System and method for evaporating OLED layer stacks in a vertical orientation

Abstract

A vacuum orientation module for a substrate processing system is described. The module comprises at least a first vacuum orientation chamber, including: a vacuum chamber; a first transport track, the first transport track being inside the vacuum chamber, the first transport track having a first support structure and a first drive structure and defining a transport direction; an orientation actuator, the orientation actuator changing the substrate orientation between a non-vertical orientation and a non-horizontal orientation, the vacuum chamber having a first pair of two slit openings, in particular substantially vertical slit openings, at opposite side walls of the vacuum chamber in the transport direction; and a second transport track, the second transport track being inside the vacuum chamber, the second transport track having a second support structure and a second drive structure extending along the transport direction, the vacuum chamber having a second pair of two slit openings at the opposite side walls of the vacuum chamber.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to an in-line substrate processing system. In addition, embodiments of the present disclosure relate to a system and method for evaporating an OLED layer stack in a vertical orientation, and in particular, to a system and method for evaporating a monochrome OLED layer stack (such as a white OLED layer stack) in a vertical orientation. Embodiments of the present disclosure relate in particular to a substrate processing system for processing multiple substrates (such as a substrate processing system for processing multiple large-area substrates in a substantially vertical orientation), a method for processing substrates in an in-line substrate processing system, a vacuum orientation module for a substrate processing system, a method for transporting a large-area substrate in a substrate processing system, and a method for manufacturing a layer stack of a display on a large-area substrate.

[0002] background

[0003] Organic light emitting diodes (OLEDs) are a special type of light emitting diode in which the emitting layer includes a thin film of certain organic compounds. OLEDs are used to make television screens, computer monitors, mobile phones, other handheld devices, etc. for displaying information. OLEDs can also be used for general space lighting. Because OLED materials emit light directly, OLED displays have a greater range of colors and brightness than traditional LCD displays. OLED displays consume significantly less energy than traditional LCD displays.

[0004] In addition, the fact that OLEDs can be manufactured on flexible substrates creates further applications. An OLED display may include, for example, a layer of organic material between two electrodes, such as electrodes from a metallic material. The OLED is typically placed between two glass panels, and the edges of the glass panels are sealed to encapsulate the OLED therein. Alternatively, the OLED may be encapsulated using thin film technology, such as a barrier film.

[0005] The process of manufacturing an OLED display includes thermal evaporation of organic materials in a high vacuum and deposition of the organic materials on a substrate. It is beneficial to supplement the process with the use of a mask to prevent areas of the substrate from being coated during deposition and / or patterning the organic layer onto the substrate. In this context, the mask is held close to the substrate during deposition of the organic layer, and the substrate is typically arranged behind and aligned relative to the mask during deposition.

[0006] FIG. 1 depicts an exemplary system 10 for producing an organic display that can be used according to an industry standard horizontal inline processing system. A substrate, such as a glass substrate used in the display industry, is processed in a horizontal orientation and enters the system 10 in a convex portion with the site to be processed facing upward. In the flip chamber 12, the substrate is rotated 180° so that the surface of the substrate to be processed faces downward. The substrate is transferred to one of a plurality of alignment chambers 16 by a transfer module, wherein a mask for masking one or more organic deposition processes is disposed above the substrate. In the acceleration module 18, the horizontally oriented substrate is accelerated to move through a plurality of organic deposition chambers 22, wherein an organic layer is deposited from below the substrate. After the deceleration module 23, the mask is separated in one of a plurality of separation chambers 26. The mask aligned on the substrate in the alignment chamber 16 and separated from the substrate in the separation chamber 26 is transferred on the mask return path 72, typically under atmospheric conditions. A load lock chamber may be disposed at the start and end of the mask return path 72.

[0007] The substrate having an organic layer processed in the above-mentioned organic module is transferred to the metal module in the transfer module 32. The metal module includes an alignment chamber 42, an acceleration module 44, a metal deposition chamber 46, a deceleration module 47 and a separation chamber 49. The substrate handling in the metal module corresponds to the above-mentioned organic module. After processing the substrate, the substrate can be rotated 180° in the second another chamber 62 and transferred out of the system 10 with the transfer module 66. Similar to the organic module, the metal module also includes a mask return path 72. Furthermore, the carrier supporting the substrate during substrate processing can be returned to the front end of the system 10 on the carrier return path 74, typically under atmospheric conditions.

[0008] The length 50 of the system 10 is determined, among other factors, by the number of organic deposition chambers and the number of metal deposition chambers, wherein the system architecture for a deposition process with multiple organic layers below multiple metal layers in combination with the reuse of masks for organic processes and different masks for metal processes and the reuse of carriers results in a substantially linear arrangement. Furthermore, the width 90 of the system is determined, among other factors, by the horizontal substrate orientation, the mask return path, and the carrier return path.

[0009] In view of the trend towards larger substrate sizes in display manufacturing, it would be beneficial to provide improved systems and improved methods for depositing an organic layer stack, and in particular for depositing an organic layer stack and a metal layer stack over the organic layer stack.

[0010] Overview

[0011] In view of the above, a vacuum orientation module for a substrate processing system, a substrate processing system for processing a plurality of substrates, a method for transporting a large area substrate in a substrate processing system, and a method for manufacturing a layer stack for a display on a large area substrate are provided. Further aspects, embodiments, features and details may be derived from the dependent claims, the drawings and the description.

[0012] According to one aspect, a vacuum orientation module for a substrate processing system is provided. The module comprises: at least a first vacuum orientation chamber, comprising: a vacuum chamber; a first transport track, the first transport track is in the vacuum chamber, the first transport track has a first support structure and a first drive structure and defines a transport direction; an orientation actuator, the orientation actuator is used to change the substrate orientation between a non-vertical orientation and a non-horizontal orientation, the vacuum chamber has a first pair of two slit openings, in particular substantially vertical slit openings, at opposite side walls of the vacuum chamber in the transport direction; and a second transport track, the second transport track is in the vacuum chamber, the second transport track has a second support structure and a second drive structure extending along the transport direction, the vacuum chamber has a second pair of two slit openings at the opposite side walls of the vacuum chamber. For example, the transport direction can be a bidirectional transport direction, i.e., transport can be provided in two opposite directions in the first vacuum orientation chamber.

[0013] According to one aspect, a substrate processing system for processing a plurality of substrates is provided. The system comprises: a first deposition module, the first deposition module being a first inline module and having a first plurality of vacuum deposition sources; a second deposition module, the second deposition module being a second inline module and having a second plurality of vacuum deposition sources; and a glass handling module, the glass handling module being between the first deposition module and the second deposition module, the glass handling module comprising a vacuum orientation module according to any of the embodiments described herein.

[0014] According to one aspect, a method for transporting a large-area substrate in a substrate processing system is provided. The method comprises: moving the large-area substrate on a first transport track of a vacuum orientation module to a first deposition module; transporting the large-area substrate on a second transport track from the first deposition module through the vacuum orientation module toward a second deposition module; and moving the large-area substrate on the first transport track from the second deposition module to the vacuum orientation module.

