Temperature balancing plate and preparation method thereof, and electronic equipment

Abstract

The present application provides a temperature averaging plate and a preparation method thereof, and an electronic device. The temperature averaging plate includes a first cover plate, a second cover plate, and a capillary structure located in a receiving cavity between the first cover plate and the second cover plate. The first cover plate includes a first substrate layer and a first metal layer and a second metal layer arranged on two opposite surfaces of the first substrate layer, and the first metal layer and the second metal layer are pressed plates. The temperature averaging plate provided in the present application has a high surface flatness on the one hand, which can improve the surface fit of other components in contact with the first cover plate, and can reduce the thickness of the electronic device when applied to electronic devices; on the other hand, it has high stability to avoid the risk of incompatibility with the working fluid; on the other hand, the three-layer structure setting can also improve the machinability of the first cover plate.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a temperature homogenizing plate and a preparation method thereof, and an electronic device. Background Art

[0002] As the performance of electronic products such as smartphones and laptops improves, the corresponding energy consumption increases, which will generate a lot of heat. Usually, a heat spreader is set in electronic products to improve the heat dissipation efficiency of electronic products. However, most of the current heat spreaders are made of copper heat spreaders. The process technology of copper heat spreaders is stable and mature, but the weight of copper heat spreaders is large, and with the high requirements of consumers for light and thin electronic products. At present, a heat spreader that uses an aluminum substrate and electroplates copper on the aluminum substrate has been developed to reduce the weight of the heat spreader, but the density of electroplated copper is limited, which is not as good as the profile. The thickness of electroplated copper is limited, and the thicker it is, the worse the density is, and it is easy to react with the water working medium inside the heat spreader; when a copper layer is formed on an aluminum substrate by rolling, due to the different materials of the copper layer and the substrate, the surface flatness of the heat spreader is poor during the rolling process. Summary of the invention

[0003] The present application provides a temperature equalizing plate and a preparation method thereof, and an electronic device. The first cover plate in the temperature equalizing plate provided in the present application includes a first base layer and a first metal layer and a second metal layer arranged on two opposite surfaces of the first base layer. The first metal layer and the second metal layer in the first cover plate are pressed plates, which can improve the density of the first metal layer and the second metal layer on the one hand, have high stability when in contact with water working medium, avoid the risk of incompatibility such as chemical reaction with water working medium, and can also improve the adhesion of the first metal layer and the second metal layer to the first base layer; on the other hand, it has a high surface flatness, which can improve the surface fit of other components in contact with the first cover plate, and can reduce the thickness of the electronic device when applied to electronic devices; on the other hand, the three-layer structure setting can also improve the machinability of the first cover plate.

[0004] In a first aspect, an embodiment of the present application provides a temperature averaging plate, which includes a first cover plate, a second cover plate and a capillary structure, wherein a receiving cavity is provided between the first cover plate and the second cover plate, and the capillary structure is located in the receiving cavity, and the first cover plate includes a first base layer and a first metal layer and a second metal layer arranged on two opposite surfaces of the first base layer, and the first metal layer and the second metal layer are pressed plates.

[0005] Among them, the pressed plate refers to a plate formed by pressure, and the first metal layer and the second metal layer are pressed plates formed on the opposite surfaces of the first base layer by pressure. When preparing the first cover plate, pressure is applied to the first metal layer and the second metal layer, so that the first metal layer and the second metal layer can be more closely attached to the first base layer through diffusion, thereby improving the adhesion between the first metal layer and the second metal layer and the first base layer, and also improving the density of the first metal layer and the second metal layer.

[0006] In one embodiment, the pressure method is a rolling composite method, and the prefabricated plate for forming the first metal layer is recorded as the first metal prefabricated plate, the prefabricated plate for forming the second metal layer is recorded as the second metal prefabricated plate, and the prefabricated plate for forming the first substrate layer is recorded as the first substrate prefabricated plate. The first metal prefabricated plate and the second metal prefabricated plate are placed on two opposite surfaces of the first substrate prefabricated plate to obtain a three-layer composite structure, and then the three-layer composite structure is composited by rolling composite method. Specifically, the three-layer composite structure is passed between two rollers. After the rolling composite step is completed, the first metal prefabricated plate and the second metal prefabricated plate are compacted during the rolling composite process and are more tightly combined with the first substrate layer. The first metal prefabricated plate is compacted to form the first metal layer. The thickness of the formed first metal layer is smaller than that of the first metal prefabricated plate, and the density of the formed first metal layer is greater than that of the first metal prefabricated plate. In addition, during the rolling composite process, the atoms of the first metal layer and the first substrate layer diffuse and penetrate each other, thereby improving the adhesion between the first metal layer and the first substrate layer, which can reduce the risk of the first metal layer falling off from the first substrate layer during long-term work; the second metal prefabricated plate is compacted to form the The second metal layer is formed with a thickness smaller than that of the second metal prefabricated plate, and a density greater than that of the second metal prefabricated plate. In addition, during the rolling composite process, the atoms of the second metal layer and the first substrate layer diffuse and penetrate each other, thereby increasing the adhesion between the second metal layer and the first substrate layer, and reducing the risk of the second metal layer falling off the first substrate layer during long-term operation. After the first substrate prefabricated plate is compacted, the first substrate layer is formed, and the thickness of the first substrate layer is smaller than that of the first substrate prefabricated plate, and the density of the first substrate layer is greater than that of the first substrate prefabricated plate. The first substrate layer formed is also a pressed plate. In some embodiments, the first metal layer and the second metal layer have textures on the surface away from the first substrate layer. Specifically, it is a rolling texture, and the shape is not limited.

[0007] In some embodiments, at least one of the first metal prefabricated plate, the second metal prefabricated plate, and the first substrate prefabricated plate is a pressed plate. Taking the first metal prefabricated plate as an example, the first metal prefabricated plate itself is a pressed plate, and has a high density before being used to form the first cover plate. Then, during the preparation of the first cover plate, it is pressed by pressure to further improve the flatness and density of the formed first metal layer.

[0008] In this embodiment, the density of the first metal layer and the second metal layer is improved when under pressure, thereby improving the stability of the first metal layer and the second metal layer. When the first metal layer is arranged adjacent to the accommodating cavity, when the temperature equalizing plate is working, the water medium in the accommodating cavity will contact the first metal layer, and the water medium is distributed between the first metal layer and the capillary structure, or the water medium is distributed in the first metal layer and the first substrate layer through a non-dense gap. When the first metal layer and the first substrate layer are made of different materials, a tiny electrochemical cell will be formed between the two, which will cause an electrochemical reaction in the first metal layer for a long time. In this application, the first metal layer is formed by pressure to have a higher density and stability, which can reduce the risk of electrochemical reaction. In this application, the first metal layer with a higher density formed by pressure will not occur or greatly reduce the risk of water entering the first metal layer through the pores and forming a primary cell between the first metal layer and the first substrate layer to produce a chemical reaction to generate non-condensable gas.

[0009] In the present application, the first metal layer and the second metal layer arranged on the two opposite surfaces of the first substrate layer are pressed plates. When pressure is applied to the first metal layer and the second metal layer during the preparation process, the pressures on the two opposite surfaces of the first substrate layer are equal, so that the residual stress and deformation degree of the first metal layer and the second metal layer are equal, thereby making the first cover plate finally formed have a higher surface flatness. Assuming that the first cover plate is a two-layer structure, specifically, the first cover plate includes a first substrate layer and a first metal layer of different materials. When pressure is applied to the first cover plate, since the first metal layer is only provided on one side of the first substrate layer, when the first cover plate is fed into the roller to be pressed, the internal deformation amounts of the first substrate layer and the first metal layer materials are different, and the internal residual stresses are different, so that the two sides of the entire first cover plate are deformed unevenly when pressed, thereby resulting in poor flatness of the first cover plate after rolling.

[0010] In the present application, the first cover plate is a three-layer structure, and the three-layer structure can increase the processability of the first cover plate. For example, the thickness of the first metal layer can be set to be thicker, and the first metal layer can be etched to form a capillary structure or a column structure, or the thickness of the second metal layer can be set to be thicker, which can be used to form a structural member adapted to an electronic device. For another example, when the first cover plate has only two layers, including a titanium layer as the first base layer and a copper layer as the first metal layer, since the titanium layer is easily oxidized to form titanium dioxide, the formed titanium dioxide is easy to stick to the roller after being pressed by the roller, and titanium dioxide is relatively hard. When the first base layer and the first metal layer are compacted by calendering composite method, the roller with titanium dioxide sticking to it will cause the surface of the first cover plate to be rough and uneven when repeatedly rolling the first cover plate; when the first cover plate adopts a three-layer structure, for example, the first metal layer and the second metal layer are copper layers, and the first base layer is a titanium layer, the two copper layers cover the titanium layer in the inner layer, which is not easily oxidized and can prevent the titanium layer from breaking, thereby avoiding the risk of titanium dioxide sticking to the roller and causing the surface of the first cover plate to be rough and uneven, thereby improving machinability.

[0011] The temperature equalizing plate provided in the present application can, on the one hand, improve the density of the first metal layer and the second metal layer, have high stability when in contact with the water medium, avoid the risk of incompatibility such as chemical reaction with the water medium, and can also improve the adhesion between the first metal layer and the second metal layer and the first substrate layer. On the other hand, it has a high surface flatness, which can improve the surface fit of other components in contact with the first cover plate. When applied to electronic equipment, it can reduce the thickness of the electronic equipment. On the other hand, the three-layer structure setting can also improve the machinability of the first cover plate.

[0012] In the present application, the pressed sheet is different from the coating, specifically including at least one of the following differences: in terms of surface morphology, the pressed sheet has calendering lines on its surface, while the coating does not, and the coating looks like sand under a light microscope; in terms of microstructure, cross-section slices are made and observed under a metallographic microscope, and at least one of the following three points is different: first, observing the thickness and the transition interface between the metal layers, the coating thickness is uneven, while the thickness of the pressed sheet is relatively uniform, the coating transition interface is uneven, and the transition interface of the pressed sheet is relatively flat; second, observing the size and number of holes, the coating density is smaller than that of the pressed sheet; third, observing the grain size, the grains of the pressed sheet will be elongated along the calendering direction, while the coating will not.

[0013] It should be noted that when the temperature equalizing plate is set in an electronic device, the first cover plate can be a cover plate adjacent to the heating element in the electronic device, or the second cover plate can be a cover plate adjacent to the heating element in the electronic device; in the present application, the second cover plate is a cover plate adjacent to the heating element in the electronic device.

[0014] In one embodiment, the pressure method can also be a gravity hammer, a gravity tripod compaction or an explosive composite method. If the above three-layer composite structure is compacted by a gravity hammer, a gravity tripod compaction or an explosive composite method, the density of the first metal layer and the second metal layer and the adhesion of the first metal layer and the second metal layer to the first substrate layer can be improved, and the surface flatness of the first cover plate can also be improved. The explosive composite method is a process for the production of metal composite panels. Specifically, a layer of explosives is set on both sides of the first metal layer and the second metal layer, and the instantaneous ultra-high pressure and ultra-high speed impact generated by the explosion of the explosives are used to achieve the composite between the three metal layers of the first metal layer, the first substrate layer and the second metal layer.

[0015] In the above implementation, the working fluid in the temperature homogenizing plate may be water, alcohol, acetone, etc.

[0016] In a possible implementation of the first aspect, the density of the first base layer is less than the density of the first metal layer and the second metal layer, which can reduce the weight of the first cover plate and further reduce the weight of the temperature homogenizing plate.

[0017] In a possible implementation of the first aspect, the first metal layer and the second metal layer are made of the same material. When the first metal layer and the second metal layer are made of the same material, when subjected to pressure, the first metal layer and the second metal layer have similar internal stress and deformation, thereby improving the surface flatness of the first cover plate.

[0018] In some embodiments, the first metal layer and the second metal layer may be a single whole block, or may be formed by splicing a plurality of sub-metal layers, respectively, and the material of each sub-metal layer may be different or the same.

[0019] In a possible implementation of the first aspect, the thickness of the first metal layer and the second metal layer is within a preset difference. Thus, the first metal layer and the second metal layer deform to the same extent when subjected to pressure. When the thickness of the first metal layer and the second metal layer are equal, that is, the preset difference in thickness between the two is zero, the first metal layer and the second metal layer deform to the same extent when subjected to pressure, thereby improving the surface flatness of the first cover plate.

[0020] In a possible implementation of the first aspect, the thickness of the first metal layer and the second metal layer is greater than 0.01 mm. When the thickness of the first metal layer and the second metal layer is set to be less than 0.01 mm, the process difficulty will increase. The upper limit of the thickness of the first metal layer and the second metal layer is set according to the product, and this is not limited in this application.

