laser

Abstract

The application discloses a laser, and belongs to the technical field of photoelectricity. The laser comprises a tube shell, one side of the tube shell is open, a plurality of light-emitting assemblies are arranged in a containing space of the tube shell, a sealing cover plate is annular, the sealing cover plate comprises an inner edge portion, an outer edge portion and a wave structure connecting the inner edge portion and the outer edge portion, the wave shape of the wave structure extends from the outer edge portion to the inner edge portion, and the outer edge portion is fixed on the side where the opening of the tube shell is located; and a light-transmitting sealing layer, the edge of the light-transmitting sealing layer is fixed on the inner edge portion. The application solves the problem of low production yield of the laser. The application is used for light emission.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of optoelectronics, and in particular to a laser. BACKGROUND

[0002] With the development of optoelectronic technology, lasers are widely used.

[0003] As shown in Figure 1 , the laser 00 includes a tube shell 001, a plurality of light emitting assemblies 002, a sealing cover plate 003 and a light-transmitting sealing layer 004. One side of the tube shell 001 has an opening, and the plurality of light emitting assemblies 002 are located in the accommodation space of the tube shell 001. The sealing cover plate 003 is a ring-shaped metal part with a recessed inner edge, and the outer edge of the sealing cover plate 003 is welded to the side of the opening of the tube shell by parallel sealing welding technology, and the edge of the light-transmitting sealing layer 004 is fixed with the inner edge of the sealing cover plate 003.

[0004] When parallel sealing welding is performed on the sealing cover plate and the tube shell, a large amount of heat is generated at the connection between the sealing cover plate and the tube shell, and the tube shell expands due to the heat and generates a large stress. The stress is transmitted to the light-transmitting sealing layer through the sealing cover plate, which causes the light-transmitting sealing layer to be more prone to breakage. Therefore, the preparation yield of the laser is low. SUMMARY

[0005] The present application provides a laser, which can solve the problem of low preparation yield of the laser. The technical solution is as follows: the laser comprises:

[0006] a tube shell, one side of the tube shell being open;

[0007] a plurality of light emitting assemblies, the plurality of light emitting assemblies being located in an accommodation space of the tube shell;

[0008] a sealing cover plate, the sealing cover plate being annular, the sealing cover plate comprising an inner edge portion and an outer edge portion, and a wave-shaped structure connecting the inner edge portion and the outer edge portion, the wave shape of the wave-shaped structure extending from the outer edge portion toward the inner edge portion, and the outer edge portion being fixed with the side of the opening of the tube shell;

[0009] a light-transmitting sealing layer, an edge of the light-transmitting sealing layer being fixed with the inner edge portion.

[0010] The technical solution provided by the present application has at least the following beneficial effects:

[0011] The laser provided in the application can make the wave structure in the tube shell and the sealing cover plate shrink to a certain extent when the tube shell and the sealing cover plate are heated, so the sealing cover plate can absorb more stress, so that the stress conducted to the light-transmitting sealing layer from the sealing cover plate is smaller; and even if the wave structure is heated and expanded, the deformation amount of the wave structure towards the light-transmitting sealing layer can be ensured to be smaller. In this way, the risk of the light-transmitting sealing layer being broken under the action of the stress generated by the thermal expansion of the sealing cover plate can be reduced, and the preparation yield of the laser can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the application, the drawings needed to be used in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0013] Figure 1 is a structural schematic diagram of a laser provided by the related art;

[0014] Figure 2 is a structural schematic diagram of a laser provided by the embodiments of the application;

[0015] Figure 3 is a structural schematic diagram of another laser provided by the embodiments of the application;

[0016] Figure 4 is a structural schematic diagram of still another laser provided by the embodiments of the application;

[0017] Figure 5 is a structural schematic diagram of yet another laser provided by the embodiments of the application;

[0018] Figure 6 is a structural schematic diagram of a sealing cover plate provided by the embodiments of the application;

[0019] Figure 7 is a structural schematic diagram of another sealing cover plate provided by the embodiments of the application;

[0020] Figure 8 is a structural schematic diagram of yet another laser provided by the embodiments of the application. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solutions and advantages of the application more clear, the embodiments of the application will be further described in detail below with reference to the drawings.

