Substrate processing apparatus and control method thereof

Abstract

The present invention relates to a substrate processing apparatus and a control method thereof. The substrate processing apparatus is characterized in that it includes: a vacuum chuck unit for mounting a wafer; a ring cover unit provided at the peripheral portion of the vacuum chuck unit; a medium supply unit connected to the vacuum chuck unit to supply an inspection medium to the vacuum chuck unit; and a seal ring unit provided at the vacuum chuck unit to support the wafer and allowing the inspection medium supplied to the vacuum chuck unit to flow in. According to the present invention, the maintenance cost of the substrate processing apparatus can be reduced, and damage or contamination of the rotating chuck unit and the vacuum chuck unit due to the penetration of the processing liquid into the rotating chuck unit and the vacuum chuck unit can be prevented.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and a control method thereof, and more particularly, to a substrate processing apparatus and a control method thereof capable of easily and quickly confirming whether a seal ring portion is damaged or contaminated. Background Art

[0002] Generally, in semiconductor processes, an etching process for etching a wafer, a separation process for cutting the wafer into a plurality of dies, a cleaning process for cleaning the wafer, etc. are performed. A substrate processing apparatus is used for the etching process or the cleaning process of the wafer.

[0003] The substrate processing apparatus is rotatably provided and includes a rotating table on which a wafer is placed at an upper portion, a seal ring portion annularly coupled to an edge region of the rotating table, etc. While the rotating table is rotating, a processing liquid is supplied to the wafer placed on the rotating table.

[0004] However, since it is difficult to accurately confirm whether the seal ring portion is damaged in a conventional substrate processing apparatus, the seal ring portion needs to be periodically replaced. As a result, the maintenance cost of the substrate processing apparatus may increase.

[0005] In addition, the process of coupling the seal ring portion to the upper portion of the rotating table is complicated, and the completed state of the coupling of the seal ring portion is not constant during coupling, so that a coupling error (misalignment, etc.) may occur. Further, when a coupling error occurs in the seal ring portion, as the processing liquid penetrates from the outside of the seal ring, the structures in the outer peripheral portion of the rotating table may be damaged.

[0006] In addition, a wafer fixing module is provided to prevent the position of the wafer from changing, and a seal ring fixing module for fixing the seal ring is provided. Therefore, the structure of the substrate processing apparatus becomes complicated, and the manufacturing cost may increase.

[0007] The background art of the present invention is disclosed in Korean Patent Publication No. 10-2016-0122067 (published on October 21, 2016, invention title: wafer processing apparatus and seal ring for wafer processing apparatus). Summary of the Invention

[0008] Technical Problem to be Solved

[0009] An object of the present invention is to provide a substrate processing apparatus and a control method thereof capable of easily and quickly confirming whether a seal ring portion is damaged or contaminated.

[0010] Means for Solving the Technical Problem

[0011] The substrate processing apparatus of the present invention is characterized by including: a vacuum chuck portion for mounting a wafer; a ring cover portion provided at the outer periphery of the vacuum chuck portion; a medium supply portion connected to the vacuum chuck portion to supply an inspection medium to the vacuum chuck portion; and a seal ring portion provided at the vacuum chuck portion to support the wafer and allowing the inspection medium supplied to the vacuum chuck portion to flow in.

[0012] The vacuum chuck portion may include a vacuum chamber configured to supply the inspection medium supplied to the vacuum chuck portion to the seal ring portion.

[0013] The medium supply portion may include: a medium supply pipe portion connected to the vacuum chamber; and a valve provided in the medium supply pipe portion to open and close the flow path of the medium supply pipe portion.

[0014] The medium supply portion may further include: a pressure detection portion provided in the medium supply pipe portion to measure the pressure of the medium supply pipe portion; and a flow rate detection portion provided in the medium supply pipe portion to measure the flow rate of the inspection medium flowing in the medium supply pipe portion.

[0015] The inspection medium may contain a fluorescent substance.

[0016] The seal ring portion may include: a seal member received in a seal groove portion of the vacuum chuck portion and having a deformation space portion formed therein; a restricting ring portion provided in the seal groove portion to fix the seal member; and a connector portion connected to the deformation space portion to supply the inspection medium to the deformation space portion.

[0017] The seal member may confirm whether the seal member is damaged and whether the inspection medium flows into the interior of the seal ring portion by detecting the pressure and flow rate of the medium supply pipe portion.

[0018] The seal member may include: a seal body portion received in the seal groove portion and having the deformation space portion formed therein; and fixing ribs extending inward from the seal body portion to be inserted into the restricting ring portion.

[0019] The seal body portion may include an elastic groove portion formed on an outer side surface or an inner side surface of the seal body portion.

[0020] The seal body portion may include a tapered portion formed on both sides or one side in the width direction of the seal body portion.

[0021] The seal body portion may include a recessed portion formed in a recessed manner on the upper side of the seal body portion.

[0022] The sealing body portion may further include an elastic groove portion formed on an outer side surface or an inner side surface of the sealing body portion.

[0023] The sealing body portion may include a stepped portion formed on an upper side of the sealing body portion.

[0024] The sealing body portion may include a plurality of deformation groove portions formed on an upper side of the sealing body portion.

[0025] The sealing body portion may include an arc portion formed in an arc shape on two sides or one side in a width direction of the sealing body portion.

[0026] The sealing body portion may include a protrusion portion formed on an upper side of the sealing body portion.

[0027] The vacuum chuck portion may include: a first vacuum chuck disposed on the rotating chuck portion to rotate together with the rotating chuck portion and having a vacuum chamber formed therein; and a second vacuum chuck mounted on the first vacuum chuck and provided with the sealing ring portion, the second vacuum chuck being movable by a moving module.

