A circuit board assembly, terminal

Abstract

The application discloses a circuit board assembly and a terminal, relates to the technical field of electronic devices, and aims to solve the problem that various electronic components cannot be integrated on a circuit board simultaneously in the case that the circuit board occupies limited planar area in an entire electronic product. The circuit board assembly comprises at least two layers of circuit boards and at least one first adapter plate. The circuit board has oppositely arranged upper and lower surfaces. The upper and lower surfaces of the circuit board are used for integrating electronic components. In addition, the first adapter plate is arranged on at least one side of the at least two layers of circuit boards and is electrically connected with the at least two layers of circuit boards.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic devices, and in particular to a circuit board assembly and a terminal. BACKGROUND

[0002] At least one circuit board is usually arranged in a consumer electronic product. The circuit board integrates a plurality of electronic components, such as memories, processors, etc.

[0003] However, as the functions of electronic products become more and more diversified, for example, in order to realize the functions of video and audio, entertainment, etc., the above-mentioned electronic products need to provide sufficient space inside for display assemblies, camera assemblies, etc. In addition, in order to improve the endurance of electronic products, larger capacity and volume batteries need to be arranged inside the electronic products to realize long standby time. In addition, with the development of wireless communication, more different types of antennas are arranged inside the electronic products to realize 4G, wireless fidelity (Wi-Fi), global positioning system (GPS), or Bluetooth wireless communication connection. Sufficient space needs to be arranged between different antennas to avoid mutual interference between the antennas.

[0004] In this case, the smaller the planar area occupied by the above-mentioned circuit board in the whole electronic product, the less area the circuit board can provide for integrating electronic components. Moreover, as the functions of electronic products become more and more diversified, the number of electronic components integrated on the above-mentioned circuit board also gradually increases, which cannot meet the demand of occupying more space for various electronic components. SUMMARY

[0005] The present application provides a circuit board assembly and a terminal, which are used to solve the problem that various electronic components cannot be simultaneously integrated on the circuit board when the planar area occupied by the circuit board in the whole electronic product is limited.

[0006] To achieve the above-mentioned purpose, the present application adopts the following technical solutions:

[0007] In a first aspect, a circuit board assembly is provided. The circuit board assembly includes at least two layers of circuit boards and at least one first adapter plate. The circuit boards have opposite upper and lower surfaces. The upper and lower surfaces of the circuit boards are configured to integrate electronic components. The first adapter plate is disposed on at least one side of the at least two layers of circuit boards and is electrically connected to the at least two layers of circuit boards. In the circuit board assembly, each layer of circuit board and the electronic components integrated thereon form a PCBA that can independently implement at least one function. In this case, a circuit module that occupies a large area of a PCB can be divided into a plurality of smaller unit modules. Based on this, each layer of circuit board and the electronic components integrated thereon in the circuit board assembly can be the unit module. In addition, the circuit board assembly further includes the first adapter plate. The first adapter plate enables different layers of circuit boards to be electrically connected, thereby enabling the plurality of unit modules to transmit signals. The plurality of unit modules transmit signals to each other during operation, thereby implementing the function of the circuit module that occupies a large area of the PCB. Since the circuit board has a small planar area, stacking multiple layers of circuit boards that carry electronic components can reduce the space occupied by the circuit board assembly in the terminal component space in the plane, thereby saving more space for arranging other devices or larger capacity batteries. In addition, when a terminal can implement more functions, more electronic components need to be arranged in the terminal. In this case, the number of circuit boards in the circuit board assembly can be increased to provide sufficient space for arranging electronic components along the height direction of the circuit board assembly, thereby achieving the purpose of integrating more electronic components. In this case, the circuit board assembly has increased in height, and the area of the circuit board assembly in the plane can remain unchanged. Therefore, the integration of the terminal can be improved without affecting the space for arranging components in the plane of the terminal.

[0008] In a first possible implementation manner of the first aspect, the first adapter plate is electrically connected to the surface of the at least two layers of circuit boards. Therefore, when the circuit board assembly is returned to the factory for repair, the first adapter plate can be more easily peeled off from the surface of the circuit board, thereby reducing repair costs.

[0009] In combination with the first possible implementation manner of the first aspect, one first adapter plate is electrically connected to the side surface of the at least two layers of circuit boards on the same side. Therefore, the first adapter plate does not occupy the area of the upper and lower surfaces of the circuit board, so that more electronic components can be arranged on the upper and lower surfaces of the circuit board.

[0010] With reference to a first possible implementation manner of the first aspect, one first adapter plate is electrically connected to the upper surface or the lower surface of one of the at least two circuit boards and is electrically connected to the side surface of the remaining at least one circuit board. The technical effect of the scheme that the first adapter plate is electrically connected to the side surface of the circuit board is as described above, and will not be repeated here.

[0011] With reference to a first possible implementation manner of the first aspect, one first adapter plate is electrically connected to the upper surface of one of the at least two circuit boards at one end and is electrically connected to the lower surface of the remaining one of the at least two circuit boards at the other end.

[0012] With reference to a first possible implementation manner of the first aspect, the circuit board assembly includes at least three circuit boards. One first adapter plate is electrically connected to the upper surface of the upper circuit board at one end and is electrically connected to the lower surface of the lower circuit board at the other end. The first adapter plate is further electrically connected to the side surface of at least one circuit board between the upper circuit board and the lower circuit board. The technical effect of the scheme that the first adapter plate is electrically connected to the side surface of the circuit board is as described above, and will not be repeated here.

[0013] With reference to a first possible implementation manner of the first aspect, the first adapter plate is a printed circuit board or a flexible circuit board, and one first adapter plate is arranged on each side of each of the at least two circuit boards. The multiple first adapter plates arranged around the at least two circuit boards improve the structural stability of the multiple circuit boards in the circuit board assembly.

[0014] With reference to a first possible implementation manner of the first aspect, the first adapter plate is a flexible circuit board, and each side of each of the at least two circuit boards is wrapped by a first adapter plate. The flexible first adapter plates arranged around the at least two circuit boards improve the structural stability of the multiple circuit boards in the circuit board assembly.

[0015] With reference to a first possible implementation manner of the first aspect, the side surface of the circuit board is provided with multiple first electric connectors arranged at intervals. The first electric connectors are electrically connected to the metal wires inside the circuit board. The first adapter plate is provided with multiple second electric connectors arranged at intervals. The second electric connectors are electrically connected to the metal wires inside the first adapter plate. One first electric connector is electrically connected to one second electric connector. The first electric connectors and the second electric connectors can be solder pads.

[0016] With reference to a first possible implementation manner of the first aspect, the upper surface of the circuit board is provided with multiple third electric connectors arranged at intervals. The third electric connectors are electrically connected to the metal wires inside the circuit board. The first adapter plate is provided with multiple second electric connectors arranged at intervals. The second electric connectors are electrically connected to the metal wires inside the first adapter plate. One second electric connector is electrically connected to one third electric connector. The third electric connectors can be solder pads.

[0017] In a second possible implementation of the first aspect, the circuit board assembly further includes at least one second adapter board, which is disposed on different sides of at least two circuit boards from the first adapter board; the second adapter board is a flexible circuit board. One end of the second adapter board is embedded in one of the at least two circuit boards, and the second adapter board and the circuit board are electrically connected through metallized holes disposed on the second adapter board and the circuit board; the other end of the second adapter board is electrically connected to at least one of the remaining at least two circuit boards. Since one end of the second adapter board is embedded in one circuit board, it does not occupy the area of ​​the upper and lower surfaces of the circuit board.

[0018] In a third possible implementation of the first aspect, the circuit board assembly further includes at least one insulating support pillar disposed between two adjacent circuit board layers to support them. This allows the insulating support pillar to improve the structural stability and reliability of the circuit board assembly during use, ensuring that the spacing between adjacent circuit board layers remains constant.

[0019] In conjunction with the third possible implementation of the first aspect, the insulating support post comes into contact with a portion of the upper or lower surface of the circuit board where no electronic components are located. This avoids contact between the insulating support post and the electronic components, preventing damage to the electronic components caused by the force exerted on the insulating support post during use.

