A high-performance power control board

Abstract

The present invention relates to the technical field of electronic appliances, and specifically relates to a high-performance power control board, which includes a power control board and a power control board connector. The power control board connector is fixedly installed on the side of the power control board. The present invention maintains continuous production, improves uniformity, uses a thin copper layer for conduction, and refers to the conventional graphic electroplating processing method. The thickness uniformity of the plated area is relatively good, and the copper thickness difference can be controlled within 10 μm, thereby ensuring the continuity of transmission in the thick copper area. It can be processed simultaneously with regular orders to improve production efficiency. When electroplating the entire board for conduction, the current transmission is uniform, which helps to improve the copper plating uniformity. According to the local thick copper characteristics of the product, a wet film is used to fill the step gaps, increasing the protection ability. The outer edge of the power control board can be quickly docked with the docked power control board regardless of its shape, with high efficiency, fast speed, and reduced splicing difficulty.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic appliances, and particularly to a high-performance power control board. Background Art

[0002] Conventional power boards generally need to be made of thick copper, and common thick copper productions are buried copper blocks or thick copper foils. The buried copper block method is only applicable to power boards with relatively simple graphics, and the method of using all thick copper foils cannot achieve signal transmission control. For printed boards with signal requirements and thick copper current-carrying requirements at the same time, thin copper needs to be used for the control module circuit to ensure signal stability. At the same time, local copper thickness needs to be increased to ensure the current-carrying capacity of the printed board.

[0003] The commonly used method in the industry is processing by electroplating lead wires:

[0004] 1) Low electroplating efficiency: The current is conducted to the electroplated area through the process wire. If the current density is too large, the wire will burn out; if the current density is small, the electroplating time will be long and the efficiency will be low.

[0005] 2) Uneven copper plating thickness: Due to the inconsistent sizes of the electroplated areas, the current density distribution in the electroplated areas conducted by the wires is uneven, resulting in uneven copper thickness after electroplating and a risk of insufficient local thickness.

[0006] Moreover, the splicing operation between existing power control boards is slow, the assembly efficiency is low, and there are high requirements for the shape of the power control board. If the power control board is of an irregular shape, the splicing difficulty will be greater. At the same time, the splicing connection device can only perform planar docking between power control boards, and the operation of non-planar docking is difficult. Summary of the Invention

[0007] The purpose of the present invention is to provide a high-performance power control board to solve the problems of low electroplating efficiency, uneven copper plating thickness, difficult splicing of power control boards, and difficult non-planar splicing mentioned in the above background art.

[0008] To achieve the above purpose, the present invention provides the following technical solutions:

[0009] A high-performance power control board includes a power control board and a power control board connector, and the power control board connector is fixedly installed on the side of the power control board.

[0010] As a further description of the above technical solution:

[0011] The power control board includes a substrate, a bottom copper layer, a solder mask wet film layer, a dry film layer, and a thick copper layer. The bottom copper layer is provided on the substrate, the solder mask wet film layer is coated on the bottom copper layer, the dry film layer is laminated on the solder mask wet film layer, and the thick copper layer is provided on the bottom copper layer.

[0012] As a further description of the above technical solution:

[0013] The power control board connector includes upper rubber clip strips, a clamping cavity, clamping grooves, upper bottom strips, glue filling grooves, glue permeation holes, sealing partition strips, partition grooves and decorative stickers. The upper rubber clip strips are symmetrically arranged. Lower rubber clip strips are symmetrically arranged below the upper rubber clip strips. A clamping cavity is formed between the upper rubber clip strip and the lower rubber clip strip on the same side. The inner sides of the upper rubber clip strip and the lower rubber clip strip are concave to form clamping grooves. The inner side of the upper rubber clip strip is bent to form an upper bottom strip. The inner side of the lower rubber clip strip is bent to form a lower bottom strip. The outer sides of the upper rubber clip strip and the lower rubber clip strip are respectively joined to form glue filling grooves. Glue permeation holes are intermittently perforated through the upper bottom strip and the lower bottom strip. The glue permeation holes communicate with the clamping cavity. The upper glue permeation holes and the lower glue permeation holes are coaxially communicated. The inner edges of the two lower bottom strips are integrally connected. The inner edge of the upper bottom strip is integrally connected to the lower bottom strip through a sealing partition strip. A partition groove is formed between the two sealing partition strips. Decorative stickers are fixedly installed by pasting on the outer sides of the upper rubber clip strip and the lower rubber clip strip.