[0021] In a possible implementation of the first aspect, the material of the first metal layer and the second metal layer is at least one of copper, copper alloy, nickel and nickel alloy. In this embodiment, the working fluid in the temperature plate is water, and water has a large thermal gain, and a unit mass of water can absorb more heat. In this embodiment, copper, copper alloy, nickel and nickel alloy materials are compatible with water, and water is compatible with copper, copper alloy, nickel and nickel alloy materials without forming non-condensing gas (NCG). In some embodiments, the first metal layer and / or the second metal layer may be a copper material or a copper alloy material in some areas, and a nickel material or a nickel alloy material in another area. In some embodiments, the first metal layer and / or the second metal layer may include two metal sublayers, one of which is a copper material or a copper alloy material, and the other is a nickel material or a nickel alloy material. In some embodiments, the material of the first metal layer and the second metal layer is a mixture of two or more of copper, copper alloy, nickel and nickel alloy. Specifically, in one embodiment, the material of the first metal layer and the second metal layer may be a copper-nickel alloy formed by copper and nickel.

[0022] In a possible implementation of the first aspect, the material of the first substrate layer is at least one of titanium, titanium alloy, steel, aluminum, aluminum alloy, magnesium and magnesium alloy. In some embodiments, the material of the first substrate layer can be one of titanium, titanium alloy, steel, aluminum, aluminum alloy, magnesium and magnesium alloy. In some embodiments, it can be a composite of two or more. The density of titanium, titanium alloy, steel, aluminum, aluminum alloy, magnesium and magnesium alloy is less than the density of copper, copper alloy, nickel and nickel alloy. The density of titanium and titanium alloy is 4.5g / cm 3 , the density of steel is 7.9g / cm 3 , the density of aluminum and aluminum alloy is 2.7g / cm 3 The density of magnesium and magnesium alloy is 1.74g / cm 3 , while the density of copper is 8.9g / cm 3 , the density of nickel is 8.9g / cm 3It should be noted that when other components are doped into each material, the density of the above materials will be different. Among them, the titanium, titanium alloy, and steel have higher strength and can be used to improve the supporting strength of the temperature-averaging plate, wherein the yield strength of titanium and titanium alloy is ≥320MPa, and the yield strength of steel is ≥230MPa. The aluminum, aluminum alloy, magnesium, and magnesium alloy have lower density and can be used to reduce the weight of the temperature-averaging plate. In the present application, the titanium alloy can be TA4 titanium alloy, or other titanium alloys can be selected, such as TA1, TA2, etc. in α-type titanium alloys, TC4 titanium alloys in α-β-type titanium alloys, or TB2 titanium alloys in β-type titanium alloys. The steel is stainless steel, which can be one of 301 stainless steel, 304 stainless steel, and 316 stainless steel. In one embodiment, the material of the first substrate layer can also be an amorphous metal, which has higher strength and can be used to form a higher-strength temperature-averaging plate.

[0023] In a possible implementation of the first aspect, the strength of the material of the first base layer is greater than the strength of the material of the first metal layer and the second metal layer. Using a material with greater strength as the first base layer can ensure that the temperature equalizer has better strength support. When the temperature equalizer is set in an electronic device, the components set on both sides of the temperature equalizer in the electronic device will have an extrusion effect on the temperature equalizer. In this embodiment, the first base layer is made of a material with greater strength, which can prevent the temperature equalizer from being squeezed and deformed by the components on both sides, thereby affecting the heat dissipation effect of the temperature equalizer. In addition, the first base layer with greater strength can avoid the risk of the temperature equalizer being squeezed and dented during the manufacturing process, thereby improving the production yield of the temperature equalizer.

[0024] In some embodiments, the material of the first substrate layer is at least one of titanium, titanium alloy and steel, so that the strength of the material of the first substrate layer is greater than the strength of the material of the first metal layer and the second metal layer. In a specific embodiment, the material of the first substrate layer is titanium alloy, and the material of the first metal layer and the second metal layer is copper. In a specific embodiment, the material of the first substrate layer is titanium alloy, and the material of the first metal layer and the second metal layer is nickel. In a specific embodiment, the material of the first substrate layer is stainless steel, and the material of the first metal layer and the second metal layer is copper. In a specific embodiment, the material of the first substrate layer is stainless steel, and the material of the first metal layer and the second metal layer is nickel. The temperature averaging plate described in the above-mentioned embodiments has a strong supporting strength. When the two sides of the first metal layer and the second metal layer are squeezed and collided, the temperature averaging plate can be prevented from being deformed, and the density of the first substrate layer is small, so that the effect of increasing strength and reducing weight can be achieved.

[0025] In some embodiments, the material of the first substrate layer is at least one of aluminum, aluminum alloy, magnesium and magnesium alloy. The density of aluminum, aluminum alloy, magnesium and magnesium alloy is smaller than that of titanium, titanium alloy and steel, making the weight of the temperature plate lighter. In a specific embodiment, the material of the first substrate layer is aluminum alloy or magnesium alloy, and the material of the first metal layer and the second metal layer is copper or nickel.

[0026] In a possible implementation of the first aspect, the first cover plate further includes a plurality of columnar structures protruding toward the accommodating cavity, and one end of the plurality of columnar structures facing the second cover plate is located on the capillary structure. The columnar structure is used to support the first cover plate and the second cover plate on the one hand, and to drain on the other hand. In this embodiment, the first cover plate is located above the second cover plate, and when the water working medium is heated and evaporated, it becomes water vapor, and the water vapor condenses to form liquid water after reaching the first cover plate, and the liquid water flows back to the capillary structure through the columnar structure.

[0027] In a possible implementation of the first aspect, the column structure is formed by stamping the first cover plate, and the column structure includes a portion of the first substrate layer, a portion of the first metal layer, and a portion of the second metal layer. After the column structure is stamped by the first cover plate, a flow channel is formed between the column structures, and water vapor condenses to form liquid water when encountering the cold surface of the first cover plate, and then flows back to the capillary structure through the column structure.

[0028] In a possible implementation of the first aspect, the first metal layer is disposed adjacent to the accommodating cavity compared to the second metal layer, the column structure is located on the side of the first metal layer away from the second metal layer, and the column structure is formed by etching the surface of the first metal layer away from the first base layer. That is, in this embodiment, the thickness of the first metal layer is set to be relatively large, and the first metal layer is etched to form the column structure. Specifically, the surface of the first metal layer away from the first base layer can be grooved by etching, and the portion other than the column structure can be removed, wherein the surface of the first metal layer facing the first base layer remains a continuous surface.

[0029] In a possible implementation of the first aspect, the first metal layer is arranged adjacent to the accommodation cavity compared to the second metal layer, and the material of the first metal layer is the same as the material of the capillary structure. The water medium can form a tiny electrochemical cell between the first metal layer and the capillary structure. Setting the first metal layer and the capillary structure to be the same material can reduce the potential difference between the two and avoid electrochemical reactions between the two. In a specific embodiment, the material of the first metal layer is copper, and the material of the capillary structure is copper. In one embodiment, the material of the first metal layer is nickel, and the material of the capillary structure is nickel.

[0030] In a possible implementation of the first aspect, the second cover plate includes a second base layer and a third metal layer and a fourth metal layer disposed on two opposite surfaces of the second base layer. In this embodiment, the second cover plate is disposed adjacent to the heating element compared to the first cover plate, the second cover plate absorbs the heat of the heating element to increase the temperature and causes the capillary structure to increase the temperature, the water medium then absorbs the heat of the second cover plate and the capillary structure to vaporize to form water vapor, the water vapor condenses to form liquid water after reaching the first cover plate, and the liquid water flows back from the column structure to the capillary structure and the second cover plate for the next cycle.

[0031] In a possible implementation of the first aspect, the third metal layer and the fourth metal layer are formed on the two opposite surfaces of the second base layer by pressure or plating. The pressure method is a rolling composite method, and the second cover plate obtained by the rolling composite method has a higher density and surface flatness. When the pressure is applied, the pressure on the two opposite surfaces of the second base layer is equivalent, and the residual stress and deformation degree inside the third metal layer and the fourth metal layer are equivalent, so that the second cover plate finally formed has a higher surface flatness.

[0032] In some embodiments, the plating method includes one of electroplating, chemical plating or electrodeposition. When the third metal layer and the fourth metal layer are formed by plating, in order to improve the density of the third metal layer and the fourth metal layer and the adhesion to the second substrate layer, the first metal layer and the fourth metal layer may be placed at a high temperature for sintering after the plating method is completed.

[0033] In this embodiment, the density of the second base layer is less than the density of the third metal layer and the fourth metal layer, so as to reduce the weight of the second cover plate, thereby reducing the weight of the entire temperature homogenizing plate. Specifically, the material of the second base layer is at least one of titanium, titanium alloy, steel, aluminum, aluminum alloy, magnesium and magnesium alloy, and the material of the third metal layer and the fourth metal layer is at least one of copper, copper alloy, nickel and nickel alloy.

[0034] In one embodiment, the strength of the second base layer is greater than the strength of the third metal layer and the fourth metal layer to improve the support strength of the second cover plate. Specifically, the material of the second base layer is at least one of titanium, titanium alloy and steel, and the material of the third metal layer and the fourth metal layer is at least one of copper, copper alloy, nickel and nickel alloy. In one embodiment, the material of the second base layer can also be amorphous metal, which has high strength and is used to form a high-strength temperature balancing plate.

[0035] In the present application, the thickness of the third metal layer and the fourth metal layer is set according to the total thickness of the actual temperature vapor chamber or the weight reduction requirement, and the thickness of the third metal layer and the fourth metal layer is greater than or equal to 0.01 mm.

[0036] In a possible implementation of the first aspect, the second cover plate has the same material and structure as the first cover plate. Specifically, the second substrate layer has the same material and structure as the first substrate layer, the third metal layer has the same material and structure as the first metal layer, and the fourth metal layer has the same material and structure as the second metal layer. In some embodiments, the third metal layer and the fourth metal layer may be pressed plates, and other features of the second cover plate are the same as those of the first cover plate, as described above.

[0037] In a possible implementation of the first aspect, the third metal layer is disposed adjacent to the accommodation cavity compared to the fourth metal layer, and the material of the third metal layer is the same as the material of the capillary structure. In this embodiment, the water medium can form a tiny electrochemical cell between the third metal layer and the capillary structure, and setting the third metal layer and the capillary structure to be the same material can reduce the potential difference between the two and avoid electrochemical reaction between the two. In one embodiment, the material of the third metal layer is copper, and the material of the capillary structure is copper.

[0038] In a possible implementation of the first aspect, the first cover plate further includes a plurality of first columnar substructures protruding toward the accommodating cavity, and the second cover plate further includes a plurality of second columnar substructures protruding toward the accommodating cavity, and at least some of the first columnar substructures have one end facing the second cover plate and at least some of the second columnar substructures have one end facing the first cover plate to form a columnar structure. That is, in this embodiment, the columnar structure is composed of the columnar substructures on the first cover plate and the second cover plate. The first columnar substructure can be formed by stamping or etching the first cover plate, and the second columnar substructure can be formed by stamping or etching the second cover plate.

[0039] In some embodiments, the second cover plate further includes a plurality of column structures protruding toward the accommodating cavity, the column structure including a portion of the second base layer, a portion of the third metal layer, and a portion of the fourth metal layer. In this embodiment, the column structure is disposed in the second cover plate and can be formed by stamping or etching the second cover plate.

[0040] In a second aspect, an embodiment of the present application provides an electronic device, which includes a heating element and a temperature averaging plate as described above, wherein the temperature averaging plate is used to dissipate heat from the heating element.

[0041] In a third aspect, an embodiment of the present application further provides a method for preparing a temperature equalizing plate, comprising preparing a first cover plate, the method for preparing the first cover plate comprising providing a first metal prefabricated plate, a second metal prefabricated plate, and a first base prefabricated plate; arranging the first metal prefabricated plate and the second metal prefabricated plate on two opposite surfaces of the first base prefabricated plate to obtain a three-layer composite structure; and compounding the three-layer composite structure by pressure. In an embodiment, the pressure compounding is rolling compounding.