[0028] The substrate processing apparatus may further include a clamping module disposed on the rotating chuck portion for fixing the wafer to the vacuum chuck portion and fixing the ring cover portion to the rotating chuck portion.

[0029] The clamping module may include: a clamping base disposed on the rotating chuck portion; a clamping rotating portion connected to the clamping base to rotate the clamping base; a plurality of first clamping link portions respectively connected to the clamping base in a radial direction and moving when the clamping base rotates; a plurality of wafer restricting portions respectively connected to the first clamping link portions to fix a retaining ring portion of the wafer to the vacuum chuck portion when the first clamping link portions move; a plurality of second clamping link portions connected to the clamping base in a radial direction and moving when the clamping base rotates; and a plurality of cover restricting portions connected to the second clamping link portions to fix the ring cover portion to the rotating chuck portion when the second clamping link portions move.

[0030] When the clamping base rotates, the plurality of first clamping link portions and the plurality of second clamping link portions may move simultaneously.

[0031] The control method of the substrate processing apparatus of the present invention is characterized by including: a step of supplying an inspection medium to a seal ring portion as the medium supply portion is driven; a step of detecting whether the inspection medium leaks from the seal ring portion; and a step of determining whether the seal ring portion is damaged based on whether the inspection medium leaks.

[0032] In the step of detecting whether the inspection medium leaks from the seal ring portion, a pressure detection portion may measure the pressure of the inspection medium supplied to the seal ring portion.

[0033] In the step of detecting whether the inspection medium leaks from the seal ring portion, a flow rate detection portion may measure the flow rate of the inspection medium supplied to the seal ring portion.

[0034] Technical effects

[0035] According to the present invention, since the medium supply portion can supply an inspection medium to the seal ring portion to enable the seal ring portion to confirm whether the inspection medium leaks, it is possible to quickly and accurately identify whether the seal ring portion is damaged. Therefore, the maintenance cost of the substrate processing apparatus can be reduced, and damage or contamination of the rotating chuck portion and the vacuum chuck portion due to the processing liquid penetrating into the rotating chuck portion and the vacuum chuck portion can be prevented. Description of the drawings

[0036] Figure 1 A plan view briefly showing a wafer being processed in a substrate processing apparatus according to an embodiment of the present invention.

[0037] Figure 2 A side view briefly showing a wafer being processed in a substrate processing apparatus according to an embodiment of the present invention.

[0038] Figure 3 A side view showing a state in which the distance between a plurality of molds is widened as the vacuum chuck portion rises in a substrate processing apparatus according to an embodiment of the present invention.

[0039] Figure 4 A cross-sectional view briefly showing a substrate processing apparatus according to an embodiment of the present invention.

[0040] Figure 5 A plan view briefly showing a clamping module in a substrate processing apparatus according to an embodiment of the present invention.

[0041] Figure 6 A cross-sectional view briefly showing a state in which a medium supply portion in a substrate processing apparatus according to an embodiment of the present invention supplies an inspection medium to a vacuum chuck portion.

[0042] Figure 7 A cross-sectional view briefly showing a state in which the inspection medium supplied to the vacuum chuck portion in a substrate processing apparatus according to an embodiment of the present invention is supplied to a seal ring portion.

[0043] Figures 8 to 18 A cross-sectional view briefly showing an embodiment of a seal ring portion in a substrate processing apparatus according to an embodiment of the present invention.

[0044] Figure 19 A flowchart briefly showing a control method of a substrate processing apparatus according to an embodiment of the present invention.

[0045] Description of reference numerals

[0046] 10: Wafer; 11: Mold; 12: Bonding sheet; 13: Retaining ring portion; 110: Driving portion; 111: Rotating shaft; 113: Motor portion; 120: Rotating chuck portion; 130: Vacuum chuck portion; 131: First vacuum chuck; 133: Second vacuum chuck; 135: Vacuum chamber; 140: Ring cover portion; 141: Cover body portion; 142: Restricting ridge portion; 143: Cover pressing portion; 150: Clamping module; 151: Clamping base; 152: Base body portion; 153: Guide portion; 154: Base gear portion; 155: Clamping rotating portion; 160: First clamping link portion; 161: First guide slider; 162: First link member; 164: First guide block; 170: Wafer restricting portion; 175: Pressing jig portion; 180: Second clamping link portion; 181: Second guide slider; 182: Second link member; 184: Second guide block; 190: Cover restricting portion; 191: Cover restricting shaft portion; 192: Restricting gear portion; 210: Medium supply portion; 211: Medium supply pipe portion; 213: Valve; 214: Pressure detection portion; 215: Flow rate detection portion; 220: Seal ring portion; 221: Sealing member; 222: Sealing body portion; 223: Deformation space portion; 224: Fixed rib; 225: Restricting ring portion; 227: Connector portion; 227a: Communication channel portion; 231: Elastic groove portion; 232: Conical portion; 233: Depression portion; 234: Step portion; 235: Deformation groove portion; 236: Arc portion; 237: Protrusion portion. Detailed description of the invention

[0047] Hereinafter, an embodiment of a substrate processing apparatus and a control method thereof according to the present invention will be described with reference to the accompanying drawings. In this process, for the sake of clarity and convenience of description, the thickness of a plurality of lines or the size of structural elements shown in the drawings may be enlarged. Also, a plurality of terms described below are terms defined in consideration of the functions in the present invention, and these may vary according to the intention or convention of users or applicators. Therefore, these terms should be defined based on the entire content of this specification.