[0014] As a further description of the above technical solution:

[0015] A limiting clamping strip is formed by the outward protrusion of the outer edge of the power control board. The limiting clamping strip is fitted and installed with the clamping groove.

[0016] As a further description of the above technical solution:

[0017] The outer side of the connection part of the lower bottom strip is cut to form a serrated groove.

[0018] As a further description of the above technical solution:

[0019] The dry film layer is double-layer laminated.

[0020] As a further description of the above technical solution:

[0021] The substrate is 0.2mm, 70 / 70μm and 0.1mm, 105 / 105μm.

[0022] As a further description of the above technical solution:

[0023] The thick copper layer is electroplated with a small current (0.8 - 1.0 ASD) for a long time.

[0024] Compared with the prior art, the present invention provides a high-performance power control board, having the following beneficial effects:

[0025] 1. In the present invention, by changing the original electroplating lead processing method to the pattern electroplating method, the processing efficiency and uniformity of product electroplating are greatly improved. The processing efficiency is increased. For the processing of conventional products, it is not necessary to separately set the electroplating parameter values and electroplating time, and multiple products can be processed simultaneously without affecting the equipment utilization rate of the process, maintaining continuous production. The uniformity is improved. Conductivity is achieved using a thin copper layer with a bottom copper layer. Referring to the conventional pattern electroplating processing method, the thickness uniformity of the plated area is good, and the copper thickness difference can be controlled within 10 μm, thus ensuring the continuity of transmission in the thick copper area.

[0026] 2. In the present invention, for the protection of the anti-corrosion layer in pattern electroplating processing, considering that only dry film protection may cause floating problems during long-term electroplating, wet film protection is added to improve the protection ability and reduce the risk of infiltration plating. Referring to the conventional pattern electroplating parameter setting method for the board, it can be processed simultaneously with conventional orders to improve production efficiency. During the electroplating of the entire board with conductivity, the current transmission is uniform, which helps to improve the copper plating uniformity. According to the local thick copper characteristics of the product, wet film is used to fill the step gaps, increasing the protection ability.

[0027] 3. In the present invention, between the power control boards, they are butt-joined and fixed through power control board connectors. The connection state between the power control boards can be adjusted, increasing the flexibility of assembly and fixation. By designing a clamping cavity in the power control board connector and a limiting clamping strip on the edge of the power control board, the power control board and the power control board connector can be quickly spliced. On this basis, through the filling of the glue in the glue filling groove, further fixation between the power control board and the power control board connector is achieved. The outer edge of the power control board can be of any shape and can be quickly docked with the butt-jointed power control board, with high efficiency, fast speed, and reduced splicing difficulty. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the butt-joint structure of the power control board of the present invention;

[0029] Figure 2 It is a schematic diagram of the structure of the power control board connector of the present invention;

[0030] Figure 3 For the present invention Figure 2 The enlarged structure schematic diagram of A in it;

[0031] Figure 4 It is a schematic diagram of the partial cross-sectional structure of the power control board of the present invention;

[0032] Figure 5 It is a schematic diagram of the structure of the power control board connector for clamping the power control board with an irregular shape of the present invention.

[0033] LEGEND DESCRIPTION:

[0034] 1. Power control board; 101. Substrate; 102. Bottom copper; 103. Solder mask wet film layer; 104. Dry film layer; 105. Thick copper layer; 2. Power control board connector; 201. Upper rubber clip strip; 202. Lower rubber clip strip; 203. Clamping cavity; 204. Card slot; 205. Upper bottom strip; 206. Lower bottom strip; 207. Glue filling groove; 208. Glue permeation hole; 209. Sealing partition strip; 2010. Partition groove; 2011. Decorative sticker; 2012. Serrated groove; 3. Limit card strip. Detailed implementation mode

[0035] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0036] Embodiment:

[0037] Please refer to Figures 1-5 , the present invention provides a high-performance power control board, including a power control board 1 and a power control board connector 2, and the power control board connector 2 is fixedly installed on the side of the power control board 1.

[0038] Specifically, as Figure 4 shown, the power control board 1 includes a substrate 101, a bottom copper 102, a solder mask wet film layer 103, a dry film layer 104 and a thick copper layer 105. The bottom copper 102 is arranged on the substrate 101, the solder mask wet film layer 103 is coated on the bottom copper 102, the dry film layer 104 is pressed on the solder mask wet film layer 103, and the thick copper layer 105 is arranged on the bottom copper 102. Through hierarchical processing, the continuity of transmission is ensured, the protection ability is improved, and the risk of infiltration plating is reduced.

