processing device

Abstract

The present application provides a machining device capable of accurately detecting the depth of a cutting tool into a workpiece. The machining device (1) has a setting unit (40) that detects the position (Z1) of the tip of a cutting tool (21) based on light emitted by a light emitting portion and received by a light receiving portion, a correction unit that detects the position (Z2) of a holding surface and stores the difference in the Z direction between the position (Z1) of the tip of the cutting tool (21) detected by the setting unit (40) and the position (Z2) of the holding surface as a correction value (ΔZ), and a control portion. In the case where the amount of variation in the temperature (T1, T2, T3) measured by a temperature measurer (61, 62, 63) from an arbitrary time exceeds a threshold value, the control portion causes the position (Z2) of the holding surface to be detected by the correction unit and the updating of the correction value (ΔZ) to be performed again, and the detection of the position (Z1) of the tip of the cutting tool (21) by the setting unit (40) to be performed again.

Description

TECHNICAL FIELD

[0001] The present application relates to a machining device. BACKGROUND

[0002] There is known a method of detecting a reference position of a cutting tool when the cutting tool comes into contact with a holding surface of a holding table by energizing the cutting tool and the holding table (for example, refer to Patent Document 1). In addition, there is known a method of providing a light emitting portion and a light receiving portion apart by a width of intrusion of the cutting tool, detecting a position of a tip of the cutting tool based on light received by the light receiving portion, and thereby obtaining the reference position of the cutting tool (for example, refer to Patent Document 2).

[0003] Patent Document 1: Japanese Utility Model Registration No. 2597808

[0004] Patent Document 2: Japanese Patent No. 4590058

[0005] However, in the method of detection by energizing the cutting tool and the holding table, since the holding table is cut by the cutting tool, there is a possibility that the cutting tool is clogged, and in addition, since the detection of the reference position takes time compared to the method using the light receiving portion and the light emitting portion, there is a problem that productivity is reduced. Therefore, conventionally, after the height of the holding surface is detected by energizing the cutting tool and the holding table at the time of replacement of the holding table, the position of the tip of the cutting edge of the cutting tool is detected using the light receiving portion and the light emitting portion, and an operation called sensor alignment setting of detecting the positional relationship of the holding surface and the light emitting portion and the light receiving portion is performed. Moreover, in machining thereafter, as long as the holding table is not replaced again, the positional relationship detected by the sensor alignment setting is fixed, and only the depth of cut of the cutting tool into a work is detected and controlled based on the detection by the light emitting portion and the light receiving portion. However, in reality, since the relative positional relationship of the positions of the light emitting portion and the light receiving portion and the position of the holding surface is changed due to a change in temperature within the machining device, there is a problem that the depth of cut of the cutting tool into the work cannot be accurately detected and controlled based only on the detection by the light emitting portion and the light receiving portion. SUMMARY

[0006] The present application has been achieved in view of the above-described problems, and an object thereof is to provide a machining device capable of accurately detecting the depth of cut of a cutting tool into a work.

[0007] To solve the aforementioned problems and achieve the objective, the processing apparatus of the present invention is a processing apparatus characterized by comprising: a holding table having a holding surface for holding a workpiece; a cutting unit that cuts the workpiece held by the holding table using a cutting tool; a Z-feed unit that moves the cutting unit along a Z-direction perpendicular to the holding surface; a setting unit having a light-emitting part and a light-receiving part provided to separate the width of the cutting tool intrusion, the setting unit detecting the tip position of the cutting tool based on the light received by the light-receiving part; and a correction unit that detects the Z-direction of the holding surface. The device includes a position unit that stores the difference between the tip position of the cutting tool detected by the setting unit and the Z-direction of the holding surface as a correction value; a temperature measuring device installed in the machining apparatus that measures the temperature; an imaging unit that takes a picture of the workpiece held by the holding table; and a control unit that drives each unit. If the temperature variation measured by the temperature measuring device exceeds a threshold from any time, the control unit causes the action of detecting the height of the holding surface using the correction unit and updating the correction value, and the detection of the tip position of the cutting tool by the setting unit to be performed again.

[0008] Alternatively, the correction unit can move the cutting unit along the Z direction and detect the Z-direction position of the cutting unit when electrical conduction with the holding table is detected as the height of the holding surface.

[0009] Alternatively, the correction unit can store the height of the shooting unit in the Z direction when the focus of the shooting unit is aligned with the holding surface as the height of the holding surface.

[0010] This invention can accurately detect the depth to which the cutting tool penetrates the workpiece. Attached Figure Description

[0011] Figure 1 This is a perspective view showing a structural example of the processing apparatus according to Embodiment 1.

[0012] Figure 2 It is shown Figure 1 A sectional view of the structure of the unit.

[0013] Figure 3 It is shown Figure 1 A cross-sectional view of the structure of the correction unit.

[0014] Figure 4 It is shown Figure 1 A cross-sectional view of an example of maintaining the positional relationship between the worktable, the cutting unit, and the setting unit.

[0015] Figure 5 It is shown Figure 1A diagram illustrating an example of location information data stored in the location information storage unit.

[0016] Figure 6 This is a flowchart illustrating an example of the sequence of operations of the processing apparatus in Embodiment 1.

