by pressing it against the polishing pad while rotating the polishing head and the polishing table. However, sometimes the substrate detaches from the polishing head and flies outwards while the substrate is being polished.

[0004] For example, Patent Document 1 discloses detecting substrate ejection by measuring the rotation drive current of the grinding head or grinding table. Additionally, Patent Document 2 discloses detecting substrate ejection by measuring the pressure or flow rate of fluid supplied to the back side of the substrate.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2001-96455

[0008] Patent Document 2: Japanese Patent Application Publication No. 10-230450

[0009] The problem that the invention aims to solve

[0010] In the technology disclosed in Patent Document 1, if the substrate flies off the polishing head, the frictional resistance between the substrate and the polishing pad changes. This change in frictional resistance is proportional to the rotational drive current of the polishing head or polishing table, and the ejection of the substrate is detected based on this change in current. In addition, in the technology disclosed in Patent Document 2, if the substrate flies off the polishing head, the pressure / flow rate of the fluid supplied to the back of the substrate changes, and the ejection of the substrate is detected based on this change in fluid pressure / flow rate.

[0011] However, the technology described in Patent Documents 1 and 2 leaves room for improving the accuracy of substrate ejection detection. Specifically, the grinding head and grinding table are components that perform grinding while clamping and pressing the substrate through a grinding pad. Therefore, the grinding head and grinding table are directly subjected to vibrations caused by the grinding of the substrate, which are reflected as noise in the rotational drive current value of the grinding head and grinding table, or in the pressure / flow rate of the fluid supplied to the back of the substrate. As a result, the technology described in Patent Documents 1 and 2 may misdetect changes in the rotational drive current value caused by noise, or changes in the pressure / flow rate of the fluid supplied to the back of the substrate caused by noise, as substrate ejection. Summary of the Invention

[0012] Therefore, one objective of this application is to improve the detection accuracy of substrates flying out of the grinding head.

[0013] Technical means for solving problems

[0014] According to one embodiment, a substrate processing apparatus is disclosed, comprising: a polishing table having a polishing pad for polishing a substrate attached thereon; a polishing head for holding the substrate and pressing it against the polishing pad; a retaining ring member configured to surround the polishing head; a retaining ring member pressure chamber configured adjacent to the retaining ring member; an arm for holding the polishing head and rotating it; and a slip-out detector for detecting a substrate ejection from the polishing head based on the rotational torque of the arm or based on the flow rate of fluid supplied to the retaining ring member pressure chamber. Attached Figure Description

[0015] Figure 1 This is a top view showing the overall structure of a substrate processing apparatus based on one embodiment.

[0016] Figure 2 This is a perspective view that schematically represents the structure of a grinding unit based on one embodiment.

[0017] Figure 3This is a schematic cross-sectional view of a grinding head that holds a substrate, which is the object to be ground, and presses the substrate onto a grinding pad, based on one embodiment.

[0018] Figure 4 This is a graph showing the relationship between the drive current of the arm and the sliding of the substrate.

[0019] Figure 5 This diagram schematically illustrates the state of the pressure chamber of the retaining ring component when the substrate slides out.

[0020] Figure 6 This is a graph showing the relationship between the flow rate of the fluid supplied to the pressurization chamber of the retaining ring component and the sliding out of the substrate.

[0021] Figure 7 This is a flowchart illustrating the substrate processing method of this embodiment.

[0022] Symbol Explanation

[0023] 3. Retaining ring components

[0024] 10. Pressure chamber for retaining ring components

[0025] 30 Fluid supply source

[0026] 300 grinding units

[0027] 302 Grinding Head

[0028] 304 Grinding Head Rotary Motor

[0029] 304' Grinding Head Ammeter

[0030] 350 Grinding Table

[0031] 352 Grinding Pad

[0032] 359 Grinding Table Rotary Motor

[0033] 359' Grinding Stage Ammeter

[0034] 360 arm

[0035] 364-arm rotary motor

[0036] 364' arm galvanometer

[0037] 370 Light Emitting Components

[0038] 372 Optical receiving component

[0039] 900 control device

[0040] 910 Slideout Detector

[0041] 920 speed detector

[0042] 930 Setting Change Detector

[0043] 940 Storage Media

[0044] 1000 Substrate Processing Device

[0045] F1, F2, F3, F4, F5, F6 flow sensors

[0046] Pressure sensors P1, P2, P3, P4, P5, and P6

[0047] WF substrate Detailed Implementation

[0048] Hereinafter, embodiments of the substrate processing apparatus, substrate processing method, and storage medium storing a program for executing the substrate processing method on a computer, according to the present invention, will be described with reference to the accompanying drawings. In the drawings, the same or similar elements are labeled with the same or similar reference numerals, and repeated descriptions related to the same or similar elements are sometimes omitted in the description of each embodiment. Furthermore, features shown in each embodiment can be applied to other embodiments as long as they do not contradict each other.

[0049] Figure 1 This is a top view showing the overall structure of a substrate processing apparatus 1000 based on one embodiment. Figure 1 The substrate processing apparatus 1000 shown includes a loading unit 100, a conveying unit 200, a polishing unit 300, a drying unit 500, and an unloading unit 600. In the illustrated embodiment, the conveying unit 200 has two conveying units 200A and 200B, and the polishing unit 300 has two polishing units 300A and 300B. In one embodiment, these units can be formed independently. By forming these units independently, substrate processing apparatuses 1000 with different structures can be easily formed by arbitrarily combining the number of units. Furthermore, the substrate processing apparatus 1000 includes a control device 900, which controls each component of the substrate processing apparatus 1000. In one embodiment, the control device 900 can be a general-purpose computer equipped with input / output devices, arithmetic units, storage devices, etc.

[0050] <Loading Unit>

[0051] The loading unit 100 is used to import the substrate WF before it undergoes grinding and cleaning processes into the substrate processing apparatus 1000. In one embodiment, the loading unit 100 is configured according to the mechanical interface standard (IPC-SMEMA-9851) of SMEMA (Surface Mount Equipment Manufacturers Association).

[0052] In the illustrated embodiment, the conveying mechanism of the loading unit 100 has a plurality of conveying rollers 202 and a plurality of roller shafts 204 for mounting the conveying rollers 202. Figure 1 In the embodiment shown, three conveyor rollers 202 are mounted on each roller shaft 204. The substrate WF is disposed on the conveyor rollers 202 and is conveyed by rotating the conveyor rollers 202.

[0053] <Conveying Unit>

[0054] Figure 1 The substrate processing apparatus 1000 shown includes two transport units 200A and 200B. The two transport units 200A and 200B can be configured with the same structure, and therefore will be described together as transport unit 200 below.