[0039] Specifically, as Figure 1 , Figure 2 and Figure 3As shown in the figure, the power control board connector 2 includes an upper rubber clip strip 201, a clamping cavity 203, a card slot 204, an upper bottom strip 205, a glue filling groove 207, a glue permeating hole 208, a sealing partition strip 209, a partition groove 2010 and a decorative sticker 2011. The upper rubber clip strips 201 are symmetrically arranged. Lower rubber clip strips 202 are symmetrically arranged below the upper rubber clip strips 201. A clamping cavity 203 is formed between the upper rubber clip strip 201 and the lower rubber clip strip 202 on the same side. The inner sides of the upper rubber clip strip 201 and the lower rubber clip strip 202 are concave to form a card slot 204. The inner side of the upper rubber clip strip 201 is bent to form an upper bottom strip 205. The inner side of the lower rubber clip strip 202 is bent to form a lower bottom strip 206. The outer sides of the upper rubber clip strip 201 and the lower rubber clip strip 202 are respectively joined to form a glue filling groove 207. Glue permeating holes 208 are intermittently and penetratingly formed on the upper bottom strip 205 and the lower bottom strip 206. The glue permeating holes 208 communicate with the clamping cavity 203. The upper glue permeating holes 208 and the lower glue permeating holes 208 are coaxially communicated. The inner edges of the two lower bottom strips 206 are integrally connected. The inner edge of the upper bottom strip 205 is integrally connected to the lower bottom strip 206 through a sealing partition strip 209. A partition groove 2010 is formed between the two sealing partition strips 209. The decorative sticker 2011 is fixedly installed by pasting on the outer sides of the upper rubber clip strip 201 and the lower rubber clip strip 202. It is easy to be clamped, easy to fill with glue liquid, and the splicing speed is fast.

[0040] Specifically, as Figure 1 shown in the figure, a limiting card strip 3 is formed by the outward protrusion of the outer edge of the power control board 1. The limiting card strip 3 is fitted and installed with the card slot 204, which fits with each other and prevents falling off.

[0041] Specifically, as Figure 3 shown in the figure, a sawtooth groove 2012 is formed by cutting on the outer side of the joint of the lower bottom strip 206, and the power control board connector 2 is easy to bend.

[0042] Specifically, as Figure 4 shown in the figure, the dry film layer 104 is double-layer laminated, and the performance is better.

[0043] Specifically, as Figure 4 shown in the figure, the substrate 101 is 0.2mm, 70 / 70μm and 0.1mm, 105 / 105μm, which is convenient for processing on the substrate 101.

[0044] Specifically, as Figure 4 shown in the figure, the thick copper layer 105 is electroplated with a small current (0.8 - 1.0 ASD) for a long time to prevent copper surface particles from being generated due to too large current density.

[0045] Working principle:

[0046] According to the specific shape of the power control board 1, the power control board connector 2 is pressed and fixed along the edge of the power control board 1, so that the limit card strip 3 on the edge of the power control board 1 fits into the card slot 204. After the power control board 1 is fixed, the power control board connector 2 can be used to clip and dock other power control boards 1 on the outside of the power control board 1. After installation, the adhesive is filled in the glue filling grooves 207 on the front and back of the power control board connector 2. The glue flows along the curved surfaces of the upper rubber clamp strip 201 and the lower rubber clamp strip 202 from the upper bottom strip. The glue holes 205 and the lower bottom strip 206 enter the clamping cavity 203, and the glue liquid adheres and fixes the power control board 1 clamped on the power control board connector 2. With the help of the sawtooth groove 2012, the external power control board 1 connected to the straight edge of the internal power control board 1 can be bent, so that the connected power control board 1 can be in different installation states, increasing the flexibility of assembly and fixation. The decorative sticker 211 has a protective effect on the upper rubber clamp 201 and the lower rubber clamp 202, and at the same time increases the aesthetics of the power control board connector 2 after installation;

[0047] The substrate 101 is manufactured according to the following method;

[0048] Inner layer cutting: the overall size of substrate 101 is 0.2mm, 70 / 70μm and 0.1mm, 105 / 105μm;

[0049] Inner layer graphics: produce inner layer signal conductors and current-carrying copper, inner layer conductor width accuracy tolerance ≤±10%;

[0050] Lamination: Press a single inner core board into a multilayer board. 1) Resin filling: The inner layer copper thickness includes 70μm and 105μm. To ensure the complete circuit filling, the thickness of the cream layer after the resin-filled conductor is calculated to be ≥10μm; 2) Interlayer deviation: Due to the high thickness of the filled conductor copper, the number of prepregs used between the layers is large. When laminating the laminate, the number of laminates must be controlled to be ≤4 layers. At the same time, check the concentric circles of the board edge after lamination for inspection;

