Cutting device and silicon rod processing equipment

Abstract

The present application discloses a cutting device and silicon rod processing equipment; the cutting device has at least one wire cutting unit, in which the cutting wheel and the transition wheel are arranged in such a way that the cutting wire is wound between the cutting wheel and the transition wheel in an end-to-end manner, thereby forming a cutting accommodating space that can be used to start cutting the silicon rod. The overall structure of the cutting device can be simplified, which is beneficial to reducing the cost of the device; at the same time, the annular cutting wire can avoid the acceleration and deceleration process of the cutting wire affecting the cutting accuracy during the operation to perform cutting, thereby improving the cutting accuracy and simplifying the subsequent processes.

Description

Technical Field

[0001] The present application relates to the technical field of silicon workpiece processing, and in particular to a cutting device and silicon rod processing equipment. Background Art

[0002] In the photovoltaic power generation field, crystalline silicon solar cells are typically manufactured on high-quality silicon wafers, which are cut from solar silicon material using a wire saw. Currently, wire sawing technology, represented by diamond wire, is widely used in the production of silicon material cutting due to its high production efficiency, low operating costs, and high precision. The silicon material can be, for example, single crystal silicon or polycrystalline silicon. The silicon material cutting operations include but are not limited to truncation, squaring, and slicing.

[0003] Taking the application of wire cutting technology in the squaring of single crystal silicon rods as an example, the silicon rod to be cut is first placed and positioned, and then the wire cutting device is used to enter from one end face of the silicon rod to be cut and feed along the length direction of the silicon rod until the cutting wire saw passes through the other end face of the silicon rod to be cut, thereby achieving four parallel axial sections in the circumference of the silicon rod. Among them, commonly used wire cutting devices include single-wire cutting devices and multi-wire cutting devices.

[0004] The cutting process is based on a high-speed steel wire that drives a cutting blade attached to the wire, or directly rubs the workpiece with diamond wire, achieving wire cutting. This process can lead to uneven wire tension due to the wire's overall length. Furthermore, the wire's reciprocating motion, causing it to be transferred (wound) between the take-up and pay-off reels, often accelerates and decelerates when switching directions. This can cause some waviness or uneven surface flatness in the cut surface. Summary of the Invention

[0005] In view of the shortcomings of the related art described above, the purpose of the present application is to provide a cutting device and silicon rod processing equipment to solve the problem of low cutting accuracy in the prior art.

[0006] To achieve the above-mentioned purpose and other related purposes, the present application discloses, in a first aspect, a cutting device for silicon rod processing, comprising: a cutting frame and at least one wire cutting unit, wherein the wire cutting unit comprises: a cutting wire; a first cutting wheel and a second cutting wheel, which are arranged on the cutting frame, wherein the wheel surfaces of the first cutting wheel and the second cutting wheel are parallel or coplanar, and the cutting wire is wound around the first cutting wheel and the second cutting wheel to form a cutting wire saw; a first transition wheel, which is arranged beside the first cutting wheel and is used to pull the cutting wire wound around the first cutting wheel so that the cutting wire wound around the first cutting wheel is coplanar with the first cutting wheel of the first cutting wheel. The plane where the wire groove is located; a second transition wheel, provided beside the second cutting wheel, for pulling the cutting wire wound around the second cutting wheel so that the cutting wire wound around the second cutting wheel is coplanar with the plane where the second cutting wire groove of the second cutting wheel is located; at least one third transition wheel, provided between the first transition wheel and the second transition wheel, for pulling the cutting wire between the first transition wheel and the second transition wheel so that a cutting accommodating space is formed in the wire-to-be-cut unit; wherein, the cutting wire is wound around the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel and the third transition wheel to form a closed-loop cutting wire connected end to end.

[0007] In a second aspect, the present application discloses a silicon rod processing device, characterized in that it includes: a machine base having a silicon rod processing platform; and a cutting device as described in any embodiment of the first aspect of the present application, used for cutting the silicon rod to be cut.

[0008] To sum up, the cutting device of the present application has the following beneficial effects in one embodiment: the cutting device has at least one wire cutting unit, and by determining the layout of the cutting wheel and the transition wheel in the wire cutting unit, the cutting wire is wound between the cutting wheel and the transition wheel in an end-to-end manner. The overall structure of the cutting device can be simplified, which is beneficial to reducing the cost of the device; at the same time, the annular cutting wire can avoid the acceleration and deceleration process of the cutting wire affecting the cutting accuracy during the operation to perform cutting, thereby improving the cutting accuracy, which is beneficial to simplifying subsequent processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The specific features of the invention involved in this application are shown in the appended claims. The features and advantages of the invention involved in this application can be better understood by referring to the exemplary embodiments described in detail below and the accompanying drawings. A brief description of the drawings is as follows:

[0010] Figure 1 Shown is a schematic structural diagram of a cutting device according to an embodiment of the present application.

[0011] Figure 2 Shown is a schematic structural diagram of a cutting device according to an embodiment of the present application.

[0012] Figure 3 Shown is a schematic structural diagram of a wire cutting unit of a cutting device of the present application in one embodiment.

[0013] Figure 4a and Figure 4b Shown are a front view and a three-dimensional schematic diagram of a wire cutting unit of a cutting device of the present application in one embodiment.

[0014] Figure 5 Shown is a partial structural schematic diagram of a cutting device in one embodiment of the present application.

[0015] Figure 6 Shown is a partial structural schematic diagram of a silicon rod processing device in one embodiment of the present application.

[0016] Figure 7a and Figure 7b Displayed as Figure 6 The top view and three-dimensional schematic diagram of any silicon rod fixture in the silicon rod processing equipment shown.

[0017] Figure 8 Shown is a schematic structural diagram of a cutting device according to an embodiment of the present application.

[0018] Figure 9 Shown is a simplified structural diagram of a silicon rod processing apparatus according to one embodiment of the present application.

[0019] Figure 10 Shown is a partial structural schematic diagram of a silicon rod processing device in one embodiment of the present application.

[0020] Figure 11 Shown is a schematic structural diagram of a silicon rod processing device in one embodiment of the present application.

[0021] Figure 12 Display as Figure 11 Schematic diagram of part of the structure of silicon rod processing equipment shown.

[0022] Figure 13 Shown is a schematic structural diagram of a silicon rod processing device in one embodiment of the present application. DETAILED DESCRIPTION

[0023] The following describes the implementation of the present application through specific embodiments. People familiar with this technology can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

[0024] In the following description, reference is made to the accompanying drawings, which describe several embodiments of the present application. It should be understood that other embodiments may also be used, and that mechanical, structural, electrical, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present application is limited only by the claims of the published patents. The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present application. Spatially related terms, such as "upper", "lower", "left", "right", "below", "below", "lower", "above", "upper", etc., may be used in the text to illustrate the relationship between one element or feature shown in the figure and another element or feature.

[0025] Although in some instances the terms first, second, etc. are used herein to describe various elements or parameters, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another. For example, the first cutting wheel can be referred to as the second cutting wheel, and similarly, the second cutting wheel can be referred to as the first cutting wheel without departing from the scope of the various described embodiments. The first cutting wheel and the second cutting wheel are both describing a cutting wheel, but unless the context clearly indicates otherwise, they are not the same cutting wheel. Similar situations also include the first transition wheel, the second transition wheel and the third transition wheel, or the first rack and the second rack, etc.

[0026] Furthermore, as used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It should be further understood that the terms "comprise", "include" indicate the presence of the described features, steps, operations, elements, components, items, kinds, and / or groups, but do not exclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Thus, "A, B, or C" or "A, B, and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B, and C". Exceptions to this definition occur only when the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.

[0027] In industrial production, crystalline silicon is usually processed into silicon wafers before being used in product manufacturing. The originally obtained silicon rods include single crystal silicon rods and polycrystalline silicon rods. Single crystal silicon rods are rod-shaped single crystal silicon grown from the melt by using the Czochralski method or the floating zone melting method. For example, single crystal silicon rods with lengths of 5000mm or 5360mm, or single crystal silicon rods with a length of approximately 800mm are common in silicon rod processing. Polycrystalline silicon rods are silicon rods in which silicon is precipitated on the surface of the silicon core wire using precipitation technology such as chemical vapor deposition technology.

[0028] As described in the background technology, the existing silicon wafer production process generally involves first pulling the brittle polysilicon material into a single crystal silicon rod, and then using a squarer to square it. At this time, the cutting mechanism feeds along the length of the silicon rod and cuts four parallel planes in the circumference of the silicon rod, making the cross-section of the silicon rod rectangular. After the square is cut, a multi-wire slicer is used to slice the squared silicon rod along the length to obtain the required silicon wafers.

[0029] In the common square cutting method, a steel wire or diamond wire is guided by a guide wheel (transition wheel), forming a wire saw or a wire mesh on the cutting roller (cutting wheel). The workpiece is fed by the rise and fall of the worktable or the rise and fall of the wire saw or wire mesh. Under the action of a pressure pump, an automatic cooling water spray device installed on the equipment sprays cold water onto the steel wire or diamond wire and the cutting part of the workpiece. The reciprocating movement of the steel wire or diamond wire generates cutting, thereby simultaneously cutting the workpiece into multiple pieces. Compared with traditional saw blades, grinding wheels, and internal circular cutting, wire cutting technology has the advantages of high efficiency, high production capacity, and high precision.

[0030] Typically, the cutting wheel and transition wheel in the cutting device are arranged in a complex manner, the corresponding winding method is complex, and the required cutting wire is too long, which may cause uneven tension in the cutting wire, and the cutting force and cutting speed are difficult to control consistently, resulting in reduced cutting accuracy; furthermore, in the existing cutting device, the cutting wire needs to run back and forth so that the cutting wire is reciprocated between the wire storage reel and the wire unwinding reel. The cutting wire thus needs to undergo a process of acceleration and deceleration, resulting in uneven cutting speed, which may cause a reduction in the accuracy of the cutting surface, such as reduced flatness, the formation of surface ripples, and other problems.

[0031] In view of this, the present application provides a cutting device that can be applied to silicon rod processing equipment. In the cutting device of the present application, the layout of the cutting wheel and transition wheel in the wire cutting unit and the winding method of the annular cutting wire enable the cutting wire to run unidirectionally and at high speed during the cutting process, which is beneficial to improving the cutting accuracy. At the same time, the wire storage drum can be eliminated in the cutting device, and the structure of the cutting device is simplified, which can reduce the production cost. At the same time, the equipment space occupied by the cutting device is reduced, which is beneficial to flexibly arrange the cutting device in the silicon rod processing equipment to cooperate with other components in the silicon rod processing equipment to complete the processing operation.

[0032] In the embodiments provided herein, to clarify the definition of directions and the manner in which different structures operate, a three-dimensional space is defined by a first direction, a second direction, and a third direction. The first direction, the second direction, and the third direction are all linear directions and are perpendicular to each other. For example, the length direction of the silicon rod processing equipment equipped with the cutting device, i.e., the direction of the axis of the silicon rod when the silicon rod is placed thereon, is defined as the first direction (i.e., the front-to-back direction), the width direction of the silicon rod processing equipment, i.e., the left-to-right direction, is defined as the second direction (i.e., the left-to-right direction), and the direction of the perpendicular is defined as the third direction (i.e., the vertical direction, vertical, up-down direction, or lifting direction).

[0033] In any embodiment provided in the present application, the end faces of the silicon rod refer to two faces opposite to each other in the length direction of the silicon rod, that is, along the first direction. For example, for the silicon rod to be cut, its two end faces are circular or quasi-circular, and the side faces of the silicon rod are arcuate surfaces; for the cut silicon rod, its two end faces are rectangular or quasi-rectangular, and the side faces of the silicon rod are the four sides of the silicon rod that are generally rectangular in the length direction of the silicon rod.

[0034] The cutting device includes: a cutting frame and at least one wire cutting unit; wherein, the at least one wire cutting unit is arranged on the cutting frame, and the wire cutting unit includes: multiple cutting wheels, transition wheels, and cutting wires, and the cutting wires are wound around the multiple cutting wheels and transition wheels to form at least one cutting wire saw.

[0035] In some embodiments, the multiple cutting wheels and transition wheels in the wire cutting unit are connected to the cutting frame, or the multiple cutting wheels and transition wheels are arranged on the cutting frame through a bracket, a connecting plate, or a mounting frame. Here, the carrier used to set the multiple cutting wheels and transition wheels can be in different forms, and this application does not impose any restrictions.

[0036] In the embodiment provided in the present application, the cutting device includes: a cutting frame and at least one wire cutting unit, wherein the wire cutting unit includes: a cutting wire; a first cutting wheel and a second cutting wheel, which are arranged on the cutting frame, wherein the wheel surfaces of the first cutting wheel and the second cutting wheel are parallel or coplanar, and the cutting wire is wound around the first cutting wheel and the second cutting wheel to form a cutting wire saw; a first transition wheel, which is arranged beside the first cutting wheel and is used to pull the cutting wire wound around the first cutting wheel so that the cutting wire wound around the first cutting wheel is coplanar with the plane where the first cutting wire groove of the first cutting wheel is located; a second transition wheel A wheel is provided beside the second cutting wheel, and is used to pull the cutting line wound around the second cutting wheel so that the cutting line wound around the second cutting wheel is coplanar with the plane where the second cutting line groove of the second cutting wheel is located; at least one third transition wheel is provided between the first transition wheel and the second transition wheel, and is used to pull the cutting line between the first transition wheel and the second transition wheel so that a cutting accommodating space is formed in the wire-to-be-cut unit; wherein, the cutting line is wound around the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel and the third transition wheel to form a closed-loop cutting line connected end to end.

[0037] See also Figure 1 , which is a simplified schematic diagram of the cutting device of the present application in one embodiment.

[0038] like Figure 1 In the illustrated embodiment, the wire cutting unit 22 is mounted on the cutting frame 21 via a wire cutting support 23. The wire cutting support 23 serves as a carrier for connecting the plurality of cutting wheels 221 and transition wheels 222 in the wire cutting unit 22 to the cutting frame 21. The wire cutting support 23 may be in the form of a beam, a plate frame, a bracket, or the like.