[0020] Secondly, a terminal is provided, including a circuit board assembly. The circuit board assembly includes at least two circuit boards and at least one first adapter plate. The circuit boards have upper and lower surfaces disposed opposite to each other. The first adapter plate is disposed on at least one side of the at least two circuit boards and is electrically connected to the at least two circuit boards. The terminal also includes a plurality of electronic components, one of which is disposed on the upper or lower surface of one of the circuit boards in the circuit board assembly. The above-described terminal has the same technical effects as the circuit board assembly provided in the foregoing embodiments, and will not be repeated here.

[0021] In a first possible implementation of the second aspect, the first adapter board is electrically connected to the surface of at least two circuit boards. Therefore, when the circuit board assembly is returned to the factory for repair, it is easier to peel the first adapter board off the surface of the circuit boards, thereby reducing repair costs.

[0022] In conjunction with the first possible implementation of the second aspect, a first adapter board is electrically connected to the side of at least two circuit boards located on the same side. Therefore, the first adapter board does not occupy the area of ​​the upper and lower surfaces of the aforementioned circuit boards, allowing more electronic components to be mounted on the upper and lower surfaces of the circuit boards.

[0023] In conjunction with the first possible implementation of the second aspect, a first adapter board is electrically connected to the upper or lower surface of one of at least two circuit boards, and electrically connected to the side of the remaining at least one circuit board. The technical advantages of the scheme where the first adapter board is electrically connected to the side of the circuit board are the same as described above, and will not be repeated here.

[0024] In conjunction with the first possible implementation of the second aspect, one end of a first adapter board is electrically connected to the upper surface of one of at least two circuit boards, and the other end is electrically connected to the lower surface of the remaining circuit boards.

[0025] In conjunction with the first possible implementation of the second aspect, the circuit board assembly includes at least three circuit boards. One end of a first adapter board is electrically connected to the upper surface of the upper circuit board of the at least three circuit boards, and the other end is electrically connected to the lower surface of the lower circuit board. The first adapter board is also electrically connected to the side of at least one circuit board between the upper and lower circuit boards of the at least three circuit boards. The technical advantages of the scheme where the first adapter board is electrically connected to the side of the circuit board are the same as described above, and will not be repeated here.

[0026] In conjunction with the first possible implementation of the second aspect, the first adapter board is a printed circuit board or a flexible circuit board, and a first adapter board is provided on each side of at least two circuit boards. By providing multiple first adapter boards that are arranged around at least two circuit boards, the structural stability of the multi-layer circuit boards in the circuit board assembly is improved.

[0027] In conjunction with the first possible implementation of the second aspect, the first adapter plate is a flexible circuit board, and each side of at least two circuit boards is wrapped by a first adapter plate. By using a flexible first adapter plate arranged around at least two circuit boards, the structural stability of the multi-layer circuit boards in the circuit board assembly is improved.

[0028] In conjunction with the first possible implementation of the second aspect, the side of the circuit board has a plurality of spaced-apart first electrical connectors. The first electrical connectors are electrically connected to metal wiring inside the circuit board. The first adapter plate has a plurality of spaced-apart second electrical connectors. The second electrical connectors are electrically connected to metal wiring inside the first adapter plate. One first electrical connector is electrically connected to one second electrical connector. The aforementioned first and second electrical connectors can be solder pads.

[0029] In conjunction with the first possible implementation of the second aspect, the upper surface of the circuit board has a plurality of spaced-apart third electrical connectors. These third electrical connectors are electrically connected to the metal wiring inside the circuit board. The first adapter plate has a plurality of spaced-apart second electrical connectors; these second electrical connectors are electrically connected to the metal wiring inside the first adapter plate. One second electrical connector is electrically connected to one third electrical connector. The aforementioned third electrical connectors can be solder pads.

[0030] In a second possible implementation of the second aspect, the circuit board assembly further includes at least one second adapter board, which is disposed on different sides of the at least two circuit board layers, along with the first adapter board; the second adapter board is a flexible circuit board. One end of the second adapter board is embedded in one of the at least two circuit board layers, and the second adapter board and the circuit board are electrically connected through metallized vias disposed on the second adapter board and the circuit board; the other end of the second adapter board is electrically connected to at least one of the remaining at least two circuit board layers. Since one end of the second adapter board is embedded in one circuit board layer, it does not occupy the area of ​​the upper and lower surfaces of the circuit board.

[0031] In a third possible implementation of the second aspect, the circuit board assembly further includes at least one insulating support pillar disposed between two adjacent circuit board layers to support them. This allows the insulating support pillar to improve the structural stability and reliability of the circuit board assembly during use, ensuring that the spacing between adjacent circuit board layers remains constant.

[0032] In conjunction with the third possible implementation of the second aspect, the insulating support pillar comes into contact with a portion of the upper or lower surface of the circuit board where no electronic components are located. This avoids contact between the insulating support pillar and the electronic components, preventing damage to these components caused by the insulating support pillar applying force to them during use.

[0033] As described above, this application provides a circuit board assembly and a terminal. In the circuit board assembly, each circuit board layer and the electronic components integrated on it, forming a PCBA, can serve as a unit module capable of independently performing at least one function. In this case, a circuit module occupying a large PCB area can be divided into multiple smaller unit modules. Based on this, each circuit board layer and the multiple electronic components integrated on it can serve as a unit module. Furthermore, the circuit board assembly also includes a first adapter board. This first adapter board enables different circuit boards to be electrically connected, thereby allowing multiple unit modules to transmit signals. During operation, these multiple unit modules transmit signals to each other, thus realizing the function of the circuit module occupying a large PCB area. Because the planar area of ​​the circuit board is small, stacking multiple circuit boards for carrying electronic components reduces the space occupied by the circuit board assembly in the terminal's planar area, saving more space for other components or a larger capacity battery. Furthermore, the more functions the terminal can perform, the more electronic components need to be installed in the terminal. In this scenario, increasing the number of circuit boards in the circuit board assembly allows for sufficient space for the electronic components along the height of the assembly, enabling the integration of more components. While the height of the circuit board assembly increases, its in-plane area remains constant. This allows for improved integration of the terminal without compromising its in-plane component placement space. Attached Figure Description

[0034] Figure 1a This application provides a schematic diagram of the structure of a terminal as an embodiment.

[0035] Figure 1b for Figure 1a A schematic diagram of the structure of a Chinese electronic component;

[0036] Figure 2a for Figure 1a A partial structural diagram of the circuit board assembly;

[0037] Figure 2b for Figure 2a A schematic diagram of a circuit board structure;

[0038] Figure 3 for Figure 1a A three-dimensional structural diagram of a circuit board assembly;

[0039] Figure 4a This application provides a schematic diagram of a structure in which an adapter board is electrically connected to the side of a circuit board, as part of some embodiments of the present application.

[0040] Figure 4b This application provides another schematic diagram of the structure in which the adapter board is electrically connected to the side of the circuit board, as part of some embodiments of the present application.

[0041] Figure 4c This application provides another schematic diagram of the structure in which the adapter board is electrically connected to the side of the circuit board, as part of some embodiments of the present application.

[0042] Figure 4d Some embodiments of this application provide another structural schematic diagram of the adapter board electrically connected to the side of the circuit board;

[0043] Figure 5a This application provides a schematic diagram of a structure in which an adapter board is electrically connected to the upper surface of a circuit board, representing some embodiments of the present application.

[0044] Figure 5b This application provides another schematic diagram of the structure in which the adapter board is electrically connected to the upper surface of the circuit board, as part of some embodiments of the present application.

[0045] Figure 6a This application provides a schematic diagram of a structure in which an adapter board is electrically connected to the upper and lower surfaces of a circuit board, as part of some embodiments of the present application.

[0046] Figure 6b This application provides another schematic diagram of the structure in which the adapter board is electrically connected to the upper and lower surfaces of the circuit board, as part of some embodiments of the present application.

[0047] Figure 6c This application provides another schematic diagram of the structure in which the adapter board is electrically connected to the upper and lower surfaces of the circuit board, as part of some embodiments of the present application.

[0048] Figure 6d This application provides another schematic diagram of the structure in which the adapter board is electrically connected to the upper and lower surfaces of the circuit board, as part of some embodiments of the present application.

[0049] Figure 6e This application provides another schematic diagram of the structure in which the adapter board is electrically connected to the upper and lower surfaces of the circuit board, as part of some embodiments of the present application.