[0015] According to one aspect, a method for manufacturing a layer stack for a display on a large area substrate is provided. The method comprises: a method for transporting a large area substrate according to any one of the embodiments described herein; and depositing one or more layers of the layer stack on the large area substrate.

[0016] BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to understand the above-mentioned features of the present disclosure in detail, a more particular description of the present disclosure briefly summarized above may be obtained by reference to the embodiments. The accompanying drawings relate to the embodiments and are described as follows:

[0018] FIG1 shows a schematic top view of an industry standard horizontal inline evaporation system according to the prior art;

[0019] Figure 2 shows a schematic top view of a vertical processing system according to an embodiment of the present disclosure;

[0020] Figure 3 shows a schematic top view of another vertical processing system according to an embodiment of the present disclosure;

[0021] Figure 4 shows a flow chart illustrating a method of manufacturing an organic layer stack according to embodiments described herein;

[0022] Figure 5 A schematic diagram showing a mask handling module for an inline substrate processing system according to embodiments described herein;

[0023] Fig. 6A and Figure 6B shows a schematic cross-sectional side view of a mask handling module for an inline substrate processing system according to embodiments described herein; and

[0024] Fig. 7A and Figure 7B A flow chart illustrating a method of transporting a substrate, such as a large area substrate, in a substrate processing system is shown according to embodiments described herein.

[0025] Detailed description of implementation method

[0026] Reference will now be made in detail to various embodiments, one or more examples of which are illustrated in the drawings. In the following description of the drawings, the same reference numerals refer to the same parts. Generally speaking, only the differences relative to a single embodiment are described. Each example is provided in an illustrative manner and is not intended to be a limitation of the present disclosure. In addition, the features illustrated or described as part of an embodiment may be used on other embodiments or in combination with other embodiments to produce yet another embodiment. The specification is intended to include such modifications and variations.

[0027] The process of manufacturing an OLED display may include thermally evaporating an organic material in a high vacuum and depositing the organic material on a substrate. Depending on the display technology, a mask may be provided to pattern the organic layer onto the substrate during deposition. For example, the mask may be an edge exclusion mask that masks the parameters of a glass substrate (such as a rectangular glass substrate) (e.g., with an edge of several millimeters). The edge exclusion mask may be used to manufacture a monochrome OLED layer stack, such as a white layer stack. Other processes may utilize a pattern mask, such as a fine metal mask (FFM), wherein the mask provides a pixel pattern for display pixels on the substrate. For example, this may be used for RGB display manufacturing. Accordingly, the OLED display manufacturing process utilizing a mask may be complicated, for example, due to the need to complete additional processes in order to transfer the mask. In addition, particle generation and contamination are important because particle generation and contamination may damage the OLED display manufacturing system and the resulting device. Similar considerations apply to the carrier of the substrate. In addition to particle generation and contamination considerations, that is, in combination with particle and contamination considerations, it is also beneficial to reduce the footprint of the substrate processing system, especially for display manufacturing on large area substrates.

[0028] Embodiments of the present disclosure allow for a significant reduction in the footprint of a substrate processing system for manufacturing an organic layer stack, and in particular for manufacturing an organic layer stack and a metal layer stack above the organic layer stack. In addition, masks and carriers for substrates are maintained under vacuum conditions during normal operation.

[0029] Figure 2 A substrate processing system 100 is shown. Figure 2 The illustrated substrate processing system 100 includes an organic deposition module 130 and a metal deposition module 160. The glass handling module 110 is disposed between the organic deposition module 130 and the metal deposition module 160. The first mask handling module 120 is disposed between the glass handling module 110 and the organic deposition module 130. The second mask handling module 150 is disposed between the glass handling module 110 and the metal deposition module 160. In addition, a first rotation module 140 (e.g., a vacuum rotation module 140) is disposed at one end of the organic deposition module 130 away from the first mask handling module 120. The second rotation module 170 is disposed at one end of the metal deposition module away from the second mask handling module 150.

[0030] In view of the above arrangement, the substrate to be processed in the substrate processing system 100 is loaded at the glass handling module (e.g., the substrate is loaded on a substrate carrier), and the substrate is unloaded at the glass handling module 110 (e.g., the substrate is unloaded from the substrate carrier). Accordingly, an empty carrier is provided at the same position after unloading the process substrate, at which position a new substrate will be loaded on the empty carrier. Therefore, transporting an empty carrier, for example, on a carrier return path can be avoided or minimized. In addition, exposure of the carrier to atmospheric conditions can be avoided or minimized.

[0031] In addition, the first rotation module 140 and the second rotation module 170 allow the organic deposition path and the metal deposition path to be "folded", respectively. As exemplarily described with respect to the organic deposition module 130, the organic deposition module includes a forward transport path 131 for depositing a first set of organic layers on a substrate and a backward transport path 133 for depositing a second set of organic layers above the first set of organic layers. The substrate is rotated between the forward transport path 131 and the backward transport path 133 by the first rotation module 140. By "folding" the organic deposition path, the length 124 of the organic deposition module can be reduced, for example, by about 50%.

[0032] This arrangement provides another advantage in combination with the advantage of reducing the length 124 of the organic deposition module and thus reducing the occupied area of ​​the substrate processing system 100 in the length direction. The first mask handling module 120 is arranged at the starting point of the organic deposition path and (simultaneously) at the end point of the organic deposition path. Accordingly, the mask that has previously been used for the deposition process is removed from the processed substrate in the first mask handling module 120, and the mask can be positioned on a new substrate to be processed in the first mask handling module 120. Accordingly, as described below, after the mask is separated from the substrate at the same position or substantially the same position where the mask is attached to the substrate, a used mask is provided. Therefore, the transportation of the mask, for example on the mask return path, can be avoided or minimized. In addition, exposure of the mask to atmospheric conditions can be avoided or minimized.

[0033] According to yet other embodiments that can be combined with other embodiments described herein, the metal deposition module includes a forward transport path 163 for depositing a first set of metal layers on a substrate and a rearward transport path 161 for depositing a second set of metal layers above the first set of metal layers. The substrate is rotated between the forward transport path and the rearward transport path by a second rotation module 170. By "folding" the metal deposition path, the length 148 of the metal deposition module can be reduced, for example, by about 50%.

[0034] According to yet further features, details, aspects, and implementations of the embodiments described herein that may be combined with other embodiments described herein, the glass handling module 110 includes a vacuum orientation module 114 configured to change the substrate orientation from a non-vertical orientation (e.g., a horizontal orientation) to a non-horizontal orientation (e.g., a substantially vertical orientation). Accordingly, the substrate can be processed and / or transported through the substrate processing system 100 in a substantially vertical orientation. Thus, the footprint can be further reduced compared to industry standard horizontal inline processing systems. The glass handling module may include a load lock module 112. The load lock module 112 is configured to load substrates (e.g., large area substrates for display manufacturing) from atmospheric conditions into vacuum, and to load substrates (e.g., large area substrates for display manufacturing) from vacuum into atmospheric conditions. For example, substrates can be loaded into and unloaded from the load lock module in a horizontal orientation.