[0017] Label Explanation

[0018] 1: Machining device; 10: Holding table; 14: Holding surface; 20: Cutting unit; 21: Cutting tool; 30: Z-feed unit; 40: Setting unit; 42: Light-emitting part; 43: Light-receiving part; 50: Correction unit; 61, 62, 63: Temperature measuring device; 70: Imaging unit; 80: Control unit; 100: Workpiece. Detailed Implementation

[0019] The embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the embodiments described below. Furthermore, the structural elements described below include substantially the same structural elements that are readily conceived by those skilled in the art. Moreover, the structures described below can be appropriately combined. Additionally, various omissions, substitutions, or modifications to the structure can be made without departing from the spirit of the present invention.

[0020] [Implementation Method 1]

[0021] The processing apparatus 1 of Embodiment 1 of the present invention will be described with reference to the accompanying drawings. Figure 1 This is a perspective view showing a structural example of the processing apparatus 1 according to Embodiment 1. Figure 2 It is shown Figure 1 A cross-sectional view of the structure of the setting unit 40. Figure 3 It is shown Figure 1 A cross-sectional view of the structure of the correction unit 50. Figure 4 It is shown Figure 1 A cross-sectional view of an example of the positional relationship between the worktable 10, the cutting unit 20, and the setting unit 40.

[0022] like Figure 1 As shown, the processing device 1 includes a holding table 10, a cutting unit 20, a Z-feed unit 30, a setting unit 40, a calibration unit 50, temperature measuring instruments 61, 62, and 63, an imaging unit 70, and a control unit 80.

[0023] The workpiece 100, which is the object of processing in the processing apparatus 1 of Embodiment 1, is, for example, a wafer-shaped semiconductor wafer or optical device wafer made of silicon, sapphire, silicon carbide (SiC), gallium arsenide, or the like. A chip-sized device is formed on the workpiece 100 in an area divided by multiple predetermined dividing lines arranged in a lattice pattern on its flat front surface. In Embodiment 1, as...Figure 1 As shown, an adhesive tape 101 is attached to the back side of the workpiece 100 opposite to the front side, and an annular frame 102 is mounted on the outer edge of the adhesive tape 101, but this is not the only limitation in this invention. Alternatively, in this invention, the workpiece 100 may also be a rectangular encapsulation substrate, ceramic plate, or glass plate having multiple resin-sealed devices.

[0024] The holding stage 10 has a circular plate-shaped frame 11 with recesses and a circular plate-shaped adsorption part 12 embedded in the recesses. The frame 11 is made of a conductive material, and in Embodiment 1, it is made of stainless steel. The adsorption part 12 of the holding stage 10 is made of porous ceramic or the like with numerous pores, and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown). Figure 1 As shown, the upper surface of the suction section 12 of the holding table 10 is a holding surface 14 that holds the workpiece 100 placed on it. The holding surface 14 and the upper surface 13 of the frame 11 of the holding table 10 are arranged on the same plane and are formed parallel to the XY plane, which is a horizontal plane. The holding table 10 is movable freely in the X direction, which is a horizontal direction, by an X feed unit (not shown) and is rotatable freely about an axis that is parallel to the vertical direction, i.e., perpendicular to the holding surface 14, by a rotary drive source (not shown).

[0025] like Figure 1 As shown, the cutting unit 20 includes a cutting tool 21 and a spindle 22. The cutting tool 21 is mounted at the front end of the spindle 22. A rotational motion is applied to the cutting tool 21 about an axis parallel to the Y direction (perpendicular to the X direction), and the cutting tool 21 performs cutting operations on the workpiece 100 held by the holding table 10. The cutting unit 20 is configured to be freely movable relative to the workpiece 100 held by the holding table 10 in the Y direction via the Y feed unit 30, and also configured to be freely movable relative to the workpiece 100 held by the holding table 10 in the Z direction via the Z feed unit 30.

[0026] The cutting tool 21 has a ring-shaped cutting edge formed from abrasive grains such as diamond or CBN (Cubic Boron Nitride) and a bonding material such as metal or resin, and formed to a specified thickness. The cutting tool 21 is electrically conductive. As cutting occurs, the cutting edge of the cutting tool 21 wears down, thus becoming self-sharpened and maintaining a certain level of sharpness. The spindle 22 is electrically conductive and is connected to the cutting tool 21 at its tip.

[0027] The machining apparatus 1 sets the cutting tool 21 in a predetermined position relative to the workpiece 100 held by the holding table 10 through the X feed unit, Y feed unit and Z feed unit 30. While rotating the cutting tool 21, it moves relative to the workpiece 100 along the predetermined dividing line, thereby cutting the workpiece 100 with the cutting tool 21 to form a cutting groove along the predetermined dividing line.

[0028] The X-feed unit, Y-feed unit, and Z-feed unit 30 are each equipped with an X-direction position detection unit (not shown) for detecting the X-direction position of the holding table 10, a Y-direction position detection unit (not shown) for detecting the Y-direction position of the cutting unit 20, and a Z-direction position detection unit 31 for detecting the Z-direction position of the cutting unit 20. The X-direction position detection unit, Y-direction position detection unit, and Z-direction position detection unit 31 each output the detected position to the control unit 80. Furthermore, the Z-direction position detection unit 31 outputs the detected position to the front-end position detection unit 48 of the setting unit 40 (described later) and the holding surface position detection unit 55 of the correction unit 50 (described later).

[0029] The X-direction position detection unit, Y-direction position detection unit, and Z-direction position detection unit 31 can each be composed of a linear scale and a reading head. The linear scale is parallel to the X, Y, or Z direction. The reading head is flexibly positioned and reads the scale of the linear scale by moving freely along the X-axis, Y-axis, or Z-axis direction via the X-feed unit, Y-feed unit, or Z-feed unit 30. Furthermore, in this invention, the X-direction position detection unit, Y-direction position detection unit, and Z-direction position detection unit 31 are not limited to a structure with a linear scale and a reading head; they can also be encoders of the motors of the X-feed unit, Y-feed unit, or Z-feed unit 30, respectively.