[0055] The illustrated conveying unit 200 includes multiple conveying rollers 202 for conveying substrate WF. By rotating the conveying rollers 202, the substrate WF on the conveying rollers 202 can be conveyed in a predetermined direction. The conveying rollers 202 are driven by an electric motor (not shown). The substrate WF is conveyed to the substrate transfer position via the conveying rollers 202.

[0056] In one embodiment, the conveying unit 200 has a cleaning nozzle 284. The cleaning nozzle 284 is connected to a source of cleaning fluid (not shown). The cleaning nozzle 284 is configured to supply cleaning fluid to the substrate WF conveyed by the conveying roller 202.

[0057] <Drying Unit>

[0058] The drying unit 500 is a device for drying the substrate WF. Figure 1 In the substrate processing apparatus 1000 shown, the drying unit 500 dries the substrate WF that has been cleaned by the cleaning section of the transport unit 200 after being polished by the polishing unit 300. Figure 1 As shown, the drying unit 500 is located downstream of the conveying unit 200.

[0059] The drying unit 500 has a nozzle 530 for spraying gas toward the substrate WF being conveyed on the conveyor roller 202. The gas can be, for example, compressed air or nitrogen. By using the drying unit 500 to blow away water droplets on the conveyed substrate WF, the substrate WF can be dried.

[0060] <Unloading Unit>

[0061] The unloading unit 600 is used to remove the substrate WF, which has undergone grinding and cleaning processes, from the substrate processing apparatus 1000. Figure 1 In the substrate processing apparatus 1000 shown, the unloading unit 600 receives the substrate dried by the drying unit 500. For example... Figure 1 As shown, the unloading unit 600 is disposed downstream of the drying unit 500. In one embodiment, the unloading unit 600 is configured according to the SMEMA (Surface Mount Equipment Manufacturers Association) mechanical device interface standard (IPC-SMEMA-9851).

[0062] <Grinding Unit>

[0063] Figure 2 This is a perspective view that schematically represents the structure of a grinding unit 300 based on one embodiment. Figure 1 The substrate processing apparatus 1000 shown includes two polishing units 300A and 300B. The two polishing units 300A and 300B can be configured with the same structure, so they will be described together as polishing unit 300 below.

[0064] like Figure 2 As shown, the polishing unit 300 includes a polishing table 350 and a polishing head 302 that holds the substrate, which is the object to be polished, and presses it against the polishing surface on the polishing table 350. The polishing table 350 is connected to a polishing table rotary motor 359 disposed below it via a table shaft 351 and is capable of rotating about the table shaft 351. A polishing table galvanometer 359' capable of measuring the drive current of the polishing table rotary motor 359 is provided on the polishing table rotary motor 359, serving as a polishing table torque detector for detecting physical quantities related to the rotational torque of the polishing table 350. A polishing pad 352 is attached to the upper surface of the polishing table 350, and the polishing surface 352a of the polishing pad 352 constitutes the polishing surface of the substrate.

[0065] A polishing slurry supply nozzle 354 is provided above the polishing table 350, through which polishing slurry is supplied to the polishing pad 352 on the polishing table 350. Additionally, as... Figure 2As shown, a passage 353 for supplying polishing fluid is provided on the polishing table 350 and the worktable shaft 351. The passage 353 communicates with the opening 355 on the surface of the polishing table 350. At a position corresponding to the opening 355 of the polishing table 350, a through hole 357 is formed in the polishing pad 352, and the polishing fluid is supplied from the opening 355 of the polishing table 350 and the through hole 357 of the polishing pad 352 through the passage 353 to the surface of the polishing pad 352.

[0066] Although Figure 2 Not shown, but in one embodiment, the grinding unit 300 includes a sprayer 358 for spraying liquid or a mixture of liquid and gas toward the grinding pad 352 (see reference). Figure 1 The liquid sprayed from sprayer 358 is, for example, pure water, and the gas is, for example, nitrogen.

[0067] The grinding head 302 is connected to the grinding head shaft 18, which moves vertically relative to the arm 360 via a vertical movement mechanism 319. This vertical movement of the grinding head shaft 18 causes the entire grinding head 302 to move vertically and position relative to the arm 360. The grinding head shaft 18 is rotated by a grinding head rotary motor 304. A grinding head galvanometer 304' capable of measuring the drive current of the grinding head rotary motor 304 is provided in the grinding head rotary motor 304, serving as a grinding head torque detector for detecting physical quantities related to the rotational torque of the grinding head 302. With the rotation of the grinding head shaft 18, the grinding head 302 rotates around the grinding head shaft 18. The grinding head 302 can maintain a quadrilateral substrate on its lower surface. A rotary joint 323 is mounted on the upper end of the grinding head shaft 18.

[0068] The arm 360 is configured to rotate around a pivot 362. The arm 360 is connected to an arm rotary motor 364 located below it via the pivot 362, and can rotate around the pivot 362. An arm current meter 364' is provided in the arm rotary motor 364 as an arm torque detector for detecting physical quantities related to the rotational torque of the arm 360. If the arm rotary motor 364 is a servo motor, it functions as an arm torque detector. The grinding head 302 can move between the substrate junction position of the aforementioned transport unit 200 and the top of the grinding table 350 via the rotation of the arm 360. By lowering the grinding head shaft 18, the grinding head 302 can be lowered to press the substrate onto the surface (grinding surface) 352a of the grinding pad 352. At this time, the polishing head 302 and the polishing table 350 are rotated respectively, and polishing liquid is supplied to the polishing pad 352 from the polishing liquid supply nozzle 354 provided above the polishing table 350 and / or from the opening 355 provided on the polishing table 350. In this way, the substrate WF can be pressed against the polishing surface 352a of the polishing pad 352 to polish the surface of the substrate. During the polishing of the substrate WF, the arm 360 can also be fixed or oscillated such that the polishing head 302 passes through the center of the polishing pad 352 (to cover the through hole 357 of the polishing pad 352).

[0069] The up-and-down movement mechanism 319 for moving the grinding head shaft 18 and the grinding head 302 up and down includes: a bridge 28 supporting the grinding head shaft 18 for rotation via a bearing 321; a ball screw 32 mounted on the bridge 28; a support platform 29 supported by a support column 130; and a servo motor 38 mounted on the support platform 29. The support platform 29 supporting the servo motor 38 is fixed to the arm 360 via the support column 130.