[0022] With the development of optoelectronic technology, the application of laser is more and more widely, for example, laser can be applied in welding process, cutting process and laser projection and the like. The following embodiments of the present application provide a kind of laser, can reduce the risk of breakage of light-transmitting sealing layer in laser, improve the preparation yield of laser.

[0023] Figure 2 It is a kind of structure schematic diagram of laser provided by the embodiments of the present application, Figure 3 It is another kind of structure schematic diagram of laser provided by the embodiments of the present application, Figure 2 It can be Figure 3 The schematic diagram of the cross section a-a' of the laser shown. As Figure 2 Shown, the laser 10 can include: tube shell 101, a plurality of light emitting components 102, sealing cover plate 103 and light-transmitting sealing layer 104.

[0024] Wherein, one side of the tube shell 101 is open, and the plurality of light emitting components 102 are located in the accommodation space of the tube shell 101. The sealing cover plate 103 is annular, and the sealing cover plate 103 includes inner edge portion W1 and outer edge portion W2, and the wave structure W3 connecting the inner edge portion W1 and the outer edge portion W2. The wave shape of the wave structure W3 extends from the outer edge portion W2 towards the inner edge portion W1, and the outer edge portion W2 is fixed on the side of the opening of the tube shell 101. The edge of the light-transmitting sealing layer 104 is fixed with the inner edge portion W1.

[0025] The thickness of the outer edge portion W2 of the sealing cover plate 103 in the embodiments of the present application can be less than a preset thickness threshold, the thickness of the outer edge portion W2 is thinner, and the outer edge portion W2 can be fixed on the side of the opening of the tube shell 101 by parallel sealing technology. Optionally, the sealing cover plate 103 can be a sheet metal part, and the thickness of each position of the sealing cover plate 103 is the same or substantially the same. The sealing cover plate 103 can be made by sheet metal process, for example, a piece of annular plate structure can be stamped to make appropriate positions of the plate structure bent, recessed or raised to obtain the sealing cover plate provided by the embodiments of the present application.

[0026] As Figure 2 Shown, the tube shell 101 can include a bottom plate 1011 and an annular side wall portion 1012 fixed on the bottom plate 1011, and the bottom plate 1011 and the side wall portion 1012 enclose the accommodation space of the tube shell 101. The opening of the side wall portion 1012 away from the bottom plate 1011 is the opening of the tube shell 101. The outer edge portion W2 of the sealing cover plate 103 can be fixed on the surface of the side wall portion 1012 away from the bottom plate 1011 by parallel sealing technology. Optionally, the bottom plate 1011 and the side wall portion 1012 in the tube shell 101 can be an integral structure, or also can be an independent structure, and are welded together to form the tube shell 101.

[0027] It should be noted that when fixing the outer edge portion W2 of the sealing cover plate 103 to the tube shell 101 by parallel sealing technology, the sealing cover plate 103 is first placed on the side of the opening of the tube shell 101, and the outer edge portion W2 of the sealing cover plate 103 is overlapped on the surface of the side wall portion 1012 of the tube shell 101 away from the bottom plate 1011. Then the outer edge portion W2 needs to be heated by a sealing device, and then the outer edge portion W2 is welded to the side wall portion of the tube shell 101. Alternatively, before fixing the sealing cover plate 103 to the tube shell 101, the light-transmitting sealing layer 104 can be fixed to the sealing cover plate 103, such as by fixing the edge of the light-transmitting sealing layer 104 to the inner edge portion W1 of the sealing cover plate 103 by sealing glue. The sealing glue can include glass melting glue, low-temperature glass solder, epoxy sealing glue or other sealing glue. The sealing glue can coat the side surface of the light-transmitting sealing layer to ensure the reliability of the adhesion of the light-transmitting sealing layer.