[0030] like Figure 2 As shown, the setting unit 40 includes a slot component 41, a light-emitting part 42, a light-receiving part 43, a light source 44, a photoelectric conversion part 45, a reference voltage setting part 46, a voltage comparison part 47, and a front end position detection part 48.

[0031] like Figure 2 As shown, the groove member 41 has a base 41-1 and a pair of sidewall portions 41-2 erected from the base 41-1. The pair of sidewall portions 41-2 are arranged at intervals in the direction of the rotation axis of the cutting tool 21, i.e., the Y direction, and the interval between them is wider than the thickness of the cutting edge of the cutting tool 21. The pair of sidewall portions 41-2 are formed with grooves 41-3 into which the front end 25 of the lower side of the cutting edge of the cutting tool 21 rotating between them can enter.

[0032] like Figure 2As shown, the light-emitting part 42 is disposed on one side wall portion 41-2 and emits light toward the other side wall portion 41-2. The light-emitting part 42 is optically connected to the light source 44 via an optical fiber or the like, and emits light from the light source 44.

[0033] like Figure 2 As shown, the light-receiving part 43 is disposed on the other side wall part 41-2 at a position opposite to the light-emitting part 42 along the Y direction, and receives light from the light-emitting part 42. The light-receiving part 43 is optically connected to a light-receiving element via an optical fiber or the like, and the light arriving at the light-receiving part 43 is detected by the light-receiving element. The light-receiving part 43 is optically connected to a photoelectric conversion part 45 via an optical fiber or the like, and transmits the light received from the light-emitting part 42 to the photoelectric conversion part 45.

[0034] The photoelectric conversion unit 45 outputs a voltage corresponding to the amount of light emitted from the light-receiving unit 43 to the voltage comparison unit 47. As the cutting edge 25 of the cutting tool 21 penetrates the groove 41-3, and the amount by which the cutting edge of the cutting tool 21 blocks the space between the light-emitting unit 42 and the light-receiving unit 43 increases, the output voltage from the photoelectric conversion unit 45 gradually decreases. In Embodiment 1, the photoelectric conversion unit 45 outputs a voltage of 5V (maximum voltage) when the ratio of the amount of light received by the light-receiving unit 43 to the amount of light emitted by the light-emitting unit 42, i.e., the light reception rate, is 100%, and outputs a voltage of 0V (minimum voltage) when the light reception rate is 0%. The photoelectric conversion unit 45 is configured such that when the amount of light received by the light-receiving unit 43 is a predetermined amount, that is, when the cutting edge 25 of the cutting tool 21 reaches a predetermined position between the light-emitting unit 42 and the light-receiving unit 43, the output voltage becomes a predetermined reference voltage (3V in Embodiment 1).

[0035] The reference voltage setting unit 46 outputs the set reference voltage to the voltage comparison unit 47. In Embodiment 1, as described above, the set reference voltage is 3V. The voltage comparison unit 47 compares the output voltage from the photoelectric conversion unit 45 with the reference voltage set by the reference voltage setting unit 46. When the output voltage from the photoelectric conversion unit 45 reaches the reference voltage, it outputs a signal indicating this to the front end position detection unit 48. At the moment the signal is output from the voltage comparison unit 47, the front end position detection unit 48 obtains the Z-direction position of the cutting unit 20 from the Z-direction position detection unit 31. The front end position detection unit 48 detects the obtained Z-direction position of the cutting unit 20 as the position of the tip 25 of the cutting edge of the cutting tool 21. Figure 4 The detected front end position Z1 of the cutting tool 21 is output to the control unit 80.

[0036] In Embodiment 1, the setting unit 40 includes a computer system. The setting unit 40 has an arithmetic processing device having a microprocessor like a CPU (Central Processing Unit), a storage device having a memory like a ROM (Read Only Memory) or a RAM (Random Access Memory), and an input-output interface device. In Embodiment 1, each function of the photoelectric conversion section 45, the reference voltage setting section 46, the voltage comparison section 47, and the front end position detection section 48 is realized by the arithmetic processing device of the computer system included in the setting unit 40 executing a computer program stored in the storage device of the computer system included in the setting unit 40.

[0037] As shown in FIG. 1, the correction unit 50 has a circuit 51, an on-off switch 52, a power supply 53, a current meter 54, a holding surface position detection section 55, and a correction value calculation section 56. Figure 3

[0038] The circuit 51 is a circuit that makes the lower side of the frame 11 of the holding stage 10 and the proximal end side of the main shaft 22 of the cutting unit 20 conductive. The on-off switch 52, the power supply 53, and the current meter 54 are provided on the circuit 51. The on-off switch 52 switches between a closed state in which the frame 11 and the main shaft 22 are electrically conductive via the circuit 51 and an open state in which the electrical conduction of the frame 11 and the main shaft 22 via the circuit 51 is cut off. The power supply 53 applies a voltage to the circuit 51. The current meter 54 detects a current value flowing through the circuit 51 and outputs a detection result of the current value to the holding surface position detection section 55.

[0039] In a case where the on-off switch 52 is in the closed state, when the front end 25 of the cutting edge of the cutting tool 21 comes into contact with the upper surface 13 of the frame 11 and is electrically conductive, the circuit 51 forms a closed circuit together with the frame 11, the cutting tool 21, and the main shaft 22, and thus a current flows inside according to the voltage applied from the power supply 53. On the other hand, in a case where the on-off switch 52 is in the open state or the front end 25 of the cutting edge of the cutting tool 21 does not come into contact with the upper surface 13 of the frame 11, the circuit 51 does not form a closed circuit, and thus no current flows inside.

