DDR memory slot connector

Abstract

The present invention is a DDR memory slot connector, which includes an insulating socket and a plurality of terminals. Two opposite side plates of the insulating socket respectively form a plurality of terminal receiving grooves for accommodating the terminals, and are connected with a slot in the middle of the insulating socket. An independent solder foot fixing groove is formed outside the two opposite side plates corresponding to each of the terminal receiving grooves, so that the solder foot of the corresponding terminal extends outwardly to a solder foot fixing portion and is fixed in the solder foot fixing groove, and a stress release groove is formed between any two adjacent solder foot fixing grooves. In this way, the DDR memory slot connector releases the internal stress generated by the solder foot fixing portion and the solder foot fixing groove when assembled with the stress release groove, thereby avoiding the problems of internal stress accumulation, thermal deformation and warping during application, and poor terminal welding in surface adhesion operation, thereby improving the production and application quality of the DDR memory slot connector.

Description

Technical Field

[0001] The invention relates to an electrical connector, and in particular to a DDR memory slot connector. Background Art

[0002] Surface mount technology does not require drilling on the circuit board during welding, so that the inner circuit board of the multi-layer circuit board has more space for circuit layout, effectively reducing the number of layers of the circuit board and achieving a high-density circuit layout design. Therefore, it is widely used in welding processes in various fields.

[0003] When a surface mount type electrical connector is used to fix multiple terminals, a fixing device is usually designed on the terminal to allow the electrical connector to fix the terminal portion to form an assembly and fixation. However, this will cause internal stress accumulation between the terminal and the electrical connector. Figure 6 as well as Figure 7 As shown, taking an electrical connector of a double data rate synchronous dynamic random access memory (DDR SDRAM) as an example, it includes an insulating socket 40 and a plurality of terminals 50. The two side plates of the insulating socket 40 are respectively formed with a plurality of terminal receiving grooves 41 arranged side by side to accommodate the terminals. Among them, the terminals 50 are located at a reference portion 51 in the terminal receiving groove 41, and two opposite side edges 510 thereof are respectively extended with a barb 511 laterally to be tightly fixed in the terminal receiving groove 41. The terminals 50 pass downward through the bottom surface of the insulating socket 40 and then extend horizontally for a short section to serve as solder pins for the surface bonding operation of the DDR memory slot connector.

[0004] Therefore, when the terminal 50 is assembled with the insulating socket 40, internal stress accumulation occurs between the barbs 511 of each terminal 50 and the terminal receiving grooves 41, thermal deformation and warping occur during use, and poor terminal welding occurs during surface bonding operations, thereby reducing the production and application quality of the DDR memory slot connector. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a DDR memory slot connector, which can solve the problems of the above-mentioned prior art and improve the quality of welding.

[0006] In order to achieve the above object, the DDR memory slot connector provided by the present invention comprises:

[0007] An insulating socket comprises a slot and two side plates; wherein the two side plates are respectively located at two opposite sides of the slot, and each of the side plates is formed with:

[0008] A plurality of terminal receiving grooves arranged side by side are communicated with the slots of the insulating socket and exposed on the bottom surface of the insulating socket;

[0009] A plurality of solder foot fixing grooves are respectively located outside the corresponding terminal receiving grooves and exposed on the bottom surface of the insulating socket; and

[0010] A plurality of stress release grooves are respectively located between corresponding adjacent solder foot fixing grooves and exposed on the bottom surface of the insulating socket; and

[0011] A plurality of terminals are arranged side by side in the corresponding side plates of the insulating socket, and each of the terminals comprises, from top to bottom:

[0012] A contact portion is disposed in an upper space of the terminal receiving slot and partially protrudes into the slot;

[0013] A reference portion extending downward from the contact portion and disposed in a reference portion fixing groove of the terminal receiving groove;

[0014] A welding foot extends downward from the reference portion, passes through the bottom surface of the insulating socket, and extends laterally along the bottom surface of the insulating socket toward the outer side of the welding foot fixing groove; and

[0015] A welding foot fixing portion extends upward from the welding foot and penetrates into the welding foot fixing groove.