[0050] Figure 7a For some embodiments of this application, a schematic diagram of a structure is provided, in which one adapter board is an FPC and the other adapter board is a PCB;

[0051] Figure 7b for Figure 7a A schematic diagram of the electrical connection structure between the adapter board embedded in the circuit board and the circuit board.

[0052] Figure 7c For some embodiments of this application, another structural diagram is provided, in which one adapter board is an FPC and the other adapter board is a PCB;

[0053] Figure 7d For some embodiments of this application, another structural diagram is provided, in which one adapter board is an FPC and the other adapter board is a PCB;

[0054] Figure 8a for Figure 1a Another three-dimensional structural diagram of the circuit board assembly;

[0055] Figure 8b for Figure 1a Another three-dimensional structural diagram of the circuit board assembly;

[0056] Figure 9 for Figure 8a or Figure 8b A schematic diagram of the structure of the circuit board and the first electrical connector on the side of the circuit board;

[0057] Figure 10a , Figure 10b for Figure 8a or Figure 8b A schematic diagram illustrating the manufacturing process of the first electrical connector on the side of the circuit board;

[0058] Figure 11 For some embodiments of this application, a schematic diagram of a circuit board with a third electrical connector on its surface is provided;

[0059] Figure 12a , Figure 12b for Figure 8a or Figure 8b A schematic diagram of the electrical connection process between the middle layer circuit board and the adapter board;

[0060] Figure 13a for Figure 1a A top view of a circuit board assembly;

[0061] Figure 13b for Figure 1a Another three-dimensional structural diagram of the circuit board assembly;

[0062] Figure 13c for Figure 13b Top view of the intermediate connection plate;

[0063] Figure 14a for Figure 1a Another top view of the circuit board assembly;

[0064] Figure 14b for Figure 1a Another top view of the circuit board assembly;

[0065] Figure 14c for Figure 1aAnother top view of the circuit board assembly;

[0066] Figure 14d This application provides some embodiments of a schematic diagram showing the structure of a multilayer circuit board wrapped with an FPC adapter board in a circuit board assembly.

[0067] Figure 15a for Figure 1a Another cross-sectional view of the circuit board assembly;

[0068] Figure 15b for Figure 15a A top-view structural diagram.

[0069] Figure label:

[0070] 01-Terminal; 10-Display module; 11-Middle frame; 12-Housing; 20-Circuit board assembly; 201-Circuit board; 2010-Insulating carrier board; 2011-Metal wiring; 2012-Adhesive layer; 202-First adapter board; 212-Second adapter board; 30-Electronic components; 300-Packaging structure; 301-Chip; 40-Third electrical connector; 41-First electrical connector; 410-Metal thin film layer; 411-Drill bit; 412-Solder paste; 42-Second electrical connector; 43-Lead wire; 50-Insulating support column. Detailed Implementation

[0071] The technical solutions of the present invention will now be described with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0072] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0073] Furthermore, in this application, directional terms such as "upper," "lower," "left," and "right" are defined relative to the indicated placement of the components in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the placement of the components in the accompanying drawings.

[0074] This application provides an embodiment of, as follows: Figure 1aThe terminal 01 shown can be a consumer electronics product on the market, such as a mobile phone, tablet computer, laptop computer, in-vehicle computer, wearable electronic products, such as smartwatches or bracelets.

[0075] This application does not impose any special restrictions on the specific form of terminal 01. For ease of explanation, the following description uses a mobile phone as an example for terminal 01.

[0076] The aforementioned mobile phones, such as Figure 1a As shown, it mainly includes a display module 10, a middle frame 11, and a housing 12. The display module 10 and the middle frame 11 are disposed within the housing 12.

[0077] In some embodiments of this application, the display module 10 may include a liquid crystal display (LCD) screen and a back light unit (BLU) for providing a light source to the LCD screen.

[0078] Alternatively, in some other embodiments of this application, the display module 10 may include an organic light emitting diode (OLED) display screen capable of self-illumination.

[0079] In addition, in order to enable the terminal 01 to perform more functions, the terminal 01 also includes multiple electronic components 30.

[0080] like Figure 1b As shown, in some embodiments of this application, the electronic component 30 includes a package structure 300 and at least one chip 301 packaged within the package structure 300.

[0081] In this case, in order to accommodate multiple electronic components 30 within the limited space of terminal 01, embodiments of this application provide a method for accommodating multiple electronic components 30 within terminal 01, such as... Figure 1a The circuit board assembly 20 shown.

[0082] In some embodiments of this application, such as Figure 1a As shown, the circuit board assembly 20 can be disposed on the side surface of the middle frame 11 facing the housing 12.

[0083] The circuit board assembly 20 includes, for example, Figure 2a The diagram shows at least two layers of circuit board 201. Circuit board 201 includes an upper surface A1 and a lower surface A2 disposed opposite to each other.

[0084] Electronic component 30 can be integrated onto the upper surface A1 or the lower surface A2 of circuit board 201. Alternatively, as... Figure 4aAs shown, electronic components 30 are integrated on both the upper surface A1 and the lower surface A2 of the circuit board 201.

[0085] In some embodiments of this application, circuit board 201 may be a printed circuit board (PCB). For example... Figure 2b As shown in the cross-sectional structure of the circuit board 201, the circuit board 201 includes at least one insulating substrate 2010. Adjacent insulating substrates 2010 are fixedly connected by an adhesive layer 2012.

[0086] In some embodiments of this application, the upper or lower surface of the insulating substrate 2010 is provided with metal wiring 2011. Alternatively, in other embodiments of this application, both the upper and lower surfaces of the insulating substrate 2010 are provided with metal wiring 2011. The metal wiring 2011 in the circuit board 201 is used to electrically connect multiple electronic components 30 integrated on the circuit board 201.

[0087] In addition, the circuit board assembly 20 also includes, for example Figure 3 As shown, at least one first adapter board 202 is disposed on at least one side of at least two layers of circuit boards 201.

[0088] In addition, the first adapter board 202 is electrically connected to at least two circuit boards 201, thereby enabling the at least two circuit boards 201 to transmit signals through the first adapter board 202.

[0089] It should be noted that the first adapter board 202 can be a PCB or a flexible printed circuit board (FPC). The cross-sectional structures of PCBs and FPCs are as follows... Figure 2b As shown, the FPC may include an insulating substrate 2010 and metal wiring 2011 located on the upper and lower surfaces of the insulating substrate 2010. The difference lies in that the material constituting the insulating substrate 2010 in the FPC is a flexible insulating material. For example, the flexible insulating material may be a polymer such as polyimide or polyester. In this case, the insulating substrate 2010 may be a polyimide film or a polyester film.

[0090] In some embodiments of this application, after the first adapter board 202 electrically connects two circuit boards 201, the signal of one circuit board 201 can be transmitted to the other circuit board 201 through the first adapter board 202. The first adapter board 202 does not need to process the transmitted signal, so there is no need to integrate electronic components 30 on the first adapter board 202.

[0091] In order for the first adapter board 202 to electrically connect at least two circuit boards 201, in some embodiments of this application, the first adapter board 202 is electrically connected to the surface of at least two circuit boards 201.

[0092] It should be noted that the surface of circuit board 201 refers to the upper surface A1, lower surface A2, or side surface B of circuit board 201.

[0093] Among them, side B of circuit board 201 is a surface of circuit board 201 that is perpendicular to the upper surface A1 or the lower surface A2 of circuit board 201.

[0094] The following example illustrates how the first adapter board 202 electrically connects at least two circuit boards 201.

[0095] Example 1

[0096] In this example, a first adapter board 202 is electrically connected to side B of at least two circuit boards 201 located on the same side.

[0097] For example, in some embodiments of this application, such as Figure 4a As shown, the circuit board assembly 20 includes circuit board 201a and circuit board 201b.

[0098] The first adapter plate 202a is electrically connected to the left side B of the circuit board 201a and the left side B of the circuit board 201b. The first adapter plate 202b is electrically connected to the right side B of the circuit board 201a and the right side B of the circuit board 201b.