[0042] In a possible implementation of the third aspect, in the process of providing the first metal prefabricated plate, the second metal prefabricated plate and the first substrate prefabricated plate. The first metal prefabricated plate, the second metal prefabricated plate and the first substrate prefabricated plate select metal materials according to the actual needs of the first cover plate product to be prepared. For example, when it is necessary to prepare a first cover plate with strong support strength, the material of the first substrate prefabricated plate is selected from at least one of titanium, titanium alloy and steel, and titanium, titanium alloy and steel have high strength. When it is necessary to prepare a first cover plate with a lighter weight, the material of the first substrate prefabricated plate can be selected from at least one of aluminum, aluminum alloy, magnesium and magnesium alloy, and aluminum, aluminum alloy, magnesium and magnesium alloy have a smaller density. In one embodiment, the first metal prefabricated plate, the second metal prefabricated plate and the first substrate prefabricated plate have the same size, so that each area forming the first cover plate includes the above-mentioned three-layer structure, thereby improving the preparation yield. In some embodiments, at least one of the first metal prefabricated plate, the second metal prefabricated plate and the first substrate prefabricated plate is a pressed plate to improve the density.

[0043] In a possible implementation of the third aspect, in the process of arranging the first metal prefabricated plate and the second metal prefabricated plate on two opposite surfaces of the first base prefabricated plate to obtain a three-layer composite structure. In this step, the layers in the three-layer composite structure are aligned with each other. In some embodiments, when the first metal prefabricated plate and the second metal prefabricated plate are arranged on different sizes of the first base prefabricated plate, the smallest prefabricated plate among the three is used as the standard, and the other two prefabricated plates are aligned with the smallest prefabricated plate. After the first metal prefabricated plate and the second metal prefabricated plate are arranged on two opposite surfaces of the first base prefabricated plate, the area not including the three prefabricated plates can be cut off to ensure the production yield of the first cover plate.

[0044] In a possible implementation of the third aspect, in the process of compounding the three-layer composite structure by pressure. In some embodiments, the three-layer composite structure can also be heated at a preset temperature, and then the three-layer composite structure is rolled and compounded by rollers after heating. After heating, the adhesion between the layers of the three-layer composite structure can be improved, and the amount of reduction can be increased. The reduction refers to the amount of thickness reduction, and the density of the first metal layer and the second metal layer formed can also be improved. The preset temperature can be set according to the material of each layer of the three-layer composite structure, such as the preset temperature can be set to 300°C, or to 500°C. It should be noted that when compounding by roller rolling, the rotation speed and the pressing speed of the roller can be set according to the temperature equalizing plate product, which is not limited in this application.

[0045] After the rolling composite is completed, the first metal prefabricated plate and the second metal prefabricated plate are compacted and more tightly combined with the first base prefabricated plate during the rolling composite process. The first metal prefabricated plate is compacted to form the first metal layer. The thickness of the formed first metal layer is smaller than that of the first metal prefabricated plate, and the density of the formed first metal layer is greater than that of the first metal prefabricated plate. In addition, during the rolling composite process, the atoms of the first metal layer and the first base layer diffuse and penetrate each other, thereby improving the adhesion between the first metal layer and the first base layer, which can reduce the risk of the first metal layer falling off from the first base layer during long-term work. The second metal prefabricated plate After the plate is compacted, the second metal layer is formed, the thickness of the formed second metal layer is smaller than that of the second metal prefabricated plate, and the density of the formed second metal layer is greater than that of the second metal prefabricated plate. In addition, during the rolling composite process, the atoms of the second metal layer and the first substrate layer diffuse and penetrate each other, thereby improving the adhesion between the second metal layer and the first substrate layer, which can reduce the risk of the second metal layer falling off from the first substrate layer during long-term work; after the first substrate prefabricated plate is compacted, the first substrate layer is formed, the thickness of the formed first substrate layer is smaller than that of the first substrate prefabricated plate, and the density of the formed first substrate layer is greater than that of the first substrate prefabricated plate.

[0046] In one embodiment, the method for preparing the first cover plate further includes performing surface treatment on the first metal prefabricated plate, the second metal prefabricated plate and the first substrate prefabricated plate; and performing annealing treatment on the three-layer composite structure after rolling and laminating to obtain the first cover plate.

[0047] In the process of surface treatment of the first metal prefabricated plate, the second metal prefabricated plate and the first substrate prefabricated plate. This step is mainly to remove the oxide layer on the surface of the first metal prefabricated plate, the second metal prefabricated plate and the first substrate prefabricated plate, so that the prefabricated plate exposes the corresponding metal material so that the surface contact is closer during rolling and compounding. Specifically, the prefabricated plate can be immersed in a salt solution to remove the surface oxide layer. In some embodiments, the surface treatment also includes roughening the surface of the first substrate prefabricated plate after removing the oxide layer on the surface of the first substrate prefabricated plate, and roughening the surface of the first metal prefabricated plate facing the first substrate prefabricated plate and the surface of the second metal prefabricated plate facing the first substrate prefabricated plate to improve the interface roughness between the first substrate prefabricated plate and the first metal prefabricated plate and the second metal prefabricated plate, so that the three-layer structure of the first metal prefabricated plate, the second metal prefabricated plate and the first substrate prefabricated plate can achieve good bonding between the interfaces when being roller rolled and compounded, and improve the adhesion between the first substrate layer and the first metal layer and the second metal layer.

[0048] In the process of annealing the three-layer composite structure after rolling and laminating to obtain the first cover plate, the annealing treatment can promote the mutual diffusion of metal atoms between the layers and enhance the bonding strength of the first cover plate. The bonding strength is related to the annealing temperature and annealing time, which can be determined according to the material of each layer of the three-layer composite structure or according to the actual needs of the temperature vapor chamber product.

[0049] In a possible implementation of the third aspect, the method for preparing the temperature homogenizing plate further includes preparing a second cover plate, and the method for preparing the second cover plate includes providing a second base layer; and forming a third metal layer and a fourth metal layer on two opposite surfaces of the second base layer, wherein the third metal layer is arranged toward the first cover plate.

[0050] In an optional implementation of the third aspect, the third metal layer and the fourth metal layer are formed on the two opposite surfaces of the second base layer by pressure or plating. The pressure method is a rolling composite method, and the second cover plate obtained by the rolling composite method has a higher density and surface flatness. The third metal layer and the fourth metal layer are formed on the two opposite surfaces of the second base layer. When pressure is applied, the pressure on the two opposite surfaces of the second base layer is equivalent, and the residual stress and deformation degree inside the third metal layer and the fourth metal layer are equivalent, so that the second cover plate finally formed has a higher surface flatness.

[0051] In some embodiments, the coating method includes one of electroplating, chemical plating or electrodeposition. When the third metal layer and the fourth metal layer are formed by the coating method, in order to improve the density of the third metal layer and the fourth metal layer and the adhesion to the second base layer, the first metal layer and the fourth metal layer can also be sintered at a high temperature in a vacuum after the coating method is completed. In some embodiments, when a thicker coating is required, in order to ensure the density of the coating, multiple coatings and multiple sintering methods can be used to form a coating with a higher density. Specifically, taking the formation of the third metal layer as an example, the coating method is electroplating, the second base layer is electroplated for the first time, a first metal sublayer is formed on the surface of the second base layer, and then the first metal sublayer is sintered at a high temperature to obtain a first metal sublayer with a higher density, and then the second base layer is electroplated for a second time, and a second metal sublayer is formed on the surface of the first metal sublayer away from the second base layer, and then the second metal sublayer is sintered at a high temperature to obtain a second metal sublayer with a higher density, and the first metal sublayer and the second metal sublayer constitute the third metal layer. In other embodiments, the number of plating and sintering can be set according to product requirements.

[0052] In the present application, the thickness of the third metal layer and the fourth metal layer is set according to the total thickness of the actual temperature vapor chamber or the weight reduction requirement, and the thickness of the third metal layer and the fourth metal layer is greater than or equal to 0.01 mm.

[0053] It should be noted that when the second cover plate has the same material and structure as the first cover plate, the preparation method of the first cover plate can be used to prepare the second cover plate. When the second cover plate has different material and structure from the first cover plate, adaptive adjustments can also be made according to the preparation method of the first cover plate.

[0054] In a possible implementation of the third aspect, the method for preparing the temperature equalizing plate further includes forming a columnar structure by stamping or etching at least one of the first cover plate and the second cover plate. Specifically, a plurality of columnar structures may be formed on the surface of the first cover plate facing the accommodating cavity, and the first cover plate may be formed into a columnar structure by stamping or etching, and the columnar structure is used to support the first cover plate and the second cover plate, and to drain the water medium. In some embodiments, a plurality of columnar structures are formed on the surface of the second cover plate facing the accommodating cavity. In some embodiments, a plurality of first columnar substructures are formed on the surface of the first cover plate facing the accommodating cavity, and a plurality of second columnar substructures are formed on the surface of the second cover plate facing the accommodating cavity, and at least part of the first columnar substructures are respectively connected to one end of at least part of the second columnar substructures facing the first cover plate to form a columnar structure.

[0055] In some embodiments, the shapes of the first cover plate and the second cover plate can be formed by stamping. The shapes of the first cover plate and the second cover plate can be set according to the actual product requirements of the temperature equalizing plate. For example, the middle areas of the first cover plate and the second cover plate are stamped to form the first recessed area and the second recessed area respectively, and the edge areas of the first cover plate and the second cover plate are stamped to form the first connecting part and the second connecting part. When the first cover plate and the second cover plate are sealed, the first connecting part and the second connecting part are sealed and connected, and the recessed area and the recessed area between the two constitute a receiving cavity.

[0056] In a possible implementation of the third aspect, the method for preparing the temperature equalizing plate also includes forming a capillary structure between the first cover plate and the second cover plate, the first metal layer is arranged adjacent to the second cover plate compared to the second metal layer, and the third metal layer is arranged adjacent to the second cover plate compared to the fourth metal layer; and the first cover plate and the second cover plate are sealed to form a accommodating cavity.

[0057] In a possible implementation of the third aspect, in the process of forming a capillary structure between the first cover plate and the second cover plate. The capillary structure can be formed on the second cover plate and located between the first cover plate and the second cover plate, or the capillary structure can be prepared first, and then the capillary structure can be arranged between the first cover plate and the second cover plate, or a part of the capillary structure can be prepared on the first cover plate, and a part of the capillary structure can be prepared on the second cover plate, and the two parts can be combined to form a capillary structure. The capillary structure can be foamed copper or foamed nickel, and the foamed copper is a new multifunctional material with a large number of connected or unconnected holes distributed in the copper matrix, and the foamed nickel is a new multifunctional material with a large number of connected or unconnected holes distributed in the nickel matrix. Alternatively, copper powder or copper mesh can be placed on the copper layer, and a capillary structure can be formed by sintering, and the capillary structure can be connected to the first cover plate and the second cover plate by sintering, hot pressing, cold pressing, etc. The thickness, area, shape area and porosity of the capillary structure can be adjusted according to the requirements of heat dissipation performance. The capillary structure includes but is not limited to mesh, powder, fiber, groove, felt cloth and boss. The material of the capillary structure is the same as that of the first metal layer and the third metal layer, so as to reduce the potential difference between the capillary structure and the first metal layer or between the capillary structure and the second metal layer and avoid electrochemical reaction.

[0058] In a possible implementation of the third aspect, during the process of sealing the first cover plate and the second cover plate to form a receiving cavity. The first cover plate and the second cover plate can be sealed by welding, and a small hole can be reserved on the periphery of the first cover plate and the second cover plate to form an injection hole, and the injection hole can be used to evacuate the interior of the receiving cavity and to inject water into the receiving cavity. The welding method includes but is not limited to laser welding, brazing, resistance roll welding, diffusion welding and hot pressing. In some embodiments, after the sealing is completed, a leveling process can be performed according to the actual situation of the sealed product to make the upper and lower surfaces of the temperature equalizing plate smoother. The leveling process includes but is not limited to heating and shaping, and cold pressing and shaping; if the product itself has good flatness in some embodiments, the actual production may not include a leveling process.

[0059] In one embodiment, the method for preparing the temperature equalizing plate further comprises injecting liquid into the containing cavity through the liquid injection hole, and after the liquid injection is completed, vacuumizing the containing cavity through the liquid injection hole, and then sealing the liquid injection hole.

[0060] In a possible implementation of the third aspect, in the step of injecting liquid into the receiving chamber through the injection hole, evacuating the receiving chamber through the injection hole after the injection is completed, and then sealing the injection hole. Evacuating the interior of the receiving chamber can, on the one hand, remove oxygen to prevent the water medium and oxygen from corroding the first surface layer and the capillary structure, and on the other hand, allow water to vaporize at a lower temperature in a vacuum environment, such as 50-70°C. The general computer operating temperature is 50-70°C, and it does not need to be heated to 100°C to vaporize, so that water can effectively absorb heat and vaporize, thereby improving the heat dissipation efficiency. In some embodiments, a catheter can be set in the injection hole, and the receiving chamber can be injected and evacuated through the catheter, and then the catheter can be shortened, that is, the tail of the catheter is removed, and then the remaining part of the catheter is sealed to complete the sealing of the receiving chamber.