[0048] Figure 1 A top view of a wafer processed in a substrate processing apparatus according to an embodiment of the present invention is briefly shown, Figure 2A side view of a wafer being processed in a substrate processing apparatus according to an embodiment of the present invention is shown briefly. Figure 3 A side view showing a state in which the distance between a plurality of dies is increased as the vacuum chuck unit rises in a substrate processing apparatus according to an embodiment of the present invention is shown. Figure 4 A cross-sectional view of a substrate processing apparatus according to an embodiment of the present invention is shown briefly. Figure 5 A top view of a clamping module in a substrate processing apparatus according to an embodiment of the present invention is shown briefly.

[0049] Referring to Figures 1 to 5 , a substrate processing apparatus according to an embodiment of the present invention includes a vacuum chuck unit 130, an annular cover unit 140, a medium supply unit 210, and a seal ring unit 220.

[0050] The substrate processing apparatus etches and cleans the wafer 10. In the etching process, an etching solution is sprayed onto the wafer 10. As the etched wafer 10 is cut in a matrix form in the separation process, a plurality of dies 11 are formed. In the cleaning process, as a cleaning solution is sprayed onto the wafer 10, foreign substances attached to the plurality of dies 11 are removed. As the cleaning solution, various types such as deionized water (DI-water) can be applied. Hereinafter, the etching solution and the cleaning solution are collectively referred to as a processing solution.

[0051] The wafer 10 includes: a plurality of dies 11 arranged in a matrix form; a bonding sheet 12 to which the plurality of dies 11 are attached; and a retainer ring portion 13 connected to the outer periphery of the bonding sheet 12 to support the bonding sheet 12 in a tightened manner (refer to Figure 1 and Figure 2 ). The bonding sheet 12 is formed of a material that can expand and contract in the horizontal direction. As the bonding sheet 12 is tightened by the retainer ring portion 13, the plurality of dies 11 are fixed in position, and the thin dies 11 maintain a flat plate form.

[0052] The rotary chuck unit 120 is provided on the drive unit 110 in a rotatable manner (refer to Figure 4 ). The rotary chuck unit 120 can be in a disk form as a whole.

[0053] The drive unit 110 includes: a rotary shaft 111 connected to the rotation center of the rotary chuck unit 120; and a motor unit 113 provided on the rotary shaft 111. The motor unit 113 includes: a stator (not shown) provided inside a housing (not shown); and a rotor (not shown) disposed inside the stator and surrounding the rotary shaft 111. Also, as the drive unit 110, a belt drive method in which the rotary shaft 111 is rotated through a belt, or a chain drive method in which the rotary shaft 111 is rotated through a chain can be adopted. As long as the rotary chuck unit 120 can be rotated, various forms of the drive unit 110 can be adopted.

[0054] A vacuum flow path portion 115 is formed on the rotation axis 111 (refer to Figure 5 ), so that the vacuum chuck portion 130 is in a vacuum state. The vacuum flow path portion 115 is formed along the length direction of the rotation axis 111. A vacuum chamber 135 is formed on the vacuum chuck portion 130 to connect with the vacuum flow path portion 115.

[0055] The vacuum chuck portion 130 is placed on the rotary chuck portion 120. A wafer 10 is mounted on the vacuum chuck portion 130. The vacuum chuck portion 130 is in a disk shape as a whole to be placed on the upper part of the rotary chuck portion 120. As the driving portion 110 is driven, the vacuum chuck portion 130 rotates together with the rotary chuck portion 120. When an etching process is performed in the substrate processing apparatus, a plurality of wafers 10 in a state where the dies 11 are not cut are placed on the vacuum chuck portion 130. When a cleaning process is performed in the substrate processing apparatus, a plurality of wafers 10 in a state where the dies 11 are cut are placed on the vacuum chuck portion 130. When the dies 11 are cut from the wafer 10, foreign matters may remain in the gaps between the surfaces of the dies 11.

[0056] The vacuum chuck portion 130 includes a first vacuum chuck 131 and a second vacuum chuck 133. The first vacuum chuck 131 is disposed on the rotary chuck portion 120 to rotate together with the rotary chuck portion 120, and a vacuum chamber 135 is formed thereon. The first vacuum chuck 131 forms a vacuum pressure to adsorb the wafer 10. The second vacuum chuck 133 is mounted on the first vacuum chuck 131 and is provided with a seal ring portion 220, and the second vacuum chuck 133 is moved by a moving module (not shown). The first vacuum chuck 131 and the second vacuum chuck 133 may be in a disk shape as a whole.

[0057] A plurality of adsorption hole portions (not shown) communicating with the medium flow path portion 115 of the first vacuum chuck 131 are formed on the second vacuum chuck 133 to adsorb the wafer 10. The plurality of adsorption hole portions can be arranged in a concentric circle shape along the circumferential direction of the second vacuum chuck 133. When a vacuum pressure is formed in the medium inflow portion 115, the wafer 10 is closely attached to the upper surface of the second vacuum chuck 133 by the vacuum adsorption force of the adsorption hole portions. Therefore, during the etching process or the cleaning process of the wafer 10 in the substrate processing apparatus, the flatness of the wafer 10 can be maintained.

[0058] The annular cover part 140 is arranged on the peripheral part of the vacuum chuck part 130. The annular cover part 140 seals the peripheral part side of the vacuum chuck part 130 by pressing the bonding piece 12 of the wafer 10. The annular cover part 140 is fixed to the rotating chuck part 120 by the clamping module 150. Since the annular cover part 140 is in a circular ring shape to press the bonding piece 12 of the wafer 10 to seal the peripheral part of the vacuum chuck part 130, the damage of the etching solution to the bonding piece 12 can be minimized, and the rotating chuck part 120 and the vacuum chuck part 130 can be prevented from being contaminated or damaged by the etching solution.