[0040] The holding surface position detection section 55 acquires the position (height) in the Z direction of the cutting unit 20 from the Z-direction position detection unit 31 at the time when the current value detected by the current meter 54 reaches a prescribed threshold value or more. The holding surface position detection section 55 detects the position in the Z direction of the holding surface 14 measured according to the front end 25 of the cutting edge of the cutting tool 21 as the position in the Z direction of the cutting unit 20 acquired from the Z-direction position detection unit 31, the height of the holding surface 14, and the like. Figure 4 ​The position of the holding surface (Z2) is determined, and the detected holding surface position Z2 is output to the control unit 80.

[0041] The correction value calculation unit 56 obtains the tip position Z1 of the cutting tool 21 detected by the tip position detection unit 48 of the setting unit 40 from the control unit 80. The correction value calculation unit 56 obtains the holding surface position Z2 detected by the holding surface position detection unit 55. The correction value calculation unit 56 calculates the difference in the Z direction between the tip position Z1 and the holding surface position Z2 of the cutting tool 21, and uses this difference as the correction value ΔZ (refer to...). Figure 4 The correction value ΔZ is output and stored in the control unit 80. The correction value ΔZ is a parameter representing the positional relationship between the light-emitting part 42 and the light-receiving part 43 and the holding surface 14 in the Z direction. After the holding table 10 is replaced, the correction value calculation unit 56 must perform a calculation of the correction value ΔZ. Here, the machining device 1 does not need to update the correction value ΔZ if the difference in the Z direction between the tip position Z1 of the cutting tool 21 and the holding surface position Z2 does not change. Therefore, in order to improve productivity and reduce the possibility of the cutting tool 21 cutting into the holding surface 14 and causing blockage, the detection operation of the holding surface position Z2 is not performed. Instead, the setting unit 40 detects the tip position Z1 of the cutting tool 21 and readjusts the position of the tip 25 of the cutting edge of the cutting tool 21 in the Z direction (cutting direction).

[0042] In Embodiment 1, the correction unit 50 includes the same computer system as the setting unit 40. The correction unit 50 has the same arithmetic processing unit, storage device, and input / output interface device as the setting unit 40. In Embodiment 1, the functions of the maintaining surface position detection unit 55 and the correction value calculation unit 56 are implemented by the arithmetic processing unit of the computer system included in the correction unit 50 executing a computer program stored in the storage device of the computer system included in the correction unit 50.

[0043] In implementation method 1, such as Figure 1 and Figure 4 As shown, the temperature measuring device 61 is disposed inside the component supporting the holding table 10, and measures the temperature T1 of the holding table 10 and the vicinity of the holding table 10. The temperature measuring device 61 is not limited to this in the present invention; it may also be disposed inside the holding table 10, or it may be disposed in contact with the outside of the holding table 10. The temperature measuring device 61 outputs the measured temperature T1 to the control unit 80.

[0044] In implementation method 1, such as Figure 1 and Figure 4As shown in FIG. 1, a temperature measurer 62 is provided in the vicinity of the spindle 22 of the cutting unit 20, and measures the temperature T2 of the cutting unit 20 and the vicinity of the cutting unit 20. The temperature measurer 62 is not limited to this in the present application, and can be provided in contact with the outside of the cutting unit 20, or in the inside of a member that supports the cutting unit 20. The temperature measurer 62 outputs the measured temperature T2 to the control section 80.

[0045] In Embodiment 1, as shown in FIG. 1, a temperature measurer 61 is provided in the vicinity of the holding table 10, and measures the temperature Tl of the holding table 10 and the vicinity of the holding table 10. The temperature measurer 61 is not limited to this in the present application, and can be provided in the inside of the holding table 10, or in contact with the outside of the holding table 10. The temperature measurer 61 outputs the measured temperature Tl to the control section 80. Figure 1 Figure 4 As shown in FIG. 1, a temperature measurer 63 is provided in the inside of a member that supports the setting unit 40, and measures the temperature T3 of the setting unit 40 and the vicinity of the setting unit 40. The temperature measurer 63 is not limited to this in the present application, and can be provided in the inside of the setting unit 40, or in contact with the outside of the setting unit 40. The temperature measurer 63 outputs the measured temperature T3 to the control section 80.

[0046] In Embodiment 1, the temperature measurers 61, 62, 63 measure the temperatures Tl, T2, T3 continuously or at certain intervals when the main power source of the processing device 1 is turned on. In Embodiment 1, the temperature measurers 61, 62, 63 use a thermocouple that measures temperature according to the deformation of a bimetal, or an electrical thermometer that measures temperature according to the change in resistance. In Embodiment 1, the temperature measurers 61, 62, 63 are provided in the vicinity of the holding table 10, the cutting unit 20, and the setting unit 40, which are structural elements in which the temperature in the processing device 1 greatly changes and the temperature in the processing device 1 greatly affects the variation of the front end position Zl of the cutting tool 21, the holding surface position Z2, and the correction value ΔZ, or in a member that supports these structural elements, but are not limited to this in the present application, and can be provided at any position in the processing device 1. In addition, in Embodiment 1, the temperature measurers 61, 62, 63 are provided at three positions in the processing device 1, but are not limited to this in the present application, and can be provided at one position, at two positions, or at four or more positions.