[0070] The ball screw 32 includes a screw shaft 32a connected to the servo motor 38 and a nut 32b screwed to the screw shaft 32a. The grinding head shaft 18 and the bridge 28 move up and down as an integral part. Therefore, if the servo motor 38 is driven, the bridge 28 moves up and down via the ball screw 32, thereby moving the grinding head shaft 18 and the grinding head 302 up and down. The grinding unit 300 can calculate the height position of the grinding head 302 based on data received from the servo motor 38. The calculation of the height position of the grinding head 302 is used, for example, in a process of detecting the height of the surface of the grinding pad 352 in order to maintain a constant distance between the grinding head 302 and the grinding pad 352 regardless of changes in the thickness of the grinding pad 352. This process is performed as follows: while the grinding head 302 is lowered, the speed is accumulated using the encoder of the servo motor 38, and the descent distance (height position) of the grinding head 302 is calculated based on the accumulated value of the encoder of the servo motor 38 when the lower surface of the grinding head 302 contacts the surface of the grinding pad 352. Furthermore, all equipment within the grinding unit, including the servo motor 38, is configured to be controlled by the control device 900.

[0071] One embodiment of the polishing unit 300 includes a trimming unit 356 for trimming the polishing surface 352a of the polishing pad 352. For example... Figure 2 As shown, the dressing unit 356 includes: a dresser 50 that slides in contact with the grinding surface 352a; a dresser shaft 51 connected to the dresser 50; a cylinder 53 for driving the dresser shaft 51 to rise and fall; and an arm 55 that supports the dresser shaft 51 for rotation. A dressing component 50a is held at the lower part of the dresser 50, and needle-shaped diamond particles are electrodeposited on the lower surface of the dressing component 50a. The cylinder 53 is disposed on a support platform 57 supported by pillars 56, which are fixed to the arm 55.

[0072] Arm 55 is configured to rotate about a pivot 58, driven by an electric motor (not shown). Dresser shaft 51 is positioned opposite a polishing pad 352 and rotates via an electric motor (not shown). This rotation of dresser shaft 51 causes dresser 50 to rotate about it. Cylinder 53 moves dresser 50 up and down via dresser shaft 51, pressing dresser 50 against the polishing surface 352a of polishing pad 352 with a predetermined pressure.

[0073] The dressing of the grinding surface 352a of the grinding pad 352 is performed as follows: The dresser 50 is pressed onto the grinding surface 352a by the cylinder 53, while simultaneously, pure water is supplied to the grinding surface 352a by a pure water supply nozzle (not shown). In this state, the dresser 50 rotates about the dresser shaft 51, causing the lower surface (diamond particle) of the dressing component 50a to slide into contact with the grinding surface 352a. Thus, the grinding pad 352 is removed by the dresser 50, and the grinding surface 352a is dressed.

[0074] Next, the grinding head 302 in the grinding unit 300 according to one embodiment will be described. Figure 3 This is a schematic cross-sectional view of a polishing head 302, based on one embodiment, which holds a substrate, the object to be polished, and presses the substrate onto a polishing pad. Figure 3 The main components constituting the grinding head 302 are only schematically illustrated in the diagram.

[0075] like Figure 3 As shown, the grinding head 302 includes: a grinding head body 2, which presses the substrate WF against the grinding surface 352a; and a retaining ring member 3, which is arranged to surround the grinding head 302 and directly presses the grinding surface 352a. The grinding head body 2 is composed of a generally quadrilateral flat plate, and the retaining ring member 3 is mounted on the outer periphery of the grinding head body 2. An elastic membrane (diaphragm) 4 that contacts the back side of the substrate is mounted on the lower surface of the grinding head body 2. In one embodiment, the elastic membrane (diaphragm) 4 is formed of a rubber material with excellent strength and durability, such as ethylene propylene diene monomer (EPDM), polyurethane rubber, or silicone rubber.

[0076] The elastic membrane (diaphragm) 4 has multiple concentric partitions 4a. Through these partitions 4a, a circular central chamber 5, a quadrilateral frame-shaped pulsating chamber 6 surrounding the central chamber 5, a quadrilateral frame-shaped intermediate chamber 7 surrounding the pulsating chamber 6, a quadrilateral frame-shaped outer chamber 8 surrounding the intermediate chamber 7, and a quadrilateral frame-shaped edge chamber 9 surrounding the outer chamber 8 are formed between the upper surface of the elastic membrane 4 and the lower surface of the grinding head body 2. That is, a central chamber 5 is formed at the center of the grinding head body 2, and the pulsating chamber 6, intermediate chamber 7, outer chamber 8, and edge chamber 9 are formed concentrically from the center outwards. Figure 3 As shown, within the grinding head body 2, flow paths 11 (communicating with the central chamber 5), 12 (communicating with the pulsating chamber 6), 13 (communicating with the intermediate chamber 7), 14 (communicating with the outer chamber 8), and 15 (communicating with the edge chamber 9) are respectively formed. Flow paths 11, 12, 13, 14, and 15 are connected to flow paths 21, 22, 23, 24, and 25 respectively via rotary joints 323. Furthermore, flow paths 21, 22, 23, 24, and 25 are connected to the fluid supply source 30 via valves V1-1, V2-1, V3-1, V4-1, and V5-1, and pressure regulators R1, R2, R3, R4, and R5 respectively. In addition, flow paths 21, 22, 23, 24, and 25 are connected to vacuum source 31 via valves V1-2, V2-2, V3-2, V4-2, and V5-2, respectively, and can be connected to the atmosphere via valves V1-3, V2-3, V3-3, V4-3, and V5-3.

[0077] Furthermore, a retaining ring member pressurization chamber 10, composed of an elastic membrane, is also formed on the retaining ring member 3. The retaining ring member pressurization chamber 10 is connected to the flow path 26 via the flow path 16 formed in the polishing head body 2 and the rotary joint 323. The flow path 26 is connected to the fluid supply source 30 via valve V6-1 and pressure regulator R6. The flow path 26 is also connected to the vacuum source 31 via valve V6-2 and can be connected to the atmosphere via valve V6-3. Pressure regulators R1, R2, R3, R4, R5, and R6 have pressure adjustment functions to adjust the pressure of the pressurized fluid supplied from the fluid supply source 30 to the central chamber 5, pulsating chamber 6, intermediate chamber 7, outer chamber 8, edge chamber 9, and retaining ring member pressurization chamber 10. With this configuration, the pressing force of the substrate WF against the polishing pad 352 can be adjusted for each area of ​​the substrate WF, and the pressing force of the retaining ring member 3 against the polishing pad 352 can also be adjusted. Pressure regulators R1, R2, R3, R4, R5, R6 and valves V1-1~V1-3, V2-1~V2-3, V3-1~V3-3, V4-1~V4-3, V5-1~V5-3, V6-1~V6-3 and control device 900 (reference) Figure 1 The connections are controlled. Additionally, pressure sensors P1, P2, P3, P4, P5, P6 and flow sensors F1, F2, F3, F4, F5, F6 are respectively provided in flow paths 21, 22, 23, 24, 25, and 26. Furthermore, in this embodiment, the retaining ring member pressurization chamber 10 is integrally formed on the top of the rectangular retaining ring member 3, but this is not a limitation; it may be formed separately relative to each of the four sides of the retaining ring member 3. In this case, a valve V6-1, a pressure regulator R6, a pressure sensor P6, and a flow sensor F6 may be provided relative to each of the four retaining ring member pressurization chambers 10.