[0028] When parallel sealing is performed, the tube shell 101 and the sealing cover plate 103 are heated and expanded, thereby generating a large stress. Under the action of the stress, the wave-shaped structure W3 in the sealing cover plate 103 is equivalent to being extruded by the inner edge portion W1 and the outer edge portion W2, and then the wave-shaped structure W3 is similar to a compression spring and is deformed by contraction, so that the wave-shaped structure W3 can absorb more stress and play a certain buffering role, thereby the stress transmitted to the light-transmitting sealing layer 104 is smaller. Even if the sealing cover plate 103 is heated and expanded to deform towards the light-transmitting sealing layer 104, since the wave-shaped structure W3 can be contracted under the action of the force generated by heating, the deformation amount of the sealing cover plate 103 towards the light-transmitting sealing layer 104 is smaller, and the extrusion of the light-transmitting sealing layer 104 is smaller, thereby reducing the risk of breaking of the light-transmitting sealing layer. Moreover, since the wave-shaped structure can absorb more stress, the limit value of the stress damage of the sealing cover plate can be improved, thereby greatly enhancing the adaptability of the sealing cover plate and the light-transmitting sealing layer to a higher parallel sealing temperature, reducing the requirements for the preparation conditions of the laser, and the requirements for the use environment of the laser are also lower, thereby the application range of the laser can be expanded. After the parallel sealing is completed and the sealing cover plate is no longer heated, the temperature of the tube shell and the sealing cover plate can be lowered, and then the wave-shaped structure in them can recover to the original state (i.e. the shape when not extruded by the inner edge portion W1 and the outer edge portion W2, which is equivalent to the free height of the compression spring).

[0029] In summary, in the laser provided by the embodiment of the present application, the stress generated when the tube shell and the sealing cover plate are heated can cause the wave-shaped structure therein to shrink and deform to a certain extent, so the sealing cover plate can absorb more stress, and the stress conducted from the sealing cover plate to the light-transmitting sealing layer is smaller; and even if the wave-shaped structure expands due to heating, the deformation amount of the wave-shaped structure towards the light-transmitting sealing layer can be ensured to be smaller. In this way, the risk of the light-transmitting sealing layer being broken under the action of the stress generated due to the expansion of the sealing cover plate due to heating can be reduced, and the production yield of the laser can be improved.

[0030] In addition, since the wave-shaped structure has a large unfolding area, the heat generated during the fixing of the sealing cover plate and the tube shell can be absorbed and dissipated by the wave-shaped structure to a larger extent, the heat transferred to the light-transmitting sealing layer can be reduced, the deformation amount of the light-transmitting sealing layer due to expansion caused by heating can be reduced, and the risk of the light-transmitting sealing layer being broken or separated from the sealing cover plate can be reduced.

[0031] In the embodiment of the present application, the light-emitting assembly 102 can include light-emitting chips, a heat sink, and a reflective prism. The heat sink can be arranged on the bottom plate 1011 of the tube shell 101, the light-emitting chips can be arranged on the heat sink, the heat sink is used to assist the light-emitting chips in dissipating heat, and the reflective prism can be located on the light-emitting side of the light-emitting chips. The light emitted by the light-emitting chips can be incident on the reflective prism and then reflected on the reflective prism to be emitted through the light-transmitting sealing layer 104. For example, the plurality of light-emitting chips can all emit light of the same color, or different light-emitting chips in the plurality of light-emitting chips can emit light of different colors, and the embodiment of the present application does not make any limitation. The light emitted by the light-emitting chips can be laser. A large amount of heat is generated when the light-emitting chips are working, and then the heat is transferred to the bottom plate 1011 through the heat sink and conducted to the sealing cover plate 103 through the side wall part 1012 of the tube shell 101. At this time, the effect of the heat on the sealing cover plate is the same as the effect of the heat generated by parallel sealing on the sealing cover plate, and the wave-shaped structure in the sealing cover plate 103 will also deform to a certain extent under the action of the heat to absorb stress. After the light-emitting chips stop working and cool down, the wave-shaped structure can return to its original state to release stress.

[0032] In the embodiment of the present application, the tube shell 101, the sealing cover plate 103, and the light-transmitting sealing layer 104 can constitute a sealed space, so that the light-emitting assembly 102 can be in the sealed space to prevent water and oxygen from corroding the light-emitting assembly 102. Since the risk of the light-transmitting sealing layer 104 being broken is reduced, the sealing effect of the sealed space can be ensured, and the service life of the light-emitting assembly can be prolonged.

[0033] The material of the tube shell in the embodiments of the present application can be copper, such as oxygen-free copper, the material of the light-transmitting sealing layer can be glass, and the material of the sealing cover plate can be stainless steel. Since the thermal expansion coefficient of stainless steel is greater than the thermal expansion coefficient of glass and less than the thermal expansion coefficient of oxygen-free copper, the difference in the thermal expansion coefficient between the various connected components is small, which can appropriately alleviate the stress transmitted to the sealing cover plate and the sealing glass due to the thermal expansion of the oxygen-free copper tube shell, and further improve the preparation yield of the laser.