[0035] According to embodiments of the present disclosure, a combination of advantages may be provided by the system arrangement. The length of the substrate processing system may be significantly reduced, for example by about 50%, wherein the term "about" relates to the fact that (for example in the case of an odd number of vacuum chambers in the processing path) one or two additional transfer chambers may be included. The width of the substrate processing system may be significantly reduced (for example by a substantially vertical substrate orientation). A carrier return path and a mask return path may be avoided, which may in particular reduce contamination and further reduce the width of the substrate processing system.

[0036] like Figure 2 and Figure 3 As shown exemplarily, embodiments of the present disclosure include one or more mask handling modules for an inline substrate processing system. For example, a first mask handling module 120 may be provided for an organic deposition path. In addition, a second mask handling module 150 may be provided for a metal deposition path. The mask handling modules may include similar details, features, and aspects, and the first mask handling module 120 is described exemplarily.

[0037] The inline substrate processing system can be a display manufacturing system or a part of a display manufacturing system, in particular an OLED display manufacturing system, and more particularly an OLED display manufacturing system for large area substrates. Transporting a mask or substrate carrier (i.e., the substrate carrier moves through the inline substrate processing system) can be provided in a vertical orientation state of the substrate carrier, among other states. For example, the substrate carrier can be configured to hold a substrate (such as a glass plate) in a vertical orientation state or a substantially vertical orientation state.

[0038] For example, reference Figure 2 and Figure 3, the mask handling module 120 may include a vacuum rotating chamber 122. For example, the vacuum rotating chamber may be disposed in the inline substrate processing system and disposed between the glass handling module 110 and the organic deposition module 130. In particular, the vacuum rotating chamber 122 may be configured to provide a vacuum condition in the chamber. In addition, the mask handling module 120 may include a rotating mechanism in the vacuum rotating chamber 122. The rotating mechanism may further include a rotating support. In addition, the rotating mechanism may also include an actuator, which is configured to rotate the rotating support in the vacuum rotating chamber 122. Examples of actuators may include electric motors, pneumatic actuators, hydraulic actuators, and the like. In particular, the actuator may be configured to provide a rotation of at least 120° of the rotating support in a clockwise and / or counterclockwise direction. For example, the actuator may be configured to provide a 180° rotation.

[0039] According to some embodiments, the mask handling module 120 may further include a first mask stage 324 and a second mask stage 326 (see, e.g., Figure 3 ). The first mask stage and the second mask stage each include a mask holder assembly to support the mask when not attached to the substrate or substrate carrier, respectively. The first mask holder assembly and / or the second mask holder assembly may include at least one clamp from the following group: an electromagnetic clamp, an electro-permanent magnetic clamp, and a mechanical clamp.

[0040] The first mask stage 324 may be mounted to a rotating mechanism for rotating the first mask stage. In addition, the first mask stage may be mounted to a rotating support in a vertical orientation state. The term "mounted" refers to a state of being fixed or fastened to a rotating mechanism and / or a rotating support by any fastening means (e.g., by using a mechanical holder, an electromagnetic holder, and / or an electro-permanent magnetic holder). According to yet another embodiment that may be combined with other embodiments described herein, a second mask stage 326 similar to the first mask stage may be provided.

[0041] In addition, the mask handling module 120 may particularly include at least one connecting flange, which is configured to connect at least one vacuum chamber and / or a transport module. Typically, some or all of the different types of connecting flanges have a housing frame-like structure that can be configured to provide vacuum conditions inside the housing frame-like structure.

[0042] According to some embodiments, the mask handling module 120 may further include a mask handling assembly. The mask handling assembly may be positioned in the mask handling chamber 123 or in another mask handling chamber 323 attached to the vacuum rotating chamber. In particular, one or more mask handling chambers may be configured to provide vacuum conditions in the chamber. The mask handling assembly may include a vacuum robot having one, two or more independently movable manipulators. Each manipulator may include a mask holding portion configured to grasp or support a mask. In addition, the mask holding portion may be configured to transfer a mask between the vacuum rotating chamber 122 and one or more mask holders (e.g., mask racks) in the mask handling chamber 123 or another mask handling chamber 323. In addition, one or more mask handling chambers may be configured to transfer a mask from a rotating mechanism (e.g., from a first mask stage 324 or from a second mask stage 326). In addition, one or more mask handling chambers may be configured to transfer a mask to a rotating mechanism (e.g., to a first mask stage or to a second mask stage).

[0043] According to some embodiments, the mask handling chamber 123 or the mask handling assembly in the mask handling chamber 323 may be configured to transfer the first mask between the first mask stage 324 and the corresponding mask handling chamber. For example, the mask handling chamber 123, in particular the mask handling assembly, may be configured to load the mask to the first mask stage. In addition, the mask handling chamber, in particular the mask handling assembly, may be configured to separate the mask from the first mask stage.

[0044] According to some embodiments, the mask handling module 120 may further include a first substrate transport track 354 associated with the first mask stage 324. The first substrate transport track may be configured to support the first substrate carrier. Accordingly, the first mask holder assembly may be configured for a second mask transfer between the first mask stage 324 and the first substrate carrier. For example, the mask may be loaded or transferred from the first mask stage to the first substrate carrier. Additionally, the mask handling module 120 may further include a second substrate transport track 356 associated with the second mask stage 326. The second substrate transport track may be configured to support the second substrate carrier.

[0045] After depositing the material on the substrate through the mask, the mask can be carried back to the mask handling module 120 (e.g., carried back to the first mask stage or to the second mask stage through the first substrate carrier or the second substrate carrier, respectively). Thereafter, for example, a third mask transfer between the second mask stage 326 and the mask handling chamber 123 can be performed. Accordingly, the second mask holder assembly can be configured for the third mask transfer between the second mask stage 326 and the mask handling chamber 123. For example, the mask can be transferred to the mask handling chamber, in particular the mask handling assembly, for example, for cleaning.

[0046] According to some embodiments, the substrate transport track may be configured for non-contact transport of the substrate carrier. For example, the substrate transport track may be the first substrate transport track 354 and / or the second substrate transport track 356 .

[0047] According to some embodiments that can be combined with other embodiments described herein, the first mask handling module 120 may include one or more mask handling chambers, such as the mask handling chamber 123 and the mask handling chamber 323. The mask handling chamber is coupled to the vacuum rotating chamber 122. Similarly, the second mask handling module 150 may include one or more mask handling chambers, such as the mask handling chamber 154 and the mask handling chamber 355. The mask handling chamber is coupled to the vacuum rotating chamber 152. According to yet another optional modification, the substrate carrier buffer chamber 129 may be coupled to the vacuum rotating chamber 122. Additionally or alternatively, the substrate carrier buffer chamber 159 may be coupled to the vacuum rotating chamber 152. The substrate carrier may be loaded into the substrate processing system 100, i.e., loaded into one of the deposition modules, from the one or more substrate carrier buffer chambers via the one or more vacuum rotating chambers.