[0099] In this configuration, the circuit board 201a and the electronic components 30 integrated on the circuit board 201a constitute a first unit module. During operation, this first unit module can transmit generated signals to the circuit board 201b via first adapter boards 202a and 202b. The circuit board 201b and the electronic components 30 integrated on the circuit board 201b constitute a second unit module. Upon receiving signals from the first adapter boards 202a and 202b, the second unit module can process these signals, thereby enabling the circuit board assembly 20 to perform its corresponding function.

[0100] As can be seen from the above, circuit boards 201a and 201b can achieve signal communication by being electrically connected to the first adapter boards 202a and 202b.

[0101] In some other embodiments of this application, when circuit boards 201a and 201b can achieve signal communication solely through the first adapter plate 202a, only the first adapter plate 202a may be provided in the circuit board assembly 20. Alternatively, when circuit boards 201a and 201b can achieve signal communication solely through the first adapter plate 202b, only the first adapter plate 202b may be provided in the circuit board assembly 20.

[0102] In some other embodiments of this application, such as Figure 4b As shown, the circuit board assembly 20 includes circuit board 201a, circuit board 201b and circuit board 201c.

[0103] Or, such as Figure 4c As shown, the circuit board assembly 20 includes circuit board 201a, circuit board 201b, circuit board 201c and circuit board 201d.

[0104] for Figure 4a and Figure 4c In terms of structure, the first adapter plate 202 is configured as described above and is electrically connected to the side B of each circuit board 201 in the circuit board assembly 20.

[0105] Furthermore, in some other embodiments of this application, when the circuit board assembly 20 includes at least three circuit boards 201, the first adapter board 202 may not need to electrically connect the sides B of all the circuit boards 201.

[0106] For example, such as Figure 4d As shown, the first adapter plate 202a on the left can electrically connect the side B of the circuit board 201a and the circuit board 201b, so that the circuit board 201a and the circuit board 201b can transmit signals through the adapter plate 202a.

[0107] As described above, in this example, the first adapter plate 202 is disposed on at least one side of at least two circuit boards 201, and the first adapter plate 202 is electrically connected to side B of a circuit board 201. For example, Figure 4a The first adapter plate 202a is electrically connected to the left side B of the circuit board 201a. In this case, the first adapter plate 202a does not contact the upper surface A1 and lower surface A2 of the circuit board 201a. Therefore, the first adapter plate 202a does not occupy the area of ​​the upper surface A1 and lower surface A2 of the circuit board 201a, allowing more electronic components 30 to be installed on the upper surface A1 and lower surface A2 of the circuit board 201a.

[0108] Example 2

[0109] In this example, a first adapter board 202 is electrically connected to the upper surface A1 or lower surface A2 of one of the at least two circuit boards 201, and is electrically connected to the side surface B of the remaining at least one circuit board 201 in the at least two circuit boards 201.

[0110] Taking circuit board assembly 20, which includes circuit boards 201a, 201b, and 201c, as an example, in some embodiments of this application, such as Figure 5a As shown, the first adapter plate 202a located on the left side of the circuit board assembly 20 is electrically connected to the upper surface A1 of the circuit board 201a and electrically connected to the side B of the circuit board 201b.

[0111] In this case, circuit board 201a and circuit board 201b can be electrically connected through the first adapter board 202a to achieve signal transmission.

[0112] Furthermore, the first adapter plate 202b located on the right side of the circuit board assembly 20 is electrically connected to the upper surface A1 of the circuit board 201a, and is also electrically connected to the side surface B of the circuit boards 201b and 201c. This allows the circuit boards 201a, 201b, and 201c to be electrically connected via the first adapter plate 202b, thus enabling signal transmission.

[0113] Alternatively, in some other embodiments of this application, such as Figure 5b As shown, the first adapter plate 202a on the left is electrically connected to the upper surface A1 of the circuit board 201b and to the side B of the circuit board 201c. This allows the circuit boards 201b and 201c to transmit signals through the first adapter plate 202a.

[0114] It should be noted that since the upper surface A1 and lower surface A2 of the circuit board 201 are defined relative to the schematic placement of the circuit board assembly 20 in the attached figure, it is only necessary to flip the circuit board assembly 20 to obtain a solution in which a first adapter plate 202 of the circuit board assembly 20 is electrically connected to the lower surface A2 of a layer of circuit board 201 and electrically connected to the side surface B of at least one layer of circuit board 201 other than the circuit board 201. This will not be elaborated here.

[0115] Example 3

[0116] In this example, one end of a first adapter board 202 is electrically connected to the upper surface A1 of one of the at least two circuit boards 201, and the other end is electrically connected to the lower surface A2 of the remaining circuit board 201 in the at least two circuit boards 201.

[0117] In some embodiments of this application, taking circuit board assembly 20 including circuit board 201a and circuit board 201b as an example, such as... Figure 6aAs shown, the first adapter plate 202a on the left is electrically connected to the upper surface A1 of the circuit board 201a and the lower surface A2 of the circuit board 201b. The first adapter plate 202b on the right is configured in the same way as the first adapter plate 202b.

[0118] In this case, circuit boards 201a and 201b transmit signals through the first adapter plate 202a and the first adapter plate 202b.

[0119] Alternatively, in some other embodiments of this application, such as Figure 6b As shown, the first adapter plate 202b located on the right can also adopt the configuration of Example 1, that is, it is electrically connected to the side B of the circuit board 201a and the circuit board 201b.

[0120] Alternatively, in some other embodiments of this application, such as Figure 6c As shown, the first adapter plate 202b located on the right can also adopt the configuration of Example 2, that is, it is electrically connected to the upper surface A1 of the circuit board 201a and electrically connected to the side B of the circuit board 201b.

[0121] Furthermore, when the circuit board assembly 20 includes at least three circuit boards, one end of a first adapter board 202 is electrically connected to the upper surface A1 of the upper circuit board 201 of the at least three circuit boards, and the other end is electrically connected to the lower surface A2 of the lower circuit board 201.

[0122] In addition, the first adapter board 202 is electrically connected to the side B of at least one of the three circuit boards, between the upper and lower circuit boards 201.

[0123] like Figure 6d As shown, the first adapter plate 202a on the left is electrically connected to the upper surface A1 of the circuit board 201a, the side surface B of the circuit board 201b, and the lower surface A2 of the circuit board 201c. The first adapter plate 202b on the right is configured in the same way as the first adapter plate 202b.

[0124] In this case, circuit boards 201a, 201b and 201c transmit signals through the first adapter plate 202a and the first adapter plate 202b.

[0125] Alternatively, in some other embodiments of this application, such as Figure 6e As shown, the first adapter plate 202b located on the right side can also be electrically connected to the upper surface A1 of the circuit board 201a and the lower surface A2 of the circuit board 201b, so that the circuit board 201a and the circuit board 201b can transmit signals through the first adapter plate 202b.

[0126] In addition, the first adapter board 202b located on the right can also adopt the setup method of Example 1 or Example 2, which will not be described in detail here.

[0127] As can be seen from the above, when a first adapter plate 202 is electrically connected to the upper surface A1 or lower surface A2 of a circuit board 201, the first adapter plate 202 does not need to be electrically connected to the side surface B of the circuit board 201. For example, Figure 6e The first adapter plate 202a is electrically connected to the upper surface A1 of the circuit board 201a. At this time, the first adapter plate 202a no longer needs to be electrically connected to the side B of the circuit board 201a.

[0128] In this way, the first adapter board 202a only needs to meet the manufacturing precision requirements when electrically connected to the upper surface A1 of the circuit board 201a to achieve signal transmission between the first adapter board 202a and the circuit board 201a. This avoids the situation where both the upper surface A1 and side surface B of the circuit board 201a are electrically connected to the first adapter board 202a, and the positions of these connections must all meet the aforementioned manufacturing precision requirements. This simplifies the manufacturing process of the circuit board assembly 20 and reduces manufacturing costs.

[0129] Similarly, when a first adapter plate 202 is electrically connected to the side B of a circuit board 201, the first adapter plate 202 no longer needs to be electrically connected to the upper surface A1 or the lower surface A2 of the circuit board 201. For example, as Figure 6c In this configuration, the first adapter plate 202b is electrically connected to the side B of the circuit board 201b. At this time, the first adapter plate 202b no longer needs to be electrically connected to the lower surface A2 of the circuit board 201b.