[0034] It should be noted that the thermal conductivity of copper is relatively large, and the material of the tube shell in the embodiments of the present application is copper, so that the heat generated by the light-emitting assembly arranged on the bottom plate of the tube shell during operation can be quickly conducted through the tube shell, and then quickly dissipated, avoiding damage to the light-emitting assembly caused by heat accumulation. Alternatively, the material of the tube shell can also be one or more of aluminum, aluminum nitride, and silicon carbide. The material of the sealing cover plate in the embodiments of the present application can also be other Kovar materials, such as iron-nickel-cobalt alloy or other alloys. The material of the light-transmitting sealing layer can also be other materials with good light transmission and reliability, such as resin materials and the like.

[0035] In the embodiments of the present application, the light-transmitting sealing layer can be directly fixed with the sealing cover plate, or the laser can further include a support frame, and the light-transmitting sealing layer can be first fixed with the support frame, and then the support frame is fixed with the sealing cover plate. For example, the support frame can be a letter frame, so that the middle region of the light-transmitting sealing layer can be supported by the support frame, thereby improving the setting firmness of the light-transmitting sealing layer. Alternatively, at least one of the surface close to the bottom plate and the surface away from the bottom plate of the light-transmitting sealing layer can also be attached with a brightness enhancement film to improve the light output brightness of the laser.

[0036] In the embodiments of the present application, the wave shape of the wave structure W3 in the sealing cover plate 103 can be wavy or zigzag, that is, the cross section of the wave structure W3 is a wavy line or a zigzag line, and the cross section is perpendicular to the face where the opening of the tube shell 101 is located. If the wave structure is wavy, the wave peaks and wave troughs of the wave structure are in arc shape, so that when the tube shell and the sealing cover plate are thermally expanded, the stress at the wave peaks and wave troughs is not too concentrated, reducing the risk of damage to the sealing cover plate under stress. If the wave structure is zigzag, the wave structure can be more similar to the structure of a compression spring, so that when the tube shell and the sealing cover plate are thermally expanded, the zigzag structure can more easily compress and deform to more easily release stress. Alternatively, the wave shape of the wave structure W3 can have 2-3 wave periods. It should be noted that each wave period in the wave shape of the wave structure can be the same or different, such as the part between the adjacent two wave peaks or wave troughs in the wave shape can be the same or different. The wave shape can have four, five or more wave periods. Alternatively, the wave shape can be a triangular wave, a sawtooth wave, or a sine wave, etc.

[0037] For example, Figure 2 The wave shape is meandering, and the wave shape is a triangular wave. For example, the wave shape has three wave periods. As shown in Figure 2 The wave shape can include three axisymmetric v-shaped substructures connected in sequence, each v-shaped substructure is composed of two plate-shaped structures connected, and the shapes and sizes of the three v-shaped substructures can be completely the same. Alternatively, the plurality of v-shaped substructures can also have the same shape but different sizes, or different shapes, such as different included angles of the two plate-shaped structures that make up different v-shaped substructures.

[0038] Please continue to refer to Figure 2 The wave shape structure W3 of the sealing cover plate 103 is recessed inwardly relative to the outer edge portion W2 and the inner edge portion W1 relative to the shell 101, that is, the distance between the wave shape structure W3 and the bottom plate 1011 is less than the distance between the outer edge portion W2 and the bottom plate 1011, and the distance between the inner edge portion W1 and the bottom plate 1011 is also less than the distance between the outer edge portion W2 and the bottom plate 1011. In the embodiment of the present application, a structure is recessed inwardly relative to another structure relative to the shell 101, that is, the distance between the structure and the bottom plate 1011 is less than the distance between the other structure and the bottom plate 1011; a structure is protruded outwardly relative to another structure relative to the shell 101, that is, the distance between the structure and the bottom plate 1011 is greater than the distance between the other structure and the bottom plate 1011. When the sealing cover plate 103 is placed on the shell 101 using parallel sealing technology to fix the sealing cover plate 103 and the shell 101, a sealing device similar to a roller needs to be rolled on the outer edge portion W2 of the sealing cover plate 103. In the embodiment of the present application, the wave shape structure W3 and the inner edge portion W1 are recessed inwardly relative to the outer edge portion W2 relative to the shell 101, which can avoid the influence of the wave shape structure W3 and the inner edge portion W1 caused by the contact of the sealing device during rolling.