[0048] According to some embodiments of the present disclosure, a substrate processing system 100 is provided, wherein a first deposition module (e.g., an organic deposition module) is provided with a first portion in one direction and a second portion in the opposite direction. A vacuum rotary chamber (i.e., a first rotary module 140) is provided to move a substrate or a carrier supporting the substrate from the first portion to the second portion. Accordingly, the first deposition module is "folded". The mask handling module 120 is provided at the starting point of the first deposition module and is simultaneously provided at the end point of the first deposition module. The mask is unloaded in the vacuum rotary chamber 122. The unloaded mask is loaded on a substrate or a substrate carrier in each of the vacuum rotary chambers 122 (i.e., the same vacuum rotary chamber). Accordingly, improved mask transfer is provided and / or a separate mask return path can be avoided. Accordingly, contamination of the mask in the substrate processing system 100 can be reduced. The substrate processing system 100 is further configured to provide the above advantages for both the organic deposition module and the metal deposition module (i.e., the first deposition module and the second deposition module).

[0049] Due to the design of the substrate processing system, the substrate handling module or glass handling module 110 is disposed close to the start point of the first deposition module and close to the end point of the first deposition module. Accordingly, an improved substrate carrier transfer is provided and / or a substrate carrier return path can be avoided. Accordingly, contamination of the substrate carrier and the substrate processing system 100 can be reduced. Furthermore, the substrate handling module is disposed between the first deposition module and the second deposition module. Accordingly, the above advantages can also be applied to a substrate processing system having a first deposition module and a second deposition module (such as an organic deposition module and a metal deposition module).

[0050] Figure 3 A deposition source in a vacuum chamber of a deposition module is further illustrated. For example, an organic deposition source 372 may be provided in a vacuum chamber of an organic deposition module. According to some embodiments that may be combined with other embodiments described herein, the organic deposition source may be an evaporation source, and in particular a line source extending substantially vertically. For example, an organic material may be deposited on a substrate while the substrate moves past the organic deposition source 372 providing the line source. Further, one or more metal deposition sources 374 and / or one or more metal deposition sources 376 may be provided in a metal deposition module. According to some embodiments that may be combined with other embodiments described herein, the metal deposition source may be an evaporation source or a sputtering source, and in particular may be a line source extending substantially vertically.

[0051] According to some embodiments that can be combined with other embodiments described herein, a deposition module (e.g., a first deposition module or a second deposition module) can be provided with one or more vacuum chambers. The deposition module has a first part and a second part, the first part having a transport path in one direction and the second part having a transport path in the opposite direction. The first part and the second part can be separated by a partition wall. According to some embodiments that can be combined with other embodiments described herein, the deposition module can be provided at a vacuum system, i.e., an arrangement of chambers with or without partition walls, wherein the vacuum system is evacuated by one or more vacuum pump systems.

[0052] Figure 3 Further illustrated is a glass handling module 110 according to some embodiments that can be combined with other embodiments described herein. The glass handling module 110 includes a first load lock chamber 312 and a second load lock chamber 313. The glass handling module 110 further includes a first vacuum orientation chamber 314 and a second vacuum orientation chamber 315. The substrate to be processed in the substrate processing system 100 can be loaded into one of the load lock chambers at atmospheric pressure. For example, the substrate can be loaded horizontally into one of the load lock chambers. After loading, the corresponding load lock chamber can be evacuated, and the substrate can be transferred to one of the vacuum orientation chambers. In the vacuum orientation chamber, the substrate orientation can be changed from a non-vertical orientation (e.g., a horizontal orientation) to a non-horizontal orientation (e.g., a vertical orientation or a substantially vertical orientation).

[0053] According to some embodiments that can be combined with other embodiments described herein, at least a first vacuum orientation chamber and a second vacuum orientation chamber can be provided. A load lock chamber can be provided for each of the vacuum orientation chambers. Providing two or more vacuum orientation chambers has the advantage of improving the takt time of the substrate processing system 100. For example, two or more load lock chambers and corresponding two or more vacuum orientation chambers can be operated sequentially and / or alternately. For example, one substrate can be loaded in the first load lock chamber and the first vacuum orientation chamber, while another substrate is transferred from the second vacuum orientation chamber toward the deposition module.

[0054] According to an embodiment of the present disclosure, a substrate processing system for processing multiple substrates is provided. The substrate processing system includes a first deposition module and a second deposition module, the first deposition module is a first in-line module and has a first plurality of vacuum deposition sources, and the second deposition module is a second in-line module and has a second plurality of vacuum deposition sources. A glass handling module is disposed between the first deposition module and the second deposition module. According to some embodiments, the glass handling module may include a vacuum orientation module configured to change the substrate orientation from a non-vertical orientation to a non-horizontal orientation under vacuum. For example, the vacuum orientation module includes a first vacuum orientation chamber and a second vacuum orientation chamber. According to some embodiments that may be combined with other embodiments described herein, the glass handling module may further include a loading lock module for horizontally loading and unloading glass substrates between an atmospheric region and a vacuum in a substrate processing system.

[0055] According to some optional modifications of the embodiments of the present invention, the substrate processing system may further include a first mask handling module between the glass handling module and the first deposition module and a second mask handling module between the glass handling module and the second deposition module. In particular, at least one of the first mask handling module and the second mask handling module may provide a vacuum rotary chamber and a mask handling chamber connected to the vacuum rotary chamber. For example, the vacuum rotary chamber may include a first mask stage and a second mask stage, and the vacuum rotary chamber is configured to exchange positions between the first mask stage and the second mask stage.

[0056] According to further embodiments that can be combined with other embodiments described herein, in particular in order to "fold" the first deposition module and the second deposition module and to provide a mask handling module for masking and unmasking the substrate, the substrate processing system may include at least one of a first vacuum spin chamber disposed at one end of the first deposition module away from the glass handling module and a second vacuum spin chamber disposed at one end of the second deposition module away from the glass handling module.

[0057] According to another embodiment in which features, details, aspects and modifications may be combined with other embodiments described herein, a substrate processing system for processing a plurality of large area substrates in a substantially vertical orientation is provided. The substrate processing system includes: at least a first load lock chamber; at least a first vacuum orientation chamber, the at least first vacuum orientation chamber being configured to move a large area substrate between a non-vertical orientation and a non-horizontal orientation; at least a first mask handling module, the at least first mask handling module being downstream of the at least first vacuum orientation chamber; a first portion of an organic deposition module, the first portion of the organic deposition module being downstream of the at least first mask handling module; at least a first vacuum spin module, the at least first vacuum spin module being downstream of the first portion of the organic deposition module; and a second portion of the organic deposition module, the second portion of the organic deposition module being downstream of the at least first vacuum spin chamber, the at least first mask handling module being downstream of the second portion of the organic deposition module. For example, the substrate processing system may further include: a second mask handling module, wherein at least the first vacuum orientation chamber is disposed between at least the first mask handling module and the second mask handling module; a first portion of a metal deposition module, the first portion of the metal deposition module being downstream of the second mask handling module; a second vacuum rotation module, the second vacuum rotation module being downstream of the first portion of the metal deposition module; and a second portion of the metal deposition module, the second portion of the metal deposition module being downstream of the second vacuum rotation chamber, the second mask handling module being downstream of the second portion of the metal deposition module.