[0039] In one implementation, the wire cutting support 23 is arranged on the cutting frame 21 through a limiting structure such as a guide rail or a guide column, wherein the guide rail or guide column is arranged along the perpendicular direction of the wheel surface of the cutting wheel 221 in the wire cutting unit 22, so that the wire cutting unit 22 has the freedom to move along the perpendicular direction of the wheel surface of the cutting wheel; under this setting, the wire cutting support 23 can move along the orthogonal direction of the wheel surface of the cutting wheel 221 under the action of the driving source.

[0040] When the wire cutting unit 22 moves along the perpendicular direction of the cutting wheel 221, the cutting wire saw in the wire cutting unit 22 moves along the perpendicular direction of the cutting wheel, and the cutting wire saw moves away from or closer to the axis of the silicon rod, thereby adjusting the cutting amount or cutting position of the silicon rod.

[0041] The cutting wheels 221 are provided with at least one wire groove for winding a cutting wire 223. This groove defines the position of the cutting wire 223, thereby controlling cutting accuracy. Each wire saw is formed by winding a cutting wire 223 between two cutting wheels 221. The positions of the two cutting wheels 221 and the relative position between the wheels 221 can be used to determine the direction of the wire saw.

[0042] The transition wheel 222 is used to reverse or guide the cutting line 223 , or the transition wheel 222 can be used to adjust the tension of the cutting line 223 .

[0043] The direction of the cutting wheel surface corresponds to the direction of the cutting wire saw. It should be understood that the cutting wheel surface is parallel to the plane where any cutting wire groove in the cutting wheel is located. In order to control the cutting accuracy and the stability of the cutting process, the cutting wire saw should be located in the plane where the cutting wire groove for winding the cutting wire is located; at the same time, during the cutting process, the force direction of the silicon rod on the cutting wire must be parallel to the cutting wire groove, that is, the cutting wheel surface is parallel to the cutting direction, and the cutting direction is the axis direction of the silicon rod (that is, the first direction) in the squaring operation.

[0044] It should be understood that the cutting device can be used in silicon rod processing equipment and can be installed in the silicon rod processing equipment in different orientations. This application defines the direction in which the silicon rods are placed in the silicon rod processing equipment as the first direction. Therefore, when the cutting device is installed in the silicon rod processing equipment, the cutting wire is generally required to be perpendicular to the first direction. To facilitate control of the amount of silicon rod cut and the arrangement of the cutting wheel and transition wheel, as well as to facilitate description of the structure and component arrangement of the cutting device of this application, the following embodiments are described using the example of the cutting wire being arranged in the second direction, or the perpendicular direction.

[0045] In the cutting device of the present application, when the cutting wire saw is located in the second direction or the direction of the vertical line, correspondingly, the cutting wheel surface is parallel to the second direction and the axis direction of the silicon rod, that is, the cutting wheel surface is located in the horizontal plane direction, or the cutting wheel surface is parallel to the direction of the vertical line and the axis direction of the silicon rod and in a vertical plane parallel to the first direction.

[0046] In each embodiment provided in the present application, the cutting wheel surface is a reference plane, which is parallel to any cutting groove on the cutting wheel. The cutting wheel surface is mainly used to illustrate the direction of the cutting wheel layout (which is also equivalent to the planar direction of the cutting groove on the cutting wheel). The present application does not impose any restrictions on the specific position of the reference plane, such as which cutting groove on the cutting wheel it specifically corresponds to.

[0047] Please refer to Figure 2 and Figure 3 ,in, Figure 2Shown is a schematic structural diagram of a cutting device in one embodiment of the present application, Figure 3 Shown is a schematic structural diagram of a wire cutting unit in a cutting device of the present application in one embodiment.

[0048] like Figure 2 In the embodiment shown, the cutting device includes two wire cutting units 22 arranged opposite to each other, forming two parallel cutting wire saws. Figure 3 The illustrated embodiment may be a structure of a wire cutting unit 22 , which includes a first cutting wheel 221 a and a second cutting wheel 221 b , and a cutting wire 223 wound around the first cutting wheel 221 a and the second cutting wheel 221 b to form a cutting wire saw.

[0049] The first cutting wheel 221a includes at least one first cutting groove, and the plane where any first cutting groove is located is parallel to the first cutting wheel surface; that is, the cutting grooves on the first cutting wheel can be called first cutting grooves.

[0050] The second cutting wheel 221b includes at least one second cutting groove, and a plane where any second cutting groove is located is parallel to the second cutting wheel surface; that is, all cutting grooves on the second cutting wheel can be called second cutting grooves.

[0051] The wheel surface of the first cutting wheel 221a and the wheel surface of the second cutting wheel 221b are parallel or coplanar, so that when the cutting wire 223 is wound around the first cutting wheel 221a and the second cutting wheel 221b, the corresponding first cutting wire groove and second cutting wire groove for winding the cutting wire 223 are located in the same plane. In this way, the direction of the cutting wire saw is simultaneously located in the plane of the first cutting wire groove and the second cutting wire groove for winding the cutting wire 223. It should be understood that the cutting wire 223 is in an operating state during the cutting action, and therefore the cutting wire saw is defined by its spatial position. In the embodiment of the present application, the cutting wire 223 wound between the first cutting wheel 221a and the second cutting wheel 221b is the cutting wire saw.

[0052] It should be understood that when the cutting wire 223 is wound around any cutting wheel, the cutting wires 223 on both sides of the cutting wheel should be located within the plane of the cutting wire groove in the cutting wheel for winding the cutting wire 223 .

[0053] When the cutting wire 223 is wound around the first cutting wheel 221a, the cutting wire 223 at one end of the first cutting wire groove is wound around the second cutting wheel 221b to form a cutting wire saw, and the cutting wire 223 at the other end of the first cutting wire groove is wound around the first transition wheel 222a. The first transition wheel 222a is located adjacent to the first cutting wheel 221a. When the cutting wire 223 wound around the first cutting wheel 221a is pulled, the cutting wire 223 wound around the first cutting wheel 221a is positioned within the plane of the first cutting wire groove in the first cutting wheel 221a for winding the cutting wire 223.

[0054] When the cutting wire 223 is wound around the second cutting wheel 221b, the cutting wire 223 at one end of the second cutting wire groove is wound around the first cutting wheel 221a to form a cutting wire saw, and the cutting wire 223 at the other end of the second cutting wire groove is wound around the second transition wheel 222b. The second transition wheel 222b is located adjacent to the second cutting wheel 221b. When the cutting wire 223 is pulled around the second cutting wheel 221b, the cutting wire 223 wound around the second cutting wheel 221b is positioned within the plane of the second cutting wire groove in the second cutting wheel 221b for winding the cutting wire 223.

[0055] The first transition wheel 222a and the second transition wheel 222b each have at least one wire groove for pulling the cutting wire 223. The first transition wheel 222a and the second transition wheel 222b are respectively disposed adjacent to the first cutting wheel 221a and the second cutting wheel 221b. Here, the adjacent arrangement can be on the left, right, upper, or lower side, etc., and this application does not impose any limitation thereto.

[0056] It should be understood that when the cutting wire 223 is wound around any cutting wheel or transition wheel, the direction of the cutting wire 223 wound around the cutting wheel or transition wheel is the tangential direction of the corresponding cutting wire groove or wire groove.

[0057] The at least one third transition wheel 222c is arranged between the first transition wheel 222a and the second transition wheel 222b, and is used to pull the cutting wire 223 between the first transition wheel 222a and the second transition wheel 222b, so as to form a cutting accommodating space in the wire-to-be-cut unit. The cutting accommodating space is determined by the range of movement of the silicon rod to be cut relative to the cutting wire saw during the cutting process.

[0058] During the cutting operation, the cutting wire saw and the silicon rod need to be moved relative to each other in the cutting direction, i.e., the first direction, to achieve square cutting of the silicon rod by the cutting wire saw. For example, the cutting device can be provided on the silicon rod processing equipment. In some examples, cutting is achieved by feeding the wire cutting unit relative to the silicon rod. For example, the cutting frame can be movably provided on the processing platform of the silicon rod processing equipment and can be moved along the axis direction of the silicon rod to drive the cutting wire saw to feed and cut. In some further examples, the cutting frame can be provided or installed at a fixed position on the silicon rod processing equipment, and clamped by a silicon rod clamp and drive the silicon rod to feed relative to the cutting wire saw to achieve cutting. The silicon rod clamp described here can also be a silicon rod clamp, a silicon rod clamp, a silicon rod positioning member, etc., which is used to determine the position of the silicon rod and can load (or carry, clamp, limit) the silicon rod.

[0059] Taking an embodiment in which a silicon rod processing device has a silicon rod clamp to drive the silicon rod to move in a first direction as an example, during the cutting operation, the silicon rod clamp drives the clamped silicon rod to feed relative to the cutting wire saw along the axis direction of the silicon rod. The cutting accommodating space is the movement range of the silicon rod from the time the silicon rod to be cut starts to contact the cutting line 223 to the time it moves to the cutting line 223 and penetrates the silicon rod to form a skin.

[0060] The cutting accommodation space can accommodate the silicon rod to be cut and only the cutting wire saw in the cutting device intersects with the cutting accommodation space. It should be understood that during the cutting process, the silicon rod clamp and the silicon rod to be cut clamped therein collide with other components in the silicon rod processing equipment, including the cutting wire 223 (here, the cutting wire 223 excludes the cutting wire saw) during movement, which is a problem that needs to be avoided; at the same time, in order to achieve cutting, the cutting wire saw and the silicon rod are fed relative to each other during the movement of the silicon rod clamp holding the silicon rod. Therefore, when the silicon rod is in the cutting accommodation space, that is, when the silicon rod is fed relative to the cutting wire saw until the cutting is completed, it should be avoided that when the silicon rod to be cut and the cutting device are in a relative motion state, the components in the silicon rod processing equipment interfere with each other, such as the silicon rod to be cut contacting the cutting wire other than the cutting wire saw, the silicon rod clamp colliding with the cutting device, the silicon rod clamp contacting the cutting wire, etc.

[0061] The first transition wheel 222a, the second transition wheel 222b and at least one third transition wheel 222c can all be used to achieve traction in the direction of the cutting line 223. The third transition wheel 222c pulls the cutting line 223 between the first transition wheel 222a and the second transition wheel 222b to form the cutting accommodation space.

[0062] In certain embodiments, the first transition wheel 222a, the second transition wheel 222b, and at least one third transition wheel 222c are used to pull the cutting wire 223 away from the silicon rod to be cut. It should be understood that the cutting wire 223 between the first cutting wheel 221a and the first transition wheel 222a, and the cutting wire 223 between the second cutting wheel 221b and the second transition wheel 222b are both located within the plane of the first cutting wire groove (or second cutting wire groove) for winding the cutting wire 223. To form the cutting accommodation space, in one implementation, the length of the cutting wire 223 between the first cutting wheel 221a and the first transition wheel 222a, and between the second cutting wheel 221b and the second transition wheel 222b can be sufficiently long, for example, longer than the length of the silicon rod to be cut. However, with this configuration, the cutting frame occupies too much equipment space, resulting in an unreasonable layout.

[0063] In some embodiments, the first transition wheel 222a, the second transition wheel 222b, and the at least one third transition wheel 222c are used to pull the cutting wire 223 away from the cutting accommodation space.

[0064] The present application provides an embodiment in which the cutting accommodating space is formed by the first transition wheel 222a, the second transition wheel 222b, and the third transition wheel 222c. In one implementation, the wheel surface of at least one of the first transition wheel 222a, the second transition wheel 222b, and the third transition wheel 222c forms a certain angle with the wheel surface of the first cutting wheel 221a or the second cutting wheel 221b, so that the cutting line 223 deviates from the plane of the first cutting line groove (or second cutting line groove) for winding the cutting line 223. To optimize the overall structural layout of the cutting device and the silicon ingot processing equipment, the deviation direction can be selected to be away from the cutting accommodating space.

[0065] Taking the cutting device including two wire cutting units arranged opposite to each other as an example, Figure 3 In the embodiment shown, by setting the first transition wheel 222a, the second transition wheel 222b and the third transition wheel 222c to be inclined in a direction away from the cutting accommodation space, or by setting the transition wheels on the side of the cutting frame away from the cutting accommodation space, the cutting line 223 can be moved away from the cutting accommodation space. Under this layout, the equipment space required for the wire cutting unit can be effectively reduced, and it is beneficial to the overall equipment layout of the silicon rod processing equipment.

[0066] Here, for any of the wire cutting units, the direction away from the cutting accommodation space is the vector of the perpendicular direction of the cutting wheel surface, Figure 2 Taking the illustrated embodiment as an example, the directions of the two corresponding wire cutting units away from the cutting accommodation space are opposite, which are respectively the directions indicated by the arrows in the figure.

[0067] In certain embodiments, the wheel surface of the first transition wheel 222a may be at a certain angle to the wheel surface of the first cutting wheel 221a, and the wheel surface of the second transition wheel 222b may be at a certain angle to the wheel surface of the second cutting wheel 221b. The first transition wheel 222a is set in an orientation such that the cutting line 223 at the other end of the first cutting wheel 221a is located within the intersection of the plane of the first cutting line groove for winding the cutting line 223 and the plane of the wire groove for winding the cutting line 223 in the first transition wheel 222a; and the second transition wheel 222b is set in an orientation such that the cutting line 223 at the other end of the second cutting wheel 221b is located within the intersection of the plane of the second cutting line groove for winding the cutting line 223 and the plane of the wire groove for winding the cutting line 223 in the second transition wheel 222b.