[0078] <Slip-out detection>

[0079] like Figure 2As shown, the polishing unit 300 includes a slip-out detector 910. The slip-out detector 910 can be implemented as a functional block of the control device 900. The slip-out detector 910 can detect the situation where the substrate WF flies out of the polishing head 302 based on the rotational torque of the arm 360. For example, the slip-out detector 910 is configured to detect the situation where the substrate WF flies out of the polishing head 302 based on the change of a physical quantity related to the rotational torque of the arm 360. Specifically, the drive current value measured by the arm galvanometer 364' is input to the slip-out detector 910. The slip-out detector 910 is configured to detect the situation where the substrate WF flies out of the polishing head 302 if the change in the drive current value measured by the arm galvanometer 364' per unit time exceeds a preset threshold. Furthermore, in this embodiment, an example of detecting the rotational torque of the arm 360 based on the drive current value measured by the arm galvanometer 364' is shown, but it is not limited to this. When the arm rotary motor 364 is a servo motor, the slip-out detector 910 can detect the rotational torque of the arm 360 based on data received from the arm rotary motor 364. In this case, the arm galvanometer 364' may not be required.

[0080] Figure 4 This is a graph showing the relationship between the drive current of arm 360 and the sliding of the substrate WF. Figure 4 In the figure, the vertical axis represents the drive current (A) of arm 360, and the horizontal axis represents time (seconds). Figure 4 The figure above shows the drive current of arm 360 during the sliding process, starting from the initial polishing of the substrate WF. Figure 4 The image below shows an enlarged view of the portion where the substrate WF slid out.

[0081] When the arm 360 rotates from the outside of the grinding table 350 onto the grinding table 350, as in Figure 4 As shown around 50 seconds, the rotational torque of arm 360 is generated, and the drive current of arm 360 changes significantly. Then, when the substrate WF is pressed onto the polishing pad 352 at a predetermined position on the polishing table 350 and polishing begins, arm 360 resists the frictional force between the substrate WF and the polishing pad 352 to continuously hold the polishing head 302 at the predetermined position on the polishing table 350. Thus, as in Figure 4 As shown from approximately 60 seconds to approximately 120 seconds, a predetermined drive current continuously flows in arm 360 as a predetermined rotational torque is continuously generated in arm 360. Furthermore, when the substrate WF slips out, the friction between the substrate WF and the polishing pad 352 disappears, thereby rapidly reducing the rotational torque of arm 360, as in... Figure 4Around 121 seconds, the drive current of arm 360 changes dramatically. At this moment, the change in the drive current value of arm 360 per unit time (e.g., every 0.1 seconds) exceeds a preset threshold, so the slip-out detector 910 is able to detect that the substrate WF has flown out of the polishing head 302.

[0082] According to this embodiment, the detection accuracy of the substrate WF flying out (slipping out) from the polishing head 302 can be improved. Specifically, in the case of detecting the slippage of the substrate WF based on changes in the rotational torque of the polishing head or polishing table, as in the prior art, noise caused by vibration during polishing is directly reflected in the rotational torque of the polishing head or polishing table, thus creating the possibility of false detections caused by this noise. In contrast, in this embodiment, the slippage of the substrate WF is detected based on changes in the rotational torque of the arm 360. Therefore, vibration during polishing is not directly reflected in the rotational torque of the arm 360, and as a result, false detections caused by vibration noise can be suppressed.

[0083] Here, in the case where the slippage of the substrate WF is detected based on the change in the rotational torque of the arm 360 as in this embodiment, there is a possibility of false detection of substrate WF slippage caused by the swinging (rotation) of the arm 360. That is, the polishing unit 300 sometimes polishes the substrate WF while swinging (reciprocating) the arm 360 within a predetermined range on the polishing table 350. In this case, since the arm 360 decelerates and accelerates in the folding region of the swinging arm 360, this manifests as a change in the rotational torque of the arm 360, which may be falsely detected as substrate WF slippage.

[0084] Regarding this point, such as Figure 2 As shown, the grinding unit 300 includes a speed detector 920 for detecting the rotational speed of the arm 360. The speed detector 920 can be implemented as a functional block of the control device 900. The speed detector 920 can receive information on the rotational direction and rotational speed of the arm 360 sent from the arm rotary motor 364, and detect the rotational speed of the arm 360 based on the change in the position of the arm 360 per unit time. The slip-out detector 910 can be configured to stop detecting the situation where the substrate WF flies out of the grinding head 302 based on the speed detected by the speed detector 920. Specifically, the slip-out detector 910 can be configured to consider that the arm 360 is in the swinging reversal area when the speed detected by the speed detector 920 is less than a preset threshold, and therefore stop detecting the situation where the substrate WF flies out of the grinding head 302.

[0085] According to this embodiment, in the swing return zone of the arm 360, the arm 360 is decelerated and then accelerated again until a predetermined speed is reached, which can stop the detection of the substrate WF flying out, and thus can suppress the occurrence of false detection in the swing return zone of the arm 360.

[0086] The slip-out detector 910 can detect the slip-out of the substrate WF based on the flow rate of the fluid supplied to the pressurization chamber 10 of the retaining ring member, instead of detecting the slip-out of the substrate WF based on the change in the rotational torque of the arm 360. Alternatively, it can detect the slip-out of the substrate WF based on the flow rate of the fluid supplied to the pressurization chamber 10 of the retaining ring member, in addition to detecting the slip-out of the substrate WF based on the change in the rotational torque of the arm 360. That is, the slip-out detector 910 can be configured to detect the situation where the substrate WF flies out of the polishing head 302 based on the change in the flow rate detected by the flow sensor F6. Specifically, the slip-out detector 910 can be configured to detect the situation where the substrate WF flies out of the polishing head 302 if the change in the flow rate of the fluid detected by the flow sensor F6 per unit time exceeds a preset threshold.