[0058] Figure 4A method 400 of processing a substrate in an inline substrate processing system or a method of manufacturing a display in an inline substrate processing system is illustrated. At operation 401, a substrate is moved from a first end of a first deposition module as an inline module and a second end of the first deposition module opposite to the first end through a first portion of the first deposition module. The substrate is rotated at the second end of the first deposition module (e.g., in a substantially vertical orientation) (see operation 402). At operation 404, the substrate is moved from the second end of the first deposition module to the first end of the first deposition module along a second portion of the first deposition module. Similar to moving through the first portion and the second portion of the first deposition module, according to operation 406, the substrate may be moved through the first portion and the second portion. For example, the substrate is moved from the first end of the second deposition module as an inline module and the second end of the second deposition module opposite to the first end through the first portion of the second deposition module, the substrate is rotated at the second end of the second deposition module, and the substrate is moved from the second end of the second deposition module to the first end of the second deposition module along the second portion of the second deposition module. At operation 408, the substrate is loaded into and unloaded from the substrate processing system between the first deposition module and the second deposition module. It should be understood that the substrate is loaded into the substrate processing system before the substrate is moved in the first deposition module and the second deposition module, and the substrate is unloaded after the substrate is moved in the first deposition module and the second deposition module. For example, the substrate can be moved from the first deposition module to the second deposition module through the substrate handling module, for example, after processing in the first deposition module and before processing in the second deposition module.

[0059] According to some embodiments that may be combined with other embodiments described herein, the substrate orientation changes between a non-vertical orientation and a non-horizontal orientation. A vacuum orientation chamber for changing the substrate orientation is disposed between a first deposition module and a second deposition module in a substrate handling module. Additionally or alternatively, a method for processing a substrate and / or manufacturing a display may include masking a substrate in a position between a first deposition module and a second deposition module in a mask handling module, and exposing the substrate in a position between the first deposition module and the second deposition module in a mask handling module. For example, the mask may be rotated to mask another substrate after exposing the substrate in the mask handling module. The rotated mask may be used to mask another substrate. Accordingly, embodiments of the present disclosure provide the advantage of avoiding a mask return path and thereby reducing the footprint of a substrate processing system.

[0060] According to an embodiment of the present disclosure, a masking concept that provides exposure and masking in the same mask handling module can be provided for a first deposition module (e.g., an organic deposition module) and a second deposition module (e.g., a metal deposition module). Accordingly, in order to manufacture one or more organic displays, the organic deposition path and the metal deposition path each provide a mask handling module according to an embodiment of the present disclosure. Accordingly, different masks for organic deposition and metal deposition can be provided. For both organic deposition and metal deposition, an advantageous masking concept can be provided for the embodiments described herein.

[0061] Embodiments of the present disclosure may relate to substrate transport in a substrate processing system. According to embodiments of the present disclosure, a substrate may be processed in a substantially vertical orientation. In addition, the substrate may be supported by a carrier, and the carrier supporting the substrate may be transported within the substrate processing system. For example, the carrier may be an electrostatic chuck configured to support a large area substrate. Additionally or alternatively, the carrier may be configured to be suspended by a transport system. Suspension refers to non-contact or substantially non-contact transport of the carrier (e.g., using a magnetic levitation system).

[0062] According to some embodiments that may be combined with other embodiments described herein, the substrate carrier may be configured to hold or support a substrate or a substrate and a mask in a substantially vertical orientation. In addition, the mask stage may be configured to hold or support a mask in a substantially vertical orientation. As used throughout the present disclosure, "substantially vertical" is understood to allow a deviation of ±20° or less (e.g., ±10° or less) from the vertical direction or orientation, particularly when referring to the substrate orientation. The deviation may be provided, for example, because a substrate support having a certain deviation from the vertical orientation may result in a more stable substrate position. In addition, when the substrate is tilted forward, fewer particles reach the substrate surface. However, the substrate orientation (e.g., during deposition of a material (such as an organic or metallic material) on a substrate in a high vacuum) is considered to be substantially vertical, which is considered to be different from a horizontal substrate orientation, which may be considered to be horizontal ±20° or less.

[0063] According to some embodiments, which can be combined with other embodiments described herein, the substrate carrier can be an electrostatic chuck (E-chuck) that provides an electrostatic force to hold the substrate and optionally the mask at the substrate carrier and in particular at the supporting surface. For example, the substrate carrier comprises an electrode arrangement that is configured to provide an attractive force acting on the substrate.

[0064] The embodiments described herein can be used to deposit materials, such as organic or metallic materials, on large area substrates, for example, for OLED display manufacturing. Specifically, the substrate for which the structures and methods according to the embodiments described herein are provided can be a large area substrate. For example, the large area substrate can be a 4.5 generation (corresponding to about 0.67 m 2 (0.73m × 0.92m) surface area), the fifth generation (corresponding to about 1.4m 2 (1.1m × 1.3m) surface area), 7.5th generation (corresponding to approximately 4.29m 2 (1.95m × 2.2m) surface area), 8.5th generation (corresponding to approximately 5.7m 2 (2.2 m × 2.5 m) surface area) or even the 10th generation (corresponding to about 8.7 m 2 (surface area of ​​2.85 m x 3.05 m). Even higher generations (such as Gen 11 and Gen 12) and corresponding surface areas can be similarly realized. Half the size of Gen GEN can also be provided in OLED display manufacturing.

[0065] According to some embodiments that may be combined with other embodiments described herein, the substrate thickness may be from 0.1 mm to 1.8 mm. The substrate thickness may be about 0.9 mm or less, for example 0.5 mm. The term "substrate" as used herein may particularly encompass substantially non-flexible substrates, such as glass plates or other substrates. However, the present disclosure is not limited thereto, and the term "substrate" may also encompass flexible substrates, such as coils or foils. The term "substantially non-flexible" should be understood to be distinguished from "flexible". In particular, a substantially non-flexible substrate may have a certain degree of flexibility, such as a glass plate having a thickness of 0.9 mm or less (such as 0.5 mm or less), wherein the flexibility of the substantially non-flexible substrate is small compared to the flexible substrate.

[0066] The non-contact transport device may be a magnetic suspension system. In particular, a magnetic suspension system may be provided so that at least a portion of the weight of the substrate carrier is carried by the magnetic suspension system. Then, the substrate carrier may be guided substantially contactlessly along the first substrate transport track and / or the second substrate transport track through the in-line substrate processing system, respectively. In particular, the first substrate transport track and the second substrate transport track may each include a carrier holding structure and a carrier drive structure. The carrier holding structure may be configured for non-contact holding of the substrate carrier. The carrier drive structure may be configured for non-contact translation of a substrate carrier (e.g., a first substrate carrier or a second substrate carrier). The carrier holding structure may include a magnetic suspension system for non-contact holding of the substrate carrier. In addition, the carrier drive structure may include a magnetic drive system for non-contact driving of the substrate carrier.

[0067] Figure 5A vacuum orientation chamber 314 is shown. The vacuum orientation chamber may be Figure 2 1. The vacuum orientation chamber of the glass handling module 110 shown in FIG. The vacuum orientation chamber includes a vacuum chamber 502. The vacuum chamber 502 includes side walls. The side wall 502A and the side wall 502B ( Figure 5 In addition, sidewall 502C is disposed between the two opposing sidewalls. The vacuum orientation chamber is configured to change the substrate orientation between a non-vertical orientation (e.g., a horizontal orientation) and a non-horizontal orientation (e.g., a vertical orientation or a substantially vertical orientation). Figure 6B An exemplary orientation actuator is shown in .