[0068] By setting the first transition wheel 222a and the second transition wheel 222b to form a certain angle with the wheel surface of the first cutting wheel 221a or the second cutting wheel 221b, the direction of the angle is to make the first transition wheel 222a or the second transition wheel 222b tilt in the direction away from the cutting accommodating space, which is beneficial to reducing the number of the required third transition wheels 222c and is beneficial to reducing the length of the wire cutting support in the first direction.

[0069] Therefore, the present application does not limit the angle between the first transition wheel and the first cutting wheel, and the angle between the second transition wheel and the second cutting wheel. For example, the positional relationship and angle between the cutting wheel and the transition wheel can also be changed.

[0070] See also Figure 4a and Figure 4b , which respectively show a front view and a three-dimensional structural schematic diagram of the wire cutting unit of the cutting device of the present application in another embodiment.

[0071] like Figure 4a 、 Figure 4bIn the illustrated embodiment, the wire cutting unit comprises a first cutting wheel 221 a , a second cutting wheel 221 b , a first transition wheel 222 a , a second transition wheel 222 b , and two third transition wheels 222 c . In which, when the first transition wheel 222a is pulling the cutting line 223 wound around the first cutting wheel 221a, the cutting line 223 wound around the first cutting wheel 221a is located in the plane of the first cutting line groove in the first cutting wheel 221a for winding the cutting line 223. At the same time, the cutting line 223 between the first cutting wheel 221a and the first transition wheel 222a is also located in the plane of the wire groove in the first transition wheel for winding the cutting line 223. When the second transition wheel 222b is pulling the cutting line 223 wound around the second cutting wheel 221b, the cutting line 223 wound around the second cutting wheel 221b is located in the plane of the second cutting line groove in the second cutting wheel 221b for winding the cutting line 223. At the same time, the cutting line 223 between the second cutting wheel 221b and the second transition wheel 222b is also located in the plane of the wire groove in the second transition wheel for winding the cutting line 223.

[0072] In the cutting device, the cutting line is wound around the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel and the third transition wheel to form a closed-loop cutting line connected end to end.

[0073] Please continue reading Figure 2 The cutting wheel and transition wheel in the wire cutting unit are wound by an annular cutting wire. In this example, the cutting device can eliminate the need for a wire storage drum, and the annular cutting wire can achieve cutting by operating the driving device.

[0074] In existing cutting devices, the cutting wire is wound from a pay-off reel onto the cutting wheel and transition wheel in the wire cutting unit, and then from the wire cutting unit onto a take-up reel. During the cutting operation, the cutting wire is driven and operated through an alternating acceleration and deceleration process. In the cutting device of the present application, the circular cutting wire in the wire cutting unit can maintain high-speed operation and simultaneously run in the same direction during the cutting operation. As such, the wire cutting unit of the present application can achieve high-precision cutting operations, avoiding problems such as ripples on the cut surface caused by the reversal of the cutting wire or the operating speed in existing cutting methods. Furthermore, the circular cutting wire can effectively reduce the total length of the cutting wire required by the wire cutting unit, thereby reducing production costs.

[0075] In some embodiments, the wire cutting unit includes two third transition wheels, wherein the cutting wire is sequentially wound around the first cutting wheel, the second cutting wheel, the second transition wheel, a third transition wheel, another third transition wheel, the first transition wheel, and the first cutting wheel to form a circular cutting wire connected end to end.

[0076] Please refer to Figure 3 Taking the first cutting wheel 221a as the starting point of the winding of the circular cutting wire 223 as an example, the cutting wire 223 is wound from the first cutting wheel 221a to the second cutting wheel 221b, forming a cutting wire saw between the two cutting wheels; the cutting wire 223 is sequentially wound from the second cutting wheel 221b to the second transition wheel 222b, a third transition wheel 222c, another third transition wheel 222c, the first transition wheel 222a, and the first cutting wheel 221a, thereby forming an end-to-end circular winding. At the same time, the cutting wire 223 is pulled and guided by multiple transition wheels, and the cutting accommodation space is formed in the wire cutting unit.

[0077] Of course, it should be understood that the positions of the first transition wheel 222a, the second transition wheel 222b, and the third transition wheel 222c relative to the cutting wheel and the inclination direction of the wheel surface are not limited to the illustrated embodiment. It is sufficient that the cutting accommodating space is formed when the cutting wire 223 is wound between the multiple cutting wheels and transition wheels of the wire cutting unit. Furthermore, the wire cutting unit third transition wheel 222c can also be provided with three, four, etc., and this application does not impose any limitation.

[0078] For example, in Figure 4a 、 Figure 4b In the illustrated embodiment, assuming that the first cutting wheel 221a is the starting point of winding, the cutting line 223 is sequentially wound around the first cutting wheel 221a, the second cutting wheel 221b, the second transition wheel 222a, a third transition wheel 222c, another third transition wheel 222c, the first transition wheel 222a, and the first cutting wheel 221a to form a circular cutting line connected end to end.

[0079] In certain embodiments, the cutting device further includes a cutting wire driving device for driving the cutting wire to operate so as to cut the silicon rod.

[0080] The principle of wire cutting is that a high-speed steel wire drives a cutting blade attached to the wire or directly uses a diamond wire to rub the workpiece to achieve the purpose of wire cutting. Here, the cutting wire drive device is used to realize the operation of the cutting wire.

[0081] In some embodiments, the cutting line driving device is a motor having a power output shaft and the power output shaft is connected to the first cutting wheel or the second cutting wheel. Figure 1 In the illustrated embodiment, the wire cutting unit is provided with a motor 224 connected to the cutting wheel. Thus, the cutting wire can be driven by the wound cutting wheel to run along the winding direction. Of course, in other specific implementations, the cutting wire drive device can also be another drive source, such as a hydraulic motor, as long as it can drive the cutting wire, and this application is not limited thereto.

[0082] In some embodiments, the cutting device further includes a tension detection mechanism. During wire cutting, the wire tension affects the yield rate and processing accuracy of the cutting process. The tension detection mechanism detects and adjusts the wire tension to a predetermined threshold and maintains it at a constant value during cutting, or within a certain range of values ​​within the center of the constant value.

[0083] In one implementation, the transition wheel in the wire cutting unit not only guides and pulls the cutting wire, but also serves as a tension wheel for adjusting the tension of the cutting wire.

[0084] A tensioner is used to adjust the tension of the cutting wire, reducing the chance of wire breakage and consumables. The cutting wire plays a crucial role in the cutting process, but even the best wire has limits to its elongation and wear resistance. This means that the wire will gradually become thinner during continuous operation, eventually breaking. Therefore, current wire-cutting equipment typically incorporates a tension compensation mechanism to compensate for the wire's elongation during its reciprocating motion. A tensioner is one such mechanism.

[0085] In some embodiments of the application, the tension detection mechanism includes at least: a tension sensor, a servo motor and a screw rod; the tension sensor is arranged on the transition wheel, continuously senses the tension value of the cutting line on the transition wheel, and sends a driving signal when the tension value is less than a preset value; the servo motor is electrically connected to the tension sensor, and is used to start working after receiving the driving signal sent by the tension sensor; one end of the screw rod is connected to the tensioning wheel, and the other end is connected to the servo motor, and when the servo motor is working, it pulls the transition wheel for unidirectional displacement to adjust the tension of the cutting line.

[0086] In certain embodiments, the cutting device further includes at least one spacing adjustment mechanism, located on the at least one wire cutting unit, for driving the plurality of cutting wheels in the wire cutting unit to move relative to the cutting frame in a direction perpendicular to the cutting wheel surfaces. The spacing adjustment mechanism can be used to switch the cutting wire between different cutting grooves of the cutting wheel, or to adjust the position of the cutting wire saw to change the cutting position (or cutting amount) relative to the silicon ingot.

[0087] In some implementations, combine Figure 2 、 Figure 3 , a wire cutting unit 22 in the cutting device is used as an example for description, the wire cutting unit 22 includes a plurality of cutting wheels 221 and a transition wheel 222. The carrier for carrying the plurality of cutting wheels 221 and the transition wheel 222 is, for example, Figure 3The wire saw support 23 shown in FIG. 1 has a spacing adjustment mechanism (not shown) that can be used to drive the entire wire saw support 23 to move perpendicularly to the surface of the cutting wheel 221. The transition wheel 222 and the cutting wheel 221 move along with the wire saw support 23 perpendicularly to the surface of the cutting wheel 221. In this state, the multiple cutting wheels 221 and the transition wheel 222 are relatively stationary, that is, the positional relationship between the transition wheel 222 and the cutting wheel 221 remains unchanged. In this state, the spacing adjustment mechanism is used to adjust the cutting position of the at least one wire saw in the at least one wire cutting unit 22 relative to the silicon ingot.

[0088] In certain embodiments, each cutting wheel has at least two cutting grooves, each of which is parallel to the other and offset perpendicular to the cutting wheel surface. When the spacing mechanism is used to drive the multiple cutting wheels in the wire cutting unit to move relative to the wire cutting support, the position of the grooves on the cutting wheel around which the cutting wire is wound can be changed. In one implementation, the multiple cutting wheels in the wire cutting unit can be connected to a bracket, for example, wherein the bracket is movably mounted on the wire cutting support and driven by the spacing mechanism to move perpendicular to the cutting wheel surface.

[0089] When the at least one distance adjusting mechanism is used to realize the change of the cutting wire grooves of the multiple cutting wheels in the at least one cutting unit, in actual scenarios, the cutting wire grooves corresponding to the cutting wires before and after the groove change can be predetermined. For example, the position of the cutting wire before the groove change is the cutting wire groove a1, and the cutting wire is wound around the cutting wire groove a2 after the groove change. The displacement of the multiple cutting wheels in the cutting unit driven by the at least one distance adjusting mechanism is determined based on the cutting offset between the cutting wire groove a1 and the cutting wire groove a2, that is, the displacement is set to the cutting offset between the cutting wire groove a1 and the cutting wire groove a2, which can be used to realize the replacement of the cutting wire from the cutting wire groove a1 to the cutting wire groove a2; it should be noted that the direction of the multiple cutting wheels in the cutting unit driven by the at least one distance adjusting mechanism to move in the direction perpendicular to the cutting wheel surface is the direction in which the cutting wire groove a2 points to the cutting wire groove a1. After the groove change, the cutting position of the cutting wire saw in space remains unchanged, so the step of further calibrating the position of the cutting wheel or other components is omitted, and the silicon rod can be cut according to the preset cutting amount, so that the groove change process is simplified.

[0090] To further illustrate how the at least one distance adjustment mechanism enables the movement of multiple cutting wheels in a linear cutting unit relative to the cutting frame in a direction perpendicular to the cutting wheel surfaces, the present application provides the following embodiments. The specific form of the at least one distance adjustment mechanism may vary accordingly when the number of linear cutting units in the cutting device varies.

[0091] In one embodiment, the cutting device includes a single-wire cutting unit; the distance adjustment mechanism includes: a screw rod, which is arranged along the orthogonal direction of the cutting wheel surface and is threadedly connected to the single-wire cutting unit; and a driving source for driving the screw rod to rotate.

[0092] Here, the single-wire cutting unit is a wire cutting unit. The single-wire cutting unit in the wire cutting device includes multiple cutting wheels. The cutting wire is wound around the multiple cutting wheels to form at least one cutting wire saw. The screw of the distance adjustment mechanism has a distal end and a proximal end. In a specific implementation, for example, the proximal end of the screw can be connected to a driving source and rotated under the drive of the driving source, and the distal end of the screw is connected to the single-wire cutting unit with a thread. By the connection method at both ends of the screw, the screw can rotate based on the drive source and convert the screw rotation into axial displacement with the help of the threaded connection. The axial displacement direction is the setting direction of the screw, that is, the orthogonal direction of the cutting wheel surface; the displacement of the single-wire cutting unit in the orthogonal direction of the cutting wheel surface can be achieved by driving the screw to rotate by the driving source in the distance adjustment mechanism. The screw is driven to rotate in different directions, which can achieve the forward or backward movement of the cutting wheel of the single-wire cutting unit in the orthogonal direction of the cutting wheel surface.

[0093] In another embodiment, the wire cutting device includes a single-wire cutting unit; the distance adjustment mechanism includes: a telescopic member, arranged along a direction perpendicular to the cutting wheel surface and associated with the single-wire cutting unit; and a drive source for driving the telescopic member to telescope along the direction perpendicular to the cutting wheel surface. Here, the telescopic member can be configured as a rod structure, and the rod extension direction is perpendicular to the cutting wheel surface. The telescopic member can be driven by the drive source to telescope along its extension direction. One end of the telescopic member can be connected to the drive source, and the retractable free end is associated with the single-wire cutting unit, so that the driving source can drive the cutting wheel of the single-wire cutting unit to move in the direction perpendicular to the cutting wheel surface. The telescopic member can be, for example, an electric telescopic rod, or a connecting rod connected to a cylinder cone rod, and the cylinder can serve as the drive source, but this application is not limited thereto. The telescopic rod can be connected to the single-wire cutting unit in a linear or indirect manner, for example, directly connected to the wire cutting support or cutting wheel bracket of the single-wire cutting unit, or indirectly connected to the single-wire cutting unit via a support or bearing. It should be understood that the extension or contraction of the telescopic member may correspond to the advancement or retreat of the single-wire cutting unit along the orthogonal direction of the cutting wheel surface.

[0094] Here, in the embodiments provided in the present application, the association can be achieved, for example, by one or more of snapping, screwing, bonding, and welding. For example, in the above embodiments, the telescopic rod can be associated with the wire cutting unit by one or more of snapping, screwing, bonding, and welding; of course, the implementation method of the association is not limited to this, but is intended to achieve transmission in the second direction.