[0059] The annular cover part 140 includes: a cover body part 141 surrounding the outer periphery of the vacuum chuck part 130; a limiting rib part 142 formed to protrude inward from the lower side of the cover body part 141; and a cover pressing part 143 extending inward from the upper side of the cover body part 141 for pressing the bonding piece 12 of the wafer 10. The cover pressing part 143 presses the part of the bonding piece 12 that is approximately separated by about 1 mm from the outermost periphery of the mold 11. The cover pressing part 143 can gradually become thinner toward the end. Since the part of the bonding piece 12 between the retaining ring part 13 and the mold 11 is sealed by the cover pressing part 143 except for a width of about 1 mm, the damage of the etching solution to the bonding piece 12 can be minimized.

[0060] The moving module (not shown) moves the second vacuum chuck 133 of the vacuum chuck part 130 upward, and the rotating chuck part 120 and the first vacuum chuck 131 maintain a fixed position. In this case, the peripheral part of the vacuum chuck part 130 supports the bonding piece 12 of the wafer 10. As the moving module is driven, the second vacuum chuck 133 of the vacuum chuck part 130 moves upward, and the rotating chuck part 120 does not rise. Therefore, with the retaining ring part 13 of the wafer 10 in a fixed position, the bonding piece 12 rises and is stretched in the radial direction. As the bonding piece 12 is stretched in the radial direction, the interval G2 (refer to Figure 3 ) between the plurality of molds 11 is widened. Therefore, when the cleaning process is performed, the foreign matters inserted in the interval G2 between the plurality of molds 11 can be removed quickly and easily.

[0061] The substrate processing device is arranged on the rotating chuck part 120 and further includes a clamping module 150 for fixing the wafer 10 to the vacuum chuck part 130 and fixing the annular cover part 140 to the rotating chuck part 120.

[0062] The clamping module 150 includes a clamping base 151, a clamping rotating part 155, a plurality of first clamping link parts 160, a plurality of wafer limiting parts 170, a plurality of second clamping link parts 180, and a plurality of cover limiting parts 190.

[0063] The clamping base 151 is provided on the rotary chuck part 120. The clamping rotation part 155 is connected to the clamping base 151 to rotate the clamping base 151. A plurality of first clamping link parts 160 are respectively connected to the clamping base 151 in a radial manner and move when the clamping base 151 rotates. A plurality of wafer restricting parts 170 are respectively connected to the first clamping link parts 160 to fix the retaining ring part 13 of the wafer 10 to the vacuum chuck part 130 when the first clamping link parts 160 move. The clamping base 151 is provided in a concentric manner with the rotary chuck part 120. The clamping base 151, the clamping rotation part 155, and the first clamping link parts 160 are arranged inside the rotary chuck part 120, and the wafer restricting parts 170 are arranged on the outer peripheries of the rotary chuck part 120 and the vacuum chuck part 130.

[0064] When the clamping rotation part 155 is driven, as the clamping base 151 rotates by a predetermined angle, a plurality of first clamping link parts 160 move in the radial direction of the clamping base 151. As the plurality of first clamping link parts 160 move simultaneously, the plurality of wafer restricting parts 170 press and fix the retaining ring part 13 of the wafer 10 to the peripheral part of the first vacuum chuck 131.

[0065] The clamping base 151 includes a base body part 152, a plurality of guide parts 153, and a base gear part 154.

[0066] The base body part 152 is annular in a concentric manner with the rotation axis 111 of the rotary chuck part 120. The base body part 152 is arranged inside the rotary chuck part 120. A plurality of guide parts 153 are formed on the base body part 152 to be combined with the first clamping link parts 160 in a movable manner. The number of the plurality of guide parts 153 is twice the number of the first clamping link parts 160 and is formed at equal intervals along the circumferential direction of the base body part 152. The first clamping link parts 160 are combined with every other one of the plurality of guide parts 153. The base gear part 154 is formed on the base body part 152 and is connected to the clamping rotation part 155. The base gear part 154 is arranged in an arc shape on the inner peripheral surface of the base body part 152. As the clamping rotation part 155 is driven, the base gear part 154 rotates, and as the base body part 152 and the base gear part 154 rotate together, the first clamping link parts 160 move in the radial direction of the base body part 152.

[0067] The guide part 153 is formed to be inclined with respect to the radius of the base body part 152. The guide part 153 may be a guide hole part. The guide part 153 may be a guide groove or a guide protrusion part. Since the guide part 153 is formed to be inclined with respect to the radius of the base body part 152, as the base body part 152 rotates by a predetermined angle, the first clamping link part 160 performs a linear motion along the radial direction of the base body part 152.

[0068] The first clamping link part 160 includes a first guiding slider 161, a first link member 162, and a first link gear part 163 (see Figure 4 ). The first guiding slider 161 is movably combined with the guiding part 153. The first link member 162 is connected to the first guiding slider 161 and linearly moves in the radial direction of the base body part 152 when the first guiding slider 161 moves. The first link member 162 is in the form of a straight rod. The first link gear part 163 is formed on the first link member 162 to move by engaging with the wafer restricting part 170. The first link gear part 163 is in the form of a rack parallel to the length direction of the first link member 162.

[0069] The first clamping link part 160 further includes a first guiding block 164, and the first link member 162 is linearly movably combined with the first guiding block 164. The first guiding block 164 prevents the first link member 162 from rotating in the circumferential direction of the base body part 152 when the base body part 152 rotates. Therefore, when the base body part 152 rotates, if the first guiding slider 161 moves along the guiding part 153, the first link member 162 can linearly move without rotating.

[0070] The wafer restricting part 170 includes a pressing jig part 175, and the pressing jig part 175 rotates when the jig link part 173 moves to press and release the retainer ring part 13 of the wafer 10. The pressing jig part 175 is in an arc shape to press and fix the retainer ring part 13 of the wafer 10 in the circumferential direction.