[0087] Figure 5 This diagram schematically illustrates the state of the pressure chamber 10 of the retaining ring component when the substrate WF slides out. Figure 5 The image above shows the state where the substrate WF has not slipped out. Figure 5 The image below shows the state where the substrate WF has slid out. For example... Figure 5 As shown in the figure above, when fluid is supplied to the pressurized chamber 10 of the retaining ring member and the retaining ring member 3 presses against the polishing pad 352, the flow rate of the fluid supplied to the pressurized chamber 10 of the retaining ring member is unlikely to change if the substrate WF does not slip out. On the other hand, when the substrate WF slips out, the substrate WF pushes against the retaining ring member 3, thereby causing the fluid to flow out of the pressurized chamber 10 of the retaining ring member, and the change in the flow rate of the fluid supplied to the pressurized chamber 10 of the retaining ring member becomes larger.

[0088] Figure 6 This is a graph showing the relationship between the flow rate of the fluid supplied to the pressurization chamber 10 of the retaining ring component and the sliding of the substrate WF. Figure 6 In the figure, the vertical axis represents the flow rate (mL) of the fluid supplied to the pressurization chamber 10 of the retaining ring component, and the horizontal axis represents the time (seconds). Figure 6 The figure above shows the flow rate of fluid supplied to the pressurized chamber 10 of the retaining ring component during the slip-out process, starting from the beginning of the substrate WF polishing process. Figure 6 The image below shows an enlarged view of the portion where the substrate WF slid out.

[0089] If fluid is supplied to the pressurization chamber 10 of the retaining ring member during the initial polishing process of the substrate WF to press the retaining ring member 3 against the polishing pad 352, then as in Figure 6As shown after approximately 60 seconds, the flow rate of the fluid supplied to the pressurized chamber 10 of the retaining ring component changes significantly. Subsequently, during the polishing process of the substrate WF, the retaining ring component 3 is continuously pressed against the polishing pad 352, and there is little change in the position of the retaining ring component 3; therefore, the flow rate of the fluid supplied to the pressurized chamber 10 of the retaining ring component remains almost unchanged. Subsequently, when the substrate WF slips out, the substrate WF contacts the retaining ring component 3, pushing the retaining ring component 3 upwards, or the retaining ring component 3 is pushed back due to the supply of fluid from the fluid supply source 30, thereby creating an inflow / outflow of fluid relative to the pressurized chamber 10 of the retaining ring component. Thus, as in... Figure 6 As shown around 96 seconds, the flow rate of the fluid supplied to the pressurization chamber 10 of the retaining ring component changes significantly. At this moment, the change in the flow rate of the fluid supplied to the pressurization chamber 10 of the retaining ring component per unit time (e.g., every 0.1 seconds) exceeds a preset threshold, so the slip-out detector 910 is able to detect that the substrate WF has been ejected from the polishing head 302.

[0090] According to this embodiment, the detection accuracy of the substrate WF flying out (slipping out) from the polishing head 302 can be improved. Specifically, in the case of detecting substrate flying out based on changes in the pressure / flow rate of the fluid supplied to the back side of the substrate, as in the prior art, noise caused by vibration during polishing is directly reflected in the fluid pressure / flow rate, thus creating the possibility of false detections caused by this noise. In contrast, in this embodiment, the slippage of the substrate WF is detected based on changes in the flow rate of the fluid supplied to the pressurization chamber 10 of the retaining ring member. Therefore, vibration during polishing is not directly reflected in the flow rate of the fluid supplied to the pressurization chamber 10 of the retaining ring member, and as a result, false detections caused by vibration noise can be suppressed.

[0091] Furthermore, while this embodiment detects the slippage of the substrate WF based on changes in the flow rate of the fluid supplied to the pressurized chamber 10 of the retaining ring member, it is not limited to this. It is also possible to detect the slippage of the substrate WF based on changes in the pressure of the fluid supplied to the pressurized chamber 10 of the retaining ring member. In this case, the slippage detector 910 can be configured to detect that the substrate WF has flown out of the grinding head 302 if the change in fluid pressure per unit time detected by the pressure sensor P6 exceeds a preset threshold. Additionally, in this embodiment, the retaining ring member pressurized chamber 10 is described as integrally formed into a rectangular frame shape, but it is not limited to this. It is also possible that a retaining ring member pressurized chamber 10 is provided with each of the four sides of the retaining ring member 3, and a flow sensor F6 is provided with each retaining ring member pressurized chamber 10. In this case, the slippage detector 910 can detect the slippage of the substrate WF based on changes in the flow rate of the fluid detected by any one of the four flow sensors F6.

[0092] In addition to detecting the slip-out of the substrate WF based on changes in the rotational torque of the arm 360 and / or changes in the flow rate of the fluid supplied to the pressurization chamber 10 of the retaining ring component, the slip-out detector 910 can also combine other slip-out detection methods. For example, the polishing unit 300 includes a polishing stage galvanometer 359' as a stage torque detector for detecting physical quantities related to the rotational torque of the polishing stage 350. The slip-out detector can detect the situation where the substrate WF flies out of the polishing head 302 based on changes in the drive current detected by the polishing stage galvanometer 359'.

[0093] Additionally, the polishing unit 300 includes a polishing head galvanometer 304' as a polishing head torque detector for detecting physical quantities related to the rotational torque of the polishing head 302. The slip-out detector 910 can detect the situation where the substrate WF flies out of the polishing head 302 based on the change in drive current detected by the polishing head galvanometer 304'.

[0094] And, as Figure 2 As shown, the polishing unit 300 further includes a light emitting member 370 for emitting light to the polishing pad 352 and a light receiving member 372 for receiving light reflected from the polishing pad 352. The slip-out detector 910 can detect the situation where the substrate WF flies out of the polishing head 302 based on the change in the amount of reflected light emitted from the light emitting member 370 and received by the light receiving member 372. That is, since the reflectivity of the polishing pad 352 and the substrate WF is different, if the substrate WF detaches from the polishing head 302 and appears in the light emitting area, the amount of reflected light changes. Therefore, if this change is detected, it is determined that the substrate WF has detached from the polishing head 302. In addition, the slip-out detector 910 can detect the situation where the substrate WF flies out of the polishing head 302 based on the change in the color of the reflected light emitted from the light emitting member 370 and received by the light receiving member 372. That is, the slip-out detector 910 registers the reference color of the polishing pad based on the light reflected from the polishing pad 352 when light is emitted from it before the polishing process of the substrate WF. During the polishing process of the substrate WF, the slip-out detector 910 compares the color of the light reflected from the polishing pad 352 with the reference color. Since the polishing pad 352 and the substrate WF have different colors, if the substrate WF detaches from the polishing head 302 and appears in the light emission area, the slip-out detector 910 detects a color different from the reference color of the polishing pad 352, thus enabling the detection of the substrate WF flying out of the polishing head 302.