[0095] In another embodiment, the wire cutting device includes a single-wire cutting unit; the distance adjustment mechanism includes: a rack disposed on the single-wire cutting unit in a direction perpendicular to the cutting wheel surface; a transmission gear meshing with the rack; and a drive source for driving the transmission gear to rotate. The transmission gear rotates under the drive source, and the rack meshing with the transmission gear correspondingly moves in the direction of the rack. In this example, the rack and transmission gear cooperate to convert the rotational motion driven by the drive source into wire transport in the direction of the rack. The rack is disposed on the single-wire cutting unit in a direction perpendicular to the cutting wheel surface, thereby driving the cutting wheel of the single-wire cutting unit to move in the direction perpendicular to the cutting wheel surface. At the same time, the drive source controls the switching of the rotation direction of the transmission gear, thereby causing the multiple cutting wheels of the single-wire cutting unit to advance or retract in the direction perpendicular to the cutting wheel surface.

[0096] In one embodiment, the cutting device includes a first wire cutting unit and a second wire cutting unit arranged in parallel and opposite to each other, and at least one of the first wire cutting unit and the second wire cutting unit is driven by the at least one distance adjustment mechanism to move along the orthogonal direction of the cutting wheel surface, and is used to adjust the wire cutting saw spacing between at least one cutting wire saw in the first wire cutting unit and at least one cutting wire saw in the second wire cutting unit, or to change the cutting wire grooves of multiple cutting wheels in the first wire cutting unit and / or the cutting wire grooves of multiple cutting wheels in the second wire cutting unit.

[0097] The at least one distance adjustment mechanism can be configured to be connected to the first wire cutting unit or the second wire cutting unit, or to be associated with the first wire cutting unit and the second wire cutting unit at the same time, so as to drive the multiple cutting wheels in the connected or associated first wire cutting unit and / or the second wire cutting unit to move along the orthogonal direction of the cutting wheel surface.

[0098] In one embodiment, the distance adjustment mechanism includes: a screw, which is arranged along the orthogonal direction of the cutting wheel surface and is threadedly connected to the first wire cutting unit or the second wire cutting unit; and a driving source for driving the screw to rotate. The way in which the screw and the driving source drive the multiple cutting wheels in the first wire cutting unit or the second wire cutting unit to move in the orthogonal direction of the cutting wheel surface is similar to the aforementioned embodiment. The first cutting unit or the second wire cutting unit driven by the distance adjustment mechanism can be regarded as a single wire cutting unit, which will not be described in detail here. It should be understood that by providing the distance adjustment mechanism on any wire cutting unit, the distance between the parallel cutting wires formed between the first wire cutting unit and the second wire cutting unit can be increased or decreased, and the wire cutting device can cut the silicon rods into different specifications.

[0099] In another embodiment, the distance adjustment mechanism includes: a telescopic member disposed orthogonally to the cutting wheel surface and associated with the first or second linear cutting unit; and a drive source for driving the telescopic member to telescope orthogonally to the cutting wheel surface. Here, the first or second linear cutting unit equipped with the distance adjustment mechanism can be considered a single linear cutting unit. The specific implementation method can be referred to in the previous embodiment and will not be further described here.

[0100] In another embodiment, the distance adjustment mechanism includes: a rack positioned perpendicular to the cutting wheel surface and associated with the first or second linear cutting unit; a transmission gear meshing with the rack; and a drive source for rotating the transmission gear. Through the meshing transmission gear and rack, the drive source can control the rack to move linearly along the rack direction, and the first or second linear cutting unit associated with the rack can drive the multiple cutting wheels to move perpendicular to the cutting wheel surface via the rack.

[0101] In one embodiment, the distance adjustment mechanism includes: a bidirectional screw, which is arranged along the orthogonal direction of the cutting wheel surface and is threadedly connected to the first wire cutting unit and the second wire cutting unit; and a driving source, which is used to drive the screw to rotate so that the first wire cutting unit and the second wire cutting unit move toward or away from each other along the orthogonal direction of the cutting wheel surface.

[0102] In one embodiment, the bidirectional screw is a double-threaded screw, with threads at both ends of the bidirectional screw being provided in opposite directions. The drive source can be provided at either end of the bidirectional screw to drive the bidirectional screw to rotate along the screw shaft. Due to the threads at both ends of the bidirectional screw having opposite directions, when the bidirectional screw is rotated by the drive source, the movement of the two ends of the bidirectional screw is converted into axial linear motion in opposite directions, where the axial direction is orthogonal to the surface of the cutting wheel on which the bidirectional screw is provided. Under the drive of the drive source, the multiple cutting wheels corresponding to the first and second linear cutting units can move toward or away from each other.

[0103] In another embodiment, the distance adjustment mechanism includes: a first rack, arranged along the orthogonal direction of the cutting wheel surface and associated with the first wire cutting unit; a second rack, arranged along the orthogonal direction of the cutting wheel surface and associated with the second wire cutting unit; a transmission gear, meshing with the first rack and the second rack; a driving source, used to drive the transmission gear to rotate so that the first wire cutting unit and the second wire cutting unit move toward or away from each other along the orthogonal direction of the cutting wheel surface.

[0104] In an embodiment, the first rack is linked to the first linear cutting unit, and the second rack is linked to the second linear cutting unit. The transmission gear is connected to a power output shaft of a driving source, such as a servo motor (not shown), and is meshed with the first rack and the second rack, and is used to drive the first linear cutting unit and the second linear cutting unit to move toward each other to perform a closing action when rotating in the forward direction, and to drive the first linear cutting unit and the second linear cutting unit to move away from each other when rotating in the reverse direction. The first rack and the second rack can be meshed on both sides of the transmission gear, so that when the transmission gear rotates, the linear velocity directions of the first rack and the second rack are opposite. The transmission gear is driven by the driving motor to rotate, so that when the transmission gear rotates forward, the first rack and the second rack move toward each other, thus driving the first linear cutting unit and the second linear cutting unit to move toward each other. When the transmission gear is driven to rotate in the reverse direction, the first rack and the second rack move away from each other, thereby driving the first linear cutting unit and the second linear cutting unit to move away from each other. Here, the transmission gear can be connected to the power output shaft of the driving source, or it can be indirectly connected to the power output shaft, such as a shaft connected to a rotating part connected to the power output shaft.

[0105] In some embodiments, the distance adjustment mechanism is a servo motor provided on the at least one wire cutting unit. In actual scenarios, a servo motor is provided on at least one wire cutting unit or each wire cutting unit of the wire cutting device, and the servo motor controls the displacement of the corresponding wire cutting unit in the orthogonal direction of the cutting wheel surface. The wire cutting unit can predetermine the cutting offset of the slot change or the adjustment amount of the cutting line to change the cutting position, and drive the multiple cutting wheels in the wire cutting unit to move along the orthogonal direction of the cutting wheel surface with a preset displacement through the precise positioning function of the servo motor. For example, the wire cutting device is provided with a single wire cutting unit, and the single wire cutting unit is provided with a servo motor to drive the single wire cutting unit to move along the orthogonal direction of the cutting wheel surface; for another example, the wire cutting device is provided with a first wire cutting unit and a second wire cutting unit, and the first wire cutting unit and / or the second wire cutting unit are driven by their corresponding servo motors to move relatively independently along the orthogonal direction of the cutting wheel surface. In some examples, the servo motor can also be replaced with a travel motor and a travel screw. It should be understood that the distance adjustment mechanism is a driving device that drives multiple cutting wheels in the wire cutting unit to move relative to the cutting frame. Its specific form is not limited in this application.

[0106] In certain embodiments, the cutting device of the present application further includes an edge skin supporting mechanism for abutting against the outside of the silicon rod and supporting the edge skin formed by cutting.

[0107] In the coordinate system defined in the present application, the first direction is a horizontal direction, that is, the silicon rod to be processed is placed horizontally in the silicon rod processing equipment. It should be noted that the cutting device of the present application does not exclude the situation of being used for cutting vertical silicon rods. For example, by changing the setting direction of the cutting device and the silicon rod loading structure such as the silicon rod clamp so that the cutting wire saw can be fed relative to the silicon rod in the vertical direction, the cutting device can of course also be used for cutting vertical silicon rods. For example, the cutting device can be provided on a guide rail or guide column in the vertical direction, or the wire cutting unit can be provided on a cutting frame with a displacement mechanism along the vertical direction. Specifically, it can be determined according to the processing needs of the silicon rod processing equipment for the silicon rod. In order to facilitate the explanation of the structure of the cutting device, the following embodiment takes the cutting of horizontal silicon rods in the silicon rod processing equipment as an example.

[0108] In the silicon rod processing equipment of the present application, the silicon rod to be cut is in a horizontal position, and the edge skin formed by the cutting is also horizontal. In this example, the edge skin needs to be supported during cutting to assist in its removal. At the same time, the edge skin formed during cutting of the horizontal silicon rod is no longer subject to the clamping force of the silicon rod clamp. Before the cutting wire saw completely penetrates the silicon rod, the connection between the edge skin and the silicon rod may be broken (also known as edge collapse) due to the torque generated by the weight of the edge skin. In this way, the edge skin support mechanism can also prevent edge collapse by supporting the edge skin.

[0109] In certain embodiments, the edge skin support mechanism includes at least one support assembly and at least one mounting portion for connecting the at least one support assembly to the cutting device. The support assembly includes a support portion that is controlled to abut against and support the edge skin, and a drive unit connected to the support portion to control the support portion to move away from or abut against the edge skin.

[0110] In some examples, the cutting device in the silicon rod processing equipment can switch the cutting position during the silicon rod processing process. For example, a first processing position and a second processing position are provided on the silicon rod processing platform. The cutting device is provided on the machine base via a conversion mechanism and can switch positions between the first processing position and the second processing position under the drive of the conversion mechanism. Under this setting, the support assembly is provided on the cutting device via a mounting portion, so that the support assembly remains relatively stationary relative to the cutting assembly when the cutting device switches the processing position. In some examples, the mounting portion is detachably connected to the cutting frame, and the mounting portion can be provided at different positions on the cutting device based on the need to support the edge skin. The position of the support assembly on the cutting device can be determined based on the specific structure of the wire cutting unit in the cutting device, for example Figure 1 In the illustrated embodiment, the supporting assembly is disposed on the wire cutting support via the mounting portion.

[0111] The supporting assembly includes a supporting portion, which is used to contact and abut against the silicon rod to achieve a supporting effect on the edge skin. It should be noted that in each embodiment of the present application, the supporting effect is to apply force to the edge skin to maintain a stable state. Taking the cutting wire saw as an example, when it is arranged in the horizontal direction, the edge skin formed by cutting is located on the upper or lower side of the silicon rod. At this time, the supporting portion can provide support for the edge skin on the lower side of the silicon rod to prevent the edge skin from breaking, thereby maintaining the edge skin in a stable state; or when the cutting wire saw is arranged in the vertical direction, the edge skin formed by cutting is located on the side of the silicon rod (left or / and right side), the supporting portion can be set to a structure adapted to the outer arc surface of the silicon rod to provide support for the edge skin, or by abutting against the edge skin to subject the edge skin to an upward friction force to maintain a stable state.

[0112] The driving unit is used to drive the supporting portion to move away from or abut against the edge skin. The direction of moving away from or abutting against the edge skin can be multiple directions. For example, abutting against the edge skin means that the supporting portion moves from a state away from the edge skin to a state of contacting the edge skin under the drive of the driving unit. The specific movement direction of the supporting portion is not limited in this application.

[0113] In one implementation, the driving unit includes: a cylinder or a hydraulic pump; a telescopic part connected to the supporting part, which is driven by the cylinder or the hydraulic pump to perform telescopic movement to control the supporting part to move away from or abut against the edge skin.

[0114] The telescopic part can be driven by a cylinder or a hydraulic pump to move telescopically, so that the telescopic part is connected to the supporting part. The telescopic direction of the telescopic part is, for example, away from or close to the axis of the silicon rod, thereby driving the connected supporting part away from or against the edge skin.

[0115] In another embodiment, the drive unit includes a drive motor and a screw assembly driven by the drive motor. The screw assembly may be threadedly connected to the support portion at one end, and the drive motor drives the screw to rotate to move the support portion along the screw direction. By controlling the screw rotation direction of the drive motor, the support portion can be controlled to move closer to or farther from the edge skin.

[0116] The supporting portion can be set to different structures to achieve the supporting effect. For example, the supporting portion can be a supporting plate and have an arc surface for contacting the edge skin, or the supporting portion can be a supporting plate with a folded edge to prevent the edge skin from rolling. For example, the cross-section of the supporting plate is a trapezoidal groove structure (wherein the groove is the lower bottom of the trapezoid); it should be understood that there are many ways to implement the supporting portion that can be used to achieve edge skin support, and this application does not impose any restrictions.

[0117] In order to securely support the cut edge to prevent it from breaking, or to simplify the unloading and transportation of the edge, this application also provides the following implementation methods:

[0118] In one example, the supporting portion includes at least two supporting blocks spaced apart along the first direction, each having a bearing surface for contacting and supporting the edge skin. The bearing surfaces of the supporting blocks can be configured to have a curved surface to accommodate the supported edge skin, or can be configured to comprise contact surfaces of different levels to prevent the edge skin from rolling.

[0119] It should be understood that in some processing scenarios, the edge skin can be supported by a single support block. Here, the present application also provides an embodiment of supporting the edge skin by at least two support blocks spaced apart along a first direction. By setting the spacing or span between the at least two support blocks along the first direction, the edge skin formed by cutting silicon rods of different length specifications can be supported. At the same time, the support of the edge skin by the spaced support blocks can cause the edge skin to be subjected to the force of the support portion in different length directions (i.e., the first direction), thereby helping to prevent the edge skin from breaking before the cutting wire saw penetrates the silicon rod. After the cutting wire saw penetrates the silicon rod to form an edge skin independent of the silicon rod, the at least two spaced support blocks can be used to support the edge skin to prevent the edge skin from tilting and falling.

[0120] At the same time, in an embodiment where the supporting portion includes two supporting blocks, the supporting assembly may further include two driving units, and any one of the driving units corresponds to a supporting block. For example, each supporting block is connected to a driving unit. During the cutting process, the two driving units of the supporting assembly can respectively drive the corresponding supporting blocks to make the supporting portion as a whole close to the edge skin to achieve support.