[0071] A plurality of second clamping link parts 180 are radially connected to the clamping base 151 and move when the clamping base 151 rotates. A plurality of cover restricting parts 190 are connected to the second clamping link parts 180 to fix the ring cover part 140 to the rotating chuck part 120 when the second clamping link parts 180 move. As the clamping rotating part 155 is driven, the base gear part 154 rotates. As the base body part 152 rotates together with the base gear part 154, the second clamping link parts 180 move in the radial direction of the base body part 152. In this case, when the base body part 152 of the clamping base 151 rotates, the plurality of first clamping link parts 160 and the plurality of second clamping link parts 180 move simultaneously. As the first clamping link part 160 moves, the retainer ring part 13 of the wafer 10 is fixed to the vacuum chuck part 130. As the second clamping link part 180 moves, the ring cover part 140 is fixed to the rotating chuck part 120. Therefore, by using one clamping base 151 and one clamping rotating part 155, the wafer 10 and the ring cover part 140 are simultaneously fixed to the vacuum chuck part 130 and the rotating chuck part 120, thereby simplifying the structure of the substrate processing apparatus.

[0072] The second clamping link portion 180 includes a second guiding slider 181 and a second link member 182.

[0073] The second guiding slider 181 is movably combined with the guiding portion 153. The second link member 182 is connected to the second guiding slider 181 and, when the second guiding slider 181 moves, linearly moves along the radial direction of the base body portion 152. A second link gear portion is formed on the second link member 182 to engage with the cover restricting portion 190 for movement. The second link member 182 is in the form of a straight rod. The second link gear portion is in the form of a rack parallel to the length direction of the second link member 182.

[0074] The second clamping link portion 180 further includes a second guiding block 184, and the second link member 182 is linearly movably combined with the second guiding block 184. The second guiding block 184 prevents the second clamping link portion 180 from rotating in the circumferential direction of the base body portion 152 when the base body portion 152 rotates. Therefore, when the base body portion 152 rotates, if the second guiding slider 181 moves along the guiding portion 153, the second link member 182 can linearly move without rotating.

[0075] The cover restricting portion 190 is connected to the second clamping link portion 180 to fix the restricting rib portion 142 of the ring cover portion 140 to the rotating chuck portion 120 when the second clamping link portion 180 moves.

[0076] Figure 6 A cross-sectional view for briefly showing a state in which an inspection medium is supplied from a medium supply portion to a vacuum chuck portion in a substrate processing apparatus according to an embodiment of the present invention, Figure 7 A cross-sectional view for briefly showing a state in which the inspection medium supplied to the vacuum chuck portion in a substrate processing apparatus according to an embodiment of the present invention is supplied to a sealing ring portion.

[0077] Referring to Figure 6 and Figure 7 , the medium supply portion 210 is connected to the vacuum chuck portion 130 to supply an inspection medium to the vacuum chuck portion 130. In this case, the vacuum chuck portion 130 includes a vacuum chamber 135, and the vacuum chamber 135 is formed to supply the inspection medium supplied to the vacuum chuck portion 130 to the sealing ring portion 220. The vacuum chamber 135 can be formed radially in the first vacuum chuck 131 to be respectively connected to a plurality of sealing ring portions 220.

[0078] The medium supply portion 210 includes a medium supply pipe portion 211 connected to the vacuum chamber 135 and a valve 213 provided in the medium supply pipe portion 211 to open and close the flow path of the medium supply pipe portion 211. As the valve 213 is opened, the inspection medium flows along the medium supply pipe portion 211 and is supplied to the vacuum chamber 135.

[0079] The medium supply unit 210 further includes: a pressure detection unit 214 disposed in the medium supply pipe unit 211 to measure the pressure of the medium supply pipe unit 211; and a flow rate detection unit 215 disposed in the medium supply pipe unit 211 to measure the flow rate of the inspection medium flowing in the medium supply pipe unit 211. If the pressure of the medium supply pipe unit 211 drops below a preset pressure during the supply of the inspection medium to the medium supply pipe unit 211, it can be determined that the seal ring unit 220 is damaged. And since the flow rate detection unit 215 detects the flow rate of the inspection medium to supply a specified amount of the inspection medium to the seal ring unit 220, an excessive increase in the internal pressure of the seal ring unit 220 can be prevented.

[0080] The inspection medium may contain a fluorescent substance. Therefore, even in a dark place, the inspection medium leaking from the seal ring unit 220 can be confirmed, so that it is easy to confirm whether the seal ring unit 220 is damaged even in a dark place.

[0081] The seal ring unit 220 is disposed on the vacuum chuck unit 130 to support the wafer 10, and the inspection medium supplied to the vacuum chuck unit 130 flows into it. When the seal ring unit 220 is damaged, since the inspection medium leaks to the outside through the damaged part of the seal ring unit 220, it is possible to confirm the leakage of the inspection medium from the seal ring unit 220 by using a leakage inspection device (not shown). Whether the seal ring unit 220 is damaged can be inspected before the processing step of the substrate processing apparatus. In this way, by confirming whether the inspection medium leaks, it is possible to quickly and easily confirm whether the seal ring unit 220 is damaged or contaminated. Therefore, the replacement time of the seal ring unit 220 can be accurately identified, thereby reducing the maintenance cost of the substrate processing apparatus. And it is possible to prevent the substrate processing apparatus from being contaminated or damaged due to the damage of the seal ring unit 220.