[0130] The solutions provided in Examples 1, 2, and 3 above illustrate how a portion of the first adapter board 202 is electrically connected to the surface of at least two circuit boards 201. Because the first adapter board 202 is electrically connected to the surface of the circuit board 201, it is easier to peel the first adapter board 202 off the surface of the circuit board 201 when the circuit board assembly 20 is returned to the factory for repair, thereby reducing repair costs.

[0131] This application also provides another way to electrically connect at least two circuit boards 201, as shown in Example 4 below.

[0132] Example 4

[0133] In this example, circuit board assembly 20 includes circuit boards 201a and 201b. Circuit board assembly 20 also includes at least one such... Figure 7a The second adapter plate 212 is shown.

[0134] It should be noted that the second adapter board 212 can also be used solely for signal transmission without signal processing. Therefore, there is no need to integrate electronic components 30 on the second adapter board 212.

[0135] The second adapter board 212 and the first adapter board 202 are disposed on different sides of at least two circuit boards. The second adapter board 212 is an FPC. The first adapter board 202 can be an FPC or a PCB.

[0136] In this case, in some embodiments of this application, such as Figure 7a As shown, one end of the second adapter plate 212 is embedded in and electrically connected to circuit board 201a. Furthermore, the other end of the second adapter plate 212 is embedded in and electrically connected to circuit board 201b. The first adapter plate 202 on the right adopts the configuration shown in Example 1.

[0137] In this case, in order to ensure that one end of the second adapter plate 212 embedded in the circuit board 201a can be electrically connected to the circuit board 201a, such as... Figure 7b As shown, during the fabrication of circuit board 201a, one end of the second adapter plate 212 is pressed into the two adjacent insulating carrier plates 2010 in circuit board 201a.

[0138] Then, through drilling and hole wall metallization processes, a structure is formed as shown. Figure 7b The plated through hole (PTH) is shown. In this case, the metal wiring 2011 on the circuit board 201a is electrically connected to the metal wiring 2011 on the second adapter board 212 through the PTH, thereby realizing the electrical connection between the second adapter board 212 and the circuit board 201a.

[0139] In this case, since one end of the second adapter plate 212 is embedded in a circuit board, such as circuit board 201a, it will not occupy the area of ​​the upper surface A1 and the lower surface A2 of the circuit board 201a, so that more electronic components 30 can be set on the upper surface A1 and the lower surface A2 of the circuit board 201a.

[0140] In addition, the other end of the second adapter board 212 is electrically connected to at least one of the remaining circuit boards 201 of the at least two circuit boards.

[0141] For example, Figure 7a In this circuit, the other end of the second adapter plate 212 is embedded in the circuit board 201b. The other end of the second adapter plate 212 embedded in the circuit board 201b is electrically connected to the circuit board 201b in the same way as described above, and will not be repeated here.

[0142] Alternatively, in some embodiments of this application, such as Figure 7cAs shown, one end of the second adapter plate 212 is embedded in and electrically connected to the circuit board 201a. Furthermore, the other end of the second adapter plate 212 is electrically connected to side B of the circuit board 201b. The first adapter plate 202 on the right side adopts the configuration shown in Example 3.

[0143] Alternatively, in some embodiments of this application, such as Figure 7d As shown, one end of the second adapter plate 212 is embedded in and electrically connected to the circuit board 201a. Furthermore, the other end of the second adapter plate 212 is electrically connected to the lower surface A2 of the circuit board 201b. The first adapter plate 202 on the right side adopts the configuration shown in Example 2.

[0144] In summary, in this embodiment, during the fabrication of circuit board 201, one end of the second adapter plate 212 made of FPC can be pressed into the circuit board, and a PTH can be fabricated to electrically connect one end of the second adapter plate 212 pressed into circuit board 201 to circuit board 201.

[0145] As the requirements for battery life and functional integration of terminals 01, such as mobile phones, continue to increase, the plane used to house the circuit board assembly 20 within the terminal 01 (such as...) Figure 3 When the area of ​​the XOY plane shown is small, but the number of electronic components 30 that need to be set in the terminal 01 is large, the number of circuit boards 201 in the circuit board assembly 20 can be increased.

[0146] At this time, due to the plane of the circuit board assembly 20 (e.g. Figure 3 The area within the XOY plane shown is limited by the space constraints of the components within the terminal 01 plane and cannot be increased further. Therefore, it can be increased by adding circuit board assembly 20 along the Z direction (…). Figure 3 The height of the circuit board assembly 20 is increased, that is, the number of circuit boards 201 in the circuit board assembly 20 is increased to carry more electronic components 30, so that multiple electronic components 30 have sufficient placement space in the Z direction.

[0147] As described above, the number of circuit boards 201 in the circuit board assembly 20 is directly proportional to the height of the circuit board assembly 20 along the Z direction. Therefore, the number of circuit boards 201 in the circuit board assembly 20 cannot be increased indefinitely; the overall size of the terminal 01 needs to be considered during the design process. For example, when the height of the circuit board assembly 20 along the Z direction is increased, it needs to be determined based on the height of the terminal 01 along the Z direction (e.g., ...). Figure 1a The thickness is set to avoid the circuit board assembly 20 having too large a height along the Z direction, which would cause the middle frame 11 to fail to engage with the housing 12.

[0148] It should be noted that the XOY plane is parallel to the surface of the display module 10 displaying the image, and to the upper surface A1 and lower surface A2 of the circuit board 201. Furthermore, the Z direction is parallel to the side surface B of the circuit board 201.

[0149] The following description uses a circuit board assembly 20, which includes a baseband circuit functional module and a radio frequency circuit functional module, as an example to illustrate the number of circuit boards 201 in the circuit board assembly 20 and the arrangement of the electronic components 30 integrated thereon. For ease of explanation, the following description uses the structure in which the circuit board assembly 20 uses a first adapter plate 202 to electrically connect the multilayer circuit boards 201 as an example.

[0150] Example 5

[0151] like Figure 4a As shown, the circuit board assembly 20 may include two circuit boards, such as circuit board 201a and circuit board 201b. Figure 4a The following description is based on the example that each circuit board 201 of the circuit board assembly 20 integrates multiple electronic components 30 on its upper surface A1 and lower surface A2.

[0152] The multiple electronic components 30 integrated on the circuit board 201a can be: a central processing unit (CPU), an audio / video control chip, and a memory, such as dual data rate (DDR) synchronous dynamic random access memory, random access memory (RAM), flash memory (nandflash), or read-only memory (ROM).

[0153] In this case, the unit module formed by the multiple electronic components 30 integrated on the circuit board 201a and the circuit board 201a serves as the aforementioned baseband circuit functional module. This baseband circuit functional module is used to demodulate, descramble, despread, and decode the wireless signals received through the radio frequency circuit functional module, and to process them.

[0154] In some embodiments of this application, when a CPU functional chip, a memory functional chip, etc., are packaged within a package structure 300, and this package structure 300 is integrated onto a small-sized circuit board 201a, the resulting printed circuit board assembly (PCBA) structure can realize the functions of the aforementioned baseband circuit. This small-sized PCBA can be referred to as a system-in-a-package (SIP) structure.

[0155] In addition, the multiple electronic components 30 integrated on the circuit board 201b can be: radio frequency receiver chip, transmitter chip, power amplifier, Wi-Fi chip, Bluetooth chip, GPS chip, etc.

[0156] In this case, the unit module formed by the multiple electronic components 30 integrated on the circuit board 201b and the circuit board 201b serves as the aforementioned radio frequency circuit functional module. This radio frequency circuit functional module is used to implement wireless communication functions.

[0157] Example 6

[0158] If the planar area of ​​the circuit board assembly 20 in the terminal 01 is further reduced, the above-mentioned functional modules can be further divided and the number of circuit boards 201 in the circuit board assembly 20 can be increased.

[0159] like Figure 4b As shown, the circuit board assembly 20 may include three circuit boards, such as circuit board 201a, circuit board 201b and circuit board 201c.

[0160] In this case, the multiple electronic components 30 integrated on the circuit board 201a are the same as those in Example 5. At this time, the multiple electronic components 30 integrated on the circuit board 201a and the circuit board 201a together form a unit module, which serves as a baseband circuit functional module.

[0161] In addition, the radio frequency circuit functional module is split into two functionally independent first functional sub-modules and second functional sub-modules.