[0121] See also Figure 5 , which is a partial structural diagram of a cutting device according to an embodiment of the present application. As shown in the figure, the supporting portion includes two supporting rods 5111 spaced apart along the second direction, and the supporting rods 5111 are arranged along the first direction.

[0122] Here, the supporting effect on the edge skin can be achieved by the at least two supporting rods 5111. It should be understood that the support of the edge skin can be achieved by making the center of gravity of the edge skin formed by cutting be located between the at least two supporting rods 5111; at the same time, any of the supporting rods 5111 is in linear contact with the supported edge skin. Under this setting, the friction between the supporting part and the edge skin can be reduced.

[0123] The connecting parts 5112 are respectively arranged at both ends of the supporting rod 5111 in the length direction (i.e., the first direction). At the same time, any of the connecting parts 5112 is connected to a driving unit and the supporting rod, and the at least two supporting rods 5111 as a whole are driven by the driving units on both sides to move closer to or away from the silicon rod edge skin. Connecting parts and driving units are provided on both sides of the supporting rod, and both ends of the supporting rod 5111 can be driven to move by the driving units. In the process of being driven to move and supporting the edge skin, the connecting parts and driving units on both sides can also serve as support to bear the weight of the edge skin, which is beneficial to improving the structural stability of the supporting part; when the center of gravity of the supported edge skin is located between the two driving units (or two connecting parts) in the first direction, it is easy to achieve stable support for the edge skin.

[0124] At the same time, the driving units at both ends of the supporting rod 5111 can also serve as supports for connecting the supporting rod 5111 and the connecting portion 5112 to the cutting device, such as Figure 5 In the embodiment shown, the driving unit is connected to the cutting device via the mounting portion, and the free end capable of telescopic movement is connected to the connecting portion 5112 to drive the entire supporting portion to move along the telescopic direction driven by the driving unit. Figure 5 In the example shown, the driving unit is a cylinder 512 having a telescopic portion, and the telescopic portion of the cylinder 512 is connected to the connecting portion 5112 .

[0125] exist Figure 5 In the example shown, the supporting portion is controlled to move along the direction of the vertical line to move away from or closer to the edge skin; it should be understood that when the direction of the cutting wire saw in the cutting device is different, or when the structure of the supporting portion is different, the corresponding driving unit in the edge skin supporting mechanism can be set in different directions to adapt to the need of supporting the edge skin. For example, when the cutting wire saw in the cutting device is along the direction of the vertical line, the driving unit can be set to the direction of its telescopic movement as the second direction, so that the supporting portion moves along the second direction to move closer to or away from the edge skin. This application does not limit the direction of the controlled movement of the supporting portion, as long as the supporting portion can achieve the supporting effect on the edge skin.

[0126] The number of the supporting components can be set according to the support needs of the edge skin. For example, when the cutting device includes a cutting wire saw, a side skin is formed correspondingly in one cutting operation, and a supporting component can be set on the cutting device to support the edge skin; for another example, when the cutting device includes two parallel cutting wire saws, two side skins are formed correspondingly in one cutting operation, and two supporting components can be set on the cutting device to support the side skins on both sides of the silicon rod respectively.

[0127] In certain embodiments, the edge skin unloading mechanism further includes an edge skin dislocation mechanism, which is provided on the cutting device and is used to push the edge skin along a first direction to separate the edge skin from the edge skin supporting mechanism or the cut silicon rod.

[0128] In certain embodiments, the edge skin dislocation mechanism is positioned on the machine base or cutting device at a preset spacing relative to the cutting wire saw along a first direction, wherein the first direction is parallel to the axis of the silicon ingot. It should be understood that when the cutting wire saw penetrates the silicon ingot, an edge skin independent of the silicon ingot is formed. At this time, one end face of the edge skin supported by the support assembly is aligned with the cutting wire saw in the first direction. Therefore, when the edge skin dislocation mechanism is positioned in the silicon ingot processing equipment, a preset spacing in the first direction between the edge skin dislocation mechanism and the cutting wire saw is predetermined, i.e., the spacing between the edge skin dislocation mechanism and the desired edge skin end face is determined. In actual processing scenarios, when the edge skin dislocation mechanism moves a certain distance in the first direction, the actual distance pushed by the edge skin dislocation mechanism against the edge skin end face can be determined based on this distance and the preset spacing between the edge skin dislocation mechanism and the cutting wire saw in the first direction. Thus, the displacement of the edge skin dislocation mechanism in the first direction can be controlled based on the desired distance of pushing the edge skin.

[0129] It should be understood that the axial direction of the silicon rod to be cut is along the first direction, and the edge skin formed during cutting is also along the first direction when supported. The edge skin dislocation mechanism can push the edge skin along the first direction to make the edge skin move relative to the edge skin supporting mechanism, so that the edge skin can be separated from the edge skin supporting mechanism and the subsequent transfer process of the edge skin can be carried out.

[0130] In some embodiments, the side skin dislocation mechanism includes: a power source; a telescopic rod arranged along a first direction and configured to telescopically move under the drive of the power source to push the side skin.

[0131] In one implementation, the power source of the edge skin misalignment mechanism is a cylinder or a hydraulic pump, wherein the telescopic rod of the cylinder or the hydraulic pump is arranged along the first direction. Figure 5 In the illustrated embodiment, the cutting device is provided with two parallel wire cutting units, and includes two edge skin dislocation mechanisms, one located on the upper wire cutting unit and the other on the lower wire cutting unit of the cutting frame. The edge skin dislocation mechanism is a cylinder 541 having a telescopic rod, which is arranged along a first direction and aligned with the edge skin end face. After the cutting wire saw penetrates the silicon rod to form an independent edge skin, the edge skin dislocation mechanism moves along the first direction to abut against the edge skin end face and push the edge skin to move, thereby allowing the edge skin to detach from the edge skin support mechanism or detach from the cut silicon rod. Here, the telescopic range of the telescopic rod of the edge skin dislocation mechanism can be determined based on the length specification of the silicon rod, or based on the span of the support portion of the support assembly in the first direction, so as to control the stroke of the edge skin being pushed in the first direction to ensure that the edge skin can be detached.

[0132] Of course, it should be understood that the specific structure and position of the edge skin dislocation mechanism are not limited to the following: Figure 5 The illustrated embodiment is not limited thereto. For example, in some examples, the edge skin dislocation mechanism may also be provided on the machine base of the silicon rod processing equipment.

[0133] An example is given of a processing scenario in which the cutting device of the present application is applied to silicon rod processing equipment. In the silicon rod processing equipment, the silicon rod clamp is used to clamp the silicon rod and drive the silicon rod to move along a first direction. The annular cutting wire of any wire cutting unit in the cutting device is in a driven state, so that the cutting wire saw and the silicon rod are fed relative to each other along the first direction to cut and form an axial section on the surface of the silicon rod; in some scenarios, the edge skin formed by cutting can be supported by the edge skin supporting mechanism in the cutting device to prevent the edge skin from collapsing, and the edge skin dislocation mechanism can also push the cutting wire saw to pass through the silicon rod along the first direction to form the edge skin, so as to assist in timely unloading of the edge skin.

[0134] Here, the cutting device provided in the first aspect of the present application determines the layout of the cutting wheel and the transition wheel, so that the cutting line is wound between the cutting wheel and the transition wheel in an end-to-end manner. The overall structure of the cutting device can be simplified, which is beneficial to reducing the cost of the device; at the same time, the annular cutting line can avoid the acceleration and deceleration process of the cutting line affecting the cutting accuracy during the process of being run to perform cutting, thereby improving the cutting accuracy, which is beneficial to simplifying subsequent processes.

[0135] In a second aspect, the present application further provides a silicon rod processing device, comprising a machine base and a cutting device as described in any embodiment provided in the first aspect of the present application.

[0136] The machine base is the main component of the silicon rod processing equipment and has a silicon rod processing platform. In one example, the machine base is large in size and weight to provide a larger mounting surface and a stronger overall stability. It should be understood that the machine base can serve as the base for different structures or components that perform processing operations in the silicon rod processing equipment, and the specific structure of the machine base can be changed based on different functional requirements or structural requirements. In some examples, the machine base includes fixed structures or limiting structures such as bases, rods, columns, frames, etc. for supporting different components in the silicon rod processing equipment, all of which are the machine bases described in this application.

[0137] Meanwhile, in some examples, the base may be an integrated base, and in other examples, the base may include a plurality of independent bases.

[0138] The silicon ingot processing platform may be equipped with a processing device for processing silicon ingots, such as squaring or grinding. Different areas may be provided on the platform, such as a processing area corresponding to the squaring of the ingot by the cutting device and a discharge area corresponding to the unloading of the cut edges. Silicon ingots are transported to the corresponding waiting area of ​​the silicon ingot processing device to facilitate processing by the silicon ingot processing device. The shape of the silicon ingot processing platform may be determined by the machine base, or may be determined by both the machine base and the processing requirements of the silicon ingot processing device.

[0139] The cutting device includes a wire cutting unit having a cutting wire saw for squaring a horizontal silicon rod to be cut. It should be understood that the horizontal silicon rod to be cut remains in a horizontal state during the squaring process, and the silicon rod to be cut is, for example, in a supported or clamped state. For example, in one embodiment, the silicon rod to be cut is clamped by a silicon rod clamp and is driven by the silicon rod clamp to move in a first direction, thereby allowing the cutting wire saw in the wire cutting unit to feed and cut the silicon rod to achieve squaring of the silicon rod.

[0140] In certain embodiments, the silicon ingot processing apparatus further includes at least one silicon ingot clamp for clamping the silicon ingot and moving the silicon ingot along its axis to feed the silicon ingot relative to the cutting wire saw of the cutting device. The silicon ingot clamp, also referred to herein as a silicon ingot clamp, silicon ingot clamping member, or silicon ingot positioning member, is used to position the silicon ingot and load (or support, clamp, or position) the silicon ingot.

[0141] Regarding the silicon rod clamp, it is used to clamp the silicon rod at both end surfaces of the silicon rod, and in some embodiments, the silicon rod clamp can be arranged on a guide structure in the first direction of the silicon rod processing platform to drive the clamped silicon rod to move in the first direction.

[0142] Please refer to Figure 6 , Figure 7a 、 Figure 7b ,in, Figure 6 This is a schematic structural diagram of a silicon rod processing device according to one embodiment of the present application; Figure 7a 、 Figure 7b Display separately Figure 6 A top view and a three-dimensional schematic diagram of any silicon rod fixture and its corresponding guide structure in the silicon rod processing equipment.

[0143] The silicon ingot processing equipment is equipped with a cutting device 20, a first silicon ingot fixture 11, and a second silicon ingot fixture 12. The first silicon ingot fixture 11 is located on a first guide structure 131 in a first processing area of ​​the silicon ingot processing platform, and the second silicon ingot fixture 12 is located on a second guide structure 132 in a second processing area of ​​the silicon ingot processing platform. The guide structure can be a transfer guide rail, a guide column, a crossbeam, a guide groove, or other structure that can be used to provide a degree of freedom of displacement in the first direction.

[0144] In certain embodiments, either the first silicon rod clamp or the second silicon rod clamp includes: a clamp arm mounting seat, which is provided on the corresponding transfer guide rail or guide column; a power source, which is used to drive the clamp arm mounting seat to move along the corresponding transfer guide rail or guide column; a pair of clamping parts, which are arranged opposite to each other along a first direction, and are used to clamp the two end faces of the silicon rod; a pair of clamp arms, wherein each clamp arm has a proximal end connected to the clamp arm mounting seat and a distal end connected to the clamping part; a clamp arm driving mechanism, which is used to drive at least one of the pair of clamp arms to move along the first direction to adjust the spacing between the pair of clamp arms along the first direction.

[0145] For ease of understanding, the following description is given using the silicon rod clamp 11 and the guide structure 131 located in the first processing area.

[0146] The silicon rod clamp 11 includes a pair of clamping arms 113 for clamping the two end faces of the silicon rod, wherein the distal end of the clamping arm 113 is connected to a clamping portion 114 for contacting the end face of the silicon rod, and the proximal end of the clamping arm 113 is connected to a clamping arm mounting seat 111. The clamping arm mounting seat 111 is movably arranged on the guide structure and moves along the guide structure under the drive of a power source 112, thereby driving the clamping arm 113 and the clamping portion 114 at the distal end of the clamping arm 113 to move along the guide structure; the power source 112 is, for example, a servo motor, which is not limited in this application. The silicon rod clamp 11 also includes a clamping arm driving mechanism 115 for driving at least one of the pair of clamping arms 113 to move along a first direction to adjust the spacing of the pair of clamping arms 113 along the first direction, so that the clamping portions 114 respectively connected to the distal ends of the pair of clamping arms 113 can move closer to or farther away from each other under the action of the clamping arm driving mechanism 115 to perform the clamping or release action on the silicon rod. It should be understood that the axis of the silicon rod is along the first direction. In order to achieve clamping of the silicon rod at both end faces of the silicon rod, the distal ends of the pair of clamping arms 113, which correspond to the clamping portions 114, are arranged relative to each other along the first direction. The pair of clamping arms 113 are arranged in a horizontal direction. When the power source 112 drives the clamping arm mounting seat 111 to move the clamping arms 113 and the silicon rod clamped therein along the guide structure, the moving clamping arms 113 can avoid the cutting wire saw. In other feasible implementations, the pair of clamping arms 113 can also be arranged to have a certain angle with the horizontal plane, and only when it is ensured that the movement range of the clamping arms 113 is separated from the cutting wire saw during the process of moving the silicon rod clamp 11 to achieve cutting.

[0147] In some embodiments, the clamping arm driving mechanism includes a screw rod arranged along the first direction and associated with any one of the pair of clamping arms; and a driving source for driving the associated clamping arm to move along the first direction.

[0148] In other embodiments, the clamping arm driving mechanism includes: a bidirectional screw rod, arranged along a first direction and threadedly connected to the pair of clamping arms at both ends; a driving source, used to drive the screw rod to rotate so that the pair of clamping arms move toward or away from each other along the first direction.