[0082] The seal ring unit 220 includes a seal member 221, a restricting ring portion 225, and a connector portion. The seal member 221 is accommodated in the seal groove portion of the vacuum chuck unit 130, and a deformation space portion 223 is formed inside. The restricting ring portion 225 is disposed in the seal groove portion to fix the seal member 221. The connector portion 227 is connected to the deformation space portion 223 to supply the inspection medium to the deformation space portion 223. The seal member 221 may be in the shape of a quadrangle with an open lower side. The lower side of the seal member 221 is inserted into the restricting ring portion 225 and is restricted. A communication channel portion 227a is formed in the connector portion 227 to communicate the deformation space portion 223 and the vacuum chamber 135. The inspection medium supplied to the vacuum chamber 135 is supplied to the deformation space portion 223 of the seal member 221 through the connector portion 227. Therefore, it is possible to accurately determine the replacement period of the seal member 221 by detecting whether the inspection medium leaks through the seal member 221.

[0083] Hereinafter, various embodiments of the sealing member 221 will be described.

[0084] Figures 8 to 18 FIG. is a cross-sectional view briefly showing an embodiment of a seal ring portion in a substrate processing apparatus according to an embodiment of the present invention.

[0085] Referring to Figure 8 , the sealing member 221 includes: a seal body portion 222, which is accommodated in the seal groove portion and has a deformation space portion 223 formed therein; and a fixing rib 224, which extends inward from the seal body portion 222 to be inserted into the restricting ring portion 225. The seal body portion 222 is generally in a "U" shape, and the fixing ribs 224 extend inward from both side ends. Since the fixing ribs 224 are restricted by being inserted into the restricting ring portion 225, even if the pressure in the deformation space portion 223 increases, the sealing member 221 can be prevented from separating from the restricting ring portion 225.

[0086] The sealing member 221 detects the pressure and flow rate of the medium supply pipe portion 211, so that it can be confirmed whether the sealing member 221 is damaged and whether the medium flows into the inside of the seal ring portion 220. Therefore, it can be pre-confirmed whether the seal ring portion 220 is damaged and contaminated.

[0087] Referring to Figures 9 to 11 , the seal body portion 222 includes an elastic groove portion 231 formed on the outer side surface or the inner side surface of the seal body portion 222. The elastic groove portion 231 is formed at the upper side corner portion or near the corner portion of the seal body portion 222. The elastic groove portion 231 is circular along the circumferential direction of the seal body portion 222. When the lid pressing portion 143 of the ring lid portion 140 presses the seal body portion 222, the seal body portion 222 can be deformed more flexibly. And, since the deformation amount of the seal body portion 222 increases, the bonding piece 12 of the wafer 10 can be sealed more tightly by the restoring force of the seal body portion 222. And, since the contact area between the seal body portion 222 and the lid pressing portion 143 increases, the sealing performance of the seal body portion 222 can be improved.

[0088] Referring to Figure 12 , the seal body portion 222 includes a tapered portion 232, which is formed on both sides or one side in the width direction of the seal body portion 222. The tapered portion 232 is inclined downward toward both sides of the seal body portion 222. Since the upper side of the seal body portion 222 is deformed more flexibly, the bonding piece 12 of the wafer 10 can be sealed more tightly by the restoring force of the seal body portion 222. And, since the contact area between the seal body portion 222 and the lid pressing portion 143 increases, the sealing performance of the seal body portion 222 can be improved.

[0089] Referring to Figure 13 and Figure 14, the sealing body portion 222 includes a recessed portion 233 which is formed in a recessed manner on the upper side of the sealing body portion 222. The central portion in the width direction of the sealing body portion 222 is recessed downward to form in the recessed portion 233. The recessed portion 233 can be conical or arc-shaped toward the central portion side in the width direction. The recessed portion 233 is circular along the circumferential direction of the sealing body portion 222. Since the recessed portion 233 is formed on the upper side of the sealing body portion 222, when the lid pressing portion 143 of the ring lid portion presses the sealing body portion 222, the deformation amount of the sealing body portion 222 can be increased. And, since the close contact area between the sealing body portion 222 and the lid pressing portion 143 is increased, the sealing performance of the sealing body portion 222 can be improved.

[0090] The sealing body portion 222 may further include an elastic groove portion 231 formed on the outer side surface or the inner side surface of the sealing body portion 222. The elastic groove portion 231 is formed at the upper side corner portion or near the corner portion of the sealing body portion 222. The elastic groove portion 231 is circular along the circumferential direction of the sealing body portion 222. Since the recessed portion 233 and the elastic groove portion 231 are formed on the sealing body portion 222 at the same time, the deformation amount of the sealing body portion 222 can be further increased.

[0091] Refer to Figure 15 , the sealing body portion 222 includes a stepped portion 234 formed on the upper side of the sealing body portion 222. The stepped portion 234 may be formed at the portion where the end of the lid pressing portion 143 contacts. The stepped portion 234 is circular along the circumferential direction of the sealing body portion 222. Since the stepped portion 234 is formed on the upper side of the sealing body portion 222, the deformation amount of the sealing body portion 222 can be further increased. And, since the close contact area between the sealing body portion 222 and the lid pressing portion 143 is increased, the sealing performance of the sealing body portion 222 can be improved.

[0092] Refer to Figure 16 , the sealing body portion 222 includes a plurality of deformation groove portions 235 formed on the upper side of the sealing body portion 222. The plurality of deformation groove portions 235 are formed on the upper side inner surface of the sealing body portion 222. The plurality of deformation groove portions 235 are circular along the circumferential direction of the sealing body portion 222. Since the plurality of deformation groove portions 235 are formed on the upper side of the sealing body portion 222, the deformation amount of the sealing body portion 222 can be further increased. And, since the close contact area between the sealing body portion 222 and the lid pressing portion 143 is increased, the sealing performance of the sealing body portion 222 can be improved.