[0095] The slip-out detector 910 can determine that the substrate WF has slipped out if slippage is detected using one or more of the aforementioned methods for detecting slippage of the substrate WF, and stop the polishing unit 300. Furthermore, the slip-out detector 910 can also be configured with a monitoring unit such as a CCD camera that captures images of the surface of the polishing pad 352 above the polishing pad 352 and near the outside of the polishing head 302, thereby detecting cases where the substrate WF flies out of the polishing head 302.

[0096] In addition, such as Figure 2 As shown, the polishing unit 300 includes a setting change detector 930, which detects when a setting change command is issued. This setting change command is used to change the set value of at least one of the following: the height of the polishing head 302 relative to the polishing pad 352; the pressure of the plurality of substrate pressure chambers formed in the polishing head 302 (central chamber 5, pulsating chamber 6, intermediate chamber 7, outer chamber 8, and edge chamber 9); the pressure of the retaining ring member pressure chamber 10; the rotational speed of the polishing table 350; the rotational speed of the polishing head 302; and the rotational speed of the arm 360. The setting change detector 930 can be implemented as a functional block of the control device 900. The setting change detector 930 can detect, for example, setting change commands input by an operator via a GUI (Graphical User Interface) screen provided on the substrate processing device 1000, or setting change commands based on automatic commands issued from the host computer of the substrate processing device 1000. The slip-out detector 910 can be configured to stop detecting when the substrate WF flies out of the polishing head 302 after the setting change detector 930 detects that a setting change command has been issued.

[0097] That is, when various setting change commands as described above are issued while the substrate WF is being polished in the polishing unit 300, a predetermined time is required for the settings to be changed until a normal polishing state is reached. During the transition period of this setting change, various detection values ​​that trigger the substrate WF ejection detection may change, and this change may be falsely detected as substrate WF ejection. Therefore, when various setting change commands as described above are issued, the slip-out detector 910 can suppress the occurrence of false detection by invalidating the slip-out detection for a predetermined time. Furthermore, not limited to the above, the slip-out detector 910 can also be configured to perform slip-out detection even if the rotation (oscillation) speed of the arm 360 is changed during the polishing of the substrate WF. That is, the slip-out detector 910 can also be effective when the speed of the arm 360 is constantly changing while polishing the substrate WF by oscillating the arm 360, or when the arm 360 is moved at a constant speed and then folded back at the end.

[0098] <Substrate Processing Method>

[0099] Next, the substrate processing method of this embodiment will be described. Figure 7 This is a flowchart illustrating the substrate processing method of this embodiment. In the substrate processing method, firstly, the operator creates various methods for substrate processing via a GUI screen (step 102) and begins the substrate polishing process (step 104). Specifically, in the polishing step, the substrate WF is held by the polishing head 302 and pressed against the polishing pad 352, and the substrate WF and the polishing pad 352 are moved relative to each other, thereby polishing the substrate WF. Next, in the substrate processing method, it is determined whether the substrate WF slip-out detection function has become active (step 106). If it has not become active (step 106, No), the processing ends.

[0100] On the other hand, when the slip-out detection function is effective (step 106, Yes), the slip-out detector 910 determines whether the polishing head 302 is within the monitoring range (step 108). That is, when the polishing process of the substrate WF begins, the polishing head 302 receives the substrate at the substrate junction and transports it to the polishing table 350 by the rotation of the arm 360. At this time, no determination of whether slip-out has occurred is made until the polishing head 302 is transported to the predetermined range on the polishing table 350, so as to avoid false detection of slip-out based on the change of the rotation torque of the arm 360.

[0101] If it is determined that the grinding head 302 is within the monitoring range (step 108, yes), the slip-out detector 910 determines whether the monitoring conditions for slip-out detection have changed (step 110). The slip-out detector 910 can make the determination in step 110 based on whether the setting change command mentioned above has been detected by the setting change detector 930. If the monitoring conditions for slip-out detection have changed (step 110, yes), the slip-out detector 910 waits for a predetermined detection start delay time (step 112). As a result, the occurrence of false slip-out detection caused by setting changes can be suppressed.

[0102] On the other hand, if the monitoring conditions for slip-out detection do not change (step 110, no), or after waiting for the predetermined detection start delay time in step 112, the slip-out detector 910 performs slip-out detection on the substrate WF to determine whether slip-out has occurred (step 116). The slip-out detector 910 can detect slip-out of the substrate WF based on changes in the rotational torque of the arm 360 or changes in the flow rate of the fluid supplied to the pressurization chamber 10 of the retaining ring member. In addition, the slip-out detector 910 can also combine slip-out detection based on changes in the rotational torque of the polishing table 350 / polishing head 302 or slip-out detection based on changes in the amount or color of reflected light received by the light receiving member 372.

[0103] If the slip-out detector 910 detects the slip-out of the substrate WF (step 116, yes), the slip-out detector 910 performs an abnormal stop process for the polishing unit 300 (step 118). On the other hand, if the slip-out detector 910 does not detect the slip-out of the substrate WF (step 116, no), it determines whether the polishing process has ended (step 120). If the polishing process has not ended (step 120, no), the slip-out detector 910 returns to step 108 and repeats the process. On the other hand, if the polishing process has ended (step 120, yes), the slip-out detector 910 ends the process.

[0104] like Figure 2 As shown, the control device 900 includes a storage medium 940. In addition to storing various data used in the substrate processing apparatus 1000, the storage medium 940 also stores a program for causing the computer (control device 900) of the substrate processing apparatus 1000 to execute each step of the aforementioned substrate processing method. The CPU (central processing unit) of the control device 900 can read and execute the program stored in the storage medium 940. This program is recorded in a computer-readable storage medium and can be provided to the control device 900 via the storage medium. Alternatively, the program can also be provided to the control device 900 via a communication network such as the Internet.

[0105] Several embodiments of the present invention have been described above. However, these embodiments are intended to facilitate understanding of the invention and are not intended to limit the invention. The invention can, of course, be modified and altered without departing from its spirit, and its equivalents can be included. Furthermore, the scope of protection claimed, and any combination or omission of the constituent elements described in the specification, can be limited to the scope that solves at least a portion of the aforementioned problems or achieves at least a portion of the effects. For example, in this embodiment, slip-out detection of a quadrilateral substrate WF has been described as an example, but it is not limited to this; the invention can also be applied to slip-out detection of other polygonal or circular substrates such as semiconductor wafers.