[0149] In certain embodiments, either the first silicon rod clamp or the second silicon rod clamp further includes a clamping portion rotating mechanism for driving the clamping portion to rotate.

[0150] In one implementation of this embodiment, the clamping portion 114 corresponding to the pair of clamping arms 113 is provided with a rotatable structure such as a rotatable base, and the clamping portion rotation mechanism 116 can be configured to drive the clamping portion 114 corresponding to at least one clamping arm 113 to rotate. The clamping portion rotation mechanism 116 drives the clamping portion 114 to rotate with the first direction as the axis, thereby causing the clamped silicon rod to rotate along the axis of the silicon rod. During cutting and grinding operations, the positional relationship of the clamped silicon rod relative to the cutting wire saw can be adjusted by driving the silicon rod to rotate along its axis through the clamping portion rotation mechanism 116, thereby determining the cutting surface of the silicon rod by the cutting device, and adjusting the positional relationship of the clamped silicon rod relative to the grinding device to determine the grinding surface relative to the silicon rod, that is, the silicon rod clamp can cooperate with the cutting device and the grinding device to achieve the selection and control of different cutting surfaces and grinding surfaces of the silicon rod.

[0151] In certain embodiments, the clamping portion has a multi-point contact clamping head. It should be understood that the contact method between the multi-point contact clamping head and the end face of the silicon rod is not limited to point contact. The clamping portion, for example, has a plurality of protrusions to contact the end face of the silicon rod, wherein each protrusion can be in surface contact with the end face of the silicon rod. In one implementation, the protrusion of the clamping portion can also be connected to the base of the clamping portion by a spring along a first direction, thereby forming a multi-point floating contact, so that the silicon rod clamp can adapt to the flatness of the end face of the silicon rod to clamp the silicon rod when clamping the end face of the silicon rod. In some examples, the clamping end of the clamping portion for contacting the end face of the silicon rod can also be connected to the base of the clamping portion by a universal mechanism such as a universal ball, thereby the clamping portion can be adapted to clamping silicon rod end faces with different inclinations.

[0152] It should be noted that the direction in which the pair of clamping arms are arranged is related to the cutting device. In the process in which the silicon rod clamp drives the clamped silicon rod to move along the first direction to feed the silicon rod relative to the cutting wire saw, the silicon rod clamp and the cutting device should be avoided from colliding or interfering with each other; for example, when the cutting wire saw in the cutting device is set to be along the direction of the vertical line, the clamping arms of the silicon rod clamp can be set to be along the direction of the vertical line; when the cutting wire saw is set to be along the horizontal direction, the clamping arms of the silicon rod clamp can be set to be in the horizontal plane.

[0153] In other embodiments, the cutting device may be movably mounted on the silicon ingot processing platform, for example, on a first-direction translation mechanism, thereby enabling the cutting wire saw in the wire cutting unit to move along the first direction to feed and cut the clamped silicon ingot. The translation mechanism may include, for example, a guide rail and a drive, wherein the guide rail may be used to position a cutting frame of the cutting device.

[0154] See also Figure 8, which is a schematic structural diagram of a cutting device of the present application in one embodiment. In the embodiment shown in the figure, the cutting device includes a wire cutting unit and a cutting frame. The cutting frame 21 has a guide groove 24 adapted to the guide rail, so that the cutting frame 21 can be movably arranged on the guide rail arranged on the silicon rod processing platform. The wire cutting unit includes a plurality of cutting wheels, a transition wheel, and an annular cutting wire wound around the plurality of cutting wheels and the transition wheel, as well as a wire cutting support 23 movably arranged on the cutting frame. The cutting device can move along the guide rail to adjust the cutting position relative to the silicon rod. Of course, Figure 8 In the embodiment shown, the cutting position can also be adjusted by driving the wire cutting support 23 to move relative to the cutting frame 21 in the second direction, that is, the direction in which the guide groove 24 is arranged is the second direction. It should be understood that in other embodiments, the structure of the cutting device can be changed. For example, the guide groove or other limiting structure at the bottom of the cutting frame is set to be along the first direction, and the cutting device can be driven to move to achieve feeding and cutting of the silicon rod.

[0155] Cutting is performed by moving the cutting device relative to the silicon ingot held by the silicon ingot holder in a first direction. In certain embodiments, the cutting device further includes a skin edge support mechanism to assist in the cutting process and form a complete skin edge. The cutting device may also include a skin edge dislocation mechanism to release the cut skin edge from its supported state for subsequent transport to a discharge area.

[0156] In certain embodiments, the silicon ingot processing equipment further includes a silicon ingot edge conveying mechanism for receiving the edge edges formed by cutting and transferring the edge edges to a discharge area, which is a edge edge discharge area.

[0157] In one embodiment, the position of the edge skin conveying structure in the second direction can be set to be aligned with the cutting device in the silicon rod processing equipment, so that the edge skin formed by cutting the silicon rod can be conveyed by the corresponding edge skin conveying structure, thereby reducing the transportation of the edge skin.

[0158] The direction and position of the edge skin conveying mechanism can be determined by the positional relationship between the cutting area and the edge skin unloading area.

[0159] In one embodiment, the edge skin unloading area and the cutting area are arranged adjacent to each other along a first direction. Here, the edge skin conveying structure can be arranged along the first direction and docked with the cutting device so that after the silicon rod is cut to form edge skin, the edge skin is pushed along the first direction to separate from the cut silicon rod or the supporting component and then transferred to the edge skin conveying structure, thereby simplifying the transfer path of the edge skin. The number of the edge skin conveying mechanisms can also be determined according to the number, structure or working mode of the cutting device in the silicon rod processing equipment. For example, when the silicon rod processing equipment is provided with different processing locations, wherein cutting devices are provided at multiple processing locations, the edge skin conveying mechanisms can be correspondingly provided at multiple processing locations to correspond to the cutting devices; for example, when the cutting device can simultaneously perform square cutting on multiple silicon rods, the edge skin conveying mechanisms can be provided in multiple forms so that each edge skin conveying mechanism corresponds to one silicon rod.

[0160] In certain embodiments, the edge skin conveying mechanism is a chain conveying mechanism, a double-speed chain mechanism, or a conveyor belt mechanism.

[0161] In one embodiment, the edge skin conveying mechanism includes: a conveying portion for carrying the edge skin; and a conveying drive source for driving the conveying portion to move so as to convey the edge skin.

[0162] See also Figure 9 , which shows a simplified schematic diagram of the structure of one embodiment of the silicon ingot processing equipment of the present application. As shown in the figure, the conveyor portion 521 can be arranged along a first direction and, driven by the conveyor drive source 522, transports the carried edge skins along the first direction. The conveyor portion 521 can be arranged to move toward the edge skin unloading area to transport the carried edge skins to the edge skin unloading area.

[0163] The conveying driving source 522 is, for example, a motor, which is used to drive the conveying portion 521 to move and control the conveying speed of the conveying portion 521 .

[0164] In some examples, to prevent the side skins from being damaged by collisions during transport, the transport portion 521 is provided with a cushion for contact with the side skin, or the transport portion 521 is made of a cushioning material. The cushion or cushioning material may be, for example, elastic rubber, silicone, or other materials with elastic deformation, damping, or cushioning properties. This reduces the risk of side skin damage during transport and facilitates the reuse of side skins.

[0165] In certain embodiments, the silicon rod processing equipment further includes a grinding device for grinding the silicon rods after being squared and cut by the cutting device.

[0166] In certain implementations, the grinding tool includes a grinding wheel and a rotating shaft. In certain embodiments, the grinding wheel is circular and has a through hole in the center. The grinding wheel is connected to the rotating shaft for controlled rotation along the rotating shaft, thereby contacting the side of the cut silicon rod while rotating to achieve grinding. It should be understood that in a feasible embodiment, the grinding device may also include a grinding tool, but in this configuration, the grinding time is increased.

[0167] The grinding wheel has a certain particle size and roughness, and is, for example, formed by bonding abrasive grains with a binder to form an abrasive surface that contacts and grinds the sides of the cut silicon rod. The grinding wheel has a certain abrasive grain size and density. Depending on the grinding requirements of the silicon rod, the abrasive material can be aluminum oxide, silicon carbide, diamond, cubic boron nitride, or other materials with a hardness greater than that of silicon.

[0168] In some embodiments, the grinding tool can also be configured as a coarse grinding tool and a fine grinding tool nested together, for example, the grinding tool can be configured to include a coarse grinding wheel and a fine grinding wheel. At least one of the coarse grinding wheel and the fine grinding wheel is provided with a telescopic drive mechanism. For example, when the fine grinding wheel is nested within the coarse grinding wheel, the coarse grinding wheel can be provided with a telescopic drive mechanism. During the coarse grinding operation, the telescopic drive mechanism is used to drive the coarse grinding wheel to extend and protrude from the fine grinding wheel, so that the protruding coarse grinding wheel can be used to perform coarse grinding on the silicon rod. During the fine grinding operation, the telescopic drive mechanism is used to drive the coarse grinding wheel to retract and be recessed into the fine grinding wheel, so that the fine grinding wheel can be used to perform fine grinding on the silicon rod. Alternatively, when the fine grinding wheel is nested in the rough grinding wheel, the fine grinding wheel may be provided with a telescopic drive mechanism. When performing rough grinding, the telescopic drive mechanism is utilized to drive the fine grinding wheel to retract and be recessed into the rough grinding wheel, so that the rough grinding wheel can be used to perform rough grinding on the silicon rod. When performing fine grinding, the telescopic drive mechanism is utilized to drive the fine grinding wheel to extend and protrude from the rough grinding wheel, so that the protruding fine grinding wheel can be used to perform fine grinding on the silicon rod.

[0169] In some examples, the at least one grinding tool includes two grinding wheels disposed opposite to each other and corresponding grinding wheel rotation axes, which can be used to grind two opposite side surfaces of the silicon rod simultaneously to improve the efficiency of the grinding operation.

[0170] The grinding surface of the grinding tool can be located in a vertical plane or a horizontal plane. For example, when the grinding surface of the grinding tool is located in a vertical plane (i.e., a plane parallel to the third direction), the grinding tool can grind the side surface of the cut silicon ingot located in the vertical plane; when the grinding surface of the grinding tool is located in a horizontal plane, the grinding tool can grind the upper and lower side surfaces of the cut silicon ingot.

[0171] See also Figure 10 , which is a schematic structural diagram showing a part of the structure of the silicon rod processing equipment of the present application in one embodiment. Figure 10 In the illustrated embodiment, a pair of grinding tools 301 of the grinding device 30 are arranged relative to each other along the vertical line direction, and the two grinding surfaces corresponding to the pair of grinding tools 301 are parallel and relatively arranged, wherein the grinding surface of any grinding tool 301 is along a horizontal plane direction.

[0172] The grinding device may also be provided with a grinding tool advance and retreat mechanism 302 for driving at least one of the at least one pair of grinding tools 301 to move along the perpendicular direction to adjust the amount of grinding applied to the cut silicon ingot. In certain embodiments, the grinding tool advance and retreat mechanism 302 includes: an advance and retreat guide rail disposed along the perpendicular direction on the first conversion mechanism for positioning the grinding tool 301; and a drive source for driving at least one of the grinding tools 301 to move along the advance and retreat guide rail.

[0173] In one embodiment, the tool advance and retreat mechanism 302 includes a sliding guide rail, a drive motor, and a ball screw (not shown in the figure). The sliding guide rail is arranged on the first conversion mechanism along the direction of the vertical line, and the grinding tool 301 is provided with a guide groove along the direction of the vertical line that cooperates with the sliding guide rail. The ball screw is arranged along the sliding guide rail and is connected to the drive motor shaft. In other feasible embodiments, the drive source can also be configured as a cylinder, a hydraulic pump, etc., and its extension direction is set to the direction of the vertical line; or the drive source can be configured as a screw assembly, which includes a screw and a rotation drive source, wherein the screw is connected to the grinding tool 301 so that the grinding tool 301 is driven by the rotation drive source to move along the sliding guide rail.

[0174] In some embodiments, the grinding tool advance and retreat mechanism includes a bidirectional screw and a drive source, and threads with opposite rotation directions are provided on both sides of the bidirectional screw. The bidirectional screw is arranged along the direction of the vertical line and is connected to a grinding tool on both sides. Under this setting, the drive source drives the bidirectional screw to rotate, and the grinding tools at both ends of the bidirectional screw approach or move away from each other along the direction of the vertical line, thereby adjusting the grinding position and grinding amount of the grinding tool relative to the silicon rod.

[0175] In an embodiment where the grinding surface of the grinding tool is disposed in a vertical plane, the advance and retreat guide rail is disposed in a direction perpendicular to the grinding surface, i.e., in a horizontal direction. In an embodiment where the grinding surface of the grinding tool is disposed in a horizontal plane, the advance and retreat guide rail is disposed in a direction perpendicular to the grinding surface. The advance and retreat guide rail can be used to position the at least one grinding tool, and the advance and retreat drive unit drives the grinding tool to move along the advance and retreat guide rail.

[0176] In the embodiment where the silicon rod processing equipment includes a cutting device and a grinding device, the cutting device, the grinding device, and the silicon rod clamping or carrying device (e.g., a silicon rod clamp) work together to complete the squaring and grinding operations of the silicon rod to be processed. To illustrate the overall layout and process conversion method of the silicon rod processing equipment, this application also provides the following examples:

[0177] In some embodiments, the silicon rod processing platform is provided with a first processing position and a second processing position, and the silicon rod processing equipment further includes: a transposition mechanism, connected to the cutting device and the grinding device, including a transposition shaft, driving the transposition shaft to rotate a preset angle so that the cutting device and the grinding device can switch positions between the first processing position and the second processing position.