[0068] The vacuum orientation module or the vacuum orientation chamber of the vacuum orientation module participates in the transportation of substrates in the substrate processing system. As indicated by arrow 513, the substrate can be loaded into or unloaded from the vacuum orientation chamber. For example, the substrate can be loaded from or loaded into the load lock chamber along arrow 513. The loading and unloading are performed in a non-vertical orientation, such as a horizontal orientation. A slit opening 512, such as a horizontal slit opening, is provided in another side wall 502C of the vacuum chamber 502.

[0069] According to some embodiments that can be combined with other embodiments described herein, the substrate can enter the vacuum chamber 502 at the first slit opening 514. For example, the slit opening 514 can be provided at the side wall 502A. The substrate can leave the vacuum chamber 502 at the side wall 502B. According to some embodiments that can be combined with other embodiments described herein, moving the substrate into and out of the vacuum chamber 502 can be performed on opposite sides (i.e., opposite side walls) of the vacuum chamber. The transport track ( Figure 5 5. The substrate is disposed between two slit openings at opposite side walls of the vacuum chamber (not shown). The movement of the substrate is indicated by arrow 515. For embodiments of the present disclosure, the substrate may be transported on a substrate carrier according to embodiments described herein.

[0070] According to an embodiment of the present disclosure, the two slit openings at the opposite side walls are vertical or substantially vertical. The substrate can be transported through the vacuum chamber 502 in a substantially vertical orientation along a bidirectional transport direction. The vacuum swing module according to the prior art typically has a horizontal slit opening at one side of the vacuum swing module and a vertical slit opening at the opposite side of the vacuum swing module. Accordingly, a robot or the like can be used to load the substrate horizontally in a portrait orientation. The substrate rotates along the longer side of the substrate (i.e., the length of the substrate) and is transported out of the vacuum swing module in a vertical orientation and in a transverse orientation. An embodiment of the present disclosure provides horizontal loading of the substrate in a transverse orientation (e.g., through a slit opening 512 at the side wall 502C (i.e., the side wall between two opposite side walls)). Horizontal loading in a transverse orientation is counterintuitive and generally needs to be avoided. However, the benefits in terms of mask handling, the occupied area of ​​the substrate processing system, and the takt time promote deviation from horizontal longitudinal transport.

[0071] According to one embodiment of the present disclosure, a vacuum orientation module for a substrate processing system is provided. The vacuum orientation module includes at least a first vacuum orientation chamber, such as Figure 5 and Figure 3 A vacuum orientation chamber 314 similar to the vacuum orientation chamber 314 may be provided. Figure 3 315 is shown in the vacuum orientation chamber. The vacuum orientation chamber includes a vacuum chamber and a transport track in the vacuum chamber, the transport track having a support structure and a drive structure and defining a transport direction, such as a bidirectional transport direction. An orientation actuator is provided to change the substrate orientation between a non-vertical orientation and a non-horizontal orientation. According to some embodiments of the present disclosure, the vacuum chamber has two slit openings at opposite side walls of the vacuum chamber in the bidirectional direction. For example, the two slit openings may include a first slit opening 514 and a Figure 5 Another slit opening not shown in FIG. The opposing side walls may be side wall 502A and side wall 502B.

[0072] According to some embodiments, at least a first vacuum orientation chamber may be provided with a non-vertical slit opening (e.g. Figure 5 The slit opening 512 is shown as a horizontal slit opening 512. The slit opening 512 may be provided for loading and unloading substrates. According to further embodiments that may be combined with other embodiments described herein, a second vacuum orientation chamber may be provided in a substrate processing system, such as Figure 3 As shown in . The second vacuum orientation chamber is aligned with at least the first orientation chamber along the in-line direction of the substrate processing system. In particular, the second vacuum orientation chamber and at least one or vertical slit openings of the first vacuum orientation chamber can be aligned.

[0073] According to some embodiments that can be combined with other embodiments described herein, the slit opening in the vacuum chamber of the vacuum orientation chamber according to the embodiments described herein can be provided with a slit valve. A slit valve can be provided to seal the vacuum chamber in a vacuum-tight manner. In particular, the horizontal slit opening 512 can be provided with a slit valve. According to further optional embodiments, the slit opening 514 and / or the slit opening opposite to the slit opening 514 can also be provided with a slit valve.

[0074] According to one embodiment, a vacuum orientation module is provided. The vacuum orientation module includes at least a first vacuum orientation chamber. At least the first vacuum orientation chamber includes a vacuum chamber and a transport track in the vacuum chamber, and the transport track has a support structure and a drive structure. In addition, an orientation actuator for changing the orientation of a substrate between a non-vertical orientation and a non-horizontal orientation is provided. The orientation actuator moves the substrate at a certain angle and around an axis between a first end of the substrate and a second end of the substrate, wherein the second end is opposite to the first end.

[0075] For example, Fig. 6A and Figure 6B A vacuum orientation chamber having a vacuum chamber 502 is shown. A slit opening 512 is provided at a side wall 502C of the vacuum chamber 502. The substrate 650 can be loaded onto a carrier 652 through the slit opening 512. According to embodiments described herein, the carrier 652 can be a substrate carrier. For example, the carrier can be an electrostatic chuck. In a non-vertical orientation (e.g. Fig. 6A After loading the substrate 650 on the carrier 652 (in the horizontal orientation shown in FIG), the substrate may be moved as indicated by arrow 651. The substrate is moved, for example, from a horizontal orientation to a vertical orientation or a substantially vertical orientation and toward a transport track for transporting the substrate or the carrier with the substrate, respectively.

[0076] According to some embodiments that can be combined with other embodiments described herein, the transport track can be provided by a magnetic levitation system. For example, the support structure 612 can be arranged above the carrier 652, and the drive structure 614 can be arranged below the carrier 652. The support structure 612 can be a magnetic bearing having, for example, one or more electromagnets to levitate the carrier 652. The drive structure 614 can be a magnetic drive (e.g., a magnetic drive having one or more electromagnets) to drive the carrier 652 in the transport direction. For example, the carrier can be as Figure 5 Move as indicated by arrow 515 shown in FIG.

[0077] The movement of the carrier from the horizontal orientation to the substantially vertical orientation may be performed by an orientation actuator (e.g. Figure 6B The orientation actuator 660 shown in FIG. Fig. 6AAs exemplarily indicated by arrow 651 in FIG. 6 , the orientation actuator is configured to move the substrate away from the transport track in a non-vertical orientation (i.e., a horizontal orientation). Accordingly, when the carrier 652 is supported in a horizontal orientation, the space between the support structure 612 and the drive structure 614 is empty. Figure 5 , another carrier with another substrate may be moved through the vacuum chamber 502 when the carrier 652 is horizontally oriented in the vacuum chamber 502. According to some embodiments that may be combined with other embodiments described herein, a transport track may be used for the second carrier when the first carrier is in a non-vertical (horizontal) orientation. Accordingly, the vacuum orientation chamber according to embodiments of the present disclosure allows for at least two substrates in the vacuum chamber 502. In particular, the first substrate may be supported in a horizontal orientation, and the second substrate may be supported between the first support structure 612 and the first drive structure 614. According to embodiments described herein, embodiments of the vacuum orientation chamber allow for increasing the takt time in a substrate processing system by providing two or more vacuum orientation chambers in a vacuum orientation module.