[0061] In one embodiment, liquid is injected into the containing cavity through the injection hole, and after the injection is completed, the containing cavity is evacuated through the injection hole, and then the injection hole is sealed. It can be determined whether to perform surface treatment according to product conditions. If the surface material of the first cover plate and the second cover plate is copper, surface treatment processes including but not limited to passivation and painting can be performed to increase surface stability; if the surface material is nickel, no surface treatment is required.

[0062] In one embodiment of the present application, a method for preparing a temperature equalizing plate is provided, comprising preparing a first cover plate and a second cover plate, wherein the first cover plate comprises a first titanium substrate layer and a first copper layer and a second copper layer formed on opposite surfaces of the first titanium substrate layer by a calendering composite method; the second cover plate comprises a second titanium substrate layer and a third copper layer and a fourth copper layer formed on opposite surfaces of the second titanium substrate layer by a calendering composite method; the first cover plate is stamped to form a columnar structure, foam copper is formed on the second cover plate, and the first copper layer and the third copper layer are arranged adjacent to the foam copper; the first cover plate and the second cover plate are sealed to form a receiving cavity and an injection hole; liquid is injected into the receiving cavity through the injection hole, and after the injection is completed, the receiving cavity is vacuumized through the injection hole, and then the injection hole is sealed.

[0063] Among them, the thickness of the first copper layer, the second copper layer, the third copper layer and the fourth copper layer is 0.01mm, the thickness of the first titanium matrix layer and the second titanium matrix layer is 0.08mm, and the thickness of the first cover plate and the second cover plate is 0.1mm, so as to obtain a thinner temperature equalizing plate. The first copper layer, the second copper layer, the third copper layer and the fourth copper layer are pressed plates. The first titanium matrix layer and the second titanium matrix layer have strong supporting strength and light weight, the first copper layer, the second copper layer, the third copper layer and the fourth copper layer have high surface flatness and good compatibility with water working medium, the water working medium will not form non-condensable gas on the copper layer, and has better heat dissipation effect. The capillary structure is foam copper. The first cover plate and the second cover plate are sealed by welding.

[0064] The first cover plate and the second cover plate of the temperature equalizing plate prepared in this embodiment have high supporting strength, surface flatness and low weight. The first cover plate and the second cover plate have high surface density and good stability. The water working medium inside the temperature equalizing plate can condense on the first copper layer to form liquid water, which has a good heat dissipation effect.

[0065] In some embodiments, the present application also provides a method for preparing a temperature equalizing plate. Different from the above-mentioned method for preparing a temperature equalizing plate, the opposite surfaces of the titanium substrate layer of the first cover plate and the second cover plate are nickel metal layers, and the capillary structure is nickel foam.

[0066] In some embodiments, the present application further provides a method for preparing a temperature equalizing plate, which is different from the above-mentioned method for preparing a temperature equalizing plate in that the base layers of the first cover plate and the second cover plate are stainless steel base layers.

[0067] In one embodiment of the present application, a method for preparing a temperature equalizing plate is provided, comprising preparing a first cover plate and a second cover plate, wherein the first cover plate comprises a first aluminum substrate layer and a first copper layer and a second copper layer formed on opposite surfaces of the first aluminum substrate layer by a rolling composite method; the second cover plate comprises a second aluminum substrate layer and a third copper layer and a fourth copper layer formed on opposite surfaces of the second aluminum substrate layer by a rolling composite method; the first cover plate is stamped to form a columnar structure, foam copper is formed on the second cover plate, and the first copper layer and the third copper layer are arranged adjacent to the foam copper; the first cover plate and the second cover plate are sealed to form a receiving cavity and an injection hole; liquid is injected into the receiving cavity through the injection hole, and after the injection is completed, the receiving cavity is vacuumized through the injection hole, and then the injection hole is sealed.

[0068] The thickness of the first copper layer, the second copper layer, the third copper layer and the fourth copper layer is 0.03 mm, and the thickness of the first aluminum substrate layer and the second aluminum substrate layer is 0.1 mm. The first aluminum substrate layer and the second aluminum substrate layer have a relatively low weight, and the first copper layer, the second copper layer, the third copper layer and the fourth copper layer have a relatively high surface flatness and good compatibility with water working medium. The water working medium will not form non-condensable gas on the copper layer, and has a relatively good heat dissipation effect.

[0069] The first cover plate and the second cover plate of the temperature equalizing plate prepared in this embodiment have light weight and surface flatness, the surface density of the first cover plate and the second cover plate is high and has good stability, and the water working medium inside the temperature equalizing plate can condense on the first copper layer to form liquid water, which has a good heat dissipation effect.

[0070] In one embodiment, the present application further provides a method for preparing a temperature equalizing plate, which is different from the above-mentioned method for preparing a temperature equalizing plate in that the base layers of the first cover plate and the second cover plate are magnesium base layers.

[0071] In one embodiment, the present application further provides a method for preparing a temperature equalizing plate, which is different from the above-mentioned method for preparing a temperature equalizing plate in that the capillary structure is a copper mesh.

[0072] In one embodiment, the present application also provides a method for preparing a temperature equalizing plate. Different from the above-mentioned method for preparing a temperature equalizing plate, the opposite surfaces of the aluminum substrate layer of the first cover plate and the second cover plate are nickel metal layers, and the capillary structure is foamed nickel. BRIEF DESCRIPTION OF THE DRAWINGS

[0073] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0074] Figure 1 This is a schematic diagram of the structure of a temperature homogenizing plate provided in an embodiment of the present application applied in an electronic device;

[0075] Figure 2 This is a schematic diagram of the structure of a temperature homogenizing plate provided in an embodiment of the present application applied in an electronic device;

[0076] Figure 3 is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

[0077] Figure 4 This is a schematic diagram of the structure of a temperature homogenizing plate provided in an embodiment of the present application applied in an electronic device;

[0078] Figure 5 It is a schematic diagram of the structure of a temperature homogenizing plate provided in one embodiment of the present application;

[0079] Figure 6 is a schematic diagram of the first cover plate in the temperature homogenizing plate provided in one embodiment of the present application during the preparation process;

[0080] Figure 7 is a schematic diagram of the first cover plate in the temperature homogenizing plate provided in one embodiment of the present application during the preparation process;

[0081] Figure 8 It is a schematic diagram of the structure of a temperature homogenizing plate provided in one embodiment of the present application;

[0082] Fig. 9 It is a schematic structural diagram of a first cover plate in a temperature homogenizing plate provided in one embodiment of the present application;

[0083] Fig.10 is a flow chart of a method for preparing a temperature homogenizing plate provided in one embodiment of the present application;

[0084] Fig.11 is a flow chart of a method for preparing a first cover plate in a temperature homogenizing plate provided in one embodiment of the present application;

[0085] Fig.12 is a flow chart of a method for preparing a second cover plate in a temperature homogenizing plate provided in one embodiment of the present application;

[0086] Fig.13 is a top view of a temperature homogenizing plate provided in one embodiment of the present application;

[0087] Fig.14 yes Fig.13 The schematic diagram of the structure of the temperature homogenizing plate shown in FIG. 1 is cut along the AA line;

[0088] Fig.15 is a flow chart of a method for preparing a temperature homogenizing plate provided in one embodiment of the present application;

[0089] Fig.16 It is a schematic diagram of the structure of a temperature homogenizing plate provided in one embodiment of the present application;

[0090] Fig.17 is a flow chart of a method for preparing a temperature homogenizing plate provided in one embodiment of the present application;

[0091] Fig.18 It is a schematic diagram of the structure of a temperature equalizing plate provided in one embodiment of the present application. DETAILED DESCRIPTION

[0092] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0093] For ease of understanding, the English abbreviations and related technical terms involved in the embodiments of the present application are explained and described below.

[0094] Vapor Chamber (VC): Also known as a heat spreader, it is a vacuum chamber with a microstructure on the inner wall and capable of injecting working fluid. The working principle of the vapor chamber specifically includes four main steps: conduction, evaporation, convection, and condensation. When the heat generated by the heat source enters the vapor chamber through heat conduction, the working fluid near the heat source in the vapor chamber will quickly vaporize after absorbing the heat, taking away a large amount of heat at the same time. Reusing the heat dissipation of steam, when the steam in the vapor chamber diffuses from the high temperature zone to the low temperature zone, when the steam contacts the inner wall with a lower temperature, it will quickly condense into liquid and release heat energy; the working fluid condensed into liquid returns to the heat source through the capillary structure, thereby completing a heat conduction cycle and forming a two-way circulation system in which the working fluid vapor and liquid coexist. At present, the commonly used material for vapor chambers is copper, and the working fluid inside is pure water.

[0095] Capillary structure: Since the liquid surface has surface tension, when the infiltrated liquid is in the capillary pore, its liquid surface is concave, so the liquid surface will exert a pulling force on the liquid below, causing the liquid to move upward along the wall of the capillary pore. This causes the capillary phenomenon. The capillary structure can include multiple capillaries or fine grooves similar to capillaries. In this way, when the liquid working medium enters the capillary pores or fine grooves in the capillary structure, it will flow to the other end of the capillary pore through capillary action, completing the transfer and return of the working medium.

[0096] The present application provides a temperature averaging plate and a preparation method thereof, and an electronic device. The temperature averaging plate of the present application can be applied to electronic devices and related modules, structural parts, and functional parts with heat dissipation functions. The electronic device can be a mobile phone, a tablet computer, a notebook, a wearable product, a smart home terminal, and other electronic devices. The electronic device 1 includes a heating element and a temperature averaging plate, and the temperature averaging plate is used to dissipate heat from the heating element. Please refer to Figure 1 , taking the electronic device 1 as a mobile phone as an example, the electronic device 1 includes a display screen, a middle frame 10, and a back cover. The middle frame 10 and the back cover enclose an internal cavity 20. The internal cavity 20 is provided with a circuit board 30, a camera device 40, a temperature plate 50 and other components. The other components include mobile phone functional components such as memory, input device, sensor, power supply, etc. It should be noted that, Figure 1 The structure of the mobile phone shown does not constitute a limitation on the mobile phone, and may include more or fewer components, or combine certain components, or separate certain components, or arrange the components differently. The electronic device 1 generates heat when it is working. For example, the circuit board 30 integrates the circuits implemented by the functional components in the electronic device 1. When the electronic device 1 is working, it generates a lot of heat. The circuit board 30 is the heating element of the electronic device 1 and is one of the high heat sources of the electronic device. If it cannot be properly cooled, the continuous heat generated by the circuit board 50 will cause the circuit board 30 to burn out. Please refer to Figure 1 , one end 51 of the temperature equalizing plate 50 is connected to the circuit board 30, and the other end 52 of the temperature equalizing plate 50 extends in a direction away from the circuit board 30, so that when the circuit board 30 generates heat, one end 51 of the temperature equalizing plate 50 introduces the heat of the circuit board 30 into the temperature equalizing plate 50, and then diffuses the heat to other areas through the other end 52 of the temperature equalizing plate 50, so that the circuit board 30 can be cooled. Specifically, the middle frame 10 includes a frame 11 and a middle plate 12 located between the frame 11, and the frame 11 is the side cover of the electronic device 1. The other end 52 of the temperature equalizing plate 50 is connected to the middle plate 12 to diffuse the heat from the other end 52 of the temperature equalizing plate 50 to the middle plate 12. The middle plate 52 has a large heat dissipation area and can effectively dissipate heat, wherein the middle plate 12 is made of aluminum alloy and has a high thermal conductivity rate. It should be noted that Figure 1The structure of the temperature averaging plate 50 is a long strip with a bending section. In actual products, the shape of the temperature averaging plate 50 can be set according to the internal structure of the product, and is not limited in this application.

[0097] See also Figure 2 In one embodiment of the present application, one end 51 of the temperature equalizer 50 is connected to the camera device 40, and the other end 52 of the temperature equalizer 50 is connected to the middle plate 12, which is used to diffuse the heat of the camera device 40 to the middle plate 12 when the camera device 40 is working, so as to cool the camera device 40. When the electronic device 1 is performing camera work, the camera device 40 will generate more heat than other components of the electronic device 10. At this time, the camera device 40 is a heating element, and one end 51 of the temperature equalizer 50 is connected to the camera device 40 to conduct the heat of the camera device 40 to the temperature equalizer 50, and then conduct the heat to the middle plate 12 through the temperature equalizer 50. The middle plate 12 then diffuses the heat to the frame 11 of the electronic device and diffuses it into the air, wherein the middle plate 12 is made of aluminum alloy and has a high thermal conductivity rate. It should be noted that in Figure 2 The temperature homogenizing plate 50 is in the shape of a long strip with a bending section to adapt to the internal structure of the electronic device 1. In actual products, the shape of the temperature homogenizing plate 50 can be set according to the internal structure of the product and is not limited in this application.