[0162] In this case, the multiple electronic components 30 integrated on the circuit board 201b can be: an RF receiver chip, a transmitter chip, and a power amplifier.

[0163] At this time, the unit module formed by the multiple electronic components 30 integrated on the circuit board 201b and the circuit board 201b serves as the aforementioned first functional submodule. This first functional submodule is used to realize long-distance wireless communication functionality.

[0164] The multiple electronic components 30 integrated on the circuit board 201c can be: Wi-Fi chip, Bluetooth chip, and GPS chip.

[0165] At this time, the unit module formed by the multiple electronic components 30 integrated on the circuit board 201c and the circuit board 201c serves as the aforementioned second functional submodule. This second functional submodule is used to realize short-range wireless communication functionality.

[0166] Example 7

[0167] If the planar area for setting up the circuit board assembly 20 in terminal 01 is further reduced and the number of electronic components 30 is further increased, the number of circuit boards in the circuit board assembly 20 can be further increased based on Example 6.

[0168] like Figure 4c As shown, the circuit board assembly 20 may include four circuit boards, such as circuit board 201a, circuit board 201b, circuit board 201c and circuit board 201d.

[0169] In this case, the multiple electronic components 30 integrated on the circuit board 201a are the same as those in Example 5. At this time, the multiple electronic components 30 integrated on the circuit board 201a and the circuit board 201a together form a unit module, which serves as the aforementioned baseband circuit functional module.

[0170] The multiple electronic components 30 integrated on the circuit board 201b are the same as those in Example 6. In this case, the multiple electronic components 30 integrated on the circuit board 201b and the circuit board 201b together form a unit module, which serves as the first functional sub-module for realizing the long-distance wireless communication function.

[0171] The multiple electronic components 30 integrated on the circuit board 201c are the same as those in Example 6. In this case, the multiple electronic components 30 integrated on the circuit board 201c and the circuit board 201c together form a unit module, which serves as the second functional sub-module for realizing the short-range wireless communication function.

[0172] Circuit boards 201a, 201b and 201c can realize the function of the motherboard after being electrically connected through the first adapter board 202.

[0173] In addition, the multiple electronic components 30 integrated on the circuit board 201d can be: headphones, motor, data transmission and charging interface connector, switch button interface connector, etc.

[0174] At this time, the unit module formed by the multiple electronic components 30 integrated on the circuit board 201b and the circuit board 201b can serve as a sub-board to realize auxiliary functions, making the functions that the terminal 01 can realize more diversified.

[0175] The above is an example of the number of circuit boards 201 in the circuit board assembly 20 and the arrangement of the electronic components 30 integrated thereon. Other examples can be derived in the same way, and will not be described in detail here.

[0176] Given the limited thickness of terminal 01 along the Z direction, in order to control the number of circuit boards 201 in the circuit board assembly 20, a unit module consisting of a single circuit board 201 and multiple electronic components 30 integrated on the circuit board 201 can independently perform at least one function.

[0177] Furthermore, in order to electrically connect the first adapter plate 202 to the side B of the circuit board 201, in some embodiments of this application, such as Figure 8a As shown, the side B of the circuit board 201 has a plurality of spaced-apart first electrical connectors 41.

[0178] Therefore, in order to enable signal communication between circuit boards 201 on different layers via the first adapter board 202, such as Figure 9 As shown, the first electrical connector 41 located on side B of the circuit board 201 is electrically connected to the metal wiring 2011 inside the circuit board 201.

[0179] In addition, such as Figure 8a As shown, the first adapter plate 202 is provided with a plurality of second electrical connectors 42 spaced apart. Among them, the first electrical connector 41 and the second electrical connector 42 are electrically connected one by one.

[0180] In some embodiments of this application, the first electrical connection 41 and the second electrical connection 42 can be pads. The pads described above are as follows: Figure 8a The shape shown is rectangular. Alternatively, it can be circular. This application does not limit the shape of the pad.

[0181] When the first electrical connector 41 is a solder pad, the method for manufacturing the first electrical connector 41 may include: First, as... Figure 10a As shown, a metal thin film layer 410 is electroplated on the side B of a circuit board 201. The material constituting the metal thin film layer 410 can be copper.

[0182] Then, as Figure 10b As shown, a drilling process is performed using drill bit 411 to remove unwanted portions of the unwanted metal thin film layer 410, thereby forming multiple spaced first electrical connectors 41.

[0183] It should be noted that the specifications of the drill bit 411, such as its diameter, can be selected based on the distance between two adjacent first electrical connectors 41 on the side B of the circuit board 201. For example, when the distance between two adjacent first electrical connectors 41 is large, a drill bit 411 with a larger diameter can be selected. Alternatively, when the distance between two adjacent first electrical connectors 41 is small, a drill bit 411 with a smaller diameter can be selected.

[0184] The second electrical connector 42, formed using drill bit 411, is typically rectangular. Therefore, it is easy to manufacture when the second electrical connector 42 is rectangular.

[0185] In some other embodiments of this application, unwanted portions of the metal thin film layer 410 can be removed by laser processing to form the second electrical connector 41.

[0186] The spacing between multiple first electrical connectors 41 located on the same side of the circuit board 201 can be set according to the circuit structure in the circuit board 201 and the circuit structure in another circuit board 201 that needs to be electrically connected to the circuit board 201, as long as signal transmission can be achieved after the two circuit boards 201 are electrically connected through the first adapter plate 202.

[0187] The following provides an example illustrating the electrical connection between the first adapter board 202 and the side B of at least two circuit boards 201. For instance, in some embodiments of this application, the circuit board assembly 20 is as follows: Figure 8a As shown, it includes circuit board 201a and circuit board 201b.

[0188] A first electrical connector 41 on side B1 of circuit board 201a is electrically connected to a second electrical connector 42 on the upper part of the first adapter plate 202, and a first electrical connector 41 on side B2 of circuit board 201b is electrically connected to a second electrical connector 42 on the lower part of the first adapter plate 202.

[0189] Furthermore, in order to enable electrical connection between circuit boards 201a and 201b, such as Figure 8a As shown, the first adapter plate 202 is also provided with a means for connecting at least two second electrical connectors 42, for example... Figure 8a The lead wire 43 is electrically connected to the upper and lower second electrical connectors 42 located in the same column along the vertical direction.

[0190] In this configuration, a first electrical connector 41 on side B1 of circuit board 201a and a first electrical connector 41 on side B2 of circuit board 201b can be electrically connected via a first adapter plate 202, thereby enabling signal transmission between circuit boards 201a and 201b. It should be noted that side B1 of circuit board 201a and side B2 of circuit board 201b are located on the same side.

[0191] The above is an example of electrical connection between the first adapter board 202 and the sides of the two adjacent circuit boards.

[0192] Alternatively, for example, in some other embodiments of this application, the circuit board assembly 20 is as follows: Figure 8b As shown, it includes three circuit boards, namely circuit board 201a, circuit board 201b and third circuit board 201c.

[0193] In this configuration, a first electrical connector 41 on side B1 of circuit board 201a is electrically connected to a second electrical connector 42 on the first adapter plate 202, located above the second column from the left. Similarly, a first electrical connector 41 on side B2 of circuit board 201b is electrically connected to a second electrical connector 42 on the first adapter plate 202, located below the second column from the left. Furthermore, the two second electrical connectors 42 are electrically connected via a lead wire 43.

[0194] In this configuration, a first electrical connector 41 on side B1 of circuit board 201a and a first electrical connector 41 on side B2 of circuit board 201b are electrically connected via a first adapter plate 202. This enables signal transmission between circuit boards 201a and 201b.

[0195] Alternatively, a first electrical connector 41 on side B2 of circuit board 201b is electrically connected to a second electrical connector 42 on the first adapter plate 202, located above the third column from the left. Similarly, a first electrical connector 41 on side B3 of the third circuit board 201c is electrically connected to a second electrical connector 42 on the first adapter plate 202, located below the third column from the left. Furthermore, the two second electrical connectors 42 are electrically connected via a lead 43.

[0196] In this configuration, a first electrical connector 41 on side B2 of circuit board 201b is electrically connected to a first electrical connector 41 on side B3 of third circuit board 201c via a first adapter plate 202. This enables signal transmission between circuit board 201b and third circuit board 201c.