[0051] Drilling: The total thickness of the inner copper layer of the multilayer board is 16oz. The tool wear is more serious during mechanical drilling than that of conventional boards. The drilling parameters need to be optimized, mainly reducing the rotation speed, feed speed and tool life. 1) Reduce the rotation speed and feed speed: mainly reduce the cutting amount during the drilling process. If the cutting amount is reduced, the reaction force on the drill needle will be smaller and it is not easy to break the needle. 2) Reduce the life: ensure the cutting ability of the tool and ensure the quality of the hole wall.

[0052] Electroplating: hole wall metallization, while increasing the conductor copper thickness; 1) The thin copper area is 2oz thick copper, so the electroplating process is designed according to the surface copper ≥ 78μm, and the hole wall copper meets the military product hole copper requirement of ≥ 25μm; 2) When it comes to the crimping aperture of the thin copper and thick copper areas, the aperture compensation of the thick copper area is designed to be 0.1mm larger than the overall thin copper area;

[0053] The bottom copper 102 is fabricated on the substrate 101. Specifically, the bottom copper 102 is a 2 oz thick copper overall. In the electroplating process, the surface copper is designed to be ≥78 μm, and the copper on the hole wall meets the military product requirement of ≥25 μm. Regarding the press-fitting hole diameters in the thin copper and thick copper areas, the aperture compensation in the thick copper area is designed to be 0.1 mm larger than that in the thin copper area overall. 1) Outer layer graphic data compensation: The thick copper and thin copper are etched simultaneously. The lead compensation in the thin copper area preferably refers to the thick copper rule for compensation. At the same time, a 50 μm compensation value needs to be added for isolated lines to avoid excessive etching caused by a large flow rate of the chemical solution. 2) Wet film resist layer: The thick copper and thin copper areas are dispersed from each other. When using a dry film for processing, gaps will appear at the copper thickness step positions. During acid etching processing, the penetration of the chemical solution will cause the holes to be copper-free. To ensure cross-section filling, wet film printing needs to be used for protection, and only the silk screen printing method can be used to increase the wet film thickness of the thin copper and reduce the film thickness of the thick copper. 3) Dry film resist layer: Since the wet film cannot protect the metallized holes, a dry film is also needed to protect the holes at the same time. Due to the presence of steps, a 75 μm dry film needs to be selected for the dry film. After laminating the film, air pressing processing is required, and after checking for no bubbles, etching is carried out;

[0054] The etching is acid etching. The acid etching line speed is calculated based on the thickness of the etched bottom copper 102. The etched bottom copper 102 is 150 - 160 μm, and it is etched at the median value of 155 μm. The line speed is calculated to be 500 - 550 mm / min to produce the first piece;

[0055] The solder mask wet film layer 103 is fabricated on the bottom copper 102. Specifically, the solder mask pattern is made according to the requirements of the device pad openings. 1) Low-pressure spraying processing: Since there are different copper thicknesses of 2OZ and 4OZ dispersed in the board, when only the silk screen printing method is used for processing, a large number of bubbles will exist in the 4 oz thick copper area at the edge of the copper conductor, and eventually, straw-shaped gaps may be formed, resulting in insufficient insulation. During the first processing, low-pressure spraying is used for production to avoid the generation of bottom bubbles. The principle of low-pressure spraying processing: Low-pressure spraying is a processing method that uses atomized ink to naturally settle and adsorb. The atomized ink particles are small and will not generate ink bubbles during adsorption. 2) Solder mask exposure 1: During the first exposure processing, to fill the substrate position between the conductors, the copper conductors at the thick copper and thin copper positions need to be opened. The opening size is 3 mil (75 μm) inward from the edge of the conductor copper to avoid the sidewall solder mask being too thin caused by the ink flowing down during the second solder mask processing. 3) Second solder mask: The solder mask is processed by low-pressure spraying. The wet film thickness is designed according to the parameters of 70 - 80 μm (the ink thickness after curing is about 35 μm), and the normal data is used for the solder mask exposure;