[0078] For example Figure 3 As shown in , a first vacuum orientation chamber 314 may be provided, and a second vacuum orientation chamber 315 may be provided. For example, substrate movement between a non-vertical orientation and a non-horizontal orientation may be provided alternately in the two vacuum orientation chambers. A substrate oriented substantially vertically may be moved from the first vacuum orientation chamber 314 through the second vacuum orientation chamber 315 toward the first deposition module. At the same time, another substrate may be loaded on another carrier in the second vacuum orientation chamber 315. In view of the fact that the orientation actuator in the vacuum chamber provides an empty transport track between the support structure 612 and the drive structure 614 when the substrate is loaded horizontally on the carrier, the substrate movement from the first vacuum orientation chamber 314 toward the first deposition module may utilize the empty transport track. Such movement is performed by Figure 5 The arrow 515 in FIG. 5 is schematically illustrated. The vacuum orientation module according to the embodiments described herein advantageously allows for increased cycle time. For example, two vacuum orientation chambers are operated simultaneously, and the cycle time can be substantially doubled.

[0079] Figure 6BFurther details of the orientation actuator 660 according to an embodiment of the present disclosure are illustrated. The orientation actuator 660 includes a support 672 for supporting a carrier 652. The carrier includes a first end 653 and a second end 655 opposite to the first end 653. The support 672 is configured to support the carrier 652 between the first end 653 and the second end 655. In particular, the support 672 can be configured to support the carrier at or near the center of the carrier (i.e., the center between the first end 653 and the second end 655). According to some embodiments that can be combined with other embodiments described herein, the orientation actuator is configured to change the substrate orientation between a non-vertical orientation and a non-horizontal orientation, and the orientation actuator moves the substrate at an angle and around an axis between the first end of the substrate and the second end of the substrate, the second end being opposite to the first end. Supporting the carrier at or near the center allows the carrier to move away from the transport track when the substrate is moved from a substantially vertical orientation to a horizontal orientation.

[0080] According to some embodiments, which can be combined with other embodiments described herein, the movement of the carrier between the two orientations may include: Figure 6B The arrows in the figure indicate translation and movement at an angle.

[0081] Fig. 7A and Figure 7B An embodiment of a method of transporting a large area substrate having a length and a width shorter than the length in a substrate processing system or a layer stack for manufacturing a display and a corresponding method thereof including a transport method is illustrated. One method may include loading a large area substrate into a vacuum orientation chamber in a non-vertical orientation with movement parallel to the width of the large area substrate, as indicated by operation 701 (see Fig. 7A ). Accordingly, the substrate is loaded horizontally in a lateral orientation. At operation 703, the large area substrate is moved from a non-vertical orientation of the substrate to a non-horizontal orientation (eg, using an orientation actuator disposed in the vacuum chamber).

[0082] Additionally or alternatively, a method includes operation 702 of moving a large area substrate into at least a first vacuum orientation chamber having a vacuum chamber through a first slit opening at a first sidewall of the vacuum chamber. For example, this may be Figure 5 514 is shown as a substantially vertical slit opening 514. At operation 704, the large area substrate is moved out of at least the first vacuum orientation chamber through a second slit opening at a second side wall of the vacuum chamber, the second side being opposite to the first side wall. For example, this may be a slit opening ( Figure 5 ). Additionally, at operation 706, the large area substrate is moved from a non-vertical orientation of the substrate to a non-horizontal orientation or from a non-horizontal orientation to a non-vertical orientation of the substrate in at least a first vacuum orientation chamber.

[0083] According to further embodiments, a method of manufacturing a layer stack for a display on a large area substrate may include one or more of the above-described transport methods, and may further include depositing one or more layers of the layer stack for a display. For example, the layer may be deposited in a first deposition module (e.g., an organic deposition module). Additionally or alternatively, the layer may be deposited in a second deposition module (e.g., a metal deposition module).

[0084] Still further embodiments of a vacuum orientation module for a substrate processing system may relate to Figure 2 , Figure 3 , Figure 5 , Fig. 6A and Figure 6B As described above, the substrate may be loaded in the substrate processing system 100 through the loading lock module 112. The substrate may be moved in a horizontal orientation in the vacuum orientation module. According to some embodiments that may be combined with other embodiments described herein, the substrate may be loaded on the substrate carrier in a horizontal orientation. In addition, the carrier supporting the substrate may be moved at a certain angle to change the substrate orientation from a horizontal orientation to a non-horizontal orientation. Thereafter, the substrate may be moved to the mask handling module 120 and the first deposition module 130. After deposition in the first deposition module 130 (e.g., an organic deposition module), the mask at the substrate previously set in the mask handling module may be removed in the mask handling module. The carrier supporting the substrate moves toward the second deposition module 160 through the glass handling module 110. For example, the carrier supporting the substrate may be moved in the second mask handling module 150, a mask may be provided at the substrate, and a deposition process may be provided in the second deposition module (e.g., a metal deposition module). After processing in the second deposition module 160, the mask may be removed in the mask handling module 150. The substrate orientation may be changed from a non-horizontal orientation (i.e., a substantially vertical orientation) to a horizontal orientation in the vacuum orientation chamber and may be unloaded from the substrate processing system 100 through the load lock module. According to some embodiments, which may be combined with other embodiments described herein, the number of load lock chambers in the load lock module 112 may correspond to the number of vacuum orientation chambers in the vacuum orientation module 114.

[0085] As described above, the transfer from the first deposition module 130 to the second deposition module 160 includes transfer through the glass handling module 110. Accordingly, the vacuum orientation module for the substrate processing system includes at least a first vacuum orientation chamber. At least the first orientation chamber includes a vacuum chamber and a first transport track in the vacuum chamber, the first transport track having a first support structure and a first drive structure that define a bidirectional transport direction. The first support structure can be Fig. 6A The support structure 612 shown in FIG. 1 , the first drive structure may be Fig. 6A614 shown in FIG. 614. An orientation actuator 660 may be provided. According to some embodiments, the orientation actuator is configured to change the substrate orientation between a non-vertical orientation and a non-horizontal orientation, and the vacuum chamber has a first pair of two slit openings at opposite side walls of the vacuum chamber in a bidirectional direction. According to some embodiments of the present disclosure that can be combined with other embodiments described herein, a second transport track is provided in the vacuum chamber. The second transport track includes a second support structure and a second drive structure extending along a bidirectional transport direction. The vacuum chamber has a second pair of two slit openings at opposite side walls of the vacuum chamber.