[0098] See also Figure 3 and Figure 4 The electronic device 1 in one embodiment of the present application is a laptop computer, which includes a display screen 60 and a computer body 70. The computer body 70 includes a circuit board 80, a temperature averaging board 50, a heat sink 90 and other components. The other components include computer functional components such as a memory, an input device, a sensor, and a power supply. It should be noted that Figure 4 The illustrated notebook computer structure does not constitute a limitation on the notebook computer, and may include more or fewer components, or combine certain components, or split certain components, or arrange the components differently. The temperature-averaging plate 50 is disposed on the circuit board 80, and one end 51 of the temperature-averaging plate 50 is provided with a heat dissipation device 90. In the present embodiment, the heat dissipation device 90 is a fan. When the notebook computer is working, the heat generated by the circuit board 80 is conducted through the temperature-averaging plate 50, and then the heat dissipation device 90 dissipates the heat of the temperature-averaging plate 50, and diffuses the heat of the temperature-averaging plate 50 into the air, so as to dissipate heat and cool the notebook computer. In the present embodiment, the temperature-averaging plate 50 is a structure with three long strips and a curved shape. In actual products, the shape of the temperature-averaging plate 50 can be set according to the internal structure of the product, and is not limited in the present application.

[0099] See also Figure 5In one embodiment of the present application, a temperature averaging plate 50 is provided, which includes a first cover plate 100, a second cover plate 200 and a capillary structure 300. A receiving cavity 400 is provided between the first cover plate 100 and the second cover plate 200. The capillary structure 300 is located in the receiving cavity 400. The first cover plate 100 includes a first base layer 110 and a first metal layer 120 and a second metal layer 130 arranged on two opposite surfaces of the first base layer 110. The first metal layer 120 and the second metal layer 130 are pressed plates.

[0100] Among them, the pressed plate refers to a plate formed by pressure, and the first metal layer 120 and the second metal layer 130 are pressed plates formed on the opposite surfaces of the first base layer 110 by pressure. When preparing the first cover plate 100, pressure is applied to the first metal layer 120 and the second metal layer 130, so that the first metal layer 120 and the second metal layer 130 can be more closely attached to the first base layer 110 through diffusion, thereby improving the adhesion between the first metal layer 120 and the second metal layer 130 and the first base layer 110, and also improving the density of the first metal layer 120 and the second metal layer 130.

[0101] In one embodiment, the pressure method is a rolling compound method, see Figure 6The prefabricated plate for forming the first metal layer 120 is denoted as the first metal prefabricated plate 121, the prefabricated plate for forming the second metal layer 130 is denoted as the second metal prefabricated plate 131, and the prefabricated plate for forming the first substrate layer 110 is denoted as the first substrate prefabricated plate 111. The first metal prefabricated plate 121 and the second metal prefabricated plate 131 are placed on two opposite surfaces of the first substrate prefabricated plate 111 to obtain a three-layer composite structure 101, and then the three-layer composite structure 101 is composited by rolling composite, specifically, the three-layer composite structure 101 is passed between two rollers 102. After the rolling composite step is completed, the first metal prefabricated plate 121 and the second metal prefabricated plate 131 are compacted during the rolling composite process and are more closely combined with the first substrate layer 110. After the first metal prefabricated plate 121 is compacted, the first metal layer 120 is formed. The thickness of the first metal layer 120 is smaller than that of the first metal prefabricated plate 121. The density of the first metal layer 120 is greater than that of the first metal prefabricated plate 121. In the rolling composite process, the atoms of the first metal layer 120 and the first substrate layer 110 diffuse and penetrate each other, thereby improving the adhesion between the first metal layer 120 and the first substrate layer 110, which can reduce the risk of the first metal layer 120 falling off from the first substrate layer 110 during long-term work. After the second metal prefabricated plate 131 is compacted, the second metal layer 130 is formed. The thickness of the second metal layer 130 is greater than that of the second metal prefabricated plate 1 31 is smaller, the density of the formed second metal layer 130 is greater than that of the second metal prefabricated plate 131, and during the rolling composite process, the atoms of the second metal layer 130 and the first substrate layer 110 diffuse and penetrate each other, thereby improving the adhesion between the second metal layer 130 and the first substrate layer 110, which can reduce the risk of the second metal layer 130 falling off from the first substrate layer 110 during long-term work; the first substrate prefabricated plate 111 is compacted to form the first substrate layer 110, the thickness of the formed first substrate layer 110 is smaller than that of the first substrate prefabricated plate 111, the density of the formed first substrate layer 110 is greater than that of the first substrate prefabricated plate 111, and the formed first substrate layer 110 is also a pressed plate. In some embodiments, the first metal layer 120 and the second metal layer 130 have textures on the surface away from the first substrate layer 110. Specifically, it is a rolling texture, and the shape is not limited.

[0102] In some embodiments, at least one of the first metal prefabricated plate 121, the second metal prefabricated plate 131, and the first base prefabricated plate 111 is a pressed plate. Taking the first metal prefabricated plate 121 as an example, the first metal prefabricated plate 121 itself is a pressed plate, and has a high density before being used to form the first cover plate 100. Then, during the process of preparing the first cover plate 100, it is pressed by pressure, which can further improve the flatness and density of the formed first metal layer 120.

[0103] In this embodiment, the density of the first metal layer 120 and the second metal layer 130 is improved when subjected to pressure, thereby improving the stability of the first metal layer 120 and the second metal layer 130 . When the first metal layer 120 is arranged adjacent to the accommodating cavity 400, when the temperature equalizing plate 50 is working, the water medium in the accommodating cavity 400 will contact the first metal layer 120, and the water medium is distributed in the first metal layer 120 and the capillary structure 300, or the water medium is distributed in the first metal layer 120 and the first substrate layer 110 through a loose gap. When the first metal layer 120 and the first substrate layer 110 are made of different materials, a tiny electrochemical cell will be formed between the two, which will cause an electrochemical reaction in the first metal layer 120 over a long period of time. In the present application, the first metal layer 120 is formed by pressure to have a higher density and stability, which can reduce the risk of electrochemical reactions. In the present application, the first metal layer 120 with a higher density formed by pressure will not have or will greatly reduce the risk of water entering the first metal layer 120 through the pores and forming a primary cell between the first metal layer 120 and the first substrate layer 110 to produce a chemical reaction to generate non-condensable gas.

[0104] In the present application, the first metal layer 120 and the second metal layer 130 disposed on the two opposite surfaces of the first base layer 110 are pressed plates. When the first metal layer 120 and the second metal layer 130 are subjected to pressure during the preparation process, the pressures on the two opposite surfaces of the first base layer 110 are similar, so that the residual stress and deformation degree of the first metal layer 120 and the second metal layer 130 are similar, thereby making the finally formed first cover plate 100 have a higher surface flatness. Figure 7 Assume that the first cover plate 100a is a two-layer structure. Specifically, the first cover plate 100a includes a first base layer 110 and a first metal layer 120 made of different materials. When pressure is applied to the first cover plate 100a, since the first metal layer 120 is only provided on one side of the first base layer 110, when the first cover plate 100a is fed into the roller 102 and subjected to pressure, the first base layer 110 and the first metal layer 120 have different deformation amounts inside the material and different internal residual stresses, so that both sides of the entire first cover plate 100a are deformed unevenly when subjected to pressure, thereby resulting in poor flatness of the first cover plate 100a after rolling.

[0105] In the present application, the first cover plate 100 is a three-layer structure, and the three-layer structure can increase the processability of the first cover plate 100. For example, the thickness of the first metal layer 120 can be set to be thicker, and the first metal layer 120 can be etched to form a capillary structure or a column structure, or the thickness of the second metal layer 130 can be set to be thicker, which can be used to form a structural member adapted to the electronic device 10. For another example, when the first cover plate 100 has only two layers, including a titanium layer as the first base layer and a copper layer as the first metal layer, since the titanium layer is easily oxidized to form titanium dioxide, the formed titanium dioxide is easy to stick to the roller after being pressed by the roller, and titanium dioxide is relatively hard. When the first base layer and the first metal layer are compacted by calendering composite method, the roller with titanium dioxide sticking to it repeatedly rolls the first cover plate 100, causing the surface of the first cover plate 100 to be rough and uneven; when the first cover plate 100 adopts a three-layer structure, for example, the first metal layer 120 and the second metal layer 130 are copper layers, and the first base layer 100 is a titanium layer, the two copper layers cover the titanium layer in the inner layer, which is not easily oxidized and can prevent the titanium layer from breaking, thereby avoiding the risk of titanium dioxide sticking to the roller and causing the surface of the first cover plate 100 to be rough and uneven, thereby improving machinability.

[0106] The temperature equalizing plate 50 provided in the present application can, on the one hand, improve the density of the first metal layer 120 and the second metal layer 130, and have high stability when in contact with the water medium, avoiding the risk of incompatibility such as chemical reaction with the water medium, and can also improve the adhesion between the first metal layer 120 and the second metal layer 130 and the first substrate layer 110. On the other hand, it has a high surface flatness, which can improve the surface fit of other components in contact with the first cover plate 100. When applied to the electronic device 10, it can reduce the thickness of the electronic device 10. On the other hand, the three-layer structure setting can also improve the machinability of the first cover plate 100.

[0107] In the present application, the pressed sheet is different from the coating, specifically including at least one of the following differences: in terms of surface morphology, the pressed sheet has calendering lines on its surface, while the coating does not, and the coating looks like sand under a light microscope; in terms of microstructure, cross-section slices are made and observed under a metallographic microscope, and at least one of the following three points is different: first, observing the thickness and the transition interface between the metal layers, the coating thickness is uneven, while the thickness of the pressed sheet is relatively uniform, the coating transition interface is uneven, and the transition interface of the pressed sheet is relatively flat; second, observing the size and number of holes, the coating density is smaller than that of the pressed sheet; third, observing the grain size, the grains of the pressed sheet will be elongated along the calendering direction, while the coating will not.

[0108] It should be noted that when the temperature equalizing plate 50 is set in the electronic device 1, the first cover plate 100 can be a cover plate adjacent to the heating element in the electronic device 1, or the second cover plate 200 is a cover plate adjacent to the heating element in the electronic device 1; in the present application, the second cover plate 200 is a cover plate adjacent to the heating element in the electronic device 1.

[0109] In one embodiment, the pressure method can also be compacted by a gravity hammer, a gravity tripod or an explosive composite method. For example, the three-layer composite structure 101 is compacted by a gravity hammer, a gravity tripod or an explosive composite method to improve the density of the first metal layer 120 and the second metal layer 130 and the adhesion of the first metal layer 120 and the second metal layer 130 to the first substrate layer 110, and the surface flatness of the first cover plate 100 can also be improved. The explosive composite method is a process for the production of metal composite panels. Specifically, a layer of explosives is set on both sides of the first metal prefabricated plate 121 and the second metal prefabricated plate 131, and the instantaneous ultra-high pressure and ultra-high speed impact generated by the explosion of the explosives are used to achieve the composite of the three metal layers of the first metal layer 120, the first substrate layer 110 and the second metal layer 130.

[0110] In the above embodiment, the working medium in the temperature homogenizing plate 50 may be water, alcohol, acetone, etc.

[0111] In a possible implementation, the density of the first base layer 110 is less than the density of the first metal layer 120 and the second metal layer 130. The weight of the first cover plate 100 can be reduced, and the weight of the temperature vapor chamber 50 can be reduced.

[0112] In a possible implementation, the first metal layer 120 and the second metal layer 130 are made of the same material. When the first metal layer 120 and the second metal layer 130 are made of the same material, when subjected to pressure, the internal stress and deformation degree of the first metal layer 120 and the second metal layer 130 are similar, thereby improving the surface flatness of the first cover plate 100.

[0113] In some embodiments, the first metal layer 120 and the second metal layer 130 may be a single whole block, or may be formed by splicing a plurality of sub-metal layers, and the material of each sub-metal layer may be different or the same.

[0114] In a possible implementation, the thickness of the first metal layer 120 and the second metal layer 130 is within a preset difference. Thus, the first metal layer 120 and the second metal layer 130 deform to the same extent when subjected to pressure. When the thickness of the first metal layer 120 and the second metal layer 130 are equal, that is, the preset difference in thickness between the two is zero, the first metal layer 120 and the second metal layer 130 deform to the same extent when subjected to pressure, thereby improving the surface flatness of the first cover plate 100.

[0115] In a possible implementation, the thickness of the first metal layer 120 and the second metal layer 130 is greater than 0.01 mm. Setting the thickness of the first metal layer 120 and the second metal layer 130 to be less than 0.01 mm will increase the process difficulty. The upper limit of the thickness of the first metal layer 120 and the second metal layer 130 is set according to the product and is not limited in this application.