[0047] ​In Embodiment 1, the imaging unit 70 is fixed to the cutting unit 20 in a manner that allows it to move integrally with the cutting unit 20. The imaging unit 70 has an imaging element that captures images of the front view and predetermined dividing lines of the workpiece 100 held by the holding table 10 before cutting. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary Metal-Oxide-Semiconductor) imaging element. The imaging unit 70 captures images of the front view, etc., of the workpiece 100 held by the holding table 10 before cutting, obtaining images for alignment purposes such as aligning the workpiece 100 with the cutting tool 21, and outputs the obtained images to the control unit 80.

[0048] The control unit 80 controls each structural element of the machining apparatus 1, causing the machining apparatus 1 to perform various actions related to cutting and machining the workpiece 100. The control unit 80 includes a position information storage unit 81. The control unit 80 stores position information data 200 (see reference 200) in the position information storage unit 81. Figure 5 The control unit 80 refers to the position information data 200 stored in the position information storage unit 81 and compares the temperatures T1, T2, and T3 obtained from the temperature measuring devices 61, 62, and 63 at any given time with the temperatures T1, T2, and T3 stored in the position information data 200 to determine whether the change in temperature T1, T2, and T3 since the time stored in the position information data 200 exceeds a threshold. Here, the change in temperature T1, T2, and T3 is the difference between the temperatures T1, T2, and T3 obtained from the temperature measuring devices 61, 62, and 63 at any given time and the temperatures T1, T2, and T3 stored in the position information data 200. In addition, the threshold used as the criterion for determining the change in temperature T1, T2, and T3 is appropriately determined in advance, for example, by the amount of temperature rise or fall when the structural element on which the temperature measuring devices 61, 62, and 63 are installed expands or contracts by about ±1 μm when the Z-direction position moves by about ±1 μm. Furthermore, the threshold values ​​used as the criteria for determining the variation in temperatures T1, T2, and T3 can be the same or different for each other. For example, the control unit 80 can also acquire the information contained in the position information data 200 when changing the holding table 10.

[0049] Figure 5 It is shown Figure 1 A diagram illustrating an example of location information data 200 stored in the location information storage unit 81. In Embodiment 1, as... Figure 5As shown, the position information storage section 81 stores the temperatures T1, T2, T3 acquired by the control section 80 from the temperature measurers 61, 62, 63, the tip position Z1 of the cutting tool 21 acquired from the tip position detection section 48, the holding surface position Z2 acquired from the holding surface position detection section 55, and the correction value ΔZ acquired from the correction value calculation section 56 in the position information data 200 in correspondence with each other.

[0050] In Embodiment 1, the control section 80 includes the same computer system as the setting unit 40 and the correction unit 50. The control section 80 has the same arithmetic processing device, storage device, and input / output interface device as the setting unit 40 and the correction unit 50. In Embodiment 1, the functions of the control section 80 are realized by the arithmetic processing device of the computer system included in the control section 80 executing the computer program stored in the storage device of the computer system included in the control section 80. In Embodiment 1, the functions of the position information storage section 81 are realized by the storage device of the computer system included in the control section 80.

[0051] The processing device 1 further has a cassette placement table 91, a cleaning unit 92, and a non-illustrated conveyance unit. The cassette placement table 91 is a placement table that places a cassette 95 that is a storage device for storing a plurality of workpieces 100, and raises and lowers the placed cassette 95 in the Z-axis direction. The cleaning unit 92 cleans the workpiece 100 after cutting processing, and removes foreign matter such as cutting chips attached to the workpiece 100. The non-illustrated conveyance unit conveys the workpiece 100 before cutting processing from inside the cassette 95 to the holding table 10, conveys the workpiece 100 after cutting processing from the holding table 10 to the cleaning unit 92, and conveys the cleaned workpiece 100 from the cleaning unit 92 to inside the cassette 95.

[0052] Next, in this specification, an example of the operation processing of the processing device 1 of Embodiment 1 will be described with reference to the drawings. Figure 6 is a flowchart showing an example of the sequence of the operation processing of the processing device 1 of Embodiment 1.

[0053] Regarding the processing device 1, when the main power source is switched from off to on at the time of startup, when the holding table 10 or the cutting tool 21 is replaced, or when a prescribed operation instruction from the administrator or the operator of the processing device 1 is accepted, before starting the cutting processing of the workpiece 100, in order to correct the tip position Z1 of the cutting tool 21, the holding surface position Z2, and the correction value ΔZ, the steps 1001 to 1006 of Figure 6 are implemented.

[0054] The temperature measurers 61, 62, 63 of the processing device 1 measure the temperatures T1, T2, T3, and output the measurement results to the control section 80 Figure 6the step 1001). The processing device 1 lowers the cutting unit 20 by the Z-feed unit 30, makes the front end 25 of the cutting edge of the cutting tool 21 intrude into the groove 41-3 of the setting unit 40, detects the front end position Zl of the cutting tool 21 by the front end position detecting section 48 of the setting unit 40, and outputs to the control section 80 Figure 6 the step 1002).

[0055] The processing device 1 lowers the cutting unit 20 by the Z-feed unit 30, makes the front end 25 of the cutting edge of the cutting tool 21 contact with the upper surface 13 of the frame 11 of the holding stage 10, detects the holding surface position Z2 by the holding surface position detecting section 55 of the correction unit 50, and outputs to the control section 80 Figure 6 the step 1003).

[0056] The processing device 1 calculates the correction value ΔZ from the front end position Zl of the cutting tool 21 detected by the step 1002 and the holding surface position Z2 detected by the step 1003 by the correction value calculating section 56 of the correction unit 50, and outputs to the control section 80 Figure 6 the step 1004).