[0039] As shown in Figure 2 The inner edge portion W1 and the outer edge portion W2 of the sealing cover plate 103 can be annular plate-shaped structures with flat surfaces, and the inner edge portion W1 and the outer edge portion W2 can be parallel. The wave shape structure W3 can be flush with the inner edge portion W1, such as the wave peak of the wave shape structure W3 being flush with the inner edge portion W1. Alternatively, the inner edge portion W1 can also be flush with any plane between the wave peak and the wave trough of the wave shape structure W3, and the embodiment of the present application is not limited.

[0040] Please continue to refer to Figure 4The sealing cover plate 103 can further comprise a first connecting portion L1 for connecting the wave structure W3 and the outer edge portion W2, the first connecting portion L1 is a plate structure which can be perpendicular to the inner edge portion W1 and the outer edge portion W2. When the side wall portion 1012 of the tube shell 101 is expanded by heat, the expanded side wall portion 1012 can transmit stress to the wave structure W3 by pressing the first connecting portion L1, and the force applied to the wave structure W3 by the side wall portion 1012 is parallel to the propagation direction of the wave of the wave structure W3, so the wave structure W3 can more easily compress to absorb stress. In this way, there can be a bending structure between the outer edge portion W2 and the wave structure W3, which includes the connecting portion of the outer edge portion W2 and the first connecting portion L1, and the connecting portion of the first connecting portion L1 and the wave structure W3. When the tube shell 101 and the sealing cover plate 103 are expanded by heat, the bending structure can deform in a bending direction to absorb part of the stress, which can further reduce the stress transmitted to the light-transmitting sealing layer 104. Therefore, the existence of the first connecting portion L1 connecting the wave structure W3 and the outer edge portion W2 can improve the stress absorption effect of the sealing cover plate 103. Optionally, the bending portion of the bending structure can have a chamfer or a round corner to avoid too much stress concentration at the bending portion.

[0041] Optionally, the sealing cover plate can also not comprise a plate structure for connecting the wave structure and the outer edge portion, but the wave structure can be directly connected with the outer edge portion, and the wave structure is used to connect the outer edge portion and the inner edge portion. In this case, the included angle between the wave midline of the wave structure and the outer edge portion can be obtuse, and the included angle between the wave midline of the wave structure and the inner edge portion can be acute. In this way, it can be ensured that when the side wall portion of the tube shell is expanded by heat to press the sealing cover plate, the force applied to the sealing cover plate can be decomposed into the propagation direction of the wave of the wave structure, and the component force in this direction can make the wave structure compress like a compression spring to absorb part of the stress.

[0042] In an optional embodiment, the inner edge portion of the sealing cover plate can also be recessed inwardly relative to the wave structure towards the tube shell. Figure 4 is another structure schematic diagram of a laser provided by an embodiment of the present application. As shown in Figure 4 , the wave structure W3 of the sealing cover plate 103 is recessed inwardly relative to the outer edge portion W2 towards the tube shell 101, and the inner edge portion W1 is also recessed inwardly relative to the wave structure W3 towards the tube shell 101. Figure 2 The laser of Figure 2 is only the inner edge portion W1 which is recessed inwardly relative to the wave structure W3 towards the tube shell 101, and the introduction of other parts can be referred to the introduction of Figure 5 , and the present application will not be described here.

[0043] It should be noted that, when fixing the sealing cover plate 103 and the light-transmitting sealing layer 104, the inner edge portion W1 of the sealing cover plate 103 needs to be coated with sealing glue first, and then the light-transmitting sealing layer 104 covers the inner edge portion W1, and the edge of the light-transmitting sealing layer 104 is in close contact with the sealing glue. The inner edge portion W1 is recessed inwardly relative to the wave-shaped structure W3, and the height difference between the wave-shaped structure W3 and the inner edge portion W1 can ensure that the sealing glue is only located at the inner edge portion W1, avoiding the influence of the sealing glue flowing to the wave-shaped structure W3 on the shrinkage deformation effect of the wave-shaped structure W3.