[0106] This application discloses a substrate processing apparatus. As one embodiment, the substrate processing apparatus includes: a polishing table with a polishing pad for polishing a substrate attached thereon; a polishing head for holding the substrate and pressing it against the polishing pad; a retaining ring member configured to surround the polishing head; a retaining ring member pressure chamber configured adjacent to the retaining ring member; an arm for holding the polishing head and rotating it; and a slip-out detector for detecting whether the substrate flies out of the polishing head based on the rotational torque of the arm or based on the flow rate of fluid supplied to the retaining ring member pressure chamber.

[0107] Furthermore, this application discloses a substrate processing apparatus, which, as one embodiment, further includes an arm torque detector for detecting a physical quantity related to the rotational torque of the arm, and the slip-out detector is configured to detect the situation where the substrate flies out of the grinding head based on the change in the physical quantity detected by the arm torque detector.

[0108] Furthermore, this application discloses a substrate processing apparatus. In one embodiment, the slip-out detector is configured to detect if the change in a physical quantity detected by the arm torque detector per unit time exceeds a preset threshold, thus detecting that the substrate has flown out of the grinding head.

[0109] Furthermore, this application discloses a substrate processing apparatus, in which, as one embodiment, the arm torque detector is a galvanometer that detects the drive current of the motor used to rotate the arm.

[0110] Furthermore, this application discloses a substrate processing apparatus, which, as one embodiment, further includes a speed detector for detecting the rotational speed of the arm. The slip-out detector is configured to stop detecting the situation where the substrate flies out of the grinding head based on the speed detected by the speed detector.

[0111] Furthermore, this application discloses a substrate processing apparatus. In one embodiment, the slip-out detector is configured to stop detecting when the speed detected by the speed detector is less than a preset threshold.

[0112] Furthermore, this application discloses a substrate processing apparatus, which, as one embodiment, further includes: a supply source for supplying fluid to the pressurization chamber of the retaining ring component; and a flow detector for detecting the flow rate of the fluid supplied to the pressurization chamber of the retaining ring component, wherein the slip-out detector is configured to detect the situation where the substrate flies out of the grinding head based on the change in flow rate detected by the flow detector.

[0113] Furthermore, this application discloses a substrate processing apparatus. In one embodiment, the slip-out detector is configured to detect if the change in the flow rate of the fluid detected by the flow detector per unit time exceeds a preset threshold, thus detecting that the substrate has flown out of the grinding head.

[0114] Furthermore, this application discloses a substrate processing apparatus. As one embodiment, it further includes a setting change detector that detects when a setting change command is issued. The setting change command is used to change the setting value of at least one of the following: the height of the polishing head relative to the polishing pad, the pressure of a plurality of substrate pressure chambers formed in the polishing head, the pressure of the pressure chamber of the retaining ring member, the rotational speed of the polishing table, the rotational speed of the polishing head, and the rotational speed of the arm. The slip-out detector is configured to stop detecting the situation of the substrate flying out of the polishing head for a predetermined time when the setting change detector detects that the setting change command has been issued.

[0115] Furthermore, this application discloses a substrate processing apparatus, which, as one embodiment, further includes a stage torque detector for detecting a physical quantity related to the rotational torque of the grinding stage. The slip-out detector is configured to detect the situation where the substrate flies out of the grinding head based on the change in the physical quantity detected by the stage torque detector.

[0116] Furthermore, this application discloses a substrate processing apparatus, which, as one embodiment, further includes a grinding head torque detector for detecting a physical quantity related to the rotational torque of the grinding head. The slip-out detector is configured to detect the situation where the substrate flies out of the grinding head based on the change in the physical quantity detected by the grinding head torque detector.

[0117] Furthermore, this application discloses a substrate processing apparatus, which, as one embodiment, further includes a light emitting component for emitting light to a polishing pad and a light receiving component for receiving light reflected from the polishing pad. The slip-out detector is configured to detect the situation where the substrate flies out of the polishing head based on the change in the amount or color of the reflected light received by the light receiving component.

[0118] Furthermore, this application discloses a substrate processing method, which, as one embodiment, includes: a grinding step, wherein the grinding step uses a grinding head to hold the substrate and press the substrate against a grinding pad adhered to a grinding table; and a slip-out detection step, wherein the slip-out detection step is used to detect the substrate flying out of the grinding head based on the rotational torque of the arm used to rotate the grinding head, or based on the flow rate of fluid supplied to a pressurized chamber of a retaining ring member disposed adjacent to a retaining ring member disposed surrounding the grinding head.

[0119] Furthermore, this application discloses a substrate processing method. As one embodiment, in the slip-out detection step, if the change in a physical quantity related to the rotational torque of the arm per unit time exceeds a preset threshold, the substrate is detected to have flown out of the grinding head.

[0120] Furthermore, this application discloses a substrate processing method. As one embodiment, in the slip-out detection step, if the rotation speed of the arm is less than a preset threshold, the detection of the substrate flying out of the grinding head is stopped.

[0121] Furthermore, this application discloses a substrate processing method. As one embodiment, in the slip-out detection step, if the change in the flow rate of the fluid supplied to the pressurization chamber of the retaining ring component per unit time exceeds a preset threshold, the substrate is detected to have flown out of the grinding head.

[0122] Furthermore, this application discloses a substrate processing method. As one embodiment, the slip-out detection step is configured such that if a setting change command is issued, the slip-out detection is stopped for a predetermined time. The setting change command is used to change the setting value of at least one of the following: the height of the grinding head relative to the grinding pad, the pressure of the plurality of substrate pressure chambers formed in the grinding head, the pressure of the pressure chamber of the retaining ring member, the rotation speed of the grinding table, the rotation speed of the grinding head, and the rotation speed of the arm.

[0123] Furthermore, this application discloses a substrate processing method. As one embodiment, in the slip-out detection step, the substrate is detected to fly out of the grinding head based on the change of a physical quantity related to the rotational torque of the grinding table or the change of a physical quantity related to the rotational torque of the grinding head.

[0124] Furthermore, this application discloses a substrate processing method. As one embodiment, in the slip-out detection step, the substrate is detected to have flown out of the polishing head based on changes in the amount or color of the reflected light emitted by the polishing pad.