[0057] In addition, in the present application, the processing device 1 can implement the steps 1001 to 1004 in any order if the step 1004 is implemented after the steps 1002 and 1003.

[0058] The control section 80 of the processing device 1 causes the position information storage section 81 to store the temperature Tl, T2, T3 measured by the step 1001, the front end position Zl of the cutting tool 21 detected by the step 1002, the holding surface position Z2 detected by the step 1003, and the correction value ΔZ calculated by the step 1004 as the position information data 200 in correspondence with each other Figure 6 the step 1005).

[0059] The processing device 1 carries the workpiece 100 to the holding surface 14 of the holding stage 10, holds the workpiece 100 by suction by the holding stage 10, and photographs the front surface of the workpiece 100 on the holding stage 10 by the photographing unit 70, thereby performing alignment of the workpiece 100 with the cutting tool 21. The processing device 1 adjusts the position of the front end 25 of the cutting edge of the cutting tool 21 in the Z direction (the cutting-in direction) after performing the alignment, with reference to the position information data 200 stored in the position information storage section 81 by the step 1005 Figure 6 the step 1006).

[0060] The machining apparatus 1 begins cutting the workpiece 100 using the cutting tool 21, whose Z-direction position was adjusted in step 1006. Figure 6 (Step 1007). While rotating the cutting tool 21, whose Z-direction position was adjusted in step 1006, the machining apparatus 1 adjusts the Y-direction (indexing direction) position of the cutting tool 21 to the predetermined dividing line via the Y-feed unit, and moves the cutting tool 21 and the workpiece 100 on the holding table 10 relative to each other in the X-direction (machining feed direction) along the predetermined dividing line via the X-feed unit, thereby performing cutting machining on the workpiece 100 along the predetermined dividing line.

[0061] After the cutting of the workpiece 100 begins (step 1007), the temperature measuring devices 61, 62, and 63 of the processing apparatus 1 continuously or at regular intervals measure the temperatures T1, T2, and T3, and output the measurement results to the control unit 80. Each time temperatures T1, T2, and T3 are output from the temperature measuring devices 61, 62, and 63, the control unit 80 of the processing apparatus 1 compares the output temperatures T1, T2, and T3 with the temperatures T1, T2, and T3 stored in the position information data 200 from the previous step 1005, and determines whether the change in temperatures T1, T2, and T3 since the time of the previous step 1005 exceeds a threshold (…). Figure 6 Step 1008).

[0062] If, since the time of step 1005, the change in temperature T1, T2, or T3 exceeds a threshold ("Yes" in step 1008), the machining apparatus 1 retracts the cutting tool 21 from the workpiece 100, thereby interrupting the cutting process of the workpiece 100. Figure 6 In step 1009), the temperatures T1, T2, and T3 measured in the previous step 1008 are regarded as the temperatures measured in step 1001. Steps 1002 to 1006 are performed again to update the front end position Z1, the holding face position Z2, and the correction value ΔZ of the cutting tool 21, and to readjust the position of the front end 25 of the cutting edge of the cutting tool 21 in the Z direction (cutting direction).

[0063] If the change in any of the temperatures T1, T2, and T3 since the previous step 1005 has not exceeded the threshold ("No" in step 1008), the processing device 1 continues to perform cutting processing on the workpiece 100. Figure 6 Step 1010). Before the cutting of the workpiece 100 is completed (in...) the machining device 1... Figure 6 If step 1011 is "No", repeat step 1008 until the cutting of the workpiece 100 is completed (in ​If the result of the determination in step 1011 is "Yes" (i.e., if the result of the determination in step 1011 is "Yes" in the case where the machining device 1 is in the state of the processing shown in FIG. 1), the series of processing is ended.

[0064] In addition, in the case where the main power supply is kept on, the holding table 10 and the cutting tool 21 are not replaced, and the same kind of workpiece 100 as the workpiece 100 on which cutting processing has been performed before is subjected to cutting processing again, and the like, the control section 80 compares the temperatures T1, T2, T3 measured by the temperature measurers 61, 62, 63 and the temperatures T1, T2, T3 last stored in the position information data 200, and determines whether the amounts of change in the temperatures T1, T2, T3 from the time point at which the temperatures T1, T2, T3 were last stored in the position information data 200 exceed the threshold values. In the case where the amount of change in at least any one of the temperatures T1, T2, T3 from the time point at which the temperatures T1, T2, T3 were last stored in the position information data 200 exceeds the threshold value, the machining device 1 performs the same processing as the processing of steps 1002 to 1006 again, updates the front end position Z1 of the cutting tool 21, the holding surface position Z2, and the correction value ΔZ, and readjusts the position of the front end 25 of the cutting edge of the cutting tool 21 in the Z direction (the cutting-in direction). On the other hand, in the case where none of the amounts of change in the temperatures T1, T2, T3 from the time point at which the temperatures T1, T2, T3 were last stored in the position information data 200 exceeds the threshold value, the machining device 1 takes into account only the change in the front end position Z1 of the cutting tool 21 due to the wear of the cutting edge of the cutting tool 21, performs only the detection of the front end position Z1 of the cutting tool 21 based on the setting unit 40, calculates the reference position of the cutting tool 21, that is, the holding surface position Z2 at the time of cutting processing using the correction value ΔZ last stored in the position information data 200 by the control section 80, and adjusts the position of the front end 25 of the cutting edge of the cutting tool 21 in the Z direction (the cutting-in direction) based on the calculated holding surface position Z2.