[0044] Alternatively, the wave-shaped structure W3 is recessed inwardly relative to the inner edge portion W1. Alternatively, the wave-shaped structure W3 can be flush with the outer edge portion W2, for example, the highest wave peak in the wave shape of the wave-shaped structure W3 is flush with the outer edge portion W2, and the inner edge portion W1 is recessed inwardly relative to the outer edge portion W2 and the wave-shaped structure W3.

[0045] In another optional embodiment, the wave-shaped structure in the sealing cover plate can include adjacent first and second portions in the direction from the inner edge portion to the outer edge portion, at least one of the first and second portions is in a wave shape, and the first portion is protruded outwardly relative to the second portion and the inner edge portion. In this way, the first and second portions can be recessed inwardly relative to the outer edge portion. Alternatively, the second portion can be recessed inwardly relative to the inner edge portion. Since the first portion is close to the inner edge portion and the first portion is protruded relative to the inner edge portion, when the sealing glue is arranged at the inner edge portion, the height difference between the first portion and the inner edge portion can limit the position of the sealing glue, and block the sealing glue from flowing to other positions. The first and second portions are recessed inwardly relative to the outer edge portion, which can ensure that the first and second portions are far away from the sealing equipment when parallel sealing is performed, avoiding the influence or damage of the sealing equipment on the first and second portions.

[0046] Figure 6 is another structure schematic diagram of a laser provided by an embodiment of the present application, Figure 7 is a structure schematic diagram of a sealing cover plate provided by an embodiment of the present application, Figure 6 is a structure schematic diagram of another sealing cover plate provided by an embodiment of the present application, Figure 7 is Figure 5 is a schematic diagram of the interface b-b' of the sealing cover plate shown in FIG. 8, Figure 6 the laser shown in FIG. 1 includes Figure 7 or Figures 5 to 7 the sealing cover plate 104 shown in FIG. 8. As shown in FIG. 8, Figures 5 to 7As shown, the wave structure W3 in the sealing cover plate 104 includes adjacent first and second portions B1 and B2 along the direction from the inner edge portion W1 to the outer edge portion W2, at least one of the first and second portions B1 and B2 is in a wave shape, and the first portion B1 is convex outward from the tube shell 101 relative to the second portion B2 and the inner edge portion W2.

[0047] Figure 5 For example, the first portion B1 can be in a rectangular structure (or n-shaped structure), and the second portion B2 is in a wave shape. As shown, the first portion B1 includes sequentially connected second, third and fourth connecting portions L2, L3 and L4, and the second and fourth connecting portions L2 and L4 are perpendicular to the third connecting portion L3. The second connecting portion L2 is connected to the inner edge portion W1, and the fourth connecting portion L4 is connected to the second portion B2. The second, third and fourth connecting portions L2, L3 and L4 are all flat annular plate structures, and the third connecting portion L3 can be parallel to the inner edge portion W1. In this way, the sealing cover plate can include more bending structures, such as the connection portions of the second and third connecting portions and the connection portions of the third and fourth connecting portions. When the tube shell and the sealing cover plate are heated and expanded, the bending structures can deform in the bending direction to absorb part of the stress, thereby further improving the stress absorption effect of the sealing cover plate. Alternatively, the included angle between the second and third connecting portions can also be obtuse or acute, the included angle between the fourth and third connecting portions can also be obtuse or acute, and the third connecting portion can also not be parallel to the inner edge portion. The first portion can also be in an arch shape or other shapes, which are not limited by the embodiments of the present application.

[0048] Alternatively, the first portion can be in a wave shape, and the second portion can be flat. For example, the third connecting portion in the first portion is in a wave shape, and the second and fourth connecting portions are flat plate structures. Alternatively, any two of the second, third and fourth connecting portions are in a wave shape, or all of the three connecting portions are in a wave shape. Alternatively, the first and second portions can both be in a wave shape, which are not limited by the embodiments of the present application.