[0086] The second transport track can be Fig. 6A The second support structure 622 and the second drive structure 624 shown in FIG. 5 are provided. Vertical slit openings may be provided in opposite side walls of the vacuum chamber 502 for transportation along the second transport track. For example, Figure 5 A slit opening 524 is shown at the side wall 502A. A second slit opening corresponding to the slit opening 524 may be provided at the side wall 502B. Accordingly, a carrier supporting a substrate may move through the vacuum chamber 502, such as Figure 5 As shown by arrow 525 in FIG. 5 , the carrier supporting the substrate can be moved by the second driving structure 624 while being supported by the second supporting structure 622 .

[0087] According to some embodiments, which can be combined with other embodiments described herein, the second transport track is positioned such that the first transport track having the first support structure 612 and the first drive structure 614 is disposed between the slit opening 512 and the second transport track. Figure 6B As shown in , according to some embodiments that can be combined with other embodiments described herein, the first transport track and the second transport track can be separated by a partition wall 632. The partition wall 632 can provide a separation between the first area of ​​the vacuum chamber 502 and the second area of ​​the vacuum chamber 502. Accordingly, the partition wall 632 can separate two vacuum areas that are pumped separately (e.g., with two vacuum pump systems). Alternatively, the two areas can be evacuated by a common vacuum pump system. Regardless of the presence of the partition wall, the horizontal distance between the first transport track and the second transport track can be, for example, 20 cm or more and / or can be 100 cm or less. For example, the distance between these transport tracks can be about 50 cm.

[0088] According to some embodiments that can be combined with other embodiments described herein, the second vacuum orientation chamber can be aligned with the first vacuum orientation chamber so that the second slit opening 524 at the side wall 502A is aligned with another slit opening at the side wall 502B. In view of the above, a substrate processing system can be provided. The substrate processing system includes a first deposition module and a second deposition module, the first deposition module is a first in-line module and has a first plurality of vacuum deposition sources, and the second deposition module is a second in-line module and has a second plurality of vacuum deposition sources. The substrate processing system further includes a glass handling module between the first deposition module and the second deposition module, the glass handling module including a vacuum orientation module according to any one of the embodiments described herein. In particular, the vacuum orientation module may have a second transport track. According to further additional or alternative modifications, the vacuum deposition module may include a first vacuum orientation chamber and a second vacuum orientation chamber, each of which has a second transport track.

[0089] In view of the above, embodiments of the present disclosure may provide one or more of the following advantages. Mask handling may be improved. In particular, a mask return path may be avoided. Additional mask transport may be provided in the vacuum processing system to avoid contamination of the mask or mask carrier. Furthermore, in addition to replacement or cleaning, substrate carrier transport may be provided in the vacuum processing system to avoid contamination of the substrate carrier. The footprint of the substrate processing system may be reduced by folding the deposition module and avoiding a return path for the mask and / or substrate carrier. Embodiments allow two or more vacuum orientation chambers to operate simultaneously in a vacuum processing system to increase the cycle time of the vacuum processing system. Additionally, separation of an organic deposition module and a metal deposition module may be provided to allow separate masking of different deposition modules. Further, the above advantages applicable to one deposition module may be provided for two deposition modules.

[0090] While the foregoing is directed to certain embodiments, other and further embodiments may be envisaged without departing from the basic scope, and the scope is to be determined by the claims that follow.

Claims

1. A vacuum orientation module for a substrate processing system, comprising: At least a first vacuum orientation chamber comprising: Vacuum chamber; A first transport track, wherein the first transport track is in the vacuum chamber, the first transport track has a first supporting structure and a first driving structure and defines a transport direction; an orientation actuator for changing the orientation of the substrate between a non-vertical orientation and a non-horizontal orientation, the vacuum chamber having a first pair of two slit openings at opposite side walls of the vacuum chamber in the transport direction, the first transport track being disposed between the first pair of two slit openings; and A second transport track, wherein the second transport track is within the vacuum chamber, the second transport track has a second support structure and a second drive structure extending along the transport direction, the vacuum chamber has a second pair of two slit openings at the opposite side walls of the vacuum chamber, and the second transport track is arranged between the second pair of two slit openings.

2. The vacuum orientation module of claim 1, wherein the at least first vacuum orientation chamber has a non-vertical slit opening for loading and unloading the substrate. 3 . The vacuum orientation module according to claim 2 , wherein the non-vertical slit opening is disposed at another side wall of the vacuum chamber between the opposing side walls.

4. The vacuum orientation module of claim 2, wherein the first transport track is disposed between the non-vertical slit opening and the second transport track.

5. The vacuum orientation module of claim 3, wherein the first transport track is disposed between the non-vertical slit opening and the second transport track. 6 . The vacuum orientation module according to claim 1 , wherein the first transport track and the second transport track are separated by a partition wall.

7. The vacuum orientation module according to any one of claims 1 to 5, further comprising: A second vacuum orientation chamber is aligned with the at least first vacuum orientation chamber along an in-line direction of the substrate processing system.

8. The vacuum orientation module according to claim 7, wherein the second vacuum orientation chamber comprises a first pair of two slit openings of the second vacuum orientation chamber, and the first pair of two slit openings of the second vacuum orientation chamber are aligned with the first pair of two slit openings of the at least first vacuum orientation chamber along the transport direction.

9. The vacuum orientation module according to claim 8, wherein the second vacuum orientation chamber comprises a second pair of two slit openings of the second vacuum orientation chamber, and the second pair of two slit openings of the second vacuum orientation chamber are aligned with the second pair of two slit openings of the at least first vacuum orientation chamber along the transport direction.

10. A substrate processing system for processing a plurality of substrates, comprising: a first deposition module, the first deposition module being a first inline module and having a first plurality of vacuum deposition sources; a second deposition module, the second deposition module being a second inline module and having a second plurality of vacuum deposition sources; and A glass handling module, wherein the glass handling module is between the first deposition module and the second deposition module, wherein the glass handling module comprises the vacuum orientation module according to any one of claims 1 to 9.

11. The substrate processing system of claim 10, wherein the glass handling module comprises: A vacuum orientation module is configured to change the orientation of the substrate from a non-vertical orientation to a non-horizontal orientation under vacuum.

12. A method for transporting a large area substrate in a substrate processing system, comprising: moving the large area substrate into a first deposition module on a first transport track of a vacuum orientation module, the vacuum orientation module comprising a vacuum chamber having a first pair of two slit openings at opposite side walls of the vacuum chamber along the first transport track, the first transport track defining a transport direction; transferring the large area substrate from the first deposition module through the vacuum orientation module toward a second deposition module on a second transport track, the vacuum chamber of the vacuum orientation module having a second pair of two slit openings at the opposite side walls of the vacuum chamber along the second transport track, the second transport track defining the transport direction; and The large area substrate is moved from the second deposition module to the vacuum orientation module on the first transport track.

13. The method according to claim 12, further comprising: loading the large area substrate into the vacuum orientation module in a non-vertical orientation; and The large area substrate is moved from the non-vertical orientation to a non-horizontal orientation.

14. A method of manufacturing a layer stack for a display on a large area substrate, comprising: A method for transporting a large area substrate according to any one of claims 12 to 13; and One or more layers of the layer stack are deposited on the large area substrate.

Images