[0065] In addition, in the case where the main power supply is kept on, the holding table 10 and the cutting tool 21 are not replaced, and the same kind of workpiece 100 as the workpiece 100 on which cutting processing has been performed before is subjected to cutting processing again, and the like, the control section 80 compares the temperatures T1, T2, T3 measured by the temperature measurers 61, 62, 63 and the temperatures T1, T2, T3 last stored in the position information data 200, and determines whether the amounts of change in the temperatures T1, T2, T3 from the time point at which the temperatures T1, T2, T3 were last stored in the position information data 200 exceed the threshold values. In the case where the amount of change in at least any one of the temperatures T1, T2, T3 from the time point at which the temperatures T1, T2, T3 were last stored in the position information data 200 exceeds the threshold value, the machining device 1 performs the same processing as the processing of steps 1002 to 1006 again, updates the front end position Z1 of the cutting tool 21, the holding surface position Z2, and the correction value ΔZ, and readjusts the position of the front end 25 of the cutting edge of the cutting tool 21 in the Z direction (the cutting-in direction). On the other hand, in the case where none of the amounts of change in the temperatures T1, T2, T3 from the time point at which the temperatures T1, T2, T3 were last stored in the position information data 200 exceeds the threshold value, the machining device 1 takes into account only the change in the front end position Z1 of the cutting tool 21 due to the wear of the cutting edge of the cutting tool 21, performs only the detection of the front end position Z1 of the cutting tool 21 based on the setting unit 40, calculates the reference position of the cutting tool 21, that is, the holding surface position Z2 at the time of cutting processing using the correction value ΔZ last stored in the position information data 200 by the control section 80, and adjusts the position of the front end 25 of the cutting edge of the cutting tool 21 in the Z direction (the cutting-in direction) based on the calculated holding surface position Z2.

[0066] In the processing apparatus 1 of Embodiment 1 having the above structure, the control section 80 is able to update the correction value ΔZ, which is the difference between the front end position Z1 of the cutting tool 21 and the holding surface position Z2, in the case where the variation in the temperatures T1, T2, T3 measured by the temperature measurers 61, 62, 63 exceeds the threshold value, and is able to adjust the position of the front end 25 of the cutting edge of the cutting tool 21 in the Z direction (the cutting-in direction) in accordance with the updated correction value ΔZ, and thus functions to accurately detect and control the depth of the cutting tool 21 into the workpiece 100 in accordance with the correction value ΔZ that is appropriately updated based on the variation in the temperatures T1, T2, T3.

[0067] In addition, the processing apparatus 1 of Embodiment 1 directly adopts the correction value ΔZ that is just calculated and stored, in the case where the variation in the temperatures T1, T2, T3 measured by the temperature measurers 61, 62, 63 does not exceed the threshold value, and only implements the detection of the front end position Z1 of the cutting tool 21 by the setting section 40, and adjusts the position of the front end 25 of the cutting edge of the cutting tool 21 in the Z direction (the cutting-in direction). In the past, after the detection of the holding surface position by the contact with the holding surface at the time of replacement of the holding table, the front end position of the tool is detected by the light emitting section and the light receiving section, and the sensor alignment setting that stores the positional relationship of the holding surface and the light emitting section and the light receiving section is performed. Also, in the past, it was assumed that the positional relationship thereof does not change thereafter, and only the position of the front end of the cutting edge of the cutting tool in the Z direction (the cutting-in direction) was adjusted by the detection based on the light emitting section and the light receiving section, and thus in the case where the positional relationship of the holding surface and the light emitting section and the light receiving section changes due to the temperature change, the depth of the cutting tool into the workpiece could not be accurately detected and controlled. Therefore, the processing apparatus 1 of Embodiment 1 re-detects the height of the holding surface 14 (the holding surface position Z2) and the height of the cutting tool 21 (the front end position Z1) detected by the setting section 40 and updates the correction value ΔZ in the case where the variation in the temperatures T1, T2, T3 measured by the temperature measurers 61, 62, 63 exceeds the threshold value, and thus is able to accurately detect and control the depth of the cutting tool 21 into the workpiece 100 compared to the past. In addition, the processing apparatus 1 of Embodiment 1 only implements the detection process of the holding surface position Z2 by the correction section 50 in order to update the correction value ΔZ in the case where the variation in the temperatures T1, T2, T3 exceeds the threshold value, and thus is able to reduce the possibility of the clogging of the cutting tool 21 by reducing the opportunities of the contact of the cutting tool 21 with the upper surface 13 of the frame 11 of the holding table 10 as much as possible.

[0068] In addition, in the processing apparatus 1 of Embodiment 1, the correction unit 50 moves the cutting unit 20 in the Z direction, and detects the position of the cutting unit 20 in the Z direction at the time when the electrical conduction with the holding table 10 is detected as the height of the holding surface 14 (holding surface position Z2). Therefore, the processing apparatus 1 of Embodiment 1 can accurately detect and control the depth of cut of the cutting tool 21 into the workpiece 100.

[0069] 〔Embodiment 2〕

[0070] The processing apparatus 1 of Embodiment 2 of the present application will be described. In the processing apparatus 1 of Embodiment 2, the photographing unit 70 that moves integrally with the cutting unit 20 substantially implements the function of detecting the holding surface position Z2 implemented by the correction unit 50 in Embodiment 1. Specifically, in Embodiment 2, the photographing unit 70 acquires the position of the cutting unit 20 in the Z direction at the time when the focal point of the photographing unit 70 is aligned with the upper surface 13 of the frame 11 of the holding table 10 that is in the same plane as the holding surface 14 from the Z direction position detection unit 31, and outputs the acquired position of the cutting unit 20 in the Z direction to the control section 80.