[0093] Refer to Figure 17, the sealing body portion 222 includes arc portions 236 formed on both sides or one side in the width direction of the sealing body portion 222 in an arc shape. The arc portions 236 are formed at the corner portions of the sealing body portion 222. The arc portions 236 are circular along the circumferential direction of the sealing body portion 222. Since the arc portions 236 are formed on both sides of the sealing body portion 222, the deformation amount of the sealing body portion 222 can be further increased. Also, since the contact area between the sealing body portion 222 and the cover pressing portion 143 is increased, the sealing performance of the sealing body portion 222 can be improved.

[0094] Refer to Figure 18 , the sealing body portion 222 includes a protrusion portion 237 formed on the upper side of the sealing body portion 222. The protrusion portion 237 is in a curved surface shape along the width direction of the sealing body portion 222. The protrusion portion 237 is circular along the circumferential direction of the sealing body portion 222. Since the protrusion portion 237 is formed on the upper side of the sealing body portion 222, the deformation amount of the sealing body portion 222 can be further increased.

[0095] A control method of a substrate processing apparatus according to an embodiment of the present invention configured as described above will be described.

[0096] Figure 19 It is a flowchart for briefly showing a control method of a substrate processing apparatus according to an embodiment of the present invention.

[0097] Refer to Figure 19 , before the start or after the end of the processing step of the substrate processing apparatus, it is possible to check whether the seal ring portion 220 is damaged.

[0098] With the driving of the medium supply unit 210, an inspection medium is supplied to the seal ring portion 220 (step S11). In this case, as the valve 213 is opened, the inspection medium flows along the medium supply pipe portion 211 and is supplied to the vacuum chamber 135. The inspection medium in the vacuum chamber 135 is supplied to the deformation space portion 223 of the sealing member 221 through the connector portion 227.

[0099] The seal ring portion 220 detects whether the inspection medium leaks (step S12). When the seal ring portion 220 is damaged, the inspection medium leaks through the damaged portion of the seal ring portion 220.

[0100] The pressure detection unit 214 measures the pressure of the inspection medium supplied to the seal ring portion 220 (step S13). If the pressure of the medium supply pipe portion 211 drops below a preset pressure during the supply of the inspection medium to the medium supply pipe portion 211, the control unit may determine that the seal ring portion 220 is damaged.

[0101] The flow rate detection unit 215 measures the flow rate of the inspection medium supplied to the seal ring unit 220 (step S14). In this case, since the flow rate detection unit 215 detects the flow rate of the inspection medium to supply a prescribed amount of the inspection medium to the seal ring unit 220, an excessive increase in the internal pressure of the seal ring unit 220 can be prevented. When the flow rate detection unit 215 detects a preset flow rate, the valve 213 can be closed or the opening degree of the valve 213 can be reduced.

[0102] Determine whether the inspection medium leaks from the seal ring unit 220 (step S15). When the inspection medium leaks from the seal ring unit 220, it is determined that the seal ring unit 220 is damaged (step S16). When the inspection medium contains a fluorescent substance, even in a dark place, it is possible to easily confirm whether the seal ring unit 220 is damaged by observing the leaked fluorescent substance. Also, it is possible to use a separate leak inspection device to confirm whether the seal ring unit 220 is damaged.

[0103] When it is detected that the inspection medium leaks, the seal ring unit 220 is replaced (step S17). In this case, the damaged seal ring unit 220 is removed from the seal groove unit, and a new seal ring unit 220 is provided in the seal groove unit.

[0104] Discharge the flowing medium in the seal ring unit 220 (step S18). In this case, the seal body unit 222 is crimped and contracted to the inside of the seal groove unit, and the fixing rib 224 of the seal ring unit 220 is deformed and tightly inserted into the restricting ring unit 225. Therefore, the assembly accuracy of the seal ring unit 220 can be improved.

[0105] The transfer unit (not shown) picks up the wafer 10 and mounts the wafer 10 on the vacuum chuck unit 130 (step S19). In this case, the retaining ring portion 13 of the wafer 10 is placed on the outer peripheral portion of the rotary chuck unit 120, and the bonding sheet 12 portion between the retaining ring portion 13 and the mold 11 is placed on the upper side of the seal ring unit 220.

[0106] The clamping module 150 is driven to fix the wafer 10 to the vacuum chuck unit 130 (step S20). As the clamping base 151 rotates through the clamping rotation unit 155, the plurality of first clamping link portions 160 and the plurality of second clamping link portions 180 move simultaneously. As the first clamping link portion 160 moves, the retaining ring portion 13 of the wafer 10 is fixed to the vacuum chuck unit 130, and as the second clamping link portion 180 moves, the ring cover portion 140 is fixed to the rotary chuck unit 120.

[0107] The flowing medium is supplied to the seal ring unit 220 to expand the seal ring unit 220 (step S21). As the seal ring unit 220 expands, the sealing force is further increased by the expansion force of the seal ring unit 220 and the pressing force of the ring cover portion 140. Therefore, the sealing performance of the seal ring unit 220 and the ring cover portion 140 can be further improved.

[0108] The wafer 10 is processed by ejecting a processing liquid onto the wafer 10 (step S22). In this case, a processing liquid nozzle (not shown) ejects the processing liquid from the upper side of the wafer 10.

[0109] When the processing of the wafer 10 is completed, the restriction on the wafer 10 is released by driving the clamping module 150. The transfer unit picks up the wafer 10 and discharges the wafer 10 to the outside of the vacuum chuck unit 130.

[0110] Although the present invention has been described with reference to the embodiments shown in the accompanying drawings, this is merely illustrative, and those skilled in the art can understand that various modifications and equivalent other embodiments can be implemented.