[0016] The beneficial effect of the present invention is that the solder foot fixing portion is fixed through the solder foot fixing groove, and the stress release groove is formed between any two adjacent solder foot fixing grooves, and the stress release groove is utilized to absorb the internal stress generated between the solder foot fixing groove and the solder foot fixing portion during assembly, thereby solving the problems of internal stress accumulation during assembly of the DDR memory slot connector, thermal deformation and warping during application, and poor terminal welding during surface adhesion operation, thereby improving the production and application quality of the DDR memory slot connector.

[0017] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional exploded view of an embodiment of a DDR memory slot connector of the present invention.

[0019] Figure 2A FIG. 4 is a three-dimensional diagram of an embodiment of a DDR memory slot connector of the present invention.

[0020] Figure 2B for Figure 2A Partially enlarged stereogram.

[0021] Figure 3 It is a three-dimensional diagram of the terminal of the DDR memory slot connector of the present invention.

[0022] Figure 4 It is a partial bottom perspective view of an embodiment of a DDR memory slot connector of the present invention.

[0023] Figure 5A FIG. 4 is a cross-sectional view of an embodiment of a DDR memory slot connector of the present invention.

[0024] Figure 5B It is a partial cross-sectional view of an embodiment of a DDR memory slot connector of the present invention.

[0025] Figure 5C It is a partial cross-sectional view of an embodiment of a DDR memory slot connector of the present invention.

[0026] Figure 6 A partial cross-sectional view of a prior art DDR memory slot connector.

[0027] Figure 7 A three-dimensional diagram of the terminals of a prior art DDR memory slot connector.

[0028] Wherein, the reference numerals are:

[0029] 1: DDR memory slot connector

[0030] 10: Insulated socket

[0031] 11: Top surface

[0032] 12: Slot

[0033] 13: Terminal receiving slot

[0034] 130: Upper space

[0035] 131: Reference part fixing groove

[0036] 132: Inner wall

[0037] 14: Welding foot fixing groove

[0038] 140: Inner wall

[0039] 15: Stress relief groove

[0040] 16: Bottom

[0041] 17: Side panels

[0042] 170:Outer wall surface

[0043] 20:Terminal

[0044] 21:Contact Department

[0045] 210: Bending part

[0046] 22: Baseline

[0047] 220: Side

[0048] 23: Welding feet

[0049] 24: Welding foot fixing part

[0050] 240: Side

[0051] 241: Card Point

[0052] 242: The End

[0053] 30: Circuit Board

[0054] 31: Soldering point

[0055] 40: Insulated socket

[0056] 41: Terminal receiving slot

[0057] 42: Reference part fixing groove

[0058] 50:Terminal

[0059] 51: Baseline

[0060] 510: Side

[0061] 511: Barb DETAILED DESCRIPTION

[0062] The structural principle and working principle of the present invention are described in detail below in conjunction with the accompanying drawings:

[0063] First see Figure 1 As shown, an embodiment of the DDR memory slot connector 1 of the present invention comprises an insulating socket 10 and a plurality of terminals 20 ; wherein the terminals 20 are accommodated in the insulating socket 10 side by side.

[0064] Please refer to Figure 2A , Figure 2B as well as Figure 5A As shown, the insulating socket 10 includes a top surface 11, a slot 12, a bottom surface 16 and two side panels 17; in this embodiment, the slot 12 is a long slot formed in the middle of the top surface 11 of the insulating socket 10, and the two side panels 17 are respectively located on two opposite sides of the slot 12. Each of the side panels 17 of the insulating socket 10 is formed with a plurality of terminal receiving grooves 13, a plurality of solder foot fixing grooves 14 and a plurality of stress release grooves 15. The DDR memory slot connector 1 of the present invention can be a DDR5 memory slot connector.

[0065] like Figure 1 As shown, the terminal receiving slots 13 are arranged side by side in the corresponding side plates 17. Figure 5A As shown, the terminal receiving grooves 13 penetrate the corresponding side plates 17, are exposed on the top surface 11 and the bottom surface 16 of the insulating socket 10, and are connected to the slot 12; Figure 5B As shown, each terminal receiving groove 13 further includes an upper space 130 and a reference portion fixing groove 131 from top to bottom, wherein the upper space 130 has a width W1, and the reference portion fixing groove 131 has a groove width W2 and a groove depth L2, and the two opposite inner walls 132 of the reference portion fixing groove 131 are respectively plane; in this embodiment, the width W1 of the upper space 130 is smaller than the groove width W2 of the reference portion fixing groove 131.