[0071] Here, by taking into account the difference in the position in the Z direction of the cutting unit 20 and the photographing unit 70, the height in the Z direction of the photographing unit 70 can be calculated, and therefore the position of the cutting unit 20 in the Z direction at the time when the focal point of the photographing unit 70 is aligned with the upper surface 13 is a detection value equivalent to the height in the Z direction of the photographing unit 70. In addition, by further taking into account the distance between the photographing unit 70 and the upper surface 13 of the frame 11 of the holding table 10 calculated from the focal point of the photographing unit 70, the holding surface position Z2 can be calculated, and therefore the position of the cutting unit 20 in the Z direction at the time when the focal point of the photographing unit 70 is aligned with the upper surface 13 is a detection value equivalent to the holding surface position Z2. In view of this, the control section 80 can substantially treat the position of the cutting unit 20 in the Z direction at the time when the focal point of the photographing unit 70 is aligned with the upper surface 13 as equivalent to the holding surface position Z2.

[0072] The machining device 1 of Embodiment 2 processes the position of the cutting unit 20 in the Z direction at the time when the focal point of the imaging unit 70 is aligned with the height of the holding surface 14 equally to the holding surface position Z2, so it is possible to further prevent clogging of the cutting tool 21 and improve productivity compared to Embodiment 1 by avoiding contact of the cutting tool 21 with the upper surface 13 of the frame 11 of the holding table 10. In addition, the machining device 1 of Embodiment 2, like Embodiment 1, after detecting the height (holding surface position Z2) of the holding surface 14 by causing the cutting tool 21 to cut into the frame 11 of the holding surface 14 when replacing the holding table 10, has the effect of being able to accurately detect and control the depth of cut of the cutting tool 21 into the workpiece 100 compared to the conventional method of adjusting the depth of cut of the cutting tool into the workpiece based only on detection by the light emitting portion and the light receiving portion.

[0073] In addition, the present application is not limited to the above-described embodiments. That is, various modifications can be made within the scope of the gist of the present application.

Claims

1. A processing apparatus, characterized in that, The processing device has the following features: A holding table having a holding surface for holding the workpiece; The cutting unit uses a cutting tool to cut the workpiece held by the holding table; The Z-feed unit moves the cutting unit along the Z direction, which is perpendicular to the holding surface. The setting unit has a light-emitting part and a light-receiving part that are separated by the width for the cutting tool to penetrate, and the setting unit detects the tip position of the cutting tool based on the light received by the light-receiving part. The correction unit detects the actual position of the holding surface in the Z direction and stores the difference between the cutting tool tip position detected by the setting unit and the holding surface in the Z direction as a correction value. A temperature measuring device is installed inside the processing device to measure the temperature; The imaging unit photographs the workpiece held by the holding table; and The control unit drives each unit. If the temperature variation measured by the temperature measuring device exceeds the threshold from any time, the control unit will perform the operation of detecting the actual Z-direction position of the holding surface itself using the correction unit and updating the correction value, and the detection of the tip position of the cutting tool performed by the setting unit will be performed again.

2. A processing apparatus, characterized in that, The processing device has the following features: A holding table having a holding surface for holding the workpiece; The cutting unit uses a cutting tool to cut the workpiece held by the holding table; The Z-feed unit moves the cutting unit along the Z direction, which is perpendicular to the holding surface. The setting unit has a light-emitting part and a light-receiving part that are separated by the width for the cutting tool to penetrate, and the setting unit detects the tip position of the cutting tool based on the light received by the light-receiving part. The correction unit detects the position of the holding surface in the Z direction and stores the difference between the tip position of the cutting tool detected by the setting unit and the Z direction of the holding surface as a correction value. A temperature measuring device is installed inside the processing device to measure the temperature; The imaging unit photographs the workpiece held by the holding table; and The control unit drives each unit. The correction unit moves the cutting unit along the Z-direction and detects the Z-direction position of the cutting unit when electrical conduction with the holding table is detected as the height of the holding surface. If the temperature variation measured by the temperature measuring device exceeds the threshold from any time, the control unit will re-perform the operation of detecting the height of the holding surface using the correction unit and updating the correction value, and the detection of the tip position of the cutting tool performed by the setting unit.

3. A processing apparatus, characterized in that, The processing device has the following features: A holding table having a holding surface for holding the workpiece; The cutting unit uses a cutting tool to cut the workpiece held by the holding table; The Z-feed unit moves the cutting unit along the Z direction, which is perpendicular to the holding surface. The setting unit has a light-emitting part and a light-receiving part that are separated by the width for the cutting tool to penetrate, and the setting unit detects the tip position of the cutting tool based on the light received by the light-receiving part. The correction unit detects the position of the holding surface in the Z direction and stores the difference between the tip position of the cutting tool detected by the setting unit and the Z direction of the holding surface as a correction value. A temperature measuring device is installed inside the processing device to measure the temperature; The imaging unit photographs the workpiece held by the holding table; and The control unit drives each unit. The correction unit stores the Z-direction position of the imaging unit when its focus is aligned with the holding surface as the Z-direction position of the holding surface. If the temperature variation measured by the temperature measuring device exceeds the threshold from any time, the control unit will perform the operation of detecting the position of the holding surface in the Z direction using the correction unit and updating the correction value, and the detection of the tip position of the cutting tool performed by the setting unit will be performed again.

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