[0197] Alternatively, a first electrical connector 41 on side B1 of circuit board 201a is electrically connected to a second electrical connector 42 on the first adapter plate 202, above the first column on the right, and a first electrical connector 41 on side B3 of third circuit board 201c is electrically connected to a second electrical connector 42 on the first adapter plate 202, below the first column on the right. Furthermore, the two second electrical connectors 42 are electrically connected via a lead 43.

[0198] In this configuration, a first electrical connector 41 on side B1 of circuit board 201a is electrically connected to a first electrical connector 41 on side B3 of third circuit board 201c via a first adapter plate 202. This enables signal transmission between circuit board 201a and third circuit board 201c.

[0199] Alternatively, a first electrical connector 41 on side B1 of circuit board 201a is electrically connected to a second electrical connector 42 on the first adapter plate 202, located above the first column on the left; a first electrical connector 41 on side B2 of circuit board 201b is electrically connected to a second electrical connector 42 on the first adapter plate 202, located in the middle of the first column on the left; and a first electrical connector 41 on side B3 of third circuit board 201c is electrically connected to a second electrical connector 42 on the first adapter plate 202, located below the first column on the left. Furthermore, the three second electrical connectors 42 are electrically connected via leads 43.

[0200] In this configuration, a first electrical connector 41 on side B1 of circuit board 201a, a first electrical connector 41 on side B2 of circuit board 201b, and a first electrical connector 41 on side B3 of third circuit board 201c are electrically connected via a first adapter plate 202. This enables signal transmission between circuit boards 201a, 201b, and 201c.

[0201] It should be noted that side B1 of circuit board 201a, side B2 of circuit board 201b, and side B3 of the third circuit board 201c are located on the same side.

[0202] The above describes the electrical connection between the first adapter plate 202 and the side B of the circuit board 201. As can be seen from the above, the first adapter plate 202 can also be electrically connected to the upper surface A1 or the lower surface A2 of the circuit board 201. In this case, such as Figure 11 As shown, a third electrical connector 40 needs to be provided on the upper surface A1 (or lower surface A2) of the circuit board 201. The third electrical connector 40 is electrically connected to a second electrical connector 42 on the first adapter board 202.

[0203] In this embodiment, the third electrical connector 40 can be a solder pad. When the circuit board 201 is a PCB, during the fabrication of the circuit board 201, the following can be addressed: Figure 2b The copper layer covering the insulating substrate 2010 shown is patterned to form a metal wiring 2011. This metal wiring 2011 can serve as a third electrical connector 40.

[0204] As described above, the first adapter board 202 can be a PCB or an FPC. In this case, when the second electrical connector 42 is a solder pad, during the fabrication of the PCB or FPC, the copper layer covering the insulating substrate 2010 can be patterned to form multiple metal traces 2011. These multiple metal traces 2011 can serve as the second electrical connector 42, as well as leads 43 for electrically connecting different second electrical connectors 42.

[0205] When the first electrical connector 41 and the second electrical connector 42 are solder pads, the method of electrical connection between the first adapter board 202 and the circuit board 201 will be described.

[0206] First, such as Figure 12a As shown, solder paste 412 is pre-applied on the first electrical connector 41 on the side B of the circuit board 201 using printing, jetting, or dispensing methods.

[0207] Then, as Figure 12b As shown, an automated placement device picks up a circuit board 201 integrating electronic components 30 and places it on a horizontal first adapter plate 202. A first electrical connector 41 pre-coated with solder paste 412 on the circuit board 201 is bonded to a second electrical connector 42 on the first adapter plate 202 via the solder paste 412.

[0208] Then, the first electrical connector 41 and the second electrical connector 42 are soldered together by high-temperature reflow using molten solder paste 412.

[0209] Alternatively, in some other embodiments of this application, solder paste 412 can be replaced with conductive adhesive. In this case, after the circuit board 201 integrating electronic components 30 is placed on the horizontal first adapter plate 202, the conductive adhesive can be cured by high-temperature curing, thereby allowing a first electrical connector 41 coated with conductive adhesive to bond and electrically connect to a second electrical connector 42 on the first adapter plate 202 through the cured conductive adhesive.

[0210] In some other embodiments of this application, in order to achieve electrical connection between the first adapter plate 202 and the circuit board 201, the first electrical connector 201 disposed on the side B of the circuit board 201 and the second electrical connector 202 disposed on the first adapter plate 202 can be configured as a plug-in structure.

[0211] For example, the first electrical connector 201 is a pin, and the second electrical connector 202 is a groove that mates with the pin. Alternatively, the first electrical connector 201 is a groove, and the second electrical connector 202 is a pin that mates with the groove.

[0212] In summary, the circuit board assembly 20 provided in this application embodiment has multiple layers of circuit boards 201. The upper surface A1 and lower surface A2 of each circuit board 201 are used to integrate electronic components 30. Thus, each circuit board 201 and the integrated electronic components 30 forming a PCBA can serve as a unit module capable of independently performing at least one function. In this case, a circuit module occupying a large PCB area can be divided into multiple smaller unit modules. Based on this, in the circuit board assembly 20, each circuit board 201 and the multiple electronic components 30 integrated on it can serve as a unit module. During operation, these multiple unit modules transmit signals to each other, thereby realizing the function of the circuit module that originally occupied a large PCB area.

[0213] Since the planar area of ​​the circuit board 201 is small, stacking multiple layers of circuit boards 201 used to carry electronic components 30 can reduce the space occupied by the circuit board assembly 20 in the plane (XOY plane) of the terminal 01, thereby saving more space for arranging other devices or batteries with larger capacity.

[0214] Furthermore, as the terminal 01 becomes capable of performing more functions, the number of electronic components 30 required within it increases. In this case, by increasing the number of circuit boards 201 in the circuit board assembly 20, sufficient space can be provided for the electronic components 30 along the height direction (Z direction) of the circuit board assembly 20, thus achieving the goal of integrating more electronic components 30. In this scenario, while the height (Z direction) of the circuit board assembly 20 increases, its area in the plane (XOY plane) remains unchanged. This allows for an increase in the integration level of the terminal 01 without affecting its in-plane component placement space.

[0215] Based on this, in order to enable signal transmission between the multiple unit modules of the circuit board assembly 20 during operation, the circuit board assembly 20 also includes a first adapter board 202. The first adapter board 202 can be electrically connected one by one to multiple first electrical connectors 41 on the side of a layer circuit board 201 through multiple second electrical connectors 42, or to three electrical connectors 40 on the upper A1 or lower A2 surface of the layer circuit board 201, thereby enabling the circuit boards 201 of different layers to be electrically connected through the first adapter board 202, and thus enabling the multiple unit modules to transmit signals.

[0216] In other embodiments, where the circuit board assembly 20 further includes a second adapter plate 212, at least two circuit boards 201 can be electrically connected by the second adapter plate 212, one end of which is embedded in the circuit board 201, so that multiple unit modules can realize signal transmission.

[0217] In some embodiments of this application, in order to improve the structural stability of the multilayer circuit board 201 in the circuit board assembly 20, such as Figure 13a As shown, each side of the multilayer circuit board 201 may be provided with a first adapter plate 202.

[0218] For example, if the first adapter board 202 is a PCB, such as Figure 13b As shown, the circuit board assembly 20 includes multiple first adapter plates 202, each of which is connected to one side B of the circuit board 201. Multiple first adapter plates 202 are assembled to form... Figure 13c The closed frame structure is shown. It should be noted that when a first adapter plate 202 is connected to a side B of the circuit board 201, it means that when the first adapter plate 202 is electrically connected to the circuit board 201, the second electrical connector 42 on the first adapter plate 202 is electrically connected to the first electrical connector 41 on the side B of the circuit board 201 through conductive adhesive or solder paste.

[0219] Alternatively, when one side of the circuit board 201 is not provided with the first electrical connector 41, the side can be bonded to the first adapter plate 202 by means of an adhesive layer.

[0220] In this way, each side of the circuit board 201 is supported by a first adapter plate 202, thereby ensuring a stable spacing between adjacent circuit board layers 201 and improving performance. Figure 13b The reliability of the circuit board assembly 20 shown.