[0116] In a possible implementation, the material of the first metal layer 120 and the second metal layer 130 is at least one of copper, copper alloy, nickel and nickel alloy. In this embodiment, the working medium in the temperature plate 50 is water, and water has a large thermal gain, and a unit mass of water can absorb more heat. In this embodiment, copper, copper alloy, nickel and nickel alloy materials are compatible with water, and water is compatible with copper, copper alloy, nickel and nickel alloy materials and will not form non-condensing gas (NCG). In some embodiments, the first metal layer 120 and / or the second metal layer 130 may be partially made of copper or copper alloy material, and another partially made of nickel or nickel alloy material. In some embodiments, the first metal layer 120 and / or the second metal layer 130 may include two metal sublayers, one of which is made of copper or copper alloy material, and the other is made of nickel or nickel alloy material. In some embodiments, the material of the first metal layer 120 and the second metal layer 130 is a mixture of two or more of copper, copper alloy, nickel and nickel alloy. Specifically, in one embodiment, the material of the first metal layer 120 and the second metal layer 130 may be a copper-nickel alloy formed by copper and nickel.

[0117] In a possible implementation, the material of the first substrate layer 110 is at least one of titanium, titanium alloy, steel, aluminum, aluminum alloy, magnesium and magnesium alloy. In some embodiments, the material of the first substrate layer 110 can be one of titanium, titanium alloy, steel, aluminum, aluminum alloy, magnesium and magnesium alloy. In some embodiments, it can be a composite of two or more of the two. The density of titanium, titanium alloy, steel, aluminum, aluminum alloy, magnesium and magnesium alloy is less than that of copper, copper alloy, nickel and nickel alloy. The density of titanium and titanium alloy is 4.5g / cm 3 , the density of stainless steel is 7.9g / cm 3 , the density of aluminum and aluminum alloy is 2.7g / cm 3 The density of magnesium and magnesium alloy is 1.74g / cm 3 , while the density of copper is 8.9g / cm 3 , the density of nickel is 8.9g / cm 3It should be noted that when other components are doped into each material, the density of the above materials will be different. Among them, the titanium, titanium alloy, and steel have higher strength and can be used to improve the support strength of the temperature averaging plate 50, wherein the yield strength of titanium and titanium alloy is ≥320MPa, and the yield strength of steel is ≥230MPa. The aluminum, aluminum alloy, magnesium, and magnesium alloy have lower density and can be used to reduce the weight of the temperature averaging plate 50. In the present application, the titanium alloy can be TA4 titanium alloy, or other titanium alloys can be selected, such as TA1, TA2, etc. in α-type titanium alloys, TC4 titanium alloys in α-β-type titanium alloys, or TB2 titanium alloys in β-type titanium alloys. The steel is stainless steel, which can be one of 301 stainless steel, 304 stainless steel, and 316 stainless steel. In one embodiment, the material of the first substrate layer 110 can also be an amorphous metal, which has higher strength and can be used to form a temperature averaging plate with higher strength.

[0118] In a possible implementation, the strength of the material of the first base layer 110 is greater than the strength of the material of the first metal layer 120 and the second metal layer 130. Using a material with greater strength as the first base layer 110 can ensure that the temperature equalizing plate 50 has better strength support. When the temperature equalizing plate 50 is arranged in the electronic device 1, the components arranged on both sides of the temperature equalizing plate 50 in the electronic device 1 will have an extrusion effect on the temperature equalizing plate 50. The first base layer 110 in this embodiment uses a material with greater strength, which can prevent the temperature equalizing plate 50 from being deformed by the components on both sides, thereby affecting the heat dissipation effect of the temperature equalizing plate 50. In addition, the first base layer 110 with greater strength can avoid the risk of the temperature equalizing plate 50 being squeezed and dented during the manufacturing process, thereby improving the manufacturing yield of the temperature equalizing plate 500.

[0119] In a possible implementation, the material of the first base layer 110 is at least one of titanium, titanium alloy and steel, so that the strength of the material of the first base layer 110 is greater than the strength of the material of the first metal layer 120 and the second metal layer 130. In a specific embodiment, the material of the first base layer 110 is titanium alloy, and the material of the first metal layer 120 and the second metal layer 130 is copper. In a specific embodiment, the material of the first base layer 110 is titanium alloy, and the material of the first metal layer 120 and the second metal layer 130 is nickel. In a specific embodiment, the material of the first base layer 110 is stainless steel, and the material of the first metal layer 120 and the second metal layer 130 is copper. In a specific embodiment, the material of the first base layer 110 is stainless steel, and the material of the first metal layer 120 and the second metal layer 130 is nickel. The temperature equalizer 50 described in the above-mentioned embodiments has strong supporting strength. When the two sides of the first metal layer 120 and the second metal layer 130 are squeezed and collided, the temperature equalizer 50 can be prevented from deforming. In addition, the density of the first base layer 110 is small, so that the strength can be increased and the weight can be reduced.

[0120] In a possible implementation, the material of the first base layer 110 is at least one of aluminum, aluminum alloy, magnesium and magnesium alloy. The density of aluminum, aluminum alloy, magnesium and magnesium alloy is smaller than that of titanium, titanium alloy and steel, so that the weight of the temperature plate 50 is lighter. In a specific embodiment, the material of the first base layer 110 is aluminum alloy or magnesium alloy, and the material of the first metal layer 120 and the second metal layer 130 is copper or nickel.

[0121] See also Figure 8 In a possible implementation, the first cover plate 100 further includes a plurality of column structures 140 protruding toward the accommodating cavity 400, and one end of the plurality of column structures 140 facing the second cover plate 200 is located on the capillary structure 300. The column structure 140 is used to support the first cover plate 100 and the second cover plate 200 on the one hand, and to drain on the other hand. In this embodiment, the first cover plate 100 is located above the second cover plate 200, and when the water working medium is heated and evaporated, it becomes water vapor, and the water vapor reaches the first cover plate 100 and condenses to form liquid water, and the liquid water flows back to the capillary structure 300 through the column structure 140.

[0122] See also Fig. 9In a possible implementation, the column structure 140 is formed by stamping the first cover plate 100, and the column structure 140 includes a portion of the first substrate layer 110, a portion of the first metal layer 120, and a portion of the second metal layer 130. After the column structure 140 is stamped by the first cover plate 100, a flow channel 150 is formed between each column structure 140, and water vapor condenses to form liquid water when encountering the cold surface of the first cover plate 100, and then flows back to the capillary structure 300 through the column structure 140.

[0123] In a possible implementation, the first metal layer 120 is disposed adjacent to the accommodation cavity 400 compared to the second metal layer 130, the column structure 140 is located on the side of the first metal layer 120 away from the second metal layer 130, and the column structure 140 is formed by etching the surface of the first metal layer 120 away from the first base layer 110. That is, in this embodiment, the thickness of the first metal layer 120 is set to be relatively large, and the first metal layer 120 is etched to form the column structure 140. Specifically, the surface of the first metal layer 120 away from the first base layer 110 can be grooved by etching, and the portion other than the column structure 140 is removed, wherein the surface of the first metal layer 120 facing the first base layer 100 remains a continuous surface.

[0124] In one embodiment, the first metal layer 120 is disposed adjacent to the accommodating cavity 400 compared to the second metal layer 130, and the material of the first metal layer 120 is the same as the material of the capillary structure 300. The water medium can form a tiny electrochemical cell between the first metal layer 120 and the capillary structure 300. Setting the first metal layer 120 and the capillary structure 300 to be the same material can reduce the potential difference between the two and avoid electrochemical reactions between the two. In a specific embodiment, the material of the first metal layer 120 is copper, and the material of the capillary structure 300 is copper. In one embodiment, the material of the first metal layer 120 is nickel, and the material of the capillary structure 300 is nickel.

[0125] Please refer again Figure 8 In a possible implementation, the second cover plate 200 includes a second base layer 210 and a third metal layer 220 and a fourth metal layer 230 disposed on two opposite surfaces of the second base layer 210. In this embodiment, the second cover plate 200 is disposed adjacent to the heating element compared to the first cover plate 100. The second cover plate 200 absorbs the heat of the heating element to increase the temperature and causes the capillary structure 300 to increase the temperature. The water medium then absorbs the heat of the second cover plate 200 and the capillary structure 300 to vaporize and form water vapor. After the water vapor reaches the first cover plate 100, it condenses to form liquid water. The liquid water flows back from the column structure 140 to the capillary structure 300 and the second cover plate 200 for the next cycle.

[0126] In an optional implementation, the third metal layer 120 and the fourth metal layer 140 are formed on the two opposite surfaces of the second base layer 210 by pressure or plating. The pressure method is a rolling compound method, and the second cover plate 200 obtained by the rolling compound method has a higher density and surface flatness. When the pressure is applied, the pressure on the two opposite surfaces of the second base layer 210 is equivalent, and the residual stress and deformation degree inside the third metal layer 220 and the fourth metal layer 230 are equivalent, so that the second cover plate 200 formed in the end has a higher surface flatness.

[0127] In some embodiments, the plating method includes one of electroplating, chemical plating or electrodeposition. When the third metal layer 220 and the fourth metal layer 230 are formed by plating, in order to improve the density of the third metal layer 220 and the fourth metal layer 230 and the adhesion to the second base layer 210, the first metal layer 220 and the fourth metal layer 230 can also be placed at a high temperature for sintering after the plating method is completed.

[0128] In this embodiment, the density of the second base layer 210 is less than the density of the third metal layer 220 and the fourth metal layer 230, so as to reduce the weight of the second cover plate 200, and further reduce the weight of the entire temperature homogenizing plate 50. Specifically, the material of the second base layer 210 is at least one of titanium, titanium alloy, steel, aluminum, aluminum alloy, magnesium and magnesium alloy, and the material of the third metal layer 220 and the fourth metal layer 230 is at least one of copper, copper alloy, nickel and nickel alloy.

[0129] In one embodiment, the strength of the second base layer 210 is greater than the strength of the third metal layer 220 and the fourth metal layer 230, so as to improve the support strength of the second cover plate 200. Specifically, the material of the second base layer 210 is at least one of titanium, titanium alloy and steel, and the material of the third metal layer 220 and the fourth metal layer 230 is at least one of copper, copper alloy, nickel and nickel alloy. In one embodiment, the material of the second base layer 210 can also be amorphous metal, which has high strength and is used to form a high-strength temperature absorbing plate.

[0130] In the present application, the thickness of the third metal layer 220 and the fourth metal layer 230 is set according to the total thickness of the actual temperature vapor chamber 50 or the weight reduction requirement, and the thickness of the third metal layer 220 and the fourth metal layer 230 is greater than or equal to 0.01 mm.

[0131] In a possible implementation, the second cover plate 200 has the same material and structure as the first cover plate 100. Specifically, the second base layer 210 has the same material and structure as the first base layer 110, the third metal layer 220 has the same material and structure as the first metal layer 120, and the fourth metal layer 230 has the same material and structure as the second metal layer 130. In some embodiments, the third metal layer 220 and the fourth metal layer 230 may be pressed plates, and other features of the second cover plate 200 are the same as those of the first cover plate 100, as described above.

[0132] In a possible implementation, the third metal layer 220 is disposed adjacent to the accommodation cavity 400 compared to the fourth metal layer 230, and the material of the third metal layer 220 is the same as the material of the capillary structure 300. In this embodiment, the water medium can form a tiny electrochemical cell between the third metal layer 220 and the capillary structure 300. Setting the third metal layer 220 and the capillary structure 300 to be the same material can reduce the potential difference between the two and avoid electrochemical reactions between the two. In one embodiment, the material of the third metal layer 220 is copper, and the material of the capillary structure 300 is copper.

[0133] See also Fig.10 In one embodiment of the present application, a method for preparing a temperature homogenizing plate 50 is also provided, comprising step S100 of preparing a first cover plate 100 .

[0134] See also Fig.11 In one embodiment, the method for preparing the first cover plate 100 includes step S110, step S120 and step S130. The detailed steps are as follows.