[0066] like Figure 5A As shown, the solder foot fixing grooves 14 are respectively formed on the outer sides of the corresponding terminal receiving grooves 13, and each of the solder foot fixing grooves 14 is exposed on the bottom surface 16 of the insulating socket 10; in this embodiment, as Figure 5B and Figure 5C As shown, the solder foot fixing groove 14 has a groove width W3 and a groove depth L3, wherein the groove width W3 of the solder foot fixing groove 14 is smaller than the groove width W2 of the reference portion fixing groove 131, and the groove depth L3 of the solder foot fixing groove 14 is smaller than the groove depth L2 of the reference portion fixing groove 131; in one embodiment, the solder foot fixing grooves 14 are not connected to the terminal receiving groove 13.

[0067] like Figure 2A and Figure 2B As shown, the stress release grooves 15 are formed between any two adjacent solder foot fixing grooves 14; in this embodiment, the stress release grooves 15 are exposed on the bottom surface 16 of the insulating socket 10, and can also be further exposed on the outer wall surface 170 of the corresponding side plate 17, wherein the stress release groove 15 is not connected to the solder foot fixing groove 14 and the terminal receiving groove 13.

[0068] See also Figure 3 As shown, each of the terminals 20 further comprises a contact portion 21 , a reference portion 22 , a solder foot 23 and a solder foot fixing portion 24 from top to bottom.

[0069] Please refer to Figure 5A and Figure 5B As shown, the contact portion 21 is disposed in the upper space 130 of the terminal receiving groove 13 and partially protrudes into the slot 12. In this embodiment, the contact portion 21 has a bending portion 210, and the bending portion 210 protrudes into the slot 12. The contact portion 21 has a width W4.

[0070] Please refer to Figure 5A and Figure 5BAs shown, the reference portion 22 extends downward from the contact portion 21 and is disposed in the reference portion fixing groove 131 of the terminal receiving groove 13. The two opposite side edges 220 of the reference portion 22 are respectively planes to correspond to the inner wall 132 of the reference portion fixing groove 131 which is also plane. In this embodiment, the reference portion 22 has a width W5 and a length L5, wherein the width W5 of the reference portion 22 is greater than the width W4 of the contact portion 21.

[0071] Please refer to Figure 4 and Figure 5A As shown, the solder leg 23 extends downward from the reference portion 22 and passes through the bottom surface 16 of the insulating socket 10, and after being bent, extends along the bottom surface 16 toward the solder leg fixing groove 14 outside the reference portion fixing groove 131; in this embodiment, the solder leg 23 is bent to form a right angle with the reference portion 22, and as shown in FIG. Figure 5B As shown, it has a width W6.

[0072] Please refer to Figure 4 and Figure 5C As shown, the above-mentioned welding foot fixing portion 24 is bent and inserted upward into the welding foot fixing groove 14, and a clamping point 241 is extended laterally from the two opposite sides 240 respectively; in this embodiment, the welding foot fixing portion 24 is bent to form a right angle with the welding foot 23, and the welding foot fixing portion 24 has a width W7 and a length L7, and there is a distance W8 between the two clamping points 241, and the end 242 of the welding foot fixing portion 24 has a width W9, wherein the width W9 of the end 242 of the welding foot fixing portion 24 is smaller than the welding foot The groove width W3 of the fixing groove 14 is for easy insertion into the weld leg fixing groove 14, but the distance W8 between the two clamping points 241 of the weld leg fixing portion 24 is slightly larger than the groove width W3 of the weld leg fixing groove 14, so that the weld leg fixing portion 24 can be pressed against the two opposite inner walls 140 of the weld leg fixing groove 14; and the width W7 of the weld leg fixing portion 24 is substantially the same as the width W6 of the weld leg 23, and is smaller than the width W5 of the reference portion 22; the length L7 of the weld leg fixing portion 24 is smaller than the length L5 of the reference portion 22.