Claims

1. A substrate processing apparatus, characterized in that, Comprising: A vacuum chuck portion for mounting a wafer; A ring cover portion provided at the peripheral portion of the vacuum chuck portion; A medium supply portion connected to the vacuum chuck portion to supply an inspection medium to the vacuum chuck portion; and A seal ring portion provided at the vacuum chuck portion to support the wafer and allowing the inspection medium supplied to the vacuum chuck portion to flow in, The seal ring portion includes: A seal member received in a seal groove portion of the vacuum chuck portion and having a deformation space portion formed therein; A restricting ring portion provided in the seal groove portion to fix the seal member; and A connector portion connected to the deformation space portion to supply the inspection medium to the deformation space portion.

2. The substrate processing apparatus according to claim 1, wherein The vacuum chuck portion includes a vacuum chamber configured to supply the inspection medium supplied to the vacuum chuck portion to the seal ring portion.

3. The substrate processing apparatus according to claim 2, wherein, The medium supply portion includes: A medium supply pipe portion connected to the vacuum chamber; and A valve provided in the medium supply pipe portion to open and close a flow path of the medium supply pipe portion.

4. The substrate processing apparatus according to claim 3, wherein, The medium supply portion further includes: A pressure detection portion provided in the medium supply pipe portion to measure the pressure of the medium supply pipe portion; and A flow rate detection portion provided in the medium supply pipe portion to measure the flow rate of the inspection medium flowing in the medium supply pipe portion.

5. The substrate processing apparatus according to claim 1, wherein The inspection medium contains a fluorescent substance.

6. The substrate processing apparatus according to claim 3, wherein The seal member confirms whether the seal member is damaged and whether the inspection medium flows into the interior of the seal ring portion by detecting the pressure and flow rate of the medium supply pipe portion.

7. The substrate processing apparatus according to claim 1, wherein The seal member includes: A seal body portion received in the seal groove portion and having the deformation space portion formed therein; and Fixed ribs extending inward from the seal body portion to be inserted into the restricting ring portion.

8. The substrate processing apparatus according to claim 7, wherein The seal body portion includes an elastic groove portion formed on an outer side surface or an inner side surface of the seal body portion.

9. The substrate processing apparatus according to claim 7, wherein, The seal body portion includes a tapered portion formed on two sides or one side in the width direction of the seal body portion.

10. The substrate processing apparatus according to claim 7, wherein, The seal body portion includes a recessed portion formed in a recessed manner on the upper side of the seal body portion.

11. The substrate processing apparatus according to claim 10, wherein, The seal body portion further includes an elastic groove portion formed on an outer side surface or an inner side surface of the seal body portion.

12. The substrate processing apparatus according to claim 7, wherein The seal body portion includes a stepped portion formed on the upper side of the seal body portion.

13. The substrate processing apparatus according to claim 7, wherein, The seal body portion includes a plurality of deformation groove portions formed on the upper side of the seal body portion.

14. The substrate processing apparatus according to claim 7, wherein The seal body portion includes an arc portion formed in an arc shape on two sides or one side in the width direction of the seal body portion.

15. The substrate processing apparatus according to claim 7, wherein The seal body portion includes a protrusion portion formed on the upper side of the seal body portion.

16. The substrate processing apparatus according to claim 1, wherein, The vacuum chuck portion includes: A first vacuum chuck provided on a rotary chuck portion to rotate together with the rotary chuck portion and having a vacuum chamber formed therein; and A second vacuum chuck mounted on the first vacuum chuck and provided with the seal ring portion, the second vacuum chuck being moved by a moving module.

17. The substrate processing apparatus according to claim 16, wherein, It further includes a clamping module, which is arranged on the rotating chuck part and is used to fix the wafer on the vacuum chuck part and fix the ring cover part on the rotating chuck part.

18. The substrate processing apparatus according to claim 17, wherein, The clamping module includes: a clamping base arranged on the rotating chuck part; a clamping rotating part connected to the clamping base to rotate the clamping base; a plurality of first clamping link parts respectively connected to the clamping base in a radial manner and moving when the clamping base rotates; a plurality of wafer limiting parts respectively connected to the first clamping link parts to fix the retaining ring part of the wafer on the vacuum chuck part when the first clamping link parts move; a plurality of second clamping link parts connected to the clamping base in a radial manner and moving when the clamping base rotates; and a plurality of cover limiting parts connected to the second clamping link parts to fix the ring cover part on the rotating chuck part when the second clamping link parts move.

19. The substrate processing apparatus according to claim 18, wherein, When the clamping base rotates, the plurality of first clamping link parts and the plurality of second clamping link parts move simultaneously.

20. A control method for a substrate processing apparatus, characterized in that, It includes: a step of supplying inspection medium to the sealing ring part under the drive of the medium supply part; a step of detecting whether the inspection medium leaks from the sealing ring part; and a step of judging whether the sealing ring part is damaged according to whether the inspection medium leaks, wherein the sealing ring part includes: a sealing component accommodated in the sealing groove part of the vacuum chuck part, and a deformation space part is formed inside the sealing component; a limiting ring part arranged in the sealing groove part to fix the sealing component; and a connector part connected to the deformation space part to supply the inspection medium to the deformation space part.

21. The control method of the substrate processing apparatus according to claim 20, wherein in the step of detecting whether the inspection medium leaks from the sealing ring part, the pressure detection part measures the pressure of the inspection medium supplied to the sealing ring part.

22. The control method of the substrate processing apparatus according to claim 20, wherein in the step of detecting whether the inspection medium leaks from the sealing ring part, the flow detection part measures the flow rate of the inspection medium supplied to the sealing ring part.

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