[0135] Step S110, providing a first metal prefabricated plate 121, a second metal prefabricated plate 131 and a first base prefabricated plate 111. The first metal prefabricated plate 121, the second metal prefabricated plate 131 and the first base prefabricated plate 111 are selected from metal materials according to the actual needs of the first cover plate 100 product to be prepared. For example, when it is necessary to prepare a first cover plate 100 with strong support strength, the material of the first base prefabricated plate 111 is selected from at least one of titanium, titanium alloy and steel, and titanium, titanium alloy and steel have high strength. When it is necessary to prepare a first cover plate 100 with a lighter weight, the material of the first base prefabricated plate 111 can be selected from at least one of aluminum, aluminum alloy, magnesium and magnesium alloy, and aluminum, aluminum alloy, magnesium and magnesium alloy have a smaller density. In one embodiment, the first metal prefabricated plate 121, the second metal prefabricated plate 131 and the first base prefabricated plate 111 have the same size, so that each area forming the first cover plate 100 includes the above-mentioned three-layer structure, thereby improving the preparation yield. In some embodiments, at least one of the first metal prefabricated plate 121 , the second metal prefabricated plate 131 , and the first base prefabricated plate 111 is a pressed plate to improve density.

[0136] Step S120, the first metal prefabricated plate 121 and the second metal prefabricated plate 131 are arranged on two opposite surfaces of the first base prefabricated plate 111 to obtain a three-layer composite structure 101. In this step, the layers in the three-layer composite structure 101 are aligned with each other. In some embodiments, when the sizes of the first metal prefabricated plate 121 and the second metal prefabricated plate 131 arranged on the first base prefabricated plate 111 are different, the smallest prefabricated plate among the three is used as the standard, and the other two prefabricated plates are aligned with the smallest prefabricated plate. After the first metal prefabricated plate 121 and the second metal prefabricated plate 131 are arranged on two opposite surfaces of the first base prefabricated plate 111, the area not including the three prefabricated plates can be cut off to ensure the manufacturing yield of the first cover plate 100.

[0137] Step S130, the three-layer composite structure 101 is compounded by pressure. In one embodiment, the pressure compounding is rolling compounding. In some embodiments, the three-layer composite structure 101 can also be heated at a preset temperature, and after heating, the three-layer composite structure 101 is rolled and compounded by roller 102. After heating, the adhesion between the layers of the three-layer composite structure 101 can be improved, and the pressing amount can be increased. The pressing amount refers to the thickness reduction amount, and the density of the first metal layer 120 and the second metal layer 130 formed can also be improved. The preset temperature can be set according to the material of each layer of the three-layer composite structure 101, such as the preset temperature can be set to 300°C, or set to 500°C. It should be noted that when rolling and compounding by roller 102, the rotation speed and pressing speed of the roller 102 can be set according to the product of the temperature equalizing plate 50, which is not limited in this application.

[0138] After step S130 is completed, the first metal prefabricated plate 121 and the second metal prefabricated plate 131 are compacted and more tightly combined with the first base prefabricated plate 111 during the rolling composite process. The first metal prefabricated plate 121 is compacted to form the first metal layer 120. The thickness of the formed first metal layer 120 is smaller than that of the first metal prefabricated plate 121. The density of the formed first metal layer 120 is greater than that of the first metal prefabricated plate 121. In addition, during the rolling composite process, atoms of the first metal layer 120 and the first base layer 110 diffuse and penetrate each other, thereby improving the adhesion between the first metal layer 120 and the first base layer 110, which can reduce the risk of the first metal layer 120 falling off from the first base layer 110 during long-term operation. After being compacted, the second metal layer 130 is formed. The thickness of the second metal layer 130 is smaller than that of the second metal prefabricated plate 131, and the density of the second metal layer 130 is greater than that of the second metal prefabricated plate 131. In addition, during the rolling and compounding process, the atoms of the second metal layer 130 and the first substrate layer 110 diffuse and penetrate each other, thereby improving the adhesion between the second metal layer 130 and the first substrate layer 110, which can reduce the risk of the second metal layer 130 falling off from the first substrate layer 110 during long-term operation; after the first substrate prefabricated plate 111 is compacted, the first substrate layer 110 is formed. The thickness of the first substrate layer 110 is smaller than that of the first substrate prefabricated plate 111, and the density of the first substrate layer 110 is greater than that of the first substrate prefabricated plate 111.

[0139] In one embodiment, the method for preparing the first cover plate 100 further includes step S140 and step S150, wherein step S140 is between step S110 and step S120, and step S150 is after step S130. The details are as follows.

[0140] Step S140, surface treatment is performed on the first metal prefabricated plate 121, the second metal prefabricated plate 131 and the first base prefabricated plate 111. This step is mainly to remove the oxide layer on the surface of the first metal prefabricated plate 121, the second metal prefabricated plate 131 and the first base prefabricated plate 111, so that the prefabricated plates expose the corresponding metal materials so that the surface contact is closer during rolling and compounding. Specifically, the prefabricated plates can be immersed in a salt solution to remove the surface oxide layer. In some embodiments, the surface treatment also includes roughening the surface of the first substrate prefabricated plate 121 after removing the oxide layer on the surface of the first substrate prefabricated plate 121, and roughening the surface of the first metal prefabricated plate 121 facing the first substrate prefabricated plate 111 and the surface of the second metal prefabricated plate 131 facing the first substrate prefabricated plate 111, so as to improve the interface roughness between the first substrate prefabricated plate 111 and the first metal prefabricated plate 121 and the second metal prefabricated plate 131, so as to enable the three-layer structure of the first metal prefabricated plate 121, the second metal prefabricated plate 131 and the first substrate prefabricated plate 111 to achieve good bonding at the interface between the three when being rolled and compounded by the roller 102, thereby improving the adhesion between the first substrate layer 110 and the first metal layer 120 and the second metal layer 130.

[0141] Step S150, annealing the three-layer composite structure 101 to obtain the first cover plate 100. Annealing can promote the mutual diffusion of metal atoms between the layers, and can enhance the bonding strength of the first cover plate 100. The bonding strength is related to the annealing temperature and annealing time, which can be determined according to the material of each layer of the three-layer composite structure 101, or according to the actual needs of the temperature vapor chamber 50 product.

[0142] See also Fig.12 The method for preparing the temperature homogenizing plate 50 further includes step S200, preparing the second cover plate 200. The method for preparing the second cover plate 200 includes step S210 and step S220. The detailed steps are as follows.

[0143] Step S210 , providing a second base layer 210 .

[0144] In step S220 , a third metal layer 220 and a fourth metal layer 230 are formed on two opposite surfaces of the second base layer 210 .

[0145] In an optional implementation, the third metal layer 220 and the fourth metal layer 230 are formed on the two opposite surfaces of the second base layer 210 by pressure or plating. The pressure method is a rolling composite method, and the second cover plate 200 obtained by the rolling composite method has a higher density and surface flatness. The third metal layer 220 and the fourth metal layer 230 are formed on the two opposite surfaces of the second base layer 210. When pressure is applied, the pressure on the two opposite surfaces of the second base layer 210 is equivalent, and the residual stress and deformation degree inside the third metal layer 220 and the fourth metal layer 230 are equivalent, so that the second cover plate 200 formed in the end has a higher surface flatness.

[0146] In some embodiments, the coating method includes one of electroplating, chemical plating or electrodeposition. When the third metal layer 220 and the fourth metal layer 230 are formed by coating, in order to improve the density of the third metal layer 220 and the fourth metal layer 230 and the adhesion to the second base layer 210, the first metal layer 220 and the fourth metal layer 230 can also be sintered at high temperature in vacuum after the coating method is completed. In some embodiments, when a thicker coating is required, in order to ensure the density of the coating, multiple coatings and multiple sintering methods can be used to form a high-density coating. Specifically, taking the formation of the third metal layer 220 as an example, the plating method is electroplating, the second base layer 210 is electroplated for the first time, a first metal sublayer is formed on the surface of the second base layer 210, and then the first metal sublayer is sintered at a high temperature to obtain a first metal sublayer with a higher density, and then the second base layer 210 is electroplated for the second time, a second metal sublayer is formed on the surface of the first metal sublayer away from the second base layer 210, and then the second metal sublayer is sintered at a high temperature to obtain a second metal sublayer with a higher density, and the first metal sublayer and the second metal sublayer constitute the third metal layer 220. In other embodiments, the number of plating and sintering can be set according to product requirements.

[0147] In the present application, the thickness of the third metal layer 220 and the fourth metal layer 230 is set according to the total thickness of the actual temperature vapor chamber 50 or the weight reduction requirement, and the thickness of the third metal layer 220 and the fourth metal layer 230 is greater than or equal to 0.01 mm.

[0148] It should be noted that when the second cover plate 200 has the same material and structure as the first cover plate 200, the preparation method of the first cover plate 100 can be used to prepare the second cover plate 200. When the second cover plate 200 has different material and structure from the first cover plate 100, adaptive adjustments can also be made according to the preparation method of the first cover plate 100.

[0149] In a possible implementation, the preparation method of the temperature homogenizing plate 50 further includes step S300, forming a column structure 140 by stamping or etching at least one of the first cover plate 100 and the second cover plate 200. Specifically, a plurality of column structures 140 may be formed on the surface of the first cover plate 100 facing the accommodating cavity 400, and the first cover plate 100 may be formed into a column structure 140 by stamping or etching, and the column structure 140 is used to support the first cover plate 100 and the second cover plate 200, and to drain the water medium. In some embodiments, a plurality of column structures 140 are formed on the surface of the second cover plate 200 facing the accommodating cavity 400. In some embodiments, a plurality of first column substructures are formed on the surface of the first cover plate facing the accommodating cavity, and a plurality of second column substructures are formed on the surface of the second cover plate facing the accommodating cavity, and at least part of the first column substructures are respectively connected to one end of at least part of the second column substructures facing the first cover plate to form a column structure.

[0150] In some embodiments, the first cover plate 100 and the second cover plate 200 may be formed by stamping. The shapes of the first cover plate 100 and the second cover plate 200 may be set according to the actual product requirements of the temperature equalizing plate 50. For example, the middle areas of the first cover plate 100 and the second cover plate 200 are stamped to form the first concave area 103 and the second concave area 201 (such as Fig.14 As shown), the edge areas of the first cover plate 100 and the second cover plate 200 are punched to form the first connecting portion 104 and the second connecting portion 202. When the first cover plate 100 and the second cover plate 200 are sealed, the first connecting portion 104 and the second connecting portion 202 are sealed and connected, and the recessed area 103 and the recessed area 201 between the two constitute the accommodating cavity 400 (as shown in FIG. Fig.13 shown).

[0151] The method for preparing the temperature plate 50 further includes step S400 of forming a capillary structure 300 between the first cover plate 100 and the second cover plate 200. The first metal layer 120 is disposed adjacent to the second cover plate 200 compared to the second metal layer 130, and the third metal layer 220 is disposed adjacent to the second cover plate 200 compared to the fourth metal layer 230.

[0152] The capillary structure 300 may be formed on the second cover plate 200 and located between the first cover plate 100 and the second cover plate 200, or the capillary structure 300 may be prepared first and then disposed between the first cover plate 100 and the second cover plate 200, or a part of the capillary structure may be prepared on the first cover plate 100 and a part of the capillary structure may be prepared on the second cover plate 200, and the two parts may be combined to form the capillary structure 300. The capillary structure 300 may be foamed copper or foamed nickel, wherein the foamed copper is a new multifunctional material having a large number of connected or unconnected pores distributed in a copper matrix, and the foamed nickel is a new multifunctional material having a large number of connected or unconnected pores distributed in a nickel matrix. Alternatively, copper powder or copper mesh can be placed on the copper layer and formed into a capillary structure 300 by sintering, and the capillary structure 300 is connected to the first cover plate 110 and the second cover plate 120 by sintering, hot pressing, cold pressing, etc. The thickness, area, shape area and porosity of the capillary structure 300 can be adjusted according to the requirements of heat dissipation performance. The capillary structure 300 includes but is not limited to mesh, powder, fiber, groove, felt cloth and boss. The material of the capillary structure 300 is the same as that of the first metal layer 120 and the third metal layer 220 to reduce the potential difference between the capillary structure 300 and the first metal layer 120 or the capillary structure 300 and the second metal layer 220 to avoid electrochemical reaction.

[0153] Step S500: The first cover plate 100 and the second cover plate 200 are sealed to form a receiving cavity 400 (eg, Fig.13 and Fig.14 As shown). Specifically, the first cover plate 100 and the second cover plate 200 can be sealed by welding, and a small hole is reserved on the periphery of the first cover plate 100 and the second cover plate 200 to form an injection hole 310, and the injection hole 310 can be used to evacuate the interior of the accommodating cavity 400 and to inject water working medium into the accommodating cavity 400. The welding method includes but is not limited to laser welding, brazing, resistance roll welding, diffusion welding and hot pressing. In some embodiments, after step S300, a leveling process can be performed according to the actual situation of the sealed product to make the upper and lower surfaces of the temperature equalizing plate smoother. The leveling process includes but is not limited to heating shaping and cold pressing shaping; if the product itself has good flatness in some embodiments, the actual production may not include a leveling process.