[0221] Therefore, in order to improve the stability of signal transmission between multiple circuit boards 201 that require electrical connection, when each side of the circuit board 201 is connected to the first adapter plate 202, each side B of the circuit board 201 is electrically connected to the first adapter plate 202. In this case, each side of the circuit board 201 may have multiple first electrical connectors 41, and each first electrical connector 41 is electrically connected to a second electrical connector 42 on the first adapter plate 202 on the side of the circuit board 201 through solder paste or conductive adhesive.

[0222] In this way, each side B of the circuit board 201 is provided with multiple spaced-apart first electrical connectors 41. Signals on the circuit board 201 can be transmitted to the first adapter board 202 through the first electrical connectors 41 on each side of the circuit board 201. This increases the output channels of the circuit structure on the circuit board 201 and avoids the problem of signal transmission failure due to the failure of a certain first electrical connector 41, thereby making the signal transmission between multiple circuit boards 201 electrically connected through the first adapter board 202 more stable.

[0223] The above description uses a rectangular top view of circuit board 201 as an example. In some embodiments of this application, the top view of circuit board 201 can be as follows: Figure 13a The rectangle shown. Or it could also be like... Figure 14a The circle shown Figure 14b The L-shaped or Figure 14c The irregular shape shown.

[0224] for Figure 14a , Figure 14b as well as Figure 14c The circuit board 201 shown has a structure relative to Figure 13a The rectangle shown is relatively complex, so that a first adapter plate 202 can be set on all sides B of each circuit board 201. The first adapter plate 202 can be an FPC.

[0225] like Figure 14d As shown, the first adapter plate 202, which is made of FPC, has flexible and bendable characteristics, so that it can wrap around each side B of the circuit board 201 along the edge, making the first adapter plate 202 fit more tightly with the side of the circuit board 201, thereby improving the reliability of the electrical connection and signal transmission between the first adapter plate 202 and the circuit board 201.

[0226] In other embodiments of this application, the top view shape of the circuit board 201 can also be C-shaped, convex, concave, etc. In this case, as described above, a first adapter plate 202 made of FPC can be used to cover all sides of each circuit board. At this time, the first adapter plate 202 has a closed frame structure.

[0227] Furthermore, in the embodiments of this application, when the first adapter plate 202 is electrically connected only to the side B of each circuit board 201, the shape and external dimensions of the horizontal cross-section of all circuit boards 201 in the circuit board assembly 20 are the same. For example, the shape of the horizontal cross-section of all circuit boards 201 in the circuit board assembly 20 is as follows: Figure 13a The rectangle shown, or all of them are as shown Figure 14a The circle shown.

[0228] In this way, the first adapter board 202 can be more easily electrically connected to the side B of the circuit board 201 of different layers, thereby avoiding the occurrence of bulges or depressions when the first adapter board 202, which is made of FPC, is electrically connected to the side of the circuit board 201 with different specifications due to the different specifications of a certain layer of circuit board 201 and other circuit boards 201.

[0229] Alternatively, it can also avoid the problem of complex manufacturing processes caused by the first adapter board 202, which is made of PCB, being electrically connected to the side of multi-layer circuit boards 201 with different specifications. This is because the spacing between the first adapter board 202 and some circuit boards 201 is different, so the amount of solder paste or conductive adhesive needs to be adjusted separately for circuit boards of different specifications.

[0230] Furthermore, in order to improve the structural stability and reliability of the circuit board assembly 20 during use, the spacing between adjacent circuit board layers 201 remains constant, such as... Figure 15a As shown, the circuit board assembly 20 also includes at least one insulating support post 50.

[0231] The insulating support column 50 is disposed between two adjacent circuit boards 201 to support the two adjacent circuit boards 201.

[0232] In embodiments of this application, the material constituting the insulating support assembly 50 may include at least one of resin and ceramic having insulating properties.

[0233] To prevent the insulating support assembly 50 from affecting the electronic components 30 integrated on the upper surface A1 or the lower surface A2 of the circuit board 201, such as... Figure 15a As shown, the insulating support post 50 is in contact with the portion of the upper surface A1 or lower surface A2 of the circuit board 201 where no electronic components 30 are disposed.

[0234] This prevents the insulating support column 50 from coming into contact with the electronic component 30, thus avoiding the phenomenon that the insulating support column 50 would exert force on the electronic component 30 during use of the terminal 01, which could damage the electronic component 30.

[0235] In other embodiments of this application, within the surface of the circuit board 201 that contacts the insulating support post 50, such as Figure 15b As shown, the orthographic projection of the insulating support column 50 on the surface is located at the angle between two adjacent intersecting edges (e.g., C1 and C2) on the surface.

[0236] Based on this, an insulating support column 50 can be provided at each of the aforementioned included angle positions of the circuit board 201, so that the insulating support columns 50 provided on the same layer of circuit board 201 are subjected to uniform force, thereby further improving the stability of the structure of the two adjacent layers of circuit board 201.

[0237] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A circuit board assembly, characterized in that, include: At least two circuit boards; the circuit boards have upper and lower surfaces disposed opposite to each other; The at least one circuit board includes two insulating substrates, the surface of which is provided with metal wiring and metallized holes. At least one first adapter board is disposed on at least one side of at least two layers of the circuit boards and is electrically connected to at least two layers of the circuit boards; The circuit board assembly further includes at least one second adapter board, which is disposed on different sides of at least two layers of the circuit board, along with the first adapter board; the second adapter board is a flexible circuit board and has metal wiring. One end of the second adapter board is embedded between an insulating carrier board in one of the at least two circuit boards, and the metal wiring of the second adapter board is electrically connected to the metal wiring of the circuit board through the metallized hole. The first adapter board is electrically connected to the side of at least two layers of the circuit board located on the same side. The side of the circuit board has a plurality of spaced-apart first electrical connectors; the first electrical connectors are electrically connected to the metal wiring inside the circuit board. The first adapter plate has a plurality of spaced-apart second electrical connectors; the second electrical connectors are electrically connected to the metal wiring inside the first adapter plate; one first electrical connector is electrically connected to one second electrical connector; The first adapter board also has leads that electrically connect the second electrical connector of the upper circuit board to the second electrical connector of the lower circuit board in the two circuit boards.

2. The circuit board assembly according to claim 1, characterized in that, The second adapter board is electrically connected to the surface of at least one layer of the circuit board.

3. The circuit board assembly according to claim 1, characterized in that, The second adapter board is electrically connected to the side of at least one layer of the circuit board.

4. The circuit board assembly according to any one of claims 1-3, characterized in that, The first adapter board is electrically connected to the surface of at least two layers of the circuit board.

5. The circuit board assembly according to claim 4, characterized in that, One of the first adapter boards is electrically connected to the upper or lower surface of one of the at least two layers of the circuit boards, and electrically connected to the side of the remaining at least one layer of the circuit boards.

6. The circuit board assembly according to claim 4, characterized in that, One end of the first adapter board is electrically connected to the upper surface of one of the at least two layers of the circuit boards, and the other end is electrically connected to the lower surface of the remaining layers of the circuit boards.

7. The circuit board assembly according to claim 4, characterized in that, The first adapter board is a printed circuit board, and one first adapter board is provided on each side of at least two layers of the circuit board.

8. The circuit board assembly according to claim 4, characterized in that, The first adapter plate is a flexible circuit board, and each side of at least two layers of the circuit board is wrapped by the first adapter plate.

9. The circuit board assembly according to claim 5, characterized in that, The upper or lower surface of the circuit board has a plurality of spaced third electrical connectors; the third electrical connectors are electrically connected to the metal wiring inside the circuit board. The first adapter plate has a plurality of spaced-apart second electrical connectors; the second electrical connectors are electrically connected to the metal wiring inside the first adapter plate; One of the second electrical connectors is electrically connected to one of the third electrical connectors.

10. The circuit board assembly according to claim 9, characterized in that, The first electrical connector is bonded to and electrically connected to the second electrical connector by conductive adhesive.

11. The circuit board assembly according to claim 1, characterized in that, The circuit board assembly also includes: At least one insulating support column is disposed between two adjacent layers of the circuit board for supporting the two adjacent layers of the circuit board.

12. An electronic terminal, characterized in that, The electronic terminal includes the circuit board assembly as described in any one of claims 1-11.

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