[0178] Continuing with reference to Figure 6, the silicon ingot processing apparatus includes a machine base 10 and a cutting device 20 and a grinding device 30 disposed on a silicon ingot processing platform of the machine base 10. The cutting device 20 and the grinding device 30 are connected to a position indexing mechanism 40 and are disposed on both sides of the position indexing mechanism so that the cutting device 20 and the grinding device 30 correspond to different processing locations, respectively.

[0179] The shifting mechanism 40 includes a shifting shaft arranged in the direction of the gravity perpendicular, so that when the cutting device 20 and the grinding device 30 are driven to rotate to switch the processing position, the center of gravity height of the cutting device 20 and the grinding device 30 remains unchanged, thereby improving the stability of the switching process, which is beneficial to the safety of the equipment and helps to reduce the torque or force borne by the shifting mechanism 40 when driving the cutting device 20 and the grinding device 30 to switch the processing position. In the embodiment in which the shifting shaft is arranged in the gravity perpendicular, the grinding device 40 can be configured to include: at least one pair of grinding tools, wherein the grinding surfaces of the pair of grinding tools are parallel and arranged relative to each other; and a grinding tool advance and retreat mechanism for driving at least one of the pair of grinding tools to move along the gravity perpendicular direction, so as to control the feed amount of the grinding tool relative to the silicon rod, that is, the grinding amount.

[0180] Regarding the transposition mechanism 40, in one embodiment, the transposition mechanism 40 further includes a rotation drive mechanism for driving the cutting device 20 and the grinding device 30 to rotate, and the rotation drive mechanism is, for example, a drive motor axially connected to the transposition shaft; in another embodiment, the rotation drive mechanism includes: a driving gear axially connected to a power drive source; a driven gear engaged with the driving gear and connected to the transposition shaft, the driving gear rotates under the drive source, thereby driving the engaged driven gear to rotate, and the driven gear can be used to carry or connect the grinding device 30 and the cutting device 20 to drive the grinding device 30 and the cutting device 20 to switch between the first processing position and the second processing position.

[0181] In one processing scenario, the processing flow performed by the silicon rod processing equipment is as follows:

[0182] The first silicon rod is loaded onto the first silicon rod clamp. The first silicon rod clamp can drive the first silicon rod to move along the first direction to feed relative to the cutting wire saw to achieve cutting. The first silicon rod clamp can drive the first silicon rod to move back in the first direction so that the silicon rod can be fed relative to the cutting wire saw multiple times until four cross-sections are formed on the surface of the silicon rod, that is, a cut silicon rod with a rectangular or quasi-rectangular cross-section is obtained.

[0183] In which, during the cutting process, the first silicon rod moves in the cutting accommodation space of the wire cutting unit, and the annular cutting wire wound in the wire cutting unit is driven to cut the silicon rod; in some cases, the edge skin supporting mechanism in the cutting device can also be used to support the edge skin formed by cutting to assist in obtaining a complete edge skin, and the cutting device can also use the edge skin dislocation mechanism to push the supported edge skin out so that the edge skin is transferred to the edge skin conveying mechanism of the silicon rod processing equipment, so as to transport the edge skin formed by cutting to the edge skin unloading area.

[0184] After the first silicon rod is cut, the switching mechanism drives the cutting device and the grinding device to switch positions between the first processing position and the second processing position. The grinding device is then moved to the first processing position. In this state, the first silicon rod clamp can drive the clamped first silicon rod to move in the first direction. The grinding device drives the grinding tool to move in the direction of the vertical line to contact the side of the first silicon rod after cutting to achieve grinding. The first silicon rod clamp drives the silicon rod to rotate along the axis of the silicon rod to switch the grinding surface of the grinding device relative to the silicon rod, thereby obtaining the ground silicon rod.

[0185] During the grinding operation in the first processing position, the second silicon rod clamp can load the second silicon rod to be processed. Similarly, the second silicon rod clamp can drive the second silicon rod to move back in the first direction so that the silicon rod can be fed relative to the cutting wire saw multiple times until four cross-sections are formed on the surface of the silicon rod, that is, a cut silicon rod with a rectangular or quasi-rectangular cross-section is obtained; here, the cutting device performs a cutting process on the second silicon rod located in the second processing position similar to that of cutting the first silicon rod.

[0186] The ground silicon rod in the first processing area is unloaded, and the first silicon rod clamp can be loaded with another third silicon rod to be cut. The cutting device and the grinding device are driven by the switching mechanism to switch positions. The cutting device can cut the third silicon rod clamped by the first silicon rod clamp; the grinding device can grind the cut second silicon rod clamped by the second silicon rod clamp.

[0187] By repeating the above process, the silicon rod processing equipment can perform different processing operations at the same time, and the position conversion mechanism can realize the effective connection of the flow of different processes. Among them, the cutting device uses a high-speed circular cutting wire to square the silicon rod, which is beneficial to obtaining high-precision cut silicon rods and simplifies the subsequent grinding process.

[0188] The silicon rod processing equipment of the present application can also be transformed in other ways. In some embodiments, a first processing position and a second processing position are provided on the silicon rod processing platform, and the silicon rod processing equipment also includes: a first conversion mechanism, which is provided at a first installation position on the silicon rod processing platform and is connected to the cutting device, and includes a first rotating shaft, which drives the first rotating shaft to rotate a preset angle so that the cutting device can switch positions between the first processing position and the second processing position; a second conversion mechanism, which is provided at a second installation position on the silicon rod processing platform and is connected to the grinding device, and includes a second rotating shaft, which drives the second rotating shaft to rotate a preset angle so that the grinding device can switch positions between the first processing position and the second processing position.

[0189] See also Figure 11 , which is a schematic structural diagram of the silicon rod processing equipment of the present application in one embodiment.

[0190] In this embodiment, the silicon rod processing equipment includes: a machine base 10, a silicon rod clamp, a cutting device 41, and a grinding device 33. The silicon rod processing platform is provided with a first processing area and a second processing area, and the silicon rod processing equipment also includes: a first conversion mechanism 43 and a second conversion mechanism 45.

[0191] The first installation position and the second installation position are not at the same position, and correspondingly, the first conversion mechanism 43 and the second conversion mechanism 45 are arranged at different positions of the silicon rod processing platform. The first installation position and the second installation position should satisfy that the cutting device 23 and the grinding device 33 do not interfere with each other during the conversion of the processing position. In some embodiments, the first installation position and the second installation position may be arranged between the first processing position and the second processing position. In one implementation, the first installation position and the second installation position may also be arranged in the center area between the first processing position and the second processing position. For example, when the first processing position and the second processing position are parallel and symmetrically arranged, the first installation position and the second installation position may be arranged on the symmetry line of the first processing position and the second processing position.

[0192] The first conversion mechanism and the second conversion mechanism can independently drive the corresponding cutting device and grinding device. Here, the directions of the first rotating shaft and the second rotating shaft can be set to the same direction or different directions.

[0193] In some embodiments, the first rotating axis is arranged in a first direction, and the second rotating axis is arranged in a direction of a perpendicular line; the first processing position and the second processing position are arranged on opposite sides of a second direction, wherein the first direction, the second direction, and the direction of the perpendicular line are perpendicular to each other.

[0194] See also Figure 12 , displayed as Figure 11 Schematic diagram of part of the structure of silicon rod processing equipment shown.

[0195] In one embodiment, the first conversion mechanism 43 includes: a bracket 430 for mounting the cutting device; a rotation drive source 432 for driving the cutting device to rotate relative to the bracket 430 along a first rotation axis 431 to convert the position between the first processing position and the second processing position. Figure 11 In the illustrated embodiment, the cutting frame 411 of the cutting device is connected to the first rotating shaft 431. At least one linear cutting unit mounted on the cutting frame 411 rotates along the first rotating shaft along with the cutting frame 411. The bracket 430 serves as the base of the first conversion mechanism 43. The cutting device is movably mounted on the bracket 430 about the first rotating shaft 431 and can rotate relative to the bracket 430 along the first rotating shaft 431 under the drive of a rotational drive source 432. The rotational drive source 432 is, for example, a motor having a power output shaft, which is axially connected to the first rotating shaft 431.

[0196] Regarding the second conversion mechanism, in one embodiment, the second conversion mechanism also includes a rotation drive mechanism for driving the grinding device to rotate and transpose, and the rotation drive mechanism is, for example, a drive motor axially connected to the transposition shaft; in another embodiment, the rotation drive mechanism includes: a driving gear axially connected to a power drive source; a driven gear engaged with the driving gear and connected to the transposition shaft, the driving gear rotates under the drive source, thereby driving the engaged driven gear to rotate, and the driven gear can be used to carry or connect the grinding device to drive the grinding device to switch between the first processing position and the second processing position.

[0197] In each embodiment in which the cutting device is connected to the first conversion mechanism and the grinding device is connected to the second conversion mechanism, a first silicon rod clamp and a second silicon rod clamp may be respectively provided at the first processing position and the second processing position, for clamping the silicon rod at the processing position and driving the silicon rod to move along the first direction, so that the silicon rod to be cut is fed relative to the cutting wire saw to achieve cutting, and the silicon rod to be ground is moved relative to the grinding device along the first direction so that the grinding surface of the grinding tool covers the entire side of the silicon rod.

[0198] In one processing scenario, the processing flow performed by the silicon rod processing equipment is as follows:

[0199] Taking the initial moment when the cutting device is located in the first processing position as an example, the first silicon rod is loaded into the first silicon rod clamp, and the first silicon rod clamp can drive the first silicon rod to move along the first direction to feed relative to the cutting wire saw to achieve cutting. The first silicon rod clamp can drive the first silicon rod to move back in the first direction so that the silicon rod can be fed relative to the cutting wire saw multiple times until four cross-sections are formed on the surface of the silicon rod, that is, a cut silicon rod with a rectangular or quasi-rectangular cross-section is obtained.

[0200] In which, during the cutting process, the first silicon rod moves in the cutting accommodation space of the wire cutting unit, and the annular cutting wire wound in the wire cutting unit is driven to cut the silicon rod; in some cases, the edge skin supporting mechanism in the cutting device can also be used to support the edge skin formed by cutting to assist in obtaining a complete edge skin, and the cutting device can also use the edge skin dislocation mechanism to push the supported edge skin out so that the edge skin is transferred to the edge skin conveying mechanism of the silicon rod processing equipment, so as to transport the edge skin formed by cutting to the edge skin unloading area.

[0201] After processing and obtaining the cut first silicon rod, the first conversion mechanism drives the cutting device to rotate along the first rotating axis by a preset angle to switch from the first processing position to the second processing position, and the cutting device is rotated to the second processing position. At the same time, the second conversion mechanism drives the grinding device to rotate along the second rotating axis by a preset angle to switch to the first processing position. In this state, the first silicon rod clamp can drive the clamped cut first silicon rod to move in the first direction, and the grinding device drives the grinding tool to move along the direction of the vertical line to contact the side of the cut silicon rod to achieve grinding. The first silicon rod clamp drives the silicon rod to rotate along the axis of the silicon rod to switch the grinding surface of the grinding device relative to the silicon rod, thereby obtaining the ground silicon rod.

[0202] During the grinding operation in the first processing area, the second silicon rod clamp can load the second silicon rod to be cut; similarly, the second silicon rod clamp can drive the second silicon rod to move back in the first direction so that the silicon rod can be fed relative to the cutting wire saw multiple times until four cross-sections are formed on the surface of the silicon rod, that is, a cut silicon rod with a rectangular or quasi-rectangular cross-section is obtained.

[0203] The ground silicon rods in the first processing position are unloaded, and the first silicon rod clamp can be loaded with the third silicon rod to be cut. The first conversion mechanism drives the cutting device to change its processing position, and the second conversion mechanism drives the grinding device to change its processing position. The cutting device can then cut the third silicon rod clamped by the first silicon rod clamp.

[0204] By repeating the above process, the silicon rod processing equipment can perform different processing operations at the same time, and the position conversion mechanism can realize the effective connection of the flow of different processes. Among them, the cutting device uses a high-speed circular cutting wire to square the silicon rod, which is beneficial to obtaining high-precision cut silicon rods and simplifies the subsequent grinding process.

[0205] See also Figure 13 , which is a schematic structural diagram of the silicon rod processing equipment of the present application in another embodiment.

[0206] In certain implementations, the cutting device and the grinding device are switched in position by a linear motion mechanism.

[0207] As shown in the figure, the silicon rod processing equipment includes a machine base, a cutting device 25, a grinding device 35, and a silicon rod loading and unloading device (not shown in the figure).

[0208] The silicon rod processing platform is provided with a first processing position and a second processing position, and the silicon rod processing equipment further includes: a cutting conversion mechanism 61, having a cutting conversion guide rail 611, driving the cutting device 25 to move along the cutting conversion guide rail 611 to switch positions between the first processing position and the second processing position; a grinding conversion mechanism 63, having a grinding conversion guide rail 631, driving the grinding tool in the grinding device 35 to move along the grinding conversion guide rail 631 to switch positions between the first processing position and the second processing position.

[0209] In one embodiment of the present application, the cutting conversion mechanism 61 is used to drive the cutting frame 251 of the cutting device 25 and at least one linear cutting unit thereon to convert between the first processing position and the second processing position.

[0210] The first and second processing locations are both arranged along the first direction, on opposite sides of the silicon ingot processing platform in the second direction. The cutting conversion guide rail 611 of the cutting conversion mechanism 61 passes through the first and second processing locations in the second direction, and the grinding conversion guide rail 631 of the grinding conversion mechanism 63 passes through the first and second processing locations in the second direction. Both the cutting conversion guide rail 611 and the grinding conversion guide rail 631 are arranged along the second direction, on opposite sides of the silicon ingot processing platform in the first direction.

[0211] In this example, the cutting conversion mechanism 61 can be used to drive the cutting frame 251 and at least one linear cutting unit thereon to move along the second direction to switch between the first processing position and the second processing position. For example, the cutting conversion mechanism 61 can be used to drive the cutting frame 251 and at least one linear cutting unit thereon to move along the second direction to switch from the first processing position to the second processing position, or the cutting conversion mechanism 61 can be used to drive the cutting frame 251 and at least one linear cutting unit thereon to move along the second direction to switch from the second processing position to the first processing position.