[0073] like Figure 4 as well as Figure 5A As shown, when the DDR memory slot connector 1 is subjected to surface mounting, the soldering feet 23 of each of the terminals 20 are soldered to corresponding soldering points 31 of a circuit board 30 .

[0074] In summary, the terminals of the DDR memory slot connector of the present invention are assembled in the insulating socket, and the solder foot fixing part is tightly fixed in the solder foot fixing groove by utilizing the clamping point, and a stress release groove is formed between any two adjacent solder foot fixing grooves to absorb the internal stress generated by the solder foot fixing groove and the solder foot fixing part when assembled, thereby avoiding the accumulation of internal stress, the occurrence of heat deformation and warping during application, and the poor soldering of terminals in the surface adhesion operation, thereby improving the production and application quality of the DDR memory slot connector.

[0075] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art may make various corresponding changes and modifications based on the present invention, but these corresponding changes and modifications should all fall within the scope of protection of the claims attached to the present invention.

Claims

1. A DDR memory slot connector, characterized in that: include: An insulating socket comprises a slot and two side plates; wherein the two side plates are respectively located at two opposite sides of the slot, and each of the side plates is formed with: A plurality of terminal receiving grooves arranged side by side are communicated with the slots of the insulating socket and exposed on the bottom surface of the insulating socket; A plurality of solder foot fixing grooves are respectively located outside the corresponding terminal receiving grooves and exposed on the bottom surface of the insulating socket; as well as A plurality of stress release grooves are respectively located between corresponding adjacent solder foot fixing grooves and exposed on the bottom surface of the insulating socket; as well as A plurality of terminals are arranged side by side in the corresponding side plates of the insulating socket, and each of the terminals comprises, from top to bottom: A contact portion is disposed in an upper space of the terminal receiving slot and partially protrudes into the slot; A reference portion extending downward from the contact portion and disposed in a reference portion fixing groove of the terminal receiving groove; A welding foot extends downward from the reference portion, passes through the bottom surface of the insulating socket, and extends laterally along the bottom surface of the insulating socket toward the outer side of the welding foot fixing groove; as well as A welding foot fixing portion extends upward from the welding foot and penetrates into the welding foot fixing groove.

2. The DDR memory slot connector according to claim 1, wherein: Two opposite sides of the solder foot fixing portion respectively have a clamping point, and the distance between the two clamping points is substantially greater than the slot width of the solder foot fixing slot.

3. The DDR memory slot connector according to claim 2, wherein: The distance between two opposite sides of the end of the welding foot fixing portion is smaller than the groove width of the welding foot fixing groove.

4. The DDR memory slot connector according to any one of claims 1 to 3, wherein: Each of the stress release grooves is exposed outside the insulating socket.

5. The DDR memory slot connector according to claim 4, wherein: Two opposite side edges of the reference portion are respectively in the form of a plane, and two opposite inner walls of the reference portion fixing groove corresponding to the reference portion are respectively in the form of a plane.

6. The DDR memory slot connector according to claim 5, wherein: The groove width of the welding foot fixing groove is smaller than the groove width of the reference portion fixing groove; and The width of the solder foot fixing portion of each terminal is smaller than the width of the reference portion of each terminal.

7. The DDR memory slot connector according to claim 5, wherein: The width of the soldering foot of each terminal is substantially the same as the width of the soldering foot fixing portion.

8. The DDR memory slot connector according to any one of claims 1 to 3, wherein: Each of the terminal receiving grooves is exposed on the top surface of the insulating socket; and Each of the stress release grooves is exposed on the outer wall surface of the corresponding side plate.

9. The DDR memory slot connector according to any one of claims 1 to 3, characterized in that: The width of the upper space of the terminal receiving groove is smaller than the groove width of the reference portion fixing groove; and The width of the contact portion of each terminal is smaller than the width of the reference portion of each terminal.

10. The DDR memory slot connector according to any one of claims 1 to 3, characterized in that: A right angle is formed between the solder foot fixing portion and the solder foot, and a right angle is formed between the reference portion and the solder foot.

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