[0154] In one embodiment, the preparation method of the temperature equalizer 50 further includes injecting liquid into the receiving chamber 400 through the injection hole 310, and after the injection is completed, the receiving chamber 400 is vacuumed through the injection hole 310, and then the injection hole 310 is sealed. Evacuating the interior of the receiving chamber 400 can, on the one hand, remove oxygen to prevent the water medium and oxygen from corroding the first surface layer 110 and the capillary structure 300, and on the other hand, water can be vaporized at a lower temperature in a vacuum environment, such as 50-70°C. The general computer working temperature is 50-70°C, and it does not need to be heated to 100°C before vaporization, so that water can effectively absorb heat and vaporize, thereby improving the heat dissipation efficiency. In some embodiments, a conduit can be set in the injection hole 310, and the receiving chamber 400 is injected and vacuumed through the conduit, and then the conduit is shortened, that is, the tail of the conduit is removed, and then the remaining part of the conduit is sealed to complete the sealing of the receiving chamber 400.

[0155] In one embodiment, after sealing is completed, whether to perform surface treatment can be determined according to the product conditions. If the surface material of the first cover plate 100 and the second cover plate 200 is copper, surface treatment processes including but not limited to passivation and painting can be performed to increase surface stability; if the surface material is nickel, no surface treatment is required.

[0156] See also Fig.15 and Fig.16 In one embodiment of the present application, a method for preparing a temperature homogenizing plate 50a is provided, comprising steps S101, S201, S301 and S401. The specific steps are as follows.

[0157] Step S101, prepare a first cover plate 100 and a second cover plate 200, the first cover plate 100 includes a first stainless steel base layer 112 and a first copper layer 122 and a second copper layer 132 formed on opposite surfaces of the first titanium base layer 112 by rolling and compounding; the second cover plate 200 includes a second titanium base layer 211 and a third copper layer 221 and a fourth copper layer 231 formed on opposite surfaces of the second titanium base layer 211 by rolling and compounding. The thickness of the first copper layer 122, the second copper layer 132, the third copper layer 221 and the fourth copper layer 231 is 0.01 mm, the thickness of the first stainless steel base layer 112 and the second stainless steel base layer 211 is 0.08 mm, and the thickness of the first cover plate 100 and the second cover plate 200 is 0.1 mm, so that a relatively thin temperature balancing plate is obtained. The first titanium base layer 112 and the second titanium base layer 211 have strong supporting strength and light weight, the first copper layer 122, the second copper layer 132, the third copper layer 221 and the fourth copper layer 231 have high surface flatness and good compatibility with water medium, the water medium will not form non-condensable gas on the copper layer, and has better heat dissipation effect.

[0158] Step S201 , stamping the first cover plate 100 to form a column structure 140 , forming a copper foam 301 on the second cover plate 200 , and disposing the first copper layer 122 and the third copper layer 221 adjacent to the copper foam 301 . In this embodiment, the capillary structure 300 is copper foam 301 .

[0159] Step S301, the first cover plate 100 and the second cover plate 200 are sealed to form the accommodating cavity 400 and the injection hole 310. Specifically, the first cover plate 100 and the second cover plate 200 are sealed by welding.

[0160] Step S401, injecting liquid into the containing chamber 400 through the liquid injection hole 310, and after the liquid injection is completed, evacuating the containing chamber 400 through the liquid injection hole 310, and then sealing the liquid injection hole 310. The liquid is water.

[0161] The first cover plate 100 and the second cover plate 200 of the temperature equalizing plate 50a prepared in this embodiment have high supporting strength, surface flatness and low weight. The first cover plate 100 and the second cover plate 200 have high surface density and good stability, and the water working medium inside the temperature equalizing plate 50a can condense on the first copper layer 122 to form liquid water, which has a good heat dissipation effect.

[0162] In some embodiments, the present application also provides a method for preparing a temperature equalizing plate, which is different from the method for preparing the temperature equalizing plate 50a described above in that the two opposite surfaces of the titanium base layer of the first cover plate 100 and the second cover plate 200 are nickel metal layers, and the capillary structure 400 is nickel foam.

[0163] In some embodiments, the present application further provides a method for preparing a temperature equalizing plate, which is different from the method for preparing the temperature equalizing plate 50a described above in that the base layers of the first cover plate 100 and the second cover plate 200 are stainless steel base layers.

[0164] See also Fig.17 and Fig.18 In one embodiment of the present application, a method for preparing a temperature homogenizing plate 50b is provided, comprising steps S102, S202, S302 and S402. The specific steps are as follows.

[0165] Step S102, preparing a first cover plate 100 and a second cover plate 200, wherein the first cover plate 100 includes a first aluminum substrate layer 113 and a first copper layer 123 and a second copper layer 133 formed on opposite surfaces of the first aluminum substrate layer 113 by rolling and compounding; the second cover plate 200 includes a second aluminum substrate layer 212 and a third copper layer 222 and a fourth copper layer 232 formed on opposite surfaces of the second aluminum substrate layer 212 by rolling and compounding. The thickness of the first copper layer 123, the second copper layer 133, the third copper layer 222 and the fourth copper layer 232 is 0.03 mm, and the thickness of the first aluminum substrate layer 113 and the second aluminum substrate layer 212 is 0.1 mm. The first aluminum substrate layer 113 and the second aluminum substrate layer 212 have a relatively low weight, the first copper layer 123, the second copper layer 133, the third copper layer 222 and the fourth copper layer 232 have a relatively high surface flatness and have good compatibility with the water medium, the water medium will not form non-condensable gas on the copper layer, and has a better heat dissipation effect.

[0166] Step S202: stamping the first cover plate 100 to form a column structure 140, forming a copper foam 302 on the second cover plate 200, and disposing the first copper layer 123 and the third copper layer 222 adjacent to the copper foam 302. In this embodiment, the capillary structure 300 is copper foam.

[0167] Step S302: The first cover plate 100 and the second cover plate 200 are sealed to form the accommodating cavity 400 and the injection hole 310. Specifically, the first cover plate 100 and the second cover plate 200 are sealed by welding.

[0168] Step S402 , injecting liquid into the containing chamber 400 through the liquid injection hole 310 , and after the liquid injection is completed, evacuating the containing chamber 400 through the liquid injection hole 310 , and then sealing the liquid injection hole 310 .

[0169] The first cover plate 100 and the second cover plate 200 of the temperature equalizing plate 50b prepared in this embodiment have a lighter weight and surface flatness, the first cover plate 100 and the second cover plate 200 have a higher surface density and better stability, and the water medium inside the temperature equalizing plate 50b can condense on the first copper layer 122 to form liquid water, which has a better heat dissipation effect.

[0170] In one embodiment, the present application further provides a method for preparing a temperature averaging plate, which is different from the method for preparing the temperature averaging plate 50 b described above in that the base layers of the first cover plate 100 and the second cover plate 200 are magnesium base layers.

[0171] In one embodiment, the present application further provides a method for preparing a temperature balancing plate, which is different from the method for preparing the temperature balancing plate 50 b described above in that the capillary structure 400 is a copper mesh.

[0172] In one embodiment, the present application also provides a method for preparing a temperature equalizing plate, which is different from the method for preparing the temperature equalizing plate 50b described above in that the magnesium base layers of the first cover plate 100 and the second cover plate 200 have nickel metal layers on opposite surfaces, and the capillary structure 400 is nickel foam.

[0173] The temperature equalizing plate and its preparation method and the electronic device provided in the embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and embodiments of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for general technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific embodiments and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A temperature equalizing plate, characterized in that: The temperature equalizing plate includes a first cover plate, a second cover plate and a capillary structure. A accommodating cavity is provided between the first cover plate and the second cover plate, and the capillary structure is located in the accommodating cavity. The first cover plate includes a first base layer and a first metal layer and a second metal layer arranged on two opposite surfaces of the first base layer. The first metal layer and the second metal layer are pressed plates formed on the surface of the first base layer by pressure. The material of the first metal layer and the second metal layer is at least one of copper, copper alloy, nickel and nickel alloy. The material of the first base layer is at least one of aluminum, aluminum alloy, magnesium and magnesium alloy. The density of the first base layer is less than the density of the first metal layer and the second metal layer.

2. The temperature equalizing plate according to claim 1, characterized in that: The pressure method is a calendering compound method.

3. The temperature equalizing plate according to claim 2, characterized in that: The first metal layer and the second metal layer have textures on their surfaces away from the first base layer.

4. The temperature homogenizing plate according to claim 1, characterized in that: The first metal layer and the second metal layer are made of the same material.

5. The temperature homogenizing plate according to claim 1, characterized in that: The strength of the material of the first base layer is greater than the strength of the materials of the first metal layer and the second metal layer.

6. The temperature homogenizing plate according to claim 1, characterized in that: The first cover plate further includes a plurality of column structures protruding toward the accommodating cavity, and one end of the plurality of column structures facing the second cover plate is located on the capillary structure.

7. The temperature equalizing plate according to claim 6, characterized in that: The column structure is formed by stamping the first cover plate, and the column structure includes a portion of the first base layer, a portion of the first metal layer, and a portion of the second metal layer. The material of the first metal layer is the same as that of the capillary structure.

8. The temperature equalizing plate according to claim 6, characterized in that: The first metal layer is disposed adjacent to the accommodating cavity compared to the second metal layer, the column structure is located on a side of the first metal layer away from the second metal layer, and the column structure is formed by etching a surface of the first metal layer away from the first base layer.

9. The temperature equalizing plate according to claim 1, characterized in that: The first metal layer is disposed adjacent to the accommodation cavity compared to the second metal layer, and the material of the first metal layer is the same as that of the capillary structure.

10. The temperature homogenizing plate according to claim 1, characterized in that: The second cover plate includes a second base layer and a third metal layer and a fourth metal layer disposed on two opposite surfaces of the second base layer.

11. The temperature homogenizing plate according to claim 10, characterized in that: The density of the second base layer is lower than that of the third metal layer and the fourth metal layer.

12. The temperature homogenizing plate according to claim 10, characterized in that: The third metal layer is disposed adjacent to the accommodation cavity compared to the fourth metal layer, and the material of the third metal layer is the same as that of the capillary structure.

13. The temperature homogenizing plate according to claim 10, characterized in that: The third metal layer and the fourth metal layer are formed on two opposite surfaces of the second base layer by pressure or plating.

14. The temperature homogenizing plate according to claim 10, characterized in that: The first cover plate also includes a plurality of first column substructures protruding toward the accommodating cavity, and the second cover plate also includes a plurality of second column substructures protruding toward the accommodating cavity, and at least some of the first column substructures have one end facing the second cover plate respectively connected to at least some of the second column substructures have one end facing the first cover plate to form a column structure.

15. An electronic device, characterized in that: The electronic device comprises a heating element and a temperature averaging plate as claimed in any one of claims 1 to 14, wherein the temperature averaging plate is used to dissipate heat from the heating element.

16. A method for preparing a temperature equalizing plate, characterized in that: The method for preparing the temperature homogenizing plate includes preparing a first cover plate, and the method for preparing the first cover plate includes: A first metal prefabricated plate, a second metal prefabricated plate and a first substrate prefabricated plate are provided; the first metal prefabricated plate and the second metal prefabricated plate are made of at least one of copper, copper alloy, nickel and nickel alloy; the first substrate prefabricated plate is made of at least one of aluminum, aluminum alloy, magnesium and magnesium alloy; The first metal prefabricated plate and the second metal prefabricated plate are arranged on two opposite surfaces of the first base prefabricated plate to obtain a three-layer composite structure; The three-layer composite structure is composited by pressure; the first metal prefabricated plate is compacted to form a first metal layer, and the second metal prefabricated plate is compacted to form a second metal layer; the first base prefabricated plate is compacted to form a first base layer; the density of the first base layer is less than the density of the first metal layer and the second metal layer.

17. The method for preparing a temperature homogenizing plate according to claim 16, characterized in that: The method for preparing the temperature homogenizing plate further includes preparing a second cover plate, and the method for preparing the second cover plate includes: providing a second substrate layer; A third metal layer and a fourth metal layer are formed on opposite surfaces of the second base layer.

18. The method for preparing a temperature homogenizing plate according to claim 17, characterized in that: The method for preparing the temperature homogenizing plate further includes: At least one of the first cover plate and the second cover plate is formed into a column structure by stamping or etching.

19. The method for preparing a temperature homogenizing plate according to claim 17, characterized in that: The method for preparing the temperature homogenizing plate further includes: A capillary structure is formed between the first cover plate and the second cover plate, the first metal layer is disposed adjacent to the second cover plate compared to the second metal layer, and the third metal layer is disposed adjacent to the second cover plate compared to the fourth metal layer; The first cover plate and the second cover plate are sealed to form a receiving cavity.

Images