[0049] Alternatively, please continue to refer to Figure 6 and Figure 8 The second portion B2 of the wave structure W3 is concave inward relative to the inner edge portion W1 of the tube shell 101, for example, the wave peak in the second portion B2 is concave inward relative to the inner edge portion W1 of the tube shell 101. In an optional example, the second portion of the wave structure can also be flush with the inner edge portion, for example, the wave peak in the second portion is flush with the inner edge portion. In another optional example, the inner edge portion can also be concave inward relative to the second portion of the wave structure, for example, the inner edge portion is concave inward relative to the wave valley in the second portion.

[0050] In summary, in the laser provided by this application embodiment, the stress generated by the shell and sealing cover when heated can cause a certain degree of shrinkage deformation in the waveform structure. Therefore, the sealing cover can absorb more stress, resulting in less stress transmitted from the sealing cover to the light-transmitting sealing layer. Furthermore, even if the waveform structure expands due to heat, the deformation of the waveform structure towards the light-transmitting sealing layer can be kept small. This reduces the risk of the light-transmitting sealing layer cracking under the stress generated by the thermal expansion of the sealing cover, thereby improving the laser fabrication yield.

[0051] Figure 8 This is a schematic diagram of another laser structure provided in an embodiment of this application. For example... Figure 2 As shown, in Figure 8 Based on this, the laser 10 may further include a collimating lens assembly 105, which is located on the side of the light-transmitting sealing layer 104 away from the housing 101. For example, the edge of the collimating lens assembly 105 may overlap the outer edge portion W2 of the sealing cover plate 103 and be fixed to the outer edge portion W2 by adhesive material. In this way, the collimating lens assembly 105 can be supported by the side wall portion 1012 of the housing 101, ensuring the reliability of the collimating lens assembly 105. Optionally, the collimating lens assembly 105 may also be located between the sealing cover plate 104 and the bottom plate 1011 of the housing 101; this embodiment does not limit the scope of the application.

[0052] The collimating lens group 105 is used to collimate and emit light emitted by the light-emitting components (such as light reflected by the reflecting prism in the light-emitting components). It should be noted that collimating the light is equivalent to converging the light, reducing the divergence angle and making it closer to parallel light. The collimating lens group 105 may include multiple collimating lenses, each corresponding to one of the multiple light-emitting components 102 in the laser. Light emitted from each light-emitting component can be directed to its corresponding collimating lens and then collimated before being emitted.

[0053] For example, such as Figures 2 to 5As shown, the plurality of collimating lenses in the collimating lens group 105 can be integrally formed, and the collimating lens group 105 can have a plurality of convex arcs facing away from the bottom plate 1011 of the tube shell 101, each convex arc can serve as a collimating lens, and thus the collimating lens group can be regarded as including a plurality of collimating lenses. The collimating lens can be a convex lens in the form of a plano-convex lens, and the collimating lens can have a convex arc and a plane, the convex arc and the plane can be two opposite faces, the plane can be parallel to the plate surface of the bottom plate 1011 and disposed close to the bottom plate 1011. Each convex arc of the collimating lens group 105 can be a convex arc of a collimating lens. Alternatively, the radius of curvature of the collimating lens in the collimating lens group in the embodiment of the present application (i.e., the radius of curvature of the convex arc in the collimating lens) can range from 1 mm to 4.5 mm.

[0054] Alternatively, the plurality of light-emitting components in the laser can include a plurality of rows and columns of light-emitting chips arranged in an array on the bottom plate of the tube shell. The distance between adjacent light-emitting chips in a first direction can range from 2 mm to 4 mm, such as 3 mm, and the first direction can be the light-emitting direction of the light-emitting chips. In a second direction perpendicular to the first direction, the distance between adjacent light-emitting chips can range from 3 mm to 6 mm, such as 4 mm.

[0055] Please continue to refer to Figure 8 and ​ The opposite sides of the side wall portion 1012 of the tube shell 101 can have a plurality of openings, and the laser 10 can further include a plurality of conductive pins 106 that can respectively extend into the tube shell 101 through the openings in the side wall portion 1012 and be fixed to the tube shell 101. The conductive pins 106 can be electrically connected to the electrodes of the light-emitting chips in the light-emitting component 102 to transmit an external power supply to the light-emitting chips and thus excite the light-emitting chips to emit light. Alternatively, the aperture of the opening can be 1.2 mm, and the diameter of the conductive pin 106 can be 0.55 mm.