[0125] Furthermore, this application discloses a storage medium storing a program as an embodiment, wherein the program is used to cause a computer of a substrate processing apparatus to execute a substrate processing method, the substrate processing method including: a polishing step, the polishing step using a polishing head to hold the substrate and press the substrate against a polishing pad adhered to a polishing table; and a slip-out detection step, the slip-out detection step being used to detect the situation where the substrate flies out of the polishing head based on the rotational torque of an arm used to rotate the polishing head, or based on the flow rate of fluid supplied to a pressurized chamber of a retaining ring member, the pressurized chamber of the retaining ring member being disposed adjacent to a retaining ring member disposed surrounding the polishing head.

Claims

1. A substrate processing apparatus characterized by comprising: comprises: a polishing table to which a polishing pad for polishing a substrate is attached; a polishing head for holding the substrate and pressing the substrate against the polishing pad; a retaining ring member configured to surround the polishing head; a retaining ring member pressurization chamber configured to be adjacent to the retaining ring member; an arm for holding the polishing head and swinging the polishing head; and a flying-out detector for detecting a case where the substrate flies out from the polishing head based on a swing torque of the arm, the substrate processing apparatus further comprises an arm torque detector for detecting a physical quantity related to the swing torque of the arm, the flying-out detector is configured to detect the case where the substrate flies out from the polishing head based on a change in the physical quantity detected by the arm torque detector, the substrate processing apparatus further comprises a speed detector for detecting a swing speed of the arm, the flying-out detector is configured to stop detection of the case where the substrate flies out from the polishing head based on the speed detected by the speed detector.

2. The substrate processing apparatus according to claim 1, wherein the flying-out detector is configured to detect the case where the substrate flies out from the polishing head if an amount of change per unit time of the physical quantity detected by the arm torque detector exceeds a threshold value set in advance.

3. The substrate processing apparatus according to claim 1, wherein the arm torque detector is a current meter that detects a drive current of a motor for swinging the arm.

4. The substrate processing apparatus according to claim 1, wherein the flying-out detector is configured to stop detection of the case where the substrate flies out from the polishing head if the speed detected by the speed detector is less than a threshold value set in advance.

5. The substrate processing apparatus according to claim 1, further comprising: a supply source for supplying fluid to the retaining ring member pressurization chamber; and a flow rate detector for detecting a flow rate of the fluid supplied to the retaining ring member pressurization chamber, the flying-out detector is configured to detect the case where the substrate flies out from the polishing head based on a change in the flow rate detected by the flow rate detector.

6. The substrate processing apparatus according to claim 5, wherein the flying-out detector is configured to detect the case where the substrate flies out from the polishing head if an amount of change per unit time of the flow rate of the fluid detected by the flow rate detector exceeds a threshold value set in advance.

7. The substrate processing apparatus according to claim 1, further comprising a setting change detector that detects a case where a setting change instruction is issued, the setting change instruction being for changing a set value of at least one of a height of the polishing head with respect to the polishing pad, a pressure of a plurality of substrate pressurization chambers formed in the polishing head, a pressure of the retaining ring member pressurization chamber, a rotational speed of the polishing table, a rotational speed of the polishing head, and a swing speed of the arm. ​ ​ The slide-out detector is configured to stop detection of the situation in which the substrate flies out from the polishing head for a prescribed time in the case where the setting change detector detects that the setting change instruction is issued.

8. The substrate processing apparatus according to claim 1, wherein a table torque detector configured to detect a physical quantity related to a rotational torque of the polishing table, the slide-out detector is configured to detect the situation in which the substrate flies out from the polishing head based on a change in the physical quantity detected by the table torque detector.

9. The substrate processing apparatus according to claim 1, wherein a polishing head torque detector configured to detect a physical quantity related to a rotational torque of the polishing head, the slide-out detector is configured to detect the situation in which the substrate flies out from the polishing head based on a change in the physical quantity detected by the polishing head torque detector.

10. The substrate processing apparatus according to claim 1, wherein a light emitting member configured to emit light to the polishing pad and a light receiving member configured to receive the light reflected from the polishing pad, the slide-out detector is configured to detect the situation in which the substrate flies out from the polishing head based on a change in an amount or color of the reflected light received by the light receiving member.

11. A substrate processing method, characterized by, comprises: a polishing step of holding a substrate by a polishing head and pressing the substrate against a polishing pad attached to a polishing table; and a slide-out detection step of detecting a situation in which the substrate flies out from the polishing head based on a rotational torque of an arm for swinging the polishing head, in the slide-out detection step, the situation in which the substrate flies out from the polishing head is detected based on a change in a physical quantity related to a rotational torque of the polishing head, in the slide-out detection step, the detection of the situation in which the substrate flies out from the polishing head is stopped in the case where a swinging speed of the arm is less than a threshold value set in advance.

12. The substrate processing method according to claim 11, wherein in the slide-out detection step, the situation in which the substrate flies out from the polishing head is detected if a change amount per unit time of the physical quantity related to the rotational torque of the arm exceeds a threshold value set in advance.

13. The substrate processing method according to claim 11, wherein in the slide-out detection step, the situation in which the substrate flies out from the polishing head is detected if a change amount per unit time of a flow rate of fluid supplied to a baffle ring member pressure chamber, which is disposed adjacent to a baffle ring member disposed so as to surround the polishing head, exceeds a threshold value set in advance.

14. The substrate processing method according to claim 11, wherein The slide-out detection step is configured to stop the slide-out detection for a predetermined time if a setting change instruction is issued, the setting change instruction being used to change a set value of at least one of a height of the polishing head with respect to a polishing pad, a pressure of a plurality of substrate pressurizing chambers formed in the polishing head, a pressure of a baffle member pressurizing chamber that is disposed in contact with a baffle member disposed so as to surround the polishing head, a rotational speed of the polishing table, a rotational speed of the polishing head, and a rotational speed of the arm.

15. The substrate processing method according to claim 11, wherein In the slide-out detection step, the case where the substrate flies out from the polishing head is detected based on a change in an amount of light or a color of reflected light of light emitted toward the polishing pad.

16. A storage medium storing a program for causing a computer of a substrate processing apparatus to execute a substrate processing method, characterized by, The substrate processing method includes: a polishing step of holding a substrate by a polishing head and pressing the substrate against a polishing pad attached to a polishing table; and a slide-out detection step of detecting the case where the substrate flies out from the polishing head based on a rotational torque of an arm that rotates the polishing head, In the slide-out detection step, the case where the substrate flies out from the polishing head is detected based on a change in a physical quantity related to a rotational torque of the polishing head, In the slide-out detection step, the detection of the case where the substrate flies out from the polishing head is stopped when the rotational speed of the arm is less than a threshold value set in advance.

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