[0056] The dry film layer 104 is fabricated on the basis of the solder mask wet film layer 103. Specifically, for the dry film layer 104: 1) Low-pressure spraying process: In the first processing, low-pressure spraying is used to avoid the generation of bottom bubbles. After the dry film is soaked in the graphic electroplating for a long time, due to the attack of the acidic solution on the copper surface, the bottom dry film will float away. Especially in the position of the small-pitch dry film, abnormal film flinging may occur, resulting in anti-plating on the thick copper surface. It is necessary to print the solder mask wet film at the bottom, requiring all device holes to be open-windowed, with an overall size 100μm larger than the drilling aperture. The principle of the low-pressure spraying process: Low-pressure spraying is processed by the natural sedimentation adsorption method of atomized ink. The atomized ink particles are small and will not generate ink bubbles during adsorption. 2) Solder mask exposure: During the first exposure processing, the substrate position between the conductors is filled. 3) Secondary solder mask: To ensure the completion of the solder mask layer thickness, secondary solder mask needs to be fabricated. Since the common dry film thickness is 50μm, an additional plating of 70μm is required in the thick copper position. If the electroplated copper thickness exceeds the dry film thickness, film clamping problems will occur in the small-pitch position. After the first outer layer pattern is completed, the film is re-pressed and exposed. The designed dry film thickness is ≥90μm (the dry film becomes thinner under pressure during the film pressing process);

[0057] The thick copper layer 105 is fabricated on the basis of the bottom copper 102. The fabrication of the thick copper layer 105 refers to the requirements of the electroplating area and current parameters in graphic electroplating. Since excessive current density will generate copper surface particles, small current (0.8 - 1.0 ASD) is used for electroplating for a long time. The copper thickness of the graphic electroplating is inspected for the thick copper thickness value and the size of the crimping aperture in the thick copper area.

[0058] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-performance power control board, comprising a power control board (1) and a power control board connector (2), the power control board connector (2) being fixedly installed on the side of the power control board (1), characterized in that: The power control board connector (2) includes an upper rubber clip strip (201), a clamping cavity (203), a card slot (204), an upper bottom strip (205), a glue filling groove (207), a glue permeating hole (208), a sealing partition strip (209), a partition groove (2010), and a decorative sticker (2011). The upper rubber clip strips (201) are symmetrically arranged. Below the upper rubber clip strips (201), lower rubber clip strips (202) are symmetrically arranged. A clamping cavity (203) is formed between the upper rubber clip strip (201) and the lower rubber clip strip (202) on the same side. The inner sides of the upper rubber clip strip (201) and the lower rubber clip strip (202) are concave to form a card slot (204). The inner side of the upper rubber clip strip (201) is bent to form an upper bottom strip (205). The inner side of the lower rubber clip strip (202) is bent to form a lower bottom strip (206). The outer sides of the upper rubber clip strip (201) and the lower rubber clip strip (202) are respectively joined to form a glue filling groove (207). Glue permeating holes (208) are intermittently and penetratingly formed on the upper bottom strip (205) and the lower bottom strip (206). The glue permeating holes (208) are communicated with the clamping cavity (203). The upper glue permeating holes (208) and the lower glue permeating holes (208) are coaxially communicated. The inner edges of the two lower bottom strips (206) are integrally connected. The inner edge of the upper bottom strip (205) is integrally connected to the lower bottom strip (206) through a sealing partition strip (209). A partition groove (2010) is formed between the two sealing partition strips (209). Decorative stickers (2011) are fixedly installed by pasting on the outer sides of the upper rubber clip strip (201) and the lower rubber clip strip (202). The outer side of the joint of the lower bottom strip (206) is cut to form a serrated groove (2012).

2. The high-performance power control board according to claim 1, characterized in that: The power control board (1) includes a substrate (101), a bottom copper layer (102), a solder resist wet film layer (103), a dry film layer (104), and a thick copper layer (105). The bottom copper layer (102) is arranged on the substrate (101). The solder resist wet film layer (103) is coated on the bottom copper layer (102). The dry film layer (104) is pressed on the solder resist wet film layer (103). The thick copper layer (105) is arranged on the bottom copper layer (102).

3. The high-performance power control board according to claim 1, characterized in that: A limiting card strip (3) protrudes from the outer edge of the power control board (1). The limiting card strip (3) is fitted and installed with the card slot (204).

4. The high-performance power control board according to claim 2, characterized in that: The dry film layer (104) is double-layer pressed.

5. The high-performance power control board according to claim 2, characterized in that: The substrate (101) is 0.2mm, 70 / 70μm and 0.1mm, 105 / 105μm.

6. The high-performance power control board according to claim 2, characterized in that: The thick copper layer (105) is electroplated with a small current (0.8 - 1.0 ASD) for a long time.

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