[0212] In the silicon rod processing equipment described in this embodiment, for the silicon rod in any processing position, such as the first processing position, the cutting conversion mechanism 61 is used to drive the cutting frame 251 and at least one linear cutting unit thereon to move along the second direction until the cutting unit is located in the first processing position. After the cutting device 25 squares the silicon rod at the first processing position, the cut silicon rod is moved along the first direction until it is aligned with the grinding device 35 in the first direction. The grinding conversion mechanism 63 drives the grinding tool to move along the second direction to the first processing position, and the cut silicon rod can be ground.

[0213] Regarding the grinding conversion mechanism, in one embodiment, the grinding device is provided with at least one pair of grinding tools and at least one grinding tool conversion mechanism. The grinding tool conversion mechanism includes: a grinding tool conversion guide rail and a grinding tool conversion drive unit.

[0214] like Figure 13 As shown, the tool transfer guide 631 is arranged along the second direction for placing the grinding tool. In some embodiments, the tool transfer guide 631 is arranged along the second direction on the silicon rod processing platform, and the at least one pair of grinding tools is mounted on the tool transfer guide 631 via, for example, a slider.

[0215] The tool conversion drive unit (not shown) is configured to drive the pair of grinding tools along the tool conversion guide rail to switch between the first and second processing positions. In certain embodiments, the tool conversion drive unit includes a movable rack, a drive gear, and a drive source. The movable rack is disposed along the second direction and parallel to the tool conversion guide rail.

[0216] The grinding tool has a grinding tool mounting seat, and the driving gear is disposed on the grinding tool mounting seat and meshes with the movable rack, thereby driving the at least one pair of grinding tools to move along the grinding tool conversion guide rail. The driving source is used to drive the driving gear. In one embodiment of the present application, the driving gear is disposed on the grinding tool mounting seat, and the driving gear is driven to rotate by the driving source. The gear teeth of the driving gear mesh with the movable rack, and the gears move in accordance with the movement of the movable rack, thereby causing the at least one pair of grinding tools connected to the driving gear to move accordingly on the grinding tool conversion guide rail.

[0217] In some embodiments, the mold conversion drive unit may be arranged on the mold mounting seat, including a movable screw and a drive source, wherein the movable screw is arranged along the second direction and is associated with the pair of molds, and the drive source is used to drive the movable screw to rotate so that the associated pair of molds move along the mold conversion guide rail.

[0218] In certain embodiments, the grinding tool conversion drive unit may further control each grinding tool of the pair of grinding tools to be positioned in the second direction, thereby controlling the grinding feed amount of the grinding tool relative to the silicon rod.

[0219] In each embodiment in which the cutting device is connected to the cutting conversion mechanism and the grinding device is connected to the grinding conversion mechanism, a first silicon rod clamp and a second silicon rod clamp may be respectively provided at the first processing position and the second processing position, for clamping the silicon rod at the processing position and driving the silicon rod to move along the first direction, so that the silicon rod to be cut is fed relative to the cutting wire saw to achieve cutting, and the silicon rod to be ground is moved relative to the grinding device along the first direction so that the grinding surface of the grinding tool covers the entire side of the silicon rod.

[0220] In one processing scenario, the processing flow performed by the silicon rod processing equipment is as follows:

[0221] Taking the initial moment when the cutting device is located in the first processing position as an example, the first silicon rod is loaded into the first silicon rod clamp, and the first silicon rod clamp can drive the first silicon rod to move along the first direction to feed relative to the cutting wire saw to achieve cutting. The first silicon rod clamp can drive the first silicon rod to move back in the first direction so that the silicon rod can be fed relative to the cutting wire saw multiple times until four cross-sections are formed on the surface of the silicon rod, that is, a cut silicon rod with a rectangular or quasi-rectangular cross-section is obtained.

[0222] In which, during the cutting process, the first silicon rod moves in the cutting accommodation space of the wire cutting unit, and the annular cutting wire wound in the wire cutting unit is driven to cut the silicon rod; in some cases, the edge skin supporting mechanism in the cutting device can also be used to support the edge skin formed by cutting to assist in obtaining a complete edge skin, and the cutting device can also use the edge skin dislocation mechanism to push the supported edge skin out so that the edge skin is transferred to the edge skin conveying mechanism of the silicon rod processing equipment, so as to transport the edge skin formed by cutting to the edge skin unloading area.

[0223] The cutting device is converted from the first processing position to the second processing position by the cutting conversion mechanism, and the grinding device is converted to the first processing position by the grinding conversion mechanism.

[0224] The first silicon rod clamp and the first silicon rod clamped therein are driven to move along the first direction, so that the grinding device grinds the first silicon rod; at the same time, the second silicon rod clamp is loaded with another second silicon rod to be cut, and the second silicon rod clamp and the second silicon rod clamped therein are driven to move along the first direction, so that the silicon rod cutting device cuts the second silicon rod to form a silicon rod with a rectangular or quasi-rectangular cross-section; wherein the cutting process of the second silicon rod by the cutting device is similar to the aforementioned cutting process of the first silicon rod.

[0225] The first silicon ingot that has been polished is unloaded, and the cutting device is switched from the second processing area to the first processing area using the cutting conversion mechanism. The polishing device is then switched from the first processing area to the second processing area using the polishing conversion mechanism. This allows the polishing device to polish the cut silicon ingot in the second processing area. The first silicon ingot holder is loaded with the third silicon ingot, and the cutting device can then begin cutting in the first processing area. The corresponding cutting process can be compared to the cutting process for the first silicon ingot and will not be further described here.

[0226] Subsequent processing is similar to the above steps. By repeating this process, the silicon ingot processing equipment can simultaneously perform cutting and grinding operations, automating the flow of different process steps and simplifying the transportation path, effectively improving processing efficiency. Among them, the cutting device uses a high-speed circular cutting wire to square the silicon ingots, which is beneficial for obtaining high-precision cut silicon ingots and simplifies the subsequent grinding process.

[0227] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical concepts disclosed in this application shall be covered by the claims of this application.

Claims

1. A silicon rod processing device, characterized in that: include: The machine base has a silicon rod processing platform; the silicon rod processing platform is provided with a first processing position and a second processing position, and the first processing position and the second processing position are arranged on opposite sides of the second direction; a first silicon rod clamp, disposed at the first processing location, for clamping the silicon rod at the first processing location and driving the silicon rod to move along a first direction; a second silicon rod clamp, disposed at the second processing location, for clamping the silicon rod at the second processing location and driving the silicon rod to move along the first direction; A cutting device, comprising a cutting frame and at least one wire cutting unit; wherein the wire cutting unit is arranged on the cutting frame via a wire cutting support, and the wire cutting unit comprises: a cutting wire; a first cutting wheel and a second cutting wheel, which are arranged on the cutting frame, wherein the wheel surfaces of the first cutting wheel and the second cutting wheel are parallel or coplanar, and the cutting wire is wound around the first cutting wheel and the second cutting wheel to form a cutting wire saw; a first transition wheel, which is arranged beside the first cutting wheel and is used to pull the cutting wire wound around the first cutting wheel so that the cutting wire wound around the first cutting wheel is coplanar with the plane where the first cutting wire groove of the first cutting wheel is located ; A second transition wheel is provided beside the second cutting wheel, and is used for pulling the cutting wire wound around the second cutting wheel so that the cutting wire wound around the second cutting wheel is coplanar with the plane where the second cutting wire groove of the second cutting wheel is located; at least one third transition wheel is provided between the first transition wheel and the second transition wheel, and is used for pulling the cutting wire between the first transition wheel and the second transition wheel so that a cutting accommodating space is formed in the wire cutting unit; wherein, the cutting wire is wound around the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel and the third transition wheel to form a closed-loop cutting wire connected end to end; A first conversion mechanism is provided at a first installation position on the silicon ingot processing platform and is connected to the cutting device, comprising a first rotating shaft, which drives the first rotating shaft to rotate by a preset angle to enable the cutting device to switch between the first processing position and the second processing position; the first rotating shaft is provided in a first direction; a grinding device for grinding the silicon rods cut by the cutting device; A second conversion mechanism is provided at a second mounting position on the silicon ingot processing platform and is connected to the grinding device, comprising a second rotating shaft, which drives the second rotating shaft to rotate by a preset angle to switch the grinding device between the first processing position and the second processing position; the second rotating shaft is provided in the direction of the vertical line, and the first direction, the second direction, and the vertical line are perpendicular to each other; The edge skin supporting mechanism is used to abut against the outside of the silicon rod and support the edge skin formed by cutting; the edge skin supporting mechanism includes: at least one supporting component and at least one mounting portion, the supporting component is arranged on the wire cutting support through the mounting portion; the supporting component includes: a supporting portion, which is controlled to abut against and support the edge skin; a driving unit, which is connected to the supporting portion to control the supporting portion to move away from or abut against the edge skin.

2. The silicon rod processing equipment according to claim 1, characterized in that: The first transition wheel, the second transition wheel, and at least one third transition wheel are used to pull the cutting wire away from the cutting accommodating space.

3. The silicon rod processing equipment according to claim 1, characterized in that: The wire cutting unit includes two third transition wheels, wherein the cutting wire is sequentially wound around the first cutting wheel, the second cutting wheel, the second transition wheel, a third transition wheel, another third transition wheel, the first transition wheel, and the first cutting wheel to form a closed-loop cutting wire connected end to end.

4. The silicon rod processing equipment according to claim 1, characterized in that: The cutting device further includes a cutting wire driving device for driving the cutting wire to operate so as to cut the silicon rod.

5. The silicon rod processing equipment according to claim 4, characterized in that: The cutting line driving device is a motor having a power output shaft, and the power output shaft is connected to the first cutting wheel or the second cutting wheel.

6. The silicon rod processing equipment according to claim 1, characterized in that: The cutting device further comprises at least one distance adjustment mechanism provided on the at least one linear cutting unit, for driving the plurality of cutting wheels and the plurality of transition wheels in the linear cutting unit to move in a direction perpendicular to the wheel surface of the cutting wheel.

7. The silicon rod processing equipment according to claim 6, characterized in that: The cutting device includes a single-wire cutting unit, and the distance adjustment mechanism includes: A screw rod is arranged along a direction perpendicular to the surface of the cutting wheel and is threadedly connected to the single-wire cutting unit; A driving source is used to drive the screw to rotate.

8. The silicon rod processing equipment according to claim 6, characterized in that: The cutting device includes a single-wire cutting unit, and the distance adjustment mechanism includes: a telescopic member, arranged along a direction orthogonal to the surface of the cutting wheel and associated with the single-wire cutting unit; The driving source is used to drive the telescopic member to telescopically move along a direction perpendicular to the cutting wheel surface.

9. The silicon rod processing equipment according to claim 6, characterized in that: The cutting device includes a single-wire cutting unit, and the distance adjustment mechanism includes: A rack is provided on the single-wire cutting unit along a direction perpendicular to the cutting wheel surface; A transmission gear is engaged with the rack; and a driving source is used to drive the transmission gear to rotate.

10. The silicon rod processing equipment according to claim 6, characterized in that: The cutting device comprises a first wire cutting unit and a second wire cutting unit which are arranged in parallel and opposite to each other. At least one of the first wire cutting unit and the second wire cutting unit is driven by the distance adjustment mechanism to move along a direction orthogonal to the cutting wheel surface.

11. The silicon rod processing equipment according to claim 10, characterized in that: The distance adjustment mechanism comprises: A screw rod is arranged along a direction perpendicular to the cutting wheel surface and is threadedly connected to the first wire cutting unit or the second wire cutting unit; A driving source is used to drive the screw to rotate.

12. The silicon rod processing equipment according to claim 10, characterized in that: The distance adjustment mechanism comprises: a telescopic member, arranged along a direction orthogonal to the cutting wheel surface and associated with the first wire cutting unit or the second wire cutting unit; The driving source is used to drive the telescopic member to perform telescopic movement along a direction perpendicular to the surface of the cutting wheel.

13. The silicon rod processing equipment according to claim 10, characterized in that: The distance adjustment mechanism comprises: A bidirectional screw rod is arranged along the orthogonal direction of the cutting wheel surface and is threadedly connected to the first wire cutting unit and the second wire cutting unit. A driving source is used to drive the bidirectional screw to rotate so that the first wire cutting unit and the second wire cutting unit move toward or away from each other along a direction orthogonal to the cutting wheel surface.

14. The silicon rod processing equipment according to claim 10, characterized in that: The distance adjustment mechanism comprises: A first rack is arranged along a direction orthogonal to the cutting wheel surface and is associated with the first wire cutting unit; A second rack is arranged along a direction orthogonal to the cutting wheel surface and is associated with the second wire cutting unit; a transmission gear meshing with the first rack and the second rack; A driving source is used to drive the transmission gear to rotate so that the first wire cutting unit and the second wire cutting unit move toward or away from each other along a direction perpendicular to the cutting wheel surface.

15. The silicon rod processing equipment according to claim 1, characterized in that: It also includes a side skin dislocation mechanism, which is provided on the cutting device and is used to push the side skin along a first direction to separate the side skin from the side skin supporting mechanism or the cut silicon rod.

16. The silicon rod processing equipment according to claim 15, characterized in that: The edge skin dislocation mechanism comprises: Power source; The telescopic rod is arranged along a first direction and is used for telescopic movement driven by a power source to push the side skin.

17. The silicon rod processing equipment according to claim 1, characterized in that: It also includes a side skin conveying mechanism for receiving the side skins formed by cutting and transporting the side skins to a discharge area.

18. The silicon rod processing equipment according to claim 17, characterized in that: The edge skin conveying mechanism includes: A conveying portion, used for carrying the edge skin; A conveying driving source is used to drive the conveying part to move so as to convey the edge skin.

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