[0056] Optionally, in the assembling of the laser, a ring-shaped solder structure (such as a ring-shaped glass bead) can be placed in the opening on the side wall portion of the tube shell first, and the conductive pin is passed through the solder structure and the opening where the solder structure is located. Then, the side wall portion is placed around the periphery of the bottom plate, and the annular silver-copper solder is placed between the bottom plate and the tube shell. Then, the structure of the bottom plate, the side wall portion and the conductive pin is placed in a high-temperature furnace for sealing sintering. After sealing sintering and solidification, the bottom plate, the side wall portion, the conductive pin and the solder become an integral whole, thereby achieving the air tightness of the opening of the side wall portion. The light-transmitting sealing layer and the sealing cover plate can also be fixed, such as the edge of the light-transmitting sealing layer being pasted to the inner edge of the sealing cover plate to obtain an upper cover assembly. Then, the light-emitting assembly can be welded on the bottom plate in the accommodation space of the tube shell, and then the upper cover assembly is welded on the surface of the side wall portion of the tube shell away from the bottom plate by using parallel sealing welding technology. Finally, the collimating mirror group is fixed on the side of the upper cover assembly away from the bottom plate by using epoxy glue, thereby completing the assembly of the laser. It should be noted that the above assembly process is only an exemplary process provided by the present application, and the welding process used in each step can also be replaced by other processes, and the order of the steps can also be adjusted, which is not limited by the present application.

[0057] It should be noted that the above embodiments of the present application take the bottom plate and the side wall portion of the tube shell as two separate structures that need to be assembled. Alternatively, the bottom plate and the side wall portion can be integrally formed. In this way, the wrinkles of the bottom plate caused by the different thermal expansion coefficients of the bottom plate and the side wall portion during high-temperature welding can be avoided, thereby ensuring the flatness of the bottom plate, the reliability of the setting of the light-emitting assembly on the bottom plate, and the emission of light from the light-emitting chip according to the predetermined light-emitting angle, and improving the light-emitting effect of the laser.

[0058] It should be noted that in the embodiments of the present application, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance. The term "a plurality of" refers to two or more, unless otherwise explicitly limited. "Approximately" means within an acceptable error range, and those skilled in the art can solve the technical problems within a certain error range and basically achieve the technical effects. In the drawings, the sizes of the layers and regions can be exaggerated for clarity of illustration. Moreover, it can be understood that when an element or layer is referred to as "on" another element or layer, it can be directly on the other element, or there can be an intermediate layer. Similar reference numerals refer to similar elements throughout.

[0059] The above description is only an optional embodiment of the present application, and is not used to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A laser, characterized in that, The laser includes: A casing, one side of which is open; Multiple light-emitting components are located in the accommodating space of the tube shell; A sealing cover plate, the sealing cover plate being annular, the sealing cover plate including an inner edge portion and an outer edge portion, and a waveform structure connecting the inner edge portion and the outer edge portion, the waveform of the waveform structure extending from the outer edge portion toward the inner edge portion, the outer edge portion being fixed to the side where the opening of the tube shell is located; A light-transmitting sealing layer, the edge of which is fixed to the inner edge portion by a support frame; the support frame is a U-shaped frame. A collimating lens assembly is located on the side of the light-transmitting sealing layer away from the tube shell, and the edge of the collimating lens assembly overlaps the outer edge portion of the sealing cover plate; The waveform structure includes adjacent first and second portions along the direction from the inner edge portion to the outer edge portion, at least one of the first portion and the second portion being waveform-shaped, and the first portion protruding outward from the shell relative to the second portion and the inner edge portion; The second portion is recessed into the casing relative to the inner edge portion.

2. The laser according to claim 1, characterized in that, The waveform is wavy or zigzag.

3. The laser according to claim 2, characterized in that, The waveform has 2 to 3 wave periods.

4. The laser according to claim 1, characterized in that, The waveform structure and the inner edge portion are recessed into the tube shell relative to the outer edge portion.

5. The laser according to any one of claims 1 to 4, characterized in that, The shell is made of copper, the sealing cover is made of stainless steel, and the light-transmitting sealing layer is made of glass.

6. The laser according to any one of claims 1 to 4, characterized in that, The outer edge portion is fixed to the side where the opening of the tube shell is located by parallel sealing welding technology.

7. The laser according to any one of claims 1 to 4, characterized in that, The sealing cover is a sheet metal part.

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